WO2022138432A1 - 熱硬化性エポキシ樹脂組成物とその成形品、繊維強化複合材料、繊維強化複合材料用成形材料、および繊維強化複合材料の製造方法 - Google Patents
熱硬化性エポキシ樹脂組成物とその成形品、繊維強化複合材料、繊維強化複合材料用成形材料、および繊維強化複合材料の製造方法 Download PDFInfo
- Publication number
- WO2022138432A1 WO2022138432A1 PCT/JP2021/046477 JP2021046477W WO2022138432A1 WO 2022138432 A1 WO2022138432 A1 WO 2022138432A1 JP 2021046477 W JP2021046477 W JP 2021046477W WO 2022138432 A1 WO2022138432 A1 WO 2022138432A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fiber
- epoxy resin
- reinforced composite
- composite material
- group
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 197
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 197
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 155
- 239000000203 mixture Substances 0.000 title claims abstract description 149
- 239000000463 material Substances 0.000 title claims abstract description 119
- 239000003733 fiber-reinforced composite Substances 0.000 title claims abstract description 113
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 239000012778 molding material Substances 0.000 title claims abstract description 17
- -1 isocyanate compound Chemical class 0.000 claims abstract description 43
- 239000012783 reinforcing fiber Substances 0.000 claims abstract description 30
- 239000012948 isocyanate Substances 0.000 claims abstract description 28
- 239000000470 constituent Substances 0.000 claims abstract description 18
- 229910017053 inorganic salt Inorganic materials 0.000 claims abstract description 18
- 230000006698 induction Effects 0.000 claims abstract description 17
- 238000002156 mixing Methods 0.000 claims abstract description 12
- 239000003365 glass fiber Substances 0.000 claims description 85
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 75
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 64
- 239000004917 carbon fiber Substances 0.000 claims description 64
- 239000010936 titanium Substances 0.000 claims description 46
- 239000000835 fiber Substances 0.000 claims description 43
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 43
- 150000001875 compounds Chemical class 0.000 claims description 33
- 238000006243 chemical reaction Methods 0.000 claims description 32
- 239000007822 coupling agent Substances 0.000 claims description 29
- 125000000524 functional group Chemical group 0.000 claims description 25
- 229910052760 oxygen Inorganic materials 0.000 claims description 22
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 20
- 239000001301 oxygen Substances 0.000 claims description 20
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 16
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 15
- 239000002759 woven fabric Substances 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 13
- 238000000113 differential scanning calorimetry Methods 0.000 claims description 10
- 229920001971 elastomer Polymers 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 10
- 150000003839 salts Chemical class 0.000 claims description 10
- 125000003277 amino group Chemical group 0.000 claims description 9
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 9
- IBLKWZIFZMJLFL-UHFFFAOYSA-N 1-phenoxypropan-2-ol Chemical compound CC(O)COC1=CC=CC=C1 IBLKWZIFZMJLFL-UHFFFAOYSA-N 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 8
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 8
- 239000000806 elastomer Substances 0.000 claims description 7
- CXOFVDLJLONNDW-UHFFFAOYSA-N Phenytoin Chemical group N1C(=O)NC(=O)C1(C=1C=CC=CC=1)C1=CC=CC=C1 CXOFVDLJLONNDW-UHFFFAOYSA-N 0.000 claims description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 claims description 4
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 4
- 238000012937 correction Methods 0.000 claims description 4
- 230000035945 sensitivity Effects 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- 229910052783 alkali metal Inorganic materials 0.000 claims description 3
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 150000001340 alkali metals Chemical class 0.000 claims description 2
- 150000004820 halides Chemical class 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract description 34
- 239000011347 resin Substances 0.000 abstract description 34
- 238000001723 curing Methods 0.000 description 45
- 238000005470 impregnation Methods 0.000 description 31
- 238000005452 bending Methods 0.000 description 28
- 238000002360 preparation method Methods 0.000 description 28
- 239000000126 substance Substances 0.000 description 27
- 238000005259 measurement Methods 0.000 description 24
- 238000000034 method Methods 0.000 description 22
- 230000000052 comparative effect Effects 0.000 description 13
- 239000011521 glass Substances 0.000 description 11
- 238000002347 injection Methods 0.000 description 11
- 239000007924 injection Substances 0.000 description 11
- 238000000465 moulding Methods 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000004593 Epoxy Substances 0.000 description 8
- 229920002556 Polyethylene Glycol 300 Polymers 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 125000003700 epoxy group Chemical group 0.000 description 8
- 239000011342 resin composition Substances 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 239000002994 raw material Substances 0.000 description 7
- VLJQDHDVZJXNQL-UHFFFAOYSA-N 4-methyl-n-(oxomethylidene)benzenesulfonamide Chemical compound CC1=CC=C(S(=O)(=O)N=C=O)C=C1 VLJQDHDVZJXNQL-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 6
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 6
- HSZCZNFXUDYRKD-UHFFFAOYSA-M lithium iodide Chemical compound [Li+].[I-] HSZCZNFXUDYRKD-UHFFFAOYSA-M 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- NHGXDBSUJJNIRV-UHFFFAOYSA-M tetrabutylammonium chloride Chemical compound [Cl-].CCCC[N+](CCCC)(CCCC)CCCC NHGXDBSUJJNIRV-UHFFFAOYSA-M 0.000 description 6
- 229920003319 Araldite® Polymers 0.000 description 5
- 239000002585 base Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 150000004756 silanes Chemical class 0.000 description 5
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000010974 bronze Substances 0.000 description 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 4
- ADAKRBAJFHTIEW-UHFFFAOYSA-N 1-chloro-4-isocyanatobenzene Chemical compound ClC1=CC=C(N=C=O)C=C1 ADAKRBAJFHTIEW-UHFFFAOYSA-N 0.000 description 3
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 3
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical group OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000011208 reinforced composite material Substances 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 125000005372 silanol group Chemical group 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 description 2
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 2
- PULOARGYCVHSDH-UHFFFAOYSA-N 2-amino-3,4,5-tris(oxiran-2-ylmethyl)phenol Chemical compound C1OC1CC1=C(CC2OC2)C(N)=C(O)C=C1CC1CO1 PULOARGYCVHSDH-UHFFFAOYSA-N 0.000 description 2
- HEBTZZBBPUFAFE-UHFFFAOYSA-N 2-methyl-n-(oxomethylidene)benzenesulfonamide Chemical compound CC1=CC=CC=C1S(=O)(=O)N=C=O HEBTZZBBPUFAFE-UHFFFAOYSA-N 0.000 description 2
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- UNMYWSMUMWPJLR-UHFFFAOYSA-L Calcium iodide Chemical compound [Ca+2].[I-].[I-] UNMYWSMUMWPJLR-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 229920000604 Polyethylene Glycol 200 Polymers 0.000 description 2
- 229920002565 Polyethylene Glycol 400 Polymers 0.000 description 2
- 229920002582 Polyethylene Glycol 600 Polymers 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000001273 butane Substances 0.000 description 2
- 229910001640 calcium iodide Inorganic materials 0.000 description 2
- 229940046413 calcium iodide Drugs 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- WRJWRGBVPUUDLA-UHFFFAOYSA-N chlorosulfonyl isocyanate Chemical compound ClS(=O)(=O)N=C=O WRJWRGBVPUUDLA-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- KIQKWYUGPPFMBV-UHFFFAOYSA-N diisocyanatomethane Chemical compound O=C=NCN=C=O KIQKWYUGPPFMBV-UHFFFAOYSA-N 0.000 description 2
- HTDKEJXHILZNPP-UHFFFAOYSA-N dioctyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OCCCCCCCC HTDKEJXHILZNPP-UHFFFAOYSA-N 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000012784 inorganic fiber Substances 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- UJYAZVSPFMJCLW-UHFFFAOYSA-N n-(oxomethylidene)benzenesulfonamide Chemical compound O=C=NS(=O)(=O)C1=CC=CC=C1 UJYAZVSPFMJCLW-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- DGTNSSLYPYDJGL-UHFFFAOYSA-N phenyl isocyanate Chemical compound O=C=NC1=CC=CC=C1 DGTNSSLYPYDJGL-UHFFFAOYSA-N 0.000 description 2
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 2
- 150000004714 phosphonium salts Chemical group 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920002523 polyethylene Glycol 1000 Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical group 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920002994 synthetic fiber Polymers 0.000 description 2
- 239000012209 synthetic fiber Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- FWBSWSPGFNAXPP-UHFFFAOYSA-M (2,4-dichlorophenyl)methyl-triphenylphosphanium;chloride Chemical compound [Cl-].ClC1=CC(Cl)=CC=C1C[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 FWBSWSPGFNAXPP-UHFFFAOYSA-M 0.000 description 1
- VJVZPTPOYCJFNI-UHFFFAOYSA-M (2-ethoxy-2-oxoethyl)-triphenylphosphanium;bromide Chemical compound [Br-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC(=O)OCC)C1=CC=CC=C1 VJVZPTPOYCJFNI-UHFFFAOYSA-M 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- SAYKZWPCENNSDR-UHFFFAOYSA-M (n-methylanilino)-triphenylphosphanium;iodide Chemical compound [I-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)N(C)C1=CC=CC=C1 SAYKZWPCENNSDR-UHFFFAOYSA-M 0.000 description 1
- GFNDFCFPJQPVQL-UHFFFAOYSA-N 1,12-diisocyanatododecane Chemical compound O=C=NCCCCCCCCCCCCN=C=O GFNDFCFPJQPVQL-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- ZTNJGMFHJYGMDR-UHFFFAOYSA-N 1,2-diisocyanatoethane Chemical compound O=C=NCCN=C=O ZTNJGMFHJYGMDR-UHFFFAOYSA-N 0.000 description 1
- ZGDSDWSIFQBAJS-UHFFFAOYSA-N 1,2-diisocyanatopropane Chemical compound O=C=NC(C)CN=C=O ZGDSDWSIFQBAJS-UHFFFAOYSA-N 0.000 description 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 1
- IKYNWXNXXHWHLL-UHFFFAOYSA-N 1,3-diisocyanatopropane Chemical compound O=C=NCCCN=C=O IKYNWXNXXHWHLL-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- SIZPGZFVROGOIR-UHFFFAOYSA-N 1,4-diisocyanatonaphthalene Chemical compound C1=CC=C2C(N=C=O)=CC=C(N=C=O)C2=C1 SIZPGZFVROGOIR-UHFFFAOYSA-N 0.000 description 1
- DFPJRUKWEPYFJT-UHFFFAOYSA-N 1,5-diisocyanatopentane Chemical compound O=C=NCCCCCN=C=O DFPJRUKWEPYFJT-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- KIEKZKLQIRABBK-UHFFFAOYSA-N 1-(2-isocyanatophenyl)ethanone Chemical compound CC(=O)C1=CC=CC=C1N=C=O KIEKZKLQIRABBK-UHFFFAOYSA-N 0.000 description 1
- NOHQUGRVHSJYMR-UHFFFAOYSA-N 1-chloro-2-isocyanatobenzene Chemical compound ClC1=CC=CC=C1N=C=O NOHQUGRVHSJYMR-UHFFFAOYSA-N 0.000 description 1
- BUIQXUQLYZPMLS-UHFFFAOYSA-N 1-ethoxy-2-isocyanatobenzene Chemical compound CCOC1=CC=CC=C1N=C=O BUIQXUQLYZPMLS-UHFFFAOYSA-N 0.000 description 1
- ILNNRESNVHAHRM-UHFFFAOYSA-N 1-isocyanato-2,3,4-trimethylbenzene Chemical compound CC1=CC=C(N=C=O)C(C)=C1C ILNNRESNVHAHRM-UHFFFAOYSA-N 0.000 description 1
- CAJBJSNTODHAAU-UHFFFAOYSA-N 1-isocyanato-2,3-dimethoxybenzene Chemical compound COC1=CC=CC(N=C=O)=C1OC CAJBJSNTODHAAU-UHFFFAOYSA-N 0.000 description 1
- NNZVKALEGZPYKL-UHFFFAOYSA-N 1-isocyanato-2-methylpropane Chemical compound CC(C)CN=C=O NNZVKALEGZPYKL-UHFFFAOYSA-N 0.000 description 1
- KCHQIPPONLLUGU-UHFFFAOYSA-N 1-isocyanato-2-phenoxybenzene Chemical compound O=C=NC1=CC=CC=C1OC1=CC=CC=C1 KCHQIPPONLLUGU-UHFFFAOYSA-N 0.000 description 1
- IHHUGFJSEJSCGE-UHFFFAOYSA-N 1-isocyanato-2-phenylbenzene Chemical compound O=C=NC1=CC=CC=C1C1=CC=CC=C1 IHHUGFJSEJSCGE-UHFFFAOYSA-N 0.000 description 1
- BDQNKCYCTYYMAA-UHFFFAOYSA-N 1-isocyanatonaphthalene Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1 BDQNKCYCTYYMAA-UHFFFAOYSA-N 0.000 description 1
- QWDQYHPOSSHSAW-UHFFFAOYSA-N 1-isocyanatooctadecane Chemical compound CCCCCCCCCCCCCCCCCCN=C=O QWDQYHPOSSHSAW-UHFFFAOYSA-N 0.000 description 1
- OQURWGJAWSLGQG-UHFFFAOYSA-N 1-isocyanatopropane Chemical compound CCCN=C=O OQURWGJAWSLGQG-UHFFFAOYSA-N 0.000 description 1
- HIQAWCBKWSQMRQ-UHFFFAOYSA-N 16-methylheptadecanoic acid;2-methylprop-2-enoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(=C)C(O)=O.CC(=C)C(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O HIQAWCBKWSQMRQ-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- YIIHEMGEQQWSMA-UHFFFAOYSA-M 2-(dimethylamino)ethyl-triphenylphosphanium;bromide Chemical compound [Br-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CCN(C)C)C1=CC=CC=C1 YIIHEMGEQQWSMA-UHFFFAOYSA-M 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical class C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- VLKXLWGYPOUERV-UHFFFAOYSA-N 2-[3-(oxiran-2-ylmethoxy)propoxymethyl]oxirane Chemical compound C1OC1COCCCOCC1CO1 VLKXLWGYPOUERV-UHFFFAOYSA-N 0.000 description 1
- MOKYFHFMPMQNOT-UHFFFAOYSA-M 2-acetyloxyethyl(trimethyl)phosphanium;bromide Chemical compound [Br-].CC(=O)OCC[P+](C)(C)C MOKYFHFMPMQNOT-UHFFFAOYSA-M 0.000 description 1
- OYRWATRYBSDCFH-UHFFFAOYSA-M 2-acetyloxyethyl(trimethyl)phosphanium;chloride Chemical compound [Cl-].CC(=O)OCC[P+](C)(C)C OYRWATRYBSDCFH-UHFFFAOYSA-M 0.000 description 1
- KKOHCQAVIJDYAF-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O KKOHCQAVIJDYAF-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- XNBUZNKPVWOQHY-UHFFFAOYSA-M 2-hydroxyethyl(trimethyl)phosphanium;bromide Chemical compound [Br-].C[P+](C)(C)CCO XNBUZNKPVWOQHY-UHFFFAOYSA-M 0.000 description 1
- NIPWFPYJCVZBSC-UHFFFAOYSA-M 2-hydroxyethyl(trimethyl)phosphanium;chloride Chemical compound [Cl-].C[P+](C)(C)CCO NIPWFPYJCVZBSC-UHFFFAOYSA-M 0.000 description 1
- FQLNVWAFXQUXGW-UHFFFAOYSA-N 2-isocyanatobenzonitrile Chemical compound O=C=NC1=CC=CC=C1C#N FQLNVWAFXQUXGW-UHFFFAOYSA-N 0.000 description 1
- GSLTVFIVJMCNBH-UHFFFAOYSA-N 2-isocyanatopropane Chemical compound CC(C)N=C=O GSLTVFIVJMCNBH-UHFFFAOYSA-N 0.000 description 1
- WGRZHLPEQDVPET-UHFFFAOYSA-N 2-methoxyethoxysilane Chemical compound COCCO[SiH3] WGRZHLPEQDVPET-UHFFFAOYSA-N 0.000 description 1
- RVEJRPJGKXTQIF-UHFFFAOYSA-M 2-oxoethyl(triphenyl)phosphanium;chloride Chemical compound [Cl-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC=O)C1=CC=CC=C1 RVEJRPJGKXTQIF-UHFFFAOYSA-M 0.000 description 1
- XAMZZEBAJZJERT-UHFFFAOYSA-M 2-oxopropyl(triphenyl)phosphanium;chloride Chemical compound [Cl-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC(=O)C)C1=CC=CC=C1 XAMZZEBAJZJERT-UHFFFAOYSA-M 0.000 description 1
- WDGCBNTXZHJTHJ-UHFFFAOYSA-N 2h-1,3-oxazol-2-id-4-one Chemical group O=C1CO[C-]=N1 WDGCBNTXZHJTHJ-UHFFFAOYSA-N 0.000 description 1
- ZADOWCXTUZWAKL-UHFFFAOYSA-N 3-(3-trimethoxysilylpropyl)oxolane-2,5-dione Chemical compound CO[Si](OC)(OC)CCCC1CC(=O)OC1=O ZADOWCXTUZWAKL-UHFFFAOYSA-N 0.000 description 1
- OZFSDOFRXYCNKS-UHFFFAOYSA-N 3-[diethoxy(1-phenylpropan-2-yloxy)silyl]-n-ethenylpropan-1-amine Chemical compound C=CNCCC[Si](OCC)(OCC)OC(C)CC1=CC=CC=C1 OZFSDOFRXYCNKS-UHFFFAOYSA-N 0.000 description 1
- MBNRBJNIYVXSQV-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propane-1-thiol Chemical compound CCO[Si](C)(OCC)CCCS MBNRBJNIYVXSQV-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- FLROJJGKUKLCAE-UHFFFAOYSA-N 3-amino-2-methylphenol Chemical compound CC1=C(N)C=CC=C1O FLROJJGKUKLCAE-UHFFFAOYSA-N 0.000 description 1
- OXKAXHPVFLEQHV-UHFFFAOYSA-N 3-tri(propan-2-yloxy)silylpropan-1-amine Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)CCCN OXKAXHPVFLEQHV-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- AXEFESAPMLYPEF-UHFFFAOYSA-N 3-triethoxysilylpropanoic acid Chemical compound CCO[Si](OCC)(OCC)CCC(O)=O AXEFESAPMLYPEF-UHFFFAOYSA-N 0.000 description 1
- LVACOMKKELLCHJ-UHFFFAOYSA-N 3-trimethoxysilylpropylurea Chemical compound CO[Si](OC)(OC)CCCNC(N)=O LVACOMKKELLCHJ-UHFFFAOYSA-N 0.000 description 1
- WPSWDCBWMRJJED-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol;oxirane Chemical compound C1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 WPSWDCBWMRJJED-UHFFFAOYSA-N 0.000 description 1
- MLOSJPZSZWUDSK-UHFFFAOYSA-N 4-carboxybutyl(triphenyl)phosphanium;bromide Chemical compound [Br-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CCCCC(=O)O)C1=CC=CC=C1 MLOSJPZSZWUDSK-UHFFFAOYSA-N 0.000 description 1
- GHBRMZFUMLMOKO-UHFFFAOYSA-N 5-[diethoxy(methyl)silyl]pentane-1,3-diamine Chemical compound CCO[Si](C)(OCC)CCC(N)CCN GHBRMZFUMLMOKO-UHFFFAOYSA-N 0.000 description 1
- OSSMYOQKNHMTIP-UHFFFAOYSA-N 5-[dimethoxy(methyl)silyl]pentane-1,3-diamine Chemical compound CO[Si](C)(OC)CCC(N)CCN OSSMYOQKNHMTIP-UHFFFAOYSA-N 0.000 description 1
- DGRMXVRKGHVYEQ-UHFFFAOYSA-N 5-tri(propan-2-yloxy)silylpentane-1,3-diamine Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)CCC(N)CCN DGRMXVRKGHVYEQ-UHFFFAOYSA-N 0.000 description 1
- ZOTKGMAKADCEDH-UHFFFAOYSA-N 5-triethoxysilylpentane-1,3-diamine Chemical compound CCO[Si](OCC)(OCC)CCC(N)CCN ZOTKGMAKADCEDH-UHFFFAOYSA-N 0.000 description 1
- KHLRJDNGHBXOSV-UHFFFAOYSA-N 5-trimethoxysilylpentane-1,3-diamine Chemical compound CO[Si](OC)(OC)CCC(N)CCN KHLRJDNGHBXOSV-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 description 1
- 229910000013 Ammonium bicarbonate Inorganic materials 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical group C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 206010016654 Fibrosis Diseases 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- RAXXELZNTBOGNW-UHFFFAOYSA-O Imidazolium Chemical compound C1=C[NH+]=CN1 RAXXELZNTBOGNW-UHFFFAOYSA-O 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229920001730 Moisture cure polyurethane Polymers 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- OMRDSWJXRLDPBB-UHFFFAOYSA-N N=C=O.N=C=O.C1CCCCC1 Chemical compound N=C=O.N=C=O.C1CCCCC1 OMRDSWJXRLDPBB-UHFFFAOYSA-N 0.000 description 1
- INWVTRVMRQMCCM-UHFFFAOYSA-N N=C=O.N=C=O.C=1C=CC=CC=1C(C)(C)C1=CC=CC=C1 Chemical compound N=C=O.N=C=O.C=1C=CC=CC=1C(C)(C)C1=CC=CC=C1 INWVTRVMRQMCCM-UHFFFAOYSA-N 0.000 description 1
- HDONYZHVZVCMLR-UHFFFAOYSA-N N=C=O.N=C=O.CC1CCCCC1 Chemical compound N=C=O.N=C=O.CC1CCCCC1 HDONYZHVZVCMLR-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229920006282 Phenolic fiber Polymers 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical group CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 1
- 102220569696 Pyridoxal-dependent decarboxylase domain-containing protein 1_M11S_mutation Human genes 0.000 description 1
- 229910008051 Si-OH Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910006358 Si—OH Inorganic materials 0.000 description 1
- VBIIFPGSPJYLRR-UHFFFAOYSA-M Stearyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)C VBIIFPGSPJYLRR-UHFFFAOYSA-M 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- GKXVJHDEWHKBFH-UHFFFAOYSA-N [2-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC=C1CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 description 1
- ZEHGKSPCAMLJDC-UHFFFAOYSA-M acetylcholine bromide Chemical compound [Br-].CC(=O)OCC[N+](C)(C)C ZEHGKSPCAMLJDC-UHFFFAOYSA-M 0.000 description 1
- JUGOREOARAHOCO-UHFFFAOYSA-M acetylcholine chloride Chemical compound [Cl-].CC(=O)OCC[N+](C)(C)C JUGOREOARAHOCO-UHFFFAOYSA-M 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 235000012538 ammonium bicarbonate Nutrition 0.000 description 1
- 239000001099 ammonium carbonate Substances 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- HONIICLYMWZJFZ-UHFFFAOYSA-N azetidine Chemical group C1CNC1 HONIICLYMWZJFZ-UHFFFAOYSA-N 0.000 description 1
- UUZYBYIOAZTMGC-UHFFFAOYSA-M benzyl(trimethyl)azanium;bromide Chemical compound [Br-].C[N+](C)(C)CC1=CC=CC=C1 UUZYBYIOAZTMGC-UHFFFAOYSA-M 0.000 description 1
- KXHPPCXNWTUNSB-UHFFFAOYSA-M benzyl(trimethyl)azanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC1=CC=CC=C1 KXHPPCXNWTUNSB-UHFFFAOYSA-M 0.000 description 1
- VTQLZQMNJYFXIZ-UHFFFAOYSA-M benzyl(trimethyl)phosphanium;bromide Chemical compound [Br-].C[P+](C)(C)CC1=CC=CC=C1 VTQLZQMNJYFXIZ-UHFFFAOYSA-M 0.000 description 1
- TXXACRDXEHKXKD-UHFFFAOYSA-M benzyl(trimethyl)phosphanium;chloride Chemical compound [Cl-].C[P+](C)(C)CC1=CC=CC=C1 TXXACRDXEHKXKD-UHFFFAOYSA-M 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 125000001246 bromo group Chemical group Br* 0.000 description 1
- IRLQAJPIHBZROB-UHFFFAOYSA-N buta-2,3-dienenitrile Chemical compound C=C=CC#N IRLQAJPIHBZROB-UHFFFAOYSA-N 0.000 description 1
- SMTOKHQOVJRXLK-UHFFFAOYSA-N butane-1,4-dithiol Chemical group SCCCCS SMTOKHQOVJRXLK-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910001622 calcium bromide Inorganic materials 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- WGEFECGEFUFIQW-UHFFFAOYSA-L calcium dibromide Chemical compound [Ca+2].[Br-].[Br-] WGEFECGEFUFIQW-UHFFFAOYSA-L 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- DVBJBNKEBPCGSY-UHFFFAOYSA-M cetylpyridinium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+]1=CC=CC=C1 DVBJBNKEBPCGSY-UHFFFAOYSA-M 0.000 description 1
- YMKDRGPMQRFJGP-UHFFFAOYSA-M cetylpyridinium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+]1=CC=CC=C1 YMKDRGPMQRFJGP-UHFFFAOYSA-M 0.000 description 1
- USJRLGNYCQWLPF-UHFFFAOYSA-N chlorophosphane Chemical compound ClP USJRLGNYCQWLPF-UHFFFAOYSA-N 0.000 description 1
- SGMZJAMFUVOLNK-UHFFFAOYSA-M choline chloride Chemical compound [Cl-].C[N+](C)(C)CCO SGMZJAMFUVOLNK-UHFFFAOYSA-M 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- KQWGXHWJMSMDJJ-UHFFFAOYSA-N cyclohexyl isocyanate Chemical compound O=C=NC1CCCCC1 KQWGXHWJMSMDJJ-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- GAURFLBIDLSLQU-UHFFFAOYSA-N diethoxy(methyl)silicon Chemical compound CCO[Si](C)OCC GAURFLBIDLSLQU-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- YQGOWXYZDLJBFL-UHFFFAOYSA-N dimethoxysilane Chemical compound CO[SiH2]OC YQGOWXYZDLJBFL-UHFFFAOYSA-N 0.000 description 1
- XHWQYYPUYFYELO-UHFFFAOYSA-N ditridecyl phosphite Chemical compound CCCCCCCCCCCCCOP([O-])OCCCCCCCCCCCCC XHWQYYPUYFYELO-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- WUDNUHPRLBTKOJ-UHFFFAOYSA-N ethyl isocyanate Chemical compound CCN=C=O WUDNUHPRLBTKOJ-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000004761 fibrosis Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000001891 gel spinning Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical group OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- OTCKOJUMXQWKQG-UHFFFAOYSA-L magnesium bromide Chemical compound [Mg+2].[Br-].[Br-] OTCKOJUMXQWKQG-UHFFFAOYSA-L 0.000 description 1
- 229910001623 magnesium bromide Inorganic materials 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- BLQJIBCZHWBKSL-UHFFFAOYSA-L magnesium iodide Chemical compound [Mg+2].[I-].[I-] BLQJIBCZHWBKSL-UHFFFAOYSA-L 0.000 description 1
- 229910001641 magnesium iodide Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
- 150000004702 methyl esters Chemical group 0.000 description 1
- HAMGRBXTJNITHG-UHFFFAOYSA-N methyl isocyanate Chemical compound CN=C=O HAMGRBXTJNITHG-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- HNHVTXYLRVGMHD-UHFFFAOYSA-N n-butyl isocyanate Chemical compound CCCCN=C=O HNHVTXYLRVGMHD-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000007500 overflow downdraw method Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- AEHDSYHVTDJGDN-UHFFFAOYSA-M phenacyl(triphenyl)phosphanium;bromide Chemical compound [Br-].C=1C=CC=CC=1C(=O)C[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 AEHDSYHVTDJGDN-UHFFFAOYSA-M 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical group OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Inorganic materials [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000011593 sulfur Chemical group 0.000 description 1
- RKHXQBLJXBGEKF-UHFFFAOYSA-M tetrabutylphosphanium;bromide Chemical compound [Br-].CCCC[P+](CCCC)(CCCC)CCCC RKHXQBLJXBGEKF-UHFFFAOYSA-M 0.000 description 1
- IBWGNZVCJVLSHB-UHFFFAOYSA-M tetrabutylphosphanium;chloride Chemical compound [Cl-].CCCC[P+](CCCC)(CCCC)CCCC IBWGNZVCJVLSHB-UHFFFAOYSA-M 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- RAOIDOHSFRTOEL-UHFFFAOYSA-N tetrahydrothiophene Chemical compound C1CCSC1 RAOIDOHSFRTOEL-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- BRKFQVAOMSWFDU-UHFFFAOYSA-M tetraphenylphosphanium;bromide Chemical compound [Br-].C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 BRKFQVAOMSWFDU-UHFFFAOYSA-M 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- VOVUARRWDCVURC-UHFFFAOYSA-N thiirane Chemical compound C1CS1 VOVUARRWDCVURC-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- MQGXELHDPFXZHF-UHFFFAOYSA-M triethyl(2-methoxyethoxymethyl)azanium;bromide Chemical compound [Br-].CC[N+](CC)(CC)COCCOC MQGXELHDPFXZHF-UHFFFAOYSA-M 0.000 description 1
- BRNRUXYQLSAFEJ-UHFFFAOYSA-M triethyl(2-methoxyethoxymethyl)phosphanium;bromide Chemical compound [Br-].CC[P+](CC)(CC)COCCOC BRNRUXYQLSAFEJ-UHFFFAOYSA-M 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- SZEMGTQCPRNXEG-UHFFFAOYSA-M trimethyl(octadecyl)azanium;bromide Chemical compound [Br-].CCCCCCCCCCCCCCCCCC[N+](C)(C)C SZEMGTQCPRNXEG-UHFFFAOYSA-M 0.000 description 1
- CVFVQXOZIJNRLO-UHFFFAOYSA-M trimethyl(octadecyl)phosphanium;chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[P+](C)(C)C CVFVQXOZIJNRLO-UHFFFAOYSA-M 0.000 description 1
- AISMNBXOJRHCIA-UHFFFAOYSA-N trimethylazanium;bromide Chemical compound Br.CN(C)C AISMNBXOJRHCIA-UHFFFAOYSA-N 0.000 description 1
- CMSYDJVRTHCWFP-UHFFFAOYSA-N triphenylphosphane;hydrobromide Chemical compound Br.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 CMSYDJVRTHCWFP-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 238000002166 wet spinning Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/003—Polymeric products of isocyanates or isothiocyanates with epoxy compounds having no active hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4833—Polyethers containing oxyethylene units
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/487—Polyethers containing cyclic groups
- C08G18/4879—Polyethers containing cyclic groups containing aromatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/64—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63
- C08G18/6415—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63 having nitrogen
- C08G18/6423—Polyalkylene polyamines; polyethylenimines; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/71—Monoisocyanates or monoisothiocyanates
- C08G18/712—Monoisocyanates or monoisothiocyanates containing halogens
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/71—Monoisocyanates or monoisothiocyanates
- C08G18/715—Monoisocyanates or monoisothiocyanates containing sulfur in addition to isothiocyanate sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
- C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4028—Isocyanates; Thioisocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/042—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/043—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
- C08K5/19—Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/02—Polyglycidyl ethers of bis-phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2475/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
- C08J2475/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
Definitions
- the present invention relates to a thermosetting epoxy resin composition and a molded product thereof, a fiber-reinforced composite material, a molding material for a fiber-reinforced composite material, and a method for manufacturing a fiber-reinforced composite material.
- Thermosetting polyurethane resin is used in various fields as a material for paints, adhesives, foams, elastomers, etc. because the cured product has excellent flexibility, toughness, and adhesion to different members. There is. On the other hand, since the polyurethane resin has a short pot life, there is a problem that the viscosity of the resin increases during the inflow into the mold or the impregnation into the carrier, and the quality of the molded product deteriorates.
- Patent Document 1 discloses a technique for extending the pot life of a resin composition by blending a small amount of epoxy resin with a polyurethane prepolymer and using a Lewis acid base catalyst.
- Patent Document 2 discloses a catalyst composition capable of simultaneously improving the pot life and the heat resistance of the cured product by using an imidazolium-based catalyst.
- thermosetting resin composition In order to extend the pot life of the thermosetting resin composition, it is common to select a curing agent or catalyst with low activity, but the curing rate decreases, so the molding cycle time becomes longer. Further, since the activity of the catalyst is selected according to the molding temperature, it is indispensable to devise the process such as changing the temperature at the time of filling the resin and at the time of curing. Therefore, there is a need to create catalyst and resin design techniques that have excellent curing speed and can control the pot life in a wide temperature range.
- thermosetting resin compositions described in Patent Documents 1 and 2 have high stability at room temperature, but are not sufficiently stable at a temperature at which they are heat-cured.
- the present invention improves the drawbacks of the prior art, and exhibits a potential at a temperature at which the thermosetting resin is cured, and has an excellent curing rate, and the thermosetting epoxy resin composition is obtained by thermosetting.
- the purpose is to provide a molded product. Further, it is an object of the present invention to provide a fiber-reinforced composite material combined with a reinforcing fiber, a molding material for a fiber-reinforced composite material, and a method for producing a fiber-reinforced composite material.
- thermosetting epoxy resin composition of the present invention has the following constitution.
- thermosetting epoxy resin composition containing the following components [a], [b], and [c], wherein the relationship between the curing time (Tc) and the induction time (Ti) is 1 ⁇ Tc / Ti ⁇ .
- thermosetting the thermosetting epoxy resin composition of the present invention is obtained by thermosetting the thermosetting epoxy resin composition of the present invention.
- the first aspect of the fiber-reinforced composite material of the present invention comprises the molded product of the present invention and the reinforcing fiber.
- the molding material for a fiber-reinforced composite material of the present invention comprises the thermosetting epoxy resin composition of the present invention and the reinforcing fiber.
- the second aspect of the fiber-reinforced composite material of the present invention is that the molding material for the fiber-reinforced composite material of the present invention is thermoset.
- the first aspect of the method for producing a fiber-reinforced composite material of the present invention is to impregnate the reinforcing fibers with the thermosetting epoxy resin of the present invention and then heat-cure the fibers.
- the second aspect of the method for producing a fiber-reinforced composite material of the present invention is to place a woven fabric containing a reinforcing fiber as a main component in a mold, and after injecting and impregnating the thermosetting epoxy resin composition of the present invention. , Thermoset.
- thermosetting epoxy resin composition that exhibits potential at a thermosetting temperature and is excellent in quick curing.
- thermosetting epoxy resin composition of the present invention contains the following components [a], [b], and [c].
- the component [a] in the present invention is an epoxy resin.
- the epoxy resin is not particularly limited as long as it is a compound having an epoxy group in the molecule. Examples thereof include bisphenol A type epoxy resin, bisphenol F type epoxy resin, amine type epoxy resin, and aliphatic type epoxy resin having an aliphatic chain in the molecule. As the epoxy resin, these may be used alone or a plurality of types may be combined.
- Examples of commercially available bisphenol A type epoxy resins include “jER (registered trademark)” 825, “jER (registered trademark)” 827, and “jER (registered trademark)” 828 (all manufactured by Mitsubishi Chemical Corporation).
- Examples of commercially available bisphenol F type epoxy resins include “jER (registered trademark)” 806, “jER (registered trademark)” 807, and “jER (registered trademark)” 4004P (all manufactured by Mitsubishi Chemical Corporation).
- "EPICLON (registered trademark)” 830 manufactured by DIC Co., Ltd.
- “Epototo (registered trademark)” YD-170 is added to the resin.
- “Epototo (registered trademark)” YDF-8170C examples of commercially available bisphenol F type epoxy resins
- YDF-870GS examples of commercially available bisphenol F type epoxy resins
- Examples of the amine type epoxy resin include tetraglycidyl diaminodiphenylmethane, tetraglycidyl diaminodiphenyl sulfone, triglycidyl aminophenol, triglycidyl aminocresol, diglycidyl aniline, diglycidyl toluidine, tetraglycidyl xylylene diamine, or halogens and alkyl thereof.
- Examples include substitutes and hydrogenated products. Examples of commercially available products of such epoxy resins include the following.
- tetraglycidyldiaminodiphenylmethane examples include, for example, "Sumiepoxy (registered trademark)” ELM434 (manufactured by Sumitomo Chemical Co., Ltd.), YH434L (manufactured by Nittetsu Chemical & Materials Co., Ltd.), “jER (registered trademark)” 604. (Made by Mitsubishi Chemical Co., Ltd.), "Araldite (registered trademark)” MY720, “Araldite (registered trademark)” MY721 (all manufactured by Huntsman Advanced Materials) and the like.
- Examples of commercially available products of tetraglycidyl diaminodiphenyl sulfone include TG3DAS (manufactured by Mitsui Kagaku Fine Co., Ltd.).
- triglycidylaminophenol or triglycidylaminocresol Commercially available products of triglycidylaminophenol or triglycidylaminocresol include, for example, "Sumiepoxy (registered trademark)” ELM100, “Sumiepoxy (registered trademark)” ELM120 (all manufactured by Sumitomo Chemical Co., Ltd.), and “Araldite (registered trademark). ) "MY0500,” Araldite (registered trademark) "MY0510,” Araldite (registered trademark) "MY0600 (all manufactured by Huntsman Advanced Materials),” jER® "630 (manufactured by Mitsubishi Chemical Corporation) And so on.
- Examples of the aliphatic type epoxy resin include ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, trimethylene glycol diglycidyl ether, hexamethylene glycol diglycidyl ether and the like.
- Examples of commercially available products of such epoxy resins include the following.
- Examples of commercially available ethylene glycol diglycidyl ethers include "Denacol (registered trademark)" EX-850, “Denacol (registered trademark)” EX-851, and “Denacol (registered trademark)” EX-821 (above, Nagasechem). Tex Co., Ltd.) and the like.
- Examples of commercially available products of hexamethylene glycol diglycidyl ether include "Denacol (registered trademark)" EX-212 (manufactured by Nagase ChemteX Corporation).
- the component [b] in the present invention is an isocyanate compound.
- the isocyanate compound is not particularly limited as long as it is a compound having an isocyanate group in the molecule.
- the isocyanate group reacts with the epoxy group of the component [a] by thermosetting to form a rigid oxazolidone ring structure, whereby the molded product exhibits excellent moisture resistance and toughness.
- isocyanate compounds include aromatic isocyanates, aliphatic isocyanates, and alicyclic isocyanates. Among them, aromatic isocyanates containing aromatics in their molecular skeletons are preferable because they have excellent curing reactivity and exhibit excellent heat resistance.
- isocyanate compound examples include methylene diisocyanate, ethylene diisocyanate, propylene diisocyanate, trimethylene diisocyanate, dodecamethylene diisocyanate, hexamethylene diisocyanate, tetramethylene diisocyanate, pentamethylene diisocyanate, propylene-1,2-diisocyanate, and 2,3-dimethyltetra.
- Examples of commercially available aliphatic isocyanate products include HDI (manufactured by Tosoh Corporation), “Duranate (registered trademark)” D101, “Duranate (registered trademark)” D201 (all manufactured by Asahi Kasei Corporation), and the like. ..
- aromatic isocyanates examples include “Lupranate (registered trademark)” MS, “Luplanate (registered trademark)” MI, “Luplanate (registered trademark)” M20S, “Luplanate (registered trademark)” M11S, and “Luplanate (registered trademark)”.
- Examples of commercially available alicyclic isocyanates include "Takenate (registered trademark)” 600 (manufactured by Mitsui Chemicals, Inc.) and “Fortimo (registered trademark)” 1,4-H6XDI (manufactured by Mitsui Chemicals, Inc.). Can be mentioned.
- the stoichiometric ratio [b] / [a] of the component [b] to the component [a] is in the range of 0.7 to 2.0. preferable.
- the stoichiometric ratio [b] / [a] is the ratio of the number of moles of isocyanate groups contained in the component [b] to the number of moles of epoxy groups contained in the component [a].
- the component [c] in the present invention is an inorganic salt.
- the inorganic salt is a salt composed of a cation composed of an inorganic substance typified by a metal element and an anion derived from a base.
- the inorganic salt of the component [c] acts as a catalyst for promoting the curing reaction between the epoxy group of the component [a] and the isocyanate group of the component [b].
- the thermosetting epoxy resin composition expresses a certain period (hereinafter, induction time) in which the reaction does not proceed, that is, exhibits potential.
- induction time a certain period in which the reaction does not proceed
- it exhibits fast-curing property in which the reaction proceeds rapidly after the lapse of the induction time.
- latent and fast-curing properties are contradictory properties and are difficult to provide at the same time.
- the potential described in the present invention refers to the property of exhibiting the induction time when the thermosetting epoxy resin composition is exposed to a predetermined temperature.
- the induction time and the curing time are values obtained by dividing the measured curing time (Tc) by the induction time (Ti) when the thermosetting epoxy resin composition is exposed to a predetermined temperature, that is, Tc /.
- the value of Ti can be used as an index for evaluation.
- the curing time is the time from the time of exposure to a predetermined temperature to the completion of curing, and is defined as including the induction time. Therefore, since the Tc value cannot be smaller than the Ti value, the Tc / Ti value cannot be 1 or less, and the closer the Tc / Ti value is to 1, the higher the potential and the quick-curing property. It can be said that they are compatible.
- thermosetting epoxy resin composition of the present invention the relationship between the curing time (Tc) and the induction time (Ti) satisfies 1 ⁇ Tc / Ti ⁇ 9.
- Tc / Ti is larger than 9
- the curing time that is, the cycle time of molding is long
- the induction time that is, the time for maintaining fluidity in the thermosetting process is short, so that it is not suitable for the resin injection and impregnation process.
- thermosetting epoxy resin composition of the present invention preferably satisfies 1 ⁇ Tc / Ti ⁇ 5, more preferably 1 ⁇ Tc / Ti ⁇ 3, and even more preferably 1 ⁇ Tc / Ti ⁇ 2. Meet. By having Tc / Ti in such a range, the quick-curing property and the potential are more excellent.
- the induction time (Ti) in the present invention can be evaluated from the complex viscosity ⁇ * measured by measuring the thermosetting epoxy resin composition of the present invention at a predetermined temperature.
- the time from the start of measurement until ⁇ * measured at a predetermined temperature reaches four times using a dynamic viscoelasticity measuring device is defined as Ti.
- the curing time (Tc) in the present invention can be obtained by observing the time course of the complex viscosity ⁇ * at a predetermined temperature and taking the time when ⁇ * reaches saturation as Tc.
- thermosetting epoxy resin composition of the present invention preferably satisfies the following conditions. 0.003 ⁇ (number of moles of component [c] / number of moles of epoxy group of component [a]) ⁇ 0.05.
- thermosetting epoxy resin composition having an excellent balance between quick-curing property and potential.
- the number of moles of the component [c] is the sum of the number of moles of each inorganic salt blended in the thermosetting epoxy resin composition, and is represented by the following formula.
- Number of moles of component [c] (mass of inorganic salt A / molecular weight of inorganic salt A) + (mass of inorganic salt B / molecular weight of inorganic salt B) + ... + (mass of inorganic salt W / inorganic) Molecular weight of salt W).
- the inorganic salt used as the constituent element [c] of the present invention examples include an alkali metal salt, an alkaline earth metal salt, and a first transition metal salt.
- the component [c] contains a halide of an alkali metal.
- inorganic salts examples include calcium chloride, calcium bromide, calcium iodide, magnesium chloride, magnesium bromide, magnesium iodide, potassium chloride, potassium bromide, potassium iodide, sodium chloride, sodium bromide, and iodide.
- examples thereof include sodium, lithium chloride, lithium bromide, and lithium iodide.
- lithium halide salts such as lithium chloride, lithium bromide, and lithium iodide are preferable because they tend to have an excellent balance between latent and fast-curing properties.
- the above-mentioned inorganic salt may be contained alone or in combination of a plurality of types.
- thermosetting epoxy resin composition of the present invention can further contain the following component [d].
- [D] A compound having a structure represented by the formula (I) in the molecule.
- n represents an integer of 1 to 6
- m represents an integer of 4 to 1,000.
- R 1 and R 2 independently represent a hydrogen atom and an alkyl group.
- X represents O, NH, S, and COO.
- COO also includes the chemical structure of OCO.
- thermosetting epoxy resin composition By including the component [d], the compatibility of the component [c] with the epoxy resin is enhanced, so that the fast-curing property of the thermosetting epoxy resin composition becomes more excellent. Further, since the homogeneity of the thermosetting epoxy resin composition is improved, the mechanical properties of the molded product obtained by thermosetting the thermosetting epoxy resin composition are excellent.
- the compatibility between the component [c] and the epoxy resin is further enhanced, and the curing characteristics and the mechanical properties of the thermosetting epoxy resin cured product are further improved.
- the compatibility between the component [c] and the epoxy resin is particularly enhanced, and the curing characteristics and the mechanical properties of the heat-curable epoxy resin cured product are further improved. It is more preferable that R 1'and R 2'of the element [d] are hydrogen atoms and X is an O atom.
- R 1'and R 2'of the component [d] are hydrogen atoms and X is an O atom
- PEG-200, PEG-300, PEG-400, and PEG-600 Commercially available products of compounds in which R 1'and R 2'of the component [d] are hydrogen atoms and X is an O atom
- PEG-1000 and the like can be mentioned.
- the number of carbon atoms contained in the alkyl group is preferably 1 to 5. ..
- the compatibility between the component [c] and the epoxy resin is further enhanced, and the curing properties and the mechanical properties of the thermosetting epoxy resin cured product tend to be further excellent.
- the alkyl group having 1 to 5 carbon atoms include a methyl group, an ethyl group, a propyl group, a butyl group, an isopropyl group, a pentyl group and the like.
- thermosetting epoxy resin composition of the present invention can further contain the following component [e].
- thermosetting epoxy resin composition By simultaneously including the component [c] and the component [e], the thermosetting epoxy resin composition exhibits fast-curing properties that cannot be achieved by the component [c] alone, that is, the Tc / Ti. The value will be small. It is speculated that this effect is due to the fact that the component [e] promotes the catalytic activation action of the component [c].
- the halogenated onium salt in the present invention is an onium salt whose counter anion is a halide ion.
- the onium salt is not particularly limited, but is preferably a quaternary ammonium salt or a quaternary phosphonium salt.
- halogenated quaternary ammonium salt examples include trimethyloctadecylammonium chloride, trimethyloctadecylammonium bromide, benzyltrimethylammonium chloride, benzyltrimethylammonium bromide, tetrabutylammonium chloride, tetrabutylammonium bromide, and (2-methoxyethoxymethyl) triethyl.
- Ammonium chloride (2-methoxyethoxymethyl) triethylammonium bromide, (2-acetoxyethyl) trimethylammonium chloride, (2-acetoxyethyl) trimethylammonium bromide, (2-hydroxyethyl) trimethylammonium chloride, (2-hydroxyethyl) Examples thereof include trimethylammonium bromide, bis (polyoxyethylene) dimethylammonium chloride, bis (polyoxyethylene) dimethylammonium bromide, 1-hexadecylpyridinium chloride, 1-hexadecylpyridinium bromide and the like.
- halogenated quaternary phosphonium salt examples include trimethyloctadecylphosphonium chloride, trimethyloctadecilphosphonium bromide, benzyltrimethylphosphonium chloride, benzyltrimethylphosphonium bromide, tetrabutylphosphonium chloride, tetrabutylphosphonium bromide, and (2-methoxyethoxymethyl) triethyl.
- Phosphonium chloride (2-methoxyethoxymethyl) triethylphosphonium bromide, (2-acetoxyethyl) trimethylphosphonium chloride, (2-acetoxyethyl) trimethylphosphonium bromide, (2-hydroxyethyl) trimethylphosphonium chloride, (2-hydroxyethyl) Trimethylphosphonium bromide, bis (polyoxyethylene) dimethylphosphonium chloride, bis (polyoxyethylene) dimethylphosphonium bromide, tetraphenylphosphonium bromide, acetonyltriphenylphosphonium chloride, (4-carboxybutyl) triphenylphosphonium bromide, (4-carboxybutyl) Carboxypropyl) Triphenylphosphonium bromide, (2,4-dichlorobenzyl) triphenylphosphonium chloride, 2-dimethylaminoethyltriphenylphosphonium bromide, ethoxy
- thermosetting epoxy resin composition of the present invention contains both the component [d] and the component [e] in addition to the components [a], [b], and [c].
- thermosetting epoxy resin composition of the present invention can further contain the following component [f].
- Component [f] Elastomer-based high toughness agent.
- the elastomer-based high toughness agent is an additive having an effect of improving the toughness of a molded product, and its chemical structure includes an elastomer structure.
- the toughness of the thermosetting epoxy resin cured product is specifically improved.
- elastomer-based high toughness agent examples include crosslinked rubber particles such as core-shell rubber particles, thermoplastic elastomers such as block copolymers, terminal reactive rubbers such as carboxyl group-terminated butadiene nitrile rubber (hereinafter, may be referred to as CTBN), and CTBN.
- CTBN carboxyl group-terminated butadiene nitrile rubber
- examples include rubber-modified epoxy such as modified epoxy.
- the total amount of the component [f] in the present invention is preferably 0.2% by mass or more and 8% by mass or less, preferably 0.2% by mass or more and 4% by mass, in 100% by mass of the total amount of the thermosetting epoxy resin composition. It is more preferably contained in an amount of 0.2% by mass or more, and further preferably contained in an amount of 0.2% by mass or more and 2% by mass or less.
- thermosetting epoxy resin composition of the present invention can further contain the following component [g].
- [G] The compound Tg in which the reaction peak temperature Tg with the hydroxyl group is 15 ° C. or more lower than the reaction peak temperature Tb between the constituent element [b] and the hydroxyl group is 1-phenoxy-2-propanol and the constituent element [g] by mass. It is the peak temperature of the reaction exothermic curve obtained by mixing at a ratio of 10: 1 and performing differential scanning calorimetry at a heating rate of 10 ° C./min.
- Tb is the peak temperature of the reaction exothermic curve obtained by mixing 1-phenoxy-2-propanol and the component [b] at a mass ratio of 10: 1 and performing differential scanning calorimetry at a heating rate of 10 ° C./min. Is.
- the component [g] functions as a hydroxyl group capping agent.
- the hydroxyl group capping agent in the present invention is a compound that can react with a hydroxyl group to cap it, that is, contains a functional group capable of protecting the hydroxyl group in the molecule.
- the hydroxyl group present in the thermosetting epoxy resin composition particularly the hydroxyl group often contained in a small amount in the component [a] is capped.
- the urethanization reaction between the component [b] and the hydroxyl group which is a side reaction, is less likely to occur, so that the induction time of the epoxy resin composition of the present invention becomes longer, which makes it more suitable as a matrix resin for a fiber-reinforced composite material.
- thermosetting epoxy resin composition is formed by the fact that the reaction exothermic peak temperature Tg of the component [g] with the hydroxyl group is 15 ° C. or more lower than the reaction exothermic peak temperature Tb of the component [b] and the hydroxyl group.
- the hydroxyl group present in the hydroxyl group has a higher probability of causing a urethanization reaction with the constituent element [g] before the constituent element [b], and the potential of the thermosetting epoxy resin composition of the present invention becomes more excellent.
- Cheap the reaction exothermic peak temperature Tg of the component [g] with the hydroxyl group is 15 ° C. or more lower than the reaction exothermic peak temperature Tb of the component [b] and the hydroxyl group.
- the reaction exothermic peak temperature Tg between the component [g] and the hydroxyl group in the present invention is such that the hydroxyl group is capped when the component [g] and a specific hydroxyl group-containing compound are mixed and the temperature is raised at a constant rate. It means the temperature at which the reaction proceeds most violently.
- 1-phenoxy-2-propanol is prepared as a hydroxyl group-containing compound imitating a hydroxyl group-containing epoxy resin, and the hydroxyl group-containing compound and the component [g] are mixed at a mass ratio of 10: 1.
- the exothermic peak temperature of the hydroxyl group cap reaction in the reaction exothermic curve obtained by performing differential scanning calorimetry (DSC) at a heating rate of 10 ° C./min is Tg.
- the reaction exothermic peak temperature Tb of the constituent element [b] and the hydroxyl group in the present invention is the hydroxyl group and the constituent element when the constituent element [b] and a specific hydroxyl group-containing compound are mixed and the temperature is raised at a constant rate. It means the temperature at which the urethanization reaction with the isocyanate group of [b] proceeds most violently.
- 1-phenoxy-2-propanol is prepared as a hydroxyl group-containing compound imitating a hydroxyl group-containing epoxy resin, and the hydroxyl group-containing compound and the component [b] are mixed at a mass ratio of 10: 1.
- the exothermic peak temperature of the hydroxyl group cap reaction in the reaction exothermic curve obtained by performing differential scanning calorimetry (DSC) at a heating rate of 10 ° C./min is Tb.
- the total amount of the component [g] in the present invention preferably contains 0.5 parts by mass or more and 20 parts by mass or less with respect to 100 parts by mass of the total amount of the component [a], and includes 1 part by mass or more and 15 parts by mass or less. It is more preferable to contain 1 part by mass or more and 10 parts by mass or less.
- the component [g] contains a monoisocyanate compound having one isocyanate group in the molecule.
- Examples of the monoisocyanate compound having one isocyanate group in the molecule include methyl isocyanate, ethyl isocyanate, n-propyl isocyanate, isopropyl isocyanate, n-butyl isocyanate, isobutyl isocyanate, octadecyl isocyanate, cyclohexyl isocyanate, and chlorosulfonyl isocyanate.
- a sulfonyl isocyanate compound is preferable, and chlorosulfonyl isocyanate, benzenesulfonyl isocyanate, o-toluene sulfonyl isocyanate, and p-toluene sulfonyl isocyanate are more preferable from the viewpoint of the effect of increasing the induction time.
- the monoisocyanate compound having one isocyanate group in these molecules may be contained alone or may be contained in two or more kinds.
- thermosetting the thermosetting epoxy resin composition of the present invention is obtained by thermosetting the thermosetting epoxy resin composition of the present invention.
- the conditions and method of thermosetting are not particularly limited, and the temperature, curing time, etc. can be set according to the shape of the molded product and the purpose of use.
- the first aspect of the fiber-reinforced composite material of the present invention comprises the molded product of the present invention and the reinforcing fiber.
- the molding material for a fiber-reinforced composite material of the present invention comprises the thermosetting epoxy resin composition of the present invention and the reinforcing fiber.
- the molding material for a fiber-reinforced composite material of the present invention is not particularly limited as long as it contains the thermosetting epoxy resin composition of the present invention and the reinforcing fiber, and the reinforcing fiber is impregnated with the thermosetting epoxy resin composition. It does not matter whether it is in an impregnated state or in an unimpregnated state. Further, the thermosetting epoxy resin composition may be in an unreacted state or may be partially reacted and B-staged.
- the second aspect of the fiber-reinforced composite material of the present invention is that the molding material for the fiber-reinforced composite material of the present invention is thermoset.
- the first aspect of the method for producing a fiber-reinforced composite material of the present invention is to impregnate the reinforcing fibers with the thermosetting epoxy resin of the present invention and then heat-cure the fibers.
- Examples of the first aspect of the method for producing a fiber-reinforced composite material of the present invention include a prepreg method, a tow preg method, a FW (Filment Winding) method, a press molding method, a pull-fusion method, a film bag molding method, and the like.
- the second aspect of the method for producing a fiber-reinforced composite material of the present invention is to place a woven fabric containing a reinforcing fiber as a main component in a mold, and after injecting and impregnating the thermosetting epoxy resin composition of the present invention. , Thermoset.
- RTM Resin Transfer Molding: resin injection molding
- thermosetting epoxy resin composition of the present invention is preferably used in the RTM method because it shows the induction time for the resin to flow at the curing temperature.
- thermosetting epoxy resin composition is impregnated by injecting a thermosetting epoxy resin composition into a woven fabric containing reinforced fibers arranged in a molding mold as a main component. Then, it is molded by thermosetting in the molding mold.
- the main component here refers to the constituent elements of the woven fabric that occupy the largest proportion by mass.
- thermosetting epoxy resin composition when the thermosetting epoxy resin composition is injected into a woven fabric containing reinforcing fibers as a main component arranged in a molding mold, the thermosetting epoxy resin composition is molded. It is preferable to inject from a plurality of points provided on the mold. Specifically, a fiber to be obtained is obtained by using a molding mold having a plurality of injection ports and injecting the thermosetting epoxy resin composition from the plurality of injection ports at the same time or sequentially with a time lag. It is preferable to select and inject appropriate conditions according to the reinforced composite material because it can correspond to molded products of various shapes and sizes. There is no limit to the number and shape of such injection ports, but the more injection ports there are, the better, and the arrangement is such that the flow length of the resin can be shortened according to the shape of the molded product. Is preferable.
- the injection pressure when injecting the thermosetting epoxy resin composition is usually 0.1 to 1.0 MPa, preferably 0.1 to 0.6 MPa from the viewpoint of injection time and equipment economy. Further, a VaRTM (Vacum-Assisted Resin Transfer Molding) method in which the inside of the mold is vacuum-sucked and the thermosetting epoxy resin composition is injected can also be used. Even in the case of pressure injection, it is preferable to suck the inside of the mold into a vacuum before injecting the thermosetting epoxy resin composition because the generation of voids is suppressed.
- glass fiber As the reinforcing fiber used in the present invention, glass fiber, aramid fiber, carbon fiber, boron fiber and the like are preferably used. Among them, carbon fiber is preferably used because it is possible to obtain a fiber-reinforced composite material which is lightweight but has excellent mechanical properties such as strength and elastic modulus.
- the carbon fiber has a substantially perfect circular cross section.
- the fact that the cross-sectional shape is substantially circular means that the ratio (r / R) of the major axis R to the minor axis r of the cross section of the single thread measured by using an optical microscope is 0.9 or more.
- the major axis R refers to the diameter of the circumscribed circle of the cross-sectional shape of the single yarn
- the minor axis r refers to the diameter of the inscribed circle of the cross-sectional shape of the single yarn.
- the perfect circular shape improves the impregnation property of the thermosetting epoxy resin composition into the base material using the carbon fiber, and can reduce the risk of the generation of the unimpregnated portion.
- the average fiber diameter of such carbon fibers which is measured using an optical microscope, is preferably in the range of 4.0 to 8.0 ⁇ m, more preferably in the range of 5.0 to 7.0 ⁇ m. It is more preferably in the range of 3 to 7.0 ⁇ m.
- the average fiber diameter is in the above range, it is possible to achieve both impact resistance and tensile strength of the fiber-reinforced composite material using such carbon fibers.
- the surface specific oxygen concentration O / C of such carbon fibers is preferably in the range of 0.03 to 0.22.
- the surface specific oxygen concentration O / C is more preferably in the range of 0.05 to 0.22, and even more preferably in the range of 0.08 to 0.22. When the O / C is 0.22 or less, the fiber-reinforced composite material using such carbon fibers tends to have sufficient tensile strength.
- the adhesiveness between the carbon fiber and the thermosetting epoxy resin composition is improved, and the fiber-reinforced composite material using the carbon fiber tends to have sufficient mechanical properties. ..
- a means for setting the surface specific oxygen concentration O / C in the above range for example, a method of changing the type and concentration of the electrolytic solution at the time of electrolytic oxidation treatment, changing the amount of electricity, and the like can be mentioned.
- Such carbon fibers are, for example, inorganic fibers such as glass fibers, metal fibers and ceramic fibers, organic synthetic fibers such as polyamide fibers, polyester fibers, polyolefin fibers and novoloid fibers, and gold to the extent that the effects of the present invention are not impaired.
- inorganic fibers such as glass fibers, metal fibers and ceramic fibers
- organic synthetic fibers such as polyamide fibers, polyester fibers, polyolefin fibers and novoloid fibers
- gold to the extent that the effects of the present invention are not impaired.
- Silver, copper, bronze, brass, phosphorus bronze, aluminum, nickel, steel, stainless steel and the like and can be used in combination with metal wire, metal mesh, metal non-woven fabric and the like.
- the content of the carbon fiber in the total fiber is preferably 30% by mass or more, more preferably 50% by mass or more, and further preferably 70% by mass or more.
- the content of carbon fiber is in the above range, it is preferable because a fiber-reinforced composite material which is lightweight and has excellent mechanical properties can be obtained.
- glass fiber is also preferably used as a reinforcing fiber because it can be reduced in cost and weight.
- the glass fiber preferably has a surface functional group capable of forming a covalent bond with the isocyanate group.
- silicon Si—OH
- silanol group silicon (Si—OH) to which a hydroxyl group is bonded
- a coupling agent or the like having various functional groups is bonded to the silanol group as needed.
- the chemical properties of the surface of the glass fiber can be improved by making the glass fiber surface.
- having a surface functional group capable of forming a covalent bond with an isocyanate group means that at least one functional group capable of forming a covalent bond with the isocyanate group by a chemical reaction is present on the surface of the glass fiber. To do.
- the [b] isocyanate compound contained in the thermosetting epoxy resin composition can be chemically bonded to the glass fiber.
- the adhesiveness between the glass fiber and the thermosetting epoxy resin composition is improved, and high strength is easily exhibited.
- the adhesiveness between the glass fiber and the epoxy resin composition is improved too much, the tensile strength may decrease as described later, and the surface of the glass fiber may be appropriately treated with a coupling agent or the like. preferable.
- the surface functional group of the glass fiber is preferably at least one functional group selected from the group consisting of a hydroxyl group, an oxylan group, an amino group, a thiol group, and a carboxy group.
- the surface functional group of the glass fiber is an amino group because it is easily compatible with the epoxy resin composition and easily forms a covalent bond with the [b] isocyanate compound.
- the glass fiber has a functional group having active hydrogen on its surface.
- active hydrogen refers to a highly reactive hydrogen atom bonded to nitrogen, oxygen, and sulfur in an organic compound.
- one amino group has two active hydrogens.
- the functional group having active hydrogen include a hydroxyl group, an oxylan group, an amino group, a thiol group, a carboxy group and the like.
- the surface functional group of the glass fiber is preferably formed by being treated with at least one selected from the group consisting of a silane coupling agent, a titanium coupling agent, an aluminum coupling agent, and a zirconium coupling agent.
- a silane coupling agent one type may be used alone or two or more types may be used in combination. If there are too many silanol groups on the surface of the glass fiber surface, the [b] isocyanate compound contained in the epoxy resin composition and the glass fiber are chemically strongly bonded to improve the adhesiveness, but the tensile stress is applied to break the glass fiber. In this case, the strength of the fiber cannot be utilized and the epoxy resin is destroyed, so that the tensile strength may decrease. Therefore, it is preferable that the surface of the glass fiber is appropriately treated with a coupling agent or the like.
- silane coupling agent used for such glass fibers examples include ⁇ -aminopropyltrimethoxysilane, ⁇ -aminopropyltriethoxysilane, ⁇ -aminopropyltriisopropoxysilane, ⁇ -aminopropylmethyldimethoxysilane, and ⁇ -aminopropyl.
- Methyldiethoxysilane ⁇ - (2-aminoethyl) aminopropyltrimethoxysilane, ⁇ - (2-aminoethyl) aminopropylmethyldimethoxysilane, ⁇ - (2-aminoethyl) aminopropyltriethoxysilane, ⁇ -( 2-Aminoethyl) Aminopropylmethyldiethoxysilane, ⁇ - (2-aminoethyl) Aminopropyltriisopropoxysilane, ⁇ -ureidopropyltrimethoxysilane, N-phenyl- ⁇ -aminopropyltrimethoxysilane, N-benzyl Amino group-containing silanes such as - ⁇ -aminopropyltrimethoxysilane, N-vinylbenzyl- ⁇ -aminopropyltriethoxysilane; ⁇ -mercaptopropyltrimethoxys
- titanium coupling agent examples include isopropyltri (N-aminoethyl-aminoethyl) titanate, tetraoctylbis (ditridecylphosphite) titanate, and tetra (2,2-diallyloxymethyl-1-butyl) bis (ditridecyl) phos.
- Fight titanate bis (dioctylpyrophosphate) oxyacetate titanate, bis (dioctylpyrophosphate) ethylene titanate, isopropyltrioctanoyl titanate, isopropyldimethacrylisostearoyltitanate, isopropyltridodecylbenzenesulfonyltitanate, isopropylisostearoyldiacrylic titanate, isopropyl Examples thereof include tri (dioctylphosphate) titanate, isopropyltricylphenyl titanate, tetraisopropylbis (dioctylphosphate) titanate and the like.
- a silane coupling agent of amino group-containing silanes is preferable because it is easily compatible with the epoxy resin composition and can appropriately improve the adhesive strength and the impact resistance.
- the glass fiber contains a coupling agent
- it is preferably 0.01 to 5 parts by mass, more preferably 0.05 to 4 parts by mass, and 0.1 to 0.1 to 100 parts by mass with respect to 100 parts by mass of the glass fiber. It is more preferably 3 parts by mass.
- the content of the coupling agent is within the above range, the wettability of the thermosetting epoxy resin composition with respect to the glass fiber is improved, the adhesiveness and the impregnation property are appropriately improved, and the mechanical properties can be improved, which is preferable.
- Examples of the method for forming the coupling agent layer include a method in which a solution containing the coupling agent is applied to the surface of the glass fiber base material and then heat-treated.
- the solvent used for liquefying the coupling agent is not particularly limited as long as it does not react with the coupling agent, but for example, an aliphatic hydrocarbon solvent such as hexane, and aromatics such as benzene, toluene and xylene. Examples thereof include a system solvent, an ether solvent such as tetrahydrofuran, an alcohol solvent such as methanol and propanol, a ketone solvent such as acetone, water and the like, and one or a mixture of two or more of these solvents is used. ..
- any kind of glass fiber can be used depending on the application.
- glass fibers include E-glass, A-glass, C-glass, D-glass, R-glass, S-glass, ECR glass, NE-glass, quartz and fluorine-free and / or boron-free fibrosis commonly known as E-glass derivatives. Examples include those prepared from possible glass compositions.
- Such glass fibers are, for example, inorganic fibers such as carbon fibers, metal fibers and ceramic fibers, organic synthetic fibers such as polyamide fibers, polyester fibers, polyolefin fibers and noboroid fibers, and gold to the extent that the effects of the present invention are not impaired.
- inorganic fibers such as carbon fibers, metal fibers and ceramic fibers
- organic synthetic fibers such as polyamide fibers, polyester fibers, polyolefin fibers and noboroid fibers
- gold to the extent that the effects of the present invention are not impaired.
- Silver, copper, bronze, brass, phosphorus bronze, aluminum, nickel, steel, stainless steel and the like, metal wire, metal mesh, metal non-woven fabric and the like can be used in combination.
- the content of the glass fiber in the total fiber is preferably 30% by mass or more, more preferably 50% by mass or more, and further preferably 70% by mass or more.
- the content of the glass fiber is within the above range, it is preferable because a fiber-reinforced composite material which is lightweight and has excellent mechanical properties and weather resistance can be obtained.
- the reinforcing fiber may be either a short fiber or a continuous fiber, or both may be used in combination.
- continuous fibers are preferable.
- the reinforcing fiber may be used in the form of a strand, but the base material composed of the reinforcing fiber obtained by processing the reinforcing fiber into a form such as a mat, a woven fabric, a knit, a blade, or a one-way sheet is used. It is preferably used. Among them, a woven fabric in which a fiber-reinforced composite material having a high Vf is easily obtained and has excellent handleability is preferably used.
- Examples 1 to 12 and Comparative Examples 1 to 7 are as follows (including Tables 1 to 3).
- Isocyanate compound [b] -1 "Lupranate (registered trademark)" M20S (Polymeric MDI, Isocyanate equivalent: 134, manufactured by BASF INOAC Polyurethane Co., Ltd.)
- Component [d] Compound [d] -1 PEG-300 (manufactured by Sanyo Chemical Industries, Ltd.) having a structure represented by the formula (I) in the molecule.
- [D] -3 "Epomin (registered trademark)” SP-003 polyethyleneimine, manufactured by NOF CORPORATION).
- Component [g] Compound [g] -1 p-chlorophenylisocyanate in which the exothermic peak temperature Tg of the reaction with the hydroxyl group is 15 ° C. or higher lower than the peak temperature Tb of the reaction between the component [b] and the hydroxyl group (Tokyo Chemical Industry Co., Ltd.) ) Made) [G] -2 p-Toluenesulfonyl isocyanate (manufactured by Tokyo Chemical Industry Co., Ltd.).
- reaction exothermic peak temperature Tb between component [b] and hydroxyl group The component [b] is added to 100 parts by mass of the hydroxyl group-containing compound 1-phenoxy-2-propanol (manufactured by Tokyo Kasei Kogyo Co., Ltd.). 10 parts by mass was blended, and differential scanning calorimetry was carried out in the range of 0 ° C. to 250 ° C. at a heating rate of 10 ° C./min using a differential scanning calorimetry device (DSC2910: manufactured by TA Instruments). The exothermic peak temperature of the urethanization reaction in the obtained reaction exothermic curve was defined as Tb (° C.).
- reaction exothermic peak temperature Tg between the component [g] and the hydroxyl group Add the component [g] to 100 parts by mass of the hydroxyl group-containing compound 1-phenoxy-2-propanol (manufactured by Tokyo Kasei Kogyo Co., Ltd.). 10 parts by mass was blended, and differential scanning calorimetry was carried out in the range of 0 ° C. to 250 ° C. at a heating rate of 10 ° C./min using a differential scanning calorimetry device (DSC2910: manufactured by TA Instruments). The exothermic peak temperature of the urethanization reaction in the obtained reaction exothermic curve was defined as Tg (° C.).
- thermosetting Epoxy Resin Composition The constituent elements [a], the constituent element [c], the constituent element [d], and the constituent element [e] are blended with the compositions (mass ratio) shown in Tables 1 to 3. Then, after kneading at room temperature for 30 minutes, the component [f], the component [g] or other additives were blended to prepare a thermosetting epoxy resin composition.
- Tc Curing Time
- ATD-1000 manufactured by Alpha Technologies Co., Ltd.
- thermosetting epoxy resin composition under the conditions of a frequency of 1 Hz and a strain amount of 1%.
- the change over time in the dynamic viscoelasticity of the resin composition prepared according to the preparation was measured at the measurement temperatures shown in Tables 1 to 3, and the time when the complex viscosity ⁇ * reached 1000000 Pa ⁇ s was defined as the curing time (Tc). ..
- the temperature at the intersection of the tangent line drawn in the glass region and the tangent line drawn in the glass transition region is defined as the glass transition temperature.
- thermosetting epoxy resin composition As described in (4) Preparation of the thermosetting epoxy resin composition, the thermosetting epoxy resin composition was prepared by the number of blending parts shown in the composition column of Table 1. The Tc / Ti of the thermosetting epoxy resin composition measured at the measurement temperature shown in Table 1 was 3.9 to 5.0, and the potential and quick curability were good. The amount of bending and bending of the cured resin product was as good as 3.9 to 6.8 mm.
- Example 1 includes Example 1-1 to Example 1-3 of Table 1. The same applies to the other examples and comparative examples in Tables 1 to 3.
- thermosetting epoxy resin composition As described in (4) Preparation of the thermosetting epoxy resin composition, the thermosetting epoxy resin composition was prepared by the number of blending parts shown in the composition column of Table 1.
- the Tc / Ti of the thermosetting epoxy resin composition measured at the measurement temperature shown in Table 1 was 3.0 to 5.2, and the potential and quick curability were good.
- the amount of bending and bending of the cured resin product was as good as 3.7 to 6.6 mm.
- Example 3 PEG-300 was added to Example 1 as a component [d].
- the Tc / Ti of the cured epoxy resin was 2.1 to 2.8, which was excellent.
- the amount of bending and bending of the cured resin product was as good as 5.0 to 7.4 mm.
- Example 4 The component [b] of Example 1 was changed to reduce the amount added. Also, the component [c] was changed.
- the Tc / Ti of the cured epoxy resin was 4.4 to 8.2, which was an acceptable level.
- the amount of bending and bending of the cured resin product was 3.1 to 4.6 mm, which was a level that was not a problem.
- Example 5 The component [b], the component [c], and the component [d] were changed from the third embodiment.
- the Tc / Ti of the cured epoxy resin was as good as 3.5 to 3.8.
- the amount of bending and bending of the cured resin product was excellent at 6.7 to 7.8 mm.
- Tetrabutylammonium chloride was added as a component [e] to Example 1 to change the component [b] and the component [c].
- the Tc / Ti of the cured epoxy resin was 1.6 to 1.8, which was very excellent.
- the amount of bending and bending of the cured resin product was 5.1 to 5.5 mm, which was a level that was not a problem.
- thermosetting epoxy resin composition was prepared by the number of blending parts shown in the composition column of Table 2.
- the Tc / Ti of the cured epoxy resin was 1.3 to 1.7, which was very excellent.
- the amount of bending and bending of the cured resin product was as good as 5.5 to 8.3 mm.
- the glass transition temperature was 10 ° C. or higher higher than the curing temperature, which was good.
- Example 8 The component [a] of Example 7 was changed, p-chlorophenylisocyanate was added to the component [g], and the component [d] was changed.
- the Tc / Ti of the cured epoxy resin was 1.6, which was very excellent.
- the amount of bending and bending of the cured resin product was as excellent as 8.7 mm.
- thermosetting epoxy resin composition was prepared by the number of blending parts shown in the composition column of Table 2.
- the Tc / Ti of the cured epoxy resin was 1.4, which was very excellent.
- the amount of bending and bending of the cured resin product was excellent at 8.6 mm.
- Example 10 For the component [g] of Example 8, p-chlorophenylisocyanate was changed to p-toluenesulfonyl isocyanate. Tc / Ti was 1.5, which was very excellent. In addition, the amount of bending and bending of the cured resin product was excellent at 5.8 to 8.6 mm.
- thermosetting epoxy resin composition was prepared by the number of blending parts shown in the composition column of Table 2. Compared with Example 10, the amount of the component [g] is larger. The Tc / Ti of the cured epoxy resin was 1.1 to 2.5, which were very excellent. In addition, the amount of bending and bending of the cured resin product was excellent at 7.3 to 9.3 mm.
- thermosetting epoxy resin composition was prepared by the number of blending parts shown in the composition column of Table 2. Includes “Kaneace®” MX-267 as a component [f].
- the Tc / Ti of the cured epoxy resin product was as excellent as 1.7 to 4.4, and the amount of bending and bending of the cured resin product was also excellent as 8.0 to 12 mm.
- the value of Kic was 1.4 to 1.7 MPa ⁇ m 0.5 , which was very excellent.
- Examples 13 to 21 and Comparative Example 8 are as follows (including Table 4).
- thermosetting epoxy resin composition of the example is the same as the raw material of the above (1) thermosetting epoxy resin composition.
- the precursor fibers are heated in air at 240 to 280 ° C. with a draw ratio of 1.05 to convert them into flame resistant fibers, and the temperature rise rate in a temperature range of 300 to 900 ° C. in a nitrogen atmosphere is 200 ° C./min. After heating at a stretching ratio of 1.10, it was fired to 1400 ° C. to proceed with carbonization.
- the basis weight of the obtained carbon fibers was 0.50 g / m, and the density was 1.80 g / cm 3 .
- the surface specific oxygen concentration O / C of the carbon fiber [I] was 0.08, the average fiber diameter was 5.5 ⁇ m, and the cross-sectional shape was r / R of 0.95, which was substantially a perfect circle.
- the carbon fiber [II] was obtained by producing under the same conditions as the carbon fiber [I] except that the amount of electricity during the electrolytic oxidation treatment was 30 C / g / tank.
- the surface specific oxygen concentration O / C of the carbon fiber [II] was 0.18, the average fiber diameter was 5.5 ⁇ m, and the cross-sectional shape was r / R of 0.95, which was substantially a perfect circle.
- the carbon fiber [III] was obtained by producing under the same conditions as the carbon fiber [I] except that the amount of electricity during the electrolytic oxidation treatment was 1 C / g / tank.
- the surface specific oxygen concentration O / C of the carbon fiber [III] was 0.03, the average fiber diameter was 5.5 ⁇ m, and the cross-sectional shape was r / R of 0.95, which was substantially a perfect circle.
- the carbon fiber [IV] was obtained by producing under the same conditions as the carbon fiber [I] except that the amount of electricity during the electrolytic oxidation treatment was 100 C / g / tank.
- the surface specific oxygen concentration O / C of the carbon fiber [IV] was 0.22, the average fiber diameter was 5.5 ⁇ m, and the cross-sectional shape was r / R of 0.95, which was substantially a perfect circle.
- the surface specific oxygen concentration O / C of the carbon fiber [V] was 0.05, the average fiber diameter was 5.4 ⁇ m, and the cross-sectional shape was flat with an r / R of 0.8.
- thermosetting Epoxy Resin Composition An epoxy resin composition was prepared in the same manner as in the above (4) Preparation of the thermosetting epoxy resin composition with the composition (mass ratio) shown in Table 4.
- the amount of voids in the fiber-reinforced composite material was calculated from the void area ratio in the fiber-reinforced composite material by observing the cross section of the smoothly polished fiber-reinforced composite material with an epi-illuminating optical microscope.
- thermosetting epoxy resin composition As described in the above (15) Preparation of the thermosetting epoxy resin composition, after preparing the thermosetting epoxy resin, ⁇ carbon fiber [I]> is used as the carbon fiber to prepare the above (16) fiber-reinforced composite material. As described above, a fiber-reinforced composite material was produced. The in-plane shear strength of the fiber-reinforced composite material was excellent at 210 MPa. Further, the impregnation property was judged as "Fair”.
- Example 14 A thermosetting epoxy resin composition in which PEG-300 was added as a component [d] to Example 13 was used.
- the in-plane shear strength of the fiber-reinforced composite material was excellent at 220 MPa. Moreover, the impregnation property was excellent in the judgment of "Good”.
- thermosetting epoxy resin composition As described in the above (15) Preparation of the thermosetting epoxy resin composition, after preparing the thermosetting epoxy resin, ⁇ carbon fiber [I]> is used as the carbon fiber to prepare the above (16) fiber-reinforced composite material. As described above, a fiber-reinforced composite material was produced. The in-plane shear strength of the fiber-reinforced composite material was excellent at 210 MPa. Further, the impregnation property was judged as "Fair”.
- Example 16 A thermosetting epoxy resin composition to which PEG-300 was added as a component [d] and tetrabutylammonium bromide was added as a component [e] was used in Example 13.
- the in-plane shear strength of the fiber-reinforced composite material was excellent at 232 MPa. Moreover, the impregnation property was excellent in the judgment of "Good”.
- Example 17 A thermosetting epoxy resin composition in which the component [a] of Example 16 was changed, p-toluenesulfonyl isocyanate was added to the component [g], and the component [d] was changed was used.
- the in-plane shear strength of the fiber-reinforced composite material was as excellent as 240 MPa. Moreover, the impregnation property was excellent in the judgment of "Good”.
- Example 18 From Example 13, the carbon fiber was changed to ⁇ carbon fiber [II]>.
- the in-plane shear strength of the fiber-reinforced composite material was as excellent as 255 MPa. Moreover, the impregnation property was excellent in the judgment of "Good”.
- Example 19 From Example 13, the carbon fiber was changed to ⁇ carbon fiber [III]>.
- the in-plane shear strength of the fiber-reinforced composite material was 195 MPa, which was a level without any problem.
- the impregnation property was excellent in the judgment of "Good”.
- Example 20 From Example 13, the carbon fiber was changed to ⁇ carbon fiber [IV]>.
- the in-plane shear strength of the fiber-reinforced composite material was as excellent as 250 MPa. Moreover, the impregnation property was excellent in the judgment of "Good”.
- Example 21 From Example 13, the carbon fiber was changed to ⁇ carbon fiber [V]>.
- the in-plane shear strength of the fiber-reinforced composite material was 190 MPa, which was a level without any problem. Further, the impregnation property was judged as "Fair”.
- thermosetting epoxy resin composition containing the components [a], the components [b], and the components [e] was used. Moreover, ⁇ carbon fiber [I]> was used as the carbon fiber.
- the in-plane shear strength of the fiber-reinforced composite material was inferior to 150 MPa. In addition, a large number of voids were found in the fiber-reinforced composite material, and the impregnation property was inferior to the judgment of "Bad".
- Examples 22 to 32 and Comparative Example 9 are as follows (including Table 5).
- thermosetting epoxy resin composition of the example is the same as the raw material of the above (1) thermosetting epoxy resin composition.
- ⁇ Glass fiber [I]> A glass fiber woven fabric KS2700 (manufactured by Nitto Boseki Co., Ltd.) was used.
- Glass fiber woven fabric KS2700 manufactured by Nitto Boseki Co., Ltd.
- a methanol solution 1% by mass
- coupling agent KBM-403 3-glycidoxypropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Industry Co., Ltd.
- the solvent was removed by drying in a hot air oven at 110 ° C. for 5 hours to obtain glass fiber [II] having an oxylan group on the surface.
- ⁇ Glass fiber [III]> A glass fiber produced under the same conditions as the glass fiber [II] except that the coupling agent is KBM-903 (3-aminopropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd.) and has an amino group on the surface. [III] was obtained.
- ⁇ Glass fiber [IV]> It is prepared under the same conditions as glass fiber [II] except that the coupling agent is KBM-803 (3-mercaptopropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd.), and has a thiol group on the surface of the glass fiber. [IV] was obtained.
- ⁇ Glass fiber [V]> It was prepared under the same conditions as glass fiber [II] except that the coupling agent was X-12-967C (3-trimethoxysilylpropyl succinic anhydride, manufactured by Shin-Etsu Chemical Co., Ltd.), and carboxy on the surface. A glass fiber [V] having a group was obtained.
- Glass fiber [VI] produced under the same conditions as glass fiber [II] except that the coupling agent was KBM-1003 (vinyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd.) and has a vinyl group on the surface.
- KBM-1003 vinyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd.
- ⁇ Glass fiber [VII]> It was prepared under the same conditions as the glass fiber [II] except that the coupling agent was methyltrimethoxysilane (manufactured by Kanto Chemical Co., Ltd.), and a glass fiber [VII] having a methyl group on the surface was obtained.
- the coupling agent was methyltrimethoxysilane (manufactured by Kanto Chemical Co., Ltd.), and a glass fiber [VII] having a methyl group on the surface was obtained.
- thermosetting Epoxy Resin Composition An epoxy resin composition was prepared in the same manner as in the above (4) Preparation of the thermosetting epoxy resin composition with the composition (mass ratio) shown in Table 5.
- thermosetting epoxy resin composition As described in the above (21) Preparation of the thermosetting epoxy resin composition, after preparing the thermosetting epoxy resin, ⁇ glass fiber [I]> is used as the glass fiber to prepare the above (21) fiber-reinforced composite material. As described above, a fiber reinforced composite material was produced. The in-plane shear strength of the fiber-reinforced composite material was excellent at 170 MPa, and the tensile strength was 230 MPa, which was a level without any problem. Further, the impregnation property was judged as "Fair”.
- Example 23 A thermosetting epoxy resin composition in which PEG-300 was added as a component [d] to Example 22 was used.
- the in-plane shear strength of the fiber-reinforced composite material was excellent at 172 MPa, and the tensile strength was 234 MPa, which was a level without any problem. Further, the impregnation property was excellent as judged as "Good”.
- thermosetting epoxy resin composition As described in the above (21) Preparation of the thermosetting epoxy resin composition, after preparing the thermosetting epoxy resin, ⁇ glass fiber [I]> is used as the glass fiber to prepare the above (22) fiber-reinforced composite material. As described above, a fiber reinforced composite material was produced. The in-plane shear strength of the fiber-reinforced composite material was excellent at 176 MPa, and the tensile strength was 240 MPa, which was a level without any problem. Further, the impregnation property was judged as "Fair”.
- Example 25 A thermosetting epoxy resin composition to which PEG-300 was added as a component [d] and tetrabutylammonium bromide was added as a component [e] was used in Example 24.
- the in-plane shear strength of the fiber-reinforced composite material was excellent at 175 MPa, and the tensile strength was particularly excellent at 250 MPa. Further, the impregnation property was judged as "Good”.
- Example 26 A thermosetting epoxy resin composition in which the component [a] of Example 25 was changed, p-toluenesulfonyl isocyanate was added to the component [g], and the component [d] was changed was used.
- the in-plane shear strength of the fiber-reinforced composite material was excellent at 179 MPa, and the tensile strength was particularly excellent at 245 MPa. Further, the impregnation property was judged as "Good".
- Example 27 From Example 22, the glass fiber was changed to ⁇ glass fiber [II]>.
- the in-plane shear strength of the fiber-reinforced composite material was excellent at 170 MPa, and the tensile strength was excellent at 240 MPa. Further, the impregnation property was judged as "Good”.
- Example 28 From Example 22, the glass fiber was changed to ⁇ glass fiber [III]>.
- the in-plane shear strength of the fiber-reinforced composite material was extremely excellent at 180 MPa, and the tensile strength was particularly excellent at 255 MPa. Further, the impregnation property was judged as "Good”.
- Example 29 From Example 22, the glass fiber was changed to ⁇ glass fiber [IV]>.
- the in-plane shear strength of the fiber-reinforced composite material was excellent at 170 MPa, and the tensile strength was particularly excellent at 250 MPa. Further, the impregnation property was judged as "Good”.
- Example 30 From Example 22, the glass fiber was changed to ⁇ glass fiber [V]>.
- the in-plane shear strength of the fiber-reinforced composite material was excellent at 168 MPa, and the tensile strength was particularly excellent at 245 MPa. Further, the impregnation property was judged as "Good”.
- Example 31 From Example 22, the glass fiber was changed to ⁇ glass fiber [VI]>.
- the in-plane shear strength of the fiber-reinforced composite material was 165 MPa, which was a level without any problem, and the tensile strength was 245 MPa, which was particularly excellent. Further, the impregnation property was judged as "Fair”.
- Example 32 From Example 22, the glass fiber was changed to ⁇ glass fiber [VII]>.
- the in-plane shear strength of the fiber-reinforced composite material was 162 MPa, which was a level that was not a problem, and the tensile strength was 247 MPa, which was particularly excellent. Further, the impregnation property was judged as "Fair”.
- thermosetting epoxy resin composition containing the components [a], the components [b], and the components [e] was used. Moreover, ⁇ glass fiber [I]> was used as the glass fiber.
- the in-plane shear strength of the fiber-reinforced composite material was as low as 130 MPa and the tensile strength was as low as 200 MPa.
- a large number of voids were found in the fiber-reinforced composite material, and the impregnation property was inferior to the judgment of "Bad”.
- thermosetting epoxy resin composition of the present invention can be widely used as a molding material having excellent productivity because it exhibits high potential at a thermosetting temperature and is excellent in quick-curing property.
- it is suitably used for the production of fiber-reinforced composite materials, and can contribute to weight reduction of various structural members.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Description
[a]:エポキシ樹脂
[b]:イソシアネート化合物
[c]:無機塩。
[a]:エポキシ樹脂
[b]:イソシアネート化合物
[c]:無機塩
まず、これらの構成要素について説明する。
本発明における構成要素[a]はエポキシ樹脂である。かかるエポキシ樹脂は、分子内にエポキシ基を有する化合物であれば特に限定されない。例えば、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、アミン型エポキシ樹脂、分子内に脂肪族鎖を有する脂肪族型エポキシ樹脂などが挙げられる。エポキシ樹脂は、これらを単独で用いても、複数種類を組み合わせても良い。
本発明における構成要素[b]は、イソシアネート化合物である。かかるイソシアネート化合物は、分子内にイソシアネート基を有する化合物であれば特に限定されない。かかるイソシアネート基が、熱硬化により、構成要素[a]のエポキシ基と反応し、剛直なオキサゾリドン環構造を形成することにより、成形品が優れた耐湿熱性と靱性を発現する。
本発明における構成要素[c]は、無機塩である。無機塩は、金属元素に代表される無機物からなる陽イオンと塩基由来の陰イオンから構成される塩である。構成要素[c]の無機塩は、構成要素[a]のエポキシ基と構成要素[b]のイソシアネート基との硬化反応を促進する触媒として作用する。無機塩を触媒として用いることで、該熱硬化性エポキシ樹脂組成物は、反応が進行しない一定の期間(以下、誘導時間)を発現する、すなわち潜在性を示す。また、誘導時間の経過後には反応が急速に進行する速硬化性を示す。一般に、潜在性と速硬化性は相反する性質であり、同時に具備することは困難である。なお、本発明で述べる潜在性とは、所定の温度に熱硬化性エポキシ樹脂組成物を暴露した際に、前記誘導時間を発現する性質のことを指す。
0.003≦(構成要素[c]のモル数/構成要素[a]のエポキシ基モル数)≦0.05。
構成要素[c]のモル数=(無機塩Aの質量/無機塩Aの分子量)+(無機塩Bの質量/無機塩Bの分子量)+・・・・+(無機塩Wの質量/無機塩Wの分子量)。
構成要素[a]のエポキシ基モル数=(樹脂Aの質量/樹脂Aのエポキシ当量)+(樹脂Bの質量/樹脂Bのエポキシ当量)+・・・・+(樹脂Wの質量/無機塩Wのエポキシ当量)。
[e]:ハロゲン化オニウム塩。
構成要素[f]:エラストマー系高靭性化剤。
[g]:水酸基との反応ピーク温度Tgが構成要素[b]と水酸基との反応ピーク温度Tbよりも15℃以上低い化合物
Tgは、1-フェノキシ-2-プロパノールと構成要素[g]を質量比10:1で混合し、昇温速度10℃/分にて示差走査熱量測定を実施し得られる反応発熱カーブのピーク温度である。Tbは、1-フェノキシ-2-プロパノールと構成要素[b]を質量比10:1で混合し、昇温速度10℃/分にて示差走査熱量測定を実施し得られる反応発熱カーブのピーク温度である。
・構成要素[a]:エポキシ樹脂
[a]-1 “jER(登録商標)”825(ビスフェノールA型エポキシ樹脂、エポキシ当量:175、三菱ケミカル(株)製)
[a]-2 “jER(登録商標)”806(ビスフェノールF型エポキシ樹脂、エポキシ当量:165、三菱ケミカル(株)製)
[a]-3 “カネエース(登録商標)”MX-267エポキシ樹脂成分((株)カネカ製)。
[b]-1 “ルプラネート(登録商標)”M20S(ポリメリックMDI、イソシアネート当量:134、BASF INOAC ポリウレタン(株)製)
[b]-2 “ルプラネート(登録商標)”MI(モノメリックMDI、イソシアネート当量:126、BASF INOAC ポリウレタン(株)製)。
[c]-1 ヨウ化リチウム(東京化成工業(株)製)
[c]-2 臭化リチウム(東京化成工業(株)製)
[c]-3 塩化リチウム(東京化成工業(株)製)
[c]-4 ヨウ化カルシウム(東京化成工業(株)製)。
[d]-1 PEG-300(三洋化成工業(株)製)
[d]-2 “ニューポール(登録商標)”BPE-60(ビスフェノールAエチレンオキサイド付加物、三洋化成工業(株)製)
[d]-3 “エポミン(登録商標)”SP-003(ポリエチレンイミン、日油(株)製)。
[e]-1 テトラブチルアンモニウムブロミド(東京化成工業(株)製)
[e]-2 テトラブチルアンモニウムクロリド(東京化成工業(株)製)。
[f]-1 “カネエース(登録商標)”MX-267主成分((株)カネカ製)。
[g]-1 p-クロロフェニルイソシアネート(東京化成工業(株)製)
[g]-2 p-トルエンスルホニルイソシアネート(東京化成工業(株)製)。
イソホロンジアミン(東京化成工業(株)製)、“jERキュア(登録商標)”W(三菱ケミカル(株)製)、“リカシッド(登録商標)”HH(新日本理化(株)製)。
水酸基含有化合物1-フェノキシ-2-プロパノール(東京化成工業(株)製)100質量部に対して、構成要素[b]を10質量部配合し、示差走査熱量測定装置(DSC2910:TAインスツルメンツ社製)を用いて、昇温速度10℃/分にて0℃から250℃の範囲で示差走査熱量測定を実施した。得られた反応発熱カーブにおける、ウレタン化反応の発熱ピーク温度をTb(℃)とした。
水酸基含有化合物1-フェノキシ-2-プロパノール(東京化成工業(株)製)100質量部に対して、構成要素[g]を10質量部配合し、示差走査熱量測定装置(DSC2910:TAインスツルメンツ社製)を用いて、昇温速度10℃/分にて0℃から250℃の範囲で示差走査熱量測定を実施した。得られた反応発熱カーブにおける、ウレタン化反応の発熱ピーク温度をTg(℃)とした。
表1~3に記載した組成(質量比)で構成要素[a]、構成要素[c]、構成要素[d]、構成要素[e]を配合し、30分間室温で混練した後に、構成要素[f]や構成要素[g]またはその他の添加物を配合して熱硬化性エポキシ樹脂組成物を調製した。
動的粘弾性測定装置(ARES:TAインスツルメント社製)を用い、直径40mmのパラレルプレートを用い、周波数1Hz、Gap1mmの測定条件で、前記(4)熱硬化性エポキシ樹脂組成物の調製に従い調製した樹脂組成物の複素粘性率η*を、表1~3に記載の測定温度で測定し、測定開始直後に取得した値を、エポキシ樹脂組成物の粘度とした。
動的粘弾性測定装置(ARES:TAインスツルメント社製)を用い、直径40mmのパラレルプレートを用い、周波数1Hz、Gap1mmの測定条件で、前記(4)熱硬化性エポキシ樹脂組成物の調製に従い調製した樹脂組成物の複素粘性率η*の経時変化を、表1~3に記載の測定温度で測定した。測定開始直後と比較し、η*が4倍の値に到達した時間を誘導時間(Ti)とした。
ポリマー硬化測定装置(ATD-1000:アルファテクノロジーズ社製)を用い、周波数1Hz、歪み量1%の条件で、前記(4)熱硬化性エポキシ樹脂組成物の調製に従い調製した樹脂組成物の動的粘弾性の経時変化を表1~3に記載の測定温度で測定し、複素粘性率η*が1000000Pa・sに到達した時間を硬化時間(Tc)とした。
前記(4)熱硬化性エポキシ樹脂組成物の調製に従い調製した樹脂組成物を真空中で脱泡した後、密閉式のプレス成形機を表1~3に記載の硬化温度で保温した状態で、プレス圧1MPaの下、前記(7)硬化時間の測定から得られたTcの時間保圧し、所望する厚みの平板形状の成形品を作製した。
前記(8)成形品の作製に従って得た厚み2mmの成形品から、幅10mm、長さ40mmの試験片を切り出し、動的粘弾性測定装置(ARES:TAインスツルメント社製)を用い、固体ねじり治具に試験片をセットし、昇温速度5℃/分、周波数1Hz、歪み量0.1%にて30~300℃の温度範囲について測定を行った。縦軸が貯蔵弾性率の常用対数、横軸が温度の散布図において、ガラス領域に引いた接線と、ガラス転移領域に引いた接線との交点における温度をガラス転移温度とした。
前記(8)成形品の作製に従って得た厚み2mmの成形品から、幅10mm、長さ60mmの試験片を切り出し、スパン間距離32mmにて3点曲げを測定し、JIS K7171-1994に従い、曲げ弾性率、および靭性の指標となる曲げ撓み量を求めた。
前記(8)成形品の作製に従って得た厚み6mmの成形品から、幅12.7mmの試験片を切り出し、ASTM D5045-99に記載の試験片形状に加工を行った後、ASTM D5045-99に従ってSENB試験を実施した。サンプル数はn=15とし、その平均値を臨界応力拡大係数Kicとして、靭性とした。
前記(4)熱硬化性エポキシ樹脂組成物の調製のとおり、表1の組成欄に記載した配合部数で熱硬化性エポキシ樹脂組成物を調製した。かかる熱硬化性エポキシ樹脂組成物の、表1に記載の測定温度で測定したTc/Tiは3.9~5.0となり、潜在性と速硬化性は良好であった。また、樹脂硬化物の曲げ撓み量は3.9~6.8mmと良好であった。なお、実施例1には、表1の実施例1-1~実施例1-3を含む。表1~表3中の他の実施例、及び比較例についても同様である。
前記(4)熱硬化性エポキシ樹脂組成物の調製のとおり、表1の組成欄に記載した配合部数で熱硬化性エポキシ樹脂組成物を調製した。かかる熱硬化性エポキシ樹脂組成物の、表1に記載の測定温度で測定したTc/Tiは3.0~5.2となり、潜在性と速硬化性は良好であった。また、樹脂硬化物の曲げ撓み量は3.7~6.6mmと良好であった。
実施例1に構成要素[d]としてPEG-300を添加した。かかるエポキシ樹脂硬化物のTc/Tiは2.1~2.8と優れたものとなった。また、樹脂硬化物の曲げ撓み量は5.0~7.4mmと良好であった。
実施例1の構成要素[b]を変更し、添加量を減らした。また構成要素[c]を変更した。かかるエポキシ樹脂硬化物のTc/Tiは4.4~8.2と許容されるレベルであった。また、樹脂硬化物の曲げ撓み量は3.1~4.6mmと問題ないレベルであった。
実施例3から構成要素[b]、構成要素[c]および構成要素[d]を変更した。かかるエポキシ樹脂硬化物のTc/Tiは3.5~3.8と良好であった。また、樹脂硬化物の曲げ撓み量は6.7~7.8mmと優れたものであった。
実施例1に構成要素[e]としてテトラブチルアンモニウムクロリドを添加し、構成要素[b]および構成要素[c]を変更した。かかるエポキシ樹脂硬化物のTc/Tiは1.6~1.8と非常に優れたものであった。また、樹脂硬化物の曲げ撓み量は5.1~5.5mmと問題ないレベルあった。
表2の組成欄に記載した配合部数で熱硬化性エポキシ樹脂組成物を調製した。かかるエポキシ樹脂硬化物のTc/Tiは1.3~1.7と非常に優れたものであった。また、樹脂硬化物の曲げ撓み量は5.5~8.3mmと良好であった。また、ガラス転移温度も硬化温度より10℃以上高く、良好であった。
実施例7の構成要素[a]を変更、構成要素[g]について、p-クロロフェニルイソシアネートを追加し、構成要素[d]を変更した。かかるエポキシ樹脂硬化物のTc/Tiは1.6と非常に優れたものであった。また、樹脂硬化物の曲げ撓み量は8.7mmと優れたものであった。
表2の組成欄に記載した配合部数で熱硬化性エポキシ樹脂組成物を調製した。かかるエポキシ樹脂硬化物のTc/Tiは1.4と非常に優れたものであった。また、樹脂硬化物の曲げ撓み量は8.6mmと優れたものであった。
実施例8の構成要素[g]について、p-クロロフェニルイソシアネートをp-トルエンスルホニルイソシアネートに変更した。Tc/Tiは1.5と非常に優れたものであった。また、樹脂硬化物の曲げ撓み量は5.8~8.6mmと優れたものであった。
表2の組成欄に記載した配合部数で熱硬化性エポキシ樹脂組成物を調製した。実施例10と比較し、構成要素[g]の配合量が多い。かかるエポキシ樹脂硬化物のTc/Tiは1.1~2.5と非常に優れたものであった。また、樹脂硬化物の曲げ撓み量は7.3~9.3mmと優れたものであった。
表2の組成欄に記載した配合部数で熱硬化性エポキシ樹脂組成物を調製した。構成要素[f]として“カネエース(登録商標)”MX-267を含む。かかるエポキシ樹脂硬化物のTc/Tiは1.7~4.4と非常に優れたものであり、樹脂硬化物の曲げ撓み量も8.0~12mmと優れたものであった。また、Kicの値は1.4~1.7MPa・m0.5と非常に優れていた。
表3に記載の通り、構成要素[a]とエポキシ樹脂硬化剤として“jERキュア(登録商標)“Wを配合した。かかるエポキシ樹脂硬化物は、70℃では硬化が十分に進行せず、Tc/Tiを得ることができなかった。温度を180℃に変更したが、Tc/Tiは50と不十分なものであった。
表3に記載の通り、構成要素[a]とエポキシ樹脂硬化剤としてイソホロンジアミンを配合した。かかるエポキシ樹脂硬化物のTc/Tiは50~60と不十分なものであった。
表3に記載の通り、構成要素[a]とエポキシ樹脂硬化剤として“リカシッド(登録商標)“HHを配合した。かかるエポキシ樹脂硬化物のTc/Tiは50~144と不十分なものであった。
実施例1~3に構成要素[f]として“カネエース(登録商標)”MX-267を追加した。かかるエポキシ樹脂硬化物のTc/Tiは41~125と不十分なものであった。また、Kicの値は0.9~1.0MPa・m0.5であり、実施例12と異なり構成要素[a]~[c]と構成要素[f]を組み合わせたことによる特異的な靭性向上効果は見られなかった。
表3に記載の通り、構成要素[a]および構成要素[b]と、エポキシ樹脂硬化剤として構成要素[e]を配合した。かかるエポキシ樹脂硬化物のTc/Tiは10~75と不十分なものであった。
表3に記載の通り、構成要素[a]と構成要素[b]からなるエポキシ樹脂組成物を作製した。かかるエポキシ樹脂組成物は硬化が十分に進行せずTc/Tiを得ることができなかった。
表3に記載の通り、構成要素[a]とエポキシ樹脂硬化剤として“リカシッド(登録商標)“HHを配合し、さらに構成要素[c]を含むエポキシ樹脂組成物を作製した。構成要素[c]を配合した。かかるエポキシ樹脂組成物のTc/Tiは48~118と不十分なものであった。また、樹脂硬化物の曲げ撓み量は2.9~3.1mmと不十分なレベルであった。
実施例の熱硬化性エポキシ樹脂組成物を得るために用いた原料は、上記(1)熱硬化性エポキシ樹脂組成物の原料と同様である。
下記製法により、炭素繊維[I]~[V]を作製した。
アクリロニトリル99.4mol%とメタクリル酸0.6mol%からなる共重合体を用いて、乾湿式紡糸法により単繊維繊度0.08tex、フィラメント数12000のアクリル系前駆体繊維を得た。
電解酸化処理時の電気量を30C/g・槽とした以外は、炭素繊維[I]と同一の条件で作製し、炭素繊維[II]を得た。
電解酸化処理時の電気量を1C/g・槽とした以外は、炭素繊維[I]と同一の条件で作製し、炭素繊維[III]を得た。
電解酸化処理時の電気量を100C/g・槽とした以外は、炭素繊維[I]と同一の条件で作製し、炭素繊維[IV]を得た。
アクリル系前駆体繊維の紡糸法を湿式紡糸法に変更し、得られたアクリル系前駆体繊維の単繊維繊度が0.09texであった以外は、炭素繊維[I]と同一の条件で作製し、炭素繊維[V]を得た。得られた炭素繊維の目付は0.50g/m、密度は1.80g/cm3であった。
上記(13)炭素繊維の作製に従って得た炭素繊維を経糸および緯糸とし、目付が190g/m2の平織の炭素繊維織物を得た。
表4に記載した組成(質量比)で、上記(4)熱硬化性エポキシ樹脂組成物の調製と同様にエポキシ樹脂組成物を調製した。
板状キャビティーを持つ金型に、上記(14)炭素繊維織物の作製に従って作製した炭素繊維織物を400mm×400mmのサイズにカットしたものを10枚積層し、プレス装置で型締めを行った。その際、キャビティーの厚みは、繊維強化複合材料の繊維体積含有率が40%となるように設定した。次に、金型内を真空ポンプにより大気圧-0.1MPaに減圧し、表4に記載の硬化温度に加温した。上記(4)熱硬化性エポキシ樹脂組成物の調製のとおり調製した熱硬化性エポキシ樹脂組成物を樹脂注入機を用いて0.2MPaの圧力で注入した。その後、上記(7)硬化時間の測定に従って得たTcの時間、加温した後に速やかに脱型し、繊維強化複合材料を得た。
上記(16)繊維強化複合材料の作製のとおり作製した繊維強化複合材料に対して、JIS K 7019:1999に従って±45°引張試験を行い、面内剪断強度を求めた。
上記(16)繊維強化複合材料の作製の樹脂注入工程における含浸性について、繊維強化複合材料のボイド量を基準に次の4段階で比較評価した。繊維強化複合材料中のボイド量が0.5%未満のものを「Good」、0.5%以上1%未満のものを「Fair」、繊維強化複合材料中のボイド量が1%以上であるものを「Bad」とした。
上記(15)熱硬化性エポキシ樹脂組成物の調製のとおり、熱硬化性エポキシ樹脂を調製した後、炭素繊維として<炭素繊維[I]>を用いて、上記(16)繊維強化複合材料の作製のとおり、繊維強化複合材料を作製した。かかる繊維強化複合材料の面内剪断強度は210MPaと優れていた。また、含浸性は「Fair」の判定であった。
実施例13に構成要素[d]としてPEG-300を追加した熱硬化性エポキシ樹脂組成物を使用した。かかる繊維強化複合材料の面内剪断強度は220MPaと優れていた。また、含浸性は「Good」の判定で、優れたものであった。
上記(15)熱硬化性エポキシ樹脂組成物の調製のとおり、熱硬化性エポキシ樹脂を調製した後、炭素繊維として<炭素繊維[I]>を用いて、上記(16)繊維強化複合材料の作製のとおり、繊維強化複合材料を作製した。かかる繊維強化複合材料の面内剪断強度は210MPaと優れていた。また、含浸性は「Fair」の判定であった。
実施例13に構成要素[d]としてPEG-300を、構成要素[e]としてテトラブチルアンモニウムブロミドを追加した熱硬化性エポキシ樹脂組成物を使用した。かかる繊維強化複合材料の面内剪断強度は232MPaと優れていた。また、含浸性は「Good」の判定で、優れたものであった。
実施例16の構成要素[a]を変更、構成要素[g]について、p-トルエンスルホニルイソシアネートを追加し、構成要素[d]を変更した熱硬化性エポキシ樹脂組成物を使用した。かかる繊維強化複合材料の面内剪断強度は240MPaと優れていた。また、含浸性は「Good」の判定で、優れたものであった。
実施例13から炭素繊維を<炭素繊維[II]>に変更した。かかる繊維強化複合材料の面内剪断強度は255MPaと非常に優れていた。また、含浸性は「Good」の判定で、優れたものであった。
実施例13から炭素繊維を<炭素繊維[III]>に変更した。かかる繊維強化複合材料の面内剪断強度は195MPaと問題無いレベルであった。また、含浸性は「Good」の判定で、優れたものであった。
実施例13から炭素繊維を<炭素繊維[IV]>に変更した。かかる繊維強化複合材料の面内剪断強度は250MPaと非常に優れていた。また、含浸性は「Good」の判定で、優れたものであった。
実施例13から炭素繊維を<炭素繊維[V]>に変更した。かかる繊維強化複合材料の面内剪断強度は190MPaと問題無いレベルであった。また、含浸性は「Fair」の判定であった。
表4に記載の通り、構成要素[a]および構成要素[b]、および構成要素[e]を配合した熱硬化性エポキシ樹脂組成物を使用した。また、炭素繊維として<炭素繊維[I]>を使用した。かかる繊維強化複合材料の面内剪断強度は150MPaと劣っていた。また、繊維強化複合材料中に多数のボイドが見られ、含浸性は「Bad」の判定と、劣ったものであった。
実施例の熱硬化性エポキシ樹脂組成物を得るために用いた原料は、上記(1)熱硬化性エポキシ樹脂組成物の原料と同様である。
下記製法により、ガラス繊維[I]~[VII]を作製した。
ガラス繊維織物KS2700(日東紡績(株)製)を用いた。
ガラス繊維織物KS2700(日東紡績(株)製)を、カップリング剤KBM-403(3-グリシドキシプロピルトリメトキシシラン、信越化学工業(株)製)のメタノール溶液(1質量%)に7時間浸漬後、110℃の熱風オーブン内で5時間乾燥させて溶媒を除去し、表面にオキシラン基を有するガラス繊維[II]を得た。
カップリング剤をKBM-903(3-アミノプロピルトリメトキシシラン、信越化学工業(株)製)とした以外は、ガラス繊維[II]と同一の条件で作製し、表面にアミノ基を有するガラス繊維[III]を得た。
カップリング剤をKBM-803(3-メルカプトプロピルトリメトキシシラン、信越化学工業(株)製)とした以外は、ガラス繊維[II]と同一の条件で作製し、ガラス繊維表面にチオール基を有する[IV]を得た。
カップリング剤をX-12-967C(3-トリメトキシシリルプロピルコハク酸無水物、信越化学工業(株)製)とした以外は、ガラス繊維[II]と同一の条件で作製し、表面にカルボキシ基を有するガラス繊維[V]を得た。
カップリング剤をKBM-1003(ビニルトリメトキシシラン、信越化学工業(株)製)とした以外は、ガラス繊維[II]と同一の条件で作製し、表面にビニル基を有するガラス繊維[VI]を得た。
カップリング剤をメチルトリメトキシシラン(関東化学(株)製)とした以外は、ガラス繊維[II]と同一の条件で作製し、表面にメチル基を有するガラス繊維[VII]を得た。
表5に記載した組成(質量比)で、上記(4)熱硬化性エポキシ樹脂組成物の調製と同様にエポキシ樹脂組成物を調製した。
上記(20)ガラス繊維の作製のとおり作製したガラス繊維と、上記(21)熱硬化性エポキシ樹脂組成物の調製のとおり調製した熱硬化性エポキシ樹脂組成物を用いて、上記(16)繊維強化複合材料の作製と同様に繊維強化複合材料を作製した。
上記(22)繊維強化複合材料の作製のとおり作製した繊維強化複合材料に対して、上記(17)面内剪断強度の測定と同様に面内剪断強度を測定した。
上記(22)繊維強化複合材料の作製のとおり作製した繊維強化複合材料に対して、JIS K 7164:2005に従って引張試験を行い、引張強度を求めた。
上記(22)繊維強化複合材料の作製の樹脂注入工程における含浸性について、上記(18)強化繊維への熱硬化性エポキシ樹脂組成物の含浸性評価と同様に評価した。
上記(21)熱硬化性エポキシ樹脂組成物の調製のとおり、熱硬化性エポキシ樹脂を調製した後、ガラス繊維として<ガラス繊維[I]>を用いて、上記(21)繊維強化複合材料の作製のとおり、繊維強化複合材料を作製した。かかる繊維強化複合材料の面内剪断強度は170MPaと優れており、引っ張り強度は230MPaと問題無いレベルであった。また、含浸性は「Fair」の判定であった。
実施例22に構成要素[d]としてPEG-300を追加した熱硬化性エポキシ樹脂組成物を使用した。かかる繊維強化複合材料の面内剪断強度は172MPaと優れており、引っ張り強度は234MPaと問題無いレベルであった。また、含浸性は「Good」の判定と優れたものであった。
上記(21)熱硬化性エポキシ樹脂組成物の調製のとおり、熱硬化性エポキシ樹脂を調製した後、ガラス繊維として<ガラス繊維[I]>を用いて、上記(22)繊維強化複合材料の作製のとおり、繊維強化複合材料を作製した。かかる繊維強化複合材料の面内剪断強度は176MPaと優れており、引っ張り強度は240MPaと問題無いレベルであった。また、含浸性は「Fair」の判定であった。
実施例24に構成要素[d]としてPEG-300を、構成要素[e]としてテトラブチルアンモニウムブロミドを追加した熱硬化性エポキシ樹脂組成物を使用した。かかる繊維強化複合材料の面内剪断強度は175MPaと優れており、引っ張り強度は250MPaと特に優れたものであった。また、含浸性は「Good」の判定であった。
実施例25の構成要素[a]を変更、構成要素[g]について、p-トルエンスルホニルイソシアネートを追加し、構成要素[d]を変更した熱硬化性エポキシ樹脂組成物を使用した。かかる繊維強化複合材料の面内剪断強度は179MPaと優れており、引っ張り強度は245MPaと特に優れたものであった。また、含浸性は「Good」の判定であった。
実施例22からガラス繊維を<ガラス繊維[II]>に変更した。かかる繊維強化複合材料の面内剪断強度は170MPaと優れており、引っ張り強度は240MPaと優れたものであった。また、含浸性は「Good」の判定であった。
実施例22からガラス繊維を<ガラス繊維[III]>に変更した。かかる繊維強化複合材料の面内剪断強度は180MPaと非常に優れており、引っ張り強度は255MPaと特に優れたものであった。また、含浸性は「Good」の判定であった。
実施例22からガラス繊維を<ガラス繊維[IV]>に変更した。かかる繊維強化複合材料の面内剪断強度は170MPaと優れており、引っ張り強度は250MPaと特に優れたものであった。また、含浸性は「Good」の判定であった。
実施例22からガラス繊維を<ガラス繊維[V]>に変更した。かかる繊維強化複合材料の面内剪断強度は168MPaと優れており、引っ張り強度は245MPaと特に優れたものであった。また、含浸性は「Good」の判定であった。
実施例22からガラス繊維を<ガラス繊維[VI]>に変更した。かかる繊維強化複合材料の面内剪断強度は165MPaと問題の無いレベルであり、引っ張り強度は245MPaと特に優れたものであった。また、含浸性は「Fair」の判定であった。
実施例22からガラス繊維を<ガラス繊維[VII]>に変更した。かかる繊維強化複合材料の面内剪断強度は162MPaと問題無いレベルであり、引っ張り強度は247MPaと特に優れたものであった。また、含浸性は「Fair」の判定であった。
表5に記載の通り、構成要素[a]および構成要素[b]、および構成要素[e]を配合した熱硬化性エポキシ樹脂組成物を使用した。また、ガラス繊維として<ガラス繊維[I]>を使用した。かかる繊維強化複合材料の面内剪断強度は130MPa、引っ張り強度は200MPaと低いものであった。また、繊維強化複合材料中に多数のボイドが見られ、含浸性は「Bad」の判定と、劣ったものであった。
Claims (30)
- 次の構成要素[a]、[b]、および[c]を含む熱硬化性エポキシ樹脂組成物であって、硬化時間(Tc)と誘導時間(Ti)の関係が、1<Tc/Ti≦9を満たす熱硬化性エポキシ樹脂組成物。
[a]:エポキシ樹脂
[b]:イソシアネート化合物
[c]:無機塩 - 次の構成要素[e]をさらに含む、請求項1に記載の熱硬化性エポキシ樹脂組成物。
[e]:ハロゲン化オニウム塩 - 構成要素[d]のR1’およびR2’が水素原子であり、かつ、XがO原子である、請求項3に記載の熱硬化性エポキシ樹脂組成物。
- 次の構成要素[g]をさらに含む、請求項1~4のいずれかに記載のエポキシ樹脂組成物。
[g]:水酸基との反応ピーク温度Tgが構成要素[b]と水酸基との反応ピーク温度Tbよりも15℃以上低い化合物
(Tgは、1-フェノキシ-2-プロパノールと構成要素[g]を質量比10:1で混合し、昇温速度10℃/分にて示差走査熱量測定を実施し得られる反応発熱カーブのピーク温度である。Tbは、1-フェノキシ-2-プロパノールと構成要素[b]を質量比10:1で混合し、昇温速度10℃/分にて示差走査熱量測定を実施し得られる反応発熱カーブのピーク温度である。) - 構成要素[g]が分子内に1つのイソシアネート基を有するモノイソシアネート化合物を含む、請求項5に記載の熱硬化性エポキシ樹脂組成物。
- 次の構成要素[f]をさらに含む、請求項1~6のいずれかに記載の熱硬化性エポキシ樹脂組成物。
[f]:エラストマー系高靭性化剤 - 構成要素[c]がアルカリ金属のハロゲン化物を含む、請求項1~7のいずれかに記載の熱硬化性エポキシ樹脂組成物。
- 構成要素[a]に対する構成要素[b]の化学量論量比[b]/[a]が0.7~2.0の範囲にある、請求項1~8のいずれかに記載の熱硬化性エポキシ樹脂組成物。
- 請求項1~9のいずれかに記載の熱硬化性エポキシ樹脂組成物が熱硬化されてなる成形品。
- 請求項10に記載の成形品と、強化繊維とを含んでなる繊維強化複合材料。
- 前記強化繊維が、下記条件[A]および[B]を満たす炭素繊維を含む、請求項11に記載の繊維強化複合材料。
[A]実質的に真円状の断面を有する
[B]平均繊維径が4.0~8.0μmの範囲にある - 前記炭素繊維が、さらに下記条件[C]を満たす、請求項12に記載の繊維強化複合材料。
[C]表面比酸素濃度O/Cが0.03~0.22の範囲にある
(ここで、表面比酸素濃度は、X線光電子分光法において、O1sピーク面積[O1s]と、C1sピーク面積[C1s]から表面比酸素濃度O/C=([O1s]/[C1s])/(感度補正値)を算出することにより特定される。) - 前記強化繊維が、イソシアネート基と共有結合可能である表面官能基を有するガラス繊維を含む、請求項11に記載の繊維強化複合材料。
- 前記ガラス繊維の表面官能基が、水酸基、オキシラン基、アミノ基、チオール基、およびカルボキシ基からなる群から選ばれる少なくとも1つの官能基を含む、請求項14に記載の繊維強化複合材料。
- 前記ガラス繊維の表面官能基が、シランカップリング剤、チタンカップリング剤、アルミニウムカップリング剤、およびジルコニウムカップリング剤からなる群から選ばれる少なくとも1つで処理されることで形成される、請求項14または15に記載の繊維強化複合材料。
- 請求項1~9のいずれかに記載の熱硬化性エポキシ樹脂組成物と、強化繊維とを含んでなる繊維強化複合材料用成形材料。
- 前記強化繊維が、下記条件[A]および[B]を満たす炭素繊維を含む、請求項17に記載繊維強化複合材料用成形材料。
[A]実質的に真円状の断面を有する
[B]平均繊維径が4.0~8.0μmの範囲にある - 前記炭素繊維が、さらに下記条件[C]を満たす、請求項18に記載の繊維強化複合材料用成形材料。
[C]表面比酸素濃度O/Cが0.03~0.22の範囲にある
(ここで、表面比酸素濃度は、X線光電子分光法において、O1sピーク面積[O1s]と、C1sピーク面積[C1s]から表面比酸素濃度O/C=([O1s]/[C1s])/(感度補正値)を算出することにより特定される。) - 前記強化繊維が、イソシアネート基と共有結合可能である表面官能基を有するガラス繊維を含む、請求項19に記載の繊維強化複合材料用成形材料。
- 前記ガラス繊維の表面官能基が、水酸基、オキシラン基、アミノ基、チオール基、およびカルボキシ基からなる群から選ばれる少なくとも1つの官能基を含む、請求項20に記載の繊維強化複合材料用成形材料。
- 前記ガラス繊維の表面官能基が、シランカップリング剤、チタンカップリング剤、アルミニウムカップリング剤、およびジルコニウムカップリング剤からなる群から選ばれる少なくとも1つで処理されることで形成される、請求項20または21に記載の繊維強化複合材料用成形材料。
- 請求項17~22のいずれかに記載の繊維強化複合材料用成形材料が熱硬化されてなる繊維強化複合材料。
- 強化繊維に、請求項1~9のいずれかに記載の熱硬化性エポキシ樹脂を含浸させたあと、熱硬化させる、繊維強化複合材料の製造方法。
- 強化繊維を主成分とする織物を型内に配置し、請求項1~9のいずれかに記載の熱硬化性エポキシ樹脂組成物を注入して含浸させたあと、熱硬化させる、繊維強化複合材料の製造方法。
- 前記強化繊維が、下記条件[A]および[B]を満たす炭素繊維を含む、請求項24または25に記載の繊維強化複合材料の製造方法。
[A]実質的に真円状の断面を有する
[B]平均繊維径が4.0~8.0μmの範囲にある - 前記炭素繊維が、さらに下記条件[C]を満たす、請求項26に記載の繊維強化複合材料の製造方法。
[C]表面比酸素濃度O/Cが0.03~0.22の範囲にある
(ここで、表面比酸素濃度は、X線光電子分光法において、O1sピーク面積[O1s]と、C1sピーク面積[C1s]から表面比酸素濃度O/C=([O1s]/[C1s])/(感度補正値)を算出することにより特定される。) - 前記強化繊維が、イソシアネート基と共有結合可能である表面官能基を有するガラス繊維を含む、請求項24または25に記載の繊維強化複合材料の製造方法。
- 前記ガラス繊維の表面官能基が、水酸基、オキシラン基、アミノ基、チオール基、およびカルボキシ基からなる群から選ばれる少なくとも1つの官能基を含む、請求項28に記載の繊維強化複合材料の製造方法。
- 前記ガラス繊維の表面官能基が、シランカップリング剤、チタンカップリング剤、アルミニウムカップリング剤、およびジルコニウムカップリング剤からなる群から選ばれる少なくとも1つで処理されることで形成される、請求項28または29に記載の繊維強化複合材料の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202180084556.1A CN116615480A (zh) | 2020-12-21 | 2021-12-16 | 热固性环氧树脂组合物及其成型品、纤维增强复合材料、纤维增强复合材料用成型材料、以及纤维增强复合材料的制造方法 |
JP2021575999A JP7160219B1 (ja) | 2020-12-21 | 2021-12-16 | 熱硬化性エポキシ樹脂組成物とその成形品、繊維強化複合材料、繊維強化複合材料用成形材料、および繊維強化複合材料の製造方法 |
US18/033,176 US20230416448A1 (en) | 2020-12-21 | 2021-12-16 | Thermosetting epoxy resin composition, molded article of same, fiber-reinforced composite material, molding material for fiber-reinforced composite materials, and method for producing fiber-reinforced composite material |
EP21910580.6A EP4265664A1 (en) | 2020-12-21 | 2021-12-16 | Thermosetting epoxy resin composition, molded article of same, fiber-reinforced composite material, molding material for fiber-reinforced composite materials, and method for producing fiber-reinforced composite material |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020211056 | 2020-12-21 | ||
JP2020-211056 | 2020-12-21 | ||
JP2021122176 | 2021-07-27 | ||
JP2021-122176 | 2021-07-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022138432A1 true WO2022138432A1 (ja) | 2022-06-30 |
Family
ID=82159217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2021/046477 WO2022138432A1 (ja) | 2020-12-21 | 2021-12-16 | 熱硬化性エポキシ樹脂組成物とその成形品、繊維強化複合材料、繊維強化複合材料用成形材料、および繊維強化複合材料の製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20230416448A1 (ja) |
EP (1) | EP4265664A1 (ja) |
JP (1) | JP7160219B1 (ja) |
WO (1) | WO2022138432A1 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01287126A (ja) * | 1988-05-13 | 1989-11-17 | Nippon Paint Co Ltd | 熱硬化性の反応性樹脂組成物ならびに耐熱性成形品の製造方法 |
JPH07216046A (ja) * | 1993-11-11 | 1995-08-15 | Enichem Spa | 架橋可能な液体組成物 |
JP2000336191A (ja) * | 1999-03-23 | 2000-12-05 | Toray Ind Inc | プリプレグ及び繊維強化複合材料 |
JP2005113014A (ja) * | 2003-10-08 | 2005-04-28 | Ube Ind Ltd | ポリシロキサン絶縁膜用組成物、絶縁膜、及び、絶縁膜の形成方法 |
WO2016102358A1 (de) | 2014-12-22 | 2016-06-30 | Henkel Ag & Co. Kgaa | Katalysator-zusammensetzung zur härtung von epoxidgruppen-haltigen harzen |
WO2019046382A1 (en) | 2017-09-01 | 2019-03-07 | Dow Global Technologies Llc | THERMOSETTING COMPOSITIONS |
WO2020067044A1 (ja) * | 2018-09-27 | 2020-04-02 | 株式会社カネカ | 硬化性エポキシ樹脂組成物、及びそれを用いた積層体 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2782945B1 (en) * | 2011-11-22 | 2021-03-31 | Huntsman International LLC | Curable polyisocyanate composition comprising an epoxy resin |
-
2021
- 2021-12-16 US US18/033,176 patent/US20230416448A1/en active Pending
- 2021-12-16 JP JP2021575999A patent/JP7160219B1/ja active Active
- 2021-12-16 EP EP21910580.6A patent/EP4265664A1/en active Pending
- 2021-12-16 WO PCT/JP2021/046477 patent/WO2022138432A1/ja active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01287126A (ja) * | 1988-05-13 | 1989-11-17 | Nippon Paint Co Ltd | 熱硬化性の反応性樹脂組成物ならびに耐熱性成形品の製造方法 |
JPH07216046A (ja) * | 1993-11-11 | 1995-08-15 | Enichem Spa | 架橋可能な液体組成物 |
JP2000336191A (ja) * | 1999-03-23 | 2000-12-05 | Toray Ind Inc | プリプレグ及び繊維強化複合材料 |
JP2005113014A (ja) * | 2003-10-08 | 2005-04-28 | Ube Ind Ltd | ポリシロキサン絶縁膜用組成物、絶縁膜、及び、絶縁膜の形成方法 |
WO2016102358A1 (de) | 2014-12-22 | 2016-06-30 | Henkel Ag & Co. Kgaa | Katalysator-zusammensetzung zur härtung von epoxidgruppen-haltigen harzen |
WO2019046382A1 (en) | 2017-09-01 | 2019-03-07 | Dow Global Technologies Llc | THERMOSETTING COMPOSITIONS |
JP2020532596A (ja) * | 2017-09-01 | 2020-11-12 | ダウ グローバル テクノロジーズ エルエルシー | 熱硬化性組成物 |
WO2020067044A1 (ja) * | 2018-09-27 | 2020-04-02 | 株式会社カネカ | 硬化性エポキシ樹脂組成物、及びそれを用いた積層体 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2022138432A1 (ja) | 2022-06-30 |
US20230416448A1 (en) | 2023-12-28 |
EP4265664A1 (en) | 2023-10-25 |
JP7160219B1 (ja) | 2022-10-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10920027B2 (en) | Epoxy resin composition, molding material, and fiber-reinforced composite material | |
JP5728383B2 (ja) | イソシアネート系強靱化剤を含んでなるベンゾオキサジン系組成物 | |
JP2016011409A5 (ja) | ||
WO2015186707A1 (ja) | ポリウレタン変性エポキシ樹脂、その製造方法、エポキシ樹脂組成物および硬化物 | |
WO2014030636A1 (ja) | エポキシ樹脂組成物及びこれを用いたフィルム、プリプレグ、繊維強化プラスチック | |
TW201841970A (zh) | 纖維強化複合材料用環氧樹脂組成物、纖維強化複合材料及成形體 | |
US20230159693A1 (en) | Curable compositions containing isocyanate-based tougheners | |
JP2014077074A (ja) | ポリウレタン変性エポキシ樹脂とその製造方法および硬化物 | |
JP2017078125A (ja) | ウレタン変性エポキシ樹脂組成物、およびその硬化物 | |
CN110317319A (zh) | 具有噁唑烷酮结构的环氧树脂、制造方法、环氧树脂组合物、纤维强化复合材料及成形体 | |
WO2022102467A1 (ja) | 熱硬化性エポキシ樹脂組成物とその成形品、繊維強化複合材料、繊維強化複合材料用成形材料、および繊維強化複合材料の製造方法 | |
WO2022124191A1 (ja) | 熱硬化性エポキシ樹脂組成物、熱硬化性エポキシ樹脂成形品、繊維強化複合材料用成形材料、繊維強化複合材料、および繊維強化複合材料の製造方法 | |
JP6958751B2 (ja) | 硬化性組成物、硬化物、繊維強化複合材料及び成形品 | |
JP7160219B1 (ja) | 熱硬化性エポキシ樹脂組成物とその成形品、繊維強化複合材料、繊維強化複合材料用成形材料、および繊維強化複合材料の製造方法 | |
WO2020217894A1 (ja) | エポキシ樹脂組成物、中間基材および繊維強化複合材料 | |
CN108473660B (zh) | 环氧树脂组合物、纤维增强复合材料用预浸料及纤维增强复合材料 | |
WO2021157442A1 (ja) | 成形材料および繊維強化複合材料 | |
KR102297539B1 (ko) | 에폭시 접착제 조성물을 위한 트리블록 구조의 폴리우레탄 강인화제 | |
CN116615480A (zh) | 热固性环氧树脂组合物及其成型品、纤维增强复合材料、纤维增强复合材料用成型材料、以及纤维增强复合材料的制造方法 | |
WO2023219007A1 (ja) | 熱硬化性樹脂組成物、成形品、繊維強化複合材料用成形材料および繊維強化複合材料 | |
JP5039625B2 (ja) | 複合材料中間材用樹脂組成物 | |
WO2024024677A1 (ja) | プリプレグ、繊維強化複合材料、および繊維強化複合材料の製造方法 | |
JP2022039263A (ja) | トウプレグ | |
CN117794976A (zh) | 环氧树脂固化剂、环氧树脂组合物和其固化物、纤维增强复合材料、以及风力发电叶片 | |
JP2022039266A (ja) | エポキシ樹脂組成物、中間基材、トウプレグ、および繊維強化複合材料 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ENP | Entry into the national phase |
Ref document number: 2021575999 Country of ref document: JP Kind code of ref document: A |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 21910580 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 202180084556.1 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2021910580 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 2021910580 Country of ref document: EP Effective date: 20230721 |