WO2024093189A1 - Server, dual-memory packaging module, and connector - Google Patents

Abstract

The present disclosure relates to a server, a dual-memory packaging module, and a connector. The connector comprises a body (210). The body (210) is provided with a first groove (211), a second groove (212), and an insertion portion (213). The first groove (211) and the second groove (212) are each provided with a conductive member electrically connected to a memory module. Two opposite sides of the insertion portion (213) are each provided with a gold finger. The conductive member of the first groove (211) and the conductive member of the second groove (212) are electrically connected to the gold fingers, respectively.

Description

Server, dual memory package module and connector

CROSS-REFERENCE TO RELATED APPLICATIONS

This disclosure claims priority to a Chinese patent application filed with the Chinese Patent Office on November 2, 2022, with application number 2022113621813 and titled “Server, dual memory packaging module and connector”. The entire contents of the patent application are incorporated by reference in this disclosure.

Technical Field

The present disclosure relates to the technical field of semiconductor devices, and in particular to a server, a dual memory packaging module, and a connector.

Background technique

Memory sticks, including but not limited to DIMM (Dual Inline Memory Module) memory sticks, provide 64-bit data channels and are widely used. Please refer to Figure 1. In this embodiment, the DIMM memory stick will be specifically introduced as an example. Figure 1 shows a schematic diagram of the structure of a traditional signal processing system. The number of signal channels 110 shown in Figure 1 is four, and they are arranged in sequence. Among them, one signal channel 110 corresponds to two DIMM memory sticks 111, and the two DIMM memory sticks 111 are arranged at intervals from each other. The signal channel 110 realizes the mutual transmission of signals between the two DIMM memory sticks 111 and the CPU device 120 through the data line 112. However, the signal quality of the two DIMM memory sticks 111 corresponding to the same signal channel 110 is different, which in turn affects the stability of the signal processing system.

Summary of the invention

According to various embodiments of the present application, a server, a dual memory packaging module, and a connector are provided.

The technical solution is as follows: a connector, comprising:

A body, wherein the body is provided with a first groove and a second groove which are arranged relatively and spaced apart from each other; a conductive member which is electrically connected to the memory bar is respectively provided on the side walls of the first groove and the second groove;

The main body is also provided with an insertion portion, and two opposite sides of the insertion portion are respectively provided with gold fingers;

The conductive member of the first groove and the conductive member of the second groove are electrically connected to the gold finger through electrical connectors respectively;

The lengths of the electrical connectors are the same.

In one of the embodiments, the conductive member of the first groove includes at least one first conductive member arranged on one of the side walls of the first groove, and a second conductive member on another opposite side wall and arranged opposite to the first conductive member; the conductive member of the second groove includes at least one third conductive member arranged on one of the side walls of the second groove, and a fourth conductive member on another opposite side wall and arranged opposite to the third conductive member; the gold finger includes at least one first gold finger arranged on one side of the insertion portion, and at least one second gold finger on another opposite side; each of the electrical connectors includes a first electrical connector, a second electrical connector, a third electrical connector and a fourth electrical connector; the first conductive member is electrically connected to the first gold finger through the first electrical connector, the second conductive member is electrically connected to the second gold finger through the second electrical connector, the third conductive member is electrically connected to the first gold finger through the third electrical connector, and the fourth conductive member is electrically connected to the second gold finger through the fourth electrical connector; the lengths of the first electrical connector, the second electrical connector, the third electrical connector and the fourth electrical connector are all the same.

In one embodiment, the first electrical connector, the second electrical connector, the third electrical connector, and the fourth electrical connector are all configured to be plate-shaped, and the widths of the first electrical connector, the second electrical connector, the third electrical connector, and the fourth electrical connector are the same and defined as W; the first electrical connector and the second electrical connector are projected onto a reference plane parallel to the side surface of the insertion portion, and the spacing between the projections of the first electrical connector and the second electrical connector on the reference plane is defined as S, S≧W.

In one of the embodiments, the conductive member of the first groove includes protrusions facing each other.

In one of the embodiments, the conductive member of the second groove includes protrusions facing each other.

In one embodiment, the conductive members are each independently configured as a conductive spring.

In one embodiment, the main body is also provided with a main body portion connected to the insertion portion; the main body portion is provided with a first surface and a second surface opposite to each other, the first groove and the second groove are formed on the first surface, and the insertion portion is connected to the middle part of the second surface; the first electrical connector, the second electrical connector, the third electrical connector and the fourth electrical connector are each respectively arranged through the inside of the main body.

In one embodiment, the first electrical connector is arranged in parallel with the second electrical connector; the third electrical connector is arranged in parallel with the fourth electrical connector; the first electrical connector and the third electrical connector are arranged symmetrically about the first gold finger axis; the second electrical connector and the fourth electrical connector are arranged symmetrically about the second gold finger axis; the first groove and the second groove are arranged symmetrically about the central axis of the insertion portion.

In one embodiment, the gold finger at the end of the inserting portion is trimmed.

A dual memory packaging module, the dual memory packaging module comprises the connector, the dual memory packaging module also comprises a first memory bar and a second memory bar; the first memory bar and the second memory bar are locked and fixed to each other by at least one fastener.

In one embodiment, the dual memory packaging module also includes a liquid cooling mechanism; the liquid cooling mechanism is used to reduce the temperature of the first memory bar and the second memory bar; the liquid cooling mechanism includes a heat exchange housing, the heat exchange housing is in contact with a group selected from the first memory bar and the second memory bar, the heat exchange housing is provided with a liquid flow channel, a liquid inlet and a liquid outlet, the liquid flow channel is connected to a cooling liquid providing mechanism through the liquid inlet, and is connected to a liquid recovery mechanism through the liquid outlet.

In one embodiment, the heat exchange housing includes at least one heat exchange sub-shell; the heat exchange sub-shell is respectively in contact with a group selected from the first memory bar and the second memory bar, the inlet of the heat exchange sub-shell is connected to the liquid inlet, and the outlet of the heat exchange sub-shell is connected to the liquid outlet.

In one embodiment, the heat exchange sub-shell includes at least two heat exchange tube shells connected in parallel between the liquid inlet and the liquid outlet.

In one embodiment, the heat exchange sub-shells are provided in three numbers and are arranged in sequence to form two partition spaces; the first memory bar and the second memory bar are respectively arranged in the two partition spaces.

In one embodiment, the dual memory packaging module also includes an insulating shell, and the liquid cooling mechanism, the first memory bar and the second memory bar are arranged inside the insulating shell; the insulating shell is also provided with a first opening corresponding to the liquid inlet and a second opening corresponding to the liquid outlet.

A server comprises the memory packaging module, and the server also comprises a memory slot, wherein the inserting part is inserted into the memory slot.

The details of one or more embodiments of the present application are set forth in the following drawings and description. Other features, objects, and advantages of the present application will become apparent from the description, drawings, and claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which constitute a part of this application, are used to provide a further understanding of the present disclosure. The illustrative embodiments of the present disclosure and their descriptions are used to explain the present disclosure and do not constitute improper limitations on the present disclosure.

In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

FIG1 is a schematic diagram of the structure of a signal processing system according to a conventional embodiment;

FIG2 is a schematic structural diagram of a dual memory package module according to an embodiment of the present disclosure;

FIG3 is a schematic structural diagram of a connector according to an embodiment of the present disclosure from one viewing angle;

FIG4 is a schematic structural diagram of a connector from another perspective according to an embodiment of the present disclosure;

FIG5 is a schematic structural diagram of a connector according to an embodiment of the present disclosure from another viewing angle;

FIG6 is a schematic structural diagram of a connector according to another embodiment of the present disclosure from one perspective;

FIG7 is a schematic structural diagram of the connector shown in FIG5 from a perspective in which the main body is hidden;

FIG8 is a schematic structural diagram of the connector shown in FIG5 from another viewing angle with the main body hidden;

FIG9 is a schematic structural diagram of a cooling mechanism according to an embodiment of the present disclosure;

FIG10 is a schematic structural diagram of a dual memory package module according to an embodiment of the present disclosure from one perspective;

FIG. 11 is a schematic structural diagram of a dual memory packaging module from another perspective according to an embodiment of the present disclosure.

110, signal channel; 111, DIMM memory bar; 112, data line; 113, arc segment; 120, CPU device; 210, body; 211, first groove; 2111, first conductive member; 2112, second conductive member; 212, second groove; 2121, third conductive member; 2122, fourth conductive member; 213, insertion portion; 2131, fifth conductive member; 2132, sixth conductive member; 214, main body; 215, protrusion; 216, hypotenuse; 221, A first memory stick; 222, a second memory stick; 223, a fastener; 231, a first electrical connector; 232, a second electrical connector; 233, a third electrical connector; 234, a fourth electrical connector; 240, a liquid cooling mechanism; 240a, a heat exchange casing; 241, a heat exchange sub-shell; 2411, a liquid inlet; 2412, a liquid outlet; 2413, a heat exchange tube shell; 2414, a liquid inlet pipe; 2415, a liquid outlet pipe; 250, a thermal insulation casing; 251, a first opening; 252, a second opening.

Detailed ways

In order to make the above-mentioned purposes, features and advantages of the present disclosure more obvious and easy to understand, the specific embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. Many specific details are described in the following description to facilitate a full understanding of the present disclosure. However, the present disclosure can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present disclosure. Therefore, the present disclosure is not limited to the specific embodiments disclosed below.

As the background technology, the problem of different signal quality of two DIMM memory bars corresponding to the same signal channel in the related technology is found through research that the reason for this problem is that, please refer to Figure 1, for the two DIMM memory bars 111 of the same signal channel 110, the line lengths of the data lines 112 from the two DIMM memory bars 111 of the same signal channel 110 to the CPU device 120 are different, that is, the length of the data line 112 between the DIMM on the right side and the CPU device 120 as shown in the figure is greater than the length of the data line 112 between the other DIMM and the CPU device 120, and the difference in line length between the two corresponds to the arc segment 113 of the two DIMM memory bars 111, resulting in differences in the signal performance of the two DIMM memory bars 111. When the signal processing system is working, due to signal reflection, the signal quality on the DIMM memory bar 111 on the right side as shown in the figure is generally worse than that on the other DIMM memory bar 111.

Based on the above reasons, the present disclosure provides a server, a dual memory packaging module and a connector, which can ensure signal integrity and greatly improve system performance.

Referring to Figures 2 to 5, Figure 2 shows a schematic diagram of the structure of a dual memory packaging module according to an embodiment of the present disclosure, Figure 3 shows a schematic diagram of the structure of a connector according to an embodiment of the present disclosure from one perspective, Figure 4 shows a schematic diagram of the structure of a connector according to another perspective, and Figure 5 shows a schematic diagram of the structure of a connector according to another perspective. A connector provided in an embodiment of the present disclosure includes a body 210. The body 210 is provided with a first groove 211 and a second groove 212 that are relatively spaced apart. The side walls of the first groove 211 and the second groove 212 are each provided with a conductive member electrically connected to the memory bar.

In addition, the main body 210 is further provided with an insertion portion 213, and gold fingers are respectively provided on opposite sides of the insertion portion 213. The conductive member of the first groove 211 and the conductive member of the second groove 212 are respectively electrically connected to the gold fingers through electrical connectors. The lengths of the electrical connectors are the same.

Specifically, at least one first conductive member 2111 is disposed on one side wall of the first groove 211, and a second conductive member 2112 disposed opposite to the first conductive member 2111 is disposed on another opposite side wall. At least one third conductive member 2121 is disposed on one side wall of the second groove 212, and a fourth conductive member 2122 disposed opposite to the third conductive member 2121 is disposed on another opposite side wall. The first groove 211 is used to insert the first memory stick 221, and the second groove 212 is used to insert the second memory stick 222. The body 210 is further provided with an insertion portion 213, and a first gold finger 2131 disposed corresponding to the first conductive member 2111 is disposed on one side wall of the insertion portion 213, and a second gold finger 2132 disposed corresponding to the second conductive member 2112 is disposed on another opposite side wall. The first conductive member 2111 is electrically connected to the first gold finger 2131 through the first electrical connector 231, the second conductive member 2112 is electrically connected to the second gold finger 2132 through the second electrical connector 232, the third conductive member 2121 is electrically connected to the first gold finger 2131 through the third electrical connector 233, and the fourth conductive member 2122 is electrically connected to the second gold finger 2132 through the fourth electrical connector 234. The first electrical connector 231, the second electrical connector 232, the third electrical connector 233 and the fourth electrical connector 234 are all the same length.

The above connector inserts the first memory bar 221 and the second memory bar 222 into the first groove 211 and the second groove 212 respectively, and the third gold fingers on the two opposite side walls of the first memory bar 221 are electrically connected to the first conductive member 2111 and the second conductive member 2112 respectively, and the fourth gold fingers on the two opposite side walls of the second memory bar 222 are electrically connected to the third conductive member 2121 and the fourth conductive member 2122 respectively; the inserting portion 213 is inserted into the memory slot of the server. In this case, since the first conductive member 2111 is electrically connected to the first gold finger 2131 through the first electrical connector 231, the second conductive member 2112 is electrically connected to the second gold finger 2132 through the second electrical connector 232, the third conductive member 2121 is electrically connected to the first gold finger 2131 through the third electrical connector 233, and the fourth conductive member 2122 is electrically connected to the second gold finger 2132 through the fourth electrical connector 234. The lengths of the first electrical connector 231, the second electrical connector 232, the third electrical connector 233 and the fourth electrical connector 234 are all the same. Therefore, the signal lines on the first memory bar 221 and the second memory bar 222 have the same routing length, thereby ensuring the consistency of the signal quality on the first memory bar 221 and the second memory bar 222. Since the influence of reflection is eliminated, the overall performance of the system is improved.

The length of the first electrical connector 231 is shown as _L1 in FIG5 , the length of the second electrical connector 232 is shown as _L2 in FIG5 , the length of the third electrical connector 233 is shown as _L3 in FIG5 , and the length of the fourth electrical connector 234 is shown as _L4 in FIG5 . The lengths of the various electrical connectors are kept equal: _L1 = _L2 = _L3 = _L4 .

In one embodiment, the first memory bar 221 and the second memory bar 222 include but are not limited to being set as DIMM memory bars, and can also be flexibly adjusted to other types of memory bars according to actual needs.

Please refer to FIG. 2 . In one embodiment, in order to ensure the overall stability of the first memory bar 221 and the second memory bar 222 after being inserted into the first groove 211 and the second groove 212 respectively, the first memory bar 221 and the second memory bar 222 are locked and fixed to each other by at least one fastener 223. The fastener 223 includes but is not limited to copper pillars, pins, rivets, bolts, screws and other fixings. Optionally, the fastener 223 includes but is not limited to 2, 3, 4, 5, 6 or other quantities. As an example, the fasteners 223 are, for example, 4, and the 4 fasteners 223 are respectively arranged at the four corners of the first memory bar 221.

Please refer to FIG. 6, which shows a schematic diagram of the structure of a connector according to another embodiment of the present disclosure from a perspective. Compared with FIG. 5, the first conductive member 2111, the second conductive member 2112, the third conductive member 2121 and the fourth conductive member 2122 are not completely planar structures, but are A protrusion 215 is provided. In one embodiment, the first conductive member 2111 and/or the second conductive member 2112 are provided with protrusions 215 protruding toward each other. Thus, under the action of the protrusions 215, the third gold fingers on the two opposite side walls of the first memory stick 221 are respectively electrically connected to the first conductive member 2111 and the second conductive member 2112, and the conductive contact performance is good, so that the third gold fingers can be stably inserted into the first groove 211.

Please refer to FIG. 6 , in one embodiment, the third conductive member 2121 and/or the fourth conductive member 2122 are provided with protrusions 215 protruding toward each other. In this way, the fourth gold fingers on the two opposite side walls of the second memory module 222 are respectively electrically connected to the third conductive member 2121 and the fourth conductive member 2122 with good conductive contact performance, so that the fourth gold fingers can be stably inserted into the second groove 212.

Optionally, the protrusion 215 includes but is not limited to an arc shape, or two walls arranged at an obtuse angle. In this way, it is helpful to firmly fix the gold finger of the memory stick, and at the same time ensure smooth insertion into the groove to avoid jamming.

Please refer to FIG. 5 and FIG. 6 . In one embodiment, the spacing between the first conductive member 2111 and the second conductive member 2112 is defined as h ₁ , the spacing at the protrusion 215 of the first conductive member 2111 and/or the second conductive member 2112 is defined as h ₂ , and the thickness of the first memory bar 221 is defined as h , wherein h ₁ >h>h ₂ . Thus, the spacing h ₁ between the first conductive member 2111 and the second conductive member 2112 in the first groove 211 is slightly larger than the thickness h of the first memory bar 221 , for example, h ₁ is set to 101% h-130% h, so as to ensure that the third gold finger of the first memory bar 221 is inserted into the groove; in addition, the spacing h ₂ at the protrusion 215 of the first conductive member 2111 is slightly smaller than the thickness h of the first memory bar 221 , for example, h ₂ is set to 85% h-99% h, so as to ensure that the protrusion 215 is tightly abutted and fixed to the third gold finger of the first memory bar 221 .

In addition, the relationship between the third conductive member 2121 and the fourth conductive member 2122 in the second groove 212 is similar to the relationship between the first conductive member 2111 and the second conductive member 2112 in the first groove 211 , and will not be described in detail herein.

Please refer to FIG. 5 and FIG. 6 . In one embodiment, the depth of the first groove 211 is defined as h3, and the length of the third longest gold finger on the first memory stick 221 is defined as m, and h3>m. Thus, the depth h3 of the first groove 211 is slightly larger than the length of the third longest gold finger on the first memory stick 221, leaving a little margin for easy insertion.

Please refer to FIG. 5 and FIG. 6. In one embodiment, the thickness of the inserting portion 213 is defined as h4, the width of the memory slot of the server is defined as n, and h4<n. The length of the inserting portion 213 is defined as h5, and the depth of the memory slot of the server is defined as h6, and h5≦h6. In this way, it can be ensured that the inserting portion 213 is smoothly inserted into the memory slot of the server.

5 and 6, in one embodiment, the first conductive member 2111, the second conductive member 2112, the third conductive member 2121 and the fourth conductive member 2122 are each independently configured as a conductive spring. The first conductive member 2111 and the second conductive member 2112 are attached and fixed to the inner wall of the first groove 211, and the third conductive member 2121 and the fourth conductive member 2122 are attached and fixed to the inner wall of the second groove 212.

Of course, as some optional solutions, the first conductive member 2111 and the second conductive member 2112 also include but are not limited to being connected to the inner wall of the first groove 211 by electroplating; similarly, the third conductive member 2121 and the fourth conductive member 2122 also include but are not limited to being connected to the inner wall of the second groove 212 by electroplating.

Among them, when set as a conductive spring, it has the following advantages: good conductivity; high tensile elasticity; high shielding effect; good corrosion resistance; long service life; large contact area, good EMI effect, easy installation; anti-click degree of more than 50,000, good product reliability; low cost and stable performance.

It should be noted that conductive springs are important metal parts of electronic components, usually for conduction, switching, clamping, resonance and other functions. The shapes are mostly S-shaped, C-shaped, round, Z-shaped, spoon-shaped, etc. They are used in mobile phone cards, mobile phone antennas, headphone audio jacks, connectors, micro motors, sensors, automotive instrument touch switches, medical equipment, PCB shielding covers, etc. This connector uses a spoon-shaped spring design.

In addition, there is actually more than one material that can be processed for conductive shrapnel. There are many materials to choose from. Generally, the material is selected according to the use environment of the conductive shrapnel. Common metal shrapnel materials include: beryllium copper (needs heat treatment), titanium copper, phosphor bronze, stainless steel, spring steel, etc. According to the characteristics of the material, the conductive shrapnel can also be surface treated to make up for the shortcomings of the metal conductive shrapnel. Common surface treatments include: gold plating, silver plating, nickel plating, tin plating, and ultrasonic cleaning of oil stains.

Referring to FIGS. 2 to 5 , in one embodiment, the body 210 is further provided with a main body 214 connected to the insertion portion 213. The main body 214 is provided with a first surface and a second surface opposite to each other, a first groove 211 and a second groove 212 are formed on the first surface, and the insertion portion 213 is connected to the middle portion of the second surface. The first electrical connector 231, the second electrical connector 232, the third electrical connector 233 and the fourth electrical connector 234 are each disposed through the interior of the body 210.

Please refer to FIG. 5 or FIG. 6. In one embodiment, the first electrical connector 231 is arranged in parallel with the second electrical connector 232. The third electrical connector 233 is arranged in parallel with the fourth electrical connector 234. The first electrical connector 231 and the third electrical connector 233 are arranged axially symmetrically about the first gold finger 2131. The second electrical connector 232 and the fourth electrical connector 234 are arranged axially symmetrically about the second gold finger 2132. The first groove 211 and the second groove 212 are arranged axially symmetrically about the central axis of the insertion portion 213 (as shown by the double arrow Z in FIG. 6). In this way, the structural arrangement of the connector is reasonable, which can help to keep the lengths of the first electrical connector 231, the second electrical connector 232, the third electrical connector 233 and the fourth electrical connector 234 consistent, and at the same time, the product volume is small.

Please refer to FIG. 5, FIG. 7 and FIG. 8. FIG. 7 shows a schematic diagram of the structure of the connector shown in FIG. 5 from a perspective in which the main body 214 is hidden. FIG. 8 shows a schematic diagram of the structure of the connector shown in FIG. 5 from another perspective in which the main body 214 is hidden. In one embodiment, the first electrical connector The connector 231, the second connector 232, the third connector 233, and the fourth connector 234 are all plate-shaped, and the widths of the first connector 231, the second connector 232, the third connector 233, and the fourth connector 234 are all the same and defined as W; the first connector 231 and the second connector 232 are projected on a reference plane parallel to the side of the insertion portion 213, and the spacing between the projections of the first connector 231 and the second connector 232 on the reference plane is defined as S, S≧W. In this way, the spacing between the projections of the third connector 233 and the fourth connector 234 on the reference plane is also S. It has been found that when the spacing S is maintained at more than 1 times the line width W, the crosstalk of the signal between the first connector 231 and the second connector 232 can be reduced.

Please refer to FIG8 . In one embodiment, the line width W of the first electrical connection member 231 is smaller than the line width W ₁ of the first conductive member 2111 (as shown in FIG8 ). As some examples, W is 0.25W ₁ to 0.35W ₁ , such as 0.25W ₁ , 0.26W ₁ , 0.27W ₁ , 0.28W ₁ , 0.29W ₁ , 0.3W ₁ , 0.31W ₁ , 0.32W ₁ , 0.33W ₁ , 0.34W ₁ , 0.35W ₁ . In addition, W can also be set to a numerical range other than 0.25W ₁ to 0.35W ₁ , and can be flexibly adjusted and set according to actual needs.

Similarly, the relationship between the line width of the second electrical connector 232 and the second conductive member 2112, the relationship between the line width of the third electrical connector 233 and the third conductive member 2121, and the relationship between the line width of the fourth electrical connector 234 and the fourth conductive member 2122 are similar to the relationship between the line width of the first electrical connector 231 and the first conductive member 2111, and will not be repeated here. In this way, it is possible to ensure that the first conductive member 2111 and the third conductive member 2121 are electrically connected to the first gold finger 2131, and the second conductive member 2112 and the fourth conductive member 2122 are electrically connected to the second gold finger 2132, respectively, so as to avoid mutual interference between the first electrical connector 231 and the third electrical connector 233 and the second electrical connector 232 and the fourth electrical connector 234 during wiring.

Please refer to Figures 6 to 8. In one embodiment, the line widths of the first conductive member 2111, the second conductive member 2112, the third conductive member 2121, the fourth conductive member 2122, the first gold finger 2131, and the second gold finger 2132 are all consistent. Of course, the line widths of the first conductive member 2111, the second conductive member 2112, the third conductive member 2121, the fourth conductive member 2122, the first gold finger 2131, and the second gold finger 2132 may also be different, and may be flexibly adjusted and set according to actual needs, and are not limited here.

Please refer to FIG. 6 . In one embodiment, the thickness of the insertion portion 213 is defined as h4 . The thickness h4 of an end of the insertion portion 213 away from the first conductive member 2111 decreases in a direction away from the first conductive member 2111 .

Optionally, the gold finger at the end of the insertion part 213 is trimmed. Specifically, the end of the insertion part 213 away from the first conductive member 2111, specifically the end of the first gold finger 2131 and/or the second gold finger 2132 away from the first conductive member 2111, is trimmed, that is, a bevel 216 is provided on the end of the first gold finger 2131 and/or the second gold finger 2132 away from the first conductive member 2111, so that it can be easily inserted into the memory slot of the server. In addition, the first gold finger 2131 and the second gold finger 2132 (specifically, for example, copper) of the insertion part 213 can be prevented from being lifted up due to improper force when inserted into the memory slot of the server, thereby improving the life of the connector, and further, since the insertion part 213 below the connector needs to be frequently inserted into the memory slot, plugging and unplugging is convenient.

It should be noted that the "first electrical connector 231" can be a "part of the first conductive component 2111", that is, the "first electrical connector 231" and the "other parts of the first conductive component 2111" are manufactured as one piece; it can also be an independent component that can be separated from the "other parts of the first conductive component 2111", that is, the "first electrical connector 231" can be manufactured independently and then combined with the "other parts of the first conductive component 2111" into a whole.

It should be noted that the "insertion portion 213" can be a "part of the main body 214", that is, the "insertion portion 213" and the "other parts of the main body 214" are manufactured as one piece; it can also be an independent component separable from the "other parts of the main body 214", that is, the "insertion portion 213" can be manufactured independently and then combined with the "other parts of the main body 214" into a whole.

Referring to FIG. 2 to FIG. 5 , in one embodiment, a dual memory package module includes a connector according to any of the above embodiments, and the dual memory package module also includes two memory bars, which are respectively inserted into the first groove 211 and the second groove 212 and electrically connected to the conductive member. Optionally, the two memory bars are locked and fixed to each other by at least one fastener.

Specifically, the two memory bars are, for example, a first memory bar 221 and a second memory bar 222. The first memory bar 221 is detachably inserted into the first groove 211, and the third gold fingers on the two opposite side walls of the first memory bar 221 are electrically connected to the first conductive member 2111 and the second conductive member 2112 respectively. The second memory bar 222 is detachably inserted into the second groove 212, and the fourth gold fingers on the two opposite side walls of the second memory bar 222 are electrically connected to the third conductive member 2121 and the fourth conductive member 2122 respectively.

The above-mentioned dual memory package module has a more and more serious signal integrity problem due to the increasing signal rate. Combining the first memory bar 221 and the second memory bar 222 together and installing them on the connector has at least the following advantages: 1. Improving the memory capacity and doubling the memory capacity; 2. The distances from the first memory bar 221 and the second memory bar 222 to the memory slot of the server are equal, which can reduce signal reflection and improve signal quality; 3. The spacing between the first memory bar 221 and the second memory bar 222 is reduced, which can save space on the motherboard; 4. As the power management chip is installed on the first memory bar 221 or the second memory bar 222, the first memory bar 221 and the second memory bar 222 are getting more and more heated, and the air cooling technology can no longer meet the heat dissipation requirements. Packaging the first memory bar 221 and the second memory bar 222 together facilitates the production of a liquid cooling heat dissipation structure with higher heat dissipation efficiency.

Please refer to Figures 2, 9 to 11, Figure 9 shows a schematic diagram of the structure of a cooling mechanism 240 according to an embodiment of the present disclosure, Figure 10 shows a schematic diagram of the structure of a dual memory packaging module according to an embodiment of the present disclosure from one perspective, and Figure 11 shows a schematic diagram of the structure of a dual memory packaging module according to another perspective. In one embodiment, the dual memory packaging module also includes a cooling mechanism. The cooling mechanism is used to reduce the temperature of the first memory bar 221 and the second memory bar 222. In this way, since the first memory bar 221 and the second memory bar 222 generate heat seriously due to a small spacing, the heat generated by the first memory bar 221 and the second memory bar 222 is timely absorbed by the cooling mechanism, and the temperature of the first memory bar 221 and the second memory bar 222 is reduced, thereby ensuring that the performance of the first memory bar 221 and the second memory bar 222 is not affected.

In one embodiment, the specific cooling method of the cooling mechanism 240 includes but is not limited to liquid cooling, air cooling or other cooling methods.

With the booming development of artificial intelligence, cloud computing and big data technologies, actual businesses are placing higher and higher demands on the computing power of the underlying hardware infrastructure. The improvement in performance directly leads to the continuous increase in server power consumption, and the overall power consumption and heat generation have increased significantly. The traditional air cooling mode is gradually approaching the heat dissipation limit and faces a bottleneck in high-power computing chips. The liquid cooling mode with more outstanding heat conduction capabilities is gradually showing its necessity in data centers.

Research has found that the heat dissipation problem of the dual memory packaging module has also become prominent. Air cooling technology can no longer meet the heat dissipation requirements of the packaging design. Therefore, liquid cooling technology with more outstanding thermal conductivity will gradually be applied to the dual memory packaging module.

Optionally, the cooling mechanism in this embodiment is specifically a liquid cooling mechanism 240 based on liquid cooling technology. The liquid cooling mechanism 240 includes a heat exchange housing 240a, the heat exchange housing 240a is in contact with the first memory bar and/or the second memory bar, and the heat exchange housing 240a is provided with a liquid flow channel, a liquid inlet 2411 and a liquid outlet 2412. The liquid flow channel is connected to a cooling liquid supply mechanism (not shown in the figure) through the liquid inlet 2411, and is connected to a liquid recovery mechanism (not shown in the figure) through the liquid outlet 2412.

Among them, liquid cooling technology refers to directly cooling the equipment through low-temperature liquid. The liquid directly takes away the heat generated by the heating elements of the equipment. This type of liquid cooling can achieve natural heat dissipation of servers and other equipment. Compared with traditional air cooling systems, it is more efficient and energy-saving.

Among them, liquid cooling technology can be divided into three categories: immersion type, spray type, and cold plate liquid cooling.

Immersion type: directly immerse the heat generating components in the coolant, and rely on the circulation of the liquid to remove the heat generated by the operation of the server and other equipment. Immersion liquid cooling is divided into two-phase liquid cooling and single-phase liquid cooling, and the heat dissipation method can be in the form of dry cooler and cooling tower.

Spray type: Allow non-corrosive coolant to pass directly through the spray plate on the top of the server chassis and spray onto the surface of the heat-generating device or the extended surface in contact with it. The absorbed heat is transferred and exchanged with the external environment of the large cooling source to achieve the target temperature of the control system.

Cold plate type: As the medium for intermediate heat transfer, the working fluid is separated from the object to be cooled and has no direct contact with the electronic devices. High-efficiency heat conduction components such as liquid cold plates are fixed on the main heater to transfer the heat of the object to be cooled to the refrigerant for cooling.

Please refer to Figures 9 to 11. In one embodiment, the heat exchange housing includes at least one heat exchange sub-shell 241. The heat exchange sub-shell 241 is in contact with the first memory bar 221 and/or the second memory bar 222 respectively. The inlet of the heat exchange sub-shell 241 is connected to the liquid inlet 2411, and the outlet of the heat exchange sub-shell 241 is connected to the liquid outlet 2412. In this way, the cooling liquid providing mechanism produces the cooling liquid and inputs the cooling liquid into the liquid flow channel through the liquid inlet 2411. During the flow of the cooling liquid in the liquid flow channel, the cooling liquid exchanges heat with the first memory bar 221 and the second memory bar 222 through the heat exchange sub-shell 241, which can reduce the temperature of the first memory bar 221 and the second memory bar 222 accordingly, and then is discharged to the liquid recovery mechanism through the liquid outlet 2412. That is, during the flow of the cooling liquid from the liquid inlet 2411 to the liquid outlet 2412, the purpose of rapid heat dissipation is achieved.

Please refer to Figures 9 to 11. In one embodiment, the heat exchange sub-shell 241 includes at least two heat exchange tube shells 2413 connected in parallel between the liquid inlet 2411 and the liquid outlet 2412. In this way, when the heat dissipation is working, the cooling liquid enters through the liquid inlet 2411 and enters the at least two heat exchange tube shells 2413 respectively, and is output from the at least two heat exchange tube shells 2413 to the liquid outlet 2412 and discharged outward. In other words, the at least two heat exchange tube shells 2413 play a diversion and guiding role, and can guide the cooling liquid of the liquid inlet 2411 to the liquid outlet 2412 respectively. When the cooling liquid flows inside, the at least two heat exchange tube shells 2413 are in contact with different positions of the first memory bar 221 and the second memory bar 222 respectively, and have a good heat dissipation effect.

Specifically, the number of heat exchange tube shells 2413 includes but is not limited to two, three, four, five or other numbers. The specific number can be flexibly adjusted and set according to actual needs and is not limited here. In this embodiment, the number of heat exchange tube shells 2413 is specifically three.

Referring to FIGS. 9 to 11 , in one embodiment, the heat exchange sub-shell 241 further includes a liquid inlet pipe 2414 and a liquid outlet pipe 2415. The liquid inlet pipe 2414 is connected to the liquid inlet 2411, and the liquid inlet pipe 2414 is also connected to one end of at least two heat exchange tube shells 2413. The liquid outlet pipe 2415 is connected to the liquid outlet 2412, and the liquid outlet pipe 2415 is also connected to the other end of at least two heat exchange tube shells 2413.

Optionally, the cross-sectional shape of the heat exchange shell 2413 along the liquid flow direction thereof includes, but is not limited to, regular and irregular shapes such as square, circle, ellipse, triangle, pentagon, etc. In this embodiment, the cross-sectional shape of the heat exchange shell 2413 is, for example, square, so that the heat exchange shell 2413 can be in surface contact with the first memory bar 221 and the second memory bar 222, thereby ensuring a better heat conduction effect.

It should be noted that the “liquid inlet pipe 2414 and liquid outlet pipe 2415” can be a part of the “heat exchange shell 2413”, that is, the “liquid inlet pipe 2414 and liquid outlet pipe 2415” and the “other parts of the heat exchange shell 2413” are integrally formed; or they can be integrally formed with the “heat exchange shell 2413”. The “other parts” of the heat exchange shell and tube 2413 are an independent component that can be separated, that is, the “liquid inlet pipe 2414 and the liquid outlet pipe 2415” can be manufactured independently and then combined with the “other parts of the heat exchange shell and tube 2413” into a whole.

9 to 11 , in one embodiment, the heat exchange sub-shell 241 extends from one side of the first memory bar 221 or the second memory bar 222 to the other side. The contact area between the heat exchange sub-shell 241 and the first memory bar 221 and the second memory bar 222 is as large as possible, which is conducive to dissipating the heat of the first memory bar 221 and the second memory bar 222.

Please refer to Figures 9 to 11. In one embodiment, three heat exchange sub-shells 241 are provided, and are arranged in sequence to form two spacing spaces. The first memory bar 221 and the second memory bar 222 are respectively arranged in the two spacing spaces. In this way, the two opposite sides of the first memory bar 221 are respectively in contact with the heat exchange sub-shell 241, which has a better heat dissipation effect; the two opposite sides of the second memory bar 222 are respectively in contact with the heat exchange sub-shell 241, which has a better heat dissipation effect.

In one embodiment, the heat exchange sub-shell 241 is connected to the first memory bar 221 or the second memory bar 222 through thermal conductive silicone grease. In this way, the thermal conductive silicone grease has good thermal conductivity and can help to achieve rapid heat dissipation of the first memory bar 221 and the second memory bar 222.

Please refer to FIG. 9 to FIG. 11 . In one embodiment, the dual memory package module further includes a heat preservation shell 250. The liquid cooling mechanism 240, the first memory bar 221 and the second memory bar 222 are arranged inside the heat preservation shell 250. The third gold finger of the first memory bar 221 penetrates the heat preservation shell 250 and extends to the outside of the heat preservation shell 250. The fourth gold finger of the second memory bar 222 penetrates the heat preservation shell 250 and extends to the outside of the heat preservation shell 250. The heat preservation shell 250 is also provided with a first opening 251 corresponding to the liquid inlet 2411 and a second opening 252 corresponding to the liquid outlet 2412. In this way, the heat preservation shell 250 protects the first memory bar 221, the second memory bar 222 and the liquid cooling mechanism 240, and plays a heat preservation role, so as to prevent the cold of the liquid cooling mechanism 240 from spreading to the environment, thereby ensuring the cooling effect of the liquid cooling mechanism 240 on the first memory bar 221 and the second memory bar 222.

Please refer to FIG. 2 to FIG. 5 . In one embodiment, a server includes the memory packaging module of any one of the above embodiments. The server also includes a memory slot, and the insertion portion 213 is inserted into the memory slot.

In the above server, the first memory bar 221 and the second inner layer bar are respectively inserted into the first groove 211 and the second groove 212, and the third gold fingers on the two opposite side walls of the first memory bar 221 are respectively electrically connected to the first conductive member 2111 and the second conductive member 2112, and the fourth gold fingers on the two opposite side walls of the second memory bar 222 are respectively electrically connected to the third conductive member 2121 and the fourth conductive member 2122; the inserting portion 213 is inserted into the memory slot of the server. In particular, since the first conductive member 2111 is electrically connected to the first gold finger 2131 through the first electrical connector 231, the second conductive member 2112 is electrically connected to the second gold finger 2132 through the second electrical connector 232, the third conductive member 2121 is electrically connected to the first gold finger 2131 through the third electrical connector 233, and the fourth conductive member 2122 is electrically connected to the second gold finger 2132 through the fourth electrical connector 234. The lengths of the first electrical connector 231, the second electrical connector 232, the third electrical connector 233 and the fourth electrical connector 234 are all the same. Therefore, the signal lines on the first memory bar 221 and the second memory bar 222 have the same routing length, thereby ensuring the consistency of the signal quality on the first memory bar 221 and the second memory bar 222. Since the influence of reflection is eliminated, the overall performance of the system is improved.

The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

The above embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the disclosed patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the disclosed patent shall be subject to the attached claims.

In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present disclosure, "plurality" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

In the present disclosure, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

Claims (16)

1. A connector, comprising:

   A body (210), wherein the body (210) is provided with a first groove (211) and a second groove (212) which are arranged at a relative interval; a conductive member electrically connected to the memory bar is respectively provided on the side walls of the first groove (211) and the second groove (212);

   The main body (210) is further provided with an insertion portion (213), and two opposite sides of the insertion portion (213) are respectively provided with gold fingers;

   The conductive member of the first groove (211) and the conductive member of the second groove (212) are respectively electrically connected to the gold finger through electrical connectors;

   The lengths of the electrical connectors are the same.
2. The connector according to claim 1, wherein the conductive member of the first groove (211) comprises at least one first conductive member (2111) arranged on one of the side walls of the first groove (211), and a second conductive member (2112) on another opposite side wall and arranged opposite to the first conductive member (2111); the conductive member of the second groove (212) comprises at least one third conductive member (2121) arranged on one of the side walls of the second groove (212), and a fourth conductive member (2122) on another opposite side wall and arranged opposite to the third conductive member (2121); the gold finger comprises at least one first gold finger arranged on one side of the insertion portion (213), and at least one second gold finger on another opposite side; each The electrical connector comprises a first electrical connector (231), a second electrical connector (232), a third electrical connector (233) and a fourth electrical connector (234); the first conductive member (2111) is electrically connected to the first gold finger via the first electrical connector (231), the second conductive member (2112) is electrically connected to the second gold finger via the second electrical connector (232), the third conductive member (2121) is electrically connected to the first gold finger via the third electrical connector (233), and the fourth conductive member (2122) is electrically connected to the second gold finger via the fourth electrical connector (234); the first electrical connector (231), the second electrical connector (232), the third electrical connector (233) and the fourth electrical connector (234) are all of the same length.
3. The connector according to claim 2, wherein the first electrical connector (231), the second electrical connector (232), the third electrical connector (233), and the fourth electrical connector (234) are all configured in a plate shape, and the widths of the first electrical connector (231), the second electrical connector (232), the third electrical connector (233), and the fourth electrical connector (234) are the same and defined as W; the first electrical connector (231) and the second electrical connector (232) are projected onto a reference plane parallel to the side of the insertion portion (213), and the spacing between the projections of the first electrical connector (231) and the second electrical connector (232) on the reference plane is defined as S, S≧W.
4. The connector according to any one of claims 1 to 3, wherein the conductive member of the first groove (211) comprises protrusions (215) facing each other.
5. The connector according to any one of claims 1 to 4, wherein the conductive member of the second groove (212) comprises protrusions (215) facing each other.
6. The connector according to any one of claims 1 to 5, wherein the conductive members are each independently configured as a conductive spring sheet.
7. According to any one of claims 2 to 6, the connector, wherein the body (210) is further provided with a main body portion (214) connected to the insertion portion (213); the main body portion (214) is provided with a first surface and a second surface opposite to each other, the first groove (211) and the second groove (212) are formed on the first surface, and the insertion portion (213) is connected to the middle part of the second surface; the first electrical connector (231), the second electrical connector (232), the third electrical connector (233) and the fourth electrical connector (234) are each respectively arranged through the inside of the body (210).
8. According to the connector of claim 7, wherein the first electrical connector (231) is arranged in parallel with the second electrical connector (232); the third electrical connector (233) is arranged in parallel with the fourth electrical connector (234); the first electrical connector (231) and the third electrical connector (233) are arranged symmetrically about the first gold finger axis; the second electrical connector (232) and the fourth electrical connector (234) are arranged symmetrically about the second gold finger axis; the first groove (211) and the second groove (212) are arranged symmetrically about the central axis of the insertion portion (213).
9. The connector according to any one of claims 1 to 8, wherein the gold finger at the end of the insertion portion (213) is trimmed.
10. A dual memory packaging module, comprising a connector as claimed in any one of claims 1 to 9, and further comprising a first memory bar (221) and a second memory bar (222); the first memory bar (221) and the second memory bar (222) are locked and fixed to each other by at least one fastener (223).
11. According to the dual memory packaging module of claim 10, the dual memory packaging module further comprises a liquid cooling mechanism (240); the liquid cooling mechanism (240) is used to reduce the temperature of the first memory bar (221) and the second memory bar (222); the liquid cooling mechanism (240) comprises a heat exchange housing (240a), the heat exchange housing (240a) is in contact with a group selected from the first memory bar (221) and the second memory bar (222), the heat exchange housing (240a) is provided with a liquid flow channel, a liquid inlet (2411) and a liquid outlet (2412), the liquid flow channel is connected to a cooling liquid supply mechanism through the liquid inlet (2411), and is connected to a liquid recovery mechanism through the liquid outlet (2412).
12. The dual memory packaging module according to claim 11, wherein the heat exchange housing (240a) comprises at least one heat exchange sub-housing (241); The heat exchange sub-shell (241) is respectively in contact with a group selected from the first memory bar (221) and the second memory bar (222); the inlet of the heat exchange sub-shell (241) is connected to the liquid inlet (2411); and the outlet of the heat exchange sub-shell (241) is connected to the liquid outlet (2412).
13. The dual memory packaging module according to claim 12, wherein the heat exchange sub-shell (241) comprises at least two heat exchange tube shells (2413) connected in parallel between the liquid inlet (2411) and the liquid outlet (2412).
14. According to the dual memory packaging module of claim 12, wherein the heat exchange sub-shells (241) are arranged in three numbers and are arranged in sequence to form two separation spaces; the first memory bar (221) and the second memory bar (222) are respectively arranged in the two separation spaces.
15. The dual memory packaging module according to claim 12, wherein the dual memory packaging module further comprises a heat-insulating shell (250), the liquid cooling mechanism (240), the first memory bar (221) and the second memory bar (222) are arranged inside the heat-insulating shell (250); the heat-insulating shell (250) is also provided with a first opening (251) arranged corresponding to the liquid inlet (2411), and a second opening (252) arranged corresponding to the liquid outlet (2412).
16. A server, comprising the memory packaging module according to any one of claims 10 to 15, and further comprising a memory slot, wherein the insertion portion (213) is inserted into the memory slot.