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WO2022166367A1 - 振动板及其加工方法、扬声器结构及电子设备 - Google Patents

振动板及其加工方法、扬声器结构及电子设备 Download PDF

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Publication number
WO2022166367A1
WO2022166367A1 PCT/CN2021/136062 CN2021136062W WO2022166367A1 WO 2022166367 A1 WO2022166367 A1 WO 2022166367A1 CN 2021136062 W CN2021136062 W CN 2021136062W WO 2022166367 A1 WO2022166367 A1 WO 2022166367A1
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WO
WIPO (PCT)
Prior art keywords
layer
adhesive film
magnetic circuit
vibration plate
magnetic
Prior art date
Application number
PCT/CN2021/136062
Other languages
English (en)
French (fr)
Inventor
李美玲
牟雅静
凌风光
郑泽东
李春
Original Assignee
歌尔股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Publication of WO2022166367A1 publication Critical patent/WO2022166367A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H04R7/06—Plane diaphragms comprising a plurality of sections or layers
    • H04R7/10—Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
    • H04R2231/001—Moulding aspects of diaphragm or surround
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
    • H04R2307/025—Diaphragms comprising polymeric materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
    • H04R2307/027—Diaphragms comprising metallic materials

Definitions

  • the present invention relates to the technical field of electro-acoustic equipment, in particular to a vibrating plate, a method for processing the vibrating plate, and a speaker structure and electronic equipment using the vibrating plate.
  • Speaker is an important part of audio equipment and communication equipment. It is a transducer device that converts electrical signals into sound signals. The quality of its performance has a great impact on sound quality.
  • the vibration plate of the loudspeaker mainly affects the high-frequency performance of the loudspeaker, and its acoustic performance directly affects the performance of the acoustic device.
  • the vibration plate of the loudspeaker adopts the structure of two flat surface layers and a foam layer in the middle, but due to the limitation of the foam processing of the intermediate foam layer, the thickness of the vibration plate is difficult to make thin, and the foaming
  • the foam body has the problem that the foam wall is relatively thin, which makes the molding structure of the foam layer unstable and affects the structural strength of the vibration plate.
  • the main purpose of the present invention is to provide a vibrating plate and its processing method, loudspeaker structure and electronic equipment, aiming at improving the structural strength of the vibrating plate, and effectively reducing the weight of the vibrating plate, so that the loudspeaker is not only easy to process, but also has high structural strength, Sound quality is good.
  • the vibrating plate proposed by the present invention is applied to a loudspeaker structure, and the vibrating plate comprises:
  • the main body comprises a first layer and a second layer arranged in layers, the first layer is provided with a rib protruding in a direction away from the second layer, and a sealing cavity is arranged in the rib;
  • a packing layer is filled into the sealing cavity.
  • a side of the first layer facing the second layer is recessed toward a side away from the second layer to form a concave area, and is enclosed with the second layer to form the sealed cavity.
  • the first layer includes a first metal layer and a first adhesive film layer stacked in layers, and the recessed area is formed by the first adhesive film layer being recessed toward the first metal layer;
  • the second layer includes a stacked second metal layer and a second adhesive film layer, and the second adhesive film layer is bonded and connected to the first adhesive film layer.
  • the material of the first metal layer and/or the second metal layer is any one of aluminum foil, copper foil, titanium foil, magnesium alloy foil and MMC;
  • the modulus density ratio of the first metal layer and/or the second metal layer >15GPa ⁇ cm 3 /g;
  • the material of the first adhesive film layer and/or the second adhesive film layer is any one of epoxy adhesive film, phenolic adhesive film, acrylate adhesive film, silicone adhesive film and polyester adhesive film. kind;
  • the tensile modulus of the first adhesive film layer and/or the second adhesive film layer >600Mpa;
  • the adhesive force of the first adhesive film layer and/or the second adhesive film layer >300gf/20mm;
  • the thickness of the first layer and/or the second layer ranges from 0.004 mm to 0.21 mm.
  • the first layer and/or the second layer is made of a fiber material and a pre-impregnated resin, and the fiber material is one of aramid fiber, carbon fiber or glass fiber.
  • the prepreg resin is any one of epoxy resin, phenolic resin, bismaleimide resin, vinyl resin, PA, PP, PC, PI and PEEK.
  • the areal density of the first layer and/or the second layer ranges from 15g/m 2 to 150g/ m 2 ; or, when the first layer and/or the second layer is a woven fabric, the areal density of the first layer and/or the second layer ranges from 25g/m 2 to 240g/m 2 ;
  • the tensile modulus of the prepreg resin >500Mpa, and the flexural strength of the prepreg resin>60MPa;
  • the content of the prepreg resin in the first layer and/or the second layer is 30%-60%.
  • the material of the filler layer is one of liquid foam or styrofoam film
  • the material of the filler layer is one of foamed PET, PMI, PA, PVC, PE, PPS, PS, PU, epoxy foam or phenolic foam.
  • the rib includes a plurality of
  • a plurality of the protruding ribs are arranged in parallel and are arranged at intervals along the length direction or width direction of the main body; or, a plurality of the protruding ribs are arranged in a cross and form an included angle, and the range of the included angle is 0 ° ⁇ 90°.
  • the present invention also proposes a processing method of the above-mentioned vibration plate, and the processing method comprises the following steps:
  • a body including a first layer and a second layer
  • the second upper mold is used to close the mold, and heating is performed to foam the packing layer in the sealed cavity, and the vibration plate is obtained by demoulding.
  • the step of filling the filler layer in the recessed area includes:
  • the filler layer is filled in the recessed area, so that the volume ratio of the filler layer to the recessed area ranges from 1/25 to 3/4.
  • the present invention also provides a loudspeaker structure, the loudspeaker structure includes a basin frame, a magnetic circuit system and a vibration system accommodated in the basin frame, and the vibration system includes the above-mentioned vibration plate.
  • the vibration system further includes:
  • the vibrating membrane is arranged opposite to the magnetic circuit system, the vibrating plate is arranged on the vibrating membrane, and the magnetic circuit system is provided with a magnetic gap and a concave part, the concave part and the diaphragm of the vibrating plate are provided. Rib corresponding setting;
  • a voice coil one end of the voice coil is connected to the vibrating membrane or the vibrating plate, and the other end of the voice coil is suspended in the magnetic gap.
  • the peripheral edge of the vibration plate is connected to the vibration membrane, and the voice coil is connected to the side of the vibration plate facing away from the vibration membrane, and is arranged around the rib.
  • the cross-sectional shape and size of the protruding ribs are adapted to the cross-sectional shape and size of the recessed portion
  • the vibrating membrane is composed of one or more materials in engineering plastics, elastomer materials, and adhesive films;
  • the thickness of the diaphragm is in the range of 0.01mm ⁇ 0.5mm.
  • the magnetic circuit system includes:
  • the magnetic conducting yoke is arranged in the basin frame;
  • the central magnetic circuit portion is provided on the magnetic conductive yoke, and the recessed portion is provided on the side of the central magnetic circuit portion facing away from the magnetic conductive yoke;
  • a side magnetic circuit portion is provided on the magnetic permeable yoke and is arranged around the central magnetic circuit portion, and the magnetic gap is formed between the side magnetic circuit portion and the central magnetic circuit portion.
  • the central magnetic circuit portion includes a central magnet and a central washer, the central magnet is disposed on the magnetic conductive yoke, and the central washer is disposed on the central magnet facing away from the magnetic conductive yoke On one side of the central washer, the concave portion is provided, and the concave portion is a groove structure or a through-groove structure.
  • the present invention also provides an electronic device, comprising a device housing and the above-mentioned speaker structure, wherein the speaker structure is arranged in the device housing.
  • the main body is set as the first layer and the second layer arranged in layers, so that the first layer is provided with ribs that protrude in the direction away from the second layer, so that the ribs are used to strengthen the vibration plate.
  • the weight of the vibration plate can be reduced while ensuring the structural strength, which can improve the sensitivity and improve the high frequency frequency response characteristics.
  • the vibrating plate of the present invention not only improves the structural strength, but also effectively reduces the weight, and also makes the speaker not only convenient to process, but also has high structural strength and good sound quality.
  • FIG. 1 is a schematic structural diagram of a vibrating plate in an embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of a vibrating plate in another embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a vibrating plate in another embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional view of a vibrating plate in an embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional view of the first layer or the second layer in an embodiment of the present invention.
  • Fig. 6 is the FR curve comparison diagram of vibrating plate in the present invention and existing aluminum alloy vibrating plate;
  • FIG. 7 is a schematic cross-sectional view of a manufacturing process of a vibrating plate in an embodiment of the present invention.
  • FIG. 8 is a schematic cross-sectional view of a speaker structure in an embodiment of the present invention.
  • the present invention provides a vibration plate 100 , and the vibration plate 100 is applied in the speaker structure 600 .
  • the speaker structure 600 is applied to an electronic device, and the electronic device may be a mobile phone, a stereo, a computer, an earphone, a watch, a TV, or a tablet computer, etc., which is not limited herein.
  • the vibration plate 100 includes a main body 1 and a filler layer 2, wherein the main body 1 includes a first layer 11 and a second layer 12 that are arranged in layers.
  • the layer 11 is provided with a convex rib 112 protruding in a direction away from the second layer 12 , a sealing cavity 1 a is formed in the convex rib 112 , and the packing layer 2 is filled into the sealing cavity 1 a.
  • the main body 1 is the main structure of the vibration plate 100 , and the main body 1 can optionally be a plate-like or sheet-like structure.
  • the material of the main body 1 may be metal material or fiber material, which is not limited herein.
  • the main body 1 is illustrated with a plate-like structure, and the main body 1 may be a single-layer structure or a multi-layer structure.
  • the main body 1 has a first surface 111 and a second surface 121 that face away from each other, and the main body 1 also has a side edge connecting the first surface 111 and the second surface 121 .
  • the main body 1 includes a first layer 11 and a second layer 12 arranged in layers, so that the side of the second layer 12 facing away from the first layer 11 is the second surface 121 , and the side of the first layer 11 facing away from the second layer 12 is the first surface 111 .
  • the first layer 11 is provided with the ribs 112 protruding in the direction away from the second layer 12, that is, the first surface 111 of the main body 1 is protruded with the ribs 112, so that the main body 1 can utilize the convex ribs 112.
  • the ribs 112 enhance the structural strength of the main body 1 of the vibration plate 100 .
  • the second surface 121 of the main body 1 is in a plane or flat plate structure, and the ribs 112 on the first surface 111 of the main body 1 are in a convex hull structure.
  • the sealing cavity 1a is provided in the rib 112, and the packing layer 2 is filled in the sealing cavity 1a, so that the structural strength of the rib 112 is further strengthened by the packing layer 2, compared with the simple convex hull form
  • the vibration plate this structure can further enhance the overall structural strength.
  • the main body 1 is configured as the first layer 11 and the second layer 12 arranged in layers, so that the first layer 11 is provided with the ribs 112 protruding in the direction away from the second layer 12, thereby utilizing
  • the rib 112 enhances the structural strength of the main body 1 of the vibration plate 100; at the same time, by arranging a sealing cavity 1a in the rib 112, and disposing the packing layer 2 in the sealing cavity 1a, the vibration plate 100 can be lightened while ensuring the structural strength.
  • weight which increases sensitivity and improves frequency response characteristics at high frequencies.
  • the vibrating plate 100 of the present invention not only improves the structural strength, but also effectively reduces the weight, and also makes the speaker not only convenient to process, but also has high structural strength and good sound quality.
  • the vibration plate 100 of the present invention achieves the advantage of being lighter than the existing vibration plate structure, and at the same time, the ribs 112 are formed on the first surface 111 of the vibration plate 100 to meet the performance requirements of the vibration plate 100.
  • the packing layer 2 is filled in the sealing cavity 1 a of the protruding ribs 112 , so as to further strengthen the overall structure of the vibration plate 100 .
  • the structure of the vibration plate 100 can form a convex hull without destroying the cell structure in the filling layer 2 . This structure can not only reduce the mass and improve the intermediate frequency sensitivity, but also improve the rigidity and stability of the vibration plate. Expand high frequency.
  • the side of the first layer 11 facing the second layer 12 is recessed toward the side facing away from the second layer 12 to form a recessed area 113 , and is enclosed with the second layer 12 to form a sealed cavity 1a.
  • the main body 1 is formed with a multi-layer structure, and the first layer 11 and the second layer 12 of the main body 1 are arranged in layers, that is, the side of the first layer 11 facing away from the second layer 12 is the first surface 111 , the side of the second layer 12 facing away from the first layer 11 is the second surface 121 .
  • the ribs 112 of the first surface 111 are recessed from the side of the first layer 11 facing the second layer 12 to the side facing away from the second layer 12 , so as to protrude on the first surface 111 and form the rib 112 structure
  • the concave area 113 is formed on the side of the first layer 11 facing the second layer 12, so that when the first layer 11 and the second layer 12 are stacked and arranged, the second layer 12 covers the opening of the concave area 113, so that the first layer 11 and the second layer 12 are stacked.
  • the recessed area 113 of the first layer 11 and the second layer 12 enclose the sealed cavity 1a.
  • the side of the first layer 11 facing away from the second layer 12 may also be protruded and formed with a rib 112 , that is, the rib 112 may be formed directly on the first surface 111 .
  • the side of the first layer 11 facing the second layer 12 is flat, and is stacked with the second layer 12 , which is not limited herein.
  • first layer 11 and the second layer 12 of the main body 1 can be made of the same material, for example, the first layer 11 and the second layer 12 can be made of metal material or fiber material, which is not limited here.
  • the material of the first layer 11 and the material of the second layer 12 may also be set to be different, which is not limited herein.
  • the first layer 11 and the second layer 12 of the main body 1 in the vibration plate 100 are partially in the form of a filling layer 2 (eg, foam), and the edge of the vibration plate 100 adopts the first layer 11 and the second layer 12 is compounded, and the middle area is partially reinforced (ie, the convex rib 112 ), so that one side of the main body 1 is in the form of a flat plate, and the other side is in the form of a convex hull.
  • a filling layer 2 eg, foam
  • the ribs 112 of the first layer 11 can be pre-formed, and the inside of the concave area 113 of the first layer 11 is filled and reinforced by the filler layer 2, so compared with the vibration plate in the form of a simple convex hull, the The vibration plate 100 can further enhance the overall rigidity.
  • the first layer 11 includes a first metal layer 131 and a first adhesive film layer 141 that are stacked in layers, and the recessed area 113 faces the first metal layer from the first adhesive film layer 141 .
  • the layer 131 is formed concavely;
  • the second layer 12 includes a second metal layer 132 and a second adhesive film layer 142 arranged in layers, and the second adhesive film layer 142 is bonded and connected to the first adhesive film layer 141 .
  • the first layer 11 and the second layer 12 of the main body 1 are made of the same material.
  • the first layer 11 is composed of a first metal layer 131 and a first adhesive film layer 141 that are stacked and arranged
  • the second layer 12 is composed of The stacked second metal layer 132 and the second adhesive film layer 142 are formed.
  • first adhesive film layer 141 of the first layer 11 and the second adhesive film layer 142 of the second layer 12 are bonded and connected, that is, the first metal layer 131
  • the side facing away from the first adhesive film layer 141 forms the first surface 111
  • the side facing away from the second adhesive film layer 142 of the second metal layer 132 forms the second surface 121 .
  • the recessed area 113 of the first layer 11 is formed by recessing the first adhesive film layer 141 toward the first metal layer 131 .
  • the first adhesive film layer 141 and the second adhesive film layer 142 provide a certain degree of damping, and at the same time can reduce weight, the first metal layer 131 and the second metal layer 132 provide strength;
  • the ribs 112 effectively enhance the strength of the vibrating plate 100 and are easy to form, so that the vibrating plate 100 has good heat resistance and constant heat and humidity resistance, and excellent water resistance.
  • the damping is better, making the FR high frequency more gentle, as shown in Figure 6.
  • the protruding ribs 112 are provided in the middle position of the vibration plate 100 .
  • the dimensions of the first layer 11 and the second layer 12 of the main body 1 in the vibration plate 100 may be the same.
  • the sizes of the first layer 11 and the second layer 12 may also be different, which are not limited herein.
  • the material of the first metal layer 131 and/or the second metal layer 132 is any one of aluminum foil, copper foil, titanium foil, magnesium alloy foil and MMC (metal matrix composite, metal matrix composite material).
  • the aluminum foil is H state aluminum foil.
  • the material of the first metal layer 131 may be any one of aluminum foil, copper foil, titanium foil, magnesium alloy foil, and MMC.
  • the material of the second metal layer 132 can be any one of aluminum foil, copper foil, titanium foil, magnesium alloy foil and MMC. It can be understood that the materials of the first metal layer 131 and the second metal layer 132 may be the same material or different materials, which are not limited herein.
  • the aluminum foil is H state aluminum foil, such as 8011H state, 5052H state, etc., which is not limited herein. Understandably, aluminum foil has better ductility and compactness.
  • the modulus density ratio of the first metal layer 131 and/or the second metal layer 132 is >15 GPa ⁇ cm 3 /g.
  • the main body 1 of the vibration plate 100 is composed of multiple metal layers (eg, the first metal layer 131 and the second metal layer 132 ) and adhesive film layers (eg, the first adhesive film layer 141 and the second adhesive film layer 142 ) , so that the multi-layer metal layer and the adhesive film layer are combined into a closely-fitting multi-layer structure through the composite process, ensuring that the modulus density ratio of the vibration plate 100 is >15GPa ⁇ cm 3 /g, thereby effectively ensuring the sensitivity of the vibration plate 100, And improve the frequency response characteristics of high frequency.
  • the modulus density of the first metal layer 131 and/or the second metal layer 132 may be 20GPa ⁇ cm 3 /g, 30GPa ⁇ cm 3 /g, or the like.
  • the material of the first adhesive film layer 141 and/or the second adhesive film layer 142 is at least one of epoxy adhesive film, phenolic adhesive film, acrylic adhesive film, silicone adhesive film and polyester adhesive film. kind.
  • the material of the first adhesive film layer 141 may be any one of epoxy adhesive film, phenolic adhesive film, acrylate adhesive film, silicone adhesive film and polyester adhesive film.
  • the material of the second adhesive film layer 142 is any one of epoxy adhesive film, phenolic adhesive film, acrylate adhesive film, silicone adhesive film and polyester adhesive film, which is not limited herein. It can be understood that the materials of the first adhesive film layer 141 and the second adhesive film layer 142 may be the same material or different materials, which are not limited herein.
  • the tensile modulus of the first adhesive film layer 141 and/or the second adhesive film layer 142 is greater than 600 Mpa.
  • the tensile modulus of the first adhesive film layer 141 is greater than 600 Mpa
  • the tensile modulus of the second adhesive film layer 142 is greater than 600 Mpa. It can be understood that the rigidity and high frequency performance of the vibration plate 100 can be ensured by limiting the modulus of the first adhesive film layer 141/the second adhesive film layer 142 to be greater than or equal to 600 Mpa. The higher the modulus of the first adhesive film layer 141/the second adhesive film layer 142 is, the better the rigidity of the entire composite vibration plate 100 is, and the higher the high frequency performance is. Further, the tensile modulus of the first adhesive film layer 141 and/or the second adhesive film layer 142 may be 800 Mpa, 1000 Mpa, or the like.
  • the adhesive force of the first adhesive film layer 141 and/or the second adhesive film layer 142 is greater than 300 gf/20 mm. It can be understood that the quality of the adhesive force determines the bending strength of the composite structure. 132 The better the coordination and consistency of the upper and lower metal layers during the vibration process, the purer the sound quality, and the initial state can still be maintained after long-term vibration, with excellent performance stability. Meanwhile, when the adhesive force of the adhesive film layer is low, the state of forming the ribs 112 on the vibration plate 100 is likely to cause delamination, or delamination occurs during high frequency vibration.
  • the adhesive force of the first adhesive film layer 141 and/or the second adhesive film layer 142 may be 500 gf/20 mm.
  • the thickness of the first layer 11 and/or the second layer 12 ranges from 0.004 mm to 0.21 mm.
  • the thickness of the first layer 11 is 0.004mm, 0.006mm, 0.008mm, 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, 0.15mm, 0.2mm, 0.21mm, etc., are not limited here.
  • the thickness of the second layer 12 ranges from 0.004mm to 0.21mm, optionally, the thickness of the second layer 12 is 0.004mm, 0.006mm, 0.008mm, 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06 mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, 0.15mm, 0.2mm, 0.21mm, etc., which are not limited here.
  • the thickness of the first layer 11 is the sum of the thicknesses of the first metal layer 131 and the first adhesive film layer 141
  • the thickness of the second layer 12 is the sum of the thicknesses of the second metal layer 132 and the second adhesive film layer 142 and. It can be understood that the thickness of the first layer 11/the second layer 12 is in the range of 0.004 mm to 0.21 mm, thereby making the structure of the vibration plate 100 lighter and thinner, which is beneficial to be widely used in the current thin electronic equipment, and can Ensure the acoustic performance of the speakers.
  • the thickness of the first layer 11 is greater than the thickness of the second layer 12 .
  • the thickness of the first layer 11 should preferably be >12 ⁇ m. If the ratio of the height of the ribs 112 to the thickness of the first layer 11 is too large, the aluminum foil (the first metal layer 131 ) of the first layer 11 will be stretched excessively, and cracks are likely to appear in the transition areas of the ribs 112 .
  • the aramid fiber has excellent high damping properties.
  • the structural rigidity of the vibrating plate 100 is effectively strengthened, the high-frequency cut-off frequency of the SPK is increased, and the FR curve is relatively flat, as shown in FIG. 6 .
  • the aramid fibers may be para-aramid fibers.
  • the fiber material is one of aramid fiber, carbon fiber or glass fiber
  • the prepreg resin is epoxy resin, phenolic resin, bismaleimide resin, vinyl resin, PA (polyamide), PP Any of (polypropylene), PC (polycarbonate), PI (polyimide) and PEEK (polyetheretherketone). It can be understood that the materials of the first layer 11 and the second layer 12 may be the same or different, which are not limited herein.
  • the first layer 11/the second layer 12 is made of fiber material and pre-impregnated resin.
  • the fiber material can be used to make a unidirectional cloth or a woven cloth, and then soaked into the pre-impregnated resin. It can be understood that when a unidirectional fiber prepreg is used, the fibers of the first layer 11 and the second layer 12 have the same direction or are arranged in a cross.
  • the first layer 11 and the second layer 12 are symmetrical, and the layering sequence can be [0°/90°/foam/90°/0°], or [90°/0°/foam/0° /90°], it can also be [ ⁇ 45°/foam/ ⁇ 45°], which is not limited here.
  • the first layer 11 and the second layer 12 are also required to be symmetrically laid.
  • the first layer 11 provided with the ribs 112 is preferably in the form of twill and satin weave in the woven cloth, which is not limited here.
  • the modulus of the fibrous material is >200 GPa.
  • the areal density of the first layer 11 and/or the second layer 12 ranges from 15 g/m 2 to 150 g/m 2 . It can be understood that when the first layer 11 and/or the second layer 12 is made of a unidirectional fabric with a fiber material, and then soaked in the prepreg resin, the areal density of the first layer 11 and/or the second layer 12 is in the range of 15g /m 2 to 150 g/m 2 .
  • the areal density of the first layer 11 ranges from 15 g/m 2 to 150 g/m 2 .
  • the areal density of the first layer 11 ranges from 15g/m 2 , 20g/m 2 , 25g/m 2 , 30g/m 2 , 35g/m 2 , 40g/m 2 , 45g/m 2 , 50g/ m 2 , 55g/m 2 , 60g/m 2 , 65g/m 2 , 70g/m 2 , 75g/m 2 , 80g/m 2 , 85g/m 2 , 90g/m 2 , 95g/m 2 , 100g/ m 2 , 120 g/m 2 , 130 g/m 2 , 140 g/m 2 , 150 g/m 2 , etc., which are not limited here.
  • the areal density of the second layer 12 ranges from 15 g/m 2 to 150 g/m 2 .
  • the areal density of the second layer 12 ranges from 15g/m 2 , 20g/m 2 , 25g/m 2 , 30g/m 2 , 35g/m 2 , 40g/m 2 , 45g/m 2 , 50g/ m 2 , 55g/m 2 , 60g/m 2 , 65g/m 2 , 70g/m 2 , 75g/m 2 , 80g/m 2 , 85g/m 2 , 90g/m 2 , 95g/m 2 , 100g/ m 2 , 120 g/m 2 , 130 g/m 2 , 140 g/m 2 , 150 g/m 2 , etc., which are not limited here.
  • the rigidity and high-frequency performance of the vibration plate 100 can be ensured by limiting the areal density of the first layer 11/the second layer 12 within the range of 15 g/m 2 to 150 g/m 2 .
  • the areal density of the first layer 11 and/or the second layer 12 ranges from 25g/m 2 to 240g/m 2 ; It is understood that when the first layer 11 and/or the second layer 12 is made of a woven fabric made of a fiber material, and then soaked in a prepreg resin, the areal density of the first layer 11 and/or the second layer 12 is in the range of 25g/m2 2 to 240g/m 2 .
  • the areal density of the first layer 11 ranges from 25 g/m 2 to 240 g/m 2 .
  • the areal density of the first layer 11 ranges from 25g/m 2 , 30g/m 2 , 35g/m 2 , 40g/m 2 , 45g/m 2 , 50g/m 2 , 55g/m 2 , 60g/ m 2 , 65g/m 2 , 70g/m 2 , 75g/m 2 , 80g/m 2 , 85g/m 2 , 90g/m 2 , 95g/m 2 , 100g/m 2 , 120g/m 2 , 130g/ m 2 , 140g/m 2 , 150g/m 2 , 160g/m 2 , 170g/m 2 , 180g/m 2 , 190g/m 2 , 200g/m 2 , 210g/m 2 , 220g/m 2 , 230g/ m 2 , 240
  • the areal density of the second layer 12 ranges from 25 g/m 2 to 240 g/m 2 .
  • the areal density of the second layer 12 ranges from 25g/m 2 , 30g/m 2 , 35g/m 2 , 40g/m 2 , 45g/m 2 , 50g/m 2 , 55g/m 2 , 60g/ m 2 , 65g/m 2 , 70g/m 2 , 75g/m 2 , 80g/m 2 , 85g/m 2 , 90g/m 2 , 95g/m 2 , 100g/m 2 , 120g/m 2 , 130g/ m 2 , 140g/m 2 , 150g/m 2 , 160g/m 2 , 170g/m 2 , 180g/m 2 , 190g/m 2 , 200g/m 2 , 210g/m 2 , 220g/m 2 , 230g/ m 2 , 240 g/m 2
  • the rigidity and high-frequency performance of the vibration plate 100 are ensured by limiting the areal density range of the first layer 11/the second layer 12 within the range of 25 g/m 2 to 240 g/m 2 .
  • the tensile modulus of the prepreg resin is >500Mpa
  • the flexural strength of the prepreg resin is >60MPa. It can be understood that by limiting the tensile modulus of the prepreg resin to >500 Mpa, the rigidity and high frequency performance of the vibration plate 100 are guaranteed. By limiting the flexural strength of the prepreg resin to >60 MPa, the rigidity and high-frequency performance of the vibration plate 100 are further ensured.
  • the tensile modulus of the prepreg resin may be 3 Gpa.
  • the flexural strength of the prepreg resin may be 100 Mpa.
  • the content of the prepreg resin in the first layer 11 and/or the second layer 12 is 30%-60%. It can be understood that when the fiber material is a unidirectional fabric, the content of the prepreg resin in the first layer 11/the second layer 12 can be selected to be 40%-60%, which can ensure the density of the first layer 11/the second layer 12 sex. When the fiber material is a woven cloth, the content of the pre-impregnated resin in the first layer 11/second layer 12 can be selected to be 30%-48%, which is not limited herein, due to its better compactness.
  • the material of the filler layer 2 is one of liquid foam or styrofoam film.
  • the filler layer 2 may be a foam filler, and the foam filler may be in the form of liquid foam injection, or may be applied in the form of a styrofoam film.
  • the foam filler can also be selected from foamed resin, which can be self-foamed in the mold cavity, which is not limited here.
  • the material of the filler layer 2 is foamed PET (polyethylene terephthalate), PMI (polymethacrylimide), PA (polyamide), PVC (polyvinyl chloride) , PE (polyethylene), PPS (polyphenylene sulfide), PS (polystyrene), PU (polyurethane), epoxy foam or phenolic foam, which is not limited here.
  • the main body 1 of the vibration plate 100 is provided with a rib 112 .
  • the ribs 112 include a plurality of ribs, which can effectively strengthen the structural strength of the vibration plate 100 and reduce the overall weight of the vibration plate 100 .
  • the plurality of ribs 112 are arranged in parallel, and are arranged at intervals along the length direction or width direction of the main body 1 .
  • the plurality of protruding ribs 112 are arranged in an intersecting manner and form an included angle, and the included angle ranges from 0° to 90°.
  • the number, shape or arrangement of the ribs 112 is not limited.
  • the height and size of the ribs 112 are determined according to the product design, so that the distance between the convex surface of the ribs 112 and the bottom of the washer is usually set to the maximum amplitude + 0.12 mm (when the amplitude is less than or equal to 0.6) or 0.15mm (when the amplitude is greater than 0.6), which is not limited here.
  • the present invention also proposes a method for processing the above-mentioned vibration plate 100, and the processing method includes the following steps:
  • a main body 1 is provided, the main body 1 includes a first layer 11 and a second layer 12;
  • first layer 11 Lay the first layer 11 on the lower mold 710, and use the first upper mold 720 to pre-press to form, so that one side of the first layer 11 forms a concave area 113 that is recessed toward the other side;
  • the second upper mold 730 is used for mold closing, and heating is performed to foam the packing layer 2 in the sealed cavity 1a, and the vibration plate 100 is obtained by demoulding.
  • the first layer 11 and the second layer 12 of the main body 1 are of separate structures, that is, the first layer 11 and the second layer 12 are respectively a separate plate-like structure or sheet-like structure
  • the structure is not limited here. It can be understood that the materials of the first layer 11 and the second layer 12 may be composed of a metal layer and an adhesive film layer.
  • the first layer 11 is composed of a stacked first metal layer 131 and a first adhesive film layer 141.
  • the second layer 12 is composed of a second metal layer 132 and a second adhesive film layer 142 that are stacked.
  • the dimensions of the first layer 11 and the second layer 12 may be the same. Of course, in other embodiments, the sizes of the first layer 11 and the second layer 12 may also be different, which are not limited herein.
  • the material of the first metal layer 131/second metal layer 132 is one of aluminum foil, copper foil, titanium foil or magnesium alloy foil, and the aluminum foil is H-state aluminum foil, which is not limited herein.
  • the material of the first adhesive film layer 141/the second adhesive film layer 142 is at least one of epoxy adhesive film, phenolic adhesive film, acrylate adhesive film, and silicone adhesive film, which is not limited herein.
  • the first layer 11/the second layer 12 is composited by fiber material and pre-impregnated resin
  • the fiber material is one of aramid fiber, carbon fiber or glass fiber
  • the pre-impregnated resin is epoxy resin Resins, phenolic resins, bismaleimide resins, vinyl resins, PA (polyamide), PP (polypropylene), PC (polycarbonate), PI (polyimide) and PEEK (polyetheretherketone) ), which is not limited here.
  • the first layer 11 is laid on the lower mold 710 , and pre-compressed with the first upper mold 720 , so that one side of the first layer 11 forms a concave area 113 recessed toward the other side.
  • the lower mold 710 is formed with a groove structure, and the groove structure is opposite to the structure and size of the recessed area 113 . That is, when the plate-shaped first layer 11 is laid on the lower mold 710, the groove structure is covered.
  • the first upper mold 720 is provided with a protrusion structure corresponding to the groove structure of the lower mold 710 , and the shape structure of the protrusion structure matches the shape structure of the groove structure, so that the first upper mold 720 is pressed down to the first layer 11 .
  • the part of the first layer 11 corresponding to the groove structure can be pre-compressed into the groove structure, so that one side of the first layer 11 forms a concave area that is concave toward the other side.
  • the concave area 113 is shown as a raised rib 112 on the other side.
  • the filler layer 2 is filled into the recessed area 113 .
  • the second layer 12 is laid on the first layer 11, and the opening of the concave area 113 is covered, so that the concave area 113 and the second layer 12 are enclosed to form a sealed cavity 1a, and then the second upper mold 730 is used to close the mold, so as to seal the cavity 1a.
  • the second layer 12 is crimped on the first layer 11 .
  • the lower mold 710 is heated and heated to foam the filler layer 2 in the sealed cavity 1a. After the heating is completed, the vibration plate 100 is obtained by demoulding.
  • the step of filling the filler layer 2 in the recessed area 113 includes: filling the filler layer 2 in the recessed area 113 , so that the volume ratio of the filler layer 2 to the recessed area 113 is 3/4. ⁇ 1/25.
  • the volume ratio of the filled packing layer 2 to the volume of the recessed area 113 is controlled in the range of 1/25 to 3/4, so that the cavity can be sealed during heating.
  • the packing layer 2 in the 1a is foamed to fill the sealed cavity 1a, thereby effectively reducing the weight of the vibration plate 100.
  • the volume ratio of the filler layer 2 to the concave region 113 is in the range of 1/25-1/2.
  • the density of the material in the first layer 11/the second layer 12 is between 1 g/cm 3 and 1.5 g/cm 3 , and the density of the material in the first layer 11/the second layer 12 after heating and foaming
  • the density is preferably between 0.04 g/cm 3 and 0.75 g/cm 3 , which is not limited here. It can be understood that the first layer 11 and the second layer 12 are formed by thermoforming.
  • the present invention further provides a speaker structure 600 , which includes a basin frame 300 , a magnetic circuit system 400 and a vibration system 500 accommodated in the basin frame 300 , and the vibration system 500 includes the above-mentioned vibration plate 100 .
  • the specific structure of the vibrating plate 100 refers to the foregoing embodiments. Since the speaker structure 600 adopts all the technical solutions of the foregoing embodiments, it has at least all the beneficial effects brought by the technical solutions of the foregoing embodiments, which will not be repeated here. One more elaboration.
  • the basin frame 300 is used to install, fix and protect the magnetic circuit system 400 , the vibration system 500 and other components of the speaker structure 600 .
  • mounting shell, mounting bracket and other structures are not limited here. It can be understood that when the basin frame 300 is a metal part, the magnetic circuit system 400 and the basin frame 300 are fixed by bonding. In another embodiment, when the basin frame 300 is plastic injection molding, the side magnetic conductive plate of the magnetic circuit system 400 is firstly injected into the basin frame 300 as an insert, and then other parts are then glued and fixed.
  • the vibration system 500 is disposed opposite the magnetic circuit system 400 and connected to the basin frame 300, thereby forming a speaker Body portion of structure 600.
  • the vibration system 500 further includes a vibration membrane 510 and a voice coil 520 , wherein the vibration membrane 510 is arranged opposite to the magnetic circuit system 400 , the vibration plate 100 is arranged on the vibration membrane 510 , and the magnetic circuit system 400 A magnetic gap 401 and a concave portion 423 are provided, and the concave portion 423 is arranged corresponding to the rib 112 of the vibration plate 100; 401.
  • the voice coil 520 when the voice coil 520 is connected to the external circuit, the voice coil 520 is used to transfer the electrical energy to the magnetic gap 401 of the magnetic circuit system 400 , and under the action of the magnetic field lines generated by the magnetic gap 401 , the voice coil 520 , vibrate and vibrate.
  • the membrane 510 and the vibrating plate 100 move up and down, that is, the magnetic field generated by the magnetic circuit system 400 is used to convert electrical energy into mechanical energy, so that the voice coil 520 vibrates, and drives the vibrating membrane 510 and the vibrating plate 100 of the vibration system 500 to vibrate and emit sound. , which further converts mechanical energy into sound energy.
  • the voice coil 520 disposed in the magnetic gap 401 receives the alternating current signal that changes from the outside, it is driven by the magnetic field force of the magnetic circuit system 400 to perform a reciprocating motion of cutting the magnetic lines of force, which drives the diaphragm 510 of the vibration system 500 to vibrate and emit sound. .
  • the concave portion 423 is disposed corresponding to the convex rib 112 of the vibration plate 100, so that the convex rib 112 and the magnetic circuit system 400 provide the avoidance space for the convex rib 112 (also That is, the concave portion 423) is matched, which not only saves the vibration space, but also can improve the high frequency of FR.
  • the cross-sectional shape and size of the protruding ribs 112 are adapted to the cross-sectional shape and size of the recessed portion 423 .
  • the top structure 31 is provided with ribs 112 and an avoidance structure is provided on the magnetic circuit system 400 so that the ribs 112 are connected to the bottom of the magnetic circuit system 400 .
  • the displacement is typically set to maximum amplitude + 0.12 mm (when amplitude ⁇ 0.6), or 0.15 mm (when amplitude > 0.6) to ensure the acoustic performance of the speaker structure 600 .
  • the loudspeaker structure 600 using the vibrating plate 100 can improve the sensitivity of the middle frequency and high frequency after 8K, expand the high frequency, make the FR curve smoother, and play more musical instruments.
  • the loudspeaker structure 600 using the vibrating plate 100 can reduce harmonic components when playing high-frequency signals, effectively improve THD (Total Harmonic Distortion), and make the subjective sense of hearing clearer.
  • the height of the rib 112 is defined as h, and the diameter of the rib 112 is defined as d. It can be understood that the height h of the rib 112 is the distance between the rib 112 and the first surface 111 , that is, the maximum distance between the vertex of the rib 112 and the first surface 111 .
  • the diameter d of the rib 112 is the opening distance in the width direction of the recessed area 113 on the side of the first layer 11 facing the second layer 12 .
  • the first layer 11 and/or the second layer 12 of the vibration plate 100 is made of aramid fiber and prepreg resin
  • the plurality of ribs 112 are arranged in parallel; /d ⁇ 0.1, the plurality of protruding ribs 112 are arranged in an intersecting manner.
  • the ribs 112 can be arranged on the edge of the main body 1 , so that a plurality of ribs 112 form a frame structure on the edge of the main body 1 , or a plurality of ribs 112 are arranged on the edge of the main body 1 .
  • Intermediate intersection setup node is possible.
  • the plurality of protruding ribs 112 are arranged in a single arrangement or in a crossed form parallel to the short axis direction, which is not limited herein.
  • the intersecting angle of the protruding ribs 112 ranges from 0° to 90°.
  • the nodes are set to form mesh ribs 112 to enhance the rigidity of the main body 1. At this time, it is necessary to increase the size of the washer avoidance, and the depth can be small or unlimited.
  • the diaphragm 510 is one of engineering plastics (such as peek, par, etc.), elastomer materials (such as tpu, tpee, silicone rubber, etc.), and adhesive films (such as acrylate-based glue, silicone-based glue, etc.). A composite of one or more materials.
  • the thickness of the diaphragm 510 is in the range of 0.01 mm ⁇ 0.5 mm.
  • the diaphragm 510 includes an inner ring portion 511 , a folding ring portion 512 disposed around the inner ring portion 511 , and a fixing portion 513 disposed on the outer periphery of the folding ring portion 512 .
  • the fixing portion 513 is connected to the basin.
  • the frame 300 is connected, the periphery of the vibration plate 100 is connected to the inner ring portion 511 , the voice coil 520 is connected to the side of the vibration plate 100 facing away from the inner ring portion 511 , and is arranged around the rib 112 .
  • the diaphragm 510 includes an inner ring portion 511 , a folding ring portion 512 disposed around the inner ring portion 511 , and a fixing portion 513 disposed on the outer periphery of the folding ring portion 512 .
  • the inner ring portion 511 of the diaphragm 510 , the folding ring The part 512 and the fixing part 513 can be optionally formed integrally.
  • the diaphragm 510 is connected to the basin frame 300 through the fixing portion 513 , and the diaphragm 510 is connected to the vibration plate 100 through the inner ring portion 511 .
  • the inner ring portion 511 of the diaphragm 510 and the vibration plate 100 are bonded by glue or adhesive tape.
  • the inner ring portion 511 of the diaphragm 510 is surrounded by an opening, and the vibration plate 100 is arranged corresponding to the opening formed by the inner ring portion 511 .
  • the peripheral edge of the plate 100 is connected to the upper side or the lower side of the inner ring portion 511 , so that the central portion of the diaphragm 510 is reinforced with the diaphragm 100 .
  • the inner ring portion 511 is a hollow structure.
  • the inner ring portion 511 may be a flat plate structure connected as a whole, so that the inner ring portion 511 has an upper side and a lower side arranged oppositely. At this time, the vibration plate 100 and the inner ring portion 511 have The upper side or the lower side is connected to reinforce the central portion of the diaphragm 510 with the diaphragm 100 .
  • the folded ring portion 512 is arranged in a convex or concave shape, and the fixing portion 513 is formed by extending outward from the outer edge of the folded ring portion 512 .
  • the fixing portion 513 may be connected to the basin frame 300 by means of bonding or welding, which is not limited herein.
  • the fixing portion 513 may also be formed by extending downward from the outer edge of the folded ring portion 512, that is, the fixing portion 513 and the outer wall of the basin frame 300 are bonded or the like. way to connect.
  • the magnetic circuit system 400 includes a magnetic conductive yoke 410 , a central magnetic circuit portion 420 and a side magnetic circuit portion 430 , wherein the magnetic conductive yoke 410 is arranged in the basin frame 300 ; the central magnetic circuit The side magnetic circuit portion 420 is provided on the magnetic conductive yoke 410, and the side of the central magnetic circuit portion 420 facing away from the magnetic conductive yoke 410 is provided with a concave portion 423; A magnetic gap 401 is formed between the magnetic circuit portion 430 and the central magnetic circuit portion 420 .
  • the magnetic conductive yoke 410 is fixed to the basin frame 300 , the central magnetic circuit portion 420 and the side magnetic circuit portion 430 are disposed on the side of the magnetic conductive yoke 410 facing the vibration system 500 , and the side magnetic circuit portion 430 surrounds the central magnetic circuit portion 430 .
  • the magnetic circuit portion 420 is arranged, and a magnetic gap 401 is formed between the central magnetic circuit portion 420, so that the voice coil 520 of the vibration system 500 can be suspended in the magnetic gap 401, that is, between the central magnetic circuit portion 420 and the side magnetic circuit portion 430. between.
  • the side magnetic circuit portion 430 that is, the side magnetic circuit portion 430 without interruption design has a larger volume, so that the magnetic field strength is higher, thereby improving the acoustic performance of the speaker structure 600 .
  • the central magnetic circuit portion 420 includes a central magnet 421 and a central washer 422 , the central magnet 421 is provided on the magnetic yoke 410 , and the central washer 422 is provided on the central magnet 421 away from the magnetic yoke On one side of 410, the central washer 422 is provided with a recessed portion 423, and the recessed portion 423 is a groove structure or a through-groove structure.
  • the side magnetic circuit portion 430 includes a side magnet 431 and a side washer 432.
  • the side magnet 431 is arranged on the magnetic conducting yoke 410 and is arranged around the central magnetic circuit portion 420. side.
  • the concave portion 423 may be provided at the center of the center magnet 421 .
  • the central magnet 421 and the central washer 422 have the same structural outline, and the central magnet 421 and the central washer 422 can be selected as plate-like structures.
  • the side magnets 431 and the side washer 432 have the same structure and outline, and the side magnets 431 and the side washer 432 can optionally be a ring structure or a plurality of strip structures, which are not limited herein.
  • the edge washer 432 can be fixed to the magnetic conductive yoke 410 and abut against the edge magnet 431 .
  • the edge washer 432 can also be disposed on the basin frame 300 , so that the edge washer 432 and the basin frame 300 are formed as an integral structure, thereby simplifying the processing technology of the speaker structure 600 .
  • the materials of the basin frame 300 and the edge washer 432 are both metal materials, which is beneficial to improve the heat conduction and heat dissipation effect.
  • the present invention also provides an electronic device, the electronic device includes a device housing and a speaker structure 600, and the speaker structure 600 is provided in the device housing.
  • the specific structure of the speaker structure 600 refers to the foregoing embodiments. Since the electronic device adopts all the technical solutions of all the foregoing embodiments, it has at least all the beneficial effects brought by the technical solutions of the foregoing embodiments, which will not be repeated here. Repeat.
  • a cavity is provided in the casing, and the speaker structure 600 is provided in the cavity.
  • the electronic device may be an electronic device, such as a mobile phone, a stereo, a computer, an earphone, a watch, a TV, or a tablet computer, etc., which is not limited herein.

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
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  • Laminated Bodies (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)

Abstract

本发明公开一种振动板及其加工方法、扬声器结构及电子设备，该振动板应用于扬声器结构，所述振动板包括主体和填料层，所述主体包括层叠设置的第一层和第二层，所述第一层上设有朝向远离所述第二层的方向凸出的凸筋，所述凸筋内设有密封腔；所述填料层填充至所述密封腔内。本发明旨在提升振动板的结构强度，且有效减轻振动板的重量，使得扬声器不仅加工方便，且结构强度高，发声质量好。

Description

振动板及其加工方法、扬声器结构及电子设备 技术领域
本发明涉及电声设备技术领域，特别涉及一种振动板、振动板的加工方法以及应用该振动板的扬声器结构和电子设备。
背景技术
受市场需求的影响，手机等电子设备正逐渐向薄型化的方向发展，而且对声音质量的要求也越来越高，这也对声学器件提出了小型、薄型、高音质的要求。扬声器是音响设备和通信设备中一个重要的部件，它是把电信号转变为声信号的换能器件，其性能的优劣对音质影响很大。扬声器的振动板主要影响扬声器的高频性能，其声学性能直接影响声学器件的性能。
相关技术中，扬声器的振动板采用两个平板状的表层加中间设置发泡层的结构，但是受中间发泡层的发泡体加工的限制，振动板的厚度很难做薄，而且发泡体存在泡壁较薄的问题，从而使得发泡层的成型结构不稳定，影响振动板的结构强度。
发明内容
本发明的主要目的是提供一种振动板及其加工方法、扬声器结构及电子设备，旨在提升振动板的结构强度，且有效减轻振动板的重量，使得扬声器不仅加工方便，且结构强度高，发声质量好。
为实现上述目的，本发明提出的振动板，应用于扬声器结构，所述振动板包括：
主体，所述主体包括层叠设置的第一层和第二层，所述第一层上设有朝向远离所述第二层的方向凸出的凸筋，所述凸筋内设有密封腔；和
填料层，所述填料层填充至所述密封腔内。
在一实施例中，所述第一层面向所述第二层的一侧朝向背离所述第二层的一侧凹陷形成凹陷区，并与所述第二层围合形成所述密封腔。
在一实施例中，所述第一层包括层叠设置的第一金属层和第一胶膜层，所述凹陷区由所述第一胶膜层朝向所述第一金属层凹陷形成；
所述第二层包括层叠设置的第二金属层和第二胶膜层，所述第二胶膜层与所述第一胶膜层粘接连接。
在一实施例中，所述第一金属层和/或所述第二金属层的材质为铝箔、铜箔、钛箔、镁合金箔和MMC中的任意一种；
且/或，所述第一金属层和/或所述第二金属层的模量密度比＞15GPa·cm 3/g；
且/或，所述第一胶膜层和/或所述第二胶膜层的材质为环氧胶膜、酚醛胶膜、丙烯酸酯胶膜、硅胶胶膜和聚酯胶膜中的任意一种；
且/或，所述第一胶膜层和/或所述第二胶膜层的拉伸模量＞600Mpa；
且/或，所述第一胶膜层和/或所述第二胶膜层的粘接力＞300gf/20mm；
且/或，所述第一层和/或所述第二层的厚度范围为0.004mm～0.21mm。
在一实施例中，所述第一层和/或所述第二层由纤维材料和预浸树脂复合而成，所述纤维材料为芳纶纤维、碳纤维或玻璃纤维中的一种，所述预浸树脂为环氧树脂、酚醛树脂、双马来酰亚胺树脂、乙烯基树脂、PA、PP、PC、PI和PEEK中的任意一种。
在一实施例中，所述第一层和/或所述第二层为单向布时，所述第一层和/或所述第二层的面密度范围为15g/m 2～150g/m 2；或，所述第一层和/或所述第二层为编织布时，所述第一层和/或所述第二层的面密度范围为25g/m 2～240g/m 2；
且/或，所述预浸树脂的拉伸模量＞500Mpa，所述预浸树脂的弯曲强度＞60MPa；
且/或，所述第一层和/或所述第二层中所述预浸树脂的含量为30％-60％。
在一实施例中，所述填料层的材质为液体泡沫或发泡胶膜中的一种；
或，所述填料层的材质为发泡PET、PMI、PA、PVC、PE、PPS、PS、PU、环氧泡沫或酚醛泡沫中的一种。
在一实施例中，所述凸筋包括多个；
多个所述凸筋呈平行设置，并沿所述主体的长度方向或宽度方向间隔排布；或，多个所述凸筋呈交叉设置，并形成夹角，所述夹角的范围为0°～90°。
本发明还提出一种上述所述的振动板的加工方法，所述加工方法包括以下步骤：
提供主体，所述主体包括第一层和第二层；
将所述第一层铺设于下模，并用第一上模预压成型，使所述第一层的一侧形成向另一侧凹陷的凹陷区；
将填料层填充于所述凹陷区内；
将所述第二层铺设于所述第一层，并盖合所述凹陷区的开口，使所述凹陷区和所述第二层围合形成密封腔；
用第二上模合模，并进行升温加热，以使所述密封腔内的填料层发泡成型，脱模得到振动板。
在一实施例中，所述将填料层填充于所述凹陷区内的步骤包括：
将所述填料层填充于所述凹陷区内，以使所述填料层的体积与所述凹陷区的体积比范围为1/25～3/4。
本发明还提出一种扬声器结构，所述扬声器结构包括盆架以及收容于所述盆架内的磁路系统和振动系统，所述振动系统包括上述所述的振动板。
在一实施例中，所述振动系统还包括：
振膜，所述振膜与所述磁路系统相对设置，所述振动板设于所述振膜，所述磁路系统设有磁间隙和凹陷部，所述凹陷部与所述振动板的凸筋对应设置；和
音圈，所述音圈的一端与所述振膜或所述振动板连接，所述音圈的另一端悬设于所述磁间隙内。
在一实施例中，所述振动板的周缘与所述振膜连接，所述音圈与所述振动板背向所述振膜的一侧连接，并围绕所述凸筋设置。
在一实施例中，所述凸筋的横截面形状和大小与所述凹陷部的横截面形状和大小相适配；
且/或，所述振膜为工程塑料、弹性体材料、胶膜中的一种或多种材料复合组成；
且/或，所述振膜的厚度在0.01mm～0.5mm范围内。
在一实施例中，所述磁路系统包括：
导磁轭，所述导磁轭设于所述盆架内；
中心磁路部，所述中心磁路部设于所述导磁轭，所述中心磁路部背向所述导磁轭的一侧设有所述凹陷部；及
边磁路部，所述边磁路部设于所述导磁轭，并环绕所述中心磁路部设置，所述边磁路部与所述中心磁路部之间形成所述磁间隙。
在一实施例中，所述中心磁路部包括中心磁铁和中心华司，所述中心磁铁设于所述导磁轭，所述中心华司设于所述中心磁铁背向所述导磁轭的一侧，所述中心华司设有所述凹陷部，所述凹陷部为凹槽结构或通槽结构。
本发明还提出一种电子设备，包括设备壳体和上述所述的扬声器结构，所述扬声器结构设于所述设备壳体内。
本发明技术方案的振动板通过将主体设置为层叠设置的第一层和第二层，使得第一层上设有朝向远离第二层的方向凸出的凸筋，从而利用凸筋增强振动板的主体结构强度；同时，通过在凸筋内设置密封腔，并将填料层设于密封腔内，从而在确保结构强度的情况下减轻振动板的重量，如此可提高灵敏度，并改善高频的频响特性。本发明的振动板不仅提升了结构强度，且有效减轻了重量，还使得扬声器不仅加工方便，且结构强度高，发声质量好。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本发明一实施例中振动板的结构示意图；
图2为本发明另一实施例中振动板的结构示意图；
图3为本发明又一实施例中振动板的结构示意图；
图4为本发明一实施例中振动板的剖面示意图；
图5为本发明一实施例中第一层或第二层的剖面示意图；
图6为本发明中振动板与现有铝合金振动板的FR曲线对比图；
图7为本发明一实施例中振动板的加工过程剖面示意图；
图8为本发明一实施例中扬声器结构的剖面示意图。
附图标号说明：
标号 名称 标号 名称
100 振动板 410 导磁轭
1 主体 420 中心磁路部
1a 密封腔 421 中心磁铁
11 第一层 422 中心华司
111 第一表面 423 凹陷部
112 凸筋 430 边磁路部
113 凹陷区 431 边磁铁
12 第二层 432 边华司
121 第二表面 500 振动系统
131 第一金属层 510 振膜
132 第二金属层 511 内环部
141 第一胶膜层 512 折环部
142 第二胶膜层 513 固定部
2 填料层 520 音圈
300 盆架 600 扬声器结构
310 容腔 710 下模
400 磁路系统 720 第一上模
401 磁间隙 730 第二上模
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明，本发明实施例中所有方向性指示(诸如上、下、左、右、前、 后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
同时，全文中出现的“和/或”或“且/或”的含义为，包括三个方案，以“A和/或B”为例，包括A方案，或B方案，或A和B同时满足的方案。
另外，在本发明中如涉及“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本发明要求的保护范围之内。
本发明提出一种振动板100，该振动板100应用于扬声器结构600中。可以理解的，该扬声器结构600应用于电子设备，电子设备可以是手机、音响、电脑、耳机、手表、电视或平板电脑等，在此不做限定。
请结合参照图1至图4所示，在本发明实施例中，该振动板100包括主体1和填料层2，其中，主体1包括层叠设置的第一层11和第二层12，第一层11上设有朝向远离第二层12的方向凸出的凸筋112，凸筋112内设有密封腔1a，填料层2填充至密封腔1a内。
可以理解的，主体1为振动板100的主体结构，主体1可选为板状或片状结构。主体1的材质可以是金属材质或纤维材质，在此不做限定。在本实施例中，主体1以板状结构进行说明，主体1可以是单层结构或多个层结构。
在本实施例中，主体1具有相背离的第一表面111和第二表面121，主体1还具有连接第一表面111和第二表面121的侧边。主体1包括层叠设置的第一层11和第二层12，如此使得第二层12背向第一层11的一侧为第二表面121，第一层11背向第二层12的一侧为第一表面111。
可以理解的，通过在第一层11上设有朝向远离第二层12的方向凸出的凸筋112，也即主体1的第一表面111凸出有凸筋112，从而使得主体1利用凸筋112增强振动板100的主体1的结构强度。在本实施例中，主体1的第二表面121呈平面或平板结构，主体1的第一表面111的凸筋112为凸包结构。
在本实施例中，通过在凸筋112内设有密封腔1a，并在密封腔1a内填充 填料层2，从而利用填料层2进一步加强凸筋112的结构强度，相比较于单纯凸包形式的振动板，此种结构可以进一步增强整体的结构强度。
本发明的振动板100通过将主体1设置为层叠设置的第一层11和第二层12，使得第一层11上设有朝向远离第二层12的方向凸出的凸筋112，从而利用凸筋112增强振动板100的主体1结构强度；同时，通过在凸筋112内设置密封腔1a，并将填料层2设于密封腔1a内，从而在确保结构强度的情况下减轻振动板100的重量，如此可提高灵敏度，并改善高频的频响特性。本发明的振动板100不仅提升了结构强度，且有效减轻了重量，还使得扬声器不仅加工方便，且结构强度高，发声质量好。
可以理解的，本发明的振动板100即实现了比现有振动板结构质轻的优势，同时在振动板100的第一表面111上成型凸筋112来满足振动板100的性能要求，进一步通过在凸筋112的密封腔1a内填充填料层2，从而进一步加强振动板100的整体结构。在本实施例中，振动板100的结构可以在不破坏填充层2内的泡孔结构的同时成型凸包，该种结构既可以减轻质量提升中频灵敏度，又可以提高振动板的刚性及稳定地拓展高频。
在一实施例中，如图4所示，第一层11面向第二层12的一侧朝向背离第二层12的一侧凹陷形成凹陷区113，并与第二层12围合形成密封腔1a。
在本实施例中，主体1采用多层结构形成，主体1的第一层11和第二层12呈层叠设置，也即第一层11背向第二层12的一侧为第一表面111，第二层12背向第一层11的一侧为第二表面121。
可以理解的，第一表面111的凸筋112由第一层11面向第二层12的一侧朝向背离第二层12的一侧凹陷，从而在第一表面111凸出并形成凸筋112结构，且在第一层11面向第二层12的一侧形成凹陷区113，如此在第一层11和第二层12层叠设置时，第二层12封盖凹陷区113的开口，从而使得第一层11的凹陷区113和第二层12围合形成密封腔1a。
当然，在其他实施例中，也可以是有第一层11背向第二层12的一侧凸设形成有凸筋112，也即直接在第一表面111凸出形成有凸筋112，此时第一层11面向第二层12的一侧呈平面，并与第二层12层叠设置，在此不做限定。
在本实施例中，主体1的第一层11和第二层12可以是相同材质，例如第一层11和第二层12可以都是金属材质或纤维材质等，在此不做限定。当 然，在其他实施例中，第一层11的材质和第二层12的材质也可设置为不同，在此不做限定。
在本实施例中，振动板100中主体1的第一层11和第二层12部分贴合填料层2(例如泡沫体)的形式，振动板100的边缘采用第一层11和第二层12复合，中间区域局部加筋(即凸筋112)，使得主体1的一面为平板结构，另一面为凸包形式。可以理解的，第一层11的凸筋112可预先成型，并在第一层11的凹陷区113内部通过填料层2填充增强，如此相比较于单纯凸包形式的振动板，本实施例的振动板100能进一步增强整体的刚性。
在一实施例中，如图4和图5所示，第一层11包括层叠设置的第一金属层131和第一胶膜层141，凹陷区113由第一胶膜层141朝向第一金属层131凹陷形成；第二层12包括层叠设置的第二金属层132和第二胶膜层142，第二胶膜层142与第一胶膜层141粘接连接。
在本实施例中，主体1的第一层11和第二层12材质相同，此时第一层11由层叠设置的第一金属层131和第一胶膜层141构成，第二层12由层叠设置的第二金属层132和第二胶膜层142构成。可以理解的，第一层11和第二层12连接时，第一层11的第一胶膜层141与第二层12的第二胶膜层142粘结连接，也即第一金属层131背向第一胶膜层141的一侧形成第一表面111，第二金属层132背向第二胶膜层142的一侧形成第二表面121。
可以理解的，第一层11的凹陷区113由第一胶膜层141朝向第一金属层131凹陷形成。在本实施例中，第一胶膜层141和第二胶膜层142提供一定的阻尼性，同时可以起到减重效果，第一金属层131和第二金属层132提供强度；同时结合凸筋112，有效增强了振动板100的强度，且容易成型，使得振动板100具有良好的耐热性及耐恒定湿热特性，耐水性极好。相对于现有铝箔结构，阻尼性较好，使FR高频更平缓，如图6所示。可选地，凸筋112设于振动板100的中间位置。
在本实施例中，振动板100中主体1的第一层11和第二层12的尺寸大小可以相同。当然，在其他实施例中，第一层11和第二层12的尺寸大小也可采用不同，在此不做限定。
在一实施例中，第一金属层131和/或第二金属层132的材质为铝箔、铜箔、钛箔、镁合金箔和MMC(metal matrix composite，金属基复合材料)中 的任意一种，铝箔为H态铝箔。
在本实施例中，第一金属层131的材质可选为铝箔、铜箔、钛箔、镁合金箔和MMC中的中的任意一种。第二金属层132的材质可选为铝箔、铜箔、钛箔、镁合金箔和MMC中的任意一种。可以理解的，第一金属层131与第二金属层132的材质可以是相同材质，也可以是不同材质，在此不做限定。
可选为，第一金属层131和/或第二金属层132的材质为铝箔时，铝箔为H态铝箔，例如8011H态、5052H态等，在此不做限定。可以理解的，铝箔具有较好的延展性和致密性。
在一实施例中，第一金属层131和/或第二金属层132的模量密度比＞15GPa·cm 3/g。可以理解的，振动板100的主体1采用多层金属层(例如第一金属层131和第二金属层132)和胶膜层(例如第一胶膜层141和第二胶膜层142)组成，使得多层金属层和胶膜层通过复合工艺复合成紧密贴合的多层结构后，确保振动板100的模量密度比＞15GPa·cm 3/g，从而有效确保振动板100的灵敏度，并改善了高频的频响特性。可选地，第一金属层131和/或第二金属层132的模量密度可以为20GPa·cm 3/g、30GPa·cm 3/g等。
在一实施例中，第一胶膜层141和/或第二胶膜层142的材质为环氧胶膜、酚醛胶膜、丙烯酸酯胶膜、硅胶胶膜和聚酯胶膜中的至少一种。
在本实施例中，第一胶膜层141的材质可选为环氧胶膜、酚醛胶膜、丙烯酸酯胶膜、硅胶胶膜和聚酯胶膜中的任意一种。第二胶膜层142的材质为环氧胶膜、酚醛胶膜、丙烯酸酯胶膜、硅胶胶膜和聚酯胶膜中的任意一种，在此不做限定。可以理解的，第一胶膜层141与第二胶膜层142的材质可以是相同材质，也可以是不同材质，在此不做限定。
可选地，第一胶膜层141和/或第二胶膜层142的拉伸模量＞600Mpa。在本实施例中，第一胶膜层141的拉伸模量＞600Mpa，第二胶膜层142的拉伸模量＞600Mpa。可以理解的，通过将第一胶膜层141/第二胶膜层142的模量要求限定为大于或等于600Mpa，从而保证振动板100的刚性和高频性能。第一胶膜层141/第二胶膜层142的模量越高，整个复合振动板100的刚性越好，高频性能相对较好。进一步地，第一胶膜层141和/或第二胶膜层142的拉伸模量可以为800Mpa、1000Mpa等。
在一实施例中，第一胶膜层141和/或第二胶膜层142的粘接力＞ 300gf/20mm。可以理解的，粘接力的好坏决定复合结构的弯曲强度，粘结力越高，第一胶膜层141和第二胶膜层142连接的第一金属层131和/或第二金属层132上下两层金属层在振动过程中的协调一致性越好，音质较纯，且长时间振动后仍可以保持初始状态，性能稳定性优。同时，胶膜层的粘接力较低时，在振动板100上成型凸筋112的状态很可能导致分层，或者在高频振动时导致分层。可选地，第一胶膜层141和/或第二胶膜层142的粘接力可以为500gf/20mm。
在一实施例中，第一层11和/或第二层12的厚度范围为0.004mm～0.21mm。
可选地，第一层11的厚度为0.004mm、0.006mm、0.008mm、0.01mm、0.02mm、0.03mm、0.04mm、0.05mm、0.06mm、0.07mm、0.08mm、0.09mm、0.1mm、0.15mm、0.2mm、0.21mm等，在此不做限定。第二层12的厚度范围为0.004mm～0.21mm，可选地，第二层12的厚度为0.004mm、0.006mm、0.008mm、0.01mm、0.02mm、0.03mm、0.04mm、0.05mm、0.06mm、0.07mm、0.08mm、0.09mm、0.1mm、0.15mm、0.2mm、0.21mm等，在此不做限定。
可以理解的，第一层11的厚度为第一金属层131和第一胶膜层141的厚度之和，第二层12的厚度为第二金属层132和第二胶膜层142的厚度之和。可以理解的，将第一层11/第二层12的厚度范围为0.004mm～0.21mm，从而使得振动板100的结构更加轻薄化，有利于广泛应用于目前的薄型化电子设备中，同时能确保扬声器的声学性能。
在本实施例中，由于第一层11成型有凸筋112，可选地，第一层11的厚度大于第二层12的厚度。可选地，凸筋112的高度与第一层11的厚度比＞0.05时，第一层11的厚度应优选＞12μm。如果凸筋112的高度与第一层11的厚度比过大，会导致第一层11的铝箔(第一金属层131)拉伸过度，在凸筋112过渡区域易出现裂痕。
可以理解的，芳纶纤维具有优异的高阻尼特性，通过将第一层11/第二层12采用纤维材料和预浸树脂复合而成，并在第一层11的局部形成凸筋112结构，从而有效加强振动板100的结构刚性，提升SPK的高频截止频率，并使FR曲线较为平缓，如图6所示。可选地，芳纶纤维可选为对位芳纶纤维。
可选地，纤维材料为芳纶纤维、碳纤维或玻璃纤维中的一种，预浸树脂 为环氧树脂、酚醛树脂、双马来酰亚胺树脂、乙烯基树脂、PA(聚酰胺)、PP(聚丙烯)、PC(聚碳酸酯)、PI(聚酰亚胺)和PEEK(聚醚醚酮)中的任意一种。可以理解的，第一层11和第二层12材质可以是相同的，也可以是不同的，在此不做限定。
在本实施例中，第一层11/第二层12采用纤维材料和预浸树脂复合而成，可采用纤维材料制成单向布或者编织布，然后浸泡入预浸树脂得到。可以理解的，当采用单向纤维预浸料时，第一层11和第二层12的纤维方向相同或者交叉排布。交叉排布时要求第一层11和第二层12对称，铺层顺序可以为【0°/90°/泡沫/90°/0°】，也可以【90°/0°/泡沫/0°/90°】铺放，同样可以为【±45°/泡沫/±45°】，在此不做限定。采用编织布时同样要求第一层11和第二层12两层对称铺放，设置凸筋112的第一层11优选编织布中的斜纹、缎纹编织形式，在此不做限定。可选地，纤维材料的模量＞200Gpa。
在一实施例中，第一层11和/或第二层12为单向布时，第一层11和/或第二层12的面密度范围为15g/m 2～150g/m 2。可以理解的，第一层11和/或第二层12采用纤维材料制成单向布，然后浸泡入预浸树脂得到时，第一层11和/或第二层12的面密度范围为15g/m 2～150g/m 2。
可以理解的，第一层11的面密度范围为15g/m 2～150g/m 2。可选地，第一层11的面密度范围为15g/m 2、20g/m 2、25g/m 2、30g/m 2、35g/m 2、40g/m 2、45g/m 2、50g/m 2、55g/m 2、60g/m 2、65g/m 2、70g/m 2、75g/m 2、80g/m 2、85g/m 2、90g/m 2、95g/m 2、100g/m 2、120g/m 2、130g/m 2、140g/m 2、150g/m 2等，在此不做限定。
第二层12的面密度范围为15g/m 2～150g/m 2。可选地，第二层12的面密度范围为15g/m 2、20g/m 2、25g/m 2、30g/m 2、35g/m 2、40g/m 2、45g/m 2、50g/m 2、55g/m 2、60g/m 2、65g/m 2、70g/m 2、75g/m 2、80g/m 2、85g/m 2、90g/m 2、95g/m 2、100g/m 2、120g/m 2、130g/m 2、140g/m 2、150g/m 2等，在此不做限定。
可以理解的，通过将第一层11/第二层12的的面密度范围限定在15g/m 2～150g/m 2的范围内，从而保证振动板100的刚性和高频性能。
在另一实施例中，第一层11和/或第二层12为编织布时，第一层11和/或第二层12的面密度范围为25g/m 2～240g/m 2；可以理解的，第一层11和/或 第二层12采用纤维材料制成编织布，然后浸泡入预浸树脂得到时，第一层11和/或第二层12的面密度范围为25g/m 2～240g/m 2。
可以理解的，第一层11的面密度范围为25g/m 2～240g/m 2。可选地，第一层11的面密度范围为25g/m 2、30g/m 2、35g/m 2、40g/m 2、45g/m 2、50g/m 2、55g/m 2、60g/m 2、65g/m 2、70g/m 2、75g/m 2、80g/m 2、85g/m 2、90g/m 2、95g/m 2、100g/m 2、120g/m 2、130g/m 2、140g/m 2、150g/m 2、160g/m 2、170g/m 2、180g/m 2、190g/m 2、200g/m 2、210g/m 2、220g/m 2、230g/m 2、240g/m 2等，在此不做限定。
第二层12的面密度范围为25g/m 2～240g/m 2。可选地，第二层12的面密度范围为25g/m 2、30g/m 2、35g/m 2、40g/m 2、45g/m 2、50g/m 2、55g/m 2、60g/m 2、65g/m 2、70g/m 2、75g/m 2、80g/m 2、85g/m 2、90g/m 2、95g/m 2、100g/m 2、120g/m 2、130g/m 2、140g/m 2、150g/m 2、160g/m 2、170g/m 2、180g/m 2、190g/m 2、200g/m 2、210g/m 2、220g/m 2、230g/m 2、240g/m 2等，在此不做限定。
可以理解的，通过将第一层11/第二层12的的面密度范围限定在25g/m 2～240g/m 2的范围内，从而保证振动板100的刚性和高频性能。
在一实施例中，预浸树脂的拉伸模量＞500Mpa，预浸树脂的弯曲强度＞60MPa。可以理解的，通过将预浸树脂的拉伸模量限定为＞500Mpa，从而保证振动板100的刚性和高频性能。通过将预浸树脂的弯曲强度限定为＞60MPa，进一步保证振动板100的刚性和高频性能。可选地，预浸树脂的拉伸模量可以为3Gpa。可选地，预浸树脂的弯曲强度可以为100Mpa。
在一实施例中，第一层11和/或第二层12中预浸树脂的含量为30％-60％。可以理解的，当纤维材料为单向布时，第一层11/第二层12中预浸树脂的含量可选为40％-60％，可以保证第一层11/第二层12的致密性。当纤维材料为编织布时，由于本身的致密性较好，第一层11/第二层12中预浸树脂的含量可选为30％-48％，在此不做限定。
在一实施例中，填料层2的材质为液体泡沫或发泡胶膜中的一种。
在本实施例中，填料层2可为泡沫填料，泡沫填料可以采用液体泡沫注入的形式，也可以采用发泡胶膜的形式进行铺贴。当然，在一些可选地实施例中，泡沫填料还可选用发泡树脂类，可在模具型腔内自发泡，在此不做限 定。
在一实施例中，填料层2的材质为发泡PET(聚对苯二甲酸乙二醇酯)、PMI(聚甲基丙烯酰亚胺)、PA(聚酰胺)、PVC(聚氯乙烯)、PE(聚乙烯)、PPS(聚苯硫醚)、PS(聚苯乙烯)、PU(聚氨酯)、环氧泡沫或酚醛泡沫中的一种，在此不做限定。
在一实施例中，如图1所示，振动板100的主体1设有一个凸筋112。在其他实施例中，如图2和图3所示，凸筋112包括多个，如此有可有效加强振动板100的结构强度，同时减轻振动板100的整体重量。
在一实施例中，如图2所示，多个凸筋112呈平行设置，并沿主体1的长度方向或宽度方向间隔排布。在另一实施例中，如图3所示，多个凸筋112呈交叉设置，并形成夹角，夹角的范围为0°～90°。
可以理解的，凸筋112的数量以及形状或设置方式不限制，凸筋112的高度和大小根据产品设计而定，使得凸筋112外形凸起面与华司底部距离通常设置为最大振幅+0.12mm(振幅≤0.6时)或0.15mm(振幅＞0.6时)，在此不做限定。
如图7所示，本发明还提出一种上述的振动板100的加工方法，该加工方法包括以下步骤：
提供主体1，主体1包括第一层11和第二层12；
将第一层11铺设于下模710，并用第一上模720预压成型，使第一层11的一侧形成向另一侧凹陷的凹陷区113；
将填料层2填充于凹陷区113内；
将第二层12铺设于第一层11，并盖合凹陷区113的开口，使凹陷区113和第二层12围合形成密封腔1a；
用第二上模730合模，并进行升温加热，以使密封腔1a内的填料层2发泡成型，脱模得到振动板100。
在本实施例中，主体1在加工前，主体1的第一层11和第二层12为分体结构，也即第一层11和第二层12分别为单独的板状结构或片状结构在此不做限定。可以理解的，第一层11和第二层12的材质可以是有金属层和胶膜层构成，例如第一层11由层叠设置的第一金属层131和第一胶膜层141构成，第二层12由层叠设置的第二金属层132和第二胶膜层142构成。
可以理解的，第一层11和第二层12的尺寸大小可以相同。当然，在其他实施例中，第一层11和第二层12的尺寸大小也可采用不同，在此不做限定。可选地，第一金属层131/第二金属层132的材质为铝箔、铜箔、钛箔或镁合金箔中的一种，铝箔为H态铝箔，在此不做限定。第一胶膜层141/第二胶膜层142的材质为环氧胶膜、酚醛胶膜、丙烯酸酯胶膜、硅胶胶膜中的至少一种，在此不做限定。
当然，在其他实施例中，第一层11/第二层12由纤维材料和预浸树脂复合而成，纤维材料为芳纶纤维、碳纤维或玻璃纤维中的一种，预浸树脂为环氧树脂、酚醛树脂、双马来酰亚胺树脂、乙烯基树脂、PA(聚酰胺)、PP(聚丙烯)、PC(聚碳酸酯)、PI(聚酰亚胺)和PEEK(聚醚醚酮)中的至少一种，在此不做限定。
在本实施例中，将第一层11铺设于下模710，并用第一上模720预压成型，使第一层11的一侧形成向另一侧凹陷的凹陷区113。可以理解的，下模710形成有凹槽结构，该凹槽结构与凹陷区113结构、尺寸大小相对。也即板状的第一层11铺设于下模710时，遮盖凹槽结构。第一上模720对应下模710的凹槽结构设置有凸起结构，该凸起结构的形状结构与凹槽结构的形状结构相匹配，如此使得第一上模720下压至第一层11时，第一上模720的凸起结构可将第一层11对应凹槽结构的部分预压成型在凹槽结构内，从而使得第一层11的一侧形成朝向另一侧凹陷的凹陷区113，该凹陷区113在另一侧表现为凸起的凸筋112。
可以理解的，预压成型后，将第一上模720脱模后，向凹陷区113内填充填料层2。然后将第二层12铺设于第一层11，并盖合凹陷区113的开口，使凹陷区113和第二层12围合形成密封腔1a，然后利用第二上模730合模，从而将第二层12压接于第一层11上。并对下模710进行升温加热，以使密封腔1a内的填料层2发泡成型，加温结束后，脱模得到振动板100。
在一实施例中，将填料层2填充于凹陷区113内的步骤包括：将填料层2填充于凹陷区113内，以使填料层2的体积与凹陷区113的体积比范围为3/4～1/25。
可以理解的，在将填料层2填充于凹陷区113内时，填充填料层2的体积与凹陷区113的体积比范围控制在1/25～3/4，如此可在加温时，密封腔1a 内的填料层2发泡成型以充满密封腔1a，从而有效减轻振动板100的重量。可选地，填料层2的体积与凹陷区113的体积比范围为1/25-1/2。
在本实施例中，第一层11/第二层12中材料的密度在1g/cm 3～1.5g/cm 3之间，加温发泡后第一层11/第二层12中材料的密度优选0.04g/cm 3～0.75g/cm 3之间，在此不做限定。可以理解的，第一层11和第二层12采用热压成型的方式成型。
如图8所示，本发明还提出一种扬声器结构600，扬声器结构600包括盆架300以及收容于盆架300内的磁路系统400和振动系统500，振动系统500包括上述的振动板100。该振动板100的具体结构参照前述实施例，由于本扬声器结构600采用了前述所有实施例的全部技术方案，因此至少具有前述实施例的技术方案所带来的所有有益效果，在此不再一一赘述。
在本实施例中，盆架300用于安装固定和保护磁路系统400、振动系统500以及扬声器结构600的其他部件，盆架300的结构可以具有容腔310的壳体、盒体、箱体、安装壳、安装支架等结构，在此不做限定。可以理解的，盆架300是金属件时，磁路系统400与盆架300采用粘接固定。在另外的实施例中，盆架300为塑料注塑成型时，磁路系统400的边导磁板先作为嵌件注塑在盆架300中，然后其他部分再粘接固定。
可以理解的，通过在盆架300内设置容腔310，并将磁路系统400设于容腔310内，使得振动系统500与磁路系统400相对设置，并与盆架300连接，从而形成扬声器结构600的主体部分。
在一实施例中，如图8所示，振动系统500还包括振膜510和音圈520，其中，振膜510与磁路系统400相对设置，振动板100设于振膜510，磁路系统400设有磁间隙401和凹陷部423，凹陷部423与振动板100的凸筋112对应设置；音圈520的一端与振膜510或振动板100连接，音圈520的另一端悬设于磁间隙401内。
在本实施例中，当音圈520与外部电路导通，利用音圈520将电能传递至磁路系统400的磁间隙401，并在磁间隙401产生的磁力线作用下，使得音圈520、振膜510及振动板100作上下运动，也即利用磁路系统400产生的磁场将电能转换为机械能，从而使得音圈520发生振动，并带动振动系统500的振膜510和振动板100实现振动发声，进一步将机械能转换为声能。也即 设置于磁间隙401内的音圈520接收到外部变化的交流电信号后，在磁路系统400的磁场力的驱动下做往复切割磁力线的运动，带动振动系统500的振膜510振动发声。
可以理解的，通过在磁路系统400上设置凹陷部423，使得凹陷部423对应振动板100的凸筋112设置，从而使得凸筋112与磁路系统400为凸筋112提供的避让空间(也即凹陷部423)吻合，既节省了振动空间，同时可以提升FR高频。
可选地，凸筋112的横截面形状和大小与凹陷部423的横截面形状和大小相适配。
可以理解的，振动板100若设置为平板结构则不能发挥其高频优势，顶结构31通过设置凸筋112，并在磁路系统400设置避让结构，使得凸筋112与磁路系统400的底部位移通常设置为最大振幅+0.12mm(振幅≤0.6时)，或0.15mm(振幅＞0.6时)，从而确保扬声器结构600的声学性能。
在本实施例中，使用该振动板100的扬声器结构600可以提升中频及高频8K之后的灵敏度，扩展高频，FR曲线更平滑，乐器播放更加丰富。使用该振动板100的扬声器结构600在播放高频信号时，可以减少谐波分量，有效改善THD(总谐波失真)，主观听感更加清晰。
在一实施例中，定义凸筋112的高度为h，定义凸筋112的直径为d。可以理解的凸筋112的高度h为凸筋112与第一表面111之间的距离，也即凸筋112的顶点与第一表面111之间的最大距离。凸筋112的直径d为第一层11面向第二层12的一侧的凹陷区113的宽度方向的开口距离。
可以理解的，振动板100的第一层11和/或第二层12采用芳纶纤维和预浸树脂复合而成时，当h/d＞0.1，多个凸筋112呈平行设置；当h/d＜0.1，多个凸筋112呈交叉设置。在本实施例中，在结构允许的情况下，凸筋112可设置在主体1的边缘设置，使得多个凸筋112在主体1的边缘形成边框结构，或者多个凸筋112在主体1的中间相交设置节点。可选地，多个凸筋112设置为平行于短轴方向单个排列或交叉形式，在此不做限定。凸筋112呈交叉设置时，凸筋112的交叉角度范围为0°～90°。
在本实施例中，当h/d＞0.1，扬声器结构100的华司避让尺寸宽度小于5mm时，尽量保持华司底部打通的形式(保证深度)，加大加强筋高度。当 h/d＜0.1，设置节点形成网状凸筋112，增强主体1的刚性，此时，需增大华司避让尺寸，深度可较小或者不限制。
可选地，振膜510为工程塑料(如peek、par等)、弹性体材料(如tpu、tpee、硅橡胶等)、胶膜(如丙烯酸酯类胶、有机硅类胶等)中的一种或多种材料复合组成。振膜510的厚度在0.01mm～0.5mm范围内。
在一实施例中，如图8所示，振膜510包括内环部511、环绕内环部511设置的折环部512以及设于折环部512外周的固定部513，固定部513与盆架300连接，振动板100的周缘与内环部511连接，音圈520与振动板100背向内环部511的一侧连接，并围绕凸筋112设置。
在本实施例中，振膜510包括内环部511、环绕内环部511设置的折环部512以及设于折环部512外周的固定部513，振膜510的内环部511、折环部512及固定部513可选为一体成型设置。振膜510通过固定部513与盆架300连接，振膜510通过内环部511与振动板100连接。可选地，振膜510的内环部511与振动板100之间通过胶水或胶带进行粘结。
可以理解的，振膜510的内环部511围合形成有开口，振动板100对应内环部511围合形成的开口设置，此时内环部511具有相对设置的上侧和下侧，振动板100的周缘与内环部511的上侧或下侧连接，从而利用振动板100加强振膜510的中央部。可选地，内环部511为镂空结构。
在另一实施例中，内环部511可以是连接为一体的平板结构，如此所述内环部511具有相对设置的上侧和下侧，此时所述振动板100与内环部511的上侧或下侧连接，从而利用振动板100加强振膜510的中央部。
在本实施例中，折环部512呈凸起或凹陷设置，固定部513由折环部512的外侧边向外延伸形成。固定部513可通过粘结或焊接等方式与盆架300连接，在此不做限定。
可以理解的，为了增大振膜510的有效振动面积，固定部513也可以是由折环部512的外侧边向下延伸形成，也即固定部513与盆架300的外壁通过粘结等方式连接。
在一实施例中，如图8所示，磁路系统400包括导磁轭410、中心磁路部420及边磁路部430，其中，导磁轭410设于盆架300内；中心磁路部420设于导磁轭410，中心磁路部420背向导磁轭410的一侧设有凹陷部423；边磁 路部430设于导磁轭410，并环绕中心磁路部420设置，边磁路部430与中心磁路部420之间形成磁间隙401。
在本实施例中，导磁轭410固定于盆架300，中心磁路部420和边磁路部430设于导磁轭410面向振动系统500的一侧，且边磁路部430环绕中心磁路部420设置，并与中心磁路部420之间形成磁间隙401，从而方便振动系统500的音圈520悬设于磁间隙401内，也即中心磁路部420和边磁路部430之间。可以理解的，通过设置边磁路部430，也即不做打断设计的边磁路部430体积更大，使得磁场强度更高，从而提高扬声器结构600的声学性能。
在一实施例中，如图8所示，中心磁路部420包括中心磁铁421和中心华司422，中心磁铁421设于导磁轭410，中心华司422设于中心磁铁421背向导磁轭410的一侧，中心华司422设有凹陷部423，凹陷部423为凹槽结构或通槽结构。边磁路部430包括边磁铁431和边华司432，边磁铁431设于导磁轭410，并环绕中心磁路部420设置，边华司432设于边磁铁431背向导磁轭410的一侧。可选地，凹陷部423可以设在中心磁铁421的中心位置。
在本实施例中，中心磁铁421和中心华司422的结构轮廓相同，中心磁铁421和中心华司422可选为板状结构。边磁铁431和边华司432的结构轮廓相同，边磁铁431和边华司432的可选为环状结构或多个条形结构，在此不做限定。
可以理解的，边华司432可固定于导磁轭410，并与边磁铁431相对抵接。当然，在其他实施例中，边华司432也可设置于盆架300，使得边华司432与盆架300设置为一体结构，从而简化扬声器结构600的加工工艺。在本实施例中，盆架300与边华司432的材质均为金属材料，从而有利于提高导热散热效果。
本发明还提出一种电子设备，该电子设备包括设备壳体和扬声器结构600，扬声器结构600设于设备壳体内。该扬声器结构600的具体结构参照前述实施例，由于本电子设备采用了前述所有实施例的全部技术方案，因此至少具有前述实施例的技术方案所带来的所有有益效果，在此不再一一赘述。
在本实施例中，壳体内设有腔体，扬声器结构600设于腔体内。可以理解的，电子设备可以是电子设备，例如手机、音响、电脑、耳机、手表、电视或平板电脑等，在此不做限定。
以上所述仅为本发明的可选实施例，并非因此限制本发明的专利范围，凡是在本发明的构思下，利用本发明说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本发明的专利保护范围内。

Claims (17)

  1. 一种振动板，应用于扬声器结构，其特征在于，所述振动板包括：
    主体，所述主体包括层叠设置的第一层和第二层，所述第一层上设有朝向远离所述第二层的方向凸出的凸筋，所述凸筋内设有密封腔；和
    填料层，所述填料层填充至所述密封腔内。
  2. 如权利要求1所述的振动板，其特征在于，所述第一层面向所述第二层的一侧朝向背离所述第二层的一侧凹陷形成凹陷区，并与所述第二层围合形成所述密封腔。
  3. 如权利要求2所述的振动板，其特征在于，所述第一层包括层叠设置的第一金属层和第一胶膜层，所述凹陷区由所述第一胶膜层朝向所述第一金属层凹陷形成；
    所述第二层包括层叠设置的第二金属层和第二胶膜层，所述第二胶膜层与所述第一胶膜层粘接连接。
  4. 如权利要求3所述的振动板，其特征在于，所述第一金属层和/或所述第二金属层的材质为铝箔、铜箔、钛箔、镁合金箔和MMC中的任意一种；
    且/或，所述第一金属层和/或所述第二金属层的模量密度比＞15GPa·cm 3/g；
    且/或，所述第一胶膜层和/或所述第二胶膜层的材质为环氧胶膜、酚醛胶膜、丙烯酸酯胶膜、硅胶胶膜和聚酯胶膜中的任意一种；
    且/或，所述第一胶膜层和/或所述第二胶膜层的拉伸模量＞600Mpa；
    且/或，所述第一胶膜层和/或所述第二胶膜层的粘接力＞300gf/20mm；
    且/或，所述第一层和/或所述第二层的厚度范围为0.004mm～0.21mm。
  5. 如权利要求2所述的振动板，其特征在于，所述第一层和/或所述第二层由纤维材料和预浸树脂复合而成，所述纤维材料为芳纶纤维、碳纤维或玻璃纤维中的一种，所述预浸树脂为环氧树脂、酚醛树脂、双马来酰亚胺树 脂、乙烯基树脂、PA、PP、PC、PI和PEEK中的任意一种。
  6. 如权利要求5所述的振动板，其特征在于，所述第一层和/或所述第二层为单向布时，所述第一层和/或所述第二层的面密度范围为15g/m 2～150g/m 2；或，所述第一层和/或所述第二层为编织布时，所述第一层和/或所述第二层的面密度范围为25g/m 2～240g/m 2；
    且/或，所述预浸树脂的拉伸模量＞500Mpa，所述预浸树脂的弯曲强度＞60MPa；
    且/或，所述第一层和/或所述第二层中所述预浸树脂的树脂含量为30％-60％。
  7. 如权利要求1至6中任一项所述的振动板，其特征在于，所述填料层的材质为液体泡沫或发泡胶膜中的一种；
    或，所述填料层的材质为发泡PET、PMI、PA、PVC、PE、PPS、PS、PU、环氧泡沫或酚醛泡沫中的一种。
  8. 如权利要求1至6中任一项所述的振动板，其特征在于，所述凸筋包括多个；
    多个所述凸筋呈平行设置，并沿所述主体的长度方向或宽度方向间隔排布；或，多个所述凸筋呈交叉设置，并形成夹角，所述夹角的范围为0°～90°。
  9. 如权利要求1至8中任一项所述的振动板的加工方法，其特征在于，所述加工方法包括以下步骤：
    提供主体，所述主体包括第一层和第二层；
    将所述第一层铺设于下模，并用第一上模预压成型，使所述第一层的一侧形成向另一侧凹陷的凹陷区；
    将填料层填充于所述凹陷区内；
    将所述第二层铺设于所述第一层，并盖合所述凹陷区的开口，使所述凹陷区和所述第二层围合形成密封腔；
    用第二上模合模，并进行升温加热，以使所述密封腔内的填料层发泡成 型，脱模得到振动板。
  10. 如权利要求9所述的振动板的加工方法，其特征在于，所述将填料层填充于所述凹陷区内的步骤包括：
    将所述填料层填充于所述凹陷区内，以使所述填料层的体积与所述凹陷区的体积比范围为1/25～3/4。
  11. 一种扬声器结构，其特征在于，所述扬声器结构包括盆架以及收容于所述盆架内的磁路系统和振动系统，所述振动系统包括如权利要求1至8中任一项所述的振动板。
  12. 如权利要求11所述的扬声器结构，其特征在于，所述振动系统还包括：
    振膜，所述振膜与所述磁路系统相对设置，所述振动板设于所述振膜，所述磁路系统设有磁间隙和凹陷部，所述凹陷部与所述振动板的凸筋对应设置；和
    音圈，所述音圈的一端与所述振膜或所述振动板连接，所述音圈的另一端悬设于所述磁间隙内。
  13. 如权利要求12所述的扬声器结构，其特征在于，所述振动板的周缘与所述振膜连接，所述音圈与所述振动板背向所述振膜的一侧连接，并围绕所述凸筋设置。
  14. 如权利要求12所述的扬声器结构，其特征在于，所述凸筋的横截面形状和大小与所述凹陷部的横截面形状和大小相适配；
    且/或，所述振膜为工程塑料、弹性体材料、胶膜中的一种或多种材料复合组成；
    且/或，所述振膜的厚度在0.01mm～0.5mm范围内。
  15. 如权利要求12所述的扬声器结构，其特征在于，所述磁路系统包括：
    导磁轭，所述导磁轭设于所述盆架内；
    中心磁路部，所述中心磁路部设于所述导磁轭，所述中心磁路部背向所述导磁轭的一侧设有所述凹陷部；及
    边磁路部，所述边磁路部设于所述导磁轭，并环绕所述中心磁路部设置，所述边磁路部与所述中心磁路部之间形成所述磁间隙。
  16. 如权利要求15所述的扬声器结构，其特征在于，所述中心磁路部包括中心磁铁和中心华司，所述中心磁铁设于所述导磁轭，所述中心华司设于所述中心磁铁背向所述导磁轭的一侧，所述中心华司设有所述凹陷部，所述凹陷部为凹槽结构或通槽结构。
  17. 一种电子设备，其特征在于，包括设备壳体和如权利要求11至16中任一项所述的扬声器结构，所述扬声器结构设于所述设备壳体内。
PCT/CN2021/136062 2021-02-08 2021-12-07 振动板及其加工方法、扬声器结构及电子设备 WO2022166367A1 (zh)

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