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research-article

Fast Dummy-Fill Density Analysis With Coupling Constraints

Published: 01 April 2008 Publication History

Abstract

In modern very large scale integration manufacturing processes, dummy fills are widely used to adjust local metal density in order to improve layout uniformity and yield optimization. However, the introduction of a large amount of dummy features also affects wire electrical properties. In this paper, we propose the first coupling-constrained dummy-fill analysis algorithm which identifies feasible locations for dummy fills such that the fill-induced coupling capacitance can be bounded within the given coupling threshold of each wire segment. A speedup approach is presented based on the cache concept. The algorithm also makes efforts to maximize ground dummy fills, which are more robust and predictable. The output of the algorithm can be treated as the upper bound for dummy-fill insertion, and it can be easily adopted in density models to guide dummy-fill insertion without disturbing the existing design.

Cited By

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  • (2019)Pin Access-Driven Design Rule Clean and DFM Optimized Routing of Standard Cells under Boolean ConstraintsProceedings of the 2019 International Symposium on Physical Design10.1145/3299902.3309744(41-47)Online publication date: 4-Apr-2019
  • (2017)High Performance Dummy Fill Insertion With Coupling and Uniformity ConstraintsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2016.263845236:9(1532-1544)Online publication date: 18-Aug-2017
  • (2016)A novel unified dummy fill insertion framework with SQP-based optimization method2016 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)10.1145/2966986.2966994(1-8)Online publication date: 7-Nov-2016
  • Show More Cited By

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Published In

cover image IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems  Volume 27, Issue 4
April 2008
189 pages

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IEEE Press

Publication History

Published: 01 April 2008

Author Tags

  1. Chemical mechanical planarization (CMP)
  2. coupling
  3. dummy fills

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Cited By

View all
  • (2019)Pin Access-Driven Design Rule Clean and DFM Optimized Routing of Standard Cells under Boolean ConstraintsProceedings of the 2019 International Symposium on Physical Design10.1145/3299902.3309744(41-47)Online publication date: 4-Apr-2019
  • (2017)High Performance Dummy Fill Insertion With Coupling and Uniformity ConstraintsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2016.263845236:9(1532-1544)Online publication date: 18-Aug-2017
  • (2016)A novel unified dummy fill insertion framework with SQP-based optimization method2016 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)10.1145/2966986.2966994(1-8)Online publication date: 7-Nov-2016
  • (2015)High performance dummy fill insertion with coupling and uniformity constraintsProceedings of the 52nd Annual Design Automation Conference10.1145/2744769.2744850(1-6)Online publication date: 7-Jun-2015
  • (2009)Provably good and practically efficient algorithms for CMP dummy fillProceedings of the 46th Annual Design Automation Conference10.1145/1629911.1630052(539-544)Online publication date: 26-Jul-2009

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