WO2024105852A1

WO2024105852A1 - Processing system

Info

Publication number: WO2024105852A1
Application number: PCT/JP2022/042714
Authority: WO
Inventors: 兼行内藤
Original assignee: 株式会社ニコン
Priority date: 2022-11-17
Filing date: 2022-11-17
Publication date: 2024-05-23

Abstract

This processing system comprises a processing device that processes a target object by irradiating the target object with a processing beam, and a control device that controls the processing device. The processing device comprises: an irradiation optical system that is able to irradiate the target object with the processing beam and a measurement beam, a first detector that detects a first return beam of the measurement beam, and a second detector that detects a second return beam of the processing beam. The control device generates position information pertaining to the position of the target object on the basis of the detection result of the first return beam and the detection result of the second return beam, and controls the processing device so as to process the target object on the basis of the position information.

Description

Processing System

The present invention relates to the technical field of processing systems capable of processing objects, for example.

Patent Document 1 describes a processing system that processes an object by irradiating the object with laser light. This type of processing system is required to process the object appropriately.

US Patent Application Publication No. 2002/0017509

According to a first aspect, there is provided a processing system comprising a processing device that processes a target object by irradiating the target object with a processing beam, and a control device that controls the processing device, the processing device comprising an irradiation optical system capable of irradiating the target object with the processing beam and a measurement beam for measuring the target object, a first detector that detects a first return beam generated from the target object as the measurement beam is irradiated onto the target object, and a second detector that detects a second return beam generated from the target object as the processing beam is irradiated onto the target object, the control device generating position information regarding the position of the target object based on the detection result of the first return beam and the detection result of the second return beam, and controlling the processing device to process the target object based on the position information.

According to a second aspect, there is provided a processing system that includes a processing device that processes a target object by irradiating the target object with a processing beam, and a control device that controls the processing device, the processing device includes an irradiation optical system that can irradiate the target object with the processing beam and a measurement beam for measuring the target object, and a detector that detects a return beam generated from the target object irradiated with the measurement beam, and the control device calculates a position of a first part of the target object and a position of a second part of the target object having a predetermined positional relationship with the first part based on the detection result of the return beam, performs an averaging process to calculate an average value of the positions of the first part and the second part as the position of the first part, and controls the processing device to process the target object based on the position of the first part calculated by the averaging process.

According to a third aspect, there is provided a processing system that includes a processing device that processes a target object by irradiating the target object with a processing beam, and a control device that controls the processing device, the processing device includes an irradiation optical system that can irradiate the target object with the processing beam and a measurement beam for measuring the target object, and a detector that detects a return beam emitted from the target object irradiated with the measurement beam, the processing device irradiates the measurement beam to the target object having a first relative attitude with respect to the irradiation optical system, and irradiates the measurement beam to the target object having a second relative attitude with respect to the irradiation optical system that is different from the first attitude, the control device calculates a first position that is the position of the target object in the first attitude and a second position that is the position of the target object in the second attitude based on the detection result of the return beam, performs an averaging process to calculate an average value of the first position and the second position as the position of the target object, and controls the processing device to process the target object based on the position of the target object calculated by the averaging process.

According to a fourth aspect, there is provided a processing system that includes a processing device that processes a target object by irradiating the target object with a processing beam, and a control device that controls the processing device, the processing device includes an irradiation optical system that can irradiate the target object with the processing beam and a measurement beam for measuring the target object, a first detector that detects a first return beam generated from the target object when the measurement beam is irradiated onto the target object, and a second detector that detects a second return beam generated from the target object when the processing beam is irradiated onto the target object, and the control device generates position information regarding the position of the target object based on the detection result of the first return beam and the detection result of the second return beam.

According to a fifth aspect, there is provided a processing system comprising a processing device that processes a target object by irradiating the target object with a processing beam, and a control device that controls the processing device, the processing device comprising a first measurement device that obtains a first distance measurement result of the target object based on a return beam generated from the target object by irradiating the target object with a measurement beam for measuring the target object, and a second measurement device that obtains the first distance measurement result of the target object using a method different from that of the first measurement device, and the control device that generates position information regarding the position of the target object based on the first distance measurement result and the second distance measurement result.

According to a sixth aspect, there is provided a processing system comprising a processing device that processes a target object by irradiating the target object with a processing beam, and a control device that controls the processing device, the processing device comprising an irradiation optical system capable of irradiating the target object with the processing beam and a measurement beam for measuring the target object, a first detector that detects a first return beam generated from the target object as the measurement beam is irradiated onto the target object, and a second detector that detects a second return beam generated from the target object as the processing beam is irradiated onto the target object, and the control device controls the irradiation position of the processing beam in processing the target object based on the detection result of the first return beam and the detection result of the second return beam.

According to the seventh aspect, a processing system is provided that includes a processing device that processes a target object by irradiating the target object with a processing beam, and a control device that controls the processing device, the processing device includes a first measurement device that obtains a first distance measurement result of the target object based on a return beam generated from the target object by irradiating the target object with a measurement beam for measuring the target object, and a second measurement device that obtains a second distance measurement result of the target object using a method different from that of the first measurement device, and the control device controls the irradiation position of the processing beam in processing the target object based on the first distance measurement result and the second distance measurement result.

The operation and other advantages of the present invention will become apparent from the following detailed description of the embodiment.

FIG. 1 is a cross-sectional view illustrating a schematic example of a configuration of a processing system according to a first embodiment. FIG. 2 is a block diagram showing an example of the configuration of the machining system according to the first embodiment. FIG. 3 is a cross-sectional view showing the configuration of the machining head in the first embodiment. FIG. 4 is a graph showing the relationship between the focusing position of the processing light and the amount of the processing light detected by the detector. FIG. 5 is a timing chart showing the measurement light incident on the detector and the interference light detected by the detector. FIG. 6 is a graph showing an example of ideal position information that should be generated based on the detection result of the measurement return light, and an example of position information actually generated based on the detection result of the measurement return light. Figure 7(a) is a cross-sectional view showing a workpiece having a tiny recess on its surface where the Z position is to be measured, and Figure 7(b) is a graph showing an example of position information actually generated based on the detection results of the measurement return light. FIG. 8 is a flowchart showing the flow of an operation for generating position information based on both the detection results of the measurement return light and the detection results of the processing return light. FIG. 9 is a graph showing the Z position of the target portion of the workpiece calculated based on the detection results of the measurement return light, and the Z position of the target portion of the workpiece calculated based on the detection results of the processing return light. FIG. 10 is a graph showing the Z position of the workpiece corrected using the position correction amount. Each of FIG. 11(a) and FIG. 11(b) is a plan view showing at least one second portion of a workpiece having a predetermined positional relationship with a first portion of the workpiece. FIG. 12 is a graph showing the intermediate value of the Z position of the workpiece calculated based on the detection results of the measurement return light, and the final value of the Z position of the workpiece calculated by averaging processing. FIG. 13 is a cross-sectional view showing an operation of irradiating the workpiece with the measurement light while changing the attitude of the workpiece with respect to the machining head. FIG. 14 is a graph showing the intermediate value of the Z position of the workpiece calculated based on the detection results of the measurement return light, and the final value of the Z position of the workpiece calculated by averaging processing. 15A and 15B each show a schematic diagram of a measurement error calculation model. FIG. 16 is a flowchart showing the flow of a model generating method for generating a measurement error calculation model. FIG. 17 is a cross-sectional view showing the configuration of a machining head in the fifth embodiment. FIG. 1 is a cross-sectional view illustrating a schematic example of a configuration of a processing system according to the sixth embodiment.

Below, an embodiment of a processing system will be described with reference to the drawings. Below, an embodiment of a processing system will be described using a processing system SYS capable of processing a workpiece W, which is an example of an object. However, the present invention is not limited to the embodiment described below.

Furthermore, in the following explanation, the positional relationships of the various components that make up the machining system SYS will be explained using an XYZ Cartesian coordinate system defined by mutually orthogonal X-axis, Y-axis, and Z-axis. For the sake of convenience, in the following explanation, it is assumed that the X-axis direction and the Y-axis direction are horizontal (i.e., a specific direction within a horizontal plane), and the Z-axis direction is vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-down direction). Furthermore, the rotation directions (in other words, tilt directions) around the X-axis, Y-axis, and Z-axis are referred to as the θX direction, θY direction, and θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Furthermore, the XY plane may be horizontal.

(1) Machining system SYS of the first embodiment
(1-1) Configuration of the Machining System SYS of the First Embodiment First, a description will be given of the machining system SYS of the first embodiment. In the following description, the machining system SYS of the first embodiment will be referred to as a "machining system SYSa."

(1-1-1) Overall Configuration of Machining System SYSa First, the configuration of the machining system SYSa in the first embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a cross-sectional view showing a schematic example of the configuration of the machining system SYSa in the first embodiment. Fig. 2 is a block diagram showing an example of the configuration of the machining system SYSa in the first embodiment.

1 and 2, the processing system SYS includes a processing unit 1 and a control unit 2. The processing unit 1 may be referred to as a processing device, and the control unit 2 may be referred to as a control device. At least a part of the processing unit 1 may be accommodated in the internal space SP1 of the housing 3. The internal space SP1 of the housing 3 may be purged with a purge gas (i.e., gas), or may not be purged with a purge gas. The purge gas may include, for example, at least one of an inert gas and CDA (Clean Dry Air). The inert gas may include, for example, at least one of nitrogen gas and argon gas. The internal space SP1 of the housing 3 may be evacuated, or may not be evacuated. However, the processing unit 1 may not be accommodated in the internal space SP1 of the housing 3. A local space surrounding only a part of the processing unit 1 may be purged with a purge gas, or may be evacuated.

The processing unit 1 is capable of processing a workpiece W, which is an object to be processed (which may also be referred to as a base material), under the control of the control unit 2. The workpiece W may be, for example, a metal, an alloy (e.g., duralumin, etc.), a semiconductor (e.g., silicon), a resin, a composite material such as CFRP (Carbon Fiber Reinforced Plastic), paint (one example being a paint layer applied to a substrate), glass, or an object made of any other material.

The processing unit 1 irradiates the processing light EL onto the workpiece W in order to process the workpiece W. The processing light EL may be any type of light as long as it can process the workpiece W by irradiating it onto the workpiece W. In the first embodiment, the processing light EL is described as a laser light, but the processing light EL may be a type of light other than laser light. Furthermore, the wavelength of the processing light EL may be any wavelength as long as it can process the workpiece W by irradiating it onto the workpiece W. For example, the processing light EL may be visible light or invisible light (for example, at least one of infrared light, ultraviolet light, and extreme ultraviolet light). The processing light EL may include pulsed light. Alternatively, the processing light EL may not include pulsed light. In other words, the processing light EL may be continuous light. Since light is an example of an energy beam, the processing light EL may be called a processing beam.

The processing unit 1 can further measure the measurement object M under the control of the control unit 2. In order to measure the measurement object M, the processing unit 1 irradiates the measurement object M with measurement light ML for measuring the measurement object M. Specifically, the processing unit 1 measures the measurement object M by irradiating the measurement object M with the measurement light ML and detecting (i.e., receiving) at least a portion of the light returning from the measurement object M irradiated with the measurement light ML. The light returning from the measurement object M irradiated with the measurement light ML is light from the measurement object M that is generated from the measurement object M by irradiation with the measurement light ML.

The measurement light ML may be any type of light as long as it is capable of measuring the measurement object M by irradiating it on the measurement object M. In the first embodiment, the description will be given using an example in which the measurement light ML is laser light. However, the measurement light ML may be a type of light other than laser light. Furthermore, the wavelength of the measurement light ML may be any wavelength as long as it is capable of measuring the measurement object M by irradiating it on the measurement object M. For example, the measurement light ML may be visible light or invisible light (e.g., at least one of infrared light, ultraviolet light, and extreme ultraviolet light). The measurement light ML may include pulsed light (e.g., pulsed light having an emission time of picoseconds or less). Alternatively, the measurement light ML may not include pulsed light. In other words, the measurement light ML may be continuous light. Since light is an example of an energy beam, the measurement light ML may be called a measurement beam.

The processing unit 1 may be capable of measuring the characteristics of the measurement object M using the measurement light ML. The characteristics of the measurement object M may include, for example, at least one of the position of the measurement object M, the shape of the measurement object M, the reflectance of the measurement object M, the transmittance of the measurement object M, the temperature of the measurement object M, and the surface roughness of the measurement object M.

In the following explanation, an example will be described in which the processing unit 1 at least measures the position of the measurement object M. The position of the measurement object M may include the position of the surface of the measurement object M. The position of the surface of the measurement object M may include the position of at least a part of the surface of the measurement object M. Furthermore, the position of the measurement object M may mean the position of the measurement object M with respect to the processing head 13 described below (i.e., the relative position). In other words, the position of the measurement object M may mean the position of the measurement object M in a measurement coordinate system based on the processing head 13. Furthermore, as described below, the operation of measuring the position of the measurement object M may include an operation of measuring the shape of the measurement object M. This is because the shape of the measurement object M can be calculated from the position of the measurement object M.

The measurement object M may include, for example, the workpiece W that is processed by the processing unit 1. The measurement object M may include, for example, any object that is placed on the stage 15 described below. The measurement object M may include, for example, the stage 15.

In order to process the workpiece W and measure the measurement object M, the processing unit 1 includes a processing light source 11, a measurement light source 12, a processing head 13, a head drive system 14, a stage 15, and a stage drive system 16.

The processing light source 11 generates the processing light EL. When the processing light EL is a laser light, the processing light source 11 may include, for example, a laser diode. Furthermore, the processing light source 11 may be a light source capable of pulse oscillation. In this case, the processing light source 11 is capable of generating pulsed light as the processing light EL. In addition, the processing light source 11 may be a CW light source that generates a CW (continuous wave).

The measurement light source 12 generates the measurement light ML. When the measurement light ML is laser light, the measurement light source 12 may include, for example, a laser diode. Furthermore, the measurement light source 12 may be a light source capable of pulse oscillation. In this case, the measurement light source 12 is capable of generating pulsed light as the measurement light ML. In addition, the measurement light source 12 may be a CW light source that generates a CW (continuous wave).

The wavelength of the measurement light ML may be different from the wavelength of the processing light EL. The wavelength of the measurement light ML may mean a peak wavelength, which is a wavelength at which the intensity is maximum in the wavelength band of the measurement light ML. The wavelength of the measurement light ML may mean a wavelength band of the measurement light ML. The wavelength band of the measurement light ML may mean a range of wavelengths at which the intensity of the measurement light ML is a certain value or more. The wavelength of the processing light EL may mean a peak wavelength, which is a wavelength at which the intensity is maximum in the wavelength band of the processing light EL. The wavelength of the processing light EL may mean a wavelength band of the processing light EL. The wavelength band of the processing light EL may mean a range of wavelengths at which the intensity of the processing light EL is a certain value or more. However, the wavelength of the measurement light ML may be the same as the wavelength of the processing light EL.

The machining head 13 irradiates the workpiece W with the machining light EL generated by the machining light source 11 and irradiates the measurement object M with the measurement light ML generated by the measurement light source 12. In order to irradiate the workpiece W with the machining light EL and the measurement object M with the measurement light ML, the machining head 13 includes a machining optical system 131, a measurement optical system 132, a synthesis optical system 133, a deflection optical system 134, and an irradiation optical system 135. The machining head 13 irradiates the workpiece W with the machining light EL via the machining optical system 131, the synthesis optical system 133, the deflection optical system 134, and the irradiation optical system 135. The machining head 13 also irradiates the measurement light ML to the measurement object M via the measurement optical system 132, the synthesis optical system 133, the deflection optical system 134, and the irradiation optical system 135. The configuration of the machining head 13 will be described in detail later with reference to FIG. 3.

The head drive system 14 moves the processing head 13. For this reason, the head drive system 14 may be referred to as a moving device. Since the processing head 13 is equipped with the processing optical system 131, the measurement optical system 132, the synthesis optical system 133, the deflection optical system 134, and the irradiation optical system 135, the head drive system 14 may be considered to move the processing optical system 131, the measurement optical system 132, the synthesis optical system 133, the deflection optical system 134, and the irradiation optical system 135. The head drive system 14 may move (i.e., move linearly) the processing head 13 along a movement axis along at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction, for example. The head drive system 14 may move the processing head 13 along at least one of the θX direction, the θY direction, and the θZ direction, in addition to or instead of at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction, for example. That is, the head drive system 14 may rotate (i.e., rotate) the processing head 13 around at least one of the rotational axes along the X-axis direction (i.e., A-axis), the rotational axis along the Y-axis direction (i.e., B-axis), and the rotational axis along the Z-axis direction (i.e., C-axis).

When the head drive system 14 moves the processing head 13, the relative positional relationship between the processing head 13 and the stage 15 (and further, the workpiece W placed on the stage 15) changes. As a result, the relative positional relationship between the irradiation area PA onto which the processing head 13 irradiates the processing light EL and the workpiece W changes. That is, the irradiation area PA onto which the processing head 13 irradiates the processing light EL moves relative to the workpiece W. In other words, the position on the workpiece W onto which the processing head 13 irradiates the processing light EL is changed. The processing unit 1 may process the workpiece W while moving the processing head 13. Specifically, the processing unit 1 may process the desired position of the workpiece W by moving the processing head 13 so that the processing light EL is irradiated onto the desired position of the workpiece W.

Furthermore, when the head drive system 14 moves the processing head 13, the relative positional relationship between the irradiation area MA onto which the processing head 13 irradiates the measurement light ML and the workpiece W changes. That is, the irradiation area MA onto which the processing head 13 irradiates the measurement light ML moves relative to the workpiece W. In other words, the position on the workpiece W onto which the processing head 13 irradiates the measurement light ML is changed. The processing unit 1 may measure the workpiece W while moving the processing head 13. Specifically, the processing unit 1 may measure the desired position of the workpiece W by moving the processing head 13 so that the measurement light ML is irradiated onto the desired position of the workpiece W.

Furthermore, when the head drive system 14 moves the machining head 13, the positional relationship between the machining head 13 (particularly, the irradiation optical system 135 provided in the machining head 13) and the workpiece W placed on the stage 15 changes. For example, the positional relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W along at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction may change. For example, the positional relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W along at least one of the θX direction, the θY direction, and the θZ direction may change. For this reason, the head drive system 14 may be considered to function as a change device that can change the positional relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W.

The positional relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W along at least one of the θX direction, the θY direction, and the θZ direction may be considered to be the attitude relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W. Therefore, the head drive system 14 may be considered to function as an attitude changing device that can change the attitude relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W. In other words, the head drive system 14 may be considered to function as an attitude changing device that can change the attitude of the machining head 13 (particularly, the irradiation optical system 135) relative to the workpiece W.

Furthermore, simply changing the positional relationship between the processing head 13 (particularly, the irradiation optical system 135) and the workpiece W by moving the processing head 13 with the head drive system 14 does not change the positional relationship between the irradiation area PA of the processing light EL and the irradiation area MA of the measurement light ML on the workpiece W. In other words, even if the head drive system 14 changes the positional relationship between the processing head 13 (particularly, the irradiation optical system 135) and the workpiece W by moving the processing head 13, the positional relationship between the irradiation area PA of the processing light EL and the irradiation area MA of the measurement light ML on the workpiece W is maintained. This is because the processing light EL and the measurement light ML are irradiated from the same processing head 13.

The workpiece W is placed on the stage 15. Therefore, the stage 15 may be referred to as a placement device or an object placement device. Specifically, the workpiece W is placed on a placement surface 151, which is at least a part of the upper surface of the stage 15. The stage 15 is capable of supporting the workpiece W placed on the stage 15. The stage 15 may be capable of holding the workpiece W placed on the stage 15. In this case, the stage 15 may be equipped with at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, and the like, in order to hold the workpiece W. Alternatively, a jig for holding the workpiece W may hold the workpiece W, and the stage 15 may hold the jig that holds the workpiece W. Alternatively, the stage 15 may not hold the workpiece W placed on the stage 15. In this case, the workpiece W may be placed on the stage 15 without being clamped.

The stage drive system 16 moves the stage 15. For this reason, the stage drive system 16 may be referred to as a moving device. The stage drive system 16 may, for example, move the stage 15 (i.e., move linearly) along a movement axis along at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. The stage drive system 16 may, for example, move the stage 15 along at least one of the θX direction, the θY direction, and the θZ direction in addition to or instead of at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. In other words, the stage drive system 16 may rotate (i.e., rotate and move) the stage 15 around at least one of the rotation axes along the X-axis direction (i.e., the A-axis), the rotation axis along the Y-axis direction (i.e., the B-axis), and the rotation axis along the Z-axis direction (i.e., the C-axis).

When the stage drive system 16 moves the stage 15, the relative positional relationship between the processing head 13 and the stage 15 (and further, the workpiece W placed on the stage 15) changes. As a result, the relative positional relationship between the irradiation area PA onto which the processing head 13 irradiates the processing light EL and the workpiece W changes. That is, the irradiation area PA onto which the processing head 13 irradiates the processing light EL moves relative to the workpiece W. In other words, the position on the workpiece W onto which the processing head 13 irradiates the processing light EL is changed. The processing unit 1 may process the workpiece W while moving the stage 15. Specifically, the processing unit 1 may process the desired position of the workpiece W by moving the stage 15 so that the processing light EL is irradiated onto the desired position of the workpiece W.

Furthermore, when the stage drive system 16 moves the stage 15, the relative positional relationship between the workpiece W and the irradiation area MA onto which the machining head 13 irradiates the measurement light ML changes. That is, the irradiation area MA onto which the machining head 13 irradiates the measurement light ML moves relative to the workpiece W. In other words, the position on the workpiece W onto which the machining head 13 irradiates the measurement light ML is changed. The machining unit 1 may measure the workpiece W while moving the stage 15. Specifically, the machining unit 1 may measure the desired position of the workpiece W by moving the stage 15 so that the measurement light ML is irradiated onto the desired position of the workpiece W.

Furthermore, when the stage drive system 16 moves the stage 15, the positional relationship between the machining head 13 (particularly, the irradiation optical system 135 provided in the machining head 13) and the workpiece W placed on the stage 15 changes. For example, the positional relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W along at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction may change. For example, the positional relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W along at least one of the θX direction, the θY direction, and the θZ direction may change. For this reason, the stage drive system 16 may be considered to function as a change device that can change the positional relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W.

The positional relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W along at least one of the θX direction, the θY direction, and the θZ direction may be considered to be the attitude relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W. Therefore, the stage drive system 16 may be considered to function as an attitude changing device that can change the attitude relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W. In other words, the stage drive system 16 may be considered to function as an attitude changing device that can change the attitude of the stage 15 relative to the machining head 13 (particularly, the irradiation optical system 135).

Furthermore, simply changing the positional relationship between the processing head 13 (particularly, the irradiation optical system 135) and the workpiece W by moving the stage 15 using the stage drive system 16 does not change the positional relationship between the irradiation area PA of the processing light EL and the irradiation area MA of the measurement light ML on the workpiece W. In other words, even if the stage drive system 16 changes the positional relationship between the processing head 13 (particularly, the irradiation optical system 135) and the workpiece W by moving the stage 15 using the stage drive system 16, the positional relationship between the irradiation area PA of the processing light EL and the irradiation area MA of the measurement light ML on the workpiece W is maintained. This is because the processing light EL and the measurement light ML are irradiated from the same processing head 13.

The control unit 2 controls the operation of the processing unit 1. For example, the control unit 2 may control the operation of the processing head 13 provided in the processing unit 1. For example, the control unit 2 may control the operation of at least one of the processing optical system 131, the measurement optical system 132, the synthesis optical system 133, the deflection optical system 134, and the irradiation optical system 135 provided in the processing head 13. For example, the control unit 2 may control the operation of the head drive system 14 provided in the processing unit 1 (for example, the movement of the processing head 13). For example, the control unit 2 may control the operation of the stage drive system 16 provided in the processing unit 1 (for example, the movement of the stage 15).

The control unit 2 may control the operation of the processing unit 1 based on the measurement results of the measurement object M by the processing unit 1. Specifically, the control unit 2 may generate measurement information of the measurement object M (e.g., measurement information including position information regarding the position of the measurement object M) based on the measurement results of the measurement object M, and control the operation of the processing unit 1 based on the generated measurement information. For example, the control unit 2 may generate measurement information of at least a part of the workpiece W based on the measurement results of the workpiece W, which is an example of the measurement object M (e.g., calculate the position of at least a part of the workpiece W), and control the operation of the processing unit 1 to process the workpiece W based on the measurement information.

The control unit 2 may include, for example, a calculation device 21 and a storage device 22. The calculation device 21 may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The storage device 22 may include, for example, a memory. The control unit 2 functions as a device that controls the operation of the machining unit 1 by the calculation device 21 executing a computer program. This computer program is a computer program for making the calculation device 21 perform (i.e., execute) the operation to be performed by the control unit 2, which will be described later. In other words, this computer program is a computer program for making the control unit 2 function so as to make the machining unit 1 perform the operation to be described later. The computer program executed by the calculation device 21 may be recorded in the storage device 22 (i.e., a recording medium) provided in the control unit 2, or may be recorded in any storage medium (e.g., a hard disk or a semiconductor memory) built into the control unit 2 or externally attachable to the control unit 2. Alternatively, the computing device 21 may download the computer program to be executed from a device external to the control unit 2 via a network interface.

The control unit 2 does not have to be provided inside the processing unit 1. For example, the control unit 2 may be provided outside the processing unit 1 as a server or the like. In this case, the control unit 2 and the processing unit 1 may be connected by a wired and/or wireless network (or a data bus and/or a communication line). As the wired network, a network using a serial bus type interface represented by at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB may be used. As the wired network, a network using a parallel bus type interface may be used. As the wired network, a network using an interface compliant with Ethernet (registered trademark) represented by at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T may be used. As the wireless network, a network using radio waves may be used. An example of a network using radio waves is a network conforming to IEEE802.1x (for example, at least one of a wireless LAN and Bluetooth (registered trademark)). A network using infrared rays may be used as a wireless network. A network using optical communication may be used as a wireless network. In this case, the control unit 2 and the processing unit 1 may be configured to be able to transmit and receive various information via the network. The control unit 2 may also be able to transmit information such as commands and control parameters to the processing unit 1 via the network. The processing unit 1 may be equipped with a receiving device that receives information such as commands and control parameters from the control unit 2 via the network. The processing unit 1 may be equipped with a transmitting device (i.e., an output device that outputs information to the control unit 2) that transmits information such as commands and control parameters to the control unit 2 via the network. Alternatively, a first control device that performs a part of the processing performed by the control unit 2 may be provided inside the processing unit 1, while a second control device that performs another part of the processing performed by the control unit 2 may be provided outside the processing unit 1.

In the control unit 2, a computation model that can be constructed by machine learning may be implemented by the computation device 21 executing a computer program. An example of a computation model that can be constructed by machine learning is, for example, a computation model including a neural network (so-called artificial intelligence (AI)). In this case, learning of the computation model may include learning of parameters of the neural network (for example, at least one of weights and biases). The control unit 2 may use the computation model to control the operation of the machining unit 1. In other words, the operation of controlling the operation of the machining unit 1 may include the operation of controlling the operation of the machining unit 1 using the computation model. Note that the control unit 2 may be implemented with a computation model that has been constructed by offline machine learning using teacher data. In addition, the computation model implemented in the control unit 2 may be updated by online machine learning on the control unit 2. Alternatively, the control unit 2 may control the operation of the machining unit 1 using a computation model implemented in an external device of the control unit 2 (i.e., a device provided outside the machining unit 1) in addition to or instead of the computation model implemented in the control unit 2.

The recording medium for recording the computer program executed by the control unit 2 may be at least one of the following: CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, optical disks such as Blu-ray (registered trademark), magnetic media such as magnetic tape, magneto-optical disk, semiconductor memory such as USB memory, and any other medium capable of storing a program. The recording medium may include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in a state in which it can be executed in at least one of the forms of software and firmware, etc.). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized in the control unit 2 by the control unit 2 (i.e., the computer) executing the computer program, or may be realized by hardware such as a predetermined gate array (FPGA (Field Programmable Gate Array), ASIC (Application Specific Integrated Circuit)) provided in the control unit 2, or may be realized in a form that combines logical processing blocks and partial hardware modules that realize some elements of the hardware.

(1-1-2) Configuration of the Machining Head 13 Next, an example of the configuration of the machining head 13 will be described with reference to Fig. 3. Fig. 3 is a cross-sectional view showing an example of the configuration of the machining head 13.

As shown in FIG. 3, the processing light EL generated by the processing light source 11 is incident on the processing head 13 via an optical transmission member 111 such as an optical fiber. However, the processing light EL may also be incident on the processing head 13 by spatial transmission using a mirror. The processing light source 11 may be disposed outside the processing head 13. The processing light source 11 may be disposed inside the processing head 13. The processing light EL may also be incident on the processing head 13 without passing through an optical transmission member 111 such as an optical fiber.

As described above, the processing head 13 includes a processing optical system 131, a measurement optical system 132, a synthesis optical system 133, a deflection optical system 134, and an irradiation optical system 135.

The processing optical system 131 is an optical system into which the processing light EL generated by the processing light source 11 is incident. The processing optical system 131 is an optical system that emits the processing light EL incident on the processing optical system 131 toward the synthesis optical system 133. The processing optical system 131 is an optical system that emits the processing light EL incident on the processing optical system 131 toward the deflection optical system 134 via the synthesis optical system 133. The processing optical system 131 is an optical system that emits the processing light EL incident on the processing optical system 131 toward the irradiation optical system 135 via the synthesis optical system 133 and the deflection optical system 134. The processing light EL emitted by the processing optical system 131 is irradiated onto the workpiece W via the synthesis optical system 133, the deflection optical system 134, and the irradiation optical system 135.

The processing optical system 131 may include, for example, a focus control optical system 1311, a half-wave plate 1312, a beam splitter 1313, a half-wave plate 1314, a galvanometer mirror 1315, a focusing lens 1316, and a detector 1317.

The processing light EL generated by the processing light source 11 may be incident on the focus control optical system 1311. The focus control optical system 1311 is an optical member capable of changing the focusing position CP of the processing light EL. Specifically, the focus control optical system 1311 can change the focusing position CP of the processing light EL along the irradiation direction of the processing light EL irradiated to the workpiece W. In the example shown in FIG. 3, the irradiation direction of the processing light EL irradiated to the workpiece W is a direction in which the Z-axis direction is the main component. In this case, the focus control optical system 1311 can change the focusing position CP of the processing light EL along the Z-axis direction. Also, since the processing head 13 irradiates the processing light EL to the workpiece W from above the workpiece W, the irradiation direction of the processing light EL is a direction that intersects with the surface (particularly, the upper surface) of the workpiece W. For this reason, the focus control optical system 1311 may be considered to be capable of changing the focusing position CP of the processing light EL along a direction that intersects with the surface (particularly, the upper surface) of the workpiece W. The focus control optical system 1311 may be considered to be capable of changing the focusing position CP of the processing light EL along the direction of the optical axis EX of the irradiation optical system 135, which will be described later.

The processing light EL that has passed through the focus control optical system 1311 is incident on the beam splitter 1313 via the half-wave plate 1312. The beam splitter 1313 emits the processing light EL that has entered the beam splitter 1313 from the focus control optical system 1311 toward the galvanometer mirror 1315 via the half-wave plate 1314. In other words, the processing light EL that has entered the beam splitter 1313 from the focus control optical system 1311 is incident on the galvanometer mirror 1315 via the beam splitter 1313. In the first embodiment, the beam splitter 1313 may be a polarizing beam splitter. In this case, in the example shown in FIG. 3, the processing light EL that has entered the beam splitter 1313 from the focus control optical system 1311 passes through the polarization separation surface of the beam splitter 1313 and is incident on the galvanometer mirror 1315. For this reason, the half-wave plate 1312 may control the polarization direction of the processed light EL that is incident on the beam splitter 1313 so that the processed light EL is incident on the polarization separation surface of the beam splitter 1313 in a state in which the processed light EL has a polarization direction that allows it to pass through the polarization separation surface of the beam splitter 1313 (for example, a polarization direction that is p-polarized with respect to the polarization separation surface).

The processing light EL that passes through the beam splitter 1313 is incident on the galvanometer mirror 1315 via the half-wave plate 1314. The galvanometer mirror 1315 is a deflection optical system that deflects the processing light EL (i.e., changes the emission angle of the processing light EL). By deflecting the processing light EL, the galvanometer mirror 1315 changes the focusing position CP of the processing light EL in a plane that intersects with the optical axis EX of the irradiation optical system 135 (i.e., in a plane along the XY plane). Normally, as shown in FIG. 3, the processing head 13 irradiates the processing light EL on the workpiece W in a state in which the optical axis EX and the surface of the workpiece W intersect. Therefore, when the focusing position CP of the processing light EL in the plane that intersects with the optical axis EX is changed, the irradiation area PA of the processing light EL on the surface of the workpiece W moves in a direction along the surface of the workpiece W. In other words, the irradiation area PA of the processing light EL moves along at least one of the X-axis direction and the Y-axis direction.

The galvanometer mirror 1315 includes an X-scanning mirror 1315X and a Y-scanning mirror 1315Y. Each of the X-scanning mirror 1315X and the Y-scanning mirror 1315Y is an inclination angle variable mirror that changes the angle with respect to the optical path of the processing light EL incident on the galvanometer mirror 1315. The X-scanning mirror 1315X deflects the processing light EL so that the irradiation area PA of the processing light EL on the workpiece W moves along the X-axis direction. In this case, the X-scanning mirror 1315X may be rotatable or oscillating around the Y-axis. In other words, the galvanometer mirror 1315 may be able to move the irradiation area PA of the processing light EL on the workpiece W along the X-axis direction by changing the position of the X-scanning mirror 1315X in the θY direction (or the attitude around the Y-axis). The Y-scanning mirror 1315Y deflects the processing light EL so that the irradiation area PA of the processing light EL on the workpiece W moves along the Y-axis direction. In this case, the Y scanning mirror 1315Y may be capable of rotating or swinging around the X axis. In other words, the galvanometer mirror 1315 may be capable of moving the irradiation area PA of the processing light EL on the workpiece W along the Y axis direction by changing the position of the Y scanning mirror 1315Y in the θX direction (or the orientation around the X axis).

The processing light EL emitted from the processing optical system 131 (in this case, the processing light EL emitted from the galvanometer mirror 1315) is incident on the synthesis optical system 133. The synthesis optical system 133 includes a dichroic mirror 1331. The dichroic mirror 1331 has optical properties that allow light of one of the wavelengths of the processing light EL and the measurement light ML to be reflected by the dichroic mirror 1331, while light of the other wavelength of the processing light EL and the measurement light ML passes through the dichroic mirror 1331. Figure 3 shows an example of the processing light EL passing through the dichroic mirror 1331.

The processed light EL that passes through the dichroic mirror 1331 (i.e., the processed light EL emitted from the synthesis optical system 133) enters the deflection optical system 134. The deflection optical system 134 emits the processed light EL that entered the deflection optical system 134 toward the irradiation optical system 135.

As described above, the processing light EL is incident on the dichroic mirror 1331 in addition to the measurement light ML#2-2. The dichroic mirror 1331 outputs the processing light EL and the measurement light ML#2-2, which are incident on the dichroic mirror 1331 from different directions, in the same direction (i.e., toward the same deflection optical system 134). Therefore, the dichroic mirror 1331 essentially functions as a combining optical element that combines the processing light EL and the measurement light ML#2-2.

In addition, when the wavelengths of the processing light EL and the measurement light ML are the same, the combining optical system 133 may include a beam splitter (e.g., an amplitude-splitting beam splitter or a polarizing beam splitter) as a combining optical element instead of the dichroic mirror 1331. Even in this case, the combining optical system 133 can combine the processing light EL and the measurement light ML#2-2 using the beam splitter (i.e., combine the optical path of the processing light EL with the optical path of the measurement light ML#2-2).

The deflection optical system 134 includes a galvanometer mirror 1341. The processing light EL incident on the deflection optical system 134 is incident on the galvanometer mirror 1341. The galvanometer mirror 1341 deflects the processing light EL (i.e., changes the emission angle of the processing light EL). By deflecting the processing light EL, the galvanometer mirror 1341 changes the focusing position CP of the processing light EL in a plane intersecting the optical axis EX of the irradiation optical system 135 (i.e., in a plane along the XY plane). Normally, as shown in FIG. 3, the processing head 13 irradiates the processing light EL on the workpiece W in a state in which the optical axis EX intersects with the surface of the workpiece W. Therefore, when the focusing position CP of the processing light EL in the plane intersecting the optical axis EX is changed, the irradiation area PA of the processing light EL on the surface of the workpiece W moves in a direction along the surface of the workpiece W. In other words, the irradiation area PA of the processing light EL moves along at least one of the X-axis direction and the Y-axis direction.

The galvanometer mirror 1341 includes an X-scanning mirror 1341X and a Y-scanning mirror 1341Y. Each of the X-scanning mirror 1341X and the Y-scanning mirror 1341Y is an inclination angle variable mirror in which the angle with respect to the optical path of the processing light EL incident on the galvanometer mirror 1341 is changed. The X-scanning mirror 1341X deflects the processing light EL so that the irradiation area PA of the processing light EL on the workpiece W moves along the X-axis direction. In this case, the X-scanning mirror 1341X may be rotatable or oscillating around the Y-axis. In other words, the galvanometer mirror 1341 may be able to move the irradiation area PA of the processing light EL on the workpiece W along the X-axis direction by changing the position of the X-scanning mirror 1341X in the θY direction (or the attitude around the Y-axis). The Y-scanning mirror 1341Y deflects the processing light EL so that the irradiation area PA of the processing light EL on the workpiece W moves along the Y-axis direction. In this case, the Y scanning mirror 1341Y may be capable of rotating or swinging around the X axis. In other words, the galvanometer mirror 1341 may be capable of moving the irradiation area PA of the processing light EL on the workpiece W along the Y axis direction by changing the position of the Y scanning mirror 1341Y in the θX direction (or the orientation around the X axis).

The processing light EL emitted from the deflection optical system 134 is incident on the irradiation optical system 135. The irradiation optical system 135 is an optical system capable of irradiating the processing light EL onto the workpiece W. In order to irradiate the processing light EL onto the workpiece W, the irradiation optical system 135 may be equipped with an fθ lens 1351. The processing light EL emitted from the deflection optical system 134 is incident on the fθ lens 1351. The fθ lens 1351 irradiates the processing light EL emitted from the deflection optical system 134 onto the workpiece W. The optical axis EX of the irradiation optical system 135 may be the optical axis of the fθ lens 1351.

The fθ lens 1351 may focus the processing light EL from the galvanometer mirror 1341 onto the workpiece W. In this case, the fθ lens 1351 may be considered to function as a focusing optical system.

When the fθ lens 1351 focuses the processing light EL on the workpiece W, the processing light EL emitted from the fθ lens 1351 may be irradiated onto the workpiece W without passing through another optical element (in other words, an optical member such as a lens) having power. In this case, the fθ lens 1351 may be called the final optical element or objective optical system because it is the optical element having the final stage of power (i.e., the optical element closest to the workpiece W) among the multiple optical elements arranged on the optical path of the processing light EL. The power of the optical element may be the reciprocal of the focal length of the optical element. In this case, the processing light EL from the galvanometer mirror 1341 may be a parallel light beam. The irradiation optical system 135 may be equipped with an objective optical system having projection characteristics different from fθ.

In addition, at least one of the X scanning mirror 1341X and the Y scanning mirror 1341Y constituting the galvanometer mirror 1341, and the X scanning mirror 1315X and the Y scanning mirror 1315Y constituting the galvanometer mirror 1315 may be disposed at the entrance pupil position of the fθ lens 1351 as the irradiation optical system and/or its conjugate position. At least one of the X scanning mirror 1341X and the Y scanning mirror 1341Y, and the X scanning mirror 1315X and the Y scanning mirror 1315Y may be disposed at a position optically conjugate with the entrance pupil position of the fθ lens 1351. When there are multiple scanning mirrors constituting the galvanometer mirrors 1341 and 1315, a relay optical system for making each scanning mirror optically conjugate with each other may be disposed between the scanning mirrors.

The irradiation optical system 135 may further include a quarter-wave plate 1352. The processing light EL that has passed through the fθ lens 1351 may be irradiated onto the workpiece W via the quarter-wave plate 1352. Note that the quarter-wave plate 1352 is not an optical member that has power, and therefore the quarter-wave plate 1352 may not be considered to be the final optical element. In other words, even if the irradiation optical system 135 includes the quarter-wave plate 1352, the fθ lens 1351 may function as the final optical element, in the same way as when the irradiation optical system 135 includes the quarter-wave plate 1352.

When the workpiece W is irradiated with the processing light EL, light resulting from the irradiation of the processing light EL is generated from the workpiece W. In other words, when the workpiece W is irradiated with the processing light EL, light resulting from the irradiation of the processing light EL is emitted from the workpiece W. The light resulting from the irradiation of the processing light EL (in other words, the light emitted from the workpiece W due to the irradiation of the processing light EL) may include processing light EL reflected by the workpiece W (i.e., reflected light).

At least a portion of the light generated from the workpiece W due to the irradiation of the processing light EL is incident on the processing head 13 as light returning from the workpiece W to the processing head 13. In the following description, the light returning from the workpiece W irradiated with the processing light EL to the processing head 13 is referred to as the processing return light REL. Specifically, of the light emitted from the workpiece W due to the irradiation of the processing light EL, the light traveling along the optical path of the processing light EL incident on the workpiece W is incident on the irradiation optical system 135 as the processing return light REL. In this case, the optical path of the processing light EL emitted from the irradiation optical system 135 and incident on the workpiece W may be the same as the optical path of the processing return light REL emitted from the workpiece W and incident on the irradiation optical system 135. The processing return light REL incident on the irradiation optical system 135 is incident on the deflection optical system 134 via the quarter-wave plate 1352 and the fθ lens 1351. The processing return light REL that is incident on the deflection optical system 134 is incident on the synthesis optical system 133 via the galvanometer mirror 1341. The processing return light REL that is incident on the synthesis optical system 133 passes through the dichroic mirror 1331. The processing return light REL that passes through the dichroic mirror 1331 is incident on the processing optical system 131.

The processing return light REL incident on the processing optical system 131 is incident on the beam splitter 1313 via the galvanometer mirror 1315 and the 1/2 wavelength plate 1314. Here, as described above, the processing light EL emitted from the processing light source 11 passes through the 1/2 wavelength plate 1312 to become p-polarized light, and then passes through the beam splitter 1313. The processing light EL, which is p-polarized light, is then irradiated onto the workpiece W via the 1/4 wavelength plate 1352. Therefore, the processing light EL, which is either right-handed circularly polarized light or left-handed circularly polarized light, is irradiated onto the workpiece W. Furthermore, since the processing return light REL includes the processing light EL reflected by the workpiece W (i.e., reflected light), the processing return light REL incident on the 1/4 wavelength plate 1352 from the workpiece W is the other of right-handed circularly polarized light and left-handed circularly polarized light. As a result, the processing return light REL that has passed through the 1/4 wavelength plate 1352 is s-polarized light. Therefore, the processing return light REL, which is s-polarized light, enters the beam splitter 1313. As a result, the processing return light REL that enters the beam splitter 1313 is reflected by the polarization separation surface of the beam splitter 1313. In this case, the beam splitter 1313, which is disposed on the optical paths of both the processing light EL and the processing return light REL, may be considered to function as a beam splitting member that splits the processing return light REL into an optical path different from the optical path of the processing light EL.

The processing return light REL reflected by the beam splitter 1313 is incident on the detector 1317 via the condenser lens 1316. In this case, the beam splitter 1313 arranged on the optical paths of both the processing light EL and the processing return light REL may be considered to function as a beam splitting member that splits the processing return light REL into an optical path different from the optical path of the processing light EL and makes it incident on the detector 1317. The detector 1317 detects the processing return light REL. In this way, the detector 1317 detects the processing return light REL generated from the workpiece W via the irradiation optical system 135 (e.g., the fθ lens 1351 and the 1/4 wavelength plate 1352), the deflection optical system 134 (e.g., the galvanometer mirror 1341), and the synthesis optical system 133 (e.g., the dichroic mirror 1331). The detection result of the detector 1317 is output to the control unit 2.

The control unit 2 acquires the detection results of the detector 1317. The control unit 2 may generate measurement information of the workpiece W (e.g., measurement information including position information regarding the position of the workpiece W) based on the detection results of the detector 1317. Here, with reference to FIG. 4, an example of a method for generating measurement information of the workpiece W based on the detection results of the detector 1317 will be described.

Figure 4 is a graph showing the relationship between the focusing position CP of the processing light EL in the Z-axis direction and the detection result of the detector 1317. Note that Figure 4 shows an example in which the amount of light of the processing return light REL detected by the detector 1317 is used as the detection result of the detector 1317. The amount of light of the processing return light REL may mean the amount of light of the processing return light REL per unit area on the light detection surface of the detector 1317. In this case, the amount of light of the processing return light REL may be considered to be substantially equivalent to the intensity of the processing return light REL. In other words, the intensity of the processing light EL detected by the detector 1317 may be used as the detection result of the detector 1317.

In the first embodiment, the control unit 2 may calculate (in other words, measure) the position of the workpiece W in a direction along the optical path of the processing light EL (e.g., the Z-axis direction) based on the relationship between the focusing position CP of the processing light EL in the Z-axis direction and the detection result of the detector 1317 (i.e., the relationship shown in FIG. 4). In other words, the control unit 2 may calculate the distance between the processing head 13 and the workpiece W in a direction along the optical path of the processing light EL (e.g., the Z-axis direction). More specifically, the control unit 2 may calculate the position of the irradiated portion of the workpiece W irradiated with the processing light EL. The control unit 2 may calculate the distance between the irradiated portion of the workpiece W irradiated with the processing light EL and the processing head 13.

The detection result of the processing return light REL used to generate position information indicating the position of the workpiece W in the Z-axis direction may be considered to include information about the measurement result of the distance between the processing head 13 and the workpiece W in the Z-axis direction. In this case, the detection result of the processing return light REL may be considered to be information about the distance measurement result. Alternatively, the position information generated based on the detection result of the processing return light REL may be considered to be information about the distance measurement result.

In order to calculate the position of the workpiece W based on the relationship between the focusing position CP of the processing light EL and the detection result of the detector 1317, in the first embodiment, the workpiece W and the detector 1317 may be aligned so that the workpiece W and the light detection surface of the detector 1317 or a surface near the light detection surface are optically conjugate. The light detection surface of the detector 1317 may mean the light receiving surface of a light receiving element (e.g., a photodetector) used by the detector 1317 to detect the processing light EL.

In this case, as shown in FIG. 4, the amount of light of the processing return light REL detected by the detector 1317 is maximum when the focusing position CP of the processing light EL coincides with the surface (particularly the top surface) of the workpiece W. As shown in FIG. 4, the amount of light of the processing return light REL detected by the detector 1317 decreases as the focusing position CP of the processing light EL moves away from the surface (particularly the top surface) of the workpiece W. Therefore, the focusing position CP of the processing light EL when the amount of light of the processing return light REL is maximum is equivalent to the position of the workpiece W (for example, the position of the surface (particularly the top surface) of the workpiece W). The focusing position CP of the processing light EL can be identified from a control signal for controlling the operation of the focus control optical system 1311 for controlling the focusing position CP of the processing light EL. Therefore, the control unit 2 may calculate the focus position CP of the processing light EL when the amount of light from the processing return light REL is maximum as the position of the workpiece W (for example, the position of the surface (particularly, the upper surface) of the workpiece W) based on the relationship between the focus position CP of the processing light EL and the detection result of the detector 1317 and the control signal for controlling the operation of the focus control optical system 1311. In other words, the control unit 2 may calculate the focus position CP of the processing light EL at the time when the focus position CP of the processing light EL is located on the surface (particularly, the upper surface) of the workpiece W as the position of the workpiece W (for example, the position of the surface (particularly, the upper surface) of the workpiece W). In this case, the processing system SYSa may be considered to measure the position of the workpiece W by measuring the focus position CP of the processing light EL using the confocal method.

4 and the detection result of the detector 1317, the processing unit 1 may alternately repeat, under the control of the control unit 2, an irradiation operation for irradiating a position of the workpiece W with the processing light EL and a focus operation for moving the focus position CP of the processing light EL along the Z-axis direction using the focus control optical system 1311. In particular, the processing unit 1 may alternately repeat the irradiation operation and the focus operation without changing the position on the workpiece W of the irradiation area PA to which the processing light EL is irradiated. In this case, the processing head 13 and the stage 15 do not need to move. When the processing head 13 and the stage 15 do not move, the focus operation may be considered to be substantially equivalent to an operation for changing the positional relationship between the workpiece W and the focus position CP of the processing light EL in the Z-axis direction. As a result, the control unit 2 acquires a plurality of pieces of information indicating the light amount of the processing light EL (i.e., the detection result of the detector 1317) corresponding to a plurality of different focus positions CP in the Z-axis direction. In this case, as shown in FIG. 4, the control unit 2 may plot multiple plot points on a graph, each of which indicates multiple pieces of information indicating the light amount of the processing light EL (i.e., multiple detection results of the detector 1317), and may interpolate between the multiple plot points to obtain the relationship between the focusing position CP of the processing light EL and the detection results of the detector 1317.

Furthermore, since the irradiation position of the processing light EL on the workpiece W is determined by the drive state of the galvanometer mirrors 1341 and 1315, the control unit 2 may calculate the position of the irradiated portion in a direction intersecting the optical path of the processing light EL (e.g., at least one of the X-axis direction and the Y-axis direction) based on the drive state of the galvanometer mirrors 1341 and 1315. As a result, the control unit 2 may generate position information indicating the position of the irradiated portion in a measurement coordinate system based on the processing head 13 (e.g., a position in a three-dimensional coordinate space).

The processing head 13 may irradiate multiple parts of the workpiece W with the processing light EL. For example, at least one of the galvanometer mirrors 1341 and 1315 may change the irradiation position of the processing light EL on the workpiece W so that the processing head 13 irradiates multiple parts of the workpiece W with the processing light EL. For example, at least one of the processing head 13 and the stage 15 may move so that the processing head 13 irradiates multiple parts of the workpiece W with the processing light EL. When the processing light EL is irradiated to multiple parts of the workpiece W, the control unit 2 may generate position information indicating the positions of the multiple parts of the workpiece W as measurement information. As a result, the control unit 2 may generate shape information indicating the shape of the workpiece W as measurement information based on the position information indicating the positions of the multiple parts. For example, the control unit 2 may generate shape information indicating the shape of the workpiece W by calculating a three-dimensional shape consisting of a virtual plane (or a curved surface) connecting the multiple parts whose positions have been identified as the shape of the workpiece W.

The measurement light ML generated by the measurement light source 12 is further incident on the processing head 13 via an optical transmission member 121 such as an optical fiber. However, the measurement light ML may also be incident on the processing head 13 by spatial transmission using a mirror. The measurement light source 12 may be disposed outside the processing head 13. The measurement light source 12 may be disposed inside the processing head 13. The measurement light ML may be incident on the processing head 13 without passing through an optical transmission member 121 such as an optical fiber. The optical transmission member 121 may also be a polarization-preserving optical fiber.

The measurement light source 12 may include an optical comb light source. An optical comb light source is a light source capable of generating light containing frequency components equally spaced on the frequency axis (hereinafter referred to as an "optical frequency comb") as pulsed light. In this case, the measurement light source 12 emits pulsed light containing frequency components equally spaced on the frequency axis as the measurement light ML. However, the measurement light source 12 may include a light source other than the optical comb light source.

In the example shown in FIG. 3, the processing system SYSa includes multiple measurement light sources 12. For example, the processing system SYSa may include a measurement light source 12#1 and a measurement light source 12#2. The multiple measurement light sources 12 may each emit multiple measurement light beams ML that are phase-synchronized and coherent with each other. For example, the multiple measurement light sources 12 may have different oscillation frequencies. Therefore, the multiple measurement light beams ML emitted by the multiple measurement light sources 12 may have different pulse frequencies (e.g., the number of pulsed lights per unit time, which is the reciprocal of the emission period of the pulsed lights). However, the processing system SYSa may include a single measurement light source 12.

The measurement light ML emitted from the measurement light source 12 is incident on the measurement optical system 132. The measurement optical system 132 is an optical system that emits the measurement light ML incident on the measurement optical system 132 toward the synthesis optical system 133. The measurement optical system 132 is an optical system that emits the measurement light ML incident on the measurement optical system 132 toward the deflection optical system 134 via the synthesis optical system 133. The measurement optical system 132 is an optical system that emits the measurement light ML incident on the measurement optical system 132 toward the irradiation optical system 135 via the synthesis optical system 133 and the deflection optical system 134. The measurement light ML emitted by the measurement optical system 132 is irradiated onto the workpiece W via the synthesis optical system 133, the deflection optical system 134, and the irradiation optical system 135.

The measurement optical system 132 includes, for example, a mirror 1320, a beam splitter 1321, a beam splitter 1322, a detector 1323, a beam splitter 1324, a mirror 1325, a detector 1326, a mirror 1327, and a galvanometer mirror 1328.

The measurement light ML emitted from the measurement light source 12 is incident on the beam splitter 1321. Specifically, the measurement light ML emitted from the measurement light source 12#1 (hereinafter referred to as "measurement light ML#1") is incident on the beam splitter 1321. The measurement light ML emitted from the measurement light source 12#2 (hereinafter referred to as "measurement light ML#2") is incident on the beam splitter 1321 via the mirror 1320. The beam splitter 1321 emits the measurement light ML#1 and ML#2 incident on the beam splitter 1321 toward the beam splitter 1322. In other words, the beam splitter 1321 emits the measurement light ML#1 and ML#2 incident on the beam splitter 1321 from different directions toward the same direction (i.e., the direction in which the beam splitter 1322 is disposed).

Beam splitter 1322 reflects measurement light ML#1-1, which is a part of measurement light ML#1 incident on beam splitter 1322, toward detector 1323. Beam splitter 1322 emits measurement light ML#1-2, which is the other part of measurement light ML#1 incident on beam splitter 1322, toward beam splitter 1324. Beam splitter 1322 reflects measurement light ML#2-1, which is a part of measurement light ML#2 incident on beam splitter 1322, toward detector 1323. Beam splitter 1322 emits measurement light ML#2-2, which is the other part of measurement light ML#2 incident on beam splitter 1322, toward beam splitter 1324.

The measurement light ML#1-1 and ML#2-1 emitted from the beam splitter 1322 are incident on the detector 1323. The detector 1323 receives (i.e., detects) the measurement light ML#1-1 and the measurement light ML#2-1. In particular, the detector 1323 receives interference light (in other words, an interference beam) generated by the interference between the measurement light ML#1-1 and the measurement light ML#2-1. The operation of receiving the interference light generated by the interference between the measurement light ML#1-1 and the measurement light ML#2-1 may be considered equivalent to the operation of receiving the measurement light ML#1-1 and the measurement light ML#2-1. The detection result of the detector 1323 is output to the control unit 2.

The measurement light ML#1-2 and ML#2-2 emitted from the beam splitter 1322 enter the beam splitter 1324. The beam splitter 1324 emits at least a portion of the measurement light ML#1-2 that entered the beam splitter 1324 toward the mirror 1325. The beam splitter 1324 emits at least a portion of the measurement light ML#2-2 that entered the beam splitter 1324 toward the mirror 1327.

The measurement light ML#1-2 emitted from the beam splitter 1324 is incident on the mirror 1325. The measurement light ML#1-2 incident on the mirror 1325 is reflected by the reflecting surface of the mirror 1325 (the reflecting surface may be referred to as a reference surface). Specifically, the mirror 1325 reflects the measurement light ML#1-2 incident on the mirror 1325 toward the beam splitter 1324. In other words, the mirror 1325 emits the measurement light ML#1-2 incident on the mirror 1325 as the reflected light, measurement light ML#1-3, toward the beam splitter 1324. In this case, the measurement light ML#1-3 may be referred to as a reference light. The measurement light ML#1-3 emitted from the mirror 1325 is incident on the beam splitter 1324. The beam splitter 1324 emits the measurement light ML#1-3 incident on the beam splitter 1324 toward the beam splitter 1322. The measurement light ML#1-3 emitted from the beam splitter 1324 is incident on the beam splitter 1322. The beam splitter 1322 emits the measurement light ML#1-3 incident on the beam splitter 1322 toward the detector 1326.

Meanwhile, the measurement light ML#2-2 emitted from the beam splitter 1324 is incident on the mirror 1327. The mirror 1327 reflects the measurement light ML#2-2 incident on the mirror 1327 toward the galvanometer mirror 1328. In other words, the mirror 1327 emits the measurement light ML#2-2 incident on the mirror 1327 toward the galvanometer mirror 1328.

The galvanometer mirror 1328 deflects the measurement light ML#2-2 (i.e., changes the emission angle of the measurement light ML#2-2). By deflecting the measurement light ML#2-2, the galvanometer mirror 1328 changes the focusing position of the measurement light ML#2-2 in a plane intersecting the optical axis EX of the irradiation optical system 135 (i.e., in a plane along the XY plane). Normally, as shown in FIG. 3, the machining head 13 irradiates the workpiece W with the measurement light ML#2-2 in a state in which the optical axis EX and the surface of the workpiece W intersect. Therefore, when the focusing position of the measurement light ML#2-2 in the plane intersecting the optical axis EX is changed, the irradiation area MA of the measurement light ML#2-2 on the surface of the workpiece W moves in a direction along the surface of the workpiece W. In other words, the irradiation area MA of the measurement light ML#2-2 moves along at least one of the X-axis direction and the Y-axis direction.

The galvanometer mirror 1328 includes an X-scanning mirror 1328X and a Y-scanning mirror 1328Y. Each of the X-scanning mirror 1328X and the Y-scanning mirror 1328Y is a tilt-angle variable mirror that changes the angle with respect to the optical path of the measurement light ML#2-2 incident on the galvanometer mirror 1328. The X-scanning mirror 1328X deflects the measurement light ML#2-2 so that the irradiation area MA of the measurement light ML#2-2 on the workpiece W moves along the X-axis direction. In this case, the X-scanning mirror 1328X may be rotatable or oscillating around the Y-axis. In other words, the galvanometer mirror 1328 may be able to move the irradiation area MA of the measurement light ML#2-2 on the workpiece W along the X-axis direction by changing the position of the X-scanning mirror 1328X in the θY direction (or the attitude around the Y-axis). The Y-scanning mirror 1328Y deflects the measurement light ML#2-2 so that the irradiation area MA of the measurement light ML#2-2 on the workpiece W moves along the Y-axis direction. In this case, the Y-scanning mirror 1328Y may be capable of rotating or swinging around the X-axis. In other words, the galvanometer mirror 1328 may be capable of moving the irradiation area MA of the measurement light ML#2-2 on the workpiece W along the Y-axis direction by changing the position of the Y-scanning mirror 1328Y in the θX direction (or the orientation around the X-axis).

The measurement light ML#2-2 emitted from the measurement optical system 132 (in this case, the measurement light ML#2-2 emitted from the galvanometer mirror 1328) is incident on the synthesis optical system 133. As described above, the dichroic mirror 1331 provided in the synthesis optical system 133 has optical properties that enable light of one of the wavelengths of the processing light EL and the measurement light ML to be reflected by the dichroic mirror 1331, while light of the other wavelength of the processing light EL and the measurement light ML to pass through the dichroic mirror 1331. As described above, in the example shown in FIG. 3, since the processing light EL passes through the dichroic mirror 1331, the measurement light ML#2-2 is reflected by the dichroic mirror 1331. The measurement light ML#2-2 reflected by the dichroic mirror 1331 is incident on the deflection optical system 134. Alternatively, the galvanometer mirror 1328 may not be provided, and the measurement light ML#2-2 from the mirror 1327 (or the beam splitter 1324) may be directly incident on the dichroic mirror 1331.

As described above, the processing light EL is incident on the dichroic mirror 1331 in addition to the measurement light ML#2-2. That is, both the measurement light ML#2-2 and the processing light EL are incident on the deflection optical system 134 via the dichroic mirror 1331. The dichroic mirror 1331 outputs the processing light EL and the measurement light ML#2-2, which are incident on the dichroic mirror 1331 from different directions, in the same direction (that is, toward the same deflection optical system 134). Therefore, the dichroic mirror 1331 essentially functions as a combining optical element that combines the processing light EL and the measurement light ML#2-2.

The measurement light ML#2-2 emitted from the synthesis optical system 133 is incident on the deflection optical system 134. The deflection optical system 134 emits the measurement light ML#2-2 incident on the deflection optical system 134 toward the irradiation optical system 135.

The measurement light ML#2-2 incident on the deflection optical system 134 is incident on the galvanometer mirror 1341. The galvanometer mirror 1341 deflects the measurement light ML#2-2 in the same manner as when deflecting the processing light EL. Therefore, the galvanometer mirror 1341 can move the irradiation area MA of the measurement light ML#2-2 on the surface of the workpiece W in a direction along the surface of the workpiece W. In other words, the galvanometer mirror 1341 may be able to move the irradiation area MA of the measurement light ML#2-2 on the workpiece W along the X-axis direction by changing the position of the X-scanning mirror 1341X in the θY direction (or the orientation around the Y-axis). The galvanometer mirror 1341 may be able to move the irradiation area MA of the measurement light ML#2-2 on the workpiece W along the Y-axis direction by changing the position of the Y-scanning mirror 1341Y in the θX direction (or the orientation around the X-axis).

As described above, the processing light EL is incident on the galvanometer mirror 1341 in addition to the measurement light ML#2-2. In other words, the processing light EL and measurement light ML#2-2 combined by the dichroic mirror 1331 are incident on the galvanometer mirror 1341. Therefore, both the measurement light ML#2-2 and the processing light EL pass through the same galvanometer mirror 1341. For this reason, the galvanometer mirror 1341 can move the irradiation area PA of the processing light EL and the irradiation area MA of the measurement light ML#2-2 in synchronization. In other words, the galvanometer mirror 1341 can move the irradiation area PA of the processing light EL and the irradiation area MA of the measurement light ML#2-2 in conjunction with each other.

On the other hand, as described above, the measurement light ML#2-2 is irradiated onto the workpiece W via the galvanometer mirror 1328, while the processing light EL is irradiated onto the workpiece W without passing through the galvanometer mirror 1328. Therefore, the processing system SYSa can use the galvanometer mirror 1328 to independently move the irradiation area MA of the measurement light ML#2-2 with respect to the irradiation area PA of the processing light EL. In other words, the processing system SYSa can use the galvanometer mirror 1328 to change the relative positional relationship between the irradiation area PA of the processing light EL and the irradiation area MA of the measurement light ML#2-2. In particular, the processing system SYSa can use the galvanometer mirror 1328 to change the relative positional relationship between the irradiation area PA of the processing light EL and the irradiation area MA of the measurement light ML#2-2 along a direction intersecting the irradiation direction of the measurement light ML#2-2 (at least one of the X-axis direction and the Y-axis direction in the example shown in FIG. 3).

Similarly, as described above, the processing light EL is irradiated onto the workpiece W via the galvanometer mirror 1315, while the measurement light ML#2-2 is irradiated onto the workpiece W without passing through the galvanometer mirror 1315. Therefore, the processing system SYSa can use the galvanometer mirror 1315 to independently move the irradiation area PA of the processing light EL relative to the irradiation area MA of the measurement light ML#2-2. In other words, the processing system SYSa can use the galvanometer mirror 1315 to change the relative positional relationship between the irradiation area PA of the processing light EL and the irradiation area MA of the measurement light ML#2-2. In particular, the processing system SYSa can use the galvanometer mirror 1328 to change the relative positional relationship between the irradiation area PA of the processing light EL and the irradiation area MA of the measurement light ML#2-2 along a direction intersecting the irradiation direction of the processing light EL (at least one of the X-axis direction and the Y-axis direction in the example shown in FIG. 3).

The measurement light ML#2-2 emitted from the deflection optical system 134 enters the irradiation optical system 135. The irradiation optical system 135 is an optical system capable of irradiating the measurement light ML#2-2 onto the workpiece W. Specifically, the fθ lens 1351 irradiates the measurement light ML#2-2 emitted from the deflection optical system 134 onto the workpiece W. Specifically, the fθ lens 1351 emits the measurement light ML#2-2 in a direction along the optical axis EX of the irradiation optical system 135. As a result, the measurement light ML#2-2 emitted by the fθ lens 1351 travels along the optical axis EX and enters the workpiece W. Note that if the irradiation optical system 135 is equipped with a quarter-wave plate 1352, the measurement light ML#2-2 emitted by the fθ lens 1351 may enter the workpiece W via the quarter-wave plate 1352.

The fθ lens 1351 may focus the measurement light ML#2-2 emitted from the deflection optical system 134 onto the workpiece W. In this case, the fθ lens 1351 may be considered to function as a focusing optical system.

When the fθ lens 1351 focuses the measurement light ML on the workpiece W, the measurement light ML#2-2 emitted from the fθ lens 1351 may be irradiated onto the workpiece W without passing through another optical element having power (in other words, an optical member such as a lens). In this case, the fθ lens 1351 may be called the final optical element or objective optical system because it is the optical element having the final stage of power (i.e., the optical element closest to the workpiece W) among the multiple optical elements arranged on the optical path of the measurement light ML#2-2. In this case, the measurement light ML#2-2 emitted from the deflection optical system 134 and incident on the fθ lens 1351 may be a parallel light beam. The irradiation optical system 135 may be equipped with an objective optical system having projection characteristics different from fθ.

When the workpiece W is irradiated with the measurement light ML#2-2, light resulting from the irradiation of the measurement light ML#2-2 is generated from the workpiece W. In other words, when the workpiece W is irradiated with the measurement light ML#2-2, light resulting from the irradiation of the measurement light ML#2-2 is emitted from the workpiece W. The light resulting from the irradiation of the measurement light ML#2-2 (in other words, the light emitted from the workpiece W due to the irradiation of the measurement light ML#2-2) may include at least one of the measurement light ML#2-2 reflected by the workpiece W (i.e., reflected light), the measurement light ML#2-2 scattered by the workpiece W (i.e., scattered light), the measurement light ML#2-2 diffracted by the workpiece W (i.e., diffracted light), and the measurement light ML#2-2 transmitted through the workpiece W (i.e., transmitted light).

At least a portion of the light emitted from the workpiece W due to the irradiation of the measurement light ML#2-2 is incident on the machining head 13 as light returning from the workpiece W to the machining head 13. In the following description, the light returning from the workpiece W irradiated with the measurement light ML#2-2 to the machining head 13 is referred to as the measurement return light RML. Specifically, of the light emitted from the workpiece W due to the irradiation of the measurement light ML#2-2, the light traveling along the optical path of the measurement light ML#2-2 incident on the workpiece W is incident on the irradiation optical system 135 as the measurement return light RML. In this case, the optical path of the measurement light ML#2-2 emitted from the irradiation optical system 135 and incident on the workpiece W may be the same as the optical path of the measurement return light RML emitted from the workpiece W and incident on the irradiation optical system 135. The measurement return light RML incident on the irradiation optical system 135 is incident on the deflection optical system 134 via the quarter-wave plate 1352 and the fθ lens 1351. The measurement return light RML that is incident on the deflection optical system 134 is incident on the synthesis optical system 133 via the galvanometer mirror 1341. The dichroic mirror 1331 of the synthesis optical system 133 reflects the measurement return light RML that is incident on the dichroic mirror 1331 toward the measurement optical system 132.

The measurement return light RML emitted from the dichroic mirror 1331 is incident on the galvanometer mirror 1328 of the measurement optical system 132. The galvanometer mirror 1328 emits the measurement return light RML incident on the galvanometer mirror 1328 toward the mirror 1327. The mirror 1327 reflects the measurement return light RML incident on the mirror 1327 toward the beam splitter 1324. The beam splitter 1324 emits at least a portion of the measurement return light RML incident on the beam splitter 1324 toward the beam splitter 1322. The beam splitter 1322 emits at least a portion of the measurement return light RML incident on the beam splitter 1322 toward the detector 1326.

As described above, in addition to the measurement return light RML, the measurement light ML#1-3 is incident on the detector 1326. That is, the measurement return light RML that travels toward the detector 1326 via the workpiece W, and the measurement light ML#1-3 that travels toward the detector 1326 without traveling through the workpiece W are incident on the detector 1326. The detector 1326 receives (i.e., detects) the measurement light ML#1-3 and the measurement return light RML. In particular, the detector 1326 receives interference light (in other words, interference beam) generated by interference between the measurement light ML#1-3 and the measurement return light RML. Note that the operation of receiving the interference light generated by interference between the measurement light ML#1-3 and the measurement return light RML may be considered equivalent to the operation of receiving the measurement light ML#1-3 and the measurement return light RML. The detection result of the detector 1326 is output to the control unit 2.

The control unit 2 acquires the detection results of the detector 1323 and the detector 1326. The control unit 2 may generate measurement information of the workpiece W (e.g., measurement information including position information regarding the position of the workpiece W) based on the detection results of the detector 1323 and the detector 1326. Here, a method of generating measurement information of the workpiece W based on the detection results of the detector 1143 and the detector 1146 will be described with reference to FIG. 5.

5 is a timing chart showing the measurement light ML#1-1 incident on detector 1323, the measurement light ML#2-1 incident on detector 1323, the interference light detected by detector 1323, the measurement light ML#1-3 incident on detector 1326, the measurement return light RML incident on detector 1326, and the interference light detected by detector 1326. Since the pulse frequency of measurement light ML#1 is different from the pulse frequency of measurement light ML#2, the pulse frequency of measurement light ML#1-1 is different from the pulse frequency of measurement light ML#2-1. Therefore, the interference light between measurement light ML#1-1 and measurement light ML#2-1 is interference light in which pulse light appears in synchronization with the timing when the pulse light constituting measurement light ML#1-1 and the pulse light constituting measurement light ML#2-1 are simultaneously incident on detector 1323. Similarly, the pulse frequency of measurement light ML#1-3 is different from the pulse frequency of measurement return light RML. Therefore, the interference light between the measurement light ML#1-3 and the measurement return light RML is an interference light in which a pulsed light appears in synchronization with the timing when the pulsed light constituting the measurement light ML#1-3 and the pulsed light constituting the measurement return light RML are simultaneously incident on the detector 1326.

Here, the position (position on the time axis) of the pulsed light of interference light detected by detector 1326 varies depending on the positional relationship between the machining head 13 and the workpiece W. This is because the interference light detected by detector 1326 is interference light between the measurement return light RML heading toward detector 1326 via the workpiece W and the measurement light ML#1-3 heading toward detector 1326 without going through the workpiece W. On the other hand, the position (position on the time axis) of the pulsed light of interference light detected by detector 1323 does not vary depending on the positional relationship between the machining head 13 and the workpiece W (that is, essentially, the positional relationship between the machining head 13 and the workpiece W). For this reason, it can be said that the time difference between the pulsed light of interference light detected by detector 1326 and the pulsed light of interference light detected by detector 1323 indirectly indicates the positional relationship between the machining head 13 and the workpiece W. Specifically, it can be said that the time difference between the pulsed light of the interference light detected by the detector 1326 and the pulsed light of the interference light detected by the detector 1323 indirectly indicates the distance between the machining head 13 and the workpiece W in the direction along the optical path of the measurement light ML (that is, the direction along the traveling direction of the measurement light ML). Therefore, the control unit 2 can calculate (in other words, measure) the distance between the machining head 13 and the workpiece W in the direction along the optical path of the measurement light ML (for example, the Z-axis direction) based on the time difference between the pulsed light of the interference light detected by the detector 1326 and the pulsed light of the interference light detected by the detector 1323. In other words, the control unit 2 can calculate the position of the workpiece W in the direction along the optical path of the measurement light ML (for example, the Z-axis direction). More specifically, the control unit 2 can calculate the distance between the irradiated portion of the workpiece W irradiated with the measurement light ML#2-2 and the machining head 13. The control unit 2 can calculate the position of the irradiated portion in the direction along the optical path of the measurement light ML (for example, the Z-axis direction). As a result, the control unit 2 can generate, as measurement information, position information indicating the position of the irradiated portion in the Z-axis direction (typically, the distance to the irradiated portion in the Z-axis direction) in a measurement coordinate system based on the processing head 13. In this case, the measurement optical system 132 may be considered to function as a measurement device that measures the position of the irradiated portion in the Z-axis direction (typically, the distance to the irradiated portion in the Z-axis direction).

The detection result of the measurement return light RML used to generate position information indicating the position of the workpiece W in the Z-axis direction may be considered to include information about the measurement result of the distance between the machining head 13 and the workpiece W in the Z-axis direction. In this case, the detection result of the measurement return light RML may be considered to be information about the distance measurement result. Alternatively, the position information generated based on the detection result of the measurement return light RML may be considered to be information about the distance measurement result.

Furthermore, since the irradiation position of the measurement light ML#2-2 on the workpiece W is determined by the drive state of the galvanometer mirrors 1341 and 1328, the control unit 2 may calculate the position of the irradiated portion in a direction intersecting the optical path of the measurement light ML (e.g., at least one of the X-axis direction and the Y-axis direction) based on the drive state of the galvanometer mirrors 1341 and 1328. As a result, the control unit 2 may generate position information indicating the position of the irradiated portion in a measurement coordinate system based on the machining head 13 (e.g., a position in a three-dimensional coordinate space).

The machining head 13 may irradiate multiple portions of the workpiece W with the measurement light ML#2-2. For example, at least one of the galvanometer mirrors 1341 and 1328 may change the irradiation position of the measurement light ML#2-2 on the workpiece W so that the machining head 13 irradiates multiple portions of the workpiece W with the measurement light ML#2-2. For example, at least one of the machining head 13 and the stage 15 may move so that the machining head 13 irradiates multiple portions of the workpiece W with the measurement light ML#2-2. When the measurement light ML#2-2 is irradiated to multiple portions of the workpiece W, the control unit 2 may generate position information indicating the positions of the multiple portions of the workpiece W as measurement information. Note that when at least one of the galvanometer mirrors 1341 and 1328 changes the irradiation position of the measurement light ML#2-2 so that the machining head 13 irradiates multiple portions of the workpiece W with the measurement light ML#2-2, the machining head 13 can irradiate multiple portions of the workpiece W with the measurement light ML#2-2 in a relatively short time. As a result, the machining system SYSa can quickly measure the positions of multiple parts of the workpiece W.

When position information indicating the positions of multiple parts of the workpiece W is generated, the control unit 2 may generate shape information indicating the shape of the workpiece W as measurement information based on the position information indicating the positions of the multiple parts. For example, the control unit 2 may generate shape information indicating the shape of the workpiece W by calculating, as the shape of the workpiece W, a three-dimensional shape composed of a virtual plane (or a curved surface) connecting the multiple parts whose positions have been identified.

(1-2) Operations Performed by the Machining System SYSa Next, operations performed by the machining system SYSa will be described.

(1-2-1) Processing Operation for Processing the Workpiece W As described above, the processing system SYSa can process the workpiece W by irradiating the processing light EL onto the workpiece W. In other words, the processing system SYSa may perform a processing operation for processing the workpiece W using the processing light EL.

The processing unit 1 may perform removal processing on the workpiece W. That is, the processing unit 1 may perform removal processing to remove a part of the workpiece W. In the first embodiment, the processing unit 1 may perform removal processing by utilizing the principle of non-thermal processing (e.g., ablation processing). That is, the processing unit 1 may perform non-thermal processing (e.g., ablation processing) on the workpiece W. To perform non-thermal processing, the processing unit 1 may use light with a high photon density (in other words, fluence) as the processing light EL. As an example, the processing unit 1 may use light including pulse light having an emission time of nanoseconds or less, picoseconds or less, or femtoseconds or less as the processing light EL. That is, the processing unit 1 may use light including pulse light having a pulse width of nanoseconds or less, picoseconds or less, or femtoseconds or less as the processing light EL. In this case, the material constituting the energy transmission part of the workpiece W to which the energy of the processing light EL is transmitted evaporates and disperses instantly. That is, the material constituting the energy transmission part of the workpiece W evaporates and disperses within a time sufficiently shorter than the thermal diffusion time of the workpiece W. The material constituting the energy transfer portion of the workpiece W may sublimate without going through a molten state. In this case, the material constituting the energy transfer portion of the workpiece W may be released from the workpiece W as at least one of ions, atoms, radicals, molecules, clusters, and solid pieces. However, the processing unit 1 may also perform removal processing using the principle of thermal processing.

The processing unit 1 may perform additive processing on the workpiece W. In other words, the processing unit 1 may perform additive processing to form a model on the workpiece W. In this case, the processing unit 1 may be considered to be capable of functioning as a 3D printer. As a method for performing additive processing, powder bed fusion may be used, laser metal deposition (LMD) or directed energy deposition (DED) may be used. When powder bed fusion is used, the workpiece W may be a modeling plate or a powder layer.

The processing unit 1 may perform melt processing to melt the surface of the workpiece W and solidify the melted surface. The melt processing may be referred to as remelt processing. The processing unit 1 may perform planar processing to make the surface of the workpiece W closer to a flat surface compared to before the melt processing by performing melt processing. In the first embodiment, the processing unit 1 may perform melt processing using the principle of thermal processing. That is, the processing unit 1 may perform thermal processing on the workpiece W. To perform thermal processing, the processing unit 1 may use light including pulsed light of milliseconds or more or nanoseconds or more as the processing light EL. To perform thermal processing, the processing unit 1 may use continuous light as the processing light EL.

In addition, when the processing unit 1 performs both non-thermal processing and thermal processing, the processing unit 1 may be provided with a processing light source 11, which will be described later, that generates processing light EL used for non-thermal processing and a processing light source that generates processing light EL used for thermal processing separately. The processing light source that generates processing light EL used for non-thermal processing may be disposed inside the processing head 13.

The processing unit 1 may perform a marking process to form a desired mark on the surface of the workpiece W. The processing unit 1 may perform a surface modification process to change the characteristics of the surface of the workpiece W. The processing unit 1 may perform a peening process to change the characteristics of the surface of the workpiece W. The processing unit 1 may perform a peeling process to peel off the surface of the workpiece W. The processing unit 1 may perform a welding process to join one workpiece W to another workpiece W. The processing unit 1 may perform a cutting process to cut the workpiece W.

The processing unit 1 may process the workpiece W to form a desired structure on the surface of the workpiece W. However, the processing unit 1 may perform processing other than the processing for forming the desired structure on the surface of the workpiece W. One example of processing other than the processing for forming the desired structure on the surface of the workpiece W may be flattening processing of the workpiece W. The flattening processing of the workpiece W may include processing for grinding the surface of the workpiece W to make it flat.

An example of a desired structure is a riblet structure. The riblet structure may include a structure that can reduce the resistance of the surface of the workpiece W to the fluid (particularly, at least one of frictional resistance and turbulent frictional resistance). For this reason, the riblet structure may be formed on a workpiece W having a member that is installed (in other words, located) in the fluid. Note that the "fluid" here means a medium (e.g., at least one of gas and liquid) that is flowing relative to the surface of the workpiece W. For example, when the surface of the workpiece W moves relative to the medium while the medium itself is stationary, this medium may be referred to as a fluid. Note that the state in which the medium is stationary may mean a state in which the medium is not moving relative to a predetermined reference object (e.g., the ground surface).

Examples of the workpiece W on which the riblet structure is formed include at least one of an aircraft, a windmill, an engine turbine, and a power generation turbine. When such a riblet structure is formed on the workpiece W, the workpiece W becomes easier to move relative to the fluid. This reduces the resistance that impedes the movement of the workpiece W relative to the fluid, leading to energy savings. In other words, it is possible to manufacture an environmentally friendly workpiece W. For example, if the workpiece W is a member exposed to the surface of the aircraft body (e.g., at least a part of the aircraft), the resistance that impedes the movement of the aircraft is reduced, leading to fuel savings in the aircraft. For example, if the workpiece W is a windmill (e.g., at least a part of the windmill), the resistance that impedes the movement (typically, rotation) of the windmill is reduced, leading to high efficiency of the windmill. For example, if the workpiece W is an engine turbine (e.g., at least a part of the engine turbine), the resistance that impedes the movement (typically, rotation) of the engine turbine is reduced, leading to high efficiency or energy savings of the engine turbine. For example, if the workpiece W is a power generating turbine (e.g., at least a part of a power generating turbine), the resistance that impedes the movement (typically, rotation) of the power generating turbine is reduced, leading to higher efficiency of the power generating turbine (i.e., improved power generation efficiency). Therefore, the processing unit 1 may be able to contribute to "13.2.2 Reduce total greenhouse gas emissions per year" in Goal 13 of the United Nations-led Sustainable Development Goals (SDGs), "Take urgent action to combat climate change and its impacts."

Another example of a desired structure is a hole structure.Another example of a desired structure is a carved structure.

(1-2-2) Measurement Operation As described above, the processing system SYSa can measure the measurement object M based on the detection result of the measurement return light RML generated from the measurement object M by irradiating the measurement light ML on the measurement object M. That is, the processing system SYSa may perform a measurement operation for measuring the measurement object M using the measurement light ML. In particular, in the first embodiment, the processing system SYSa can measure the position of the measurement object M (particularly, the position of the measurement object M in the Z-axis direction, and essentially the distance) based on the detection result of the measurement return light RML. In the following description, for convenience of explanation, an example will be described in which the measurement object M is a workpiece W and the processing system SYSa measures the position of the workpiece W in the Z-axis direction. In addition, in the following description, for convenience of explanation, the position of the workpiece W in the Z-axis direction will be referred to as the Z position of the workpiece W. However, even if the measurement object M is an object different from the workpiece W, the processing system SYSa may perform the measurement operation described below. Even when the machining system SYSa measures the position (e.g., Z position) of the measurement object M, the machining system SYSa may perform the measurement operation described below.

Furthermore, as described above, the processing system SYSa can measure the Z position of the workpiece W based on the detection result of the processing return light REL generated from the workpiece W by irradiating the workpiece W with the processing light EL instead of the detection result of the measurement return light RML. In other words, the processing system SYSa may perform a measurement operation to measure the Z position of the workpiece W using the processing light EL instead of the measurement light ML.

In particular, in the first embodiment, the processing system SYSa may measure the Z position of the workpiece W based on both the detection result of the measurement return light RML of the measurement light ML and the detection result of the processing return light REL of the processing light EL. In other words, the control unit 2 may calculate the Z position of the workpiece W based on both the detection result of the measurement return light RML by each of the

detectors

1323 and 1326 and the detection result of the processing return light REL by the detector 1317. In other words, the control unit 2 may generate position information indicating the Z position of the workpiece W as measurement information based on both the detection result of the measurement return light RML and the detection result of the processing return light REL.

The operation of generating position information based on both the detection results of the measurement return light RML and the detection results of the processing return light REL will be explained in more detail below.

(1-2-2-1) Technical reasons for generating position information based on both the detection results of the measurement return light RML and the detection results of the processing return light REL First , as a premise for explaining the operation of generating position information based on both the detection results of the measurement return light RML and the detection results of the processing return light REL in the first embodiment, the technical reasons for generating position information based on both the detection results of the measurement return light RML and the detection results of the processing return light REL will be explained.

As described above, the control unit 2 can generate position information indicating the Z position of the workpiece W based on the detection results of the measurement return light RML without using the detection results of the processing return light REL. However, in some cases, the position information generated based on the detection results of the measurement return light RML without using the detection results of the processing return light REL may not accurately indicate the Z position of the workpiece W. In other words, the position information generated based on the detection results of the measurement return light RML without using the detection results of the processing return light REL may contain errors.

For example, Figure 6 shows by a dotted line the ideal position information that should be generated based on the detection results of the measurement return light RML, and also shows in solid lines an example of position information that is actually generated based on the detection results of the measurement return light RML. The ideal position information indicates the actual Z position of the workpiece W at each position within a surface along the XY plane, and the generated position information indicates the measurement results of the Z position of the workpiece W at each position within a surface along the XY plane.

As shown in FIG. 6, the position information generated based on the detection results of the measurement return light RML may be erroneous position information indicating that the Z position of the workpiece W is farther toward the -Z side than the actual Z position of the workpiece W indicated by the ideal position information. In other words, the position information generated based on the detection results of the measurement return light RML may be erroneous position information indicating that the distance in the Z axis direction between the machining head 13 and the workpiece W is longer than the distance in the Z axis direction between the machining head 13 and the workpiece W indicated by the ideal position information. In this way, the position information generated based on the detection results of the measurement return light RML may contain a measurement error equivalent to the difference between the position information generated based on the detection results of the measurement return light RML and the ideal position information.

One of the technical reasons why the position information generated based on the detection result of the measurement return light RML contains a measurement error is that the timing at which the measurement return light RML generated from the workpiece W is detected by the detector 1326 deviates from the original timing due to the influence of minute recesses on the surface of the workpiece W. As an example, FIG. 7(a) shows a workpiece W having a minute recess CC on the surface WS whose Z position is to be measured. In this case, the measurement light ML may be irradiated not only to the surface WS of the workpiece W whose Z position is to be measured (particularly the part where the recess CC is not formed), but also to the recess CC recessed on the -Z side of the surface WS of the workpiece W. In the first embodiment, for convenience of explanation, the phenomenon in which the measurement light ML is irradiated to the recess CC recessed on the -Z side of the surface WS of the workpiece W is referred to as "penetration of the measurement light ML". When such penetration of the measurement light ML occurs, the timing at which the measurement return light RML generated from the recess CC enters the detector 1326 differs from the timing at which the measurement return light RML generated from the surface WS of the workpiece W enters the detector 1326. This is because the distance from the processing head 13 to the recess CC (particularly, the distance to the bottom forming the recess CC) differs from the distance from the processing head 13 to the surface WS of the workpiece W. Typically, the timing at which the measurement return light RML generated from the recess CC enters the detector 1326 is delayed by a time corresponding to the penetration amount of the measurement light ML with respect to the timing at which the measurement return light RML generated from the surface WS of the workpiece W enters the detector 1326. The penetration amount of the measurement light ML may mean the distance that the measurement light ML has advanced toward the -Z side from the surface WS of the workpiece W, as shown in FIG. 7A. For example, the penetration amount of the measurement light ML may refer to the distance traveled by the measurement light ML inside a recess CC recessed toward the -Z side from the surface WS of the workpiece W. As a result, as shown in FIG. 7B, the position information generated based on the detection results of the measurement return light RML includes not only information about the Z position of the surface of the workpiece W, but also information about the Z position of the recess CC recessed toward the -Z side from the surface WS of the workpiece W. For this reason, the method of generating position information based on the detection results of the measurement return light RML has a technical problem in that the measurement error described using FIG. 6 may be included in the position information.

The cause of the penetration of the measurement light ML is not limited to a change in the timing of the measurement return light RML generated from the minute recess CC. For example, the penetration of the measurement light ML may occur due to interference caused by diffuse reflection of at least one of the measurement light ML and the measurement return light RML inside the minute recess. For example, the penetration of the measurement light ML may occur due to variations in the optical transparency of the workpiece W. In either case, a technical problem arises in that measurement errors may be included in the position information.

On the other hand, as described above, the control unit 2 can generate position information indicating the Z position of the workpiece W based on the detection result of the processing return light REL without using the detection result of the measurement return light RML. Here, the method of generating position information based on the detection result of the processing return light REL does not cause the above-mentioned technical problems that arise when generating position information based on the detection result of the measurement return light RML. This is because even if the timing at which the processing return light REL generated from the recess CC enters the detector 1317 is different from the timing at which the processing return light REL generated from the surface WS of the workpiece W enters the detector 1317, the light amount of the processing return light REL used as the detection result of the processing return light REL does not fluctuate. Therefore, the position information generated based on the detection result of the processing return light REL is usually more accurate than the position information generated based on the detection result of the measurement return light RML. In other words, the position information generated based on the detection result of the processing return light REL usually indicates the Z position of the workpiece W with higher accuracy than the position information generated based on the detection result of the measurement return light RML.

On the other hand, when position information is generated based on the detection results of the processing return light REL, as described above, the processing unit 1, under the control of the control unit 2, must alternately repeat an irradiation operation of irradiating a position on the workpiece W with the processing light EL and a focusing operation of moving the focusing position CP of the processing light EL along the Z-axis direction. For this reason, the time required to generate position information based on the detection results of the processing return light REL is longer than the time required to generate position information based on the detection results of the measurement return light RML. In other words, the method of generating position information based on the detection results of the processing return light REL poses a technical problem in that the time required to generate position information may be long.

Therefore, in the first embodiment, the processing system SYSa generates position information while solving the above-mentioned technical problems by combining a method of generating position information based on the detection result of the measurement return light RML and a method of generating position information based on the detection result of the processing return light REL. Specifically, the processing system SYSa generates position information indicating the Z position of each part of the surface WS of the workpiece W based on the detection result of the measurement return light RML in principle. As a result, the processing system SYSa can reduce the time required to generate position information compared to the case where position information indicating the Z position of each part of the surface WS of the workpiece W is generated based on the detection result of the processing return light REL. Furthermore, the processing system SYSa corrects the position information generated based on the detection result of the measurement return light RML using the detection result of the processing return light REL that indicates the Z position of the workpiece W with higher accuracy. More specifically, the processing system SYSa corrects the relatively low-precision position information generated based on the detection result of the measurement return light RML using the relatively high-precision position information generated based on the detection result of the processing return light REL. As a result, the processing system SYSa can generate position information that indicates the Z position of the workpiece W with higher accuracy than when position information indicating the Z position of each part of the surface WS of the workpiece W is generated based on the detection results of the measurement return light RML without using the detection results of the processing return light REL.

(1-2-2-2) Specific flow of operation for generating position information based on both the detection result of the measurement return light RML and the detection result of the processing return light REL Next, a specific flow of operation for generating position information based on both the detection result of the measurement return light RML and the detection result of the processing return light REL will be described with reference to Fig. 8. Fig. 8 is a flowchart showing the flow of operation for generating position information based on both the detection result of the measurement return light RML and the detection result of the processing return light REL.

8, the processing unit 1 irradiates the workpiece W with the measurement light ML under the control of the control unit 2 (step S101). For example, the processing unit 1 may irradiate each of a plurality of different parts of the workpiece W with the measurement light ML. In this case, the processing unit 1 may irradiate each of a plurality of different parts of the workpiece W with the measurement light ML by moving the irradiation area MA of the measurement light ML relative to the workpiece W using at least one of the galvanometer mirrors 1328 and 1341. The processing unit 1 may irradiate each of a plurality of different parts of the workpiece W with the measurement light ML by moving at least one of the processing head 13 and the stage 15 to move the irradiation area MA of the measurement light ML relative to the workpiece W. Thereafter, the control unit 2 calculates the Z position of the workpiece W based on the detection result of the measurement return light RML generated from the workpiece W by irradiating the workpiece W with the measurement light ML (step S102). In other words, the control unit 2 generates position information indicating the Z position of the workpiece W (step S102). For example, when the measurement light ML is irradiated onto each of multiple different parts of the workpiece W, the control unit 2 may generate position information indicating the Z position of each of the multiple different parts of the workpiece W.

As an example, the processing unit 1 may irradiate a first portion of the workpiece W with the measurement light ML, and may also irradiate a second portion of the workpiece W that is different from the first portion with the measurement light ML. Thereafter, the control unit 2 may calculate the Z position of the first portion of the workpiece W based on the detection result of the measurement return light RML generated from the first portion of the workpiece W when the measurement light ML is irradiated onto the first portion of the workpiece W. Furthermore, the control unit 2 may calculate the Z position of the second portion of the workpiece W based on the detection result of the measurement return light RML generated from the second portion of the workpiece W when the measurement light ML is irradiated onto the second portion of the workpiece W. In other words, the control unit 2 may generate position information indicating the Z positions of the first and second portions of the workpiece W.

In parallel with or before or after the operations from step S101 to step S102, the processing unit 1 irradiates the workpiece W with the processing light EL under the control of the control unit 2 (step S103). In particular, the processing unit 1 irradiates the processing light EL to at least one of the multiple different parts of the workpiece W irradiated with the measurement light ML in step S101. In the following description, for convenience of explanation, an example will be described in which the processing unit 1 irradiates the processing light EL to any one of the multiple different parts of the workpiece W irradiated with the measurement light ML in step S101. As an example, when the processing unit 1 irradiates the measurement light ML to each of the first and second parts of the workpiece W in step S101, the processing unit 1 may irradiate the processing light EL to the first or second part of the workpiece W in step S103. In the following description, for convenience of explanation, a part of the workpiece W irradiated with the processing light EL in step S103 to generate position information is referred to as a "target part".

However, the processing unit 1 may irradiate the processing light EL to an area near at least one of the multiple different parts of the workpiece W irradiated with the measurement light ML in step S101. As an example, if the processing unit 1 irradiates the measurement light ML to each of the first and second parts of the workpiece W in step S101, the processing unit 1 may irradiate the processing light EL to an area near the first or second part of the workpiece W in step S103.

The characteristics of the processing light EL irradiated to the workpiece W to generate position information may be different from the characteristics of the processing light EL irradiated to the workpiece W to process the workpiece W. An example of the characteristics of the processing light EL is at least one of the intensity of the processing light EL and the irradiation time of the processing light EL. The intensity of the processing light EL may mean the fluence. In the case where the processing light EL includes pulsed light, an example of the characteristics of the processing light EL is at least one of the number of pulsed lights per unit time (i.e., the number of pulses) and the pulse length.

When the intensity of the processing light EL is used as the characteristic of the processing light EL, the intensity of the processing light EL irradiated to the workpiece W to generate position information may be lower than the intensity of the processing light EL irradiated to the workpiece W to process the workpiece W. As a result, the possibility of the workpiece W being unintentionally processed by the processing light EL irradiated to the workpiece W to generate position information is reduced. Typically, the intensity of the processing light EL irradiated to the workpiece W to generate position information may be lower than the intensity of the processing light EL capable of processing the workpiece W. As a result, the possibility of the workpiece W being unintentionally processed by the processing light EL irradiated to the workpiece W to generate position information is reduced.

In order to make the intensity of the processing light EL irradiated to the workpiece W to generate position information lower than the intensity of the processing light EL irradiated to the workpiece W to process the workpiece W, the control unit 2 may control the processing light source 11 to control the intensity of the processing light EL emitted from the processing light source 11. In order to make the intensity of the processing light EL irradiated to the workpiece W to generate position information lower than the intensity of the processing light EL irradiated to the workpiece W to process the workpiece W, the processing unit 1 may place an attenuation member capable of attenuating the processing light EL in the optical path of the processing light EL.

The angle of incidence of the processing light EL on the target portion of the workpiece W in step S103 may be the same as the angle of incidence of the measurement light ML on the target portion of the workpiece W in step S101. In this case, the penetration amount of the processing light EL in step S103 will be the same as the penetration amount of the measurement light ML in step S101.

When the processing light EL is irradiated onto the workpiece W, the detector 1317 detects the processing return light REL that is generated from the target portion of the workpiece W as a result of the processing light EL being irradiated onto the target portion of the workpiece W (step S104).

Then, under the control of the control unit 2, the processing unit 1 alternately repeats a focusing operation (step S106) that changes the focusing position CP of the processing light EL and an irradiation operation (steps S103 to S104) that irradiates the target portion of the workpiece W with the processing light EL and detects the processing return light REL until the target portion of the workpiece W is irradiated the processing light EL the required number of times (step S105).Then, the control unit 2 calculates the Z position of the target portion of the workpiece W based on the detection result of the processing return light REL in step S104 (step S107).

Then, the control unit 2 calculates a position correction amount for correcting the Z position of the workpiece W calculated based on the detection results of the measurement return light RML based on the Z position of the workpiece W calculated based on the detection results of the measurement return light RML in step S102 and the Z position of the workpiece W calculated based on the detection results of the processing return light REL in step S107 (step S108). Specifically, the control unit 2 calculates the position correction amount based on the Z position of the target portion of the workpiece W calculated based on the detection results of the measurement return light RML in step S102 and the Z position of the same target portion of the workpiece W calculated based on the detection results of the processing return light REL in step S107.

In the first embodiment, the control unit 2 may calculate the position correction amount based on the relationship between the Z position of the target portion of the workpiece W calculated based on the detection result of the measurement return light RML and the Z position of the same target portion of the workpiece W calculated based on the detection result of the processing return light REL. As an example, as described above, the Z position of the workpiece W calculated based on the detection result of the processing return light REL indicates the Z position of the workpiece W with high accuracy compared to the Z position of the workpiece W calculated based on the detection result of the measurement return light RML. Therefore, the difference between the Z position of the workpiece W calculated based on the detection result of the processing return light REL and the Z position of the workpiece W calculated based on the detection result of the measurement return light RML is likely to indicate a measurement error contained in the Z position of the workpiece W calculated based on the detection result of the measurement return light RML. Therefore, in the first embodiment, as shown in FIG. 9, the control unit 2 may calculate the difference between the Z position of the target portion of the workpiece W calculated based on the detection result of the measurement return light RML and the Z position of the same target portion of the workpiece W calculated based on the detection result of the processing return light REL as the position correction amount.

Referring back to FIG. 8, the control unit 2 then corrects the Z position of the workpiece W calculated in step S102 based on the detection result of the measurement return light RML using the position correction amount calculated in step S108 (step S109). Specifically, the control unit 2 adds the position correction amount calculated in step S108 to the Z position of the workpiece W calculated in step S102 based on the detection result of the measurement return light RML of the measurement light ML (step S109). That is, the control unit 2 adds the position correction amount to each of the Z positions of multiple different parts of the workpiece W calculated based on the detection result of the measurement return light RML (step S109). As a result, the Z position to which the position correction amount has been added is calculated as the corrected Z position. That is, position information indicating the corrected Z position of the workpiece W (i.e., corrected position information) is generated.

As an example, when the processing unit 1 irradiates the first and second portions of the workpiece W with the measurement light ML in step S101 and irradiates the first portion of the workpiece W with the processing light EL in step S103, the control unit 2 may calculate the difference between the Z position of the first portion of the workpiece W calculated based on the detection result of the measurement return light RML and the Z position of the first portion of the workpiece W calculated based on the detection result of the processing return light REL as the position correction amount. Thereafter, the control unit 2 may correct the Z position of the first portion of the workpiece W by adding the position correction amount to the Z position of the first portion of the workpiece W calculated based on the detection result of the measurement return light RML. Similarly, the control unit 2 may correct the Z position of the second portion of the workpiece W by adding the position correction amount to the Z position of the second portion of the workpiece W calculated based on the detection result of the measurement return light RML. As a result, the control unit 2 may generate position information indicating the Z position of the first part of the work W to which the position correction amount has been added (i.e., the corrected Z position of the first part of the work W) and the Z position of the second part of the work W to which the position correction amount has been added (i.e., the corrected Z position of the second part of the work W).

When the position information is corrected, the control unit 2 may control the operation of the processing unit 1 to process the workpiece W based on the corrected position information.

(1-3) Technical Effects As described above, the processing system SYSa can generate position information indicating the Z position of the workpiece W based on both the detection result of the measurement return light RML and the detection result of the processing return light REL. Specifically, the processing system SYSa can correct the position information generated based on the detection result of the measurement return light RML using a position correction amount generated based on the detection result of the processing return light REL. As a result, the measurement error included in the corrected position information is smaller than the measurement error included in the position information generated based on the detection result of the measurement return light RML. Therefore, the processing system SYSa can process the workpiece W using the corrected position information that indicates the Z position of the workpiece W with high accuracy compared to the position information generated based on the detection result of the measurement return light RML. Therefore, the processing system SYSa can properly process the workpiece W.

(2) Machining system SYS of the second embodiment
Next, a description will be given of a machining system SYS in the second embodiment. In the following description, the machining system SYS in the second embodiment will be referred to as a "machining system SYSb."

The machining system SYSb in the second embodiment differs from the machining system SYSa in the first embodiment described above in that the method for calculating the Z position of the workpiece W based on the detection result of the measurement return light RML of the measurement light ML in step S102 of FIG. 8 is different. Other features of the machining system SYSb may be the same as other features of the machining system SYSa.

Specifically, in the first embodiment described above, the control unit 2 calculates the Z position of the first portion of the work W based on the detection result of the measurement return light RML generated by irradiating the first portion of the work W with the measurement light ML. On the other hand, in the second embodiment, as shown in FIG. 11(a) and FIG. 11(b), the control unit 2 may calculate the Z position of the first portion P1 of the work W based on both the detection result of the measurement return light RML generated by irradiating the first portion P1 of the work W with the measurement light ML and the detection result of the measurement return light RML generated by irradiating at least one second portion P2 of the work W having a predetermined positional relationship with the first portion P1. Note that FIG. 11(a) shows an example in which the control unit 2 calculates the Z position of the first portion P1 of the work W based on both the detection result of the measurement return light RML generated by irradiating the first portion P1 of the work W with the measurement light ML and the detection result of the measurement return light RML generated by irradiating one second portion P2 of the work W with the measurement light ML. On the other hand, FIG. 11(b) shows an example in which the control unit 2 calculates the Z position of the first portion P1 of the workpiece W based on both the detection result of the measurement return light RML generated by irradiating the measurement light ML onto the first portion P1 of the workpiece W and the detection result of the measurement return light RML generated by irradiating the measurement light ML onto multiple second portions P2 of the workpiece W.

As shown in Figures 11(a) and 11(b), the second part P2 having a predetermined positional relationship with the first part P1 may be located within a predetermined distance from the first part P1. In other words, in the second embodiment, the state in which "the first part P1 of the work W and the second part P2 of the work W have a predetermined positional relationship" may mean the state in which "the second part P2 of the work W is located within a predetermined distance from the first part P1 of the work W." In the second embodiment, the state in which "the first part P1 of the work W and the second part P2 of the work W have a predetermined positional relationship" may mean the state in which "the distance between the first part P1 of the work W and other parts of the work W is within a predetermined distance."

The specified distance may be a constant fixed in advance. For example, the specified distance may be determined in advance based on the material of the workpiece W. For example, the specified distance may be determined in advance based on the shape of the workpiece W. In this case, constant information specifying the predetermined distance fixed in advance may be input to the processing system SYSb. Alternatively, the control unit 2 may store constant information specifying the predetermined distance fixed in advance in the storage device 22. The control unit 2 may specify at least one second portion P2 located within a predetermined distance from the first portion P1 using the predetermined distance specified by the distance information, and calculate the Z position of the first portion P1 based on both the detection result of the measurement return light RML generated by irradiating the first portion P1 with the measurement light ML and the detection result of the measurement return light RML generated by irradiating the measurement light ML to at least one second portion P2.

The specified distance may be a variable that can be changed by a user of the processing system SYSb. As an example, the user may change the specified distance based on the material of the workpiece W. As another example, the user may change the specified distance based on the shape of the workpiece W. As another example, the user may change the specified distance so that the specified distance becomes a distance desired by the user. In this case, user instruction information regarding a user's instruction to change (e.g., specify) the specified distance may be input to the processing system SYSb. Alternatively, the specified distance may be a variable that can be changed by the control unit 2. In this case, the control unit 2 may change the specified distance based on a specified distance change criterion without requiring a user's instruction. As an example, the control unit 2 may change the specified distance based on the material of the workpiece W. As another example, the control unit 2 may change the specified distance based on the shape of the workpiece W. If the specified distance is changeable, the control unit 2 may use the changed specified distance to specify at least one second portion P2 located within a specified distance from the first portion P1, and calculate the Z position of the first portion P1 based on both the detection result of the measurement return light RML generated by irradiating the measurement light ML onto the first portion P1 and the detection result of the measurement return light RML generated by irradiating the measurement light ML onto at least one second portion P2.

The control unit 2 may calculate the Z position of the first part P1 as an intermediate value based on the detection result of the measurement return light RML generated by irradiating the first part P1 with the measurement light ML, and may calculate the Z position of the second part P2 as an intermediate value based on the detection result of the measurement return light RML generated by irradiating the second part P2 with the measurement light ML. Thereafter, the control unit 2 may calculate the final value of the Z position of the first part P1 based on both the intermediate value of the Z position of the first part P1 and the intermediate value of the Z position of the second part P2.

As an example, the control unit 2 may calculate the average value of the intermediate value of the Z position of the first part P1 and the intermediate value of the Z position of the second part P2 as the final value of the Z position of the first part P1. In other words, the control unit 2 may perform an averaging process to calculate the average value of the intermediate value of the Z position of the first part P1 and the intermediate value of the Z position of the second part P2 as the final value of the Z position of the first part P1. By such an averaging process, the measurement error contained in the position information generated based on the detection result of the measurement return light RML of the measurement light ML is reduced. Specifically, FIG. 12 shows the intermediate value of the Z position of the workpiece W calculated based on the detection result of the measurement return light RML of the measurement light ML and the final value of the Z position of the workpiece W calculated by the averaging process. As shown in FIG. 12, by the averaging process, the variation of the final value of the Z position of the workpiece W in the plane along the XY plane becomes smaller than the variation of the intermediate value of the Z position of the workpiece W in the plane along the XY plane. It can be seen that the variation in the calculated Z position of the workpiece W depends on the amount of penetration of the measurement light ML into the workpiece W described above, and the greater the variation in the calculated Z position of the workpiece W, the greater the measurement error contained in the position information; therefore, the averaging process reduces the measurement error contained in the position information. As a result, the control unit 2 can more accurately calculate the Z position of the workpiece W based on the detection results of the measurement return light RML of the measurement light ML, compared to when the averaging process is not performed.

In this way, when the Z position of the workpiece W is calculated by the averaging process in step S102 of FIG. 8, the control unit 2 may calculate the position correction amount using the Z position of the target part calculated by the averaging process in step S108 of FIG. 8. Furthermore, the control unit 2 may add the position correction amount to the Z position of the workpiece W calculated by the averaging process in step S109 of FIG. 8.

Alternatively, when the Z position of the workpiece W is calculated by the averaging process in step S102 of FIG. 8, the control unit 2 does not need to correct the Z position of the workpiece W calculated by the averaging process based on the detection result of the processing return light REL. In other words, the control unit 2 may control the processing unit 1 to process the workpiece W using position information indicating the Z position of the workpiece W calculated by the averaging process. In this case, the processing system SYSb does not need to perform the operations from steps S103 to S109 of FIG. 8.

(3) Machining system SYS of the third embodiment
Next, a machining system SYS in the third embodiment will be described. In the following description, the machining system SYS in the third embodiment will be referred to as a "machining system SYSc."

The machining system SYSc in the third embodiment differs from at least one of the machining systems SYSa in the first embodiment to SYSb in the second embodiment described above in that the method for calculating the Z position of the workpiece W based on the detection result of the measurement return light RML in step S102 of FIG. 8 is different. Other features of the machining system SYSc may be the same as other features of at least one of the machining systems SYSa and SYSb.

Specifically, in each of the first and second embodiments described above, the control unit 2 irradiates the workpiece W with the measurement light ML without changing the attitude of the workpiece W relative to the processing head 13 (particularly, the attitude of the workpiece W relative to the irradiation optical system 135). On the other hand, in the third embodiment, the control unit 2 may irradiate the workpiece W with the measurement light ML while changing the attitude of the workpiece W relative to the processing head 13. That is, the control unit 2 may irradiate the workpiece W with the measurement light ML while changing the attitude of the workpiece W relative to the processing head 13 by moving at least one of the processing head 13 and the stage 15 along at least one of the θX direction, the θY direction, and the θZ direction. In other words, the control unit 2 may irradiate the workpiece W with the measurement light ML while changing the attitude of the workpiece W relative to the processing head 13 by rotating at least one of the processing head 13 and the stage 15 around at least one of the rotation axes along the X axis, the Y axis, and the Z axis.

Specifically, as shown in FIG. 13, the control unit 2 may control the head drive system 14 and the stage drive system 16 so that the attitude of the work W relative to the processing head 13 becomes a first attitude. Thereafter, the processing unit 1 may irradiate the measurement light ML to the work W in the first attitude. Specifically, the processing unit 1 may irradiate the measurement light ML to each of the multiple different parts of the work W in the first attitude. As a result, as shown in FIG. 14, the control unit 2 may calculate the Z position of the work W in the first attitude as the intermediate value of the Z position of the work W based on the detection result of the measurement return light RML. Specifically, the control unit 2 may calculate the Z position of each of the multiple different parts of the work W in the first attitude as the intermediate value of the Z position of the work W based on the detection result of the measurement return light RML. Thereafter, as shown in FIG. 13, the control unit 2 may control the head drive system 14 and the stage drive system 16 so that the attitude of the work W relative to the processing head 13 becomes a second attitude different from the first attitude. 13 shows an example in which the stage drive system 16 moves the stage 15 so as to change the attitude of the workpiece W relative to the processing head 13, but the head drive system 14 may move the processing head 13 so as to change the attitude of the workpiece W relative to the processing head 13. After that, the processing unit 1 may irradiate the measurement light ML to the workpiece W in the second attitude. Specifically, the processing unit 1 may irradiate the measurement light ML to each of a plurality of different parts of the workpiece W in the second attitude. As a result, as shown in FIG. 14, the control unit 2 may calculate the Z position of the workpiece W in the second attitude as the intermediate value of the Z position of the workpiece W based on the detection result of the measurement return light RML. Specifically, the control unit 2 may calculate the Z position of each of a plurality of different parts of the workpiece W in the second attitude as the intermediate value of the Z position of the workpiece W based on the detection result of the measurement return light RML.

Then, the machining system SYSc may repeat the same operation until the Z position of the workpiece W is calculated the required number of times. In other words, if the required number of times is N (where N is an integer equal to or greater than 2), the machining system SYSc may repeat the same operation until each of the Z positions of the workpiece W in the first posture to the Nth posture is calculated as the intermediate value of the Z position of the workpiece W. Note that Figures 13 and 14 show an example in which the machining system SYSc repeats the operation of changing the posture of the workpiece W relative to the machining head 13, the operation of irradiating the measurement light ML onto the workpiece W, and the operation of calculating the Z position of the workpiece W until the Z position of the workpiece W in the first posture, the Z position of the workpiece W in the second posture, and the Z position of the workpiece W in the third posture are calculated.

Then, the control unit 2 may calculate the final value of the Z position of the workpiece W based on the intermediate value of the Z position of the workpiece W in the first posture to the intermediate value of the Z position of the workpiece W in the Nth posture. As an example, as shown in FIG. 14, the control unit 2 may calculate the average value of the intermediate value of the Z position of the workpiece W in the first posture to the intermediate value of the Z position of the workpiece W in the Nth posture as the final value of the Z position of the workpiece W. In other words, the control unit 2 may perform an averaging process to calculate the average value of the intermediate value of the Z position of the workpiece W in the first posture to the intermediate value of the Z position of the workpiece W in the Nth posture as the final value of the Z position of the workpiece W. Specifically, the control unit 2 may calculate the final Z position value of each of the multiple different parts of the workpiece W by repeating an averaging process for multiple different parts of the workpiece W to calculate the average value of the intermediate value of the Z position of one part of the workpiece W in the first posture, the intermediate value of the Z position of the same part of the workpiece W in the second posture, ..., the intermediate value of the Z position of the same part of the workpiece W in the Nth posture as the final Z position value of the one part of the workpiece W.

14, the control unit 2 may perform tilt correction processing according to the attitude of the workpiece W relative to the machining head 13 on the intermediate value of the Z position of the workpiece W, and then perform averaging processing. In other words, the control unit 2 may perform tilt correction processing according to the amount of rotation of the workpiece W relative to the machining head 13 on the intermediate value of the Z position of the workpiece W, and then perform averaging processing. For example, the control unit 2 may perform tilt correction processing according to the second attitude of the workpiece W, in which the intermediate value of the Z position of the workpiece W in the second attitude is rotated in a direction opposite to the direction of rotation of the workpiece W in the second attitude based on the workpiece W in the first attitude by the same amount of rotation as the amount of rotation of the workpiece W in the second attitude based on the workpiece W in the first attitude. For example, the control unit 2 may perform a process of rotating the intermediate value of the Z position of the workpiece W in the third posture in a direction opposite to the direction of rotation of the workpiece W in the third posture based on the workpiece W in the first posture by the same amount of rotation as the amount of rotation of the workpiece W in the third posture based on the workpiece W in the first posture, as a tilt correction process according to the third posture of the workpiece W.

By such averaging process, the variation of the measurement error included in the position information generated based on the detection result of the measurement return light RML of the measurement light ML can be averaged. Specifically, when the posture of the work W with respect to the processing head 13 changes, the relationship between the extension direction of the recess CC (see FIG. 7A) present on the surface of the work W and the traveling direction of the measurement light ML may change. Therefore, when the posture of the work W with respect to the processing head 13 changes, the amount of penetration of the measurement light ML into the work W may change. Therefore, since the measurement error included in the position information depends on the amount of penetration of the measurement light ML into the work W, when the posture of the work W with respect to the processing head 13 changes, the measurement error included in the position information may change. In the third embodiment, the control unit 2 performs the above-mentioned averaging process to generate position information including the measurement error obtained by averaging the measurement error that may change depending on the posture of the work W. In other words, the control unit 2 performs the above-mentioned averaging process to generate position information including a measurement error that is substantially uniform regardless of the posture of the work W.

When the Z position of the workpiece W is calculated by the averaging process in step S102 of FIG. 8 in this manner, the control unit 2 may calculate a position correction amount using the Z position of the target part calculated by the averaging process in step S108 of FIG. 8. Furthermore, the control unit 2 may add a position correction amount to the Z position of the workpiece W calculated by the averaging process in step S109 of FIG. 8. As a result, the machining system SYSc can appropriately calculate the Z position of the workpiece W even if the posture of the workpiece W changes.

Alternatively, when the Z position of the workpiece W is calculated by the averaging process in step S102 of FIG. 8, the control unit 2 does not need to correct the Z position of the workpiece W calculated by the averaging process based on the detection result of the processing return light REL. In other words, the control unit 2 may control the processing unit 1 to process the workpiece W using position information indicating the Z position of the workpiece W calculated by the averaging process. In this case, the processing system SYSc does not need to perform the operations from steps S103 to S109 of FIG. 8.

(4) Machining system SYS of the fourth embodiment
Next, a machining system SYS in the fourth embodiment will be described. In the following description, the machining system SYS in the fourth embodiment will be referred to as a "machining system SYSd."

The machining system SYSd in the fourth embodiment differs from at least one of the machining systems SYSa in the first embodiment to SYSc in the third embodiment described above in that the method for calculating the position correction amount in step S108 in FIG. 8 is different. Other features of the machining system SYSd may be the same as other features of at least one of the machining systems SYSa to SYSc.

Specifically, in each of the first to third embodiments described above, the control unit 2 calculates the position correction amount based on the Z position of the workpiece W calculated based on the detection results of the measurement return light RML and the Z position of the workpiece W calculated based on the detection results of the processing return light REL. On the other hand, in the fourth embodiment, the control unit 2 may calculate the position correction amount using the measurement error calculation model 4.

The measurement error calculation model 4 is a calculation model capable of outputting the measurement error contained in the position information generated based on the detection results of the measurement return light RML. Considering that a position correction amount is added to the position information to correct the measurement error contained in the position information (as a result, the measurement error is offset by the position correction amount), the measurement error output by the measurement error calculation model 4 can be used as a position correction amount. In this case, the measurement error calculation model may be referred to as a position correction amount calculation model.

An example of a measurement error calculation model 4 capable of outputting such measurement errors is shown in Figures 15(a) and 15(b).

15(a), the measurement error calculation model 4 may be capable of outputting the measurement error that occurs when calculating the Z position of the workpiece W based on the detection result of the measurement return light RML for each type of workpiece W. As an example, when information indicating the type of workpiece W is input, the measurement error calculation model 4 may be capable of outputting the measurement error that occurs when calculating the Z position of the workpiece W of the type indicated by the information based on the detection result of the measurement return light RML. For example, when the type of workpiece W is a first type, the measurement error calculation model 4 may be capable of outputting the measurement error that occurs when calculating the Z position of the first type of workpiece W based on the detection result of the measurement return light RML. For example, when the type of workpiece W is a second type different from the first type, the measurement error calculation model 4 may be capable of outputting the measurement error that occurs when calculating the Z position of the second type of workpiece W based on the detection result of the measurement return light RML.

The types of workpieces W may include types that can be distinguished by the material of the workpieces W. In this case, the measurement error calculation model 4 may be capable of outputting the measurement error that occurs when the Z position of the workpieces W is calculated based on the detection results of the measurement return light RML for each material of the workpieces W. For example, the measurement error calculation model 4 may be capable of outputting the measurement error that occurs when the Z position of the workpieces W made of the first material is calculated based on the detection results of the measurement return light RML when information indicating that the material of the workpieces W is a first material is input. For example, the measurement error calculation model 4 may be capable of outputting the measurement error that occurs when the Z position of the workpieces W made of the second material is calculated based on the detection results of the measurement return light RML when information indicating that the type of the workpieces W is a second material different from the first material is input. As an example, the measurement error calculation model 4 may be capable of outputting the measurement error that occurs when the Z position of the workpieces W made of aluminum is calculated based on the detection results of the measurement return light RML when information indicating that the material of the workpieces W is aluminum is input. For example, when information indicating that the type of workpiece W is anodized aluminum is input, the measurement error calculation model 4 may be capable of outputting the measurement error that occurs when the Z position of the anodized aluminum workpiece W is calculated based on the detection results of the measurement return light RML.

The control unit 2 may calculate the measurement error based on information about the type of workpiece W for which position information is to be generated and the measurement error calculation model 4. The calculated measurement error corresponds to the difference between the actual Z position of the workpiece W (i.e., ideal position information) and the calculated value of the Z position of the workpiece W based on the measurement return light RML (i.e., actually generated position information). Therefore, the control unit 2 may use the calculated measurement error as a position correction amount.

Alternatively, as shown in FIG. 15(b), the control unit 2 may use multiple measurement error calculation models 4 corresponding to multiple types of workpieces W, respectively. Each measurement error calculation model 4 may be capable of outputting a measurement error that occurs when calculating the Z position of one type of workpiece W corresponding to each measurement error calculation model 4 based on the detection result of the measurement return light RML. In this case, the control unit 2 may select one measurement error calculation model 4 corresponding to the type of workpiece W for which position information is to be generated from the multiple measurement error calculation models 4, and calculate the measurement error based on the selected one measurement error calculation model 4. In this case, the control unit 2 may also use the calculated measurement error as a position correction amount.

The measurement error calculation model 4 used by the machining system SYSd may be generated by the model generation method shown in FIG. 16. Hereinafter, the model generation method for generating the measurement error calculation model 4 will be described with reference to FIG. 16. FIG. 16 is a flowchart showing the flow of the model generation method for generating the measurement error calculation model 4.

The model generation method may be performed by the machining system SYSd. The model generation method may be performed by a device different from the machining system SYSd. For ease of explanation, the following describes an example in which the machining system SYSd performs the model generation method.

As shown in FIG. 16, a sample workpiece SW is placed on the stage 15 of the machining system SYSd (step S200). The sample workpiece SW is an object used to generate the measurement error calculation model 4. As one example, an object of the same type as the type of workpiece W to be machined by the machining system SYSd through its machining operation may be used as the sample workpiece SW. As another example, an object having the same material as the material of the workpiece W to be machined by the machining system SYSd through its machining operation may be used as the sample workpiece SW. However, the workpiece W to be machined by the machining system SYSd through its machining operation itself may also be used as the sample workpiece SW.

Then, under the control of the control unit 2, the machining unit 1 irradiates the sample workpiece SW with the measurement light ML (step S201). Note that the operation of step S201 may be the same as the operation of step S101 in FIG. 8 described above, except that the sample workpiece SW is used instead of the workpiece W. For this reason, a detailed description of the operation of step S201 will be omitted.

However, in step S201, the processing unit 1 may irradiate the measurement light ML to a sample area SA, which is a part of the surface of the sample work SW. The processing unit 1 may irradiate the measurement light ML to each of multiple different parts in the sample area SA, which is a part of the surface of the sample work SW. The sample area SA may be an area having a predetermined size on the surface of the sample work SW. As an example, the sample area SA may be a rectangular area having a size of 0.2 mm x 0.2 mm. As another example, the sample area SA may be an area of any shape that is the same as or smaller than the scanning area in which at least one of the galvanometer mirrors 1328 and 1341 can scan the measurement light ML.

Then, the control unit 2 calculates the Z position of the sample work SW based on the detection result of the measurement return light RML generated from the sample work SW when the measurement light ML is irradiated onto the sample work SW (step S202). The operation of step S202 may be the same as the operation of step S102 in FIG. 8 described above, except that the sample work SW is used instead of the work W. For this reason, a detailed description of the operation of step S202 will be omitted. However, in step S202, the processing unit 1 may calculate the Z position of the sample area SA, which is a part of the surface of the sample work SW. The processing unit 1 may calculate the Z position of each of multiple different parts within the sample area SA, which is a part of the surface of the sample work SW.

In parallel with or before or after the operations from step S200 to step S202, the control unit 2 acquires a reference value for the Z position of the sample work SW (step S203). In particular, the control unit 2 acquires a reference value for the Z position of the sample area SA of the sample work SW.

The reference value for the Z position of the sample work SW is the Z position of the sample work SW obtained (e.g., measured or calculated) using a method different from the method for calculating the Z position of the sample work SW based on the detection results of the measurement return light RML. For example, the Z position of the sample work SW measured using an optical microscope may be used as the reference value for the Z position of the sample work SW. For example, the Z position of the sample work SW measured using an electron microscope may be used as the reference value for the Z position of the sample work SW. For example, the Z position of the sample work SW measured using a probe that contacts the sample work SW may be used as the reference value for the Z position of the sample work SW.

Then, the control unit 2 generates information regarding the relationship between the Z position of the sample work SW calculated in step S202 and the reference value of the Z position of the sample work SW acquired in step S203 (step S204). In the fourth embodiment, an example will be described in which the control unit 2 generates the difference (i.e., measurement error) between the Z position of the sample work SW calculated in step S202 and the reference value of the Z position of the sample work SW acquired in step S203 as information regarding the relationship between the Z position of the sample work SW calculated in step S202 and the reference value of the Z position of the sample work SW acquired in step S203.

The control unit 2 may associate the measurement error calculated in step S204 with information about the type of sample work SW and store it in the storage device 22. In other words, the control unit 2 may store in the storage device 22 sample measurement information in which the measurement error calculated in step S204 is associated with information about the type of sample work SW.

Then, the control unit 2 determines whether or not to perform the operations from step S200 to step S204 using a different type of sample work SW (step S205). If the result of the determination in step S204 is that the operations from step S200 to step S204 are to be performed using a different type of sample work SW (step S205: Yes), the operations from step S201 to step S204 are performed after a new sample work SW of the different type is placed on the stage 15 (step S200). As a result, multiple pieces of sample measurement information are acquired in which the measurement error calculated in step S204 is associated with information on the type of sample work SW.

On the other hand, if it is determined in step S204 that the operations from step S200 to step S204 are not performed using another type of sample work SW (step S205: No), the control unit 2 uses the sample measurement information stored in the storage device 22 to generate a measurement error calculation model 4 (step S206). For example, a model capable of outputting the measurement error occurring in the sample work SW for each type of sample work SW may be generated as a measurement error calculation model 4 capable of outputting the measurement error occurring when calculating the Z position of the work W based on the detection result of the measurement return light RML for each type of work W. For example, a plurality of models capable of outputting a plurality of measurement errors corresponding to each type of sample work SW may be generated as a plurality of measurement error calculation models 4 corresponding to each type of work W. In this case, the control unit 2 may generate the measurement error calculation model 4 using a so-called machine learning technique.

The machining system SYSd in the fourth embodiment can calculate the position correction amount using the measurement error calculation model 4. Therefore, the machining system SYSd does not need to perform the operation of calculating the Z position of the workpiece W based on the detection result of the processing return light REL. Specifically, the machining system SYSd does not need to perform the operations from step S103 to step S107 in FIG. 8. Therefore, the machining system SYSd can calculate the position correction amount relatively easily while shortening the time required to calculate the position correction amount.

(5) Machining system SYS of the fifth embodiment
Next, a machining system SYS in the fifth embodiment will be described. In the following description, the machining system SYS in the fifth embodiment will be referred to as a "machining system SYSe."

The machining system SYSe in the fifth embodiment differs from at least one of the machining systems SYSa in the first embodiment to SYSd in the fourth embodiment in that it includes a machining unit 1e instead of the machining unit 1. Other features of the machining system SYSe may be the same as other features of at least one of the machining systems SYSa to SYSd. The machining unit 1e differs from the machining unit 1 in that it includes a machining head 13e instead of the machining head 13. Other features of the machining unit 1e may be the same as other features of the machining unit 1. For this reason, the configuration of the machining head 13e in the fifth embodiment will be described below with reference to FIG. 17. FIG. 17 is a cross-sectional view showing the configuration of the machining head 13e in the fifth embodiment.

As shown in FIG. 17, the processing head 13e differs from the processing head 13 in that it has a processing optical system 131e instead of the processing optical system 131. Other features of the processing head 13e may be the same as other features of the processing head 13.

The processing optical system 131e differs from the processing optical system 131 in that it has a toric lens 1316e instead of the condenser lens 1316. Other features of the processing optical system 131e may be the same as other features of the processing optical system 131.

In this fifth embodiment, the processing system SYSe may measure the position of the workpiece W by measuring the focal position CP of the processing light EL using the astigmatism method instead of the confocal method. As a result, the processing system SYSe of the fifth embodiment can enjoy the same effects as those that can be enjoyed by at least one of the processing systems SYSa of the first embodiment to SYSd of the fourth embodiment described above.

In addition, the processing optical system 131e may be equipped with an optical system including a cylindrical lens and a normal lens instead of the toric lens 1316e. Even in this case, the processing system SYSe can measure the position of the workpiece W by measuring the focusing position CP of the processing light EL using the astigmatism method instead of the confocal method.

(6) Machining system SYS of the sixth embodiment
Next, a machining system SYS in the sixth embodiment will be described. In the following description, the machining system SYS in the sixth embodiment will be referred to as a "machining system SYSf."

In the above description, at least one of the processing systems SYSa in the first embodiment to the processing systems SYSe in the fifth embodiment generates position information indicating the Z position of the workpiece W based on both the detection results of the measurement return light RML and the detection results of the processing return light REL. In other words, at least one of the processing systems SYSa to SYSe generates third position information indicating the Z position of the workpiece W with higher accuracy than the first position information based on both the first position information (first distance measurement result) generated based on the detection results of the measurement return light RML and the second position information (second distance measurement result) generated based on the detection results of the processing return light REL.

On the other hand, the processing system SYSf in the sixth embodiment may generate third position information indicating the Z position of the workpiece W with higher accuracy than the first position information based on both the first position information generated based on the detection result of the measurement return light RML and any second position information generated using any method other than the method for generating the first position information. In other words, the processing system SYSa may generate third position information indicating the Z position of the workpiece W with higher accuracy than the first position information based on both the first position information generated using the measurement optical system 132 and any second position information generated using a measurement device that measures the position of the workpiece W using a method other than the method using the measurement optical system 132. The second position information generated based on the detection result of the processing return light REL described above is an example of any second position information generated using any method other than the method for generating the first position information based on the detection result of the measurement return light RML.

In this case, as shown in FIG. 18, which is a cross-sectional view showing a schematic configuration of the processing system SYSf, the processing system SYSf may include a processing head 13 (particularly, a measurement optical system 132) capable of functioning as a first measurement device used to generate first position information, as well as a second measurement device 5f used to generate second position information using a method different from that of the first measurement device.

An example of the second measuring device 5f is a measuring device including an oblique incidence autofocus sensor described in U.S. Pat. No. 5,502,311. Another example of the second measuring device 5f is a measuring device including a fluid gauge sensor described in at least one of U.S. Pat. No. 4,953,388 and Japanese Patent Application Laid-Open No. 4-043210.

Even with the machining system SYSf of the sixth embodiment, it is possible to obtain the same effects as those obtainable by at least one of the machining systems SYSa of the first embodiment to SYSe of the fifth embodiment described above.

(7) Modification In the above description, the processing system SYS generates position information indicating the position of the workpiece W based on both the detection result of the measurement return light RML generated from the measurement object M by irradiating the measurement light ML on the measurement object M and the detection result of the processing return light REL generated from the workpiece W by irradiating the workpiece W with the processing light EL. However, the processing system SYS may process the workpiece W based on the detection result of the measurement return light RML and the detection result of the processing return light REL without generating position information. For example, the control unit 2 may control the processing unit 1 to process the workpiece W based on the detection result of the measurement return light RML and the detection result of the processing return light REL without generating position information. As an example, the control unit 2 may generate processing path information indicating the movement path of the irradiation area PA on which the processing light EL is irradiated to process the workpiece W based on the detection result of the measurement return light RML and the detection result of the processing return light REL without generating position information, and control the processing unit 1 to process the workpiece W based on the generated processing path information.

In the above description, the machining unit 1 is provided with a head drive system 14. However, the machining unit 1 does not have to be provided with a head drive system 14. In other words, the machining head 13 does not have to be movable. Also, in the above description, the machining unit 1 is provided with a stage drive system 16. However, the machining unit 1 does not have to be provided with a stage drive system 16. In other words, the stage 15 does not have to be movable.

In the above description, the processing system SYS includes one processing unit 1. However, the processing system SYS may include multiple processing units 1. In this case, the processing system SYS may include multiple control units 2 that respectively control the multiple processing units 1. As an example, the processing system SYS may include a first processing unit 1, a second processing unit 1, a first control unit 2 that controls the first processing unit 1, and a second control unit 2 that controls the second processing unit 1. Alternatively, the processing system SYS may include a control unit 2 that controls at least two of the multiple processing units 1. As an example, the processing system SYS may include a first processing unit 1, a second processing unit 1, and one control unit 2 that controls the first processing unit 1 and the second processing unit 1.

In the above description, the processing system SYS processes the workpiece W by irradiating the workpiece W with processing light EL. In other words, the processing system SYS processes the workpiece W by irradiating the workpiece W with an energy beam in the form of light. However, the processing system SYS may irradiate the workpiece W with any energy beam other than light to process the workpiece W. An example of the arbitrary energy beam is at least one of a charged particle beam and an electromagnetic wave. An example of the charged particle beam is at least one of an electron beam and an ion beam. Also, in the above description, the processing system SYS processes the workpiece W by irradiating the workpiece W with measurement light ML. However, the processing system SYS may irradiate the workpiece W with any energy beam other than light to measure the workpiece W.

(8) Supplementary Notes The following supplementary notes are further disclosed with respect to the embodiment described above.
[Appendix 1]
measuring a position of the sample object based on a detection result of a sample return beam generated from the sample object by irradiating the sample object with a measurement beam for measuring the sample object;
generating sample related information regarding a relationship between a position of the sample object calculated based on the detection result of the sample return beam and a reference value of the position of the sample object obtained using a technique other than measuring the position of the sample object;
measuring a position of a target object by detecting a return beam generated from the target object by irradiating the measurement beam onto the target object;
generating a computational model based on the generated sample relationship information, information about the type of the sample workpiece, and information about the type of the target object;
A model generation method comprising: generating a computational model capable of outputting target relationship information regarding a relationship between the position of the target object calculated based on a detection result of the target return beam and a reference value of the position of the target object.
[Appendix 2]
Measuring the position of the sample object comprises:
measuring a position of a first sample object based on a detection result of a first sample return beam generated from a first sample object by irradiating the measurement beam onto the first sample object;
measuring a position of the first sample object based on a detection result of a second sample return beam generated from a second sample object by irradiating the measurement beam onto the second sample object, the second sample object being a sample object of a different type from the first sample object;
generating the sample related information
generating, as the sample relationship information, first sample relationship information relating to a relationship between a position of the first sample object calculated based on a detection result of the first sample return beam and a reference value of the position of the first sample object obtained using a method other than measuring the position of the first sample object;
generating, as the sample relationship information, second sample relationship information relating to a relationship between a position of the second sample object calculated based on a detection result of the second sample return beam and a reference value of the position of the second sample object obtained using a technique different from measuring the position of the second sample object;
2. The model generation method of claim 1, wherein generating the computational model includes generating the computational model based on the generated first and second sample relationship information and information regarding types of the first and second sample works.
[Appendix 3]
the sample-related information includes information regarding a difference between a position of the sample object calculated based on a detection result of the sample return beam and a reference value of a position of the sample object;
The model generation method according to

claim

1 or 2, wherein the target relation information includes information regarding a difference between a position of the target object calculated based on a detection result of the target return beam and a reference value of the position of the target object.
[Appendix 4]
The model generating method according to any one of claims 1 to 3, wherein the types of the sample workpieces include types that can be distinguished by the material of the sample workpieces.
[Appendix 5]
A processing system that processes the target object using the computational model generated by the model generation method according to any one of appendixes 1 to 4.
[Appendix 6]
The processing system includes:
a processing device that processes the target object by irradiating the target object with a processing beam;
A control device for controlling the processing device,
The processing device includes:
an irradiation optical system capable of irradiating the processing beam and the measurement beam onto the target object;
a detector for detecting the object return beam emitted from the object irradiated with the measurement beam,
The control device includes:
obtaining the target relationship information based on the computational model and information regarding the type of the target object;
Calculating a position of the target object based on the detection of the target return beam;
The processing system according to claim 5, further comprising: correcting the calculated position of the target object based on the acquired target relation information.
[Appendix 7]
The processing system of claim 6, wherein the control device controls the processing device to process the object based on the corrected position of the target object.
[Appendix 8]
the target relation information includes information regarding a difference between a position of the target object calculated based on a detection result of the target return beam and a correct value of the position of the target object;
The processing system described in

Appendix

6 or 7, wherein the control device corrects the position of the target object calculated based on the detection result of the target return beam by adding the difference to the position of the target object calculated based on the detection result of the target return beam.
[Appendix 9]
a processing device that processes a target object by irradiating the target object with a processing beam;
A control device for controlling the processing device,
The processing device includes:
an irradiation optical system capable of irradiating the target object with the processing beam and a measurement beam for measuring the target object;
a detector for detecting a return beam generated from the object irradiated with the measurement beam,
The control device includes:
Calculating a position of a first portion of the target object and a position of a second portion of the target object having a predetermined positional relationship with the first portion based on a detection result of the return beam;
performing an averaging process to calculate an average value of the position of the first portion and the position of the second portion as the position of the first portion;
and controlling the processing device so as to process the target object based on the position of the first portion calculated by the averaging process.
[Appendix 10]
The processing system of claim 9, wherein the second portion is located within a predetermined distance from the first portion.
[Appendix 11]
The control device includes:
Calculating a position of a first portion of the target object and positions of a plurality of second portions of the target object having a predetermined positional relationship with the first portion based on a detection result of the return beam;
The machining system according to claim 9 or 10, wherein the averaging process is performed to calculate an average value of the position of the first portion and the positions of the plurality of second portions as the position of the first portion.
[Appendix 12]
When the detector is a first detector and the return beam is a first return beam, the processing apparatus further includes a second detector that detects a second return beam emitted from the target object irradiated with the processing beam,
The control device includes:
performing a first correction process to correct the position of the first portion calculated by the averaging process based on a detection result of the second return beam;
The processing system according to any one of appendixes 9 to 11, further comprising: controlling the processing device to process the target object based on a result of the position of the first portion corrected by the first correction process.
[Appendix 13]
The control device includes:
performing a second correction process to correct the position of the first portion calculated by the averaging process, using the computation model generated by the model generation method according to any one of Supplementary Notes 1 to 8;
The processing system according to any one of appendixes 9 to 12, further comprising: controlling the processing device to process the target object based on a result of the position of the first portion corrected by the second correction process.
[Appendix 14]
the second correction process includes a process of acquiring the target relation information based on the computational model and information related to the type of the target object;
and correcting the position of the first portion calculated by the averaging process based on the acquired object relation information.
[Appendix 15]
the processing apparatus irradiates the measurement beam onto the target object having a first posture relative to the irradiation optical system, and irradiates the measurement beam onto the target object having a second posture relative to the irradiation optical system different from the first posture;
the control device calculates, based on a detection result of the return beam, a first position that is a position of the target object in the first attitude and a second position that is a position of the target object in the second attitude;
The processing system according to any one of appendixes 9 to 15, wherein the averaging process is a process of calculating an average value of the first position and the second position as the position of the target object.
[Appendix 16]
A processing method for processing a target object using a processing device that irradiates the target object with a processing beam, comprising:
irradiating the target object with the processing beam and a measurement beam for measuring the target object;
detecting a first return beam generated from the target object by irradiating the target object with the measurement beam;
detecting a second return beam generated from the target object by irradiating the target object with the processing beam;
the control device generates position information regarding a position of the target object based on a detection result of the first return beam and a detection result of the second return beam;
and controlling the processing device to process the target object based on the position information.
[Appendix 17]
A processing method for processing a target object using a processing device that irradiates the target object with a processing beam, comprising:
irradiating the target object with the processing beam and a measurement beam for measuring the target object;
detecting a return beam originating from the object illuminated by the measurement beam;
Calculating a position of a first portion of the target object and a position of a second portion of the target object having a predetermined positional relationship with the first portion based on a detection result of the return beam; and performing an averaging process to calculate an average value of the positions of the first portion and the second portion as the position of the first portion.
and controlling the processing device to process the target object based on the position of the first portion calculated by the averaging process.
[Appendix 18]
A processing method for processing a target object using a processing device that irradiates the target object with a processing beam, comprising:
Irradiating the processing beam onto the target object using an irradiation optical system included in a processing apparatus;
irradiating the measurement beam onto the target object, the target object having a first posture relative to the irradiation optical system, using the irradiation optical system;
irradiating the measurement beam onto the target object, the target object having a second orientation relative to the irradiation optical system that is different from the first orientation, using the irradiation optical system;
detecting a return beam emitted from the target object irradiated with the measurement beam; and calculating a first position that is a position of the target object in the first orientation and a second position that is a position of the target object in the second orientation based on a detection result of the return beam.
performing an averaging process of calculating an average value of the first position and the second position as the position of the target object;
and controlling the processing device so as to process the target object based on the position of the target object calculated by the averaging process.
[Appendix 19]
A processing method for processing a target object using a processing device that irradiates the target object with a processing beam, comprising:
irradiating the target object with the processing beam and a measurement beam for measuring the target object;
detecting a first return beam generated from the target object by irradiating the target object with the measurement beam;
A processing method comprising: detecting a second return beam generated from the target object when the processing beam is irradiated onto the target object; and generating position information regarding the position of the target object based on the detection result of the first return beam and the detection result of the second return beam.
[Appendix 20]
A processing method for processing a target object using a processing device that irradiates the target object with a processing beam, comprising:
obtaining a first distance measurement result of the target object based on a return beam generated from the target object by irradiating the target object with a measurement beam for measuring the target object;
A processing method comprising: obtaining a second distance measurement result of the target object using a method different from a method for obtaining the first distance measurement result; and generating position information regarding a position of the target object based on the first distance measurement result and the second distance measurement result.
[Appendix 21]
A processing method for processing a target object using a processing device that irradiates the target object with a processing beam, comprising:
irradiating the target object with the processing beam and a measurement beam for measuring the target object;
detecting a first return beam generated from the target object by irradiating the target object with the measurement beam;
A processing method comprising: detecting a second return beam generated from the target object when the processing beam is irradiated onto the target object; and controlling the irradiation position of the processing beam in processing the target object based on the detection result of the first return beam and the detection result of the second return beam.
[Appendix 22]
A processing method for processing a target object using a processing device that irradiates the target object with a processing beam, comprising:
obtaining a first distance measurement result of the target object based on a return beam generated from the target object by irradiating the target object with a measurement beam for measuring the target object;
obtaining a second distance measurement of the target object using a technique different from the technique for obtaining the first distance measurement;
and controlling an irradiation position of the processing beam in processing the target object based on the first distance measurement result and the second distance measurement result.
[Appendix 23]
A processing method for processing the target object using the computational model generated by the model generation method according to any one of Supplementary Notes 1 to 4.

At least some of the constituent elements of each of the above-mentioned embodiments may be appropriately combined with at least some of the other constituent elements of each of the above-mentioned embodiments. Some of the constituent elements of each of the above-mentioned embodiments may not be used. In addition, to the extent permitted by law, the disclosures of all publications and U.S. patents cited in each of the above-mentioned embodiments are incorporated by reference into the present text.

The present invention is not limited to the above-described embodiment, but may be modified as appropriate within the scope of the claims and the overall specification without violating the spirit or concept of the invention, and processing systems involving such modifications are also included within the technical scope of the present invention.

SYS Machining system 1 Machining unit 13 Machining head 131 Machining optical system 1313 Galvanometer mirror 132 Measurement optical system 1328 Galvanometer mirror 133 Synthesis optical system 134 Deflection optical system 1341 Galvanometer mirror 135 Irradiation optical system 1351 fθ lens 2 Control unit W Workpiece M Measurement object EL Machining light REL Return light ML Measurement light RML Return light CP Focus position

Claims

a processing device that processes a target object by irradiating the target object with a processing beam;
A control device for controlling the processing device,
The processing device includes:
an irradiation optical system capable of irradiating the target object with the processing beam and a measurement beam for measuring the target object;
a first detector that detects a first return beam generated from the target object when the measurement beam is irradiated onto the target object;
a second detector that detects a second return beam generated from the target object when the target object is irradiated with the processing beam;
The control device generates position information regarding the position of the target object based on the detection result of the first return beam and the detection result of the second return beam, and controls the processing device to process the target object based on the position information.
the first detector detects, via a final optical element, the first return beam generated from the target object by the measurement beam irradiated onto the target object via the final optical element disposed closest to the target object in the optical path of the irradiation optical system;
The processing system of claim 1 , wherein the second detector detects, via the final optical element, the second return beam generated from the target object by the processing beam irradiated onto the target object via the final optical element.
The processing system according to claim 1 or 2, wherein the control device generates the position information by correcting information obtained based on the detection result of the first return beam using the detection result of the second return beam.
The processing system according to any one of claims 1 to 3, wherein the control device calculates the position of the target object based on the detection result of the first return beam, and generates the position information by correcting the position of the target object calculated based on the detection result of the first return beam using the detection result of the second return beam.
The processing system according to any one of claims 1 to 4, wherein the processing system irradiates a portion of the target object where one of the measurement beam and the processing beam is irradiated with the other of the measurement beam and the processing beam in order to obtain one of the detection result of the first return beam and the detection result of the second return beam, and obtains the other of the detection result of the first return beam and the detection result of the second return beam.
The processing system described in any one of claims 1 to 4, wherein an incidence angle of the measurement beam with respect to a portion of the target object where the measurement beam is irradiated to obtain the detection result of the first return beam is the same as an incidence angle of the processing beam with respect to a portion of the target object where the processing beam is irradiated to obtain the detection result of the second return beam.
the processing device irradiates a first portion of the target object with each of the processing beam and the measurement beam, and irradiates a second portion of the target object with the measurement beam;
The processing system of any one of claims 1 to 6, wherein the control device calculates a first position as the position of the first portion of the target object based on a detection result of the first return beam generated from the first portion, calculates a second position as the position of the first portion of the target object based on a detection result of the second return beam generated from the first portion, calculates a third position as the position of the second portion of the target object based on a detection result of the first return beam generated from the second portion, and corrects the third position based on a relationship between the first position and the second position, thereby generating the position information including information regarding the corrected third position.
The processing system of claim 7 , wherein the relationship between the first position and the second position includes a difference between the first position and the second position.
The machining system according to claim 8 , wherein the control device corrects the third position by adding the difference to the third position.
the processing device irradiates the first portion of the target object with the processing beam while changing a positional relationship between the first portion of the target object and a focusing position of the processing beam in a direction along an optical axis of the irradiation optical system;
The processing system according to any one of claims 7 to 9, wherein the control device calculates, based on a detection result of the second return beam generated from the first portion, the focal position of the processing beam at a point in time when the focal position of the processing beam is located on the surface of the first portion as the second position.
11. The processing system according to claim 1 , wherein the processing device includes a moving device that moves at least one of an object mounting device on which the target object is placed and the irradiation optical system to change a position on the target object at which the measurement beam and the processing beam are irradiated.
The processing system according to claim 1 , wherein the position information includes information regarding a position of the target object in a direction along an optical axis of the irradiation optical system.
The processing system of claim 1 , wherein a wavelength of the processing beam is different from a wavelength of the metrology beam.
the processing apparatus includes a measurement optical system that emits the measurement beam toward the irradiation optical system,
The processing system according to claim 1 , wherein the first detector receives an interference beam between the first return beam and a portion of the measurement beam.
The processing system according to claim 14, wherein the processing device comprises a beam splitting member disposed in the optical paths of the processing beam and the second return beam, and splitting the second return beam into an optical path different from the optical path of the processing beam to be incident on the second detector.
The processing system according to claim 15 , wherein the target object and a light detection surface of the second detector or a surface adjacent to the light detection surface are optically conjugate.
The processing system according to claim 1 , wherein a characteristic of the processing beam when processing the target object is different from a characteristic of the processing beam irradiated to the target object when detecting the second return beam.
a processing device that processes a target object by irradiating the target object with a processing beam;
A control device for controlling the processing device,
The processing device includes:
an irradiation optical system capable of irradiating the target object with the processing beam and a measurement beam for measuring the target object;
a detector for detecting a return beam generated from the object irradiated with the measurement beam,
The control device includes:
Calculating a position of a first portion of the target object and a position of a second portion of the target object having a predetermined positional relationship with the first portion based on a detection result of the return beam;
performing an averaging process to calculate an average value of the position of the first portion and the position of the second portion as the position of the first portion;
and controlling the processing device so as to process the target object based on the position of the first portion calculated by the averaging process.
The processing system of claim 18 , wherein the second portion is located within a predetermined distance from the first portion.
The processing system according to claim 18 or 19, wherein the second portion is a plurality of portions.
The control device includes:
Calculating a position of a first portion of the target object and positions of a plurality of second portions of the target object having a predetermined positional relationship with the first portion based on a detection result of the return beam;
The machining system according to claim 18 , wherein the averaging process is performed to calculate an average value of the position of the first portion and the positions of the plurality of second portions as the position of the first portion.
When the detector is a first detector and the return beam is a first return beam, the processing apparatus further includes a second detector that detects a second return beam emitted from the target object irradiated with the processing beam,
The control device includes:
performing a first correction process to correct the position of the first portion calculated by the averaging process based on a detection result of the second return beam;
The processing system according to claim 18 , further comprising: controlling the processing device to process the target object based on a result of the position of the first portion corrected by the first correction process.
the processing apparatus irradiates the measurement beam onto the target object having a first posture relative to the irradiation optical system, and irradiates the measurement beam onto the target object having a second posture relative to the irradiation optical system different from the first posture;
the control device calculates, based on a detection result of the return beam, a first position that is a position of the target object in the first attitude and a second position that is a position of the target object in the second attitude;
The machining system according to claim 18 , wherein the averaging process includes a process of calculating an average value of the first position and the second position as the position of the target object.
a processing device that processes a target object by irradiating the target object with a processing beam;
A control device for controlling the processing device,
The processing device includes:
an irradiation optical system capable of irradiating the target object with the processing beam and a measurement beam for measuring the target object;
a detector for detecting a return beam emitted from the object irradiated with the measurement beam,
the processing apparatus irradiates the measurement beam onto the target object having a first posture relative to the irradiation optical system, and irradiates the measurement beam onto the target object having a second posture relative to the irradiation optical system different from the first posture;
The control device includes:
Calculating a first position, which is a position of the target object in the first attitude, and a second position, which is a position of the target object in the second attitude, based on a detection result of the return beam;
performing an averaging process to calculate an average value of the first position and the second position as the position of the target object;
and controlling the processing device so as to process the target object based on the position of the target object calculated by the averaging process.
a processing device that processes a target object by irradiating the target object with a processing beam;
A control device for controlling the processing device,
The processing device includes:
an irradiation optical system capable of irradiating the target object with the processing beam and a measurement beam for measuring the target object;
a first detector that detects a first return beam generated from the target object when the measurement beam is irradiated onto the target object;
a second detector that detects a second return beam generated from the target object when the target object is irradiated with the processing beam;
The control device generates position information regarding a position of the target object based on the detection results of the first return beam and the detection results of the second return beam.
a processing device that processes a target object by irradiating the target object with a processing beam;
A control device for controlling the processing device,
The processing device includes:
a first measurement device that obtains a first distance measurement result of the target object based on a return beam generated from the target object by irradiating the target object with a measurement beam for measuring the target object;
a second measurement device that obtains a second distance measurement result of the target object using a method different from that of the first measurement device,
The control device generates position information regarding a position of the target object based on the first distance measurement result and the second distance measurement result.
a processing device that processes a target object by irradiating the target object with a processing beam;
A control device for controlling the processing device,
The processing device includes:
an irradiation optical system capable of irradiating the target object with the processing beam and a measurement beam for measuring the target object;
a first detector that detects a first return beam generated from the target object when the measurement beam is irradiated onto the target object;
a second detector that detects a second return beam generated from the target object when the target object is irradiated with the processing beam;
The control device controls an irradiation position of the processing beam in processing the target object based on a detection result of the first return beam and a detection result of the second return beam.
a processing device that processes a target object by irradiating the target object with a processing beam;
A control device for controlling the processing device,
The processing device includes:
a first measurement device that obtains a first distance measurement result of the target object based on a return beam generated from the target object by irradiating the target object with a measurement beam for measuring the target object;
a second measurement device that obtains a second distance measurement result of the target object using a method different from that of the first measurement device,
The control device controls an irradiation position of the processing beam in processing the target object based on the first distance measurement result and the second distance measurement result.