WO2023138205A1

WO2023138205A1 - Packaging structure, electronic device and packaging method

Info

Publication number: WO2023138205A1
Application number: PCT/CN2022/133532
Authority: WO
Inventors: 李所; 郭丽波
Original assignee: 华为技术有限公司
Priority date: 2022-01-22
Filing date: 2022-11-22
Publication date: 2023-07-27
Also published as: CN116525592A

Abstract

The present application relates to the field of electromagnetic shielding, and provides a packaging structure, an electronic device and a packaging method. The packaging structure comprises: a substrate having a first surface, and a plurality of grounding pads being provided on the first surface; a member to be shielded fixed to the first surface; a plurality of first shielding wires, wherein both ends of each first shielding wire are electrically connected to two of the plurality of grounding pads, and at least some of the first shielding wires are bent in the direction furthest from the first surface; and a plurality of second shielding wires, wherein both ends of each second shielding wire are electrically connected to two of the plurality of grounding pads, at least some of the second shielding wires are bent in the direction furthest from the first surface, and the second shielding wires are closer to the first surface than the first shielding wires. The packaging structure can improve the electromagnetic shielding effect thereof.

Description

Packaging structure, electronic device and packaging method

This application claims the priority of the Chinese patent application with the application number 202210075696.9 and the invention title "Packaging Structure, Electronic Device and Packaging Method" submitted to the China Patent Office on January 22, 2022, the entire contents of which are incorporated in this application by reference.

technical field

The present application relates to the technical field of electromagnetic shielding, and in particular to a packaging structure, electronic equipment and a packaging method.

Background technique

The Power Amplifier Module with integrated (PAMid) is a commonly used power amplifier product. The substrate in the PAMid is usually provided with a bare die (Die). Some dies have high power and may generate large electromagnetic interference signals. Therefore, it is necessary to perform electromagnetic shielding on the die.

As shown in FIG. 1 , the package structure in the related art usually includes a substrate 30 , a top coating (not shown in FIG. 1 ) and a plurality of shielded wires 12 arranged around the die 11. The shielded wires 12 are arc-shaped shielded wires, and the two ends of the shielded wires 12 are fixed to two adjacent ground pads 312 of the substrate 30. In this way, the shielding wire 12 surrounding the bare die 11 and the top coating form a shielding layer to shield the die 11 electromagnetically.

It can be seen from FIG. 1 that after the bare die 11 radiates the electromagnetic interference signal, the electromagnetic interference signal radiated toward the side of the bare die 11 is mainly shielded by the shielding wire 12, and part of the electromagnetic interference signal may radiate from the area between the arc-shaped shielding wire 12 and the substrate 30, and the shielding effect is slightly insufficient. To improve the shielding effect, it is necessary to add grounding pads 312 on the substrate and increase the density of the shielding wires 12 . However, the surface size of the substrate is limited, and the number of grounding pads 312 that can be provided is limited.

Therefore, how to further improve the electromagnetic shielding effect of the packaging structure is an urgent technical problem to be solved at present.

Contents of the invention

In order to solve the above technical problems, the present application provides a packaging structure, an electronic device and a packaging method, which can further improve the electromagnetic shielding effect of the packaging structure.

The present application provides a packaging structure, including: a substrate, the substrate has a first surface, and a plurality of ground pads are arranged on the first surface; a member to be shielded, the member to be shielded is fixed on the first surface; a plurality of first shielded wires, both ends of each first shielded wire are electrically connected to two ground pads in the plurality of ground pads, at least part of the first shielded wire is bent in a direction away from the first surface; The first shielding wire is closer to the first surface.

In the packaging structure provided by the present application, when the electromagnetic interference signal is radiated by the shielding part, each first shielding wire can guide the electromagnetic interference signal received by itself to the grounding pad for shielding; each second shielding wire can also guide the electromagnetic interference signal received by itself to the grounding pad for shielding. Since the shielding area of each shielding wire includes itself and a certain area around it, the shielding areas of the multiple first shielding wires can form at least one first shielding layer, and the shielding areas of the multiple second shielding wires can form at least one second shielding layer. Since the second shielding wires are closer to the first surface than the first shielding wires, the package structure can form at least two shielding layers. After the electromagnetic interference signal radiated by the shielding member passes through the shielding of the second shielding layer first, some electromagnetic interference signals may not be shielded, and this part of the unshielded electromagnetic interference signal reaches the first shielding layer, and the first shielding layer can shield the part of the unshielded electromagnetic interference signal, thereby improving the electromagnetic shielding effect of the packaging structure.

In some possible implementation manners, the first shielded wires and the second shielded wires are arc-shaped wires; the second heights between the tops of the second shielded wires and the first surface are the same, and the first heights between the tops of the first shielded wires and the first surface are the same. In this way, a plurality of second shielded wires with the same second height can form a second shielding layer, and a plurality of first shielded wires with the same first height can form a first shielding layer. In the packaging structure, the area of the first surface is relatively limited, and the number of ground pads that can be provided on the first surface is also limited. When the number of layers of the shielding layer is 2, compared with a structure with more layers, the density of the first shielding wires contained in each layer of the first shielding layer can be higher. In this way, the distance between every two adjacent first shielding wires in the first shielding layer of the layer can be reduced, so that the respective shielding areas of each two adjacent first shielding wires cover the area between the two as much as possible. Based on the same principle, the respective shielding areas of every two adjacent second shielding wires can also cover the area between them as much as possible, thereby further improving the shielding effect of the package structure.

In some possible implementation manners, the ratio between the second height and the first height is greater than or equal to 0.3 and less than or equal to 0.7. Like this, the first height between the top of the second shielding wire and the first surface is relatively moderate, and when the ratio is too small, the first height is lower, which will cause the shielding effect of the second shielding wire to affect the circuit on the first surface; Therefore, the ratio between the second height and the first height adopts the above-mentioned range, which can further improve the shielding effect.

In some possible implementation manners, the projection of at least part of the first shielding line on the first surface overlaps the projection of the object to be shielded on the first surface; the projection of at least part of the second shielding line on the first surface overlaps the projection of the object to be shielded on the first surface. When the projection of the first shielding line on the first surface overlaps with the projection of the member to be shielded on the first surface, it indicates that a partial area of the first shielding line is located above the member to be shielded, so that the first shielding line can perform electromagnetic shielding on part of the electromagnetic interference signal radiated by the shielding member to be shielded above it. Similarly, the second shielded wire can also perform electromagnetic shielding on a part of the electromagnetic interference signal radiated by the shield to be shielded above it.

In some possible implementation manners, the projection of at least part of the first shielded wire on the first surface overlaps with the projection of at least part of the second shielded wire on the first surface. In this way, the extension direction of the projection of part of the first shielded wire on the first surface intersects the extension direction of the projection of part of the second shielded wire on the first surface, so that the first shielded wire and the second shielded wire can be distributed on the first surface as uniformly as possible.

In some possible implementation manners, the packaging structure further includes: a conductive coating, the conductive coating is fixed on the first surface, and a first dielectric layer is provided between the conductive coating and the first surface, the first shielding wire and the second shielding wire are both located in the first dielectric layer, and the conductive coating is electrically connected to the first shielding wire. Since the conductive coating is electrically connected to the first shielding wire, and the first shielding wire is electrically connected to the ground pad, the conductive coating is electrically connected to the ground pad. When the electromagnetic interference signal to be radiated by the shielding member passes through the shielding of the second shielding layer and the first shielding layer in sequence, when a small part of the electromagnetic interference signal is still radiated to the conductive coating, the conductive coating can receive this part of the electromagnetic interference signal and guide it to the ground pad through the first shielding wire for shielding, thereby further improving the shielding effect of the package structure.

In some possible implementation manners, a plurality of ground pads surround a projection of the member to be shielded on the first surface. Since the first shielding wire and the second shielding wire are both fixed on the two grounding pads of the plurality of grounding pads, the plurality of grounding pads surround the projection of the object to be shielded on the first surface, that is, the fixed points of the first shielding wire and the second shielding wire on the first surface surround the projection of the object to be shielded on the first surface, so that the first shielding wire and the second shielding wire can be arranged around the object to be shielded as much as possible, thereby improving the shielding effect of the packaging structure.

In some possible implementation manners, the projection adjacent to the projection of the second shielded line on the first surface is the projection of the first shielded line. In this way, the first shielded wire and the second shielded wire not only have a height difference, but also are arranged at intervals in a horizontal direction perpendicular to the height direction, that is, in the lateral direction, the second shielded wire is arranged between the two first shielded wires, and the first shielded wire is located between the two second shielded wires. Since part of the electromagnetic interference signal radiated by the shielding member may radiate from the area between the two second shielded wires to the first shielded wire, the height is higher than the second shielded wire, and the first shielded wire located between the two second shielded wires in the lateral direction can shield the part of the electromagnetic interference signal, thereby further improving the shielding effect of the package structure.

In some possible implementation manners, there are at least two first shielded lines parallel to each other among the multiple first shielded lines, and the projections of the at least two first shielded lines parallel to each other on the first surface both extend along the first direction; and/or there are at least two second shielded lines parallel to each other among the multiple second shielded lines, and the projections of the at least two second shielded lines parallel to each other on the first surface both extend along the first direction. In this way, at least two first shielded wires parallel to each other can be distributed on the first surface as evenly as possible, and similarly, at least two second shielded wires parallel to each other can also be distributed on the first surface as uniformly as possible.

In some possible implementation manners, there is at least one projection of the first shielded line on the first surface among the multiple first shielded lines, extending along the second direction, and there is an angle between the second direction and the first direction; and/or, there is at least one projection of the second shielded line on the first surface among the multiple second shielded lines, extending along the second direction. Among the multiple first shielded wires, the projections of some of the first shielded wires on the first surface extend along the first direction, and the projections of some of the first shielded wires along the first surface extend along the second direction, and the same is true for the second shielded wires. In this way, it is convenient for the first shielded wires and the second shielded wires to be arranged at intervals in the lateral direction, thereby improving the shielding effect.

In some possible implementation manners, the first direction is orthogonal to the second direction. Since a plurality of grounding pads are usually arranged symmetrically about the center of the projection of the member to be shielded on the first surface, when the first direction is perpendicular to the second direction, in the process of manufacturing the package structure, one grounding pad and the grounding pad at its symmetrical position can be used as two fixed points to make the first shielding line, thereby facilitating the production of the first shielding line. Similarly, it is beneficial to make the second shielded wire.

In some possible implementation manners, among the plurality of first shielded lines, there is at least one projection of the first shielded line on the first surface, which extends along the third direction, and the first direction and the second direction respectively have an included angle with the third direction; and/or, among the plurality of second shielded lines, there is also at least one projection of the second shielded line on the first surface, which extends along the third direction. Since the projection of the object to be shielded on the first surface is generally rectangular, when there are at least two first shielded wires whose projections on the first surface extend along the first direction, projections extend along the second direction, and projections extend along the third direction, the plurality of first shielded wires can cover the corners and central areas of the object to be shielded, and the first shielded wires can cover the area to be shielded as much as possible; similarly, multiple first shielded wires can also cover the corners and central areas of the object to be shielded.

In some possible implementation manners, the first shielding wire is in contact with the conductive coating. In this way, the structure is relatively simple, and the connection between the first shielding wire and the conductive film does not require other intermediate connectors. In the process of manufacturing the packaging structure, after the first shielding wire and the second shielding wire are prepared on the first surface, the first dielectric layer can be prepared on the first surface, and then, a conductive film can be directly prepared on the first dielectric layer, during which no other intermediate connectors need to be prepared, so the process flow can be saved.

In some possible implementations, the substrate includes a first metal layer, a second dielectric layer and a second metal layer stacked in sequence, the first surface is located on the side of the first metal layer away from the second dielectric layer, a conductive device is provided inside the second dielectric layer, a ground layer is provided on the surface of the second metal layer connected to the second dielectric layer, and the ground layer is electrically connected to the ground pad through the conductive device. In this way, the first shielded wire and the second shielded wire can guide the received electromagnetic interference signal to the ground layer through the ground pad, the first metal layer and the conductive element in sequence, so as to shield the electromagnetic interference signal.

The present application also provides an electronic device, including a circuit board and any one of the packaging structures described above, and the circuit board and the packaging structure are electrically connected. Electronic equipment can achieve all the effects of the above-described package structure.

The present application provides a packaging method. The packaging method includes: providing a substrate, the substrate has a first surface, and a plurality of grounding pads are provided on the first surface; fixing an object to be shielded to the first surface; using the multiple grounding pads as fixed points, preparing a plurality of second shielding wires, wherein both ends of each second shielding wire are fixed to two grounding pads of the plurality of grounding pads, and at least part of the second shielding wire is bent in a direction away from the first surface; In the pad, at least part of the second shielded wire is bent toward a direction away from the first surface, and the second shielded wire is closer to the first surface than the first shielded wire.

Since the second shielded wire is closer to the first surface than the first shielded wire, that is to say, the first shielded wire is farther away from the first surface than the second shielded wire. Therefore, in the process of manufacturing the package structure, after the to-be-shielded member is soldered to the first surface, first prepare a plurality of second shielded wires, and then prepare a plurality of first shielded wires, so that after the preparation of the plurality of second shielded wires, there is enough space for preparing the first shielded wires. In addition, the packaging structure obtained by using the packaging method of the present application can form at least two shielding layers. After the electromagnetic interference signal radiated by the shielding member passes through the shielding of the second shielding layer, some electromagnetic interference signals may not be shielded, and this part of the unshielded electromagnetic interference signal reaches the first shielding layer and is shielded by the first shielding layer, thereby improving the electromagnetic shielding effect of the packaging structure.

In some possible implementation manners, after the step of preparing a plurality of first shielded wires with the plurality of ground pads as fixed points, the packaging method further includes: preparing a first dielectric layer on the first surface, the top of the first dielectric layer being flush with the top of the first shielded wires; forming a conductive coating on the top of the first dielectric layer by means of coating, and the conductive coating is in contact with the first shielded wires. After the first dielectric layer is prepared, a conductive coating can be formed on the top of the first dielectric layer. Since the top of the first shielding line is flush with the top of the first dielectric layer, the conductive coating formed on the top of the first dielectric layer is also in contact with the first shielding line. In this way, when the packaging structure obtained by the packaging method of the present application is in use, after the electromagnetic interference signal to be radiated by the shielding member passes through the shielding of the second shielding layer and the first shielding layer in sequence, a small part of the electromagnetic interference signal is still radiated to the conductive coating, the conductive coating can receive this part of the electromagnetic interference signal, and guide it to the ground pad through the first shielding wire for shielding, thereby further improving the shielding effect of the packaging structure.

Description of drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the accompanying drawings used in the description of the embodiments of the present application. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained according to these drawings without paying creative labor.

FIG. 1 is a schematic structural diagram of a packaging structure of the related art;

FIG. 2 is a structural schematic diagram of the packaging structure and the electrical connection of the circuit board according to the embodiment of the present application;

FIG. 3 is a perspective view of the packaging structure of the embodiment of the present application;

Fig. 4 is a plan view of the packaging structure of the embodiment shown in Fig. 3;

FIG. 5 is a schematic structural diagram of a packaging structure according to another embodiment of the present application;

FIG. 6 is a schematic structural diagram of a packaging structure according to another embodiment of the present application;

Fig. 7 is the B direction view of Fig. 6;

Fig. 8 is the A direction view of Fig. 6;

FIG. 9 is a schematic structural diagram of a packaging structure according to another embodiment of the present application;

Fig. 10 is the D direction view of Fig. 9;

Fig. 11 is the C direction view of Fig. 9;

Figure 12 is a comparison diagram of electromagnetic near-field energy obtained by simulation experiments;

FIG. 13 is a schematic flowchart of a packaging method according to an embodiment of the present application.

Icons: 11-bare crystal; 12-shielding wire; 20-PCB; 21-package pin; 30-substrate; 31-first metal layer; 311-first surface; 312-ground pad; 313-first ground pad; 314-second ground pad; 32-second metal layer; 321-ground layer; 33-third metal layer; -bump; 50-conductive coating; 51-first dielectric layer; 60-first shielding line; 70-second shielding line; E-first direction; F-second direction; G-third direction; I-fourth direction; J-fifth direction; K-sixth direction; H1-first height; H2-second height.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

The term "and/or" in this article is just an association relationship describing associated objects, which means that there may be three relationships, for example, A and/or B may mean: A exists alone, A and B exist simultaneously, and B exists alone.

The terms "first" and "second" in the description and claims of the embodiments of the present application are used to distinguish different objects, rather than to describe a specific order of objects. For example, the first target object, the second target object, etc. are used to distinguish different target objects, rather than describing a specific order of the target objects.

In the embodiments of the present application, words such as "exemplary" or "for example" are used as examples, illustrations or illustrations. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of the present application shall not be interpreted as being more preferred or more advantageous than other embodiments or design schemes. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete manner.

In the description of the embodiments of the present application, unless otherwise specified, "plurality" means two or more. For example, multiple processing units refer to two or more processing units; multiple systems refer to two or more systems.

The packaging structure provided in the embodiment of the present application can be applied to electronic equipment, and the electronic equipment can be a mobile phone, a tablet computer, and the like. For example, PAMid used in mobile phones, or front-end modules (Front-end Modules, FEM). Since some bare crystals included in the PAMid and FEM have relatively high power, large electromagnetic interference signals are often generated during use. The packaging structure in the embodiment of the present application can perform electromagnetic shielding on the bare crystals to reduce electromagnetic interference caused by the bare crystals to other circuits in the PAMid.

The electronic device also includes a circuit board electrically connected to the packaging structure, and the circuit board may be, for example, a printed circuit board (Printed Circuit Board, PCB).

As shown in FIG. 2 , the package structure includes a substrate 30 , a member to be shielded 40 , a conductive film 50 , a plurality of first shielded wires 60 and a plurality of second shielded wires 70 .

As shown in FIG. 2 , one side surface of the PCB 20 is provided with packaging pins 21, and the substrate 30 is fixedly connected to the PCB 20 through the packaging pins 21.

As shown in FIG. 2 , the substrate 30 includes a first metal layer 31 , a second metal layer 32 , a third metal layer 33 and a fourth metal layer 34 arranged parallel to each other in sequence, and a second dielectric layer 35 is arranged between every two adjacent metal layers. Each metal layer is parallel to the PCB 20, and the fourth metal layer 34 is the closest metal layer to the PCB 20. A plurality of conductive devices 36 are arranged in the second dielectric layer 35 between every two metal layers, for electrically connecting the metal layers on both sides of the second dielectric layer 35 . Wherein, the conductive device 36 may be a metal via.

As shown in FIG. 2, the second metal layer 32 is a metal layer adjacent to the first metal layer 31, and the surface of the second metal layer 32 facing the first metal layer 31 is provided with a ground layer 321, and the ground layer 321 can cover the entire surface of the second metal layer 32 facing the first metal layer 31.

As shown in FIG. 2, the first metal layer 31 is the metal layer farthest away from the PCB 20, therefore, the first metal layer 31 is disposed toward the surface on which the ground layer 321 is provided on the second metal layer 32. The first metal layer 31 has a first surface 311 facing away from the second metal layer 32 , and the first surface 311 is used to carry the to-be-shielded component 40 so that the to-be-shielded component 40 can be electrically connected to the first metal layer 31 .

As shown in FIG. 2 , a plurality of ground pads 312 are disposed on the first surface 311 , and the plurality of ground pads 312 are used to fix the first shielding wire 60 and the second shielding wire 70 . Wherein, both ends of each first shielded wire 60 are fixed to two ground pads 312 in the plurality of ground pads 312, and both ends of each second shielded wire 70 are fixed to two ground pads 312 in the plurality of ground pads 312. Each ground pad 312 can only fix one end of a first shielded wire 60, or only fix one end of a second shielded wire 70.

As shown in FIG. 4, a plurality of ground pads 312 can surround the projection of the member 40 to be shielded on the first surface 311. The shape of the area surrounded by the multiple ground pads 312 can be a closed and hollow shape. Exemplarily, in this embodiment, as shown in FIG. 4, the shape of the multiple ground pads 312 can be rectangular and hollow. Since the first shielded wire 60 and the second shielded wire 70 are all fixed on the two ground pads 312 of the plurality of ground pads 312, the plurality of ground pads 312 surround the projection of the member to be shielded 40 on the first surface 311, that is, the fixed points of the first shielded wire 60 and the second shielded wire 70 on the first surface 311 surround the projection of the member to be shielded 40 on the first surface 311, so that the first shielded wire 60 and the second shielded wire 70 can be arranged around the member 40 to be shielded as much as possible.

As shown in FIG. 5 , the plurality of grounding pads 312 can also adopt the following structure: including a first grounding pad 313 surrounding the projected circle area of the member to be shielded 40 on the first surface 311 and an outer second grounding pad 314, so that the second grounding pad 314 can also fix the first shielding wire 60 and/or the second shielding wire 70, thereby increasing the number of the first shielding wire 60 and/or the second shielding wire 70, thereby improving the shielding effect of the packaging structure.

Since the first metal layer 31 is made of metal, it is a conductor itself. As shown in FIG.

As shown in FIG. 2 , the member 40 to be shielded may be a bare die 11, and the die 11 may be integrated with radio frequency (Radio Frequency, RF) and digital circuits. In this embodiment, the bare die 11 is the radiation source, and the bare die 11 will radiate electromagnetic interference signals during use, so it needs to be electromagnetically shielded. The bare chip 11 is fixed on the first surface 311 of the substrate 30 through the bumps 41. The fixing through the bumps 41 is a packaging technology. First, a plurality of small ball-shaped solders are placed according to the shape of the die pin array to form a small ball array. Then, the bare chip is placed on the small ball array, and each small ball of solder is heated. After the small balls of solder melt, the bare chip is soldered to the substrate 30. The size of the bare die 11 may be 1.06mm×1.5mm×0.012mm.

It should be noted that in the chip, there may be multiple dies 11, but usually only the dies 11 with higher power (that is, the parts to be shielded 40) are shielded. Therefore, the number of ground pads 312 can be set according to the number of parts to be shielded 40, and each part to be shielded 40 corresponds to a plurality of ground pads 312, and each part to be shielded 40 also needs to be provided with multiple first shielding wires 60 and multiple second shielding wires 70.

As shown in FIG. 3 and FIG. 4 , among the plurality of first shielded wires 60 , both ends of each first shielded wire 60 are electrically connected to two ground pads 312 of the plurality of ground pads 312 . The material of the first shielding wire 60 may be metal, for example, it may be copper. In this way, as shown in FIG. 2, after the first shielding wire 60 receives the electromagnetic interference signal radiated by the shielding member 40, the electromagnetic interference signal can be introduced to the ground layer 321 of the second metal layer 32 through the ground pad 312, the first metal layer 31, and the conductive device 36 in order to shield the electromagnetic interference signal.

At least part of the first shielded wire 60 bends away from the first surface 311. It may mean that, as shown in FIG.

The projection of at least part of the first shielded wire 60 on the first surface 311 overlaps with the projection of the component to be shielded 40 on the first surface 311 . In a possible implementation, as shown in FIG. 4 , the projection of a part of the first shielded wire 60 on the first surface 311 overlaps the projection of the member to be shielded 40 on the first surface 311, and the projection of another part on the first surface 311 has no overlap with the projection of the member to be shielded 40 on the first surface 311. Exemplarily, FIG. 4 contains thirteen first shielded

wires

60 and 11 second shielded wires 70, and the projections of the first shielded wires 60 located around and on the edge on the first surface 311 have no overlap with the projections of the member 40 to be shielded on the first surface 311; In another possible implementation manner, as shown in FIG. 6 , the projection of each first shielded wire 60 on the first surface 311 overlaps with the projection of the member 40 to be shielded on the first surface 311 .

When the projection of the first shielded wire 60 on the first surface 311 overlaps with the projection of the member to be shielded 40 on the first surface 311, it indicates that a partial area of the first shielded wire 60 is located above the member to be shielded 40, so that the first shielded wire 60 can electromagnetically shield the electromagnetic interference signal radiated from the shielded member 40 to its top.

As shown in FIG. 4 , among the multiple second shielded wires 70 , both ends of each second shielded wire 70 are electrically connected to two ground pads 312 among the multiple ground pads 312 . The material of the second shielding wire 70 may be metal, for example, it may be copper. In this way, as shown in FIG. 2, after the second shielding wire 70 receives the electromagnetic interference signal radiated by the shielding member 40, the electromagnetic interference signal can be introduced to the ground layer 321 of the second metal layer 32 through the ground pad 312, the first metal layer 31, and the conductive device 36 in order to shield the electromagnetic interference signal.

At least part of the second shielded wire 70 bends away from the first surface 311. It may mean that the second shielded wire 70 is bent in a direction away from the first surface 311 as a whole (as shown in FIG. 3 ).

The projection of at least part of the second shielded wire 70 on the first surface 311 overlaps with the projection of the component to be shielded 40 on the first surface 311 . In a possible implementation, as shown in FIG. 4 , the projection of a part of the second shielded wire 70 on the first surface 311 overlaps with the projection of the member to be shielded 40 on the first surface 311, and the projection of another part of the second shielded wire 70 on the first surface 311 has no overlap with the projection of the member to be shielded 40 on the first surface 311. Exemplarily, FIG. 4 contains eleven second shielded wires 70, wherein the projections of the four second shielded wires 70 on the first surface 311 located around and near the edge of the member to be shielded 40 do not overlap with the projections of the member to be shielded 40 on the first surface 311, and the projections of other second shielded wires 70 on the first surface 311 overlap with the projections of the member to be shielded 40 on the first surface 311. In another possible implementation manner, as shown in FIG. 6 , the projection of each second shielded wire 70 on the first surface 311 overlaps with the projection of the member 40 to be shielded on the second surface.

When the projection of the second shielded wire 70 on the first surface 311 overlaps with the projection of the member to be shielded 40 on the first surface 311, it indicates that the partial area of the second shielded wire 70 is located above the member to be shielded 40, so that the second shielded wire 70 can electromagnetically shield the electromagnetic interference signal radiated from the shielded member 40 to its top.

As shown in FIG. 2 , the second shielded wire 70 is closer to the first surface 311 than the first shielded wire 60. Since the first shielded wire 60 and the second shielded wire 70 are fixed on the two ground pads 312 of the first surface 311, usually the height of each ground pad 312 is the same, therefore, the distance between the fixed points at both ends of the first shielded wire 60 and the second shielded wire 70 and the first surface 311 can be the same. The top of the second shielded wire 70 is closer to the first surface 311 than the top of the first shielded wire 60. In addition, the portion between the top of the second shielded wire 70 and the fixed point is also closer to the first surface 311 than the portion between the top of the first shielded wire 60 and the fixed point. When the electromagnetic interference signal is radiated by the shielding member 40, each first shielded wire 60 can import the electromagnetic interference signal received by itself to the ground pad 312 for shielding; each second shielded wire 70 can also import the electromagnetic interference signal received by itself to the ground pad 312 for shielding. Since the shielding area of each shielding wire includes itself and a certain area around it, the shielding areas of the multiple first shielding wires 60 can form at least one first shielding layer, and the shielding areas of the multiple second shielding wires 70 can form at least one second shielding layer. Since the second shielding wires 70 are closer to the first surface 311 than the first shielding wires 60, the package structure can form at least two shielding layers. After the electromagnetic interference signal radiated by the shielding member 40 first passes through the shielding of the second shielding layer, some electromagnetic interference signals may not be shielded, and this part of the unshielded electromagnetic interference signal reaches the first shielding layer, and the first shielding layer can shield the part of the unshielded electromagnetic interference signal, thereby improving the electromagnetic shielding effect of the packaging structure. It should be noted that the top of the first shielded wire 60 refers to the part of the first shielded wire 60 farthest from the first surface 311 .

In a possible implementation manner, among the plurality of first shielded wires 60, the first heights H1 between the tops of the first shielded wires 60 and the first surface 311 are different, and the first heights H1 of the first shielded wires 60 near the center of the member 40 to be shielded are higher than the heights of the first shielded wires 60 farther away from the center of the member 40 to be shielded.

Among the plurality of second shielded wires 70, the first height H1 between the top of each second shielded wire 70 and the first surface 311 is different, and the first height H1 of the second shielded wire 70 near the center of the member 40 to be shielded is higher than the height of the second shielded wire 70 farther from the center of the member 40 to be shielded. In this way, the first height H1 of the second shielded wire 70 gradually increases from both sides of the member 40 to be shielded to the center. It should be noted that the top of the second shielded wire 70 refers to the part of the second shielded wire 70 farthest from the first surface 311 .

In another possible implementation manner, among the plurality of first shielded wires 60, the first height H1 between the top of the first part of the first shielded wire 60 and the first surface 311 is the same, and the first height H1 between the top of the second part of the first shielded wire 60 and the first surface 311 is the same, but the first height H1 of the first part of the first shielded wire 60 is different from the first height H1 of the second part of the first shielded wire 60. When the difference is large, the plurality of first shielded wires 60 can form two shielding layers.

Among the multiple second shielded wires 70, the second heights H2 between the tops of the first part of the second shielded wires 70 and the first surface 311 are the same, and the second heights H2 between the tops of the second part of the second shielded wires 70 and the first surface 311 are all the same, but the second height H2 of the first part of the second shielded wires 70 is different from the second height H2 of the second part of the second shielded wires 70. 70 can form two layers of shielding.

As shown in FIGS. 7 and 8 , in another possible implementation, the first heights H1 between the tops of the first shielded wires 60 and the first surface 311 are the same, and the second heights H2 between the tops of the first shielded wires 70 and the first surface 311 are the same. In this way, a plurality of second shielded wires 70 with the same second height H2 can form a second shielded layer, and a plurality of first shielded wires 60 with the same first height H1 can form a first shielded layer. In the packaging structure, the area of the first surface 311 is relatively limited, and the number of grounding pads 312 that can be provided on the first surface 311 is also limited. When the number of layers of the shielding layer is 2, the arrangement density of the first shielding wires 60 contained in each layer of the first shielding layer can be higher than that of a structure with more layers. In this way, the distance between every two adjacent first shielding wires 60 in the first shielding layer of the layer can be reduced, so that the shielding area of each two adjacent first shielding wires 60 can cover the area between them as much as possible. Based on the same principle, the respective shielding areas of every two adjacent second shielding wires 70 can also cover the area between them as much as possible, thereby further improving the shielding effect of the package structure.

In the embodiment of the present application, as shown in FIG. 10 and FIG. 11, the ratio between the second height H2 and the first height H1 is greater than or equal to 0.3 and less than or equal to 0.7. Exemplarily, the first height H1 can be 0.49mm, and the second height H2 can be 0.147mm, 0.33mm or 0.343mm, etc. In this way, the first height H1 between the top of the second shielded wire 70 and the first surface 311 is relatively moderate. When the ratio is too small, the first height H1 is relatively low, which will cause the shielding effect of the second shielded wire 70 to affect the circuit on the first surface 311; The signal is radiated from this part of the area, that is, the shielding effect of the second shielded wire 70 is reduced. Therefore, if the ratio between the second height H2 and the first height H1 adopts the above-mentioned range, the shielding effect can be further improved.

In the embodiment of the present application, as shown in FIG. 4 , the projection of at least part of the first shielded wire 60 on the first surface 311 overlaps with the projection of at least part of the second shielded wire 70 on the first surface 311 . If the projection of the first shielded wire 60 on the first surface 311 does not overlap with the projection of the second shielded wire 70 on the first surface 311, it means that the projection of the first shielded wire 60 on the first surface 311 is parallel to the projection of the second shielded wire 70 on the first surface 311, and the number of grounding pads 312 on the first surface 311 is limited. Therefore, there will not be enough grounding pads 312 to fix the first shielding wire 60 and the second shielding wire 70. If the projection of the first shielded wire 60 on the first surface 311 overlaps with the projection of the second shielded wire 70 on the first surface 311, then the extension direction of the projection of the first shielded wire 60 on the first surface 311 intersects the extension direction of the projection of the second shielded wire 70 on the first surface 311, thus, the first shielded wire 60 and the second shielded wire 70 can be distributed on the first surface 311 as uniformly as possible.

In a possible implementation manner, as shown in FIG. 4 , the projection of a part of the first shielded wires 60 on the first surface 311 overlaps the projection of a part of the second shielded wires 70 on the first surface 311, and the projection of another part of the first shielded wires 60 on the first surface 311 has no overlap with the projection of another part of the second shielded wires 70 on the first surface 311. Exemplarily, in FIG. 4, the first shielded wires 60 and the second shielded wires 70 that are connected to the left and right sides of the member to be shielded 40 and whose projections on the first surface 311 are arranged in different directions have overlapping projections on the first surface 311, and the projections of the first shielded wires 60 and the second shielded wires 70 located at the four corners of the member to be shielded 40 on the first surface 311 have no overlap.

In another possible implementation manner, as shown in FIG. 9 , the projections of the first shielded wires 60 on the first surface 311 overlap with the projections of the second shielded wires 70 on the first surface 311 . Exemplarily, the projections of the seven first shielded wires 60 on the first surface 311 in FIG. 9 overlap with the projections of the six second shielded wires 70 on the first surface 311 .

In the embodiment of the present application, as shown in FIG. 4 , the projection adjacent to the projection of the second shielded line 70 on the first surface 311 is the projection of the first shielded line 60 . Likewise, the projection adjacent to the projection of the first shielded line 60 on the first surface 311 is the projection of the second shielded line 70 . In other words, the ground pad 312 adjacent to the ground pad 312 that fixes one end of the first shielded wire 60 fixes the second shielded wire 70 as much as possible, and the ground pad 312 adjacent to the ground pad 312 that fixes one end of the second shielded wire 70 fixes the first shielded wire 60 as much as possible. In this way, the first shielded wires 60 and the second shielded wires 70 not only have a height difference, but also are arranged at intervals in a lateral direction perpendicular to the height direction, that is, in the lateral direction, the second shielded wires 70 are arranged between the two first shielded wires 60, and the first shielded wires 60 are located between the two second shielded wires 70. Since part of the electromagnetic interference signal to be radiated by the shield 40 may radiate from the area between the two second shielded wires 70 to the first shielded wire 60, the height is higher than the second shielded wire 70, and the first shielded wire 60 positioned between the two second shielded wires 70 can shield the part of the electromagnetic interference signal, thereby further improving the shielding effect of the package structure.

In the embodiment of the present application, as shown in FIG. 4 , there are at least two mutually parallel first shielded wires 60 among the plurality of first shielded wires 60 , and the projections of the at least two mutually parallel first shielded wires 60 on the first surface 311 extend along the first direction E, and/or there are at least two mutually parallel second shielded wires 70 among the plurality of second shielded wires 70 , and the projections of the at least two mutually parallel second shielded wires 70 on the first surface 311 extend along the first direction E. In this way, at least two first shielded wires 60 parallel to each other can be distributed on the first surface 311 as evenly as possible, and similarly, at least two second shielded wires 70 parallel to each other can be distributed on the first surface 311 as evenly as possible.

In a possible implementation manner, as shown in FIG. 4 , some of the first shielded wires 60 among the plurality of first shielded wires 60 are parallel to each other, and another part of the first shielded wires 60 has an included angle with the first shielded wires 60 that are parallel to each other; among the plurality of second shielded wires 70, some of the second shielded wires 70 are parallel to each other, and another part of the second shielded wires 70 has an included angle with the second shielded wires 70 that are parallel to each other. Exemplarily, as shown in FIG. 4 , the projections on the first surface 311 and the two first shielded lines 60 arranged along the first direction E are parallel to each other, and the projections on the first surface 311 are arranged along the second direction F. Three first shielded lines 60 are arranged parallel to each other, and the projections of the three first shielded lines 60 on the first surface 311 and the projections of the two first shielded lines 60 on the first surface 311 respectively have included angles.

In another possible implementation manner, as shown in FIG. 9 , every first shielded wire 60 is parallel; every second shielded wire 70 is parallel. Exemplarily, in FIG. 9 , the projections of the seven first shielded wires 60 on the first surface 311 are all arranged along the first direction E. Referring to FIG.

In another possible implementation manner, some of the first shielded lines 60 are parallel to each other, the projection of another part of the first shielded lines 60 on the first surface 311 has an included angle with the projection of the mutually parallel first shielded lines 60 on the first surface 311, and each of the second shielded lines 70 is parallel. Alternatively, some of the second shielded lines 70 are parallel to each other, and the projection of another part of the second shielded lines 70 on the first surface 311 has an included angle with the projection of the parallel second shielded lines 70 on the first surface 311 , and each first shielded line 60 is parallel.

In the embodiment of the present application, as shown in FIG. 4 , there is at least one projection of the first shielded wire 60 on the first surface 311 among the plurality of first shielded wires 60 , extending along the second direction F, and there is an angle between the second direction F and the first direction E;

In a possible implementation, as shown in FIG. 6 , among the plurality of first shielded wires 60 , the projection of a part of the first shielded wires 60 on the first surface 311 extends along the first direction E, and the projection of the other part of the first shielded wires 60 on the first surface 311 extends along the second direction F. Exemplarily, in FIG. 6 , the number of first shielded wires 60 is five, wherein projections of three first shielded wires 60 on the first surface 311 extend along the first direction E, and projections of the other two first shielded wires 60 on the first surface 311 extend along the second direction F. The arrangement of the second shielded wires 70 is similar to that of the first shielded wires 60 , and will not be repeated here.

Since the projection of some of the first shielded wires 60 on the first surface 311 among the plurality of first shielded wires 60 extends along the first direction E, and the projection of part of the first shielded wires 60 along the first surface 311 extends along the second direction F, and the second shielded wire 70 is the same.

In addition, as shown in FIG. 6 , when the first direction E is perpendicular to the second direction F, since a plurality of ground pads 312 are usually arranged symmetrically about the center of the projection of the member 40 to be shielded on the first surface 311, therefore, when the first direction E is orthogonal to the second direction F, in the process of manufacturing the package structure, one ground pad 312 and the ground pad 312 at a symmetrical position can be used as two fixed points to make the first shielded line 60, thereby facilitating the production of the first shielded line 60. Similarly, it is beneficial to manufacture the second shielded wire 70 .

In the embodiment of the present application, as shown in FIG. 4 , there is at least one projection of the first shielded wire 60 on the first surface 311 among the plurality of first shielded wires 60 , extending along the third direction G, and the first direction E and the second direction F respectively have an included angle with the third direction G; Among the plurality of first shielded wires 60, the projection of a part of the first shielded wires 60 on the first surface 311 extends along the first direction E, the projection of a part of the first shielded wires 60 on the first surface 311 extends along the second direction F, and the projection of a part of the first shielded wires 60 on the first surface 311 extends along the third direction G. Exemplarily, in FIG. 4 , the projections of the three first shielded wires 60 on the first surface 311 extend along the first direction E, the projections of the two first shielded wires 60 on the first surface 311 extend along the second direction F, and the projections of the two first shielded wires 60 on the first surface 311 extend along the third direction G. Besides, there are six first shielded wires 60 , and the projections of every two first shielded wires 60 on the first surface 311 extend along the fourth direction I, the fifth direction J and the sixth direction K respectively. The projections of the first shielded wires 60 extending along the third direction G, the fourth direction I, the fifth direction J and the sixth direction K are respectively located at the four corners of the member 40 to be shielded, and the first shielded wires 60 projected along the first direction E and the second direction F are located near the middle of the member 40 to be shielded. In this way, the first shielding layer formed by the plurality of first shielded wires 60 can cover the member 40 to be shielded as much as possible, thereby improving the shielding effect of the member 40 to be shielded. As shown in FIG. 4 , the arrangement of the second shielded wires 70 on the first surface 311 is similar to that of the first shielded wires 60 . Therefore, the second shielding layer formed by the plurality of second shielded wires 70 can also cover the object 40 to be shielded as much as possible.

As shown in FIG. 2 , the conductive coating 50 is fixed on the first surface 311, and there is a first dielectric layer 51 between the conductive coating 50 and the first surface 311, the first shielding wire 60 and the second shielding wire 70 are located in the first dielectric layer 51, and the conductive coating 50 is electrically connected to the first shielding wire 60. In this embodiment, the height between the conductive film 50 and the first surface 311 may be 0.49 mm.

As shown in FIG. 2 , since the conductive coating 50 is electrically connected to the first shielding wire 60 and the first shielding wire 60 is electrically connected to the ground pad 312 , the conductive coating 50 is electrically connected to the ground pad 312 . When the electromagnetic interference signal to be radiated by the shielding member 40 passes through the shielding of the second shielding layer and the first shielding layer in sequence, when there is still a small part of the electromagnetic interference signal radiating to the conductive coating 50, the conductive coating 50 can receive this part of the electromagnetic interference signal, and guide it to the ground pad 312 through the first shielding wire 60 for shielding, thereby further improving the shielding effect of the package structure.

As shown in FIG. 2 , the top of the first shielded wire 60 is in contact with the conductive film 50 . In this way, the structure is relatively simple, and the connection between the first shielding wire 60 and the conductive film 50 does not require other intermediate connectors. In the process of manufacturing the packaging structure of the embodiment of the present application, after the first shielding wire 60 and the second shielding wire 70 are prepared on the first surface 311, the first dielectric layer 51 can be prepared on the first surface 311, and then, the conductive film 50 can be directly prepared on the first dielectric layer 51, during which no other intermediate connectors need to be prepared, so the process flow can be saved.

It should be noted that, in FIGS. 2 , 4-11 , in order to clearly show the structure of the first shielding wire 60 and the second shielding wire 70 , the conductive coating is not shown.

Next, a simulation experiment is performed on the packaging structure of the related art shown in FIG. 1 and the packaging structure of the embodiment shown in FIG. 4 , wherein the number and arrangement of the grounding pads 312 on the first surface 311 are the same, and the energy of the shielding member 40 is set to 10 dBm. In the experiment, the electromagnetic near-field energy above the conductive coating 50 and at a height of 0.1 mm from the conductive coating 50 is tested, and a comparison diagram of electromagnetic near-field energy as shown in FIG. 12 is obtained. As shown in FIG. 12 , S1 is the near-field energy curve in the related art, and S2 is the near-field energy curve of the package structure of the embodiment shown in FIG. 4 . It can be seen from FIG. 12 that the near-field energy is different at different frequencies. Compared with the package structure shown in FIG. 1, the near-field energy of the package structure of the embodiment shown in FIG.

As shown in Figure 13, the embodiment of the present application also provides a packaging method, the packaging method includes:

S81 , providing the substrate 30 .

As shown in FIG. 2 , the substrate 30 has a first surface 311 on which a plurality of ground pads 312 are disposed.

The substrate 30 can be prepared in advance. In the process of preparing the substrate 30, as shown in FIG. 2 , the fourth metal layer 34, the second dielectric layer 35 between the fourth metal layer 34 and the third metal layer 33, the third metal layer 33, the second dielectric layer 35 between the third metal layer 33 and the second metal layer 32, the second metal layer 32, the second dielectric layer 35 and the first metal layer 31 between the second metal layer 32 and the first metal layer 31 can be prepared in sequence.

Next, a plurality of ground pads 312 are welded on the first surface 311 of the first metal layer 31 , and holes are processed on each ground pad 312 .

S82 , fixing the to-be-shielded component 40 to the first surface 311 .

The to-be-shielded component 40 may be fixed to the first surface 311 by welding. Exemplarily, a plurality of bumps 41 may be welded on the first surface 311 first, and then the member 40 to be shielded is welded to the plurality of bumps 41 .

S83. Prepare multiple second shielded wires 70 with multiple ground pads 312 as fixed points.

In the embodiment of the present application, both ends of each second shielded wire 70 are fixed to two ground pads 312 of the plurality of ground pads 312 , and at least part of the second shielded wire 70 is bent away from the first surface 311 .

Use equipment to inject molten liquid into the hole of one ground pad 312, and pull the device from one ground pad 312 to the other ground pad 312 according to a predetermined arc trajectory, and make the molten liquid fill the hole of the other ground pad 312 to complete the preparation of a second shielded wire 70. Next, the remaining second shielded wires 70 are prepared in the same manner.

S84. Prepare a plurality of first shielded wires 60 with the plurality of ground pads 312 as fixed points.

In the embodiment of the present application, both ends of each first shielded wire 60 are fixed to two ground pads 312 of the plurality of ground pads 312, at least part of the second shielded wire 70 is bent in a direction away from the first surface 311, and the second shielded wire 70 is closer to the first surface 311 than the first shielded wire 60.

Referring to the preparation method of the second shielded wire 70, a plurality of first shielded wires 60 are prepared, which will not be repeated here.

Since the second shielded wire 70 is closer to the first surface 311 than the first shielded wire 60 , that is, the first shielded wire 60 is farther away from the first surface 311 than the second shielded wire 70 . Therefore, in the process of manufacturing the package structure, after the to-be-shielded member 40 is soldered to the first surface 311, a plurality of second shielded wires 70 are first prepared, and then a plurality of first shielded wires 60 are prepared. In this way, after the preparation of the plurality of second shielded wires 70 is completed, there is enough space for preparing the first shielded wires 60. In addition, the packaging structure obtained by using the packaging method of the embodiment of the present application can form at least two shielding layers. After the electromagnetic interference signal radiated by the shielding member 40 first passes through the shielding of the second shielding layer, some electromagnetic interference signals may not be shielded, and this part of the unshielded electromagnetic interference signal reaches the first shielding layer and is shielded by the first shielding layer, thereby improving the electromagnetic shielding effect of the packaging structure.

S85 , preparing a first dielectric layer 51 on the first surface 311 .

A mold can be formed around the first surface 311 , and then the medium liquid is poured into the mold so that its top is flush with the top of the first shielding wire 60 . After the medium liquid is cooled, the first medium layer 51 can be formed. If the top of the first dielectric layer 51 is not flat enough or exceeds the top of the first shielded wire 60 , the first dielectric layer 51 can be polished to ensure that the top of the first dielectric layer 51 is flush with the top of the first shielded wire 60 .

S86 , welding a plurality of package pins 21 on the surface of the substrate 30 opposite to the first surface 311 .

After the plurality of package pins 21 are soldered, laser marking can be performed on the surface of the substrate 30 . Next, the substrate 30 may be diced into a plurality of individual package components.

S87, forming a conductive coating 50 on the top of the first dielectric layer 51 by means of coating.

After the first dielectric layer 51 is prepared, the conductive film 50 can be formed on the top of the first dielectric layer 51 by coating, specifically by sputtering coating or spray printing coating. Since the top of the first shielding wire 60 is flush with the top of the first dielectric layer 51 , the conductive film 50 formed on the top of the first dielectric layer 51 is also in contact with the first shielding wire 60 . In this way, when the package structure obtained by the package method of the embodiment of the present application is in use, after the electromagnetic interference signal to be radiated by the shielding member 40 passes through the shielding of the second shielding layer and the first shielding layer in sequence, when a small part of the electromagnetic interference signal still radiates to the conductive film 50, the conductive film 50 can receive this part of the electromagnetic interference signal, and guide it to the ground pad 312 through the first shielding wire 60 for shielding, thereby further improving the shielding effect of the package structure.

S88, welding one end of the plurality of packaging pins 21 away from the conductive film 50 to the PCB 20.

After ensuring that the surfaces of the plurality of package pins 21 facing away from the conductive film 50 are flat, and the dimensional accuracy of the package pins 21 meets the requirements, one end of the plurality of package pins 21 away from the conductive film 50 can be welded to the PCB 20, that is, a single package component and the PCB 20 are welded together.

The embodiments of the present application have been described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific embodiments. The above-mentioned specific embodiments are only illustrative and not restrictive. Under the inspiration of this application, those skilled in the art can also make many forms without departing from the purpose of the application and the scope of protection of the claims, all of which belong to the protection of the present application.

Claims

A package structure, characterized in that, comprising:

a substrate, the substrate has a first surface, and a plurality of ground pads are arranged on the first surface;

a member to be shielded, the member to be shielded is fixed on the first surface;

A plurality of first shielded wires, both ends of each of the first shielded wires are electrically connected to two of the plurality of ground pads, and at least part of the first shielded wires are bent in a direction away from the first surface;

A plurality of second shielded wires, both ends of each of the second shielded wires are electrically connected to two of the ground pads, at least part of the second shielded wires are bent in a direction away from the first surface, and the second shielded wires are closer to the first surface than the first shielded wires.
The packaging structure according to claim 1, wherein the first shielded wire and the second shielded wire are arc-shaped wires;

The second heights between the tops of the second shielded wires and the first surface are the same, and the first heights between the tops of the first shielded wires and the first surface are the same.
The package structure according to claim 2, wherein the ratio between the second height and the first height is greater than or equal to 0.3 and less than or equal to 0.7.
The packaging structure according to any one of claims 1-3, wherein at least part of the projection of the first shielded wire on the first surface overlaps with the projection of the member to be shielded on the first surface;

At least part of the projection of the second shielded wire on the first surface overlaps with the projection of the component to be shielded on the first surface.
The package structure according to any one of claims 1-4, wherein a projection of at least part of the first shielded wire on the first surface overlaps with a projection of at least part of the second shielded wire on the first surface.
The packaging structure according to any one of claims 1-5, wherein the packaging structure further comprises: a conductive coating, the conductive coating is fixed on the first surface, and a first dielectric layer is provided between the conductive coating and the first surface, the first shielding wire and the second shielding wire are both located in the first dielectric layer, and the conductive coating is electrically connected to the first shielding wire.
The package structure according to any one of claims 1-6, wherein the plurality of ground pads surround a projection of the member to be shielded on the first surface.
The package structure according to any one of claims 1-7, wherein the projection adjacent to the projection of the second shielded line on the first surface is the projection of the first shielded line.
The packaging structure according to any one of claims 1-8, wherein there are at least two first shielded lines parallel to each other among the plurality of first shielded lines, and projections of at least two first shielded lines parallel to each other on the first surface extend along the first direction;

And/or, there are at least two second shielded lines parallel to each other among the plurality of second shielded lines, and projections of the at least two second shielded lines parallel to each other on the first surface both extend along the first direction.
The packaging structure according to claim 9, wherein there is at least one projection of the first shielded wire on the first surface among the plurality of first shielded wires, extending along a second direction, and an included angle exists between the second direction and the first direction;

And/or, among the plurality of second shielded wires, there is also a projection of at least one second shielded wire on the first surface, extending along the second direction.
The package structure according to claim 10, wherein the first direction is orthogonal to the second direction.
The packaging structure according to claim 10 or 11, wherein, among the plurality of first shielded wires, there is also a projection of at least one of the first shielded wires on the first surface, extending along a third direction, and the first direction and the second direction respectively have an included angle with the third direction;

And/or, among the plurality of second shielded wires, there is also a projection of at least one second shielded wire on the first surface, extending along the third direction.
The package structure according to claim 6, wherein the first shielding wire is in contact with the conductive film.
The package structure according to any one of claims 1-13, wherein the substrate comprises a first metal layer, a second dielectric layer, and a second metal layer stacked in sequence, the first surface is located on a side of the first metal layer away from the second dielectric layer, a conductive device is provided inside the second dielectric layer, a ground layer is provided on a surface of the second metal layer connected to the second dielectric layer, and the ground layer is electrically connected to the ground pad through the conductive device.
An electronic device, characterized by comprising a circuit board and the packaging structure according to any one of claims 1-14, the circuit board being electrically connected to the packaging structure.
A packaging method, characterized in that the packaging method comprises:

providing a substrate, the substrate has a first surface, and a plurality of ground pads are arranged on the first surface;

fixing the member to be shielded to the first surface;

Using the plurality of ground pads as fixed points, preparing a plurality of second shielded wires, wherein both ends of each of the second shielded wires are fixed to two of the ground pads of the plurality of ground pads, and at least part of the second shielded wires are bent in a direction away from the first surface;

Using the plurality of ground pads as fixed points, prepare a plurality of first shielded wires, wherein both ends of each of the first shielded wires are fixed to the two ground pads of the plurality of ground pads, at least part of the second shielded wire is bent in a direction away from the first surface, and the second shielded wire is closer to the first surface than the first shielded wire.
The packaging method according to claim 16, wherein after the step of preparing a plurality of first shielded wires with the plurality of ground pads as fixed points, the packaging method further comprises:

preparing a first dielectric layer on the first surface, the top of the first dielectric layer being flush with the top of the first shielded wire;

A conductive film is formed on the top of the first dielectric layer by plating, and the conductive film is in contact with the first shielding wire.