WO2023282027A1 - 基板用コネクタおよび機器 - Google Patents
基板用コネクタおよび機器 Download PDFInfo
- Publication number
- WO2023282027A1 WO2023282027A1 PCT/JP2022/024297 JP2022024297W WO2023282027A1 WO 2023282027 A1 WO2023282027 A1 WO 2023282027A1 JP 2022024297 W JP2022024297 W JP 2022024297W WO 2023282027 A1 WO2023282027 A1 WO 2023282027A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- outer conductor
- housing
- spring
- board connector
- mounting
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 6
- 239000004020 conductor Substances 0.000 claims abstract description 139
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000013011 mating Effects 0.000 description 17
- 238000000034 method Methods 0.000 description 11
- 230000002093 peripheral effect Effects 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6596—Specific features or arrangements of connection of shield to conductive members the conductive member being a metal grounding panel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/514—Bases; Cases composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/7052—Locking or fixing a connector to a PCB characterised by the locating members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2103/00—Two poles
Definitions
- the present disclosure relates to board connectors and devices.
- a board connector attached to a circuit board for example, a board connector described in JP-A-2020-109738 is known.
- This board connector includes a connector housing attached to a circuit board, an outer conductor attached to the connector housing, a dielectric accommodated inside the outer conductor, and an inner conductor accommodated inside the dielectric. have.
- the circuit board is housed within the housing.
- the housing includes a box-shaped lower case that opens upward, and an upper case that is assembled to the lower case from above and closes the opening of the lower case.
- the circuit board is first fixed to the lower case, the upper case is assembled from above the lower case, and the lower case and upper case are fixed to form the housing. At this time, the hole edge of the lower recess provided in the lower case is brought into contact with the outer surface of the outer conductor, and the hole edge of the upper recess provided in the upper case is brought into contact with the outer surface of the outer conductor. Thereby, the outer conductor and the housing are electrically connected.
- ground spring By the way, when connecting the outer conductor and the housing, it may be desired to connect via a ground spring as necessary. However, since the ground spring cannot be retrofitted in the board connector, the ground spring cannot be used.
- the technology disclosed in this specification has been perfected based on the above circumstances, and aims to provide a board connector and equipment that can be retrofitted with a ground spring.
- a board connector of the present disclosure is a board connector to be attached to a circuit board, and is a housing having a hood portion that opens forward and a rear wall that is provided on the opposite side of the front end portion where the hood portion opens.
- an outer conductor penetrating through the rear wall and fixed to the housing; an insulating dielectric disposed inside the outer conductor; an inner conductor disposed inside the dielectric; a ground spring connected to a conductor, the outer conductor having a flange disposed along the rear wall of the housing, the ground spring interposed between the rear wall and the flange.
- a board connector having a mounting piece.
- FIG. 1 is a perspective view showing a board connector of Embodiment 1.
- FIG. FIG. 2 is an exploded perspective view of the board connector.
- FIG. 3 is a perspective view showing the board connector before attaching the ground spring.
- FIG. 4 is a cross-sectional view showing a state in which the mounting piece is accommodated inside the locking recess.
- FIG. 5 is a cross-sectional view showing a state in which the holding spring is in elastic contact with the flange from behind.
- FIG. 6 is a cross-sectional view showing a state in which the dielectric is held by the outer conductor.
- FIG. 7 is a plan view of the board connector with the ground spring removed.
- FIG. 8 is a side view of the board connector with the ground spring removed.
- FIG. 1 is a perspective view showing a board connector of Embodiment 1.
- FIG. 2 is an exploded perspective view of the board connector.
- FIG. 3 is a perspective view showing the board connector before attaching the ground spring.
- FIG. 9 is a vertical cross-sectional view showing a housing electrically connected to an outer conductor via an earth spring.
- FIG. 10 is a cross-sectional view showing a housing electrically connected to an outer conductor via a ground spring.
- FIG. 11 is a perspective view showing a board connector of Embodiment 2.
- FIG. 12 is a perspective view showing the board connector before attaching the ground spring.
- FIG. 13 is a vertical cross-sectional view showing a housing electrically connected to an outer conductor via an earth spring.
- the board connector of the present disclosure includes: (1) A board connector mounted on a circuit board, the housing having a hood portion opening forward and having a rear wall provided on the opposite side to the front end portion where the hood portion opens; an outer conductor fixed to the housing by penetrating through, an insulating dielectric disposed inside the outer conductor, an inner conductor disposed inside the dielectric, and the outer conductor connected to the a ground spring, the outer conductor having a flange disposed along the rear wall of the housing, the ground spring having a mounting piece inserted between the rear wall and the flange; This is a board connector.
- a device includes a board connector, a circuit board to which the board connector is attached, and a metal body in which the circuit board is accommodated and electrically connected to the outer conductor via the ground spring.
- a device comprising a housing made of Since the ground spring has a mounting piece inserted between the rear wall of the housing and the flange of the outer conductor, the ground spring can be retrofitted to the board connector mounted on the circuit board.
- the outer conductor and the metal housing can be electrically connected via the ground spring, the connection state is stabilized and the shielding performance can be improved.
- the ground spring includes a gate-shaped mounting body and a plurality of connection springs protruding forward from a front edge of the mounting body, and the mounting piece is provided at the rear of the mounting body. It is preferable that it protrudes inward from the edge. Since the mounting main body has a gate shape, the earth spring can be mounted on the substrate connector from above or from the side, and the mounting piece can be inserted between the rear wall and the flange. Since the connection spring protrudes forward from the front edge of the mounting body, the connection spring can be brought into contact with the housing from the rear.
- the mounting main body includes a pair of arms and a connecting portion that connects the pair of arms, and the plurality of connection springs are connected between the pair of arms and the connecting portion. It is preferable to provide a plurality of each of both or one of them. A plurality of connection springs are provided on both or either one of the pair of arms and the connecting part, so the shield can be connected to the housing in a multi-contact state, further improving the shielding performance. can be made
- the flange has a locking recess that retains the ground spring when the mounting piece is accommodated therein. Since the ground spring is prevented from coming off by housing the mounting piece inside the engaging recess, the mounting state of the ground spring to the outer conductor is stabilized.
- the ground spring has a retaining spring that elastically contacts the flange from behind.
- the earth spring is held and electrically connected to the outer conductor by elastically contacting the holding spring with the flange from the rear side, so that the connection state of the earth spring to the outer conductor is stabilized.
- the board connector 10 is attached to a circuit board 50 housed inside a device 60, as shown in FIGS.
- FIGS. the front-rear direction is based on the left-right direction in the figure, and the left side in the figure is the front. Also, with respect to a plurality of identical members, there are cases where only some members are given reference numerals and the reference numerals for other members are omitted.
- the device 60 includes a lower case 61 that opens upward and forward, an upper case 62 that is assembled to the lower case 61 from above and closes the upper opening of the lower case 61, and a lower case 62 that is assembled to the lower case 61 from the front. and a front panel 63 that closes the front opening of 61 .
- the lower case 61, upper case 62 and front panel 63 are made of conductive metal.
- the lower case 61, the upper case 62, and the front panel 63 are integrally assembled by a known method such as screwing, locking structure, or the like to form a housing 64.
- the housing 64 has a rectangular parallelepiped shape as a whole.
- the front panel 63 is provided with a connector insertion hole 65 through which a part of the board connector 10 is inserted.
- a front wall 66 forming the connector insertion hole 65 is a wall for shield connection with which an earth spring 40, which will be described later, elastically contacts from behind.
- a circuit board 50 is accommodated in the housing 64 .
- the circuit board 50 is fixed to the housing 64 by a known method such as screwing.
- the circuit board 50 is formed with a signal conductive path 53 through which signals are transmitted and a ground conductive path 54 by etching a copper foil using a known printed wiring technique.
- Conductive paths (not shown) formed by through-hole copper plating or the like are formed on the inner peripheral surfaces of the outer conductor through-holes 51 .
- a conductive path formed on the inner peripheral surface of the outer conductor through-hole 51 is electrically connected to the ground conductive path 54 .
- the conductive path formed on the surface of the inner conductor land 52 constitutes a part of the signal conductive path 53 .
- Electronic components (not shown) are connected to the signal conductive path 53 and the ground conductive path 54 on the circuit board 50 by a known method such as soldering.
- the board connector 10 includes a housing 11 attached to a circuit board 50, an outer conductor 20 attached to the housing 11, a dielectric 19 accommodated inside the outer conductor 20, and a dielectric It has an inner conductor 18 housed inside 19 and a ground spring 40 connected to the outer conductor 20 .
- the housing 11 is formed by injection molding an insulating synthetic resin.
- the housing 11 includes a hood portion 15 that opens forward and into which the mating connector 70 is fitted, a rear wall 30 provided on the opposite side of a front end portion (open end portion) 16 where the hood portion 15 opens, have.
- a locking portion 31 projecting downward is provided at the front edge (opening end) of the inner wall of the hood portion 15 .
- the lock portion 31 engages with a lock arm (not shown) provided on the mating connector 70 to hold the mating connector 70 in a fitted state inside the receptacle 15 .
- the rear wall 30 is located at the rear end of the housing 11 . As shown in FIG. 2, the rear wall 30 is larger than the receptacle 15 in the left-right direction and has the same size in the up-down direction. As shown in FIG. 9, a die-cut hole 32 is formed through the rear wall 30 in the front-rear direction at a position behind the lock portion 31 to form the lock portion 31 when the housing 11 is injection-molded. ing. An outer conductor mounting hole 34 through which the outer conductor 20 is inserted is formed through the rear wall 30 below the punched hole 32 in the front-rear direction. The inner peripheral surface of the outer conductor mounting hole 34 has a rectangular shape with rounded corners when viewed from the rear.
- a plurality of (four in this embodiment) outer conductor guide holes 36 are provided around the outer conductor mounting hole 34 in the rear wall 30 .
- the outer conductor guide hole 36 is a recess with a bottom, and is formed by recessing a portion of the rear wall 30 forward.
- the inside of the outer conductor mounting hole 34 and the inside of the outer conductor guide hole 36 communicate with each other.
- the outer conductor 20 is made of a conductive metal.
- any metal such as copper, copper alloy, zinc, aluminum, and aluminum alloy can be appropriately selected.
- the outer conductor 20 is formed by known techniques such as casting, die casting, and cutting.
- the outer conductor 20 is in electrical contact with a mating outer conductor (not shown) accommodated in the mating connector 70 .
- the outer conductor 20 includes a cylindrical portion 21 extending in the front-rear direction and having a cylindrical shape, a dielectric enclosing portion 22 extending rearward from the rear edge of the cylindrical portion 21, and a boundary portion between the cylindrical portion 21 and the dielectric enclosing portion 22. and a flange 23 that protrudes in a direction intersecting the front-rear direction.
- a dielectric holding portion 22A for holding the dielectric 19 inside is provided at a boundary portion between the cylindrical portion 21 and the dielectric enclosing portion 22 so as to open in the front-rear direction.
- the inner wall of the dielectric holding portion 22A is provided with a plurality of retaining protrusions 22B that bite into the dielectric 19 to prevent the dielectric from coming off backward.
- the outer peripheral surface of the cylindrical portion 21 has a rectangular shape with rounded corners when viewed from the front.
- the outer peripheral shape of the cylindrical portion 21 is set to have substantially the same size as the inner peripheral shape of the outer conductor mounting hole 34 of the rear wall 30 . As a result, the cylindrical portion 21 can be press-fitted into the outer conductor mounting hole 34 from behind.
- the dielectric enclosing part 22 has a gate shape opening downward when viewed from the rear.
- the dielectric 19 is housed inside the dielectric enclosing portion 22 while being surrounded by the dielectric enclosing portion 22 from above, from the left side, and from the right side.
- a plurality of (four in the embodiment) substrate connecting portions 24 projecting downward are provided at the lower end of the dielectric enclosing portion 22 .
- the board connecting portion 24 is inserted into the outer conductor through hole 51 of the circuit board 50 and connected to a conductive path formed on the inner surface of the outer conductor through hole 51 by a known technique such as soldering.
- soldering As a result, the outer conductor 20 is electrically connected to the ground conductive path 54 formed on the circuit board 50 .
- the dielectric 19 is formed by injection molding an insulating synthetic resin.
- the dielectric 19 is generally formed to have an L-shaped cross section.
- the dielectric 19 has an inner conductor accommodating chamber 27 capable of accommodating the inner conductor 18 therein.
- the inner conductor accommodating chamber 27 is formed so as to pass through the dielectric 19 in the front-rear direction and also open on the lower surface side.
- the inner conductor 18 is made of a conductive metal. As the metal forming the inner conductor 18, any metal such as copper, copper alloy, aluminum, aluminum alloy, etc. can be appropriately selected. The inner conductor 18 is formed by a known technique such as press working or cutting. The inner conductor 18 is electrically connected to a mating inner conductor (not shown) accommodated in the mating connector 70 .
- the inner conductor 18 is formed by bending a tab-shaped metal plate halfway.
- the inner conductor 18 is bent in a stepped shape as a whole by being bent twice.
- the inner conductor 18 includes a terminal connection portion 28 connected to a mating inner conductor (not shown) and a board connection portion 29 connected to the inner conductor land 52 of the circuit board 50 .
- the terminal connection portion 28 has a shape extending in the front-rear direction and protrudes forward beyond the front end of the dielectric 19 .
- the substrate connecting portion 29 is in a slightly inclined posture compared to the terminal connecting portion 28, and has a shape extending downward toward the rear. Therefore, the board connecting portion 29 is surface-mounted to the inner conductor land 52 by soldering, thereby being electrically connected to the signal conducting path 53 of the circuit board 50 .
- the earth spring 40 is made of a conductive metal plate. Any metal such as copper, a copper alloy, aluminum, an aluminum alloy, or the like can be appropriately selected as the metal forming the earth spring 40 .
- the earth spring 40 is formed by a known method such as press working, cutting work, or the like.
- the ground spring 40 can be retrofitted to the outer conductor 20 .
- the retrofit means that the ground spring 40 can be attached to the outer conductor 20 after the board connector 10 is mounted on the circuit board 50 before the ground spring 40 is attached.
- the earth spring 40 includes a gate-shaped mounting body portion 41 and a plurality of connection springs 42 projecting forward from the front edge of the mounting body portion 41 .
- the mounting main body 41 includes a pair of arm portions 44 arranged in parallel with each other at a predetermined interval in the left-right direction, and a connecting portion 45 connecting the base ends of the pair of arm portions 44 to each other.
- connection springs 42 are provided on each of the one arm portion 44 , the other arm portion 44 , and the connecting portion 45 .
- a pair of vertically elongated rectangular mounting pieces 46 protrude inward.
- One mounting piece 46 projects toward the other mounting piece 46
- the other mounting piece 46 projects toward one mounting piece 46 .
- the pair of mounting pieces 46 are arranged side by side in the left-right direction.
- the mounting piece 46 has a dimension equal to or less than half the vertical dimension of the arm portion 44 .
- the mounting piece 46 is provided on the arm portion 44 at a position near the connecting portion 45 .
- a holding spring 43 is provided at the rear edge of the connecting portion 45 .
- the holding spring 43 extends downward from the central portion of the connecting portion 45 and is formed in a mountain shape with the front side as the apex.
- the holding spring 43 is flexible and elastically contacts the rear surface of the flange 23 from behind when attached to the outer conductor 20 .
- a pair of mounting recesses 35 are provided on both left and right sides of the rear surface of the rear wall 30 of the housing 11 .
- the mounting recess 35 is formed by recessing the rear surface of the rear wall 30 forward.
- the mounting groove 33 is formed by the mounting recess 35 and the flange 23 .
- the mounting groove 33 is located between the rear wall 30 and the flange 23 and is open upward and laterally.
- the mounting groove 33 located on the left side in front view opens upward and leftward, and the mounting groove 33 located on the right side in front view opens upward and rightward.
- a pair of mounting pieces 46 of the earth spring 40 are inserted through the pair of mounting grooves 33 .
- the dimension of the mounting groove 33 in the front-rear direction is the same as or slightly larger than the plate thickness of the mounting piece 46 .
- the vertical dimension of the mounting groove 33 is approximately half the vertical dimension of the rear wall 30, and is formed from the upper end of the rear wall 30 to the central portion in the vertical direction.
- the pair of mounting pieces 46 are inserted into the pair of mounting grooves 33, respectively.
- the retaining spring 43 elastically contacts the flange 23 from behind, and the mounting piece 46 is fitted into the locking recess 26 from the front to close the locking recess 26 . (see FIG. 10).
- the upper edges of the pair of mounting pieces 46 move from below the upper edges of the pair of locking recesses 26.
- the earth spring 40 is held upwardly.
- the holding spring 43 is in elastic contact with the rear surface of the flange 23
- the upper connection spring 42 is in elastic contact with the front wall 66 of the front panel 63
- a pair of mounting pieces 46 are in elastic contact with the front surfaces of the pair of locking recesses 26 of the flange 23, and left and right connecting springs are attached to the front wall 66 of the front panel 63. 42 are in elastic contact. Therefore, since the conductive path from the flange 23 to the front panel 63 is constructed with the shortest distance, the shielding performance can be improved.
- a conductive path from the holding spring 43 of the ground spring 40 to the front wall 66 of the front panel 63 is branched into a plurality of branches by a plurality of connection springs 42, and a conductive path from each mounting piece 46 to the front wall 66 of the front panel 63 is also formed. , are branched by a plurality of connection springs 42 . In this way, since the ground spring 40 is connected to the front panel 63 with multiple contacts, the resistance at each contact is reduced, and the shielding performance can be further improved.
- the inner conductor 18 is inserted into the inner conductor accommodating chamber 27 of the dielectric 19 from behind. Subsequently, the inner conductor 18 is attached to the outer conductor 20 from behind. As a result, the portion of the dielectric 19 extending in the front-rear direction is press-fitted into the dielectric retaining portion 22A of the outer conductor 20, and the dielectric 19 is retained in a state of being retained by the retaining projection 22B. In this state, the terminal connecting portion 28 of the inner conductor 18 is housed inside the cylindrical portion 21 (see FIG. 9).
- the cylindrical portion 21 of the outer conductor 20 is inserted into the outer conductor mounting hole 34 of the housing 11 from behind, and the dielectric holding portion 22A is press-fitted into the outer conductor mounting hole 34 .
- the board connector 10 is completed, and the flange 23 is arranged along the rear wall 30 of the housing 11 .
- the board connector 10 is attached to the circuit board 50 from above.
- the board connecting portion 24 of the outer conductor 20 is inserted from above into the through hole 51 for outer conductor of the circuit board 50
- the board connecting portion 29 of the inner conductor 18 is inserted into the land 52 for inner conductor of the circuit board 50 . are placed from above and soldered to electrically connect them.
- the ground spring 40 is attached to the board connector 10 from above, and the pair of attachment pieces 46 are inserted into the pair of attachment grooves 33 from above.
- the holding spring 43 elastically contacts the flange 23 from behind, and the pair of mounting pieces 46 elastically contacts the pair of locking recesses 26 from the front. .
- the ground spring 40 is electrically connected to the outer conductor 20 at a plurality of points (three points in the embodiment).
- the circuit board 50 is fixed to the lower case 61 by screwing or the like.
- the upper case 62 is assembled from above the lower case 61
- the front panel 63 is assembled from the front of the lower case 61
- the lower case 61, upper case 62 and front panel 63 are fixed by screwing or the like.
- the housing 64 is formed, and the board connector 10 and the circuit board 50 are housed inside the housing 64 with the receptacle 15 passing through the connector insertion hole 65 .
- the front ends of the plurality of connection springs 42 are pressed against the front wall 66 of the front panel 63 from behind and come into elastic contact.
- the ground spring 40 is electrically connected to the housing 64 in a multi-contact state. Therefore, the outer conductor 20 is shield-connected to the housing 64 via the ground spring 40 .
- the outer conductor 20 is shield-connected to the housing 64 via a plurality of board connection portions 24 and the circuit board 50, but the shield connection by the ground spring 40 has a short distance to the housing 64. Since it is possible to elastically contact the housing 64, the connection state is stable and the shielding performance can be improved. That is, since the flange 23 is sandwiched between the holding spring 43 and the mounting piece 46, a sufficient contact pressure can be ensured and stable shield connection can be achieved.
- the board connector 10 and the mating connector 70 are mated.
- a lock arm (not shown) provided on the mating connector 70 engages the lock portion 31 .
- the mating connector 70 is held in the housing 11 in a retaining state.
- the inner conductor 18 of the board connector 10 is electrically connected to a mating inner conductor (not shown) of the mating connector 70 .
- the outer conductor 20 of the board connector 10 is electrically connected to the mating outer conductor (not shown) of the mating connector 70 .
- the board connector 10 of the present disclosure is a board connector 10 that is attached to a circuit board 50 and has a hood portion 15 that opens forward.
- a housing 11 having a rear wall 30; an outer conductor 20 passing through the rear wall 30 and fixed to the housing 11; an insulating dielectric 19 disposed inside the outer conductor 20; and a ground spring 40 connected to the outer conductor 20, the outer conductor 20 having a flange 23 disposed along the rear wall 30 of the housing 11, the ground spring 40 being connected to the rear wall 30 of the housing 11;
- a board connector 10 having a mounting piece 46 inserted between a wall 30 and a flange 23.
- the device 60 of the present disclosure includes the board connector 10, the circuit board 50 to which the board connector 10 is attached, and the circuit board 50, which is housed inside and electrically connected to the outer conductor 20 via the ground spring 40.
- a device 60 comprising a metal housing 64 that has been sealed. Since the ground spring 40 has a mounting piece 46 inserted between the rear wall 30 of the housing 11 and the flange 23 of the outer conductor 20, the ground spring 40 can be retrofitted to the board connector 10 mounted on the circuit board 50. . In addition, since the outer conductor 20 and the metal housing 64 can be electrically connected via the ground spring 40, the connection state is stable and the shielding performance can be improved.
- the ground spring 40 includes a gate-shaped mounting body portion 41 and a plurality of connection springs 42 projecting forward from the front edge of the mounting body portion 41 . is provided so as to protrude inward from the Since the mounting body 41 has a gate shape, the earth spring 40 can be mounted from above the board connector 10 and the mounting piece 46 can be inserted between the rear wall 30 and the flange 23 . Since the connection spring 42 protrudes forward from the front edge of the mounting body portion 41, the connection spring 42 can be brought into contact with the housing 64 from behind.
- the mounting body portion 41 includes a pair of arm portions 44 and a connecting portion 45 that connects the pair of arm portions 44 . are provided in multiple numbers. Since a plurality of connection springs 42 are provided on each of the pair of arm portions 44 and the connecting portion 45, the shield can be connected to the housing 64 in a multi-contact state, further improving the shield performance. can be made
- the flange 23 has a locking recess 26 that retains the ground spring 40 by accommodating the mounting piece 46 inside. Since the ground spring 40 is prevented from coming off by housing the mounting piece 46 inside the engaging recess 26 , the mounting state of the ground spring 40 to the outer conductor 20 is stabilized.
- the earth spring 40 has a retaining spring 43 that elastically contacts the flange 23 from behind.
- the earth spring 40 is held and electrically connected to the outer conductor 20 by elastically contacting the holding spring 43 with the flange 23 from behind, so that the connection state of the earth spring 40 to the outer conductor 20 is stable. do. That is, since the flange 23 is sandwiched between the holding spring 43 and the mounting piece 46, a sufficient contact pressure can be ensured and stable shield connection can be achieved.
- the board connector 210 is different from the board connector of the first embodiment in that the ground spring 240 can be attached later to the board connector 210 before the ground spring 240 is attached. 210 is different.
- the board connector 210 is attached to the circuit board 50 housed inside the device 260, as shown in FIG.
- the board connector 210 includes a housing 211 attached to the circuit board 50 , an outer conductor 220 attached to the housing 211 , a dielectric 19 accommodated inside the outer conductor 220 , and accommodated inside the dielectric 19 . It has an inner conductor 18 and a ground spring 240 connected to the outer conductor 220 .
- the ground spring 240 can be retrofitted to the outer conductor 220 .
- the retrofit means that the ground spring 240 can be attached to the outer conductor 220 after the board connector 210 is mounted on the circuit board 50 before the ground spring 240 is attached.
- the earth spring 240 includes a gate-shaped mounting body portion 241 and a plurality of connection springs 242 projecting forward from the front edge of the mounting body portion 241 .
- the mounting main body 241 includes a pair of arms 244 arranged in parallel with each other at a predetermined interval in the vertical direction, and a connecting portion 245 connecting the base ends of the pair of arms 244 to each other.
- connection springs 242 are provided on each of the one arm portion 244 and the other arm portion 244 .
- the connection spring 242 is not provided in the connecting portion 245 .
- a pair of rectangular mounting pieces 246 elongated in the left-right direction are provided on the rear edges of the pair of arm portions 244 so as to protrude inward.
- One attachment piece 246 protrudes toward the other attachment piece 246
- the other attachment piece 246 protrudes toward the one attachment piece 246 .
- the pair of mounting pieces 246 are arranged side by side in the vertical direction.
- the mounting piece 246 of this embodiment is formed over the entire length of the arm portion 244 so that the dimension in the width direction (the direction in which the arm portion 244 protrudes from the connecting portion 245) is longer than that of the mounting piece 46 of the first embodiment. is provided.
- a holding spring 243 is provided at the rear edge of the connecting portion 245 .
- the holding spring 243 extends laterally (in the mounting direction to the board connector 210) from the upper end portion of the connecting portion 245, and is formed in a mountain shape with the front side as the apex.
- the holding spring 243 is flexible and elastically contacts the rear surface of the flange 223 from behind when attached to the outer conductor 220 .
- the portion of the flange 223 with which the apex of the holding spring 243 contacts is formed as an engaging recess 226 recessed forward.
- a pair of mounting recesses 235 are provided on both upper and lower sides of the rear surface of the rear wall 230 of the housing 211 .
- the mounting recess 235 is formed by recessing the rear surface of the rear wall 230 forward.
- the mounting groove 233 is formed by the mounting recess 235 and the flange 223 .
- the mounting groove 233 is located between the rear wall 230 and the flange 223 and is open vertically and laterally.
- the mounting groove 233 located on the upper side when viewed from the front opens upward and to the right side, and the mounting groove 233 located on the lower side when viewed from the front opens downward and to the right side.
- a pair of mounting pieces 246 of the earth spring 240 are inserted through the pair of mounting grooves 233 .
- the dimension of the mounting groove 233 in the front-rear direction is set to be the same as or slightly larger than the plate thickness of the mounting piece 246 .
- the lateral dimension of the mounting groove 233 is approximately the same as the lateral dimension of the rear wall 30 and is formed from the right end to the left end of the rear wall 230 .
- the pair of mounting pieces 246 are inserted into the pair of mounting grooves 233, respectively.
- the retaining spring 243 elastically contacts the flange 223 from behind, and the mounting piece 246 is inserted into the mounting groove 233 and elastically contacts the front surface of the flange 223.
- the apex of the holding spring 243 is fitted in the engaging recess 226, the apex of the holding spring 243 is engaged with the upper edge of the engaging recess 226 from below, thereby preventing the ground spring 240 from coming off upward.
- the earth spring 240 is held in a laterally prevented state by engaging the apex of the holding spring 243 with the side edge of the engaging recess 226 from the side.
- a holding spring 243 is in elastic contact with the rear surface of the flange 223 , and upper and lower connection springs 242 are in elastic contact with the front wall 66 of the front panel 63 . Therefore, since the conductive path from the flange 223 to the front panel 63 is constructed with the shortest distance, the shielding performance can be improved.
- a conductive path from each mounting piece 246 to the front wall 66 of the front panel 63 is branched by a plurality of connection springs 242 .
- the ground spring 240 is connected to the front panel 63 with multiple contacts, so that the resistance at each contact is reduced and the shielding performance can be further improved.
- the ground spring 240 is attached to the board connector 210 .
- the ground spring 240 is laterally attached to the board connector 210 , and the pair of attachment pieces 246 are laterally inserted into the pair of attachment grooves 233 .
- the holding spring 243 elastically contacts the flanges 223 from behind, and the pair of mounting pieces 246 elastically contacts the front surfaces of the pair of flanges 223 from the front. .
- the ground spring 240 is electrically connected to the outer conductor 220 at a plurality of points (three points in the embodiment).
- the circuit board 50 is fixed to the lower case 61 by screwing or the like.
- the upper case 62 is assembled from above the lower case 61
- the front panel 63 is assembled from the front of the lower case 61
- the lower case 61, upper case 62 and front panel 63 are fixed by screwing or the like.
- the housing 64 is formed, and the board connector 210 and the circuit board 50 are housed inside the housing 64 with the receptacle 15 passing through the connector insertion hole 65 .
- the front ends of the plurality of connection springs 242 are pressed against the front wall 66 of the front panel 63 from behind and come into elastic contact.
- the earth spring 240 is electrically connected to the housing 64 in a multi-contact state. Therefore, the outer conductor 220 is shield-connected to the housing 64 via the ground spring 240 .
- the outer conductor 220 is shield-connected to the housing 64 via the plurality of board connection portions 24 and the circuit board 50, but the shield connection by the ground spring 240 has a short distance to the housing 64. Since it is possible to elastically contact the housing 64, the connection state is stable and the shielding performance can be improved. That is, since the flange 223 is sandwiched between the holding spring 243 and the mounting piece 246, a sufficient contact pressure can be secured and stable shield connection can be achieved.
- the mounting body portion 241 includes a pair of arm portions 244 and a connecting portion 245 that connects the pair of arm portions 244.
- a plurality of connection springs 242 are provided for each pair of arm portions 244. ing.
- connection springs 242 are provided for each pair of arm portions 244, they can be shield-connected to the housing 64 in a multi-contact state, and the shield performance can be further improved.
- connection springs 42 are provided on both the pair of arm portions 44 and the connection portion 45, but the connection springs may be provided only on the connection portion, or the connection springs may be provided only on the connection portion.
- a spring may be provided only on a pair of arms.
- the ground spring 240 is assembled from the right side as viewed from the front, but the ground spring may be assembled from the left side as viewed from the front.
- the rear surface of the flange 23 is formed flat, but as in the second embodiment, an engaging recess is provided in the rear surface of the flange, and the apex of the holding spring is fitted in the engaging recess. You can also include it. By doing so, the retaining spring is more difficult to come off from the flange.
- the earth spring is integrally constructed, but the earth spring may be constructed of a pair of halves.
- the ground spring may be formed into a pair of left and right half-split bodies, and each half-split body may be retrofitted to the board connector from both left and right sides.
- the number of inner conductors 18 may be one, or three or more.
- the outer conductor may be formed by pressing a metal plate.
- the housing and the outer conductor are fixed by press-fitting, but they may be fixed by heat caulking.
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- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
最初に本開示の実施態様を列記して説明する。
(1)回路基板に取り付けられる基板用コネクタであって、前方に開口するフード部を有し、前記フード部が開口する前端部と反対側に設けられた後壁を有するハウジングと、前記後壁を貫通して前記ハウジングに固定された外導体と、前記外導体の内部に配された絶縁性の誘電体と、前記誘電体の内部に配された内導体と、前記外導体に接続されるアースバネと、を備え、前記外導体は、前記ハウジングの前記後壁に沿って配されるフランジを有し、前記アースバネは、前記後壁と前記フランジとの間に挿入される取付片を有する、基板用コネクタである。
アースバネは、ハウジングの後壁と外導体のフランジとの間に挿入される取付片を有するから、回路基板に取り付けられた基板用コネクタに対してアースバネを後付けできる。また、アースバネを介して外導体と金属製の筐体とを電気的に接続できるから、接続状態が安定し、シールド性能を向上させることができる。
取付本体部は門形をなすから、基板用コネクタに対して上方もしくは側方からアースバネを取り付けでき、取付片を後壁とフランジとの間に挿入できる。接続バネは取付本体部の前縁から前方に突出しているから、接続バネを筐体に対して後方から接触させることができる。
複数の接続バネは、一対の腕部と連結部の双方またはいずれか一方に複数個ずつ設けられているから、筐体に対して多接点状態でシールド接続することができ、シールド性能をさらに向上させることができる。
取付片が係止凹部の内部に収容されることでアースバネが抜け止めされるから、アースバネの外導体に対する取付状態が安定する。
保持バネがフランジに対して後方から弾性的に接触することでアースバネが外導体に対して保持されるとともに電気的に接続されるから、アースバネの外導体に対する接続状態が安定する。
本開示の基板用コネクタ10および機器60の具体例を、図1から図10の図面を参照しつつ説明する。なお、本開示はこれらの例示に限定されるものではなく、特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。
本実施形態に係る基板用コネクタ10は、図9および図10に示すように、機器60の内部に収容された回路基板50に取り付けられる。図9において前後方向は図示左右方向を基準として図示左方を前方とし、上下方向は図示上下方向を基準とする。また、複数の同一部材については、一部の部材にのみ符号を付して、他の部材の符号を省略する場合がある。
図9に示すように、機器60は、上側と前側に開口するロアケース61と、ロアケース61に上方から組み付けられてロアケース61の上側開口を塞ぐアッパーケース62と、ロアケース61に前方から組み付けられてロアケース61の前側開口を塞ぐフロントパネル63と、を備える。ロアケース61とアッパーケース62とフロントパネル63とは、導電性を有する金属製である。ロアケース61とアッパーケース62とフロントパネル63とは、ネジ止め、ロック構造等の公知の手法により一体に組み付けられることにより、筐体64が形成される。筐体64が全体として直方体形状をなしている。
図9に示すように、基板用コネクタ10は、回路基板50に取り付けられるハウジング11と、ハウジング11に装着される外導体20と、外導体20の内部に収容される誘電体19と、誘電体19の内部に収容される内導体18と、外導体20に接続されるアースバネ40と、を有する。
ハウジング11は、絶縁性の合成樹脂を射出成形することにより形成される。ハウジング11は、前方に開口するとともに、相手側コネクタ70が内嵌されるフード部15と、フード部15が開口する前端部(開口端部)16と反対側に設けられた後壁30と、を有している。フード部15の内壁の前端縁(開口端部)には、下方に突出するロック部31が設けられている。ロック部31は、相手側コネクタ70に設けられたロックアーム(図示せず)と係止することにより、相手側コネクタ70をフード部15内に嵌合した状態に保持する。
図2に示すように、外導体20は、導電性を有する金属製である。外導体20を構成する金属としては、銅、銅合金、亜鉛、アルミニウム、アルミニウム合金等、任意の金属を適宜に選択できる。外導体20は、鋳造、ダイキャスト、切削加工等、公知の手法により形成される。外導体20は、相手側コネクタ70に収容された相手側外導体(図示せず)と電気的に接触する。
図2に示すように、誘電体19は、絶縁性の合成樹脂を射出成形することにより形成される。誘電体19は、概ね、断面L字状に形成されている。誘電体19は、内部に内導体18を収容可能な内導体収容室27を備える。図6に示すように、内導体収容室27は、誘電体19を前後方向に貫通するとともに、下面側にも開口して形成されている。
内導体18は、導電性を有する金属製である。内導体18を構成する金属としては、銅、銅合金、アルミニウム、アルミニウム合金等、任意の金属を適宜に選択できる。内導体18は、プレス加工、切削加工等、公知の手法により形成される。内導体18は、相手側コネクタ70に収容された相手側内導体(図示せず)と電気的に接続されるようになっている。
アースバネ40は、導電性を有する金属製の板金によって構成されている。アースバネ40を構成する金属としては、銅、銅合金、アルミニウム、アルミニウム合金等、任意の金属を適宜に選択できる。アースバネ40は、プレス加工、切削加工等、公知の手法により形成される。図3に示すように、アースバネ40は、外導体20に対して後付け可能とされている。後付けとは、アースバネ40が取り付けられる前の基板用コネクタ10が回路基板50に実装された後、アースバネ40を外導体20に対して取付可能であることを意味する。
図7および図8に示すように、ハウジング11の後壁30の後面における左右両側には、一対の取付凹部35が設けられている。取付凹部35は、後壁30の後面を前方に凹ませた形態とされている。ハウジング11と外導体20が組み付いた状態では、取付凹部35とフランジ23によって取付溝33が構成される。取付溝33は後壁30とフランジ23の間に位置するとともに、上方と側方に開口している。前面視で左側に位置する取付溝33は上方と左側方に開口し、前面視で右側に位置する取付溝33は上方と右側方に開口している。図3に示すように、一対の取付溝33にはアースバネ40の一対の取付片46が挿通される。
図9に示すように、フランジ23の後面には保持バネ43が弾性的に接触しており、フロントパネル63の前壁66には上側の接続バネ42が弾性的に接触している。また、図10に示すように、フランジ23の一対の係止凹部26の前面には一対の取付片46が弾性的に接触しており、フロントパネル63の前壁66には左右両側の接続バネ42が弾性的に接触している。したがって、フランジ23からフロントパネル63までの導電路は最短距離で構成されるため、シールド性能を向上させることができる。
続いて、本実施形態の基板用コネクタ10および機器60の組立方法の一例を説明する。基板用コネクタ10および機器60の組立方法は、以下の記載に限定されない。
本開示の基板用コネクタ10は、回路基板50に取り付けられる基板用コネクタ10であって、前方に開口するフード部15を有し、フード部15が開口する前端部16と反対側に設けられた後壁30を有するハウジング11と、後壁30を貫通してハウジング11に固定された外導体20と、外導体20の内部に配された絶縁性の誘電体19と、誘電体19の内部に配された内導体18と、外導体20に接続されるアースバネ40と、を備え、外導体20は、ハウジング11の後壁30に沿って配されるフランジ23を有し、アースバネ40は、後壁30とフランジ23との間に挿入される取付片46を有する、基板用コネクタ10である。
アースバネ40は、ハウジング11の後壁30と外導体20のフランジ23との間に挿入される取付片46を有するから、回路基板50に取り付けられた基板用コネクタ10に対してアースバネ40を後付けできる。また、アースバネ40を介して外導体20と金属製の筐体64とを電気的に接続できるから、接続状態が安定し、シールド性能を向上させることができる。
取付本体部41は門形をなすから、基板用コネクタ10に対して上方からアースバネ40を取り付けでき、取付片46を後壁30とフランジ23との間に挿入できる。接続バネ42は取付本体部41の前縁から前方に突出しているから、接続バネ42を筐体64に対して後方から接触させることができる。
複数の接続バネ42は、一対の腕部44と連結部45の双方に複数個ずつ設けられているから、筐体64に対して多接点状態でシールド接続することができ、シールド性能をさらに向上させることができる。
取付片46が係止凹部26の内部に収容されることでアースバネ40が抜け止めされるから、アースバネ40の外導体20に対する取付状態が安定する。
保持バネ43がフランジ23に対して後方から弾性的に接触することでアースバネ40が外導体20に対して保持されるとともに電気的に接続されるから、アースバネ40の外導体20に対する接続状態が安定する。すなわち、保持バネ43と取付片46によってフランジ23を挟持しているから、十分な接圧を確保でき、安定したシールド接続が可能になる。
本開示の基板用コネクタ210および機器260の具体例を、図11から図13の図面を参照しつつ説明する。以下の説明において実施形態1と同じ構成については、その説明を省略するものとし、実施形態1と対応する構成については、符号の数字部分に200を加えた符号を用いるものとする。
基板用コネクタ210は、図11および図12に示すように、アースバネ240を取り付ける前の基板用コネクタ210に対してアースバネ240を側方から後付けできるようにした点で、実施形態1の基板用コネクタ210とは異なる。基板用コネクタ210は、図13に示すように、機器260の内部に収容された回路基板50に取り付けられる。
基板用コネクタ210は、回路基板50に取り付けられるハウジング211と、ハウジング211に装着される外導体220と、外導体220の内部に収容される誘電体19と、誘電体19の内部に収容される内導体18と、外導体220に接続されるアースバネ240と、を有する。
図12に示すように、アースバネ240は、外導体220に対して後付け可能とされている。後付けとは、アースバネ240が取り付けられる前の基板用コネクタ210が回路基板50に実装された後、アースバネ240を外導体220に対して取付可能であることを意味する。
図12に示すように、ハウジング211の後壁230の後面における上下両側には、一対の取付凹部235が設けられている。取付凹部235は、後壁230の後面を前方に凹ませた形態とされている。図13の一部拡大図に示すように、ハウジング211と外導体220が組み付いた状態では、取付凹部235とフランジ223によって取付溝233が構成される。取付溝233は後壁230とフランジ223の間に位置するとともに、上下方向と側方に開口している。前面視で上側に位置する取付溝233は上方と右側方に開口し、前面視で下側に位置する取付溝233は下方と右側方に開口している。一対の取付溝233にはアースバネ240の一対の取付片246が挿通される。
図13に示すように、フランジ223の後面には保持バネ243が弾性的に接触しており、フロントパネル63の前壁66には上下両側の接続バネ242が弾性的に接触している。したがって、フランジ223からフロントパネル63までの導電路は最短距離で構成されるため、シールド性能を向上させることができる。
アースバネ240は基板用コネクタ210に対して取り付けられる。アースバネ240は基板用コネクタ210に対して側方から取り付けられ、一対の取付片246は一対の取付溝233に側方から挿入される。アースバネ240が正規の取付位置に至ると、保持バネ243がフランジ223に対して後方から弾性的に接触し、一対の取付片246が一対のフランジ223の前面に対して前方から弾性的に接触する。これにより、アースバネ240は外導体220に対して複数箇所(実施形態では3箇所)で電気的に接続される。
取付本体部241は、一対の腕部244と、一対の腕部244を連結する連結部245と、を備えて構成され、複数の接続バネ242は、一対の腕部244に複数個ずつ設けられている。
(1)実施形態1では接続バネ42が一対の腕部44と連結部45の双方に設けられているものを例示したが、接続バネが連結部のみに設けられているものでもよく、あるいは接続バネが一対の腕部のみに設けられているものでもよい。
20:外導体 21:筒部 22:誘電体包囲部 22A:誘電体保持部 22B:抜止突部 23:フランジ 24:基板接続部 26:係止凹部 27:内導体収容室 28:端子接続部 29:基板接続部
30:後壁 31:ロック部 32:型抜き孔 33:取付溝 34:外導体取付孔 35:取付凹部
40:アースバネ 41:取付本体部 42:接続バネ 43:保持バネ 44:腕部 45:連結部 46:取付片
50:回路基板 51:外導体用スルーホール 52:内導体用ランド 53:信号用導電路 54:グランド用導電路
60:機器 61:ロアケース 62:アッパーケース 63:フロントパネル 64:筐体 65:コネクタ挿通孔 66:前壁
70:相手側コネクタ
210:基板用コネクタ 211:ハウジング
220:外導体 223:フランジ 226:係合凹部
230:後壁 233:取付溝 235:取付凹部
240:アースバネ 241:取付本体部 242:接続バネ 243:保持バネ 244:腕部 245:連結部 246:取付片
260:機器
Claims (6)
- 回路基板に取り付けられる基板用コネクタであって、
前方に開口するフード部を有し、前記フード部が開口する前端部と反対側に設けられた後壁を有するハウジングと、
前記後壁を貫通して前記ハウジングに固定された外導体と、
前記外導体の内部に配された絶縁性の誘電体と、
前記誘電体の内部に配された内導体と、
前記外導体に接続されるアースバネと、を備え、
前記外導体は、前記ハウジングの前記後壁に沿って配されるフランジを有し、
前記アースバネは、前記後壁と前記フランジとの間に挿入される取付片を有する、基板用コネクタ。 - 前記アースバネは、門形をなす取付本体部と、前記取付本体部の前縁から前方に突出する複数の接続バネと、を備えて構成され、前記取付片は前記取付本体部の後縁から内方に突出して設けられている、請求項1に記載の基板用コネクタ。
- 前記取付本体部は、一対の腕部と、前記一対の腕部を連結する連結部と、を備えて構成され、前記複数の接続バネは、前記一対の腕部と前記連結部の双方またはいずれか一方に複数個ずつ設けられている、請求項2に記載の基板用コネクタ。
- 前記フランジは、前記取付片が内部に収容されることで前記アースバネを抜け止めする係止凹部を有する、請求項1から請求項3のいずれか1項に記載の基板用コネクタ。
- 前記アースバネは、前記フランジに対して後方から弾性的に接触する保持バネを有する、請求項1から請求項4のいずれか1項に記載の基板用コネクタ。
- 請求項1から請求項5のいずれか1項に記載の基板用コネクタと、
前記基板用コネクタが取り付けられた回路基板と、
前記回路基板が内部に収容されるとともに、前記アースバネを介して前記外導体と電気的に接続された金属製の筐体と、を備えた機器。
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CN202280044739.5A CN117546374A (zh) | 2021-07-05 | 2022-06-17 | 基板用连接器及机器 |
US18/575,962 US20240322463A1 (en) | 2021-07-05 | 2022-06-17 | Board connector and device |
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JP2021111387A JP2023008100A (ja) | 2021-07-05 | 2021-07-05 | 基板用コネクタおよび機器 |
JP2021-111387 | 2021-07-05 |
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WO2023282027A1 true WO2023282027A1 (ja) | 2023-01-12 |
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PCT/JP2022/024297 WO2023282027A1 (ja) | 2021-07-05 | 2022-06-17 | 基板用コネクタおよび機器 |
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US (1) | US20240322463A1 (ja) |
JP (1) | JP2023008100A (ja) |
CN (1) | CN117546374A (ja) |
WO (1) | WO2023282027A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024190297A1 (ja) * | 2023-03-10 | 2024-09-19 | 株式会社オートネットワーク技術研究所 | シールドコネクタ |
WO2024190295A1 (ja) * | 2023-03-10 | 2024-09-19 | 株式会社オートネットワーク技術研究所 | シールドコネクタ |
Families Citing this family (1)
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JP7563325B2 (ja) | 2021-08-02 | 2024-10-08 | 住友電装株式会社 | コネクタ |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US6132253A (en) * | 1998-03-25 | 2000-10-17 | Hon Hai Precision Ind. Co., Ltd. | Connector having an auxiliary shielding device |
US7101189B1 (en) * | 2005-09-09 | 2006-09-05 | Hon Hai Precision Ind. Co., Ltd | Electrical connector for automotive with latch |
JP2015530724A (ja) * | 2012-10-04 | 2015-10-15 | タイコ・エレクトロニクス・コーポレイションTyco Electronics Corporation | ヘッダーアセンブリ |
JP2020109738A (ja) * | 2018-12-28 | 2020-07-16 | 株式会社オートネットワーク技術研究所 | 基板用コネクタ、及び機器 |
-
2021
- 2021-07-05 JP JP2021111387A patent/JP2023008100A/ja active Pending
-
2022
- 2022-06-17 CN CN202280044739.5A patent/CN117546374A/zh active Pending
- 2022-06-17 WO PCT/JP2022/024297 patent/WO2023282027A1/ja active Application Filing
- 2022-06-17 US US18/575,962 patent/US20240322463A1/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US6132253A (en) * | 1998-03-25 | 2000-10-17 | Hon Hai Precision Ind. Co., Ltd. | Connector having an auxiliary shielding device |
US7101189B1 (en) * | 2005-09-09 | 2006-09-05 | Hon Hai Precision Ind. Co., Ltd | Electrical connector for automotive with latch |
JP2015530724A (ja) * | 2012-10-04 | 2015-10-15 | タイコ・エレクトロニクス・コーポレイションTyco Electronics Corporation | ヘッダーアセンブリ |
JP2020109738A (ja) * | 2018-12-28 | 2020-07-16 | 株式会社オートネットワーク技術研究所 | 基板用コネクタ、及び機器 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2024190297A1 (ja) * | 2023-03-10 | 2024-09-19 | 株式会社オートネットワーク技術研究所 | シールドコネクタ |
WO2024190295A1 (ja) * | 2023-03-10 | 2024-09-19 | 株式会社オートネットワーク技術研究所 | シールドコネクタ |
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US20240322463A1 (en) | 2024-09-26 |
CN117546374A (zh) | 2024-02-09 |
JP2023008100A (ja) | 2023-01-19 |
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