WO2023092326A1

WO2023092326A1 - Heat dissipation plate, electronic assembly, and terminal

Info

Publication number: WO2023092326A1
Application number: PCT/CN2021/132755
Authority: WO
Inventors: 万军平; 崔培华
Original assignee: 华为技术有限公司
Priority date: 2021-11-24
Filing date: 2021-11-24
Publication date: 2023-06-01
Also published as: CN116490969A

Abstract

Provided are a heat dissipation plate, an electronic assembly, and a terminal. The heat dissipation plate has a fluid inlet, and a cavity, in which a refrigerant fluid flows after same enters the heat dissipation plate. The cavity comprises a slow flow region and a main heat dissipation region, wherein the fluid inlet is in communication with the slow flow region, the slow flow region is in communication with the main heat dissipation region, and the refrigerant fluid sequentially flows through the fluid inlet, the slow flow region and the main heat dissipation region. When the refrigerant fluid flows to the slow flow region and then flows out of the slow flow region through a fluid flow opening of same, the flow velocity of the refrigerant fluid decreases, and the flow rate tends to be stable. The scouring of the main heat dissipation region by the refrigerant fluid is relatively small, so that there is relatively little scouring corrosion of the main heat dissipation region, thereby facilitating the extension of the service life of the heat dissipation plate.

Description

Heat sinks, electronic components and terminals

technical field

The present application relates to the technical field of electronic component structure, in particular to a heat dissipation plate, an electronic component and a terminal.

Background technique

With the development of smart cars, the automatic driving functions of vehicles are becoming more and more perfect. The controller is an important vehicle-mounted electronic device, which can judge and analyze the road condition information obtained by the vehicle-mounted laser radar, millimeter-wave radar or vehicle-mounted camera, and then give driving instructions. The controller includes a heating device. During the working process, the heating device will generate heat, which needs to be dissipated to ensure the normal working state of the heating device. As the application of controllers in vehicles becomes more and more abundant, the functions and applications of controllers are also continuously expanded, and the performance is also improved. Therefore, how to quickly dissipate heat from the controller has become an urgent technical problem to be solved.

Contents of the invention

The present application provides a cooling plate, an electronic component, and a terminal to improve the cooling effect and service life of the cooling plate. Furthermore, the electronic component can arrange heating devices on both sides, and correspondingly arrange the cooling plates on both sides, which can also reduce the occupied area of the electronic component.

In a first aspect, the present application provides a heat dissipation plate, for example, the heat dissipation plate is a liquid cooling plate. Specifically, the heat dissipation plate has a liquid inlet and a cavity, and the cavity can be formed as a flow channel for cooling liquid, and the cooling liquid flows in the cavity after entering the heat dissipation plate from the liquid inlet. The cavity includes a slow flow area and a main heat dissipation area, the liquid inlet communicates with the slow flow area, the slow flow area has a liquid outlet, and the liquid flow port communicates with the main heat dissipation area. The slow flow area communicates with the main heat dissipation area. That is to say, after the refrigerant liquid enters the cavity from the liquid inlet, it first enters the slow flow area, and then the refrigerant liquid that enters the slow flow area flows from the liquid flow port to the main heat dissipation area.

It can be seen that in the heat dissipation plate provided by the present application, by setting a slow flow area on the heat dissipation plate, after the refrigerant liquid flows through the slow flow area, the flow rate of the refrigerant liquid flowing out from the liquid flow port decreases and the flow tends to be stable. The refrigerant liquid can flow to the main heat dissipation area at a relatively low speed and relatively stable, so as to achieve a more stable and uniform heat dissipation effect on the heat generating device. At the same time, due to the buffering effect of the slow flow area, the refrigerant has less erosion on the main heat dissipation area, which makes the erosion and corrosion of the main heat dissipation area relatively slight, which is beneficial to improve the service life of the heat dissipation plate.

The radiating plate includes refrigerating liquid, and the refrigerating liquid is located in the cavity. In this solution, it is beneficial to use the refrigerant liquid to improve the heat dissipation effect of the heat dissipation plate.

In a specific technical solution, the above-mentioned refrigerant liquid may be water, oil or refrigerant, which is not limited in this application.

Specifically, when the main heat dissipation area of the heat dissipation plate is set, the main heat dissipation area may be provided with heat dissipation fins, so as to further improve the heat dissipation capacity of the main heat dissipation area, so that the heat dissipation effect of the main heat dissipation area is better.

The above-mentioned heat dissipation plate may include a plurality of heat dissipation fins, and heat dissipation fins may also be provided in areas other than the main heat dissipation area. In addition, the shapes of different cooling fins may be the same or different, which is not limited in the present application.

The specific structure of the above-mentioned slow flow area is not limited. In one technical solution, the above-mentioned slow flow area has a first buffer port, and the first buffer port is arranged alternately with the liquid inlet. Through the staggered arrangement of the first buffer port and the liquid inlet port, the flow velocity of the refrigerant liquid is slowed down, thereby achieving a more uniform heat dissipation effect.

In a specific technical solution, the above-mentioned slow-flow area includes a first slow-flow structure, and the liquid inlet is directly connected to the first slow-flow structure, that is, the refrigerant can flow through the liquid inlet and the first slow-flow structure in sequence . The above-mentioned first buffer port is arranged in the first slow-flow structure, and the refrigerant liquid can flow out of the first slow-flow structure from the above-mentioned first buffer port, and the refrigerant liquid can flow to the main heat dissipation area through the liquid-flow port.

In an implementation manner, the first slow flow structure includes a retaining wall, and the retaining wall is specifically perpendicular to the flow direction of the refrigerant liquid in the liquid inlet, or in other words, the retaining wall is perpendicular to the extending direction of the liquid inlet. In this solution, the refrigerant liquid enters the first slow flow structure from the liquid inlet, and directly scours the above-mentioned retaining wall.

Specifically, at least two first buffer ports may be provided in the above-mentioned first slow flow structure, so that the refrigerant liquid is divided in the first slow flow structure and flows out of each first buffer port at a relatively low speed.

The above-mentioned slow flow area can also have a second buffer port, which can be arranged in a staggered manner with the liquid inlet, or the second buffer port can also be arranged opposite to the liquid inlet, which is not limited in this application . The second buffer port can be arranged in the area between the liquid inlet and the first buffer port, or the second buffer port can also be arranged between the first buffer port and the liquid flow port. The application does not limit the front, back, left, and right positions of the second buffer port relative to the first buffer port.

In an implementation manner, the slow flow region includes at least two stages of slow flow structures to enhance the slow flow effect. For example, the above slow flow area may also include a second slow flow structure, the second slow flow structure is arranged on the side of the first slow flow structure away from the liquid inlet, and the second slow flow structure communicates with the first buffer port, and the second slow flow structure is connected to the first buffer port. The two buffer ports are arranged on the above-mentioned second slow flow structure. That is to say, after the refrigerant liquid flows out from the first slow flow structure, it flows to the second slow flow structure through the first buffer port. The second buffer port is staggered with the first buffer port. This scheme can realize at least two-stage slow flow of the refrigerant liquid, and the slow flow effect is better, which can make the flow rate of the refrigerant liquid flowing into the main heat dissipation area further slow and uniform, thereby further improving the heat dissipation effect and service life of the main heat dissipation area .

When the above-mentioned slow-flow area is specifically set, the second slow-flow structure can include a second buffer port, and the flow rate of the refrigerant liquid flowing out of the second slow-flow structure is relatively slow, so that the refrigerant liquid can be stored in the second slow-flow structure, and then Steady velocity flows out of the second slow flow structure and into the main cooling area.

The number of main heat dissipation areas included in the heat dissipation plate is not limited. For example, the heat dissipation plate may include at least two main heat dissipation areas, and the slow flow area may include at least two liquid outlets. The above-mentioned main heat dissipation area is connected with the liquid outlet in one-to-one correspondence. In this scheme, the heat dissipation capacity of each main heat dissipation area is relatively consistent, and all have good heat dissipation effects. In a specific embodiment, the main heat dissipation area of the heat dissipation plate may be connected to the heat generating devices provided on the circuit board in a one-to-one correspondence. In order to dissipate heat from the heat-generating components of the circuit board.

The above-mentioned heat dissipation plate has a first wall, which is used to connect with the heat-generating device, and it can be considered that the above-mentioned first wall is the wall surface on which the heat dissipation plate actually works. Specifically, one side of the first wall is connected to a heating element, and the other side is connected to a cooling fin. The heat dissipation fins are connected to the first wall so that heat can be dissipated in the heat dissipation fins, thereby further improving the heat dissipation effect of the heat dissipation plate.

The above-mentioned heat dissipation plate also includes an auxiliary heat dissipation area, and the auxiliary heat dissipation area is arranged around the housing heat dissipation area. The retaining wall between the main heat dissipation area and the auxiliary heat dissipation area has an opening, and the opening can communicate with the main heat dissipation area and the auxiliary heat dissipation area. Then the refrigerant fluid enters the main heat dissipation area to dissipate heat for the heating device, and then flows from the opening to the auxiliary heat dissipation area to dissipate heat for the area corresponding to the auxiliary heat dissipation area, so as to improve the heat dissipation effect of the electronic components.

The heat dissipation plate also includes a second wall, which is arranged opposite to the first wall, and the distance between the edge of the opening facing the second wall and the first wall is smaller than the distance between the wall surface of the heat dissipation fin facing the second wall and the first wall . When the heat dissipation plate is in use, the first wall is located above the second wall. This solution can ensure that at least part of the structure of the heat dissipation fin is immersed in the refrigerant liquid, and then the refrigerant liquid flows from the opening of the retaining wall to the auxiliary heat dissipation area. This solution can ensure that the cooling fin dissipates heat through the refrigerant liquid.

In another technical solution, the above-mentioned first wall has a boss, and the cooling fins are connected to the boss. In this technical solution, the distance between the edge of the opening facing the second wall and the first wall is smaller than the distance between the wall surface of the boss facing the second wall and the first wall. Similarly, when the cooling plate is in use, this solution can make the entire cooling fin immersed in the refrigerant liquid, so as to improve the heat dissipation effect of the cooling fin. In addition, this solution can also make the boss contact with the refrigerant liquid, so that the refrigerant liquid can take away the heat of the first wall, which is beneficial to improve the heat dissipation effect of the first wall.

The number of the openings is not limited, and the blocking wall may include a plurality of openings to facilitate the flow of refrigerant liquid between the main heat dissipation area and the auxiliary heat dissipation area.

In a second aspect, the present application also provides an electronic assembly, which includes a circuit board, a first heat generating device, and the heat dissipation plate of the above-mentioned first aspect. The above-mentioned circuit board includes a first side and a second side opposite to each other, and the first heat generating device is arranged on the first side of the circuit board. The above heat dissipation plate includes a first heat dissipation plate, wherein the first heat dissipation plate is arranged on a side of the first heat generating device away from the circuit board, and is used for dissipating heat for the first heat generating device. In the technical solution, since the heat dissipation plate has a good heat dissipation effect and a long service life, the heat dissipation capability and service life of the electronic components are improved.

In a technical solution, the above-mentioned electronic component may further include a second heat generating device, and the second heat generating device is arranged on the second side surface of the circuit board. The heat dissipation plate also includes a second heat dissipation plate, which is arranged on a side of the second heat generating device away from the circuit board, and is used for dissipating heat from the second heat generating device. In the technical solution of the present application, a first heat dissipation plate and a second heat dissipation plate are arranged on both sides of the circuit board, so that heating devices can be arranged on both sides of the circuit board. This solution can improve the integration degree of the heating device of the circuit board, so as to reduce the area of the circuit board. The area occupied by the electronic components is small, which facilitates the installation of the electronic components in the embodiment of the present application. Of course, from another perspective, this solution can double the computing power of electronic components when the area of the circuit board of the electronic components remains constant.

Specifically, when the above-mentioned heat dissipation plate is provided, the main heat dissipation area of the first heat dissipation plate is connected to the first heat-generating device through heat conduction, and the main heat-dissipation area of the second heat dissipation plate is connected to the second heat-generating device through heat conduction. In this embodiment, the main heat dissipation area is used to dissipate heat from the heat generating device, so as to improve the heat dissipation effect of the electronic components.

The cavity of the first heat dissipation plate is connected in series with the cavity of the second heat dissipation plate, that is, the first heat dissipation plate is connected in series with the second heat dissipation plate. The cooling liquid flows through the first cooling plate and the second cooling plate in sequence. In the embodiment of the present application, regardless of whether the first cooling plate and the second cooling plate are connected in series or in parallel, only one set of cooling devices can be used to realize the work of the two cooling plates, so as to reduce the volume of electronic components.

When assembling the above-mentioned electronic components, the first heat-conducting layer can be connected between the first heat-generating device and the first heat dissipation plate, and the second heat-conducting layer can be connected between the second heat-generating device and the second heat-dissipating plate. In order to improve the efficiency of heat conduction between the first heat generating device and the first heat dissipation plate, and the efficiency of heat conduction between the second heat generating device and the second heat dissipation plate.

Specifically, the above-mentioned first heat conduction layer and the second heat conduction layer can be heat conduction glue or heat conduction foam, which has both thermal conductivity and elasticity, which is beneficial to increase the contact area between the heat dissipation plate and the metal base, and improve the heat dissipation effect. The application does not limit the specific materials of the above-mentioned first heat conduction layer and the second heat conduction layer, for example, they may be materials with high heat dissipation efficiency such as phase change material layer, carbon fiber layer, graphite layer, copper layer or aluminum layer. The material of the above-mentioned first heat conduction layer and the material of the second heat conduction layer may be the same or different, which is not limited in this application.

In order to install the above-mentioned first heat-generating device, the electronic assembly may further include a first sub-circuit board and a first bracket, and the first heat-generating device is mounted on the circuit board through the first sub-circuit board. Specifically, the above-mentioned first heating device is installed on the first sub-circuit board, the first sub-circuit board is installed on the first bracket, the first bracket is installed on the first side of the circuit board, and the first heating device is connected to the circuit board through a connector . In this solution, the heating device is installed on the circuit board with strong strength, which can adapt to vibration and other scenarios, and is conducive to improving the stability of electronic components. In addition, in this solution, the first heat generating device and the second heat generating device are respectively connected to the circuit board through connectors, so that the heat generating device can be modularized and the electronic components can be easily upgraded.

Specifically, when installing the above-mentioned first bracket and the circuit board, the first connector can be used to connect the first bracket and the circuit board in sequence, and the second connector can be used to connect the circuit board and the first bracket in sequence. In a specific implementation manner, the above-mentioned first connecting part may be a connecting part, and the second connecting part may also be a connecting part, so as to facilitate the above-mentioned connecting operation and realize detachable connection. Specifically, when installing the above-mentioned first connecting piece and the second connecting piece, the extension axes of the first connecting piece and the extending axes of the second connecting piece may be staggered. It is conducive to improving the installation strength of the first bracket and improving the structural stability of the electronic component.

In addition, the electronic assembly may further include a second sub-circuit board and a second bracket, and the second heat generating device is mounted on the circuit board through the second sub-circuit board. Specifically, the above-mentioned second heating device is installed on the second sub-circuit board, the second sub-circuit board is installed on the second bracket, the second bracket is installed on the second side of the circuit board, and the second heating device is connected to the circuit board through a connector .

When specifically installing the above-mentioned first bracket and the second bracket, the first bracket, the circuit board and the second bracket can be stacked in sequence, the third connecting piece is connected to the first bracket, the circuit board and the second bracket in turn, and the fourth connecting piece is sequentially connected. Connect the second bracket, the circuit board, and the first bracket. In addition, the extension axis of the third connecting member and the extending axis of the fourth connecting member are arranged in a staggered manner. This solution can connect the first bracket, the circuit board and the second bracket from both sides, and the two connecting parts are arranged in a staggered manner, so the installation strength of the first bracket and the second bracket is strong, which is conducive to the promotion of electronic components stability.

The specific structure of the electronic component is not limited, for example, the electronic component may be a controller. The chip in the controller is a heat-generating device with high heat generation. Using the electronic components in the technical solution of the present application is beneficial to improve the heat dissipation effect of the controller and improve the integration of the controller.

In addition, there is no limit to the number of layers of the circuit board and the number of layers of the heat dissipation plate included in the above-mentioned electronic components. Specifically, the electronic component includes an N-layer circuit board, and the heat dissipation plate includes an N+1-layer heat dissipation plate. The above N-layer circuit boards are stacked, and a heat dissipation plate is arranged between any two adjacent circuit boards, and N is a positive integer greater than or equal to 2. In this solution, multiple layers of circuit boards and heat dissipation plates can be stacked to reduce the area of each layer of circuit boards.

In a third aspect, the present application further provides an electronic assembly, which includes a circuit board, a first heat generating device, a second heat generating device, and a heat dissipation plate. The above circuit board includes a first side and a second side opposite to each other, the first heat generating device is arranged on the first side of the circuit board, and the second heat generating device is arranged on the second side of the circuit board. The above heat dissipation plate includes a first heat dissipation plate and a second heat dissipation plate, wherein the first heat dissipation plate is arranged on the side of the first heat generating device away from the circuit board, and is used to dissipate heat for the first heat generating device; the second heat dissipation plate is arranged on the second heat sink. The side of the heating element away from the circuit board is used to dissipate heat for the second heating element. In the technical solution of the present application, a first heat dissipation plate and a second heat dissipation plate are arranged on both sides of the circuit board, so that heating devices can be arranged on both sides of the circuit board. This solution can improve the integration degree of the heating device of the circuit board, so as to reduce the area of the circuit board. The area occupied by the electronic components is small, which facilitates the installation of the electronic components in the embodiment of the present application. Of course, from another perspective, this solution can double the computing power of electronic components when the area of the circuit board of the electronic components remains constant.

Specifically, when installing the above-mentioned first bracket and the circuit board, the first connector can be used to connect the first bracket and the circuit board in sequence, and the second connector can be used to connect the circuit board and the first bracket in sequence. In a specific implementation manner, the above-mentioned first connecting member may be a screw, and the second connecting member may also be a screw, so as to facilitate the above-mentioned connection operation and realize detachable connection. Specifically, when installing the above-mentioned first connecting piece and the second connecting piece, the extension axes of the first connecting piece and the extending axes of the second connecting piece may be staggered. It is conducive to improving the installation strength of the first bracket and improving the structural stability of the electronic component.

In a fourth aspect, the present application further provides a terminal. The terminal includes at least one electronic component of the second or third aspect above. Generally, terminals are sensitive to the area of electronic components, but have a relatively strong capacity for the thickness of electronic components. Therefore, the terminal installation of electronic components in the embodiment of the present application occupies a small area, and it is beneficial to improve the electronic components of the terminal. Computing power of the component.

The specific type of the above-mentioned terminal is not limited, for example, it may be a vehicle, an aircraft, a ship, a server, or a computer. In particular, when the terminal is a vehicle, the electronic component can be a vehicle controller, which helps to reduce the space required for the vehicle to install the vehicle controller, and can also improve the automatic control capability of the vehicle.

Description of drawings

FIG. 1 is a schematic diagram of a lateral structure of an electronic component in an embodiment of the present application;

FIG. 2 is another schematic diagram of the lateral structure of the electronic component in the embodiment of the present application;

FIG. 3 is a schematic top view of an internal structure of a heat dissipation plate in an embodiment of the present application;

FIG. 4 is a schematic top view of another internal structure of the heat dissipation plate in the embodiment of the present application;

FIG. 5 is a schematic diagram of a lateral cross-sectional structure of a heat dissipation plate in an embodiment of the present application;

FIG. 6 is a schematic diagram of another lateral cross-sectional structure of the heat dissipation plate in the embodiment of the present application;

FIG. 7 is a schematic diagram of another lateral cross-sectional structure of the heat dissipation plate in the embodiment of the present application;

Fig. 8 is another schematic structural diagram of the electronic component in the embodiment of the present application;

FIG. 9 is another schematic structural view of the electronic component in the embodiment of the present application;

FIG. 10 is another schematic structural diagram of the electronic component in the embodiment of the present application.

Reference signs:

1-circuit board; 11-first side;

12-the second side; 2-the first heating element;

3-Second heating device; 4-radiating plate;

41-the first cooling plate; 42-the second cooling plate;

43-cavity; 44-liquid inlet;

45-slow flow area; 451-flow port;

452-the first slow flow structure; 4521-the first buffer port;

4522-retaining wall; 453-second slow flow structure;

4531-second buffer port; 46-main cooling area;

461-radiating fins; 47-first wall;

471-boss; 48-second wall;

49-auxiliary cooling area; 491-opening;

410-retaining wall; 51-first heat conduction layer;

52-the second heat conduction layer; 61-the first sub-circuit board;

62-the second sub-circuit board; 71-the first bracket;

72-the second bracket; 81-the first connecting piece;

82-the second connecting piece; 83-the third connecting piece;

84—the fourth connector.

Detailed ways

For ease of understanding, the embodiments of the present application provide a heat sink, an electronic component, and a terminal. The application scenarios are introduced below. At present, the electronic control function has been applied in various fields. The electronic control function needs to use a controller to realize the control process. The above-mentioned controller can be understood as an electronic component with a chip. The chip will generate a lot of heat during the working process, therefore, the heat dissipation capability of the controller also has an important impact on the performance of the controller. As the intelligent control technology becomes more and more mature, the computing power of the controller is also gradually improved, and the number of chips that the controller needs to integrate also needs to increase. Correspondingly, in order to ensure the normal operation of the controller, the integrated heat dissipation structure of the controller also needs to be increased. In the prior art, as the number of chips and heat dissipation structures in the controller increases, the area of the controller becomes larger and larger, resulting in the need for a larger area of space to install the above-mentioned controller when the controller is actually used. At present, many terminals have strong intelligent control functions, especially the automatic driving function of vehicles, etc., and the functions of corresponding controllers are becoming more and more abundant. However, the installation space of the terminal is limited, and it is sensitive to the area occupied by the controller. Therefore, the present application provides a heat dissipation plate, an electronic component and a terminal, so as to improve the heat dissipation effect and service life of the heat dissipation plate, and reduce the area occupied by the electronic component.

Embodiments of the present application will be described in detail below in conjunction with the accompanying drawings. The terms used in the following examples are for the purpose of describing particular examples only, and are not intended to limit the application. As used in the specification and appended claims of this application, the singular expressions "a", "an", "said", "above", "the" and "this" are intended to also Expressions such as "one or more" are included unless the context clearly dictates otherwise.

Reference to "one embodiment" or "a particular embodiment" or the like described in this specification means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. The terms "including", "comprising", "having" and variations thereof mean "including but not limited to", unless specifically stated otherwise.

FIG. 1 is a schematic structural diagram of an electronic component in an embodiment of the present application. As shown in FIG. 1 , in the embodiment of the present application, the electronic component includes a circuit board 1 , a first heat generating device 2 , a second heat generating device 3 and a cooling plate. The above-mentioned circuit board 1 includes opposite first side 11 and second side 12 , that is to say, two surfaces of the circuit board 1 , one is the first side 11 and the other is the second side 12 . The above-mentioned first heating element 2 is arranged on the first side 11 of the circuit board 1 , and the second heating element 3 is arranged on the second side 12 of the circuit board 1 . The above heat dissipation plate includes a first heat dissipation plate 41 and a second heat dissipation plate 42, wherein the first heat dissipation plate 41 is arranged on the side of the first heat generating device 2 away from the circuit board 1, and the first heat dissipation plate 41 and the first heat generating device 2 The heat conduction connection makes the first heat dissipation plate 41 used for dissipating heat for the first heat generating device 2 . The second heat sink 42 is arranged on the side of the second heat generating device 3 away from the circuit board 1, and the second heat sink 42 is connected to the second heat generating device 3 through heat conduction, so that the second heat sink 42 is used to dissipate heat for the second heat generating device 3 .

In the technical solution of the present application, a first heat dissipation plate 41 and a second heat dissipation plate 42 are respectively provided on both sides of the circuit board 1 , so that both sides of the circuit board 1 can be provided with heating devices. This solution can improve the integration degree of the heating device of the circuit board 1 to reduce the area of the circuit board 1 . Compared with the prior art, with the same number of heat-generating devices, the embodiment of the present application can reduce the area of the circuit board 1, so that the area occupied by the electronic components is smaller, thereby facilitating the installation of the electronic components in the embodiment of the present application. Of course, looking at it from another perspective, when the area of the circuit board 1 of the electronic component remains constant, this solution can install heating devices, such as chips, on both sides of the circuit board 1, which can double the computing power of the electronic component.

In a specific embodiment, the number of first heat generating devices 2 provided on the first side 11 of the above-mentioned circuit board 1 is not limited, for example, one first heat generating device 2 may be provided, and two or more first heat generating devices may be provided. 2. When at least two first heat generating devices 2 are provided on the first side 11 of the circuit board 1 , one first heat dissipation plate 41 may also be used to dissipate heat from all the first heat generating devices 2 . Likewise, the number of second heat generating devices 3 provided on the second side 12 of the circuit board 1 is not limited, for example, one second heat generating device 3 may be provided, and two or more second heat generating devices 3 may be provided. When at least two second heat-generating devices 3 are provided on the second side 12 of the circuit board 1 , one second heat-dissipating plate 42 may also be used to dissipate heat from all the second heat-generating devices 3 .

It is worth noting that the specific type of the above-mentioned first heat-generating device 2 is not limited. The above-mentioned first heat-generating device 2 refers to an electronic device that generates a large amount of heat during operation, or refers to an electronic device that needs to use a heat sink to dissipate heat. The electronic device, for example, the first heat generating device 2 is a chip. Similarly, the specific type of the above-mentioned second heat-generating device 3 is not limited. The above-mentioned first heat-generating device 2 refers to an electronic device that generates a large amount of heat during operation, or refers to an electronic device that needs to use a heat sink for heat dissipation. For example, the second heat generating device 3 is a chip.

The above-mentioned first heat dissipation plate 41 is thermally connected to the first heat generating device 2 , which means that heat conduction can be realized between the two. In a specific embodiment, the first heat dissipation plate 41 may be directly connected to the first heat generating device 2 to conduct heat, as shown in FIG. 1 . Or, please refer to FIG. 2 , which is another schematic diagram of the lateral structure of the electronic assembly in the embodiment of the present application. A first heat conducting layer 51 may also be provided between the first heat dissipation plate 41 and the first heat generating device 2 . A heat conduction layer 51 is used to transmit the heat of the first heat generating device 2 to the first heat dissipation plate 41 , as shown in FIG. 2 . The above-mentioned first heat conduction layer 51 can specifically be an elastic material layer, which can make the connection between the first heat dissipation plate 41 and the first heat generating device 2 more tightly, so as to improve the efficiency of heat transfer, and further improve the heat dissipation effect of electronic components.

Similarly, the above-mentioned second heat dissipation plate 42 is thermally connected to the second heat generating device 3 , which means that heat conduction can be realized between the two. In a specific embodiment, the second heat dissipation plate 42 may be directly connected to the second heat generating device 3 to conduct heat, as shown in FIG. 1 . Alternatively, a second heat conduction layer 52 can also be arranged between the second heat sink 42 and the second heat generating device 3, and the second heat conduct layer 52 is used to transmit the heat of the second heat generating device 3 to the second heat sink 42, such as Figure 2 shows. The above second heat conduction layer 52 can specifically be an elastic material layer, which can make the connection between the second heat dissipation plate 42 and the second heat generating device 3 closer, so as to improve the efficiency of heat transfer, and further improve the heat dissipation effect of electronic components.

In a specific embodiment, the above-mentioned elastic material layer may include thermally conductive glue or thermally conductive foam, which has both thermal conductivity and elasticity, which is beneficial to increase the contact area between the heat dissipation plate and the metal base, and improve the heat dissipation effect.

The application does not limit the specific materials of the above-mentioned first heat conduction layer and the second heat conduction layer, for example, they may be materials with high heat dissipation efficiency such as phase change material layer, carbon fiber layer, graphite layer, copper layer or aluminum layer. The material of the above-mentioned first heat conduction layer and the material of the second heat conduction layer may be the same or different, which is not limited in this application.

Fig. 3 is a schematic top view of the internal structure of the heat dissipation plate in the embodiment of the present application. As shown in Fig. 3, the structure can be understood as the bottom of the heat dissipation plate, and the heat dissipation plate may also include a cover (not shown), the bottom It is combined with the cover (for example, welded together, or integrally formed) to form a heat dissipation plate. The embodiment of the present application does not limit the structure and shape of the cover. In a specific embodiment, the specific type of the heat dissipation plate may be a liquid cold plate, and the heat dissipation plate has a cavity 43, and the cavity 43 is formed as a flow channel of the cooling liquid. That is to say, the refrigerant liquid can flow in the radiator to dissipate heat from the first heat generating device 2 and the second heat generating device 3 on the circuit board 1 . The specific material of the above-mentioned refrigerant liquid is not limited, specifically, it may be water, and the cost is relatively low. In this embodiment, the heat dissipation plate is a liquid cooling plate, so the heat dissipation effect is better, which is beneficial to improve the heat dissipation capability of the electronic components.

In a specific embodiment, the above-mentioned refrigerating liquid may be liquid such as water or oil, for example, fluorinated liquid or mineral oil, and the present application does not limit the material of the refrigerating liquid.

The refrigerant liquid channels between the first heat dissipation plate 41 and the second heat dissipation plate 42 may be connected in parallel or in series. Specifically, it can be considered that the above-mentioned first heat dissipation plate 41 has a first cavity, and the first cavity is used for carrying refrigerant liquid. The above-mentioned second heat dissipation plate 42 has a second cavity, and the second cavity is also used to carry refrigerant liquid. Specifically, when the above-mentioned first heat dissipation plate 41 and the second heat dissipation plate 42 are arranged, the first cavity and the second cavity can be connected in parallel. In this scheme, the refrigerant liquid flows independently in the first cavity and the second cavity respectively, which can Improve the heat dissipation effect of the heat sink. Or, the above-mentioned first cavity and the second cavity can also be connected in series, and the above-mentioned refrigerating liquid flows through the first cavity and the second cavity in sequence, that is to say, the refrigerating liquid first flows into the first cooling plate 41, and then flows into the The second heat sink 42 . The first cooling plate 41 and the second cooling plate 42 are connected in series or in parallel, so that only one cooling liquid driving device is needed to drive the cooling liquid in the two cooling plates.

As shown in FIG. 3 , in a specific embodiment, the cooling plate includes a liquid inlet 44 and a cavity 43 , and the cavity 43 includes a slow flow area 45 and a main cooling area 46 . Wherein, the liquid inlet 44 is the general inlet for the refrigerant liquid to enter the cavity 43 of the cooling plate. The liquid inlet 44 communicates with the slow flow area 45 , and the slow flow area 45 has a liquid flow port 451 . After the refrigerant liquid enters the cavity 43 of the cooling plate from the liquid inlet 44, it first enters the slow flow area 45 for slow flow. The flow rate of the refrigerant liquid entering the liquid inlet 44 is relatively fast, and the flow rate is unstable. By setting a slow flow area on the cooling plate, after the refrigerant liquid flows through the above-mentioned slow flow area 45, the flow rate of the refrigerant liquid flowing out of the liquid flow port 451 The flow rate decreases and the flow rate stabilizes. The liquid outlet 451 of the slow flow area 45 communicates with the main heat dissipation area 46, so that the refrigerant can flow to the main heat dissipation area 46 at a relatively low speed and relatively stable, thereby achieving a more stable and uniform heat dissipation effect on the heat generating device. At the same time, due to the buffering effect of the slow flow area, the cooling liquid has less erosion on the main heat dissipation area 46, so that the erosion and corrosion of the main heat dissipation area 46 is relatively slight, which is beneficial to improve the service life of the heat dissipation plate.

It is worth noting that the "communication" in the embodiment of the present application means that the circulation of refrigerant liquid can be realized between the two. For example, A and B are connected, and A and B may be directly connected, and refrigerant fluid can flow between A and B. Or, it is also possible that A and B are connected through C, and the refrigerant liquid can flow among A, C and B. That is to say, the refrigerant liquid may flow through A, C and B in sequence, or the above refrigerant liquid may flow through B, C and A in sequence.

When using the heat dissipation plate of the embodiment of the present application, one main heat dissipation area 46 may correspond to one heat generating device, or one main heat dissipation area 46 may correspond to at least two heat generating devices, which is not limited in the present application. For example, two heat-generating devices are arranged along the flow direction of the refrigerant liquid in the main heat-dissipating area 46 , so that the main heat-dissipating area 46 covers the two heat-generating devices to dissipate heat for the two heat-generating devices at the same time.

Please continue to refer to FIG. 3 , in a specific embodiment, the main heat dissipation area 46 of the above-mentioned heat dissipation plate is provided with heat dissipation fins 461 , which can further improve the heat dissipation capacity of the main heat dissipation area 46 and make the heat dissipation effect of the main heat dissipation area 46 better.

In a specific embodiment, the above-mentioned slow flow area 45 is made of a stronger material, for example, die-cast aluminum made of YL102 (hard aluminum 102), which has a stronger ability to resist erosion. Therefore, even if the flow rate of the cooling liquid entering the liquid inlet 44 is relatively high, damage to the slow flow region 45 caused by the cooling liquid can be reduced. The material of the heat dissipation fins 461 of the main heat dissipation area 46 can be aluminum alloy or pure aluminum and other materials with better heat conduction effect.

In a specific embodiment, the heat dissipation plate may include a plurality of heat dissipation fins, and the shapes of the plurality of heat dissipation fins may be the same or different. Specifically, the above shape may refer to the three-dimensional shape of the entire cooling fin, including size, length, thickness and the like. In addition, in the embodiment of the present application, in addition to the main heat dissipation area, other areas may also be provided with heat dissipation fins. The shapes of the cooling fins in different regions can be different, and of course, the shapes of the cooling fins in different regions can also be the same.

Please continue to refer to FIG. 3 , in a specific embodiment, the slow flow area 45 has a first buffer port 4521 , and the first buffer port 4521 and the liquid inlet port 44 are arranged in a staggered manner. In this embodiment, the flow velocity of the cooling liquid is slowed down through the staggered arrangement of the first buffer port and the liquid inlet port, thereby achieving a more uniform heat dissipation effect.

Specifically, the slow flow region 45 may include a first slow flow structure 452 . The first slow flow structure 452 is directly connected to the liquid inlet 44 , and the cooling liquid flows into the first slow flow structure 452 after entering the cooling plate from the liquid inlet 44 . The above-mentioned first buffer port 4521 is disposed in the first slow flow structure 452 , the first buffer port 4521 and the liquid inlet port 44 are arranged alternately, and the first buffer port 4521 communicates with the liquid flow port 451 .

The above-mentioned first slow flow structure 452 specifically includes a retaining wall 4522 , and the first buffer port 4521 is disposed on the retaining wall 4522 . The refrigerant liquid enters the first slow flow structure 452 from the liquid inlet 44 , directly washes the above-mentioned retaining wall 4522 , and then flows out from the first buffer port 4521 . The retaining wall 4522 is provided with at least two first buffer ports 4521 , so that the cooling fluid is split and flows out of the first buffer ports 4521 at a lower speed.

In addition, the slow flow area may also have a second buffer port, and the second buffer port may correspond to or be staggered with the liquid inlet port. For example, both the second buffer port and the first buffer port can be arranged in the above-mentioned first slow flow structure. Alternatively, the slow flow area can also include at least two slow flow structures, and the refrigerant liquid flows through the slow flow structures at each stage in sequence to enhance the slow flow effect. For example, the at least two-stage slow flow structure includes a first slow flow structure and a second slow flow structure, and the refrigerant liquid enters the first slow flow structure and the second slow flow structure in sequence. The first buffer port can be arranged in the first slow-flow structure, and the second buffer port can be arranged in the second slow-flow structure. At this time, the second buffer port and the first buffer port can be arranged in a staggered manner, so as to improve the slow-flow area slow flow effect.

Please continue to refer to FIG. 3 , in a specific embodiment, the heat dissipation plate may further include a second slow flow structure 453 , which is arranged on the side of the first slow flow structure 452 away from the liquid inlet 44 , and the second slow flow structure 453 communicates with the first buffer port 4521 . That is to say, after the refrigerant liquid enters the first slow flow structure 452 from the liquid inlet 44 , passes through the first buffer port 4521 , and then flows to the second slow flow structure 453 . The second slow flow structure 453 has a second buffer port 4531 , and the second buffer port 4531 and the first buffer port 4521 are arranged alternately. The second buffer port 4531 may be directly connected to the main heat dissipation area 46 . This scheme can realize the two-stage slow flow of the refrigerant liquid, and the slow flow effect is better, which can make the flow rate of the refrigerant liquid flowing into the main heat dissipation area 46 slow and uniform, and improve the service life of the main heat dissipation area 46 .

Specifically, when the above-mentioned second slow flow structure 453 is set, the second slow flow structure 453 can have a second buffer port 4531, so that the flow rate of the refrigerant liquid flowing out of the second slow flow structure 453 is relatively slow, and the refrigerant liquid can be stored in the second slow flow structure 453. The slow flow structure 453 then flows out from the second slow flow structure 453 at a relatively stable speed and flows to the main heat dissipation area 46 .

Of course, in other embodiments, the slow-flow area may also include three or four more slow-flow structures, and the buffer ports are staggered with each other, and this application does not list them all.

Please continue to refer to FIG. 3 , the heat dissipation plate may include at least two main heat dissipation areas 46 , and the slow flow area 45 may include at least two liquid outlets 451 , and the main heat dissipation areas 46 communicate with the liquid outlets 451 in one-to-one correspondence. That is to say, each main heat dissipation area 46 is arranged in parallel, and flows out from the second slow flow structure 453 and directly flows into each main heat dissipation area 46 . In this solution, the heat dissipation capabilities of each main heat dissipation area 46 are relatively consistent, and all have better heat dissipation effects. In a specific embodiment, the main heat dissipation area 46 of the heat dissipation plate may be connected to the heat generating devices provided on the circuit board 1 in a one-to-one correspondence. In order to dissipate heat from the heat-generating components of the circuit board 1 . Specifically, the main heat dissipation area 46 of the first heat dissipation plate 41 can be the first main heat dissipation area 46 , and the first main heat dissipation area 46 is thermally connected to the first heat generating devices 2 in one-to-one correspondence. Similarly, the main heat dissipation area 46 of the second heat dissipation plate 42 can be the second main heat dissipation area 46, and the second main heat dissipation area 46 is connected to the second heat generating device 3 in a one-to-one correspondence. When the second slow flow structure 453 has a second buffer port 4531 , the second buffer port 4531 can be connected to each liquid flow port 451 to realize flow splitting, so that the refrigerant liquid can evenly flow to each main cooling area 46 .

The above is the heat dissipation plate provided by the embodiment of the present application, and the heat dissipation plate may be applied in an electronic component, for example, the electronic component may include a first heat generating device and the above-mentioned first heat dissipation plate. Alternatively, the electronic assembly includes a plurality of heat generating devices and a plurality of heat dissipation plates, such as including the first heat generation device, the second heat generation device, the first heat dissipation plate and the second heat dissipation plate mentioned above. The present application does not limit the number of heating devices and cooling plates.

In a specific embodiment, in the same electronic component, the specific structures of the first heat dissipation plate 41 and the second heat dissipation plate 42 may be the same or different. Taking the first cooling plate 41 and the second cooling plate 42 connected in series as an example, the first cooling plate 41 may have the first slow flow structure 452 and the second slow flow structure 453 . That is to say, the specific structure of the first heat dissipation plate 41 is shown in FIG. 3 . Specifically, the cooling liquid enters the first cavity of the first heat dissipation plate 41 from the liquid inlet 44 . The blocking wall 4522 of the first slow flow structure 452 is opposite to the liquid inlet 44 , and the blocking wall 4522 has a first buffer port 4521 , and the liquid inlet 44 and the first buffer port 4521 are arranged alternately. The second slow flow structure 453 is disposed on the side of the first slow flow structure 452 away from the liquid inlet 44 , that is, the cooling liquid flows from the first buffer port 4521 into the second slow flow structure 453 . The above-mentioned second slow flow structure 453 has a second buffer port 4531 , the second buffer port 4531 is arranged alternately with the first buffer port 4521 , and the second buffer port 4531 communicates with the main cooling area 46 . In a specific embodiment, due to the effect of the first slow flow structure 452 and the second slow flow structure 453, the speed of the refrigerant liquid at the liquid inlet 44 is lower than that at the first buffer port 4521 and lower than that at the second buffer port 4531. speed. The first heat dissipation plate 41 includes two first main heat dissipation regions 46, and the second slow flow structure 453 has a second buffer port 4531, and the second buffer port 4531 is connected with the two liquid flow ports 451, so that flow splitting can be realized to make cooling The liquid evenly flows to the two main cooling areas 46. In this embodiment, since the cooling liquid first flows to the first heat dissipation plate 41 and then flows to the second heat dissipation plate 42 , the structure of the slow flow area 45 of the first heat dissipation plate 41 is relatively complicated, as shown in FIG. 3 . FIG. 4 is a schematic top view of another internal structure of the heat dissipation plate in the embodiment of the present application. This structure can be understood as the bottom of the heat dissipation plate, and the heat dissipation plate may also include a cover (not shown), and the bottom and cover are combined (such as welded together, or integrally formed) to form a heat dissipation plate. The embodiment of the present application does not limit the structure and shape of the cover. The cooling fluid in the second cooling plate 42 flows out from the first cooling plate 41 at a slow and uniform flow rate. Therefore, the structure of the slow flow area 45 of the second cooling plate 42 is relatively simple, as shown in FIG. 4 . Optionally, in the cooling plate shown in Figure 4, the lengths of different cooling fins can be the same or different, and the longer cooling fins can divide the main cooling area into two sub-main cooling areas, as shown in Figure 4 from bottom to top The length of the fifth cooling fin is relatively long. Optionally, when the cover and the bottom are combined, the length of the fifth cooling fin can reach the cover, so that the main cooling fin can The area is divided into upper and lower sub-main heat dissipation areas, which can further improve the heat dissipation effect.

Fig. 5 is a schematic diagram of a lateral cross-sectional structure of the heat dissipation plate in the embodiment of the present application. As shown in Fig. 5, the heat dissipation plate has a first wall 47 and a second wall 48 opposite to each other. connection, that is, one side of the first wall 47 is connected to the heat generating device. Specifically, when the heat dissipation fins 461 are provided, the heat dissipation fins 461 are connected to the other side of the first wall 47 , that is, the outer side of the first wall 47 is connected to the heat generating device. The inner side of the first wall 47 is connected to the cooling fin 461 . So that the heat can be dissipated in the cooling fins 461 to improve the cooling effect of the cooling plate. Optionally, the second wall 48 may be the cover of the heat dissipation plate, specifically a metal plate.

In a specific embodiment, when the heat dissipation plate has at least two main heat dissipation areas 46 , a blocking wall 410 may be provided between adjacent main heat dissipation areas 46 to separate adjacent main heat dissipation areas 46 . Of course, the above-mentioned blocking wall 410 can also be provided with a liquid outlet, so that the refrigerant liquid between adjacent main heat dissipation regions 46 can also flow, as shown in FIG. 3 . Or, in another embodiment, it is also possible to connect the two ends of the fins 461 between the adjacent main heat dissipation areas 46 to the first wall 47 and the second wall 48 respectively, so that the heat dissipation between different main heat dissipation areas 46 to divide.

Please refer to FIG. 3 and FIG. 4 , in a further embodiment, the heat dissipation plate 4 further includes an auxiliary heat dissipation area 49 , and the auxiliary heat dissipation area 49 is disposed on the peripheral side of the main heat dissipation area 46 . The auxiliary heat dissipation area 49 can be used to dissipate heat for electronic components other than the main heat generating components of the circuit board 1 , so as to increase the service life of the electronic components. The blocking wall 410 between the main heat dissipation area 46 and the auxiliary heat dissipation area 49 has an opening 491 , which communicates the main heat dissipation area 46 and the auxiliary heat dissipation area 49 , so that the refrigerant can flow from the main heat dissipation area 46 to the auxiliary heat dissipation area 49 . Therefore, after the cooling fluid enters the main heat dissipation area 46 to dissipate heat for the heat-generating device, it flows from the opening 491 of the retaining wall 410 to the auxiliary heat dissipation area 49 to dissipate heat for the corresponding area of the auxiliary heat dissipation area 49 to improve the heat dissipation effect of the electronic components.

It is worth noting that there is no limitation on the form or shape of the above-mentioned opening, for example, it may be in the form of a hole, a slot, or a slit, as long as the liquid can flow through. In addition, the number of openings is not limited, specifically, the retaining wall may have a plurality of openings, so as to enhance the cooling liquid flow effect between the main heat dissipation area and the auxiliary heat dissipation area.

As shown in FIG. 5 , in one embodiment, the heat dissipation fins 461 are connected to the first wall 47 , the blocking wall 410 is connected to the second wall 48 , and the opening 491 is disposed on a side of the blocking wall 410 facing the first wall 47 . When the above-mentioned opening 491 is specifically arranged, the distance a between the edge of the opening 491 facing the second wall 48 and the first wall 47 can be smaller than the distance b between the wall surface of the cooling fin 461 facing the second wall 48 and the first wall 47 . When the cooling plate in this embodiment is in use, the first wall 47 is located above the second wall 48 , for example, the second cooling plate 42 in the embodiment shown in FIG. 1 . Under the effect of gravity, the refrigerant liquid is located at the lower part of the main heat dissipation area 46 and flows along the second wall 48. If there is air in the cavity 43 of the heat dissipation plate, the air is located between the first wall 47 and the refrigerant liquid. This embodiment can ensure that at least part of the heat dissipation fin 461 is immersed in the refrigerant liquid, and then the refrigerant liquid flows from the opening 491 of the blocking wall 410 to the auxiliary heat dissipation area 49 . This solution can ensure that the cooling fins 46 dissipate heat through the refrigerant liquid.

FIG. 6 is a schematic diagram of another lateral cross-sectional structure of the heat dissipation plate in the embodiment of the present application. As shown in FIG. 6 , in another embodiment, the cooling fin 461 is connected to the first wall 47 , the blocking wall 410 is connected to the second wall 48 , and the opening 491 is disposed on a side of the blocking wall 410 facing the first wall 47 . The first wall 47 has a boss 471 , and the cooling fin 461 is connected to the boss 471 . The projection of the second opening 491 on the side wall of the boss 471 is completely located on the side wall of the boss 471 . In other words, the distance a between the bottom wall of the second opening 491 facing the second wall 48 and the first wall 47 is smaller than the distance c between the wall surface of the boss 471 facing the second wall 48 and the first wall 47 . Likewise, when the cooling plate in this embodiment is in use, the first wall 47 is located above the second wall 48 , for example, the second cooling plate 42 in the embodiment shown in FIG. 1 . Under the effect of gravity, the refrigerant liquid is located at the lower part of the main heat dissipation area 46 and flows along the second wall 48. If there is air in the cavity 43 of the heat dissipation plate, the air is located between the first wall 47 and the refrigerant liquid. This solution can make the entire length of the cooling fin 461 immersed in the cooling liquid, that is, the liquid level of the cooling liquid can exceed the length of the cooling fin shown in the figure, such as the liquid level of the cooling liquid can be as high as the boss, so that It is beneficial to improve the heat dissipation effect of the heat dissipation fins 461 . In addition, this solution can also make the boss 471 also contact with the refrigerant liquid, so that the refrigerant liquid can take away the heat of the first wall 47 , which is beneficial to improve the heat dissipation effect of the first wall 47 .

FIG. 7 is a schematic diagram of another lateral cross-sectional structure of the heat dissipation plate in the embodiment of the present application. As shown in FIG. 7 , in another embodiment, the cooling fin 461 is connected to the first wall 47, the blocking wall 410 is also connected to the above-mentioned first wall 47, and the opening 491 is arranged on a side of the blocking wall 410 facing the second wall 48. side. When the cooling plate in this embodiment is in use, the second wall 48 is located above the first wall 47 , for example, the first cooling plate 41 in the embodiment shown in FIG. 1 . Under the effect of gravity, the refrigerant liquid is located at the lower part of the main heat dissipation area 46 and flows along the first wall 47. If there is air in the cavity 43 of the heat dissipation plate, the air is located between the second wall 48 and the refrigerant liquid. When the above-mentioned opening 491 is specifically provided, the distance a between the bottom wall of the opening 491 facing the second wall 48 and the first wall 47 can be smaller than the distance d between the wall surface of the cooling fin 461 facing the second wall 48 and the second wall 48 . Thereby the liquid level height of refrigerating liquid can be higher than cooling fin, and this scheme can make radiating fin 461 be submerged entirely in refrigerating liquid, improves the cooling effect of radiating fin 461.

Figure 8 is another schematic structural view of the electronic assembly in the embodiment of the present application. The device 2 is installed on the circuit board 1 through the first sub-circuit board 61 . Specifically, the above-mentioned first sub-circuit board 61 is located on a side of the first heat generating device 2 away from the first heat dissipation plate 41 . The first heating element 2 is installed on the first sub-circuit board 61 , the first sub-circuit board 61 is installed on the first support 71 , and the first support 71 is installed on the first side 11 of the circuit board 1 . Both the first sub-circuit board 61 and the circuit board 1 are provided with connectors, and when the first bracket 71 is mounted on the first side 11 of the circuit board 1 , the first heating element 2 and the circuit board 1 are connected through the connector. In an optional embodiment, the first sub-circuit board 61 has a first connector, the first heating element 2 is connected to the first connector through the first sub-circuit board, the circuit board 1 has a second connector, and the first sub-circuit board 61 has a second connector. A connector is adapted to the second connector. When the first sub-circuit board is installed on the circuit board, the first connector is connected to the second connector, so as to realize the connection between the first heating element 2 and the circuit board 1 . The first bracket 71 is disposed between the first sub-circuit board 61 and the circuit board 1 . Therefore, in this solution, the heat-generating device installed on the circuit board 1 has a strong strength, can adapt to scenarios such as vibration, and is beneficial to improving the service life of electronic components. In addition, in this solution, the first heating element 2 is connected to the circuit board 1 through a connector, so that the heating element can be modularized, and it is easy to upgrade the electronic components.

Please continue to refer to FIG. 8. In an optional embodiment, when specifically installing the above-mentioned first bracket 71 to the circuit board 1, the first bracket 71 and the circuit board 1 can be connected in sequence by using the first connecting piece 81, and the second connecting piece 82 Connect the circuit board 1 and the first bracket 71 in sequence. Specifically, when installing the above-mentioned first connecting piece 81 and the second connecting piece 82 , the extension axis of the first connecting piece 81 and the extension axis of the second connecting piece 82 may be arranged in a staggered manner. It is beneficial to improve the installation strength of the first bracket 71 and improve the structural stability of the electronic components.

In an optional embodiment, the above-mentioned first connecting member 81 may specifically be a screw, and the second connecting member 82 may specifically also be a screw. This solution uses screws to connect the first bracket 71 and the circuit board 1 , which is beneficial to realize the detachable connection between the first bracket 71 and the circuit board 1 . Alternatively, the connectors in the embodiment of the present application may also be thumbtacks, and the embodiment of the present application does not limit the type of the connectors.

Fig. 9 is another schematic structural view of the electronic assembly in the embodiment of the present application. As shown in Fig. 9, in another embodiment, the above-mentioned electronic assembly further includes a first sub-circuit board 61, a second sub-circuit board 62, With the first bracket 71 and the second bracket 72 , the first heat generating device 2 is mounted on the circuit board 1 through the first sub-circuit board 61 , and the second heat generating device 3 is mounted on the circuit board 1 through the second sub-circuit board 62 . Specifically, the above-mentioned first sub-circuit board 61 is located on a side of the first heat generating device 2 away from the first heat dissipation plate 41 . The second sub-circuit board 62 is located on a side of the second heat generating device 3 away from the second heat sink 42 . The first heating element 2 is installed on the first sub-circuit board 61 , the first sub-circuit board 61 is installed on the first support 71 , and the first support 71 is installed on the first side 11 of the circuit board 1 . Both the first heating element 2 and the circuit board 1 are provided with connectors, and when the first bracket 71 is mounted on the first side 11 of the circuit board 1 , the first heating element 2 and the circuit board 1 are connected through the connector. Similarly, the above-mentioned second heating element 3 is mounted on the second sub-circuit board 62 , the second sub-circuit board 62 is mounted on the second bracket 72 , and the second bracket 72 is mounted on the second side 12 of the circuit board 1 . Both the second heat generating device 3 and the circuit board 1 are provided with connectors, and when the second bracket 72 is installed on the second side 12 of the circuit board 1 , the second heat generating device 3 and the circuit board 1 are connected through the connector. The first bracket 71 is disposed between the first sub-circuit board 61 and the circuit board 1 , and the second bracket 72 is disposed between the second sub-circuit board 62 and the circuit board 1 . Therefore, in this solution, the heat-generating device installed on the circuit board 1 has a strong strength, can adapt to scenarios such as vibration, and is beneficial to improving the service life of electronic components. In addition, in this solution, the first heat generating device 2 and the second heat generating device 3 are respectively connected to the circuit board 1 through connectors, so that the heat generating devices can be modularized and the electronic components can be easily upgraded.

When installing the first sub-circuit board 61, the second sub-circuit board 62, the first support 71 and the second support 72, the first support 71, the circuit board 1 and the second support 72 can be stacked in sequence, and the third The connecting piece 83 connects the above-mentioned first bracket 71 , the circuit board 1 and the second bracket 72 in sequence, and the fourth connecting piece 84 connects the second bracket 72 , the circuit board 1 and the first bracket 71 in sequence. That is to say, the third connector 83 is sequentially inserted into the first support 71, the circuit board 1 and the second support 72 from the side where the first side 11 of the circuit board 1 is located; The side where the two side surfaces 12 are located is sequentially inserted into the second support 72 , the circuit board 1 and the first support 71 . In addition, when specifically installing the third connecting piece 83 and the fourth connecting piece 84 , the extension axis of the third connecting piece 83 and the extension axis of the fourth connecting piece 84 may be arranged in a staggered manner. This solution can connect the first bracket 71, the circuit board 1 and the second bracket 72 from both sides, and the two connecting parts are arranged in a staggered manner, so the installation strength of the first bracket 71 and the second bracket 72 is strong, which is conducive to lifting Lifetime of electronic components.

In an optional technical solution, the above-mentioned third connecting member 83 may be a screw, and the fourth connecting member 84 may also be a screw, so as to facilitate installation and disassembly operations.

In a specific embodiment, there is no limitation on the direction in which the above two connectors are arranged alternately. For example, as shown in FIG. 8 , the two connectors may be arranged in a direction away from the first heat generating device 2 . Alternatively, the two connectors can also be arranged in parallel, with the same distance from the first heat generating device 2, so as to reduce the area of the first support 71 and the second support 72, which is beneficial to realize the miniaturization of electronic components.

In a specific embodiment, the above electronic component may be a controller. The chip in the controller is a heat-generating device with high heat generation. Using the electronic components in the technical solution of the present application is beneficial to improve the heat dissipation effect of the controller and improve the integration of the controller.

In particular, the aforementioned controller may be a vehicle-mounted controller. The electronic component has a small area, which is beneficial to install the vehicle-mounted controller on a vehicle with a small space, reducing the vehicle area occupied by the vehicle-mounted controller, and the computing power of the vehicle-mounted controller is relatively strong, which is conducive to improving the automatic control of the vehicle. control ability.

Fig. 10 is another schematic structural diagram of an electronic component in an embodiment of the present application. As shown in Fig. 10, in one embodiment, the above-mentioned electronic component includes an N-layer circuit board 1, and the heat dissipation plate includes an N+1 layer heat dissipation plate. The above N is a positive integer greater than or equal to 2. The above-mentioned N-layer circuit boards 1 are stacked, and a heat dissipation plate is arranged between any two adjacent circuit boards 1 . This scheme can realize the stacked arrangement of electronic components, and can make two adjacent layers of circuit boards 1 share the same heat dissipation plate. This solution is beneficial to further reduce the area of the circuit board 1 of the electronic component, and facilitates the installation of the above-mentioned electronic component. N of the electronic components shown in FIG. 10 is equal to 2, and N may also be other numbers, which are not limited in this application. As shown in FIG. 10 , four heat generating devices are arranged on one layer of circuit boards, and two heat generating devices are respectively arranged on two sides of the circuit board. This application does not limit the number of emitting devices on each layer of circuit boards.

It is worth noting that, in a specific embodiment, the number of circuit boards 1 in each layer of circuit boards 1 is not limited, for example, each layer of circuit boards 1 may include one circuit board 1, or may include two or more block circuit board 1, the present application does not limit this. Of course, in specific embodiments, the number of heat dissipation plates in each layer of heat dissipation plates is not limited. For example, each layer of heat dissipation plates may include one heat dissipation plate, or may include two or more heat dissipation plates. There is no restriction on this.

Based on the same inventive concept, the present application also provides a terminal, where the terminal includes at least one electronic component in any one of the foregoing embodiments. Generally, terminals are sensitive to the area of electronic components, but have a relatively strong capacity for the thickness of electronic components. Therefore, the terminal installation of electronic components in the embodiment of the present application occupies a small area, and it is beneficial to improve the electronic components of the terminal. Computing power of the component.

The specific type of the above-mentioned terminal is not limited, for example, it may be a vehicle, an aircraft, a ship, a server, or a computer. In particular, when the terminal is a vehicle, the electronic component can be a vehicle controller, which helps to reduce the space required for the vehicle to install the above-mentioned vehicle controller, and can also improve the automatic control capability of the vehicle.

The above vehicles may specifically be passenger vehicles or commercial vehicles, which is not limited in this application. The above-mentioned electronic components can be arranged at the co-pilot position or the trunk position of the vehicle. Electronic components can be used to control the vehicle's autonomous driving or media and other modules.

Apparently, those skilled in the art can make various changes and modifications to this application without departing from the protection scope of this application. In this way, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application is also intended to include these modifications and variations.

Claims

A heat dissipation plate, characterized in that the heat dissipation plate includes a liquid inlet and a cavity, and the cavity is used to form a flow channel for refrigerant liquid; the cavity includes a slow flow area and a main heat dissipation area, and the slow flow area The liquid inlet is connected with the main heat dissipation area, and the slow flow area is used to slow down the flow velocity of the refrigerant liquid.
The heat dissipation plate according to claim 1, wherein the slow flow area has a first buffer port, and the first buffer port and the liquid inlet port are arranged in a staggered manner.
The heat dissipation plate according to claim 2, wherein the slow flow area further has a second buffer port, and the second buffer port and the liquid inlet are arranged in a staggered manner; or,

The second buffer port is set corresponding to the liquid inlet port.
The heat dissipation plate according to any one of claims 1 to 3, characterized in that it includes at least two main heat dissipation areas, the slow flow area has at least two liquid outlets, and the main heat dissipation area and the The liquid outlets are connected in one-to-one correspondence.
The heat dissipation plate according to any one of claims 1 to 4, wherein the main heat dissipation area is provided with heat dissipation fins.
The heat dissipation plate according to claim 5, characterized in that, the heat dissipation plate has a first wall, and two sides of the first wall are respectively connected to the heat generating device and the heat dissipation fins.
The heat dissipation plate according to claim 6, further comprising an auxiliary heat dissipation area, the auxiliary heat dissipation area is arranged on the peripheral side of the main heat dissipation area, and the area between the main heat dissipation area and the auxiliary heat dissipation area The blocking wall has an opening, and the opening communicates with the main heat dissipation area and the auxiliary heat dissipation area.
The heat dissipation plate according to claim 7, wherein the number of the openings is multiple.
The heat dissipation plate according to any one of claims 1 to 8, characterized in that the heat dissipation plate comprises a plurality of heat dissipation fins, and different heat dissipation fins have the same or different shapes.
The heat dissipation plate according to any one of claims 1 to 9, wherein the heat dissipation plate further comprises a cooling liquid, and the cooling liquid is located in the cavity.
The radiator plate according to claim 10, wherein the refrigerant liquid is water or oil.
An electronic component, characterized by comprising a circuit board, a first heat generating device, and a heat dissipation plate according to any one of claims 1-11, wherein:

The heat dissipation plate includes a first heat dissipation plate, and the circuit board includes a first side and a second side opposite to each other; the first heat generating device is disposed on the first side, and the first heat dissipation plate is disposed on the The side of the first heat generating device away from the circuit board is used for dissipating heat from the first heat generating device.
The electronic assembly according to claim 12, further comprising a second heat-generating device, the heat dissipation plate comprises a second heat-dissipating plate, and the second heat-generating device is arranged on the second side of the circuit board; The second heat dissipation plate is disposed on a side of the second heat generating device away from the circuit board, and is used for dissipating heat from the second heat generating device.
The electronic assembly according to claim 13, wherein the main heat dissipation area of the first heat dissipation plate is connected to the first heat generating device through heat conduction, and the main heat dissipation area of the second heat dissipation plate is connected to the second heat dissipation device. Device thermally connected.
The electronic component according to claim 13 or 14, wherein the cavity of the first heat dissipation plate is connected in series with the cavity of the second heat dissipation plate, and the cooling liquid flows through the first heat dissipation plate in sequence with the second heat sink.
The electronic assembly according to any one of claims 13-15, wherein a first heat conducting layer is connected between the first heat generating device and the first heat dissipation plate, and the second heat generating device and the A second heat conduction layer is connected between the second heat dissipation plates.
The electronic assembly of claim 16, wherein,

The first heat conduction layer is a phase change material layer, a carbon fiber layer, a graphite layer, a copper layer or an aluminum layer; or

The second heat conduction layer is a phase change material layer, a carbon fiber layer, a graphite layer, a copper layer or an aluminum layer.
The electronic component according to any one of claims 13 to 17, further comprising a first sub-circuit board and a first bracket, the first heating element is mounted on the first sub-circuit board, and the first sub-circuit board A sub-circuit board is mounted on the first bracket, and the first bracket is mounted on the first side of the circuit board, and the first heating element is connected to the circuit board through a connector.
The electronic assembly according to claim 18, wherein the first connecting member sequentially connects the first bracket and the circuit board, and the second connecting member sequentially connects the circuit board and the first bracket; The extension axis of the first connection part is set in a staggered manner with the extension axis of the second connection part.
The electronic assembly according to claim 18 or 19, further comprising a second sub-circuit board and a second bracket, the second heat generating device is mounted on the second sub-circuit board, and the second sub-circuit The board is mounted on the second bracket, the second bracket is mounted on the second side of the circuit board, and the second heating element is connected to the circuit board through a connector.
The electronic assembly according to claim 20, wherein the first support, the circuit board and the second support are sequentially stacked, and the third connecting member sequentially connects the first support and the circuit board and the second bracket, and the fourth connecting piece sequentially connects the second bracket, the circuit board and the first bracket; the extension axis of the third connecting piece is the same as the extending axis of the fourth connecting piece Wrong setting.
The electronic component according to any one of claims 12-21, wherein the electronic component is a controller.
The electronic component according to any one of claims 12-22, characterized in that it includes N layers of circuit boards and N+1 layers of heat sinks, the N layers of circuit boards are stacked, and any two adjacent layers A layer of heat dissipation plates is arranged between the circuit boards, and the N is a positive integer greater than or equal to 2.
An electronic component is characterized in that it includes a circuit board, a first heat generating device, a second heat generating device and a heat sink, the heat sink includes a first heat sink and a second heat sink, and the circuit board includes opposite first heat sinks One side and a second side; the first heat generating device is arranged on the first side, the second heat generating device is arranged on the second side, and the first heat dissipation plate is arranged on the side away from the first heat generating device One side of the circuit board is used to dissipate heat for the first heat-generating device; the second heat-dissipating plate is arranged on the side of the second heat-generating device away from the circuit board and is used to dissipate heat for the second heat-generating device. Device heat dissipation.
The electronic assembly according to claim 24, further comprising a first sub-circuit board and a first bracket, the first heating element is mounted on the first sub-circuit board, and the first sub-circuit board is mounted on As for the first bracket, the first bracket is installed on the first side of the circuit board, and the first heating element is connected to the circuit board through a connector.
The electronic assembly according to claim 25, wherein the first connecting member sequentially connects the first bracket and the circuit board, and the second connecting member sequentially connects the circuit board and the first bracket; The extension axis of the first connection part is set in a staggered manner with the extension axis of the second connection part.
The electronic assembly according to claim 25 or 26, further comprising a second sub-circuit board and a second bracket, the second heat generating device is mounted on the second sub-circuit board, and the second sub-circuit The board is mounted on the second bracket, the second bracket is mounted on the second side of the circuit board, and the second heating element is connected to the circuit board through a connector.
The electronic assembly according to claim 27, wherein the first support, the circuit board and the second support are sequentially stacked, and the third connecting member sequentially connects the first support and the circuit board and the second bracket, the fourth connecting piece sequentially connects the second bracket, the circuit board and the first bracket; the extension axis of the third connecting piece is the same as the extending axis of the fourth connecting piece Wrong setting.
The electronic component according to any one of claims 24-28, wherein the electronic component is a controller.
The electronic component according to any one of claims 24 to 29, characterized in that it includes N layers of circuit boards and N+1 layers of heat sinks, the N layers of circuit boards are stacked, and any two adjacent layers A layer of heat dissipation plates is arranged between the circuit boards, and the N is a positive integer greater than or equal to 2.
A terminal, characterized by comprising at least one electronic component according to any one of claims 12-23; or,

Comprising at least one electronic component as claimed in any one of claims 24-30.
The terminal according to claim 31, wherein the terminal is a vehicle.