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"Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of ..."

Ari Laor et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.03.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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Ari Laor, Depayne Athia, Alireza Rezvani, Horst Clauberg, Michael Mayer:
Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of warpage and tilt in flip chip thermo-compression bonding. Microelectron. Reliab. 73: 60-68 (2017)

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