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Cora Salm
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2020 – today
- 2020
- [c1]Maurits J. de Jong, Cora Salm, Jurriaan Schmitz:
Effect of Ambient on the Recovery of Hot-Carrier Degraded Devices. IRPS 2020: 1-6
2010 – 2019
- 2018
- [j12]Maurits J. de Jong, Cora Salm, Jurriaan Schmitz:
Towards understanding recovery of hot-carrier induced degradation. Microelectron. Reliab. 88-90: 147-151 (2018) - 2017
- [j11]Maurits J. de Jong, Cora Salm, Jurriaan Schmitz:
Observations on the recovery of hot carrier degradation of hydrogen/deuterium passivated nMOSFETs. Microelectron. Reliab. 76-77: 136-140 (2017)
2000 – 2009
- 2008
- [j10]Cora Salm, Victor M. Blanco Carballo, Joost Melai, Jurriaan Schmitz:
Reliability aspects of a radiation detector fabricated by post-processing a standard CMOS chip. Microelectron. Reliab. 48(8-9): 1139-1143 (2008) - 2007
- [j9]Arnoud P. van der Wel, Eric A. M. Klumperink, Jay S. Kolhatkar, Eric Hoekstra, Martijn F. Snoeij, Cora Salm, Hans Wallinga, Bram Nauta:
Low-Frequency Noise Phenomena in Switched MOSFETs. IEEE J. Solid State Circuits 42(3): 540-550 (2007) - [j8]Cora Salm, Eric Hoekstra, Jay S. Kolhatkar, André J. Hof, Hans Wallinga, Jurriaan Schmitz:
Low-frequency noise in hot-carrier degraded nMOSFETs. Microelectron. Reliab. 47(4-5): 577-580 (2007) - 2006
- [j7]Cora Salm, André J. Hof, Fred G. Kuper, Jurriaan Schmitz:
Reduced temperature dependence of hot carrier degradation in deuterated nMOSFETs. Microelectron. Reliab. 46(9-11): 1617-1622 (2006) - 2005
- [j6]M. S. B. Sowariraj, Theo Smedes, Peter C. de Jong, Cora Salm, Ton J. Mouthaan, Fred G. Kuper:
A 3-D Circuit Model to evaluate CDM performance of ICs. Microelectron. Reliab. 45(9-11): 1425-1429 (2005) - 2004
- [j5]Zhichun Wang, Jan Ackaert, Cora Salm, Fred G. Kuper, Eddy De Backer:
Plasma Charging Damage Reduction in IC Processing by A Self-balancing Interconnect. Microelectron. Reliab. 44(9-11): 1503-1507 (2004) - 2003
- [j4]M. S. B. Sowariraj, Theo Smedes, Cora Salm, Ton J. Mouthaan, Fred G. Kuper:
Role of package parasitics and substrate resistance on the Charged Device Model (CDM) failure levels -An explanation and die protection strategy. Microelectron. Reliab. 43(9-11): 1569-1575 (2003) - 2002
- [j3]M. S. B. Sowariraj, Theo Smedes, Cora Salm, Ton J. Mouthaan, Fred G. Kuper:
The influence of technology variation on ggNMOSTs and SCRs against CDM BSD stress. Microelectron. Reliab. 42(9-11): 1287-1292 (2002) - [j2]H. V. Nguyen, Cora Salm, J. Vroemen, J. Voets, Benno Krabbenborg, Jaap Bisschop, A. J. Mouthaan, Fred G. Kuper:
Fast temperature cycling and electromigration induced thin film cracking in multilevel interconnection: experiments and modeling. Microelectron. Reliab. 42(9-11): 1415-1420 (2002) - [j1]H. V. Nguyen, Cora Salm, R. Wenzel, A. J. Mouthaan, Fred G. Kuper:
Simulation and experimental characterization of reservoir and via layout effects on electromigration lifetime. Microelectron. Reliab. 42(9-11): 1421-1425 (2002)
Coauthor Index
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