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Sen Lin 0002
Person information
- affiliation: OURS Technology Inc., Santa Clara, USA
Other persons with the same name
- Sen Lin — disambiguation page
- Sen Lin 0001 — University of Houston, Department of Computer Science, Houston, TX, USA (and 1 more)
- Sen Lin 0003 — Shenyang Ligong University, Shenyang, China
- Sen Lin 0004 — Beijing Jiaotong University, Beijing, China
- Sen Lin 0005 — Shanghai Jiao Tong University, Shanghai, China
- Sen Lin 0006 — University of Electronic Science and Technology of China, Chengdu, China
- Sen Lin 0007 — Shenzhen Polytechnic, Shenzhen, China (and 1 more)
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2020 – today
- 2020
- [j4]Nandish Mehta, Sen Lin, Bozhi Yin, Sajjad Moazeni, Vladimir Stojanovic:
A Laser-Forwarded Coherent Transceiver in 45-nm SOI CMOS Using Monolithic Microring Resonators. IEEE J. Solid State Circuits 55(4): 1096-1107 (2020)
2010 – 2019
- 2019
- [c9]Nandish Mehta, Sen Lin, Bozhi Yin, Sajjad Moazeni, Vladimir Stojanovic:
A Laser-forwarded Coherent 10Gb/s BPSK Transceiver using Monolithic Microring Resonators in 45nm SOI CMOS. VLSI Circuits 2019: 192- - 2018
- [c8]Sen Lin, Sajjad Moazeni, Vladimir Stojanovic:
A 40GB/S Optical NRZ Transmitter Based on Monolithic Microring Modulators in 45NM SOI CMOS. VLSI Circuits 2018: 273-274 - 2017
- [j3]Sajjad Moazeni, Sen Lin, Mark T. Wade, Luca Alloatti, Rajeev J. Ram, Milos A. Popovic, Vladimir Stojanovic:
A 40-Gb/s PAM-4 Transmitter Based on a Ring-Resonator Optical DAC in 45-nm SOI CMOS. IEEE J. Solid State Circuits 52(12): 3503-3516 (2017) - [c7]Mohammad Shahanshah Akhter, Paul Somogyi, Chen Sun, Mark T. Wade, Roy Meade, Pavan Bhargava, Sen Lin, Nandish Mehta:
WaveLight: A Monolithic Low Latency Silicon-Photonics Communication Platform for the Next-Generation Disaggregated Cloud Data Centers. Hot Interconnects 2017: 25-28 - [c6]Sajjad Moazeni, Sen Lin, Mark T. Wade, Luca Alloatti, Rajeev J. Ram, Milos A. Popovic, Vladimir Stojanovic:
29.3 A 40Gb/s PAM-4 transmitter based on a ring-resonator optical DAC in 45nm SOI CMOS. ISSCC 2017: 486-487 - [c5]Chen Sun, Mark T. Wade, Yunsup Lee, Jason S. Orcutt, Luca Alloatti, Michael S. Georgas, Andrew S. Waterman, Jeffrey M. Shainline, Rimas R. Avizienis, Sen Lin, Benjamin R. Moss, Rajesh Kumar, Fabio Pavanello, Amir H. Atabaki, Henry M. Cook, Albert J. Ou, Jonathan C. Leu, Yu-Hsin Chen, Krste Asanovic, Rajeev J. Ram, Milos A. Popovic, Vladimir Marko Stojanovic:
Microprocessor chip with photonic I/O. OFC 2017: 1-3 - 2016
- [j2]Chen Sun, Mark T. Wade, Michael Georgas, Sen Lin, Luca Alloatti, Benjamin Moss, Rajesh Kumar, Amir H. Atabaki, Fabio Pavanello, Jeffrey Shainline, Jason Orcutt, Rajeev J. Ram, Milos A. Popovic, Vladimir Stojanovic:
A 45 nm CMOS-SOI Monolithic Photonics Platform With Bit-Statistics-Based Resonant Microring Thermal Tuning. IEEE J. Solid State Circuits 51(4): 893-907 (2016) - [c4]Nandish Mehta, Chen Sun, Mark T. Wade, Sen Lin, Milos A. Popovic, Vladimir Stojanovic:
A 12Gb/s, 8.6µApp input sensitivity, monolithic-integrated fully differential optical receiver in CMOS 45nm SOI process. ESSCIRC 2016: 491-494 - 2015
- [j1]Chen Sun, Mark T. Wade, Yunsup Lee, Jason S. Orcutt, Luca Alloatti, Michael Georgas, Andrew Waterman, Jeffrey M. Shainline, Rimas Avizienis, Sen Lin, Benjamin Moss, Rajesh Kumar, Fabio Pavanello, Amir H. Atabaki, Henry Cook, Albert J. Ou, Jonathan C. Leu, Yu-Hsin Chen, Krste Asanovic, Rajeev J. Ram, Milos A. Popovic, Vladimir Marko Stojanovic:
Single-chip microprocessor that communicates directly using light. Nat. 528(7581): 534-538 (2015) - [c3]Krishna T. Settaluri, Sen Lin, Sajjad Moazeni, Erman Timurdogan, Chen Sun, Michele Moresco, Zhan Su, Yu-Hsin Chen, Gerald Leake, Douglas LaTulipe, Colin McDonough, Jeremiah Hebding, Douglas Coolbaugh, Michael Watts, Vladimir Stojanovic:
Demonstration of an optical chip-to-chip link in a 3D integrated electronic-photonic platform. ESSCIRC 2015: 156-159 - [c2]Erman Timurdogan, Zhan Su, Krishna T. Settaluri, Sen Lin, Sajjad Moazeni, Chen Sun, Gerald Leake, Douglas D. Coolbaugh, Benjamin R. Moss, Michele Moresco, Vladimir Stojanovic, Michael R. Watts:
An ultra low power 3D integrated intra-chip silicon electronic-photonic link. OFC 2015: 1-3 - [c1]Chen Sun, Mark T. Wade, Michael Georgas, Sen Lin, Luca Alloatti, Benjamin Moss, Rajesh Kumar, Amir Atabaki, Fabio Pavanello, Rajeev J. Ram, Milos A. Popovic, Vladimir Stojanovic:
A 45nm SOI monolithic photonics chip-to-chip link with bit-statistics-based resonant microring thermal tuning. VLSIC 2015: 122-
Coauthor Index
aka: Vladimir Marko Stojanovic
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