WO2022226796A1 - Silicone pressure sensitive adhesive, composition and method for its preparation, and use in a flexible display device - Google Patents
Silicone pressure sensitive adhesive, composition and method for its preparation, and use in a flexible display device Download PDFInfo
- Publication number
- WO2022226796A1 WO2022226796A1 PCT/CN2021/090313 CN2021090313W WO2022226796A1 WO 2022226796 A1 WO2022226796 A1 WO 2022226796A1 CN 2021090313 W CN2021090313 W CN 2021090313W WO 2022226796 A1 WO2022226796 A1 WO 2022226796A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- weight
- alternatively
- composition
- starting materials
- resin
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 108
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 62
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims description 33
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 105
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 52
- 239000007858 starting material Substances 0.000 claims description 92
- 229920005989 resin Polymers 0.000 claims description 79
- 239000011347 resin Substances 0.000 claims description 79
- 239000000758 substrate Substances 0.000 claims description 47
- 125000004432 carbon atom Chemical group C* 0.000 claims description 30
- 239000002904 solvent Substances 0.000 claims description 29
- 239000007809 chemical reaction catalyst Substances 0.000 claims description 24
- 239000000654 additive Substances 0.000 claims description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 15
- 125000000217 alkyl group Chemical group 0.000 claims description 15
- 229910052710 silicon Inorganic materials 0.000 claims description 15
- 239000010703 silicon Substances 0.000 claims description 15
- 239000010410 layer Substances 0.000 claims description 13
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 claims description 11
- 230000000996 additive effect Effects 0.000 claims description 10
- 229930195735 unsaturated hydrocarbon Natural products 0.000 claims description 10
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 9
- 239000003054 catalyst Substances 0.000 claims description 8
- 239000002683 reaction inhibitor Substances 0.000 claims description 8
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 8
- 229920002554 vinyl polymer Polymers 0.000 claims description 8
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 125000001931 aliphatic group Chemical group 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 238000005266 casting Methods 0.000 claims description 4
- AJSTXXYNEIHPMD-UHFFFAOYSA-N triethyl borate Chemical compound CCOB(OCC)OCC AJSTXXYNEIHPMD-UHFFFAOYSA-N 0.000 claims description 4
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 3
- 229910015868 MSiO Inorganic materials 0.000 claims description 3
- 125000006038 hexenyl group Chemical group 0.000 claims description 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 4
- -1 fully unsaturated Chemical group 0.000 description 38
- 150000002430 hydrocarbons Chemical group 0.000 description 21
- 239000003112 inhibitor Substances 0.000 description 21
- 238000012360 testing method Methods 0.000 description 18
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 14
- 230000003287 optical effect Effects 0.000 description 13
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 11
- 239000004945 silicone rubber Substances 0.000 description 11
- 229920000260 silastic Polymers 0.000 description 10
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 9
- 239000004205 dimethyl polysiloxane Substances 0.000 description 9
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 9
- 239000002585 base Substances 0.000 description 8
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 8
- 125000004122 cyclic group Chemical group 0.000 description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 7
- 239000013523 DOWSIL™ Substances 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 229920013731 Dowsil Polymers 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000007795 chemical reaction product Substances 0.000 description 6
- 229910052739 hydrogen Inorganic materials 0.000 description 6
- 239000001257 hydrogen Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 229910052697 platinum Inorganic materials 0.000 description 6
- 238000010998 test method Methods 0.000 description 6
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 5
- 125000003342 alkenyl group Chemical group 0.000 description 5
- 238000005452 bending Methods 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 5
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- 150000004756 silanes Chemical class 0.000 description 4
- 229920002725 thermoplastic elastomer Polymers 0.000 description 4
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 3
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 125000000304 alkynyl group Chemical group 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- 150000001642 boronic acid derivatives Chemical class 0.000 description 3
- 229910002091 carbon monoxide Inorganic materials 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 3
- VZCYOOQTPOCHFL-OWOJBTEDSA-L fumarate(2-) Chemical class [O-]C(=O)\C=C\C([O-])=O VZCYOOQTPOCHFL-OWOJBTEDSA-L 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical group 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 230000007062 hydrolysis Effects 0.000 description 3
- 238000006460 hydrolysis reaction Methods 0.000 description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 3
- 150000002688 maleic acid derivatives Chemical class 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- 125000003944 tolyl group Chemical group 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 2
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical group [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 229910052910 alkali metal silicate Inorganic materials 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 125000006267 biphenyl group Chemical group 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 125000006165 cyclic alkyl group Chemical group 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 2
- RQCQBDUYEHRNPP-UHFFFAOYSA-N dimethyl-bis(2-methylbut-3-yn-2-yloxy)silane Chemical compound C#CC(C)(C)O[Si](C)(C)OC(C)(C)C#C RQCQBDUYEHRNPP-UHFFFAOYSA-N 0.000 description 2
- 238000011067 equilibration Methods 0.000 description 2
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical class C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- CRJSCSRODDRNDN-UHFFFAOYSA-N methyl-tris(2-methylbut-3-yn-2-yloxy)silane Chemical compound C#CC(C)(C)O[Si](C)(OC(C)(C)C#C)OC(C)(C)C#C CRJSCSRODDRNDN-UHFFFAOYSA-N 0.000 description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000013557 residual solvent Substances 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 239000013464 silicone adhesive Substances 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 150000003852 triazoles Chemical class 0.000 description 2
- HMVBQEAJQVQOTI-SOFGYWHQSA-N (e)-3,5-dimethylhex-3-en-1-yne Chemical compound CC(C)\C=C(/C)C#C HMVBQEAJQVQOTI-SOFGYWHQSA-N 0.000 description 1
- GRGVQLWQXHFRHO-AATRIKPKSA-N (e)-3-methylpent-3-en-1-yne Chemical compound C\C=C(/C)C#C GRGVQLWQXHFRHO-AATRIKPKSA-N 0.000 description 1
- QFMZQPDHXULLKC-UHFFFAOYSA-N 1,2-bis(diphenylphosphino)ethane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)CCP(C=1C=CC=CC=1)C1=CC=CC=C1 QFMZQPDHXULLKC-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- GDKOYYDQISQOMH-UHFFFAOYSA-N 1-ethynylcyclohexan-1-amine Chemical compound C#CC1(N)CCCCC1 GDKOYYDQISQOMH-UHFFFAOYSA-N 0.000 description 1
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 1
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 1
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 description 1
- GHUKNXGEAKLBCF-UHFFFAOYSA-N 2-cyclohexylethynoxy(2-methylprop-1-enyl)silane Chemical compound CC(C)=C[SiH2]OC#CC1CCCCC1 GHUKNXGEAKLBCF-UHFFFAOYSA-N 0.000 description 1
- CKGFUKMCQWCVTF-UHFFFAOYSA-N 2-cyclohexylethynoxy(trimethyl)silane Chemical compound C[Si](C)(C)OC#CC1CCCCC1 CKGFUKMCQWCVTF-UHFFFAOYSA-N 0.000 description 1
- IHZPGDZOQYVHPH-UHFFFAOYSA-N 2-cyclohexylethynoxy-hex-1-enyl-dimethylsilane Chemical compound CCCCC=C[Si](C)(C)OC#CC1CCCCC1 IHZPGDZOQYVHPH-UHFFFAOYSA-N 0.000 description 1
- XJXLITUVRZECSK-UHFFFAOYSA-N 2-methylprop-1-enyl(2-phenylbut-3-yn-2-yloxy)silane Chemical compound CC(C)=C[SiH2]OC(C)(C#C)C1=CC=CC=C1 XJXLITUVRZECSK-UHFFFAOYSA-N 0.000 description 1
- KSLSOBUAIFEGLT-UHFFFAOYSA-N 2-phenylbut-3-yn-2-ol Chemical compound C#CC(O)(C)C1=CC=CC=C1 KSLSOBUAIFEGLT-UHFFFAOYSA-N 0.000 description 1
- 238000005133 29Si NMR spectroscopy Methods 0.000 description 1
- ZCTILCZSUSTVHT-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-yloxy(trimethyl)silane Chemical compound CC(C)CC(C)(C#C)O[Si](C)(C)C ZCTILCZSUSTVHT-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- CUUQUEAUUPYEKK-UHFFFAOYSA-N 4-ethyloct-1-yn-3-ol Chemical compound CCCCC(CC)C(O)C#C CUUQUEAUUPYEKK-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 241001161843 Chandra Species 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- XMSXQFUHVRWGNA-UHFFFAOYSA-N Decamethylcyclopentasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 XMSXQFUHVRWGNA-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-UHFFFAOYSA-N Di-Et ester-Fumaric acid Natural products CCOC(=O)C=CC(=O)OCC IEPRKVQEAMIZSS-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-WAYWQWQTSA-N Diethyl maleate Chemical compound CCOC(=O)\C=C/C(=O)OCC IEPRKVQEAMIZSS-WAYWQWQTSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 229920003354 Modic® Polymers 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- QODJQAPYENPFSO-UHFFFAOYSA-N [Rh+].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 Chemical compound [Rh+].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 QODJQAPYENPFSO-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 125000004423 acyloxy group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000002178 anthracenyl group Chemical group C1(=CC=CC2=CC3=CC=CC=C3C=C12)* 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- GXWXVPLULLDSQD-UHFFFAOYSA-N benzhydryl(2-cyclohexylethynoxy)silane Chemical compound C1CCCCC1C#CO[SiH2]C(C=1C=CC=CC=1)C1=CC=CC=C1 GXWXVPLULLDSQD-UHFFFAOYSA-N 0.000 description 1
- UGCRVOQFQNFERL-UHFFFAOYSA-N benzhydryl(2-phenylbut-3-yn-2-yloxy)silane Chemical compound C=1C=CC=CC=1C(C)(C#C)O[SiH2]C(C=1C=CC=CC=1)C1=CC=CC=C1 UGCRVOQFQNFERL-UHFFFAOYSA-N 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- GVTGUOINIMHIRT-WAYWQWQTSA-N bis(1-methoxypropan-2-yl) (z)-but-2-enedioate Chemical compound COCC(C)OC(=O)\C=C/C(=O)OC(C)COC GVTGUOINIMHIRT-WAYWQWQTSA-N 0.000 description 1
- ZPOLOEWJWXZUSP-AATRIKPKSA-N bis(prop-2-enyl) (e)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C\C(=O)OCC=C ZPOLOEWJWXZUSP-AATRIKPKSA-N 0.000 description 1
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 description 1
- GKPOMITUDGXOSB-UHFFFAOYSA-N but-3-yn-2-ol Chemical compound CC(O)C#C GKPOMITUDGXOSB-UHFFFAOYSA-N 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000000480 butynyl group Chemical group [*]C#CC([H])([H])C([H])([H])[H] 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000013036 cure process Methods 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- MNFGEHQPOWJJBH-UHFFFAOYSA-N diethoxy-methyl-phenylsilane Chemical compound CCO[Si](C)(OCC)C1=CC=CC=C1 MNFGEHQPOWJJBH-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-AATRIKPKSA-N diethyl fumarate Chemical compound CCOC(=O)\C=C\C(=O)OCC IEPRKVQEAMIZSS-AATRIKPKSA-N 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- CVQVSVBUMVSJES-UHFFFAOYSA-N dimethoxy-methyl-phenylsilane Chemical compound CO[Si](C)(OC)C1=CC=CC=C1 CVQVSVBUMVSJES-UHFFFAOYSA-N 0.000 description 1
- XUKFPAQLGOOCNJ-UHFFFAOYSA-N dimethyl(trimethylsilyloxy)silicon Chemical compound C[Si](C)O[Si](C)(C)C XUKFPAQLGOOCNJ-UHFFFAOYSA-N 0.000 description 1
- HEKCLFBKPBNPEA-UHFFFAOYSA-N dimethyl-(2-methylbut-3-yn-2-yloxy)-phenylsilane Chemical compound C#CC(C)(C)O[Si](C)(C)C1=CC=CC=C1 HEKCLFBKPBNPEA-UHFFFAOYSA-N 0.000 description 1
- PUMXRKCXGXELTP-UHFFFAOYSA-N dimethyl-phenyl-(2-phenylbut-3-yn-2-yloxy)silane Chemical compound C=1C=CC=CC=1C(C)(C#C)O[Si](C)(C)C1=CC=CC=C1 PUMXRKCXGXELTP-UHFFFAOYSA-N 0.000 description 1
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- KPWVUBSQUODFPP-UHFFFAOYSA-N ethenyl-(ethenyl-methyl-phenylsilyl)oxy-methyl-phenylsilane Chemical compound C=1C=CC=CC=1[Si](C)(C=C)O[Si](C)(C=C)C1=CC=CC=C1 KPWVUBSQUODFPP-UHFFFAOYSA-N 0.000 description 1
- NFDITRFZTVIWOM-UHFFFAOYSA-N ethenylsilyl acetate Chemical compound CC(=O)O[SiH2]C=C NFDITRFZTVIWOM-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- XLYMOEINVGRTEX-UHFFFAOYSA-N fumaric acid monoethyl ester Natural products CCOC(=O)C=CC(O)=O XLYMOEINVGRTEX-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- OEAGVCHVQWNBCD-UHFFFAOYSA-N hex-1-enyl-dimethyl-(2-methylbut-3-yn-2-yloxy)silane Chemical compound CCCCC=C[Si](C)(C)OC(C)(C)C#C OEAGVCHVQWNBCD-UHFFFAOYSA-N 0.000 description 1
- JWFPHSIMAILTFM-UHFFFAOYSA-N hex-1-enyl-dimethyl-(2-phenylbut-3-yn-2-yloxy)silane Chemical compound CCCCC=C[Si](C)(C)OC(C)(C#C)C1=CC=CC=C1 JWFPHSIMAILTFM-UHFFFAOYSA-N 0.000 description 1
- 150000004687 hexahydrates Chemical class 0.000 description 1
- HTDJPCNNEPUOOQ-UHFFFAOYSA-N hexamethylcyclotrisiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O1 HTDJPCNNEPUOOQ-UHFFFAOYSA-N 0.000 description 1
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- NYMPGSQKHIOWIO-UHFFFAOYSA-N hydroxy(diphenyl)silicon Chemical compound C=1C=CC=CC=1[Si](O)C1=CC=CC=C1 NYMPGSQKHIOWIO-UHFFFAOYSA-N 0.000 description 1
- 239000000543 intermediate Substances 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- DMDPEWNPPFMQBF-UHFFFAOYSA-N methyl-bis(2-methylbut-3-yn-2-yloxy)-(3,3,3-trifluoropropyl)silane Chemical compound C#CC(C)(C)O[Si](C)(CCC(F)(F)F)OC(C)(C)C#C DMDPEWNPPFMQBF-UHFFFAOYSA-N 0.000 description 1
- QXLPXWSKPNOQLE-UHFFFAOYSA-N methylpentynol Chemical compound CCC(C)(O)C#C QXLPXWSKPNOQLE-UHFFFAOYSA-N 0.000 description 1
- 125000002950 monocyclic group Chemical group 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- ILBIXZPOMJFOJP-UHFFFAOYSA-N n,n-dimethylprop-2-yn-1-amine Chemical compound CN(C)CC#C ILBIXZPOMJFOJP-UHFFFAOYSA-N 0.000 description 1
- HQFYIDOMCULPIW-UHFFFAOYSA-N n-methylprop-2-yn-1-amine Chemical compound CNCC#C HQFYIDOMCULPIW-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004344 phenylpropyl group Chemical group 0.000 description 1
- CHOLPKIHPFNIPE-UHFFFAOYSA-N phosphanylphosphane rhodium Chemical compound [Rh].PP CHOLPKIHPFNIPE-UHFFFAOYSA-N 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- JKANAVGODYYCQF-UHFFFAOYSA-N prop-2-yn-1-amine Chemical compound NCC#C JKANAVGODYYCQF-UHFFFAOYSA-N 0.000 description 1
- TVDSBUOJIPERQY-UHFFFAOYSA-N prop-2-yn-1-ol Chemical compound OCC#C TVDSBUOJIPERQY-UHFFFAOYSA-N 0.000 description 1
- 125000002568 propynyl group Chemical group [*]C#CC([H])([H])[H] 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 125000005373 siloxane group Chemical group [SiH2](O*)* 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- VNRWTCZXQWOWIG-UHFFFAOYSA-N tetrakis(trimethylsilyl) silicate Chemical compound C[Si](C)(C)O[Si](O[Si](C)(C)C)(O[Si](C)(C)C)O[Si](C)(C)C VNRWTCZXQWOWIG-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- LGQXXHMEBUOXRP-UHFFFAOYSA-N tributyl borate Chemical compound CCCCOB(OCCCC)OCCCC LGQXXHMEBUOXRP-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- CAAPVQVUCVXKKS-UHFFFAOYSA-N triethyl(2-methylbut-3-yn-2-yloxy)silane Chemical compound CC[Si](CC)(CC)OC(C)(C)C#C CAAPVQVUCVXKKS-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical group CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 1
- WRECIMRULFAWHA-UHFFFAOYSA-N trimethyl borate Chemical compound COB(OC)OC WRECIMRULFAWHA-UHFFFAOYSA-N 0.000 description 1
- JNRUXZIXAXHXTN-UHFFFAOYSA-N trimethyl(2-methylbut-3-yn-2-yloxy)silane Chemical compound C#CC(C)(C)O[Si](C)(C)C JNRUXZIXAXHXTN-UHFFFAOYSA-N 0.000 description 1
- 239000005051 trimethylchlorosilane Substances 0.000 description 1
- PQDJYEQOELDLCP-UHFFFAOYSA-N trimethylsilane Chemical compound C[SiH](C)C PQDJYEQOELDLCP-UHFFFAOYSA-N 0.000 description 1
- 239000011995 wilkinson's catalyst Substances 0.000 description 1
- UTODFRQBVUVYOB-UHFFFAOYSA-P wilkinson's catalyst Chemical compound [Cl-].C1=CC=CC=C1P(C=1C=CC=CC=1)(C=1C=CC=CC=1)[Rh+](P(C=1C=CC=CC=1)(C=1C=CC=CC=1)C=1C=CC=CC=1)P(C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 UTODFRQBVUVYOB-UHFFFAOYSA-P 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Definitions
- This invention relates to a silicone pressure sensitive adhesive and methods for its preparation and use. More particularly, this invention relates to a hydrosilylation curable composition that cures to from a silicone pressure sensitive adhesive suitable for use in a flexible display device.
- Flexible display devices that can be deformed, e.g., by bending, folding, winding, rolling up, or stretching are being developed. Flexible display devices can be deformed depending on the needs of the consumer or the situations where the flexible display device is used. Typically, various components of display devices are made with multiple layers, and it is important for the layers to adhere to one another and not suffer damage causing failure of the component when the flexible display device is deformed.
- LSRs liquid silicone rubbers
- HCRs high consistency rubbers
- LSRs include SILASTIC TM 9202-50 LSR, SILASTIC TM LCF 3760, and SILASTIC TM LCF 3600.
- Optical LSRs include SILASTIC TM MS-1001, MS-1002, MS-1003, MS-4001, MS-4002 and MS-4007, which are moldable optical silicone elastomers, and SYLGARD TM 182, 184 and 186, which are also optical silicone elastomers.
- HCRs include XIAMETER TM RBB-2030-40EN, XIAMETER TM RBB-6660-60EN, XIAMETER TM RBB-2002-30 Base, XIAMETER TM RBB-2004-60, and XIAMETER TM RBB-2220-70.
- Filled silicone elastomers such as DOWSIL TM VE-8001 Flexible Silicone Adhesive are also suitable. All of these silicone elastomers are commercially available from Dow Silicones Corporation of Midland, Michigan, USA.
- silicone elastomers such as those described above, may suffer from the drawback of being difficult to adhere to other layers in flexible display devices. Therefore, there is an industry need for a silicone pressure sensitive adhesive that can adhere to a silicone elastomer and that does not cause failure in a flexible display device.
- a hydrosilylation reaction curable composition is capable of forming a silicone pressure sensitive adhesive.
- a method for making the composition, and a method for fabricating an article using the composition, are provided.
- the article may comprise a component of a flexible display device.
- Figure 1 shows a partial cross section of a component of a flexible display device 100.
- the hydrosilylation reaction curable composition for forming the silicone pressure sensitive adhesive comprises:
- each R M is an independently selected monovalent hydrocarbon group of 1 to 30 carbon atoms that is free of aliphatic unsaturation; each subscript a’ has a value sufficient to give the polydiorganosiloxane gum a plasticity of 20 mil (0.51 mm) to 80 mil (2.03 mm) ;
- (D) a polyorganohydrogensiloxane of unit formula: (R M 2 SiO 2/2 ) e (HR M SiO 2/2 ) f , (R M 2 HSiO 1/2 ) g (R M 3 SiO 1/2 ) h ; where subscript e ⁇ 0, subscript f ⁇ 0, a quantity (e + f) is 4 to 500, subscript g is 0, 1, or 2, subscript h is 0, 1, or 2, a quantity (g + h) 2, and a quantity (f + g) ⁇ 3; where (D) the polyorganohydrogensiloxane is present in an amount sufficient to provide a mole ratio of silicon bonded hydrogen atoms to aliphatically unsaturated hydrocarbon groups of (A) the polydiorganosiloxane gum, ⁇ (D) : (A) ratio ⁇ , of 22.0: 1 to 57.8: 1;
- the hydrosilylation reaction curable composition comprises (A) the polydiorganosiloxane gum component.
- the polydiorganosiloxane gum component comprises: (A-1) the aliphatically unsaturated polydiorganosiloxane gum and (A-2) the hydroxyl-terminated polydiorganosiloxane gum.
- Starting material (A-1) the aliphatically unsaturated polydiorganosiloxane gum, has unit formula: (R M 2 R U SiO 1/2 ) 2 (R M 2 SiO 2/2 ) a , where each R M is an independently selected monovalent hydrocarbon group of 1 to 30 carbon atoms that is free of aliphatic unsaturation; each R U is an independently selected monovalent aliphatically unsaturated hydrocarbon group of 2 to 30 carbon atoms; and subscript a has a value sufficient to give (A-1) the aliphatically unsaturated polydiorganosiloxane gum the plasticity of 20 mil (0.51 mm) to 80 mil (0.203 mm) , alternatively 30 mil (0.76 mm) to 70 mil (1.78 mm) , and alternatively 55 mil (1.40 mm) to 65 mil (1.65 mm) , where plasticity is measured based on ASTM D926 by applying 1 kg load to a spherical sample of 4.2 g
- each R M is an independently selected monovalent hydrocarbon group of 1 to 30 carbon atoms that is free of aliphatic unsaturation. Alternatively, each R M may have 1 to 12 carbon atoms, and alternatively 1 to 6 carbon atoms. Suitable monovalent hydrocarbon groups for R M are exemplified by alkyl groups and aromatic groups such as aryl groups and aralkyl groups. “Alkyl” means a cyclic, branched, or unbranched, saturated monovalent hydrocarbon group.
- Alkyl is exemplified by, but not limited to, methyl, ethyl, propyl (e.g., iso-propyl and/or n-propyl) , butyl (e.g., isobutyl, n-butyl, tert-butyl, and/or sec-butyl) , pentyl (e.g., isopentyl, neopentyl, and/or tert-pentyl) , hexyl, heptyl, octyl, nonyl, and decyl, and branched alkyl groups of 6 or more carbon atoms; and cyclic alkyl groups such as cyclopentyl and cyclohexyl.
- propyl e.g., iso-propyl and/or n-propyl
- butyl e.g., isobutyl, n-butyl, ter
- Aryl means a cyclic, fully unsaturated, hydrocarbon group.
- Aryl is exemplified by, but not limited to, cyclopentadienyl, phenyl, anthracenyl, and naphthyl.
- Monocyclic aryl groups may have 5 to 9 carbon atoms, alternatively 6 to 7 carbon atoms, and alternatively 5 to 6 carbon atoms.
- Polycyclic aryl groups may have 10 to 17 carbon atoms, alternatively 10 to 14 carbon atoms, and alternatively 12 to 14 carbon atoms.
- “Aralkyl” means an alkyl group having a pendant and/or terminal aryl group or an aryl group having a pendant alkyl group.
- Exemplary aralkyl groups include tolyl, xylyl, benzyl, phenylethyl, phenyl propyl, and phenyl butyl.
- each R M may be independently selected from the group consisting of alkyl and aryl.
- each R M may be independently selected from methyl and phenyl.
- each R M may be alkyl.
- each R M may be methyl.
- each R U is an independently selected monovalent aliphatically unsaturated hydrocarbon group of 2 to 30 carbon atoms.
- each R U may have 2 to 12 carbon atoms, and alternatively 2 to 6 carbon atoms.
- Suitable monovalent aliphatically unsaturated hydrocarbon groups include alkenyl groups and alkynyl groups.
- Alkenyl means a branched or unbranched, monovalent hydrocarbon group having one or more carbon-carbon double bonds.
- alkenyl groups are exemplified by vinyl, allyl, butenyl, pentenyl, hexenyl, and heptenyl, (including branched and linear isomers of 3 to 7 carbon atoms) ; and cyclohexenyl.
- Alkynyl means a branched or unbranched, monovalent hydrocarbon group having one or more carbon-carbon triple bonds.
- Suitable alkynyl groups are exemplified by ethynyl, propynyl, and butynyl (including branched and linear isomers of 2 to 4 carbon atoms) .
- each RU may be alkenyl, such as vinyl, allyl, or hexenyl.
- Polydiorganosiloxane gums are known in the art and may be prepared by methods such as hydrolysis and condensation of the corresponding organohalosilanes or equilibration of cyclic polydiorganosiloxanes.
- suitable polydiorganosiloxane gums for use in the hydrosilylation reaction curable composition are exemplified by:
- the polydiorganosiloxane gum may be selected from the group consisting of i) dimethylvinylsiloxy-terminated polydimethylsiloxane,
- Starting material (A-1) the aliphatically unsaturated polydiorganosiloxane gum, is present in the hydrosilylation reaction curable composition in an amount at least 38.7 weight %, alternatively at least 40 weight %, alternatively at least 42 weight %, and alternatively at least 44 weight %, while at the same time the amount may be up to 48.1 weight%, alternatively up to 47%, and alternatively up to 46 weight %, based on combined weights of starting materials (A) to (F) .
- the amount of (A-1) the aliphatically unsaturated polydiorganosiloxane gum may be 37.8 weight %to 48.1 weight %, alternatively 38.7 weight %to 48.1 weight %, and alternatively 42 weight %to 45 weight %, based on combined weights of starting materials (A) to (F) .
- the polydiorganosiloxane component may optionally further comprise (A-2) a hydroxyl-terminated polydiorganosiloxane gum of unit formula: (R M 2 R U SiO 1/2 ) 2 (R M 2 SiO 2/2 ) a’ , where R M and R U are as described above; and subscript a’ has a value sufficient to give (A-2) the hydroxyl-terminated polydiorganosiloxane gum a plasticity of 20 mil (0.51 mm) to 80 mil (2.03 mm) , alternatively 30 mil (0.76 mm) to 70 mil (1.78 mm) , and alternatively 45 mil (1.14 mm) to 65 mil (1.65 mm) , where plasticity is measured based on ASTM D926 by applying 1 kg load to a spherical sample of 4.2 g in weight for 3 minutes at
- Hydroxyl-terminated polydiorganosiloxane gums suitable for use as starting material (A-2) are known in the art and may be prepared by methods such as hydrolysis and condensation of the corresponding organohalosilanes or equilibration of cyclic polydiorganosiloxanes.
- suitable hydroxyl-terminated polydiorganosiloxane gum for use as starting material (A-2) in the hydrosilylation reaction curable composition are exemplified by:
- starting material (A-2) comprise bis-hydroxyl-terminated polydimethylsiloxane.
- Starting material (A-2) the hydroxyl-terminated polydiorganosiloxane gum is present in the hydrosilylation reaction curable composition in an amount of 0 weight %to ⁇ 1.2 weight %, based on combined weights of starting materials (A) to (F) .
- the hydroxyl-terminated polydiorganosiloxane gum may be present in an amount of at least 0.1 weight %, alternatively at least 0.13 weight %, while at the same time the amount may be up to 1.1 weight %, alternatively up to 1.06 weight %, on the same basis.
- (A-1) , the aliphatically unsaturated polydiorganosiloxane gum, and (A-2) the bis-hydroxyl-terminated polydiorganosiloxane may be present in amounts such that a weight ratio (A-1) : (A-2) may be ⁇ 32.5: 1.
- the weight ratio (A-1) : (A-2) may be at least 35: 1, and alternatively at least 37: 1; while at the same time, the weight ratio (A-1) : (A-2) may be up to 50: 1, alternatively up to 48: 1, and alternatively up to 47: 1, when (A-2) the hydroxyl-terminated polydiorganosiloxane gum is present.
- the ratio (A-1) : (A-2) may be 32.5: 1 to 45.3: 1.
- the hydrosilylation reaction curable composition further comprises starting material (B) , a polyorganosilicate resin component, which comprises (B-1) a capped resin and (B-2) an uncapped resin.
- Polyorganosilicate resins which comprises monofunctional units ( “M” units) of formula R M 3 SiO 1/2 and tetrafunctional silicate units ( “Q” units) of formula SiO 4/2 , where R M is as described above.
- R M is as described above.
- at least one-third, alternatively at least two thirds of the R M groups are alkyl groups (e.g., methyl groups) .
- the M units may be exemplified by (Me 3 SiO 1/2 ) and (Me 2 PhSiO 1/2 ) .
- the polyorganosilicate resin is soluble in solvents such as those described below, exemplified by liquid hydrocarbons, such as benzene, toluene, xylene, and heptane, or in liquid organosilicon compounds such as low viscosity linear and cyclic polydiorganosiloxanes.
- solvents such as those described below, exemplified by liquid hydrocarbons, such as benzene, toluene, xylene, and heptane, or in liquid organosilicon compounds such as low viscosity linear and cyclic polydiorganosiloxanes.
- the polyorganosilicate resin comprises the M and Q units described above, and the polyorganosiloxane further comprises units with silicon bonded hydroxyl groups and may comprise neopentamer of formula Si (OsiR M 3 ) 4 , where R M is as described above, e.g., the neopentamer may be tetrakis (trimethylsiloxy) silane.
- 29 Si NMR spectroscopy may be used to measure hydroxyl content and molar ratio of M and Q units, where said ratio is expressed as ⁇ M (resin) ⁇ / ⁇ Q (resin) ⁇ , excluding M and Q units from the neopentamer.
- M Q ratio represents the molar ratio of the total number of triorganosiloxy groups (M units) of the resinous portion of the polyorganosilicate resin to the total number of silicate groups (Q units) in the resinous portion.
- M: Q ratio may be 0.5: 1 to 1.5: 1.
- the Mn of the polyorganosilicate resin depends on various factors including the types of hydrocarbon groups represented by RM that are present.
- the Mn of the polyorganosilicate resin refers to the number average molecular weight measured using GPC, when the peak representing the neopentamer is excluded from the measurement.
- the Mn of the polyorganosilicate resin is 500 g/mol to 5,000 g/mol, alternatively 2,500 g/mol to 5,000 g/mol, alternatively 2,700 g/mol to 4,900 g/mol, and alternatively 2,700 g/mol to 4,700 g/mol.
- a suitable GPC test method for measuring Mn is disclosed in U.S. Patent 9,593,209, Reference Example 1 at col. 31.
- MQ resins which are suitable polyorganosilicate resins for use in the hydrosilylation reaction curable composition described herein.
- the polyorganosilicate resin can be prepared by any suitable method, such as cohydrolysis of the corresponding silanes or by silica hydrosol capping methods.
- the polyorganosilicate resin may be prepared by silica hydrosol capping processes such as those disclosed in U.S. Patent 2,676,182 to Daudt, et al.; U.S.
- the method of Daudt, et al. described above involves reacting a silica hydrosol under acidic conditions with a hydrolyzable triorganosilane such as trimethylchlorosilane, a siloxane such as hexamethyldisiloxane, or mixtures thereof, and recovering a copolymer having M-units and Q-units.
- the resulting copolymers generally contain from 2 to 5 percent by weight of hydroxyl groups.
- the intermediates used to prepare the polyorganosilicate resin may be triorganosilanes and silanes with four hydrolyzable substituents or alkali metal silicates.
- the triorganosilanes may have formula R M 3 SiX 1 , where R M is as described above and X 1 represents a hydrolyzable substituent such as halogen, alkoxy, acyloxy, hydroxyl, oximo, or ketoximo; alternatively, halogen, alkoxy or hydroxyl.
- Silanes with four hydrolyzable substituents may have formula SiX 2 4 , where each X 2 is halogen, alkoxy or hydroxyl.
- Suitable alkali metal silicates include sodium silicate.
- the polyorganosilicate resin prepared as described above is an uncapped resin, which typically contains silicon bonded hydroxyl groups, e.g., of formulae, HOSi 3/2 and/or HOR M 2 SiO 1/2 .
- the polyorganosilicate resin may comprise > 3%to 10%of silicon bonded hydroxyl groups, as measured by NMR spectroscopy.
- Silicon bonded hydroxyl groups formed during preparation of the polyorganosilicate resin can be converted to trihydrocarbon siloxane groups or to a different hydrolyzable group by reacting the silicone resin with a silane, disiloxane, or disilazane containing the appropriate terminal group in a process referred to a capping.
- Silanes containing hydrolyzable groups may be added in molar excess of the quantity required to react with the silicon bonded hydroxyl groups on the polyorganosilicate resin.
- the capped may comprise 2%or less, alternatively 0.7%or less, and alternatively 0.3%or less, and alternatively 0.3%to 0.8%of units represented by formula HOSiO 3/2 and/or HOR M 2 SiO 1/2 where R M is as described above.
- the concentration of silanol groups present in the polyorganosiloxane may be determined using NMR spectroscopy as described above.
- the polyorganosilicate resin component comprises (B-1) a capped resin as described above and (B-2) an uncapped resin as described above.
- the capped resin may have unit formula: (R M 3 SiO 1/2 ) z (SiO 4/2 ) o Z p , where R M is as described above and subscripts z and o have values such that o > 1, and subscript z > 4, a quantity (o + z) has a value sufficient to give the capped resin the Mn described above (e.g., 500 g/mol to 5,000 g/mol, alternatively 1,000 g/mol to 4,700 g/mol, alternatively 2,900 g/mol to 4,700 g/mol, and alternatively 2,900 g/mol to 4,100 g/mol) )
- subscript p has a value sufficient to give the capped resin a hydrolyzable group content as described above (e.g., 0 to 2%, alternatively 0 to 0.7%, and alternatively 0 to 0.3%)
- Starting material (B-1) the capped resin may be present in an amount of 42.4 weight %to 50.9 weight %, based on combined weights of starting materials (A) to (F) .
- (B-1) the capped resin may be present in an amount of 44 weight %to 48 weight %, alternatively 44.7 weight %to 47.4 weight %, on the same basis.
- the uncapped resin may have unit formula (R M 3 SiO 1/2 ) z’ (SiO 4/2 ) o’ Z p’ , where R M is as described above and subscripts z’ and o’ have values such that o’ > 1, and subscript z’ > 4, a quantity (o’+ z’) has a value sufficient to give the uncapped resin the Mn described above (e.g., 500 g/mol to 5,000 g/mol, alternatively 1,000 g/mol to 4,700 g/mol, alternatively 2,700 g/mol to 4,700 g/mol, and alternatively 2,700 g/mol to 4,100 g/mol) ) , and subscript p’ has a value sufficient to give the uncapped resin a hydrolyzable group content as described above (e.g., > 3%to 10%) .
- Starting material (B-2) the uncapped resin is optional, and its amount may be 0.
- the uncapped resin may be present in an amount of > 0 weight %to 1.5 weight %, alternatively 1.25 weight %to 1.45 weight %, and alternatively 1.26 weight %to 1.42 weight %, based on combined weights of starting materials (A) to (F) .
- the hydrosilylation reaction curable composition comprises (B) the polyorganosilicate resin component in an amount of 42.4 weight %to 52.4 weight %, alternatively 43.7 weight %to 52.3 weight %, and alternatively 46.2 weight %to 48.8 weight %based on combined weights of starting materials (A) to (F) (e.g., combined amounts of (B-1) the capped resin and (B-2) the uncapped resin, based on combined weights of all starting materials in the hydrosilylation reaction curable composition, excluding solvent) .
- the amounts of capped resin and uncapped resin in starting material (B) may be sufficient to provide a weight ratio of uncapped resin: capped resin ⁇ i.e., (B-2) : (B-1) ratio ⁇ of 0.028: 1 to 0.0.032: 1, alternatively 0.029: 1 to 0.031: 1, and alternatively 0.03.
- the (B-2) : (B-1) ratio may be at least 0.028, alternatively at least 0.029, while at the same time the (B-2) : (B-1) ratio may be up to 0.0.032, alternatively up to 0.031.
- the (B-2) : (B-1) ratio may be 0.03: 1.
- the polyorganosilicate resin component may be present in the hydrosilylation reaction curable composition in amounts sufficient to provide a weight ratio of (B) polyorganosilicate resin component : (A) polydiorganosiloxane gum component ⁇ i.e., (B) : (A) ratio ⁇ ⁇ 1.4: 1.
- the (B) : (A) ratio may be at least 0.75: 1, alternatively at least 0.88: 1, and alternatively at least 1: 09; while at the same time the (B) : (A) ratio may be up to ⁇ 1.4: 1, alternatively up to 1.31: 1, and alternatively up to 1.13: 1.
- the (B) : (A) ratio may be 1.0: 1 to 2.0: 1; alternatively 1.8: 1 to 1.9: 1.
- Hydrosilylation reaction catalysts are known in the art and are commercially available. Hydrosilylation reaction catalysts include platinum group metal catalysts. Such hydrosilylation reaction catalysts can be (C-1) a metal selected from platinum, rhodium, ruthenium, palladium, osmium, and iridium; alternatively platinum, ruthenium and iridium; and alternatively the metal may be platinum.
- the hydrosilylation reaction catalyst may be (C-2) a compound of such a metal, for example, chloridotris (triphenylphosphane) rhodium (I) (Wilkinson’s Catalyst) , a rhodium diphosphine chelate such as [1, 2-bis (diphenylphosphino) ethane] dichlorodirhodium or [1, 2-bis (diethylphospino) ethane] dichlorodirhodium, chloroplatinic acid (Speier’s Catalyst) , chloroplatinic acid hexahydrate, or platinum dichloride.
- chloridotris triphenylphosphane
- I Tinon’s Catalyst
- a rhodium diphosphine chelate such as [1, 2-bis (diphenylphosphino) ethane] dichlorodirhodium or [1, 2-bis (diethyl
- the hydrosilylation reaction catalyst may be (C-3) a complex of the platinum group metal compound with an alkenyl functional organopolysiloxane oligomer, or (C-4) the platinum group metal compound microencapsulated in a matrix or coreshell type structure.
- Complexes of platinum alkenyl functional organopolysiloxane oligomers include 1, 3-diethenyl-1, 1, 3, 3-tetramethyldisiloxane complexes with platinum (Karstedt’s Catalyst) .
- the hydrosilylation catalyst may comprise (C-5) the complex microencapsulated in a resin matrix. Exemplary hydrosilylation reaction catalysts are described in U.S.
- the amount of hydrosilylation reaction catalyst used herein will depend on various factors including the selection of starting material (D) the polyorganohydrogensiloxane and (A) the polydiorganosiloxane gum component, and their respective contents of silicon bonded hydrogen atoms (SiH) and aliphatically unsaturated groups, and the content of the platinum group metal in the catalyst selected, however, the amount of hydrosilylation reaction catalyst is sufficient to catalyze hydrosilylation reaction of SiH and aliphatically unsaturated groups, alternatively the amount of catalyst is sufficient to provide 1 ppm to 6,000 ppm of the platinum group metal based on combined weights of starting materials containing silicon bonded hydrogen atoms and aliphatically unsaturated hydrocarbon groups; alternatively 1 ppm to 1,000 ppm, and alternatively 1 ppm to 100 ppm, on the same basis.
- the hydrosilylation reaction catalyst comprises a platinum –organosiloxane complex
- the amount of hydrosilylation reaction catalyst may
- the quantity (f + g) may be sufficient to provide the polyorganohydrogensiloxane with a silicon bonded hydrogen content of 0.5%to 2%, alternatively 0.6%to 1.5%, where the silicon-bonded hydrogen (Si-H) content of the polyorganohydrogensiloxane can be determined using quantitative infra-red analysis in accordance with ASTM E168.
- Suitable polyorganohydrogensiloxanes are exemplified by:
- (D-5) a combination of two or more of (D-1) , (D-2) , (D-3) , and (D-4) .
- Methods of preparing polyorganohydrogensiloxanes such as hydrolysis and condensation of organohydridohalosilanes, are well known in the art, for example, see U.S. Patent 3,957,713 to Jeram et al. and U.S. Patent 4,329,273 to Hardman, et al.
- Polyorganohydrogensiloxanes can also be prepared as described, for example in U.S.
- Patent 2,823,218 to Speier, et al. which discloses organohydrogensiloxane oligomers and linear polymers, e.g., 1, 1, 1, 3, 3-pentamethyldisiloxane; bis-trimethylsiloxy-terminated polymethylhydrogensiloxane homopolymer; bis-trimethylsiloxy-terminated poly (dimethyl/methylhydrogen) siloxane copolymer; and cyclic polymethylhydrogensiloxanes.
- Polyorganohydrogensiloxanes are also commercially available, such as those available from Gelest, Inc.
- the amount of polyorganohydrogensiloxane in the hydrosilylation reaction curable composition is 0.1%to 5%, based on combined weights of starting materials (A) to (F) .
- the amount of polyorganohydrogensiloxane in the hydrosilylation reaction curable composition may be at least 0.1%, alternatively at least 0.25%, alternatively at least 0.3%; while at the same time, the amount may be up to 5%, alternatively up to 2.5%, alternatively up to 1.5%, alternatively up to 1%, on the same basis.
- the silicon-bonded hydrogen to aliphatically unsaturated group ratio is important when relying on a hydrosilylation cure process. Generally, this is determined by calculating the total weight %of aliphatically unsaturated groups in the composition, e.g. vinyl [V] and the total weight %of silicon bonded hydrogen [H] in the composition and given the molecular weight of hydrogen is 1 and of vinyl is 27 the molar ratio of silicon bonded hydrogen to vinyl is 27 [H] / [V] .
- Starting material (A) the polydiorganosiloxane gum component and (D) the polyorganohydrogensiloxane may be present in the hydrosilylation reaction curable composition in an amount sufficient to provide a mole ratio of silicon bonded hydrogen atoms to aliphatically unsaturated hydrocarbon groups of ⁇ (D) : (A) ratio ⁇ of at least 22.0: 1, alternatively at least 28.7: 1, while at the same time the ratio may be up to 57.8: 1, alternatively up to 57.6: 1.
- (D) : (A) ratio may be 22.0: 1 to 57.8: 1, alternatively 22.0: 1 to 57.6: 1, and alternatively 57.5: 1 to 57.6: 1.
- Starting material (E) in the hydrosilylation reaction curable composition is a trialkyl borate of formula R A 3 B, where each R A is an independently selected alkyl group of 1 to 30 carbon atoms, alternatively 1 to 12 carbon atoms, and alternatively 1 to 6 carbon atoms.
- the alkyl group may be methyl, ethyl, propyl (e.g., iso-propyl or n-propyl) , butyl (e.g., isobutyl, n-butyl, tert-butyl, or sec-butyl) , pentyl (e.g., isopentyl, neopentyl, or tert-pentyl) , hexyl, a branched alkyl group of 6 carbon atoms, or a cyclic alkyl group such as cyclopentyl or cyclohexyl.
- suitable trialkyl borates include trimethyl borate, triethyl borate, tributyl borate, and combinations of two or more thereof.
- the trialkyl borate may be triethyl borate.
- Trialkyl borates are known in the art and may be made by known methods, such as that described in U.S. Patent 3,020,308 to Stange. Trialkyl borates are also commercially available, for example, triethyl borate is available from Meryer (Shanghai) Chemical Technology Co., Ltd., and trialkyl borate additives for silicone compositions are also known in the art, such as DOWSIL TM 7429 PSA Additive, which is available from Dow Silicones Corporation.
- the amount of (E) the trialkyl borate added to the hydrosilylation curable composition is 0.1 weight %to 4.65 weight %, based on combined weights of starting materials (A) to (F) .
- the amount of (E) the trialkyl borate may be at least 0.1 weight %, alternatively at least 0.5 weight %, and alternatively at least 0.8%; while at the same time the amount may be up to 4.65 weight %, alternatively up to 4.64 weight %, alternatively up to 4.63 weight %, alternatively up to 4.2 weight %, and alternatively up to 4.13 weight %, on the same basis.
- the amount of (E) the trialkyl borate may be 4.63 weight %to 4.65 weight %, and alternatively 4.64 weight %, on the same basis.
- Starting material (F) is an optional hydrosilylation reaction inhibitor (inhibitor) that may be used for altering the rate of the hydrosilylation reaction, as compared to a composition containing the same starting materials but with the inhibitor omitted.
- Starting material (F) may be selected from the group consisting of (F-1) an acetylenic alcohol, (F-2) a silylated acetylenic alcohol, (F-3) an ene-yne compound, (F-4) a triazole, (F-5) a phosphine, (F-6) a mercaptan, (F-7) a hydrazine, (F-8) an amine, (F-9) a fumarate, (F-10) a maleate, (F-11) an ether, (F-12) carbon monoxide, (F-13) an alkenyl-functional siloxane oligomer, and (F-14) a combination of two or more thereof.
- the hydrosilylation reaction inhibitor may be selected from the group consisting of (F-1) an acetylenic alcohol, (F-2) a silylated acetylenic alcohol, (F-9) a fumarate, (F-10) a maleate, (F-13) carbon monoxide, (F-14) a combination of two or more thereof.
- Acetylenic alcohols are exemplified by 3, 5-dimethyl-1-hexyn-3-ol, 1-butyn-3-ol, 1-propyn-3-ol, 2-methyl-3-butyn-2-ol, 3-methyl-1-butyn-3-ol, 3-methyl-1-pentyn-3-ol, 3-phenyl-1-butyn-3-ol, 4-ethyl-1-octyn-3-ol, 3, 5-dimethyl-1-hexyn-3-ol, and 1-ethynyl-1-cyclohexanol, and a combination thereof.
- Acetylenic alcohols are known in the art and are commercially available from various sources, see for example, U.S.
- the inhibitor may be a silylated acetylenic compound.
- adding a silylated acetylenic compound reduces yellowing of the reaction product prepared from hydrosilylation reaction as compared to a reaction product from hydrosilylation of starting materials that do not include a silylated acetylenic compound or that include an organic acetylenic alcohol inhibitor, such as those described above.
- the silylated acetylenic compound is exemplified by (3-methyl-1-butyn-3-oxy) trimethylsilane, ( (1, 1-dimethyl-2-propynyl) oxy) trimethylsilane, bis (3-methyl-1-butyn-3-oxy) dimethylsilane, bis (3-methyl-1-butyn-3-oxy) silanemethylvinylsilane, bis ( (1, 1-dimethyl-2-propynyl) oxy) dimethylsilane, methyl (tris (1, 1-dimethyl-2-propynyloxy) ) silane, methyl (tris (3-methyl-1-butyn-3-oxy) ) silane, (3-methyl-1-butyn-3-oxy) dimethylphenylsilane, (3-methyl-1-butyn-3-oxy) dimethylhexenylsilane, (3-methyl-1-butyn-3-oxy) triethylsilane, bis (3-methyl-1-butyn-3-oxy)
- silylated acetylenic compound useful as the inhibitor herein may be prepared by methods known in the art, for example, U.S. Patent 6,677,407 to Bilgrien, et al. discloses silylating an acetylenic alcohol described above by reacting it with a chlorosilane in the presence of an acid receptor.
- the inhibitor may be an ene-yne compound such as 3-methyl-3-penten-1-yne, 3, 5-dimethyl-3-hexen-1-yne; and a combination thereof.
- the inhibitor may comprise a triazole, exemplified by benzotriazole.
- the inhibitor may comprise a phosphine.
- the inhibitor may comprise a mercaptan.
- the inhibitor may comprise a hydrazine.
- the inhibitor may comprise an amine.
- Amines are exemplified by tetramethyl ethylenediamine, 3-dimethylamino-1-propyne, n-methylpropargylamine, propargylamine, 1-ethynylcyclohexylamine, or a combination thereof.
- the inhibitor may comprise a fumarate. Fumarates include dialkyl fumarates such as diethyl fumarate, dialkenyl fumarates such as diallyl fumarate, dialkoxyalkyl fumarates such as bis- (methoxymethyl) ethyl fumarate.
- the inhibitor may comprise a maleate.
- Maleates include dialkyl maleates such as diethyl maleate, dialkenyl maleates such as diallyl maleate, and dialkoxyalkyl maleates such as bis- (methoxymethyl) ethyl maleate.
- the inhibitor may comprise an ether.
- the inhibitor may comprise carbon monoxide.
- the inhibitor may comprise an alkenyl-functional siloxane oligomer, which may be cyclic or linear such as methylvinylcyclosiloxanes exemplified by 1, 3, 5, 7-tetramethyl-1, 3, 5, 7-tetravinylcyclotetrasiloxane, 1, 3, 5, 7-tetramethyl-1, 3, 5, 7-tetrahexenylcyclotetrasiloxane, 1, 3-divinyl-1, 3-diphenyl-1, 3-dimethyldisiloxane; 1, 3-divinyl-1, 1, 3, 3-tetramethyldisiloxane; and a combination of two or more thereof.
- the compounds useful as inhibitors described above are commercially available, e.g., from Sigma-Aldrich Inc. or Gelest, Inc., and are known in the art, for example, see U.S. Patent 3,989,667 to Lee, et al. Suitable inhibitors for use herein are exemplified by those described as stabilizer E in U.S. Patent Application Publication 20007/0099007 at paragraphs [0148] to [0165] .
- the amount of inhibitor will depend on various factors including the desired pot life, whether the composition will be a one part composition or a multiple part composition, the particular inhibitor used, and the selection and amount of (C) the hydrosilylation reaction catalyst. However, when present, the amount of (F) the inhibitor may be may range from 0 %to 5 %, alternatively 0%to 1%, alternatively 0.001 %to 1 %, alternatively 0.01 %to 0.5 %, and alternatively 0.0025 %to 0.025 %, based on the combined weights of starting materials (A) to (F) in the hydrosilylation reaction curable composition.
- the hydrosilylation reaction curable composition further comprises starting material (G) , a solvent.
- the solvent may be an organic solvent such as a hydrocarbon, a ketone, an ester acetate, an ether, and/or a cyclic siloxane having an average degree of polymerization from 3 to 10.
- Suitable hydrocarbons for the solvent can be (G-1) an aromatic hydrocarbon such as benzene, toluene, or xylene; (G-2) an aliphatic hydrocarbon such as hexane, heptane, octane, or iso-paraffin; or (G-3) a combination thereof.
- the solvent may be a glycol ether such as propylene glycol methyl ether, dipropylene glycol methyl ether, propylene glycol n-butyl ether.
- Suitable ketones include acetone, methyl ethyl ketone, or methyl isobutyl ketone.
- Suitable ester acetates include ethyl acetate or isobutyl acetate.
- Suitable ethers include diisopropyl ether or 1, 4-dioxane.
- Suitable cyclic siloxanes having a degree of polymerization from 3 to 10, alternatively 3 to 6, include hexamethylcyclotrisiloxane, octamethylcyclotetrasiloxane, and/or decamethylcyclopentasiloxane.
- the solvent may be selected from the group consisting of benzene, toluene, xylene, heptane, ethyl benzene, ethyl acetate, and a combination of two or more thereof.
- the amount of solvent will depend on various factors including the type of solvent selected and the amount and type of other starting materials selected for the hydrosilylation reaction curable composition. However, the amount of solvent may range from > 0%to 90%, alternatively 0%to 60%, alternatively 20 to 60%, alternatively 45%to 65%, and alternatively 50%to 60%, based on combined weights of all starting materials in the hydrosilylation reaction curable composition.
- the solvent can be added during preparation of the hydrosilylation reaction curable composition, for example, to aid mixing and delivery of one or more starting materials, described above. All or a portion of the solvent may be added with one or more of the other starting materials.
- the polyorganosilicate resin and/or the hydrosilylation reaction catalyst may be dissolved in a solvent before combination with the other starting materials in the hydrosilylation reaction curable composition. All or a portion of the solvent may optionally be removed after the hydrosilylation reaction curable composition is prepared.
- Starting material (H) in the hydrosilylation reaction curable composition is an anchorage additive.
- the anchorage additive will facilitate bonding to a substrate by a silicone pressure sensitive adhesive prepared by curing the hydrosilylation reaction curable composition described herein.
- Suitable anchorage additives for starting material (H) include silane coupling agents such as methyltrimethoxysilane, vinyltrimethoxysilane, allyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, bis (trimethoxysilyl) propoane, and bis (trimethoxysilylhexane; and mixtures or reaction mixtures of said silane coupling agents.
- silane coupling agents such as methyltrimethoxysilane, vinyltrimethoxysilane, allyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, bis (
- the anchorage additive may be tetramethoxysilane, tetraethoxysilane, dimethyldimethoxysilane, methylphenyldimethoxysilane, methylphenyldiethoxysilane, phenyltrimethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, vinyltriethoxysilane, allyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, or 3-methacryloxypropyl trimethoxysilane.
- Suitable anchorage additives are exemplified by a reaction product of a vinyl alkoxysilane and an epoxy-functional alkoxysilane; a reaction product of a vinyl acetoxysilane and epoxy-functional alkoxysilane; and a combination (e.g., physical blend and/or a reaction product) of a polyorganosiloxane having at least one aliphatically unsaturated hydrocarbon group and at least one hydrolyzable group per molecule and an epoxy-functional alkoxysilane (e.g., a combination of a hydroxy-terminated, vinyl functional polydimethylsiloxane with glycidoxypropyltrimethoxysilane) .
- Anchorage additives are known in the art, such as in U.S. Patent 9,562,149; U.S. Patent Application Publication Number 2003/0088042, U.S. Patent Application Publication Number 2004/0254274, U.S. Patent Application Publication Number 2005/0038188; U.S. Patent Publication 2012/0328863 at paragraph [0091] and U.S. Patent Publication 2017/0233612 at paragraph [0041] ; and European Patent 0 556 023.
- Anchorage additives are commercially available. For example, SYL-OFF TM 9250, SYL-OFF TM 9176, SYL-OFF TM 297 and SYL-OFF TM 397 are available from Dow Silicones Corporation of Midland, Michigan, USA.
- anchorage additives include (G-1) vinyltriacetoxysilane, (G-2) glycidoxypropyltrimethoxysilane, and (G-3) a combination of (G-1) and (G-2) .
- This combination (G-3) may be a mixture and/or a reaction product.
- the amount of anchorage additive depends on various factors including the type of substrate to which the silicone pressure sensitive adhesive will be adhered. However, when present, the amount of anchorage additive may be 0.5%to 5%, alternatively 0.5%to 3%, and alternatively 0.5%to 2.5%, based on combined weights of all starting materials in the hydrosilylation reaction curable composition, excluding solvent.
- the hydrosilylation reaction curable composition can be prepared by a method comprising combining all starting materials as described above by any convenient means such as mixing at ambient or elevated temperature.
- the hydrosilylation reaction inhibitor may be added before the hydrosilylation reaction catalyst, for example, when the hydrosilylation reaction curable composition will be prepared at elevated temperature and/or the hydrosilylation reaction curable composition will be prepared as a one part composition.
- the method may further comprise delivering one or more starting materials in a solvent (e.g., the hydrosilylation reaction catalyst and/or the polyorganosilicate resin) may be dissolved in a solvent when combined with one or more of the other starting materials in the hydrosilylation reaction curable composition.
- a solvent e.g., the hydrosilylation reaction catalyst and/or the polyorganosilicate resin
- solvent may be removed after mixing two or more of the starting materials, and in this instance, solvent is not intentionally added to the hydrosilylation reaction curable composition.
- the hydrosilylation reaction curable composition may be prepared as a multiple part composition, for example, when the hydrosilylation reaction curable composition will be stored for a long period of time before use, e.g., up to 6 hours before applying the hydrosilylation reaction curable composition on an optical silicone elastomer or other substrate.
- the hydrosilylation reaction catalyst is stored in a separate part from any starting material having a silicon bonded hydrogen atom, for example the polyorganohydrogensiloxane, and the parts are combined shortly before use of the hydrosilylation reaction curable composition.
- a multiple part composition may be prepared by combining starting materials comprising at least some of the polydiorganosiloxane gum component, the polyorganohydrogensiloxane, and optionally one or more other starting materials described above (other than the hydrosilylation reaction catalyst) to form a base part, by any convenient means such as mixing.
- a curing agent may be prepared by combining starting materials comprising at least some of the polydiorganosiloxane gum, the hydrosilylation reaction catalyst, and optionally one or more other starting materials described above (other than the polyorganohydrogensiloxane) by any convenient means such as mixing.
- the starting materials may be combined at ambient or elevated temperature.
- the hydrosilylation reaction inhibitor may be included in one or more of the base part, the curing agent part, or a separate additional part.
- the polyorganosilicate resin may be added to the base part, the curing agent part, or a separate additional part.
- the polyorganosilicate resin may be added to the base part.
- the solvent may be added to the base part.
- starting materials comprising the polyorganosilicate resin and some or all of the solvent may be added in a separate additional part.
- the weight ratio of amounts of base part to curing agent part may range from 1: 1 to 10: 1.
- the hydrosilylation reaction curable composition will cure via hydrosilylation reaction to form the silicone pressure sensitive adhesive.
- the method described above may further comprise one or more additional steps.
- the hydrosilylation reaction curable composition prepared as described above may be used to form an adhesive article, e.g., a silicone pressure sensitive adhesive (prepared by curing the hydrosilylation reaction curable composition described above) on a substrate.
- the method may, therefore, further comprise comprises applying the hydrosilylation reaction curable composition to a substrate.
- Applying the hydrosilylation reaction curable composition to the substrate can be performed by any convenient means.
- the hydrosilylation reaction curable composition may be applied onto a substrate by gravure coater, comma coater, offset coater, offset-gravure coater, roller coater, reverse-roller coater, air-knife coater, slot die or curtain coater.
- the substrate can be any material that can withstand the curing conditions (described below) used to cure the hydrosilylation reaction curable composition to form the silicone pressure sensitive adhesive on the substrate.
- any substrate that can withstand heat treatment at a temperature equal to or greater than 120°C, alternatively 150°C is suitable.
- Examples of materials suitable for such substrates including polymeric films and/or foams, which may be comprised of polyimide (PI) , polyetheretherketone (PEEK) , polyethylene naphthalate (PEN) , liquid-crystal polyarylate, polyamideimide (PAI) , polyether sulfide (PES) , polyethylene terephthalate (PET) , polycarbonate (PC) , polymethylmethacrylate (PMMA) , thermoplastic polyurethane (TPU) , thermoplasticelastomer (TPE) , polyethylene (PE) , or polypropylene (PP) .
- the substrate may be glass.
- the substrate may be a release liner, for example, when the silicone pressure sensitive adhesive will be used in a dry casting method.
- the thickness of the substrate is not critical, however, the thickness may be 5 ⁇ m to 300 ⁇ m, alternatively 10 ⁇ m to 200 ⁇ m.
- the substrate may be selected from the group consisting of PE, PU, TPE, TPU, and a silicone elastomer.
- Liquid silicone rubbers LSRs
- High consistency rubbers HCRs
- the silicone elastomer may be selected based on the use in the flexible display device, i.e., the component of the flexible display device to be fabricated.
- optical silicone elastomers are known in the art and are described, for example, in U.S. Patent 8,859,693 to Hasegawa, et al. and U.S. Patent 8,853,332 to Akitomo, et al.
- Optical LSRs are commercially available.
- optical LSRs include SILASTIC TM MS-1001, MS-1002, MS-1003, MS-4001, MS-4002 and MS-4007, which are moldable optical silicone elastomers, and SYLGARD TM 182, 184 and 186 are other optical silicone elastomers, all of which are commercially available from Dow Silicones Corporation. These LSRs are suitable for fabricating optical components in a flexible display device.
- an LSR such as, SILASTIC TM 9202-50 LSR, SILASTIC TM LCF 3760, and SILASTIC TM LCF 3600
- an HCR such as XIAMETER TM RBB-2030-40EN, XIAMETER TM RBB-6660-60EN, XIAMETER TM RBB-2002-30 Base, XIAMETER TM RBB-2004-60, or XIAMETER TM RBB-2220-70 may be used.
- a filled silicone elastomer such as DOWSIL TM VE-8001 Flexible Silicone Adhesive may be used. All silicone elastomers branded DOWSIL TM , SILASTIC TM , SYLGARD TM , and XIAMETER TM are commercially available from Dow Silicones Corporation.
- the method for forming the adhesive article may optionally further comprise treating the substrate before applying the hydrosilylation reaction curable composition. Treating the substrate may be performed by any convenient means, such as applying a primer, or subjecting the substrate to corona-discharge treatment, etching, or plasma treatment before applying the hydrosilylation reaction curable composition to the substrate.
- the method described herein may optionally further comprise applying a removable release liner to the silicone pressure sensitive adhesive opposite the substrate, e.g., to protect the silicone pressure sensitive adhesive before use of the adhesive article.
- the release liner may be applied before, during or after curing the hydrosilylation reaction curable composition; alternatively after curing.
- the adhesive article may be a component for use in a flexible display device, such as an optical component, a lens (frame) component, or a hinge component.
- Figure 1 shows a partial cross section of a flexible display device component (100) .
- the component (100) includes a silicone pressure sensitive (102) having a surface (102a) and an opposing surface (102b) .
- the opposing surface (102b) of the silicone pressure sensitive (102) adheres to the surface (103a) of the silicone elastomer (103) with a peel adhesion of > 400 g/in as measured by the test method described in the EXAMPLES, below.
- the silicone pressure sensitive (102) may have a thickness of 10 ⁇ m to 200 ⁇ m.
- the silicone pressure sensitive (102) adheres to a substrate (101) having a surface (101a) and an opposing surface (101b) .
- the surface (102a) of the silicone pressure sensitive (102) contacts the opposing surface (101b) of the substrate (101) .
- the substrate (101) may be selected from the group consisting of PE, PU, TPU, TPE, and a silicone elastomer (which may be the same as, or different from, the silicone elastomer (103) and may have a thickness of 10 ⁇ m to 200 ⁇ m.
- the silicone elastomer (103) may be an HCR, as described above.
- the hydrosilylation reaction curable composition and method described above may be used in fabrication of the flexible display device component (100) via wet casting.
- the hydrosilylation reaction curable composition may be applied to the opposing surface (101b) of the substrate (101) and cured to form the silicone pressure sensitive adhesive (102) .
- the hydrosilylation reaction curable composition described herein may be applied to the surface (103a) of the silicone elastomer (103) and cured to form the silicone pressure sensitive adhesive (102) .
- hydrosilylation reaction curable composition may be applied to a surface of a release liner and cured to form the silicone pressure sensitive adhesive (102) .
- the silicone elastomer (103) may be contacted with the opposing surface (102b) of the silicone pressure sensitive adhesive (102) and the substrate (101) may be contacted with the surface (102a) of the silicone pressure sensitive adhesive (102) .
- Pressure may be applied to adhere the layers of substrate (101) , silicone pressure sensitive adhesive (102) , and silicone elastomer (103) together.
- samples of hydrosilylation reaction curable compositions were prepared as follows, using the starting materials and amounts shown below in Table 2. Amounts are in weight parts unless otherwise indicated.
- Starting material (A) the polyidorganosiloxane gum component and starting material (B) the polyorganosilicate resin component were dissolved in (G) the solvent under mixing until the resulting mixture was homogenous.
- starting material (F) the hydrosilylation reaction inhibitor was thoroughly blended into the mixture above.
- starting material (E) the trialkyl borate was thoroughly blended into the mixture above.
- starting material (D) the polyorganohydrogensiloxane was thoroughly blended into the mixture above.
- starting material (H) the anchorage additive (if used) was thoroughly blended into the mixture above.
- starting material (C) the hydrosilylation reaction catalyst was added and mixed until homogeneous. All the starting materials were mixed at RT. The starting materials and their amounts (by weight) are shown below in Tables 2 and 3.
- the hydrosilylation reaction curable compositions in Tables 2 and 3 contained small amounts of residual Solvent 1, which was introduced with the starting materials.
- DOWSIL TM 7499 PSA Primer was coated onto the substrate with a thickness sufficient to provide a dry coat weight of 0.20 gsm after heating in an oven at 120°C for 0.5 minute.
- the primer layer on the substrate provided a sufficient bonding between substrates and cured silicone pressure sensitive adhesives.
- the hydrosilylation reaction curable compositions were coated on substrates and cured according to the following procedure. Each sample prepared as described above was applied on 50 ⁇ m thick PET film with a thickness sufficient to provide a dry coat weight of 50 ⁇ m thickness after heating in an oven at 140 °C for 2 min.
- the resulting tape samples were applied to substrates such that the silicone pressure sensitive adhesive contacted the substrate.
- the substrates were SUS and Si Rubber A, and samples were kept at RT for 20 min after contacting the silicone pressure sensitive adhesive with the substrate before testing. This test was repeated, but samples were held at 70 °C for 1 day before testing.
- each tape sample prepared as described above was tested for adhesion to the SUS and Si Rubber A substrates by peeling each tape from the substrate and checking if there was any silicone pressure sensitive adhesive transferred onto the substrate from the PET film.
- An Adhesion/Release Tester AR-1500 was used. The width of each PET sheet was 1 inch. Peel speed and angle were 0.3 m/min and 180°, respectively. The unit was grams/in. Results are shown below in Tables 6 and 7.
- Adhesion to SUS test methods refers to the test standard ASTM D3330.
- Adhesion to Silicone Rubber A test method refers to the test standard ASTM D3330. Clean silicone rubber sheet with solvent. Apply tape sample (1 inch, 25.4 mm in width) to silicone rubber sheet. Roll twice in each direction with a standard 2 kg test roller at a speed of 10mm/s. Peel the sample from silicone rubber sheet using AR-1500 with a peeling angle of 180° at rate of 300mm/min after 20 min dwell time.
- Adhesion to silicone rubber (70 °C-1d) test method refers to the test standard ASTM D3330. Clean silicone rubber sheet with solvent. Apply tape sample (1 inch, 25.4 mm, in width) to silicone rubber sheet. Roll twice in each direction with a standard 2kg test roller at a speed of 10mm/s. Peel the sample from silicone rubber sheet using AR-1500 with a peeling angle of 180° at rate of 300mm/min after aging sample at 70 °C for one day (24hr) .
- Rheological data (Tg, G’ at -20 °C, 25 °C and 100 °C) test method refers to test standard ASTM D4440-15
- Cured pure silicone pressure sensitive adhesive films (without substrate) each having a thickness of 0.5 mm -1.5 mm were prepared for rheological properties testing on parallel plate with 8mm in diameter on a rheometer, either TA DHR-2 or ARES-G2.
- Loss modulus G” and storage modulus G’ at different temperatures were measured by a temperature ramp program with oscillation mode at a cooling rate of 3 °C/min under 1Hz and a strain of 0.25%. Tan delta was calculated by G”/G’.
- the glass transition temperature was defined as the temperature at peak point of tan delta.
- hydrosilylation reaction curable compositions can be prepared that cure to form silicone pressure sensitive adhesives with desirable adhesive properties of adhesion to stainless steel of >300 g/inch, adhesion to silicone rubber> 400 g/inch at RT, and adhesion to silicone rubber > 1000 g/inch after aging the silicone pressure sensitive adhesive on silicone rubber at 70 °C for one day.
- the high adhesions make the interface between the silicone pressure sensitive adhesive and substrates (adherends) strong enough to resist the delamination over repeated deformation tests of the flexible display device (e.g., by folding, bending, rolling or stretching tests) .
- the silicone pressure sensitive adhesives may also have Tg ⁇ 0 °C, G’ at -20 °C ⁇ 300kPa, G’ at 25 °C ⁇ 0.1 100kPa, and G’ at 100 °C of ⁇ 100kPa.
- the low Tg and low G’ at broad temperature ranges makes the silicone pressure sensitive adhesive suitable for use at broad temperature ranges with low stress imposed onto other layers during repeated deformation tests (e.g., folding, bending, rolling and stretching tests) .
- This combination of properties makes the silicone pressure sensitive adhesive suitable for use in fabricating multilayer components of flexible display devices, particularly in optical components, lens (frame) mounting layers, and silicone hinge and bonding layers.
- silicone pressure sensitive adhesive Due to the excellent properties in silicone elastomers to resist the repeated deformation tests (e.g., folding, bending, rolling and stretching) , the combination of silicone pressure sensitive adhesive and silicone elastomer makes the articles described herein suitable for use in flexible display devices with excellent reliability tests such as repeated folding, bending, rolling and stretching tests.
- any ranges and subranges relied upon in describing the present invention independently and collectively fall within the scope of the appended claims, and are understood to describe and contemplate all ranges including whole and/or fractional values therein, even if such values are not expressly written herein.
- One of skill in the art readily recognizes that the enumerated ranges and subranges sufficiently describe and enable various embodiments of the present invention, and such ranges and subranges may be further delineated into relevant halves, thirds, quarters, fifths, and any other subrange subsumed within the range.
- a range of “0.1 to 4.65” may be further delineated into a lower third, i.e., 0.1 to 1.5, a middle third, i.e., 1.76 to 3.1, and an upper third, i.e., from 3.2 to 4.65, and alternatively, the range “0.1 to 4.65” includes the subrange “0.1 to 4.2” , “4.1 to 4.65: , and “4.63 to 4.65” each which individually and collectively are within the scope of the appended claims, and may be relied upon individually and/or collectively and provide adequate support for specific embodiments within the scope of the appended claims.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Silicon Polymers (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (15)
- A hydrosilylation reaction curable composition for forming a silicone pressure sensitive adhesive, where the composition comprises:(A) a polydiorganosiloxane gum component comprising38.7 weight %to 48.1 weight %, based on combined weights of starting materials (A) to (F) , of (A-1) an aliphatically unsaturated polydiorganosiloxane gum of unit formula (R M 2R USiO 1/2) 2 (R M 2SiO 2/2) a, where each R M is an independently selected monovalent hydrocarbon group of 1 to 30 carbon atoms that is free of aliphatic unsaturation; each R U is an independently selected monovalent aliphatically unsaturated hydrocarbon group of 2 to 30 carbon atoms; and subscript a has a value sufficient to give the polydiorganosiloxane gum a plasticity of 20 mil (0.51 mm) to 80 mil (2.03 mm) , where plasticity is measured based on ASTM D926 by applying 1 kg load to a spherical sample of 4.2 g in weight for 3 minutes at 25 ℃ and the results are measured in thousandths of an inch (mil) and the procedure is based on ASTM D926; and0 to < 1.2 weight %of (A-2) a hydroxyl-terminated polydiorganosiloxane gum of unit formula ( (HO) R M 2SiO 1/2) 2 (R M 2SiO 2/2) a’, where each R M is an independently selected monovalent hydrocarbon group of 1 to 30 carbon atoms that is free of aliphatic unsaturation; each subscript a’ has a value sufficient to give the polydiorganosiloxane gum a plasticity of 20 mil (0.51 mm) to 80 mil (2.03 mm) ;with the proviso that a weight ratio of (A-1) the aliphatically unsaturated polydiorganosiloxane gum: (A-2) the hydroxyl-terminated polydiorganosiloxane gum { (A-1) : (A-2) ratio} ≥ 32.5: 1;(B) a polyorganosilicate resin component comprising42.4 weight %to 50.9 weight %, based on combined weights of starting materials (A) to (F) , of (B-1) a capped resin of unit formula: (R M 3SiO 1/2) z (SiO 4/2) oZ p, where Z is a hydrolyzable group, subscript p is 0 to a value sufficient to give the capped resin a hydrolyzable group content up to 2%, subscripts z and o have values such that z > 4, o > 1, and a quantity (z + o) has a value sufficient to provide the capped resin with a number average molecular weight of 500 g/mol to 5,000 g/mol; and0 to 1.5 weight %, based on combined weights of starting materials (A) to (F) , of (B-2) an uncapped resin of unit formula (R M 3SiO 1/2) z’ (SiO 4/2) o’Z p’, where subscript p’ has a value sufficient to give the uncapped resin a hydrolyzable group content of > 3%to 10%, subscripts z’ and o’ have values such that z’ > 4, o’ > 1, and a quantity (z’ + o’) has a value sufficient to provide the uncapped resin with a number average molecular weight of 500 g/mol to 5,000 g/mol, where (B-1) the capped resin and (B-2) the uncapped resin are present in a combined amount of 42.4 weight %to 52.4 weight %, based on combined weights of starting materials (A) to (F) ;where (A) the polydiorganosiloxane gum component and (B) the polyorganosilicate resin component are present in a weight ratio of (B) : (A) (Resin: Gum Ratio) < 1.4: 1;0.01 weight %to 5 weight %, based on combined weights of starting materials (A) to (F) , of (C) a hydrosilylation reaction catalyst;(D) a polyorganohydrogensiloxane of unit formula:(R M 2SiO 2/2) e (HR MSiO 2/2) f (R M 2HSiO 1/2) g (R M 3SiO 1/2) h; where subscript e ≥ 0, subscript f ≥ 0, a quantity (e + f) is 4 to 500, subscript g is 0, 1, or 2, subscript h is 0, 1, or 2, a quantity (g + h) = 2, and a quantity (f + g) ≥ 3; where (D) the polyorganohydrogensiloxane is present in an amount sufficient to provide a mole ratio of silicon bonded hydrogen atoms to aliphatically unsaturated hydrocarbon groups of (A) the polydiorganosiloxane gum component, { (D) : (A) ratio} , of 22.0: 1 to 57.8: 1;0.05 weight %to 4.8 weight %, based on combined weights of starting materials (A) to (F) , of (E) a trialkyl borate;0 weight %to 5 weight %, based on combined weights of starting materials (A) to (F) , of (F) a hydrosilylation reaction inhibitor;> 0 weight %to 90 weight %, based on combined weights of all starting materials in the composition, of (G) a solvent; and0 to 5 weight %, based on combined weights of starting materials (A) to (F) , of (H) an anchorage additive.
- The composition of claim 1, where in (A) the polydiorganosiloxane gum component, each R M is an independently selected alkyl group of 1 to 6 carbon atoms; and each R U is independently selected from the group consisting of vinyl, allyl, and hexenyl; subscript a is sufficient to provide a plasticity value of 30 mil (0.76 mm) to 70 mil (1.778 mm) . number average molecular weight of 500,000 g/mole to 1,000,000 g/mole to (A-1) the aliphatically unsaturated polydiorganosiloxane gum, and subscript a’ is sufficient to provide a number average molecular weight of 200,000 g/mole to 1,000,000 g/mole to (A-2) the hydroxyl-terminated polydiorganosiloxane gum.
- The composition of claim 1, where in (B) the polyorganosilicate resin component, each R M is an independently selected alkyl group of 1 to 6 carbon atoms; each Z is OH; and the quantity (z + o) has a value sufficient to provide (B-1) the capped resin with a number average molecular weight of 2,900 g/mol to 4,100 g/mol.
- The composition of claim 1, where (C) the hydrosilylation reaction catalyst comprises Karstedt’s catalyst.
- The composition of claim 1, where in (D) the polyorganohydrogensiloxane, each R M is an independently selected alkyl group of 1 to 6 carbon atoms, subscript g = 0, and subscript h = 2.
- The composition of claim 1, where (E) the trialkyl borate comprises triethyl borate.
- The composition of any one of claims 1 to 6, where the composition is a multiple part composition comprising a base part and a curing agent part, where the base part comprises starting materials A) and C) ; and the curing agent part comprises starting materials A) , and D) ; and the composition further comprises starting materials B) , E) , and F) in one or more of the base part, the curing agent part, or a separate additional part.
- A wet casting method comprising1) applying the composition according to any one of claims 1 to 6 to a substrate, and2) curing the composition to form the silicone pressure sensitive adhesive on the substrate.
- A dry casting method comprising1) applying the composition according to any one of claims 1 to 6 to a release liner,2) curing the composition to form the silicone pressure sensitive adhesive on the release liner, and3) applying the silicone pressure sensitive adhesive to a substrate.
- The method of claim 8 or claim 9, where the substrate is a silicone elastomer.
- An article prepared by the method of any one of claims 8 to 10.
- The article of claim 11, where the article is a portion of a foldable organic light emitting diode display.
- The article of claim 12, where the article is a portion of a lens (frame) mounting component.
- The article of claim 12, where the article comprises a hinge and a bonding layer.
- A component of foldable display device comprising:I) a silicone elastomer layer, andII) a silicone pressure sensitive adhesive layer adhered to the silicone elastomer layer, wherein the silicone pressure sensitive adhesive layer is a product of the composition of any one of claims 1 to 6.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023564607A JP2024517119A (en) | 2021-04-27 | 2021-04-27 | Silicone pressure sensitive adhesives and compositions and methods for their preparation and use in flexible displays - Patents.com |
CN202180096347.9A CN117098823A (en) | 2021-04-27 | 2021-04-27 | Silicone pressure sensitive adhesive composition, method for preparing the same, and use in flexible display device |
KR1020237040019A KR20240004573A (en) | 2021-04-27 | 2021-04-27 | Silicone pressure-sensitive adhesives, compositions and methods of making the same, and use in flexible display devices |
PCT/CN2021/090313 WO2022226796A1 (en) | 2021-04-27 | 2021-04-27 | Silicone pressure sensitive adhesive, composition and method for its preparation, and use in a flexible display device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2021/090313 WO2022226796A1 (en) | 2021-04-27 | 2021-04-27 | Silicone pressure sensitive adhesive, composition and method for its preparation, and use in a flexible display device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022226796A1 true WO2022226796A1 (en) | 2022-11-03 |
Family
ID=83847683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2021/090313 WO2022226796A1 (en) | 2021-04-27 | 2021-04-27 | Silicone pressure sensitive adhesive, composition and method for its preparation, and use in a flexible display device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2024517119A (en) |
KR (1) | KR20240004573A (en) |
CN (1) | CN117098823A (en) |
WO (1) | WO2022226796A1 (en) |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5096981A (en) * | 1990-05-29 | 1992-03-17 | General Electric Company | Pressure sensitive adhesives |
US5366809A (en) * | 1993-09-02 | 1994-11-22 | Dow Corning Corporation | Silicone pressure-sensitive adhesives |
US5466532A (en) * | 1991-03-26 | 1995-11-14 | Gen Electric | Solventless or high solids-containing silicone pressure sensitive adhesive compositions |
US6201055B1 (en) * | 1999-03-11 | 2001-03-13 | Dow Corning Corporation | Silicone composition and silicone pressure sensitive adhesive |
CN102399528A (en) * | 2010-08-23 | 2012-04-04 | 信越化学工业株式会社 | Addition-curable solventless pressure sensitive silicone adhesive composition and adhesive article |
CN104877622A (en) * | 2014-02-27 | 2015-09-02 | 信越化学工业株式会社 | Silicone pressure-sensitive adhesive composition having improved substrate adhesion and pressure-sensitive adhesive article |
CN105579537A (en) * | 2013-09-03 | 2016-05-11 | 东亚合成株式会社 | Adhesive composition |
CN107429126A (en) * | 2014-10-16 | 2017-12-01 | 道康宁公司 | Silicon composition and the pressure sensitive adhesive films with the pressure sensitive adhesive layer made of the composition |
CN108431166A (en) * | 2015-12-15 | 2018-08-21 | 美国陶氏有机硅公司 | Silicone pressure-sensitive adhesive composition |
CN111065705A (en) * | 2018-06-29 | 2020-04-24 | 美国陶氏有机硅公司 | Solventless silicone pressure sensitive adhesives and methods of making and using the same |
CN111194341A (en) * | 2018-09-14 | 2020-05-22 | 美国陶氏有机硅公司 | Pressure sensitive adhesives, their preparation and use |
WO2021029413A1 (en) * | 2019-08-13 | 2021-02-18 | ダウ・東レ株式会社 | Pressure-sensitive adhesive layer-forming organopolysiloxane composition, and use thereof |
CN112654687A (en) * | 2018-08-10 | 2021-04-13 | 陶氏东丽株式会社 | Polyorganosiloxane composition having pressure-sensitive adhesive layer-forming property and use thereof |
CN112673073A (en) * | 2018-08-10 | 2021-04-16 | 陶氏东丽株式会社 | Polyorganosiloxane composition having pressure-sensitive adhesive layer-forming property and use thereof |
CN112703240A (en) * | 2018-08-10 | 2021-04-23 | 陶氏东丽株式会社 | Polyorganosiloxane composition having pressure-sensitive adhesive layer-forming property and use thereof |
-
2021
- 2021-04-27 JP JP2023564607A patent/JP2024517119A/en active Pending
- 2021-04-27 WO PCT/CN2021/090313 patent/WO2022226796A1/en active Application Filing
- 2021-04-27 KR KR1020237040019A patent/KR20240004573A/en active Search and Examination
- 2021-04-27 CN CN202180096347.9A patent/CN117098823A/en active Pending
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5096981A (en) * | 1990-05-29 | 1992-03-17 | General Electric Company | Pressure sensitive adhesives |
US5466532A (en) * | 1991-03-26 | 1995-11-14 | Gen Electric | Solventless or high solids-containing silicone pressure sensitive adhesive compositions |
US5366809A (en) * | 1993-09-02 | 1994-11-22 | Dow Corning Corporation | Silicone pressure-sensitive adhesives |
US6201055B1 (en) * | 1999-03-11 | 2001-03-13 | Dow Corning Corporation | Silicone composition and silicone pressure sensitive adhesive |
CN102399528A (en) * | 2010-08-23 | 2012-04-04 | 信越化学工业株式会社 | Addition-curable solventless pressure sensitive silicone adhesive composition and adhesive article |
CN105579537A (en) * | 2013-09-03 | 2016-05-11 | 东亚合成株式会社 | Adhesive composition |
CN104877622A (en) * | 2014-02-27 | 2015-09-02 | 信越化学工业株式会社 | Silicone pressure-sensitive adhesive composition having improved substrate adhesion and pressure-sensitive adhesive article |
CN107429126A (en) * | 2014-10-16 | 2017-12-01 | 道康宁公司 | Silicon composition and the pressure sensitive adhesive films with the pressure sensitive adhesive layer made of the composition |
CN108431166A (en) * | 2015-12-15 | 2018-08-21 | 美国陶氏有机硅公司 | Silicone pressure-sensitive adhesive composition |
CN111065705A (en) * | 2018-06-29 | 2020-04-24 | 美国陶氏有机硅公司 | Solventless silicone pressure sensitive adhesives and methods of making and using the same |
CN112654687A (en) * | 2018-08-10 | 2021-04-13 | 陶氏东丽株式会社 | Polyorganosiloxane composition having pressure-sensitive adhesive layer-forming property and use thereof |
CN112673073A (en) * | 2018-08-10 | 2021-04-16 | 陶氏东丽株式会社 | Polyorganosiloxane composition having pressure-sensitive adhesive layer-forming property and use thereof |
CN112703240A (en) * | 2018-08-10 | 2021-04-23 | 陶氏东丽株式会社 | Polyorganosiloxane composition having pressure-sensitive adhesive layer-forming property and use thereof |
CN111194341A (en) * | 2018-09-14 | 2020-05-22 | 美国陶氏有机硅公司 | Pressure sensitive adhesives, their preparation and use |
WO2021029413A1 (en) * | 2019-08-13 | 2021-02-18 | ダウ・東レ株式会社 | Pressure-sensitive adhesive layer-forming organopolysiloxane composition, and use thereof |
Also Published As
Publication number | Publication date |
---|---|
CN117098823A (en) | 2023-11-21 |
JP2024517119A (en) | 2024-04-19 |
KR20240004573A (en) | 2024-01-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102170926B1 (en) | Solvent-free silicone pressure-sensitive adhesive and its preparation and use method | |
KR102240167B1 (en) | Silicone pressure-sensitive adhesive composition and its preparation and use method | |
JP7334279B2 (en) | Silicone pressure sensitive adhesive composition and method of preparation and use thereof | |
US11814554B2 (en) | Silicone pressure sensitive adhesive composition and methods for the preparation and use thereof | |
KR102669320B1 (en) | Silicone pressure-sensitive adhesive composition containing fluorosilicone additive and method for making and using the same | |
WO2022226797A1 (en) | Hydrosilylation reaction cured silicone pressure sensitive adhesive, composition and method for its preparation, and use in flexible display device | |
WO2022226796A1 (en) | Silicone pressure sensitive adhesive, composition and method for its preparation, and use in a flexible display device | |
WO2022226775A1 (en) | Hydrosilylation reaction curable composition forming silicone pressure sensitive adhesive that adheres to optical silicone elastomers and methods for preparation and use in flexible display device | |
US12091548B2 (en) | Curable composition for silicone pressure sensitive adhesives | |
KR102724169B1 (en) | Silicone pressure-sensitive adhesive composition and method for making and using the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 21938283 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 202180096347.9 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2023564607 Country of ref document: JP |
|
ENP | Entry into the national phase |
Ref document number: 20237040019 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020237040019 Country of ref document: KR |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 21938283 Country of ref document: EP Kind code of ref document: A1 |