WO2022213722A1

WO2022213722A1 - Electronic device and assembly method therefor

Info

Publication number: WO2022213722A1
Application number: PCT/CN2022/076180
Authority: WO
Inventors: 耿景卓
Original assignee: Oppo广东移动通信有限公司
Priority date: 2021-04-07
Filing date: 2022-02-14
Publication date: 2022-10-13

Abstract

The present application provides an electronic device and an assembly method therefor. The electronic device comprises a middle frame, a bonding member, and a bending cover plate. The middle frame comprises a first assembly surface and a first outer surface connected to each other, and a step slot is formed between the first assembly surface and the first outer surface; the bonding member is arranged in the step slot; and the bending cover plate comprises a body and a bending portion in bending connection with the periphery of the body, and a second assembly surface is formed at the end of the bending portion distant from the body. The first assembly surface and the second assembly surface are arranged opposite to each other, and the bonding connection between the first assembly surface and the second assembly surface is achieved by means of the bonding member; and a second outer surface of the bending cover plate, a third outer surface of the bonding member, and the first outer surface constitute a smooth surface. According to the present application, by changing a position where the step slot is formed, a boss at the outer periphery of the middle frame is removed, such that the outer surface of the middle frame, the outer surface of the bonding member, and the outer surface of the bending cover plate may constitute a smoothly transitional surface, thereby improving the flatness of the electronic device.

Description

Electronic device and method of assembling the same

technical field

The present application belongs to the technical field of electronic products, and specifically relates to electronic equipment and an assembling method thereof.

Background technique

When assembling a middle frame and a cover plate in an electronic device, usually a stepped groove is formed on the middle frame first, and then the cover plate is assembled into the stepped groove. However, in this way, there will be a boss at the transition between the middle frame and the cover plate protruding from the appearance surface of the cover plate, resulting in a smooth transition between the cover plate and the middle frame, and the user will have a scratching feeling when touching the appearance surface, reducing the use of electronic equipment. experience.

SUMMARY OF THE INVENTION

In view of this, a first aspect of the present application provides an electronic device, including a middle frame, an adhesive member, and a curved cover plate; the middle frame includes a connected first assembly surface and a first outer surface, the first assembly A stepped groove is formed between the surface and the first outer surface; the adhesive member is arranged in the stepped groove; the curved cover plate includes a body and a curved portion connected to the periphery of the body in a curved manner. One end of the part away from the body forms a second assembly surface;

Wherein, the first assembling surface and the second assembling surface are arranged opposite to each other, and the adhesive connection of the first assembling surface and the second assembling surface is realized by the adhesive member; and the curved cover plate The second outer surface of the adhesive member, the third outer surface of the bonding member, and the first outer surface constitute a smooth surface.

In the electronic device provided in the first aspect of the present application, the positions of the stepped grooves are changed, and the stepped grooves are formed between the first assembly surface and the first outer surface. In this way, there will be no bosses on the outer periphery of the middle frame. Therefore, the first outer surface, the second outer surface, and the third outer surface can form a smooth surface, even if the curved part, the bonding part, and the appearance surface of the middle frame form a continuous and integral surface, avoiding the convex surface Existence, thereby avoiding bumps, paint peeling and other defects in the production and manufacturing process, and improving the yield. Moreover, when the user touches the appearance surface of the electronic device, a scratching feeling is not generated, which improves the flatness and use experience of the electronic device.

In addition, in the first aspect of the present application, since there is no boss, and the middle frame and the curved cover plate are bonded by an adhesive member, the existence of a gap between the middle frame and the curved cover plate can be avoided compared with the related art, The effect of smooth transition between the middle frame and the curved cover plate is further improved, the flatness of the electronic device is improved, and the waterproof performance of the electronic device is further improved.

A second aspect of the present application provides an assembling method of an electronic device, comprising:

A middle frame is provided, which includes a first assembling surface and a first outer surface that are connected, and a stepped groove is formed between the first assembling surface and the first outer surface;

providing an adhesive, and setting the adhesive in the step groove;

A curved cover plate is provided, the curved cover plate includes a main body and a curved portion connected to the periphery of the main body in a curved manner, an end of the curved portion away from the main body forms a second mounting surface, the first mounting surface and the The second assembling surfaces are oppositely arranged; the second assembling surfaces are abutted against the adhesive, and part of the adhesive is protruded from the first outer surface; and

removing the adhesive protruding from the first outer surface, so that the second outer surface of the curved cover plate, the third outer surface of the adhesive member, and the first outer surface are formed to be smooth and the remaining adhesive is converted into a bonding piece, and the adhesive connection of the first mounting surface and the second mounting surface is realized through the bonding piece.

The assembly method provided in the second aspect of the present application may firstly provide the stepped groove structure described in the first aspect of the present application. The liquid adhesive is then placed in the stepped groove. A curved cover plate is then provided, and the curved cover plate is assembled to the midframe and connected with the adhesive. At this time, part of the adhesive will protrude from the first outer surface due to the pressing force, that is, protrude from the appearance surface of the electronic device. Since the appearance surface of the electronic device is smooth and flat at this time, and is not blocked by other components, no step structure will be formed. Therefore, the adhesive protruding from the first outer surface can be removed by equipment or manually before the adhesive is cured into an adhesive part, so that no adhesive residue is formed on the appearance surface of the electronic device, The production yield is further improved.

Description of drawings

In order to describe the technical solutions in the embodiments of the present application more clearly, the accompanying drawings required to be used in the embodiments of the present application will be described below.

FIG. 1 is a schematic three-dimensional structural diagram of an electronic device according to an embodiment of the present application.

FIG. 2 is a top view of FIG. 1 .

FIG. 3 is a schematic cross-sectional view along the A-A direction in FIG. 2 .

FIG. 4 is a partial schematic diagram of FIG. 3 .

FIG. 5 is a partial cross-sectional schematic diagram of an electronic device in another embodiment of the present application.

FIG. 6 is a partial cross-sectional schematic diagram of an electronic device in yet another embodiment of the present application.

FIG. 7 is a partial cross-sectional schematic diagram of an electronic device in yet another embodiment of the present application.

FIG. 8 is a partial cross-sectional schematic diagram of an electronic device in yet another embodiment of the present application.

9 is a top view of a middle frame, a support member, and an adhesive member in an embodiment of the present application.

FIG. 10 is a partial cross-sectional schematic diagram of an electronic device in yet another embodiment of the present application.

FIG. 11 is a partial cross-sectional schematic diagram of an electronic device in yet another embodiment of the present application.

FIG. 12 is a partial cross-sectional schematic diagram of an electronic device in yet another embodiment of the present application.

FIG. 13 is a partial cross-sectional schematic diagram of an electronic device in yet another embodiment of the present application.

FIG. 14 is a schematic cross-sectional view of an electronic device in yet another embodiment of the present application.

FIG. 15 is a process flow diagram of a method for assembling an electronic device according to an embodiment of the present application.

16-19 are schematic diagrams corresponding to S100, S200, S300, and S400, respectively.

FIG. 20 is a process flow diagram included in S300 in an embodiment of the present application.

FIG. 21 is a process flow diagram included in S200 in an embodiment of the application.

Label description:

Electronic equipment-1, middle frame-10, frame-11, inner surface-111, first assembly surface-112, first outer surface-113, first accommodation space-12, stepped groove-13, bottom surface-131, first Two sub-assembly surface-131a, second bending surface-131b, first sub-bending surface 131c, second sub-bending surface-131d, adhesive member-20, adhesive-20a, third outer surface-21 , curved cover plate-30, curved part-31, second assembly surface-311, second outer surface-312, main body-32, second accommodation space-33, first sub-assembly surface-34, first bending surface -35, support piece-60, support part-600, blocking piece-70, first limit surface-71, second limit surface-72, display screen-80, rear case-90, first logo-91, The second sign -92, the accommodating space -93.

Detailed ways

The following are the preferred embodiments of the present application. It should be pointed out that for those skilled in the art, without departing from the principles of the present application, several improvements and modifications can be made, and these improvements and modifications are also regarded as the present invention. The scope of protection applied for.

This embodiment provides an electronic device, including a middle frame, an adhesive member, and a curved cover plate; the middle frame includes a connected first assembly surface and a first outer surface, the first assembly surface and the first assembly surface A stepped groove is formed between an outer surface; the adhesive member is arranged in the stepped groove; the curved cover plate includes a main body and a curved portion connected to the periphery of the main body in a curved manner, and the curved portion is far away from the main body one end forms the second assembly surface;

Wherein, the bottom surface of the stepped groove is bent and connected to the first outer surface, one end of the bonding member is bonded to the bottom surface, and the other end is bonded to the second assembly surface.

Wherein, the second assembly surface includes a first sub-assembly surface and a first bending surface connected by bending, the first bending surface is also connected by bending the second outer surface, and the first bending surface is relatively is closer to the second outer surface than the first sub-assembly surface; and the first bending surface is bent in a direction away from the middle frame compared to the first sub-assembly surface.

The bottom surface of the stepped groove includes a second sub-assembly surface and a second bending surface that are connected by bending, the second bending surface is also connected to the first outer surface by bending, and the second bending surface is connected to the first outer surface. The second sub-assembly surface is closer to the first outer surface than the second sub-assembly surface; and the second bending surface is bent in a direction closer to the curved portion than the second sub-assembly surface.

Wherein, the first sub-assembly surface is parallel to the second sub-assembly surface, and the first bending surface is parallel to the second bending surface.

Wherein, the second bending surface includes a first sub-bending surface and a second sub-bending surface that are connected by bending, the second sub-bending surface is also bent and connected to the first outer surface, and the first sub-bending surface is also connected by bending. The two sub-bending surfaces are closer to the first outer surface than the first sub-bending surface; and the second sub-bending surface faces a direction away from the curved portion compared to the first sub-bending surface Bend.

Wherein, the electronic device further includes a support member, the support member is arranged in the stepped groove to support the second assembly surface, so that a specified distance is maintained between the second assembly surface and the bottom surface of the stepped groove .

Wherein, when the width of the bottom surface of the stepped groove is greater than the width of the second assembly surface in a direction parallel to the second assembly surface, the support member is disposed in the stepped groove.

Wherein, when the width of the bottom surface of the stepped groove is greater than the width of the second assembling surface in a direction parallel to the second assembling surface, part of the adhesive member acts as the supporting member to support the Bend the cover.

Wherein, when the width of the bottom surface of the stepped groove in the direction parallel to the second assembly surface is smaller than the width of the second assembly surface, the protruding portion of the stepped groove serves as the support member.

Wherein, the adhesive member is further arranged on the support member, and the adhesive member bonds the support member and the curved cover plate.

Wherein, the support member includes a plurality of support parts arranged at intervals.

Wherein, the electronic device further includes a blocking member, and the blocking member is provided on the first assembling surface, or the blocking member is provided on the supporting member.

Wherein, the main body and the curved portion are surrounded to form a second accommodation space, and the electronic device further includes a display screen, the display screen is arranged in the second accommodation space, and part of the display screen is sandwiched between the display screens. between the curved cover plate and the blocking member.

Wherein, the first assembly surface has a first mark, and the side of the curved cover plate close to the middle frame has a second mark, and the first mark corresponds to the second mark.

Wherein, the electronic device further includes a rear shell, the rear shell is arranged on the middle frame, and the rear shell and the curved cover plate are arranged on opposite sides of the middle frame; The middle frame and the curved cover plate are enclosed to form an accommodating space.

Wherein, the first outer surface is a curved surface, the second outer surface is a curved surface, and the third outer surface is a curved surface; the second outer surface of the curved cover plate and the third outer surface of the bonding member , and the first outer surface forms a smooth curved surface.

This embodiment also provides a method for assembling an electronic device, including:

providing an adhesive, and setting the adhesive in the step groove;

Wherein, "abutting the second mounting surface with the adhesive" includes:

Obtain the first mark on the first assembly surface and the second mark on the side of the curved cover plate close to the middle frame;

controlling the curved cover plate to move relative to the middle frame so that the second mark is aligned with the first mark; and

The curved cover plate is controlled to move toward the direction close to the middle frame, so that the second assembly surface abuts the adhesive.

Wherein, the electronic device further includes a support member, and the support member is arranged on the bottom surface of the stepped groove, and “providing an adhesive, and disposing the adhesive in the stepped groove” includes:

An adhesive is provided, the adhesive is arranged in the step groove, and a part of the adhesive is also arranged on the surface of the support member facing away from the bottom surface.

Before introducing the technical solution of the present application, the technical problems in the related art are introduced in detail.

With the continuous development of electronic devices, due to their portability and various operability, electronic devices are now favored by the majority of users. But at the same time, users' expectations and requirements for electronic equipment are getting higher and higher. For example, electronic equipment usually includes a middle frame and a curved cover. The middle frame and curved cover are usually assembled by first designing a deep middle frame step groove on the middle frame, and then assembling the curved cover into the step groove. The middle frame and the curved cover plate are bonded together by the adhesive arranged in the step groove.

However, in practice, the middle frame needs to be wider than the curved cover plate, so that the middle frame will have a boss at the transition with the curved cover plate to protrude from the appearance surface of the curved cover plate. When the boss size is too wide, it will affect the overall size and appearance. When the boss size is too narrow, it will affect its strength and manufacturability. At present, the design width commonly used in the industry is 0.15-0.3mm. However, regardless of the width of the boss, as long as the boss exists, the curved cover plate and the middle frame cannot smoothly transition, and the user will have a scratching feeling when touching the appearance surface, which reduces the experience of using the electronic device. In addition, because the size of the boss is very small, there are risks of deformation of the boss, paint peeling, etc. during the manufacturing and use process.

Moreover, due to the existence of the boss, a whole circle of tiny gaps will be formed between the inner wall of the stepped groove and the outer wall of the curved cover, which will not only affect the appearance performance of the electronic device, but also reduce the waterproof performance of the electronic device.

In addition, since the curved cover plate and the middle frame are bonded together by adhesive, it is very difficult to control the filling consistency of the adhesive to the gap between the middle frame and the curved cover plate. When there is too little adhesive, there is little adhesive in the gap, and the user can see the bottom color of the middle frame. When the amount of adhesive is too much, the glue will overflow the metal boss unevenly, resulting in poor glue overflow. In addition, since the outer wall of the curved cover plate and the boss form a stepped structure, the residual glue at the corner is not easy to be wiped off.

In view of this, in order to solve the above problems, the present application provides an electronic device. Please refer to FIG. 1 to FIG. 4 together. FIG. 1 is a schematic three-dimensional structure diagram of an electronic device according to an embodiment of the present application. FIG. 2 is a top view of FIG. 1 . FIG. 3 is a schematic cross-sectional view along the A-A direction in FIG. 2 . FIG. 4 is a partial schematic diagram of FIG. 3 . This embodiment provides an electronic device 1 . The electronic device 1 includes a middle frame 10 , an adhesive member 20 , and a curved cover plate 30 . The middle frame 10 includes a connected first mounting surface 112 and a first outer surface 113 , and a stepped groove 13 is formed between the first mounting surface 112 and the first outer surface 113 . The adhesive member 20 is arranged in the stepped groove 13 . The curved cover plate 30 includes a main body 32 and a curved portion 31 connected to the periphery of the main body 32 in a curved manner, and an end of the curved portion 31 away from the main body 32 forms a second assembly surface 311 . Wherein, the first assembling surface 112 and the second assembling surface 311 are disposed opposite to each other, and the adhesive connection between the first assembling surface 112 and the second assembling surface 311 is realized by the adhesive member 20; and The second outer surface 312 of the curved cover plate 30 , the third outer surface 21 of the adhesive member 20 , and the first outer surface 113 constitute a smooth surface.

The electronic device 1 provided by this embodiment includes but is not limited to a mobile phone, a tablet computer, a notebook computer, a palmtop computer, a personal computer (Personal Computer, PC), a personal digital assistant (Personal Digital Assistant, PDA), a portable media player (Portable Media Player) Player, PMP), navigation devices, wearable devices, smart bracelets, smart watches, pedometers and other mobile terminals, as well as stationary terminals such as digital TVs and desktop computers. In this application, the electronic device 1 is used as a smart watch for illustration.

The electronic device 1 provided in this embodiment includes a middle frame 10 . The middle frame 10 can play a role of supporting the curved cover plate 30 and the rear case 90 , and the middle frame 10 can also provide a foundation for installation and protection of other components of the electronic device 1 . Optionally, the middle frame 10 includes a plurality of frames 11 connected in sequence. That is, the middle frame 10 is formed by being surrounded by a plurality of frames 11 connected end to end, and it can also be understood that the middle frame 10 is formed by being surrounded by a circle of frames 11 . Further optionally, the middle frame 10 includes four borders 11 , which respectively constitute four sides of the middle frame 10 . In addition, the middle frame 10 provided in this embodiment may not include a bottom edge, that is, the area surrounded by the frame 11 is connected up and down.

Wherein, the middle frame 10 has a plurality of surfaces, such as an inner surface 111 , a first mounting surface 112 , a first outer surface 113 and the like. The inner surface 111 and the first outer surface 113 are disposed away from each other, and the first assembly surface 112 is bent to connect the inner surface 111 and the first outer surface 113 , namely the inner surface 111 and the first assembly surface 112. Three first outer surfaces 113 are connected by bending in sequence. The plurality of inner surfaces 111 surround the first receiving space 12 . The first outer surface 113 can be understood as the outer surface opposite to the inner surface, that is, the appearance surface of the electronic device 1 . At this time, the first assembly surface 112 can be understood as the surface connecting the inner surface and the outer surface, that is, the upper surface or the lower surface of the middle frame 10 , and the first assembly surface 112 is used as the upper surface for illustration in this application. In this embodiment, the stepped groove 13 can be formed on the first assembly surface 112 and the first outer surface 113 , that is, the stepped groove 13 is formed on the first assembly surface 112 and the first outer surface 113 at the same time. In this embodiment, the bottom surface 131 of the stepped groove 13 can be regarded as a part of the first mounting surface 112.

In addition, the stepped groove 13 can be understood as a space formed after removing a part of the structure of the upper surface and the appearance surface, and the space can be used to install other components such as the adhesive member 20 later. Moreover, since the stepped groove 13 is formed on the upper surface and the appearance surface at the same time, it can also be understood that the stepped groove 13 in this embodiment has a side wall only on one side close to the first accommodation space 12 , and does not have a side wall on the other side. As for the side walls of the stepped groove 13 in other directions, it depends on the extent to which the stepped groove 12 penetrates the first assembly surface 112 . When the stepped groove 13 is opened once around the first mounting surface 112 , the stepped groove 12 is in the shape of an annular shape at this time, so there is no side wall in the remaining directions. Otherwise, the stepped groove will also have side walls in the remaining directions. This can be adjusted according to the actual situation. In addition, after the middle frame 10 and the curved cover plate 30 are matched, the stepped groove 12 on the surface of the middle frame 10 and the curved cover plate 30 can be transformed into a groove structure.

Optionally, the middle frame 10 may be a plastic middle frame 10 , for example, the middle frame 10 may be made of thermoplastic or thermosetting plastic materials. The middle frame 10 can be processed by integral injection molding, so that the middle frame 10 has the advantages of high processing precision, high processing efficiency and low cost. Of course, it can be understood that the middle frame 10 can also be made of other materials such as metal. For example, the middle frame 10 is an aluminum alloy middle frame 10, etc., in this way, the middle frame 10 and the curved cover plate 30 can have both light weight , the advantages of high strength. The specific material of the middle frame 10 is not limited in the embodiment of the present application, and those skilled in the art can select it according to actual needs.

The electronic device 1 provided in this embodiment further includes a curved cover plate 30 . The curved cover plate 30 is generally used to protect the display screen 80 and encapsulate the electronic device 1 . The curved cover plate 30 includes a main body 32 and a curved portion 31, and the curved portion 31 is connected to the periphery of the main body 32 by bending, so that the curved cover plate 30 forms a 2.5D curved cover plate 30 or a 3D curved cover plate 30, so that the curved cover plate 30 can be formed. The edges of the plate 30 are curved. In addition, the main body 32 and the curved portion 31 are surrounded to form a second accommodating space 33 , and the second accommodating space 33 can be used for accommodating some devices. Optionally, the shape of the curved portion 31 is an arc, and the shape of the body 32 may be a straight line or an arc.

Optionally, the curved cover plate 30 may be a glass curved cover plate 30 or a plastic composite curved cover plate 30 . The glass curved cover plate 30 has the advantages of high strength, good hardness and not easy to deform. The plastic composite curved cover plate 30 has the advantages of good toughness, good ductility and low cost. The embodiment of the present application does not specifically limit the material of the curved cover plate 30, and those skilled in the art can set it according to the actual situation.

Further optionally, the curved cover plate 30 may be a 2.5D composite curved cover plate 30, which is formed by using a polymer as a matrix material and adding reinforcing materials, fillers, and the like. For example, the curved cover plate 30 can be made of epoxy resin, calcium carbonate, glass fiber and other additives mixed into a composite material, so that the curved cover plate 30 can have both high strength, light weight, strong weather resistance, acid and alkali resistance, Excellent corrosion resistance and wear resistance. In practical applications, the curved cover plate 30 can be processed by integral injection molding. Since integral injection molding has higher precision and lower cost, the curved cover plate 30 processed by integral injection molding also has the advantages of high precision and low cost. In practical applications, the integrated injection molding processing method can make the matching precision of the curved cover plate 30 and the middle frame 10 higher, the assembly effect is better, and the problem of interference noise can be effectively reduced.

The electronic device 1 provided in this embodiment further includes a bonding member 20 , which can play a role of fixed bonding. The bonding member 20 is arranged in the stepped groove 13 , and one end of the bonding member 20 is bonded to the middle frame. 10. Bond the curved cover plate 30 at the other end. Optionally, the material of the adhesive member 20 may be foam tape, EPDM rubber, or adhesive glue or the like.

It can be seen from the above content that due to the existence of the boss in the related art, the curved cover plate 30 and the middle frame 10 cannot smoothly transition, and the user has a scratching feeling when touching. Therefore, in this embodiment, the positions of the stepped grooves 13 are changed, and the stepped grooves 13 are formed on the first assembly surface 112 and the first outer surface 113 at the same time, so that there will be no bosses on the outer periphery of the middle frame 10 . Therefore, in this embodiment, the surface of the curved portion 31 facing away from the second accommodating space 33 , the surface of the adhesive member 20 facing away from the first accommodating space 12 , and the first outer surface 113 can be formed. Smooth surface, even if the second outer surface 312 of the curved cover plate 30, the third outer surface 21 of the bonding member 20, and the first outer surface 113 form a continuous, integral surface, avoiding bosses The existence of it, thus avoiding the bumps, paint peeling and other defects in the production and manufacturing process, and improving the yield. Moreover, when the user touches the appearance surface of the electronic device 1 , a scratching feeling is not generated, which improves the flatness and the use experience of the electronic device 1 .

In addition, in this embodiment, since there is no boss, and the bonding member 20 is used to bond the middle frame 10 and the curved cover 30, the gap between the middle frame 10 and the curved cover 30 can be avoided compared with the related art The existence of , further improves the effect of smooth transition between the middle frame 10 and the curved cover plate 30 , improves the flatness of the electronic device 1 , and further improves the waterproof performance of the electronic device 1 . The waterproof performance mentioned here refers to the ability of the electronic device 1 to prevent water from entering the interior of the electronic device 1 for a certain period of time when the electronic device 1 is placed in water of a certain depth.

Optionally, the first outer surface 113 is a curved surface, the second outer surface 312 is also a curved surface, the third outer surface 21 is also a curved surface, and the first outer surface 113 is a curved surface. It can also be understood that the second outer surface 312 of the curved cover plate 30 , the third outer surface 21 of the adhesive member 20 , and the first outer surface 113 form a smooth curved surface.

Referring again to FIG. 4 , in this embodiment, the bottom surface 131 of the stepped groove 13 is bent and connected to the first outer surface 113 , one end of the bonding member 20 is bonded to the bottom surface 131 , and the other end is bonded to the bottom surface 131 . The second assembly surface 311 is described.

Since the stepped groove 13 of this embodiment passes through at least part of the first assembly surface 112 and at least part of the first outer surface 113 at the same time, the bottom surface 131 of the stepped groove 13 can be bent and connected to the first outer surface 113 , and the bonding One end of the member 20 is bonded to the bottom surface 131 , and the other end is bonded to the curved cover plate 30 . In this way, arranging the adhesive member 20 in the covering direction of the curved cover plate 30 can further improve the connection performance between the middle frame 10 and the curved cover plate 30 . And due to the arrangement of the stepped groove 13 and the adhesive member 20 , the structure provided by this embodiment supports the glue-wiping process. Among them, the glue-wiping process refers to placing an excess amount of glue between the two bonded parts. When the parts are assembled in place, the glue can completely fill the assembly gap and evenly spill out of the product. Before the glue solidifies, use a cotton cloth Or the jig will remove the excess glue. The stepped groove 13 provided in this embodiment has a simple structure, so that good filling of the glue can be achieved, and after the glue overflows, the entire surface of the stepped groove 13 is flat and smooth transition due to the absence of the boss. Therefore, excess glue residue and overflow glue can be removed well, which further improves the production yield.

Optionally, the adhesive member 20 includes, but is not limited to, glue. The glue is liquid in an initial state. After the curved cover plate 30 is bonded, the glue will gradually solidify, thereby forming a solid adhesive member 20 .

The above content describes the relationship between the bonding member 20 , the middle frame 10 and the curved cover plate 30 , and this application will continue to introduce the relationship between the middle frame 10 and the mounting surface of the curved cover plate 30 .

Please also refer to FIG. 5 , which is a partial cross-sectional schematic diagram of an electronic device according to another embodiment of the present application. In this embodiment, the second assembly surface 311 includes a first sub-assembly surface 34 and a first bending surface 35 connected by bending, and the first bending surface 35 is also connected by bending the second outer surface 312 , the first bending surface 35 is closer to the second outer surface 312 than the first sub-assembly surface 34 ; and the first bending surface 35 faces the first sub-assembly surface 34 Bend away from the middle frame 10 .

This embodiment first introduces the curved cover plate 30 . The second assembly surface 311 of the curved cover plate 30 refers to the side surface of the curved portion 31 away from the main body 32 . There is a second outer surface 312, that is, a first chamfered structure. It can also be understood that the first sub-assembly surface 34 , the first bending surface 35 , and the second outer surface 312 form a first chamfering structure, and the first bending surface 35 is the first chamfering surface. In addition, since the first bending surface 35 is bent in a direction away from the middle frame 10 compared to the first sub-assembly surface 34 , the angle of the edge of the curved portion 31 can be increased, thereby preventing the curved portion 31 from being too sharp. , the process difficulty of bending the cover plate 30 is reduced, and it is beneficial to manufacture and processing. In addition, the curved cover plate 30 is not easily damaged, scratches are prevented, and the service life of the curved cover plate 30 is improved.

Optionally, the first bending surface 35 may be an inclined surface, which further reduces the technological difficulty of bending the cover plate 30 .

Optionally, the first bending surface 35 can be formed by preparing the second mounting surface 311 and the second outer surface 312 and then processing, so that the second mounting surface 311 becomes the first sub-mounting surface that is connected by bending. 34 and the first bending surface 35. Alternatively, the first sub-assembly surface 34 and the first bending surface 35 are prepared in the process of preparing the curved cover plate 30 .

Please also refer to FIG. 6 , which is a partial cross-sectional schematic diagram of an electronic device in yet another embodiment of the present application. In this embodiment, the bottom surface 131 of the stepped groove 13 includes a second sub-assembly surface 131 a and a second bending surface 131 b that are connected by bending, and the second bending surface 131 b is also connected by bending the first outer surface. 113, the second bending surface 131b is closer to the first outer surface 113 than the second sub-assembly surface 131a; and the second bending surface 131b is closer to the second sub-assembly surface 131a Bend toward the direction close to the curved portion 31 .

This embodiment will continue to introduce the middle frame 10 . The assembly surface of the middle frame 10 refers to the bottom surface 131 of the middle frame 10 after the stepped groove 13 is formed. In this embodiment, the bottom surface 131 of the stepped groove 13 is not a regular horizontal structure, but is composed of a second sub-assembly surface 131 a and a second bending surface 131 b that are connected by bending. The second sub-assembly surface 131a is a horizontal surface, and the second bending surface 131b is an inclined surface, and the horizontal surface is close to the inner side and the inclined surface is close to the outer side. In addition, the inclined direction of the inclined surface is inclined toward the direction close to the curved cover plate 30 , that is, the second bending surface 131 b is bent toward the direction close to the curved portion 31 compared with the second sub-assembly surface 131 a . It can also be understood that the distance between the side of the second bending surface 131b close to the second sub-assembly surface 131a and the second outer surface 312 is greater than the distance between the second bending surface 131b and the first The distance between one side of the sub-assembly surface 131a and the second outer surface 312 . Therefore, at this time, the inclined surface of the second bending surface 131b can be used as the side wall on the other side of the stepped groove 13, so that when the adhesive is filled, the adhesive can be fixed in the stepped groove 13 to prevent the adhesive from sticking. overflow.

Referring to FIG. 6 again, in this embodiment, the first sub-assembly surface 34 is parallel to the second sub-assembly surface 131a, and the first bending surface 35 is parallel to the second bending surface 131b.

In this embodiment, on the basis of the second sub-assembly surface 131a and the second bending surface 131b, the plane of the second sub-assembly surface 131a can be made parallel to the fourth surface 34, respectively, so that the second bending surface 131b The inclined surface of the slanted surface is parallel to the fifth surface 35, that is, the mating surface of the curved portion 31 and the mating surface of the middle frame 10 are set correspondingly, so that the thickness of the adhesive can be kept the same, and the connection between the middle frame 10 and the curved cover plate 30 can be improved. The balance and stability can prevent the problem of stress concentration in the adhesive member 20 .

Please also refer to FIG. 7 . FIG. 7 is a partial cross-sectional schematic diagram of an electronic device according to still another embodiment of the present application. In this embodiment, the second bending surface 131b includes a first sub-bending surface 131c and a second sub-bending surface 131d which are connected by bending, and the second sub-bending surface 131d is also connected by bending and connecting the first sub-bending surface 131d. an outer surface 113, the second sub-bending surface 131d is closer to the first outer surface 113 than the first sub-bending surface 131c; and the second sub-bending surface 131d is closer to the first outer surface 113 The first sub-bending surface 131c is bent in a direction away from the bending portion 31 .

In this embodiment, a second chamfering structure may also be provided at the connection between the second bending surface 131b and the first outer surface 113 , that is, the second bending surface 131b includes the first sub-bending surface 131c connected by bending The second sub-bending surface 131d, the first sub-bending surface 131c, the second sub-bending surface 131d, and the first outer surface 113 constitute a second chamfering structure, and the second sub-bending surface 131d is the second chamfering structure. Chamfered face. And since the second sub-bending surface 131d is bent in a direction away from the bending portion 31 compared to the first sub-bending surface 131c, the angle of the edge of the middle frame 10 can be increased, thereby preventing the middle frame 10 from being bent. The edge is too sharp, which reduces the technological difficulty of the middle frame 10 and is beneficial to the manufacturing process. In addition, the middle frame 10 is not easily damaged, scratches are prevented, and the service life of the middle frame 10 is improved.

Optionally, the second sub-bending surface 131d may be an inclined surface, which further reduces the difficulty of the process of the middle frame.

Optionally, the second sub-bending surface 131d may be formed by preparing the second bending surface 131b and the first outer surface 113 and then processing, so that the second bending surface 131b becomes the first bending and connecting surface. The sub-bending surface 131c and the second sub-bending surface 131d. Alternatively, the first sub-bending surface 131c and the second sub-bending surface 131d are prepared during the process of preparing the middle frame 10 (eg, injection molding).

The above content introduces the related structures of the middle frame 10 and the curved cover plate 30 . Next, the electronic device 1 may further add other structural components on the basis of the above structure, so as to further improve various performances of the electronic device 1 .

Please also refer to FIG. 8 , which is a partial cross-sectional schematic diagram of an electronic device in yet another embodiment of the present application. In this embodiment, the electronic device 1 further includes a support member 60 . The support member 60 is disposed in the stepped groove 13 to support the second assembly surface 311 , so that the second assembly surface 311 is connected to the second assembly surface 311 . A predetermined distance is maintained between the bottom surfaces 131 of the stepped grooves 13 .

In this embodiment, a support member 60 can also be added in the stepped groove 13 . The support member 60 is disposed on the bottom surface 131 of the stepped groove 13 , and the second assembly surface 311 can be connected to the support member 60 . It can also be understood that not all of the second assembling surface 311 is connected to the adhesive member 20 , but a part of the surface is connected to the adhesive member 20 , and the rest of the surface is provided on the support member 60 . The arrangement of the support member 60 in this embodiment can firstly enable the curved cover plate 30 and the support member 60 to be rigidly supported during the assembly process, so as to ensure the unevenness of the curved cover plate 30 caused by the uneven assembly force, and at the same time to ensure The consistency of the thickness of the bond 20 is achieved. Secondly, the rigid support also effectively supports the inner area of the curved cover plate 30, ensuring the high-level waterproof force reliability.

In addition, for the specific arrangement of the support member 60, the present embodiment provides three specific examples. In one embodiment, when the width of the bottom surface 131 of the stepped groove 13 is greater than the width of the second mounting surface 311 in the direction parallel to the second mounting surface 311 , the above-mentioned support needs to be provided at this time. 60 for support. The position of the support member 60 in the stepped groove 13 is not limited in this embodiment.

In the second embodiment, when the width of the bottom surface 131 of the stepped groove 13 in the direction parallel to the second mounting surface 311 is greater than the width of the second mounting surface 311 , the support member 60 may not be provided at this time. , the curved cover plate 30 is supported by the adhesive member 20 . During the preparation process, it is only necessary to control the curved cover plate 30 to slowly move toward the middle frame 10, and after moving to a specified distance, the adhesive still in liquid state can bond the curved cover plate 30, and when the liquid adhesive solidifies After the adhesive member 20 is changed, the adhesive member 20 can be used to support the curved cover plate 30 without the need for the support member 60 to support.

In the third embodiment, when the width of the bottom surface 131 of the stepped groove 13 is smaller than the width of the second assembly surface 311 in the direction parallel to the second mounting surface 311 , the protruding portion of the stepped groove 13 ( 8) to act as the support member 60. At this time, when the support member 60 is an integral structure with the middle frame 10, the support member 60 can be regarded as a part of the middle frame 10. To distinguish, a part of the structure of the frame 10 is named as the support member 60 .

Please also refer to FIG. 9 . FIG. 9 is a top view of a middle frame, a support member, and an adhesive member in an embodiment of the present application. In this embodiment, the support member 60 includes a plurality of support portions 600 arranged at intervals.

In the present embodiment, the support member 60 is not provided around the stepped groove 13 in a circle, but through the support portions 600 arranged at intervals, the support portion 600 can be arranged in a partial area to achieve the effect of fixed support. As shown in FIG. 9 , the number of frames 11 is 4, the number of support parts 600 is 8, and two support parts 600 may be provided on each frame 11 . In addition, the adhesive member 20 can still be provided between the two adjacent supporting parts 600 by means of the supporting part 600, so that compared with providing the supporting member 60 in a whole circle, the middle frame 10 and the bending part can be further improved. Connectivity of the cover plate 30 .

Please also refer to FIG. 10 . FIG. 10 is a partial cross-sectional schematic diagram of an electronic device according to another embodiment of the present application. In this embodiment, the adhesive member 20 is further disposed on the support member 60 , and the adhesive member 20 bonds the support member 60 and the curved cover plate 30 .

In addition, in the process of assembling, the adhesive member 20 can be set in the step groove 13 first, and in order to achieve the best bonding performance, usually an excess of the adhesive member 20 is filled, in this case, the part of the adhesive member 20 will be set on the step. The adhesive member 20 in the groove 13 overflows onto the support member 60 , and in this embodiment, the adhesive member 20 can be used to improve the connection effect between the curved cover plate 30 and the support member 60 .

Please also refer to FIG. 11 . FIG. 11 is a partial cross-sectional schematic diagram of an electronic device according to still another embodiment of the present application. In this embodiment, the electronic device 1 further includes a blocking member 70 , the blocking member 70 is disposed in the second receiving space 33 , and the blocking member 70 is disposed on the first assembly surface 112 , Alternatively, the blocking member 70 is provided on the supporting member 60 .

In this embodiment, the electronic device 1 may further include a blocking member 70 . The blocking member 70 is provided on the first mounting surface 112 , or the blocking member 70 is provided on the supporting member 60 . It can also be understood that the blocking member 70 is a protrusion provided on the first mounting surface 112 or the supporting member 60 . It can be seen from the above content that overfilling of the adhesive members 20 will cause part of the adhesive members 20 to overflow onto the support member 60 . Therefore, in this embodiment, the blocking member 70 can be used to block the portion of the adhesive member 20 to prevent the part from sticking to the supporting member 60 . The knot 20 enters the first accommodating space 12 , thereby affecting other components in the electronic device 1 . In this embodiment, a schematic diagram is shown in which the blocking member 70 is disposed on the first assembly surface 112 .

Please also refer to FIG. 12 . FIG. 12 is a partial cross-sectional schematic diagram of an electronic device according to still another embodiment of the present application. In this embodiment, the electronic device 1 further includes a display screen 80 , and the display screen 80 is disposed in the second accommodation space 33 .

In this embodiment, the electronic device 1 further includes a display screen 80 , and the display screen 80 is the main component of the electronic device 1 that performs a display function. In this embodiment, the display screen 80 can be arranged in the second receiving space 33 , so that the display screen 80 can be effectively protected by bending the cover plate 30 . In addition, the display screen 80 is arranged on the side of the curved cover plate 30 close to the second receiving space 33 , that is, the display screen 80 can be prevented from being pressed by the curved cover plate 30 being matched with the middle frame 10 or the support 60 . damaged, the service life of the display screen 80 is increased.

Optionally, the curved cover plate 30 is a transparent curved cover plate 30 , so that the light emitted by the display screen 80 can exit the electronic device 1 through the transparent curved cover plate 30 for viewing by the user.

Referring to FIG. 12 again, in this embodiment, part of the display screen 80 is sandwiched between the curved cover plate 30 and the blocking member 70 . Optionally, the blocking member 70 has a first limiting surface 71 facing away from the first accommodating space 12 , the curved portion 31 has a second limiting surface 72 facing the second accommodating space 33 , the The second limiting surface 72 is disposed opposite to the first limiting surface 71 , and part of the display screen 80 is sandwiched between the first limiting surface 71 and the second limiting surface 72 .

In this embodiment, part of the display screen 80 can also be sandwiched between the curved cover plate 30 and the blocking member 70 , that is, part of the display screen 80 is sandwiched between the first limiting surface 71 and the blocking member 70 . between the second limiting surfaces 72 . The blocking member 70 can not only be used to block the adhesive member 20 , but also can be used to display the position of the display screen 80 to reduce the difficulty of assembly. In addition, the blocking member 70 and the curved cover plate 30 can be used to fix the display screen 80 , so as to improve the fixing performance of the display screen 80 .

Please also refer to FIG. 13 . FIG. 13 is a partial cross-sectional schematic diagram of an electronic device according to still another embodiment of the present application. In this embodiment, the first assembly surface 112 has a first mark 91 , the side of the curved cover 30 close to the middle frame 10 has a second mark 92 , and the first mark 91 corresponds to the The second identification 92 .

In this embodiment, the first marking 91 may be provided on the first assembly surface 112 , and the second marking 92 may be provided on the curved portion 31 . In this way, during the assembling process, that is, during the process of covering the curved cover plate 30 with the middle frame 10, the curved cover plate 30 can be moved first, so that the second mark 92 on the curved cover plate 30 is aligned with the mark on the middle frame 10. The first mark 91 is used to align the curved cover plate 30 with the middle frame 10 in the assembly direction, and then the assembly is carried out, thereby improving the assembly accuracy of the electronic device 1 .

Please also refer to FIG. 14 . FIG. 14 is a schematic cross-sectional view of an electronic device in yet another embodiment of the present application. In this embodiment, the electronic device 1 further includes a rear casing 90 , the rear casing 90 is disposed on the middle frame 10 , and the rear casing 90 and the curved cover 30 are disposed on the middle frame 10 . Opposite sides; the rear case 90 , the middle frame 10 , and the curved cover plate 30 are surrounded to form an accommodating space 93 , and the accommodating space 93 includes the first accommodating space 12 and the second accommodating space 93 . Storage space 33.

In this embodiment, the electronic device 1 may further include a rear case 90 , and the rear case 90 and the curved cover plate 30 are disposed on opposite sides of the middle frame 10 . The rear case 90 , the middle frame 10 , and the curved cover plate 30 can wrap the electronic device 1 , so as to enclose an accommodating space 93 . The accommodating space 93 includes the first accommodating space 12 and the second accommodating space 33 . Other components of the electronic device 1 can be arranged in the accommodating space 93 .

In addition, the material of the rear case 90 may be the same as the material of the middle frame 10 , which will not be repeated in this embodiment.

The above is a detailed description of the relevant content of the electronic device 1 in the present application. According to an embodiment of the present application, an assembling method of the electronic device 1 is also provided. This assembling method can be used to assemble the electronic device 1 described above. Of course, the electronic device 1 can also be assembled by other assembly methods, which is not limited in this application. The electronic device 1 and the assembling method provided by the embodiments of the present application may be used in combination or alone, which does not affect the essence of the present application.

Please refer to FIGS. 15-19 . FIG. 15 is a process flow diagram of a method for assembling an electronic device according to an embodiment of the present application. 16-19 are schematic diagrams corresponding to S100, S200, S300, and S400, respectively. This embodiment provides an assembly method of the electronic device 1, including S100, S200, S300, and S400. The details of S100, S200, S300, and S400 are as follows.

Referring to FIG. 16 , S100 , the middle frame 10 is provided, which includes a first assembling surface 112 and a first outer surface 113 connected to each other, and a stepped groove 13 is formed between the first assembling surface 112 and the first outer surface 113 .

Referring to FIG. 17 , in S200 , an adhesive 20 a is provided, and the adhesive 20 a is disposed in the stepped groove 13 .

Please refer to FIG. 18 , S300 , a curved cover plate 30 is provided. The curved cover plate 30 includes a main body 32 and a curved portion 31 connected to the periphery of the main body 32 in a curved manner. The curved portion 31 is formed at an end away from the main body 32 . The second mounting surface 311, the first mounting surface 112 and the second mounting surface 311 are disposed opposite to each other; the second mounting surface 311 is abutted against the adhesive 20a, and part of the adhesive 20a is Protruding from the first outer surface 113 .

Referring to FIG. 19 , S400 , remove the adhesive 20 a protruding from the first outer surface 113 , so that the second outer surface 312 of the curved cover 30 and the third The outer surface 21 and the first outer surface 113 constitute a smooth surface; and the remaining adhesive 20a is converted into the adhesive member 20, and the first assembly surface 112 and the first assembly surface 112 and the Adhesive connection of the second mounting surface 311 .

In the assembling method provided by this embodiment, a stepped groove 13 with a special structure can be provided first, and the beneficial effects brought by the stepped groove 13 have been mentioned in the above content in this application, and will not be repeated here. Then, the liquid adhesive 20 a is placed in the stepped groove 13 . Further, the curved cover plate 30 is provided, and the curved cover plate 30 is assembled to the middle frame 10 and connected with the adhesive 20a. At this time, a part of the adhesive 20 a will be subjected to the pressing force to protrude from the first outer surface 113 , that is, to protrude from the appearance surface of the electronic device 1 . Since the appearance surface of the electronic device 1 is smooth and flat at this time, and is not blocked by other components, no step structure will be formed. Therefore, the adhesive 20 a protruding from the first outer surface 113 can be removed by equipment or manually before the adhesive 20 a is cured into the adhesive 20 , so that it will not be on the appearance surface of the electronic device 1 . Residual glue is formed on the surface, which further improves the production yield.

Please refer to FIG. 20 together. FIG. 20 is a process flow diagram included in S300 in an embodiment of the present application. In this embodiment, S300 "abutting the second mounting surface 311 with the adhesive 20a" includes S310, S320, and S330. The details of S310, S320, and S330 are as follows.

S310 , acquiring the first mark 91 on the first assembly surface 112 and the second mark 92 on the side of the curved cover plate 30 close to the middle frame 10 .

S320 , controlling the curved cover plate 30 to move relative to the middle frame 10 , so that the second mark 92 is aligned with the first mark 91 .

S330 , controlling the curved cover plate 30 to move toward the direction close to the middle frame 10 , so that the second assembly surface 311 abuts the adhesive 20 a.

Before mating the curved cover plate 30 with the middle frame 10 , the first identification 91 on the first assembly surface 112 of the middle frame 10 can be obtained first, and then the second identification 92 on the curved cover plate 30 can be obtained. Then, the curved cover plate 30 is controlled to move horizontally relative to the middle frame 10 so that the second mark 92 is aligned with the first mark 91 . At this time, it can be considered that the curved cover plate 30 and the middle frame 10 are aligned in the horizontal direction. Finally, the curved cover plate 30 can be controlled to move in the direction of the middle frame 10 , so that the curved cover plate 30 is assembled with the middle frame 10 , thereby improving the assembly accuracy of the electronic device 1 .

Please refer to FIG. 21 together. FIG. 21 is a process flow diagram included in S200 in an embodiment of the present application. In this embodiment, the electronic device 1 further includes a support member 60, and the support member 60 is provided on the bottom surface 131 of the stepped groove 13; S200 "provide the adhesive 20a, and set the adhesive 20a on the bottom surface 131 of the stepped groove 13; "Inside the stepped groove 13" includes S210. The detailed introduction of S210 is as follows.

S210 , providing adhesive 20 a , and disposing the adhesive 20 a in the stepped groove 13 , and part of the adhesive 20 a is also disposed on the surface of the support member 60 away from the bottom surface 131 .

In order to ensure a good bonding effect, an excess of the binder 20a is usually provided. When the excess adhesive 20 a is disposed in the stepped groove 13 , part of the adhesive 20 a will be disposed on the surface of the support member 60 away from the bottom surface 131 . In this way, when the curved cover plate 30 is subsequently controlled to cooperate with the middle frame 10, part of the surface of the curved cover plate 30 will be bonded with the adhesive 20a on the support member 60, thereby improving the connection between the curved cover plate 30 and the support member 60. performance.

The content provided by the embodiments of the present application has been introduced in detail above, and the principles and embodiments of the present application have been described and explained herein. Persons of ordinary skill, according to the idea of the present application, will have changes in the specific implementation manner and application scope. In conclusion, the contents of this specification should not be construed as a limitation on the present application.

Claims

An electronic device, characterized in that it includes a middle frame, an adhesive member, and a curved cover plate; the middle frame includes a first assembling surface and a first outer surface that are connected, the first assembling surface and the first A stepped groove is formed between the outer surfaces; the bonding element is arranged in the stepped groove; the curved cover plate comprises a main body and a curved part connected to the peripheral edge of the main body in a curved manner, and the curved part is far from the edge of the main body. One end forms a second assembly surface;

Wherein, the first assembling surface and the second assembling surface are arranged opposite to each other, and the adhesive connection of the first assembling surface and the second assembling surface is realized by the adhesive member; and the curved cover plate The second outer surface of the adhesive member, the third outer surface of the bonding member, and the first outer surface constitute a smooth surface.
The electronic device according to claim 1, wherein the bottom surface of the stepped groove is bent and connected to the first outer surface, one end of the bonding member is bonded to the bottom surface, and the other end is bonded to the first outer surface. Two assembly surfaces.
The electronic device according to claim 1, wherein the second assembly surface comprises a first sub-assembly surface and a first bending surface that are connected by bending, and the first bending surface is also connected by bending the first sub-assembly surface. a second outer surface, the first bending surface is closer to the second outer surface than the first sub-assembly surface; and the first bending surface faces away from the first sub-assembly surface compared to the first sub-assembly surface The direction of the middle frame is bent.
3. The electronic device according to claim 3, wherein the bottom surface of the stepped groove comprises a second sub-assembly surface and a second bending surface that are connected by bending, and the second bending surface is also connected by bending the second sub-assembly surface. a first outer surface, the second bending surface is closer to the first outer surface than the second sub-assembly surface; and the second bending surface is closer to the second sub-assembly surface than the second sub-assembly surface Bend in the direction of the curved portion.
The electronic device according to claim 4, wherein the first sub-mounting surface is parallel to the second sub-mounting surface, and the first bending surface is parallel to the second bending surface.
The electronic device according to claim 4, wherein the second bending surface comprises a first sub-bending surface and a second sub-bending surface that are connected by bending, and the second sub-bending surface is further bent The first outer surface is folded and connected, the second sub-bending surface is closer to the first outer surface than the first sub-bending surface; and the second sub-bending surface is closer to the first outer surface than the first sub-bending surface The sub-bending surface is bent in a direction away from the bending portion.
The electronic device according to claim 1, wherein the electronic device further comprises a support member, the support member is disposed in the stepped groove to support the second mounting surface, so that the second mounting surface Keep a specified distance from the bottom surface of the stepped groove.
The electronic device according to claim 7, wherein when the width of the bottom surface of the stepped groove is greater than the width of the second mounting surface in a direction parallel to the second mounting surface, the support The piece is arranged in the step groove.
The electronic device according to claim 7, wherein when the width of the bottom surface of the stepped groove is greater than the width of the second mounting surface in a direction parallel to the second mounting surface, part of the The adhesive acts as the support to support the curved cover plate.
8. The electronic device according to claim 7, wherein when the width of the bottom surface of the stepped groove is smaller than the width of the second mounting surface in a direction parallel to the second mounting surface, the step The protruding part of the slot acts as the support.
The electronic device according to claim 7, wherein the adhesive member is further provided on the support member, and the adhesive member bonds the support member and the curved cover plate.
The electronic device according to claim 7, wherein the support member comprises a plurality of support parts arranged at intervals.
The electronic device according to claim 7, characterized in that, the electronic device further comprises a blocking member, and the blocking member is provided on the first mounting surface, or the blocking member is provided on the support member.
14. The electronic device according to claim 13, wherein the main body and the curved portion are surrounded to form a second receiving space, the electronic device further comprises a display screen, and the display screen is arranged in the second receiving space In the space, part of the display screen is sandwiched between the curved cover plate and the blocking member.
The electronic device according to claim 1, wherein the first assembly surface has a first mark, the side of the curved cover plate close to the middle frame has a second mark, and the first mark is corresponding to the second identifier.
The electronic device according to claim 1, wherein the electronic device further comprises a rear shell, the rear shell is arranged on the middle frame, and the rear shell and the curved cover plate are arranged in the middle frame The opposite sides of the frame; the rear case, the middle frame, and the curved cover plate are enclosed to form an accommodating space.
The electronic device according to claim 1, wherein the first outer surface is a curved surface, the second outer surface is a curved surface, and the third outer surface is a curved surface; the second outer surface of the curved cover plate is a curved surface. The surface, the third outer surface of the bonding member, and the first outer surface constitute a smooth curved surface.
A method for assembling an electronic device, comprising:

A middle frame is provided, which includes a first assembling surface and a first outer surface that are connected, and a stepped groove is formed between the first assembling surface and the first outer surface;

providing an adhesive, and setting the adhesive in the step groove;

A curved cover plate is provided, the curved cover plate includes a main body and a curved portion connected to the periphery of the main body in a curved manner, an end of the curved portion away from the main body forms a second mounting surface, the first mounting surface and the The second assembling surfaces are oppositely arranged; the second assembling surfaces are abutted against the adhesive, and part of the adhesive is protruded from the first outer surface; and

removing the adhesive protruding from the first outer surface, so that the second outer surface of the curved cover plate, the third outer surface of the adhesive member, and the first outer surface are formed to be smooth and the remaining adhesive is converted into a bonding piece, and the adhesive connection of the first mounting surface and the second mounting surface is realized through the bonding piece.
The assembling method of claim 18, wherein "abutting the second assembling surface with the adhesive" comprises:

Obtain the first mark on the first assembly surface and the second mark on the side of the curved cover plate close to the middle frame;

controlling the curved cover plate to move relative to the middle frame so that the second mark is aligned with the first mark; and

The curved cover plate is controlled to move toward the direction close to the middle frame, so that the second assembly surface abuts the adhesive.
The assembling method according to claim 18, characterized in that, the electronic device further comprises a support member, the support member is provided on the bottom surface of the stepped groove, "provide an adhesive, and set the adhesive to the bottom surface. "In the step groove" includes:

An adhesive is provided, the adhesive is arranged in the step groove, and a part of the adhesive is also arranged on the surface of the support member facing away from the bottom surface.