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WO2022218261A1 - 拍摄装置及电子设备 - Google Patents

拍摄装置及电子设备 Download PDF

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Publication number
WO2022218261A1
WO2022218261A1 PCT/CN2022/086138 CN2022086138W WO2022218261A1 WO 2022218261 A1 WO2022218261 A1 WO 2022218261A1 CN 2022086138 W CN2022086138 W CN 2022086138W WO 2022218261 A1 WO2022218261 A1 WO 2022218261A1
Authority
WO
WIPO (PCT)
Prior art keywords
shake
reed
lens
driving member
photographing device
Prior art date
Application number
PCT/CN2022/086138
Other languages
English (en)
French (fr)
Inventor
许能华
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Priority to KR1020237039275A priority Critical patent/KR20230170763A/ko
Priority to EP22787487.2A priority patent/EP4325834A4/en
Publication of WO2022218261A1 publication Critical patent/WO2022218261A1/zh
Priority to US18/485,473 priority patent/US20240040252A1/en

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
    • H04N23/682—Vibration or motion blur correction
    • H04N23/685—Vibration or motion blur correction performed by mechanical compensation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
    • H04N23/682—Vibration or motion blur correction
    • H04N23/685—Vibration or motion blur correction performed by mechanical compensation
    • H04N23/687—Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/64—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
    • G02B27/646—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image compensating for small deviations, e.g. due to vibration or shake
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B13/00—Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
    • G03B13/32—Means for focusing
    • G03B13/34—Power focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B3/00—Focusing arrangements of general interest for cameras, projectors or printers
    • G03B3/10—Power-operated focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B5/00—Adjustment of optical system relative to image or object surface other than for focusing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2205/00—Adjustment of optical system relative to image or object surface other than for focusing
    • G03B2205/0007—Movement of one or more optical elements for control of motion blur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2205/00—Adjustment of optical system relative to image or object surface other than for focusing
    • G03B2205/0053—Driving means for the movement of one or more optical element
    • G03B2205/0069—Driving means for the movement of one or more optical element using electromagnetic actuators, e.g. voice coils

Definitions

  • the present application relates to the field of electronic equipment, and in particular, to a photographing device and electronic equipment.
  • the anti-shake technology realized by the chip movement.
  • the chip is smaller and heavier. Lightweight, the anti-shake by driving the chip movement will consume less power, and the entire anti-shake mechanism can also be designed to be smaller, so the chip-moving anti-shake technology is widely used in shooting devices to help the shooting device achieve anti-shake,
  • the photographing device can be developed to be lighter in weight and lower in power.
  • the currently applied chip anti-shake technology usually uses FPC (Flexible Printed Circuit, flexible circuit board) to connect and conduct the chip in its hardware structure.
  • FPC Flexible Printed Circuit, flexible circuit board
  • the shaking mechanism cannot be further reduced, thereby preventing the further development of light weight and miniaturization of the photographing device with the chip anti-shake mechanism.
  • the present application proposes a photographing device and electronic equipment to solve the problem that the anti-shake mechanism of the photographing device will occupy a large space.
  • the present application provides a photographing device, comprising a lens, a mounting frame, a first driving member, an anti-shake driving mechanism, a second driving member, and a photosensitive chip, the lens passing through the mounting frame, and the first driving member.
  • a driving member is arranged on the mounting frame, the lens and the photosensitive chip are arranged in sequence along the optical axis of the lens, and the anti-shake driving mechanism includes a base plate, an anti-shake elastic member and a base, and the base plate passes through the anti-shake
  • the elastic member is movably connected to the base, the photosensitive chip and the second driving member are both arranged on the substrate, the first driving member drives the substrate to move through the second driving member, and the photosensitive chip can An anti-shake motion is performed with the substrate.
  • the present application provides an electronic device, including the photographing device.
  • the photographing device of the present application includes a base plate, an anti-shake elastic member and a base by setting an anti-shake driving mechanism, the base plate is movably connected to the base through the anti-shake elastic member, and a photosensitive chip and a second driving member are arranged on the base plate, so that the first driving member is driven When the second driving member moves, the photosensitive chip can be moved with the substrate, so as to achieve the purpose of anti-shake.
  • This design of the present application can reduce the volume of the anti-shake driving mechanism, thereby reducing the overall volume of the photographing device and achieving a higher degree of integration. , and make the electronic equipment equipped with the photographing device further developed towards light weight and miniaturization.
  • FIG. 1 is an exploded view of a photographing device disclosed in an embodiment of the present application.
  • FIG. 2 is an internal structure diagram of a photographing device disclosed in an embodiment of the present application.
  • FIG. 3 is a diagram of the installation position of the first driving member of the photographing device disclosed in the embodiment of the present application on the installation frame;
  • FIG. 5 is a composition diagram of an elastic anti-shake part disclosed in an embodiment of the present application.
  • FIG. 6 is an internal structure diagram of the anti-shake elastic member disclosed in the embodiment of the present application.
  • Fig. 7 is an enlarged view of part I of Fig. 6 disclosed in the embodiment of the present application.
  • FIG. 9 is an overall structural diagram of an anti-shake mechanism disclosed in an embodiment of the present application.
  • FIG. 11 is an installation diagram of the third driving member disclosed in the embodiment of the present application on the carrier frame
  • FIG. 12 is an overall structural diagram of a photographing device disclosed in an embodiment of the present application.
  • FIG. 13 is a schematic diagram of the conduction of the third driving member disclosed in the embodiment of the present application.
  • 600-third driver 700-first driver, 900-filter, 1000-second driver,
  • the present application discloses a photographing device including a lens 200 , a mounting frame 400 , a first driving member 700 , an anti-shake driving mechanism Q, a second driving member 1000 and a photosensitive chip 1300 .
  • the mounting frame 400 may provide an installation basis for the relevant components in the photographing device; the lens 200 may be used to realize photographing and imaging, such as a common wide-angle lens. Specifically, the lens 200 can pass through the mounting frame 400 , and the first driving member 700 can be disposed on the mounting frame 400 .
  • the photosensitive chip 1300 can be used to convert the optical signal of the lens 200 into an electrical signal, so that the image can be captured by the photographing device.
  • the anti-shake driving mechanism Q is used to realize anti-shake motion during shooting by the photographing device, and the anti-shake driving mechanism Q may include a substrate 1100 , an anti-shake elastic member 1200 and a base 1400 .
  • the substrate 1100 is used for installing the photosensitive chip 1300, and the base 1400 is the bearing base of the anti-shake driving mechanism Q.
  • the base 1400 can be injection-molded by liquid crystal polymer.
  • the first driving member 700 and the second driving member 1000 cooperate with each other to provide the required driving force for the movement of the anti-shake driving mechanism Q.
  • the substrate 1100 can be movably connected to the base 1400 through the anti-shake elastic member 1200 , and the photosensitive chip 1300 and the second driving member 1000 can both be disposed on the substrate 1100 .
  • the driving force can be transmitted to the base plate 1100 through the second driving member 1000, so that the base plate 1100 can move relative to the base 1400 through the anti-shake elastic member 1200. That is, the first driving member 700 can drive the substrate 1100 to move through the second driving member 1000, and the photosensitive chip 1300 can perform anti-shake motion along with the substrate 1100, so as to realize anti-shake during the shooting process of the photographing device and achieve better shooting quality.
  • the present application can reduce the overall volume of the anti-shake driving mechanism Q through the setting of the anti-shake driving mechanism Q and the method of arranging the anti-shake elastic member 1200 to connect the substrate 1100 and the base 1400, thereby reducing the overall volume of the photographing device. , and has a higher level of integration.
  • the photographing device may further include a filter 900 .
  • the filter 900 is disposed between the lens 200 and the photosensitive chip 1300 and can perform a filtering function, thereby making the image formed by the photographing device better.
  • the anti-shake elastic member 1200 can be any part that can realize the movement of the base plate 1100 relative to the base 1400 through its own elastic deformation.
  • the anti-shake elastic member 1200 can be disposed between the base plate 1100 and the base 1400.
  • Several springs or elastic pads As shown in FIG. 4 and FIG. 5 in the present application, the anti-shake elastic member 1200 may include a first connecting portion 1210 , an elastic anti-shake portion 1220 and a second connecting portion 1230 .
  • the elastic anti-shake part 1220 may include a first reed 1221 , a first bent part 1222 and a second reed 1223 .
  • the second connecting portion 1230 , the first reed 1221 , the first bending portion 1222 , the second reed 1223 and the first connecting portion 1210 are connected in sequence.
  • the anti-shake elastic member 1200 can be connected to the base 1400 through the first connecting portion 1210 , and the anti-shake elastic member 1200 can also be connected to the substrate 1100 through the second connecting portion 1230 , so that the substrate 1100 can be movably connected between the bases 1400 .
  • the included angle between the first reed 1221 and the second reed 1223 will change, and the first bending portion 1222 will be bent and deformed according to the change of the included angle, so as to Adjust its own bending amplitude, when the included angle changes, the first reed 1221 or the second reed 1223 will swing around the first bending portion 1222, and as the swing progresses, the substrate 1100 can also follow the first reed 1221 and the second reed 1223.
  • the angle between the second reeds 1223 changes to move, so that the photosensitive chip 1300 moves with the substrate 1100, so as to achieve the purpose of anti-shake.
  • the bending deformation of the first bending portion 1222 will be eliminated, the first reed 1221 and the second reed 1223 will be reset to their original positions, and the same substrate 1100 and the photosensitive chip 1300 thereon will also be reset to their original positions. Location.
  • an installation groove can be preset on the base 1400 , so that the first connecting portion 1210 is embedded in the installation groove on the base 1400 , so that the connection between the anti-shake elastic member 1200 and the base 1400 is more convenient. It is firm, and at the same time, it can achieve high multiplexing of the same stack, improve the integration degree of the shooting device, and further reduce the overall volume.
  • the optical axis of the lens 200 is set along the third direction Z
  • the first reed 1221 is arranged along the first direction X
  • the second reed 1223 is arranged along the second direction Y.
  • the optical axis of the lens 200 that is, the third direction Z is perpendicular to the plane determined by the first direction X and the second direction Y, so that the anti-shake movement of the photosensitive chip 1300 is specifically the movement in the vertical third direction Z plane, which makes it easier to control the photosensitive The motion path of the chip 1300 .
  • the first direction X, the second direction Y and the third direction Z are orthogonal to each other to form a three-dimensional coordinate system, so as to better control the anti-shake movement direction of the photosensitive chip 1300 .
  • the anti-shake elastic member 1200 may further include a third reed 1225 .
  • the third reed 1225 is arranged in a direction parallel to the optical axis of the lens 200 .
  • the first end of the second reed 1223 is connected to the first bending portion 1222 , and the second end of the second reed 1223 is connected to the first connection portion 1210 through the third reed 1225 .
  • the arrangement of the third reeds 1225 can support the substrate 1100, so that the substrate 1100 can be spaced apart from the base 1400 by the third reeds 1225, so that the substrate 1100 can form a floating state relative to the base 1400, while the lens 200 and the photosensitive chip 1300
  • the base 1400 and the base 1400 are arranged in sequence along the direction of the optical axis of the lens 200 , so that the base plate 1100 can move relative to the base 1400 more easily, thereby realizing more effective anti-shake of the photosensitive chip 1300 .
  • the anti-shake elastic member 1200 further includes a second bending portion 1224 and a third bending portion 1226 .
  • the first end of the third reed 1225 is connected to the second end of the second reed 1223 through the second bent portion 1224
  • the second end of the third reed 1225 is connected to the first connection portion 1210 through the third bent portion 1226 .
  • the arrangement of such multiple bendings of the anti-shake elastic member 1200 can make the first bending part 1222 , the second bending part 1224 and the third bending part 1222 , the second bending part 1224 and the third bending part under the condition that the first driving member 700 drives the substrate 1100 to move.
  • the connecting parts 1226 are all bent and deformed, so that the connection between the first connecting part 1210 and the third reed 1225, between the second reed 1223 and the third reed 1225, and between the first reed 1221 and the second reed 1223 is
  • the included angle can be changed, so that the substrate 1100 can move according to the above-mentioned change of the included angle, so that it is easier to realize the anti-shake of the photosensitive chip 1300 .
  • the substrate 1100 may be a circuit board, and the photosensitive chip 1300 is electrically connected to the anti-shake elastic member 1200 through the substrate 1100 , so that the mutual cooperation between the substrate 1100 and the anti-shake elastic member 1200 can not only realize the anti-shake of the photosensitive chip 1300 , but also The photosensitive chip 1300 is provided with the electric power required for operation, so that one thing can be used for multiple purposes.
  • the substrate 1100 can be made of a ceramic material, and the substrate 1100 is usually provided with wires for conducting electricity.
  • the anti-shake elastic member 1200 is usually provided with a metal material to realize electrical conduction.
  • the anti-shake elastic member 1200 may include a substrate layer 1201 and a first conductive layer 1203 stacked in sequence, wherein the substrate The layer 1201 is a basic material for shaping to determine the shape of the anti-shake elastic member 1200.
  • the first conductive layer 1203 is arranged along the shape determined by the base material layer 1201 to form the traces on the base material layer 1201.
  • the first conductive layer 1203 is a copper wire layer or the like.
  • the anti-shake elastic member 1200 can be electrically connected to the substrate 1100 through the first conductive layer 1203 , so that the anti-shake elastic member 1200 , the substrate 1100 and the photosensitive chip 1300 form a conductive loop, so as to supply power to the photosensitive chip 1300 during operation.
  • the anti-shake elastic member 1200 may further include a first insulating layer 1202 and a second insulating layer 1204 .
  • the second insulating layer 1204, the first conductive layer 1203, the first insulating layer 1202 and the base material layer 1201 are stacked in sequence.
  • the setting of the first insulating layer 1202 can prevent short circuit between the first conductive layer 1203 and the base material layer 1201.
  • the first insulating layer 1202 is made of inorganic non-metal insulating material; the second insulating layer 1204 can prevent the first conductive layer A short circuit occurs between 1203 and other components in the photographing device, for example, the second insulating layer 1204 is pasted on the first conductive layer 1203 by using an insulating material that has undergone electroplating.
  • the first connecting portion 1210 is provided with a first conducting member 1211
  • the second connecting portion 1230 is provided with a second conducting member 1231 .
  • Both the first conductive member 1211 and the second conductive member 1231 may be configured as lead pieces for soldering, and the second connection portion 1230 is connected to the substrate 1100 through the second conductive member 1231 by soldering, and The first connecting portion 1210 is connected to the base 1400 through the first conducting member 1211 to enhance the firmness of the connection.
  • both the second conductive member 1231 and the first conductive member 1211 can be in contact with the first conductive layer 1203, so that the second conductive member 1231 can be connected to the first conductive member 1211 through the first conductive layer 1203, thereby connecting the
  • the external electrical energy is introduced into the substrate 1100 to supply power for the normal operation of the photosensitive chip 1300 .
  • the second connecting portion 1230 may be disposed on the side of the elastic anti-shake portion 1220 away from the lens 200 , and the side of the substrate 1100 facing away from the lens 200 is connected to the second connecting portion 1230 .
  • the plane determined by the elastic anti-shake part 1220 and the substrate 1100 is perpendicular to the optical axis of the lens 200, so that the substrate 1100 and the anti-shake elastic member 1200 can be reused at the same stacking height while ensuring stable connection.
  • the substrate 1100 does not occupy the stacking space, which is beneficial to The integration of the camera is improved, and the miniaturization is further realized.
  • the four anti-shake elastic members 1200 there may be four anti-shake elastic members 1200 in total, and the four anti-shake elastic members 1200 are respectively disposed at the corners of the substrate 1100.
  • the four anti-shake elastic members 1200 can restrain and cooperate with each other so that When the photosensitive chip 1300 performs the anti-shake motion, it can move along the diagonal of the substrate 1100, so as to better control the anti-shake motion path of the photosensitive chip 1300, and the arrangement of the plurality of anti-shake elastic members 1200 can also make the photosensitive chip 1300 The anti-shake movement is smoother.
  • the shooting device may further include a focus driving mechanism P and a third driving member 600 .
  • the focus driving mechanism P may include a first focus elastic member 300 , a carrier frame 500 and a second focus elastic member 800 .
  • the carrier frame 500 can be made of liquid crystal polymer, and the carrier frame 500 can be the installation basis for the zoom movement of the lens 200. Specifically, the carrier frame 500 can be inserted between the lens 200 and the installation frame 400, and the carrier frame The 500 and the lens 200 can be fixed to each other by means of gluing or the like.
  • the carrier frame 500 is elastically connected to the mounting frame 400 through the first focusing elastic member 300 and the second focusing elastic member 800 to achieve movement relative to the mounting frame 400 , so that the lens 200 is movably connected to the mounting frame 400 through the carrier frame 500 .
  • the cooperation between the third driving member 600 and the first driving member 700 can provide the driving force required for the zooming movement of the lens 200.
  • the carrier frame 500 can move along the optical axis of the lens 200 along with the third driving member 600
  • the lens 200 can focus movement with the carrier frame 500
  • the elastic member 800 can guide the moving direction of the carrier frame 500, and can be bent and deformed with the movement of the carrier frame 500.
  • the first focusing elastic member 300 and the second focusing elastic member 800 will restore the deformation, and the carrier frame 500 drives the lens 200 to reset with the recovery of the deformation.
  • the first driving member 700 can cooperate with the second driving member 1000 and the third driving member 600 respectively, so as to realize the anti-shake driving of the photosensitive chip 1300 and the zoom driving of the lens 200 respectively, so as to realize the
  • the multiplexing of a driver 700 further improves the integration and reduces the required volume of the photographing device.
  • both the first focusing elastic member 300 and the second focusing elastic member 800 can be made of alloy spring sheets, and the first focusing elastic member 300 and the second focusing elastic member 800 can be respectively disposed on the back of the installation frame 400 . toward the end face of the substrate 1100, so that the whole formed by the first focusing elastic member 300 and the second focusing elastic member 800 will clamp the upper and lower ends to clamp the carrier frame 500; or the first focusing elastic member 300 and the second focusing elastic member 800 are springs or the like disposed between the gaps of the mounting frame 400 of the carrier frame 500 .
  • the first driving member 700 can be set as a magnet
  • the third driving member 600 and the second driving member 1000 are both electromagnetic coils. Electromagnetic driving is performed between the first driving member 700 and the third driving member 600 and between the first driving member 700 and the second driving member 1000 respectively, thereby realizing the zoom driving of the lens 200 and the anti-shake driving of the photosensitive chip 1300 .
  • it can also be any other driving manner capable of realizing motion, which will not be described in detail here.
  • a groove can be provided on the side of the mounting frame 400 facing the substrate 1100 , and the first driving member 700 as a magnet can be embedded in the mounting frame 400 ; an annular recess can also be provided on the periphery of the carrier frame 500 .
  • the third driving member 600 as a coil is wound in the annular groove so as to be arranged around the carrier frame 500 . Such an arrangement does not need to occupy extra space, and further improves the integration degree of the device of the present application.
  • second driving members 1000 there may be four second driving members 1000 in total, and they are respectively disposed at the corners of the substrate 1100 .
  • first driving members 700 there are also four first driving members 700 in total, which correspond to the positions of the second driving members 1000 .
  • the driving force received is more stable.
  • the carrier frame 500 is provided with a first guide portion 510
  • the installation frame 400 is provided with a second guide portion 410 and a third guide portion 420 .
  • the guide portion 510 may be a wire slot provided on the carrier frame 500
  • the second guide portion 410 and the third guide portion 420 may be plug pins provided on the mounting frame 400 .
  • the installation frame 400 may be connected to the base 1400 through the third guide portion 420 , so as to realize a firm connection between the installation frame 400 and the base 1400 .
  • the third driving part 600 , the first guiding part 510 , the first focusing elastic part 300 , the second guiding part 410 and the third guiding part 420 are electrically connected in sequence to form a power supply loop, so as to introduce electric energy into the third driving part 600 , and then The zoom motion of the lens 200 is realized.
  • the substrate 1100 is a circuit board and the second driving member 1000 is an electromagnetic coil
  • the external electrical energy can also be transported to the second driving member 1000 through the anti-shake elastic member 1200 and the substrate 1100 in sequence, that is, the anti-shake elastic member
  • the power supply circuit formed by the 1200 , the substrate 1100 and the second driving member 1000 can introduce electrical energy into the second driving member 1000 , thereby realizing the anti-shake motion of the photosensitive chip 1300 . It can be seen that the above two power supply circuits are independent of each other and do not interfere with each other, which can improve the controllability of the photographing device of the present application.
  • the photographing device may further include a cover 100 .
  • the cover case 100 can be made of an alloy-type metal material.
  • the cover case 100 can be configured to cover and protect the relevant components on the photographing device, so as to achieve the purpose of dustproof and waterproof, and preventing bump damage.
  • the mounting frame 400 , the first driving member 700 , the second driving member 1000 and the photosensitive chip 1300 can all be arranged in the housing 100 , at least part of the lens 200 is arranged in the housing 100 , and the anti-shake driving mechanism Q At least partially disposed within the housing 100 .
  • the first connecting portion 1210 can extend out of the cover 100, so as to easily introduce an external current into the second driving member 1000 and the photosensitive chip 1300, so as to realize the anti-shake motion of the photosensitive chip 1300, And provide power for the imaging of the photosensitive chip 1300 .
  • the first reed 1221 and the second reed 1223 are both provided with a hollow area, the arrangement of the hollow area can reduce the overall weight of the anti-shake elastic member 1200, and more conveniently realize the anti-shake elastic member 1200 and the substrate 1100. heat dissipation between.
  • the hollow area may be a through hole provided on the first reed 1221 and the second reed 1223, and the through hole is along the length direction of the first reed 1221 and the second reed 1223, namely the first reed 1221 and the second reed 1223 respectively.
  • the opening in one direction X and the second direction Y can ensure the overall strength of the first reed 1221 and the second reed 1223 , and can also facilitate the layout and wiring of the first conductive layer 1203 .
  • the electronic devices disclosed in the embodiments of the present application may be mobile phones, tablet computers, e-book readers, wearable devices (eg, smart watches, smart glasses), etc.
  • the embodiments of the present application do not limit the specific types of electronic devices.

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Abstract

本申请公开一种拍摄装置，包括镜头、安装框、第一驱动件、防抖驱动机构、第二驱动件和感光芯片，镜头穿设于安装框，第一驱动件设于安装框，镜头和感光芯片沿镜头光轴方向依次设置，防抖驱动机构包括基板、防抖弹性件和底座，基板通过防抖弹性件活动连接底座，感光芯片和第二驱动件均设于基板，可使第一驱动件通过第二驱动件驱动基板运动，进而使感光芯片可随基板进行防抖运动。

Description

拍摄装置及电子设备
交叉引用
本发明要求在2021年4月15日提交中国专利局、申请号为202110406243.5、发明名称为“拍摄装置及电子设备”的中国专利申请的优先权，该申请的全部内容通过引用结合在本发明中。
技术领域
本申请涉及电子设备领域，特别涉及一种拍摄装置及电子设备。
背景技术
随着科学技术的发展，对于拍摄装置的防抖需求越来越强烈，其中一种便是芯片移动实现防抖技术，相较于镜头移动的方式进行防抖，芯片的体积更小、重量更轻，通过驱动芯片移动进行防抖将消耗更小的功率，并且整个防抖机构也能够设计的更小，故芯片移动防抖技术广泛应用于拍摄装置中，以帮助拍摄装置实现拍摄防抖，进而使拍摄装置能够向轻量化、低功率化发展。
但是目前应用的芯片防抖技术，其硬件结构上通常采用FPC(Flexible Printed Circuit，柔性电路板)对芯片进行连接和导通，柔性电路板由于自身结构特点占用空间较大，进而导致整个芯片防抖机构无法进一步缩小，进而阻止安装芯片防抖机构的拍摄装置进一步向轻量化、小型化发展。
发明内容
本申请提出了一种拍摄装置及电子设备，以解决拍摄装置的防抖机构将 占据较大空间的问题。
在一方面，本申请提出一种拍摄装置，包括镜头、安装框、第一驱动件、防抖驱动机构、第二驱动件和感光芯片，所述镜头穿设于所述安装框，所述第一驱动件设于所述安装框，所述镜头和所述感光芯片沿所述镜头光轴方向依次设置，所述防抖驱动机构包括基板、防抖弹性件和底座，所述基板通过防抖弹性件活动连接所述底座，所述感光芯片和所述第二驱动件均设于所述基板，所述第一驱动件通过所述第二驱动件驱动所述基板运动，所述感光芯片可随所述基板进行防抖运动。
在另一方面，本申请提出一种电子设备，包括所述的拍摄装置。
本申请的有益效果如下：
本申请的拍摄装置通过设置防抖驱动机构包括基板、防抖弹性件和底座，基板通过防抖弹性件活动连接底座，并设置感光芯片和第二驱动件于基板，从而使第一驱动件驱动第二驱动件运动时，可使感光芯片随基板运动，从而达到防抖目的，本申请的此种设计可以减小防抖驱动机构的体积，进而使拍摄装置整体体积减小，集成度更高，以及使装配拍摄装置的电子设备进一步向轻量化、小型化发展。
附图说明
此处所说明的附图用来提供对本申请的进一步理解，构成本申请的一部分，本申请的示意性实施例及其说明用于解释本申请，并不构成对本申请的不当限定。在附图中：
图1本申请实施例公开的拍摄装置的爆炸图；
图2本申请实施例公开的拍摄装置的内部结构图；
图3本申请实施例公开的拍摄装置的第一驱动件于安装框上的安装位置图；
图4本申请实施例公开的防抖弹性件的总体结构图；
图5本申请实施例公开的弹性防抖部的组成图；
图6本申请实施例公开的防抖弹性件内部结构图；
图7本申请实施例公开的图6的I处放大图；
图8本申请实施例公开的防抖机构的内部结构图；
图9本申请实施例公开的防抖机构总体结构图；
图10本申请实施例公开的防抖机构的爆炸图；
图11本申请实施例公开的第三驱动件于载体框上的安装图；
图12本申请实施例公开的拍摄装置的总体结构图；
图13本申请实施例公开的第三驱动件的导电示意图。
附图标记说明：
100-罩壳、200-镜头、
P-对焦驱动机构、
300-第一对焦弹性件、500-载体框、510-第一引导部、800-第二对焦弹性件、
400-安装框、410-第二引导部、420-第三引导部、
600-第三驱动件、700-第一驱动件、900-滤光片、1000-第二驱动件、
Q-防抖驱动机构、
1100-基板、1400-底座、
1200-防抖弹性件、
1201-基材层、1202-第一绝缘层、1203-第一导电层、1204-第二绝缘层、
1210-第一连接部、1211-第一导通件、1212-第一延伸部、
1220-弹性防抖部、1221-第一簧片、1222-第一折弯部、1223-第二簧片、1224-第二折弯部、1225-第三簧片、1226-第三折弯部、
1230-第二连接部、1231-第二导通件、
1300-感光芯片、X-第一方向、Y-第二方向、Z-第三方向。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚，下面将结合本申请具体实施例及相应的附图对本申请技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
请参考图1～图13，本申请公开一种拍摄装置，包括镜头200、安装框400、第一驱动件700、防抖驱动机构Q、第二驱动件1000和感光芯片1300。
安装框400可以为拍摄装置中的相关部件提供安装基础；镜头200可用于实现拍摄成像，比如常见的广角镜头等。具体来说镜头200可以穿设于安装框400，第一驱动件700可以设于安装框400。而感光芯片1300可用于将镜头200的光信号转化为电信号，以实现拍摄装置拍出影像，镜头200和感光芯片1300可以沿镜头200光轴方向依次设置。
如图8～图10所示，防抖驱动机构Q用于实现拍摄装置拍摄时的防抖运动，防抖驱动机构Q可以包括基板1100、防抖弹性件1200和底座1400。其中基板1100用于安装感光芯片1300，而底座1400为防抖驱动机构Q的承载基础，底座1400具体可以采用液晶高分子聚合物注塑成型。
第一驱动件700和第二驱动件1000相互配合可以为防抖驱动机构Q的运动提供所需的驱动力。具体来说，基板1100可以通过防抖弹性件1200活动连接底座1400，感光芯片1300和第二驱动件1000可以均设于基板1100。
这样第一驱动件700在驱动第二驱动件1000进行运动时，能够将驱动力通过第二驱动件1000传递至基板1100，进而使基板1100通过防抖弹性件1200进行相对于底座1400的运动，即第一驱动件700可以通过第二驱动件1000驱动基板1100运动，而感光芯片1300可随基板1100进行防抖运动，从而实现拍摄装置在拍摄过程中的防抖，达到较好的拍摄质量。
综上，本申请通过防抖驱动机构Q的设置，以及设置防抖弹性件1200来连接基板1100和底座1400的方式，可以缩小防抖驱动机构Q的整体体积，进而使拍摄装置整体体积减小，并具有更高的集成度。
进一步的，拍摄装置还可以包括滤光片900，滤光片900设置于镜头200和感光芯片1300之间，能够发挥滤光作用，进而使拍摄装置所形成的影像更佳。
对于防抖弹性件1200的具体结构来说，可以是任何能够通过自身的弹性形变实现基板1100相对于底座1400运动的零件，比如防抖弹性件1200可以是设置在基板1100和底座1400之间的若干弹簧或者弹性垫。本申请如图4和图5所示，设置防抖弹性件1200可以包括第一连接部1210、弹性防抖部1220和第二连接部1230。
如图5所示，弹性防抖部1220可以包括第一簧片1221、第一折弯部1222和第二簧片1223。第二连接部1230、第一簧片1221、第一折弯部1222、第二簧片1223和第一连接部1210依次连接。
防抖弹性件1200可以通过第一连接部1210连接底座1400，同时防抖弹性件1200还可以通过第二连接部1230连接基板1100，这样便实现基板1100活动连接于底座1400之间。具体来说，当需要进行防抖运动时，第一簧片1221和第二簧片1223之间的夹角将进行变化，第一折弯部1222将随该夹角变化而进行弯曲形变，以调整自身弯曲幅度，该夹角变化时第一簧片1221或第二簧片1223将发生绕第一折弯部1222的摆动，随此摆动的进行，基板1100也可随第一簧片1221和第二簧片1223之间的夹角变化进行运动，从而使感光芯片1300跟随基板1100运动，以达到防抖目的。而拍摄结束后，第一折弯部1222的弯曲形变将消除，第一簧片1221和第二簧片1223将复位至初始位置，同样的基板1100和其上的感光芯片1300也将复位至初始位置。
更进一步的，如图3所示，底座1400上可以预设安装槽，使第一连接部1210嵌设在底座1400上的安装槽中，使防抖弹性件1200于底座1400之间 的连接更加牢固，同时也能够实现同一堆叠高度复用，提高拍摄装置的集成度，进一步减小整体体积。
更为具体的，如图5所示，设定镜头200光轴方向沿第三方向Z，以及第一簧片1221沿第一方向X设置，第二簧片1223沿第二方向Y设置。镜头200光轴，即第三方向Z垂直第一方向X和第二方向Y所确定的平面，这样感光芯片1300的防抖运动具体为位于垂直第三方向Z平面的移动，这样更易于控制感光芯片1300的运动路径。更进一步的，第一方向X、第二方向Y和第三方向Z两两正交构成三维坐标系，以便更好控制感光芯片1300的防抖运动方向。
更为具体的，如图5所示，防抖弹性件1200还可以包括第三簧片1225。第三簧片1225沿平行镜头200光轴的方向进行设置。第二簧片1223的第一端连接第一折弯部1222，第二簧片1223的第二端通过第三簧片1225连接第一连接部1210。
第三簧片1225的设置可实现对基板1100的支撑，使基板1100可以通过第三簧片1225与底座1400间隔设置，从而使基板1100相对于底座1400形成悬浮状态，同时镜头200、感光芯片1300和底座1400沿镜头200光轴方向依次设置，这样基板1100将更为容易的相对于底座1400进行运动，进而实现感光芯片1300更为有效的防抖。
更进一步的，如图5所示，防抖弹性件1200还包括第二折弯部1224和第三折弯部1226。第三簧片1225的第一端通过第二折弯部1224连接第二簧片1223的第二端，第三簧片1225的第二端通过第三折弯部1226连接第一连接部1210。
防抖弹性件1200的此种多处折弯的设置，能够在第一驱动件700驱动基板1100运动的情况下，可以使第一折弯部1222、第二折弯部1224和第三折弯部1226均发生弯曲形变，进而使第一连接部1210和第三簧片1225之间、第二簧片1223与第三簧片1225之间、以及第一簧片1221和第二簧片1223 的夹角均可发生变化，进而使基板1100随上述的夹角变化进行运动，从而更为容易的实现感光芯片1300的防抖。
更进一步的，基板1100可以为电路板，感光芯片1300通过基板1100电连接于防抖弹性件1200，这样基板1100和防抖弹性件1200的相互配合不仅能够实现感光芯片1300的防抖，还能够为感光芯片1300提供工作所需的电能，实现一物多用。
在更为具体的实施方案中，基板1100可以选用陶瓷材料进行制作，基板1100内部通常设置有走线以实现导电。而防抖弹性件1200内部通常设置金属材料以实现导电，具体如图6和图7所示，防抖弹性件1200可以包括依次叠置的基材层1201和第一导电层1203，其中基材层1201为用于定型的基础材料，以确定防抖弹性件1200的外形形状，第一导电层1203沿基材层1201所确定的形状进行设置，以形成位于基材层1201上的走线，比如第一导电层1203为铜线层等。这样防抖弹性件1200可以通过第一导电层1203电连接基板1100，进而使防抖弹性件1200、基板1100和感光芯片1300形成导电回路，实现对感光芯片1300工作时供电。
更进一步的，防抖弹性件1200还可以包括第一绝缘层1202和第二绝缘层1204。第二绝缘层1204、第一导电层1203、第一绝缘层1202和基材层1201依次叠置。第一绝缘层1202的设置可以防止第一导电层1203和基材层1201之间出现短路，比如第一绝缘层1202采用无机非金属绝缘材料进行制作；第二绝缘层1204可以防止第一导电层1203与拍摄装置中的其他零部件之间出现短路现象，比如第二绝缘层1204采用经过电镀处理的绝缘材料贴敷在第一导电层1203上。
在更为具体的实施方案中，第一连接部1210上设有第一导通件1211，第二连接部1230上设有第二导通件1231。第一导通件1211和第二导通件1231可以均可以设置为用于焊接的引脚片，并通过焊接的方式，使第二连接部1230通过第二导通件1231连接基板1100，以及使第一连接部1210通过 第一导通件1211连接底座1400，以增强连接的牢固性。同时第二导通件1231和第一导通件1211均可以与第一导电层1203形成接触，这样可以使第二导通件1231通过第一导电层1203连接第一导通件1211，从而将外界电能引入基板1100，进而为感光芯片1300的正常工作进行供电。
更为具体的，如图5、图8和图9所示，第二连接部1230可以设于弹性防抖部1220背离镜头200的一侧，基板1100背离镜头200的一面连接第二连接部1230。这样弹性防抖部1220和基板1100所确定的平面垂直镜头200光轴，这样在保证连接稳定同时，实现基板1100与防抖弹性件1200同一堆叠高度的复用，基板1100不占用堆叠空间，利于提高拍摄装置集成度，进一步实现小型化。
更进一步的，防抖弹性件1200可以共计4个，4个防抖弹性件1200分别设于基板1100的拐角处，此种布局结构中，4个防抖弹性件1200可以相互牵制和配合，使感光芯片1300在进行防抖运动时，能够沿基板1100的对角线进行运动，更好的控制感光芯片1300的防抖运动路径，并且多个防抖弹性件1200的设置也能够使感光芯片1300的防抖运动更加平稳。
在另一些可选的实施方案中，如图1和图2所示，为实现镜头200拍摄过程中的变焦需求，拍摄装置还可以包括对焦驱动机构P和第三驱动件600。
对焦驱动机构P可以包括第一对焦弹性件300、载体框500和第二对焦弹性件800。其中载体框500可选用液晶高分子聚合物进行制作，载体框500可以为镜头200进行变焦运动的安装基础，具体来说载体框500可以穿设于镜头200与安装框400之间，并且载体框500和镜头200之间可以通过胶水粘接等方式实现相互固定。载体框500通过第一对焦弹性件300和第二对焦弹性件800弹性连接于安装框400，以实现相对于安装框400的运动，进而使镜头200通过载体框500活动连接安装框400。
第三驱动件600和第一驱动件700的相互配合可以为镜头200变焦运动所需的提供驱动力，具体来说第三驱动件600可以设于载体框500，第一驱 动件700在驱动第三驱动件600进行运动的情况下，载体框500可随第三驱动件600进行沿镜头200光轴的运动，镜头200可随载体框500进行对焦运动，第一对焦弹性件300和第二对焦弹性件800可对载体框500的运动方向进行导向，并且可随载体框500运动进行弯曲形变，而在拍摄结束后，第一对焦弹性件300和第二对焦弹性件800将恢复形变，载体框500随该形变的回复带动镜头200进行复位。
综上，本申请中第一驱动件700可以分别和第二驱动件1000、第三驱动件600进行配合，以分别实现对感光芯片1300的防抖驱动和镜头200的变焦驱动，从而实现对第一驱动件700的复用，进一步提高了集成度，减小了拍摄装置所需体积。
更进一步的，第一对焦弹性件300和第二对焦弹性件800均可采用合金类的弹簧片进行制作，并且第一对焦弹性件300和第二对焦弹性件800可以分别设置于安装框400背向和朝向基板1100的端面，这样第一对焦弹性件300和第二对焦弹性件800形成的整体将以上下两端对夹的方式，来对载体框500进行夹持；或者第一对焦弹性件300和第二对焦弹性件800为设置于载体框500的安装框400的间隙之间的弹簧等。
在具体的驱动方式选择上，可以设置第一驱动件700为磁体，第三驱动件600和第二驱动件1000均为电磁线圈。第一驱动件700和第三驱动件600之间，以及第一驱动件700和第二驱动件1000之间分别进行电磁驱动，进而实现对镜头200的变焦驱动和感光芯片1300的防抖驱动。当然也可以是其他任意能够实现运动的驱动方式，这里不再详述。
同时需要指出的是，可以在安装框400朝向基板1100的一面设置凹槽，并将作为磁体的第一驱动件700嵌设在安装框400中；也可以在载体框500的周部开设环形凹槽，将作为线圈的第三驱动件600绕设在环形凹槽中，以便围绕载体框500设置。这样的设置方式无需占用多余空间，进一步提高本申请装置的集成度。
更进一步的，第二驱动件1000可以共计四个，并分别设于基板1100的拐角处。而第一驱动件700也共计四个，并与第二驱动件1000位置对应。这样
感光芯片1300在进行防抖运动时，所受到的驱动力更加平稳。
在另一些可选的实施方案中，如图12和图13所示，载体框500内设第一引导部510，安装框400内设第二引导部410和第三引导部420。引导部510可以为设于载体框500上的过线槽，而第二引导部410和第三引导部420可以为设于安装框400上的插接引脚。安装框400可以通过第三引导部420连接于底座1400，从而实现将安装框400和底座1400之间的牢固连接。
第三驱动件600、第一引导部510、第一对焦弹性件300、第二引导部410和第三引导部420依次电连接，以形成供电回路，从而将电能引入第三驱动件600，进而实现镜头200的变焦运动。
同时需要说明的是，当基板1100为电路板而第二驱动件1000为电磁线圈时，外界电能还能够依次通过防抖弹性件1200和基板1100输送至第二驱动件1000，即防抖弹性件1200、基板1100和第二驱动件1000形成的供电回路，能够将电能引入第二驱动件1000，进而实现感光芯片1300的防抖运动。可见上述两条供电回路彼此独立，互不干涉，可提高对本申请拍摄装置的操控性。
更为具体的，如图1和图2所示，拍摄装置还可以包括罩壳100。罩壳100可选用合金类的金属材质进行制作，罩壳100的设置可以为拍摄装置上的相关部件进行遮罩保护，达到防尘防水，防止磕碰损伤的目的。具体来说，安装框400、第一驱动件700、第二驱动件1000和感光芯片1300均可以设于罩壳100内，镜头200的至少部分设置于罩壳100内，防抖驱动机构Q的至少部分设置于罩壳100内。
同时需要指出的是，第一连接部1210可以伸出于罩壳100外，以便较为容易的实现将外界电流引入至第二驱动件1000和感光芯片1300，从而实现 感光芯片1300的防抖运动，以及为感光芯片1300的成像提供电能。
更进一步的，第一簧片1221和第二簧片1223上均设有中空区域，中空区域的设置可以减少防抖弹性件1200的整体重量，并较为方便的实现防抖弹性件1200与基板1100之间的散热。具体来说，该中空区域可以是设置在第一簧片1221和第二簧片1223上的通孔，并且该通孔分别沿第一簧片1221和第二簧片1223的长度方向，即第一方向X和第二方向Y进行开设，这样的设置可以保证第一簧片1221和第二簧片1223的整体强度，也能够方便第一导电层1203的布局走线。
本申请实施例公开的电子设备可以是手机、平板电脑、电子书阅读器、可穿戴设备(例如智能手表、智能眼镜)等，本申请实施例不限制电子设备的具体种类。
以上所述仅为本申请的实施例而已，并不用于限制本申请。对于本领域技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原理之内所作的任何修改、等同替换、改进等，均应包含在本申请的权利要求范围之内。

Claims (19)

  1. 一种拍摄装置，包括镜头(200)、安装框(400)、第一驱动件(700)、防抖驱动机构(Q)、第二驱动件(1000)和感光芯片(1300)，
    所述镜头(200)穿设于所述安装框(400)，所述第一驱动件(700)设于所述安装框(400)，所述镜头(200)和所述感光芯片(1300)沿所述镜头(200)光轴方向依次设置，
    所述防抖驱动机构(Q)包括基板(1100)、防抖弹性件(1200)和底座(1400)，所述基板(1100)通过防抖弹性件(1200)活动连接所述底座(1400)，所述感光芯片(1300)和所述第二驱动件(1000)均设于所述基板(1100)，
    所述第一驱动件(700)通过所述第二驱动件(1000)驱动所述基板(1100)运动，所述感光芯片(1300)可随所述基板(1100)进行防抖运动。
  2. 根据权利要求1所述的拍摄装置，其中，所述防抖弹性件(1200)包括第一连接部(1210)、弹性防抖部(1220)和第二连接部(1230)，所述弹性防抖部(1220)包括第一簧片(1221)、第一折弯部(1222)和第二簧片(1223)，所述第二连接部(1230)、所述第一簧片(1221)、所述第一折弯部(1222)、所述第二簧片(1223)和所述第一连接部(1210)依次连接，
    所述防抖弹性件(1200)通过所述第一连接部(1210)连接所述底座(1400)，所述防抖弹性件(1200)通过所述第二连接部(1230)连接所述基板(1100)，
    在所述第一驱动件(700)驱动所述基板(1100)运动的情况下，所述第一簧片(1221)和所述第二簧片(1223)之间的夹角进行变化，所述第一折弯部(1222)进行弯曲形变，所述基板(1100)可随所述第一簧片(1221)和所述第二簧片(1223)之间的夹角变化进行运动。
  3. 根据权利要求2所述的拍摄装置，其中，所述第一簧片(1221)沿第一方向(X)设置，所述第二簧片(1223)沿第二方向(Y)设置，
    所述镜头(200)光轴垂直所述第一方向(X)和所述第二方向(Y)所确定的平面。
  4. 根据权利要求2所述的拍摄装置，其中，所述防抖弹性件(1200)还包括第三簧片(1225)，所述第三簧片(1225)沿平行所述镜头(200)光轴的方向进行设置，
    所述第二簧片(1223)的第一端连接所述第一折弯部(1222)，所述第二簧片(1223)的第二端通过所述第三簧片(1225)连接所述第一连接部(1210)，所述基板(1100)通过所述第三簧片(1225)与所述底座(1400)间隔设置，
    所述镜头(200)、所述感光芯片(1300)和所述底座(1400)沿所述镜头(200)光轴方向依次设置。
  5. 根据权利要求4所述的拍摄装置，其中，所述防抖弹性件(1200)还包括第二折弯部(1224)和第三折弯部(1226)，
    所述第三簧片(1225)的第一端通过所述第二折弯部(1224)连接所述第二簧片(1223)的第二端，所述第三簧片(1225)的第二端通过所述第三折弯部(1226)连接所述第一连接部(1210)，
    在所述第一驱动件(700)驱动所述基板(1100)运动的情况下，所述第二折弯部(1224)和所述第三折弯部(1226)均可发生弯曲形变，所述第一连接部(1210)和所述第二簧片(1223)分别与所述第三簧片(1225)之间的夹角均可发生变化，
    所述基板(1100)可随所述第三簧片(1225)和所述第一连接部(1210)之间的夹角变化，和/或随所述第三簧片(1225)和所述第二簧片(1223)之间的夹角变化进行运动。
  6. 根据权利要求2所述的拍摄装置，其中，所述基板(1100)为电路板，所述感光芯片(1300)通过所述基板(1100)电连接于所述防抖弹性件(1200)。
  7. 根据权利要求6所述的拍摄装置，其中，所述防抖弹性件(1200)包括依次叠置的基材层(1201)和第一导电层(1203)，所述防抖弹性件(1200)通过所述第一导电层(1203)电连接所述感光芯片(1300)。
  8. 根据权利要求7所述的拍摄装置，其中，所述防抖弹性件(1200)还 包括第一绝缘层(1202)和第二绝缘层(1204)，
    所述第二绝缘层(1204)、所述第一导电层(1203)、所述第一绝缘层(1202)和所述基材层(1201)依次叠置。
  9. 根据权利要求7所述的拍摄装置，其中，所述第一连接部(1210)上设有第一导通件(1211)，所述第二连接部(1230)上设有第二导通件(1231)，
    所述第二连接部(1230)通过所述第二导通件(1231)连接所述基板(1100)，所述第二导通件(1231)通过所述第一导电层(1203)连接所述第一导通件(1211)。
  10. 根据权利要求1所述的拍摄装置，其中，所述拍摄装置还包括对焦驱动机构(P)和第三驱动件(600)，所述对焦驱动机构(P)包括第一对焦弹性件(300)、载体框(500)和第二对焦弹性件(800)，
    所述载体框(500)穿设于所述镜头(200)与所述安装框(400)之间，所述载体框(500)通过所述第一对焦弹性件(300)和所述第二对焦弹性件(800)弹性连接于所述安装框(400)，所述镜头(200)通过所述载体框(500)活动连接所述安装框(400)，所述第三驱动件(600)设于所述载体框(500)，
    所述第一驱动件(700)可驱动所述第三驱动件(600)进行运动，所述载体框(500)可随所述第三驱动件(600)进行沿所述镜头(200)光轴的运动，所述镜头(200)可随所述载体框(500)进行对焦运动，所述第一对焦弹性件(300)和所述第二对焦弹性件(800)可随所述载体框(500)运动进行弯曲形变。
  11. 根据权利要求10所述的拍摄装置，其中，所述第一驱动件(700)为磁体，所述第三驱动件(600)和所述第二驱动件(1000)均为电磁线圈，
    所述第一驱动件(700)和所述第三驱动件(600)之间，以及所述第一驱动件(700)和所述第二驱动件(1000)之间分别进行电磁驱动。
  12. 根据权利要求11所述的拍摄装置，其中，所述第二驱动件(1000)共计四个，并分别设于所述基板(1100)的拐角处，所述第一驱动件(700) 也共计四个，并与所述第二驱动件(1000)位置对应。
  13. 根据权利要求11所述的拍摄装置，其中，所述第三驱动件(600)围绕所述载体框(500)设置。
  14. 根据权利要求13所述的拍摄装置，其中，所述载体框(500)内设第一引导部(510)，所述安装框(400)内设第二引导部(410)和第三引导部(420)，
    所述第三驱动件(600)、所述第一引导部(510)、第一对焦弹性件(300)、所述第二引导部(410)和所述第三引导部(420)依次电连接，
    所述安装框(400)通过所述第三引导部(420)连接于所述底座(1400)。
  15. 根据权利要求2所述的拍摄装置，其中，所述拍摄装置还包括罩壳(100)，所述安装框(400)、所述第一驱动件(700)、所述第二驱动件(1000)和所述感光芯片(1300)均设于所述罩壳(100)内，
    所述镜头(200)的至少部分设置于所述罩壳(100)内，所述防抖驱动机构(Q)的至少部分设置于所述罩壳(100)内。
  16. 根据权利要求2所述的拍摄装置，其中，所述第二连接部(1230)设于所述弹性防抖部(1220)背离所述镜头(200)的一侧，所述基板(1100)背离所述镜头(200)的一面连接所述第二连接部(1230)，
    所述弹性防抖部(1220)和所述基板(1100)所确定的平面垂直所述镜头(200)光轴。
  17. 根据权利要求1所述的拍摄装置，其中，所述防抖弹性件(1200)共计4个，4个所述防抖弹性件(1200)分别设于所述基板(1100)的拐角处。
  18. 根据权利要求2所述的拍摄装置，其中，所述第一簧片(1221)和所述第二簧片(1223)上均设有中空区域。
  19. 一种电子设备：包括权利要求1～18中任意一项所述的拍摄装置。
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