WO2022127515A1 - Cup-shaped chuck of substrate holding device, and substrate holding device - Google Patents

Abstract

Disclosed in the present invention is a cup-shaped chuck of a substrate holding device. The cup-shaped chuck comprises an inner pressing ring, a middle frame, a sealing member, an outer pressing ring and a contact ring. The inner pressing ring is locked on the inner peripheral surface of the middle frame. The sealing member has an outer end part, a bottom part and an inner end part; the outer end part of the sealing member covers the outer peripheral surface of at least part of the middle frame; the bottom part of the sealing member covers the bottom part of the middle frame, and is exposed at the outside of the cup-shaped chuck; the inner end part of the sealing member covers the inner peripheral surface of the at least part of the middle frame; the inner end part of the sealing member is pressed between the inner pressing ring and the middle frame by means of the inner pressing ring; the outer pressing ring is made of an insulating material and is locked on the outer peripheral surface of the middle frame, and the outer end part of the sealing member is pressed between the outer pressing ring and the middle frame by means of the outer pressing ring; the contact ring is located above the sealing member and is pressed between the inner pressing ring and the middle frame, and a sealing ring is provided between the inner pressing ring and the contact ring.

Description

Cup chuck of substrate holding device and substrate holding device technical field

The present invention relates to the technical field of semiconductor electroplating, and more particularly, to a cup-shaped chuck for holding a substrate during electroplating and a substrate holding device.

Background technique

The electroplating fixture that holds the substrate is an important part of the semiconductor electroplating equipment. The electroplating fixture is usually equipped with a contact ring and a seal, and the seal is used to isolate the electroplating solution from the contact ring, so as to avoid the uneven electroplating film caused by poor contact between the contact ring and the seed layer. Therefore, the performance of the seal is a key factor in ensuring the normal operation of the electroplating process.

At present, there are still many problems in the long-term use of the seals in the electroplating fixture. For example: 1) As shown in Figure 18, the electroplating fixture adopts all wrap-type seals 23, and its exposed area is too large, and the outer side 231 and the bottom surface 233 are easily damaged, especially at the bottom bending part 232, after the seal 23 is damaged , the penetration of the electroplating solution through the sealing member 23 and the contact with the internal metal base 22 will result in partial loss of current, so that the thickness of the electroplating layer on the substrate is lower than the predetermined target value, which affects the product yield. 2) The inside of the seal 23 is wrapped with a relatively hard metal base 22, the bottom of the metal base 22 is bent upward to form a support portion 221, and its thickness is only 1mm, which is very sharp. The seal 23 wraps the support portion 221 to form a sealing lip 234. Among them, the sealing lip 234 is in close contact with the substrate to achieve sealing on the edge and the back of the substrate. However, the sealing lip 234 may be easily broken due to aging under long-term stress. 3) When the electroplating fixture is maintained, the contact ring 25 and the seal 23 need to be cleaned. However, the inner pressure ring 24 and the contact ring 25 of the existing electroplating fixture are directly conductive, and there is no seal between the outer metal base 22 and an online During spray cleaning or immersion cleaning, the cleaning solution or electroplating solution will penetrate into the inner layer of the electroplating fixture along the arrows shown in Figure 18, which cannot complete the purpose of quick cleaning and maintenance, and needs to be disassembled and maintained separately.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a cup-shaped chuck of a substrate holding device, which can effectively reduce the risk of damage to the seal by reducing the exposed area of the seal, and in addition, by improving the installation sealing performance of the contact ring, the contact ring and the seal can be realized. In-line cleaning of parts.

In order to achieve the above object, the cup-shaped chuck of the substrate holding device provided by the present invention includes a cup-shaped chuck for accommodating a substrate, and the cup-shaped chuck includes:

inner pressure ring;

an intermediate frame, the inner pressure ring is locked on the inner peripheral surface of the intermediate frame;

A seal, the seal has an outer end, a bottom and an inner end, the outer end of the seal covers at least part of the outer peripheral surface of the middle frame, the bottom of the seal covers the bottom of the middle frame, and is exposed to the Outside the cup-shaped chuck, the inner end of the seal covers at least part of the inner peripheral surface of the middle frame, and the inner end of the seal is pressed between the inner pressure ring and the middle frame by the inner pressure ring;

an outer pressure ring, the outer pressure ring is made of insulating material, locked on the outer peripheral surface of the middle frame, and the outer end of the seal is pressed between the outer pressure ring and the middle frame through the outer pressure ring;

The contact ring is located on the seal and is crimped between the inner pressure ring and the intermediate frame, and a sealing ring is arranged between the inner pressure ring and the contact ring.

By using an insulating outer pressure ring, the whole is locked with the seal, and only the bottom of the seal is exposed, which is beneficial to reduce the exposed area of the seal and the risk of damage. The overall sealing of the cup-shaped chuck prevents the plating solution or cleaning solution from infiltrating the inner layer of the cup-shaped chuck.

Preferably, in the cup-shaped chuck of the substrate holding device, the bottom of the intermediate frame forms a horizontal support portion radially and horizontally inward, and the bottom of the seal wraps the horizontal support portion and protrudes upward at the end of the horizontal support portion. A sealing lip portion is formed, and the sealing lip portion is one or more than two, and the sealing lip portion is used for sealing contact with the edge of the substrate.

There is no hard material support inside the sealing lip, so as to avoid the damage of the inner hard support when the sealing lip is pressed, which can prolong the service life of the seal. At the same time, the radial width of the sealing lip can be designed to be 1mm Below, in order to meet the subsequent narrower edge removal process requirements. When more than two sealing lips are provided, multi-stage sealing can be formed between the sealing element and the edge of the substrate, so as to achieve better sealing effect.

Preferably, in the cup chuck of the substrate holding device, when there are more than two sealing lips, the heights of the two or more sealing lips are the same.

Preferably, in the cup chuck of the substrate holding device, when there are more than two sealing lips, at least two sealing lips have a height difference between them.

Preferably, in the cup chuck of the substrate holding device, the height of the sealing lip gradually increases radially inward.

Preferably, in the cup chuck of the substrate holding device, the height of the sealing lip gradually decreases radially inward.

Preferably, in the cup-shaped chuck of the substrate holding device, the heights of the sealing lips are arranged alternately in the radial direction.

Preferably, in the cup-shaped chuck of the substrate holding device, when there is one sealing lip, the radial width of the one sealing lip is not more than 1 mm, and when there are more than two sealing lips, the two The total radial width of more than one sealing lip is not more than 1mm.

Preferably, in the cup-shaped chuck of the substrate holding device, when there is one sealing lip, the radial width of the one sealing lip is 0.4 mm to 0.8 mm, and when there are more than two sealing lips , the total radial width of the two or more sealing lips is 0.4mm-0.8mm.

Preferably, in the cup-shaped chuck of the substrate holding device, the sealing member is detachably installed with the intermediate frame as an independent accessory.

Preferably, in the cup-shaped chuck of the substrate holding device, the sealing member is bonded to the intermediate frame by an adhesive.

Preferably, in the cup-shaped chuck of the substrate holding device, several rings of inner sealing protrusions are formed on the contact surface of the sealing member and the intermediate frame. Correspondingly, the surface of the intermediate frame is provided with several inner seals. The protrusions match the sealing grooves.

The multi-ring inner sealing protrusion can form a multi-stage seal between the seal and the intermediate skeleton. Once the seal is damaged somewhere, the multi-stage seal can reduce the diffusion of the plating solution in the inner layer of the cup-shaped chuck and reduce the impact of the plating solution on the device. corrosion.

Preferably, in the cup-shaped chuck of the substrate holding device, several rings of outer sealing protrusions are formed on the contact surface of the sealing member and the outer pressure ring.

The multi-circle outer sealing protrusions are arranged to enhance the sealing between the outer pressure ring, the intermediate frame and the sealing element. In addition, the multi-circle inner sealing protrusion and the multi-circle outer sealing protrusion are also conducive to the positioning of the seal when assembling the intermediate frame, so that the assembly of the two components is more accurate.

Preferably, in the cup chuck of the substrate holding device, the seal is hydrophobic.

The hydrophobic treatment of the seal can reduce the adhesion of liquid on its surface. The hydrophobic treatment of the seal can use hydrophobic materials, or mix hydrophobic materials, or surface coating or sputtering hydrophobic films, or reduce surface roughness, Preferably, the surface roughness Ra of the seal is less than 10 nm.

Preferably, in the cup-shaped chuck of the substrate holding device, the outer surface of the outer pressure ring is provided with a blocking portion.

By forming a blocking portion on the outer side of the outer pressure ring, the resistance of the liquid rising up along the outer side wall of the outer pressure ring can be increased, and the liquid can be guided to change its flow direction and slanted downward into the sump set in the electroplating chamber, thereby avoiding the cup When the chuck is rotated, the liquid is thrown out of the electroplating chamber, polluting the process environment.

Preferably, in the cup-shaped chuck of the substrate holding device, the blocking portion includes at least an upper blocking portion and/or a lower blocking portion, the number of the upper blocking portion is more than one, and the number of the lower blocking portion is more than one, The upper blocking part is a downward annular protrusion formed on the top end of the outer pressure ring, and the lower blocking part is an outward annular protrusion formed at the middle and lower part of the outer pressure ring.

Preferably, in the cup-shaped chuck of the substrate holding device, the surface of the outer pressing ring has hydrophobicity.

The hydrophobic treatment of the outer pressure ring can reduce the adhesion of liquid on its surface. Specifically, the outer pressure ring adopts a hydrophobic material, or is mixed with a hydrophobic material, or a hydrophobic film is arranged on the surface, or the surface roughness Ra is less than 10 nm.

Preferably, in the cup-shaped chuck of the substrate holding device, a number of bumps are formed on the contact surface of the outer pressure ring and the seal, and a number of bumps are formed on the contact surface of the inner pressure ring and the seal. .

The arrangement of bumps on the contact surfaces of the outer pressure ring and the inner pressure ring and the seal can improve the sealing effect between the parts in contact with each other.

Preferably, in the cup-shaped chuck of the substrate holding device, the bottom of the outer pressure ring is provided with several support points.

Several support points set at the bottom of the outer pressure ring can play a supporting role during the maintenance of the device, keep the seal and the worktable at a certain distance, and reduce the damage or contamination of the seal.

Preferably, in the cup-shaped chuck of the substrate holding device, the material of the inner pressure ring is a conductive and corrosion-resistant metal, and the contact ring is electrically connected to the electroplating power source through the inner pressure ring.

Preferably, in the cup-shaped chuck of the substrate holding device, the material of the inner pressure ring is insulating material, the material of the intermediate frame is conductive metal, and the contact ring is electrically connected to the electroplating power source through the intermediate frame.

Using the intermediate skeleton to electrically connect the contact ring and the electroplating power supply, the inner pressure ring does not need to meet both conductivity and corrosion resistance, but only needs to have corrosion resistance, that is, the inner pressure ring can be made of insulating materials (such as PVC, PTFE, PVDF, etc.), Thus, the material selection range of the inner pressure ring is expanded, which is beneficial to reduce the cost and realize the on-line cleaning of the cup chuck.

In the present invention, a substrate holding device is also proposed, comprising:

The cup chuck of any of the above, for holding a substrate;

a chuck plate abutting the back of the substrate so that the substrate is in pressing contact with the seal of the cup chuck;

A chuck plate driving device for driving the chuck plate against or away from the back of the substrate;

Angle drive device for adjusting the angle of the substrate clamped by the cup chuck and the chuck plate;

a rotary drive for driving rotation of the substrate clamped by the cup chuck and the chuck plate; and

The vertical drive device is used to drive the substrate clamped by the cup chuck and the chuck plate to ascend or descend.

Preferably, in the substrate holding device, the chuck plate includes a base, the base has a lower surface in contact with the back surface of the substrate, the lower surface is provided with a plurality of exhaust grooves, and the peripheral edge of the base is An exhaust hole communicated with the exhaust groove is opened.

The arrangement of the exhaust grooves and the exhaust holes on the chuck plate facilitates the separation of the chuck plate and the substrate when the substrate is unloaded.

Preferably, in the substrate holding device, the lower surface of the base is further provided with a contact portion protruding toward the substrate, so as to reduce the contact area between the chuck plate and the substrate.

The cup-shaped chuck of the substrate holding device proposed by the present invention adopts an insulating outer pressure ring, which is integrally locked and sealed with the intermediate frame covered with the sealing member, so that only the bottom of the sealing member is exposed, which greatly reduces the electroplating of the sealing member. The exposed area in the liquid reduces the risk of damage to the seal and improves the reliability of the device. During the maintenance of the device, especially when cleaning the contact ring and seals, it can effectively prevent the treatment liquid from infiltrating the inner layer of the cup-shaped chuck, and it is not necessary to disassemble and then maintain each part one by one, which can realize online cleaning and improve the convenience of device maintenance. and efficiency, and reduce maintenance costs.

BRIEF DESCRIPTION OF THE DRAWINGS

The features and performance of the present invention are further described by the following examples and accompanying drawings.

Figure 1 discloses a perspective view of the substrate holding device of the present invention;

Figure 2 discloses another perspective view of the substrate holding device of the present invention;

Figure 3 discloses a cross-sectional view of the substrate holding device of the present invention;

Fig. 4 discloses another cross-sectional view of the substrate holding device of the present invention;

Fig. 5 discloses the partial enlarged view of A in Fig. 4;

FIG. 6 discloses an enlarged view of some of the components in FIG. 5;

Figure 7 discloses a perspective view of the cup chuck of the present invention;

Figure 8 discloses an exploded view of the cup chuck in the present invention;

Figure 9 discloses a partial cross-sectional view of the intermediate frame of the present invention;

Figure 10 discloses a partial cross-sectional view of the seal of the present invention;

Figure 11 discloses a perspective view of the outer pressure ring of the present invention;

Figure 12 discloses a perspective view of the chuck plate of the present invention;

Figure 13 discloses another perspective view of the chuck plate of the present invention;

Figure 14 discloses a cross-sectional view of the chuck plate of the present invention;

Fig. 15 discloses a partial enlarged view at B in Fig. 14;

Figures 16a to 16d disclose schematic diagrams of different forms of external pressure rings;

Figures 17a to 17c disclose partial schematic views of different forms of seals;

Figure 18 discloses an enlarged view of some components of a prior art electroplating fixture.

Preferred Embodiments of the Invention

In order to describe the technical content, structural features, achieved objects and effects of the present invention in detail, the following will be described in detail with reference to the embodiments and the drawings.

1 and 2 illustrate a substrate holding device in an embodiment of the present invention. The substrate holding device includes components such as a cup chuck 11 , a chuck plate 12 , a chuck plate drive device 13 , an angle drive device 14 , a rotation drive device 16 , and a vertical drive device. A penetrating accommodating space 110 is formed in the center of the cup-shaped chuck 11 , and the accommodating space 110 is used for accommodating the substrate 10 . The chuck plate driving device 13 is connected to the chuck plate 12 through the universal joint shaft 15 to drive the chuck plate 12 to ascend and descend. Specifically, referring to FIG. 3 , the chuck plate 12 is lifted to the substrate loading/unloading position away from the cup chuck 11 by the chuck plate driving device 13 ; after the substrate 10 is put into the accommodating space 110 by the transfer robot, see FIG. 4 5 , the chuck plate 12 is driven downward by the chuck plate driving device 13 to abut against the backside of the substrate 10 to clamp the substrate 10 between the cup chuck 11 and the chuck plate 12 . Generally, the substrate holding device is connected to a vertical drive device (not shown) through the support plate 17, and the vertical drive device drives the substrate 10 clamped by the cup chuck 11 and the chuck plate 12 to ascend or descend. The angle driving device 14 is used to adjust the angle of the substrate 10 clamped by the cup chuck 11 and the chuck plate 12 during the process of entering the electroplating solution, so as to reduce the influence of air bubbles on the electroplating process. The rotation driving device 16 is used to drive the substrate 10 clamped by the cup chuck 11 and the chuck plate 12 to rotate during the electroplating process. It is understood that when the chuck plate 12 is lifted away from the cup by the chuck plate driving device 13 When cleaning the cup chuck 11 by chucking the chuck 11 , the rotation driving device 16 may drive the cup chuck 11 to rotate.

5 and 6 , the cup-shaped chuck 11 includes an inner pressure ring 111 , a middle frame 112 and an outer pressure ring 113 , wherein the inner pressure ring 111 is locked on the inner peripheral surface of the middle frame 112 , and the outer pressure ring 113 is locked on the outer peripheral surface of the intermediate frame 112 . The outer pressure ring 113 is made of insulating material, which can directly contact the electroplating solution during the electroplating process, and there is no leakage problem. In addition, the outer pressure ring 113 has a certain hardness so as to support other components. Specifically, the outer pressure ring 113 can be made of PEEK, PVC, PVDF, PFA, CPVC, PE or PC and other materials.

Figure 9 shows a partial cross-sectional view of the intermediate skeleton. The middle frame 112 has a side wall 1121 , the upper end of the side wall 1121 extends radially outward to form a first mounting table 1122 , the lower end of the side wall 1121 extends radially inward to form a second mounting table 1123 , and the end of the second mounting table 1123 The bottom end of the intermediate frame 112 extends obliquely inward to form the bottom of the intermediate frame 112 , and the bottom end of the intermediate frame 112 extends radially and horizontally inward to form a horizontal support portion 1124 , wherein the second mounting platform 1123 , the bottom of the intermediate frame 112 and the horizontal support portion 1124 serve as the intermediate frame The surface of the head of 112 is covered with a sealing member 114, and the sealing member 114 will be described in detail later. Referring to FIGS. 5 and 6 again, a first step 1131 is formed on the upper part of the inner side wall of the outer pressure ring 113 , and a second step 1132 is formed at the lower part of the inner side wall of the outer pressure ring 113 . When the middle frame 112 is installed in the outer pressure ring 113 , the first installation platform 1122 of the middle frame 112 is pressed against the first step 1131 of the outer pressure ring 113 , and the second installation platform 1123 of the middle frame 112 is pressed against the outer pressure ring 113 on the second step 1132. As shown in FIG. 9 , a plurality of first positioning grooves 1125 are spaced apart on the upper surface of the first mounting platform 1122 of the intermediate frame 112 . The upper part of the inner pressure ring 111 is provided with several first positioning blocks 1111 (as shown in FIG. 8 ). When the inner pressure ring 111 is installed in the middle frame 112 , the first positioning blocks 1111 of the inner pressure ring 111 are pressed in the middle In the first positioning groove 1125 of the frame 112 , the lower part of the inner pressure ring 111 is pressed against the second mounting platform 1123 of the middle frame 112 .

The outer surface of the outer pressure ring 113 is provided with a blocking portion for preventing the process liquid, such as electroplating liquid, from splashing upward along the outer surface of the outer pressure ring 113 when the cup-shaped chuck rotates. The blocking portion includes at least an upper blocking portion and/or a lower blocking portion, the number of the upper blocking portion is more than one, and the number of the lower blocking portion is more than one. The blocking portion is an outward annular protrusion formed in the lower middle portion of the outer pressure ring 113 .

The outer pressure ring 113 shown in FIG. 16(a) has a lower blocking portion 1133. The lower blocking portion 1133 is an outward annular convex formed in the middle and lower part of the outer pressure ring 113. Any shape such as a parabola or a rectangle can prevent the liquid from climbing along the outer surface of the outer pressure ring 113 or guide the liquid to flow downward. In FIG. 16( a ), the lower blocking portion 1133 is located at the lowest part of the outer pressure ring 113 , that is, flush with the bottom surface of the outer pressure ring 113 . Of course, it is understood that in other embodiments, the lower blocking portion 1133 is higher than the bottom surface of the outer pressure ring 113 . The bottom surface of the outer pressure ring 113 is located in the middle and lower part of the outer pressure ring 113, as shown in FIG. 16(b). 16 ( a) The solid line arrow is thrown into the sump set in the electroplating chamber obliquely downward, and will not climb up along the outer side wall of the outer pressure ring 113, and then the electroplating is thrown out obliquely upward along the dotted arrow in Fig. 16(a). cavity, polluting the process environment.

In other embodiments, the outer pressure ring can be provided with two or more upper and lower blocking parts, which can more effectively prevent the liquid from being thrown out obliquely upward along the outer side wall of the outer pressure ring when the cup chuck rotates. FIG. 16( c ) shows that the lower part of the outer pressure ring 113 has two lower blocking parts 1133 , and the two lower blocking parts 1133 are arranged up and down along the outer surface of the outer pressure ring 113 . Of course, it can be understood that in other embodiments Among them, the number of the lower blocking parts 1133 can be determined according to specific process requirements, and the number of the following blocking parts 1133 can also be set to three, four or more than four. The outwardly protruding widths of the two or more lower blocking portions 1133 may be the same or different. For example, the outwardly protruding widths of the two or more lower blocking portions 1133 may gradually increase from bottom to top, or may also increase from bottom to top. slowing shrieking.

Figure 16(d) shows a schematic diagram of another outer pressure ring. The outer pressure ring 113 also has an upper blocking portion 1134, which is a downward annular protrusion formed on the top of the outer pressure ring 113, and is used to change the flow direction of the liquid, so that the liquid flowing obliquely upward along the outer side wall of the outer pressure ring 113 passes through the upper blocking portion. At 1134, the liquid flows obliquely downward along the upper blocking portion 1134 which is protruded downward. When the cup chuck 11 rotates, even if part of the liquid climbs over the lower blocking portion 1133 to the top of the outer pressure ring 113, it will be intercepted by the upper blocking portion 1134 formed at the top of the outer pressure ring 113, and under the action of centrifugal force, the inclined Throw it down into the sump set in the electroplating chamber, as shown by the solid arrow in Figure 16(d), so as to prevent the liquid from splashing out of the electroplating chamber and polluting the process environment. In this embodiment, the included angle θ between the upper blocking portion 1134 and the outer peripheral surface of the outer pressure ring 113 is between 80° and 120°, preferably 90°.

In another embodiment, the number of the upper blocking portions 1134 may also be more than two (not shown in the figure), such as two, three, or four, and the two or more upper blocking portions 1134 may extend from the inside to the outside in the radial direction Arrange. The downwardly protruding heights of the two or more upper blocking portions 1134 may be the same or different. For example, the downwardly protruding heights of the two or more upper blocking portions 1134 may gradually increase from the inside to the outside, or may also increase from the inside to the outside. Gradually decreases.

In order to reduce the adhesion of the electroplating solution on the surface of the outer pressure ring 113, the surface of the outer pressure ring 113 is treated with hydrophobicity, for example, to reduce the surface roughness of the outer pressure ring 113. In this embodiment, the surface roughness Ra of the outer pressure ring 113 is less than 10 nm, Preferably, the surface roughness Ra of the outer pressure ring 113 is less than 2 nm; or a hydrophobic film (such as PTFE coating) is coated or sputtered on the surface of the outer pressure ring 113 ; or the outer pressure ring 113 is made of a hydrophobic material, or mixed with hydrophobic Made of sexual material.

The substrate holding device further includes a sealing member 114 and a contact ring 115, wherein the contact ring 115 generally has a mounting portion and a finger portion, the mounting portion is pressed between the inner pressure ring 111 and the intermediate frame 112, and the contact ring 115 is mounted and fixed on the cup In the chuck 11, the tips of the fingers are in contact with the edge seed layer of the substrate 10 during the electroplating process to conduct electricity to the substrate. As shown in FIG. 5 and FIG. 6 , the sealing member 114 covers the inner peripheral surface, the bottom and the outer peripheral surface of the intermediate frame 112 , and a contact ring 115 and a sealing ring 116 are sequentially installed on the sealing member 114 , and the inner pressure ring 111 is pressed on the intermediate frame 112, and the inner space of the cup-shaped chuck 11 is sealed by the sealing ring 116. After the electroplating is completed, the cleaning liquid or soaking liquid penetrates into the inside of the cup chuck 11 , that is, between the inner pressure ring 111 and the intermediate frame 112 , during the online cleaning or soaking of the cup chuck 11 . Wherein, the sealing ring 116 can be an O-ring sealing ring.

In this embodiment, the sealing member 114, as an independent accessory, can be integrally formed by a process such as mold opening or injection molding, and can be detachably installed with the intermediate frame 112. Specifically, the seal 114 is integrally covered on the head of the intermediate frame 112, and its two ends are locked and fixed on the intermediate frame 112 by the inner pressure ring 111 and the outer pressure ring 113. When performance is degraded, the broken seal can be removed by simply disassembling the cup chuck 11, and then the equipment can be put back into service by replacing with a new seal, which can reduce the operational difficulty and cost of seal replacement. Of course, in other embodiments, in order to make the installation of the sealing member 114 and the intermediate frame 112 more firmly attached, the sealing member 114 may be bonded on the intermediate frame 112 by an adhesive.

The sealing member 114 can be selected from fluorine rubber (such as perfluoro or fluorine-containing rubber), silicon rubber, etc., and the hardness detected by the durometer is 50-90. Specifically, the sealing member 114 can be made of different materials according to different process applications. For example, when electroplating copper, a semi-fluorine rubber (such as Viton fluorine rubber) with good sealing performance and low hardness can be used, and when electroplating nickel or gold, In the high temperature electroplating process, perfluororubber can be used. In other embodiments, by performing hydrophobic treatment on the sealing member 114 to make the sealing member 114 hydrophobic, the adhesion of the electroplating solution on the surface of the sealing member 114 is reduced. The sealing member 114 can be hydrophobic treated in various ways, for example: 1) the sealing member 114 is made of a hydrophobic material (eg Teflon); 2) the surface of the sealing member 114 is coated with a hydrophobic coating (eg Teflon coating) ); 3) Incorporating hydrophobic materials (eg, Teflon) in the sealing member 114; 4) Reducing the surface roughness of the sealing member 114, eg, the surface roughness Ra of the sealing member is less than 10 nm, preferably, less than 2 nm.

Figure 10 shows a partial cross-sectional view of the seal. The seal 114 has an inner end 1141 , an outer end 1142 and a bottom 1143 . Referring to FIG. 6 , the inner end portion 1141 covers the inner peripheral surface of the middle frame 112 and is pressed against the upper surface of the second mounting platform 1123 of the middle frame 112 by the inner pressure ring 111 , and the outer end portion 1142 is wrapped around the middle frame 112 and is locked on the lower surface of the second mounting platform 1123 of the middle frame 112 by the second step 1132 of the outer pressure ring 113, and the bottom 1143 of the sealing member 114 wraps the bottom of the middle frame 112, and bends upward to wrap the middle frame Horizontal support 1124 of 112 . Referring to FIG. 10 , the sealing member 114 protrudes upward at the end of the horizontal support portion 1124 to form a sealing lip 1144 . The thickness of the sealing lip portion 1144 is larger than that of the other portions of the sealing member 114 . After the substrate 10 is loaded into the cup chuck 11 , the chuck plate 12 presses the back of the substrate 10 to make the edge of the substrate 10 closely fit the sealing lip 1144 to seal the edge and the back of the substrate. In this embodiment, there is no metal support inside the sealing lip 1144 and the thickness is increased, which can effectively prolong the service life of the seal 114. In addition, since the sealing lip 1144 has no metal support inside, the radial width of the sealing lip 1144 is only limited by the sealing lip 1144 It is determined by its own width and can be designed to be less than 1 mm. Preferably, the radial width of the sealing lip portion 1144 is 0.4 mm˜0.8 mm, and most preferably, the radial width is 0.8 mm. The sealing lip portion 1144 has a radial width of less than 1 mm, which can reduce the width of the blank holder when the sealing member 114 is in sealing contact with the substrate 10, and can meet the requirements of the subsequent narrower and narrower edge removal process.

In another embodiment, the seal has more than two sealing lips. The sealing lip has a certain elasticity, and can be slightly deformed under the pressure of the chuck plate, so that more than two sealing lips of the seal are in sealing contact with the substrate at the same time to achieve multi-stage sealing between the cup-shaped chuck and the substrate. To achieve better edge sealing effect. Two or more sealing lips are distributed radially inward and outward, and the sealing lips have the same height, or at least two sealing lips have a height difference between them. Gradually decrease radially inward, or alternately arrange high and low along the radial direction. In addition, the total radial width of the two or more sealing lips is not greater than 1 mm, and preferably, the total radial width of the two or more sealing lips is 0.4 mm˜0.8 mm.

Figures 17(a) to 17(c) show a partial schematic view of a seal with two sealing lips, which are distributed radially inward and outward, respectively an inner sealing lip 1144a and an outer sealing lip 1144b. Referring to FIG. 17( a ), the heights of the inner sealing lip portion 1144a and the outer sealing lip portion 1144b are equal, and the height h is about 0.3 mm˜0.5 mm. 17(b), the height h2 of the inner sealing lip 1144a is greater than the height h1 of the outer sealing lip 1144b, for example, the height h2 of the inner sealing lip 1144a is 0.4mm, and the height h1 of the outer sealing lip 1144b is 0.35mm . 17(c), the height h2 of the inner sealing lip 1144a is smaller than the height h1 of the outer sealing lip 1144b, for example, the height h2 of the inner sealing lip 1144a is 0.35mm, and the height h1 of the outer sealing lip 1144b is 0.4mm .

17(a) to 17(c), the sum of the radial widths of the inner sealing lip 1144a and the outer sealing lip 1144b is not greater than 1 mm, that is, a+b≤1 mm, the radial width a of the inner sealing lip 1144a and the radial width b of the outer sealing lip 1144b may be the same or different, preferably, the radial width a of the inner sealing lip 1144a is smaller than the radial width b of the outer sealing lip 1144b, specifically, as shown in Fig. 17(c ), the radial width b of the outer sealing lip portion 1144b is 0.6 mm, and the radial width a of the inner sealing lip portion 1144a is 0.2 mm.

In this embodiment, the outer pressure ring 113 is made of insulating material, specifically, the entire side surface and the bottom of the outer pressure ring 113 are made of insulating material, and the outer pressure ring 113 is locked and sealed with the sealing member 114 from the outside, so that the exposed area of the sealing member 114 is large. Therefore, only the bottom 1143 is exposed to the plating solution during the process, which can effectively reduce the risk of damage to the seal.

Referring to FIG. 10 again, the contact surface between the seal 114 and the outer pressure ring 113 is formed with a plurality of rings of outer sealing protrusions 1146 for enhancing the sealing between the seal 114 and the outer pressure ring 113 . A plurality of rings of inner sealing protrusions 1145 are formed on the contact surface of the sealing member 114 and the intermediate frame 112. When the sealing member 114 is wrapped to the intermediate frame 112 and locked by the inner pressure ring 111 and the outer pressure ring 112, the inner sealing protrusions 1145 Embedded in the sealing groove 1128 opened on the surface of the intermediate frame 112, on the one hand, the sealing member 114 and the intermediate frame 112 can be tightly assembled, and on the other hand, a multi-stage seal can be formed inside the sealing member 114 to strengthen the sealing member 114 and the intermediate frame 112. sealing effect between. When the bottom 1143 of the sealing member 114 is damaged, the multi-circle inner sealing protrusions 1145 can effectively prevent the infiltrated electroplating solution from diffusing inside the cup chuck 11, reducing the corrosion of the plating solution to the inside of the cup chuck 11, so that the inside of the cup chuck 11 can pass through Simple replacement of the seal 114 allows the substrate retention device to resume normal operation, which is beneficial for reducing maintenance time and cost of the device.

Since it is difficult to achieve complete sealing by pressing two planes together, the pressing surfaces of the inner pressure ring 111 and the outer pressure ring 113 and the sealing member 114 are provided with several bumps (not shown in the figure). When the pressure ring 111 and the outer pressure ring 113 are locked, they can completely fit with the contact surface of the sealing member 114, thereby improving the sealing performance between the components.

Referring to FIG. 11 , the bottom of the outer pressure ring 113 is processed with bumps 1137. When the cup chuck 11 needs to be repaired, the bumps 1137 at the bottom of the outer pressure ring 113 can play a supporting role, so that the seal 114 can be kept suspended without In contact with the maintenance workbench, so as to avoid damaging the sealing member 114 or contaminating the surface of the sealing member 114, in this embodiment, the height of the bump 1137 at the bottom of the outer pressure ring 113 is about 1 mm.

In this embodiment, the inner pressure ring 111 is made of conductive material, usually conductive metal, and the contact ring 115 is electrically connected to the electroplating power source through the inner pressure ring 111 . In another embodiment, the inner pressure ring 111 and the middle frame 112 are both made of conductive materials, usually conductive metals, the electroplating power source is directly connected to the middle frame 112 , and the middle frame 112 is electrically connected to the contact ring 115 through the inner pressure ring 111 . Due to the need to maintain the cup chuck 11 after multiple process cycles, sulfuric acid, nitric acid, tin-silver stripping solution and various surfactants are often used. At this time, the inner pressure ring 111 will inevitably be Therefore, the inner pressure ring 111 not only needs to have electrical conductivity, but also needs to have corrosion resistance. The requirements for material selection are high, and conductive and corrosion-resistant metals, such as titanium, titanium alloy, stainless steel and other expensive metal materials, need to be used. This will increase manufacturing and maintenance costs.

Preferably, in other embodiments, the middle frame 112 is made of conductive material, generally conductive metal, and the contact ring 115 is electrically connected to the electroplating power source through the middle frame 112. Since the middle frame 112 is sealed by the sealing member 114 and the sealing ring 116, No matter in the electroplating process or the cleaning of the device, the intermediate frame 112 is not in contact with the treatment liquid, and there is no risk of being corroded by the treatment liquid. Therefore, the material of the intermediate frame 112 only needs to meet the electrical conductivity, and the inner pressure ring 111 is used as a The electrical connection parts reduce the selection requirements for materials, and can use ordinary conductive metals, which can effectively reduce manufacturing and maintenance costs. At this time, the inner pressure ring 111 only needs to have corrosion resistance, and corrosion-resistant insulating materials can be used instead of corrosion-resistant conductive materials, thereby expanding the selection range of the inner pressure ring 111 and helping to reduce costs. In order to realize on-line cleaning of the cup-shaped chuck 11, in this embodiment, the inner pressure ring 111 can be made of PVC, PEEK, PTFE, PVDF, PP, or the like.

7 and 8, the assembly process of the cup chuck 11 is as follows:

Step 1: wrap the seal 114 on the head of the middle frame 112 , that is, wrap the seal 114 on the second mounting platform 1123 , the bottom and the horizontal support part 1124 of the middle frame 112 .

Step 2: Assemble the intermediate frame 112 covered with the seal 114 into the outer pressure ring 113 . The contact surface between the outer pressure ring 113 and the middle frame 112 can be provided with a plurality of positioning pieces. As shown in FIG. 8 , the inner side wall of the outer pressure ring 113 is provided with a second positioning groove 1135 , and the outer side wall of the middle frame 112 is provided with a second positioning groove 1135 . The second positioning block 1120 is matched with the two positioning grooves 1135 .

Step 3: Install the contact ring 115 on the intermediate frame 112, and the fingers of the contact ring 115 are used to contact the seed layer on the edge of the substrate to conduct electricity. For ease of assembly, referring to FIG. 9 , a plurality of positioning posts 1129 are provided on the second mounting platform 1123 of the intermediate frame 112 so that the contact ring 115 is mounted on the second mounting platform 1123 of the intermediate frame 112 along the positioning columns 1129 and is located on the seal above 114.

Step 4: After the contact ring 115 is installed, install the inner pressure ring 111 on the intermediate frame 112 and press the contact ring 115 . The first positioning block 1111 formed on the periphery of the inner pressure ring 111 is overlapped in the first positioning groove 1125 at the top of the middle frame 112, and a sealing ring 116 is installed on the lower surface of the inner pressure ring 111. When the inner pressure ring 111 and the middle frame 112 When locked, the sealing ring 116 is fixed between the inner pressure ring 111 and the contact ring 115 .

Step 5: A plurality of screws 117 pass through the first screw holes 1112 on the inner pressure ring 111 and the second screw holes 1126 on the intermediate frame 112 to lock the inner pressure ring 111 on the inner peripheral surface of the intermediate frame 112, and make the The bottom of the inner pressure ring 111 presses the sealing ring 116, the contact ring 115 and the inner end 1141 of the sealing member 114 on the second mounting platform 1123 of the intermediate frame 112 in sequence from top to bottom; a plurality of screws 118 pass through the intermediate frame The third screw hole 1127 on the 112 and the fourth screw hole 1136 on the outer pressure ring 113 lock the outer pressure ring 113 on the outer peripheral surface of the intermediate frame 112, and press the outer end 1142 of the seal 114 against the outer pressure ring 113. between the ring 113 and the intermediate skeleton 112 .

12 and 13 show perspective views of the chuck plate in this embodiment. The chuck plate 12 includes a base 121 , the base 121 has a lower surface contacting the substrate 10 , a plurality of exhaust grooves 122 are formed on the lower surface, and a peripheral edge of the base 121 is provided with an exhaust communicated with the exhaust grooves 122 hole 125. When the chuck plate 12 is pressed against the back of the substrate 10, the pressure on the back of the substrate 10 is equal to the ambient air pressure through the exhaust holes 125 provided on the periphery of the chuck plate 12, so as to facilitate the separation of the substrate 10 and the chuck plate 12 after the electroplating process is completed , to avoid a slight negative pressure between the chuck plate 12 and the substrate 10 , the substrate 10 is adsorbed on the chuck plate 12 , and the unloading operation of the substrate 10 is affected.

Referring again to FIG. 13 , the lower surface of the base 121 is further provided with a contact portion protruding toward the substrate 10 . The lower edge of the contact ring protrusion 124 is formed. 14 and 15 , the protrusion heights of the contact bumps 123 and the contact ring bumps 124 are the same. When the chuck plate 12 is in contact with the substrate 10 , only the contact bumps 123 and the contact ring bumps 124 are in contact with the back of the substrate 10 . The rest of the lower surface of the base 121 is not in contact with the substrate 10. On the one hand, the contact area between the chuck plate 12 and the substrate 10 can be reduced, the scratches and contamination on the back of the substrate 10 can be reduced, and on the other hand, the pressure on the back of the substrate 10 and the environment can be reduced. The pressures are equalized to facilitate separation of the substrate 10 from the chuck plate 12 when unloaded.

To sum up, the present invention has been described in detail and in detail through the description of the above-mentioned embodiments and the related drawings, so that those skilled in the art can implement it accordingly. The above-mentioned embodiments are only used to illustrate the present invention, rather than to limit the present invention, and the scope of rights of the present invention should be defined by the claims of the present invention. Changes in the number of elements described herein or substitution of equivalent elements should still fall within the scope of the present invention.

Claims (24)

1. A cup-shaped chuck of a substrate holding device, wherein the cup-shaped chuck is used to hold a substrate, characterized in that it comprises:

   inner pressure ring;

   an intermediate frame, the inner pressure ring is locked on the inner peripheral surface of the intermediate frame;

   A seal, the seal has an outer end, a bottom and an inner end, the outer end of the seal covers at least part of the outer peripheral surface of the middle frame, the bottom of the seal covers the bottom of the middle frame, and is exposed to the Outside the cup-shaped chuck, the inner end of the seal covers at least part of the inner peripheral surface of the middle frame, and the inner end of the seal is pressed between the inner pressure ring and the middle frame by the inner pressure ring;

   an outer pressure ring, the outer pressure ring is made of insulating material, locked on the outer peripheral surface of the middle frame, and the outer end of the seal is pressed between the outer pressure ring and the middle frame through the outer pressure ring;

   The contact ring is located on the seal and is crimped between the inner pressure ring and the intermediate frame, and a sealing ring is arranged between the inner pressure ring and the contact ring.
2. The cup chuck of the substrate holding device according to claim 1, wherein the bottom of the intermediate frame forms a horizontal support portion radially and horizontally inward, and the bottom of the sealing member wraps the horizontal support portion and is located at the horizontal support portion. The end protrudes upward to form a sealing lip, and the sealing lip is one or more than two, and the sealing lip is used for sealing contact with the edge of the substrate.
3. The cup chuck of the substrate holding device according to claim 2, wherein when there are two or more sealing lips, the heights of the two or more sealing lips are the same.
4. The cup chuck of the substrate holding device according to claim 2, wherein when the number of the sealing lips is two or more, there is a height difference between at least two of the sealing lips.
5. 5. The cup chuck of the substrate holding device according to claim 4, wherein the height of the sealing lip portion gradually increases radially inward.
6. The cup chuck of the substrate holding device according to claim 4, wherein the height of the sealing lip gradually decreases inward in the radial direction.
7. The cup chuck of the substrate holding device according to claim 4, wherein the heights of the sealing lips are arranged alternately in the radial direction.
8. The cup chuck of the substrate holding device according to claim 2, wherein when there is one sealing lip, the radial width of the one sealing lip is not more than 1 mm, and when there are more than two sealing lips , the total radial width of the two or more sealing lips is not more than 1mm.
9. The cup chuck of the substrate holding device according to claim 8, wherein when there is one sealing lip, the radial width of the one sealing lip is 0.4 mm˜0.8 mm, and when the sealing lip is two When there are more than one, the total radial width of the two or more sealing lips is 0.4 mm to 0.8 mm.
10. The cup chuck of the substrate holding device according to claim 1, wherein the sealing member is detachably installed with the intermediate frame as an independent accessory.
11. The cup chuck of the substrate holding device according to claim 10, wherein the sealing member is bonded to the intermediate frame by an adhesive.
12. The cup chuck of the substrate holding device according to claim 1, wherein a plurality of inner sealing protrusions are formed on the contact surface of the sealing member and the intermediate frame, and correspondingly, the surface of the intermediate frame is provided with a plurality of inner sealing protrusions. A sealing groove that mates with the inner sealing protrusion.
13. The cup chuck of the substrate holding device according to claim 12, wherein a plurality of outer sealing protrusions are formed on the contact surface of the sealing member and the outer pressure ring.
14. The cup chuck of the substrate holding device according to claim 1, wherein the sealing member has hydrophobicity.
15. The cup chuck of the substrate holding device according to claim 1, wherein the outer surface of the outer pressure ring is provided with a blocking portion.
16. The cup chuck of the substrate holding device according to claim 15, wherein the blocking part comprises at least an upper blocking part and/or a lower blocking part, the number of the upper blocking part is more than one, and the number of the lower blocking part is More than one, the upper blocking portion is a downward annular convex formed on the top end of the outer pressure ring, and the lower blocking portion is an outward annular convex formed at the middle and lower part of the outer pressure ring.
17. The cup chuck of the substrate holding device according to claim 1, wherein the surface of the outer pressing ring has hydrophobicity.
18. The cup chuck of the substrate holding device according to claim 1, wherein a plurality of bumps are formed on the contact surface of the outer pressure ring and the sealing member, and a contact surface between the inner pressure ring and the sealing member is formed with a plurality of bumps Several bumps.
19. The cup-shaped chuck of the substrate holding device according to claim 1, wherein the bottom of the outer pressure ring is provided with several support points.
20. The cup-shaped chuck of the substrate holding device according to claim 1, wherein the material of the inner pressure ring is a conductive and corrosion-resistant metal, and the contact ring is electrically connected to the electroplating power supply through the inner pressure ring.
21. The cup chuck of the substrate holding device according to claim 1, wherein the inner pressure ring is made of insulating material, the intermediate frame is made of conductive metal, and the contact ring is electrically connected to the electroplating power source through the intermediate frame.
22. A substrate holding device, characterized in that it includes:

    The cup chuck as claimed in any one of claims 1 to 21 for holding a substrate;

    a chuck plate abutting the back of the substrate so that the substrate is in pressing contact with the seal of the cup chuck;

    A chuck plate driving device for driving the chuck plate against or away from the back of the substrate;

    Angle drive device for adjusting the angle of the substrate clamped by the cup chuck and the chuck plate;

    a rotary drive for driving rotation of the substrate held by the cup chuck and the chuck plate; and

    The vertical drive device is used to drive the substrate clamped by the cup chuck and the chuck plate to ascend or descend.
23. The substrate holding device according to claim 22, wherein the chuck plate comprises a base, the base has a lower surface in contact with the back surface of the substrate, the lower surface is provided with a plurality of exhaust grooves, and the base An exhaust hole communicated with the exhaust groove is opened on the peripheral edge.
24. The substrate holding device according to claim 23, wherein the lower surface of the base is further provided with a contact portion protruding toward the substrate, so as to reduce the contact area between the chuck plate and the substrate.

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