WO2023071671A1 - Chip module and circuit board - Google Patents

Abstract

Embodiments of the present application provide a chip module and a circuit board. The chip module comprises: a chip; a heat dissipation metal sheet; a heat conduction layer located between the chip and the heat dissipation metal sheet, wherein the heat conduction material contained in the heat conduction layer is a phase change material layer or a thermal paste; and a fixing assembly used for maintaining the relative position of the heat dissipation metal sheet and the chip.

Description

A chip module and circuit board

This disclosure claims the priority of the Chinese application with application number 202122586216.9 and the filing date is October 26, 2021; all the content of the Chinese application involved in the priority is the content of this disclosure.

technical field

The present disclosure relates to the technical field of chips but is not limited to the technical field of wireless communication, and in particular relates to a chip module and a circuit board.

Background technique

The heat source of the chip (Die) becomes smaller and smaller with the improvement of the process, and the problem of thermal expansion becomes more and more prominent. The difference between the chip and the radiator of the traditional gel solution can be 20°C. In emerging technologies, a phase change material or high-thin thermal paste is used between the chip and the heat dissipation metal sheet, and the chip BSM (Back Side Metal, back gold process, that is, the process of depositing metal on the back of the wafer is used to facilitate soldering and heat dissipation on the chip. Metal sheet, to realize the thermal expansion of the chip) coating and heat dissipation metal sheet welding method, can significantly improve the temperature difference between the chip and the heat sink, and also reduce the difficulty of production, but the phase change thermal conductivity material or thermal paste has no adhesive force, and cannot guarantee heat dissipation during vibration The metal sheet does not slip in the plane of the chip, and the stability is poor.

Contents of the invention

Embodiments of the present disclosure provide a chip module and a circuit board.

According to a first aspect of an embodiment of the present disclosure, a chip module is provided, including:

chip;

Heat sink metal sheet;

A heat conduction layer, located between the chip and the heat dissipation metal sheet, wherein the heat conduction material contained in the heat conduction layer is: a phase change material layer or a heat conduction paste;

The fixing component is used for maintaining the relative position between the heat dissipation metal sheet and the chip.

According to a second aspect of an embodiment of the present disclosure, there is provided a circuit board, including:

Printed circuit board PCB;

heat sink;

A plurality of chip modules as provided in the first aspect of the above-mentioned embodiment;

Wherein, the chip module is fixed on the PCB on a side away from the heat dissipation metal sheet;

The heat sink is connected to a side of the heat dissipation metal sheet away from the chip module.

According to a third aspect of the embodiments of the present disclosure, an electronic device is provided, wherein the electronic device includes: the circuit board provided in the second aspect.

The technical solutions provided by the embodiments of the present disclosure may include the following beneficial effects:

The embodiment of the present disclosure includes a chip, a heat dissipation metal sheet, a heat conduction layer and a fixed component; wherein, the heat conduction layer is located between the chip and the heat dissipation metal sheet, and is combined with the heat dissipation metal sheet to dissipate heat from the chip; the heat conduction material contained in the heat conduction layer is: Change material or heat conduction paste, that is, the embodiment of the present disclosure utilizes the characteristics of good interface wettability and high thermal conductivity of phase change material or heat conduction paste, and cooperates with the top heat dissipation metal sheet to realize heat dissipation; at the same time, uses the fixed component to maintain the heat dissipation metal sheet The relative position between the chip and the chip ensures that the relative position between the heat dissipation metal sheet and the chip remains unchanged during movement or vibration.

For the technical solutions provided by the embodiments of the present disclosure, it should be understood that the above general description and the following detailed descriptions are only exemplary and explanatory, and cannot limit the embodiments of the present disclosure.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present invention and together with the description serve to explain principles of the embodiments of the present invention.

Fig. 1 is a schematic structural diagram of a chip module according to an exemplary embodiment.

Fig. 2 is a schematic structural diagram of a chip module provided with an apron according to an exemplary embodiment.

Fig. 3 is a schematic structural diagram of a chip module provided with buckles and slots according to an exemplary embodiment.

Fig. 4 is an exploded view showing the structure of a chip module provided with buckles and slots according to an exemplary embodiment.

Fig. 5 is a schematic structural view of a chip module provided with bosses and pits according to an exemplary embodiment.

Fig. 6 is an exploded view showing the structure of a chip module provided with bosses and pits according to an exemplary embodiment.

Fig. 7 is a schematic structural diagram of another chip module provided with bosses and pits according to an exemplary embodiment.

Fig. 8 is an exploded view of the structure of another chip module provided with bosses and pits according to an exemplary embodiment.

Fig. 9 is a structural top view of a chip module provided with bosses and pits according to an exemplary embodiment.

Fig. 10 is a schematic structural diagram of a circuit board according to an exemplary embodiment.

Explanation of reference signs

100-chip;

200-radiating metal sheet;

300-thermal conduction layer;

400-fixed component; 410-apron; 420-buckle; 430-slot; 440-boss; 450-pit;

500-PCB;

600 - Radiator.

Detailed ways

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the embodiments of the present invention. Rather, they are merely examples of apparatuses and methods consistent with aspects of embodiments of the invention.

Terms used in the embodiments of the present disclosure are for the purpose of describing specific embodiments only, and are not intended to limit the present disclosure. Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure shall have the usual meanings understood by those skilled in the art to which the present disclosure belongs. "First", "second" and similar words used in the embodiments of the present disclosure do not indicate any sequence, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one" or "one" do not indicate a limitation of quantity, but indicate that there is at least one, and if only "one" is referred to, it will be described separately. "Multiple" or "several" means two or more. Unless otherwise indicated, terms such as "front", "rear", "lower" and/or "upper" are used for convenience of description only and are not intended to be limiting to a position or orientation in space. "Includes" or "comprises" and similar terms mean that the elements or items listed before "comprises" or "comprises" include the elements or items listed after "comprises" or "comprises" and their equivalents, and do not exclude other elements or objects. Words such as "connected" or "connected" are not limited to physical or mechanical connections, and may include electrical connections, whether direct or indirect. The singular forms "a", "said" and "the" used in the embodiments of the present disclosure are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and/or" used in the embodiments of the present disclosure refers to and includes any or all possible combinations of one or more associated listed items.

In addition, the terms indicating direction and orientation in the embodiments of the present disclosure, such as "up", "down", "length", "width", and "height", etc., are intended to describe the relative positional relationship of each component, and are not intended to be specific to each component. The orientation and installation position of the components are limited.

Fig. 1 is a schematic structural diagram of a chip module according to an exemplary embodiment. Chip modules can be applied to various types of electronic devices. The chip module can include various chips. The chip may include: various computing power chips and/or image processing chips, etc. The computing power chip can be used for blockchain-related data processing, etc.

The electronic equipment provided by the embodiments of the present disclosure may be various types of electronic equipment. For example, the electronic device may be a terminal device or a server. Exemplarily, the terminal device may include: a personal computer (Personal Computer, PC) and the like. The PC may include a desktop PC, a notebook computer, or a large-screen display device. The server can be: a rack server and/or a blade server.

As shown in FIG. 1 , the chip module includes: a chip 100 , a heat dissipation metal sheet 200 , a heat conduction layer 300 and a fixing component 400 . The heat conduction layer 300 is located between the chip 100 and the heat dissipation metal sheet 200 , and the fixing component 400 is used to maintain the relative position between the heat dissipation metal sheet 200 and the chip 100 .

The chip can be various types of chips, for example, the chip includes but is not limited to a computing power chip and/or an image processing chip (Graphics Processing Unit, GPU). The computing chips include but are not limited to Application Specific Integrated Circuit (ASIC) chips.

Here, the chip 100 can be a bare chip (Die), or a wafer, which is a small piece of semiconductor material on which a given functional circuit can be manufactured, but no heat dissipation structure has been added, and no packaging has been performed. Apply directly. Since the chip 100 is fixed between the fixing component and the heat-dissipating metal sheet in this implementation, no BSM process is required, that is, no welding is required, which reduces the use of the welding process and the damage caused by the welding process to the chip.

Here, the heat dissipation metal sheet 200 may be made of various metals that are solid at normal temperature (or room temperature) and have good heat dissipation performance. For example, the heat dissipation metal sheet 200 can be a copper sheet or an aluminum sheet or an alloy metal sheet or the like. Exemplarily, the heat dissipation metal sheet 200 of this embodiment can be a copper sheet, and the thickness can be between 0.1mm and 1mm, for example, the thickness of the copper sheet is 0.2mm, 0.5mm, etc. It is not too thick, and while ensuring heat dissipation of the chip 100, the overall thickness of the packaged chip 100 is reduced to save costs.

Here, the phase change material is a heat-enhanced polymer, which refers to a substance that can absorb a large amount of latent heat during the phase change process of changing the state of matter under the condition of constant temperature, and also makes the gap between the chip 100 and the heat dissipation metal sheet 200 The thermal resistance is reduced, and the gap between the interfaces can be filled, the air between the interfaces can be effectively eliminated, and the reliability is high. The phase change material in this embodiment may be an organic phase change material or an inorganic phase change material, and the phase change material in this embodiment is not specifically limited, as long as it meets requirements such as thermal conductivity.

The thermally conductive paste is a material with high thermal conductivity, and may include at least one or more of thermally conductive gel, thermally conductive silicone grease, thermally conductive silica gel, and thermally conductive mud, which is not specifically limited in this embodiment.

The fixing component 400 can be any structure other than welding to realize the physical fixing between the chip and the heat dissipation metal sheet. For example, the fixing component 400 can be a clamping component or the fixing component 400 can be a sleeve component, etc. FIG.

In this implementation, BSM is not performed on the chip 100, and the relative displacement such as the slippage of the heat dissipation metal sheet 200 between the chips 100 is suppressed by fixing the component 400, so as to maintain the relative position between the heat dissipation metal sheet 200 and the chip 100, thereby maintaining the chip Mod stability.

In some embodiments of the present invention, the thermal conductivity of the heat conducting layer 300 is at least not less than 4W/(m·K).

In order to ensure the heat dissipation of the chip 100 of this embodiment, this embodiment requires that the thermal conductivity of the thermal conduction layer 300 should not be less than 4W/(m·K), for example, the thermal conductivity of the thermal conduction layer 300 is 5W/(m·K) or 10W/(m · K) and so on, so that it is convenient to cooperate with the heat dissipation metal sheet 200 to realize thermal expansion of the chip 100 and achieve a better heat dissipation effect.

In some embodiments of the present invention, the thickness of the heat conduction layer 300 may be 0.05-0.1 mm, for example, the thickness of the heat conduction layer 300 is 0.05 mm, 0.06 mm, or 0.1 mm. This can not only ensure that the thermal conductivity of the thermal conduction layer 300 meets the requirements, but also reduce the overall thickness of the chip module due to the thin coating.

In addition, due to the characteristics of high thermal conductivity, thin coating, and good surface wettability, the phase change material or thermal paste can reduce the contact thermal resistance between the chip and the heat sink, and the phase change material or thermal paste does not need to be cured in a high-temperature furnace and time to wait.

In one embodiment, the fixing assembly 400 may include: a rubber ring 410 . The rubber ring 410 surrounds the side of the chip 100 ; the top surface of the rubber ring 410 is glued to the heat dissipation metal sheet 200 , and the size of the heat dissipation metal sheet 200 is larger than the size of the chip 100 at this time.

Exemplarily, referring to FIG. 1 and FIG. 2 , the rubber ring 410 surrounds the side of the chip 100, so that the chip 100 is placed inside the rubber ring 410, and at the same time, the height of the rubber ring 410 is higher than that of the chip 100 under no pressure. In this way, after the high-performance thermal paste or phase change material is applied on the chip 100 in the apron 410, when the heat-dissipating metal sheet 200 is covered on the heat-conducting layer 300, the heat-dissipating metal sheet 200 can be fully bonded to the apron 410, At the same time, the heat conduction layer 300 can also fully contact the chip 100 and the heat dissipation metal sheet 200 to achieve better heat dissipation. At the same time, the rubber ring 410 is used to fix the relative position of the chip 100 and the heat dissipation metal sheet 200, which has low cost and strong operability in actual production.

In some embodiments of the present invention, the side of the rubber ring 410 that is in contact with the PCB 500 has stickiness and is fixed on the PCB 500, or the side that is in contact with the chip 100 has stickiness and is bonded to the side of the chip 100. At the same time, the rubber ring 410 has a certain degree of elasticity. When the material of the heat conduction layer such as phase change material or heat conduction paste changes in volume with the change of cold and heat, the rubber ring 410 will increase or shrink due to its own elasticity, thus providing a good heat conduction layer. The required accommodation space. In one embodiment, the bottom surface of the rubber ring 410 is bonded to the PCB 500 , the top surface of the rubber ring 410 is bonded to the heat dissipation metal sheet 200 , and the chip 100 and the heat conduction layer 300 are arranged inside the rubber ring 410 , so that the chip is positioned at the bottom of the rubber ring 410 The inner side is enough, and the actual operability is more convenient during production.

In another embodiment, the inner surface of the rubber ring 410 is bonded to the side of the chip 100, the top surface of the rubber ring 410 is bonded to the heat dissipation metal sheet 200, and the heat conduction layer 300 is arranged inside the rubber ring 410. At this time, the rubber ring 100 It does not need to be attached to the PCB 500, and it is easy to manufacture.

In some embodiments of the present invention, the rubber ring 410 may be an elastic rubber ring. Wherein, the inner diameter when no chip 100 is placed in the elastic rubber ring is the first value, and the inner diameter after the chip 100 is placed in the elastic rubber ring is the second value, and the second value is greater than the first value, so that the rubber ring can 410 is in sealed contact with the chip 100 to ensure that the position of the chip 100 and the rubber ring 410 remains unchanged, and there is no need for the bottom or side of the rubber ring 410 to be sticky, only the top surface of the rubber ring 410 is bonded to the heat dissipation metal sheet 200. .

Exemplarily, when the chip 100 is not placed in the elastic rubber ring, the inner diameter is 1 mm, and the inner diameter after the chip 100 is placed in the elastic rubber ring is 1.2 mm, so that the elastic rubber ring is fully in contact with the chip 100 to ensure the contact between the chip 100 and the chip 100. The position remains unchanged, the actual operability is stronger, and the operation is more convenient.

At the same time, the elastic rubber ring has certain elasticity and can provide more space between the chip 100 and the heat dissipation metal sheet 200 when the thermal conduction layer 300 expands, thereby ensuring the stability of the chip module.

In this embodiment, the material of the apron 410 is not limited, it can be the apron 410 made of double-sided adhesive, hot melt adhesive or epoxy resin bonding colloid, as long as the heat dissipation metal sheet 200 and the chip 100 can be connected and fixed. That is, it is ensured that the relative position of the heat dissipation metal sheet 200 and the chip 100 does not change, and the reliability of the chip module is improved.

In some embodiments, the apron 410 can be a colloid that is in a ground state with certain fluidity such as a molten state or a liquid state at high temperature, and solidifies at room temperature. The colloid can have a higher thermal conductivity, for example, the thermal conductivity of the colloid can be greater than or equal to 2W/(m·K) or 3W/(m·K), so that on the one hand, the bonding effect can be achieved, and on the other hand, it can be compatible with thermal conductivity. The layer realizes the heat dissipation of the chip.

In one embodiment, the fixing assembly 400 may include: a slot 430 and a buckle 420 .

Exemplarily, as shown in Figures 3 and 4, the heat dissipation metal sheet 200 covers the front of the chip 100, and the heat dissipation metal sheet 200 is bent toward the side of the chip 100. 100 ; the side inner wall of the heat dissipation metal sheet 200 has buckles 420 , as shown in FIG. 4 , the buckles 420 of the heat dissipation metal sheet 200 are engaged in the slots 430 of the chip 100 .

As shown in Figure 3, the heat dissipation metal sheet 200 is clamped with the chip 100. While ensuring the full contact between the heat conduction layer 300, the heat dissipation metal sheet 200 and the chip 100, the heat dissipation metal sheet 200 is limited to ensure that the heat dissipation metal sheet 200 is in contact with the chip 100. The relative position remains the same, it is firmer and the stability is better.

In some embodiments of the present invention, in order to stabilize the position of the heat dissipation metal sheet 200, this embodiment can also set a viscous colloid between the bent heat dissipation metal sheet 200 and the PCB 500, that is, the heat dissipation metal sheet 200 on the side of the chip 100 and the PCB 500 The PCB 500 is bonded by colloid, which further stabilizes the position between the heat dissipation metal sheet 200 and the chip 100, and ensures that the heat dissipation metal sheet 200 will not slide in both horizontal and vertical directions.

In this embodiment, the shapes of the buckle 420 and the slot 430 are not limited, and may be triangular as shown in Figures 3 and 4, or rectangular, dovetail or T-shaped, etc., as long as the buckle 420 is engaged in the In the slot 430 , it is sufficient to ensure that the relative positions of the chip 100 and the heat dissipation metal sheet 200 remain unchanged.

In some embodiments of the present invention, the pins of the chip 100 are arranged on the first side, the slot 430 is arranged on the second side of the chip 100, and the second side is different from the first side, that is, the second side with the slot 430 No pins are set, so that when the heat dissipation metal sheet is clamped to the chip, the pins of the buckle and the chip are located on different sides of the chip, which can reduce the damage of the chip circuit or pins when packaging plastics, and ensure that the heat dissipation metal sheet 200 In the case of no displacement, the availability of the chip module is guaranteed, and the maintenance rate and scrap rate of the chip are reduced.

In some embodiments of the present invention, the number of the second sides is two, the two second sides are arranged opposite to each other, and no pins are provided on the second sides, that is, at least one of the remaining two first sides is provided with fewer pins. For example, the second sides may be the left and right sides of the chip, respectively, or the second sides may be the front and rear sides of the chip.

Exemplarily, as shown in FIG. 3 , the card slots 430 are arranged on two opposite second sides of the chip 100 , at this time, the heat dissipation metal sheet 200 has a rectangular shape without bending, and the heat dissipation metal sheet 200 covers the chip 100 , and The two ends are bent toward the two opposite second side surfaces of the chip 100 , and the inner walls of the bent two ends of the heat dissipation metal sheet 200 have buckles 420 .

As shown in Fig. 4 , the buckle 420 of the heat dissipation metal sheet 200 is engaged in the slot 430 of the chip 100, so that the heat dissipation metal sheet 200 is fully contacted while ensuring that the heat conduction layer 300 is fully in contact with the heat dissipation metal sheet 200 and the chip 100. The position limit ensures that the relative position of the heat dissipation metal sheet 200 and the chip 100 remains unchanged, which is stronger and more stable.

In some embodiments of the present invention, the number of the second sides is three, and two of the three second sides are arranged opposite to each other, and pins are not provided on the second sides, that is, pins are provided on the remaining first sides. , so as to ensure that when the chip 100 is provided with the card slot 430, the chip will not be damaged, and at the same time, it can also ensure that the heat dissipation metal sheet 200 will not be displaced in the horizontal direction and the vertical direction.

Exemplarily, the card slot 430 is provided on the three second side surfaces of the chip 100. At this time, the heat dissipation metal sheet 200 is T-shaped without bending, the heat dissipation metal sheet 200 covers the chip 100, and the three ends face the chip. The three second side surfaces of 100 are bent, and the inner walls of the three bent sides of the heat dissipation metal sheet 200 have buckles 420 , and the buckles 420 of the heat dissipation metal sheet 200 are engaged in the slots 430 of the chip 100 . In this way, while ensuring sufficient contact between the heat conduction layer 300 and the heat dissipation metal sheet 200 and the chip 100, the heat dissipation metal sheet 200 is limited, which reduces the displacement of the heat dissipation metal sheet 200 when vibration occurs, and is more firm, ensuring that the heat dissipation metal sheet 200 in the horizontal direction and vertical direction stability.

In one embodiment, the fixing assembly may further include: a recess 450 and a boss 440 engaged with the recess 450 . Both the bosses 440 and the pits 450 are located on the opposite surfaces of the chip 100 and the heat dissipation metal sheet 200 .

Exemplarily, as shown in FIG. 5 or FIG. 7, the bosses 440 and the pits 450 are located on the opposite surfaces of the chip 100 and the heat dissipation metal sheet 200, that is, the bosses or pits are prepared on the chip 100; Prepare pits or bosses that match the chip 100 , the thermal conduction layer 300 is below the heat dissipation metal sheet 200 , and the pits 450 are engaged with the bosses 440 above the chip 100 .

In one embodiment, the recess 450 is in interference fit with the boss 440 , so that the position between the heat dissipation metal sheet 200 and the chip 100 is fixed.

In some embodiments of the present invention, in order to stabilize the position of the heat dissipation metal sheet 200 , in this embodiment, the heat dissipation metal sheet 200 can be bonded to the chip 100 by colloid. At this time, the size of the heat dissipation metal sheet 200 is larger than that of the chip 100 . The colloid can be any rubber ring of the above-mentioned embodiment, and can also be a colloid glued on the side of the chip 100. The top surface of the colloid is bonded to the heat dissipation metal sheet 200, which further stabilizes the gap between the heat dissipation metal sheet 200 and the chip 100. position to ensure that the heat dissipation metal sheet 200 will not slide in both the horizontal direction and the vertical direction.

In this embodiment, the number and position of the boss 440 and the pit 450 are not limited, and there may be one. For example, when it is arranged in the middle of the chip 100 or the heat dissipation metal sheet 200 , the number of the boss 440 and the pit 450 can be one.

The number of bosses 440 and pits 450 can also be two, for example, they are arranged at diagonal positions of the chip 100 or the heat dissipation metal sheet 200 .

The number of bosses 440 and pits 450 can also be four, as shown in FIG. 9 , they are arranged on the four corners of the chip 100 or the heat dissipation metal sheet 200 .

Of course, the number of bosses 440 and pits 450 can be four or more, as long as the relative positions of the heat dissipation metal sheet 200 and the chip 100 remain unchanged and the usage of the chip is not affected.

In this embodiment, the shapes of the boss 440 and the pit 450 are not limited. They may be rectangular as shown in FIG. 5 to FIG. It is sufficient to ensure that the relative positions of the chip 100 and the heat dissipation metal sheet 200 remain unchanged.

In some embodiments of the present invention, the recess 450 is located on the surface of the heat dissipation metal sheet 200 facing the chip 100 , and the protrusion 440 is located on the front side of the chip 100 .

Exemplarily, as shown in FIG. 7 and FIG. 8 , the recess 450 is located on the surface of the heat dissipation metal sheet 200 facing the chip 100 , the boss 440 is located on the surface of the chip 100 facing the heat dissipation metal sheet 200 , and the boss 440 is engaged in the recess 450 In this way, damage to the internal circuit of the chip can be prevented, and the pit 450 of the heat dissipation metal sheet 20 is also easy to process, while ensuring the relative position of the chip 100 and the heat dissipation metal sheet 200 . It should be understood that this embodiment does not limit the number, position and shape of the bosses 440 and the pits 450, as long as the bosses 440 are engaged in the pits 450, the relative positions of the heat dissipation metal sheet 200 and the chip 100 remain unchanged. , and does not affect the use of the chip.

In some embodiments of the present invention, the pit 450 is located on the front surface of the chip 100 , and the protrusion 440 is located on the surface of the heat dissipation metal sheet 200 facing the chip 100 .

Exemplarily, as shown in FIG. 5 and FIG. 6 , the recess 450 is located on the surface of the chip 100 facing the heat dissipation metal sheet 200 , the boss 440 is located on the surface of the heat dissipation metal sheet 200 facing the chip 100 , and the boss 440 is engaged in the recess 450 .

With the fixing assembly of the boss 440 and the recess 450, the chip is easy to package, and the boss 440 of the heat dissipation metal sheet 20 is also easy to process, while ensuring that the relative position of the chip 100 and the heat dissipation metal sheet 200 remains unchanged.

In some embodiments of the present invention, the boss 440 penetrates the heat conducting layer 300 and engages with the recess 450 . As shown in FIG. 5 , the boss 440 of the heat dissipation metal sheet 200 penetrates the heat conduction layer 300 and engages with the recess 450 of the chip 100 .

As shown in FIG. 7 , the boss 440 of the chip 100 penetrates the heat conduction layer 300 and engages with the pit 450 of the heat dissipation metal sheet 200 , thus, while not increasing the size of the chip 100 and the heat dissipation metal sheet 200 , the contact between the chip 100 and the heat dissipation metal sheet 200 is ensured. The relative positions of the heat dissipation metal sheets 200 remain unchanged.

In some embodiments of the present invention, both the pit 450 and the boss 440 are located outside the heat conducting layer 300 . Exemplarily, the heat conduction layer 300 is arranged at the middle position of the chip 100, and the pit 450 is arranged at the outer side of the middle position, or the boss 440 is arranged at the outer side of the middle position of the chip 100. The boss 440 or the pit 450 of 200 is installed, and the relative position between the chip 100 and the heat dissipation metal sheet 200 is guaranteed to remain unchanged, without affecting the coating of the heat conduction layer 300 .

In another embodiment, as shown in FIG. 10 , this embodiment may also include a heat sink 600; the heat sink 600 is installed on a plurality of above-mentioned chip modules, and the heat sink 600 is fixed to the heat dissipation metal sheet 200 of each chip module. Connect to realize thermal expansion of multi-chip coplanarity.

Here, the heat sink 600 can be a large-sized metal heat sink, as shown in Figure 10, the heat sink 600 can be a heat sink, a device specially designed for heat dissipation of electronic components that are prone to heat, and can be made of metal such as aluminum alloy, brass or bronze. It can be in the shape of a plate, or a multi-sheet, etc. Multiple chips can use one or several (for example, 2, 3, etc.) radiators 600 for heat dissipation. In the case of using multiple heat sinks 600, the chip modules on the PCB 500 can be divided into areas, and each area uses a large-size heat sink, for example, the area is divided according to the size of the PCB 500 or the size of the heat sink 600, so that each The heat sinks 600 are fully utilized, and at the same time, each chip 100 is guaranteed to be dissipated.

In practical applications, there are hundreds of computing power chips on the PCB, and each chip has a small heat source bare chip. The thermal expansion of the chip also uses the overall heat sink 600 to dissipate heat to achieve the coplanar thermal conduction expansion, achieving the engineering effect of 1+1>2.

In some embodiments of the present invention, the relative position of the heat dissipation metal sheet 200 and the radiator 600 can also be maintained through the above-mentioned fixing assembly 400 to avoid displacement of the heat dissipation metal sheet 200 and the radiator 600 during vibration.

For example, the rubber ring of the above embodiment is wrapped around the side of the heat dissipation metal sheet 200 , and the top surface of the rubber ring is glued to the heat sink 600 .

Alternatively, the side of the radiator 600 has a slot, the heat dissipation metal sheet 200 is bent toward the side of the radiator 600 , and the inner wall of the side of the heat dissipation metal sheet 200 has a buckle, and the buckle is engaged in the slot.

Or, the recess is located on the surface of the heat dissipation metal sheet 200 facing the heat sink 600, and the boss is located on the surface of the heat sink 600 facing the heat dissipation metal sheet 200, and the boss is engaged in the recess, or the recess is located on the radiator 600 facing the heat dissipation on the surface of the metal sheet 200 , and the boss is located on the surface of the heat dissipation metal sheet 200 facing the radiator 600 .

In this way, the position between the heat sink 600 and the heat dissipation metal sheet 200 is maintained by the fixing component 400 , so the stability is higher.

In some embodiments of the present invention, between the heat dissipation metal sheet 200 and the heat sink 600 further includes: heat conduction gel.

Referring to Fig. 10, the heat conduction layer 300 is arranged between the chip 100 and the heat dissipation metal sheet 200, and the heat conduction gel is arranged between the heat dissipation metal sheet 200 and the heat sink 600; the heat conduction layer 300 is used for dissipating heat from the chip 100, and the heat conduction gel not only In order to dissipate heat from the heat dissipation metal sheets 200 , it is also used to fix the heat sink 600 on a plurality of heat dissipation metal sheets 200 , so as to realize coplanar connection of multiple chips to the heat sink 600 . In one embodiment, the structure of the heat conduction layer 300 , the heat dissipation metal sheet 200 , the heat conduction gel and the heat sink 600 can better dissipate heat from the chip 100 .

Here, the thermally conductive gel has the function of filling large gaps and absorbing multi-chip tolerances, so this embodiment uses thermally conductive gel to fill between the heat dissipation metal sheet 200 and the heat sink 600, and ensure that the heat sink 600 is fixed on the heat dissipation metal sheet 200 At the same time, the tolerance between multiple chips is eliminated, the gap between each heat dissipation metal sheet 200 and the heat sink 600 is filled, and the multi-chip coplanar connection with the heat sink 600 is realized.

In some embodiments of the present invention, the thickness of the thermally conductive gel can be greater than 0.2mm, for example, the thickness of the thermally conductive gel is 0.3mm, 0.4mm or 1mm, etc., which can ensure that the gap between each heat dissipation metal sheet 200 and the radiator 600 is fully filled. The gap between the chips can be eliminated, and the multi-chip coplanar connection with the heat sink can be realized.

The combination of the heat conduction layer 300 and the heat dissipation metal sheet 200 in the embodiment of the present disclosure can dissipate heat from the chip 100; With the characteristics of good wettability, high thermal conductivity, and thin coating, it can achieve better thermal expansion with the top heat dissipation metal sheet 200 and is easier for actual production; at the same time, the fixing component 400 can be an apron 410 or a buckle 420 and a slot 430 Alternatively, the protrusions 440 and the recesses 450 have a simple structure, which is easy to process while ensuring that the relative positions of the chip 100 and the heat dissipation metal sheet 200 remain unchanged. At the same time, the embodiment of the present disclosure also utilizes the entire heat sink 600 to be arranged on the heat dissipation metal sheets 200 of multiple chip modules, so as to achieve a multi-advantage combination and realize multi-chip coplanar thermal expansion.

Based on the above-mentioned various embodiments, as shown in FIG. 10, a circuit board is also provided in an embodiment of the present disclosure, including: a PCB 500, a heat sink 600, and a plurality of chip modules as provided in the above-mentioned embodiments; wherein, the chip module will deviate from One side of the heat dissipation metal sheet 200 is fixed on the PCB 500, and the radiator 600 is connected with the side of the heat dissipation metal sheet 200 away from the chip module.

In the above embodiment, the heat sink 600 is assembled with the PCB 500 to realize the combination of the chip 100, the heat conduction layer 300, the heat dissipation metal sheet 200, the fixed structure 400, the heat conduction gel, and the whole heat sink 600, thereby realizing the thermal expansion of the multi-chip, through The fixing structure 400 ensures that the relative position of the chip 100 and the heat dissipation metal sheet 200 remains unchanged, and the tolerance between multiple chips is eliminated through the thermal conductive gel, so as to realize the coplanar connection of the multiple chips and the heat sink.

According to a third aspect of the embodiments of the present disclosure, an electronic device is provided, wherein the electronic device includes: the circuit board provided in the second aspect.

The electronic device may include the circuit board provided in any of the foregoing embodiments.

The electronic device can be various types of servers or terminal devices, etc.

The electronic equipment may also include: a rack;

The circuit board case is mounted on the rack.

This electronic device can be used for various calculations, for example, calculations in the blockchain generation process.

Other embodiments of the invention will be readily apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This disclosure is intended to cover any modification, use or adaptation of the present invention, these modifications, uses or adaptations follow the general principles of the present invention and include common knowledge or conventional technical means in the technical field not disclosed in this disclosure . The specification and examples are to be considered exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It should be understood that the present invention is not limited to the precise constructions which have been described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.

Claims (12)

A chip module, comprising: chip; Heat sink metal sheet; A heat conduction layer, located between the chip and the heat dissipation metal sheet, wherein the heat conduction material contained in the heat conduction layer is: a phase change material layer or a heat conduction paste; The fixing component is used for maintaining the relative position between the heat dissipation metal sheet and the chip. The chip module according to claim 1, wherein the fixing component comprises: a rubber ring surrounding the side of the chip; The top surface of the rubber ring is bonded to the heat dissipation metal sheet. The chip module according to claim 2, wherein, The apron is an elastic apron; The inner diameter when the chip is not placed in the apron is the first value; After there is the chip in the apron, the inner diameter of the apron is the second value; Wherein, the second value is greater than the first value. The chip module according to claim 1, wherein the fixing component comprises: a slot and a buckle; The side of the chip has the card slot; The heat dissipation metal sheet covers the front surface of the chip; The heat dissipation metal sheet is bent toward the side of the chip, and the side inner wall of the heat dissipation metal sheet has the buckle; The buckle is engaged in the slot. The chip module according to claim 4, wherein, The pins of the chip are arranged on the first side; The card slot is disposed on the second side of the chip; wherein, the second side is different from the first side. The chip module according to claim 5, wherein, The number of the second side is two, and the two second sides are arranged opposite to each other; or, The number of the second sides is three, and two of the three second sides are opposite to each other. The chip module according to claim 1, wherein the fixing component comprises: a dimple and a boss engaged with the dimple; Wherein, the boss and the pit are located on the opposite surface of the chip and the heat dissipation metal sheet. The chip module according to claim 7, wherein, The pit is located on the surface of the heat dissipation metal sheet facing the chip, and the boss is located on the front side of the chip; or, The pit is located on the front surface of the chip, and the boss is located on the surface of the heat dissipation metal sheet facing the chip. The chip module according to claim 7, wherein, The boss penetrates the heat conducting layer and engages with the pit; or, Both the pit and the boss are located outside the heat conducting layer. The chip module according to any one of claims 1 to 9, wherein, The thermal conductivity of the heat conducting layer is at least not less than 4W/(m·K). A circuit board comprising: Printed circuit board PCB; heat sink; A plurality of chip modules provided by any one of claims 1 to 10; Wherein, the chip module is fixed on the PCB on a side away from the heat dissipation metal sheet; The heat sink is connected to a side of the heat dissipation metal sheet away from the chip module. An electronic device, wherein the electronic device comprises: the circuit board provided in claim 11.

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