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WO2022063021A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2022063021A1
WO2022063021A1 PCT/CN2021/118742 CN2021118742W WO2022063021A1 WO 2022063021 A1 WO2022063021 A1 WO 2022063021A1 CN 2021118742 W CN2021118742 W CN 2021118742W WO 2022063021 A1 WO2022063021 A1 WO 2022063021A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
area
antenna module
camera
module
Prior art date
Application number
PCT/CN2021/118742
Other languages
English (en)
French (fr)
Inventor
王珅
王义金
韩永健
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2022063021A1 publication Critical patent/WO2022063021A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/52—Details of telephonic subscriber devices including functional features of a camera
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00—Reducing energy consumption in communication networks
    • Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks

Definitions

  • the present invention relates to the technical field of electronic devices, and in particular, to an electronic device.
  • the fifth generation mobile communication technology can provide higher communication speed, lower latency and more simultaneous connections than previous generation technologies.
  • millimeter-wave communication technology with a frequency band above 20GHz is one of the key technologies in 5G technology.
  • the millimeter-wave communication technology standard in 5G technology stipulates that the millimeter-wave antenna should have a gain above a certain level to compensate for various losses in the space link. This requires that the millimeter-wave antenna is in the form of an antenna array, and the phased array beamforming is realized by controlling the phase difference between the neutron antennas in the array, so that the synthesized beam has a high gain.
  • millimeter-wave antenna modules of electronic devices are often installed under components such as back shells that use insulator plates such as glass or ceramics, and the dielectric constant of these insulator materials is greater than that of air.
  • the wave impedance inside the plate is different from the wave impedance of the air.
  • reflected waves and refracted waves will appear due to the mismatch of wave impedance, which will lead to antenna mismatch and loss. If it increases, on the other hand, the electromagnetic wave radiation direction will be disordered, and the radiation performance of the millimeter wave antenna will be weakened.
  • the structure of the existing electronic device has a problem that affects the performance of the antenna.
  • the purpose of the present invention is to provide an electronic device to solve the problem that the structure of the electronic device affects the performance of the antenna in the prior art.
  • An embodiment of the present invention provides an electronic device, including:
  • the area cover is provided with a through hole
  • the camera module and the antenna module are both communicated with the outside through the through hole.
  • the antenna module in the setting area where the camera module is arranged, and both the camera module and the antenna module are communicated with the outside world through the through holes on the area cover matched with the setting area,
  • the performance of the antenna can be guaranteed to the greatest extent, and the influence of the shell plate of the electronic device on the performance of the antenna can be avoided; the problem that the structure of the electronic device affects the performance of the antenna in the prior art is well solved.
  • FIG. 1 is a schematic structural diagram 1 of an electronic device according to an embodiment of the present invention.
  • FIG. 2 is a second schematic structural diagram of an electronic device according to an embodiment of the present invention.
  • FIG. 3 is a third schematic structural diagram of an electronic device according to an embodiment of the present invention.
  • FIG. 4 is a fourth schematic structural diagram of an electronic device according to an embodiment of the present invention.
  • FIG. 5 is a fifth schematic structural diagram of an electronic device according to an embodiment of the present invention.
  • FIG. 6 is a sixth schematic structural diagram of an electronic device according to an embodiment of the present invention.
  • the present invention aims at the problem that the structure of the electronic device affects the performance of the antenna in the prior art, and provides a kind of electronic device A, as shown in Figure 1 to Figure 6, comprising:
  • the antenna module 3 arranged in the setting area 2 of the camera module 1;
  • the camera module 1 and the antenna module 3 are both communicated with the outside through the through hole 5 .
  • the antenna module is arranged in the setting area where the camera module is arranged, and the camera module and the antenna module are connected to the outside world through the through holes on the area cover matched with the setting area. Connected, the performance of the antenna can be guaranteed to the greatest extent, and the influence of the shell plate of the electronic device on the performance of the antenna can be avoided; the problem that the structure of the electronic device affects the performance of the antenna in the prior art is well solved.
  • the area where the antenna module 3 is located and the area where the camera module 1 is located do not overlap with each other.
  • the number of the camera modules 1 is at least two, and the at least two camera modules 1 and the antenna modules 3 are respectively arranged along the first direction.
  • the number of the camera modules 1 is at least two, and the area where the antenna module 3 is located is located between any two camera modules 1 .
  • the module layout can be made more compact and the internal space of the electronic device can be saved.
  • connection components between at least two camera modules 1 bypass or do not cover the antenna module 3 .
  • the electronic device further includes: a metal decorative ring 6 arranged in the setting area 2 ; wherein, the at least two camera modules 1 are both arranged on the metal decorative ring 6 inside, and is grounded through the metal decorative ring 6 ; the antenna module 3 is located on the metal decorative ring 6 and is grounded through the metal decorative ring 6 .
  • the electronic device further includes: a circuit board 7 electrically connected to the antenna module 3 .
  • the antenna module is provided on the circuit board (not shown in the figure); or, as shown in FIG. 3 and FIG. 6 , the circuit board 7 includes a vacant area 8 , and the antenna module 3 set in the vacant area 8 .
  • arranging the antenna module in the vacant area can further save the internal space of the electronic device and reduce the thickness of the electronic device.
  • the antenna of the antenna module 3 extends toward the direction close to the area cover 4 .
  • the antenna module may specifically be a millimeter-wave antenna module, but it is not limited thereto.
  • the antenna module takes a millimeter wave antenna module as an example.
  • Example 1 The overall structure of Example 1 is shown in Figure 1.
  • the structure of this example involves the housing cover of the electronic device (ie the electronic device cover), the camera area (ie the above-mentioned setting area 2), the camera area cover (ie the above-mentioned area cover 4), at least one camera module 1, At least one millimeter wave antenna module, a circuit board 7, and a connection line between each module and the circuit board.
  • FIG. 1 What is shown in FIG. 1 can also be understood as an external view of the electronic device, and the camera area is located at a certain position of the body of the electronic device.
  • FIG. 2 can also be understood as an internal view of the electronic device after the casing cover is removed.
  • a camera module 1 and a millimeter-wave antenna module are located in the camera area, and the two types of modules are placed side by side without overlapping each other.
  • the two types of modules can be connected to the circuit board of the electronic device through a flexible circuit board or other suitable means to transmit signals and feed power.
  • Other components of the electronic device may also be placed in the camera area, which is not limited herein.
  • 9 in FIG. 2 denotes a flexible circuit board and a connection port.
  • FIG. 3 can also be understood as a partial enlarged cross-sectional view of the camera area.
  • the camera module 1 and the millimeter-wave antenna module are placed and installed in the vacancy of the circuit board (ie, the above-mentioned vacant area 8 ), or placed and installed on the circuit board 7 .
  • the electronic device cover 10 in the camera area has a vacant part (refer to FIG. 3 , which is basically the same as the vacancy of the circuit board, that is, the vacant area 8 ), and the size of the vacant part can make the two types of modules directly above the module without cover. .
  • the vacant part is covered and filled with a camera area cover plate.
  • a decorative ring 11 may be connected between the camera area cover and the electronic device cover 10 to ensure sealing and appearance.
  • the lens 12 of the camera module 1 and the antenna 13 of the millimeter-wave antenna module face the camera area cover.
  • the camera area cover can be a non-metal or an insulator, and has a certain light transmittance in the area directly above the camera module.
  • 9 in FIG. 3 denotes a flexible circuit board and a connection port.
  • the degree of freedom in the selection of materials and structures can be increased according to the performance of the millimeter-wave antenna. Larger, easier to design to have as little impact on mmWave antenna performance as possible.
  • Example 2 The overall structure of Example 2 is shown in FIG. 4 , which can also be understood as an external view of an electronic device.
  • the difference between Example 2 and Example 1 is that the millimeter-wave antenna module is placed in the area between some modules of the plurality of camera modules.
  • FIG. 5 can also be understood as an internal view of the electronic device after the casing cover is removed.
  • the two types of modules can be connected to the circuit board of the electronic device through a flexible circuit board or other suitable means to transmit signals and feed power.
  • Other components of the electronic device may also be placed in the camera area, which is not limited herein.
  • 9 in FIG. 5 denotes a flexible circuit board and a connection port.
  • FIG. 6 can also be understood as a partial enlarged cross-sectional view of the camera area.
  • the camera module and the millimeter-wave antenna module are placed and installed in the vacancy of the circuit board (ie, the above-mentioned vacant area 8 ), or placed and installed on the circuit board 7 .
  • the coupling components between the plurality of camera modules 1 are bypassed (specifically, not passing through the area where the millimeter-wave antenna module is located), or not covered (specifically, not passing through the top of the millimeter-wave antenna module (ie, the millimeter-wave antenna module). between the antenna module and the area cover), can pass under the millimeter-wave antenna module without affecting the antenna performance) the millimeter-wave antenna module.
  • the electronic device cover 10 in the camera area has a vacant part (see FIG. 6 , which is basically the same as the vacancy of the circuit board, that is, the vacant area 8 ), and the size of the vacant part can make the two types of modules directly above the module without cover. .
  • the vacant part is covered and filled with a camera area cover plate.
  • a decorative ring 11 may be connected between the camera area cover and the electronic device cover 10 to ensure sealing and appearance.
  • the lens 12 of the camera module 1 and the antenna 13 of the millimeter-wave antenna module face the camera area cover.
  • the camera area cover can be a non-metal or an insulator, and has a certain light transmittance in the area directly above the camera module.
  • 9 in FIG. 6 denotes a flexible circuit board and a connection port.
  • the solution in this example can also make the design of the camera module and the millimeter-wave antenna module more compact, saving the internal space of the electronic device.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Studio Devices (AREA)

Abstract

本发明提供了一种电子设备，包括：摄像头模组；设置于所述摄像头模组的设置区域内的天线模组；与所述设置区域配合的区域盖板，所述区域盖板上设有通孔；其中，所述摄像头模组与天线模组均通过所述通孔与外界相连通。

Description

电子设备
相关申请的交叉引用
本申请主张在2020年9月22日在中国提交的中国专利申请号No.202011000499.8的优先权，其全部内容通过引用包含于此。
技术领域
本发明涉及电子设备技术领域，尤其涉及一种电子设备。
背景技术
第五代移动通信技术(5G)相比前代技术可提供更高通信速度、更低时延以及更多的同时连接数。其中，因为拥有非常宽的通信带宽，频段在20GHz以上的毫米波通信技术是5G技术中的关键技术之一。
由于毫米波在空间中的传播损耗以及反射损耗较大，5G技术中的毫米波通信技术标准规定毫米波天线应具有一定程度以上的增益以弥补空间链路中的各种损耗。这就要求毫米波天线是以天线阵列的形式，通过控制阵列中子天线间相位差实现相控阵波束赋形，使合成波束具有较高的增益。
具体的，手机等电子设备的毫米波天线模组经常被安装于使用玻璃或陶瓷等绝缘体板材的背壳等部件下方，而这些绝缘体材料的介电常数大于空气的介电常数，对毫米波这样的超高频电磁波来说，板材内部的波阻抗与空气的波阻抗有一定差异。这就导致安装于其下方的毫米波天线所发出的超高频电磁波穿过这些绝缘体板材时，会因波阻抗的失配造成出现反射波和折射波，这一方面会导致天线失配及损耗增大，另一方面会导致电磁波辐射方向紊乱，削弱了毫米波天线的辐射性能。另外，而当这些背壳或侧面边框被设计为金属时，其下部的毫米波天线所辐射的电磁波将被反射和损耗掉，因此毫米波天线模组不能被安装于金属板材外壳的下部，设计安装的空间在很大程度上受到了限制。
由上可知，现有的电子设备的结构存在影响天线性能的问题。
发明内容
本发明的目的在于提供一种电子设备，以解决现有技术中电子设备的结构影响天线性能的问题。
为了解决上述技术问题，本发明是这样实现的：
本发明实施例提供了一种电子设备，包括：
摄像头模组；
设置于所述摄像头模组的设置区域内的天线模组；
与所述设置区域配合的区域盖板，所述区域盖板上设有通孔；
其中，所述摄像头模组与天线模组均通过所述通孔与外界相连通。
在本发明实施例中，通过将天线模组设置在设置摄像头模组的设置区域内，且摄像头模组与天线模组均通过与设置区域配合的区域盖板上的通孔与外界相连通，可以最大程度地保证天线的性能，避免电子设备的外壳板材等对天线性能的影响；很好的解决了现有技术中电子设备的结构影响天线性能的问题。
附图说明
图1为本发明实施例的电子设备结构示意图一；
图2为本发明实施例的电子设备结构示意图二；
图3为本发明实施例的电子设备结构示意图三；
图4为本发明实施例的电子设备结构示意图四；
图5为本发明实施例的电子设备结构示意图五；
图6为本发明实施例的电子设备结构示意图六。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明针对现有的技术中电子设备的结构影响天线性能的问题，提供一 种电子设备A，如图1至图6所示，包括：
摄像头模组1；
设置于所述摄像头模组1的设置区域2内的天线模组3；
与所述设置区域2配合的区域盖板4，所述区域盖板4上设有通孔5；
其中，所述摄像头模组1与天线模组3均通过所述通孔5与外界相连通。
本发明实施例提供的所述电子设备通过将天线模组设置在设置摄像头模组的设置区域内，且摄像头模组与天线模组均通过与设置区域配合的区域盖板上的通孔与外界相连通，可以最大程度地保证天线的性能，避免电子设备的外壳板材等对天线性能的影响；很好的解决了现有技术中电子设备的结构影响天线性能的问题。
如图1至图3所示，所述天线模组3所处的区域和所述摄像头模组1所处的区域之间相互不重合。
这样可以更好的保证天线性能。
如图1至图3所示，所述摄像头模组1的数量为至少两个，且所述至少两个摄像头模组1和所述天线模组3分别沿第一方向排列。
这样可以便于布局安装。
如图4至图6所示，所述摄像头模组1的数量为至少两个，所述天线模组3所处的区域位于任意两个所述摄像头模组1之间。
这样可以使得模组布局更加紧凑，节省电子设备的内部空间。
如图4至图6所示，至少两个所述摄像头模组1之间的连接组件绕开或不覆盖所述天线模组3。
这样可以尽量避免对天线模组产生影响。
如图4至图5所示，所述的电子设备，还包括：设于所述设置区域2内的金属装饰圈6；其中，所述至少两个摄像头模组1均设于金属装饰圈6内，并通过所述金属装饰圈6接地；所述天线模组3位于所述金属装饰圈6上，并通过所述金属装饰圈6接地。
这样可以保证摄像头模组和天线模组分别正常实现功能。
如图2、图3、图5和图6所示，所述的电子设备，还包括：与所述天线模组3电连接的电路板7。
这样可以保证天线模组的正常工作。
具体的，所述天线模组设于所述电路板上(图中未示出)；或者，如图3和图6所示，所述电路板7包括空缺区域8，所述天线模组3设于所述空缺区域8内。
其中，将天线模组设于空缺区域内可以进一步节省电子设备的内部空间，并降低电子设备的厚度。
如图3和图6所示，所述天线模组3的天线朝向靠近所述区域盖板4的方向延伸。
这样可以尽量避免天线功能受影响。
本发明实施例中，所述天线模组具体可为毫米波天线模组，但并不以此为限。
下面对本发明实施例提供的电子设备进行进一步说明，天线模组以毫米波天线模组为例。
针对上述技术问题，为了解决手机等电子设备的外壳板材对其下方的毫米波天线性能影响的问题，且考虑到由于一般情况下电子设备的摄像头区域(即上述设置区域)的盖板板材在材料种类选择与结构设计等方面比整机的大面积外壳板材的自由度更高，因此可以最大程度地保证毫米波天线的性能；故提出一种电子设备，涉及将毫米波天线模组安装于电子设备摄像头区域的方案；下面对本发明实施例提供的方案进行举例说明。
举例一
(1)举例一的整体构架如图1所示。本举例的构架涉及到电子设备的外壳盖板(即电子设备盖板)、摄像头区域(即上述设置区域2)、摄像头区域盖板(即上述区域盖板4)、至少一个摄像头模组1、至少一个毫米波天线模组、电路板7、各模组与电路板之间的连接线路。
(2)图1所示也可理解为所述电子设备的外部视图，摄像头区域位于电子设备机身的某一位置。
(3)图2所示也可理解为所述电子设备去掉外壳盖板后的内部视图。所述摄像头区域内有摄像头模组1和毫米波天线模组，且两类模组相互不重合地并排摆放。所述两类模组可通过柔性电路板或其他合适的方式与电子设备 的电路板连接以传输信号和馈电。所述摄像头区域还可以放置电子设备的其他组件，在此不作限定。图2中的9表示柔性电路板及连接口。
(4)图3所示也可理解为所述摄像头区域的局部放大截面图。所述摄像头模组1和所述毫米波天线模组放置安装于所述电路板的空缺处(即上述空缺区域8)，或放置安装于所述电路板7之上。所述摄像头区域的电子设备盖板10有空缺部分(参见图3，与电路板空缺，即空缺区域8基本一致)，空缺部分大小可以使所述两类模组的正上方无盖板覆盖遮挡。所述空缺部分有摄像头区域盖板覆盖填充。所述摄像头区域盖板与所述电子设备盖板10之间可有装饰圈11连接，以保证密封和美观。所述摄像头模组1的镜头12和所述毫米波天线模组的天线13朝向所述摄像头区域盖板。所述摄像头区域盖板可为非金属、绝缘体，且在所述摄像头模组的正上方区域具有一定透光性。图3中的9表示柔性电路板及连接口。
本举例的方案中：由于手机等电子设备的摄像头区域盖板与覆盖电子设备大部分区域的外壳盖板为不同的部件，因此可以针对毫米波天线的性能进行材料及结构的选择时自由度更大，更容易设计使其对毫米波天线性能的影响尽可能小。
举例二
(1)举例二的整体构架如图4所示，图4也可理解为电子设备的外部视图。举例二与举例一的不同之处是毫米波天线模组放置于多个摄像头模组的部分模组间的区域。
(2)图5所示也可理解为所述电子设备去掉外壳盖板后的内部视图。所述摄像头区域内有摄像头模组1和毫米波天线模组，且两类模组部分区域相互重合地摆放，毫米波天线模组放置于多个摄像头模组1的部分模组间的区域。所述两类模组可通过柔性电路板或其他合适的方式与电子设备的电路板连接以传输信号和馈电。所述摄像头区域还可以放置电子设备的其他组件，在此不作限定。图5中的9表示柔性电路板及连接口。
(3)图6所示也可理解为所述摄像头区域的局部放大截面图。所述摄像头模组和所述毫米波天线模组放置安装于所述电路板的空缺处(即上述空缺区域8)，或放置安装于所述电路板7之上。所述多个摄像头模组1之间的联 结组件绕开(具体为不穿过毫米波天线模组所在区域)、或不覆盖(具体为不穿过毫米波天线模组的上方(即毫米波天线模组与区域盖板之间)，可以穿过毫米波天线模组下方，不影响天线性能即可)所述毫米波天线模组。所述摄像头区域的电子设备盖板10有空缺部分(参见图6，与电路板空缺，即空缺区域8基本一致)，空缺部分大小可以使所述两类模组的正上方无盖板覆盖遮挡。所述空缺部分有摄像头区域盖板覆盖填充。所述摄像头区域盖板与所述电子设备盖板10之间可有装饰圈11连接，以保证密封和美观。所述摄像头模组1的镜头12和所述毫米波天线模组的天线13朝向所述摄像头区域盖板。所述摄像头区域盖板可为非金属、绝缘体，且在所述摄像头模组的正上方区域具有一定透光性。图6中的9表示柔性电路板及连接口。
本举例的方案除了具备举例一的方案的优势外，还可以使摄像头模组与毫米波天线模组设计得更加紧凑，节省电子设备内部空间。
在此说明，本方案可适用于电子设备屏幕侧的摄像头区域，但并不以此为限。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。
上面结合附图对本发明的实施例进行了描述，但是本发明并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本发明的启示下，在不脱离本发明宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本发明的保护之内。

Claims (10)

  1. 一种电子设备，包括：
    摄像头模组；
    设置于所述摄像头模组的设置区域内的天线模组；
    与所述设置区域配合的区域盖板，所述区域盖板上设有通孔；
    其中，所述摄像头模组与天线模组均通过所述通孔与外界相连通。
  2. 根据权利要求1所述的电子设备，其中，所述天线模组所处的区域和所述摄像头模组所处的区域之间相互不重合。
  3. 根据权利要求2所述的电子设备，其中，所述摄像头模组的数量为至少两个，且所述至少两个摄像头模组和所述天线模组分别沿第一方向排列。
  4. 根据权利要求1所述的电子设备，其中，所述摄像头模组的数量为至少两个，所述天线模组所处的区域位于任意两个所述摄像头模组之间。
  5. 根据权利要求4所述的电子设备，其中，至少两个所述摄像头模组之间的连接组件绕开或不覆盖所述天线模组。
  6. 根据权利要求4所述的电子设备，还包括：设于所述设置区域内的金属装饰圈；
    其中，所述至少两个摄像头模组均设于金属装饰圈内，并通过所述金属装饰圈接地；
    所述天线模组位于所述金属装饰圈上，并通过所述金属装饰圈接地。
  7. 根据权利要求1所述的电子设备，还包括：与所述天线模组电连接的电路板。
  8. 根据权利要求7所述的电子设备，其中，所述天线模组设于所述电路板上；或者，所述电路板包括空缺区域，所述天线模组设于所述空缺区域内。
  9. 根据权利要求1所述的电子设备，其中，所述天线模组的天线朝向靠近所述区域盖板的方向延伸。
  10. 根据权利要求1所述的电子设备，其中，所述天线模组为毫米波天线模组。
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