Hands-On 3D Printed Electronics
Authors: 
Julian Rasch, 
Florian Müller, 
Thomas Kosch, 
Martin Schmitz, 
Sebastian S. FegerAuthors Info & Claims
Article No.: 70, Pages 1 - 2
Abstract
The parallel improvements in multi-material 3D printers and the quality of conductive filament open new possibilities for the fabrication of tangible and functional objects. In this studio, we discuss best practices for 3D printed electronics, talk about encountered problems, and derive design recommendations. We will guide the participants through a fabrication process by practically designing and printing objects. Consequently, we contemplate individual functional fabricated components, including small printed circuits and multi-material prints. We aim to spark a discussion about individually experienced challenges participants encountered during their design and fabrication process. This discussion includes problem-solving strategies, whose insights benefit other participants. Finally, we show the potential of printed electronics and discuss encouraging new opportunities in this field.
References
[1]
Varun Perumal C and Daniel Wigdor. 2015. Printem: Instant Printed Circuit Boards with Standard Office Printers & Inks. In Proceedings of the 28th Annual ACM Symposium on User Interface Software & Technology(Charlotte, NC, USA) (UIST ’15). Association for Computing Machinery, New York, NY, USA, 243–251. https://doi.org/10.1145/2807442.2807511
[2]
Sebastian Feger, Lars Semmler, Albrecht Schmidt, and Thomas Kosch. 2022. ElectronicsAR: Design and Evaluation of a Mobile and Tangible High-Fidelity Augmented Electronics Toolkit. Proc. ACM Hum.-Comput. Interact. 6, ISS, Article 587 (nov 2022), 22 pages. https://doi.org/10.1145/3567740
[3]
Thomas Kosch, Julian Rasch, Albrecht Schmidt, and Sebastian Feger. 2022. Supporting Electronics Learning through Augmented Reality. In Workshop on Reimagining Systems for Learning Hands-on Creative and Maker Skills at the CHI Conference on Human Factors in Computing Systems (New Orleans, LA, USA) (CHI ’22). ACM, New York, NY, USA. https://doi.org/10.48550/arXiv.2210.13820
[4]
Karola Marky, Andreas Weiß, Andrii Matviienko, Florian Brandherm, Sebastian Wolf, Martin Schmitz, Florian Krell, Florian Müller, Max Mühlhäuser, and Thomas Kosch. 2021. Let’s Frets! Assisting Guitar Students During Practice via Capacitive Sensing. In Proceedings of the 2021 CHI Conference on Human Factors in Computing Systems (Yokohama, Japan) (CHI ’21). Association for Computing Machinery, New York, NY, USA, Article 746, 12 pages. https://doi.org/10.1145/3411764.3445595
[5]
Matt Saari, Bin Xia, Bryan Cox, Paul S Krueger, Adam L Cohen, and Edmond Richer. 2016. Fabrication and analysis of a composite 3D printed capacitive force sensor. 3D Printing and Additive Manufacturing 3, 3 (2016), 136–141. https://doi.org/10.1089/3dp.2016.0021
[6]
Martin Schmitz, Florian Müller, Max Mühlhäuser, Jan Riemann, and Huy Viet Le. 2021. Itsy-Bits: Fabrication and Recognition of 3D-Printed Tangibles with Small Footprints on Capacitive Touchscreens. In Proceedings of the 2021 CHI Conference on Human Factors in Computing Systems(CHI ’21). ACM, New York, NY, USA. https://doi.org/10.1145/3411764.3445502
[7]
Martin Schmitz, Jan Riemann, Florian Müller, Steffen Kreis, and Max Mühlhäuser. 2021. Oh, Snap! A Fabrication Pipeline to Magnetically Connect Conventional and 3D-Printed Electronics. In Proceedings of the 2021 CHI Conference on Human Factors in Computing Systems (Yokohama, Japan) (CHI ’21). Association for Computing Machinery, New York, NY, USA, Article 420, 11 pages. https://doi.org/10.1145/3411764.3445641
Index Terms
- Hands-On 3D Printed Electronics
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Published In
February 2023
709 pages
ISBN:9781450399777
DOI:10.1145/3569009
Copyright © 2023 Owner/Author.
Permission to make digital or hard copies of part or all of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for third-party components of this work must be honored. For all other uses, contact the Owner/Author.
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Association for Computing Machinery
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Published: 26 February 2023
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TEI '23
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TEI '23: Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction
February 26 - March 1, 2023
Warsaw, Poland
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