WO2023276769A1

WO2023276769A1 - Scanner device and electrical inspection device

Info

Publication number: WO2023276769A1
Application number: PCT/JP2022/024632
Authority: WO
Inventors: 雅也椹木
Original assignee: 日本電産リード株式会社
Priority date: 2021-06-29
Filing date: 2022-06-21
Publication date: 2023-01-05
Also published as: CN117597587A; TW202300938A; KR20240026153A; JPWO2023276769A1

Abstract

[Problem] To provide a scanner device and electrical inspection device having reduced susceptibility to increases in size. [Solution] A scanner device 3 that is mounted in an electrical inspection device 1, the scanner device 3 comprising a first independent substrate 31 that is a board-shaped circuit board and extends in a first direction, a first common substrate 41 that is a board-shaped circuit board and is disposed in parallel with the first independent substrate 31, and a second common substrate 42 that is a board-shaped circuit board and electrically connects the first independent substrate 31 and first common substrate 41, wherein the X-direction length of the first common substrate 41 is longer than the X-direction length of the first independent substrate 31.

Description

Scanner device and electrical inspection device

The present invention relates to a scanner device that switches connection relationships between a plurality of probes and an inspection processing unit, and an electrical inspection device using the same.

Conventionally, a module substrate having a selection circuit is held substantially vertically by a connector on the opposite side of the substrate on which the contacts are provided, and a microcomputer controls the selection circuit to sequentially select the contacts for inspection. A so-called scanner device is known (see, for example, Patent Document 1).

Japanese Patent Publication No. 7-7038

By the way, in recent years, miniaturization of circuit boards, semiconductors, etc. to be inspected and an increase in circuit scale have been remarkable. Therefore, the number of inspection points with which probes are brought into contact is increasing. As the number of inspection points increases, the scanner device has to select among more inspection points, so the circuit scale of the selection circuit increases. As the circuit scale of the selection circuit increases, the size of the scanner device increases.　

SUMMARY OF THE INVENTION An object of the present invention is to provide a scanner device and an electrical inspection device that are difficult to increase in size.

A scanner device according to an example of the present invention is a scanner device mounted on an electrical inspection device, and includes a first independent board that is a plate-shaped circuit board extending in a first direction, and a plate-shaped circuit board, a first common substrate arranged in parallel with the first independent substrate; a second common substrate, which is a plate-like circuit substrate and electrically connects the first independent substrate and the first common substrate; wherein the length of the first common substrate in the first direction is longer than the length of the first independent substrate in the first direction.　

Further, a scanner device according to an example of the present invention is a scanner device that switches an electrical connection relationship with an inspection processing unit that performs an inspection based on an electric signal, and is formed in a plate shape extending in a predetermined first direction. an independent substrate group in which a plurality of first independent substrates are arranged in parallel in a second direction orthogonal to the first direction; a first common substrate in which one of the first independent substrates of the independent substrate group is arranged in parallel; A plate-shaped second common substrate electrically connected to the end surfaces of the plurality of first independent substrates and electrically connected to the plate-shaped surface of the first common substrate.　

Also, an electrical inspection apparatus according to an example of the present invention includes the scanner device described above.

A scanner device and an electrical inspection device having such a configuration are difficult to increase in size.

1 is a schematic diagram conceptually showing the configuration of an electrical inspection apparatus using a scanner device according to an embodiment of the present invention; FIG. 2 is a side view schematically showing the structure of

measurement units

2U and 2L shown in FIG. 1. FIG. 3 is a perspective view schematically showing an example of the configuration of the scanner device 3 shown in FIG. 2; FIG. 4 is a schematic side view of the scanner device 3 shown in FIG. 3 as seen from the -Y direction; FIG. FIG. 4 is a schematic side view of the scanner device 3 shown in FIG. 3 as seen from the −Z direction; FIG. 10 is an explanatory diagram for explaining the effect of the configuration of the scanner device 3 that makes it difficult to increase the size; FIG. 4 is a schematic perspective view showing a modification of the scanner device shown in FIG. 3;

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment according to the present invention will be described below with reference to the drawings. It should be noted that the same reference numerals in each figure indicate the same configuration, and the description thereof will be omitted. In each drawing, XYZ orthogonal coordinate axes are shown as appropriate to clarify the directional relationship. The X-axis corresponds to the vertical direction. An electrical inspection apparatus 1 shown in FIG. 1 is an apparatus for inspecting an object B to be inspected.　

The inspection object B may be, for example, a printed wiring board, a glass epoxy board, a flexible board, a ceramic multilayer wiring board, a package board for a semiconductor package, an interposer board, a film carrier, or the like. Electronic parts such as CSP (Chip Size Package) and semiconductor elements (IC: Integrated Circuit) may be used, and electrode plates for displays such as liquid crystal displays, EL (Electro-Luminescence) displays, touch panel displays, touch panels, etc. It may be an electrode plate or any other object as long as it is subject to electrical inspection.　

The electrical inspection apparatus 1 shown in FIG. 1 mainly includes

measuring units

2U and 2L, a fixing device 101, a moving mechanism 102, an inspection processing unit 20, and a housing 103 that accommodates them. The fixing device 101 is configured to fix the inspection object B at a predetermined position.　

The measurement unit 2U is positioned above the inspection object B fixed to the fixing device 101. As shown in FIG. The measurement unit 2L is positioned below the inspection object B fixed to the fixing device 101. As shown in FIG. The

measurement units

2U and 2L are provided with

measurement jigs

4U and 4L for bringing the probes Pr into contact with a plurality of conductive portions provided on the inspection object B. As shown in FIG.　

A plurality of probes Pr are attached to the

measuring jigs

4U and 4L. The

measurement jigs

4U and 4L arrange and hold a plurality of probes Pr so as to correspond to the arrangement of conductive portions (inspection points) to be measured provided on the surface of the inspection object B. FIG. The moving mechanism 102 appropriately moves the

measuring units

2U and 2L within the housing 103 according to a control signal from the inspection processing unit 20, and moves the probes Pr of the

measuring jigs

4U and 4L to respective inspection points of the inspection object B. make contact.　

In addition, the electrical inspection apparatus 1 may be configured to include only one of the

measurement units

2U and 2L.　

The inspection processing unit 20 includes, for example, a CPU (Central Processing Unit) that executes predetermined arithmetic processing, a RAM (Random Access Memory) that temporarily stores data, and a ROM (Read Only Memory) that stores a predetermined control program. ), HDD (Hard Disk Drive), and other peripheral circuits. Then, the inspection processing unit 20 inspects the inspection object B, for example, by executing a control program stored in the storage unit.　

The measurement unit 2U shown in FIG. 2 includes two

scanner devices

3, 3, a measurement jig 4U, an aluminum plate 21, and a wiring board 22. The

scanner devices

3, 3 are attached to the upper surface of the aluminum plate 21, and the wiring board 22 is laminated on the lower surface of the aluminum plate 21. As shown in FIG. A measurement jig 4U is attached to the lower surface of the wiring board 22 .　

The rear ends of the probes Pr of the measuring jig 4U are connected to the wiring board 22, and the

scanner devices

3, 3 are connected to the wiring board 22 through openings (not shown) formed in the aluminum plate 21. . The wiring board 22 is provided with wirings for connecting the probes Pr and the

scanner devices

3 , 3 . Thereby, each probe Pr and the

scanner devices

3, 3 are electrically connected.　

The measurement jig 4L is configured in substantially the same manner as the measurement jig 4U except that it is inverted upward (+X) and downward (-X), so the description thereof will be omitted. Hereinafter, the

measuring units

2U and 2L are collectively referred to as the measuring unit 2, and the

measuring jigs

4U and 4L are collectively referred to as the measuring jig 4.　

The measuring jig 4 and the

scanner devices

3, 3 are fixed by an aluminum plate 21. As shown in FIG. The moving mechanism 102 moves the entire measuring section 2 supported by the aluminum plate 21 when positioning the probe Pr at the inspection point of the inspection object B. As shown in FIG. Each of the

measuring jigs

4U and 4L has approximately 1000 to 20000 probes Pr.　

The scanner device 3 switches the electrical connection relationship with the inspection processing unit 20 that performs inspection based on electrical signals. The scanner device 3 includes a power supply circuit, a voltmeter, an ammeter, and the like for inspecting the inspection object B. FIG. Further, the scanner device 3 includes a switching circuit for switching the connection relationship between each probe Pr provided in the measuring jig 4 and the power supply circuit, voltmeter, ammeter, etc. according to a control signal from the inspection processing unit 20. I have. Therefore, several thousand, for example, 4096 probes Pr are electrically connected to one scanner device 3 via the wiring board 22 .　

The scanner device 3 and the inspection processing unit 20 are connected by a cable (not shown) or the like so that signals can be transmitted and received between each unit in the scanner device 3 and the inspection processing unit 20 . As a result, a measurement result obtained by a measuring circuit such as a voltmeter or an ammeter based on the signal obtained from the probe Pr selected by the switching circuit is transmitted to the inspection processing section 20 . That is, the scanner device 3 switches the probe Pr used for inspection among the plurality of probes Pr between the plurality of probes Pr and the inspection processing unit 20 .　

The scanner device 3 shown in FIGS. 3 and 4 includes an independent board group 33 , a second independent board 32 , a first common board 41 , a second common board 42 , a third common board 43 and a parallel board 51 . The independent board group 33 includes four first independent boards 31 . In addition, the number of the first independent substrates 31 included in the independent substrate group 33 is not limited to four, as long as the number is plural. In FIG. 3, the number of the first independent substrates 31 included in the independent substrate group 33 is four for the sake of simplicity of explanation, but the number of first independent substrates 31 is assumed to be about 32 in reality.　

The first independent board 31 is a circuit board having a substantially rectangular plate shape extending in the X direction (first direction). The plurality of first independent substrates 31 are arranged to face each other in the Y direction (second direction) orthogonal to the X direction and arranged in parallel. The −X side end of the first common substrate 41 is connected to the wiring substrate 22 by a connector (not shown) or the like. As a result, the wiring provided on the −X side end of the first common substrate 41 is electrically connected to the probe Pr through the wiring substrate 22 .　

For example, if the number of probes Pr connected to one scanner device 3 is 4096 and the number of first independent substrates 31 included in the independent substrate group 33 is 32, then 128 probes per first independent substrate 31 are electrically connected. A switching circuit, a so-called multiplexer, for selecting the probe Pr according to a control signal from the inspection processing section 20 is mounted on the first independent substrate 31 .　

When, for example, 128 probes Pr are connected to one first independent board 31, it is necessary to select any probe Pr from among the 128 probes Pr, and the probes Pr are connected to the first independent board 31. As the number of probes Pr mounted increases, the circuit scale of the switching circuit mounted on the first independent substrate 31 increases.　

The first common board 41 is a circuit board having a substantially rectangular plate shape extending in the X direction. The first common substrate 41 is arranged in parallel to face one of the plurality of first independent substrates 31, for example, the first independent substrate 31 located on the most +Y side. The X-direction length L41 of the first common substrate 41 is longer than the X-direction length L31x of the first independent substrate 31 . Thereby, the first common substrate 41 protrudes to the +X side of the independent substrate group 33 .　

At least one of the above-described power supply circuit, voltmeter, and ammeter is mounted on the first common substrate 41 . The power supply circuit supplies voltage and current through the probe Pr used for conducting, breaking, or measuring electrical resistance of the object B to be inspected, and probes the power supply voltage for operating the semiconductor circuit included in the object B to be inspected. Pr. The voltmeter and ammeter measure the voltage and current obtained from the object B to be inspected by the probe Pr. Measurement results such as voltage or current measured by the first common substrate 41 are transmitted to the inspection processing unit 20 .　

The second common board 42 is a circuit board having a substantially rectangular plate shape extending in the Y direction. The plane direction of the second common substrate 42 is along the XY plane. The −X side end of the second common board 42 is electrically connected to the +X side ends of all the first independent boards 31 of the independent board group 33 by, for example, connectors (not shown).　

The +Y side end of the second common substrate 42 is electrically connected to the -Y side substrate surface (plate surface) of the first common substrate 41 by, for example, a connector (not shown). Thereby, the first common substrate 41 is electrically connected to each first independent substrate 31 via the second common substrate 42 .　

As shown in FIG. 3, the length L41 of the first common substrate 41 is longer than the length L31x of the first independent substrate 31, and the first common substrate 41 protrudes toward the +X side of the independent substrate group 33, thereby It becomes easy to electrically connect the +Y side end portion of the second common substrate 42 to the plate-like surface of the first common substrate 41 on the -Y side.

On the second common board 42, the connection relationship between the power supply circuit, voltmeter, and ammeter of the first common board 41 and the signal wiring connected to the switching circuit of each first independent board 31 is checked by the inspection processing unit 20. A switching circuit, a so-called multiplexer, is mounted for switching according to a control signal from.　

That is, the switching circuit that switches the connection relationship between the power supply circuit, the voltmeter, and the ammeter of the first common substrate 41 and each probe Pr according to the control signal from the inspection processing unit 20 has a plurality of first They are distributed on the independent substrate 31 and the second common substrate 42 .　

The number of second common substrates 42 may be one, or, for example, as shown in FIG. 4, a plurality of second common substrates 42 may be provided in parallel. By providing a plurality of second common substrates 42, it becomes easy to increase the circuit scale of the switching circuit that can be mounted on the second common substrate 42. FIG.　

As shown in FIG. 3 , the first common substrate 41 is arranged to face the first independent substrate 31 , and the first common substrate 41 is electrically connected to each first independent substrate 31 via the second common substrate 42 . The configuration in which they are connected makes it difficult for the scanner device 3 to become large.　

If, instead of employing the configuration of the scanner device 3 shown in FIG. become.　

That is, the X-direction length of the second common substrate region 42′ necessary for mounting a circuit corresponding to the second common substrate 42 and the first independent substrate 31 on the substrate 400 is the same as in FIG. , the length is L41. Furthermore, since it is necessary to mount a circuit equivalent to that of the first common substrate 41 on the substrate 400, if the Z-direction length L31z of the first independent substrate 31 and the Y-direction length L400 of the substrate 400 are equal, Assuming that the first common substrate area 41' required for mounting the circuit corresponding to the first common substrate 41 has a length L41. Therefore, the scanner device employing the configuration shown in FIG. 6 has a length in the X direction twice as long as L41.　

On the other hand, since the length in the X direction of the scanner device 3 shown in FIG. 3 is L41, the length in the X direction is half that of the scanner device having the configuration shown in FIG.　

Since the size of the scanner device 3 is less likely to increase, it becomes easier to move the scanner device 3 together with the measurement jig 4 by the moving mechanism 102 . If the scanner device becomes large, it is difficult to move it by the moving mechanism 102 . In that case, it is conceivable that the power supply circuit, voltmeter, ammeter, etc. mounted on the first common substrate 41 are arranged outside the scanner device and connected to each probe Pr by a cable. However, when the signal line is extended with a cable, the signal obtained from the probe Pr is affected by the resistance and impedance of the cable, resulting in a decrease in measurement accuracy.　

On the other hand, according to the scanner device 3 that is difficult to increase in size, it is easy to move the scanner device 3 together with the measurement jig 4 without extending the signal line with a cable. As a result, it becomes easy to improve the measurement accuracy of the inspection object B by the scanner device 3 .　

As shown in FIGS. 4 and 5, the second independent board 32 is a circuit board having a substantially rectangular plate-like shape whose surface direction is the same as that of the first independent board 31 . One second independent substrate 32 is provided for each first independent substrate 31 . In addition, one second independent substrate 32 may be provided for every two first independent substrates 31 , and two first independent substrates 31 may be connected to one second independent substrate 32 . In this way, for example, 16 second independent substrates 32 may be provided for 32 first independent substrates 31, so the number of substrates of the second independent substrates 32 can be reduced.　

The Z-direction length L32 of the second independent substrate 32 is shorter than the Z-direction length L31z of the first independent substrate 31 . The −X side end of the second independent board 32 is connected to a portion of the +X side end of the first independent board 31 that is not connected to the second common board 42 by, for example, a connector (not shown).　

In addition, the second independent substrate 32 is not necessarily connected to all the first independent substrates 31 , and may be connected to at least one of the first independent substrates 31 . Alternatively, the scanner device 3 may not have the second independent substrate 32 .　

The third common board 43 is a circuit board having a substantially rectangular plate-like shape whose surface direction is along the YZ plane. The third common board 43 is connected to the +X side ends of the one or more second independent boards 32 by, for example, a connector (not shown). Also, the third common board 43 is connected to the outside of the scanner device 3 by, for example, a cable (not shown).　

When measuring the object B to be inspected, the signal of the object to be measured is not necessarily limited to one that requires highly accurate measurement. Some signals to be measured may be high voltage, low frequency, or affected by cable resistance and impedance. Therefore, the second independent board 32 extracts a signal from the first independent board 31 that does not cause any problem even if it is affected by the resistance and impedance of the cable, and outputs the signal to the scanner device 3 via the third common board 43 and a cable (not shown). to be connected to a measuring circuit located outside the　

By providing the scanner device 3 with the second independent substrate 32 and the third common substrate 43 in this manner, a signal that is not affected by cable resistance and impedance can be extracted and measured outside the scanner device 3. easier to do. As a result, there is no need to provide a measuring circuit for processing signals that are not affected by cable resistance and impedance in the scanner device 3, so that it is easy to make the scanner device 3 more difficult to increase in size. .　

Alternatively, without providing the third common board 43, the second independent board 32 may be directly connected to the measuring circuit provided outside the scanner device 3 by a cable or the like. Also, the second independent substrate 32 and the third common substrate 43 may not be provided.　

The parallel substrate 51 shown in FIGS. 4 and 5 has, for example, a substantially rectangular plate shape, and is arranged parallel to and facing the second common substrate. The −X side end of the parallel board 51 is electrically connected to the +X side ends of all the first independent boards 31 of the independent board group 33 by, for example, connectors (not shown). The +X side end of the parallel substrate 51 is connected to the outside of the scanner device 3 by, for example, a cable (not shown).　

Note that the parallel substrate 51 is not necessarily connected to all the first independent substrates 31 and may be connected to at least one of the first independent substrates 31 . Alternatively, the scanner device 3 may not have the parallel substrate 51 .　

A scanner device 3a shown in FIG. 7 differs from the scanner device 3 shown in FIG. Other points are the same as those of the scanner device 3, so the description thereof will be omitted, and the characteristic points of the scanner device 3a will be described below.　

The second common board 42a is a circuit board having a substantially rectangular plate shape extending in the Y direction. The surface direction of the second common substrate 42a is along the YZ plane. The -X side substrate surface of the second common substrate 42a is electrically connected to the +X side end portions of all the first independent substrates 31 of the independent substrate group 33 by, for example, connectors (not shown).　

The +Y side end of the second common board 42a is electrically connected to the −Y side board surface of the first common board 41 by, for example, a connector (not shown). Thereby, the first common substrate 41 is electrically connected to each first independent substrate 31 via the second common substrate 42a.　

As shown in FIG. 7, the length L41 of the first common substrate 41 is longer than the length L31x of the first independent substrate 31, and the first common substrate 41 protrudes toward the +X side of the independent substrate group 33, thereby It becomes easy to electrically connect the +Y side end of the second common substrate 42a to the plate-like surface of the first common substrate 41 on the -Y side.　

As with the second common substrate 42, the second common substrate 42a has a power supply circuit, a voltmeter, and an ammeter on the first common substrate 41 and signal wirings connected to switching circuits on the first independent substrates 31. A switching circuit, a so-called multiplexer, for switching the connection relationship according to a control signal from the inspection processing unit 20 is mounted.　

The number of second common substrates 42a may be one, or, for example, as shown in FIG. 7, a plurality of second common substrates 42a may be provided in parallel. By providing a plurality of second common substrates 42a, it becomes easy to increase the circuit scale of the switching circuit that can be mounted on the second common substrate 42a.　

As shown in FIG. 7, the first common substrate 41 is arranged opposite to the first independent substrate 31, and the first common substrate 41 is electrically connected to each of the first independent substrates 31 via the second common substrate 42a. The connected configuration facilitates making the scanner device 3a difficult to increase in size.　

In the scanner device 3a, the surface direction of the second common substrate 42a is along the YZ plane, and the X direction is the plate thickness direction of the second common substrate 42a. As a result, the size of the scanner device 3a is less likely to increase than that of the scanner device 3 in which the surface direction of the second common substrate 42 extends in the X direction.　

That is, a scanner device according to an example of the present invention is a scanner device mounted on an electrical inspection device, and includes a first independent board which is a plate-shaped circuit board extending in a first direction, and a plate-shaped circuit board. a first common substrate arranged parallel to the first independent substrate; and a plate-like circuit substrate, the second common substrate electrically connecting the first independent substrate and the first common substrate. and, the length of the first common substrate in the first direction is longer than the length of the first independent substrate in the first direction.　

According to this configuration, since the first independent substrate and the first common substrate are arranged in parallel, the size of the scanner device is less likely to increase than when the first independent substrate and the first common substrate are arranged on a straight line.　

According to this configuration, since the plurality of first independent substrates are arranged in parallel, if the probes are connected to the first independent substrates, the number of probes can be increased by increasing the number of the first independent substrates. It becomes easier to let In addition, the first independent substrate is arranged in parallel with one of the plurality of parallel arranged independent substrates, and the second common substrate is electrically connected to the end surfaces of the plurality of first independent substrates and the first Since it is electrically connected to the plate-shaped surface of the common substrate, it is easy to arrange the first common substrate and the second common substrate so as to be bent in an L shape along the edge of the independent substrate group. becomes. Therefore, the circuits mounted on the first common substrate and the second common substrate can be arranged compactly, which makes it easy to make the scanner device difficult to increase in size.　

Moreover, it is preferable that the surface direction of the second common substrate is along the second direction and the first direction, which are the separation directions between the first independent substrate and the first common substrate.　

According to this configuration, the space of the one end portion of the first independent substrate that is connected to the second common substrate may be small, so that the space of the one end portion of the first independent substrate that is not connected to the second common substrate may be replaced by another space. It becomes easy to connect a circuit board or the like.　

Moreover, it is preferable to provide a plurality of the second common substrates. According to this configuration, it becomes easy to increase the circuit scale that can be mounted on the second common substrate. As a result, it becomes easy to cope with an increase in the number of probes.　

Moreover, it is preferable to further include a parallel substrate arranged in parallel with the second common substrate. According to this configuration, the circuit mounting space is increased by the parallel board, so that it becomes easy to increase the circuit scale of the scanner device.

Moreover, it is preferable to further include a second independent substrate, which is a plate-shaped circuit substrate having the same surface direction as the first independent substrate and is connected to one end portion of the first independent substrate in the first direction. According to this configuration, among the signals obtained from the first independent substrate, those signals that do not need to be processed by the first common substrate can be easily processed by the second independent substrate.　

Further, the apparatus further includes a third common substrate, which is a plate-shaped circuit board and whose surface direction is perpendicular to the first direction, wherein the second independent substrate is located between the third common substrate and the first independent substrate. and the third common substrate is preferably connected to the second independent substrate. According to this configuration, it becomes easy to further process the signal obtained from the second independent substrate by the third common substrate.　

Moreover, it is preferable that the plane direction of the second common substrate is perpendicular to the first direction. According to this configuration, it becomes easy to dispose the second common substrate so as to cover the edge of the first independent substrate.　

Moreover, it is preferable to provide a plurality of the second common substrates. According to this configuration, it becomes easy to increase the circuit scale that can be mounted on the second common substrate.　

Also, an electrical inspection apparatus according to an example of the present invention includes the scanner device described above. In the electrical inspection device having such a configuration, the size of the scanner device is less likely to increase.

1

Electrical inspection device

2, 2U,

2L Measuring unit

3,

3a Scanner device

4, 4U, 4L Measuring jig 20 Inspection processing unit 21 Aluminum plate 22 Wiring board 31 First independent board 32 Second independent board 33 Independent board group 41 Second One common substrate 41' First

common substrate regions

42, 42a Second common substrate 42' Second common substrate region 43 Third common substrate 51 Parallel substrate 101 Fixing device 102 Moving mechanism 103 Housing 400 Substrate B Inspection object L31x, L31z , L32, L400, L41 length Pr probe

Claims

A scanner device mounted on an electrical inspection device, comprising: a first independent board that is a plate-shaped circuit board extending in a first direction; and a plate-shaped circuit board that is arranged parallel to the first independent board. and a second common board, which is a plate-shaped circuit board and electrically connects the first independent board and the first common board, wherein the The scanner device, wherein the length in the first direction is longer than the length in the first direction of the first independent substrate.
A scanner device that switches an electrical connection relationship with an inspection processing unit that performs an inspection based on an electrical signal, wherein a first independent substrate formed in a plate shape extending in a predetermined first direction is orthogonal to the first direction. a group of independent substrates arranged in parallel in a second direction, a first common substrate arranged in parallel with one of the first independent substrates of the group of independent substrates, and an end surface of each of the plurality of first independent substrates A scanner device comprising a plate-like second common substrate electrically connected and electrically connected to the plate-like surface of the first common substrate.
3. The scanner device according to claim 1, wherein the planar direction of the second common substrate is along the second direction and the first direction, which are directions in which the first independent substrate and the first common substrate are separated.
4. The scanner device according to claim 3, comprising a plurality of said second common substrates.
5. The scanner device according to claim 3, further comprising a parallel board arranged parallel to the second common board.
6. The circuit board according to any one of claims 3 to 5, further comprising a second independent board, which is a plate-shaped circuit board having the same surface direction as the first independent board, and is connected to one end of the first independent board in the first direction. A scanner device according to any one of the preceding claims.
It further comprises a third common board which is a plate-shaped circuit board and whose surface direction is perpendicular to the first direction, wherein the second independent board is arranged between the third common board and the first independent board 7. The scanner device according to claim 6, wherein said third common board is connected to said second independent board.
3. The scanner device according to claim 1, wherein the planar direction of the second common substrate is orthogonal to the first direction.
9. The scanner device according to claim 8, comprising a plurality of said second common substrates.
An electrical inspection device comprising the scanner device according to any one of claims 1 to 9.