WO2022074776A1 - Signal transmission wiring connection unit, endoscope, method for manufacturing signal transmission wiring connection unit, and ultrasound oscillator module - Google Patents

Abstract

A signal transmission wiring connection unit according to the present invention comprises: a first substrate that has a first connection terminal part having an electrode disposed thereto, the first connection terminal part being a connection terminal for outputting electric signals from an element for generating image data; a cable having a plurality of signal wires for transferring the electric signals; a second substrate having two first connection terminals respectively connected to the plurality of signal wires, a second connection terminal electrically connected to the first substrate, a first folding part provided between the two first connection terminals, and a second folding part provided between the first connection terminals and the second connection terminal; and an insulating layer provided between the two facing surfaces of the second substrate while the first and second folding parts are folded.

Description

Manufacturing method of signal transmission wiring connection unit, endoscope, signal transmission wiring connection unit and ultrasonic oscillator module

The present invention relates to a signal transmission wiring connection unit, an endoscope, a method for manufacturing a signal transmission wiring connection unit, and an ultrasonic vibrator module.

Conventionally, in the medical field, an endoscope system has been used when observing an organ of a subject such as a patient. In the endoscope system, for example, an image sensor, an ultrasonic transducer, or other element is provided at the tip, and the endoscope is connected to an endoscope having an insertion portion to be inserted into the subject via a cable to the base end side of the insertion portion. It is provided with a processing device that performs image processing on the image pickup signal generated by the element and displays an internal image on a display unit or the like. The insertion portion is provided on the base end side of the tip portion where the element is provided, and has a bendable portion.

The element and the signal cable are electrically connected via a substrate at the tip of the endoscope (see, for example, Patent Document 1). The signal cable has a plurality of signal lines. The element is electrically connected to each signal line via the substrate. In Patent Document 1, electronic components and the like are mounted by a laminated substrate in which a plurality of substrates are laminated, and an image pickup device and a signal line are electrically connected.

Japanese Unexamined Patent Publication No. 2011-50496

By the way, the tip of the endoscope is required to be miniaturized in order to facilitate insertion into the subject. Since Patent Document 1 has a configuration in which a plurality of substrates are laminated, wiring is complicated and unsuitable for miniaturization.

The present invention has been made in view of the above, and is a signal transmission wiring connection unit, an endoscope, and a signal transmission wiring connection that can reduce the size of connections between members of a unit that transmits signals with a simple configuration. It is an object of the present invention to provide a method of manufacturing a unit and an ultrasonic transducer module.

In order to solve the above-mentioned problems and achieve the object, the signal transmission wiring connection unit according to the present invention is provided with an electrode which is a connection terminal for outputting an electric signal from an element for generating image data. A first board having one connection terminal portion, a cable having a plurality of signal lines for transmitting the electric signal, two first connection terminals connected to the plurality of signal lines, and the first board. A second connection terminal that is electrically connected, a first bent portion provided between the two first connection terminals, and a provision between the first connection terminal and the second connection terminal. It is provided with a second substrate having a second bent portion to be formed, and an insulating layer provided between the surfaces of the second substrate facing each other in a folded state of the first and second bent portions. It is a feature.

Further, in the signal transmission wiring connection unit according to the present invention, in the above invention, the second substrate has a front surface and a back surface, and the first connection is connected to a part of the signal lines among the plurality of signal lines. It is characterized by having a first portion in which terminals are arranged on the surface and a second portion in which a first connection terminal connected to the remaining signal lines of the plurality of signal lines is arranged on the surface. And.

Further, in the signal transmission wiring connection unit according to the present invention, in the above invention, the first bent portion is provided between the first portion and the second portion, and the back surface of the first portion is provided. It is characterized in that the back surface of the second portion and the back surface of the second portion are bent so as to approach each other.

Further, in the signal transmission wiring connection unit according to the present invention, in the above invention, the insulating layer is a back surface of the first portion and a back surface of the second portion in a state where the first bent portion is bent. It is characterized by being provided between and.

Further, in the signal transmission wiring connection unit according to the present invention, in the above invention, the insulating layer is a back surface of the first portion and a back surface of the second portion in a state where the first bent portion is bent. It is characterized by fixing between and.

Further, in the signal transmission wiring connection unit according to the present invention, in the above invention, the second substrate further has a third portion in which the second connection terminal is arranged, and the second bent portion is. It is provided between the first portion and the third portion, and is characterized in that the first portion and the third portion are bent so as to approach each other.

Further, the signal transmission wiring connection unit according to the present invention is characterized in that, in the above invention, a coverlay covering at least the second bent portion on the surface of the second substrate is provided.

Further, the signal transmission wiring connection unit according to the present invention is characterized in that, in the above invention, the first bent portion is thinner than the other portions.

Further, the signal transmission wiring connection unit according to the present invention is characterized in that, in the above invention, a notch portion is formed in the second bent portion.

Further, the signal transmission wiring connection unit according to the present invention is characterized in that, in the above invention, the element is an ultrasonic vibrator for generating image data based on ultrasonic waves.

Further, the signal transmission wiring connection unit according to the present invention is characterized in that, in the above invention, the element is an image pickup element for generating image data based on an optical image.

Further, in the signal transmission wiring connection unit according to the present invention, in the above invention, the second bent portion is bent so that the first connection terminal portion and the third connection terminal portion are close to each other. It is characterized by that.

Further, the endoscope according to the present invention is characterized by including an insertion portion for accommodating the signal transmission wiring connection unit according to the above invention.

Further, the method for manufacturing a signal transmission wiring connection unit according to the present invention is arranged on the surface of the first and second connection terminal portions of a substrate electrically connected to a plurality of elements for generating image data, respectively. A signal line connection step for connecting a corresponding signal line to each of the plurality of first connection terminals to be formed, and after connecting the signal line to the first connection terminal, the above-mentioned is performed on the back surface of the first connection terminal portion. It is characterized by including an insulating layer forming step for forming an insulating layer for fixing the back surface of the second connection terminal portion.

Further, in the method for manufacturing a signal transmission wiring connection unit according to the present invention, in the above invention, the insulating layer forming step is provided between the first connection terminal portion and the second connection terminal portion. After bending the bent portion of the above to face the back surfaces of the first and second connection terminal portions, the back surface of the second connection terminal portion is fixed to the back surface of the first connection terminal portion to insulate the insulation. It is characterized by further comprising a removal step of forming a layer and removing the first bent portion.

Further, the ultrasonic transducer module according to the present invention includes a first substrate having a first connection terminal portion in which an electrode, which is a connection terminal for outputting an electric signal from an element for generating image data, is arranged. A cable having a plurality of signal lines for transmitting the electric signal, two first connection terminals connected to the plurality of signal lines, and a second connection terminal electrically connected to the first board. A second having a first bent portion provided between the two first connection terminals and a second bent portion provided between the first connection terminal and the second connection terminal. It is characterized by comprising a substrate and an insulating layer provided between the surfaces of the second substrate facing each other in a state where the first and second bent portions are bent.

Further, the signal transmission wiring connection unit according to the present invention includes a first substrate having a first connection terminal portion in which an electrode, which is a connection terminal for outputting an electric signal from an element for generating image data, is arranged. A cable having a plurality of signal lines for transmitting the electric signal, a first connection terminal portion in which a first connection terminal for connecting to a part of the signal lines among the plurality of signal lines is arranged on the surface, and a portion of the first connection terminal. A second connection terminal portion in which a first connection terminal connected to the remaining signal lines of the plurality of signal lines is arranged on the surface and a second connection terminal electrically connected to the first board are provided. The third connection terminal portion arranged, and the back surface of the first connection terminal portion and the second connection terminal portion provided between the first connection terminal portion and the second connection terminal portion. A first bent portion that is bent so that the back surfaces are close to each other, and a first connection terminal portion and the third connection terminal portion are provided between the first bending portion and the first connection terminal portion and the third connection. A second substrate having a second bent portion that can be bent so that the terminal portions approach each other, and a back surface of the first connection terminal portion in a state where the first bent portion is bent. It is characterized by comprising an insulating layer for fixing between the back surface of the second connection terminal portion.

According to the present invention, there is an effect that the connection between the members of the unit that transmits a signal can be miniaturized with a simple configuration.

FIG. 1 is a diagram schematically showing an endoscope system according to the first embodiment of the present invention. FIG. 2 is a perspective view schematically showing the tip configuration of the insertion portion of the ultrasonic endoscope according to the first embodiment of the present invention. FIG. 3 is a perspective view schematically showing the internal configuration of the tip portion of the ultrasonic endoscope according to the first embodiment of the present invention. FIG. 4 is a perspective view schematically showing the internal configuration of the tip portion of the ultrasonic endoscope according to the first embodiment of the present invention. FIG. 5 is a diagram illustrating the configuration of the ultrasonic oscillator shown in FIGS. 3 and 4. FIG. 6 is a diagram (No. 1) for explaining the connection between the substrate and the signal line at the time of manufacturing the ultrasonic endoscope according to the first embodiment of the present invention. FIG. 7 is a diagram (No. 2) illustrating the connection between the substrate and the signal line at the time of manufacturing the ultrasonic endoscope according to the first embodiment of the present invention. FIG. 8 is a diagram (No. 3) illustrating the connection between the substrate and the signal line at the time of manufacturing the ultrasonic endoscope according to the first embodiment of the present invention. FIG. 9 is a plan view of the first portion and the second portion as viewed from the direction of arrow A shown in FIG. FIG. 10 is a diagram (No. 1) illustrating the connection between the first substrate and the second substrate of the relay substrate at the time of manufacturing the ultrasonic endoscope according to the first embodiment of the present invention. FIG. 11 is a diagram (No. 2) illustrating the connection between the first substrate and the second substrate of the relay substrate at the time of manufacturing the ultrasonic endoscope according to the first embodiment of the present invention. FIG. 12 is a plan view illustrating the configuration of the ultrasonic endoscope second substrate according to the modified example of the first embodiment of the present invention. FIG. 13 is a perspective view schematically showing the internal configuration of the tip portion of the ultrasonic endoscope according to the second embodiment of the present invention. FIG. 14 is a perspective view schematically showing the internal configuration of the tip portion of the ultrasonic endoscope according to the second embodiment of the present invention. FIG. 15 is a diagram (No. 1) for explaining the connection between the substrate and the signal line at the time of manufacturing the ultrasonic endoscope according to the second embodiment of the present invention. FIG. 16 is a diagram (No. 2) illustrating the connection between the substrate and the signal line at the time of manufacturing the ultrasonic endoscope according to the second embodiment of the present invention. FIG. 17 is a diagram (No. 3) illustrating the connection between the substrate and the signal line at the time of manufacturing the ultrasonic endoscope according to the second embodiment of the present invention. FIG. 18 is a plan view of the first portion and the second portion as viewed from the direction of arrow B shown in FIG. FIG. 19 is a diagram (No. 1) illustrating the connection between the first substrate and the second substrate of the relay substrate at the time of manufacturing the ultrasonic endoscope according to the second embodiment of the present invention. FIG. 20 is a diagram (No. 2) illustrating the connection between the first substrate and the second substrate of the relay substrate at the time of manufacturing the ultrasonic endoscope according to the second embodiment of the present invention. FIG. 21 is a diagram (No. 1) for explaining the connection between the substrate and the signal line at the time of manufacturing the ultrasonic endoscope according to the modified example of the second embodiment of the present invention. FIG. 22 is a diagram (No. 2) illustrating the connection between the substrate and the signal line at the time of manufacturing the ultrasonic endoscope according to the modified example of the second embodiment of the present invention. FIG. 23 is a diagram schematically showing an internal configuration of a tip portion in an ultrasonic endoscope according to another embodiment of the present invention.

Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as embodiments) will be described with reference to the drawings. The present invention is not limited to the embodiments described below. Further, in the description of the drawings, the same parts are designated by the same reference numerals.

(Embodiment 1)
FIG. 1 is a diagram schematically showing an endoscope system 1 according to a first embodiment of the present invention. The endoscope system 1 is a system for performing ultrasonic diagnosis in a subject such as a person using an ultrasonic endoscope. As shown in FIG. 1, the endoscope system 1 includes an ultrasonic endoscope 2, an ultrasonic observation device 3, an endoscope observation device 4, a display device 5, and a light source device 6.

The ultrasonic endoscope 2 has an imaging optical system and an imaging element, and is inserted into the digestive tract (esophagus, stomach, duodenum, large intestine) or respiratory organs (trachea, bronchus) of the subject, and is inserted into the digestive tract or the digestive tract. , It is possible to perform either respiratory imaging. The ultrasonic endoscope 2 has a light guide that guides the illumination light to irradiate the subject at the time of imaging. Light guided by an optical fiber cable 61, which will be described later, is supplied to this light guide, and the tip portion reaches the tip of the insertion portion of the ultrasonic endoscope 2 into the subject, while the base end portion is illuminated. It is connected to a light source device 6 that generates light. Further, the ultrasonic endoscope 2 transmits ultrasonic waves to the gastrointestinal tract and organs around the respiratory organs (pancreatic duct, gallbladder, bile duct, biliary tract, lymph node, mediastinal organ, blood vessel, etc.), and the periphery thereof. Receives ultrasonic waves reflected by the organ.

As shown in FIG. 1, the ultrasonic endoscope 2 includes an insertion unit 21, an operation unit 22, a universal cord 23, and a connector 24. The insertion portion 21 is a portion to be inserted into the subject. The insertion portion 21 is provided on the tip side, and has a rigid tip portion 211 having an ultrasonic vibrator 7, a curved portion 212 connected to the base end side of the tip portion 211 to enable bending, and a base of the curved portion 212. A flexible tube portion 213 connected to the end side and having flexibility is provided. Here, although specific illustration is omitted inside the insertion portion 21, various signals including a light guide for transmitting the illumination light supplied from the light source device 6 and a signal line (signal line 81) described later are included. A plurality of signal lines for transmitting the light source are routed, and an insertion passage for the treatment tool for inserting the treatment tool is formed. The bending portion 212 is capable of bending the longitudinal axis of the tip portion 211 in at least two directions different from each other.

The ultrasonic vibrator 7 is a convex type in which a plurality of piezoelectric elements are provided in an array, the piezoelectric elements involved in transmission / reception are electronically switched, and the transmission / reception of each piezoelectric element is delayed to electronically scan. It is an ultrasonic transducer of. The ultrasonic vibrator 7 irradiates an observation target with ultrasonic waves by vibrating the piezoelectric element due to the input of a pulse signal. Further, the ultrasonic waves reflected from the observation target are transmitted to the piezoelectric element. The piezoelectric element vibrates due to ultrasonic waves, and the piezoelectric element converts the vibration into an electrical echo signal and outputs the vibration to the ultrasonic observation device 3.

The operation unit 22 is connected to the base end side of the insertion unit 21 and is a part that receives various operations from users such as doctors. The operation unit 22 includes a bending knob 221 for performing a bending operation on the bending portion 212, and a plurality of operating members 222 for performing various operations. Further, the operation unit 22 is formed with a treatment tool insertion port 223 that communicates with the treatment tool insertion passage and inserts the treatment tool into the treatment tool insertion passage.

The universal cord 23 is a cable extending from the operation unit 22 and having a plurality of signal cables for transmitting various signals, an optical fiber for transmitting illumination light supplied from the light source device 6, and the like.

The connector 24 is provided at the tip of the universal cord 23. The connector 24 includes first to third connector portions 241 to 243 to which the external ultrasonic signal cable 31, the video cable 41, and the optical fiber cable 61 are connected, respectively.

The ultrasonic observation device 3 is electrically connected to the ultrasonic endoscope 2 via an external ultrasonic signal cable 31, and outputs a pulse signal to the ultrasonic endoscope 2 via an external ultrasonic signal cable 31. At the same time, an echo signal is input from the ultrasonic endoscope 2. Then, the ultrasonic observation device 3 performs a predetermined process on the echo signal to generate ultrasonic image data.

The endoscope observation device 4 is electrically connected to the ultrasonic endoscope 2 via a video cable 41, and inputs an image signal from the ultrasonic endoscope 2 via the video cable 41. Then, the endoscope observation device 4 performs a predetermined process on the image signal to generate endoscopic image data.

The display device 5 is configured by using a liquid crystal display or an organic EL (Electro Luminescence), a projector, a CRT (Cathode Ray Tube), or the like, and an ultrasonic image generated by the ultrasonic observation device 3 or an endoscopic observation device 4 Display the endoscopic image etc. generated in.

The light source device 6 is connected to the ultrasonic endoscope 2 via the optical fiber cable 61, and supplies the illumination light for illuminating the inside of the subject via the optical fiber cable 61 to the ultrasonic endoscope 2.

FIG. 2 is a perspective view schematically showing the tip configuration of the insertion portion 21 of the ultrasonic endoscope 2 according to the first embodiment. As shown in FIG. 2, the tip portion 211 includes an ultrasonic vibrator module 214 holding the ultrasonic vibrator 7, an objective lens 215a that forms a part of an imaging optical system and captures light from the outside, and an imaging element. It also includes an endoscope module 215 having an illumination lens 215b that collects illumination light and emits it to the outside. The endoscope module 215 is formed with a treatment tool protrusion 215c that communicates with the treatment tool insertion passage formed in the insertion portion 21 and projects the treatment tool from the tip of the insertion portion 21. In the insertion passage for the treatment tool, the vicinity of the end connected to the treatment tool protrusion 215c is inclined with respect to the longitudinal axis of the insertion portion 21, and the treatment tool protrudes from the treatment tool protrusion 215c in the direction inclined with respect to the longitudinal axis. It is provided to do so. The longitudinal axis referred to here is an axis along the longitudinal direction of the insertion portion 21. In the curved portion 212 and the flexible tube portion 213, the axial direction changes depending on each position, but in the rigid tip portion 211, the longitudinal axis is an axis forming a constant straight line.

Subsequently, the internal configuration (signal transmission cable unit) in the tip portion 211 of the insertion portion 21 will be described with reference to FIGS. 3 and 4. 3 and 4 are perspective views schematically showing the internal configuration of the tip portion 211 in the ultrasonic endoscope according to the first embodiment. The ultrasonic oscillator module 214 forms a part of a path for electrically connecting the ultrasonic oscillator 7, the ultrasonic oscillator 7 (ultrasonic oscillator module 214), and the ultrasonic observation device 3, and is super. A relay board 9 for relaying an electrical connection between the sound wave oscillator 7 and the internal ultrasonic signal cable 8 is provided. The signal transmission wiring connection unit according to the present invention is composed of an ultrasonic vibrator 7 corresponding to an element, an internal ultrasonic signal cable 8, and a relay board 9.

The ultrasonic oscillator 7 is connected to the internal ultrasonic signal cable 8 via the relay board 9. The internal ultrasonic signal cable 8 is electrically connected to the external ultrasonic signal cable 31. The internal ultrasonic signal cable 8 has a plurality of signal lines 81. Each signal line 81 is electrically connected to the corresponding piezoelectric element via the relay board 9. Although the simplified configuration is shown in FIG. 3 for the sake of explanation, the actual coaxial line is provided according to the number of piezoelectric elements.

FIG. 5 is a diagram illustrating the configuration of the ultrasonic oscillator shown in FIGS. 3 and 4. The ultrasonic vibrator 7 is provided with a plurality of piezoelectric elements 71 having a prismatic shape and being arranged so as to be aligned in the longitudinal direction. Each piezoelectric element 71 is connected to a relay board 9 (first board 91 described later). Further, the ultrasonic vibrator 7 is provided with an acoustic matching layer, an acoustic lens, and a backing material provided on the outer surface side of the ultrasonic vibrator 7.

The relay board 9 is connected to the ultrasonic vibrator 7, and the first board 91 extending from the ultrasonic vibrator 7 and one end thereof are connected to the first board 91, and the other end is connected to the internal ultrasonic signal cable 8. It has a second substrate 92 to be connected. The first substrate 91 and the second substrate 92 are configured by using flexible printed circuits (FPCs), and can be deformed according to an external load. Hereinafter, the surface having the largest area in each of the first substrate 91 and the second substrate 92 is referred to as a “main surface”.
The signal transmission wiring connection unit is configured by using at least the first board 91, the second board 92, and the internal ultrasonic signal cable 8.

The first substrate 91 and the second substrate 92 are formed by providing a wiring pattern on a substrate formed by using polyimide. Each of the first substrate 91 and the second substrate 92 is configured by laminating, for example, a plurality of base materials. A predetermined wiring pattern is formed in each layer. Further, a coverlay, which will be described later, is provided on the surface of the outermost layer of the base material.

Next, the connection between the relay board 9 and the signal line 81 at the time of manufacturing the ultrasonic endoscope 2 will be described with reference to FIGS. 6 to 9. FIG. 6 is a diagram (signal line connection step 1-1) for explaining the connection between the substrate and the signal line at the time of manufacturing the ultrasonic endoscope 2 according to the first embodiment of the present invention. In FIGS. 6 to 8 below, the signal line 81 and the electrodes on the substrate are omitted.

First, the first substrate 91 and the second substrate 92 will be described.
On the first surface P ₁₁ of the first substrate 91, a piezoelectric element connection terminal portion 911 in which an electrode for outputting an electric signal of the corresponding connection terminal of the second substrate 92 is arranged is formed. The first substrate 91 is also electrically connected to each piezoelectric element of the ultrasonic vibrator 7.

The second substrate 92 extends in a band shape, and among the plurality of signal lines 81 of the internal ultrasonic signal cable 8, a plurality of first connection terminals 921a connected to some of the signal lines 81 are arranged. A portion 1 (first connection terminal portion) 921 and a second portion (second connection terminal portion) 922 in which a plurality of first connection terminals 922a connected to the remaining signal lines 81 are arranged. ). Further, the second substrate 92 has an L-shaped shape in which another connection terminal portion extends from the first portion 921 in a direction orthogonal to the direction in which the second portion 922 extends. Specifically, the second board 92 has a third portion (third connection terminal portion) 923 in which a plurality of second connection terminals 923a connected to the first board 91 are arranged, and a first portion 921. It has a first bent portion 924 provided between the second portion 922 and the second portion 922. Further, the second substrate 92 is provided between the first portion 921 and the third portion 923 and has a second bent portion 925 including a bent position.

On one surface (first surface P ₂₁ ) of the main surface of the first portion 921, a plurality of first connection terminals 921a connected to some signal lines of each signal line 81 are formed. Will be done. A plurality of first connection terminals 922a connected to the remaining signal lines of each signal line 81 are formed on the first surface P ₂₁ of the second portion 922. The first connection terminals 921a and 922a are connected to signal lines 81 different from each other.
On the first surface P ₂₁ of the third portion 923, a plurality of second connection terminals 923a connected to each electrode (piezoelectric element connection terminal portion 911) formed on the first substrate 91 are formed.
The first surface P ₂₁ corresponds to the surface of the second substrate 92 (first portion 921, second portion 922, and third portion 923).

Coverlays 910 and 920 are provided on the first substrate 91 and the second substrate 92, respectively.
The coverlay 910 covers the surface of the first substrate 91 other than the piezoelectric element connection terminal portion 911 forming region.
The coverlay 920 has a surface other than a part of the first connection terminal 921a and 922a forming region, the second connection terminal 923a forming region, the first bent portion 924, and the second bent portion 925 of the second substrate 92. Covering.
The coverlays 910 and 920 protect the wiring pattern formed on the substrate by covering the surface of each substrate.

The first bent portion 924 is bent so that the back surface of the first portion 921 and the back surface of the second portion 922 (here, the second surface P ₂₂ ) are close to each other. Since the coverlay 920 is not provided in the first bent portion 924, the thickness of the first bent portion 924 is thinner than that of the other portions. The first bent portion 924 is easier to bend than the first portion 921 and the second portion 922 due to the difference in the thickness thereof.

The second bent portion 925 can be bent so that the surface of the first portion 921 and the surface of the third portion 923 (here, the first surface P ₂₁ ) are close to each other. A notch 925a is formed in the second bent portion 925, and a through hole 925b is formed in the periphery thereof. The cut portion 925a is formed at both ends of the outer shape of the second bent portion 925, for example. In the first embodiment, the through hole 925b has a ground pattern formed on the inner substrate of the substrate constituting the second substrate 92 mainly for the purpose of shielding, and the first connection terminal. It is electrically connected to the ground pattern formed on the substrate on which 921a or the like is formed. The second bent portion 925 has a configuration in which the bent position can be identified by forming the cut portion 925a. Further, in the second bent portion 925, the region (region 925c) excluding the cut portion 925a and the portion between which the cover ray 920 is not provided is relatively harder than the other portions, and is difficult to bend. In the second bent portion 925, if the bent position is the easiest to bend, such as by partially changing the thickness, the configuration may not have the notch portion 925a, or the configuration may be covered with the coverlay 920. good.

Next, the connection between the relay board 9 and the signal line 81 will be described. First, in a state where the first bent portion 924 is not bent, that is, in a state where the main surfaces of the first portion 921 and the second portion 922 do not face each other, the first signal line 81 corresponds to the first. Connect to connection terminals 921a and 922a, respectively (see FIG. 6: signal line connection step). The signal line 81 is connected to the first connection terminals 921a and 922a, respectively, by a joining process involving heat treatment such as soldering. At this time, in FIG. 6, the second bent portion 925 is also in a non-bent state.

FIG. 7 is a diagram (signal line connection step 1-2) illustrating the connection between the substrate and the signal line at the time of manufacturing the ultrasonic endoscope according to the first embodiment of the present invention. With the signal line 81 connected to the first connection terminals 921a and 922a, the first bent portion 924 is bent and the second portion 922 is folded back in the direction of arrow R1, that is, toward the first portion 921. .. After the second portion 922 is folded back, the second surface P ₂₂ which is the opposite surface of the first portion 921 and the second portion 922 and is the opposite surface of the first surface P ₂₁ is insulated from each other. It is fixed by an adhesive or the like (insulation layer forming step). The second surface P ₂₂ corresponds to the back surface of the second substrate 92.

FIG. 8 is a diagram (signal line connection step 1-3) for explaining the connection between the substrate and the signal line at the time of manufacturing the ultrasonic endoscope according to the first embodiment of the present invention. FIG. 9 is a plan view of the first portion 921 and the second portion 922 as viewed from the direction of arrow A shown in FIG. The first portion 921 is bent at the first bent portion 924, and the signal line 81 is arranged on one side of the second substrate 92 and the opposite side thereof. Further, an insulating layer 926 is provided between the second surface P ₂₂ of the first portion 921 and the second surface P ₂₂ of the second portion 922. The insulating layer 926 is made of an insulating adhesive and is formed so as to fix the second surface P ₂₂ of the first portion 921 and the second surface P ₂₂ of the second portion 922. Therefore, the first portion 921 and the second portion 922 are in a state of being insulated between the main surfaces.

Next, the connection between the first substrate 91 and the second substrate 92 at the time of manufacturing the ultrasonic endoscope 2 will be described with reference to FIGS. 10 and 11. FIG. 10 is a diagram (signal line connection step 1-4) for explaining the connection between the first substrate and the second substrate of the relay board at the time of manufacturing the ultrasonic endoscope according to the first embodiment of the present invention. be. The first substrate 91 and the second substrate 92 are electrically connected by joining the second connection terminal 923a of the third portion 923 to the piezoelectric element connection terminal portion 911 of the first substrate 91. The second connection terminal 923a is connected to the piezoelectric element connection terminal portion 911 by, for example, soldering or the like.

FIG. 11 is a diagram (signal line connection step 1-5) for explaining the connection between the first substrate and the second substrate of the relay board at the time of manufacturing the ultrasonic endoscope according to the first embodiment of the present invention. be. The second substrate 92 shown in FIG. 11 is the second substrate 92 shown in FIG. 10 turned upside down. In a state where the second connection terminal 923a is electrically connected to the piezoelectric element connection terminal portion 911, the end portion of the first substrate 91 on the ultrasonic transducer 7 side is bent in the direction of arrow R2 and the second bending is performed. By bending the portion 925 in the direction of the arrow R3, the internal configuration shown in FIGS. 3 and 4 can be obtained.

The internal configuration of the tip portion 211 (see FIG. 3) according to the first embodiment is such that the first substrate 91 and the second substrate 92 made of flexible substrates are bent to save space and the second substrate. By arranging the first connection terminal 921a connected to the signal line 81 on one side of the 92 and on the opposite side thereof, the relay board 9 is made thinner. In the second substrate 92, electrodes are arranged on the front surface and the back surface of the substrate and are connected to the signal line 81, respectively.

In the first embodiment described above, the first substrate 91 and the second substrate 92 made of flexible substrates are bent at the tip portion 211 to save space. Further, in the first embodiment, the first bent portion 924 of the second substrate 92 is bent, the first portion 921 is arranged on one side of the second substrate 92, and the second portion 922 is arranged on the opposite side. Then, as the whole of the second board 92 after bending, the relay board 9 is made thinner by arranging the first connection terminals 921a connected to the signal line 81 on both sides of the second board 92. According to the first embodiment, the unit for connecting the members (here, the ultrasonic vibrator 7, the internal ultrasonic signal cable 8 and the relay board 9) can be miniaturized with a simple configuration.

Further, in the first embodiment, when the signal lines 81 are connected to the first connection terminals 921a and 922a, the first bent portions 924 are expanded without being bent, and the respective signal lines 81 are corresponding to each other. It is joined to the connection terminals 921a and 922a of No. 1, respectively. In the state where the first bent portion 924 is expanded, the first connection terminals 921a and 922a do not face each other, and the distance between the first connection terminals is secured. It is possible to suppress disconnection due to heat generated at the time of joining the signal line 81 of.

(Modified Example of Embodiment 1)
Next, a modified example of the first embodiment will be described with reference to FIG. FIG. 12 is a plan view illustrating the configuration of the second substrate 92A of the ultrasonic endoscope according to the modified example of the first embodiment of the present invention. FIG. 12 corresponds to the plan view seen from the arrow A direction shown in FIG. The endoscope system according to this modification has the same configuration except that the configuration of the relay board of the endoscope system 1 described above is changed. In this modification, the configuration of the second substrate 92 is different in the relay board 9 of the first embodiment described above. Hereinafter, a configuration different from the above-described first embodiment will be described.

The second substrate 92 according to this modification is provided with a wiring pattern on a substrate formed by using polyimide. Further, a ground pattern 927 is provided on the side (second surface P ₂₂ ) opposite to the side where the first connection terminals ( first connection terminals 921a and 922a) are arranged. The insulating layer 926 fixes the second surface P ₂₂ of the second portion 922 to the second surface P ₂₂ of the first portion 921 via the ground pattern 927. The ground pattern 927 is connected to an external ground via wiring (not shown).

Also in the modification described above, the unit for connecting the members can be miniaturized with a simple configuration as in the first embodiment.

(Embodiment 2)
13 and 14 are perspective views schematically showing the internal configuration of the tip portion 211 in the ultrasonic endoscope according to the second embodiment of the present invention. The endoscope system according to the second embodiment has the same configuration except that the relay board of the endoscope system 1 described above is changed. In the second embodiment, the relay board 9A is provided in place of the relay board 9 of the first embodiment described above. Hereinafter, a configuration (relay board 9A) different from that of the first embodiment described above will be described.

The relay board 9A is connected to the ultrasonic vibrator 7, and the first board 91A extending from the ultrasonic vibrator 7 and one end connected to the first board 91 and the other end connected to the ultrasonic cable 8. It has a second substrate 92A to be used. The first substrate 91A and the second substrate 92A are configured by using a flexible substrate (FPC) and can be deformed according to an external load.

The first substrate 91A and the second substrate 92A are formed by providing a wiring pattern on a substrate formed by using polyimide. Further, on one surface (first surface P ₃₁ ) of the main surface of the first substrate 91A, a plurality of electrodes (piezoelectric element connection terminal portion 913a shown in FIG. 15) connected to the corresponding electrodes of the second substrate 92 are connected. , 914a) are provided.

Next, the connection between the relay board 9 and the signal line 81 at the time of manufacturing the ultrasonic endoscope 2 will be described with reference to FIGS. 15 to 17. FIG. 15 is a diagram (signal line connection step 2-1) for explaining the connection between the substrate and the signal line at the time of manufacturing the ultrasonic endoscope according to the second embodiment of the present invention. In the following FIGS. 15 to 17, the signal line 81 and the electrodes on the substrate are omitted.

First, the first substrate 91A and the second substrate 92A will be described.
The first substrate 91A is electrically connected to each piezoelectric element of the ultrasonic vibrator 7, and has a main body portion 912 extending from the ultrasonic vibrator 7 and two extending portions (first) extending from the main body portion 912. It includes an extending portion 913 and a second extending portion 914). A plurality of piezoelectric element connection terminal portions 913a, 914a in which electrodes connecting to the corresponding connection terminals of the second substrate 92A are arranged on the first surface P ₃₁ side of the first extending portion 913 and the second extending portion 914. Are formed respectively.

The second substrate 92A has the above-mentioned first portion 921, second portion 922, and first bent portion 924. Further, the second substrate 92A extends from the first portion 921 in a direction orthogonal to the direction in which the second portion 922 extends, and is connected to the first substrate 91A from the third portion 928 and the second portion 922. , A fourth portion (fourth connection terminal portion) 929 extending in a direction orthogonal to the extending direction of the first portion 921 and connecting to the first substrate 91A. Further, the second substrate 92A has a second bent portion 931 connecting the first portion 921 and the third portion 928, and a third bent portion connecting the second portion 922 and the fourth portion 929. It has a part 932. The first portion 921, the second portion 922, and the first bent portion 924 are the same as those in the first embodiment.

A plurality of first connection terminals 921a connected to each signal line 81 are formed on one surface (first surface P ₄₁ ) of the main surfaces of the first portion 921. A plurality of first connection terminals 922a connected to each signal line 81 are formed on the first surface P ₄₁ of the second portion 922.
On the first surface P ₄₁ of the third portion 928, a plurality of second connection terminals 928a connected to each piezoelectric element connection terminal portion 913a formed on the first substrate 91A are formed. On the first surface P ₄₁ of the fourth portion 929, a plurality of second connection terminals 929a connected to each piezoelectric element connection terminal portion 914a formed on the first substrate 91A are formed.

The second bent portion 931 can be bent so that the surface of the first portion 921 and the surface of the third portion 928 (here, the first surface P ₄₁ ) are close to each other. Further, the third bent portion 932 can be bent so that the surface of the second portion 922 and the surface of the fourth portion 929 are close to each other. The second bent portion 931 and the third bent portion 932 may have a wiring layout that does not require the coverlay 920A, and may be partially thinned to form a bent position. Further, a cut portion may be formed in each bent portion to form a bent position.

Coverlays 910A and 920A are provided on the first substrate 91A and the second substrate 92A, respectively.
The coverlay 910A covers the surface of the first substrate 91A other than the piezoelectric element connection terminal portions 913a and 914a forming regions.
The coverlay 920A covers the surface of the second substrate 92A other than the first connection terminal 921a and 922a forming region, the second connection terminal 928a and 929a forming region, and the first bent portion 924.
The coverlays 910A and 920A protect the wiring pattern formed on the substrate by covering the surface of each substrate.

Next, the connection between the relay board 9A and the signal line 81 will be described. First, in a state where the first bent portion 924 is not bent, that is, in a state where the main surface of the first portion 921 is not bent, each signal line 81 is connected to the corresponding first connection terminal 921a. (See FIG. 13: signal line connection step). The signal line 81 is connected to the first connection terminal 921a by a joining process involving heat treatment such as soldering.

FIG. 16 is a diagram (signal line connection step 2-2) for explaining the connection between the substrate and the signal line at the time of manufacturing the ultrasonic endoscope according to the second embodiment of the present invention. With the signal line 81 connected to the first connection terminal 921a, the first bent portion 924 is bent in the direction of arrow R4, and the second portion 922 is folded back toward the first portion 921. At this time, the fourth portion 929 is folded back toward the third portion 928. After folding back, the second surface P ₄₂ , which is the opposite surface of the first portion 921 and the second portion 922 and is the opposite surface of the first surface P ₄₁ , is fixed to each other by an insulating adhesive or the like ( Insulation layer formation step).

FIG. 17 is a diagram (signal line connection step 2-3) for explaining the connection between the substrate and the signal line at the time of manufacturing the ultrasonic endoscope according to the second embodiment of the present invention. FIG. 18 shows a second portion by bending the first portion 921 and the second portion 922 at the first bent portion 924, which is a plan view of the first portion 921 and the second portion 922 as viewed from the direction of arrow B shown in FIG. The signal line 81 is connected to one of the boards 92A and the other side of the board 92A. Further, an insulating layer 926 formed of an insulating adhesive is provided between the second surface P ₄₂ of the first portion 921 and the second surface P ₄₂ of the second portion 922 (insulating layer). Formation step). Therefore, the first portion 921 and the second portion 922 are in a state of being insulated between the main surfaces. In this state, the third portion 928 and the fourth portion 929 are in a state of being bent opposite to each other with the second bent portion 931 and the third bent portion 932 as the base points, respectively.

Next, the connection between the first substrate 91A and the second substrate 92A at the time of manufacturing the ultrasonic endoscope 2 will be described with reference to FIGS. 19 and 20. FIG. 19 is a diagram (signal line connection step 2-4) for explaining the connection between the first substrate and the second substrate of the relay board at the time of manufacturing the ultrasonic endoscope according to the second embodiment of the present invention. be. In FIGS. 19 and 20, the surface to which the first substrate 91A of the ultrasonic transducer 7 is connected is defined as the surface S, and the virtual surface passing through the surfaces of the third portion 928 and the fourth portion 929 is defined as the virtual surface L. .. The first substrate 91A and the second substrate 92A have a second connection terminal 928a of the third portion 928, a second connection terminal 929a of the fourth portion 929, and a piezoelectric element connection terminal portion 913a of the first substrate 91A. , 914a are connected by joining. The second connection terminals 928a and 929a are connected to the piezoelectric element connection terminal portions 913a and 914a by, for example, soldering or the like. At this time, the third portion 928 and the fourth portion 929 are joined to the first substrate 91A in a state of being bent to the opposite sides from the second bent portion 931 and the third bent portion 932, respectively. .. After connecting the first substrate 91A and the second substrate 92A, the first substrate 91A is bent in the direction of the arrow R5.

FIG. 20 is a diagram (signal line connection step 2-5) illustrating the connection between the first substrate and the second substrate of the relay board at the time of manufacturing the ultrasonic endoscope according to the second embodiment of the present invention. be. In a state where the second connection terminal 923a is connected to the piezoelectric element connection terminal portion 911, the end portion of the first substrate 91A on the ultrasonic transducer 7 side is bent in the direction of the arrow R6 to be shown in FIGS. 13 and 14. The internal configuration shown is obtained. In the internal configuration shown in FIGS. 13 and 14, the surface S and the virtual surface L are parallel to each other.

Here, the formation range d ₁ of the first bent portion 924 will be described. This formation range d ₁ corresponds to the distance between the third portion 928 and the fourth portion 929. The first bent portion 924 has a curved shape due to the rigidity of the substrate when bent (see, for example, FIG. 15). The formation range d ₁ is set to, for example, a length at which the first bent portion 924 does not interfere with the member provided inside the tip portion 211 when the first bent portion 924 is bent.

In the second embodiment described above, in the tip portion 211, the first substrate 91A and the second substrate 92A made of a flexible substrate are bent to save space, and the first bent portion of the second substrate 92A is bent. The 924 is bent and the first portion 921 is arranged on one side of the second substrate 92A, and the second portion 922 is arranged on the opposite side thereof. By arranging the first connection terminal 921a connected to the signal line 81 on both sides, the relay board 9A is made thinner. According to the second embodiment, the unit for connecting the members (here, the ultrasonic oscillator 7, the internal ultrasonic signal cable 8 and the relay board 9A) can be miniaturized with a simple configuration.

Further, in the second embodiment, when the signal lines 81 are connected to the first connection terminals 921a and 922a, each signal line 81 is corresponded to the first in a state where the first bent portion 924 is expanded without being bent. It is joined to the connection terminals 921a and 922a, respectively. In the state where the first bent portion 924 is expanded, the first connection terminals 921a and 922a do not face each other, and the distance between the first connection terminals is secured. It is possible to suppress disconnection due to heat generated at the time of joining the signal line 81 of.

(Modified Example of Embodiment 2)
Next, a modification of the second embodiment will be described with reference to FIGS. 21 and 22. The endoscope system according to this modification has the same configuration except that the configuration of the relay board of the endoscope system 1 described above is changed. In this modification, in the relay board 9A of the second embodiment described above, the signal line 81 is joined to the first connection terminal 921a, and then the first bent portion 924 is cut off. Hereinafter, a configuration different from the above-described first embodiment will be described.

FIG. 21 is a diagram (signal line connection step 3-1) for explaining the connection between the substrate and the signal line at the time of manufacturing the ultrasonic endoscope according to the modified example of the second embodiment of the present invention. In this modification, the first bent portion 924 is cut off (removal step) in a state where the signal line 81 is connected to the first connection terminal 921a (see FIG. 16). After excision of the first bent portion 924, the second portion 922 is turned in the direction of the arrow R7, and the second surface P ₄₂ of the divided first portion 921 and the second portion 922 is separated from each other by the insulating layer 926. (See FIG. 18) to fix. The second portion 922 may be fixed to the first portion 921 by the insulating layer 926, and then the first bent portion 924 may be cut off.

FIG. 22 is a diagram (signal line connection step 3-2) for explaining the connection between the substrate and the signal line at the time of manufacturing the ultrasonic endoscope according to the modified example of the second embodiment of the present invention. By fixing the second surface P ₄ of the divided first portion 921 and the second surface P ₄₂ of the second portion 922, the first portion 921 is exposed on one of the second substrate 92A. The second portion 922 is exposed on the opposite side, and the signal line 81 is connected to each first connection terminal. In this state, the third portion 928 and the fourth portion 929 are in a state of being bent opposite to each other with the second bent portion 931 and the third bent portion 932 as the base points, respectively.

After that, the second substrate 92A is connected to the first substrate 91A in the same manner as in the second embodiment. Also in this modification, the same effect as that of the second embodiment described above can be obtained. Further, in this modification, since the first bent portion 924 does not exist as the second substrate 92A in a curved state, the relay board 9A can be further miniaturized.

It should be noted that, by applying the above-mentioned modification to the above-mentioned first embodiment, the first bent portion 924 of the second substrate 92 can be cut off.

Although the embodiments for carrying out the present invention have been described so far, the present invention should not be limited only to the above-described embodiments and modifications. The present invention is not limited to the embodiments and modifications described above, and may include various embodiments within the scope of the technical ideas described in the claims. Further, the configurations of the embodiments and the modifications may be appropriately combined.

In the above-described first and second embodiments, the configuration in which the relay board is composed of the first substrate and the second substrate has been described as an example, but the relay board is composed of a single substrate in which the first substrate and the second substrate are integrated. It may be done.

Further, in the above-described first and second embodiments, the configuration in which the relay board is connected to the ultrasonic vibrator 7 has been described as an example, but the configuration may be such that the relay board is connected to an element different from the ultrasonic vibrator. FIG. 23 is a diagram schematically showing an internal configuration of a tip portion in an ultrasonic endoscope according to another embodiment of the present invention. For example, the relay board 9 is configured to relay signal transmission between the image pickup element 10 and a cable (internal ultrasonic signal cable 8) which is composed of a plurality of signal lines and transmits an electric signal generated by the image pickup element 10. Also, the above-mentioned effects can be obtained. At this time, the relay board 9 and the image pickup device 10 are electrically connected by, for example, a transmission member 12 made of a wire, a flexible board, or the like.

Further, in the above-described first and second embodiments, a piezoelectric element has been described as an example for emitting ultrasonic waves and converting ultrasonic waves incident from the outside into echo signals, but the present invention is not limited to MEMS. Elements manufactured using (Micro Electro Mechanical Systems), for example, C-MUT (Capacitive Micromachined Ultrasonic Transducers) or P-MUT (Piezoelectric Micromachined Ultrasonic Transducers) may be used.

Further, as an ultrasonic endoscope, it may be applied to a small-diameter ultrasonic probe that does not have an optical system and mechanically rotates and scans an oscillator. Ultrasound probes are usually inserted into the biliary tract, bile duct, pancreatic duct, trachea, bronchi, urethra, ureter and used to observe surrounding organs (pancreas, lung, prostate, bladder, lymph nodes, etc.).

The ultrasonic oscillator may be a linear oscillator, a radial oscillator, or a convex oscillator. When the ultrasonic oscillator is a linear oscillator, its scanning area is rectangular (rectangular, square), and when the ultrasonic oscillator is a radial oscillator or convex oscillator, its scanning area is fan-shaped or annular. Oscillator. Further, the ultrasonic endoscope may be one that mechanically scans the ultrasonic vibrator, or a plurality of elements are provided in an array as the ultrasonic vibrator, and the elements involved in transmission / reception are electronically switched. Alternatively, it may be electronically scanned by delaying the transmission and reception of each element.

Further, as an ultrasonic endoscope, an extracorporeal ultrasonic probe that irradiates ultrasonic waves from the body surface of the subject may be applied. Extracorporeal ultrasound probes are typically used to observe abdominal organs (liver, gallbladder, bladder), breasts (particularly the mammary glands), and thyroid glands.

In the above-described first and second embodiments, an ultrasonic endoscope provided with an ultrasonic transducer at the tip has been described as an example, but an endoscope having no ultrasonic transducer, for example, an endoscope module It can also be applied to an endoscope equipped with only 215 at the tip. In the case of an endoscope, it is possible to apply the configurations of the above-described first and second embodiments in a configuration including a relay board connected to the image pickup device and a cable extending from the relay board to the connector.

Further, in the above-described first and second embodiments, the ultrasonic endoscope in which the insertion portion 21 is provided with the flexible tube portion 213 has been described as an example, but a hard tube portion is used instead of the flexible tube portion 213. It is possible to apply even an endoscope having an insertion portion, that is, a rigid endoscope.

As described above, the method for manufacturing the signal transmission wiring connection unit, the endoscope, the signal transmission wiring connection unit, and the ultrasonic vibrator module according to the present invention are useful for miniaturizing the connection between the members of the element unit with a simple configuration. Is.

1 Endoscope system 2 Ultrasonic endoscope 3 Ultrasonic observation device 4 Endoscope observation device 5 Display device 6 Light source device 7 Ultrasonic oscillator 8 Internal ultrasonic signal cable 9, 9A Relay board 10 Imaging element 21 Insertion part 22 Operation part 23 Universal cord 24 Connector 31 External ultrasonic signal cable 41 Video cable 61 Optical fiber cable 211 Tip part 212 Curved part 213 Flexible tube part 214 Ultrasonic oscillator module 215 Endoscope module 91, 91A 1st board 92 , 92A 2nd board 911, 913a, 914a Hydraulic element connection terminal part 912 Main body part 913 1st extension part 914 2nd extension part 921 1st part (1st connection terminal part)
921a, 922a First connection terminal 922 Second part (second connection terminal part)
923, 928 Third part (third connection terminal part)
923a, 928a, 929a Second connection terminal 924 First bending part 925, 931 Second bending part 926 Insulation layer 927 Ground pattern 929 Fourth part (fourth connection terminal part)
932 Third bent part

Claims (17)

1. A first substrate having a first connection terminal portion in which an electrode, which is a connection terminal for outputting an electric signal from an element for generating image data, is arranged, and a first substrate.
   A cable having a plurality of signal lines for transmitting the electric signal,
   The first connection terminal provided between the two first connection terminals connected to the plurality of signal lines, the second connection terminal electrically connected to the first board, and the two first connection terminals. A second substrate having a bent portion of the above and a second bent portion provided between the first connection terminal and the second connection terminal.
   An insulating layer provided between the surfaces of the second substrate facing each other in a state where the first and second bent portions are bent, and
   A signal transmission wiring connection unit.
2. The second substrate is
   It has a front surface and a back surface, and
   A first portion in which a first connection terminal for connecting to a part of the plurality of signal lines is arranged on the surface, and
   A second portion in which the first connection terminal for connecting to the remaining signal lines of the plurality of signal lines is arranged on the surface, and
   The signal transmission wiring connection unit according to claim 1.
3. The first bent portion is provided between the first portion and the second portion, and is bent so that the back surface of the first portion and the back surface of the second portion approach each other.
   The signal transmission wiring connection unit according to claim 2.
4. The insulating layer is provided between the back surface of the first portion and the back surface of the second portion in a state where the first bent portion is bent.
   The signal transmission wiring connection unit according to claim 3.
5. The insulating layer is fixed between the back surface of the first portion and the back surface of the second portion in a state where the first bent portion is bent.
   The signal transmission wiring connection unit according to claim 4.
6. The second substrate further has a third portion in which the second connection terminal is arranged.
   The second bent portion is provided between the first portion and the third portion, and is bent so that the first portion and the third portion approach each other.
   The signal transmission wiring connection unit according to claim 3.
7. A coverlay that covers at least the second bent portion on the surface of the second substrate.
   2. The signal transmission wiring connection unit according to claim 2.
8. The first bent portion is thinner than the other portions.
   The signal transmission wiring connection unit according to claim 7.
9. A notch is formed in the second bent portion.
   The signal transmission wiring connection unit according to claim 7.
10. The element is an ultrasonic transducer for generating image data based on ultrasonic waves.
    The signal transmission wiring connection unit according to claim 1.
11. The element is an image pickup element for generating image data based on an optical image.
    The signal transmission wiring connection unit according to claim 1.
12. The second bent portion is bent so that the first portion and the third portion are close to each other.
    The signal transmission wiring connection unit according to claim 6.
13. An insertion unit that accommodates the signal transmission wiring connection unit according to claim 1.
    Endoscope equipped with.
14. Corresponds to a plurality of first and second connection terminals respectively arranged on the surface of the first and second connection terminal portions in a substrate electrically connected to a plurality of elements for generating image data. The signal line connection step that connects each signal line, and
    An insulating layer forming step of forming an insulating layer for fixing the back surface of the second connection terminal portion to the back surface of the first connection terminal portion after connecting the signal line to the first connection terminal.
    Manufacturing method of signal transmission wiring connection unit including.
15. In the insulating layer forming step, the back surface of the first and second connection terminal portions is formed by bending the first bent portion provided between the first connection terminal portion and the second connection terminal portion. After facing each other, the back surface of the second connection terminal portion is fixed to the back surface of the first connection terminal portion to form the insulating layer.
    The removal step of removing the first bent portion,
    14. The method of manufacturing a signal transmission wiring connection unit according to claim 14.
16. A first substrate having a first connection terminal portion in which an electrode, which is a connection terminal for outputting an electric signal from an element for generating image data, is arranged, and a first substrate.
    A cable having a plurality of signal lines for transmitting the electric signal,
    The first connection terminal provided between the two first connection terminals connected to the plurality of signal lines, the second connection terminal electrically connected to the first board, and the two first connection terminals. A second substrate having a bent portion of the above and a second bent portion provided between the first connection terminal and the second connection terminal.
    An insulating layer provided between the surfaces of the second substrate facing each other in a state where the first and second bent portions are bent, and
    Ultrasonic oscillator module equipped with.
17. A first substrate having a first connection terminal portion in which an electrode, which is a connection terminal for outputting an electric signal from an element for generating image data, is arranged, and a first substrate.
    A cable having a plurality of signal lines for transmitting the electric signal,
    The first connection terminal portion to be connected to a part of the plurality of signal lines is connected to the first connection terminal portion arranged on the surface and the remaining signal lines of the plurality of signal lines. A second connection terminal portion in which the first connection terminal is arranged on the surface, a third connection terminal portion in which the second connection terminal electrically connected to the first board is arranged, and the first connection terminal portion. A first bent portion provided between the connection terminal portion and the second connection terminal portion and bent so that the back surface of the first connection terminal portion and the back surface of the second connection terminal portion approach each other. The second connection terminal portion is provided between the first connection terminal portion and the third connection terminal portion, and can be bent so that the first connection terminal portion and the third connection terminal portion are close to each other. A second substrate having a bent portion of, and
    An insulating layer for fixing between the back surface of the first connection terminal portion and the back surface of the second connection terminal portion in a state where the first bent portion is bent.
    A signal transmission wiring connection unit.

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