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Erman Timurdogan
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2020 – today
- 2022
- [c14]Atsunobu Ohta, Dogan A. Atlas, Erman Timurdogan, Skylar Deckoff-Jones, Mike R. Watts, Michihiro Komoto, Hironori Honda, Naoto Yoshimoto:
Ultra Compact Athermal 400G-FR4 Silicon Photonics Receiver with Polarization Diversity. OFC 2022: 1-3 - 2021
- [c13]Kenneth M. Jabon, Christopher V. Poulton, Ren-Jye Shiue, Matthew J. Byrd, Zhan Su, Mohammad H. Teimourpour, Scott Breitenstein, Ronald P. Millman, Dogan A. Atlas, Michael R. Watts, Erman Timurdogan:
Edge-Coupled Active and Passive Wafer-Scale Measurements on 300mm Silicon Photonics Wafers. OFC 2021: 1-3 - [c12]Aditya Malik, Songtao Liu, Erman Timurdogan, Mark W. Harrington, Andrew M. Netherton, Mitra Saeidi, Daniel J. Blumenthal, Luke Theogarajan, Michael Watts, John E. Bowers:
Low power consumption silicon photonics datacenter interconnects enabled by a parallel architecture. OFC 2021: 1-3 - 2020
- [c11]Erman Timurdogan, Zhan Su, Ren-Jye Shiue, Matthew J. Byrd, Christopher V. Poulton, Kenneth Jabon, Christopher DeRose, Benjamin R. Moss, Ehsan S. Hosseini, Ivan Duzevik, Michael Whitson, Ronald P. Millman, Dogan A. Atlas, Michael R. Watts:
400G Silicon Photonics Integrated Circuit Transceiver Chipsets for CPO, OBO, and Pluggable Modules. OFC 2020: 1-3
2010 – 2019
- 2019
- [j2]Taehwan Kim, Pavan Bhargava, Christopher V. Poulton, Jelena Notaros, Ami Yaacobi, Erman Timurdogan, Christopher Baiocco, Nicholas Fahrenkopf, Seth Kruger, Tat Ngai, Yukta Timalsina, Michael R. Watts, Vladimir Stojanovic:
A Single-Chip Optical Phased Array in a Wafer-Scale Silicon Photonics/CMOS 3D-Integration Platform. IEEE J. Solid State Circuits 54(11): 3061-3074 (2019) - [c10]Taehwan Kim, Pavan Bhargava, Christopher V. Poulton, Jelena Notaros, Ami Yaacobi, Erman Timurdogan, Christopher Baiocco, Nicholas Fahrenkopf, Seth Kruger, Tat Ngai, Yukta Timalsina, Michael R. Watts, Vladimir Stojanovic:
A Single-Chip Optical Phased Array in a 3D-Integrated Silicon Photonics/65nm CMOS Technology. ISSCC 2019: 464-466 - [c9]Erman Timurdogan, Zhan Su, Ren-Jye Shiue, Christopher V. Poulton, Matthew J. Byrd, Simon Xin, Michael R. Watts:
APSUNY Process Design Kit (PDKv3.0): O, C and L Band Silicon Photonics Component Libraries on 300mm Wafers. OFC 2019: 1-3 - [c8]Pavan Bhargava, Taehwan Kim, Christopher V. Poulton, Jelena Notaros, Ami Yaacobi, Erman Timurdogan, Christopher Baiocco, Nicholas Fahrenkopf, Seth Kruger, Tat Ngai, Yukta Timalsina, Michael R. Watts, Vladimir Stojanovic:
Fully Integrated Coherent LiDAR in 3D-Integrated Silicon Photonics/65nm CMOS. VLSI Circuits 2019: 262- - 2018
- [c7]Erman Timurdogan, Zhan Su, Christopher V. Poulton, Matthew J. Byrd, Simon Xin, Ren-Jye Shiue, Benjamin R. Moss, Ehsan S. Hosseini, Michael R. Watts:
AIM Process Design Kit (AIMPDKv2.0): Silicon Photonics Passive and Active Component Libraries on a 300mm Wafer. OFC 2018: 1-3 - 2016
- [b1]Erman Timurdogan:
Wafer-scale integrated active silicon photonics for manipulation and conversion of light. Massachusetts Institute of Technology, Cambridge, USA, 2016 - 2015
- [j1]Chen Sun, Michael Georgas, Jason Orcutt, Benjamin Moss, Yu-Hsin Chen, Jeffrey Shainline, Mark T. Wade, Karan Mehta, Kareem Nammari, Erman Timurdogan, Daniel L. Miller, Ofer Tehar-Zahav, Zvi Sternberg, Jonathan C. Leu, Johanna Chong, Reha Bafrali, Gurtej Sandhu, Michael Watts, Roy Meade, Milos A. Popovic, Rajeev J. Ram, Vladimir Stojanovic:
A Monolithically-Integrated Chip-to-Chip Optical Link in Bulk CMOS. IEEE J. Solid State Circuits 50(4): 828-844 (2015) - [c6]Krishna T. Settaluri, Sen Lin, Sajjad Moazeni, Erman Timurdogan, Chen Sun, Michele Moresco, Zhan Su, Yu-Hsin Chen, Gerald Leake, Douglas LaTulipe, Colin McDonough, Jeremiah Hebding, Douglas Coolbaugh, Michael Watts, Vladimir Stojanovic:
Demonstration of an optical chip-to-chip link in a 3D integrated electronic-photonic platform. ESSCIRC 2015: 156-159 - [c5]Erman Timurdogan, Zhan Su, Krishna T. Settaluri, Sen Lin, Sajjad Moazeni, Chen Sun, Gerald Leake, Douglas D. Coolbaugh, Benjamin R. Moss, Michele Moresco, Vladimir Stojanovic, Michael R. Watts:
An ultra low power 3D integrated intra-chip silicon electronic-photonic link. OFC 2015: 1-3 - 2014
- [c4]Zhan Su, Ehsan S. Hosseini, Erman Timurdogan, Jie Sun, Gerald Leake, Douglas D. Coolbaugh, Michael R. Watts:
Reduced wafer-scale frequency variation in adiabatic microring resonators. OFC 2014: 1-3 - [c3]Chen Sun, Michael Georgas, Jason Orcutt, Benjamin Moss, Yu-Hsin Chen, Jeffrey Shainline, Mark T. Wade, Karan Mehta, Kareem Nammari, Erman Timurdogan, Daniel L. Miller, Ofer Tehar-Zahav, Zvi Sternberg, Jonathan C. Leu, Johanna Chong, Reha Bafrali, Gurtej Sandhu, Michael Watts, Roy Meade, Milos A. Popovic, Rajeev J. Ram, Vladimir Stojanovic:
A monolithically-integrated chip-to-chip optical link in bulk CMOS. VLSIC 2014: 1-2 - 2013
- [c2]Aleksandr Biberman, Erman Timurdogan, Michael R. Watts, William A. Zortman, Douglas C. Trotter:
Adiabatic microring modulators. OFC/NFOEC 2013: 1-3 - [c1]Erman Timurdogan, Cheryl M. Sorace-Agaskar, Aleksandr Biberman, Michael R. Watts:
Vertical junction silicon microdisk modulators at 25Gb/s. OFC/NFOEC 2013: 1-3
Coauthor Index
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