WO2024188071A1 - Thermal simulation method and system for filter module, and related device - Google Patents
Thermal simulation method and system for filter module, and related device Download PDFInfo
- Publication number
- WO2024188071A1 WO2024188071A1 PCT/CN2024/079555 CN2024079555W WO2024188071A1 WO 2024188071 A1 WO2024188071 A1 WO 2024188071A1 CN 2024079555 W CN2024079555 W CN 2024079555W WO 2024188071 A1 WO2024188071 A1 WO 2024188071A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thermal simulation
- acoustic wave
- surface acoustic
- dual
- filter module
- Prior art date
Links
- 238000004088 simulation Methods 0.000 title claims abstract description 134
- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000010897 surface acoustic wave method Methods 0.000 claims abstract description 105
- 238000010438 heat treatment Methods 0.000 claims abstract description 83
- 238000012546 transfer Methods 0.000 claims abstract description 19
- 238000004590 computer program Methods 0.000 claims description 14
- 238000004364 calculation method Methods 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 230000020169 heat generation Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 101000968091 Pithecopus azureus Dermaseptin-H2 Proteins 0.000 description 14
- 101000927330 Pithecopus azureus Dermaseptin-H6 Proteins 0.000 description 14
- 238000013461 design Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 2
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 2
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
- G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/08—Thermal analysis or thermal optimisation
Definitions
- the present invention relates to the field of filtering technology, and in particular to a thermal simulation method, system and related equipment for a filter module.
- Surface acoustic wave filters have the characteristics of high operating frequency, small size and suitability for large-scale production. They have been widely used in the field of wireless communications.
- the specific structure is that a surface acoustic wave impedance element filter is made on a piezoelectric substrate to form the main body of the surface acoustic wave impedance element filter.
- surface acoustic wave filters are constantly developing towards high frequency, low loss and high power handling capacity. Since the operating frequency of the surface acoustic wave filter is inversely proportional to the finger line width of the interdigital transducer, the higher the operating frequency, the thinner the finger line width of the interdigital transducer will be. This reduces the power handling capacity of the surface acoustic wave filter when working at high frequency, and it is very likely to be damaged during application.
- the power loss of the surface acoustic wave filter during operation is almost all dissipated in the form of heat, that is, the power loss is close to the heat generation power. Based on this rule, establishing a thermal analysis model close to the real device to predict the thermal characteristics of the surface acoustic wave filter is an important means to optimize the power tolerance design of the surface acoustic wave filter.
- the power tolerance simulation of the surface acoustic wave filter is actually to obtain the temperature distribution on the filter after the electrical energy lost during operation is converted into heat energy. By optimizing the design so that the maximum temperature does not reach the threshold of electrode damage under the specified input power, the surface acoustic wave filter can be avoided from being damaged during application.
- the filter can be composed of a DMS (dual-mode surface acoustic wave filter) and a resonator cascade.
- DMS dual-mode surface acoustic wave filter
- the heating power of the resonator can be obtained through the current and voltage of the equivalent circuit.
- DMS dual-mode surface acoustic wave filter
- the filter includes DMS
- DMS since DMS has no universal equivalent circuit, its heating power is inconvenient to obtain. Therefore, the related technology cannot perform temperature simulation at the equivalent circuit level of the filter containing DMS structure, that is, when the filter includes DMS, the related technology cannot perform heat transfer simulation on the filter.
- the object of the present invention is to provide a thermal simulation method for a filter module to solve the problem that when the filter includes DMS, the related art cannot perform heat transfer simulation on the filter.
- the present invention provides a thermal simulation method for a filter module, which comprises the following steps:
- P_diss is the heat generation power of the dual-mode surface acoustic wave filter
- P_in is the input power allocated to the dual-mode surface acoustic wave filter in the branch
- S21 and S11 are scattering parameters of the dual-mode surface acoustic wave filter at the same frequency as the input signal.
- the specific step of setting the boundary conditions of the filter module for heat transfer simulation according to the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter is as follows:
- the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter are respectively added to the boundary conditions of the thermal simulation model in the form of heat sources, and the heat sources corresponding to the heating power of the resonator and the heat sources corresponding to the heating power of the dual-mode surface acoustic wave filter are respectively made to correspond one-to-one to the heating areas of the thermal simulation model.
- the thermal simulation model is established using finite element simulation software COMSOL.
- the materials used in the thermal simulation model include metal aluminum and substrate lithium tantalate.
- the filter module comprises a plurality of resonators and a plurality of dual-mode surface acoustic wave filters.
- the present invention provides a thermal simulation system for a filter module, comprising:
- a first building unit module the first building unit module is used to build an equivalent circuit of a filter module including a resonator and a dual-mode surface acoustic wave filter;
- a drawing module the drawing module is used to draw the electrical layout of the filter module according to the equivalent circuit
- An acquisition module the acquisition module is used to determine the frequency and power of the input signal according to the equivalent circuit; and to acquire the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter according to the frequency and power of the input signal;
- a second establishing module is used to establish a thermal simulation model of the filter module according to the electrical layout
- a setting module the setting module is used to set the boundary conditions of the filter module for thermal simulation according to the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter;
- the simulation module performs heat transfer simulation according to the thermal simulation model and the boundary conditions to obtain thermal simulation data of the filter module.
- the present invention provides an electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein When the processor executes the computer program, the steps in the thermal simulation method of the filter module as described above are implemented.
- the present invention provides a computer-readable storage medium storing a computer program, wherein the computer program, when executed by a processor, implements the steps in the thermal simulation method of the filter module as described above.
- the thermal simulation method of the filter module in the present invention sequentially establishes an equivalent circuit of the filter module including a resonator and a dual-mode surface acoustic wave filter, draws the electrical layout of the filter module, obtains the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter, establishes a thermal simulation model of the filter module, sets boundary conditions for thermal simulation of the filter module, and performs heat transfer simulation according to the thermal simulation model and the boundary conditions to obtain thermal simulation data of the filter module.
- the heating power of the dual-mode surface acoustic wave filter can be obtained by using the set calculation formula, which solves the problem that the related art cannot perform heat transfer simulation on the filter module when the filter module includes a dual-mode surface acoustic wave filter.
- FIG1 is a flow chart of the steps of a thermal simulation method for a filter module provided by an embodiment of the present invention
- FIG2 is a topological structure diagram of an equivalent circuit in a thermal simulation method for a filter module provided by an embodiment of the present invention
- FIG3 is a filter layout in a thermal simulation method for a filter module provided by an embodiment of the present invention.
- FIG4 is a diagram of a thermal simulation model in a thermal simulation method for a filter module provided by an embodiment of the present invention.
- FIG5 is a temperature distribution diagram in a thermal simulation model finally obtained by a thermal simulation method of a filter module provided by an embodiment of the present invention.
- FIG6 is a schematic diagram of a thermal simulation system for a filter module provided by an embodiment of the present invention.
- FIG. 7 is a schematic diagram of a framework of an electronic device provided by an embodiment of the present invention.
- An embodiment of the present invention provides a thermal simulation method for a filter module, as shown in FIG1 , which includes the following steps:
- the resonator and the dual-mode surface acoustic wave filter included in the equivalent circuit may be one or more, respectively. This embodiment is described by taking the case where the resonator and the dual-mode surface acoustic wave filter are multiple, respectively.
- the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter can be obtained.
- the heating power of each resonator and the heating power of each dual-mode surface acoustic wave filter are obtained.
- P_diss is the heat generation power of the dual-mode surface acoustic wave filter
- P_in is the input power allocated to the dual-mode surface acoustic wave filter in the branch
- S21 and S11 are respectively the scattering parameters (S parameters) of the dual-mode surface acoustic wave filter at the same frequency as the input signal.
- the calculation formula for the heating power of the dual-mode surface acoustic wave filter can also be understood as the calculation formula for the loss power of the dual-mode surface acoustic wave filter;
- the input power allocated to the dual-mode surface acoustic wave filter in the branch is the power of the input signal allocated to the dual-mode surface acoustic wave filter in the branch;
- the heat dissipation parameter is an important parameter in microwave transmission
- S11 is the input reflection parameter
- S12 is the reverse transmission coefficient
- S21 is the forward transmission coefficient
- S21 is the output reflection parameter
- the calculation formula for the heating power of the dual-mode surface acoustic wave filter in this embodiment only needs to use S21 and S11, that is, the heating power of the dual-mode surface acoustic wave filter in this embodiment only needs to be calculated through the equivalent circuit and heat dissipation parameters to be obtained.
- the thermal simulation model is a three-dimensional model; of course, according to actual needs, the thermal simulation model can be appropriately simplified after it is established to save computing resources for subsequent numerical thermal simulation.
- the thermal simulation model in this embodiment is established using the finite element simulation software COMSOL.
- the thermal simulation model can also be established through a variety of software that supports piezoelectric simulation or thermal simulation.
- it can also be established through a combination of multiple software, such as HFSS (three-dimensional structural electromagnetic field simulation software), Icepak (electronic product thermal analysis software) and other software.
- the specific steps of setting the boundary conditions for thermal simulation of the filter module according to the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter are as follows:
- the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter are respectively added to the boundary conditions of the thermal simulation model in the form of heat sources, and the heat sources corresponding to the heating power of the resonator and the heat sources corresponding to the heating power of the dual-mode surface acoustic wave filter are respectively made to correspond one-to-one to the heating areas of the thermal simulation model.
- the heating power of each resonator and the heating power of each dual-mode surface acoustic wave filter are added to the boundary conditions of the thermal simulation model in the form of heat sources, and the heat source corresponding to the heating power of each resonator and the heat source corresponding to the heating power of each dual-mode surface acoustic wave filter are made to correspond one-to-one with the heating area of the thermal simulation model.
- the thermal simulation method of the filter module in the present invention sequentially establishes an equivalent circuit of the filter module including a resonator and a dual-mode surface acoustic wave filter, draws the electrical layout of the filter module, obtains the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter, establishes a thermal simulation model of the filter module, sets boundary conditions for thermal simulation of the filter module, and performs heat transfer simulation according to the thermal simulation model and the boundary conditions to obtain thermal simulation data of the filter module.
- the heating power of the dual-mode surface acoustic wave filter can be obtained by using the set calculation formula, which solves the problem that the related art cannot perform heat transfer simulation on the filter module when the filter module includes a dual-mode surface acoustic wave filter.
- the filter module includes a first resonator P1, a second resonator P2, a first dual-mode surface acoustic wave filter DMS1 and a second dual-mode surface acoustic wave filter DMS2.
- the first dual-mode surface acoustic wave filter DMS1 and the second dual-mode surface acoustic wave filter DMS2 The surface wave filter DMS2 is arranged in series, the first resonator P1 is connected in parallel to the input end of the first dual-mode surface acoustic wave filter DMS1, and the second resonator P2 is connected in parallel to the output end of the second dual-mode surface acoustic wave filter DMS2.
- This embodiment provides a thermal simulation method for a filter module, which includes the following steps:
- the first step is to establish an equivalent circuit of a filter module including the first resonator P1, the second resonator P2, the first dual-mode surface acoustic wave filter DMS1 and the second dual-mode surface acoustic wave filter DMS2.
- the topological structure of the equivalent circuit is shown in Figure 2; the electrical performance of the first dual-mode surface acoustic wave filter DMS1 and the second dual-mode surface acoustic wave filter DMS2 is characterized by a common S2P format file, which usually comes from the design department, and the first resonator P1 and the second resonator P2 are characterized by a common BVD electrical equivalent model; port 1 is the signal input terminal, port 2 is the signal output terminal, and port 3 and port 4 are ground terminals.
- the filter module of this topological structure can be electrically simulated by ADS (Advanced Design System, RF simulation software). Of course, according to actual needs, the filter module of this topological structure can also be electrically simulated by other software, such as AWR (RF/microwave design software).
- Step 2 Draw the electronic layout of the filter module according to the equivalent circuit.
- the filter layout is shown in FIG3 .
- Step 3 Based on the equivalent circuit, when the frequency and power of the input signal are determined, the heating power of the first resonator P1 and the second resonator P2 and the input power allocated to the first dual-mode surface acoustic wave filter DMS1 and the second dual-mode surface acoustic wave filter DMS2 in the branches are obtained. Since the heating power of the first dual-mode surface acoustic wave filter DMS1 and the second dual-mode surface acoustic wave filter DMS2 cannot be directly obtained, it is necessary to obtain it using the loss power calculation formula, that is, using formula (1) in Example 1.
- the frequency of the input signal is 769 MHz and the power is 0.3 W; the input powers of the first dual-mode surface acoustic wave filter DMS1 and the second dual-mode surface acoustic wave filter DMS2 are 0.5474 W and 0.4474 W respectively.
- the frequency of the input signal is 769Hz
- the power is 0.3W
- the heating power on the first dual-mode surface acoustic wave filter DMS1, the second dual-mode surface acoustic wave filter DMS2, the first resonator P1 and the second resonator P2 are 0.0805W, 0.0669W, 0.0007W, and 0.0005W respectively.
- Step 4 Use finite element simulation software COMSOL to establish a thermal simulation model (three-dimensional model) of the filter module, as shown in Figure 4.
- the materials used in the thermal simulation model include metal aluminum and substrate lithium tantalate, wherein the metal aluminum is area A in Figure 4, and the substrate lithium tantalate is area B in Figure 4.
- Step 5 Add the heating power of the first resonator P1 and the second resonator P2 and the heating power of the first dual-mode surface acoustic wave filter DMS1 and the second dual-mode surface acoustic wave filter DMS2 to the boundary conditions of the thermal simulation model in the form of heat sources, and make the heat sources corresponding to the heating power of the first resonator P1 and the second resonator P2 and the heating power of the first dual-mode surface acoustic wave filter DMS1 and the second dual-mode surface acoustic wave filter DMS2 correspond one-to-one to the heating areas of the thermal simulation model, that is, set the boundary conditions for the filter module to perform thermal fax.
- the heating area of the thermal simulation model is area C in Figure 4
- the heat source corresponding to the heating power of the first resonator P1 and the second resonator P2 and the heating power of the first dual-mode surface acoustic wave filter DMS1 and the second dual-mode surface acoustic wave filter DMS2 is area D in Figure 4.
- Step 6 Use the above-mentioned finite element simulation software to perform thermal fax according to the thermal simulation model and the boundary conditions, and finally obtain the thermal simulation data of the filter module, that is, the temperature distribution of the filter module, as shown in Figure 5.
- the frequency of the input signal is 769Hz
- the power is 0.3W
- the highest temperature on the filter appears on the first dual-mode surface acoustic wave filter DMS1, which is about 61.84°C.
- This embodiment provides a thermal simulation system 200 for a filter module, in combination with FIG. It includes:
- the first establishing unit module 201 is used to establish an equivalent circuit of a filter module including a resonator and a dual-mode surface acoustic wave filter.
- a drawing module 202 is used to draw the electrical layout of the filter module according to the equivalent circuit.
- the acquisition module 203 is used to determine the frequency and power of the input signal according to the equivalent circuit; and to acquire the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter according to the frequency and power of the input signal.
- the second establishing module 204 is used to establish a thermal simulation model of the filter module according to the electrical layout.
- a setting module 205 the setting module 205 is used to set the boundary conditions of the filter module for thermal simulation according to the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter;
- the simulation module 206 is used to perform heat transfer simulation according to the thermal simulation model and the boundary conditions to obtain thermal simulation data of the filter module.
- each module in the thermal simulation system 200 of the filter module in this embodiment is used to implement each step in the above-mentioned embodiment 1, it can also achieve the technical effect achieved by the thermal simulation method of the filter module in the above-mentioned embodiment 1, which will not be elaborated here.
- This embodiment provides an electronic device 300, as shown in Figure 7, which includes a memory 301, a processor 302, and a computer program stored in the memory 301 and executable on the processor 302.
- the processor 302 executes the computer program, the steps in the thermal simulation method of the filter module in the above-mentioned embodiment 1 are implemented.
- the processor 3032 of the electronic device 300 in this embodiment implements the steps in the thermal simulation method of the filter module in the above-mentioned embodiment 1 when executing the computer program, it can also achieve the technical effect achieved by the thermal simulation method of the filter module in the above-mentioned embodiment 1, which will not be elaborated here.
- This embodiment provides a computer-readable storage medium storing a computer program.
- the computer program is executed by a processor, the steps in the thermal simulation method of the filter module in the first embodiment are implemented.
- the computer program stored in the computer-readable storage medium in this embodiment implements the steps in the thermal simulation method of the filter module in the above-mentioned embodiment 1 when executed by the processor, it can also achieve the technical effect achieved by the thermal simulation method of the filter module in the above-mentioned embodiment 1, which will not be elaborated here.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Disclosed in the present invention are a thermal simulation method and system for a filter module, and a related device. The thermal simulation method for the filter module comprises the following steps: establishing an equivalent circuit comprising a resonator and a dual-mode surface acoustic wave filter; drawing an electrical layout; determining the frequency and power of an input signal according to the equivalent circuit, and acquiring the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter according to the frequency and power of the input signal; establishing a thermal simulation model according to the electrical layout; setting a boundary condition for thermal simulation of the filter module according to the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter; and performing heat transfer simulation according to the thermal simulation model and the boundary condition to obtain thermal simulation data of the filter module. The thermal simulation method for the filter module in the present invention solves the problem in the related art of being unable to perform heat transfer simulation on a filter module comprising a dual-mode surface acoustic wave filter.
Description
本发明涉及滤波技术领域，尤其涉及一种滤波器模组的热仿真方法、系统及相关设备。The present invention relates to the field of filtering technology, and in particular to a thermal simulation method, system and related equipment for a filter module.
声表面波滤波器具有工作频率高、体积小及适宜大规模生产等特点，现已被广泛应用于无线通信领域，具体结构是将声表面波阻抗元滤波器制作在压电基材上，以构成声表面波阻抗元滤波器的主体。Surface acoustic wave filters have the characteristics of high operating frequency, small size and suitability for large-scale production. They have been widely used in the field of wireless communications. The specific structure is that a surface acoustic wave impedance element filter is made on a piezoelectric substrate to form the main body of the surface acoustic wave impedance element filter.
随着通信技术的发展，声表面波滤波器不断向着高频化、低损耗及高功率承受力等方向发展，由于声表面波滤波器的工作频率与叉指换能器的指条线宽呈反比，其工作频率越高，叉指换能器指条线宽便会越细，这使得声表面波滤波器在高频工作时功率承受能力降低，极有可能在应用过程中发生损坏。With the development of communication technology, surface acoustic wave filters are constantly developing towards high frequency, low loss and high power handling capacity. Since the operating frequency of the surface acoustic wave filter is inversely proportional to the finger line width of the interdigital transducer, the higher the operating frequency, the thinner the finger line width of the interdigital transducer will be. This reduces the power handling capacity of the surface acoustic wave filter when working at high frequency, and it is very likely to be damaged during application.
声表面波滤波器工作中的损耗功率几乎都在以热量的形式耗散，也就是说损耗功率近似于发热功率，基于这一规则，建立接近真实器件的热分析模型来预测声表面波滤波器的热学特性是优化声表面波滤波器的功率耐受性设计的重要手段。The power loss of the surface acoustic wave filter during operation is almost all dissipated in the form of heat, that is, the power loss is close to the heat generation power. Based on this rule, establishing a thermal analysis model close to the real device to predict the thermal characteristics of the surface acoustic wave filter is an important means to optimize the power tolerance design of the surface acoustic wave filter.
声表面波滤波器的功率耐受性仿真实际就是获取其在工作时损耗掉的电学能量转化为热能后在滤波器上的温度分布，通过设计优化使其在规定输入功率下最高温度不达到电极损毁的阈值，便可避免声表面波滤波器在应用过程中发生损坏的现象。The power tolerance simulation of the surface acoustic wave filter is actually to obtain the temperature distribution on the filter after the electrical energy lost during operation is converted into heat energy. By optimizing the design so that the maximum temperature does not reach the threshold of electrode damage under the specified input power, the surface acoustic wave filter can be avoided from being damaged during application.
声表面波滤波器的设计涉及到电场与固体力学的耦合，其结构以及物理求解模型的复杂程度不利于直接进行数值分析，因此常用二维简化模型及等效电路模型或者其他唯象模型等进行设计。一般地，滤波器可以由DMS(双模声表面波滤波器)和谐振器级联构成，当滤波
器不包含DMS时，可以通过等效电路的电流电压获得谐振器的发热功率，然而，当滤波器包含DMS时，由于DMS没有普适的等效电路，其发热功率的获取不便，因此相关技术没有能进行含DMS结构滤波器的等效电路级的温度仿真，即滤波器包含DMS时，相关技术无法对滤波器进行传热仿真。The design of surface acoustic wave filters involves the coupling of electric field and solid mechanics. The complexity of their structure and physical solution model is not conducive to direct numerical analysis. Therefore, two-dimensional simplified models, equivalent circuit models or other phenomenological models are often used for design. Generally, the filter can be composed of a DMS (dual-mode surface acoustic wave filter) and a resonator cascade. When the filter does not include DMS, the heating power of the resonator can be obtained through the current and voltage of the equivalent circuit. However, when the filter includes DMS, since DMS has no universal equivalent circuit, its heating power is inconvenient to obtain. Therefore, the related technology cannot perform temperature simulation at the equivalent circuit level of the filter containing DMS structure, that is, when the filter includes DMS, the related technology cannot perform heat transfer simulation on the filter.
【发明内容】[Summary of the invention]
本发明的目的在于提供一种滤波器模组的热仿真方法，以解决滤波器包含DMS时，相关技术无法对滤波器进行传热仿真的问题。The object of the present invention is to provide a thermal simulation method for a filter module to solve the problem that when the filter includes DMS, the related art cannot perform heat transfer simulation on the filter.
为了解决上述技术问题，第一方面，本发明提供了一种滤波器模组的热仿真方法，其包括以下步骤：In order to solve the above technical problems, in a first aspect, the present invention provides a thermal simulation method for a filter module, which comprises the following steps:
建立包含谐振器和双模声表面波滤波器的滤波器模组的等效电路；Establish an equivalent circuit of a filter module including a resonator and a dual-mode surface acoustic wave filter;
根据所述等效电路绘制所述滤波器模组的电学版图；Draw the electrical layout of the filter module according to the equivalent circuit;
根据所述等效电路确定输入信号的频率和功率；并根据所述输入信号的频率和功率获取所述谐振器的发热功率和所述双模声表面波滤波器的发热功率；Determine the frequency and power of the input signal according to the equivalent circuit; and obtain the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter according to the frequency and power of the input signal;
根据所述电学版图建立所述滤波器模组的热仿真模型；Establishing a thermal simulation model of the filter module according to the electrical layout;
根据所述谐振器的发热功率和所述双模声表面波滤波器的发热功率设置所述滤波器模组进行热仿真的边界条件；Setting boundary conditions for thermal simulation of the filter module according to the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter;
根据所述热仿真模型和所述边界条件进行传热仿真，得到所述滤波器模组的热仿真数据；Perform heat transfer simulation according to the thermal simulation model and the boundary conditions to obtain thermal simulation data of the filter module;
其中，所述双模声表面波滤波器的发热功率的计算公式如下：
P_diss＝P_in*(1-|S21|^2-|S11|^2)；The calculation formula of the heating power of the dual-mode surface acoustic wave filter is as follows:
P_diss=P_in*(1-|S21|^2-|S11|^2);
P_diss＝P_in*(1-|S21|^2-|S11|^2)；The calculation formula of the heating power of the dual-mode surface acoustic wave filter is as follows:
P_diss=P_in*(1-|S21|^2-|S11|^2);
P_diss为所述双模声表面波滤波器的发热功率，P_in为所述双模声表面波滤波器在支路中分配到的输入功率，S21和S11分别为所述双模声表面波滤波器在与所述输入信号相同频率下的散射参数。P_diss is the heat generation power of the dual-mode surface acoustic wave filter, P_in is the input power allocated to the dual-mode surface acoustic wave filter in the branch, and S21 and S11 are scattering parameters of the dual-mode surface acoustic wave filter at the same frequency as the input signal.
优选的，根据所述谐振器的发热功率和所述双模声表面波滤波器的发热功率设置所述滤波器模组进行传热仿真的边界条件的具体步骤
如下：Preferably, the specific step of setting the boundary conditions of the filter module for heat transfer simulation according to the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter is as follows:
将所述谐振器的发热功率和所述双模声表面波滤波器的发热功率分别以热源的形式添加至所述热仿真模型的边界条件中，并使所述谐振器的发热功率所对应的热源以及所述双模声表面波滤波器的发热功率所对应的热源分别与所述热仿真模型的发热区域一一对应。The heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter are respectively added to the boundary conditions of the thermal simulation model in the form of heat sources, and the heat sources corresponding to the heating power of the resonator and the heat sources corresponding to the heating power of the dual-mode surface acoustic wave filter are respectively made to correspond one-to-one to the heating areas of the thermal simulation model.
优选的，所述热仿真模型利用有限元仿真软件COMSOL建立。Preferably, the thermal simulation model is established using finite element simulation software COMSOL.
优选的，所述热仿真模型使用的材料包括金属铝和衬底钽酸锂。Preferably, the materials used in the thermal simulation model include metal aluminum and substrate lithium tantalate.
优选的，根据所述热仿真模型和所述边界条件进行传热仿真时，利用数值分析软件进行。Preferably, when heat transfer simulation is performed according to the thermal simulation model and the boundary conditions, numerical analysis software is used.
优选的，所述滤波器模组中包含的所述谐振器和所述双模声表面波滤波器分别为多个。Preferably, the filter module comprises a plurality of resonators and a plurality of dual-mode surface acoustic wave filters.
第二方面，本发明提供了一种滤波器模组的热仿真系统，其包括：In a second aspect, the present invention provides a thermal simulation system for a filter module, comprising:
第一建立单元模块，所述第一建立单元模块用于建立包含谐振器和双模声表面波滤波器的滤波器模组的等效电路；A first building unit module, the first building unit module is used to build an equivalent circuit of a filter module including a resonator and a dual-mode surface acoustic wave filter;
绘制模块，所述绘制模块用于根据所述等效电路绘制所述滤波器模组的电学版图；A drawing module, the drawing module is used to draw the electrical layout of the filter module according to the equivalent circuit;
获取模块，所述获取模块用于根据所述等效电路确定输入信号的频率和功率；并根据所述输入信号的频率和功率获取所述谐振器的发热功率和所述双模声表面波滤波器的发热功率；An acquisition module, the acquisition module is used to determine the frequency and power of the input signal according to the equivalent circuit; and to acquire the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter according to the frequency and power of the input signal;
第二建立模块，所述第二建立模块用于根据所述电学版图建立所述滤波器模组的热仿真模型；A second establishing module, the second establishing module is used to establish a thermal simulation model of the filter module according to the electrical layout;
设置模块，所述设置模块用于根据所述谐振器的发热功率和所述双模声表面波滤波器的发热功率设置所述滤波器模组进行热仿真的边界条件；A setting module, the setting module is used to set the boundary conditions of the filter module for thermal simulation according to the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter;
仿真模块，根据所述热仿真模型和所述边界条件进行传热仿真，得到所述滤波器模组的热仿真数据。The simulation module performs heat transfer simulation according to the thermal simulation model and the boundary conditions to obtain thermal simulation data of the filter module.
第三方面，本发明提供了一种电子设备，其包括存储器、处理器以及存储在所述存储器上并可在所述处理器上运行的计算机程序，所
述处理器执行所述计算机程序时实现如上所述的滤波器模组的热仿真方法中的步骤。In a third aspect, the present invention provides an electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein When the processor executes the computer program, the steps in the thermal simulation method of the filter module as described above are implemented.
第四方面，本发明提供了一种计算机可读存储介质，其存储有计算机程序，所述计算机程序被处理器执行时实现如上所述的滤波器模组的热仿真方法中的步骤。In a fourth aspect, the present invention provides a computer-readable storage medium storing a computer program, wherein the computer program, when executed by a processor, implements the steps in the thermal simulation method of the filter module as described above.
与相关技术相比，本发明中的滤波器模组的热仿真方法依次通过建立包含谐振器和双模声表面波滤波器的滤波器模组的等效电路，绘制滤波器模组的电学版图，获取谐振器的发热功率和双模声表面波滤波器的发热功率，建立滤波器模组的热仿真模型，设置所述滤波器模组进行热仿真的边界条件，根据所述热仿真模型和所述边界条件进行传热仿真，以得到所述滤波器模组的热仿真数据，而双模声表面波滤波器的发热功率通过设定的计算公式便可以获取，即解决了滤波器模组包含双模声表面波滤波器时，相关技术无法对滤波器模组进行传热仿真的问题。Compared with the related art, the thermal simulation method of the filter module in the present invention sequentially establishes an equivalent circuit of the filter module including a resonator and a dual-mode surface acoustic wave filter, draws the electrical layout of the filter module, obtains the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter, establishes a thermal simulation model of the filter module, sets boundary conditions for thermal simulation of the filter module, and performs heat transfer simulation according to the thermal simulation model and the boundary conditions to obtain thermal simulation data of the filter module. The heating power of the dual-mode surface acoustic wave filter can be obtained by using the set calculation formula, which solves the problem that the related art cannot perform heat transfer simulation on the filter module when the filter module includes a dual-mode surface acoustic wave filter.
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:
图1为本发明实施例提供的一种滤波器模组的热仿真方法的步骤流程图；FIG1 is a flow chart of the steps of a thermal simulation method for a filter module provided by an embodiment of the present invention;
图2为本发明实施例提供的一种滤波器模组的热仿真方法中等效电路的拓扑结构图；FIG2 is a topological structure diagram of an equivalent circuit in a thermal simulation method for a filter module provided by an embodiment of the present invention;
图3为本发明实施例提供的一种滤波器模组的热仿真方法中的滤波器版图；FIG3 is a filter layout in a thermal simulation method for a filter module provided by an embodiment of the present invention;
图4为本发明实施例提供的一种滤波器模组的热仿真方法中的热仿真模型图；
FIG4 is a diagram of a thermal simulation model in a thermal simulation method for a filter module provided by an embodiment of the present invention;
图5为本发明实施例提供的一种滤波器模组的热仿真方法最终获取的热仿真模型中的温度分布图；FIG5 is a temperature distribution diagram in a thermal simulation model finally obtained by a thermal simulation method of a filter module provided by an embodiment of the present invention;
图6为本发明实施例提供的一种滤波器模组的热仿真系统的框架示意图；FIG6 is a schematic diagram of a thermal simulation system for a filter module provided by an embodiment of the present invention;
图7为本发明实施例提供的一种电子设备的框架示意图。FIG. 7 is a schematic diagram of a framework of an electronic device provided by an embodiment of the present invention.
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
实施例一Embodiment 1
本发明实施例提供了一种滤波器模组的热仿真方法，结合图1所示，其包括以下步骤：An embodiment of the present invention provides a thermal simulation method for a filter module, as shown in FIG1 , which includes the following steps:
S101、建立包含谐振器和双模声表面波滤波器的滤波器模组的等效电路。S101, establishing an equivalent circuit of a filter module including a resonator and a dual-mode surface acoustic wave filter.
其中，所述等效电路中包含的所述谐振器和所述双模声表面波滤波器分别可以为一个或多个。本实施例以所述谐振器和所述双模声表面波滤波器分别为多个进行举例说明。The resonator and the dual-mode surface acoustic wave filter included in the equivalent circuit may be one or more, respectively. This embodiment is described by taking the case where the resonator and the dual-mode surface acoustic wave filter are multiple, respectively.
S102、根据所述等效电路绘制所述滤波器模组的电学版图。S102, drawing the electrical layout of the filter module according to the equivalent circuit.
S103、根据所述等效电路确定输入信号的频率和功率；并根据所述输入信号的频率和功率获取所述谐振器的发热功率和所述双模声表面波滤波器的发热功率。S103, determining the frequency and power of the input signal according to the equivalent circuit; and obtaining the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter according to the frequency and power of the input signal.
具体为，基于所述等效电路，在所述输入信号的频率和功率确定时，便可获取所述谐振器的发热功率和所述双模声表面波滤波器的发热功率。本实施例获取的是每个所述谐振器的发热功率和每个所述双模声表面波滤波器的发热功率Specifically, based on the equivalent circuit, when the frequency and power of the input signal are determined, the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter can be obtained. In this embodiment, the heating power of each resonator and the heating power of each dual-mode surface acoustic wave filter are obtained.
所述双模声表面波滤波器的发热功率的计算公式如下：
P_diss＝P_in*(1-|S21|^2-|S11|^2) (1)；The calculation formula of the heating power of the dual-mode surface acoustic wave filter is as follows:
P_diss=P_in*(1-|S21|^2-|S11|^2) (1);
P_diss＝P_in*(1-|S21|^2-|S11|^2) (1)；The calculation formula of the heating power of the dual-mode surface acoustic wave filter is as follows:
P_diss=P_in*(1-|S21|^2-|S11|^2) (1);
P_diss为所述双模声表面波滤波器的发热功率，P_in为所述双模声表面波滤波器在支路中分配到的输入功率，S21和S11分别为所述双模声表面波滤波器在与所述输入信号相同频率下的散射参数(S参数)。P_diss is the heat generation power of the dual-mode surface acoustic wave filter, P_in is the input power allocated to the dual-mode surface acoustic wave filter in the branch, and S21 and S11 are respectively the scattering parameters (S parameters) of the dual-mode surface acoustic wave filter at the same frequency as the input signal.
其中，所述双模声表面波滤波器的发热功率的计算公式也可以理解为所述双模声表面波滤波器的耗损功率计算公式；所述双模声表面波滤波器在支路中分配到的输入功率，即为所述双模声表面波滤波器在支路中分配到的所述输入信号的功率；所述散热参数是微波传输中的一个重要参数，S11为输入反射参数，S12为反向传输系数，S21为正向传输系数，S21为输出反射参数，而本实施例中所述双模声表面波滤波器的发热功率的计算公式只需要用到S21和S11，即本实施例中的所述双模声表面波滤波器的发热功率只需要通过所述等效电路和散热参数进行计算便可获取。Among them, the calculation formula for the heating power of the dual-mode surface acoustic wave filter can also be understood as the calculation formula for the loss power of the dual-mode surface acoustic wave filter; the input power allocated to the dual-mode surface acoustic wave filter in the branch is the power of the input signal allocated to the dual-mode surface acoustic wave filter in the branch; the heat dissipation parameter is an important parameter in microwave transmission, S11 is the input reflection parameter, S12 is the reverse transmission coefficient, S21 is the forward transmission coefficient, and S21 is the output reflection parameter, and the calculation formula for the heating power of the dual-mode surface acoustic wave filter in this embodiment only needs to use S21 and S11, that is, the heating power of the dual-mode surface acoustic wave filter in this embodiment only needs to be calculated through the equivalent circuit and heat dissipation parameters to be obtained.
S104、根据所述电学版图建立所述滤波器模组的热仿真模型。S104, establishing a thermal simulation model of the filter module according to the electrical layout.
具体地，所述热仿真模型为三维模型；当然，根据实际需求，所述热仿真模型建立完成后还可以进行适当的简化，以节省后续进行数值的热仿真的计算资源。Specifically, the thermal simulation model is a three-dimensional model; of course, according to actual needs, the thermal simulation model can be appropriately simplified after it is established to save computing resources for subsequent numerical thermal simulation.
本实施例中的所述热仿真模型是利用有限元仿真软件COMSOL建立，当然，根据实际需求，所述热仿真模型还可以通过多种支持压电仿真或热仿真的软件实现建立，同时，还可以通过多种软件组合建立，如HFSS(三维结构电磁场仿真软件)、Icepak(电子产品热分析软件)等软件。The thermal simulation model in this embodiment is established using the finite element simulation software COMSOL. Of course, according to actual needs, the thermal simulation model can also be established through a variety of software that supports piezoelectric simulation or thermal simulation. At the same time, it can also be established through a combination of multiple software, such as HFSS (three-dimensional structural electromagnetic field simulation software), Icepak (electronic product thermal analysis software) and other software.
S105、根据所述谐振器的发热功率和所述双模声表面波滤波器的发热功率设置所述滤波器模组进行热仿真的边界条件。S105 , setting boundary conditions for thermal simulation of the filter module according to the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter.
具体地，对根据所述谐振器的发热功率和所述双模声表面波滤波器的发热功率设置所述滤波器模组进行热仿真的边界条件的具体步骤如下：
Specifically, the specific steps of setting the boundary conditions for thermal simulation of the filter module according to the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter are as follows:
将所述谐振器的发热功率和所述双模声表面波滤波器的发热功率分别以热源的形式添加至所述热仿真模型的边界条件中，并使所述谐振器的发热功率所对应的热源以及所述双模声表面波滤波器的发热功率所对应的热源分别与所述热仿真模型的发热区域一一对应。The heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter are respectively added to the boundary conditions of the thermal simulation model in the form of heat sources, and the heat sources corresponding to the heating power of the resonator and the heat sources corresponding to the heating power of the dual-mode surface acoustic wave filter are respectively made to correspond one-to-one to the heating areas of the thermal simulation model.
本实施例是将每个所述谐振器的发热功率和每个所述双模声表面波滤波器的发热功率分别以热源的形式添加至所述热仿真模型的边界条件中，并使每个所述谐振器的发热功率所对应的热源以及每个所述双模声表面波滤波器的发热功率所对应的热源分别与所述热仿真模型的发热区域一一对应。In this embodiment, the heating power of each resonator and the heating power of each dual-mode surface acoustic wave filter are added to the boundary conditions of the thermal simulation model in the form of heat sources, and the heat source corresponding to the heating power of each resonator and the heat source corresponding to the heating power of each dual-mode surface acoustic wave filter are made to correspond one-to-one with the heating area of the thermal simulation model.
S106、根据所述热仿真模型和所述边界条件进行传热仿真，得到所述滤波器模组的热仿真数据。S106 , performing heat transfer simulation according to the thermal simulation model and the boundary conditions to obtain thermal simulation data of the filter module.
本实施例中，根据所述热仿真模型和所述边界条件进行传热仿真时，利用数值分析软件进行；得到所述滤波器模组的热仿真数据，即为所述滤波器模组的温度分布情况。In this embodiment, when heat transfer simulation is performed according to the thermal simulation model and the boundary conditions, numerical analysis software is used to obtain thermal simulation data of the filter module, that is, the temperature distribution of the filter module.
与相关技术相比，本发明中的滤波器模组的热仿真方法依次通过建立包含谐振器和双模声表面波滤波器的滤波器模组的等效电路，绘制滤波器模组的电学版图，获取谐振器的发热功率和双模声表面波滤波器的发热功率，建立滤波器模组的热仿真模型，设置所述滤波器模组进行热仿真的边界条件，根据所述热仿真模型和所述边界条件进行传热仿真，以得到所述滤波器模组的热仿真数据，而双模声表面波滤波器的发热功率通过设定的计算公式便可以获取，即解决了滤波器模组包含双模声表面波滤波器时，相关技术无法对滤波器模组进行传热仿真的问题。Compared with the related art, the thermal simulation method of the filter module in the present invention sequentially establishes an equivalent circuit of the filter module including a resonator and a dual-mode surface acoustic wave filter, draws the electrical layout of the filter module, obtains the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter, establishes a thermal simulation model of the filter module, sets boundary conditions for thermal simulation of the filter module, and performs heat transfer simulation according to the thermal simulation model and the boundary conditions to obtain thermal simulation data of the filter module. The heating power of the dual-mode surface acoustic wave filter can be obtained by using the set calculation formula, which solves the problem that the related art cannot perform heat transfer simulation on the filter module when the filter module includes a dual-mode surface acoustic wave filter.
实施例二Embodiment 2
为了更好的体现实施例一中滤波器模组的热仿真方法，以下通过滤波器模组包含第一谐振器P1、第二谐振器P2、第一双模声表面波滤波器DMS1和第二双模声表面波滤波器DMS2进行举例说明。In order to better reflect the thermal simulation method of the filter module in the first embodiment, the following is an example in which the filter module includes a first resonator P1, a second resonator P2, a first dual-mode surface acoustic wave filter DMS1 and a second dual-mode surface acoustic wave filter DMS2.
其中，所述第一双模声表面波滤波器DMS1和所述第二双模声表
面波滤波器DMS2串联设置，所述第一谐振器P1并联至所述第一双模声表面波滤波器DMS1的输入端，所述第二谐振器P2并联至所述第二双模声表面波滤波器DMS2的输出端。The first dual-mode surface acoustic wave filter DMS1 and the second dual-mode surface acoustic wave filter DMS2 The surface wave filter DMS2 is arranged in series, the first resonator P1 is connected in parallel to the input end of the first dual-mode surface acoustic wave filter DMS1, and the second resonator P2 is connected in parallel to the output end of the second dual-mode surface acoustic wave filter DMS2.
本实施例提供了一种滤波器模组的热仿真方法，其包括以下步骤：This embodiment provides a thermal simulation method for a filter module, which includes the following steps:
第一步：建立包含所述第一谐振器P1、所述第二谐振器P2、所述第一双模声表面波滤波器DMS1和所述第二双模声表面波滤波器DMS2的滤波器模组的等效电路。The first step is to establish an equivalent circuit of a filter module including the first resonator P1, the second resonator P2, the first dual-mode surface acoustic wave filter DMS1 and the second dual-mode surface acoustic wave filter DMS2.
其中，所述等效电路的拓扑结构如图2所示；所述第一双模声表面波滤波器DMS1和所述第二双模声表面波滤波器DMS2的电学性能由通用的S2P格式文件进行表征，该文件通常来自于设计部门，所述第一谐振器P1和所述第二谐振器P2由常见的BVD电学等效模型进行表征；端口1为信号输入端，端口2为信号输出端，端口3和端口4为接地端，该拓扑结构的滤波器模组可以通过ADS(Advanced Design System，射频仿真软件)实现电学仿真。当然，根据实际需求，该拓扑结构的滤波器模组还可以通过其它软件实现电学仿真，如AWR(射频/微波设计软件)。Among them, the topological structure of the equivalent circuit is shown in Figure 2; the electrical performance of the first dual-mode surface acoustic wave filter DMS1 and the second dual-mode surface acoustic wave filter DMS2 is characterized by a common S2P format file, which usually comes from the design department, and the first resonator P1 and the second resonator P2 are characterized by a common BVD electrical equivalent model; port 1 is the signal input terminal, port 2 is the signal output terminal, and port 3 and port 4 are ground terminals. The filter module of this topological structure can be electrically simulated by ADS (Advanced Design System, RF simulation software). Of course, according to actual needs, the filter module of this topological structure can also be electrically simulated by other software, such as AWR (RF/microwave design software).
第二步：根据所述等效电路绘制所述滤波器模组的电子版图。Step 2: Draw the electronic layout of the filter module according to the equivalent circuit.
其中，所述滤波器版图如图3所示。Wherein, the filter layout is shown in FIG3 .
第三步：基于所述等效电路，在输入信号的频率和功率确定时，获取所述第一谐振器P1和所述第二谐振器P2的发热功率以及所述第一双模声表面波滤波器DMS1和所述第二双模声表面波滤波器DMS2分别在支路中分配到的输入功率，由于所述第一双模声表面波滤波器DMS1和所述第二双模声表面波滤波器DMS2的发热功率无法直接获取，因此需要利用耗损功率计算公式获取，即利用实施例一中的公式(1)获取。Step 3: Based on the equivalent circuit, when the frequency and power of the input signal are determined, the heating power of the first resonator P1 and the second resonator P2 and the input power allocated to the first dual-mode surface acoustic wave filter DMS1 and the second dual-mode surface acoustic wave filter DMS2 in the branches are obtained. Since the heating power of the first dual-mode surface acoustic wave filter DMS1 and the second dual-mode surface acoustic wave filter DMS2 cannot be directly obtained, it is necessary to obtain it using the loss power calculation formula, that is, using formula (1) in Example 1.
本实施例中，所述输入信号的频率为769MHz，功率为0.3W；所述第一双模声表面波滤波器DMS1和所述第二双模声表面波滤波器DMS2的输入功率分别为0.5474W和0.4474W，所述第一双模声表面
波滤波器DMS1和所述第二双模声表面波滤波器DMS2的S2P文件相同，因此S_21＝-0.8843-0.1574i，S_11＝-0.1718-0.0280i。经计算得出，所述输入信号的频率为769Hz，功率为0.3W，所述第一双模声表面波滤波器DMS1、所述第二双模声表面波滤波器DMS2、所述第一谐振器P1及所述第二谐振器P2上的发热功率分别为0.0805W、0.0669W、0.0007W、0.0005W。In this embodiment, the frequency of the input signal is 769 MHz and the power is 0.3 W; the input powers of the first dual-mode surface acoustic wave filter DMS1 and the second dual-mode surface acoustic wave filter DMS2 are 0.5474 W and 0.4474 W respectively. The S2P files of the first dual-mode surface acoustic wave filter DMS1 and the second dual-mode surface acoustic wave filter DMS2 are the same, so S_21 = -0.8843-0.1574i, S_11 = -0.1718-0.0280i. It is calculated that the frequency of the input signal is 769Hz, the power is 0.3W, and the heating power on the first dual-mode surface acoustic wave filter DMS1, the second dual-mode surface acoustic wave filter DMS2, the first resonator P1 and the second resonator P2 are 0.0805W, 0.0669W, 0.0007W, and 0.0005W respectively.
第四步：利用有限元仿真软件COMSOL建立所述滤波器模组的热仿真模型(三维模型)，如图4所示，所述热仿真模型使用的材料包括金属铝以及衬底钽酸锂，其中，金属铝为图4中的A区域，衬底钽酸锂为图4中的B区域。Step 4: Use finite element simulation software COMSOL to establish a thermal simulation model (three-dimensional model) of the filter module, as shown in Figure 4. The materials used in the thermal simulation model include metal aluminum and substrate lithium tantalate, wherein the metal aluminum is area A in Figure 4, and the substrate lithium tantalate is area B in Figure 4.
第五步：将所述第一谐振器P1和所述第二谐振器P2的发热功率以及所述第一双模声表面波滤波器DMS1和所述第二双模声表面波滤波器DMS2的发热功率分别以热源的形式添加到所述热仿真模型的边界条件中，并使所述第一谐振器P1和所述第二谐振器P2的发热功率以及所述第一双模声表面波滤波器DMS1和所述第二双模声表面波滤波器DMS2的发热功率所对应的热源分别与所述热仿真模型的发热区域一一对应，即设置所述滤波器模组进行热传真的边条件。Step 5: Add the heating power of the first resonator P1 and the second resonator P2 and the heating power of the first dual-mode surface acoustic wave filter DMS1 and the second dual-mode surface acoustic wave filter DMS2 to the boundary conditions of the thermal simulation model in the form of heat sources, and make the heat sources corresponding to the heating power of the first resonator P1 and the second resonator P2 and the heating power of the first dual-mode surface acoustic wave filter DMS1 and the second dual-mode surface acoustic wave filter DMS2 correspond one-to-one to the heating areas of the thermal simulation model, that is, set the boundary conditions for the filter module to perform thermal fax.
其中，所述热仿真模型的发热区域为图4中的C区域，所述第一谐振器P1和所述第二谐振器P2的发热功率以及所述第一双模声表面波滤波器DMS1和所述第二双模声表面波滤波器DMS2的发热功率所对应的热源为图4中的D区域。Among them, the heating area of the thermal simulation model is area C in Figure 4, and the heat source corresponding to the heating power of the first resonator P1 and the second resonator P2 and the heating power of the first dual-mode surface acoustic wave filter DMS1 and the second dual-mode surface acoustic wave filter DMS2 is area D in Figure 4.
第六步：利用上述有限元仿真软件根据所述热仿真模型和所述边界条件进行热传真，最终获取所述滤波器模组的热仿真数据，即所述滤波器模组的温度分布情况，如图5所示，本实施例中，所述输入信号的频率为769Hz，功率为0.3W，所述滤波器上的最高温度出现在所述第一双模声表面波滤波器DMS1上，约为61.84℃。Step 6: Use the above-mentioned finite element simulation software to perform thermal fax according to the thermal simulation model and the boundary conditions, and finally obtain the thermal simulation data of the filter module, that is, the temperature distribution of the filter module, as shown in Figure 5. In this embodiment, the frequency of the input signal is 769Hz, the power is 0.3W, and the highest temperature on the filter appears on the first dual-mode surface acoustic wave filter DMS1, which is about 61.84°C.
实施例三Embodiment 3
本实施例提供了一种滤波器模组的热仿真系统200，结合图6所
示，其包括：This embodiment provides a thermal simulation system 200 for a filter module, in combination with FIG. It includes:
第一建立单元模块201，所述第一建立单元模块201用于建立包含谐振器和双模声表面波滤波器的滤波器模组的等效电路。The first establishing unit module 201 is used to establish an equivalent circuit of a filter module including a resonator and a dual-mode surface acoustic wave filter.
绘制模块202，所述绘制模块202用于根据所述等效电路绘制所述滤波器模组的电学版图。A drawing module 202 is used to draw the electrical layout of the filter module according to the equivalent circuit.
获取模块203，所述获取模块203用于根据所述等效电路确定输入信号的频率和功率；并根据所述输入信号的频率和功率获取所述谐振器的发热功率和所述双模声表面波滤波器的发热功率。The acquisition module 203 is used to determine the frequency and power of the input signal according to the equivalent circuit; and to acquire the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter according to the frequency and power of the input signal.
第二建立模块204，所述第二建立模块204用于根据所述电学版图建立所述滤波器模组的热仿真模型。The second establishing module 204 is used to establish a thermal simulation model of the filter module according to the electrical layout.
设置模块205，所述设置模块205用于根据所述谐振器的发热功率和所述双模声表面波滤波器的发热功率设置所述滤波器模组进行热仿真的边界条件；A setting module 205, the setting module 205 is used to set the boundary conditions of the filter module for thermal simulation according to the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter;
仿真模块206，所述仿真模块206用于根据所述热仿真模型和所述边界条件进行传热仿真，得到所述滤波器模组的热仿真数据。The simulation module 206 is used to perform heat transfer simulation according to the thermal simulation model and the boundary conditions to obtain thermal simulation data of the filter module.
由于本实施例中的滤波器模组的热仿真系统200中各个模块分别用于实现上述实施例一中的各个步骤，因此其也能达到上述实施例一中滤波器模组的热仿真方法所达到的技术效果，在此不作赘述。Since each module in the thermal simulation system 200 of the filter module in this embodiment is used to implement each step in the above-mentioned embodiment 1, it can also achieve the technical effect achieved by the thermal simulation method of the filter module in the above-mentioned embodiment 1, which will not be elaborated here.
实施例四Embodiment 4
本实施例提供了一种电子设备300，结合图7所示，其包括存储器301、处理器302以及存储在所述存储器301上并可在所述处理器302上运行的计算机程序，所述处理器302执行所述计算机程序时实现上述实施例一中的滤波器模组的热仿真方法中的步骤。This embodiment provides an electronic device 300, as shown in Figure 7, which includes a memory 301, a processor 302, and a computer program stored in the memory 301 and executable on the processor 302. When the processor 302 executes the computer program, the steps in the thermal simulation method of the filter module in the above-mentioned embodiment 1 are implemented.
由于本实施例中电子设备300的处理器3032执行计算机程序时实现上述实施例一中的滤波器模组的热仿真方法中的步骤，因此其也能达到上述实施例一中滤波器模组的热仿真方法所达到的技术效果，在此不作赘述。Since the processor 3032 of the electronic device 300 in this embodiment implements the steps in the thermal simulation method of the filter module in the above-mentioned embodiment 1 when executing the computer program, it can also achieve the technical effect achieved by the thermal simulation method of the filter module in the above-mentioned embodiment 1, which will not be elaborated here.
实施例五Embodiment 5
本实施例提供了一种计算机可读存储介质，其存储有计算机程序，所述计算机程序被处理器执行时实现上述实施例一中的滤波器模组的热仿真方法中的步骤。This embodiment provides a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, the steps in the thermal simulation method of the filter module in the first embodiment are implemented.
由于本实施例中的计算机可读存储介质存储的计算机程序被处理器执行时实现上述实施例一中的滤波器模组的热仿真方法中的步骤，因此其也能达到上述实施例一中滤波器模组的热仿真方法所达到的技术效果，在此不作赘述。Since the computer program stored in the computer-readable storage medium in this embodiment implements the steps in the thermal simulation method of the filter module in the above-mentioned embodiment 1 when executed by the processor, it can also achieve the technical effect achieved by the thermal simulation method of the filter module in the above-mentioned embodiment 1, which will not be elaborated here.
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本发明的专利保护范围内。
The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.
Claims (9)
- 一种滤波器模组的热仿真方法，其特征在于，所述滤波器模组的热仿真方法包括以下步骤：A thermal simulation method for a filter module, characterized in that the thermal simulation method for the filter module comprises the following steps:建立包含谐振器和双模声表面波滤波器的滤波器模组的等效电路；Establish an equivalent circuit of a filter module including a resonator and a dual-mode surface acoustic wave filter;根据所述等效电路绘制所述滤波器模组的电学版图；Draw the electrical layout of the filter module according to the equivalent circuit;根据所述等效电路确定输入信号的频率和功率；并根据所述输入信号的频率和功率获取所述谐振器的发热功率和所述双模声表面波滤波器的发热功率；Determine the frequency and power of the input signal according to the equivalent circuit; and obtain the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter according to the frequency and power of the input signal;根据所述电学版图建立所述滤波器模组的热仿真模型；Establishing a thermal simulation model of the filter module according to the electrical layout;根据所述谐振器的发热功率和所述双模声表面波滤波器的发热功率设置所述滤波器模组进行热仿真的边界条件；Setting boundary conditions for thermal simulation of the filter module according to the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter;根据所述热仿真模型和所述边界条件进行传热仿真，得到所述滤波器模组的热仿真数据；Perform heat transfer simulation according to the thermal simulation model and the boundary conditions to obtain thermal simulation data of the filter module;其中，所述双模声表面波滤波器的发热功率的计算公式如下：
P_diss＝P_in*(1-|S21|^2-|S11|^2)；The calculation formula of the heating power of the dual-mode surface acoustic wave filter is as follows:
P_diss=P_in*(1-|S21|^2-|S11|^2);P_diss为所述双模声表面波滤波器的发热功率，P_in为所述双模声表面波滤波器在支路中分配到的输入功率，S21和S11分别为所述双模声表面波滤波器在与所述输入信号相同频率下的散射参数。P_diss is the heat generation power of the dual-mode surface acoustic wave filter, P_in is the input power allocated to the dual-mode surface acoustic wave filter in the branch, and S21 and S11 are scattering parameters of the dual-mode surface acoustic wave filter at the same frequency as the input signal. - 如权利要求1所述的滤波器模组的热仿真方法，其特征在于，根据所述谐振器的发热功率和所述双模声表面波滤波器的发热功率设置所述滤波器模组进行传热仿真的边界条件的具体步骤如下：The thermal simulation method of the filter module according to claim 1 is characterized in that the specific steps of setting the boundary conditions for the heat transfer simulation of the filter module according to the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter are as follows:将所述谐振器的发热功率和所述双模声表面波滤波器的发热功率分别以热源的形式添加至所述热仿真模型的边界条件中，并使所述谐振器的发热功率所对应的热源以及所述双模声表面波滤波器的发热功率所对应的热源分别与所述热仿真模型的发热区域一一对应。The heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter are respectively added to the boundary conditions of the thermal simulation model in the form of heat sources, and the heat sources corresponding to the heating power of the resonator and the heat sources corresponding to the heating power of the dual-mode surface acoustic wave filter are respectively made to correspond one-to-one to the heating areas of the thermal simulation model.
- 如权利要求1所述的滤波器模组的热仿真方法，其特征在于，所述热仿真模型利用有限元仿真软件COMSOL建立。 The thermal simulation method of the filter module according to claim 1, characterized in that the thermal simulation model is established using finite element simulation software COMSOL.
- 如权利要求3所述的滤波器模组的热仿真方法，其特征在于，所述热仿真模型使用的材料包括金属铝和衬底钽酸锂。The thermal simulation method of the filter module as described in claim 3 is characterized in that the materials used in the thermal simulation model include metallic aluminum and substrate lithium tantalate.
- 如权利要求1所述的滤波器模组的热仿真方法，其特征在于，根据所述热仿真模型和所述边界条件进行传热仿真时，利用数值分析软件进行。The thermal simulation method of the filter module according to claim 1 is characterized in that when the heat transfer simulation is performed according to the thermal simulation model and the boundary conditions, numerical analysis software is used.
- 如权利要求1所述的滤波器模组的热仿真方法，其特征在于，所述滤波器模组中包含的所述谐振器和所述双模声表面波滤波器分别为多个。The thermal simulation method of the filter module according to claim 1 is characterized in that the resonator and the dual-mode surface acoustic wave filter contained in the filter module are respectively multiple.
- 一种滤波器模组的热仿真系统，其特征在于，所述滤波器模组的热仿真系统包括：A thermal simulation system for a filter module, characterized in that the thermal simulation system for the filter module comprises:第一建立单元模块，所述第一建立单元模块用于建立包含谐振器和双模声表面波滤波器的滤波器模组的等效电路；A first building unit module, the first building unit module is used to build an equivalent circuit of a filter module including a resonator and a dual-mode surface acoustic wave filter;绘制模块，所述绘制模块用于根据所述等效电路绘制所述滤波器模组的电学版图；A drawing module, the drawing module is used to draw the electrical layout of the filter module according to the equivalent circuit;获取模块，所述获取模块用于根据所述等效电路确定输入信号的频率和功率；并根据所述输入信号的频率和功率获取所述谐振器的发热功率和所述双模声表面波滤波器的发热功率；An acquisition module, the acquisition module is used to determine the frequency and power of the input signal according to the equivalent circuit; and to acquire the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter according to the frequency and power of the input signal;第二建立模块，所述第二建立模块用于根据所述电学版图建立所述滤波器模组的热仿真模型；A second establishing module, the second establishing module is used to establish a thermal simulation model of the filter module according to the electrical layout;设置模块，所述设置模块用于根据所述谐振器的发热功率和所述双模声表面波滤波器的发热功率设置所述滤波器模组进行热仿真的边界条件；A setting module, the setting module is used to set the boundary conditions of the filter module for thermal simulation according to the heating power of the resonator and the heating power of the dual-mode surface acoustic wave filter;仿真模块，根据所述热仿真模型和所述边界条件进行传热仿真，得到所述滤波器模组的热仿真数据。The simulation module performs heat transfer simulation according to the thermal simulation model and the boundary conditions to obtain thermal simulation data of the filter module.
- 一种电子设备，其特征在于，所述电子设备包括存储器、处理器以及存储在所述存储器上并可在所述处理器上运行的计算机程序，所述处理器执行所述计算机程序时实现如权利要求1至6任意一项所述的滤波器模组的热仿真方法中的步骤。 An electronic device, characterized in that the electronic device includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps in the thermal simulation method of the filter module as described in any one of claims 1 to 6 when executing the computer program.
- 一种计算机可读存储介质，其特征在于，所述计算机可读存储介质存储有计算机程序，所述计算机程序被处理器执行时实现如权利要求1至6任意一项所述的滤波器模组的热仿真方法中的步骤。 A computer-readable storage medium, characterized in that the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in the thermal simulation method of the filter module as described in any one of claims 1 to 6 are implemented.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310288434.5 | 2023-03-15 | ||
| CN202310288434.5A CN116306149A (en) | 2023-03-15 | 2023-03-15 | Thermal simulation method, system and related equipment of filter module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2024188071A1 true WO2024188071A1 (en) | 2024-09-19 |
Family
ID=86823792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2024/079555 WO2024188071A1 (en) | 2023-03-15 | 2024-03-01 | Thermal simulation method and system for filter module, and related device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN116306149A (en) |
| WO (1) | WO2024188071A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116306149A (en) * | 2023-03-15 | 2023-06-23 | 深圳飞骧科技股份有限公司 | Thermal simulation method, system and related equipment of filter module |
| CN117118394B (en) * | 2023-10-23 | 2024-01-12 | 成都梓峡信息技术有限公司 | Switch filter module chip and matching parameter correction method thereof |
| CN118332884B (en) * | 2024-06-17 | 2024-08-09 | 天通瑞宏科技有限公司 | Simulation method, device, equipment and medium of surface acoustic wave filter |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114117690A (en) * | 2022-01-27 | 2022-03-01 | 深圳飞骧科技股份有限公司 | Method for simulating surface acoustic wave filter, related device and storage medium |
| CN114330195A (en) * | 2021-12-31 | 2022-04-12 | 广州广电计量检测股份有限公司 | Cavity filter electrothermal coupling simulation test method, device and medium |
| WO2023005167A1 (en) * | 2021-07-27 | 2023-02-02 | 中国电子科技集团公司第二十六研究所 | Thin-film bulk acoustic resonant filter assembling and using method and electronic device |
| CN116070585A (en) * | 2023-03-14 | 2023-05-05 | 深圳飞骧科技股份有限公司 | Thermal simulation method, system and related equipment of filter module |
| CN116306149A (en) * | 2023-03-15 | 2023-06-23 | 深圳飞骧科技股份有限公司 | Thermal simulation method, system and related equipment of filter module |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114679132B (en) * | 2022-05-30 | 2022-08-26 | 锦浪科技股份有限公司 | Photovoltaic inverter electric heating working condition simulation method and device and storage medium |
-
2023
- 2023-03-15 CN CN202310288434.5A patent/CN116306149A/en active Pending
-
2024
- 2024-03-01 WO PCT/CN2024/079555 patent/WO2024188071A1/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023005167A1 (en) * | 2021-07-27 | 2023-02-02 | 中国电子科技集团公司第二十六研究所 | Thin-film bulk acoustic resonant filter assembling and using method and electronic device |
| CN114330195A (en) * | 2021-12-31 | 2022-04-12 | 广州广电计量检测股份有限公司 | Cavity filter electrothermal coupling simulation test method, device and medium |
| CN114117690A (en) * | 2022-01-27 | 2022-03-01 | 深圳飞骧科技股份有限公司 | Method for simulating surface acoustic wave filter, related device and storage medium |
| CN116070585A (en) * | 2023-03-14 | 2023-05-05 | 深圳飞骧科技股份有限公司 | Thermal simulation method, system and related equipment of filter module |
| CN116306149A (en) * | 2023-03-15 | 2023-06-23 | 深圳飞骧科技股份有限公司 | Thermal simulation method, system and related equipment of filter module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116306149A (en) | 2023-06-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2024188071A1 (en) | Thermal simulation method and system for filter module, and related device | |
| WO2024188070A1 (en) | Thermal simulation method and system for filter module, and related device | |
| KR101987761B1 (en) | Element removal design in microwave filters | |
| CN106712738B (en) | The method for requiring design sound microwave filter according to frequency response | |
| CN109716336A (en) | The layering cascade of acoustic wave filter device two-dimensional finite element method simulation | |
| US9374061B1 (en) | Method of optimizing input impedance of surface acoustic wave filter | |
| JP2016181909A (en) | Improved design of microwave acoustic wave filter | |
| CN112287635A (en) | FBAR filter optimization method based on improved Mason model | |
| CN106026962A (en) | Surface acoustic wave filter | |
| CN116205191B (en) | Method, system and related equipment for predicting energy tolerance value of filter device | |
| San-Blas et al. | Efficient design of compact H-plane rectangular waveguide band-pass filters with integrated coaxial excitation | |
| US20110081878A1 (en) | Filtering device for filtering rf signals and method for filtering rf signals | |
| CN116502508B (en) | Real-time simulation method, system and related equipment for electric thermal performance of elastic wave filter | |
| Oldoni et al. | A new approach to the synthesis of microwave lossy filters | |
| TW202315312A (en) | Surface acoustic wave resonator and filter utilizing effective reflection structure | |
| CN106650054A (en) | Transmission line filter design method based on distribution parameter-lumped parameter equivalence | |
| WO2024230595A1 (en) | Method and system for predicting energy withstand value of filtering device, and related device | |
| Chen et al. | Design and optimization of FBAR filter using acoustic-electromagnetic coupling model and MBVD model | |
| San Blas et al. | Novel solution for the coaxial excitation of inductive rectangular waveguide filters | |
| Wang et al. | 2.5 GHz Low-Loss and Wideband Surface Acoustic Wave Filter Based on AL/128° YX-LiNbO3 | |
| Momen et al. | A method for low-pass filter designing by commensurate transmission lines | |
| Nedelchev et al. | Wave Digital Modeling in Microstrip Hairpin Filter Synthesis | |
| Labyntsev et al. | The method of synthesis of microstrip filters using HFSS software package | |
| CN112332061A (en) | Design method of miniaturized stopband selectable microstrip 3dB coupler | |
| Ross | A Simple Method for Obtaining the System Function of a Cascade Connection of Transmission Lines (Correspondence) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 24769765 Country of ref document: EP Kind code of ref document: A1 |