WO2023118383A1 - Pièce en matériau composite recyclé et procédé de fabrication - Google Patents
Pièce en matériau composite recyclé et procédé de fabrication Download PDFInfo
- Publication number
- WO2023118383A1 WO2023118383A1 PCT/EP2022/087372 EP2022087372W WO2023118383A1 WO 2023118383 A1 WO2023118383 A1 WO 2023118383A1 EP 2022087372 W EP2022087372 W EP 2022087372W WO 2023118383 A1 WO2023118383 A1 WO 2023118383A1
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- WIPO (PCT)
- Prior art keywords
- chips
- chip
- composite material
- carbon fibers
- adhesive
- Prior art date
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 89
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000000853 adhesive Substances 0.000 claims abstract description 97
- 230000001070 adhesive effect Effects 0.000 claims abstract description 97
- 239000011159 matrix material Substances 0.000 claims abstract description 27
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 13
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 96
- 239000004917 carbon fiber Substances 0.000 claims description 96
- 239000000835 fiber Substances 0.000 claims description 56
- 238000000034 method Methods 0.000 claims description 41
- 230000008569 process Effects 0.000 claims description 28
- 238000005520 cutting process Methods 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 10
- 229910052799 carbon Inorganic materials 0.000 abstract description 10
- 239000000463 material Substances 0.000 description 34
- 229920005989 resin Polymers 0.000 description 31
- 239000011347 resin Substances 0.000 description 31
- 238000004064 recycling Methods 0.000 description 20
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- 238000005452 bending Methods 0.000 description 13
- 230000002457 bidirectional effect Effects 0.000 description 13
- 238000006116 polymerization reaction Methods 0.000 description 13
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- 238000003797 solvolysis reaction Methods 0.000 description 8
- 239000000945 filler Substances 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 238000000605 extraction Methods 0.000 description 6
- 239000003292 glue Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
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- 238000006243 chemical reaction Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000013001 point bending Methods 0.000 description 4
- 229920001601 polyetherimide Polymers 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000004697 Polyetherimide Substances 0.000 description 3
- 238000012512 characterization method Methods 0.000 description 3
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- 230000007613 environmental effect Effects 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
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- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 239000004634 thermosetting polymer Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 229920002292 Nylon 6 Polymers 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004954 Polyphthalamide Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000003490 calendering Methods 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000000593 degrading effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical class OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
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- 230000008018 melting Effects 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 230000008447 perception Effects 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920002239 polyacrylonitrile Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920006375 polyphtalamide Polymers 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
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- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical class NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- XMTQQYYKAHVGBJ-UHFFFAOYSA-N 3-(3,4-DICHLOROPHENYL)-1,1-DIMETHYLUREA Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C(Cl)=C1 XMTQQYYKAHVGBJ-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 239000005510 Diuron Substances 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000002144 chemical decomposition reaction Methods 0.000 description 1
- JXCGFZXSOMJFOA-UHFFFAOYSA-N chlorotoluron Chemical compound CN(C)C(=O)NC1=CC=C(C)C(Cl)=C1 JXCGFZXSOMJFOA-UHFFFAOYSA-N 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 229960000860 dapsone Drugs 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- XXOYNJXVWVNOOJ-UHFFFAOYSA-N fenuron Chemical compound CN(C)C(=O)NC1=CC=CC=C1 XXOYNJXVWVNOOJ-UHFFFAOYSA-N 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011325 microbead Substances 0.000 description 1
- BMLIZLVNXIYGCK-UHFFFAOYSA-N monuron Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C=C1 BMLIZLVNXIYGCK-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000011146 organic particle Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 239000012925 reference material Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- 239000000243 solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/042—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/0026—Recovery of plastics or other constituents of waste material containing plastics by agglomeration or compacting
- B29B17/0042—Recovery of plastics or other constituents of waste material containing plastics by agglomeration or compacting for shaping parts, e.g. multilayered parts with at least one layer containing regenerated plastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/04—Disintegrating plastics, e.g. by milling
- B29B17/0412—Disintegrating plastics, e.g. by milling to large particles, e.g. beads, granules, flakes, slices
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/04—Disintegrating plastics, e.g. by milling
- B29B2017/042—Mixing disintegrated particles or powders with other materials, e.g. with virgin materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2307/00—Use of elements other than metals as reinforcement
- B29K2307/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/141—Feedstock
- Y02P20/143—Feedstock the feedstock being recycled material, e.g. plastics
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
Definitions
- the present invention relates to the field of recycling composite materials, in particular composite materials comprising carbon fibers.
- Composite materials based on carbon fibers are used in many technical fields for their mechanical properties, in particular resistance and lightness. They are commonly used in particular in the aeronautical field, in the automotive industry, in boating, but also in the field of construction, energy, etc. Composite materials based on carbon fibers generally comprise carbon fibers included in a matrix.
- the carbon fibers are included in the matrix according to a given orientation, for example unidirectionally, or in the form of sheets of woven fibers.
- the matrix generally, it consists of a polymer or it essentially comprises a polymer.
- the matrix can also be called “adhesive”, or even “resin” (the matrix generally being a polymer).
- the matrix can be thermoplastic or thermosetting in nature. Adhesives of a similar nature can be used in the same way within the scope of the present invention. Thus, unless otherwise stated, the terms "matrix”, “glue”, “adhesive” and “resin” are considered synonymous in this document.
- thermosetting polymers undergo a chemical reaction called crosslinking during the shaping of the composite material. This reaction generates chemical bonds and is irreversible. It is generally accepted that the most effective thermosetting polymers for forming a composite material based on carbon fibers are polyepoxides (known as “epoxies”).
- Thermoplastic polymers are polymers which, beyond a certain temperature, called “phase transition temperature”, below their thermal degradation temperature, become viscous and can thus be shaped. When the temperature drops below this phase transition temperature, the polymer hardens and regains its initial stiffness. This hardening is reversible, by heating the polymer again.
- the most common thermoplastic polymers are polyethylene (PE), poly(ethylene terephthalate) (PET) or polycaprolactam (PA-6).
- PEEK poly(phenylene ether-ether-ketone)
- PPS poly(phenylene sulfide)
- PEI polyetherimide
- composite materials based on carbon fibers being numerous and increasingly widespread, the question of the recycling of these materials arises.
- these composite materials are high-value materials (largely due to the fact that they contain carbon fibers), the recovery of which may prove to be economically relevant.
- Recycling may concern elements made of composite material at the end of their life or having suffered damage, elements manufactured but not meeting or no longer meeting certain standards required for the use for which they are intended (in particular in the aeronautical or space field) , or, more rarely, items not used on a certain date.
- Mechanical recycling consists, in principle, of splitting and grinding existing composite material parts to separate at least partially the fibers from the resin, so as to obtain more or less long fibers which can be reused as reinforcement in new new resin.
- the low fibrous particles resulting from the grinding which come in the form of powder, can be mixed with a resin during the formation of a new element in composite material.
- the shredded pieces of composite are used as filling elements or as reinforcement in molded parts, but are not really intended to replace virgin carbon fibers as used in the traditional processes for manufacturing composite elements (based on non-recycled materials).
- the powder obtained by grinding the composite materials to be recycled can be sieved in order to be sorted into several categories of particle sizes, without however this size having a significant influence on the mechanical properties of the element then formed in including these particles.
- Chemical recycling consists of chemically degrading the hardened resin of a composite material in order to recover carbon fibers present in this material.
- the recovered fibers are then generally aligned and/or spun to create a yarn from several thousand recovered fibers.
- the mechanical properties of parts formed from composite materials comprising these recycled fibers are much lower than those of composite materials comprising new, non-recycled carbon fibers.
- chemical degradation processes are known, in particular conventional solvolysis, solvolysis “under mild conditions”, or solvolysis under supercritical conditions.
- the parts to be recycled are immersed in a solvent, at high temperature (more than 200°C) and high pressure (around 180 bar), so that the resin is decomposed.
- a solvent at high temperature (more than 200°C) and high pressure (around 180 bar), so that the resin is decomposed.
- These may be, for example, concentrated acids (nitric acid or sulfuric acid in particular).
- solvolysis under mild conditions, more moderate temperatures than in conventional solvolysis, below 200° C., are used.
- the process takes place at atmospheric pressure (ambient pressure), and milder solvents, such as acetone or N,N-dimethylformamide are used, as well as possibly catalysts such as hydrogen peroxide or peroxyaceous acid tick.
- Pre-treatment with acetic acid can also be used. That said, solvolysis under mild conditions has a fairly low production yield.
- solvents are used under supercritical conditions to exhibit improved diffusivity and increased solvating ability. It is a complex and expensive process.
- thermal recycling consists in principle of thermally degrading the resin of a composite material to recover the carbon fibers.
- the heat can be provided by a pyrolysis process, which generally consists of burning the resin in an oven, by a fluidized bed process which uses the combined action of a solvent and high temperature, and finally by micro- waves.
- the recovered fibers have highly degraded mechanical properties compared to new fibers.
- THE Recovered fibers are generally short, they must be aligned and spun to be reused in applications requiring correct mechanical characteristics. Otherwise, they are used in filling, as are for example the powders obtained in the mechanical recycling processes mentioned above.
- the present invention aims to provide a composite material part obtained by a recycling process which overcomes all or part of the problems mentioned above. In particular, it aims to obtain a part made of composite material with high mechanical properties, at a controlled economic and environmental cost.
- the invention relates to a part made of composite material comprising shavings at least partly included in a matrix.
- Each chip has a substantially constant thickness defined between two opposite parallel faces of the chip, each chip comprising carbon fibers at least partly included in an adhesive hardened during a first hardening prior to the formation of said part. At least a majority of the fibers of the chip extend substantially parallel to opposite faces of the chip.
- the matrix in which each chip is embedded at least in part is formed of an adhesive cured during a second cure. Thus, a bonding interface is formed between the die and each chip in the part.
- the concept of substantially constant thickness is interpreted as follows.
- the thickness corresponds to the smallest dimension of the chip, which is small compared to its other dimensions (for example compared to its length and its width for a chip in a rectangular shape).
- the chip thickness is substantially constant, because the chip has two (main) faces opposite substantially parallel at all points.
- the chip is flat in the absence of constraints, it can be curved once included in a part which is the subject of the present invention. This possible curvature is possible due to the low thickness of the chip, which gives it a certain flexibility.
- the thickness of the chip measured perpendicular to the main faces of the chip, is constant at all points of the chip, or, at the very least, is perceived as constant by an observer.
- the thickness is “substantially” constant, that is to say that it is naturally perceived as constant.
- the thickness is substantially constant when the smallest thickness is not less than half of the greatest thickness measured on a chip, and preferably when the difference between the greatest thickness and the smallest thickness measured on one chip does not exceed 25%.
- the thickness is substantially constant when the difference between the smallest thickness and the largest thickness measured on the chip does not exceed 0.5 mm.
- the bonding interface may essentially comprise mechanical adhesion bonds.
- mechanical adhesion bond is meant a mechanical bond such as a mechanical anchor (physical anchoring of the adhesive in the roughness of the solid surface of the chips), as well as possibly a bond by diffusion (diffusion of the adhesive in the chip) and/or a bond of the thermodynamic type, in particular of the “Van der Waals” type.
- Mechanical adhesion bonds are inherently different from ionocovalent bonds.
- the expression "essentially mechanical adhesion bonds” expresses the fact that the first hardening is deemed to be complete, but it cannot be excluded that there remain on the chips a few rare sites capable of forming an iono-covalent bond with the part matrix.
- the chip adhesive is hardened during the first cure, i.e. polymerized for a thermosetting or thermoplastic adhesive, so that it no longer (or almost no longer) contains a site for forming a bond. chemical with the adhesive in which the chips are included for the second curing.
- the presence of iono-covalent bond between the chip and the cured adhesive during a second curing is rare or even non-existent, so that the bonding interface between the chip and the adhesive is visible to the naked eye. , as shown in Figures 2 and 3 described below.
- the term “substantially” conventionally refers to the perception of this characteristic according to the system used for its measurement or manufacture. If a characteristic is observed with the naked eye, the term “significantly” therefore refers to the perception that an observer has of this characteristic.
- An expression containing the term “substantially” should be interpreted as a technical characteristic produced within the tolerance range of its method of manufacture. In particular, the “substantially parallel” character between two elements can be understood to within 10° of angle. If the considered fiber is included in a fabric (typically taffetas, twills or satins), the direction of extension of the fiber is considered by neglecting the undulations of the fiber related to the weaving.
- chips at least partly included in a matrix we mean the fact that each chip is embedded in the matrix, with the possible exception of certain chips that may emerge on the surface of the part.
- carbon fibers at least partly included in an adhesive hardened during a first hardening is meant the fact that the carbon fibers are embedded in the adhesive of a chip, with the possible exception of some fibers may emerge on the surface of the chip.
- the process of curing transforms a resin by a process of cross-linking.
- Energy and/or catalysts are added to cause the molecular chains to react at chemically active sites binding into a rigid 3D structure.
- the cross-linking process forms a molecule with a higher molecular weight, resulting in a material with a higher melting point.
- the molecular weight increases until the melting point is above the surrounding room temperature, and the material turns into a solid material.
- the adhesives suitable for composite materials can be chosen from the group consisting of thermosetting resins such as epoxy resins, cyanate ester and phenolic resins.
- Suitable epoxy resins include diglycidyl ethers of bisphenol A, diglycidyl ethers of bisphenol F, epoxy novolac resins and N-glycidyl ethers, glycidyl esters, aliphatic and cycloaliphatic glycidyl ethers, glycidyl ethers of aminophenols, ethers glycidyls of any substituted phenols and mixtures thereof.
- thermosetting polymers Also included are modified blends of the aforementioned thermosetting polymers.
- modified blend is meant a polymer modified, typically, by the addition of rubber or thermoplastic.
- Any suitable catalyst (or “hardener”) can be used.
- the catalyst will be chosen to match the resin used.
- the catalyst can be accelerated.
- a dicyandiamide catalyst when used, a substituted urea can be used as an accelerator.
- the curing agent with an epoxy resin can also be chosen from Dapsone (DDS), Diamino-diphenyl methane (DDM), BF3-amine complex, substituted imidazoles, accelerated anhydrides, metaphenylene diamine, diaminodiphenyl ether, aromatic polyetheramines, adducts aliphatic amine salts, aliphatic amine salts, aromatic amine adducts and aromatic amine salts.
- DDS Dapsone
- DDM Diamino-diphenyl methane
- BF3-amine complex substituted imidazoles
- metaphenylene diamine diaminodiphenyl ether
- aromatic polyetheramines adducts aliphatic amine salts
- aromatic amine salts aliphatic amine salts
- aromatic amine adducts aromatic amine salts
- Suitable accelerators include Diuron, Monuron, Fenuron, Chlortoluron, toluenediisocyanate bis-urea and other substituted homologs.
- the adhesives suitable for composite materials can also be chosen from the group consisting of thermoplastic resins.
- thermoplastics we can distinguish between high-performance plastics, engineering plastics and standard plastics. Most of the thermoplastics used in composite materials are high performance plastics or engineering plastics. These plastics differ from standard plastics in particular by greater wear resistance and chemical resistance.
- Thermoplastics depending on their nature, can be hard in amorphous form or in crystalline form.
- thermoplastics commonly used in composite materials are polyetherimides (PEI), polyethersulfone (PES), and polysulfones (PSU).
- PEI polyetherimides
- PES polyethersulfone
- PSU polysulfones
- thermoplastics used in composite materials include polyamides (PA), poly(ethylene terephthalate), polyphthalamide (PPA), poly(phenylene sulfide) (PPS), and polyetheretherketone ( PEEK).
- PA polyamides
- PPA poly(ethylene terephthalate)
- PPA polyphthalamide
- PPS poly(phenylene sulfide)
- PEEK polyetheretherketone
- Each chip has been shaped so that it has an orientation of the majority of the fibers it contains, parallel to the faces of the chip.
- the fibers can have a significant length and a controlled orientation in the chip.
- the length and orientation of the fibers in the chips, and the arrangement of the chips in the part give it high mechanical properties.
- the chips are in particular obtained by cutting into elements made of composite material based on carbon fibers to be recycled, as explained in more detail below.
- the formation of a part in accordance with the invention therefore allows the recycling of such elements, according to a low-polluting mechanical process, while offering good mechanical performance to the formed part.
- the faces of each chip can have a surface, called surface of the chip, of at least 1 cm 2 .
- the chips may have a much greater surface area, for example of the order of 3cm 2 , 5cm 2 , 10 cm 2 , or 20 cm 2 , 100 cm 2 .
- the chips formed and used in the context of the present invention thus have a large surface area, allowing the inclusion of carbon fibers of great length since the latter extend substantially parallel to the opposite faces of the chip.
- the bonding interface between each chip and the matrix may not present an inflection point, over the entire surface of the chip.
- the interface can be substantially planar over a majority of the surface of the chip.
- each chip which includes carbon fibers in a cured adhesive, before inclusion in a die to form the composite material part.
- Each chip advantageously has a small thickness (e) compared to its other dimensions.
- a chip thus being an essentially two-dimensional part, of small thickness, its other dimensions typically correspond to the largest dimension (d) measurable at the surface of the chip and to the dimension measured perpendicularly, also at the surface of the chip.
- the ratio (e)/(d) is between 0.05 and 0.0005, preferentially between 0.01 and 0.001 and even more preferentially between 0.005 and 0.001.
- the carbon fibers advantageously mainly extend in parallel planes.
- the chips may have a unidirectional arrangement of carbon fibers.
- the chips can be oriented so that the carbon fibers of the part are substantially oriented in the same direction.
- the chips can be oriented so that the carbon fibers of the part are substantially oriented in two distinct directions only, for example a first direction and a second direction forming an angle of 90° between them.
- the shavings are advantageously arranged in the part in a repeating pattern.
- a pattern corresponds to a particular relative arrangement of several chips.
- a pattern corresponds in particular to a non-random arrangement, which is generally repeatable in the part which is formed.
- the carbon fibers present in each chip are arranged in sheets each having a weaving of carbon fibers.
- each chip can all have substantially the same shape and the same dimensions.
- each chip is substantially rectangular in shape (i.e., the faces of each chip are substantially rectangular).
- the two-dimensional shape of the chips is thus a parameter that can be optimized to improve the mechanical properties of the part, and/or to adapt to the shape of the elements to be recycled.
- the thickness of the chips can for example be between 200 ⁇ m and 1 mm.
- the invention also relates to a part made of composite material comprising fibrous zones, formed by the shavings and representing between 20% and 85% by volume of the part, and non-fibrous zones, consisting of the added adhesive and hardened during the second hardening, forming the rest of the part.
- the invention also relates to a part made of composite material comprising:
- zones comprising carbon fibers and a first adhesive, the carbon fibers having a non-random orientation within the same zone, said zones comprising carbon fibers having a substantially constant thickness defined between two opposite parallel faces , and all of the carbon fibers of said zones comprising carbon fibers being oriented along substantially parallel planes, and
- the carbon fibers of said zones being oriented along substantially parallel planes
- the carbon fibers present in said zones are oriented along substantially parallel planes, and this, from one zone to another.
- the plurality of zones comprising carbon fibers and a first adhesive being at least partly included in the at least one zone devoid of carbon fiber comprising a second adhesive
- the second adhesive of the at least one zone devoid of carbon fiber encompasses at least 75%, preferably at least 80%, even more preferably at least 85% such as for example 90%, of the surface of the plurality of areas comprising carbon fibers and the first adhesive.
- a sectional view of a part made of composite material according to the invention makes it possible to visualize the plurality of zones comprising carbon fibers (the striated light gray parts visible on FIG. 5, the streaks being the carbon fibers) and at least one zone devoid of carbon fibers (dark gray part).
- the zones comprising carbon fibers can also be distributed in the part made of composite material according to a pattern.
- the zones comprising carbon fibers represent between 20% and 85% by volume of the part.
- the areas comprising carbon fibers, also called fibrous areas, are in fact the chips included in the part made of composite material.
- the first adhesive is identical to the second adhesive, the first adhesive having been hardened before the second adhesive.
- the first and the second adhesive are different.
- the carbon fibers can be oriented substantially parallel, orthogonal and/or at 45° within the same zone.
- the composite material part can, for example, be a flat or curved panel.
- the invention also relates to a method for manufacturing a part made of composite material, said method comprising the steps of
- each chip having a substantially constant thickness defined between two opposite parallel faces of the chip, each chip comprising carbon fibers at least partly included in an adhesive hardened during a first hardening, at least one majority of said fibers of the chip extending substantially parallel to said opposite faces of the chip;
- - positioning of the shavings so as to constitute a tangle of shavings i.e. a superposition forming an interweaving and/or an intermingling of the shavings
- second hardening - hardening of the liquid adhesive
- the invention finally relates to a part made of composite material capable of being obtained by such a process.
- FIG. 1 schematically represents, according to a block diagram, a method in accordance with one embodiment of the invention
- FIG. 2 represents, in a photograph, a so-called random arrangement of chips that can be implemented in the context of the present invention
- FIG. 3 shows, in a photograph, a so-called unidirectional arrangement of chips that can be implemented within the scope of the present invention
- FIG. 4 schematically represents a so-called bidirectional arrangement of chips that can be implemented in the context of the present invention
- FIG. 5 represents, in the form of a photograph, a section of a part made of composite material according to one embodiment of the invention, at a magnification x50;
- FIG. 1 schematically represents, according to a block diagram, a method in accordance with one embodiment of the invention
- FIG. 2 represents, in a photograph, a so-called random arrangement of chips that can be implemented in the context of the present invention
- FIG. 3 shows, in a photograph, a so-called unidirectional arrangement of chips that can be implemented within the
- FIGS. 7a, 7b and 7c illustrate an aspect of a panel made according to an embodiment of the invention in which the arrangement of the chips is made according to a non-random pattern
- FIGS. 8a and 8b illustrate an aspect of another panel made according to an embodiment of the invention in which the arrangement of the chips is made according to a non-random pattern
- FIGS. 9a and 9b illustrate an aspect of yet another panel produced according to an embodiment of the invention in which the arrangement of the chips is carried out according to a non-random pattern.
- FIG. 1 schematically represents, according to a block diagram, a process in accordance with an embodiment of the invention, making it possible to obtain parts made of composite material in accordance with an embodiment of the invention.
- the method implements the steps described below.
- the implementation of the present invention requires the formation of chips from the composite material elements based on carbon fibers which are to be recycled.
- the chips are obtained by mechanical cutting of said elements.
- the cutting of the chips can be carried out using a cutting machine such as a blade device.
- the blade device may be a planer type system.
- a plane-type system corresponds to a cutting machine comprising a blade making it possible to separate thin slices of regular thickness from the surface of an element over which it is passed.
- the blade of the blade device When an item is cut to form chips, the blade of the blade device is positioned, conventionally, so that its edge runs in a plane parallel to the direction of cutting.
- the material to be cut is positioned in the cutting machine according to the organization of the carbon fibers it contains.
- the fibers in the material to be cut are unidirectional, i.e. included in a matrix substantially parallel, in only one direction, then the fibers are positioned parallel to the direction of advance of the blade device.
- the part will preferably be placed so that the weft or warp threads are substantially parallel to the direction of advance of the blade device.
- the fibers can also be arranged in a succession of layers, each layer comprising unidirectional fibers, but the layers having different fiber orientations. This is for example the case for so-called “four-way” materials, the layers of which may have the following successive relative orientations: 0° (reference layer), 90°, 45°, -45°.
- the blade device can advantageously be adjusted so that its blade attacks the element between two layers of fibers, whether they are two layers of unidirectional fibers or two woven webs.
- the cutting plane will advantageously be maintained between the layers of fibers in order to preserve their integrity as much as possible.
- Thin slices of composite material are thus obtained. These slices may in particular have a thickness of between 200 ⁇ m and 1 mm, preferably between 200 ⁇ m and 500 ⁇ m.
- the elements to be cut are made to the desired length for the chips before being cut into slices by the cutting machine, so that the chips having the desired length are obtained directly from the cutting machine.
- the slices are then recut to obtain chips.
- they are cut transversely by any suitable cutting means, for example by sawing, in order to form fine rectangular shavings of regular length. Other shapes of shavings can of course be cut from the slices obtained.
- chips of 10 cm to 20 cm in length have been obtained and have made it possible to obtain very good results in terms of mechanical performance, as exemplified below.
- Greater lengths can also be implemented, such as around 50 cm, or even 1 m.
- the material to be recycled is a pre-coated but uncured carbon fiber fabric
- this material is first cured (polymerized for a material coated with a thermosetting resin) and then cut to the desired shape of the chip.
- a fabric generally having a thickness of between 200 ⁇ m and 500 ⁇ m, the chip thus obtained has a thickness that is entirely suitable for being implemented according to the present invention for the formation of a part, in particular molded, in composite material.
- the chips are therefore in the form of fine elements comprising carbon fibers included, at least in part, in a hardened resin.
- the chips are therefore in the form of substantially two-dimensional parts (in that their thickness is very small compared to its other dimensions).
- the surface of the chips is advantageously at least 1 cm 2 , and preferably greater than 3 cm 2 , of the order of 10 cm 2 , or even greater, for example up to approximately 100 cm 2 .
- the carbon fibers are oriented in the cured resin of the chips. Preferably, they are substantially parallel, orthogonal to each other, and/or oriented at 45° to each other.
- the fibers of the chips having a substantially constant thickness, they have two opposite faces (between which the thickness is defined).
- the cutting of the chips is carried out in such a way as to keep the carbon fibers intact as much as possible.
- the cutting of the chips is carried out so that the fibers (in their majority, even in their quasi totality or their totality) extend parallel to the opposite faces of the chips.
- the fibers thus extend in planes parallel to the general plane of extension of the chip, and can have a great length despite the low thickness of the chips.
- “Majority” means more than 50% in number
- the shavings are then mixed with a liquid adhesive in order to coat them, with a view to molding them.
- This step can be carried out before placing the chips in the mold intended to form the desired part, or during or even after placing them in the mold.
- the chips are mixed with an adhesive before being placed in a mold.
- the mixture can be done manually in a suitable container, for example aluminum.
- step S3 The chips are first weighed into the container (step S3), then the adhesive (e.g. a resin/hardener system, see below) is prepared (step S4) and added. Coating is complete when each chip is evenly covered with adhesive.
- the adhesive e.g. a resin/hardener system, see below
- the addition of the adhesive and the mixing between the chips and the adhesive can be done in an automated way.
- An automatic mixer can be used to stir the chips and adhesive.
- the quantity of adhesive to be added to the chips is determined according to the characteristics of the part (for example of the panel) that is to be produced.
- the amount of adhesive to be added depends, for example, on the volume or mass percentage of shavings desired in the final material, to obtain the desired mechanical properties, and on the adhesive used, in particular its density.
- the masses applied are also determined by the thicknesses of the panels to be obtained.
- the proportion of chips in the material should be maximized.
- the Applicant has produced parts containing up to 80% mass percentage of chips, and estimates that parts containing up to 85% mass percentage of chips, or even slightly more, can be produced successfully.
- Various adhesives can be used successfully. In general, all the adhesives known to be used as a matrix in composite materials comprising carbon fibers can be used, with the possible exception of adhesives which would be incompatible with the hardened adhesive present in the chips.
- Two-component epoxy systems consist of an epoxy resin and a hardener.
- the polymerization time is variable depending on the nature of the system used.
- the first two-component epoxy system mentioned by way of example is the system marketed by the company SIKA under the name ADEKIT H9011 (ADEKIT is a registered trademark).
- This system is a common system and can be used, according to the recommendations of its manufacturer, for bonding applications of many metals, ceramics, glass, rubber, rigid plastics, or even the bonding of common materials. It is suitable for most home industrial applications.
- the resin is light amber in color, with a density at 25°C of 1.16, and a viscosity at 25°C of 25 to 50 Pa.s.
- the hardener is amber in color, with a density at 25°C of 0.96 and a viscosity at 25°C of 20 to 40 Pa.s.
- the mixture of the two is light amber in color, with a density at 23° C. of 1.07 after polymerization, and a viscosity at 25° C. of 25 to 50 Pa.s.
- the proportions of mixture by mass of the resin/hardener mixture are 100/80, the proportions by volume at 25° C. are 100/100.
- the time during which the mixture is usable after bringing the two components into contact (generally designated by the English expression “pot-life”, and which is given for a given mass and temperature) on 110 g at 25° C. is 100 minutes.
- the transparency of the adhesive once hardened makes it possible to see the chips in the final part.
- the second two-component epoxy system mentioned by way of example is a system marketed by the company SICOMIN under the name “EPOXY RESIN SR 1700 + STANDARD HARDENER SD 2803”. This system is a common system and can be used, according to the recommendations of its manufacturer, for lamination applications in various fields such as boating, bodywork and model making.
- the mixture has a viscosity at 20° C. of 0.6 to 0.7 Pa.s.
- the mass mixing proportions of the resin/hardener mixture are 100/39, the volume proportions are 100/45.
- the time during which the mixture can be used after bringing the two components into contact (generally designated by the English expression “pot-life”, and which is given for a given mass and temperature) on 500 g at 20° C. is 120 minutes.
- many adhesives are useful for forming parts according to various embodiments of the invention. In particular, systems intended for composite production applications (resins for infusion, injection, lamination) but also systems intended for structural applications as adhesives.
- the systems can in particular have a density of between 1.03 and 1.38 at 25°C.
- Their dynamic viscosity can in particular be between 0.4 and 80 Pa.s.
- they may have a modulus of elasticity (once hardened) of between 2 GPa and 4 GPa.
- the polymerization of these adhesives can be done at room temperature or at higher temperature, around 70°C.
- the polymerization times being significantly different depending on the thermosetting adhesive system, the choice of the system can also depend on this time, depending on the mechanical properties and the desired cycle times.
- the adhesive can be thermoplastic.
- each adhesive has a particular color and transparency (or opacity). This can be leveraged to achieve the desired look for the final piece.
- Additives can also be added to the adhesive, for example to the glue/hardener mixture, before coating the chips.
- the additive(s) may comprise dyes, pigments, pigment pastes (pigments already mixed with a resin).
- a significant coloration of a transparent resin could be obtained by mixing only 0.94% paste relative to the mass of the resin/hardener mixture. This proportion was enough to give a very opaque color to the mixture. The color is visible on the parts, for example the panels, obtained after molding.
- the additive(s) may also include fillers.
- Fillers refer to all the particulate elements that can be added to the adhesive to modify its properties, and/or to lower the cost for the same volume.
- the fillers considered include in particular mineral or organic particles capable of improving certain properties of the final part, in particular its resistance to scratching or abrasion.
- fillers are most often of a mineral nature (aluminum fillers, calcium fillers, etc.) in the form of particles whose size is of the order of magnitude of a nanometer or a micrometer.
- the adhesive may also include glass microbeads.
- the filler used may also include carbon dust, for example from the preparation and cutting operations of the elements to be recycled. In this case, it is therefore an organic load.
- the mixture of chips and adhesive is then molded.
- adhesive is optionally used to make a topping (step S6) of the mold.
- topping makes it possible to produce a layer of resin on the surface and gives the part produced a good surface finish, for example smooth or corresponding perfectly to the surface finish provided by the mould.
- overmolding can be done.
- resin is injected into the mold to cover the molded part, and obtain an effect similar to that of topping.
- the high injection pressure during overmolding can make it possible to add functional elements to the surface of the molded part (grooves, notches, rails, etc.) or to create the desired surface appearance.
- a gel-coat (which can be translated as gel coat) can be applied to the mould.
- a top-coat (which can be translated as finishing coat) can be applied to the part once it has been molded.
- the mold used comprises a concave part, called female cavity, and a part forming a corresponding male cavity.
- the topping is made on the surface of the female impression and on the surface of the male impression.
- the area of the female indentation is equal to that of the male indentation, and the following rule can be used.
- the adhesive can be deposited on the surface of the male cavity or on the chips once they have been placed in the female cavity, as described below.
- the amount of glue to be used is 68 g and the excess glue is 5 g
- the amount of glue for the topping will be 9.3 g for each side, i.e. 18.6 g in total .
- the glue can be applied using a flexible applicator, or sprayed onto the walls to be covered. Depending on the scale of production, this step can be performed by an operator or automated.
- a release agent can be applied to the internal surface of the mold to facilitate the extraction of the part once it has been formed.
- the shavings When the shavings have been mixed with the adhesive, they should be placed in the female cavity of the mold, then the molding under press can be finalized.
- the placement of the chips can be carried out manually, using templates or visual cues (for example guides formed by a laser), or automated.
- the chips covered with adhesive are placed in the female cavity of the mold, on an extraction plate.
- the extraction plate allows the panel to be extracted from the mold after the pressing action. It can also be used to adapt the thickness of the panel being formed (several thicknesses can be made in the same mold by varying the thickness of the extraction plate). If an extraction plate is used, it then forms the internal surface of the mold and it will therefore be the extraction plate which will be coated with adhesive, if necessary, and beforehand with release agent, also if necessary.
- the step of arranging the chips (step S7) in the mold can be important for the mechanical properties of the panel (or more generally of the part) which is formed. Starting from the assumption that the chips have unidirectional carbon fibers, the chips can be arranged in the mold according to three main types of distribution.
- a first arrangement is said to be random.
- random it is understood that the chips are arranged according to various orientations, and are superimposed on each other in an irregular manner.
- An example of a so-called random arrangement is represented in FIG. 2.
- FIG. 2 more precisely represents the surface of a flat panel according to an embodiment of the invention in which the chips have a so-called random arrangement.
- the chips used here are rectangular.
- a panel with a random 1 chip arrangement is generally substantially isotropic in the plane in which it extends, as far as its mechanical properties are concerned.
- the Applicant has nevertheless found that the volumes left free by the superposition of the chips should be minimized, in particular for thin panels (typically less than or equal to 2 mm) .
- a second arrangement is said to be unidirectional.
- An example of a so-called unidirectional arrangement is shown in Figure 3.
- the chips are all arranged in the same direction (A), that is to say that the carbon fibers contained in the different chips are all substantially oriented in the same direction.
- An angle tolerance of the order of plus or minus 10°, is acceptable. This tolerance is measured according to the angle a formed between the theoretical direction (A) of the chips 10 and the direction of general extension of each chip (typically the direction along the length of the chip, for a rectangular chip). It is also permissible for a maximum of 10% of the chips to deviate from the desired orientation and angle tolerance.
- the chips 1 are therefore oriented in the same way, but without being strictly organized with respect to each other according to a structure which may induce weaknesses in the panel.
- This arrangement makes it possible to obtain an anisotropic panel as regards its mechanical properties.
- These properties in particular the resistance to bending and the resistance to rupture, are very important in the direction (A) of alignment of the chips and the fibers, to the detriment of the direction orthogonal (B) to the fibers.
- a third arrangement is called multidirectional, such as, for example, bidirectional.
- FIG. 4 An example of a so-called bidirectional arrangement is shown in FIG. 4. It consists of making several plies (each comprising one or more layers of chips) with different chip orientations between adjacent plies. For example, with rectangular chips, it is possible to alternate the plies, with an arrangement of the chips of one ply at 90° to the chips of the adjacent plies.
- a bidirectional layout can therefore be defined as a stack of unidirectional layers as described previously.
- Figure 4 partially two folds (that is to say that only certain chips of each fold are represented to illustrate the superposition of the chips), namely an upper fold in which the chips are oriented according to a first direction (x), and a lower ply in which the chips are oriented in a direction (y) orthogonal to the direction (x).
- the chips of the flat panel taken here as an example are positioned parallel to the (x,y) plane.
- any multidirectional arrangement can be envisaged.
- the provisions presented above relate to a thin flat panel.
- a part having a large thickness for example a cube
- the arrangement of the chips when it is not purely random, can be such that the chips form a particular pattern which is repeated to form the panel (or more generally a part).
- a pattern corresponds to a particular arrangement of several chips together in three dimensions.
- the other arrangements envisaged can be considered as the repetition of a pattern of chips.
- Examples of patterns illustrating the advantages which can be obtained thanks to a non-random arrangement of the chips, are given below (Example III and Example IV)
- the layout, the geometry, the size of the chips used and the thickness of the plies can be adapted according to the intended application.
- the longer the chips the better the mechanical properties.
- the length of the chips that can be formed and used depends on the elements that are recycled, and the new parts formed, and in particular on their geometric complexity (it is quite obvious that it is easier to integrate chips of large length in a large flat panel than in a curved part, with complex geometry, and/or presenting many geometric details).
- it is advantageous to implement chips whose largest dimension, such as the length is between 3 and 20 cm.
- the plies forming the external surfaces of the part have their chips 11 oriented longitudinally, that is to say in the direction of main extension of the part, or if this direction cannot be determined, in an arbitrarily fixed direction, and the inner ply, or one inner ply out of two, has its chips 12 oriented transversely (that is to say perpendicular to the chips oriented longitudinally).
- the thicknesses of each ply it is also possible to vary the performance of the panel in these two directions.
- each ply can comprise one or more layers of chips.
- the mold is closed by positioning the male cavity (mold closing step S8).
- the mold is installed in a press, which is activated to put the contents of the mold under pressure (pressure molding step S9).
- Panel prototypes were made by applying a force of 20 tonne-force (about 1600 daN). Substantially less pressure could nevertheless suffice.
- a thermosetting resin is used, polymerization can take place at room temperature.
- the mold can be heated to accelerate the polymerization.
- two heating plates can be used, on either side of the mould.
- a closed loop control for example of the PID type (proportional, integral, derivative) can be used.
- the part is demolded when the adhesive has hardened sufficiently to make the part handle without deformation (demolding step S10). Polymerization is not however, not necessarily completely complete during demoulding. This frees up the press for other castings.
- step S11 In order to finalize the hardening of the parts (step S11), they can be placed in an oven, typically at 70°C.
- the polymerization time is 16 hours at 70°C.
- the complete polymerization of this adhesive takes about a week at room temperature.
- the method described above thus makes it possible to obtain molded parts in composite material formed from elements in composite material based on carbon fibers which it is desired to recycle.
- the method described above implements a molding of the part.
- other shaping techniques can be used.
- a pultrusion process or a calendering process can be used.
- the chips are coated and oriented in a nozzle and come out of said nozzle with the desired arrangement in a resin during (second) hardening.
- Pultrusion can be used, in particular, to obtain very long parts (beams, panels, etc.).
- a mass of adhesive during polymerization and including the correctly arranged chips passes through the roller gap in order to form a thin part, for example a thin panel.
- FIG. 5 represents, in the form of a photograph, a section of a part made of composite material according to one embodiment of the invention, at a magnification x50.
- Figure 5 shows the section of a flat panel comprising chips 1 positioned parallel to each other and included in a matrix 2.
- the chips 1 in Figure 5 are rectangular chips, which are arranged unidirectionally according to a longitudinal direction.
- the cut made is a longitudinal section of the panel, perpendicular to the plane in which said panel extends.
- the shavings 1 appear as striated light gray parts, the streaks corresponding to carbon fibers 3, the areas inside the shavings located between the carbon fibers 3 corresponding to the adhesive hardened during a first hardening.
- Matrix 2 which is formed of an adhesive cured during a second cure, and in which the chips 1 are included, corresponds to the areas devoid of carbon fibers which appear in dark gray in Figure 5.
- Chips 1 remain distinct from matrix 2, so that a connection interface between each chip 1 and matrix 2 is perceptible.
- FIG. 5 thus makes it possible to visualize that each chip is an essentially two-dimensional element of small thickness e.
- the thickness e of the chip is measured between the two parallel faces 4 of the chip 1 (the thickness being, conventionally, the smallest distance between the faces 4, that is to say measured perpendicular to these faces 4) .
- the tests were carried out on prototype plates measuring 23 cm by 23 cm and having a thickness of between 3.5 mm and 3.6 mm.
- the shavings used in the tests presented here come from composite material elements comprising carbon fibers in a unidirectional arrangement included in an adhesive of the epoxy resin type.
- the elements used come from the aeronautical industry.
- the composite material had identical or similar characteristics to the “UD carbon plate” material, the characteristics of which are indicated in table 1 below.
- the chips used are rectangular, and have a length I of 100 mm, a width b of 9 mm and a thickness of between 0.3 mm and 0.5 mm.
- the plates are produced according to a method as described above with reference to FIG.
- the mold is coated with a release agent and coated under the conditions described above.
- the adhesive used is the ADEKIT H9011 system used according to the recommendations of its manufacturer, mentioned above.
- the chips are manually positioned in the mould.
- the ratio of chips to adhesive is, unless otherwise specified, 65/35 by mass in the finished plate.
- the molding is carried out under a press, by applying a force of 20 ton-force, and by controlling the temperature at around 70°C. After demoulding, the plates are kept for one week at room temperature (20°C) before being used for measurements.
- the "UD carbon plate” corresponds to a plate of a composite material based on new unidirectional carbon fibers.
- the "bidirectional carbon plate” corresponds to a plate of a composite material based on new carbon fibers organized in a bidirectional manner, that is to say with an alternation, in equal number, of layers having longitudinal fibers and layers with transverse fibers.
- the "UD1 Plate” and “UD2 Plate” correspond to composite material plates in accordance with embodiments of the invention, obtained as described above, and whose chips, and therefore the fibers, are positioned according to an arrangement unidirectional.
- the "BD1 Plate” corresponds to a material with a bidirectional arrangement of chips and fibers, i.e. the plate tested has two external plies (forming the external surfaces of the part) in which the chips, and therefore the fibers, are positioned in a unidirectional longitudinal arrangement, and an internal ply in which the chips, and therefore the fibres, are positioned in a unidirectional transverse arrangement.
- the inner ply has a thickness measuring twice the thickness of each outer ply.
- the "BD2 Plate” corresponds to a material with a bidirectional arrangement of chips and fibers, namely that the plate tested has two external plies in which the chips, and therefore the fibers, are positioned according to a longitudinal unidirectional arrangement, and a ply internal in which the chips, and therefore the fibers, are positioned in a transverse unidirectional arrangement.
- the internal ply has a thickness measuring approximately six times the thickness of each external ply (which provides isotropic behavior in these longitudinal and transverse directions to the panel under reference Plate BD2).
- the flexural modulus and the breaking stress of the UD2 Plate (with 65% of chips by mass) is significantly higher than 50% of the values obtained for the reference Carbon UD Plate, i.e. a composite material based on of comparable new unidirectional fibers (from which the chips used can be extracted).
- the flexural modulus obtained, in the longitudinal direction is equal to 57% of the flexural modulus of the comparable unidirectional material based on carbon fibers. new.
- the BD2 Plate offers a similar result. Indeed, in both longitudinal and transverse directions, the flexural modulus and the breaking stress of the BD2 Plate is significantly greater than 50% of the values obtained for the Bidirectional Carbon Plate.
- the BD1 Plate offers a flexural modulus identical to the reference Bidirectional Carbon Plate in the longitudinal direction (and therefore a performance superior to the new panel in this direction, at the same mass), at the cost of a lower performance in the transverse direction.
- the invention therefore makes it possible to obtain a recycled material which has approximately 70% of the mechanical performance, in particular 70% of the flexural modulus, and (up to 75% to 80% of the performance at identical masses) of comparable materials based on new fibers. , with a simple manufacturing process, and having a low environmental impact compared to chemical or thermal recycling processes.
- FIG. 6 represents the flexural modulus of a panel in accordance with an embodiment of the invention, the chips of which are organized in a unidirectional manner, and that of a panel containing new carbon fibers oriented unidirectionally.
- the flexural modulus is plotted on the ordinate.
- the abscissa shows the angle at which the measurement is made.
- An angle of 0° corresponds to the direction of extension of the fibers or chips, and 90° corresponds to the direction transverse to the fibers and/or chips.
- the triangles correspond to the measurements taken on a plate of a material in accordance with one embodiment of the invention, the shavings of which, formed on the basis of elements comprising unidirectional carbon fibers, are organized in a unidirectional manner, of which the modulus of bending measured in the direction of extension of the chips and the fibers they contain, is 47 GPa.
- the circles represent the theoretical bending moduli calculated for an equivalent plate, formed in a composite material based on new unidirectional carbon fibers whose bending modulus in the direction of the fibers it contains would be 47 GPa.
- This example concerns the formation of a panel using two different non-random patterns of chips, each pattern making it possible to form a layer of chips, the layers of chips formed according to the two patterns being arranged alternately in the panel.
- the mechanical properties given in the following table have been determined for a laminated panel having the dimensions: 230 mm ⁇ 230 mm ⁇ 4 mm, formed according to a so-called “semi-random” arrangement of chips.
- the chips are placed in the mold manually, in order to obtain a good filling of the mold, without however making a particular or repetitive pattern.
- chips having dimensions of 60 mm x 60 mm x 0.4 mm were used.
- the chips are obtained by cutting a composite material incorporating woven carbon fibers, arranged in layers of fabrics. The cutting to form the chips is carried out as much as possible between the layers.
- the coefficient of variation CV is the ratio of the standard deviation to the mean, expressed as a percentage. The higher the value of the coefficient of variation, the greater the dispersion around the mean.
- the bending properties measured therefore show significant variations between the different prototypes made. It is noted in particular that the coefficients of variation are much greater than 10% for the mechanical properties.
- a laminated panel of the same dimensions (ie 230 mm ⁇ 230 mm ⁇ 4 mm) was then formed, with chips obtained in the same material as for the reference panel, and of the same thickness.
- FIG. 7a represents a first pattern according to which the chips are arranged, edge to edge, to form a layer of 230 mm by 230 mm.
- the reference of the chips used (A to H according to the list above) is indicated at the level of each chip represented.
- FIG. 7b represents a second pattern according to which the chips are arranged, edge to edge, to form a layer of 230 mm by 230 mm.
- the reference of the chips used (A to H according to the list above) is indicated at the level of each chip represented.
- the chips are placed in the mold by alternating the layers of the first pattern and the layers of the second pattern.
- FIG. 7c represents the superposition of a layer of first pattern (in dotted lines) and of a layer of second pattern (in solid line).
- this panel The idea behind the formation of this panel is to ensure that an abutment zone between two chips, which can constitute an area of mechanical weakness, is always sandwiched between two chips.
- the ply thickness is an important parameter in the formation of a laminate (whether it is recycled or not). Having a constant chip thickness therefore makes it possible to control the thickness of a ply, the layout, the thickness of the panel (or part) formed as well as its mechanical properties.
- Example 4 laminated panels with plies made with a pattern of chips with unidirectional carbon fibers
- This example also relates to the formation of a panel using two different non-random patterns of chips, each pattern making it possible to form a layer of chips, the layers of chips formed according to the two patterns being arranged alternately in the panel.
- the mechanical properties given in the following table have been determined for a laminated panel having the dimensions: 230 mm ⁇ 230 mm ⁇ 4 mm, formed according to a so-called “semi-random” arrangement of chips.
- the chips are placed in the mold manually, in order to obtain a good filling of the mold, without however making a particular or repetitive pattern.
- the chips are obtained by cutting a composite material incorporating unidirectional carbon fibers.
- the chips used have the dimensions: 100 mm x 10 mm x 0.4 mm.
- the adhesive and the conditions for obtaining the panel are similar to those described in Example I.
- the bending properties (determined by a 3-point bending test, according to the ISO 14125: 1998 standard) as well as the thickness of the prototype panels thus formed are summarized in Table 4 below.
- Panels (panels 1 and panels 2) were formed, as explained below, with chips having the following dimensions:
- FIG. 8a represents a first pattern according to which the chips are arranged, edge to edge, to form a layer of 230 mm by 230 mm.
- FIG. 8b represents a second pattern according to which the chips are arranged, edge to edge, to form a layer of 230 mm by 230 mm.
- the panel 1 is formed by alternately superimposing layers of chips according to the pattern of FIG. 8a and according to the pattern of FIG. 8b.
- FIG. 9a represents a first pattern according to which the chips are arranged, edge to edge, to form a layer of 230 mm by 230 mm.
- FIG. 9b represents a second pattern according to which the chips are arranged, edge to edge, to form a layer of 230 mm by 230 mm.
- Arrangement 1 makes it possible to obtain panels which have mechanical characteristics equivalent to those of the reference panels, with nevertheless a higher variation as regards the breaking stress in bending. A much lower rate of variation of the thickness of the panel is obtained with a non-random device.
- the fact of using a non-random pattern (or non-random patterns) to produce the panel thus makes it possible to limit the dispersions in thickness of the panels produced. Indeed, although the panels presented above all have the same number of plies, a "semi-random" arrangement of the chips leads to overlapping of certain chips in the same ply. This results in a greater thickness of the panel, and also a greater variation in the thickness from one panel to another.
- Panels 2 perform much better in bending with similar variations compared to the semi-random layout, i.e. more than 25% higher flex modulus and 15% higher flexural modulus compared to the reference panel, while panel 2 is thinner, for the reasons explained above.
- Examples III and IV thus show, in general, that the use of a non-random, repetitive pattern can make it possible to improve the mechanical characteristics of the parts formed according to the present invention. This also allows for less variation in part characteristics. Since the characteristics obtained are better controlled, stable and predictable, the most accurate dimensioning of the parts can be achieved.
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
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Abstract
Description
Claims
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CA3240590A CA3240590A1 (fr) | 2021-12-22 | 2022-12-21 | Piece en materiau composite recycle et procede de fabrication |
CN202280084818.9A CN118525055A (zh) | 2021-12-22 | 2022-12-21 | 由回收复合材料制成的部件及其制造方法 |
EP22843723.2A EP4453070A1 (fr) | 2021-12-22 | 2022-12-21 | Pièce en matériau composite recyclé et procédé de fabrication |
KR1020247023995A KR20240125967A (ko) | 2021-12-22 | 2022-12-21 | 재활용된 복합 물질로부터 제조된 부분 및 그의 제조 방법 |
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FR2114292A FR3130819A1 (fr) | 2021-12-22 | 2021-12-22 | Pièce en matériau composite recyclé et procédé de fabrication |
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KR (1) | KR20240125967A (fr) |
CN (2) | CN118525055A (fr) |
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Citations (5)
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JP2004148796A (ja) * | 2002-09-03 | 2004-05-27 | Sekisui Chem Co Ltd | 再生成形材の製造方法並びに再生成形材、再生構造材、合成まくら木および軽量合成木材 |
JP2004338228A (ja) * | 2003-05-15 | 2004-12-02 | Sekisui Chem Co Ltd | 再生成形材の製造方法 |
JP2006198809A (ja) * | 2005-01-18 | 2006-08-03 | Sekisui Chem Co Ltd | 再生成形材及び再生成形材の製造方法 |
US20210370550A1 (en) * | 2020-05-28 | 2021-12-02 | ZED Services LLC | Reclaiming and Remanufacturing Fiber Reinforced Polymer Composite Structures |
WO2021259757A1 (fr) * | 2020-06-22 | 2021-12-30 | Solvay Specialty Polymers Usa, Llc | Compositions de paek renforcées comprenant des fibres de carbone recyclées |
-
2021
- 2021-12-22 FR FR2114292A patent/FR3130819A1/fr active Pending
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2022
- 2022-12-21 KR KR1020247023995A patent/KR20240125967A/ko unknown
- 2022-12-21 CA CA3240590A patent/CA3240590A1/fr active Pending
- 2022-12-21 CN CN202280084818.9A patent/CN118525055A/zh active Pending
- 2022-12-21 EP EP22843723.2A patent/EP4453070A1/fr active Pending
- 2022-12-21 WO PCT/EP2022/087372 patent/WO2023118383A1/fr active Application Filing
- 2022-12-21 CN CN202280084816.XA patent/CN118525046A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004148796A (ja) * | 2002-09-03 | 2004-05-27 | Sekisui Chem Co Ltd | 再生成形材の製造方法並びに再生成形材、再生構造材、合成まくら木および軽量合成木材 |
JP2004338228A (ja) * | 2003-05-15 | 2004-12-02 | Sekisui Chem Co Ltd | 再生成形材の製造方法 |
JP2006198809A (ja) * | 2005-01-18 | 2006-08-03 | Sekisui Chem Co Ltd | 再生成形材及び再生成形材の製造方法 |
US20210370550A1 (en) * | 2020-05-28 | 2021-12-02 | ZED Services LLC | Reclaiming and Remanufacturing Fiber Reinforced Polymer Composite Structures |
WO2021259757A1 (fr) * | 2020-06-22 | 2021-12-30 | Solvay Specialty Polymers Usa, Llc | Compositions de paek renforcées comprenant des fibres de carbone recyclées |
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FR3130819A1 (fr) | 2023-06-23 |
KR20240125967A (ko) | 2024-08-20 |
EP4453070A1 (fr) | 2024-10-30 |
CN118525055A (zh) | 2024-08-20 |
CN118525046A (zh) | 2024-08-20 |
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