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WO2022154317A1 - Structure de contact de module de caméra et appareil électronique la comprenant - Google Patents

Structure de contact de module de caméra et appareil électronique la comprenant Download PDF

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Publication number
WO2022154317A1
WO2022154317A1 PCT/KR2021/019932 KR2021019932W WO2022154317A1 WO 2022154317 A1 WO2022154317 A1 WO 2022154317A1 KR 2021019932 W KR2021019932 W KR 2021019932W WO 2022154317 A1 WO2022154317 A1 WO 2022154317A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
camera
rear plate
camera bracket
metal member
Prior art date
Application number
PCT/KR2021/019932
Other languages
English (en)
Korean (ko)
Inventor
정양균
박홍철
장병근
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2022154317A1 publication Critical patent/WO2022154317A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Definitions

  • Various embodiments of the present disclosure relate to a contact structure of a camera module and an electronic device including the camera module.
  • An electronic device is a device that performs a specific function according to a loaded program, such as an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet PC, an image/audio device, a desktop/laptop computer, or a car navigation device from a home appliance. It can mean a device. For example, these electronic devices may output stored information as sound or image.
  • various functions may be mounted in one electronic device such as a mobile communication terminal in recent years. For example, not only communication functions, but also entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions such as mobile banking, or various functions such as schedule management or electronic wallets are integrated into one electronic device. it is becoming Such electronic devices are being miniaturized so that users can conveniently carry them.
  • the camera module needs to be designed to limit malfunction due to external static electricity.
  • a bracket (eg, deco) of a camera module was fixed by placing an adhesive member (eg, tape) between the rear plate and the bracket, and a contact structure could be designed in one area of the flange.
  • a new contact structure for preventing electrostatic discharge (ESD) of the camera module is required.
  • ESD electrostatic discharge
  • An electronic device includes a rear plate including a recess structure, a camera bracket disposed in the recess structure to be exposed to the outside, covering a camera assembly and connected to the rear plate, and within the electronic device a printed circuit board disposed, a first portion disposed along a boundary portion of the rear plate and the camera bracket, a second portion extending from the first portion toward the camera bracket, and the rear plate from the first portion
  • a sealing member including a third portion extending toward the sealing member, a metal member formed to surround at least a portion of the first portion of the sealing member, and coupling the rear plate and the bracket, the metal member and the printed circuit board It may include a conductive member for electrically connecting.
  • An electronic device includes a housing including a rear plate including a recess structure formed in an edge region, and a camera bracket disposed in the recess structure to be exposed to the outside and connected to the rear plate; A printed circuit board disposed in the housing, a camera assembly covered by the camera bracket for imaging an external object through at least one opening formed in the camera bracket, a metal member coupling the rear plate and the bracket, and and a conductive member electrically connecting the metal member and the printed circuit board.
  • a metal member and a conductive member connected to a printed circuit board may be disposed inside the camera bracket that covers the camera assembly. Accordingly, it is possible to provide a contact structure of the camera module for ESD improvement.
  • the contact structure of the camera module may include a sealing member disposed along a boundary portion between the camera bracket and the rear plate, and a metal member disposed to surround the sealing member. Accordingly, it is possible to prevent separation of the camera bracket forming an area of the housing and to limit the intrusion of foreign substances.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments.
  • FIG. 2 is a front perspective view of an electronic device, according to various embodiments of the present disclosure.
  • FIG. 3 is a rear perspective view of an electronic device, according to various embodiments of the present disclosure.
  • FIG. 4 is an exploded perspective view of an electronic device, according to various embodiments of the present disclosure.
  • FIG 5 is a plan view of a rear plate of an electronic device and a camera bracket connected to the rear plate as viewed from the rear, according to one of various embodiments of the present disclosure.
  • FIG. 6 is a plan view of a rear plate of an electronic device, a camera bracket connected to the rear plate, and a metal member viewed from the front, according to one of various embodiments of the present disclosure
  • FIG. 7 is a plan view of the camera bracket and the sealing member connected to the rear plate as viewed from the front as the metal member is removed in FIG. 6 .
  • FIG. 8 is an exploded perspective view illustrating a coupling relationship between a rear plate of an electronic device, a camera bracket, and a peripheral device according to one of various embodiments of the present disclosure
  • FIG. 9 is a cross-sectional view taken along line A-A' in the rear plate and camera bracket of the electronic device of FIG. 6 .
  • FIG. 10 is a plan view of a rear plate of an electronic device and a camera bracket connected to the rear plate, as viewed from the rear, according to another one of various embodiments of the present disclosure.
  • FIG. 11 is a plan view of a camera bracket connected to a rear plate of an electronic device as viewed from the front, according to another one of various embodiments of the present disclosure.
  • FIG. 12 is a cross-sectional view taken along line B-B' in the rear plate and camera bracket of the electronic device of FIG. 10 .
  • FIG. 13 is a plan view of a rear plate of an electronic device and a camera bracket connected to the rear plate, as viewed from the front, according to another one of various embodiments of the present disclosure.
  • FIG. 14 is a plan view of a rear plate of an electronic device and a camera bracket connected to the rear plate, as viewed from the rear, according to another one of various embodiments of the present disclosure.
  • FIG. 15 is a plan view illustrating a state in which the rear plate and the camera bracket are excluded from the electronic device of FIG. 14 .
  • FIG. 16 is a cross-sectional view taken along line C-C' in the rear plate and camera bracket of the electronic device of FIGS. 14 and 15 .
  • 17 is a plan view of a rear plate of an electronic device, a camera bracket connected to the rear plate, and a flash lens assembly disposed on the camera bracket, as viewed from the front, according to another one of various embodiments of the present disclosure.
  • FIG. 18 is an enlarged perspective view of a flash lens assembly and surrounding structures in the electronic device of FIG. 17 .
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 .
  • at least one of these components eg, the connection terminal 178
  • some of these components are integrated into one component (eg, display module 160 ). can be
  • the processor 120 for example, executes software (eg, the program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • software eg, the program 140
  • the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 .
  • the volatile memory 132 may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • the processor 120 is the main processor 121 (eg, a central processing unit or an application processor), or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) that can be operated independently or together with the main processor 121 .
  • NPU neural processing unit
  • image signal processor sensor hub processor, or communication processor
  • the main processor 121 uses less power than the main processor 121 or is set to be specialized for a specified function.
  • the auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .
  • the secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the coprocessor 123 eg, an image signal processor or a communication processor
  • may be implemented as part of another functionally related component eg, the camera module 180 or the communication module 190. have.
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example.
  • the artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 .
  • the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 .
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 155 may output a sound signal to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
  • the display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 .
  • the display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device.
  • the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, a sound output module 155 ) directly or wirelessly connected to the electronic device 101 .
  • the electronic device 102) eg, a speaker or headphones
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module).
  • a wireless communication module 192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 eg, : It may include a local area network (LAN) communication module, or a power line communication module.
  • a corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with an external electronic device through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunication network such as a computer network (eg, LAN or WAN).
  • a first network 198 eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
  • a second network 199 eg, legacy It may communicate with an external electronic device through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunication network such as a computer network (eg, LAN or WAN).
  • a telecommunication network such as a computer network (eg, LAN
  • the wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 .
  • subscriber information eg, International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the electronic device 101 may be identified or authenticated.
  • the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR).
  • NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency
  • the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • a high frequency band eg, mmWave band
  • the wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna.
  • the wireless communication module 192 may support various requirements defined in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ).
  • the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: Downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) can be supported.
  • a peak data rate eg, 20 Gbps or more
  • loss coverage eg, 164 dB or less
  • U-plane latency for realizing URLLC
  • the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
  • all or part of the operations executed in the electronic device 101 may be executed in one or more of the external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 .
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of things (IoT) device.
  • the server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or the server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • the electronic device may have various types of devices.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a wearable device e.g., a smart bracelet
  • a home appliance device e.g., a home appliance
  • first”, “second”, or “first” or “second” may simply be used to distinguish the component from other such components, and refer to those components in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101).
  • a storage medium eg, internal memory 136 or external memory 138
  • the processor eg, the processor 120
  • the device eg, the electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is different from the case where data is semi-permanently stored in the storage medium. It does not distinguish between temporary storage cases.
  • a signal eg, electromagnetic wave
  • the method according to various embodiments disclosed in this document may be provided as included in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly or online between smartphones (eg: smartphones).
  • a part of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.
  • each component eg, a module or a program of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. have.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. , or one or more other operations may be added.
  • FIG. 2 is a front perspective view of an electronic device, according to various embodiments of the present disclosure
  • 3 is a rear perspective view of an electronic device, according to various embodiments of the present disclosure
  • the electronic device 101 has a front surface 310A, a rear surface 310B, and a side surface 310C surrounding a space between the front surface 310A and the rear surface 310B.
  • a housing 310 including a may refer to a structure that forms part of the front surface 310A of FIG. 2 , the rear surface 310B of FIG. 3 , and the side surfaces 310C.
  • the front surface 310A may be formed by a front plate 302 (eg, a glass plate including various coating layers, or a polymer plate) at least a portion of which is substantially transparent.
  • the rear surface 310B may be formed by the rear plate 311 .
  • the rear plate 311 may be formed of, for example, glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.
  • the side surface 310C is coupled to the front plate 302 and the rear plate 311 and may be formed by a side bezel structure (or "side member") 318 including a metal and/or a polymer.
  • the back plate 311 and the side bezel structure 318 are integrally formed and may include the same material (eg, glass, a metallic material such as aluminum, or ceramic).
  • the front plate 302 includes two first edge regions 310D extending seamlessly from the front surface 310A toward the rear plate 311, the front plate ( 302) may be included at both ends of the long edge.
  • the rear plate 311 includes two second edge regions 310E extending seamlessly from the rear surface 310B toward the front plate 302 at both ends of the long edge.
  • the front plate 302 (or the back plate 311 ) may include only one of the first edge regions 310D (or the second edge regions 310E). In another embodiment, some of the first edge areas 310D or the second edge areas 310E may not be included.
  • the side bezel structure 318 when viewed from the side of the electronic device 101 , does not include the first edge regions 310D or the second edge regions 310E as described above.
  • a side surface may have a first thickness (or width), and a side surface including the first edge areas 310D or second edge areas 310E may have a second thickness thinner than the first thickness.
  • the electronic device 101 includes a display 301 , audio modules 303 , 307 , 314 (eg, the audio module 170 of FIG. 1 ), and a sensor module (eg, the sensor module of FIG. 1 ). 176 ), camera modules 305 and 312 (eg, camera module 180 in FIG. 1 ), key input device 317 (eg, input module 150 in FIG. 1 ), and connector holes 308 , 309) (eg, the connection terminal 178 of FIG. 1 ).
  • the electronic device 101 may omit at least one of the components (eg, the connector hole 309 ) or additionally include other components.
  • the display 301 may be visually exposed through, for example, a substantial portion of the front plate 302 .
  • at least a portion of the display 301 may be exposed through the front plate 302 forming the front surface 310A and the first edge regions 310D.
  • the edge of the display 301 may be formed to be substantially the same as an adjacent outer shape of the front plate 302 .
  • the distance between the periphery of the display 301 and the periphery of the front plate 302 may be substantially the same.
  • the surface (or the front plate 302 ) of the housing 310 may include a screen display area formed as the display 301 is visually exposed.
  • the screen display area may include a front surface 310A and first edge areas 310D.
  • a recess or opening is formed in a part of the screen display area (eg, the front surface 310A and the first edge area 310D) of the display 301 , and the recess is formed.
  • it may include at least one of an audio module 314 aligned with the opening, a sensor module (not shown), a light emitting device (not shown), and a camera module 305 .
  • an audio module 314 , a sensor module (not shown), a camera module 305 , a fingerprint sensor (not shown), and a light emitting element (not shown) may include at least one or more of.
  • the display 301 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. can be placed.
  • a touch sensing circuit capable of measuring the intensity (pressure) of a touch
  • a digitizer capable of measuring the intensity (pressure) of a touch
  • a digitizer that detects a magnetic field type stylus pen.
  • at least a portion of the key input device 317 may be disposed in the first edge regions 310D and/or the second edge regions 310E.
  • the audio modules 303 , 307 , and 314 may include, for example, a microphone hole 303 and speaker holes 307 and 314 .
  • a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound.
  • the speaker holes 307 and 314 may include an external speaker hole 307 and a call receiver hole 314 .
  • the speaker holes 307 and 314 and the microphone hole 303 may be implemented as a single hole, or a speaker may be included without the speaker holes 307 and 314 (eg, a piezo speaker).
  • the audio modules 303 , 307 , and 314 are not limited to the above structure, and various design changes may be made, such as mounting only some audio modules or adding a new audio module, depending on the structure of the electronic device 101 .
  • the sensor module may generate, for example, an electrical signal or data value corresponding to an internal operating state of the electronic device 101 or an external environmental state.
  • a sensor module may include, for example, a first sensor module (eg, a proximity sensor) and/or a second sensor module (eg, a fingerprint sensor) disposed on the front surface 310A of the housing 310 , and/or Alternatively, a third sensor module (eg, an HRM sensor) and/or a fourth sensor module (eg, a fingerprint sensor) disposed on the rear surface 310B of the housing 310 may be included.
  • the fingerprint sensor may be disposed on the back 310B as well as the front 310A (eg, the display 301 ) of the housing 310 .
  • the electronic device 101 may include a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor and an illuminance sensor.
  • the sensor module is not limited to the above structure, and the design may be changed in various ways, such as mounting only some sensor modules or adding a new sensor module, depending on the structure of the electronic device 101 .
  • the camera modules 305 and 312 are, for example, a front camera module 305 disposed on the front surface 310A of the electronic device 101 , and a rear camera module disposed on the rear surface 310B of the electronic device 101 . 312 , and/or a flash (not shown).
  • the camera module 305, 312 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 101 .
  • the camera modules 305 and 312 are not limited to the above structure, and various design changes may be made, such as mounting only some camera modules or adding a new camera module, depending on the structure of the electronic device 101 .
  • the electronic device 101 may include a plurality of camera modules (eg, a dual camera or a triple camera) each having different properties (eg, angle of view) or functions.
  • a plurality of camera modules 305 and 312 including lenses having different angles of view may be configured, and the electronic device 101 performs a camera performed by the electronic device 101 based on a user's selection. It can be controlled to change the angle of view of the modules 305 and 312 .
  • at least one of the plurality of camera modules 305 and 312 may be a wide-angle camera, and at least the other may be a telephoto camera.
  • the plurality of camera modules 305 and 312 may be a front camera, and at least the other may be a rear camera.
  • the plurality of camera modules 305 and 312 may include at least one of a wide-angle camera, a telephoto camera, and an IR (infrared) camera (eg, a time of flight (TOF) camera, a structured light camera).
  • the IR camera may be operated as at least a part of the sensor module.
  • the TOF camera may be operated as at least a part of a sensor module (not shown) for detecting the distance to the subject.
  • the key input device 317 may be disposed on the side surface 310C of the housing 310 .
  • the electronic device 101 may not include some or all of the above-mentioned key input devices 317 and the not included key input devices 317 may be displayed on the display 301 , such as soft keys. It may be implemented in other forms.
  • the key input device may include a sensor module 316 disposed on the rear surface 310B of the housing 310 .
  • the light emitting device may be disposed on the front surface 310A of the housing 310 , for example.
  • the light emitting device (not shown) may provide, for example, state information of the electronic device 101 in the form of light.
  • the light emitting device may provide, for example, a light source linked to the operation of the front camera module 305 .
  • the light emitting device (not shown) may include, for example, an LED, an IR LED, and/or a xenon lamp.
  • the connector holes 308 and 309 are, for example, a first connector hole capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data with an external electronic device.
  • a connector eg, a USB connector
  • a second connector hole eg, earphone jack
  • the camera module 305 and 312 of the camera modules 305 and 312 and/or some of the sensor modules are exposed to the outside through at least a part of the display 301 .
  • the camera module 305 may include a punch hole camera disposed inside a hole or recess formed on the rear surface of the display 301 .
  • the camera module 312 may be disposed inside the housing 310 such that the lens is exposed to the rear surface 310B of the electronic device 101 .
  • the camera module 312 may be disposed on a printed circuit board (eg, the printed circuit board 340 of FIG. 4 ).
  • the camera module 305 and/or the sensor module may be in contact with the external environment through a transparent area from the internal space of the electronic device 101 to the front plate 302 of the display 301 . can be placed.
  • some sensor modules 304 may be arranged to perform their functions without being visually exposed through the front plate 302 in the internal space of the electronic device.
  • FIG. 4 is an exploded perspective view of an electronic device, according to various embodiments of the present disclosure.
  • the electronic device 101 (eg, the electronic device 101 of FIGS. 1 to 3 ) according to various embodiments includes a support bracket 370 and a front plate 320 (eg, in FIG. 2 ).
  • Front plate 302 the display 330 (eg, display 301 in FIG. 2), printed circuit board 340 (eg, PCB, flexible PCB (FPCB), or rigid flexible PCB (RFPCB)), battery 350 (eg, the battery 189 of FIG. 1 ), the second support member 360 (eg, the rear case), the antenna 390 (eg, the antenna module 197 of FIG. 1 ), and the rear plate ( 380) (eg, the rear plate 311 of FIG. 2 ).
  • the support bracket 370 of the electronic device 101 may include a side bezel structure 371 (eg, the side bezel structure 318 of FIG. 2 ) and a first support member 372 . have.
  • the electronic device 101 may omit at least one of the components (eg, the first support member 372 or the second support member 360 ) or additionally include other components. . At least one of the components of the electronic device 101 may be the same as or similar to at least one of the components of the electronic device 101 of FIG. 2 or 3 , and overlapping descriptions will be omitted below.
  • the first support member 372 may be disposed inside the electronic device 101 and connected to the side bezel structure 371 , or may be integrally formed with the side bezel structure 371 .
  • the first support member 372 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the first support member 372 may have a display 330 coupled to one surface and a printed circuit board 340 coupled to the other surface.
  • the printed circuit board 340 may be equipped with a processor, a memory, and/or an interface.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the printed circuit board 340 may include a flexible printed circuit board type radio frequency cable (FRC).
  • FRC radio frequency cable
  • the printed circuit board 340 may be disposed on at least a portion of the first support member 372 , and an antenna module (eg, the antenna module 197 of FIG. 1 ) and a communication module (eg, of FIG. 1 ). It may be electrically connected to the communication module 190).
  • the memory may include, for example, a volatile memory or a non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may, for example, electrically or physically connect the electronic device 101 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery 350 is a device for supplying power to at least one component of the electronic device 101 , for example, a non-rechargeable primary battery, or a rechargeable secondary battery, or fuel. It may include a battery. At least a portion of the battery 350 may be disposed substantially on the same plane as the printed circuit board 340 , for example. The battery 350 may be integrally disposed inside the electronic device 101 , or may be disposed detachably from the electronic device 101 .
  • the second support member 360 (eg, a rear case) may be disposed between the printed circuit board 340 and the antenna 390 .
  • the second support member 360 may include one surface to which at least one of the printed circuit board 340 and the battery 350 is coupled, and the other surface to which the antenna 390 is coupled.
  • the antenna 390 may be disposed between the rear plate 380 and the battery 350 .
  • the antenna 390 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna 390 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
  • an antenna structure may be formed by a part of the side bezel structure 371 and/or the first support member 372 or a combination thereof.
  • the rear plate 380 may form at least a portion of the rear surface of the electronic device 101 (eg, the rear surface 310B of FIG. 3 ).
  • FIG. 5 is a plan view of a rear plate of an electronic device and a camera bracket connected to the rear plate as viewed from the rear, according to one of various embodiments of the present disclosure.
  • FIG. 8 is an exploded perspective view illustrating a coupling relationship between a rear plate of an electronic device, a camera bracket, and a peripheral device according to one of various embodiments of the present disclosure
  • 9 is a cross-sectional view taken along line A-A' in the rear plate and camera bracket of the electronic device of FIG. 6 .
  • the electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) includes a housing (eg, the housing 310 of FIGS. 2 and 3 ), and the housing 310 includes the electronic device ( and a camera bracket 315 that covers the rear plate 311 and the camera assembly (eg, the camera module 312 in FIG. 3 ) that covers the rear surface of the electronic device 101 and forms at least a part of the rear surface of the electronic device 101 . can do.
  • the configuration of the rear plate 311 of FIGS. 5 to 8 may be partially or entirely the same as that of the rear plate 380 of FIG. 4 .
  • the rear surface (eg, the surface facing the +Z axis) of the housing 310 may be formed by the first surface 311b of the rear plate 311 and the camera bracket 315 of the camera module 312 .
  • the rear plate 311 may include a first surface 311b and a recess structure 311a formed in an edge region of the first surface 311b. At least a portion of the camera bracket 315 having a shape corresponding to the shape of the recess structure 311a may be disposed along the recess structure 311a and exposed to the outside (eg, in the +Z-axis direction).
  • the recess structure 311a may include at least one of various shapes, such as an opening, a hole, or a groove.
  • the camera bracket 315 may be designed to have a different thickness compared to the adjacent recess structure 311a.
  • the recess structure 311a formed in the rear plate 311 is manufactured in a ' ⁇ ' or ' ⁇ ' shape when viewed from above the rear plate 311, so that one side of the edge of the rear plate 311 is It may have a cut shape.
  • the camera bracket 315 may be provided in a shape corresponding to the cut shape, and may be connected to the rear plate 311 .
  • the camera bracket 315 is a separate configuration separated from the rear plate 311 and may include a metal material (eg, aluminum).
  • the camera bracket 315 includes at least one opening 315e corresponding to the number of lens assemblies of the camera module 312 , and reduces the external impact transmitted to the camera module 312 , thereby reducing the camera module 312 . can protect
  • the camera bracket 315 may be provided in a substantially rectangular shape, and referring to FIGS. 5 and 6 , a first sidewall 315a facing the +Y-axis direction and forming an upper edge, A second sidewall 315b facing the -Y-axis direction and forming a lower edge, a third sidewall 315c facing the +X-axis direction and forming a right end edge, and a third sidewall 315c facing the -X-axis direction and forming a lower edge 4 sidewalls 315d may be included.
  • a connection portion between the first sidewall 315a, the second sidewall 315b, the third sidewall 315c, and the fourth sidewall 315d may include a curved portion to be seamless.
  • the first sidewall 315a and the second sidewall 315b may be formed to have a shorter length than the third sidewall 315c and the fourth sidewall 315d, and the first sidewall 315a and a length of the second sidewall 315b may form approximately 1/3 to 1/2 of an upper edge portion of the rear surface (eg, a surface facing the +Z axis) of the housing 310 .
  • the sealing member 400 and the metal member 500 may be disposed in the -Z axis direction with respect to the rear surface (eg, the surface facing the +Z axis) of the housing 310 .
  • the sealing member 400 includes a first part 410 positioned on the camera bracket 315, a second part 420 positioned on the rear plate 311, and the camera bracket 315 and the rear plate ( A third portion 430 positioned at a boundary portion (eg, the recess structure 311a) of 311 may be included.
  • the first part 410 may be disposed along the edge of the surface of the camera bracket 315 facing the -Z axis.
  • the first portion 410 may be disposed along the first sidewall 315a of the camera bracket 315 and the fourth sidewall 315d extending from the first sidewall 315a.
  • the second part 420 may be disposed along the edge of the surface of the rear plate 311 facing the -Z axis.
  • the first portion 410 and the second portion 420 may be disposed along the edge of the rear surface of the housing 310 .
  • the third part 430 is disposed along the recess structure 311a, and a part is disposed along the edge of the side facing the -Z axis of the camera bracket 315 adjacent to the rear plate 311 and , the other part may be disposed along the edge of the side facing the -Z axis of the rear plate 311 adjacent to the camera bracket 315 .
  • a portion of the third portion 430 may be disposed along the second sidewall 315b and the third sidewall 315c extending from the second sidewall 315b of the camera bracket 315 .
  • the third part 430 may have a ' ⁇ ' or ' ⁇ ' shape when viewed from above the rear plate 311 , and may have a thickness greater than that of the first part 410 and/or the second part 420 . .
  • the third part 430 is based on the connection part (eg, boundary part) of the camera bracket 315 and the rear plate 311, one side and the rear plate 311 of the camera bracket 315. By simultaneously covering and bonding one side of the , the camera bracket 315 and the rear plate 311 can be connected.
  • the sealing member 400 may include at least one of a tape, an adhesive, a waterproof dispensing, silicone, a waterproof rubber, and urethane.
  • the adhesive material may include at least one of an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat-reactive adhesive, a general adhesive, and a double-sided tape.
  • the metal member 500 may be disposed along a boundary portion (eg, the recess structure 311a) between the camera bracket 315 and the rear plate 311 . As the metal member 500 is disposed to surround at least a portion of the sealing member 400 , the coupling between the camera bracket 315 and the rear plate 311 may be strengthened and the sealing member 400 may be prevented from being pushed.
  • a boundary portion eg, the recess structure 311a
  • the metal member 500 has one surface 430a facing the -Z axis of the third portion 430 of the sealing member 400, and both side surfaces 430b and 431b perpendicular to the direction in which the one surface 430a faces. ), a second area 520 extending from the first area 510 toward the camera bracket 315 , and extending from the first area 510 toward the rear plate 311 .
  • a third region 530 may be included.
  • At least a portion of the second region 520 may be disposed to contact the camera bracket 315 .
  • a portion of the second region 520 of the metal member 500 may directly contact the camera bracket 315 or may be electrically connected to the camera bracket 315 through a separate member (eg, a screw).
  • the first region 510 and the second region 520 of the metal member 500 are disposed to face a partial region of the camera bracket 315, but is not limited thereto, and the camera bracket ( 315), the design can be changed to face-to-face with the entire area.
  • FIG. 7 illustrates a process in which the sealing member 400 is disposed in a state in which the rear plate 311 and the camera bracket 315 of the electronic device are fitted.
  • the process in which the metal member 500 is disposed may be shown.
  • At least a portion 410a of the first portion 410 of the sealing member 400 may be disposed to surround at least a portion of at least one opening 315e formed in the camera bracket 315 .
  • the sealing member 400 is a structure for bonding the camera bracket 315 and the metal member 500 , and may be manufactured to correspond to the shape of the metal member 500 . Accordingly, the shape of the at least part 410a may be designed to correspond to the second region 520 of the metal member 500 .
  • the shape of the sealing member 400 disposed on a part of the camera bracket 315 is an example, and when the metal member 500 is manufactured in a shape disposed on the entire surface of the camera bracket 315, to correspond to this Design may change.
  • 10 is a plan view of a rear plate of an electronic device and a camera bracket connected to the rear plate, as viewed from the rear, according to another one of various embodiments of the present disclosure.
  • 11 is a plan view of a camera bracket connected to a rear plate of an electronic device as viewed from the front, according to another one of various embodiments of the present disclosure.
  • 12 is a cross-sectional view taken along line B-B' in the rear plate and camera bracket of the electronic device of FIG. 10 .
  • the electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) includes a housing (eg, the housing 310 of FIGS. 2 and 3 ), a camera module 312 , and a main circuit board ( 340) may be included.
  • the housing 310 includes a support bracket 370 formed along a side surface of the electronic device 101 , a rear plate 311 covering the rear surface of the electronic device 101 , and a camera bracket 315 . can do.
  • the camera module 312 may include a camera assembly 312a including a plurality of lenses, and a camera bracket 315 covering the camera assembly 312a.
  • the electronic device 101 may further include a sealing member 400 and a metal member 500 for connecting the rear plate 311 and the camera bracket 315 to each other.
  • the configuration of the rear plate 311 , the camera bracket 315 , the sealing member 400 , and the metal member 500 of the electronic device of FIGS. 10 and 11 is the rear plate 311 of the electronic device of FIGS. 5 to 8 .
  • the configuration of the camera bracket 315, the sealing member 400, and the metal member 500 may be in part or all the same.
  • the conductive member 550 different from the structure of FIGS. 5 to 8 will be described.
  • the side wall of the housing 310 may be formed by the side of the support bracket 370 .
  • the edge region of the support bracket 370 may have a closed loop shape, and some regions may be coupled to the rear plate 311 , and other partial regions may be coupled to the camera bracket 315 .
  • the sealing member 400 and the metal member 500 may be disposed along the boundary portion (eg, the recess structure 311a) of the rear plate 311 and the camera bracket 315 .
  • a conductive member 550 may be formed in one region of the metal member 500 .
  • the conductive member 550 may be formed in plurality.
  • the first conductive member 551 may be formed on a portion of the third region 530 extending from the first region 510 of the metal member 500 toward the rear plate 311 .
  • the first conductive member 551 may be electrically connected to the main circuit board 340 disposed inside the electronic device 101 .
  • the first conductive member 551 may be disposed in contact with the ground of the main circuit board 340 to provide a part of the ESD path.
  • the second conductive member 552 may be formed on a portion of the second region 520 extending from the first region 510 of the metal member 500 toward the camera bracket 315 .
  • the second conductive member 552 may be connected to the camera bracket 315 .
  • the second conductive member 552 may include a coupling member such as a screw formed to pass through the coupling hole of the camera bracket 315 .
  • the electronic device 101 receives the main circuit board 340 from the camera module 312 (eg, the printing of FIG. 4 ).
  • a conductive path connected to the circuit board 340 may be formed.
  • static electricity penetrating around the camera assembly 312a is transferred to the camera bracket 315 covering the camera assembly 312a and then electrically connected to the camera bracket 315 .
  • It may be designed to have an ESD path that moves to the main circuit board 340 through the second conductive member 552 , the metal member 500 , and the first conductive member 551 .
  • the configuration showing the ESD path is one embodiment, and design can be modified through a metal structure disposed adjacent to a hardware component (eg, a component such as a camera assembly and a sensor) other than the camera bracket 315 .
  • a hardware component eg, a component such as a camera assembly and a sensor
  • an ESD path may be formed so that external static electricity is directed toward the main circuit board 340 by connecting the metal structure and the main circuit board 340 .
  • FIG. 13 is a plan view of a rear plate of an electronic device and a camera bracket connected to the rear plate, as viewed from the front, according to another one of various embodiments of the present disclosure.
  • the electronic device may include a housing (eg, the housing 310 of FIGS. 2 and 3 ), and the housing 310 includes an electronic device. It may include a rear plate 311 and a camera bracket 315 for covering the rear surface of the device 101 .
  • the electronic device 101 may further include a sealing member 400 and a metal member 500 for connecting the rear plate 311 and the camera bracket 315 .
  • the configuration of the rear plate 311 , the camera bracket 315 , the sealing member 400 , and the metal member 500 of the electronic device of FIG. 13 is the rear plate 311 and the camera bracket of the electronic device of FIGS. 5 to 9 . Some or all of the configurations of the 315 , the sealing member 400 , and the metal member 500 may be the same.
  • the metal member 500 may be disposed to cover the inner surface of the camera bracket 315 .
  • the metal member 500 includes a first area 510 disposed along a boundary portion (eg, a recess structure 311a) of the camera bracket 315 and the rear plate 311 , and the camera bracket from the first area 510 . It may include a second region 520 extending toward the 315 , and a third region 530 extending from the first region 510 toward the rear plate 311 .
  • the second region 520 of the metal member 500 may be disposed to overlap the camera bracket 315 as a whole when viewed toward the front or rear surface (eg, a surface facing the +Z axis) of the housing 310 .
  • the metal member 500 may include a material having higher thermal conductivity than the camera bracket 315 .
  • the camera bracket 315 may be formed to include an Al material.
  • condensation occurring in the camera module 312 can be prevented by the second region 520 of the metal member 500 formed to completely surround one surface of the camera bracket 315 .
  • condensation may occur in the camera assembly of the camera module 312 .
  • the heat transfer efficiency generated toward the camera module 312 is reduced. improvement, and it is possible to prevent dew condensation occurring in the camera module 312 .
  • 14 is a plan view of a rear plate of an electronic device and a camera bracket connected to the rear plate, as viewed from the rear, according to another one of various embodiments of the present disclosure.
  • 15 is a plan view illustrating a state in which the rear plate and the camera bracket are excluded from the electronic device of FIG. 14 .
  • 16 is a cross-sectional view taken along line C-C' in the rear plate and camera bracket of the electronic device of FIGS. 14 and 15 .
  • the electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) includes a housing (eg, the housing 310 of FIGS. 2 and 3 ), a camera assembly 312a , and a support member 360 . (eg, a rear case), and/or a printed circuit board 340 .
  • the housing 310 includes a support bracket 370 formed along a side surface of the electronic device 101 , a rear plate 311 covering the rear surface of the electronic device 101 , and a camera bracket 315 . can do.
  • the electronic device 101 may further include a sealing member 400 and a metal member 500 for connecting the rear plate 311 and the camera bracket 315 .
  • the configuration of the rear plate 311 , the camera bracket 315 , the sealing member 400 , and the metal member 500 of the electronic device of FIGS. 14 to 16 is the rear plate 311 of the electronic device of FIGS. 5 to 8 .
  • the configuration of the camera bracket 315, the sealing member 400, and the metal member 500 may be in part or all the same.
  • the camera module 312 may be disposed in one area of the support member 360 .
  • the support member 360 includes a first surface facing the +Z axis direction and a second surface facing the -Z axis direction, and the first surface 361 is the rear plate 311 (and/or the camera bracket 315). ) and disposed to face, the second face 362 may be disposed to face a partial region of the support bracket 370 .
  • an antenna pattern (not shown) used as an antenna radiator and devices in an electronic device (eg, the camera assembly 312a and the flexible circuit board 312b) are mounted. space can be provided.
  • the side wall of the housing 310 may be formed by the side of the support bracket 370 .
  • the edge region of the support bracket 370 may have a closed loop shape, and some regions may be coupled to the rear plate 311 , and other partial regions may be coupled to the camera bracket 315 .
  • the sealing member 400 and the metal member 500 may be disposed along the boundary portion (eg, the recess structure 311a) of the rear plate 311 and the camera bracket 315 .
  • a conductive member 560 (eg, the conductive member 560 disposed on the P1 region of FIGS. 15 and 16 ) may be formed in one region of the metal member 500 .
  • the conductive member 560 may be electrically connected to the flexible circuit board 312b extending from the camera assembly 312a.
  • the flexible circuit board 312b may have one side connected to the camera assembly 312a and the other side connected to the main circuit board 340 .
  • the electronic device 101 receives the main circuit board 340 from the camera module 312 (eg, the printing of FIG. 4 ).
  • a conductive path connected to the circuit board 340 may be formed.
  • static electricity penetrating around the camera assembly 312a is transferred to the camera bracket 315 covering the camera assembly 312a and then electrically connected to the camera bracket 315 .
  • It can be designed to have an ESD path that moves to the main circuit board 340 through the metal member 500 , the conductive member 560 , and the flexible circuit board 312b .
  • 17 is a plan view of a rear plate of an electronic device, a camera bracket connected to the rear plate, and a flash lens assembly disposed on the camera bracket, as viewed from the front, according to another one of various embodiments of the present disclosure.
  • 18 is an enlarged perspective view of a flash lens assembly and surrounding structures in the electronic device of FIG. 17 .
  • the electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) includes a housing (eg, the housing 310 of FIGS. 2 and 3 ) and a flash lens assembly 610 disposed adjacent to the camera assembly. ), and the housing 310 may include a rear plate 311 covering the rear surface of the electronic device 101 and a camera bracket 315 .
  • the electronic device 101 may further include a sealing member 400 and a metal member 500 for connecting the rear plate 311 and the camera bracket 315 .
  • the configuration of the rear plate 311 , the camera bracket 315 , the sealing member 400 , and the metal member 500 of the electronic device of FIGS. 17 and 18 is the rear plate 311 of the electronic device of FIGS. 5 to 9 .
  • the configuration of the camera bracket 315, the sealing member 400, and the metal member 500 may be in part or all the same.
  • the metal member 500 may be disposed to cover the inner surface of the camera bracket 315 .
  • the metal member 500 may include a first region 510 disposed along a boundary portion between the camera bracket 315 and the rear plate 311 (eg, the recess structure 311a of FIG. 6 ), the first It may include a second region 520 extending from the region 510 toward the camera bracket 315 , and a third region 530 extending from the first region 510 toward the rear plate 311 .
  • the second region 520 of the metal member 500 may be disposed to overlap at least a portion of the flash lens assembly 610 when viewed toward the front or rear surface (eg, the surface facing the +Z axis) of the housing 310 .
  • At least a portion of the second area 520 of the metal member 500 may be disposed to cover one area of the edge of the flash lens assembly 610 . 17 and 18 , due to the overlapping area P2 of the flash lens assembly 610 and the metal member 500, the flash lens assembly 620 is stably coupled to the mounting space of the camera bracket 315. can Accordingly, even when an external impact is applied to the electronic device 101 , it is possible to prevent the flash lens assembly 610 from being separated from the camera bracket 315 .
  • the electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) according to various embodiments of the present disclosure includes a rear plate (eg, the recessed structure 311a of FIG. 5 ) including a recessed structure (eg, the recessed structure 311a of FIG. 5 ).
  • the rear plate 311 of FIG. 5 disposed in the recess structure and exposed to the outside, covering the camera assembly and connected to the rear plate (eg, the camera bracket 315 of FIG. 5 ), the housing
  • a printed circuit board disposed within eg, printed circuit board 340 of FIG. 4
  • a first portion disposed along a boundary portion of the rear plate and the camera bracket (eg, third portion 430 of FIG.
  • a sealing member (eg, the sealing member 400 of FIG. 6 ) including the second portion 420 of 6), is formed to surround at least a portion of the first portion of the sealing member, and the rear plate and the bracket It may include a metal member for bonding (eg, the metal member 500 of FIG. 6 ), and a conductive member (eg, the conductive member 550 of FIG. 11 ) electrically connecting the metal member and the printed circuit board. .
  • the conductive member may be disposed on one region of the metal member and protrude in a direction opposite to the rear plate.
  • the electronic device is provided from the camera assembly (eg, the camera assembly 312a of FIG. 12 ) through the camera bracket, the metal member electrically connected to the camera bracket, and the conductive member, and A conductive path connected to the circuit board may be formed.
  • the metal member may include a first area (eg, the first area 510 of FIG. 6 ) covering at least a portion of the third portion of the sealing member, from the first area to the camera bracket.
  • a second region extending toward (eg, the second region 520 of FIG. 6 ), and a third region extending from the first region toward the rear plate (eg, the third region 530 of FIG. 6 ) may include
  • the conductive member is disposed in the second region of the metal member and is formed to electrically connect the camera bracket and the camera assembly to a first conductive member (eg, the second conductive member of FIG. 11 ). (552)), and a second conductive member disposed in the third region of the metal member and configured to provide electrical contact with the printed circuit board (eg, the first conductive member 551 of FIG. 11).
  • the second region of the metal member may be formed to surround an edge of at least one opening (eg, the opening 315e of FIG. 11 ) formed in the camera bracket.
  • the second region of the metal member may be formed to entirely cover an inwardly facing surface of the camera bracket.
  • the second region of the metal member is disposed to overlap a partial region of a flash lens assembly (eg, the flash lens assembly 610 of FIGS. 17 and 18 ) mounted on the camera bracket, and the flash lens The assembly may be configured to restrict movement.
  • a flash lens assembly eg, the flash lens assembly 610 of FIGS. 17 and 18
  • the metal member may include a material having higher thermal conductivity than the camera bracket.
  • the first portion of the sealing member may include one surface facing the inside of the electronic device and both side surfaces perpendicular to the direction in which the one surface faces.
  • the metal member may be formed to surround the one surface and the both surfaces of the first part.
  • the sealing member includes an adhesive material, and the first portion of the sealing member extends from the boundary portion to an edge area of the camera bracket and an edge area of the rear plate, the camera bracket and The rear plate may be coupled.
  • the second part of the sealing member may extend from the first part and be disposed along an edge of the camera bracket.
  • the second portion of the sealing member may be formed to surround an edge of the at least one opening formed in the camera bracket.
  • the second portion and/or the third portion of the sealing member may extend from the first portion to provide a single closed-loop shape.
  • the electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) according to various embodiments of the present disclosure includes a rear plate (eg, the rear plate 311 of FIG. 5 ) including a recess structure formed in an edge region. ), and a housing (eg, the housing 310 of FIGS. 2 and 3 ) including a camera bracket (eg, the camera bracket 315 of FIG. 5 ) disposed in the recess structure and exposed to the outside, and connected to the rear plate )), a printed circuit board (eg, the printed circuit board 340 of FIG.
  • a rear plate eg, the rear plate 311 of FIG. 5
  • a housing eg, the housing 310 of FIGS. 2 and 3
  • a camera bracket eg, the camera bracket 315 of FIG. 5
  • a printed circuit board eg, the printed circuit board 340 of FIG.
  • a camera assembly (eg, the camera assembly 312a of FIG. 12 ), a metal member coupling the rear plate and the bracket (eg, the metal member 500 of FIG. 6 ), and the metal member and the printed circuit board are electrically connected may include a conductive member (eg, the conductive member 550 of FIG. 11 ) connected to each other.
  • the metal member may include a first area disposed along a boundary portion between the rear plate and the camera bracket, a second area extending from the first area toward the camera bracket, and the first area It may include a third region extending toward the rear plate from the.
  • the conductive member may be disposed in the second region of the metal member and protrude in a direction opposite to the rear plate.
  • the electronic device may form a conductive path connected from the camera assembly to the printed circuit board through the camera bracket, the metal member electrically connected to the camera bracket, and the conductive member.
  • the electronic device may further include a sealing member disposed between the camera bracket and the metal member.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Studio Devices (AREA)

Abstract

Un appareil électronique selon divers modes de réalisation de la présente invention peut comprendre : une plaque arrière comprenant une structure évidée ; un support de caméra qui est disposé dans la structure évidée et exposé à l'extérieur, qui recouvre un ensemble caméra, et qui est relié à la plaque arrière ; une carte de circuit imprimé disposée à l'intérieur de l'appareil électronique ; un élément d'étanchéité comprenant une première partie disposée le long de la partie limite de la plaque arrière et du support de caméra, une deuxième partie s'étendant vers le support de caméra à partir de la première partie, et une troisième partie s'étendant vers la plaque arrière à partir de la première partie ; une plaque métallique qui est formée pour entourer au moins une partie de la première partie de l'élément d'étanchéité et couple la plaque arrière et le support ; et un élément conducteur connectant électriquement l'élément métallique et la carte de circuit imprimé.
PCT/KR2021/019932 2021-01-13 2021-12-27 Structure de contact de module de caméra et appareil électronique la comprenant WO2022154317A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020210004679A KR20220102383A (ko) 2021-01-13 2021-01-13 카메라 모듈의 접점 구조 및 이를 포함하는 전자 장치
KR10-2021-0004679 2021-01-13

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WO2022154317A1 true WO2022154317A1 (fr) 2022-07-21

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Publication number Priority date Publication date Assignee Title
WO2024112128A1 (fr) * 2022-11-23 2024-05-30 삼성전자 주식회사 Structure de caméra et dispositif électronique comprenant cette structure de caméra

Citations (5)

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Publication number Priority date Publication date Assignee Title
KR100780204B1 (ko) * 2006-12-13 2007-11-27 삼성전기주식회사 접지용 더미기판을 갖는 카메라 모듈
KR20150142386A (ko) * 2014-06-11 2015-12-22 삼성전자주식회사 카메라 장치 및 카메라 장치를 구비한 전자 장치
KR20160093563A (ko) * 2015-01-29 2016-08-08 주식회사 아모텍 감전보호기능이 내장된 휴대용 전자기기
KR20170003846A (ko) * 2015-06-30 2017-01-10 엘지디스플레이 주식회사 모바일 단말기
KR20180096178A (ko) * 2017-02-20 2018-08-29 엘지전자 주식회사 전자기기

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100780204B1 (ko) * 2006-12-13 2007-11-27 삼성전기주식회사 접지용 더미기판을 갖는 카메라 모듈
KR20150142386A (ko) * 2014-06-11 2015-12-22 삼성전자주식회사 카메라 장치 및 카메라 장치를 구비한 전자 장치
KR20160093563A (ko) * 2015-01-29 2016-08-08 주식회사 아모텍 감전보호기능이 내장된 휴대용 전자기기
KR20170003846A (ko) * 2015-06-30 2017-01-10 엘지디스플레이 주식회사 모바일 단말기
KR20180096178A (ko) * 2017-02-20 2018-08-29 엘지전자 주식회사 전자기기

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