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View all- Tao YLiang CMei ZSong ZWu YSun YZhang WRuan YZhao X(2024)Numerical simulation of copper electrodeposition for Through Silicon Via (TSV) with SPS-PEG-Cl additive systemMicroelectronics Journal10.1016/j.mejo.2024.106089144:COnline publication date: 1-Feb-2024