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WO2023145129A1 - Imaging device - Google Patents

Imaging device Download PDF

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Publication number
WO2023145129A1
WO2023145129A1 PCT/JP2022/034832 JP2022034832W WO2023145129A1 WO 2023145129 A1 WO2023145129 A1 WO 2023145129A1 JP 2022034832 W JP2022034832 W JP 2022034832W WO 2023145129 A1 WO2023145129 A1 WO 2023145129A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
substrate
imaging device
fixing member
hole
Prior art date
Application number
PCT/JP2022/034832
Other languages
French (fr)
Japanese (ja)
Inventor
康孝 松本
雅之 秋枝
敬一 宇治田
秀之 井口
正実 福原
誠 宮本
Original Assignee
パナソニックIpマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニックIpマネジメント株式会社 filed Critical パナソニックIpマネジメント株式会社
Publication of WO2023145129A1 publication Critical patent/WO2023145129A1/en

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/02Bodies
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B30/00Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/52Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements

Definitions

  • the present invention relates to imaging devices.
  • imaging devices In recent years, with the spread of vehicle driving support systems, the number of vehicles equipped with cameras (hereinafter also referred to as imaging devices) is increasing.
  • an imaging device includes a lens unit to which a lens is attached, and a housing that houses an image sensor (hereinafter also referred to as a sensor) and the like.
  • the casing is also made of a conductive material such as metal as a heat countermeasure to prevent electromagnetic noise from entering and leaking and to suppress the temperature rise inside the camera.
  • the imaging device described above is used in various environments such as being exposed to vehicle vibrations and being installed outside the vehicle. Images can be obtained over time.
  • fixing members such as screws are used to fix the positional relationship between the lens and the sensor (for example, Patent Document 1).
  • the housing and the fixing member are formed of dissimilar metals, corrosion due to electric corrosion may occur, and the waterproof performance of the imaging device may deteriorate. be. If the waterproof function of an imaging device deteriorates, there is a risk that electrical parts housed in the imaging device will short-circuit due to water intrusion, rendering the imaging device inoperable. It is
  • the present disclosure provides an imaging device capable of preventing deterioration of waterproof performance due to corrosion.
  • An imaging device includes a substrate, a housing, and a first fixing member.
  • An imaging device is mounted on the substrate.
  • the housing has a first housing and a second housing, and accommodates the substrate in a space formed by the first housing and the second housing.
  • the first fixing member penetrates through the first housing or the second housing and fixes one housing to the other housing.
  • the outer peripheral surface of the fixing member is subjected to surface treatment for preventing corrosion of the contact surface of the housing through which the first fixing member penetrates.
  • the imaging device according to the present disclosure can prevent deterioration of waterproof performance due to corrosion.
  • FIG. 1 is a schematic diagram showing an example of an imaging device according to an embodiment.
  • FIG. 2 is an exploded view showing an example of the imaging device according to the embodiment.
  • FIG. 3 is a schematic diagram illustrating an example of a housing according to the embodiment;
  • FIG. 4 is a cross-sectional view showing an example of the imaging device according to the embodiment.
  • FIG. 5 is a schematic diagram showing an example of a substrate according to the embodiment.
  • FIG. 6 is a cross-sectional view showing an example of the imaging device according to the embodiment.
  • FIG. 7 is a cross-sectional view showing an example of an imaging device according to Modification 2.
  • FIG. 8 is a cross-sectional view showing an example of an imaging device according to modification 5.
  • FIG. 9 is a cross-sectional view showing an example of an imaging device according to modification 5.
  • FIG. 8 is a cross-sectional view showing an example of an imaging device according to modification 5.
  • FIG. 9 is a cross-sectional view showing an example of an imaging device
  • the imaging device is, for example, an in-vehicle camera that is mounted on a vehicle and that can be used for driving assistance of the vehicle.
  • the imaging device for driving support detects objects such as vehicles, pedestrians, and obstacles by image processing by the internal ISP (Image Signal Processor), warns the driver, and forces the vehicle to stop. It plays a major role in the driving support system of the vehicle.
  • ISP Image Signal Processor
  • the X-axis, Y-axis, and Z-axis that are orthogonal to each other are shown for convenience, and the left-right direction (X-direction), the front-rear direction (Y-direction), and the up-down direction of the imaging device 100 of the present embodiment are shown.
  • the direction (Z direction) will be explained using the X axis, Y axis, and Z axis. In the following description, simply describing the X direction, the Y direction, or the Z direction means each axial direction and includes two opposite directions.
  • the positive direction of the X-axis is one direction from left to right; when the positive direction of the Y-axis is specified, it is one direction from front to back; If specified as a positive direction, it is one direction from bottom to top.
  • the negative direction of the X-axis it is one direction from right to left; when specified as the negative direction of the Y-axis, it is one direction from the rear to the front;
  • the direction is specified, it is one direction from the upper side to the lower side.
  • FIG. 1 is a schematic diagram of an imaging device according to an embodiment.
  • FIG. 2 is an exploded view of the imaging device according to the embodiment.
  • FIG. 3 is a schematic diagram of the first housing according to the embodiment viewed from the positive direction of the Z-axis.
  • FIG. 4 is a cross-sectional view of the imaging device according to the embodiment.
  • FIG. 5 is a schematic diagram of the substrate according to the embodiment viewed from the positive direction of the Z-axis.
  • FIG. 6 is an enlarged view enlarging a part of the cross section of the imaging device according to the embodiment.
  • the imaging device 100 includes a lens unit 1, a first housing 2, a second housing 3, a substrate 4, a mounting substrate connector 5, a waterproof member 6, a first fixing member 7 and a second fixing member 8. Prepare. Note that the configuration of the imaging device 100 is not limited to this.
  • the lens unit 1 has a barrel and a lens (both not shown).
  • a lens barrel is a cylindrical member that is open at both ends. Inside the lens barrel, lenses are arranged at predetermined positions.
  • the lens barrel can be formed using, for example, a resin material.
  • the lens is made of plastic, glass, or the like.
  • the lens is arranged along the optical axis inside the lens barrel, and forms an image of light from a subject on an imaging device mounted on a substrate 4, which will be described later. Note that the number of lenses may be one or plural.
  • the first housing 2 is an example of a housing.
  • the first housing 2 has a concave shape with a hollow inside.
  • the first housing 2 accommodates part of the lens unit 1 and a substrate 4 described later in a space formed by combining with a second housing 3 described later.
  • a lens unit 1 is attached to the first housing 2 .
  • a hole 21 corresponding to the outer shape (outer diameter) of the lens unit 1 is formed in the surface of the first housing 2 to which the lens unit 1 is attached.
  • the lens unit 1 is attached to the first housing 2 by fitting one end of the lens unit 1 into the hole 21 of the first housing 2 .
  • the first housing 2 is made of metal such as aluminum die-cast (as an example, an aluminum alloy such as the ADC 12). Further, the surface of the first housing 2 is generally subjected to surface treatment (alumite, electrodeposition coating, plating, etc.) with a predetermined film thickness (several microns to several tens of microns) as an antirust treatment. Note that the first housing 2 is also called a front case.
  • the first housing 2 has a first hole 22 at a portion that contacts the second housing 3, which will be described later.
  • the first hole 22 is an example of a hole.
  • the first hole 22 is a hole provided in the first housing 2 in the Z-axis direction, and is used when combining the first housing 2 and the second housing 3 .
  • the first fixing member 7 described later is inserted into the first hole 22 .
  • a chamfered portion 26 is formed at the opening of the first hole 22 to serve as a guide for inserting the first fixing member 7 .
  • the first housing 2 and the second housing 3 are fixed by the first fixing member 7 inserted into the first hole 22 .
  • a plurality of first holes 22 are provided on the outer edge of the second housing 3 .
  • FIG. 2 shows an example in which two first holes 22 are provided outside the first housing 2 .
  • the first holes 22 are preferably provided at diagonal positions on the outer edge of the first housing 2 .
  • the first housing 2 has a first projecting portion 23, a second hole 24, a second projecting portion 25, etc. inside.
  • the first projecting portion 23 is an example of a projecting portion.
  • the first projecting portion 23 is used to position the substrate 4, which will be described later, within the housing.
  • the first projecting portion 23 is a portion projecting in the positive direction of the Z-axis direction.
  • the first projecting portion 23 is inserted into a fourth hole 41 provided in the substrate 4 when the substrate 4 to be described later is attached to the first housing 2 .
  • a plurality of first protrusions 23 are provided inside the first housing 2 .
  • FIG. 3 shows an example in which two first protrusions 23 are provided inside the first housing 2 .
  • the first protrusions 23 are provided at diagonal positions inside the first housing 2 .
  • the element surface (sensor surface) of the imaging element provided on the substrate 4 can be attached to the first housing 2 with the element surface (sensor surface) arranged perpendicular to the XY axes, that is, parallel to the Z axis.
  • the element surface (sensor surface) of the imaging element provided on the substrate 4 can be attached to the first housing 2 in a state in which the position in the XY axis direction is arranged at an appropriate position.
  • the second hole 24 is an example of a hole.
  • the second hole 24 is a part for fixing the substrate 4 which will be described later.
  • the second hole 24 is a hole provided in the Z-axis direction of the first housing 2 .
  • a second fixing member 8 to be described later is inserted into the second hole 24 .
  • the second hole 24 corresponds to a fifth hole 42 provided in the substrate 4, which will be described later.
  • the first housing 2 and the substrate 4 are fixed by the second fixing member 8 inserted into the second hole 24 and the fifth hole 42 .
  • a plurality of second holes 24 are provided inside the first housing 2 .
  • FIG. 3 shows an example in which two second holes 24 are provided inside the first housing 2 .
  • the second holes 24 are provided at diagonal positions inside the first housing 2 .
  • the second projecting portion 25 is an example of a projecting portion.
  • the second protruding portion 25 is a part for positioning the layout position of the substrate 4 to be described later inside the first housing 2 .
  • the second projecting portion 25 is a portion projecting in the positive direction of the Z-axis direction.
  • the second protrusion 25 is fitted into a recess 43 provided on the substrate 4, which will be described later.
  • the second protrusion 25 is provided inside the first housing 2 .
  • FIG. 3 shows an example in which one second projecting portion 25 is provided inside the first housing 2 .
  • the direction of the substrate 4 specifically, the Z-axis (vertical) direction and the XY-axis (horizontal) direction can be arranged in an appropriate direction. can.
  • a plurality of second projecting portions 25 may be provided inside the first housing 2 .
  • the second housing 3 is an example of a housing.
  • the second housing 3 has a concave shape with a hollow inside.
  • the second housing 3 accommodates a part of the lens unit 1 and a substrate 4 described later in a space formed by combining with the first housing 2 .
  • the second housing 3 is made of, for example, aluminum die-cast (eg, an aluminum alloy such as the ADC 12), resin, or the like.
  • the second housing 3 is also called a rear case.
  • the first housing 2 and the second housing 3 are collectively referred to as a housing.
  • the second housing 3 has an output mechanism 31 inside.
  • the output mechanism 31 has a conductive connection portion 32 for connecting an electric cable for outputting an image signal, which is a signal output from the imaging element, to the outside.
  • the output mechanism 31 is, for example, a coaxial (2-wire type) connector, an STQ (shielded twisted quad wire) (4-wire type) connector, a CAN-incorporated STQ (6-wire type) connector, or the like.
  • the connecting portion 32 is electrically connected to the mounting board connector 5 by fitting with the mounting board connector 5 described later. Fitting between the connection portion 32 and the mounting board connector 5 will be described later.
  • the second housing 3 has a third hole 33 at a portion that contacts the first housing 2 .
  • the third hole 33 is an example of a hole.
  • the third hole 33 is a hole for combining the first housing 2 and the second housing 3 and is provided at a position corresponding to the first hole 22 .
  • the third hole 33 is a hole penetrating the second housing 3 in the Z-axis direction.
  • the first fixing member 7 described later is inserted into the third hole 33 .
  • the first housing 2 and the second housing 3 are fixed by the first fixing member 7 inserted into the third hole 33 .
  • FIG. 2 shows an example in which two third holes 33 are provided according to the number of first holes 22 .
  • the substrate 4 On one side of the substrate 4, an imaging device is mounted that converts the light received through the lens into an image signal. Further, the substrate 4 has a mounting substrate connector 5 including a connection terminal with an imaging element mounted on one surface side. The substrate 4 is housed inside the space formed by the first housing 2 and the second housing 3 .
  • the substrate 4 also has a fourth hole 41 , a fifth hole 42 and a recess 43 .
  • the fourth hole 41 is an example of a hole.
  • the fourth hole 41 has a diameter corresponding to the first protrusion 23 at a portion corresponding to the first protrusion 23 when properly arranged in the housing.
  • the substrate 4 is attached to the first housing 2 with the first projecting portion 23 inserted into the fourth hole 41 .
  • the fourth hole 41 is a hole penetrating through the substrate 4 in the Z-axis direction.
  • the first projecting portion 23 is inserted into the fourth hole 41 .
  • the first housing 2 and the substrate 4 are fixed by the first projecting portion 23 inserted into the fourth hole 41 .
  • the fourth hole 41 corresponds to the first projecting portion 23 when the substrate 4 is properly attached to the first housing 2 .
  • a plurality of fourth holes 41 are provided in the substrate 4 .
  • FIG. 5 shows an example in which two fourth holes 41 are provided in the substrate 4 .
  • the fourth hole 41 is provided at a diagonal position on the substrate 4 .
  • the fifth hole 42 is an example of a hole.
  • the fifth hole 42 is a hole for fixing the substrate 4 to the first housing 2 .
  • the fifth hole 42 is a hole penetrating the substrate 4 in the Z-axis direction.
  • a second fixing member 8 to be described later is inserted into the fifth hole 42 .
  • the first housing 2 and the substrate 4 are fixed by the second fixing member 8 inserted into the fifth hole 42 .
  • One or more fifth holes 42 are provided in the substrate 4 .
  • FIG. 5 shows an example in which two fifth holes 42 are provided in the substrate 4 .
  • the fifth holes 42 are preferably provided at diagonal positions on the substrate 4 .
  • the direction of the substrate 4 attached to the second fixing member 8 described later specifically, the Z-axis (vertical) direction and the XY-axis (horizontal) direction can be appropriately arranged. can.
  • the rotation of the substrate 4 around the Z-axis can be suppressed, and the substrate 4 can be fixed in an appropriate direction.
  • the recessed portion 43 is provided at a portion corresponding to the second projecting portion 25 when the substrate 4 is properly arranged in the housing.
  • the recessed portion 43 is an example of a notch portion, and has a notch shape corresponding to the second projecting portion 25 .
  • the recess 43 is a notch provided at the corner of the substrate 4 .
  • the substrate 4 is attached to the first housing 2 with the second protrusion 25 fitted in the recess 43 .
  • FIG. 5 shows an example in which one recess 43 is provided in the substrate 4, a plurality of recesses 43 may be provided. Moreover, it is preferable to provide the concave portions 43 at diagonal positions on the substrate 4 .
  • the direction of the substrate 4 that contacts the second projecting portion 25, specifically, the Z-axis (vertical) direction and the XY-axis (horizontal) direction can be appropriately arranged. Further, by providing the concave portion 43, the rotation of the substrate 4 around the Z-axis can be suppressed, and the substrate 4 can be fixed in an appropriate direction.
  • the mounting board connector 5 is a connection section 32 for outputting an image signal, which is a signal output from the imaging device, to the output mechanism 31 .
  • the mounting board connector 5 is provided on the imaging device mounted on the board 4 and is fitted with the connecting portion 32 .
  • the board 4 is fixed by the second fixing member 8 before the mounting board connector 5 and the connection portion 32 are fitted together.
  • the mounting substrate connector 5 and the connection portion 32 are fitted together.
  • the connecting portion 32 is fitted to the mounting board connector 5
  • the substrate 4 may be displaced.
  • the mounting board connector 5 and the connecting portion 32 may not be properly fitted.
  • the inner diameter L2 of the mating surface of the connecting portion 32 is formed larger than the outer diameter L1 of the mating surface of the mounting board connector 5 .
  • the inner diameter L2 is 0.5 mm larger than the outer diameter L1.
  • the waterproof member 6 is a sealing member for keeping the internal space of the housing airtight.
  • the waterproof member 6 is provided between the first housing 2 and the second housing 3, is sandwiched between the first housing 2 and the second housing 3, and is pressed from the Z-axis direction. By pressing the waterproof member 6, the mating surfaces of the first housing 2 and the second housing 3 are sealed, and the imaging device 100 has a waterproof function.
  • the waterproof member 6 is, for example, a waterproof packing using any elastic material such as rubber.
  • the first fixing member 7 is an example of a fixing member.
  • the first fixing member 7 is a fixing member made of a metal different from that of the housing, which penetrates through the first housing 2 or the second housing 3 and fixes one housing to the other housing.
  • the first fixing member 7 fixes the second housing 3 to the first housing 2 by fastening the second housing 3 to the first housing 2 in the negative direction of the Z-axis direction.
  • the first fixing member 7 is, for example, a fixing screw made of a metal material (eg, stainless steel).
  • the first fixing member 7 is provided with a surface treatment portion 71 .
  • the outer peripheral surface of the first fixing member 7 is subjected to surface treatment to prevent corrosion of the contact surface of the housing through which the first fixing member 7 penetrates.
  • the surface treatment is, for example, ZECCOAT (registered trademark) such as a silica-based special compound, or rust prevention treatment such as iron-zinc-chromate treatment.
  • the second fixing member 8 is an example of a fixing member.
  • the second fixing member 8 fixes the substrate 4 to the first housing 2 by fastening the substrate 4 to the first housing 2 in the negative direction of the Z-axis direction.
  • the second fixing member 8 is, for example, a tapping screw made of a metal material (eg, stainless steel). By using the tapping screws, the first housing 2 and the substrate 4 can be more fixed, and the positional relationship between the lens and the imaging device mounted on the substrate 4 does not change, so the captured image can be kept clear. can do.
  • the first housing 2 and the first fixing member 7 are made of dissimilar metals, a metal corrosion phenomenon may occur between dissimilar metals.
  • the phenomenon of metal corrosion will be described below. In this event, it is assumed that the material of the first housing 2 is a first metallic material such as aluminum, and the first fixing member 7 is a second metallic material such as stainless steel that is different from the first metallic material.
  • the first housing 2 and the first fixing member 7 are made of dissimilar metals. Therefore, when an electrically conductive liquid such as raindrops or salt water enters between the first housing 2 and the first fixing member 7 due to capillary action or the like, a potential difference is generated between the first housing 2 and the first fixing member 7 . occurs, and electrical corrosion occurs.
  • the metal with a high ionization tendency dissolves into the liquid, and the metal corrodes due to electric corrosion.
  • the surface treatment of the first housing 2 deteriorates (for example, the paint film floats), the airtightness of the housing cannot be maintained, and the waterproof performance of the imaging device is hindered.
  • the surface of the first fixing member 7 is coated with a surface treatment agent.
  • a surface treatment agent is a material that suppresses the potential difference between different metals with respect to the surface with which different metals are in contact.
  • the imaging device 100 of the present embodiment fastens the housing, and the first fixing member is subjected to surface treatment for preventing corrosion of the contact surface of the housing through which the first fixing member 7 penetrates.
  • a member 7 is provided. Accordingly, in the imaging apparatus 100 of the present embodiment, the surface of the outer peripheral surface of the first fixing member 7 is subjected to surface treatment, so that no potential difference occurs on the outer peripheral surface of the first fixing member 7 that contacts the housing, and corrosion is prevented. Therefore, deterioration of waterproof performance due to corrosion can be prevented.
  • the first housing 2 and the first fixing member 7 are made of different metals, and the first housing 2 is the member to be fastened.
  • Modified Example 1 a configuration in which the second housing 3 and the first fixing member 7 are made of dissimilar metals and the second housing 3 is a member to be fastened will be described.
  • Modification 1 For example, if the second housing 3 and the first fixing member 7 are made of dissimilar metals, metal corrosion may occur between dissimilar metals. The phenomenon of metal corrosion will be described below. In this event, it is assumed that the material of the second housing 3 is a first metallic material such as aluminum, and the first fixing member 7 is a second metallic material such as stainless steel that is different from the first metallic material.
  • the second housing 3 and the first fixing member 7 are made of dissimilar metals. Therefore, when an electrically conductive liquid such as raindrops or salt water enters between the second housing 3 and the first fixing member 7 due to capillary action or the like, the potential difference between the first housing 2 and the first fixing member 7 is increased. occurs and corrosion occurs.
  • the metal with a high ionization tendency dissolves into the liquid, causing corrosion.
  • the surface treatment of the second housing 3 deteriorates (for example, the paint film floats), the airtightness of the housing cannot be maintained, and the waterproof performance of the imaging device is hindered.
  • FIG. 7 is a cross-sectional view showing an example of an imaging device 200 according to Modification 2. As shown in FIG.
  • the substrate 410 has a first substrate 411 , a second substrate 412 and flexible wiring 413 .
  • the first substrate 411 mounts an imaging device that captures an object image formed on an imaging surface by a lens.
  • the first substrate 411 is the substrate 410 fixed to the first housing 2 via the second fixing member 8 .
  • the first substrate 411 has a sixth hole 4111 .
  • the sixth hole 4111 is an example of a hole.
  • the sixth hole 4111 extends in the Z-axis direction and penetrates the first substrate 411 .
  • the first protrusion 23 is inserted into the fourth hole 41 .
  • the second board 412 is a board 410 that has a mounting board connector 5 for fitting the output mechanism 31 and is electrically connected to the first board 411 via flexible wiring 413 .
  • the flexible wiring 413 is wiring that electrically connects the first substrate 411 and the second substrate 412 .
  • the mounting substrate connector 5 provided on the second substrate 412 has a degree of freedom with respect to the connecting portion 32 , so that it can be properly fitted with the connecting portion 32 . Thereby, the assembly of the first housing 2 and the second housing 3 can be efficiently performed.
  • the outer diameter of the contact surface of the first housing 2 and the outer diameter of the contact surface of the second housing 3 may be equal.
  • the first housing 2 and the side of the second housing 3 can be aligned to provide a reference surface for assembly. Thereby, the assembly of the first housing 2 and the second housing 3 can be efficiently performed.
  • Modification 4 In the second modification described above, the outer diameter of the contact surface of the first housing 2 and the outer diameter of the contact surface of the second housing 3 are equal, but the outer diameter of the contact surface is limited to this. not to be Therefore, in Modified Example 3, a form in which the outer diameter of the contact surface of the first housing 2 and the outer diameter of the contact surface of the second housing 3 are different will be described.
  • the outer diameter of the second housing 3 may be larger than the outer diameter of the first housing 2. That is, the second housing 3 may cover the first housing 2 that contacts the second housing 3 .
  • the connection part 32 provided in the second housing 3 is connected to the substrate 4 fixed to the first housing 2 . Since it can move freely with respect to the mounting board connector 5 , it can be properly fitted with the mounting board connector 5 .
  • FIG. 8 and 9 are cross-sectional views showing an example of the first housing 2 according to Modification 5.
  • FIG. 8 and 9 are cross-sectional views showing an example of the first housing 2 according to Modification 5.
  • the first hole 22 to which the first fixing member 7 is fastened is generally machined after surface treatment because a predetermined dimensional accuracy is required.
  • the chamfered portion 26 is machined at the same timing as the first hole 22 is machined.
  • the chamfered portion 26 has a shape that is susceptible to the accumulation of salt water or the like when it enters from the outside, when the film formed by the surface treatment is removed, the aluminum die-cast metal base is exposed and is resistant to corrosion. Endurance will decrease.
  • the first housing 2 is first formed with the chamfered portion 26 during molding. After forming the chamfered portion 26, the first housing 2 is subjected to surface treatment. After the surface treatment, the first housing 2 is processed to form the first holes 22 as shown in FIG.
  • the film thickness of the chamfered portion 26 remains after the surface treatment.
  • the chamfered portion 26 is formed during molding, but the surface treatment may be performed after the chamfered portion 26 is machined.
  • the chamfered portion may be formed in the third hole 33 provided in the second housing 3, and the formed chamfered portion may be subjected to surface treatment.
  • lens unit 2 first housing 3 second housing 4 board 5 mounting board connector 6 waterproof member 7 first fixing member 8 second fixing member 22 first hole 23 first protrusion 24 second hole 25 second protrusion 26 chamfered portion 31 output mechanism 32 connection portion 33 third hole 41 fourth hole 42 fifth hole 43 concave portion 410 substrate 100, 200 imaging device

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

An imaging device according to the present disclosure comprises a substrate, a housing, and a first fixing member. An imaging element is mounted on the substrate. The housing comprises a first housing and a second housing, and houses the substrate in a space defined by the first housing and the second housing. The first fixing member penetrates through the first housing or the second housing and fixes one housing to the other housing. The first fixing member is made of a different metal than the housings. A peripheral surface of the first fixing member is provided with a surface treatment for preventing corrosion of an abutting surface of the housing through which the first fixing member penetrates.

Description

撮像装置Imaging device
 本発明は、撮像装置に関する。 The present invention relates to imaging devices.
 近年、車両の運転支援システムの普及に伴い、車両にカメラ(以下、撮像装置ともいう)が搭載されることが増えつつある。係る撮像装置は、レンズが取り付けられたレンズユニットと、イメージセンサ(以下、センサともいう)等を収容する筐体とを備える。また、筐体は、電磁ノイズの侵入及び漏洩を防ぎ、さらにカメラ内部の温度上昇を抑える熱対策として金属等の導電性部材で形成することも行われている。 In recent years, with the spread of vehicle driving support systems, the number of vehicles equipped with cameras (hereinafter also referred to as imaging devices) is increasing. Such an imaging device includes a lens unit to which a lens is attached, and a housing that houses an image sensor (hereinafter also referred to as a sensor) and the like. In addition, the casing is also made of a conductive material such as metal as a heat countermeasure to prevent electromagnetic noise from entering and leaking and to suppress the temperature rise inside the camera.
 ところで、上述の撮像装置は、車両の振動にさらされたり、車外に設置されたりする等、様々な環境で使用されるが、レンズとセンサとの適切な位置関係を保持することで、鮮明な画像を長期にわたって得ることができる。例えば、従来、ネジ等の固定部材を用いて、レンズとセンサとの位置関係を固定することが行われている(例えば、特許文献1)。 By the way, the imaging device described above is used in various environments such as being exposed to vehicle vibrations and being installed outside the vehicle. Images can be obtained over time. For example, conventionally, fixing members such as screws are used to fix the positional relationship between the lens and the sensor (for example, Patent Document 1).
米国特許第8542451号明細書U.S. Pat. No. 8,542,451
 しかしながら、例えば、上述した固定部材を用いて固定する技術では、筐体と固定部材とが異種金属で形成されると、電蝕による腐食が発生し、撮像装置の防水性能が低下する可能性がある。撮像装置の防水機能が低下すると、浸水により撮像装置に収容する電気部品がショートして、撮像装置が機能しなくなるおそれがあるため、腐食により防水性能の低下を防止することが可能な技術が要求されている。 However, for example, in the technique of fixing using the fixing member described above, if the housing and the fixing member are formed of dissimilar metals, corrosion due to electric corrosion may occur, and the waterproof performance of the imaging device may deteriorate. be. If the waterproof function of an imaging device deteriorates, there is a risk that electrical parts housed in the imaging device will short-circuit due to water intrusion, rendering the imaging device inoperable. It is
 本開示は、腐食により防水性能の低下を防止することが可能な撮像装置を提供する。 The present disclosure provides an imaging device capable of preventing deterioration of waterproof performance due to corrosion.
 本開示に係る撮像装置は、基板と、筐体と、第1固定部材と、を備える。基板は、撮像素子が実装される。筐体は、第1筐体及び第2筐体を有し、前記第1筐体と前記第2筐体とで形成される空間内部に前記基板を収容する筐体である。第1固定部材は、前記第1筐体または前記第2筐体を貫通し、一方の筐体を他方の筐体に固定する、前記第1筐体とは異なる金属で形成され、前記第1固定部材の外周面には、前記第1固定部材が貫通する前記筐体の当接面を腐食防止するための表面処理が施される。 An imaging device according to the present disclosure includes a substrate, a housing, and a first fixing member. An imaging device is mounted on the substrate. The housing has a first housing and a second housing, and accommodates the substrate in a space formed by the first housing and the second housing. The first fixing member penetrates through the first housing or the second housing and fixes one housing to the other housing. The outer peripheral surface of the fixing member is subjected to surface treatment for preventing corrosion of the contact surface of the housing through which the first fixing member penetrates.
 本開示に係る撮像装置は、腐食により防水性能の低下を防止することができる。 The imaging device according to the present disclosure can prevent deterioration of waterproof performance due to corrosion.
図1は、実施形態に係る撮像装置の一例を示す概略図である。FIG. 1 is a schematic diagram showing an example of an imaging device according to an embodiment. 図2は、実施形態に係る撮像装置の一例を示す分解図である。FIG. 2 is an exploded view showing an example of the imaging device according to the embodiment. 図3は、実施形態に係る筐体の一例を示す概略図である。FIG. 3 is a schematic diagram illustrating an example of a housing according to the embodiment; 図4は、実施形態に係る撮像装置の一例を示す断面図である。FIG. 4 is a cross-sectional view showing an example of the imaging device according to the embodiment. 図5は、実施形態に係る基板の一例を示す概略図である。FIG. 5 is a schematic diagram showing an example of a substrate according to the embodiment. 図6は、実施形態に係る撮像装置の一例を示す断面図である。FIG. 6 is a cross-sectional view showing an example of the imaging device according to the embodiment. 図7は、変形例2に係る撮像装置の一例を示す断面図である。FIG. 7 is a cross-sectional view showing an example of an imaging device according to Modification 2. As shown in FIG. 図8は、変形例5に係る撮像装置の一例を示す断面図である。FIG. 8 is a cross-sectional view showing an example of an imaging device according to modification 5. As shown in FIG. 図9は、変形例5に係る撮像装置の一例を示す断面図である。FIG. 9 is a cross-sectional view showing an example of an imaging device according to modification 5. As shown in FIG.
 以下、図面を参照しながら、本開示の実施形態を詳細に説明する。ただし、必要以上に詳細な説明は省略する場合がある。なお、添付図面及び以下の説明は、当業者が本開示を十分に理解するために提供されるのであって、これらにより請求の範囲に記載の主題を限定することは意図されていない。 Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. However, more detailed description than necessary may be omitted. It should be noted that the accompanying drawings and the following description are provided for a thorough understanding of the present disclosure by those skilled in the art and are not intended to limit the claimed subject matter.
 本実施形態に係る撮像装置は、例えば、車両に搭載され、車両の運転支援に用いられ得る車載カメラである。運転支援用の撮像装置は、内部のISP(Image Signal Processor)による画像処理により、車両、歩行者、障害物等の物体を検知し、運転者に警告を行ったり、車両を強制的に停止させたりする等、車両の運転支援システムにおいて主要な役割を担っている。 The imaging device according to this embodiment is, for example, an in-vehicle camera that is mounted on a vehicle and that can be used for driving assistance of the vehicle. The imaging device for driving support detects objects such as vehicles, pedestrians, and obstacles by image processing by the internal ISP (Image Signal Processor), warns the driver, and forces the vehicle to stop. It plays a major role in the driving support system of the vehicle.
 図1、図2、図3、図4、図5及び図6を用いて、本実施形態に係る撮像装置の構成の一例について説明する。なお、以下に説明する図面において、便宜上、互いに直交するX軸、Y軸、Z軸を示しており、本実施形態の撮像装置100における左右方向(X方向)、前後方向(Y方向)、上下方向(Z方向)をX軸、Y軸、Z軸を用いて説明する。なお、以下の説明において、単に、X方向、Y方向、またはZ方向と記載した場合には、それぞれの軸方向であり、逆向きの2方向を含む。 An example of the configuration of the imaging device according to the present embodiment will be described using FIGS. 1, 2, 3, 4, 5 and 6. In the drawings described below, the X-axis, Y-axis, and Z-axis that are orthogonal to each other are shown for convenience, and the left-right direction (X-direction), the front-rear direction (Y-direction), and the up-down direction of the imaging device 100 of the present embodiment are shown. The direction (Z direction) will be explained using the X axis, Y axis, and Z axis. In the following description, simply describing the X direction, the Y direction, or the Z direction means each axial direction and includes two opposite directions.
 また、X軸の正の方向と特定した場合には左側から右側への一方向であり、Y軸の正の方向と特定した場合には前側から後ろ側への一方向であり、Z軸の正の方向と特定した場合には下側から上側への一方向である。X軸の負の方向と特定した場合には右側から左側への一方向であり、Y軸の負の方向と特定した場合には後ろ側から前側への一方向であり、Z軸の負の方向と特定した場合には上側から下側への一方向である。 When the positive direction of the X-axis is specified, it is one direction from left to right; when the positive direction of the Y-axis is specified, it is one direction from front to back; If specified as a positive direction, it is one direction from bottom to top. When specified as the negative direction of the X-axis, it is one direction from right to left; when specified as the negative direction of the Y-axis, it is one direction from the rear to the front; When the direction is specified, it is one direction from the upper side to the lower side.
 図1は、実施形態に係る撮像装置の概略図である。図2は、実施形態に係る撮像装置の分解図である。図3は、実施形態に係る第1筐体をZ軸方向の正の方向から見た概略図である。図4は、実施形態に係る撮像装置の断面図である。図5は、実施形態に係る基板をZ軸方向の正の方向から見た概略図である。図6は、実施形態に係る撮像装置の断面の一部を拡大した拡大図である。 FIG. 1 is a schematic diagram of an imaging device according to an embodiment. FIG. 2 is an exploded view of the imaging device according to the embodiment. FIG. 3 is a schematic diagram of the first housing according to the embodiment viewed from the positive direction of the Z-axis. FIG. 4 is a cross-sectional view of the imaging device according to the embodiment. FIG. 5 is a schematic diagram of the substrate according to the embodiment viewed from the positive direction of the Z-axis. FIG. 6 is an enlarged view enlarging a part of the cross section of the imaging device according to the embodiment.
 本実施形態に係る撮像装置100は、レンズユニット1、第1筐体2、第2筐体3、基板4、実装基板コネクタ5、防水部材6、第1固定部材7及び第2固定部材8を備える。なお、撮像装置100に係る構成はこれに限定されない。 The imaging device 100 according to this embodiment includes a lens unit 1, a first housing 2, a second housing 3, a substrate 4, a mounting substrate connector 5, a waterproof member 6, a first fixing member 7 and a second fixing member 8. Prepare. Note that the configuration of the imaging device 100 is not limited to this.
 レンズユニット1は、鏡筒と、レンズとを有する(何れも図示せず)。鏡筒は、両端が開口された円筒形の部材である。鏡筒の内側には、レンズが所定の位置に配置される。鏡筒は、例えば、樹脂材料を用いて形成することができる。レンズは、プラスチックあるいはガラス等で形成される。レンズは、鏡筒の内側において光軸に沿って配置され、後述する基板4に実装された撮像素子上に被写体からの光を結像させる。なお、レンズは、1枚であってもよく、複数であっても良い。 The lens unit 1 has a barrel and a lens (both not shown). A lens barrel is a cylindrical member that is open at both ends. Inside the lens barrel, lenses are arranged at predetermined positions. The lens barrel can be formed using, for example, a resin material. The lens is made of plastic, glass, or the like. The lens is arranged along the optical axis inside the lens barrel, and forms an image of light from a subject on an imaging device mounted on a substrate 4, which will be described later. Note that the number of lenses may be one or plural.
 第1筐体2は、筐体の一例である。第1筐体2は、内側が窪んだ凹状の形状を有する。第1筐体2は、後述する第2筐体3と組み合わせることで形成される空間内部に、レンズユニット1の一部及び後述する基板4を収容する。第1筐体2には、レンズユニット1が取り付けられる。レンズユニット1が取り付けられる第1筐体2の面には、レンズユニット1の外形(外径)に応じた孔21が形成されている。レンズユニット1の一端を第1筐体2の孔21に嵌めこむことで、レンズユニット1は第1筐体2に対して取り付けられる。 The first housing 2 is an example of a housing. The first housing 2 has a concave shape with a hollow inside. The first housing 2 accommodates part of the lens unit 1 and a substrate 4 described later in a space formed by combining with a second housing 3 described later. A lens unit 1 is attached to the first housing 2 . A hole 21 corresponding to the outer shape (outer diameter) of the lens unit 1 is formed in the surface of the first housing 2 to which the lens unit 1 is attached. The lens unit 1 is attached to the first housing 2 by fitting one end of the lens unit 1 into the hole 21 of the first housing 2 .
 第1筐体2は、例えば、アルミダイカスト(一例として、ADC12等のアルミニウム合金)等の金属で作製される。また、第1筐体2の表面には、一般的に防錆処理として所定の膜厚(数ミクロン~数十ミクロン)で表面処理(アルマイト、電着塗装、メッキ等)が施されている。なお、第1筐体2は、前面ケースともいう。 The first housing 2 is made of metal such as aluminum die-cast (as an example, an aluminum alloy such as the ADC 12). Further, the surface of the first housing 2 is generally subjected to surface treatment (alumite, electrodeposition coating, plating, etc.) with a predetermined film thickness (several microns to several tens of microns) as an antirust treatment. Note that the first housing 2 is also called a front case.
 第1筐体2は、後述する第2筐体3と接する部位に第1孔22を備える。第1孔22は、孔の一例である。第1孔22は、第1筐体2をZ軸方向に設けられた孔であり、第1筐体2と第2筐体3とを組み合わせる際に使用される。具体的には、第1孔22は、後述する第1固定部材7が挿入される。また、第1孔22の開口部には、第1固定部材7の挿入時のガイドとなる面取り部26が形成されている。第1孔22に挿入される第1固定部材7により、第1筐体2と第2筐体3とは固定される。 The first housing 2 has a first hole 22 at a portion that contacts the second housing 3, which will be described later. The first hole 22 is an example of a hole. The first hole 22 is a hole provided in the first housing 2 in the Z-axis direction, and is used when combining the first housing 2 and the second housing 3 . Specifically, the first fixing member 7 described later is inserted into the first hole 22 . A chamfered portion 26 is formed at the opening of the first hole 22 to serve as a guide for inserting the first fixing member 7 . The first housing 2 and the second housing 3 are fixed by the first fixing member 7 inserted into the first hole 22 .
 例えば、第1孔22は、第2筐体3の外縁部に複数設けられる。図2では、第1筐体2の外側に第1孔22を2つ設けた例を示している。なお、第1孔22は、第1筐体2の外縁部において、対角となる位置に設けられることが好ましい。 For example, a plurality of first holes 22 are provided on the outer edge of the second housing 3 . FIG. 2 shows an example in which two first holes 22 are provided outside the first housing 2 . The first holes 22 are preferably provided at diagonal positions on the outer edge of the first housing 2 .
 第1筐体2は、内側に第1突出部23、第2孔24及び第2突出部25等を備える。第1突出部23は突出部の一例である。第1突出部23は、筐体内での後述する基板4の配置位置を位置決めするために用いられる。具体的には、第1突出部23は、Z軸方向の正の方向に向かって突出した部位である。第1突出部23は、後述する基板4を第1筐体2に取り付ける際に、基板4に設けられた第4孔41に挿入される。 The first housing 2 has a first projecting portion 23, a second hole 24, a second projecting portion 25, etc. inside. The first projecting portion 23 is an example of a projecting portion. The first projecting portion 23 is used to position the substrate 4, which will be described later, within the housing. Specifically, the first projecting portion 23 is a portion projecting in the positive direction of the Z-axis direction. The first projecting portion 23 is inserted into a fourth hole 41 provided in the substrate 4 when the substrate 4 to be described later is attached to the first housing 2 .
 第1突出部23は、第1筐体2の内側に複数設けられる。図3では、第1筐体2の内側に第1突出部23を2つ設けた例を示している。また、第1突出部23は、第1筐体2の内側において、対角となる位置に設けることが好ましい。第1突出部23を複数設けることで、第1突出部23に取り付ける基板4の向き、具体的には、Z軸(上下)方向やXY軸(左右)方向を適切に配置することができる。また、第1突出部23を複数設けることで、基板4のθ軸周りの回転を抑えることができ、基板4を適切な方向に固定することができる。 A plurality of first protrusions 23 are provided inside the first housing 2 . FIG. 3 shows an example in which two first protrusions 23 are provided inside the first housing 2 . In addition, it is preferable that the first protrusions 23 are provided at diagonal positions inside the first housing 2 . By providing a plurality of first protrusions 23, the orientation of the substrate 4 attached to the first protrusions 23, specifically, the Z-axis (vertical) direction and the XY-axis (horizontal) direction can be appropriately arranged. Further, by providing a plurality of first protrusions 23, it is possible to suppress the rotation of the substrate 4 around the .theta.-axis, so that the substrate 4 can be fixed in an appropriate direction.
 これにより、基板4に設けられた撮像素子の素子面(センサ面)を、XY軸に対して垂直、すなわちZ軸と平行に配置した状態で、第1筐体2に取り付けることができる。また、基板4に設けられた撮像素子の素子面(センサ面)の、XY軸方向での位置を、適切な位置に配置した状態で、第1筐体2に取り付けることができる。 As a result, the element surface (sensor surface) of the imaging element provided on the substrate 4 can be attached to the first housing 2 with the element surface (sensor surface) arranged perpendicular to the XY axes, that is, parallel to the Z axis. In addition, the element surface (sensor surface) of the imaging element provided on the substrate 4 can be attached to the first housing 2 in a state in which the position in the XY axis direction is arranged at an appropriate position.
 第2孔24は孔の一例である。第2孔24は、後述する基板4を固定するための部位である。具体的には、第2孔24は、第1筐体2のZ軸方向に設けられた孔である。第2孔24には、後述する第2固定部材8が挿入される。第2孔24は、後述する基板4に設けられた第5孔42に対応する。第2孔24と第5孔42に挿入される第2固定部材8により、第1筐体2と基板4は固定される。 The second hole 24 is an example of a hole. The second hole 24 is a part for fixing the substrate 4 which will be described later. Specifically, the second hole 24 is a hole provided in the Z-axis direction of the first housing 2 . A second fixing member 8 to be described later is inserted into the second hole 24 . The second hole 24 corresponds to a fifth hole 42 provided in the substrate 4, which will be described later. The first housing 2 and the substrate 4 are fixed by the second fixing member 8 inserted into the second hole 24 and the fifth hole 42 .
 第2孔24は、第1筐体2の内側に複数設けられる。図3では、第1筐体2の内側に第2孔24を2つ設けた例を示している。また、第2孔24は、第1筐体2の内側において、対角となる位置に設けることが好ましい。第2孔24を複数設けることで、第2孔24に取り付けられる第2固定部材8の向き、具体的には、Z軸(上下)方向やXY軸(左右)方向を適切に配置することができる。 A plurality of second holes 24 are provided inside the first housing 2 . FIG. 3 shows an example in which two second holes 24 are provided inside the first housing 2 . Moreover, it is preferable that the second holes 24 are provided at diagonal positions inside the first housing 2 . By providing a plurality of second holes 24, the direction of the second fixing member 8 attached to the second holes 24, specifically, the Z-axis (vertical) direction and the XY-axis (horizontal) direction can be appropriately arranged. can.
 第2突出部25は突出部の一例である。第2突出部25は、当該第1筐体2の内側に、筐体内での後述する基板4の配置位置を位置決めするための部位である。具体的には、第2突出部25は、Z軸方向の正の方向に向かって突出した部位である。第2突出部25は、後述する基板4上に設けられた凹部43に嵌め合わされる。 The second projecting portion 25 is an example of a projecting portion. The second protruding portion 25 is a part for positioning the layout position of the substrate 4 to be described later inside the first housing 2 . Specifically, the second projecting portion 25 is a portion projecting in the positive direction of the Z-axis direction. The second protrusion 25 is fitted into a recess 43 provided on the substrate 4, which will be described later.
 第2突出部25は、第1筐体2の内側に設けられる。図3では、第1筐体2の内側に第2突出部25を1つ設けた例を示している。第2突出部25を基板4の凹部43に嵌め合すことで、基板4の向き、具体的には、Z軸(上下)方向やXY軸(左右)方向を適切な方向に配置することができる。なお、第2突出部25は第1筐体2の内側に複数設けられても良い。 The second protrusion 25 is provided inside the first housing 2 . FIG. 3 shows an example in which one second projecting portion 25 is provided inside the first housing 2 . By fitting the second protrusion 25 into the recess 43 of the substrate 4, the direction of the substrate 4, specifically, the Z-axis (vertical) direction and the XY-axis (horizontal) direction can be arranged in an appropriate direction. can. A plurality of second projecting portions 25 may be provided inside the first housing 2 .
 第2筐体3は、筐体の一例である。第2筐体3は、内側が窪んだ凹状の形状を有する。第2筐体3は、第1筐体2と組み合わせることで形成される空間内部に、レンズユニット1の一部及び後述する基板4を収容する。第2筐体3は、例えば、アルミダイカスト(一例として、ADC12等のアルミニウム合金)や樹脂等から作製される。なお、第2筐体3は、後面ケースともいう。なお、第1筐体2と第2筐体3を合わせて筐体ともいう。 The second housing 3 is an example of a housing. The second housing 3 has a concave shape with a hollow inside. The second housing 3 accommodates a part of the lens unit 1 and a substrate 4 described later in a space formed by combining with the first housing 2 . The second housing 3 is made of, for example, aluminum die-cast (eg, an aluminum alloy such as the ADC 12), resin, or the like. The second housing 3 is also called a rear case. In addition, the first housing 2 and the second housing 3 are collectively referred to as a housing.
 第2筐体3は、内側に出力機構31を有する。出力機構31は、撮像素子から出力された信号である画像信号を外部へ出力する電気ケーブルを接続するための、導電性の接続部32を有する。出力機構31は、例えば、同軸(2線タイプ)用コネクタ、STQ(シールドツイストクアッド電線)(4線タイプ)コネクタ、またはCAN入りSTQ(6線タイプ)コネクタ等である。接続部32は、後述する実装基板コネクタ5と篏合することで、実装基板コネクタ5と電気的に接続する。接続部32と実装基板コネクタ5との篏合について後述する。 The second housing 3 has an output mechanism 31 inside. The output mechanism 31 has a conductive connection portion 32 for connecting an electric cable for outputting an image signal, which is a signal output from the imaging element, to the outside. The output mechanism 31 is, for example, a coaxial (2-wire type) connector, an STQ (shielded twisted quad wire) (4-wire type) connector, a CAN-incorporated STQ (6-wire type) connector, or the like. The connecting portion 32 is electrically connected to the mounting board connector 5 by fitting with the mounting board connector 5 described later. Fitting between the connection portion 32 and the mounting board connector 5 will be described later.
 第2筐体3は、第1筐体2と接する部位に第3孔33を備える。第3孔33は、孔の一例である。第3孔33は、第1筐体2と第2筐体3を組み合わせるための孔であり、第1孔22に対応する位置に設けられる。具体的には、第3孔33は、第2筐体3をZ軸方向に貫通する孔である。第3孔33は、後述する第1固定部材7が挿入される。第3孔33に挿入される第1固定部材7により、第1筐体2と第2筐体3は固定される。 The second housing 3 has a third hole 33 at a portion that contacts the first housing 2 . The third hole 33 is an example of a hole. The third hole 33 is a hole for combining the first housing 2 and the second housing 3 and is provided at a position corresponding to the first hole 22 . Specifically, the third hole 33 is a hole penetrating the second housing 3 in the Z-axis direction. The first fixing member 7 described later is inserted into the third hole 33 . The first housing 2 and the second housing 3 are fixed by the first fixing member 7 inserted into the third hole 33 .
 第3孔33は、第2筐体3の外側に複数設けられる。図2では、第1孔22の個数に応じて、第3孔33を2つ設けた例を示している。 A plurality of third holes 33 are provided outside the second housing 3 . FIG. 2 shows an example in which two third holes 33 are provided according to the number of first holes 22 .
 基板4は、一方の面側に、レンズを介して受光した光を画像信号に変換する撮像素子を実装する。また、基板4は、一方の面側に、撮像素子との接続端子を含む実装基板コネクタ5を実装する。基板4は、第1筐体2及び第2筐体3により形成される空間内部に収容される。 On one side of the substrate 4, an imaging device is mounted that converts the light received through the lens into an image signal. Further, the substrate 4 has a mounting substrate connector 5 including a connection terminal with an imaging element mounted on one surface side. The substrate 4 is housed inside the space formed by the first housing 2 and the second housing 3 .
 また、基板4は、第4孔41、第5孔42及び凹部43を備える。第4孔41は、孔の一例である。第4孔41は、筐体内で適切に配置した場合での第1突出部23に対応する部位に、第1突出部23に応じた径を有する。基板4は、第4孔41に第1突出部23が挿入された状態で、第1筐体2に取り付けられる。具体的には、第4孔41は、基板4をZ軸方向に貫通する孔である。第4孔41には、第1突出部23が挿入される。第4孔41に挿入される第1突出部23により、第1筐体2と基板4は固定される。第4孔41は、基板4を第1筐体2に正しく取り付けた場合の第1突出部23に対応する。 The substrate 4 also has a fourth hole 41 , a fifth hole 42 and a recess 43 . The fourth hole 41 is an example of a hole. The fourth hole 41 has a diameter corresponding to the first protrusion 23 at a portion corresponding to the first protrusion 23 when properly arranged in the housing. The substrate 4 is attached to the first housing 2 with the first projecting portion 23 inserted into the fourth hole 41 . Specifically, the fourth hole 41 is a hole penetrating through the substrate 4 in the Z-axis direction. The first projecting portion 23 is inserted into the fourth hole 41 . The first housing 2 and the substrate 4 are fixed by the first projecting portion 23 inserted into the fourth hole 41 . The fourth hole 41 corresponds to the first projecting portion 23 when the substrate 4 is properly attached to the first housing 2 .
 なお、第4孔41は、基板4に複数設けられる。図5では、基板4に第4孔41を2つ設けた例を示している。また、第4孔41は、基板4において、対角となる位置に設けることが好ましい。第4孔41を複数設けることで、第1突出部23に取り付ける基板4の向き、具体的には、Z軸(上下)方向やXY軸(左右)方向を適切に配置することができる。また、第4孔41を複数設けることで、基板4のZ軸周りの回転を抑えることができ、基板4を適切な方向に固定することができる。 A plurality of fourth holes 41 are provided in the substrate 4 . FIG. 5 shows an example in which two fourth holes 41 are provided in the substrate 4 . Moreover, it is preferable that the fourth hole 41 is provided at a diagonal position on the substrate 4 . By providing a plurality of fourth holes 41, the substrate 4 attached to the first protruding portion 23 can be properly arranged in the Z-axis (vertical) direction and the XY-axis (horizontal) direction. Further, by providing a plurality of fourth holes 41, rotation of the substrate 4 around the Z axis can be suppressed, and the substrate 4 can be fixed in an appropriate direction.
 第5孔42は、孔の一例である。第5孔42は、第1筐体2に基板4を固定するための孔である。具体的には、第5孔42は、基板4をZ軸方向に貫通する孔である。第5孔42には、後述する第2固定部材8が挿入される。第5孔42に挿入される第2固定部材8により、第1筐体2と基板4は固定される。 The fifth hole 42 is an example of a hole. The fifth hole 42 is a hole for fixing the substrate 4 to the first housing 2 . Specifically, the fifth hole 42 is a hole penetrating the substrate 4 in the Z-axis direction. A second fixing member 8 to be described later is inserted into the fifth hole 42 . The first housing 2 and the substrate 4 are fixed by the second fixing member 8 inserted into the fifth hole 42 .
 第5孔42は、基板4に1つまたは複数設けられる。図5では、基板4に第5孔42を2つ設けた例を示している。また、第5孔42は、基板4において、対角となる位置に設けることが好ましい。第5孔42を複数設けることで、後述する第2固定部材8に取り付けられる基板4の向き、具体的には、Z軸(上下)方向やXY軸(左右)方向を適切に配置することができる。また、第5孔42を複数設けることで、基板4のZ軸周りの回転を抑えることができ、基板4を適切な方向に固定することができる。 One or more fifth holes 42 are provided in the substrate 4 . FIG. 5 shows an example in which two fifth holes 42 are provided in the substrate 4 . Also, the fifth holes 42 are preferably provided at diagonal positions on the substrate 4 . By providing a plurality of fifth holes 42, the direction of the substrate 4 attached to the second fixing member 8 described later, specifically, the Z-axis (vertical) direction and the XY-axis (horizontal) direction can be appropriately arranged. can. Further, by providing a plurality of fifth holes 42, the rotation of the substrate 4 around the Z-axis can be suppressed, and the substrate 4 can be fixed in an appropriate direction.
 凹部43は、筐体内に基板4を適切に配置した場合での第2突出部25に対応する部位に設けられる。凹部43は、切欠部の一例であり、第2突出部25に応じた形状の切欠を有する。具体的には、凹部43は、基板4の角部に設けられた切欠部である。基板4は、凹部43に第2突出部25が嵌め合わされた状態で第1筐体2に取り付けられる。 The recessed portion 43 is provided at a portion corresponding to the second projecting portion 25 when the substrate 4 is properly arranged in the housing. The recessed portion 43 is an example of a notch portion, and has a notch shape corresponding to the second projecting portion 25 . Specifically, the recess 43 is a notch provided at the corner of the substrate 4 . The substrate 4 is attached to the first housing 2 with the second protrusion 25 fitted in the recess 43 .
 なお、図5では、基板4に凹部43を1つ設けた例を示しているが、複数設けてもよい。また、凹部43は、基板4において、対角となる位置に設けることが好ましい。凹部43を設けることで、第2突出部25と当接される基板4の向き、具体的には、Z軸(上下)方向やXY軸(左右)方向を適切に配置することができる。また、凹部43を設けることで、基板4のZ軸周りの回転を抑えることができ、基板4を適切な方向に固定することができる。 Although FIG. 5 shows an example in which one recess 43 is provided in the substrate 4, a plurality of recesses 43 may be provided. Moreover, it is preferable to provide the concave portions 43 at diagonal positions on the substrate 4 . By providing the concave portion 43, the direction of the substrate 4 that contacts the second projecting portion 25, specifically, the Z-axis (vertical) direction and the XY-axis (horizontal) direction can be appropriately arranged. Further, by providing the concave portion 43, the rotation of the substrate 4 around the Z-axis can be suppressed, and the substrate 4 can be fixed in an appropriate direction.
 実装基板コネクタ5は、撮像素子から出力された信号である画像信号を出力機構31へ出力するための接続部32である。実装基板コネクタ5は、基板4に実装された撮像素子上に設けられ、接続部32と篏合する。 The mounting board connector 5 is a connection section 32 for outputting an image signal, which is a signal output from the imaging device, to the output mechanism 31 . The mounting board connector 5 is provided on the imaging device mounted on the board 4 and is fitted with the connecting portion 32 .
 ここで、実装基板コネクタ5と接続部32との篏合について説明する。まず、実装基板コネクタ5と接続部32を篏合する前に、基板4は、第2固定部材8により固定される。基板4が固定された後、実装基板コネクタ5と接続部32を篏合する。ここで、例えば、接続部32を実装基板コネクタ5に篏合する際に、接続部32の篏合する面と、実装基板コネクタ5の篏合する面とが、位置ずれが生じると、基板4が予め第1筐体2に固定されているため、実装基板コネクタ5と接続部32をうまく篏合できない場合がある。 Here, the fitting between the mounting board connector 5 and the connecting portion 32 will be described. First, the board 4 is fixed by the second fixing member 8 before the mounting board connector 5 and the connection portion 32 are fitted together. After the substrate 4 is fixed, the mounting substrate connector 5 and the connection portion 32 are fitted together. Here, for example, when the connecting portion 32 is fitted to the mounting board connector 5, if there is a positional deviation between the mating surface of the connecting portion 32 and the mating surface of the mounting board connector 5, the substrate 4 may be displaced. is fixed to the first housing 2 in advance, the mounting board connector 5 and the connecting portion 32 may not be properly fitted.
 そこで、本実施形態では、図6に示すように、接続部32の篏合する面の内径L2は、実装基板コネクタ5の篏合する面の外径L1より大きく形成されている。例えば、内径L2は、外径L1に対して、0.5mm大きい。これにより、実装基板コネクタ5と接続部32とを、容易かつ適切に篏合させることができる。 Therefore, in this embodiment, as shown in FIG. 6, the inner diameter L2 of the mating surface of the connecting portion 32 is formed larger than the outer diameter L1 of the mating surface of the mounting board connector 5 . For example, the inner diameter L2 is 0.5 mm larger than the outer diameter L1. As a result, the mounting board connector 5 and the connection portion 32 can be easily and properly fitted.
 防水部材6は、筐体の内部空間の気密性を保つための密封部材である。防水部材6は、第1筐体2と、第2筐体3の間に設けられ、第1筐体2と、第2筐体3とに挟まれて、Z軸方向から押圧される。防水部材6を押圧することにより、第1筐体2と第2筐体3との合わせ面が密封され、撮像装置100は防水機能を有することになる。防水部材6は、例えば、ゴムなどのなどの任意の弾性材料を用いる防水パッキンである。 The waterproof member 6 is a sealing member for keeping the internal space of the housing airtight. The waterproof member 6 is provided between the first housing 2 and the second housing 3, is sandwiched between the first housing 2 and the second housing 3, and is pressed from the Z-axis direction. By pressing the waterproof member 6, the mating surfaces of the first housing 2 and the second housing 3 are sealed, and the imaging device 100 has a waterproof function. The waterproof member 6 is, for example, a waterproof packing using any elastic material such as rubber.
 第1固定部材7は、固定部材の一例である。第1固定部材7は、第1筐体2または第2筐体3を貫通し、一方の筐体を他方の筐体に固定する、筐体とは異なる金属で形成された固定部材である。第1固定部材7は、第2筐体3をZ軸方向の負の方向に向かって、第1筐体2と締結することで、第2筐体3を第1筐体2に固定する。第1固定部材7は、例えば、金属材料(一例として、ステンレス)等から作製された固定ねじである。 The first fixing member 7 is an example of a fixing member. The first fixing member 7 is a fixing member made of a metal different from that of the housing, which penetrates through the first housing 2 or the second housing 3 and fixes one housing to the other housing. The first fixing member 7 fixes the second housing 3 to the first housing 2 by fastening the second housing 3 to the first housing 2 in the negative direction of the Z-axis direction. The first fixing member 7 is, for example, a fixing screw made of a metal material (eg, stainless steel).
 また、第1固定部材7は、表面処理部71を設ける。具体的には、第1固定部材7の外周面には、第1固定部材7が貫通する筐体の当接面を腐食防止するための表面処理が施される。表面処理は、例えば、シリカ系特殊化合物等のZECCOAT(登録商標)や、鉄-亜鉛-クロメート処理等の防錆化処理である。 Also, the first fixing member 7 is provided with a surface treatment portion 71 . Specifically, the outer peripheral surface of the first fixing member 7 is subjected to surface treatment to prevent corrosion of the contact surface of the housing through which the first fixing member 7 penetrates. The surface treatment is, for example, ZECCOAT (registered trademark) such as a silica-based special compound, or rust prevention treatment such as iron-zinc-chromate treatment.
 第2固定部材8は、固定部材の一例である。第2固定部材8は、基板4をZ軸方向の負の方向に向かって、第1筐体2と締結することで、基板4を第1筐体2に固定する。第2固定部材8は、例えば、金属材料(一例として、ステンレス)等から作製されたタッピングねじである。タッピングねじを用いることで、第1筐体2と基板4をより固定することができ、レンズと基板4に実装された撮像素子との位置関係が変化しないため、撮像画像が鮮明な状態を維持することができる。 The second fixing member 8 is an example of a fixing member. The second fixing member 8 fixes the substrate 4 to the first housing 2 by fastening the substrate 4 to the first housing 2 in the negative direction of the Z-axis direction. The second fixing member 8 is, for example, a tapping screw made of a metal material (eg, stainless steel). By using the tapping screws, the first housing 2 and the substrate 4 can be more fixed, and the positional relationship between the lens and the imaging device mounted on the substrate 4 does not change, so the captured image can be kept clear. can do.
 ところで、第1筐体2と第1固定部材7とを異種金属で形成すると、異種金属間で金属が腐食する事象が発生する場合がある。以下、金属が腐食する事象について説明する。本事象においては、第1筐体2の材質がアルミ等の第1金属材質、第1固定部材7がステンレス等の第1金属材質とは異なる第2金属材質であるとする。 By the way, if the first housing 2 and the first fixing member 7 are made of dissimilar metals, a metal corrosion phenomenon may occur between dissimilar metals. The phenomenon of metal corrosion will be described below. In this event, it is assumed that the material of the first housing 2 is a first metallic material such as aluminum, and the first fixing member 7 is a second metallic material such as stainless steel that is different from the first metallic material.
 上述の構成では、第1筐体2と第1固定部材7とが異種金属で形成される。そのため、雨滴、塩水等の通電性の液体が毛細管現象等により第1筐体2と第1固定部材7と間に侵入すると、第1筐体2と第1固定部材7との間に電位差が発生し、電蝕が発生する。 In the above configuration, the first housing 2 and the first fixing member 7 are made of dissimilar metals. Therefore, when an electrically conductive liquid such as raindrops or salt water enters between the first housing 2 and the first fixing member 7 due to capillary action or the like, a potential difference is generated between the first housing 2 and the first fixing member 7 . occurs, and electrical corrosion occurs.
 具体的には、イオン化傾向の高い金属(上記例では第1金属材質の第1筐体2)が液体に溶け出し、電蝕により金属が腐食することになる。腐食が進行すると、第1筐体2の表面処理が劣化(例えば、塗装膜の浮き等が発生)し、筐体の気密性が維持できなくなり、撮像装置の防水性能に支障をきたす。 Specifically, the metal with a high ionization tendency (in the above example, the first housing 2 made of the first metal material) dissolves into the liquid, and the metal corrodes due to electric corrosion. As the corrosion progresses, the surface treatment of the first housing 2 deteriorates (for example, the paint film floats), the airtightness of the housing cannot be maintained, and the waterproof performance of the imaging device is hindered.
 そこで、本実施形態では、第1固定部材7の表面に表面処理剤を塗布している。表面処理剤は、異なる金属が当接する面に対し、異なる金属間の電位差を抑制する材料である。第1固定部材7の表面に表面処理剤を塗布することで、第1固定部材7の外周面を覆う表面処理部71が形成される。第1固定部材7に表面処理部71が形成されることで、第1筐体2と当接しても、電位差が生じず、腐食が発生しないため、第1筐体2と第2筐体3は適切に固定されている状態を保つことができる。 Therefore, in this embodiment, the surface of the first fixing member 7 is coated with a surface treatment agent. A surface treatment agent is a material that suppresses the potential difference between different metals with respect to the surface with which different metals are in contact. By applying a surface treatment agent to the surface of the first fixing member 7, a surface treatment portion 71 that covers the outer peripheral surface of the first fixing member 7 is formed. Since the surface-treated portion 71 is formed on the first fixing member 7 , even if it contacts the first housing 2 , no potential difference occurs and corrosion does not occur. can remain properly fixed.
 以上説明したように、本実施形態の撮像装置100は、筐体を締結し、第1固定部材7が貫通する筐体の当接面を腐食防止するための表面処理が施される第1固定部材7を備える。これにより、本実施形態の撮像装置100は、第1固定部材7の外周面の表面に表面処理を施すことで、筐体と当接する第1固定部材7の外周面に電位差が生じず、腐食が発生しないため、腐食により防水性能の低下を防止することができる。 As described above, the imaging device 100 of the present embodiment fastens the housing, and the first fixing member is subjected to surface treatment for preventing corrosion of the contact surface of the housing through which the first fixing member 7 penetrates. A member 7 is provided. Accordingly, in the imaging apparatus 100 of the present embodiment, the surface of the outer peripheral surface of the first fixing member 7 is subjected to surface treatment, so that no potential difference occurs on the outer peripheral surface of the first fixing member 7 that contacts the housing, and corrosion is prevented. Therefore, deterioration of waterproof performance due to corrosion can be prevented.
 なお、上述した実施形態は、上述した各装置が有する構成または機能の一部を変更することで、適宜に変形して実施することも可能である。そこで、以下では、上述した実施形態に係るいくつかの変形例を他の実施形態として説明する。なお、以下では、上述した実施形態と異なる点を主に説明することとし、既に説明した内容と共通する点については詳細な説明を省略する。 It should be noted that the above-described embodiment can be appropriately modified and implemented by changing a part of the configuration or function of each device described above. Therefore, hereinafter, some modifications of the above-described embodiment will be described as other embodiments. In the following description, points different from the above-described embodiment will be mainly described, and detailed description of points common to the contents already described will be omitted.
 上述した実施形態では、第1筐体2と第1固定部材7とを異種金属で形成し、第1筐体2が被締結部材とする形態について説明した。変形例1では、第2筐体3と第1固定部材7とを異種金属で形成し、第2筐体3が被締結部材とする形態について説明する。 In the above-described embodiment, the first housing 2 and the first fixing member 7 are made of different metals, and the first housing 2 is the member to be fastened. In Modified Example 1, a configuration in which the second housing 3 and the first fixing member 7 are made of dissimilar metals and the second housing 3 is a member to be fastened will be described.
(変形例1)
 例えば、第2筐体3と第1固定部材7とを異種金属で形成すると、異種金属間で金属が腐食する事象が発生する場合がある。以下、金属が腐食する事象について説明する。本事象においては、第2筐体3の材質がアルミ等の第1金属材質、第1固定部材7がステンレス等の第1金属材質とは異なる第2金属材質であるとする。
(Modification 1)
For example, if the second housing 3 and the first fixing member 7 are made of dissimilar metals, metal corrosion may occur between dissimilar metals. The phenomenon of metal corrosion will be described below. In this event, it is assumed that the material of the second housing 3 is a first metallic material such as aluminum, and the first fixing member 7 is a second metallic material such as stainless steel that is different from the first metallic material.
 上述の構成では、第2筐体3と第1固定部材7とが異種金属で形成される。そのため、雨滴、塩水等の通電性の液体が毛細管現象等により第2筐体3と第1固定部材7との間に侵入すると、第1筐体2と第1固定部材7との間に電位差が発生し、腐食が発生する。 In the above configuration, the second housing 3 and the first fixing member 7 are made of dissimilar metals. Therefore, when an electrically conductive liquid such as raindrops or salt water enters between the second housing 3 and the first fixing member 7 due to capillary action or the like, the potential difference between the first housing 2 and the first fixing member 7 is increased. occurs and corrosion occurs.
 具体的には、イオン化傾向の高い金属(変形例1では第1金属材質の第2筐体3)が液体に溶け出し、腐食が発生することになる。腐食が進行すると、第2筐体3の表面処理が劣化(例えば塗装膜の浮き等が発生)し、筐体の気密性が維持できなくなり、撮像装置の防水性能に支障をきたす。 Specifically, the metal with a high ionization tendency (the second housing 3 made of the first metal material in Modification 1) dissolves into the liquid, causing corrosion. As the corrosion progresses, the surface treatment of the second housing 3 deteriorates (for example, the paint film floats), the airtightness of the housing cannot be maintained, and the waterproof performance of the imaging device is hindered.
 しかしながら、第1固定部材7に表面処理部71が形成されることで、第2筐体3と当接しても、電位差が生じず、腐食が発生しないため、腐食により防水性能の低下を防止することができる。 However, since the surface-treated portion 71 is formed on the first fixing member 7, even if it comes into contact with the second housing 3, no potential difference occurs and corrosion does not occur. be able to.
 以下で説明する変形例は、主に、第1筐体2と第2筐体3との組立時において、レンズとセンサとの適切な位置関係の実現可能な構成について説明する。また、以下で説明する変形例は、個別に実施されても良いし、適宜組み合わせて実施されても良い。 In the modified examples described below, a configuration that can achieve an appropriate positional relationship between the lens and the sensor will be mainly described when assembling the first housing 2 and the second housing 3 . Further, the modifications described below may be implemented individually or in combination as appropriate.
(変形例2)
 上述の実施形態では、基板4の枚数が1枚である形態について説明したが、基板4の枚数はこれに限定されるものではない。そこで、変形例2では、基板4の枚数を2枚とする基板410の形態について、図7を用いて説明する。図7は、変形例2に係る撮像装置200の一例を示す断面図である。
(Modification 2)
Although the number of substrates 4 is one in the above-described embodiment, the number of substrates 4 is not limited to this. Therefore, in Modified Example 2, a configuration of the substrate 410 in which the number of the substrates 4 is two will be described with reference to FIG. FIG. 7 is a cross-sectional view showing an example of an imaging device 200 according to Modification 2. As shown in FIG.
 例えば、基板410は、第1基板411、第2基板412及びフレキシブル配線413を有する。第1基板411は、レンズにより撮像面に形成された被写体像を撮像する撮像素子を実装する。第1基板411は、第2固定部材8を介して第1筐体2に固定される基板410である。また、第1基板411は、第6孔4111を備える。第6孔4111は、孔の一例である。第6孔4111は、Z軸方向に延びて第1基板411を貫通している。第4孔41は、第1突出部23を挿入される。 For example, the substrate 410 has a first substrate 411 , a second substrate 412 and flexible wiring 413 . The first substrate 411 mounts an imaging device that captures an object image formed on an imaging surface by a lens. The first substrate 411 is the substrate 410 fixed to the first housing 2 via the second fixing member 8 . Also, the first substrate 411 has a sixth hole 4111 . The sixth hole 4111 is an example of a hole. The sixth hole 4111 extends in the Z-axis direction and penetrates the first substrate 411 . The first protrusion 23 is inserted into the fourth hole 41 .
 第2基板412は、出力機構31を篏合する実装基板コネクタ5を有し、フレキシブル配線413を介して第1基板411と電気的に接続される基板410である。フレキシブル配線413は、第1基板411及び第2基板412を電気的に接続する配線である。 The second board 412 is a board 410 that has a mounting board connector 5 for fitting the output mechanism 31 and is electrically connected to the first board 411 via flexible wiring 413 . The flexible wiring 413 is wiring that electrically connects the first substrate 411 and the second substrate 412 .
 基板410は、フレキシブル配線413を有することで、第2基板412に設けられた実装基板コネクタ5は接続部32に対し自由度があるため、接続部32と適切に篏合することができる。これにより、第1筐体2と第2筐体3の組立が効率的に行うことができる。 Since the substrate 410 has flexible wiring 413 , the mounting substrate connector 5 provided on the second substrate 412 has a degree of freedom with respect to the connecting portion 32 , so that it can be properly fitted with the connecting portion 32 . Thereby, the assembly of the first housing 2 and the second housing 3 can be efficiently performed.
(変形例3)
 例えば、第1筐体2の当接面の外径と第2筐体3の当接面の外径は等しくても良い。第1筐体2の当接面の外径と第2筐体3の当接面の外径を等しくすることで、第1筐体2と第2筐体3を組立てる場合、第1筐体2と第2筐体3の側面を合わせ、組立における基準面を備えることができる。これにより、第1筐体2と第2筐体3の組立が効率的に行うことができる。
(Modification 3)
For example, the outer diameter of the contact surface of the first housing 2 and the outer diameter of the contact surface of the second housing 3 may be equal. By equalizing the outer diameter of the contact surface of the first housing 2 and the outer diameter of the contact surface of the second housing 3, when assembling the first housing 2 and the second housing 3, the first housing 2 and the side of the second housing 3 can be aligned to provide a reference surface for assembly. Thereby, the assembly of the first housing 2 and the second housing 3 can be efficiently performed.
(変形例4)
 上述の変形例2では、第1筐体2の当接面の外径と第2筐体3の当接面の外径は等しい形態について説明したが、当接面の外径はこれに限定されるものではない。そこで、変形例3では、第1筐体2の当接面の外径と第2筐体3の当接面の外径が異なる形態について説明する。
(Modification 4)
In the second modification described above, the outer diameter of the contact surface of the first housing 2 and the outer diameter of the contact surface of the second housing 3 are equal, but the outer diameter of the contact surface is limited to this. not to be Therefore, in Modified Example 3, a form in which the outer diameter of the contact surface of the first housing 2 and the outer diameter of the contact surface of the second housing 3 are different will be described.
 例えば、第2筐体3の外径は、第1筐体2の外径より大きくしても良い。すなわち、第2筐体3は、第2筐体3と当接する第1筐体2を覆っても良い。第2筐体3の外径を第1筐体2の外径より大きくすることで、第2筐体3に設けられた接続部32は、第1筐体2に固定されている基板4の実装基板コネクタ5に対し、自由に移動することができるため、実装基板コネクタ5と適切に篏合することができる。 For example, the outer diameter of the second housing 3 may be larger than the outer diameter of the first housing 2. That is, the second housing 3 may cover the first housing 2 that contacts the second housing 3 . By making the outer diameter of the second housing 3 larger than the outer diameter of the first housing 2 , the connection part 32 provided in the second housing 3 is connected to the substrate 4 fixed to the first housing 2 . Since it can move freely with respect to the mounting board connector 5 , it can be properly fitted with the mounting board connector 5 .
(変形例5)
 また、変形例5では、面取り部26の加工工程を変更することで、表面処理で形成された膜厚を残すことができることについて図8及び図9を用いて説明する。図8及び図9は、変形例5に係る第1筐体2の一例を示す断面図である。
(Modification 5)
In Modified Example 5, the fact that the film thickness formed by the surface treatment can be left by changing the processing process of the chamfered portion 26 will be described with reference to FIGS. 8 and 9. FIG. 8 and 9 are cross-sectional views showing an example of the first housing 2 according to Modification 5. FIG.
 例えば、第1固定部材7が締結される第1孔22は、所定の寸法精度が要求されるため、表面処理後に機械加工されるのが一般的である。また、面取り部26は、第1孔22が機械加工されるタイミングで同時に機械加工される。しかしながら、面取り部26は、外部からの侵入で、塩水等が堆積しやすい形状のため、表面処理で形成された膜厚が除去されると、アルミダイカストからなる金属の下地が露出し、腐食に対する耐性が低下することになる。 For example, the first hole 22 to which the first fixing member 7 is fastened is generally machined after surface treatment because a predetermined dimensional accuracy is required. Also, the chamfered portion 26 is machined at the same timing as the first hole 22 is machined. However, since the chamfered portion 26 has a shape that is susceptible to the accumulation of salt water or the like when it enters from the outside, when the film formed by the surface treatment is removed, the aluminum die-cast metal base is exposed and is resistant to corrosion. Endurance will decrease.
 そのため、変形例5では、図8に示すように、まず、第1筐体2は、面取り部26を成型時に形成する。第1筐体2は、面取り部26を形成後、表面処理を行う。そして、第1筐体2は、表面処理後に、図9に示すように、第1孔22を加工する。 Therefore, in modification 5, as shown in FIG. 8, the first housing 2 is first formed with the chamfered portion 26 during molding. After forming the chamfered portion 26, the first housing 2 is subjected to surface treatment. After the surface treatment, the first housing 2 is processed to form the first holes 22 as shown in FIG.
 これにより、面取り部26に表面処理を行った膜厚が残ることになる。つまり、第1筐体2のアルミダイカストからなる金属の下地が露出することを回避でき、腐食に対する耐性を向上させることができる。なお、変形例5では、成型時に面取り部26を形成したが、面取り部26を機械加工した後で表面処理を施してもよい。なお、面取り部は第2筐体3が備える第3孔33に形成し、形成した面取り部に表面処理を施してもよい。 As a result, the film thickness of the chamfered portion 26 remains after the surface treatment. In other words, it is possible to avoid exposing the aluminum die-cast metal base of the first housing 2 and improve resistance to corrosion. In Modification 5, the chamfered portion 26 is formed during molding, but the surface treatment may be performed after the chamfered portion 26 is machined. The chamfered portion may be formed in the third hole 33 provided in the second housing 3, and the formed chamfered portion may be subjected to surface treatment.
 なお、上述した実施形態は、例として提示したものであり、本開示の範囲を限定することは意図していない。上記実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。上記実施形態は、本開示の範囲または要旨に含まれるとともに、請求の範囲に記載された発明とその均等の範囲に含まれる。 It should be noted that the above-described embodiments are presented as examples and are not intended to limit the scope of the present disclosure. The above embodiment can be implemented in various other forms, and various omissions, replacements, and modifications can be made without departing from the scope of the invention. The above-described embodiments are included in the scope or gist of the present disclosure, and are included in the invention described in the claims and their equivalents.
 1   レンズユニット
 2   第1筐体
 3   第2筐体
 4   基板
 5   実装基板コネクタ
 6   防水部材
 7   第1固定部材
 8   第2固定部材
 22  第1孔
 23  第1突出部
 24  第2孔
 25  第2突出部
 26  面取り部
 31  出力機構
 32  接続部
 33  第3孔
 41  第4孔
 42  第5孔
 43  凹部
 410 基板
 100、200 撮像装置
1 lens unit 2 first housing 3 second housing 4 board 5 mounting board connector 6 waterproof member 7 first fixing member 8 second fixing member 22 first hole 23 first protrusion 24 second hole 25 second protrusion 26 chamfered portion 31 output mechanism 32 connection portion 33 third hole 41 fourth hole 42 fifth hole 43 concave portion 410 substrate 100, 200 imaging device

Claims (7)

  1.  撮像素子が実装される基板と、
     第1筐体及び第2筐体を有し、前記第1筐体と前記第2筐体とで形成される空間内部に前記基板を収容する筐体と、
     前記第1筐体または前記第2筐体を貫通し、一方の筐体を他方の筐体に固定する、前記筐体とは異なる金属で形成された第1固定部材と、
     を備え、
     前記第1固定部材の外周面には、前記第1固定部材が貫通する前記筐体の当接面を腐食防止するための表面処理が施される、
     撮像装置。
    a substrate on which an imaging device is mounted;
    a housing having a first housing and a second housing, and housing the substrate in a space formed by the first housing and the second housing;
    a first fixing member that penetrates through the first housing or the second housing and fixes one housing to the other housing and is formed of a metal different from that of the housing;
    with
    The outer peripheral surface of the first fixing member is subjected to surface treatment to prevent corrosion of the contact surface of the housing through which the first fixing member penetrates.
    Imaging device.
  2.  前記第1固定部材が挿入される前記第1筐体、前記第2筐体の孔の開口部のうち、少なくとも1つの開口部に形成した面取り部と、を備え、
     前記面取り部は、所定の膜厚を有する前記表面処理が施される、
     請求項1に記載の撮像装置。
    a chamfered portion formed in at least one of the openings of the holes of the first housing and the second housing into which the first fixing member is inserted;
    The chamfered portion is subjected to the surface treatment having a predetermined film thickness,
    The imaging device according to claim 1 .
  3.  前記第1筐体は、当該第1筐体の内側に、前記筐体内での前記基板の配置位置を位置決めするための第1突出部を有し、
     前記基板は、前記筐体内で適切に配置した場合での前記第1突出部に対応する部位に、前記第1突出部に応じた径の孔部を有し、当該孔部に前記第1突出部が挿入された状態で、前記第1筐体に取り付けられる、
     請求項1または2に記載の撮像装置。
    The first housing has a first protrusion inside the first housing for positioning the substrate in the housing,
    The substrate has a hole having a diameter corresponding to the first protrusion at a portion corresponding to the first protrusion when properly arranged in the housing, and the first protrusion is formed in the hole. attached to the first housing with the part inserted;
    The imaging device according to claim 1 or 2.
  4.  前記第1筐体は、当該第1筐体の内側に、前記筐体内での前記基板の配置位置を位置決めするための第2突出部を有し、
     前記基板は、前記筐体内で適切に配置した場合での前記第2突出部に対応する部位に、前記第2突出部に応じた形状の切欠部を有し、当該切欠部に前記第2突出部が嵌め合わされた状態で、前記第1筐体に取り付けられる、
     請求項3に記載の撮像装置。
    The first housing has a second protrusion inside the first housing for positioning the substrate in the housing,
    The substrate has a notch portion having a shape corresponding to the second projecting portion at a portion corresponding to the second projecting portion when properly arranged in the housing, and the second projecting portion is formed in the notch portion. attached to the first housing with the parts fitted together;
    The imaging device according to claim 3.
  5.  前記基板は、前記第1筐体に対しタッピングねじで固定される、
     請求項1から4の何れか1項に記載の撮像装置。
    The substrate is fixed to the first housing with a tapping screw,
    The imaging device according to any one of claims 1 to 4.
  6.  前記基板は、前記撮像素子から出力された画像信号を出力するための実装基板コネクタを有し、
     前記第2筐体は、前記実装基板コネクタに篏合し、当該実装基板コネクタと電気的に接続するための接続部を有し、
     前記接続部の内径は、前記実装基板コネクタの外径よりも大きい、
     請求項1から5の何れか1項に記載の撮像装置。
    The board has a mounting board connector for outputting an image signal output from the imaging element,
    The second housing has a connecting portion for fitting to the mounting board connector and electrically connecting to the mounting board connector,
    The inner diameter of the connecting portion is larger than the outer diameter of the mounting board connector,
    The imaging device according to any one of claims 1 to 5.
  7.  前記第2筐体の外径は、前記第1筐体の外径よりも大きく、
     前記第2筐体は、前記実装基板コネクタに対し移動する、
     請求項6に記載の撮像装置。
    The outer diameter of the second housing is larger than the outer diameter of the first housing,
    the second housing moves relative to the mounting board connector;
    The imaging device according to claim 6.
PCT/JP2022/034832 2022-01-26 2022-09-16 Imaging device WO2023145129A1 (en)

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