WO2023120954A1 - Procédé de passivation d'article revêtu par injection - Google Patents
Procédé de passivation d'article revêtu par injection Download PDFInfo
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- WO2023120954A1 WO2023120954A1 PCT/KR2022/016914 KR2022016914W WO2023120954A1 WO 2023120954 A1 WO2023120954 A1 WO 2023120954A1 KR 2022016914 W KR2022016914 W KR 2022016914W WO 2023120954 A1 WO2023120954 A1 WO 2023120954A1
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- passivation
- injection
- plating
- injection molding
- plated
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Links
- 238000000034 method Methods 0.000 title claims abstract description 70
- 238000002161 passivation Methods 0.000 claims abstract description 116
- 238000007747 plating Methods 0.000 claims abstract description 96
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 37
- 239000011651 chromium Substances 0.000 claims abstract description 37
- 238000001035 drying Methods 0.000 claims abstract description 12
- 238000005530 etching Methods 0.000 claims abstract description 11
- 238000005238 degreasing Methods 0.000 claims abstract description 10
- 230000003472 neutralizing effect Effects 0.000 claims abstract description 8
- 238000001746 injection moulding Methods 0.000 claims description 45
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 43
- 239000000463 material Substances 0.000 claims description 30
- 229910052759 nickel Inorganic materials 0.000 claims description 21
- 239000000126 substance Substances 0.000 claims description 20
- 150000003839 salts Chemical class 0.000 claims description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 239000000243 solution Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 238000002347 injection Methods 0.000 claims description 9
- 239000007924 injection Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 9
- 239000000654 additive Substances 0.000 claims description 8
- 239000012153 distilled water Substances 0.000 claims description 7
- 230000000996 additive effect Effects 0.000 claims description 6
- 238000005406 washing Methods 0.000 claims description 6
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 claims description 4
- GRWVQDDAKZFPFI-UHFFFAOYSA-H chromium(III) sulfate Chemical compound [Cr+3].[Cr+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GRWVQDDAKZFPFI-UHFFFAOYSA-H 0.000 claims description 3
- 229910000356 chromium(III) sulfate Inorganic materials 0.000 claims description 3
- 235000015217 chromium(III) sulphate Nutrition 0.000 claims description 3
- 239000011696 chromium(III) sulphate Substances 0.000 claims description 3
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 25
- 238000005260 corrosion Methods 0.000 description 21
- 230000007797 corrosion Effects 0.000 description 21
- 230000007547 defect Effects 0.000 description 17
- 239000007921 spray Substances 0.000 description 13
- 239000003599 detergent Substances 0.000 description 12
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 239000007844 bleaching agent Substances 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 2
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 2
- 238000007591 painting process Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 229910021555 Chromium Chloride Inorganic materials 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 231100000357 carcinogen Toxicity 0.000 description 1
- 239000003183 carcinogenic agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229910001430 chromium ion Inorganic materials 0.000 description 1
- QSWDMMVNRMROPK-UHFFFAOYSA-K chromium(3+) trichloride Chemical compound [Cl-].[Cl-].[Cl-].[Cr+3] QSWDMMVNRMROPK-UHFFFAOYSA-K 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 238000005237 degreasing agent Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000005211 surface analysis Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/024—Anodisation under pulsed or modulated current or potential
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/38—Chromatising
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/04—Electroplating: Baths therefor from solutions of chromium
- C25D3/06—Electroplating: Baths therefor from solutions of chromium from solutions of trivalent chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
Definitions
- the present invention relates to a passivation treatment method for an injection-plated product, and more particularly, to a passivation treatment method for an injection-plated product for improving corrosion resistance and chemical resistance by passivation treatment.
- chrome plating is to visually enhance aesthetics, and functionally to cathode the material through a passivation film to create an electrochemically inactive state to increase corrosion resistance and abrasion resistance.
- This naturally generated passivation film exists on the surface layer as very thin as 1-3 nm.
- Types of chromium plating currently commercialized include trivalent chromium plating and hexavalent chromium plating.
- trivalent chromium plating is gradually being regulated globally as carcinogens, and trivalent chromium plating is increasing as an alternative.
- trivalent chromium plating is significantly inferior to hexavalent chromium in corrosion resistance and chemical resistance.
- the trivalent chromium plating is plated at a high current density, microcracks due to internal stress may exist, and water or oxygen comes into contact with the nickel plating layer, which is an underlying layer, through the microcracks. Accordingly, a local battery in which the nickel plating layer serves as an anode is formed to promote corrosion.
- iron (Fe) is used as a conduction aid, and the iron component forms vacancies in the plating layer to promote corrosion.
- transparent coating is applied after trivalent chromium plating in order to prevent the above-mentioned defects, but a lot of money loss occurs due to cost increase and defect rate increase due to coating cost.
- An object of the present invention to solve the above problems is to provide a passivation treatment method for an injection-plated material that improves corrosion resistance and chemical resistance through a passivation process while utilizing trivalent chromium plating.
- a passivation treatment method for an injection-plated article includes the steps of racking and degreasing the injection-molded article; Etching and neutralizing the degreased injection product; Catalyzing and accelerating the neutralized injection molding product; plating the accelerated injection molding; Passivating the plated injection molding; and drying, wherein the plating step includes trivalent chromium plating, and the passivating step may be performed using Pulse Reverse Current (PR).
- PR Pulse Reverse Current
- the plating step may include chemical nickel plating.
- the plating may include copper plating.
- the plating step may include nickel plating.
- the passivation step is composed of 1 to 3% of Chromium (III) sulfate, 5 to 10% of Etidronic acid, and 87 to 94% of distilled water as main components It can be carried out with a passivation solution containing
- the passivation step may be performed with a passivation liquid containing 3,3'-Methylenebis as an additive.
- the passivation step may be performed with a passivation liquid containing an organic salt.
- the passivation step may apply a current density of 0.1 to 0.4 A/dm 2 .
- the passivation step may be performed with a passivation liquid having a pH of 9.3 to 9.7 and a temperature of 25 to 35 °C.
- the passivation step may be performed for 210 to 240 seconds.
- the drying step may be performed at 60 to 70° C. for 5 to 10 minutes.
- the passivation treatment method of the injection-plated article according to an embodiment of the present invention may further include a step of washing the water after the passivation step.
- the washing step may be performed by immersing in ion-exchanged water or distilled water at 40 to 60 ° C. for 30 to 90 seconds.
- the thickness of the passivation film generated through the passivation treatment method of injection-plated material according to an embodiment of the present invention may be 8 nm or more.
- the passivation treatment method of injection molding includes the steps of racking and degreasing the injection molding; Etching and neutralizing the degreased injection product; Catalyzing and accelerating the neutralized injection molding product; plating the accelerated injection molding; Passivating the plated injection molding; and drying, and the resulting passivation film may have a thickness of 8 nm or more.
- injection molding according to an embodiment of the present invention, the injection molding; a plating layer provided on the injection-molded product; and a passivation film provided on the plating layer, wherein the plating layer includes trivalent chromium plating, and the passivation film may have a thickness of 8 nm or more.
- FIG. 1 is a flow chart showing a passivation treatment method for an injection-plated product according to an example of the present invention.
- FIG. 2 is a schematic diagram showing the occurrence of corrosion due to micro cracks and surface vacancies present in a plated product subjected to trivalent chromium plating.
- FIG 3 is a cross-sectional photograph of micro-cracks present in a plated product subjected to trivalent chromium plating using a scanning electron microscope (SEM).
- FIG. 4 is a schematic diagram showing an injection-plated material subjected to passivation treatment according to an embodiment of the present invention.
- FIG. 5 is a graph showing the thickness of the passivation film subjected to the passivation process using a general DC current.
- FIG. 6 is a graph showing the thickness of a passivation film subjected to passivation treatment using a PR current.
- FIG. 7 is a photograph showing poor rusting as a result of performing a 72-hour salt spray test on a plated product plated with trivalent chromium.
- FIG. 8 is a photograph showing defects in blistering as a result of performing a 72-hour salt spray test on a plate plated with trivalent chromium.
- FIG. 9 is a photograph showing no defects as a result of performing a 120-hour salt spray test, a 96-hour detergent test, and a 3-hour bleach test on the passivated injection molding according to an example of the present invention.
- FIG. 10 is a photograph showing poor rusting as a result of performing a 24-hour detergent test on a plate plated with trivalent chromium.
- FIG. 11 is a photograph showing peeling defects as a result of performing a 2-hour lax test on a plated material plated with trivalent chromium.
- a passivation treatment method for an injection-plated article includes the steps of racking and degreasing the injection-molded article; Etching and neutralizing the degreased injection product; Catalyzing and accelerating the neutralized injection molding product; plating the accelerated injection molding; Passivating the plated injection molding; and drying, wherein the plating step includes trivalent chromium plating, and the passivating step may be performed using Pulse Reverse Current (PR).
- PR Pulse Reverse Current
- a passivation treatment method for an injection-plated article includes the steps of racking and degreasing the injection-molded article; Etching and neutralizing the degreased injection product; Catalyzing and accelerating the neutralized injection molding product; plating the accelerated injection molding; Passivating the plated injection molding; and drying.
- FIG. 1 is a flow chart showing a passivation treatment method for an injection-plated product according to an example of the present invention.
- a passivation treatment method for an injection-plated article may include steps of racking, degreasing, etching, neutralization, catalization, acceleration, plating, passivation, and drying. Each step is described in detail below.
- the plastic material may be ABS or PC-ABS material, but is not limited thereto.
- the plastic material may be manufactured as an injection molding product by injection molding according to the purpose.
- a degreasing step for removing foreign substances from the injection-molded product may be performed.
- the degreasing step may be performed by immersing the injection-molded product in a degreasing agent at 45 to 55° C. for 1 to 5 minutes.
- the degreased injection molding product may generate an anchor by performing an etching step to remove the butadiene component on the surface.
- the etching process may be performed by immersing for 8 to 12 minutes in a mixed solution containing 380 to 420 g/L of chromic anhydride and 200 to 240 ml/L of sulfuric acid at 68 to 70 °C.
- a step of neutralizing the etching solution may be performed to prevent non-plating.
- the neutralization step may be performed by immersing in a solution containing 30 to 35 ml/L of hydrochloric acid at 20 to 30° C. for 1 to 2 minutes.
- a catalysing step for adsorbing Pd (palladium) and Sn (tin) components to the surface of the neutralized injection molding product may be performed.
- the catalyzing step may be performed by immersing for 2 to 3 minutes in a mixed solution containing 50 ppm in Pd 30 and 200 to 300 ml / L of hydrochloric acid at 27 to 33 ° C.
- the Catalyst injection molding product undergoes an Acceleration step, whereby the Sn (tin) component adsorbed in the Catalyst process can be removed.
- the accelerating step may be performed by immersing in a solution containing 180 to 220 ml/L of sulfuric acid at 40 to 50° C. for 2 to 3 minutes.
- a step of plating the accelerated injection-molded product may be performed.
- the plating may include chemical nickel plating, copper plating, nickel plating, and trivalent chromium plating.
- the chemical nickel plating is a process of forming an electroless nickel plating layer so that electricity can be applied using the Pd (palladium) component on the surface of the injection molding product as a catalyst. That is, the chemical nickel plating can be regarded as a preceding process for electroplating. According to one example of the present invention, the chemical nickel plating may be performed by dipping for 5 to 8 minutes in a solution containing 5 to 10 g/L of nickel sulfate and 12 to 18 g/L of hypophosphite at 25 to 45 ° C. .
- the copper plating is a process of forming a copper plating layer on the surface of an injection-molded product so as to perform a role of imparting gloss through surface smoothing and buffering between the injection-molded product and the Ni (nickel) plating layer.
- the copper plating may be performed with a solution containing 180 to 220 g/L of copper sulfate, 50 to 70 g/L of sulfuric acid, and additives at 22 to 30°C.
- the copper plating layer formed through the copper plating may have a thickness of 15 ⁇ m or more.
- the nickel plating is a process of forming a nickel plating layer on top of the copper plating layer in order to impart corrosion resistance and surface gloss to the injected product.
- the nickel plating may be performed with a solution containing 250 to 280 g/L of nickel sulfate, 40 to 60 g/L of nickel chloride, and additives at 45 to 55 °C.
- a thickness of the nickel plating layer formed through the nickel plating may be 10 ⁇ m or more.
- the trivalent chromium plating is a process of forming a trivalent chromium plating layer on top of the nickel plating layer in order to improve corrosion resistance and surface hardness of an injection-molded product.
- the trivalent chromium plating may be performed with a solution containing 100 to 120 g/L of chromium chloride and an additive at 20 to 30°C.
- the trivalent chromium plating layer formed through the trivalent chromium plating may have a thickness of 0.15 ⁇ m or more.
- a step of passivating the plated injection molding product may be performed.
- the passivation liquid used in the passivation treatment step may include, as main components, 1 to 3% of Chromium (III) sulfate, 5 to 10% of Etidronic acid, and 87 to 94% of distilled water.
- main components etidronic acid can play a role in adjusting the pH of the passivation solution.
- the main component may be added in an amount of 23 to 27ml/L.
- the passivation solution used in the passivation treatment step may contain 3,3'-Methylenebis as an additive.
- the additive may serve to prevent trivalent chromium from being oxidized to hexavalent chromium.
- the additive may be added in an amount of 0.3 to 0.7ml/L.
- the passivation liquid used in the passivation treatment step may contain an organic salt.
- the organic salt may include, for example, a surfactant.
- the organic salt may play a role of increasing the reaction rate by lowering the surface tension, allowing the passivation liquid to spread uniformly on the surface of the injection-molded product.
- the organic salt may be added in an amount of 14 to 16 g/L.
- the passivating step may be performed with a passivation liquid having a pH of 9.3 to 9.7 and a temperature of 25 to 35 °C.
- the above pH and temperature ranges are ranges in which a thick passivation film can be formed within a range that does not reduce productivity.
- the passivating step may be performed for 210 to 240 seconds.
- the passivation treatment time is short, the passivation film may be formed thinly.
- the passivation treatment is performed for a long time, it may be difficult to secure sufficient corrosion resistance and chemical resistance.
- the passivation process may be performed using Pulse Reverse Current (PR).
- PR Pulse Reverse Current
- the corrosion resistance of metal depends on how dense and chemically stable the oxide film formed on the metal surface is.
- the PR current does not have a large current deviation between high current and low current, so it can play a role in forming a uniform and dense passivation film.
- a current density of 0.1 to 0.4 A/dm 2 may be applied using an injection-molded product as a cathode.
- the current density range may be set in consideration of productivity and passivation film thickness.
- the drying step may be performed at 60 to 70° C. for 5 to 10 minutes.
- the passivation treatment method of injection molding according to an embodiment of the present invention may further include a step of washing the water after the passivation step.
- the rinsing may be performed to efficiently perform a drying process by removing chromic acid and organic substances, which are harmful components, remaining on the surface of the injection-molded product and removing moisture from the surface of the injection-molded product.
- the step of washing the water may be performed by immersing in ion-exchanged water or distilled water at 40 to 60 ° C. for 30 to 90 seconds.
- the thickness of the passivation film created through the passivation treatment method of the injection-plated material described above may be 8 nm or more.
- the thickness of the passivation film that is naturally generated is 1 to 3 nm, and the thickness of the passivation film that is generated through a general DC current is about 3 nm. Therefore, corrosion resistance and chemical resistance can be improved by forming a uniform and thick passivation film through the passivation treatment method of injection molding according to one embodiment of the present invention.
- An injection-plated product is an injection-molded product; a plating layer provided on the injection-molded product; and a passivation film provided on the plating layer, wherein the plating layer includes trivalent chromium plating, and the passivation film may have a thickness of 8 nm or more.
- the plating layer may include a copper plating layer, a nickel plating layer, and a trivalent chromium plating layer.
- FIG. 2 is a schematic diagram showing the occurrence of corrosion due to microcracks and surface vacancies present in a plating material plated with trivalent chromium
- FIG. 3 shows microcracks present in a plating material plated with trivalent chromium using a scanning electron microscope (SEM) , a cross-sectional picture taken with a scanning electron microscope).
- SEM scanning electron microscope
- FIG. 4 is a schematic diagram showing an injection-plated material subjected to passivation treatment according to an embodiment of the present invention.
- the resulting passivation film thickness was measured through XPS analysis.
- a salt spray test, a detergent test, and a lax test are performed to determine corrosion resistance and chemical resistance. Evaluated.
- XPS X-ray Photoelectron. Spectroscopy
- FIG. 5 is a graph showing the thickness of the passivation film passivated using a general DC current
- FIG. 6 is a graph showing the thickness of the passivation film subjected to the passivation process using a PR current.
- the salt spray test was performed over a certain cycle by spraying 5 wt% sodium chloride (NaCl) for 8 hours and resting for 16 hours as one cycle at a temperature of 35 ° C.
- FIG. 7 is a photograph showing poor rusting as a result of performing a 72-hour salt spray test on a plate plated with trivalent chromium
- FIG. 8 is a 72-hour salt spray test for a plate plated with trivalent chromium.
- FIG. 9 is a 120-hour salt spray test, a 96-hour detergent test, and a 3-hour bleach test for the passivated injection plating material according to an example of the present invention, respectively. As a result, it is a picture without defects.
- the detergent test was carried out by immersion in a 60° C. solution of 0.5% bleach, 0.5% detergent and the rest distilled water for a certain period of time or longer.
- FIG. 10 is a photograph showing poor rusting as a result of performing a 24-hour detergent test on a plating material plated with trivalent chromium, and FIG. As a result of performing a 120-hour salt spray test, a 96-hour detergent test, and a 3-hour bleach test, respectively, this is a photo showing no defects.
- the lacquer test was performed by immersing 5% lacquer at room temperature for a certain period of time or longer.
- FIG. 11 is a photograph showing peeling defects as a result of performing a 2-hour bleach test on a plating material plated with trivalent chromium, and FIG. As a result of performing a 120-hour salt spray test, a 96-hour detergent test, and a 3-hour bleach test, respectively, this is a photo showing no defects.
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Abstract
Un procédé pour la passivation d'un article revêtu par injection, selon un mode de réalisation de la présente invention, comprend les étapes consistant à : soutirer et dégraisser l'article moulé par injection ; graver et neutraliser l'article moulé par injection dégraissé ; catalyser et accélérer l'article moulé par injection neutralisé ; revêtir l'article moulé par injection accéléré ; passiver l'article moulé par injection revêtu ; et sécher celui-ci, l'étape de revêtement consistant à revêtir avec du chrome trivalent et l'étape de passivation étant effectuée à l'aide d'un courant à impulsions inversées (PR).
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2015209579A (ja) * | 2014-04-28 | 2015-11-24 | ユケン工業株式会社 | 着色部材およびその製造方法、液状電解質ならびに濃縮組成物 |
JP2019108616A (ja) * | 2014-03-07 | 2019-07-04 | マクダーミッド アキューメン インコーポレーテッド | 三価電解液から析出される微小不連続クロムの不動態化 |
KR20200014970A (ko) * | 2018-08-02 | 2020-02-12 | 주식회사 주영테크 | 도금 불량 방지기능을 갖는 이중 사출 성형품의 도금방법 |
JP2020506292A (ja) * | 2017-02-13 | 2020-02-27 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH | 最外クロム層または最外クロム合金層を電解不動態化して耐食性を向上させる方法 |
US20200340122A1 (en) * | 2019-04-26 | 2020-10-29 | Bulk Chemicals, Inc. | Process and composition for passivating metal surfaces |
-
2021
- 2021-12-21 KR KR1020210184248A patent/KR20230094811A/ko unknown
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- 2022-11-01 WO PCT/KR2022/016914 patent/WO2023120954A1/fr unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2019108616A (ja) * | 2014-03-07 | 2019-07-04 | マクダーミッド アキューメン インコーポレーテッド | 三価電解液から析出される微小不連続クロムの不動態化 |
JP2015209579A (ja) * | 2014-04-28 | 2015-11-24 | ユケン工業株式会社 | 着色部材およびその製造方法、液状電解質ならびに濃縮組成物 |
JP2020506292A (ja) * | 2017-02-13 | 2020-02-27 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH | 最外クロム層または最外クロム合金層を電解不動態化して耐食性を向上させる方法 |
KR20200014970A (ko) * | 2018-08-02 | 2020-02-12 | 주식회사 주영테크 | 도금 불량 방지기능을 갖는 이중 사출 성형품의 도금방법 |
US20200340122A1 (en) * | 2019-04-26 | 2020-10-29 | Bulk Chemicals, Inc. | Process and composition for passivating metal surfaces |
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