WO2024125657A1

WO2024125657A1 - Circuit board module for lidar and manufacturing method thereof

Info

Publication number: WO2024125657A1
Application number: PCT/CN2023/139381
Authority: WO
Inventors: Jie Chen; Shaoqing Xiang
Original assignee: Hesai Technology Co., Ltd.
Priority date: 2022-12-16
Filing date: 2023-12-18
Publication date: 2024-06-20
Also published as: CN118215210A

Abstract

A circuit board module for a LiDAR includes a first circuit component including a first pad, and a second circuit component including a first surface, a second surface, and a via. The via penetrates through the first surface and the second surface. An inner sidewall of the via is provided with a conductive metal layer. The via is connected to the first pad through the conductive material disposed therein.

Description

CIRCUIT BOARD MODULE FOR LIDAR AND MANUFACTURING METHOD THEREOF

CROSS-REFERENCE TO RELATED APPLICATION (S)

This application claims priority to Chinese Patent Application No. 202211625678. X, filed on December 16, 2022, the content of which is incorporated herein by reference in its entirety.

TECHNICAL FIELD

This disclosure relates to a field of circuit technology, in particular to circuit board modules for a LiDAR and manufacturing methods thereof.

BACKGROUND

Typically, multiple printed circuit boards ( “PCBs” ) can be used in a LiDAR, and the multiple printed circuit boards can be connected through a flexible printed circuit ( “FPC” ) board. For example, the PCB at the transmitter or receiver of a LiDAR can be connected with a main controller board through the FPC.

The connection between the FPC and the PCB can be typically achieved based on paired pin plugs and sockets. For example, the PCB and the FPC can be provided with paired pin plugs and sockets respectively. However, pin plugs and sockets are expensive, and at least two pairs of pin plugs and sockets are required for connecting two PCBs through an FPC. The cost of the LiDAR can be significantly increased. The connection between PCB and FPC can also be obtained by combining the PCB and FPC together through processes like pressing to manufacture rigid-flex board. However, this method is costly with high processing difficulty, and the process is not stable.

Currently, a commonly used method to connect PCB with FPC can be using a hotbar process. For example, gold fingers can be provided on the FPC, pads can be provided on the PCB, and the gold fingers with pads can be soldered together based on tin paste. However, the soldering area is too large, and the soldering location is prone to be pulled and broken when the temperature is too high due to the difference in thermal expansion coefficient of the materials. Instability in the structure can be resulted. Additionally, it is difficult to control the amount of tin paste used at the soldering location. Solder overflow or false soldering can be caused. The reliability of the connection between PCB and the FPC can be affected.

SUMMARY

To solve the above technical problem, this disclosure provides a circuit board module for a LiDAR and a method for manufacturing the circuit board module.

In a first aspect, this disclosure provides a circuit board module for a LiDAR. The circuit board module includes: a first circuit component including a first pad, and a second circuit component including a first surface, a second surface and a via penetrating through the first surface and the second surface. An inner sidewall of the via has a conductive metal layer. The via is connected with the first pad through a conductive material in the via.

Optionally, a volume of the conductive material is 10%-90%of a volume of the via.

Optionally, the first circuit component includes at least one first pad, and the second circuit component includes at least one via, and the first pads are disposed corresponding to the vias.

Optionally, the first circuit component includes a plurality of first pads, and the second circuit component includes a plurality of vias, corresponding to the plurality of first pads.

Optionally, the vias are disposed at a first end and a second end of the second circuit component. A number of the vias at the first end is equal to a number of vias at the second end. The second circuit component further includes a metal wire, and the metal wire connects the vias at the first end and the second end of the second circuit component.

Optionally, a first number of the plurality of vias are disposed at a first end of the second circuit component, a second number of the plurality of vias are disposed at a second end of the second circuit component, and the first number is equal to the second number, and the second circuit component further includes a metal wire connecting the first number of vias and the second number of vias.

Optionally, the circuit board module further includes a third circuit component. The third circuit component includes a plurality of second pads disposed corresponding to the plurality of vias. The plurality of first pads are disposed corresponding to the first number of vias, and the first circuit component is connected with the second circuit component through the first number of vias. The plurality of second pads are disposed corresponding to the second number of vias, and the third circuit component is connected with the second circuit component through the second number of vias.

Optionally, the circuit board module further includes a third circuit component. The third circuit component includes second pads disposed corresponding to the vias. The first pads of the first circuit component are disposed corresponding to the vias at the first end of the second circuit component. The first circuit component is connected with the second circuit component through the vias at the first end of the second circuit component. The second pads of the third circuit component are disposed corresponding to the vias at the second end of the second circuit component. The third circuit component is connected with the second circuit component through the vias at the second end of the second circuit component.

Optionally, the first circuit component is a printed circuit board, the second circuit component is a flexible circuit board, and the third circuit component is a printed circuit board.

Optionally, the circuit board module includes at least one third circuit components. The first circuit component is a main controller board of the LiDAR. The third circuit component is at least one of a transmitter circuit board of the LiDAR, a receiver circuit board of the LiDAR, and a control circuit board for a scanning device of the LiDAR.

Optionally, the circuit board module comprising at least one third circuit components. The first circuit component is a main controller board of the LiDAR. The at least one third circuit component is at least one of a transmitter circuit board of the LiDAR, a receiver circuit board of the LiDAR, or a control circuit board for a scanning device of the LiDAR.

Optionally, the first number of vias at the first end of the second circuit component are arranged in a first direction and in a first row, and the second number of vias at the second end of the second circuit component are arranged in the first direction or a second direction, and are arranged in a second row.

Optionally, the vias at the first end of the second circuit component are arranged in a first direction and arranged in at least one row. The vias at the second end of the second circuit component are arranged in the first direction or a second direction and arranged in at least one row.

Optionally, two adjacent rows of vias at a same end of the second circuit component are staggered in an arrangement direction.

Optionally, the via includes a flange disposed on the first surface.

Optionally, a distance between two adjacent vias in a same row is greater than a first threshold. The first threshold is greater than a sum of an outer diameter of the via and a width of the metal wire. The outer diameter of the via is an outer diameter of the flange.

Optionally, the metal wire is located on at least one of the first surface or the second surface of the second circuit component.

Optionally, the second circuit component further includes a through hole penetrating through the first surface and the second surface. The metal wire on the second surface extends through the through hole to the first surface.

Optionally, the plurality of the first pads are disposed close to an edge of the first circuit component.

Optionally, the circuit board module further includes fixing adhesive between the first circuit component and the second circuit component, and the fixing adhesive at least partially surrounds the plurality of first pads.

Optionally, the first circuit component includes a first alignment part. The second circuit component includes a second alignment part disposed corresponding to the first alignment part.

In a second aspect, this disclosure relates to a method for manufacturing a circuit board module of this disclosure. The method includes: aligning the second circuit component of this disclosure with the first circuit component of this disclosure, and pressing the second circuit component and the first circuit component together; applying a conductive material in the via; and connecting the inner sidewall of the via with the first pad through the conductive material.

In a third aspect, this disclosure provides a method for manufacturing a circuit board module of this disclosure. The method includes: applying a conductive material on the first pad of the first circuit component of this disclosure, so that the conductive material are in the via of the second circuit component after the first circuit component and the second circuit component of this disclosure are aligned and pressed together; aligning the second circuit component with the first circuit component and pressing the second circuit component and the first circuit component together; and connecting the inner sidewall of the via with the first pad through the conductive material.

In a fourth aspect, this disclosure provides a method for manufacturing a circuit board module of this disclosure. The method includes applying a conductive material on the first pad of the first circuit component; aligning the second circuit component with the first circuit component and pressing the second circuit component and the first circuit component together, the conductive material is in the via of the second circuit component; connecting the inner sidewall of the via with first pad through the conductive material.

In a fifth aspect, this disclosure provides a circuit board of a LiDAR. The circuit board includes a first circuit comprising a first pad; and a second circuit comprising a first surface, a second surface and a via penetrating through the first surface and the second surface, wherein an inner sidewall of the via has a conductive metal layer, and the via is connected with the first pad through a conductive material in the via.

Optionally, the first circuit further includes a plurality of first pads, and the second circuit further includes a plurality of vias corresponding to the plurality of first pads.

Optionally, a first number of the plurality of vias are disposed at a first end of the second circuit, a second number of the plurality of vias are disposed at a second end of the second circuit, and the first number is equal to the second number, and the second circuit further includes a metal wire connecting a first via of the first number of vias and a second via of the second number of vias.

Optionally, the circuit board includes a third circuit. The third circuit includes a plurality of second pads, the plurality of first pads are disposed corresponding to the first number of vias, and the first circuit is connected with the second circuit through the first number of vias. The plurality of second pads are disposed corresponding to the second number of vias, and the third circuit is connected with the second circuit through the second number of vias.

Optionally, the first circuit is a printed circuit board, the second circuit is a flexible circuit board, and the third circuit is a printed circuit board.

Optionally, the first circuit is a main controller board of the LiDAR. The third circuit is at least one of a transmitter circuit board of the LiDAR, a receiver circuit board of the LiDAR, or a control circuit board for a scanning device of the LiDAR.

Optionally, the first number of vias are arranged in a first direction and in a first row, and the second number of vias are arranged in the first direction or a second direction, and are arranged in a second row.

Optionally, the first number of vias are arranged in a plurality of first rows, and two adjacent rows of vias in the plurality of first rows are staggered in the first direction, and the second number of vias are arranged in a plurality of second rows, and two adjacent rows of vias in the plurality of second rows are staggered in the first direction or in the second direction.

Optionally, the via includes a flange disposed on the first surface.

Optionally, a distance between two adjacent vias in the first row or in the second row is greater than a first threshold, and the first threshold is greater than a sum of an outer diameter of the via and a width of the metal wire, and the outer diameter of the via is an outer diameter of a flange of the via disposed on the first surface.

Optionally, the metal wire is located on at least one of the first surface or the second surface.

Optionally, the second circuit further includes a through hole penetrating through the first surface and the second surface, and the metal wire is on the second surface and extends through the through hole to the first surface.

Optionally, the plurality of first pads are disposed close to an edge of the first circuit.

Optionally, the circuit board further includes fixing adhesive between the first circuit and the second circuit, the fixing adhesive at least partially surrounds the plurality of first pads.

Optionally, the first circuit includes a first alignment part, and the second circuit includes a second alignment part disposed corresponding to the first alignment part.

In a sixth aspect, this disclosure provides a method for manufacturing a circuit board. The method includes applying a conductive material on a first pad of a first circuit of the circuit board; aligning a second circuit of the circuit board with the first circuit and pressing the second circuit and the first circuit together, wherein the conductive material is in a via of the second circuit; and connecting an inner sidewall of the via with the first pad through the conductive material.

In a seventh aspect, this disclosure provides a method for manufacturing a circuit board. The method includes aligning a first circuit of the circuit board with a second circuit of the circuit board; pressing the first circuit and the second circuit together; applying a conductive material in a via of the second circuit board; and connecting an inner sidewall of the via with a first pad of the first circuit through the conductive material.

In this disclosure, the first circuit component can include a first pad, and the second circuit component includes a via, and a metal conductive layer is provided on inner sidewall of the via. The via is connected with the first pad through the conductive material disposed therein. The first circuit component is connected with the second circuit component. In the circuit board module with the above structure, the connection is implemented by soldering. There is no need to provide paired pin plugs and sockets. The cost is low. In addition, by using the circuit board module with the above structure, as the conductive material is disposed in the vias, the amount of conductive material (e.g., tin paste) can be well controlled based on the volume of the via. Problems such as overflow of the conductive material or false soldering can be reduced or avoided. Furthermore, the connection area is smaller, the pulling at the joint caused by the difference in thermal expansion coefficients of the materials at high temperatures is smaller. The connection structure can be stable.

If the technical conditions permit, the technical solutions of various embodiments in this disclosure can be arbitrarily combined.

This disclosure is further described below in conjunction with the attached drawings. The same or similar labels can be used in the drawings to indicate the same or similar elements, devices, shapes, constructions, steps in different embodiments. Besides, descriptions on the same and similar elements, devices, shapes, structures, steps, features, effects in different embodiments can be omitted and descriptions on elements, devices, shapes, structures, steps, features, effects, or the like, the same as and similar to those in prior art can also be omitted.

BRIEF DESCRIPTION OF THE DRAWINGS

To more clearly explain the technical solutions in the embodiments of this disclosure or the prior art, an introduction to the drawings to be used in describing the embodiments or the prior art is provided as follows. The drawings described below are only used to illustrate embodiments of this disclosure. For those skilled in the art, additional drawings can also be obtained based on the drawings provided without creative work.

FIG. 1 shows a schematic section view of an example circuit board module for a LiDAR, consistent with some embodiments of this disclosure.

FIG. 2 shows a schematic top view of the example circuit board module in FIG. 1.

FIG. 3 shows a schematic top view of an example second circuit component, consistent with some embodiments of this disclosure.

FIG. 4 shows a schematic top view of the example second circuit component, consistent with some embodiments of this disclosure.

FIG. 5 shows a schematic top view of the example second circuit component, consistent with some embodiments of this disclosure.

FIG. 6 shows another schematic section view of the circuit board module in FIG. 1.

FIG. 7 shows a schematic flow chart illustrating an example method for manufacturing a circuit board module for a LiDAR, consistent with some embodiments of this disclosure.

FIG. 8 shows a schematic flow chart illustrating an example method for manufacturing a circuit board module for a LiDAR, consistent with some embodiments of this disclosure.

FIG. 9 shows an example schematic section view of the circuit board module of FIG. 1 in the manufacturing process.

DETAILED DESCRIPTION

The circuit board module of a LiDAR can include one or more circuit boards, and different circuit boards can be electrically connected with each other. During operation of the LiDAR, the internal temperature can increase. When reducing the connection cost of the circuit board module, stability of the connection between circuit boards can be ensured or improved, and pulling or break at joints due to difference in thermal expansion coefficients of the materials at high temperatures can be reduced or avoided. Additionally, based on the needs of circuit control or function, each circuit board can be provided with multiple sub-circuits for implementing different functions. When two circuit boards are connected, separate connection lines can be provided for different sub-circuits. As the number of lines and complexity of functions of the LiDAR increase, there can be more and more sub-circuits in the circuit board, and more and more connection lines need to be provided between the circuit boards. To limit the increasing size of the circuit board, the connection density of the connection lines between the circuit boards can be increased.

FIG. 1 shows a schematic section view of an example circuit board module 10 for a LiDAR, consistent with some embodiments of this disclosure. For example, FIG. 1 provides a circuit board module 10 for the LiDAR. The circuit board module 10 includes: a first circuit or first circuit component 12, and a second circuit or second circuit component 16. The first circuit component includes a first pad 14. The second circuit component 16 includes a first surface 18, a second surface 20 and a via 22. The via 22 penetrates through the first surface 18 and the second surface 20. The via 22 is provided with a conductive metal layer 23 on its inner sidewall. The via 22 is connected with the first pad 14 through a conductive material 24 disposed in the via 22 to connect the first circuit component 12 with the second circuit component 16.

In some embodiments, the conductive material 24 can be a solder material, such as a tin-lead solder material, a silver solder material, a copper solder material, or the like. The via 22 can be connected with the first pad 14 by soldering.

In some embodiments, the connection between the first circuit component 12 and the second circuit component 16 can be implemented through soldering without using paired pin plugs or sockets. By doing so, the costs can be reduced. In addition, as the conductive material 24 is disposed in the via 22, the amount of the conductive material 24 used (e.g., the tin-lead solder material, the silver solder material, the copper solder material, or the like) can be better controlled to reduce or avoid problems such as overflow of the conductive material or false soldering.

In some cases, due to the difference between thermal expansion coefficients of the connected material and the conductive material 24, a significant change in thermal expansion can occur when the temperature increases. Such thermal expansion can cause breaks at the soldering location due to large stress generated at soldering position. For example, the thermal expansion coefficient of the connected first pad 14 can typically be smaller than the thermal expansion coefficient of the conductive material 24. Because of the large difference in the thermal expansion coefficients, significant difference in size can be generated when the temperature increases. Large stress can be generated at the soldering position. In such cases, the soldering location can be broken.

In some embodiments, because the connection area can be small, the difference in size change caused by the difference in thermal expansion coefficients can also be small when the temperature changes. Pulling at the joint caused by the difference in thermal expansion coefficients of material at high temperatures can be small. In such scenarios, the connection structure can be stable. Furthermore, when selecting the conductive material, the conductive material with a thermal expansion coefficient close to the thermal expansion coefficient of the connected material can be selected to further reduce or avoid the problem of pulling and breaking due to the difference in thermal expansion coefficients.

Unless otherwise specified, the circuit board module 10 for the LiDAR can be any circuit board module applicable to the LiDAR, and the circuit board module can have any possible structure as long as it is applicable to this disclosure.

In some embodiments, still referring to FIG. 1, the first pad can be conductive. The first circuit component 12 can be soldered to another circuit board through the first pad 14 to create an electrical connection with the other circuit board. The first circuit component 12 can be a plate-like circuit of any shape (e.g., a rectangle, a circle, or any other shape) .

In some embodiments, the first surface 18 and the second surface 20 can be two opposite surfaces of the second circuit component 16. The via 22 can be a through hole of any shape, such as cylinder, cuboid, cube, or any other shape. The conductive metal layer 23 can be disposed on the inner sidewall of the via 22 by metal deposition. In some embodiments, the conductive metal layer 23 can be snapped to or adhered to the inner sidewall of the via 22. The conductive material 24 can be any material that can be used for electrical connection, such as tin paste, silver solder, or copper solder.

In some embodiments, the connection between the first circuit component 12 and the second circuit component 16 can be implemented by soldering the conductive material 24 inside the via 22. The soldering area can include a part of an area where the via 22 is connected with the conductive material 24 and a part of area where the first pad 14 is connected with the conductive material 24. The soldering area can be small. By doing so, pulling at the joints caused by the difference in thermal expansion coefficients of the materials being soldered together at high temperatures can be reduced, and breaks at the soldering location at high temperatures can be reduced or avoided, which is beneficial for the structural stability of the circuit board module 10.

In some embodiments, the amount of conductive material 24 used can be determined based on the volume of the via 22. By doing so, overflow due to excessive conductive material 24 or false soldering due to insufficient conductive material 24 can be reduced or avoided.

In some embodiments, a volume of the conductive material 24 can be 10%-90%of a volume of the via 22. For example, the volume of the conductive material 24 can be 30%of the volume of the via 22. As another example, the volume of the conductive material 24 can be 50%of the volume of the via 22. By doing so, usage of excessive conductive material 24 can be reduced or avoided. Short circuit between different soldering locations due to overflow of the conductive material 24 from the via 22 during soldering can also be reduced or avoided. The situation of using insufficient conductive material 24 and false soldering can also be reduced or avoided.

FIG. 2 shows a schematic top view of the example circuit board module 10 in FIG. 1. In some embodiments, referring to FIG. 2, the first circuit component 12 includes multiple first pads 14 (represented by dashed-line circles in FIG. 2) . The second circuit component 16 includes multiple vias 22 (represented by solid-line circles in FIG. 2) . The first pads 14 and the vias 22 are disposed correspondingly. By doing so, alignment between the vias 22 and the first pads 14 can be improved or ensured. After soldering, electrical connections between corresponding circuits of the first circuit component 12 and the second circuit component 16 can be achieved. In some embodiments, an outer diameter of the first pad 14 (e.g., the first pad 14 of FIG. 1 or one of the first pads 14 of FIG. 2) can be greater than or equal to an inner diameter of the via 22 (e.g., the first via 22 of FIG. 1 or one of the vias 22 of FIG. 2) . By doing so, the firmness and stability of the soldering can be improved or ensured.

In some embodiments, the corresponding disposition of the first pads 14 and the vias 22 is not limited by the number of first circuit components 12 and the number of the second circuit components 16. For example, the first pads 14 and the vias 22 disposed correspondingly can be included in one first circuit component 12 and one second circuit component 16, or in one first circuit component 12 and multiple second circuit components 16, or in multiple first circuit components 12 and one second circuit component 16, or the like.

FIG. 3 shows a schematic top view of an example second circuit component, consistent with some embodiments of this disclosure. FIG. 4 shows schematic a top view of the example second circuit component, consistent with some embodiments of this disclosure. FIG. 5 shows a schematic top view of the example second circuit component, consistent with some embodiments of this disclosure. In some embodiments, referring to FIGS. 3-5, the vias 22 are disposed at a first end 26 and a second end 28 of the second circuit component 16. The number of vias 22 at the first end 26 is equal to the number of vias 22 at the second end 28. The second circuit component 16 also includes metal wires 30. The metal wires 30 connects the vias 22 at the first end 26 of the second circuit component 16 with the vias 22 at the second end 28 of the second circuit component 16.

In FIGS. 3-5, the vias 22 at the first end 26 and the second end 28 of the second circuit component 16 are electrically one-to-one connected through the metal wires 30. By doing so, electrical connection between two circuit components at the two ends of the second circuit component 16 can be achieved. For example, referring back to FIG. 2, the first end 26 of the second circuit component 16 is connected to the first circuit component 12. The second end 28 of the second circuit component 16 is connected to the third circuit component 32. The corresponding circuits of the first circuit component 12 and the third circuit component 32 are electrically connected through the second circuit component 16.

In some embodiments, the arrangement directions of the vias 22 at the two ends of the second circuit component 16 can be the same or different. The vias 22 can be arranged arbitrarily at the two ends of the second circuit component 16 (e.g., the arrangement as shown in FIGS. 3-5) , as long as the number of vias 22 at one end of the second circuit component 16 is equal to the number of vias 22 at the other end.

In some embodiments, still referring to FIG. 2, the circuit board module 10 for the LiDAR further includes a third circuit component 32. The third circuit component 32 includes second pads 34 corresponding to the vias 22. The first pads 14 of the first circuit component 12 are disposed corresponding to the vias 22 at the first end 26 of the second circuit component 16. The first circuit component 12 is connected with the second circuit component 16 through the vias 22 at the first end 26 of the second circuit component 16. The second pads 34 of the third circuit component 32 are disposed corresponding to the vias 22 at the second end 28 of the second circuit component 16. The third circuit component 32 is connected with the second circuit component 16 through the vias 22 at the second end 28 of the second circuit component 16.

In some embodiments, as for the connection between the above third circuit component 32 and the second circuit component 16, by disposing the conductive material 24 in the vias 22, the third circuit component 32 can be connected with the second circuit component 16 through soldering. In this way, corresponding circuits of the first circuit component 12 and the third circuit component 32 can be electrically connected through the second circuit component 16. By doing so, there is no need to provide paired pin plugs and sockets, which can reduce cost. In addition, because the solder is disposed in the via, the amount of used tin paste can be better controlled. Problems such as solder overflow or false soldering can be reduced or avoided. Furthermore, because the soldering area can be small, pulling at the soldering location caused by the difference in thermal expansion coefficients of the materials at high temperatures can also be small. In such cases, a stable connection structure can be obtained.

In some embodiments, still referring to FIG. 2, the vias 22 at the first end 26 and the second end 28 of the second circuit component 16 are electrically one-to-one connected through the metal wires 30. The first pads 14 of the first circuit component 12 are disposed corresponding to the vias 22 at the first end 26 of the second circuit component 16. The first circuit component 12 and the second circuit component 16 are electrically connected by soldering the first pads 14 with the vias 22 at the first end 26. The second pads 34 of the third circuit component 32 are disposed corresponding to the vias 22 at the second end 28 of the second circuit component 16. The third circuit component 32 and the second circuit component 16 are electrically connected by soldering the second pads 34 to the via 22 at the second end 28. Because the vias 22 at the two ends of the second circuit component 16 are one-to-one connected through the metal wires 30, the first circuit component 12 and the third circuit component 32 are electrically connected through the second circuit component 16.

In some embodiments, the first circuit component 12 can connect with the third circuit component 32 through the second circuit component 16. For example, one first circuit component 12 can connect with one or more third circuit components 32 through at least one second circuit component 16. For another example, one or more first circuit components 12 can connect with one third circuit component 32 through at least one second circuit component 16. For another example, one first circuit component 12 can be connected with one third circuit component 32 through the second circuit component 16 (e.g., having the arrangement of the vias 22 at the two ends as shown in any of FIGS. 3-5) , or one first circuit component 12 can be connected with two third circuit components 32 through the second circuit component 16 (e.g., having the arrangement of the vias 22 at the two ends as shown in any of FIGS. 3-5) , or two first circuit components 12 can be connected with two third circuit components 32 through the second circuit component 16 (e.g., having the arrangement of the vias 22 at the two ends as shown in any of FIGS. 3-5) .

In some embodiments, the first circuit components 12 can be a PCB, the second circuit components 16 can be an FPC, and the third circuit components 32 can be another PCB. In some embodiments, the first circuit components 12 can be a PCB, the third circuit components 32 can be a driving mechanism for a scanner or scanner module in a LiDAR (e.g., a motor) , and the second circuit component 16 can be an FPC. In some embodiments, the first circuit component 12 can be a PCB, the third circuit component 32 can be a wireless power supply component (e.g., wireless transceiver coils) , and the second circuit component 16 can be an FPC. The first circuit components 12 and the third circuit components 32 can also have other combinations, which are not exhaustively listed herein. In this disclosure, electrical connection between two PCBs can be achieved. The cost of the circuit board module formed by the above connection can be low and the connection structure can be stable.

In some embodiments, the circuit board module 10 for the LiDAR includes at least one third circuit component 32. The first circuit component 12 can be a main controller board of the LiDAR. The third circuit component 32 can be at least one of a transmitter circuit board of the LiDAR, a receiver circuit board of the LiDAR, or a scanner control circuit board of the LiDAR.

The transmitter circuit board of the LiDAR, the receiver circuit board of the LiDAR, and the scanner control circuit board of the LiDAR can be connected with the main controller board of the LiDAR through a flexible circuit board by soldering, thus there is no need to provide paired pin plugs and sockets, which can reduce cost. In addition, because the solder is disposed in the via, the amount of tin paste used can be well controlled. Solder overflow or false soldering can be reduced or avoided. Moreover, due to the small soldering area, pulling at the soldering location caused by difference in thermal expansion coefficients of the materials at high temperature can be small. The soldering structure can be stable. The stability of the LiDAR performance can be ensured or improved.

Referring to FIGS. 3 and 4, in some embodiments, the vias 22 at the first end 26 of the second circuit component 16 are arranged along a first direction T and arranged in at least one row. The vias 22 at the second end 28 of the second circuit component 16 are arranged along the first direction T or a second direction H and arranged in at least one row. The first direction T and the second direction H are two non-overlapping directions. The first direction T and the second direction H can be perpendicular to each other or not perpendicular to each other.

By arranging multiple rows of the vias 22 at one end (the first end 26 and/or the second end 28) of the second circuit component 16, the wiring density of the second circuit component 16 (e.g., density of metal wires 30 of the second circuit component 16) can be increased. Connection density between the first circuit component 12 and the second circuit component 16 (or connection density between the third circuit component 32 and the second circuit component 16) can be increased. The space occupied by joints between the two circuit boards can be reduced. It is beneficial for miniaturization of the size of the circuit board. In the case that the size of the first circuit component 12 is not changed, more connection points can be disposed (e.g., one first pad 14 and one via 22 form a connection point, similarly, one third pad 34 and one via 22 form a connection point) .

For example, the vias 22 at the first end 26 of the second circuit component 16 and the vias 22 at the second end 28 of the second circuit component 16 can be arranged along the same direction or along different directions. For example, referring to FIG. 4, the vias 22 at the first end 26 of the second circuit component 16 are arranged along the first direction T. The vias 22 at the second end 28 of the second circuit component 16 are arranged along the second direction H. For example, referring to FIG. 5, both the vias 22 at the first end 26 of the second circuit component 16 and the vias 22 at the second end 28 of the second circuit component 16 are arranged along the second direction H. The example arrangement of the vias 22 at the first end 26 of the second circuit component 16 and the vias 22 at the second end 28 of the second circuit component 16 can correspond to the number and arrangement of the first circuit components 12 and the third circuit components 32 to be connected. The diverse arrangements can be beneficial for connecting different numbers of first circuit components 12 and the third circuit components 32 in various arrangements.

For example, referring back to FIG. 2, the vias 22 at the first end 26 of the second circuit component 16 and the vias 22 at the second end 28 of the second circuit component 16 can be arranged in three rows in the same direction respectively. In this case, the spacing between soldering points in a row direction equals to column spacing D1 of single row/number of rows= D1/3. Connection density between the first circuit component 12 and the second circuit component 16 can be increased. Furthermore, as the number of rows of vias 22 increases, the spacing between soldering points in the row direction can be decreased, and the connection density between the first circuit component 12 and the second circuit component 16 can be increased. Therefore, when the number of connection points is unchanged, the space occupied by the joints between the two circuit boards can be reduced, which is beneficial for miniaturizing the size of the circuit board. When the size of the circuit board is unchanged, more connection points can be disposed to meet the connection requirements between circuit boards.

In some embodiments, referring to FIGS. 2-5, two adjacent rows of vias 22 at the same end of the second circuit component 16 are staggered from each other in their arrangement direction.

The two adjacent rows of vias 22 at the same end of the second circuit component 16 are staggered in the arrangement direction. The vias 22 can be arranged more densely. The metal wires 30 can be easier routed. The size of the second circuit component 16 and the size of the circuit board module 10 can be reduced, or the number of soldering points without changing the size of the second circuit component 16 can be increased.

FIG. 6 shows another schematic section view of the circuit board module 10 in FIG. 1. In some embodiments, referring to FIGS. 1 and 6, the via 22 include a flange 36 provided on the first surface 18. By providing the flange 36, the metal wire 30 can be connected with the metal layer 23 inside the via 22 more conveniently.

When connecting the metal wire 30 with the via 22, the metal wire 30 can be connected with the flange 36 of the first surface 18. There is no need to connect the metal wire 30 to the inside of the via 22, which is convenient to operate.

It should be understood that the flange 36 can be provided on the first surface 18 or the second surface 20, or the flange 36 can be provided on both the first surface 18 and the second surface 20.

In some embodiments, referring back to FIG. 2, the distance D1 between two adjacent vias 22 in the same row is greater than a first threshold, and the first threshold is greater than the sum of the outer diameter of the via 22 and the width of the metal wire 30. The outer diameter of the via 22 is the outer diameter of the flange 36. For example, still referring to FIG. 2, when multiple rows of vias 22 are disposed at one end of the second circuit component 16 (the first end 26 or the second end 28) , the metal wire 30 connecting the vias 22 at the two ends needs to pass through the space between the vias 22. Because the distance D1 between two adjacent vias 22 in the same row is greater than the first threshold and the first threshold is greater than the sum of the outer diameter of the via 22 and the width of the metal wire 30, sufficient space for routing of the metal wire 30 can be provided.

In some embodiments, still referring to FIG. 6, the metal wire 30 is located on at least one of the first surface 18 or the second surface 20 of the second circuit component 16. In some embodiments, to dispose the metal wire 30 on at least one of the first surface 18 or the second surface 20, copper foil or other conductive metal foil can be pressed (e.g., by rolling pressing) or adhered onto at least one of the first surface 18 or the second surface 20 of the second circuit component 16 by rolling pressing. The metal wire 30 can be disposed on at least one of the first surface 18 or the second surface 20 of the second circuit component 16 using other methods, which are not exhaustively listed here.

The metal wire 30 can be located on the first surface 18 or the second surface 20 of the second circuit component 16, so that the metal wire 30 can be flexibly arranged based on the requirements.

In some embodiments, with reference to FIG. 6, the second circuit component 16 further includes a through hole 37 penetrating through the first surface 18 and the second surface 20, and the metal wire 30 on the second surface 20 passes through the through hole 37 and extends to the first surface 18.

In some embodiments, the first surface 18 is a side of the second circuit component 16 where no ground wire is provided. For example, the first surface 18 can be a surface of the second circuit component 16 close to the first circuit component 12. For another example, the first surface 18 can be a surface of the second circuit component 16 away from the first circuit component 12. The second surface 20 is a surface of the second circuit component 16 where the ground wire is provided. The metal wire 30 on the second surface 20 passes through the through hole 37 and extends to the first surface 18. The metal 30 can be provided on the second surface 20, bypassing the ground wire. Still referring to FIG. 6, the first surface 18 is a surface of the second circuit component 16 away from the first circuit component 12, and the second surface 20 is a surface of the second circuit component 16 close to the first circuit component 12. The metal wire 30 extends on the first surface 18, or the metal wire 30 passes through the through hole 37 from the second surface 20 and extends on the first surface 18.

In some embodiments, referring back to FIG. 2, the first pads 14 are disposed close to an edge of the first circuit component 12.

In some embodiments, soldering the first pads 14 of the first circuit component 12 with the vias 22 of the second circuit component 16 can be facilitated. The appearance of the circuit board module 10 for the LiDAR can be clean and tidy. Interference with other components on the first circuit component 12 can be decreased or avoided.

In some embodiments, the circuit board module 10 for the LiDAR includes fixing adhesive 38 between the first circuit component 12 and the second circuit component 16, and the fixing adhesive 38 at least partially surrounds the first pad 14.

In some embodiments, the fixing adhesive 38 is provided. The connection between the first circuit component 12 and the second circuit component 16 can be more stable. Damage to the soldering point caused by pulling at soldering location due to the difference in thermal expansion coefficients of the materials when the temperature is too high can be reduced or avoided. For example, still referring to FIG. 2, the fixing adhesive 38 can be located at the periphery of the whole array of vias 22. The fixing adhesive 38 can also be provided between some of the vias 22 and the edge of the second circuit component 16. The stability of the connection between the first circuit component 12 and the second circuit component 16 can be improved.

In some embodiments, the first circuit component 12 includes a first alignment portion 40, and the second circuit component 16 includes a second alignment portion 42 disposed corresponding to the first alignment portion 40.

In some embodiments, the convenient alignment of the first circuit component 12 with the second circuit component 16 by the first alignment portion 40 and the second alignment portion 42 can be provided. The first pad 14 can be aligned with the via 22. Similarly, the third circuit component 32 can also be provided with an alignment portion. By doing so, the third circuit component 32 can be aligned with the second circuit component 16 conveniently.

In some embodiments, the first alignment portion 40 and the second alignment portion 42 can be a hole and a protrusion (or a protrusion or a hole) with corresponding shapes respectively, or a limiting slot and a limiting protrusion (or a limiting protrusion and a limiting slot) with corresponding shapes respectively. For example, the first alignment portion 40 can be a hole, and the second alignment portion 42 can be a protrusion with corresponding shapes. For another example, the first alignment portion 40 can be a protrusion, and the second alignment portion 42 can be a hole with corresponding shapes. For another example, the first alignment portion 40 can be a limiting slot, and the second alignment portion 40 can be a limiting protrusion with corresponding shapes. For another example, the first alignment portion 40 can be a limiting protrusion, and the second alignment portion 40 can be a limiting slot with corresponding shapes.

It should be noted that the shape of the aforementioned hole and limiting slot is not limited, as long as it can be adapted to the corresponding protrusion.

In some embodiments, the first alignment portion 40 and the second alignment portion 42 can also be visual positioning points, and the alignment of the first circuit component 12 with the second circuit component 16 can also be performed through visual alignment or other methods.

FIG. 7 shows a schematic flowchart illustrating an example method for manufacturing a circuit board module for a LiDAR, consistent with some embodiments of this disclosure. FIG. 8 shows a schematic flowchart illustrating an example method for manufacturing a circuit board module for a LiDAR, consistent with some embodiments of this disclosure. FIG. 9 shows an example schematic section view of the circuit board module of FIG. 1 in the manufacturing process. For example, referring to FIGS. 7 and 9, this disclosure provides a method 100. The method 100 can be used for manufacturing the circuit board module 10 of this disclosure. The method 100 includes: at step 101, the second circuit component 16 and the first circuit component 12 are aligned and pressed together; at step 102, a conductive material 24 in the via 22 is provided; at step 103, an inner sidewall of the via 22 is connected with the first pad 14 through the conductive material 24.

The method 100 can be performed after picking-and-placing other electronic devices on the first circuit component 12. The restrictions on the devices of the first circuit component 12 can be little. The flexibility of devices of the manufactured circuit board module 10 for the LiDAR can be high.

The alignment in step 101 can be performed by aligning the first alignment portion 40 with the second alignment portion 42 or by methods such as visual alignment, or the like.

The conductive material 24 in step 102 can be tin paste, silver solder, or copper solder, or the like.

In step 103, any applicable soldering method (e.g., reflow soldering, wave soldering, or the like) can be used for soldering the inner sidewall of the via 22 to the first pad 14.

In some embodiments, referring to FIGS. 8 and 9, this disclosure provides a method 200. The method 200 can be used for manufacturing the circuit board module 10 of this disclosure. The method 200 includes: at step 201, the conductive material 24 on the first pad 14 of the first circuit component 12 is applied, such that the conductive material 24 are in the via 22 of the second circuit component 16 after the first circuit component 12 and the second circuit component 16 are aligned and pressed together; at step 202, the second circuit component 16 and the first circuit component 12 are aligned and pressed together; and at step 203, the inner sidewall of the via 22 is connected with the first pad 14 through the conductive material 24.

In method 200, the second circuit component 16 can be taken as a regular surface mounted device. At the final step 203, the second circuit component 16 is soldered to the first circuit component 12 together with other electronic components. In method 200, the degree of automation can be high.

Step 201 can be performed by applying the conductive material 24 (e.g., tin paste, or the like) on the first pad 14 of the first circuit component 12 by using a steel mesh. The diameter of the conductive material 24 is smaller than the inner diameter of the via 22 of the second circuit component 16. The conductive material 24 can be disposed in the via 22.

The alignment in step 202 can be performed by aligning the first alignment portion 40 with the second alignment portion 42 or by methods such as visual alignment, or the like.

In step 203, any applicable soldering method (e.g., reflow soldering, wave soldering, or the like) can solder the inner sidewall of the via 22 to the first pad 14.

Various embodiments described above and shown in the attached drawings are intended only to illustrate this disclosure but not the entirety of this disclosure. Within the scope of the basic technical ideas of this disclosure, any changes made on this disclosure by those skilled in the art would fall within the scope of protection of this disclosure.

It should be understood that the term "and/or" in this disclosure is merely a description describing the relationship between associated objects, which indicates three relationships, for example, A and/or B indicates: only A, only B, and both A and B. In addition, the sign "/" in this disclosure indicates a non-exclusive "or" relationship between the preceding and following associated objects.

The terms "or" and "and/or" of this disclosure describe an association relationship between associated objects, and represent a non-exclusive inclusion. For example, each of "A and/or B" and "A or B" can include: only "A" exists, only "B" exists, and "A" and "B" both exist, where "A" and "B" can be singular or plural. For another example, each of "A, B, and/or C" and "A, B, or C " can include: only "A" exists, only "B" exists, only "C" exists, "A" and "B" both exist, "A" and "C" both exist, "B" and "C" both exist, and "A" , "B" , and "C" all exist, where "A, " "B, " and "C" can be singular or plural.

The term "multiple " in this disclosure refers to a number of two or more. For example, multiple PCBs can include two PCBs, three PCBs, ten PCBs, or the like.

The "first" , "second" and other descriptions in the embodiments of this disclosure are only used for illustration and distinction of the described objects, which do not indicate sequence, or indicate any special restrictions on the number of devices in this disclosure. They do not form any limitations on the embodiments of this disclosure.

The term "connection" in this disclosure refers to various connection methods such as direct connection or indirect connection to implement communication between devices. The embodiments of this disclosure not make any limitations on this.

Although this disclosure has been disclosed as above, this disclosure is not limited thereto. Those skilled in the art can make various modifications and changes within the spirit and scope of this disclosure, and therefore, the scope of protection of this disclosure should be defined by the claims.

Claims

A circuit board module of a LiDAR, comprising:

a first circuit component comprising a first pad; and

a second circuit component comprising a first surface, a second surface and a via penetrating through the first surface and the second surface, wherein an inner sidewall of the via has a conductive metal layer, and the via is connected with the first pad through a conductive material in the via.
The circuit board module of claim 1, wherein a volume of the conductive material is 10%-90%of a volume of the via.
The circuit board module of claim 1, wherein the first circuit component comprises a plurality of first pads, and the second circuit component comprises a plurality of vias corresponding to the plurality of first pads.
The circuit board module of claim 3, wherein a first number of the plurality of vias are disposed at a first end of the second circuit component, a second number of the plurality of vias are disposed at a second end of the second circuit component, and the first number is equal to the second number, and

the second circuit component further comprises a metal wire connecting the first number of vias and the second number of vias.
The circuit board module of claim 4, further comprising a third circuit component, wherein the third circuit component comprises a plurality of second pads disposed corresponding to the plurality of vias,

the plurality of first pads are disposed corresponding to the first number of vias, and the first circuit component is connected with the second circuit component through the first number of vias;

the plurality of second pads are disposed corresponding to the second number of vias, and the third circuit component is connected with the second circuit component through the second number of vias.
The circuit board module of claim 5, wherein the first circuit component is a printed circuit board, the second circuit component is a flexible circuit board, and the third circuit component is a printed circuit board.
The circuit board module of claim 6, comprising at least one third circuit components,

wherein the first circuit component is a main controller board of the LiDAR; and

the at least one third circuit component is at least one of a transmitter circuit board of the LiDAR, a receiver circuit board of the LiDAR, or a control circuit board for a scanning device of the LiDAR.
The circuit board module of claim 4, wherein the first number of vias at the first end of the second circuit component are arranged in a first direction and in a first row, and

the second number of vias at the second end of the second circuit component are arranged in the first direction or a second direction, and are arranged in a second row.
The circuit board module of claim 8, wherein two adjacent rows of vias at a same end of the second circuit component are staggered in an arrangement direction.
The circuit board module of any of claim 1 to 8, wherein the via comprises a flange disposed on the first surface.
The circuit board module of claim 10, wherein a distance between two adjacent vias in a same row is greater than a first threshold, and the first threshold is greater than a sum of an outer diameter of the via and a width of the metal wire, and the outer diameter of the via is an outer diameter of the flange.
The circuit board module of claim 11, wherein the metal wire is located on at least one of the first surface or the second surface.
The circuit board module of claim 12, wherein the second circuit component further comprises a through hole penetrating through the first surface and the second surface, and the metal wire on the second surface extends through the through hole to the first surface.
The circuit board module of claim 3, wherein the plurality of first pads are disposed close to an edge of the first circuit component.
The circuit board module of claim 3, further comprising fixing adhesive between the first circuit component and the second circuit component, wherein the fixing adhesive at least partially surrounds the plurality of first pads.
The circuit board module of claim 1, wherein the first circuit component comprises a first alignment part, and the second circuit component comprises a second alignment part disposed corresponding to the first alignment part.
A method for manufacturing a circuit board module of any of claims 1-16, comprising:

aligning the second circuit component with the first circuit component and pressing the second circuit component and the first circuit component together;

applying a conductive material in the via; and

connecting the inner sidewall of the via with the first pad through the conductive material.
A method for manufacturing a circuit board module of any of claims 1-16, comprising:

applying a conductive material on the first pad of the first circuit component;

aligning the second circuit component with the first circuit component and pressing the second circuit component and the first circuit component together, wherein the conductive material is in the via of the second circuit component; and

connecting the inner sidewall of the via with the first pad through the conductive material.