WO2023070259A1 - Heating assembly for aerosol-generating device - Google Patents
Heating assembly for aerosol-generating device Download PDFInfo
- Publication number
- WO2023070259A1 WO2023070259A1 PCT/CN2021/126067 CN2021126067W WO2023070259A1 WO 2023070259 A1 WO2023070259 A1 WO 2023070259A1 CN 2021126067 W CN2021126067 W CN 2021126067W WO 2023070259 A1 WO2023070259 A1 WO 2023070259A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate layer
- heating
- aerosol
- layer
- temperature sensor
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 227
- 239000000758 substrate Substances 0.000 claims abstract description 254
- 239000010410 layer Substances 0.000 claims description 260
- 239000012790 adhesive layer Substances 0.000 claims description 42
- 239000010935 stainless steel Substances 0.000 claims description 17
- 229910001220 stainless steel Inorganic materials 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 3
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims description 3
- 229920002530 polyetherether ketone Polymers 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 239000000443 aerosol Substances 0.000 description 17
- 230000006698 induction Effects 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 238000001994 activation Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
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- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000001627 detrimental effect Effects 0.000 description 2
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- 230000000391 smoking effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910001006 Constantan Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004964 aerogel Substances 0.000 description 1
- YXTPWUNVHCYOSP-UHFFFAOYSA-N bis($l^{2}-silanylidene)molybdenum Chemical compound [Si]=[Mo]=[Si] YXTPWUNVHCYOSP-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
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- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
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Images
Classifications
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
- A24F40/46—Shape or structure of electric heating means
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/50—Control or monitoring
- A24F40/51—Arrangement of sensors
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/50—Control or monitoring
- A24F40/53—Monitoring, e.g. fault detection
Definitions
- the present invention relates to a heating assembly for an aerosol-generating device.
- the invention further relates to an aerosol-generating device and a method for manufacturing a heating assembly.
- Aerosol-generating device for generating an inhalable vapor.
- Such devices may heat aerosol-forming substrate to a temperature at which one or more components of the aerosol-forming substrate are volatilised without burning the aerosol-forming substrate.
- Aerosol-forming substrate may be provided as part of an aerosol-generating article.
- the aerosol-generating article may have a rod shape for insertion of the aerosol-generating article into a cavity, such as a heating chamber, of the aerosol-generating device.
- a heating assembly may be arranged in or around the heating chamber for heating the aerosol-forming substrate once the aerosol-generating article is inserted into the heating chamber of the aerosol-generating device.
- a heating assembly for an aerosol-generating device.
- the heating assembly may comprise a first substrate layer, the first substrate layer being an electrically isolating substrate layer.
- the heating assembly may further comprise a heating element, wherein the heating element is arranged on the first substrate layer.
- the heating assembly may further comprise a second substrate layer, the second substrate layer may be an electrically isolating substrate layer.
- the second substrate layer may be arranged covering the heating element and the first substrate layer.
- the heating assembly may further comprise a temperature sensor.
- the temperature sensor may be arranged on the second substrate layer.
- the heating assembly may further comprise a third substrate layer, the third substrate layer may be an electrically isolating substrate layer.
- the third substrate layer may be arranged at least partly covering the temperature sensor and covering the second substrate layer.
- a heating assembly for an aerosol-generating device.
- the heating assembly comprises a first substrate layer, the first substrate layer being an electrically isolating substrate layer.
- the heating assembly further comprises a heating element, wherein the heating element is arranged on the first substrate layer.
- the heating assembly further comprises a second substrate layer, the second substrate layer being an electrically isolating substrate layer.
- the second substrate layer is arranged covering the heating element and the first substrate layer.
- the heating assembly further comprises a temperature sensor.
- the temperature sensor is arranged on the second substrate layer.
- the heating assembly further may comprise a third substrate layer, the third substrate layer being an electrically isolating substrate layer.
- the third substrate layer may be arranged at least partly covering the temperature sensor and covering the second substrate layer.
- the temperature sensor is placed on an adhesive layer of the second substrate layer.
- Adhesion between any of the layers discussed herein, particularly adhesion between the temperature sensor and the second substrate layer may be created by an assembly process based on the application of pressure and high temperature (hot melt press) .
- the press is applied on the temperature sensor which is in turn arranged on an adhesive layer.
- the problem is that the adhesive layer is applied evenly on the surface of the second substrate layer and the temperature sensor occupy only a limited area, with the result that the press surface gets in contact with the adhesive layer, creating significant difficulties during the assembly process.
- the proposed solution is to apply a third substrate layer on top of the temperature sensor such to avoid contact between the press surface and the adhesive layer.
- the third substrate layer may have one or more openings to allow the electrical contacts of the temperature sensor track to still be connected to the temperature sensor as will be described in more detail below.
- the term ‘covering’ or ‘cover’ may mean that a first layer has the substantial same surface size as a second layer so that the first layer can be placed on the second layer in a way that the surface area of the second layer facing the first layer is substantially overlapped by the first layer.
- the surface size of the first layer may be at least 90 %of the surface area of the second layer, preferably the surface size of the first layer may be at least 80 %of the surface area of the second layer, more preferably the surface size of the first layer may be at least 70 %of the surface area of the second layer, most preferably the surface size of the first layer may be at least 60 %of the surface area of the second layer
- the heating element may be sandwiched between the first substrate layer and the second substrate layer.
- the heating element may only cover a portion of the surface of the first substrate layer.
- the second substrate layer When the second substrate layer is placed on the first substrate layer and on the heating element, the second substrate layer preferably covers the heating element and covers the rest of the surface of the first substrate layer on which the heating element is arranged and that is not covered by the heating element.
- the temperature sensor may be sandwiched between the second substrate layer and a third substrate layer.
- the temperature sensor may only cover a portion of the surface of the second substrate layer.
- the third substrate layer When the third substrate layer is placed on the second substrate layer and on the temperature sensor, the third substrate layer preferably covers the temperature sensor and covers the rest of the surface of the second substrate layer on which the temperature sensor is arranged and that is not covered by the temperature sensor.
- the heating element and the temperature sensor are preferably arranged on opposite surfaces of the second substrate layer. Hence, the heating element is electrically isolated from the temperature sensor via the second substrate layer.
- the heating element is protected by the first substrate layer and by the second substrate layer.
- the temperature sensor is protected by the second substrate layer and by the third substrate layer.
- the heating element may be a resistive heater.
- the heating element may comprise a heating track.
- the heating element may be a heating track.
- the heating tracks may be configured to generate heat.
- the heating tracks may be electrically resistive heating tracks.
- the heating elements may comprise electrical contacts for electrically contacting the heating tracks.
- the electrical contacts may be attached to the heating tracks by any known means, exemplarily by soldering or welding.
- a first electrical contact may be attached to a first end of the heating tracks and a second electrical contact may be attached to a second end of the heating tracks.
- the first end of the heating tracks may be a proximal end of the heating tracks and the second end of the heating tracks may be a distal end of the heating tracks or vice versa.
- the heating tracks may be made from stainless-steel.
- the heating tracks may be made from stainless-steel at about 50 ⁇ m thickness.
- the heating tracks may be preferably made from stainless-steel at about 25 ⁇ m thickness.
- the heating tracks may be made from inconel at about 50.8 ⁇ m thickness.
- the heating tracks may be made from inconel at about 25.4 ⁇ m thickness.
- the heating tracks may be made from copper at about 35 ⁇ m thickness.
- the heating tracks may be made from constantan at about 25 ⁇ m thickness.
- the heating tracks may be made from nickel at about 12 ⁇ m thickness.
- the heating tracks may be made from brass at about 25 ⁇ m thickness.
- the heating element preferably the heating tracks, may be printed on the first substrate layer.
- the heating tracks may be photo-printed on the substrate layer.
- the heating tracks may be chemically etched on the substrate layer.
- heating tracks encompasses a single heating track.
- the heating element or the heating tracks may be printed on the first substrate layer.
- the heating tracks may be centrally arranged on the first substrate layer.
- the heating tracks may have a bent shape.
- the heating tracks may have a curved shape.
- the heating tracks may have a zigzag shape. This heating tracks may have a winding shape.
- the heating assembly may be rolled into a tube.
- the heating tracks may be flat before the substrate layer is rolled into the tubular shape.
- the heating tracks or the heating element may be flexible.
- the heating tracks or the heating element may conform to the tubular shape of the substrate layer when the substrate layer is rolled into the tubular shape.
- the third substrate layer may comprise at least two openings.
- the two openings are provided for enabling the electrical contacts of the temperature sensor to be contacted through the third substrate layer.
- the two openings may be aligned such that the two contacts of the temperature sensor are not covered by the third substrate layer.
- the two openings may be arranged adjacent to opposite ends of the third substrate layer.
- the two openings may correspond to the placement of electrical contacts on the temperature sensor.
- a further opening may be provided in the third substrate layer.
- the third opening may be arranged centrally in the third substrate layer. This third opening may increase the mechanical strength of the third substrate layer in this area. Particularly, the opening in the middle of the third substrate layer may strengthen the fixation of the electrical wires contacting the electrical contacts of the temperature sensor, since the electrical wires come into contact with the underlying adhesive layer of the second substrate layer in this area.
- the electrical contacts of the temperature sensor may be attached to the temperature sensor by any known means, exemplarily by soldering or welding.
- a first electrical contact may be attached to a first end of the temperature sensor and a second electrical contact may be attached to a second end of the temperature sensor.
- the first end of the temperature sensor may be a proximal end of the temperature sensor and the second end of the temperature sensor may be a distal end of the temperature sensor or vice versa.
- the temperature sensor may comprise temperature sensor tracks.
- the heating assembly may comprise a tube, preferably a metal tube, around which the substrate layer may be wrapped or rolled.
- the metal tube is preferable a stainless-steel tube.
- the tube may be a ceramic tube.
- the tube may define the tubular shape of the heating assembly.
- the outer diameter of the tube may correspond to the inner diameter of the first substrate layer after rolling of the substrate layer.
- the heating assembly may further comprise a heating chamber conformed by the tubular shape of the heating assembly.
- the substrate layers together with the heating element and the temperature sensor may be rolled to conform the tube forming the heating chamber.
- the first substrate layer may form the inner layer facing the tube and the third substrate layer may be the outer layer.
- the first substrate layer may be adjacent the metal tube forming the innermost layer of the heating assembly.
- the tube may be made from stainless-steel.
- the tube may have a length of between 10 mm and 35 mm, preferably between 12 mm and 30 mm, preferably between 13 mm and 22 mm.
- the tube may be a hollow tube.
- the hollow tube may have an internal diameter of between 4 mm and 9 mm, preferably between 5 mm and 6 mm or between 6.8 mm and 7.5 mm, preferably around 5.35 mm or around 7.3 mm.
- the tube may have a thickness of between 70 ⁇ m and 110 ⁇ m, preferably between 80 ⁇ m and 100 ⁇ m, preferably around 90 ⁇ m.
- the tube may have a cylindrical cross-section.
- the tube may have a circular cross-section.
- the length of the first substrate layer may be equal to or less than the circumference of the tube.
- the first substrate layer may fully wrap around the tube.
- the first substrate layer may wrap around the tube once such that the surface of the tube is covered by the first substrate layer after the first substrate layer has been wrapped around the tube.
- the tube of the heating chamber may have a thickness of between 70 ⁇ m and 110 ⁇ m, preferably between 80 ⁇ m and 100 ⁇ m, preferably around 90 ⁇ m.
- the temperature sensor may be an NTC, a Pt100 or preferably a Pt1000 temperature sensor.
- the temperature sensor may be attached to the second substrate layer by means of an adhesive layer.
- the temperature sensor may be photo-printed onto the second substrate layer. Chemical etching may be utilized for forming one or both of the heating tracks of the heating element and the temperature sensor tracks. Subsequently, the contacts of the temperature sensor may be welded on the temperature sensor tracks through the openings in the third substrate layer.
- the temperature sensor may be positioned on the second substrate layer such that when the heating assembly is rolled up, the temperature sensor may be positioned in an area corresponding to the centre of the first substrate layer.
- the heating element may be mapping the temperature sensor so that the temperature sensor is positioned adjacent the hottest part of the heating element.
- the hottest part adjacent the temperature sensor may be the centre of the first substrate layer.
- the heating element may be arranged at the center of the first substrate layer.
- the temperature sensor may be arranged directly adjacent the heating element only distanced from the heating element by the thickness of the second substrate layer.
- a first adhesive layer may be provided between the first substrate layer and the heating element
- a second adhesive layer may be provided between the heating element and the second substrate layer
- a third adhesive layer may be provided between the second adhesive layer and the temperature sensor, and
- a fourth adhesive layer may be provided between the temperature sensor and the third substrate layer.
- the first adhesive layer may facilitate attachment between the first substrate layer and the heating element.
- the first adhesive layer may further facilitate attachment between the first substrate layer and the second substrate layer in the area of the first substrate layer not covered by the heating element.
- the second adhesive layer may facilitate attachment between the heating element and the second substrate layer.
- the third adhesive layer may facilitate attachment between the second substrate layer and the temperature sensor.
- the third adhesive layer may further facilitate attachment between the second substrate layer and the third substrate layer in the area of the third adhesive layer not covered by the temperature sensor.
- the fourth adhesive layer may facilitate attachment between the temperature sensor and the third substrate layer.
- One or more of the adhesive layers may have a thickness of between 2 ⁇ m and 10 ⁇ m, preferably between 3 ⁇ m and 7 ⁇ m, more preferably around 5 ⁇ m.
- One or more of the adhesive layers may be a silicon-based adhesive layer.
- the adhesive layer may comprise one or both of PEEK-based adhesives and acrylic adhesives.
- first substrate layer, the second substrate layer and the third substrate layer may comprise a polyamide or polyimide film.
- Any of the substrate layers may be made from polyimide or polyamide.
- the substrate layers may be configured to withstand between 220 °C and 320 °C, preferably between 240 °C and 300 °C, preferably around 280 °C. Any of the substrate layers may be made from Pyralux.
- a heat shrink layer may be arranged around the heating assembly.
- the heat shrink layer may be arranged around the heating assembly when the heating assembly is rolled into the tubular shape.
- the heat shrink layer may be configured to shrink when heated.
- the heat shrink layer may securely hold the heating assembly together.
- the heat shrink layer may be configured to apply a uniform inwards pressure to the heating assembly.
- the heat shrink layer may improve the contact between one or both of the tube and the first substrate layer and the second substrate layer and the third substrate layer.
- the heat shrink layer may hold most or all components of the heating assembly tight together.
- the heat shrink layer may be employed to replace the glue layers or adhesive layers described herein. Alternatively, the heat shrink layer may be employed in addition to the glue layers or adhesive layers described herein.
- the thickness of the heat shrink layer may be between 100 ⁇ m and 300 ⁇ m, preferably around 180 ⁇ m.
- the heat shrink layer may be made of PEEK.
- the heat shrink layer may be made of or comprise one or more of Teflon and PTFE.
- One or more of the substrate layers may have a thickness of between 10 ⁇ m and 50 ⁇ m, preferably between 20 ⁇ m and 30 ⁇ m, more preferably around 25 ⁇ m.
- the heating element may, when preferably made of stainless-steel, have a thickness of between 20 ⁇ m and 60 ⁇ m, preferably between 30 ⁇ m and 50 ⁇ m, more preferably around 40 ⁇ m.
- the heating tracks may, when preferably made of stainless-steel, have a thickness of between 20 ⁇ m and 60 ⁇ m, preferably between 30 ⁇ m and 50 ⁇ m, more preferably around 40 ⁇ m.
- the thermal insulating layer is preferably made of aerogel.
- the invention further relates to an aerosol-generating device comprising the heating assembly as described herein.
- the aerosol-generating device may comprise a cavity for receiving an aerosol-generating article.
- the heating assembly may be arranged at least partly surrounding the cavity.
- a sidewall of the cavity may be formed of the tube described herein, preferably a stainless-steel tube.
- the heating assembly may be mounted on the stainless-steel tube or the tube may be part of the heating assembly and mounted within the housing or an inner frame of the aerosol-generating device.
- the invention further relates to a method for manufacturing a heating assembly for an aerosol-generating device, the method may comprise one or more of the following steps:
- the first substrate layer being an electrically isolating substrate layer
- the second substrate layer being an electrically isolating substrate layer
- the invention further relates to a method for manufacturing a heating assembly for an aerosol-generating device, the method comprising the steps of:
- the first substrate layer being an electrically isolating substrate layer
- the second substrate layer being an electrically isolating substrate layer
- Aerosol generating devices comprise a proximal end through which, in use, an aerosol exits the device.
- the proximal end of the aerosol generating device may also be referred to as the mouth end or the downstream end.
- the mouth end is downstream of the distal end.
- the distal end of the aerosol generating article may also be referred to as the upstream end.
- Components, or portions of components, of the aerosol generating device may be described as being upstream or downstream of one another based on their relative positions with respect to the airflow path of the aerosol generating device.
- the heating element may comprise an electrically resistive material.
- Suitable electrically resistive materials include but are not limited to: semiconductors such as doped ceramics, electrically "conductive" ceramics (such as, for example, molybdenum disilicide) , carbon, graphite, metals, metal alloys and composite materials made of a ceramic material and a metallic material.
- Such composite materials may comprise doped or undoped ceramics.
- the heating element may comprise an external heating element, where "external” refers to the aerosol-forming substrate.
- An external heating element may take any suitable form.
- an external heating element may take the form of one or more flexible heating foils or heating tracks on a dielectric substrate, such as polyimide.
- the dielectric substrate is the substrate layer.
- the flexible heating foils or heating tracks can be shaped to conform to the perimeter of the heating chamber.
- an external heating element may take the form of a metallic grid or grids, a flexible printed circuit board, a molded interconnect device (MID) , ceramic heater, flexible carbon fibre heater or may be formed using a coating technique, such as plasma vapour deposition, on the suitable shaped substrate layer.
- MID molded interconnect device
- An external heating element may also be formed using a metal having a defined relationship between temperature and resistivity.
- the metal may be formed as a track between the first substrate layer and the second substrate layer.
- An external heating element formed in this manner may be used to both heat and monitor the temperature of the external heating element during operation.
- the heating element advantageously heats the aerosol-forming substrate by means of conduction.
- the heat from either an internal or external heating element may be conducted to the substrate by means of a heat conductive element.
- the aerosol-forming substrate may be completely contained within the aerosol-generating device. In that case, a user may puff on a mouthpiece of the aerosol-generating device.
- a smoking article containing the aerosol-forming substrate may be partially contained within the aerosol-generating device. In that case, the user may puff directly on the smoking article.
- the heating element may be configured as an induction heating element.
- the induction heating element may comprise an induction coil and a susceptor.
- a susceptor is a material that is capable of generating heat, when penetrated by an alternating magnetic field.
- the susceptor may be electrically conductive or magnetic or both electrically conductive and magnetic.
- An alternating magnetic field generated by one or several induction coils heat the susceptor, which then transfers the heat to the aerosol-forming substrate, such that an aerosol is formed.
- the heat transfer may be mainly by conduction of heat. Such a transfer of heat is best, if the susceptor is in close thermal contact with the aerosol-forming substrate.
- the induction heating element may be configured as an external heater as described herein.
- the susceptor element is preferably configured as a cylindrical susceptor at least partly surrounding the heating chamber.
- the heating tracks described herein may be configured as a susceptor.
- the susceptor may be arranged between the first substrate layer and the second substrate layer. The second portion of the substrate layer may be surrounded by the induction coil.
- the susceptor as well as the induction coil may be part of the heating assembly.
- the aerosol-generating device comprises a power supply configured to supply power to the one or both of the heating element and the heating assembly.
- the power supply preferably comprises a power source.
- the power source is a battery, such as a lithium ion battery.
- the power source may be another form of charge storage device such as a capacitor.
- the power source may require recharging.
- the power source may have sufficient capacity to allow for the continuous generation of aerosol for a period of around six minutes or for a period that is a multiple of six minutes.
- the power source may have sufficient capacity to allow for a predetermined number of puffs or discrete activations of the heating assembly.
- the aerosol-generating device may comprise control electronics.
- the control electronics may comprise a microcontroller.
- the microcontroller is preferably a programmable microcontroller.
- the electric circuitry may comprise further electronic components.
- the electric circuitry may be configured to regulate a supply of power to the heating assembly. Power may be supplied to the heating assembly continuously following activation of the system or may be supplied intermittently, such as on a puff-by-puff basis. The power may be supplied to the heating assembly in the form of pulses of electrical current.
- the control electronics may comprise a printed circuit board.
- the control electronics may be configured as a printed circuit board.
- the temperature sensor may be electrically connected with the control electronics.
- the length of the electrical connections between the temperature sensor and the control electronics may be longer than the distance between the temperature sensor and the control electronics. This may have the beneficial effect of preventing a detrimental effect on the electrical contact between the temperature sensor and the control electronics due to thermal expansion of the contacts during operation of the aerosol-generating device.
- the electrical connections are preferably configured as electrical wires.
- the length of the electrical connections between the heating element and the control electronics may be longer than the distance between the heating element and the control electronics. This may have the beneficial effect of preventing a detrimental effect on the electrical contact between the heating element and the control electronics due to thermal expansion of the contacts during operation of the aerosol-generating device.
- the electrical connections are preferably configured as electrical wires.
- aerosol-forming substrate refers to a substrate capable of releasing volatile compounds that can form an aerosol.
- the volatile compounds may be released by heating or combusting the aerosol-forming substrate.
- volatile compounds may be released by a chemical reaction or by a mechanical stimulus, such as ultrasound.
- the aerosol-forming substrate may be solid or liquid or may comprise both solid and liquid components.
- An aerosol-forming substrate may be part of an aerosol-generating article.
- aerosol-generating article refers to an article comprising an aerosol-forming substrate that is capable of releasing volatile compounds that can form an aerosol.
- An aerosol-generating article may be disposable.
- aerosol-generating device refers to a device that interacts with an aerosol-forming substrate to generate an aerosol.
- An aerosol-generating device may interact with one or both of an aerosol-generating article comprising an aerosol-forming substrate, and a cartridge comprising an aerosol-forming substrate.
- the aerosol-generating device may heat the aerosol-forming substrate to facilitate release of volatile compounds from the substrate.
- An electrically operated aerosol-generating device may comprise an atomiser, such as an electric heater, to heat the aerosol-forming substrate to form an aerosol.
- aerosol-generating system refers to the combination of an aerosol-generating device with an aerosol-forming substrate.
- aerosol-generating system refers to the combination of the aerosol-generating device with the aerosol-generating article.
- the aerosol-forming substrate and the aerosol-generating device cooperate to generate an aerosol.
- Fig. 1 shows the heating assembly
- Fig. 2 shows layers making up the heating assembly
- Fig. 3 shows layers making up the heating assembly including a third insulating layer
- Fig. 4 shows a different perspective of the heating assembly and particularly the electrical connections.
- FIG. 1 shows a heating assembly 10.
- the heating assembly 10 comprises a stainless-steel tube 12.
- the stainless-steel tube 12 forms the inner layer of the heating assembly 10.
- the stainless-steel tube 12 is tubular.
- the stainless-steel tube 12 forms a heating chamber 14 such that an aerosol-generating article comprising aerosol forming substrate can be placed in the heating chamber 14 to heat the aerosol-forming substrate and to create an inhalable aerosol.
- Figure 1 further shows a first substrate layer 16.
- a heating element 18 in the form of heating tracks is arranged. Electrical heater contacts 20 of the heating element 18 also indicated in Figure 1.
- a first adhesive layer 22 is arranged for an attachment between the first substrate layer 16 and the heating element 18. Additionally, the surface area of the first substrate layer 16 not covered with the heating element 18 may be attached to the second substrate layer 24 via the first adhesive layer 22.
- Figure 1 further shows the second substrate layer 24.
- a second adhesive layer 26 is arranged on the second substrate layer 24.
- the second adhesive layer 26 has the function of enabling an attachment between the second substrate layer 24 and a temperature sensor 28.
- the second adhesive layer 26 further facilitates the attachment between the second substrate layer 24 and sensor contacts 30 of the temperature sensor 28.
- the second adhesive layer 26 facilitates the attachment between the second substrate layer 24 and a third substrate layer 38.
- the third substrate layer 38 is arranged over the temperature sensor 28 as described in more detail below with reference to Figure 3.
- the third substrate layer 38 is not depicted in Figure 1.
- a heat shrink layer 32 is placed over the heating assembly 10. Heating of the heat shrink layer 32 facilitates a secure holding of all components of the heating assembly 10.
- FIG. 2 shows the layers of the heating assembly 10 in more detail.
- the inner layers formed by the stainless-steel tube 12.
- a tube adhesive layer 34 is utilized to connect the stainless-steel tube 12 with the first substrate layer 16.
- the heating element 18 is arranged on the first substrate layer 16 versus the first adhesive layer 22.
- a heater adhesive layer 36 is arranged between the heating element 18 and the second substrate layer 24, a heater adhesive layer 36 is arranged.
- the temperature sensor 28 is arranged on the second substrate layer 24 via the second adhesive layer 26.
- Figure 2 further shows the preferred thicknesses of all layers.
- Figure 3 shows the additional placement of a third substrate layer 38 over the temperature sensor 28 via a sensor adhesive layer 40.
- a sensor adhesive layer 40 In the third substrate layer 38 at least two openings 42 are provided to enable sensor contacts 30 to be contacted through the third substrate layer 38.
- Figure 3 further shows the preferred thicknesses of all layers.
- Figure 4 shows a different perspective of the heating assembly 10 seen from the top and before the heating assembly 10 is rolled into a tubular shape.
- the heating tracks of the heating element 18 are depicted in Figure 4.
- Two heater contacts 20 are provided to enable the supply of electrical energy to the heating element 18.
- two sensor contacts 30 are provided for electrically contacting the temperature sensor 28.
- Openings in the third substrate layer 38 are indicated in Figure 4 which enable contacting the temperature sensor 28 via the sensor contacts 30.
- Figure 4 indicates a third opening in the middle of the third substrate layer 38 to increase the mechanical strength of the connections of the temperature sensor 28, since the contacts can come into contact with the sensor adhesive layer 40 through this opening.
Landscapes
- Resistance Heating (AREA)
Abstract
Description
Claims (15)
- A heating assembly for an aerosol-generating device, the heating assembly comprising:a first substrate layer, the first substrate layer being an electrically isolating substrate layer,a heating element, wherein the heating element is arranged on the first substrate layer,a second substrate layer, the second substrate layer being an electrically isolating substrate layer, wherein the second substrate layer is arranged covering the heating element and the first substrate layer,a temperature sensor, wherein the temperature sensor is arranged on the second substrate layer,a third substrate layer, the third substrate layer being an electrically isolating substrate layer, wherein the third substrate layer is arranged at least partly covering the temperature sensor and covering the second substrate layer.
- The heating assembly according to claim 1, wherein the heating element is a resistive heater.
- The heating assembly according to any of the preceding claims, wherein the heating element comprise a heating track, preferably wherein the heating element is a heating track.
- The heating assembly according to any of the preceding claims, wherein the heating element is printed on the first substrate layer.
- The heating assembly according to any of the preceding claims, wherein the heating assembly is rolled into a tube.
- The heating assembly according to any of the preceding claims, wherein the temperature sensor comprises two contacts.
- The heating assembly according to any of the preceding claims, wherein the third substrate layer comprises at least two openings.
- The heating assembly according to the two preceding claims, wherein the two openings are aligned such that the two contacts are not covered by the third substrate layer.
- The heating assembly according to any of the preceding claims, wherein a heat shrink layer is arranged around the heating assembly, wherein the heat shrink layer is preferably made of PEEK.
- The heating assembly according to any of the preceding claims, wherein one or more of:- a first adhesive layer is provided between the first substrate layer and the heating element,- a second adhesive layer is provided between the heating element and the second substrate layer,- a third adhesive layer is provided between the second adhesive layer and the temperature sensor, and- a fourth adhesive layer is provided between the temperature sensor and the third substrate layer.
- The heating assembly according to any of the preceding claims, wherein one or more of the first substrate layer, the second substrate layer and the third substrate layer comprise a polyamide film.
- An aerosol-generating device comprising the heating assembly according to any of the preceding claims.
- The aerosol-generating device according to the preceding claim, wherein the aerosol-generating device comprises a cavity for receiving an aerosol-generating article, and wherein the heating assembly is arranged at least partly surrounding the cavity.
- The aerosol-generating device according to the preceding claim, wherein a sidewall of the cavity is formed of a stainless-steel tube, and wherein the heating assembly is mounted on the stainless-steel tube.
- A method for manufacturing a heating assembly for an aerosol-generating device, the method comprising the steps of:providing a first substrate layer, the first substrate layer being an electrically isolating substrate layer,arranging a heating element on the first substrate layer,arranging a second substrate layer covering the heating element and the first substrate layer, the second substrate layer being an electrically isolating substrate layer,arranging a temperature sensor on the second substrate layer,arranging a third substrate layer at least partly covering the temperature sensor and covering the second substrate layer, the third substrate layer being an electrically isolating substrate layer.
Priority Applications (15)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP21790061.2A EP4422436A1 (en) | 2021-10-25 | 2021-10-25 | Heating assembly for aerosol-generating device |
JP2024524409A JP2024538813A (en) | 2021-10-25 | 2021-10-25 | Heating assembly for an aerosol generating device |
KR1020247013472A KR20240089020A (en) | 2021-10-25 | 2021-10-25 | Heating assembly for aerosol-generating devices |
CN202180102631.2A CN117999001A (en) | 2021-10-25 | 2021-10-25 | Heating assembly for an aerosol-generating device |
PCT/CN2021/126067 WO2023070259A1 (en) | 2021-10-25 | 2021-10-25 | Heating assembly for aerosol-generating device |
CN202180102538.1A CN117979844A (en) | 2021-10-22 | 2021-11-05 | Method for manufacturing a heating assembly for an aerosol-generating device |
JP2024523476A JP2024537908A (en) | 2021-10-22 | 2021-11-05 | Method for manufacturing a heating assembly for an aerosol generating device - Patent application |
KR1020247012917A KR20240090203A (en) | 2021-10-22 | 2021-11-05 | Method for manufacturing a heating assembly for an aerosol-generating device |
EP21798253.7A EP4418912A1 (en) | 2021-10-22 | 2021-11-05 | Method for manufacturing a heating assembly for an aerosol-generating device |
PCT/CN2021/129057 WO2023065407A1 (en) | 2021-10-22 | 2021-11-05 | Method for manufacturing a heating assembly for an aerosol-generating device |
JP2024524410A JP2024538814A (en) | 2021-10-25 | 2022-09-27 | Heating assembly with side extensions |
CN202280066581.1A CN118042951A (en) | 2021-10-25 | 2022-09-27 | Heating assembly with side extensions |
EP22786273.7A EP4422438A1 (en) | 2021-10-25 | 2022-09-27 | Heating assembly with side extensions |
PCT/CN2022/121696 WO2023071668A1 (en) | 2021-10-25 | 2022-09-27 | Heating assembly with side extensions |
KR1020247013309A KR20240093496A (en) | 2021-10-25 | 2022-09-27 | Heating assembly with side extensions |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2021/126067 WO2023070259A1 (en) | 2021-10-25 | 2021-10-25 | Heating assembly for aerosol-generating device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2023070259A1 true WO2023070259A1 (en) | 2023-05-04 |
Family
ID=78516441
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2021/126067 WO2023070259A1 (en) | 2021-10-22 | 2021-10-25 | Heating assembly for aerosol-generating device |
PCT/CN2022/121696 WO2023071668A1 (en) | 2021-10-25 | 2022-09-27 | Heating assembly with side extensions |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2022/121696 WO2023071668A1 (en) | 2021-10-25 | 2022-09-27 | Heating assembly with side extensions |
Country Status (5)
Country | Link |
---|---|
EP (2) | EP4422436A1 (en) |
JP (2) | JP2024538813A (en) |
KR (2) | KR20240089020A (en) |
CN (2) | CN117999001A (en) |
WO (2) | WO2023070259A1 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2018194291A2 (en) * | 2017-04-18 | 2018-10-25 | 주식회사 아모센스 | Heater for cigarette-type electronic cigarette device |
KR20190030262A (en) * | 2017-09-13 | 2019-03-22 | 전자부품연구원 | Electric heating type smoking device using printed temperature sensor |
WO2021043689A1 (en) * | 2019-09-06 | 2021-03-11 | Jt International Sa | Thin film heater |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
PL3282873T3 (en) * | 2015-04-13 | 2020-06-01 | G.D. S.P.A | Electric cartridge for electronic cigarette and electronic cigarette |
EP3409467B1 (en) * | 2017-05-30 | 2019-07-03 | Heraeus Nexensos GmbH | Heater with a co-sintered multi-layer structure |
KR20220056854A (en) * | 2019-09-06 | 2022-05-06 | 제이티 인터내셔널 소시에떼 아노님 | heater assembly |
-
2021
- 2021-10-25 KR KR1020247013472A patent/KR20240089020A/en active Search and Examination
- 2021-10-25 WO PCT/CN2021/126067 patent/WO2023070259A1/en active Application Filing
- 2021-10-25 EP EP21790061.2A patent/EP4422436A1/en active Pending
- 2021-10-25 CN CN202180102631.2A patent/CN117999001A/en active Pending
- 2021-10-25 JP JP2024524409A patent/JP2024538813A/en active Pending
-
2022
- 2022-09-27 KR KR1020247013309A patent/KR20240093496A/en unknown
- 2022-09-27 JP JP2024524410A patent/JP2024538814A/en active Pending
- 2022-09-27 EP EP22786273.7A patent/EP4422438A1/en active Pending
- 2022-09-27 WO PCT/CN2022/121696 patent/WO2023071668A1/en active Application Filing
- 2022-09-27 CN CN202280066581.1A patent/CN118042951A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018194291A2 (en) * | 2017-04-18 | 2018-10-25 | 주식회사 아모센스 | Heater for cigarette-type electronic cigarette device |
KR20190030262A (en) * | 2017-09-13 | 2019-03-22 | 전자부품연구원 | Electric heating type smoking device using printed temperature sensor |
WO2021043689A1 (en) * | 2019-09-06 | 2021-03-11 | Jt International Sa | Thin film heater |
Also Published As
Publication number | Publication date |
---|---|
JP2024538813A (en) | 2024-10-23 |
CN117999001A (en) | 2024-05-07 |
EP4422438A1 (en) | 2024-09-04 |
CN118042951A (en) | 2024-05-14 |
EP4422436A1 (en) | 2024-09-04 |
WO2023071668A1 (en) | 2023-05-04 |
KR20240093496A (en) | 2024-06-24 |
KR20240089020A (en) | 2024-06-20 |
JP2024538814A (en) | 2024-10-23 |
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