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Static and dynamic temperature-aware scheduling for multiprocessor SoCs

Authors:

Ayse Kivilcim Coskun,

Tajana Šimunic Rosing,

Keith A. Whisnant,

Kenny C. GrossAuthors Info & Claims

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Volume 16, Issue 9

Pages 1127 - 1140

https://doi.org/10.1109/TVLSI.2008.2000726

Published: 01 September 2008 Publication History

Abstract

Thermal hot spots and high temperature gradients degrade reliability and performance, and increase cooling costs and leakage power. In this paper, we explore the benefits of temperature-aware task scheduling for multiprocessor system-on-a-chip (MPSoC). We evaluate our techniques using workload characteristics collected from a real system by Sun's Continuous System Telemetry. We first solve the task scheduling problem statically using integer linear programming (ILP). The ILP solution is guaranteed to be optimal for the given assumptions for tasks. We formulate ILPs for minimizing energy, balancing energy, and reducing hot spots, and provide an extensive comparison of their thermal behavior against our technique. Our static solution can reduce the frequency of hot spots by 35%, spatial gradients by 85%, and thermal cycles by 61% in comparison to the ILP for minimizing energy. We then design dynamic scheduling policies at the OS-level with negligible performance overhead. Our adaptive dynamic policy reduces the frequency of high-magnitude thermal cycles and spatial gradients by around 50% and 90%, respectively, in comparison to state-of-the-art schedulers. Reactive thermal management strategies, such as thread migration, can be combined with our scheduling policy to further reduce hot spots, temperature variations, and the associated performance cost.

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Cited By

Inci AIsgenc MMarculescu D(2022)DeepNVM++: Cross-Layer Modeling and Optimization Framework of Nonvolatile Memories for Deep LearningIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2021.312714841:10(3426-3437)Online publication date: 1-Oct-2022
https://dl.acm.org/doi/10.1109/TCAD.2021.3127148
da Silva AMartins AMoraes FMartino JLubaszewski MReorda M(2019)Fine-grain temperature monitoring for many-core systemsProceedings of the 32nd Symposium on Integrated Circuits and Systems Design10.1145/3338852.3339841(1-6)Online publication date: 26-Aug-2019
https://dl.acm.org/doi/10.1145/3338852.3339841
Mukherjee PJain KChattopadhyay S(2019)Thermal-aware task allocation and scheduling for periodic real-time applications in mesh-based heterogeneous NoCsReal-Time Systems10.1007/s11241-019-09327-x55:4(774-809)Online publication date: 1-Oct-2019
https://dl.acm.org/doi/10.1007/s11241-019-09327-x
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Information & Contributors

Information

Published In

cover image IEEE Transactions on Very Large Scale Integration (VLSI) Systems

IEEE Transactions on Very Large Scale Integration (VLSI) Systems Volume 16, Issue 9

September 2008

159 pages

ISSN:1063-8210

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Copyright © 2008.

Publisher

IEEE Educational Activities Department

United States

Publication History

Published: 01 September 2008

Revised: 15 August 2007

Received: 31 May 2007

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Cited By

Inci AIsgenc MMarculescu D(2022)DeepNVM++: Cross-Layer Modeling and Optimization Framework of Nonvolatile Memories for Deep LearningIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2021.312714841:10(3426-3437)Online publication date: 1-Oct-2022
https://dl.acm.org/doi/10.1109/TCAD.2021.3127148
da Silva AMartins AMoraes FMartino JLubaszewski MReorda M(2019)Fine-grain temperature monitoring for many-core systemsProceedings of the 32nd Symposium on Integrated Circuits and Systems Design10.1145/3338852.3339841(1-6)Online publication date: 26-Aug-2019
https://dl.acm.org/doi/10.1145/3338852.3339841
Mukherjee PJain KChattopadhyay S(2019)Thermal-aware task allocation and scheduling for periodic real-time applications in mesh-based heterogeneous NoCsReal-Time Systems10.1007/s11241-019-09327-x55:4(774-809)Online publication date: 1-Oct-2019
https://dl.acm.org/doi/10.1007/s11241-019-09327-x
Pasricha SChittamuru SThakkar IChen DHomayoun HTaskin B(2018)Cross-Layer Thermal Reliability Management in Silicon Photonic Networks-on-ChipProceedings of the 2018 Great Lakes Symposium on VLSI10.1145/3194554.3194608(317-322)Online publication date: 30-May-2018
https://dl.acm.org/doi/10.1145/3194554.3194608
Moudallal ZNajm FParameswaran S(2017)Power scheduling with active power gridsProceedings of the 36th International Conference on Computer-Aided Design10.5555/3199700.3199762(466-473)Online publication date: 13-Nov-2017
https://dl.acm.org/doi/10.5555/3199700.3199762
Moudallal ZNajm F(2017)Power scheduling with active power grids2017 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)10.1109/ICCAD.2017.8203814(466-473)Online publication date: 13-Nov-2017
https://dl.acm.org/doi/10.1109/ICCAD.2017.8203814
Coskun AGu AJin WJoshi AKahng AKlamkin JMa YRecchio JSrinivas VZhang TFanucci LTeich J(2016)Cross-layer floorplan optimization for silicon photonic NoCs in many-core systemsProceedings of the 2016 Conference on Design, Automation & Test in Europe10.5555/2971808.2972114(1309-1314)Online publication date: 14-Mar-2016
https://dl.acm.org/doi/10.5555/2971808.2972114
Sahu AFanucci LTeich J(2016)Thermal aware scheduling and mapping of multiphase applications onto chip multiprocessorProceedings of the 2016 Conference on Design, Automation & Test in Europe10.5555/2971808.2972063(1096-1101)Online publication date: 14-Mar-2016
https://dl.acm.org/doi/10.5555/2971808.2972063
Sheikh HAhmad I(2016)Sixteen Heuristics for Joint Optimization of Performance, Energy, and Temperature in Allocating Tasks to Multi-CoresACM Transactions on Parallel Computing10.1145/29489733:2(1-29)Online publication date: 2-Aug-2016
https://dl.acm.org/doi/10.1145/2948973
Tang AGao XChen LJha N(2016)Delay/Power Modeling and Optimization of FinFET Circuit Modules under PVT VariationsACM Journal on Emerging Technologies in Computing Systems10.1145/279523112:4(1-21)Online publication date: 8-Mar-2016
https://dl.acm.org/doi/10.1145/2795231
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