WO2024203375A1

WO2024203375A1 - Holding device, alignment device, film formation device, film formation method, and manufacturing method

Info

Publication number: WO2024203375A1
Application number: PCT/JP2024/009929
Authority: WO
Inventors: 拓平三村
Original assignee: キヤノントッキ株式会社
Priority date: 2023-03-30
Filing date: 2024-03-14
Publication date: 2024-10-03
Also published as: JP2024142949A

Abstract

This holding device comprises: a holding means for holding an object; a supporting means for supporting the holding means in a floating state; and a first weight member provided to the holding means. The outer shape of the holding means is a polygonal shape including a first side section. The first weight member is disposed along the first side section, and is disposed closer to the center of the first side section than an end of the first side section.

Description

Holding device, alignment device, film forming device, film forming method, and manufacturing method

The present invention relates to a holding device, an alignment device, a film forming device, a film forming method, and a manufacturing method.

Mechanisms that support objects in a floating state have been proposed as mechanisms for holding objects. For example, Patent Document 1 discloses a semiconductor exposure apparatus that supports a stage that holds a substrate in a floating state. In this type of holding mechanism, the floating attitude of the stage is adjusted with a weight member so that the stage is maintained in, for example, a horizontal attitude.

JP 2004-342987 A

While installing a weight member is advantageous in terms of adjusting the levitation posture, installing the weight member may affect the vibration characteristics of the member that holds the object. For example, installing a weight member may lower the natural frequency of the member that holds the object, deteriorating the vibration characteristics.

The object of the present invention is to adjust the levitation posture using a weight member while suppressing the effect of the weight member on vibration characteristics.

According to the present invention,
A holding means for holding an object;
a support means for supporting the holding means in a floating state;
a first weight member provided on the holding means;
A holding device comprising:
The outer shape of the holding means is a polygon including a first side portion,
the first weight member is disposed along the first side portion and is disposed closer to a center of the first side portion than an end portion of the first side portion;
A holding device characterized in that

According to the present invention, the floating attitude can be adjusted using the weight member while suppressing the effect of the weight member on vibration characteristics.

1 is a schematic diagram showing a part of a configuration of a manufacturing line for electronic devices to which the present invention can be applied; 1 is a schematic diagram of a film forming apparatus according to an embodiment of the present invention. FIG. 3 is an enlarged view of a portion of FIG. 2 . FIG. 4 is a schematic diagram showing an example of the operation of the film forming apparatus. FIG. 4 is a schematic diagram showing an example of the operation of the film forming apparatus. FIG. 4 is a plan view of the holding device taken along line A-A of FIG. 3 . FIG. FIG. 4 is an explanatory diagram of an arrangement area of a weight member. FIG. 4 is an explanatory diagram of an arrangement area of a weight member. FIG. 4 is a schematic diagram showing a first natural vibration mode of the main body. FIG. 1 is a schematic diagram showing an example of an organic EL display device. FIG. 1 is a schematic diagram showing an example of an organic EL display device. FIG. FIG. FIG. FIG. 4 is a side view showing an example of an arrangement of weight members. FIG. FIG. FIG. 4 is a plan view showing an example of the outer shape of a main body portion. FIG. 4 is a plan view showing an example of the outer shape of a main body portion.

Below, the embodiments are described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe multiple features, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicate explanations are omitted.

First Embodiment
<Electronic device manufacturing line>
1 is a schematic diagram showing a part of the configuration of a manufacturing line for electronic devices to which the present invention can be applied. The manufacturing line in FIG. 1 is used, for example, for manufacturing display panels for organic EL display devices for smartphones, in which substrates 1 are sequentially transported to a film-forming block 401, and an organic EL film is formed on the substrates 1.

In the deposition block 401, a plurality of deposition chambers 403a to 403d in which deposition processing is performed on the substrate 1, and a mask storage chamber 405 in which masks before and after use are stored are arranged around a transfer chamber 402 that has an octagonal shape in a plan view. A transfer robot 402a that transfers the substrate 1 is arranged in the transfer chamber 402. The transfer robot 402a includes a hand that holds the substrate 1 and a multi-joint arm that moves the hand horizontally. In other words, the deposition block 401 is a cluster-type deposition unit in which a plurality of deposition chambers 403a to 403d are arranged to surround the transfer robot 402a. When the deposition chambers 403a to 403d are collectively referred to or when no distinction is made, they are referred to as deposition chambers 403.

In the transport direction (arrow direction) of the substrate 1, a buffer chamber 406, a swirl chamber 407, and a delivery chamber 408 are disposed upstream and downstream of the deposition block 401, respectively. During the manufacturing process, each chamber is maintained in a vacuum state. Although only one deposition block 401 is shown in FIG. 1, the manufacturing line according to this embodiment has multiple deposition blocks 401, which are connected by a connection device composed of a buffer chamber 406, a swirl chamber 407, and a delivery chamber 408. The configuration of the connection device is not limited to this, and may be composed of only the buffer chamber 406 or the delivery chamber 408, for example.

The transport robot 402a transports the substrate 1 from the upstream delivery chamber 408 to the transport chamber 402, transports the substrate 1 between the deposition chambers 403, transports the mask between the mask storage chamber 305 and the deposition chamber 303, and transports the substrate 1 from the transport chamber 402 to the downstream buffer chamber 406.

The buffer chamber 406 is a chamber for temporarily storing substrates 1 depending on the operating status of the production line. The buffer chamber 406 is provided with a substrate storage shelf, also called a cassette, and a lifting mechanism. The substrate storage shelf has a multi-tier structure capable of storing multiple substrates 1 while maintaining the substrate 1 in a horizontal position with the surface to be processed (surface to be deposited) facing downward in the direction of gravity. The lifting mechanism raises and lowers the substrate storage shelf to align the tier where the substrate 1 is loaded or unloaded with the transport position. This allows multiple substrates 1 to be temporarily stored and retained in the buffer chamber 406.

The swirl chamber 407 is equipped with a device for changing the orientation of the substrate 1. For example, in the swirl chamber 407, the orientation of the substrate 1 is rotated 180 degrees by a transport robot provided in the swirl chamber 407. The transport robot provided in the swirl chamber 407 rotates 180 degrees while supporting the substrate 1 received in the buffer chamber 406 and delivers it to the delivery chamber 408, so that the front end and rear end of the substrate are swapped between the buffer chamber 406 and the delivery chamber 408. As a result, the orientation of the substrate 1 when it is brought into the film formation chamber 403 is the same in each film formation block 401, so that the scan direction of film formation on the substrate 1 and the orientation of the mask can be aligned in each film formation block 401. With this configuration, the orientation of the mask installed in the mask storage chamber 405 in each film formation block 401 can be aligned, simplifying mask management and improving usability.

The control system of the manufacturing line includes a higher-level device 400 that controls the entire line as a host computer, and control devices 140a-140d, 409, 410 that control each component, and these can communicate via a wired or wireless communication line 400a. The control devices 140a-140d are provided corresponding to the deposition chambers 403a-403d, and control the deposition device 100 described below. Note that when the control devices 140a-140d are referred to collectively or when no distinction is made, they are referred to as control device 140.

The control device 409 controls the transport robot 402a. The control device 410 controls the devices in the swirl chamber 307. The higher-level device 400 transmits information about the substrate 1 and instructions such as transport timing to each of the

control devices

140, 409, and 410, and each of the

control devices

140, 409, and 410 controls each component based on the received instructions.

<Film forming equipment>
2 is a schematic diagram showing a film forming apparatus 100 according to an embodiment of the present invention. The film forming apparatus 100 is an apparatus for forming a film of a deposition material on a substrate 1, and forms a thin film of the deposition material in a predetermined pattern on the substrate 1 using a mask 2. The material of the substrate 1 on which a film is formed in the film forming apparatus 100 can be appropriately selected from materials such as glass, resin, and metal. The deposition material is an organic material, an inorganic material (metal, metal oxide, etc.), and the like. The film forming process is performed in a state in which the substrate 1 is placed on the mask 2 and the substrate 1 and the mask 2 are superimposed on each other.

The film forming apparatus 100 can be used as a manufacturing apparatus for manufacturing electronic devices such as display devices (such as flat panel displays), thin-film solar cells, and organic photoelectric conversion elements (organic thin-film imaging elements), as well as optical components, and is particularly applicable to a manufacturing apparatus for manufacturing organic EL panels. In the following explanation, an example is assumed in which the film forming apparatus 100 forms a film on the substrate 1 by vacuum deposition, but the present invention is not limited to this, and various film forming methods such as sputtering and CVD can be applied. In each figure, the arrow Z indicates the up-down direction (the direction of gravity), and the arrows X and Y indicate horizontal directions that are perpendicular to each other.

The film forming apparatus 100 includes a box-shaped vacuum chamber 110 (sometimes simply referred to as chamber 110) having a bottom 111, sides 112, and a top 113. An internal space 114 of the vacuum chamber 110 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. In this embodiment, the vacuum chamber 110 is connected to a vacuum pump (not shown). In this specification, "vacuum" refers to a state filled with gas at a pressure lower than atmospheric pressure, in other words, a reduced pressure state.

In the internal space 114 of the vacuum chamber 110, a holding device 300 that holds the substrate 1 in a horizontal position, a mask support unit 9 that supports the mask 2, a deposition unit 12, and a plate unit 11 are arranged.

The mask 2 has an opening pattern corresponding to the thin film pattern to be formed on the substrate 1, and is placed on the mask table 91. The mask table 91 can be replaced with other means for fixing the mask 2 in a predetermined position. The mask 2 can be a mask having a structure in which a mask foil having a thickness of several μm to several tens of μm is welded to a frame-shaped mask frame. The material of the mask is not particularly limited, but it is preferable to use a metal with a small thermal expansion coefficient such as Invar. The film formation process is performed with the substrate 1 placed on the mask 2 and the substrate 1 and mask 2 overlapping each other.

The plate unit 11 includes a cooling plate 11a, a magnet plate 11b, and a plate movable part 11c. The cooling plate 11a is disposed below the magnet plate 11b, and the cooling plate 11a and the magnet plate 11b are suspended by the plate movable part 11c so as to be displaceable in the Z direction. The cooling plate 11a has a function of cooling the substrate 1 attracted to the holder 6 by approaching the holder 6 described later during film formation. The cooling plate 11a is not limited to a type that is equipped with a water cooling mechanism or the like and actively cools the substrate 1, and may be a plate-like member that does not have a water cooling mechanism or the like but removes heat from the substrate 1 by approaching the holder 6. The magnet plate 11b is a plate that attracts the mask 2 by magnetic force, and is placed on the upper surface of the substrate 1 to improve the adhesion between the substrate 1 and the mask 2 during film formation.

The cooling plate 11a and the magnetic plate 11b may be omitted as appropriate. For example, if the holding unit 6 is provided with a cooling mechanism, the cooling plate 11a may not be necessary. In addition, the holding unit 6 may be configured to attract the mask 2 without the magnetic plate 11b.

The deposition unit 12 is composed of a heater, a shutter, an evaporation source drive mechanism, an evaporation rate monitor, etc., and is an evaporation source that deposits an evaporation material onto the substrate 1. More specifically, in this embodiment, the deposition unit 12 is a linear evaporation source in which multiple nozzles (not shown) are arranged in the X direction, and the evaporation material is emitted from each nozzle. For example, the linear evaporation source is moved back and forth in the Y direction (depth direction of the device) by an evaporation source moving mechanism (not shown). In this embodiment, the deposition unit 12 is provided in a vacuum chamber 110 together with an alignment device 2 described later.

<Alignment device>
The film forming apparatus 1 includes an alignment device 200 that aligns a substrate 1 and a mask 2. The alignment device 200 includes a holding device 300 that holds the substrate 1, a mask support unit 9, a position measurement unit 10, a measurement unit 13, and a vibration isolation unit 120. The holding device 300 also includes a holding unit 3 that holds the substrate 1, etc. Each component of the alignment device 200 will be described below.

The mask support unit 9 includes a mask table 91, a mask support column 92, a mask lifting mechanism 93, and an airtight member 94. The mask table 91 is fixed to the mask support column 92. The mask support column 92 is connected to the mask lifting mechanism 93 through an airtight member 94 provided between the support frame 130 and the ceiling 113. The mask lifting mechanism 93 is provided on the support frame 130, and raises and lowers the mask support column 92 in the Z direction. The airtight member 94 is, for example, a bellows, and is airtight and elastic. The airtight member 94 can prevent the vacuum level of the vacuum chamber 110 from being compromised when the mask support column 92 is raised and lowered.

The position measurement unit 10 measures the position of the holding unit 3 that holds the substrate 1. A plurality of position measurement units 10 are arranged on the mask stage 91 so as to measure the positions of the holding unit 3 in the X, Y, and Z directions (only one of them is shown in FIG. 2). Based on the position information of the holding unit 3 in each direction measured by the position measurement unit 10, the floating attitude (e.g., the inclination with respect to the X-Y plane) and floating position (e.g., the position in the Z direction) of the holding unit 3 can be adjusted. The position measurement unit 10 may use, for example, a laser displacement meter that measures the distance to the object in a non-contact manner.

The measurement unit 13 measures the positional deviation between the substrate 1 and mask 2 held by the holding unit 3. The measurement unit 13 is provided on the support frame 130, and can capture an image of the inside of the vacuum chamber 110 through

windows

130a, 113a formed in the support frame 130 and the vacuum chamber top plate 113. Alignment marks (not shown) are formed on the substrate 1 and mask 2, respectively. The measurement unit 13 captures the alignment marks of the substrate 1 and mask 2. Based on the measurement results of the measurement unit 13, the control device 140 (described later) controls the holding device 300 to eliminate the positional deviation of each alignment mark, and adjusts the relative positions of the substrate 1 and mask 2.

The measurement unit 13 can use multiple types of alignment cameras, such as a low-magnification CCD camera (rough camera) with a relatively wide field of view but low resolution, and a high-magnification CCD camera (fine camera) with a relatively narrow field of view but high resolution (for example, on the order of a few μm). This makes it possible to measure the rough positional misalignment between the substrate 1 and mask 2 while also measuring the positional misalignment between the substrate 1 and mask 2 with high accuracy.

The vibration isolation unit 120 is composed of a vibration isolation table base 121, a vibration isolation table 122, etc. The vibration isolation section 120 may be, for example, an active vibration isolation device or a passive vibration isolation device such as a vibration isolation rubber. The vibration isolation unit 120 is provided on top of the vacuum chamber top plate 113, and when vibration occurs in the vacuum chamber 110, it suppresses the transmission of vibration to the support frame 130 side. This allows the alignment device 200 to perform highly accurate alignment even when vibration occurs in the vacuum chamber 110.

<Holding device>
The holding device 300 will be described with reference to Fig. 3 in addition to Fig. 2. Fig. 3 is an enlarged view of the holding device 300 and its periphery in Fig. 2. The holding device 300 includes a holding unit 3 that holds a substrate, a support unit 7 that supports the holding unit 3 in a floating state, and a position adjustment unit 8 that displaces the holding unit 3.

The holding unit 3 has a holding part 6 that holds the substrate 1, and a main body part 5 that is a plate member that supports the holding part 6. The holding part 6 is provided on the lower surface D of the main body part 5. The holding part 6 is, for example, an electrostatic chuck that attracts the substrate 1 by electrostatic force. The electrostatic chuck has a structure in which an electric circuit such as a metal electrode is embedded inside a matrix (also called a base) made of a ceramic material, for example. When a positive (+) and negative (-) voltage is applied to the metal electrode, a polarized charge is induced in the substrate 1 through the ceramic matrix, and the electrostatic attraction (electrostatic force) between the substrate 1 and the holding part 6 fixes the substrate 1 to the attraction surface (lower surface) of the holding part 6.

The support unit 7 of this embodiment supports the holding unit 3 in a levitated state by magnetic force. The support unit 7 includes a magnetic force generating unit 7a provided on the main body 5 and a magnetic force generating unit 7b provided on the fixed member 4. The fixed member 4 is fixed to the vacuum chamber 110 and supports the magnetic force generating unit 7b. The magnetic

force generating units

7a and 7b are permanent magnets. The magnetic attraction force (or magnetic repulsion force) between the magnetic

force generating units

7a and 7b allows the holding unit 3 to be magnetically levitated and supported without contact with the fixed member 4. The support unit 7 is capable of generating a levitation force equivalent to the weight of the holding unit 3 itself.

The position adjustment unit 8 in this embodiment is a unit that displaces the holding unit 3 by magnetic force, and is, for example, a linear motor. The position adjustment unit 8 has a magnetic force generating unit 8a provided on the main body 5 and a magnetic force generating unit 8b provided on the fixed member 4. One of the magnetic

force generating units

8a and 8b is a permanent magnet, and the other is an electromagnet.

The position adjustment unit 8 is provided in multiple sets (see FIG. 6, etc., described later), and can adjust the holding unit 3 in translation in the X, Y, and Z directions, in rotation around the X, Y, and Z axes, and in posture (tilt with respect to the horizontal direction).

<Control device>
The control device 140 controls the entire film forming apparatus 100. The control device 140 includes a processing unit 140a, a storage unit 140b, an input/output interface (I/O) 140c, and a communication unit 140d. The processing unit 140a is a processor such as a CPU, and controls the film forming apparatus 100 by executing a program stored in the storage unit 140b. The storage unit 140b is a storage device such as a ROM, RAM, or HDD, and stores various control information in addition to the program executed by the processing unit 140a. The I/O 140c is an interface that transmits and receives signals between the processing unit 140a and an external device. The communication unit 140d is a communication device that communicates with the above-mentioned devices or other control devices via a communication line.

<Example of film formation device operation>
An operation example of the film forming apparatus 100 will be described with reference to Fig. 4 and Fig. 5. Fig. 4 and Fig. 5 show an example of a state of the film forming apparatus 100 when the substrate 1 is carried into the inside 114 of the vacuum chamber, the substrate 1 is aligned with the mask 2, and then a film of a deposition material is formed on the substrate 1.

State ST41 in FIG. 4 shows an example of the state of the film forming apparatus 100 before the substrate 1 is loaded into the internal space 114 of the vacuum chamber 110 by the transfer robot 402a shown in FIG. 1. The mask stage 91 is lowered by the mask lifting mechanism 93. From state ST41 in FIG. 4, the substrate 1 is loaded into the internal space 114, and the substrate 1 is held by the holding portion 6 of the holding unit 3.

State ST42 in Figure 4 shows the state of the film forming apparatus 100 during the alignment operation of the substrate 1 and mask 2. The substrate 1 is held by the holder 6. The mask 2 is raised to the alignment position. The alignment of the substrate 1 and mask 2 is performed with the substrate 1 and mask 2 spaced apart very slightly. In Figures 4 and 5, the gap between the substrate 1 and mask 2 is exaggerated to make the operation easier to understand.

In the alignment operation, first, the levitation position of the holding unit 3 is measured by the position measurement unit 10 provided on the mask stage 91. Based on the information measured by the position measurement unit 10, the control device 140 shown in FIG. 1 performs coordinate conversion and calculates position information of the holding unit 3 in six degrees of freedom (X direction, Y direction, Z direction, θX direction, θY direction, and θZ direction). Based on the position information of the six degrees of freedom of the holding unit 3, the control device 140 controls the position adjustment unit 8 to adjust the levitation position of the holding unit 3. The position adjustment unit 8 maintains the levitation attitude of the holding unit 3 horizontally. In this way, the levitation attitude of the holding unit 3 is adjusted horizontally, making it possible to perform a highly accurate alignment operation.

Next, the measurement unit 13 photographs the alignment marks on the substrate 1 and mask 2, and measures the amount of misalignment between the substrate 1 and mask 2. The "amount of misalignment" refers to the amount of relative misalignment between the substrate 1 and mask 2 in the X direction, Y direction, and the θ direction around the Z axis. The control device 104 controls the position adjustment unit 8 so as to reduce the amount of misalignment, and the position of the holding unit 3 is adjusted. Measurement and position adjustment are repeated until the amount of misalignment falls within the allowable range. This adjusts the relative position of the substrate 1 with respect to the mask 2.

Once the alignment operation is complete, the substrate 1 is placed on the mask 2. As shown in state ST51 of FIG. 5, the cooling plate 11a and magnet plate 11b of the plate unit 11 are lowered into the opening 50a of the main body 5. The plate unit 11 is lowered toward the opening 50a of the main body 5, and the cooling plate 11a approaches the holder 6 as shown in state ST52 of FIG. 5. The mask 2 is attracted by the magnetic force of the magnet plate 11b, and the mask 2 and the substrate 1 can be brought into close contact as a whole. After that, a film formation process is performed in which the deposition material is released from the deposition unit 12 through the mask 2 onto the substrate 1. A thin film of the deposition material is formed on the substrate 1.

<Structure of holding unit>
The structure of the holding unit 3 will be described in detail. As described above, the alignment operation for adjusting the positional deviation between the substrate 1 and the mask 2 is performed in a state in which the holding unit 3 is floating. By disposing a weight member on the main body 5, the weight balance of the holding unit 3 can be adjusted, and the floating attitude of the holding unit 3 can be easily made horizontal. On the other hand, depending on the arrangement of the weight member, the vibration characteristics of the holding unit 3 may be affected. In this embodiment, a structure is shown in which the floating attitude of the holding unit 3 is adjusted by the weight member, while the influence of the weight member on the vibration characteristics is suppressed by the arrangement of the weight member. FIG. 6 is a plan view of the holding unit 3, and corresponds to the view in the direction of the arrow A-A in FIG. 3. FIG. 7 is a perspective view of the holding unit 3. In the following description, for convenience, the Y direction may be called the front-rear direction and the X direction may be called the left-right direction.

The main body 5 forms the outer shape of the holding unit 3 in a plan view. The outer shape of the main body 5 is polygonal, and in particular rectangular (square). Point P is the centroid of the outer shape of the main body 5. The main body 5 is a plate-like member having a circular opening 50a in its center. The opening 50a is large enough to allow the cooling plate 11a and magnet plate 11b of the plate unit 11 to pass through.

The main body 5 has a front edge 5F and a rear edge 5B that face each other in the Y direction, and a left edge 5L and a right edge 5R that face each other in the X direction between the front edge 5F and the rear edge 5B, and also has corners 5a to 5d. The

corners

5a and 5b are corners at both ends of the front edge 5F. The

corners

5c and 5d are corners at both ends of the rear edge 5B. The

corners

5a and 5d are corners at both ends of the left edge 5L. The

corners

5b and 5c are corners at both ends of the right edge 5R. The front edge 5F and the rear edge 5B are parallel, and the left edge 5L and the right edge 5R are parallel. The direction of the front edge 5F and the rear edge 5B is perpendicular to the direction of the left edge 5L and the right edge 5R.

The upper surface U of the main body 5 is provided with the magnetic force generating portion 7b of the support unit 7, the magnetic force generating portion 8b of the position adjustment unit 8, and the weight member 15. Surface U is the surface on the side of the fixed member 4. The lower surface D of the main body is provided with the holding portion 6. Surface D is the surface on the side to which the mask 2 is attracted.

The holding device 300 of this embodiment has four support units 7 and four position adjustment units 8. Therefore, four magnetic force generating units 7b and four magnetic force generating units 8b are provided on the upper surface U of the main body 5. The four magnetic force generating units 7b and the four magnetic force generating units 8b are arranged at diagonal positions on the main body 5. Two of the four magnetic force generating units 8b extend in the Y direction, and the remaining two extend in the X direction.

In this embodiment, a total of four weight members 15 are provided on each of the

sides

5F, 5B, 5L, and 5R. The floating attitude of the holding unit 3 can be adjusted by tuning the weight of each weight member 15. In this embodiment, the weight members 15 are detachably attached to the main body 5 using a fastener 150. The fastener 150 is, for example, a bolt that screws into a screw hole formed in the main body 5. Weight members 15 of different weights can be easily replaced, making it easier to adjust the floating attitude of the holding unit 3.

Each weight member 15 is provided along the

corresponding side

5F, 5B, 5L, or 5R. Each weight member 15 is positioned closer to the center 51-54 than the end (corner 5a-5d) of the corresponding side 5F-5R.

For example, the weight member 15 arranged along the front edge 5F is positioned closer to the center 51 of the front edge 5F than the

corners

5a and 5b. Similarly, the weight member 15 arranged along the rear edge 5B is positioned closer to the center 53 of the rear edge 5B than the

corners

5c and 5d. The weight member 15 arranged along the left edge 5L is positioned closer to the center 52 of the left edge 5L than the

corners

5b and 5c. The weight member 15 arranged along the right edge 5R is positioned closer to the center 54 of the right edge 5R than the

corners

5a and 5d.

In this embodiment, the positions of the weight members 15 along the corresponding

sides

5F, 5B, 5L, and 5R are arranged so that their longitudinal centers (in other words, the centroids in plan view) are located at the centers 51 to 54 of the corresponding

sides

5F, 5B, 5L, and 5R, respectively, but the positions of the weight members 15 are not limited to this.

The position of the weight member 15 will be described with reference to Figures 8A and 8B. Figures 8A and 8B are explanatory diagrams and are schematic diagrams of the main body 5. Figure 8A is a schematic diagram explaining the range of the weight member 15 along the side 5F of the main body 5. The range of the range is, for example, range L12, which is 3/5 of the range centered on the center 51 of the length L1 of the side 5F divided into 5 equal parts. Length L1 is also the length (separation distance) between side 5L and side 5R.

The arrangement range may be a range L11 narrower than L12. Range L11 is 2/4 of the range centered on the center 51 of the length L1 of the side 5F divided into four equal parts. The arrangement range may be a range L10 narrower than L11. Range L10 is 1/3 of the range centered on the center 51 of the length L1 of the side 5F divided into three equal parts. In this embodiment, the weight member 15 is arranged within range L10.

FIG. 8B is a diagram showing a range similar to range L10 of side 5F for each of

sides

5B, 5L, and 5R.

Range L20 is one-third of the length L2 of side 5R, centered on center 52, and in this embodiment, the corresponding weight member 15 is disposed within range L20. Length L2 is also the length (separation distance) between side 5F and side 5B.

Range L30 is one-third of the length L3 of side 5B, centered on center 53, and in this embodiment, the corresponding weight member 15 is disposed within range L30. Length L3 is also the length (separation distance) between side 5L and side 5R.

Range L40 is one-third of the length L4 of side 5L, centered on center 54, and in this embodiment, the corresponding weight member 15 is disposed within range L40. Length L4 is also the length (separation distance) between side 5F and side 5B.

With the above configuration, in this embodiment, by arranging the weight members 15 closer to the centers 51-54 of each side 5F-5L than the corners 5a-5d of the main body 5, the effect of the weight members 15 on the vibration characteristics of the holding unit 3, particularly on the natural frequency, can be suppressed as described below.

The vibration characteristics of the main body 5 will be described with reference to FIG. 9. FIG. 9 is a schematic diagram showing the primary natural vibration mode of the main body 5 without the weight member 15. When the holding unit 3 is displaced, the main body 5 generates micro-vibrations. In the primary natural vibration mode, due to the material shape of the main body 5, the amplitude is large at the corners 5a to 5d and small at the centers 51 to 54 of each side 5F to 5L. Therefore, when the weight member 15 is placed near the corners 5a to 5d, it acts in a direction that increases the amplitude of the vibration. By placing the weight member 15 closer to the centers 51 to 54 of the main body 5 than the corners 5a to 5d, the increase in the amplitude of the vibration can be reduced and the decrease in the natural frequency can be suppressed.

Furthermore, since the center (center of gravity) P of the main body 5 is closer to the center 51-54 side than the corners 5a-5d, the moment of inertia acting on the weight member 15 is smaller by placing the weight member 15 on the center 51-54 side. Therefore, as in this embodiment, the influence of the weight member 15 can be suppressed by placing the weight member 15 on the center 51-54 side of each side 5F-5L rather than the corners 5a-5d of the main body 5. In the example of FIG. 8A, the influence of the vibration characteristics can be reduced by placing the weight member 15 in range L11 rather than range L12, and furthermore, the influence of the vibration characteristics can be reduced by placing the weight member 15 in range L10 rather than range L11.

<Method of Manufacturing Electronic Device>
Next, an example of a method for manufacturing an electronic device will be described. Below, as an example of an electronic device, the configuration and manufacturing method of an organic EL display device will be illustrated. In this example, the deposition block 401 illustrated in FIG. 1 is provided in, for example, three places on the manufacturing line.

First, we will explain the organic EL display device to be manufactured. Figure 10A is an overall view of organic EL display device 500, and Figure 10B is a diagram showing the cross-sectional structure of one pixel.

As shown in FIG. 10A, a plurality of pixels 510, each of which includes a plurality of light-emitting elements, are arranged in a matrix in a display region 501 of an organic EL display device 500. As will be described in detail later, each of the light-emitting elements has a structure including an organic layer sandwiched between a pair of electrodes.

Note that the pixel here refers to the smallest unit that allows a desired color to be displayed in the display region 501. In the case of a color organic EL display device, the pixel 510 is configured by a combination of multiple sub-pixels of a first light-emitting element 510R, a second light-emitting element 510G, and a third light-emitting element 510B that emit light differently from each other. The pixel 510 is often configured by a combination of three types of sub-pixels: a red (R) light-emitting element, a green (G) light-emitting element, and a blue (B) light-emitting element, but is not limited to this. The pixel 510 needs to include at least one type of sub-pixel, and preferably includes two or more types of sub-pixels, and more preferably includes three or more types of sub-pixels. The sub-pixels that make up the pixel 510 may be, for example, a combination of four types of sub-pixels: a red (R) light-emitting element, a green (G) light-emitting element, a blue (B) light-emitting element, and a yellow (Y) light-emitting element.

FIG. 10B is a schematic partial cross-sectional view taken along line A-B in FIG. 10A. The pixel 510 has a plurality of sub-pixels on a substrate 520, each of which is composed of an organic EL element having a first electrode (anode) 521, a hole transport layer 522, a red layer 522R, a green layer 522G, or a blue layer 522B, an electron transport layer 523, and a second electrode (cathode) 528. Of these, the hole transport layer 522, the red layer 522R, the green layer 522G, the blue layer 522B, and the electron transport layer 523 correspond to organic layers. The red layer 522R, the green layer 522G, and the blue layer 522B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively.

The first electrode 521 is formed separately for each light-emitting element. The hole transport layer 522, the electron transport layer 523, and the second electrode 522 may be formed in common across multiple light-emitting

elements

510R, 510G, and 510B, or may be formed for each light-emitting element. That is, as shown in FIG. 10B, the hole transport layer 522 may be formed as a common layer across multiple sub-pixel regions, and the red layer 522R, the green layer 522G, and the blue layer 522B may be formed separately for each sub-pixel region on top of the hole transport layer 522, and the electron transport layer 523 and the second electrode 522 may be formed on top of the hole transport layer 522 as a common layer across multiple sub-pixel regions.

In order to prevent short circuits between adjacent first electrodes 521, an insulating layer 529 is provided between the first electrodes 521. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer 530 is provided to protect the organic EL element from moisture and oxygen.

In FIG. 10B, the hole transport layer 522 and the electron transport layer 523 are shown as a single layer, but depending on the structure of the organic EL display element, they may be formed of multiple layers including a hole blocking layer and an electron blocking layer. In addition, a hole injection layer having an energy band structure that allows holes to be smoothly injected from the first electrode 521 to the hole transport layer 522 may be formed between the first electrode 521 and the hole transport layer 522. Similarly, an electron injection layer may be formed between the second electrode 528 and the electron transport layer 523.

Each of the red layer 522R, green layer 522G, and blue layer 522B may be formed of a single light-emitting layer, or may be formed by laminating multiple layers. For example, the red layer 522R may be configured of two layers, with the upper layer being a red light-emitting layer and the lower layer being a hole transport layer or an electron blocking layer. Alternatively, the lower layer may be formed of a red light-emitting layer and the upper layer being an electron transport layer or a hole blocking layer. In this way, by providing a layer below or above the light-emitting layer, the light-emitting position in the light-emitting layer can be adjusted, and the optical path length can be adjusted, thereby improving the color purity of the light-emitting element.

Note that although an example of the red layer 522R is shown here, a similar structure may also be adopted for the green layer 522G and the blue layer 522B. The number of layers may be two or more. Furthermore, layers of different materials may be laminated, such as a light-emitting layer and an electron blocking layer, or layers of the same material may be laminated, for example, two or more light-emitting layers may be laminated.

Next, an example of a manufacturing method for an organic EL display device will be specifically described. Here, it is assumed that the red layer 522R is composed of two layers, a lower layer 522R1 and an upper layer 522R2, and the green layer 522G and the blue layer 522B are composed of a single light-emitting layer. Six deposition chambers are assumed as the deposition chambers 403.

First, a circuit (not shown) for driving the organic EL display device 500 and a substrate 520 on which a first electrode 521 are formed are prepared. The material of the substrate 520 is not particularly limited, and it can be made of glass, plastic, metal, or the like. In this embodiment, a substrate in which a polyimide film is laminated on a glass substrate is used as the substrate 520.

A resin layer such as acrylic or polyimide is coated by bar coating or spin coating on the substrate 520 on which the first electrode 521 is formed, and the resin layer is patterned by lithography so that an opening is formed in the portion where the first electrode 521 is formed, forming the insulating layer 529. This opening corresponds to the light-emitting region where the light-emitting element actually emits light. Note that in this embodiment, processing is performed on the large substrate up to the formation of the insulating layer 529, and after the insulating layer 529 is formed, a division process is carried out to divide the substrate 520.

The substrate 520 with the patterned insulating layer 529 is carried into the first film forming apparatus 100, and the hole transport layer 522 is formed as a common layer on the first electrode 521 of the display area. The hole transport layer 522 is formed using a mask with an opening for each display area 501 that will eventually become the panel portion of each organic EL display device.

Next, the substrate 520 on which the hole transport layer 522 has been formed is carried into the second film formation chamber 403. The substrate 520 and the mask are aligned, the substrate 520 is placed on the mask, and the red layer 56R is formed on the hole transport layer 522 in the portion of the substrate 520 where the red emitting element is to be arranged (the region where the red subpixel is formed). Here, the mask used in the second film formation apparatus is a high-definition mask in which openings are formed only in the multiple regions that will become the red subpixels among the multiple regions on the substrate 520 that will become the subpixels of the organic EL display device 500. As a result, the red layer 522R including the red light emitting layer is formed only in the multiple regions that will become the red subpixels among the multiple regions on the substrate 520 that will become the subpixels. In other words, the red layer 522R is selectively deposited in the regions that will become red subpixels, but not in the regions that will become blue subpixels or green subpixels among the regions on the substrate 520 that will become subpixels.

Similar to the formation of the red layer 522R, the green layer 522G is formed in the third film formation chamber 503, and then the blue layer 522B is formed in the fourth film formation chamber 503. After the formation of the red layer 522R, the green layer 522G, and the blue layer 522B is completed, the electron transport layer 523 is formed over the entire display area 501 in the fifth film formation device 100. The electron transport layer 523 is formed as a layer common to the three

color layers

522R, 522G, and 522B.

The substrate on which the electron transport layer 523 has been formed is moved to the sixth deposition chamber 403, where the second electrode 528 is formed. In this embodiment, the layers are formed by vacuum deposition in the first deposition chamber 403 to the sixth deposition chamber 403. However, the present invention is not limited to this, and for example, the second electrode 528 in the sixth deposition chamber 403 may be formed by sputtering. Thereafter, the substrate on which the second electrode 528 has been formed is moved to a sealing device, and the protective layer 530 is formed by plasma CVD (sealing process), completing the organic EL display device 500. Note that, although the protective layer 530 is formed by the CVD method here, the method is not limited to this, and it may also be formed by the ALD method or the inkjet method.

Second Embodiment
In the first embodiment, the weight member 15 is disposed on the upper surface U of the main body 5, but the location of the weight member 15 is not limited thereto.

FIG. 11A shows an example in which the weight member 15 is arranged on the side of the main body 5. FIG. 11B shows an example in which the weight member 15 is arranged on the bottom surface U of the main body 5. In this way, the weight member 15 may be arranged on the side of the main body 5 or on the bottom surface U along the corresponding

sides

5F, 5B, 5L, and 5L.

In addition, as a mode for arranging the weight member 15 in region L10, in addition to the mode in which the entire weight member 15 is arranged in region L10 as in the first embodiment, a mode in which a part of the weight member 15 protrudes from region L10 but the center of gravity is arranged in region L10 may also be used. Figure 11C shows one example. The weight member 15 arranged along side 5F has both ends in the longitudinal direction protruding slightly from region L10, but its center of gravity position P' is located within region L10. The same applies to each of the weight members 15 along the

other sides

5B, 5L, and 5R.

The weight member 15 may be entirely or partially embedded inside the main body 5. FIG. 12 shows an example in which the weight member 15 is disposed in a recess 50b provided on the upper surface U of the main body 5. By providing the weight member 15 so that it is embedded in the main body 5, it is possible to prevent the center of gravity P' of the weight member 15 from becoming high. Therefore, it is possible to suppress the effects of the vibration characteristics of the holding unit 3 while increasing the stability of the levitation posture of the holding unit 3.

Third Embodiment
In the first embodiment, the weight members 15 are provided on each of the

sides

5F, 5B, 5L, and 5R, but there may be sides on which the weight members 15 are not provided. Figures 13A and 13B show another example of the arrangement of the weight members 15. Figure 13A shows an example in which the weight members 15 are arranged along the

sides

5L and 5R of the main body 5, and two weight members 15 are provided in total. No weight members 15 are provided corresponding to the

sides

5F and 5B.

The weight member 15 may be composed of multiple weight portions. In the example of FIG. 13B, the weight member 15 is composed of multiple weight portions 15'. By adjusting the number of weight portions 15', the weight of each weight member 15 can be easily adjusted.

Fourth Embodiment
The outer shape of the main body 5 can be various polygonal shapes. Fig. 14A shows a shape in which chamfered portions 5g are provided at the corners 5a to 5d of the main body 5, and the shape is generally rectangular, more precisely, octagonal. The weight members 15 arranged along the side 5F are arranged closer to the center than both ends e1 of the side 5F, and are arranged within a range L10. As an example, the range L10 is 1/3 of the length L1 between the side 5L and the side 5R divided into three equal parts, the range being centered on the center of the side 5F.

The weight member 15 arranged along the side 5R is arranged closer to the center than both ends e2 of the side 5R, and is arranged within the range L20. As an example, the range L20 is 1/3 of the length L2 between the side 5F and the side 5B divided into three equal parts, with the center of the side 5R being the center.

The weight member 15 arranged along the side portion 5B is arranged closer to the center than both ends e3 of the side portion 5B, and is arranged within the range L30. As an example, the range L30 is 1/3 of the range centered on the center of the side portion 5B, when the length L3 between the

side portions

5L and 5R is divided into three equal parts.

The weight members 15 arranged along the side 5L are arranged closer to the center than both ends e4 of the side 5L, and are arranged within the range L40. As an example, the range L40 is 1/3 of the range centered on the center of the side 5L, when the length L4 between the side 5F and the side 5B is divided into three equal parts.

Fig. 14B shows a form in which the corners 5a-5d of the main body 5 are rounded (arc-shaped). In this example, the weight members 15 arranged along the side 5F are arranged closer to the center than both ends e1 of the side 5F, and are arranged within the range L10. As an example, the range L10 is 1/3 of the length L1 between the side 5L and the side 5R, divided into three equal parts, with the center being the center of the side 5F.

The weight member 15 arranged along the side portion 5B is arranged closer to the center than both ends e3 of the side portion 5B, and is arranged within the range L30. As an example, the range L30 is 1/3 of the length L3 between the

side portions

5L and 5R divided into three equal parts, with the center of the side portion 5B as the center.

In addition to the above examples, the external shape of the main body 5 can also be a triangle, hexagon, etc.

The invention is not limited to the above-described embodiment, and various modifications and variations are possible without departing from the spirit and scope of the invention. Therefore, the following claims are attached to publicly disclose the scope of the invention.

1. Substrate, 2. Mask, 3. Holding unit, 4. Fixing member, 5. Main body, 6. Holding unit, 7. Support unit, 8. Position adjustment unit, 9. Mask support unit, 10. Position measurement unit, 11. Plate unit, 12. Vapor deposition unit, 13. Measurement unit, 15. Weight member, 100. Film deposition device, 200. Alignment device, 300. Holding device

Claims

A holding means for holding an object;
a support means for supporting the holding means in a floating state;
a first weight member provided on the holding means;
A holding device comprising:
The outer shape of the holding means is a polygon including a first side,
the first weight member is disposed along the first side portion and is disposed closer to a center of the first side portion than an end portion of the first side portion;
A holding device characterized in that
The first weight member is disposed in a central third of the length of the first side portion, the central third of the length being divided into thirds.
2. The holding device according to claim 1.
The first weight member is detachably disposed on the holding means.
2. The holding device according to claim 1.
Further comprising a position adjustment means for displacing the holding means.
2. The holding device according to claim 1.
Further comprising a second weight member provided on the holding means,
The polygonal shape is
a second side portion opposed to the first side portion,
the second weight member is disposed along the second side portion and is disposed closer to a center of the second side portion than an end portion of the second side portion.
2. The holding device according to claim 1.
The holding means further includes a third weight member and a fourth weight member,
The polygonal shape is
a third side portion and a fourth side portion between the first side portion and the second side portion,
the third weight member is disposed along the third side portion and is disposed closer to a center of the third side portion than an end portion of the third side portion;
the fourth weight member is disposed along the fourth side portion and is disposed closer to a center of the fourth side portion than an end portion of the fourth side portion;
6. A holding device according to claim 5.
the third side portion and the fourth side portion are sides in a direction perpendicular to a direction of the first side portion and the second side portion,
the first weight member is disposed in a central third of a length between the third side portion and the fourth side portion, the central third of the length being divided into thirds,
the second weight member is disposed in a central third of a length between the third side portion and the fourth side portion, the central third of the length being divided into thirds,
the third weight member is disposed in a central third of a length between the first side portion and the second side portion, the central third of the length being divided into thirds,
The fourth weight member is disposed in a central one-third portion of a length between the first side portion and the second side portion, the length being divided into three equal parts.
7. A holding device according to claim 6.
An alignment apparatus for adjusting the positions of a substrate and a mask, comprising:
A holding means for holding the substrate;
a support means for supporting the holding means in a floating state;
a first weight member provided on the holding means;
an adjustment means for adjusting positions of the substrate and the mask by displacing the holding means,
The outer shape of the holding means is a polygon including a first side portion and first corner portions on both sides of the first side portion,
the first weight member is disposed along the first side portion and is disposed closer to a center of the first side portion than the first corner portion;
An alignment apparatus comprising:
An alignment device according to claim 8 ;
A deposition means for depositing a deposition material on a substrate.
A film forming apparatus comprising:
A film forming method comprising forming a film on a substrate through a mask using the film forming apparatus according to claim 9.
A manufacturing method for manufacturing an electronic device using the film forming method described in claim 10.