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Sayuri Kohara
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2010 – 2019
- 2015
- [c6]Sayuri Kohara, Keishi Okamoto, Hirokazu Noma
, Kazushige Toriyama, Hiroyuki Mori:
Warpage analysis of organic substrates for 2.1D packaging. 3DIC 2015: TS8.17.1-TS8.17.5 - [c5]Kuniaki Sueoka, Akihiro Horibe, T. Aoki, Sayuri Kohara, Kazushige Toriyama, Hiroyuki Mori, Yasumitsu Orii:
Vertical integration after stacking (ViaS) process for low-cost and low-stress 3D silicon integration. 3DIC 2015: TS8.3.1-TS8.3.5 - 2013
- [c4]Sayuri Kohara, Akihiro Horibe, Kuniaki Sueoka, Keiji Matsumoto, Fumiaki Yamada, Hiroyuki Mori, Yasumitsu Orii:
Thermo-mechanical evaluation of 3D packages. 3DIC 2013: 1-4 - 2011
- [c3]Toru Ikeda, Masatoshi Oka, Shinya Kawahara, Noriyuki Miyazaki, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada:
Combination between the nonlinear finite element analyses and the strain measurement using the digital image correlation for a new 3D SIC package. 3DIC 2011: 1-6 - [c2]Sayuri Kohara, Akihiro Horibe, Kuniaki Sueoka, Keiji Matsumoto, Fumiaki Yamada, Yasumitsu Orii, Katsuyuki Sakuma
Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration. 3DIC 2011: 1-7 - 2010
- [c1]Akihiro Horibe, Kuniaki Sueoka, Katsuyuki Sakuma
High density 3D integration by pre-applied Inter Chip Fill. 3DIC 2010: 1-5
Coauthor Index
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