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Alireza Rezvani
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2020 – today
- 2023
- [j9]Elaheh Movahedi, Hafez Razmazma, Alireza Rezvani, Ali Ebrahimi:
Binding profile of a mixed-ligand silver(I) complex with DNA and Topoisomerase I. Comput. Biol. Chem. 103: 107831 (2023) - 2021
- [j8]Abdallah Aldosary, Muhyaddin Jamal H. Rawa, Ziad M. Ali, Mohsen Latifi, Armin Razmjoo, Alireza Rezvani:
Energy management strategy based on short-term resource scheduling of a renewable energy-based microgrid in the presence of electric vehicles using θ-modified krill herd algorithm. Neural Comput. Appl. 33(16): 10005-10020 (2021) - 2020
- [j7]Di Wu, Goran Saman Nariman, Salim Qadir Mohammed, Zehui Shao, Alireza Rezvani, Saeed Mohajeryami:
Modeling and simulation of novel dynamic control strategy for PV-wind hybrid power system using FGS-PID and RBFNSM methods. Soft Comput. 24(11): 8403-8425 (2020) - [j6]Seyed Mohammad Hassan Hosseini, Alireza Rezvani:
Modeling and simulation to optimize direct power control of DFIG in variable-speed pumped-storage power plant using teaching-learning-based optimization technique. Soft Comput. 24(22): 16895-16915 (2020)
2010 – 2019
- 2018
- [j5]Mehrdad Khaksar, Alireza Rezvani, Mohammad Hassan Moradi:
Simulation of novel hybrid method to improve dynamic responses with PSS and UPFC by fuzzy logic controller. Neural Comput. Appl. 29(3): 837-853 (2018) - 2017
- [j4]Ari Laor, Depayne Athia, Alireza Rezvani, Horst Clauberg, Michael Mayer:
Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of warpage and tilt in flip chip thermo-compression bonding. Microelectron. Reliab. 73: 60-68 (2017) - [j3]Alireza Rezvani, Majid Gandomkar:
Simulation and control of intelligent photovoltaic system using new hybrid fuzzy-neural method. Neural Comput. Appl. 28(9): 2501-2518 (2017) - 2013
- [j2]Alireza Rezvani, Aashish Shah, M. Mayer, Norman Y. Zhou, J. T. Moon:
Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding. Microelectron. Reliab. 53(7): 1002-1008 (2013) - 2011
- [j1]Aashish Shah, Alireza Rezvani, M. Mayer, Norman Y. Zhou, John Persic, J. T. Moon:
Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding. Microelectron. Reliab. 51(1): 67-74 (2011)
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