WO2021200642A1

WO2021200642A1 - Conductive member

Info

Publication number: WO2021200642A1
Application number: PCT/JP2021/012834
Authority: WO
Inventors: 今野　英明; 雅道石久保
Original assignee: 積水ポリマテック株式会社
Priority date: 2020-03-31
Filing date: 2021-03-26
Publication date: 2021-10-07
Also published as: JP6979737B1; CN114930645B; JPWO2021200642A1; CN114930645A

Abstract

Provided is a conductive member that conducts/connects at low load and low resistance. A conductive member 10A that conducts/connects a metal housing C and a circuit board P includes a plate body 11 formed from a rubber-like elastic body, and a conductive film 12 that is provided on a surface of the plate body 11 and can expand and contract along with deformation of the plate body 11. The plate body 11 includes a bend section 11b protruding in a Z direction; and the conductive film 12 includes a contact surface section 12b that covers the bend section 11b, thereby conducting in a state of surface contact with at least one of the metal housing C and the circuit board P. When the conductive member 10A is subjected to pressing due to the metal housing C and the circuit board P approaching each other in the Z direction, the conductive member 10A is capable of deflecting/deforming such that the bend section 11b widens the bend while the contact surface section 12b maintains a state of surface contact with the metal housing C and/or the circuit board P.

Description

Conductive member

The disclosure in this application relates to conductive members.

Wireless communication devices such as smartphones transmit and receive various high-frequency electromagnetic waves, so they can be a source of noise. Noise generated from wireless communication devices may cause malfunctions of the wireless communication devices themselves and peripheral electronic devices, and may interfere with the normal operation of these devices. For this reason, EMI (ElectroMagnetic Interference) measures that suppress noise generated by wireless communication devices so as not to affect the wireless communication devices themselves and surrounding electronic devices are indispensable inside the wireless communication devices. ..

One of the EMI countermeasures is grounding, which allows noise that tries to enter the electronic circuit part of electronic devices such as wireless communication devices to escape to the ground. Conductive contacts are known as one of the EMI countermeasure components using this grounding. The conductive contact suppresses the influence of noise by, for example, conducting a grounding connection between the grounding pattern of the printed wiring board and the grounding electrode to ground the printed wiring board.

Japanese Patent Publication No. 2008-524799, Fig. 2

By the way, general conductive rubber and metal leaf springs are often used as EMI countermeasure parts for electronic devices. These EMI countermeasure components electrically connect the housing and the substrate in a compressed state. The external force required for the compressive deformation of the conductive rubber and the compressive deformation of the metal leaf spring made of a highly rigid material tends to be large, and the stress (repulsive force) is also likely to be large. In particular, if overcompression, in which stress exceeding the material limit is applied to the metal leaf spring, continues, the metal leaf spring may be plastically deformed and strain remains, causing sagging without returning to the original shape. ..

Furthermore, the contact surface of a metal leaf spring made of a highly rigid material is not easily compressed and deformed even when a load is applied from the object to be connected. Therefore, the contact portion between the contact surface of the metal leaf spring and the hard flat surface of the object to be connected tends to be a point contact having a narrower cross-sectional area than the surface contact. If vibration or impact is applied to the electronic device in such a point contact state, stable continuity may not be obtained because the conductive connection between the metal leaf spring and the object to be connected is momentarily cut off.

On the other hand, the conductive rubber is, for example, a rubber in which a conductive filler is dispersed using rubber as a binder. Although it is possible to reduce the electrical resistance of the conductive rubber by adding a large amount of the conductive filler, its flexibility is reduced. On the contrary, if the conductive rubber pursues its flexibility, its electric resistance is less likely to decrease. Therefore, it is desirable that the EMI countermeasure component has excellent performance in terms of both flexibility and conductivity as compared with the conductive rubber.

For example, as shown in Patent Document 1, it has an elastomer bump containing elastic rubber and a metal layer continuously extending from the source side to the terminal side of the connector on the outer surface thereof, and the chip module and the printed wiring board. Electrical contacts that are crimped between are known. However, the conductive contact of Patent Document 1 has a lump shape having a larger thickness toward the connected object to be arranged so as to face each other. Therefore, in the conductive contact of Patent Document 1, the pressing load due to the pair of connecting objects sandwiching and compressing the conductive contact becomes large.

And, for example, in smartphones, as an EMI countermeasure, a large number of EMI countermeasure parts may be used for ground connection. At this time, when assembling the product, the pressing load is accumulated and increased due to the large number of EMI countermeasure parts, and it becomes difficult to achieve both the strength of the housing and the substrate and the thinning and weight reduction of the product.

Some aspects disclosed in this application are configured to have the following characteristics.

That is, one aspect disclosed in the present application is to attach a conductive member for conducting and connecting a first connection object and a second connection object to a base material made of a rubber-like elastic body and the surface of the base material. The first base material has a conductive coating film that is provided and can be expanded and contracted with the deformation of the base material, and the base material is such that the first connection object and the second connection object approach and separate from each other. The conductive coating film has a bent portion that protrudes in the direction of The conductive member has a contact surface portion that conducts in the above-mentioned state, and when the conductive member receives a pressure due to the first connection object and the second connection object approaching each other, the contact surface portion It is characterized in that the bent portion can be flexed and deformed so as to widen the bend while maintaining the state of surface contact with at least one of the first connection object and the second connection object.

The conductive member has a base material made of a rubber-like elastic body and a conductive coating film that can be expanded and contracted and deformed as the base material is deformed. Therefore, the conductive member can be greatly deformed even by a small pressing load by the first connection object and the second connection object. Therefore, according to this aspect, the pressing load and the stress (repulsive force) thereof by the first connection object and the second connection object to the conductive member can be reduced.

Further, the base material of the conductive member has a bent portion that can be flexed and deformed so as to widen the bend, and the conductive coating of the conductive member covers the bent portion to cover the bent portion to connect the first object and the second connection. It has a contact surface portion that conducts in a surface contact state with at least one of the objects. Therefore, the conductive coating can secure the cross-sectional area of the current path on the contact surface portion with at least one of the first connection object and the second connection object. Therefore, according to this aspect, the first connection object and the second connection object are close to each other with respect to the conductive member, and the contact surface portion is the first connection object and the second connection object. The contact resistance value at the start of conductive contact with at least one can be quickly reduced.

Then, the base material has a stress that tries to return to the original shape without causing plastic deformation in a state of being subjected to a pressing load by the first connection object and the second connection object. Therefore, the conductive member can maintain this surface contact state while being pressed by the first connection object and the second connection object. Therefore, according to this aspect, even if, for example, an electronic device having a first connection object and a second connection object is subjected to vibration or shock, the electronic device and the conductive member Stable continuity can be maintained.

The base material is a plate body and is located between the first connection object and the second connection object which are arranged to face each other, and the base material is the first connection object. When the object and the second connecting object are pressed by approaching each other, the bent portion can be flexed and deformed so as to approach flatness.

According to this aspect, in the conductive member, the base material is a plate body, and when the first connection object and the second connection object are pressed by approaching each other, the bent portion is flat. It is configured to be flexible and deformable so as to approach. Therefore, according to this aspect, the contact of the contact surface, which is in a surface contact state with at least one of the first connection object and the second connection object, due to the bent portion approaching flatness. The area can be expanded. Therefore, according to this aspect, at least the first connection object and the second connection object do not increase the pressing load of the first connection object and the second connection object on the conductive member. The contact resistance value of the conductive member with respect to one can be reduced.

The base material can be configured to be a conductive rubber containing a conductive filler in a rubber material.

According to this aspect, the conductive member has a structure in which not only the conductive coating but also the base material has conductivity. Therefore, according to this aspect, the overall electrical resistance of the conductive member can be reduced.

The conductive coating can be configured to cover the entire surface of the base material.

According to this aspect, the entire surface of the conductive member is covered with a conductive film. As a result, the entire surface of the conductive member serves as a current path. Therefore, according to this aspect, the conductive member can conduct a conductive connection between the first connection object and the second connection object reliably and with low resistance by using the surface thereof as a current path. On the other hand, according to this aspect, the base material can be an insulating material such as insulating rubber. In general, trying to make an insulating material conductive tends to reduce its flexibility. However, according to this aspect, conductivity is not essential for the substrate. Therefore, according to this aspect, since a more flexible material can be used for the base material, the conductive member is pressed by the first connection object and the second connection object. In addition, it can be deformed softly.

The base material has a tip portion extending from the bent portion, and the contact surface portion covering the bent portion comes into contact with one of the first connection object and the second connection object, and the said. Another contact surface portion that covers the tip portion can be configured to be in contact with the other of the first connection object and the second connection object.

According to this aspect, the conductive member has a first connection object in a state where another contact surface portion covering the tip portion extending from the bent portion is in contact with the other of the first connection object and the second connection object. Pressed by the object and the second object to be connected. As a result, the pressing load of the first connection object and the second connection object on the conductive member becomes larger than that in the state where the tip portion is at the free end. Therefore, according to this aspect, the pressing load by the first connection object and the second connection object on the conductive member does not become too small and can be maintained appropriately.

The base material may have a hardness of A1 to A90 measured by a type A durometer conforming to JIS K6253.

According to this aspect, the base material is a JIS K 6253 compliant type A durometer and has a hardness of A1 to A90. This is because the base material can be easily flexed and deformed and is sufficiently soft to some extent when the first connection object and the second connection object are pressed by approaching each other. Therefore, as compared with, for example, a metal leaf spring that is often used as an EMI countermeasure component, the load when the conductive member is pressed by the first connection object and the second connection object can be sufficiently reduced. .. More specifically, when the rubber-like elastic body of the base material is an insulating rubber, it preferably has a hardness of A1 to A60, and when it is a conductive rubber, it preferably has a hardness of A10 to A90. ..

Further, the conductive member can be configured to have a fixed holding portion provided with a fixing portion made of an adhesive material layer or a metal foil layer.

According to this aspect, since the conductive member has a fixed portion, the conductive member can be easily attached to, for example, a circuit.

The base material may be configured to extend from the fixed holding portion in a cantilever shape in a second direction intersecting with the first direction.

According to this aspect, the base material extends from the fixed holding portion in the shape of a cantilever. Therefore, according to this aspect, the pressing load and the stress (repulsive force) thereof by the first connection object and the second connection object to the conductive member can be reduced.

The base material can be configured such that the thickness of the material is 0.05 mm to 0.5 mm.

According to this aspect, since the base material has an appropriate thickness, the conductive member can be softly flexed and deformed when pressed by the first connection object and the second connection object. ..

The base material has a long side extending in a second direction intersecting with the first direction, and the long side can be 0.5 mm to 5 mm.

According to this aspect, since the base material has a long side having a sufficient length, the conductive member is softly flexed and deformed when pressed by the first connection object and the second connection object. can do.

It is a figure which shows the conductive member by 1st Embodiment, FIG. 1A is a plan view, and FIG. 1B is a front view. 2A is a front view showing an example in which an adhesive layer is attached to a fixed holding portion, and FIG. 2B is a front view showing an example in which an adhesive layer is attached to a fixed holding portion, and FIG. The front view which shows the buried example. FIG. 2C is a front view showing an example in which the conductive film is provided only on the top surface and the bottom surface, and FIG. 2D shows the conductive film and the metal leaf layer on the top surface after the conductive film is provided only on the top surface. The front view which shows the example which conducts with and directly. It is a figure explaining the operation of the conductive member, and FIG. 3A is a cross-sectional view corresponding to line IIIA-IIIA of FIG. 1A which shows the state before the conductive member bends and deforms. FIG. 3B is a cross-sectional view corresponding to a line IIIA-IIIA of FIG. 1A showing a state in which the conductive member is flexed, deformed, and flattened. It is a figure which shows the conductive member by 2nd Embodiment, FIG. 4A is a plan view, and FIG. 4B is a front view. It is a figure which shows the conductive member by 3rd Embodiment, FIG. 5A is a plan view, and FIG. 5B is a front view. It is a figure which shows the conductive member by 4th Embodiment, FIG. 6A is a plan view, and FIG. 6B is a front view. FIG. 7A is a front view showing an example in which an adhesive layer is attached to a fixed holding portion, and FIG. 7B is a front view showing an example in which an adhesive layer is attached to a fixed holding portion, and FIG. 7B shows a metal foil layer in advance as a fixed holding portion. The front view which shows the buried example. FIG. 8A is a front view showing the conductive member according to the fifth embodiment. FIG. 8B is a front view showing a conductive member according to a modified example of the fifth embodiment in which an adhesive layer is attached to a fixed holding portion. FIG. 8C is a front view showing a conductive member according to a modified example of the fifth embodiment in which a metal foil layer is embedded in advance as a fixed holding portion. FIG. 9A is a front view showing the conductive member according to the sixth embodiment. FIG. 9B is a front view showing the conductive member according to the seventh embodiment. The front view which shows the conductive member by 8th Embodiment. 9 is a view showing a conductive member according to a ninth embodiment, FIG. 11A is a plan view, and FIG. 11B is a front view. FIG. 12A is a front view showing a conductive member according to a modified example of the seventh embodiment. FIG. 12B is a front view showing the conductive member according to the tenth embodiment.

Hereinafter, examples of the embodiments disclosed in the present application will be described with reference to the drawings. The same reference numerals are given to the configurations common to the following embodiments, and duplicate description in the specification is omitted. Further, duplicate description will be omitted for the usage method and the action and effect common to each embodiment. Here, in the present specification and the scope of claims, when "first" and "second" are described, they are used to distinguish different components, and a specific order or superiority or inferiority is used. It is not used to indicate.

The "conductive member" disclosed in this application is for conducting a conductive connection between the "first connection object" and the adherend as the "second connection object". As one aspect of the "first connection object", a metal housing such as an electric device can be exemplified. As one aspect of the "second connection object", a circuit board housed in a metal housing can be exemplified. The "first connection object" and the "second connection object" may be reversed.

In the scope of the present specification and the patent claims, for convenience, as shown in FIGS. 1A, 1B, etc., the long side direction (horizontal direction) of the conductive member 10 is the X direction, and the short side direction (front-back direction) is the Y direction. The height direction (vertical direction) is described as the Z direction. Further, in the Y direction, the front side of FIG. 1B and the like is described as the front side of the conductive member 10, and the back side is described as the rear side of the conductive member 10. Then, in the conductive member 10, the side on which the circuit board P is placed is described as the lower side in the Z direction, and the side on which the metal housing C is arranged is described as the upper side in the Z direction. However, they do not limit the connection direction, the compression direction, the arrangement direction with respect to the electronic device, and the like of the conductive member 10.

First Embodiment [FIG. 1A, FIG. 1B]

The conductive member 10 of the present embodiment functions as an EMI countermeasure component as a grounding that allows noise that is about to enter an electronic circuit portion of a wireless communication device or the like to escape to the ground. The conductive member 10 is conductively connected to each other in a state of being compressed by, for example, a metal housing C and a circuit board P which are arranged so as to approach and separate from each other in the Z direction as the "first direction". (See FIG. 3B).

The conductive member 10 has a plate body 11 as a "base material" and a conductive coating film 12. The conductive member 10 is configured by covering the surface of the plate body 11, which is the basis of the structure, with the conductive coating film 12. The conductive member 10 is located between the metal housing C and the circuit board P which are arranged to face each other, and the plate body 11 is connected to the metal housing C and the circuit board P via the conductive coating 12. Are in contact.

The conductive member 10 has a plate surface extending in the XY direction as shown in FIG. 1A, and has a thin plate shape having a plate thickness in the Z direction as shown in FIG. 1B. The conductive member 10 has a valley fold line extending in the Y direction toward the left end in the X direction, and has a sigmoid (S-shaped) shape in front view having a mountain fold line extending in the Y direction toward the right end. There is. That is, the conductive member 10 has a plane having a low position in the Z direction toward the left end, a plane having a high position toward the right end, and an inclined surface between these planes, in other words, a central portion in the X direction. The conductive member 10 has a flat bottom surface near the left end located at the lower end in the Z direction mounted on the circuit board P. On the other hand, the conductive member 10 is arranged so that the top surface of the flat surface near the right end located at the upper end in the Z direction is in contact with the metal housing C.

The plate body 11 receives stress (repulsion) by receiving a load (pressing load) between the metal housing C and the circuit board P that shrinks and presses the gap in the Z direction so as to be flexible (bending) and deformable in the gap. The force) is reduced. Therefore, the plate body 11 is configured to be easily flexible and deformable with respect to pressing in the Z direction by the metal housing C and the circuit board P. As shown in FIG. 1A, the plate body 11 of the present embodiment has a plate surface that is longer in the X direction than in the Y direction and spreads in the XY direction, and has a plate thickness in the Z direction as shown in FIG. 1B. It has a thin plate shape. According to this configuration, since the plate body 11 has a thin plate shape in the Z direction, the plate body 11 can be easily flexed and deformed particularly in the Z direction. At this time, since the plate body 11 is longer in the X direction than in the Y direction, the plate body 11 can be flexed and deformed so as to bend around the Y direction.

Further, the plate body 11 of the present embodiment is made of a rubber-like elastic body. The rubber-like elastic body has a property of having a low elastic modulus. Therefore, the conductive member 10 can be greatly deformed even by a small pressing load by the metal housing C and the circuit board P. Therefore, according to the present embodiment, the pressing load by the metal housing C and the circuit board P on the conductive member 10 and the stress (repulsive force) thereof can be reduced. In this way, the plate body 11 has higher flexibility than the conductive coating film 12, and is the portion of the conductive member 10 that is most easily deformed by an external force.

The plate body 11 is bent so as to extend toward the right in the X direction while projecting upward in the Z direction, and has a sigmoid (S-shaped) shape when viewed from the front. The plate body 11 has a plate body base portion 11a and a bent portion 11b. The bent portion 11b here is a region having a bent shape in a front view in which one of the metal housing C and the circuit board P first comes into contact with each other when the metal housing C and the circuit board P approach each other. Therefore, the bent portion 11b is a region including any of the upper and lower ends of the conductive member 10. Further, the "bending" here may be bent (bent) with clear corners in the front view (see, for example, FIG. 1B), or may be smoothly bent (curved). Good (see, for example, FIG. 6B, etc.).

The plate body base portion 11a is a portion on which the plate body 11 is placed on the circuit board P via the conductive coating film 12. The plate body base portion 11a has a thin plate shape, and extends from the left end of the plate body 11 toward the right along the X direction when viewed from the front.

The bent portion 11b is a main part that converts the load received from the metal housing C and the circuit board P into a force that bends and deforms the plate body 11. The bent portion 11b is formed so as to project upward from the plate base portion 11a, which is one in the "first direction". Since the bent portion 11b of the present embodiment comes into contact with the metal housing C located above, it is provided at a high position in the Z direction of the plate body 11, that is, at the top including the upper end of the plate body 11.

The bent portion 11b is composed of a thin plate-shaped inclined piece portion 11c and a top side horizontal piece portion 11d. The inclined piece portion 11c extends to the right along the X direction so as to incline upward in the Z direction from the right end of the plate base portion 11a in the front view. The top-side lateral piece 11d extends from the right end of the inclined piece 11c to the right along the X direction in front view. In the bent portion 11b, a bending angle θ1 in the initial state is formed by the top side lateral piece portion 11d and the inclined piece portion 11c when viewed from the front (see FIG. 3A).

The top side lateral piece 11d extends along the X direction so as to be parallel to the plate base 11a. As a result, when the metal housing C is arranged parallel to the circuit board P, the contact area when the conductive member 10 starts to make conductive contact with the metal housing C can be increased. Therefore, the conductive member 10 stabilizes the surface contact state while the conductive member 10 is pressed by the metal housing C and the circuit board P after the conductive member 10 starts to make conductive contact with the metal housing C. Can be maintained.

However, the top-side lateral piece 11d may be configured to extend to the right along the X direction so as to be inclined downward in the Z direction from the right end of the inclined piece 11c in the front view. As a result, when the metal housing C and the circuit board P come close to each other, the right end of the conductive member 10 can be brought into contact with the circuit board P at an earlier stage. Then, by being pressed by the metal housing C and the circuit board P in a state where the right end of the conductive member 10 is in contact with the circuit board P, the conductive member 10 is compared with a state in which the right end of the conductive member 10 is not in contact. The pressing load on the metal housing C and the circuit board P is increased. Therefore, according to this configuration, the pressing load of the metal housing C and the circuit board P on the conductive member 10 does not become too small and can be maintained appropriately.

Both the front end surface and the rear end surface of the plate 11 in the Y direction are exposed portions 11e formed as "cut surfaces". The exposed portion 11e is a portion where the surface of the plate body 11 is not covered with the conductive coating 12 and is exposed. Both of the set of exposed portions 11e are formed along the XZ plane which is the intersecting direction with respect to the XY plane in which the conductive member 10 receives the pressing load from the metal housing C and the circuit board P. The set of exposed portions 11e are flush with the front end and the rear end formed as the "cut surface" of the conductive coating 12, respectively.

Here, as described above, the plate body 11 has higher flexibility than the conductive coating film 12. Therefore, as compared with the "covered portion" in which the plate body 11 is covered with the conductive coating 12, the exposed portion 11e in which the plate body 11 is not covered with the conductive coating 12 is a portion that is easily deformed when an external force is applied. Is. That is, when the plate body 11 is compressed and deformed by being pressed, the exposed portion 11e can bulge and deform forward and backward, respectively, with reference to the front end and the rear end of the conductive coating 12.

The exposed set of exposed portions 11e of the plate body 11 face back to each other, that is, opposite to each other, and the conductive member 10 is a plane perpendicular to the XY plane to which the metal housing C and the circuit board P receive a pressing load. It has become. Therefore, when the plate body 11 is compressed in the Z direction, which is the direction perpendicular to the exposed portion 11e, by the metal housing C and the circuit board P, the pair of exposed portions 11e are moved outward in the Y direction, respectively. It can be efficiently inflated toward. Therefore, in the conductive member 10, the pressing load at the time of compression can be reduced.

The conductive coating film 12 covers at least a part of the surface of the plate body 11 and electrically connects the metal housing C and the circuit board P while expanding and contracting according to the deformation of the plate body 11. The conductive film 12 is a conductive film having a film shape in which the thickness in the intersecting direction is thin with respect to the area exposed in a plane on the surface. When the conductive member 10 is pressed by the metal housing C and the circuit board P, the conductive coating 12 is configured to be stretchable and deformable along with the bending deformation of the plate body 11 without tearing.

As described above, the conductive coating film 12 of the present embodiment covers the entire surface other than the front end surface and the rear end surface, which are the exposed portions 11e of the plate body 11. Therefore, the conductive coating film 12 has a sigmoid (S-shaped) tubular shape when viewed from the front, and has a hollow region penetrating in the Y direction inside the conductive coating film 12. That is, the top surface and the bottom surface of the conductive coating 12 are not connected in the regions of the front end surface and the rear end surface of the plate body 11 which is the exposed portion 11e, but are electrically connected on the left and right side surfaces. The conductive coating 12 has a fixed holding portion 12a and a contact surface portion 12b.

The fixed holding portion 12a is a mounting portion and an electrical connection surface of the conductive member 10 to the circuit board P as an adherend. The fixed holding portion 12a is located at the lower end of the conductive member 10. The fixed holding portion 12a is the bottom surface of the conductive coating film 12 that covers the bottom surface of the plate body base portion 11a from below, and is formed along the XY plane.

The contact surface portion 12b is an electrical connection surface of the conductive member 10 to the metal housing C. The contact surface portion 12b is located at the upper end of the conductive member 10. The contact surface portion 12b is the top surface of the conductive coating 12 that covers the top surface of the bent portion 11b from above. The contact surface portion 12b has a curved surface shape formed along the bent portion 11b.

As described above, the conductive member 10 is configured so that the contact surface portion 12b covering the bent portion 11b is also a bent surface. Further, in the conductive member 10, since the contact surface portion 12b which is the electrical connection surface is formed by the bent surface, the contact area between the conductive member 10 and the metal housing C can be secured more widely and stably. The contact resistance between them can be reduced. Therefore, when the conductive member 10 has the bent portion 11b and the contact surface portion 12b that covers the bent portion 11, the conductive connection by the conductive member 10 can be stabilized.

Modifications of the First Embodiment [FIGS. 2A-2D]

Since the conductive member 10 of the present embodiment can be deformed, examples thereof will be described.

In the first embodiment, an example is shown in which the fixed holding portion 12a is simply formed on the bottom surface of the conductive coating film 12. However, as shown in FIG. 2A, the adhesive layer 13a as a "fixing portion" may be attached to the fixed holding portion 12a. For example, as the pressure-sensitive adhesive layer 13a, a conductive sticking member capable of adhering the conductive member 10A to the circuit board P can be used. As a result, the adhesive layer 13a can adhere the fixed holding portion 12a and the circuit board P, and can be conductively connected between them.

As the conductive adhesive member, for example, a conductive adhesive or a conductive adhesive tape in which a copper foil or the like is previously coated with the conductive adhesive can be used. When the conductive sticking member is used alone as the pressure-sensitive adhesive layer 13a, the conductive sticking member may be integrated with the separately formed conductive coating 12 by sticking the conductive sticking member to the fixed holding portion 12a.

According to the configuration of this modification, since the conductive member 10A has the adhesive layer 13a in the fixed holding portion 12a, the conductive member 10A can be easily attached to, for example, a circuit without soldering.

As another modification, as shown in FIG. 2B, the fixed holding portion 12a may have a form in which a metal foil layer 13b as a "fixing portion" is embedded in advance. For example, the metal foil layer 13b can be provided by insert-molding a copper foil on the bottom surface of the plate body base portion 11a of the plate body 11. The material of the metal foil is not limited to copper and may be, for example, aluminum. Then, the metal foil layer 13b can be attached to the circuit board P by, for example, soldering. As a result, the metal foil layer 13b can fix the fixed holding portion 12a and the circuit board P, and can electrically connect between them.

According to the configuration of this other modification, since the conductive member 10B has the metal foil layer 13b in the fixed holding portion 12a, the conductive member 10B can be easily attached to, for example, a circuit by soldering.

As yet another modification, as shown in FIG. 2C, the conductive coating film 12 may be in a form of covering only the top surface and the bottom surface of the plate body 11. In that case, the rubber-like elastic body of the plate body 11 is preferably conductive rubber.

According to the configuration of the conductive member 10C, which is another modification of the present invention, since the plate body 11 has conductivity, the metal foil layer 13b conducts conduction from the metal foil layer 13b to the contact surface portion 12b through the plate body 11 and the conductive coating film 12. Can be done. Since the left and right end faces of the plate 11 are exposed portions 11e as well as the front and rear end faces, the exposed portions 11e can be efficiently bulged not only in the Y direction but also in the X direction.

As yet another modification, as shown in FIG. 2D, a connection hole 11h that can be connected between the metal foil layer 13b embedded near the bottom surface of the plate body 11 and the top surface of the plate body 11 is provided in the plate body 11. It may be in the form of having a filling portion 12e formed and the conductive coating 12 is filled in the connection hole 11h. The rubber-like elastic body of the plate body 11 may be formed of an insulating rubber, and the plate body 11 is formed with a connection hole 11h penetrating the plate body base portion 11a. The conductive coating film 12 covers the top surface of the plate body 11 and is provided inside the connection hole 11h as a filling portion 12e. The conductive coating film 12 provided in the filling portion 12e may be configured so as to be conductively connected between the conductive coating film 12 covering the top surface of the plate body 11 and the metal foil layer 13b, and is not necessarily the inner surface of the connection hole 11h. It does not have to be a film shape that follows.

According to the configuration of the conductive member 10D, which is yet another modification, the metal foil layer 13b is passed through the filling portion 12e that fills the connection hole 11h of the plate body base portion 11a and the conductive coating 12 that covers the top surface of the plate body 11. Conduction to the contact surface portion 12b is possible. At this time, since the metal foil layer 13b and the contact surface portion 12b are directly conductively connected by the conductive coating film 12, the resistance of the conductive member 10D can be reduced.

Action of 1st Embodiment [FIGS. 3A, 3B]

Next, the operation when the conductive member 10 of the present embodiment is mounted on the metal housing C and the circuit board P will be described. Here, an example of the conductive member 10A according to a modified example having the pressure-sensitive adhesive layer 13a as the “fixed portion” shown in FIG. 2A will be described. However, the same effect as that of the conductive member 10A can be obtained for the conductive member 10B according to the modified example having the metal foil layer 13b and the conductive member 10 not having such a configuration.

First, the conductive member 10A is adhered to the circuit board P by the adhesive layer 13a. Then, the metal housing C moves so as to approach the circuit board P downward in the Z direction and comes into contact with the contact surface portion 12b (see FIG. 3A).

Here, the conductive member 10A of the present embodiment has a bent portion 11b in which the plate body 11 made of a rubber-like elastic body projects upward, and is in contact with the metal housing C as a bent surface. The surface portions 12b come into contact with each other. The contact surface portion 12b of the conductive coating 12 is configured to be stretchable and deformable as the bent portion 11b of the plate body 11 is deformed. Then, as compared with the case where the entire top surface of the conductive coating 12 is in contact with the metal housing C from the beginning, since the contact surface portion 12b is a bent surface, the contact area with the metal housing C is the bent surface. By narrowing the area near the apex, the pressing load from the metal housing C can be easily concentrated. Further, since the plate body 11 is made of a rubber-like elastic body, it is greatly compressed and deformed even by a small pressing load by the metal housing C, and many point contact portions are easily crushed and become in a surface contact state. Cheap. Therefore, the contact surface portion 12b comes into surface contact with the metal housing C.

In this way, the conductive coating 12 can secure the cross-sectional area of the current path on the contact surface portion 12b with the metal housing C. Therefore, according to the present embodiment, the contact resistance value when the metal housing C and the circuit board P approach each other with respect to the conductive member 10A and the contact surface portion 12b begins to make conductive contact with the metal housing C. Can be quickly reduced. The conductive coating film 12 is electrically connected between the contact surface portion 12b and the fixed holding portion 12a, both of which are electrical connection surfaces, regardless of the conductivity of the plate body 11. Therefore, by having the conductive coating 12 on the conductive member 10A, the metal housing C and the circuit board P can be conductively connected with low resistance.

The bent portion 11b is in a high position in the Z direction in the initial state in which the bent portion 11b is not in contact with the metal housing C, the circuit board P, or the like and is not bent and deformed (FIGS. 3A, 1B, and 2A-). See also Figure 2D). That is, the conductive member 10A has a large height H1 of the conductive member 10A in the initial state and a small length L1 of the conductive member 10A in the initial state. The bending angle θ1 in the initial state formed by the top side lateral piece portion 11d and the inclined piece portion 11c in the front view is the minimum state as described later. The bending angle θ1 in the initial state is, for example, about 160 ° in the figure.

When the bent portion 11b is pressed so that the distance between the metal housing C and the circuit board P in the Z direction is shortened, the bent portion 11b is flattened by expanding its bending from a shape having a protruding height in the Z direction and bending. It is configured to flex and deform so that it becomes soft. At the time of the flexural deformation, the bent portion 11b is configured to be particularly extendable in the X direction as the "second direction" which is the intersecting direction with respect to the Z direction. That is, when the bent portion 11b receives a pressing load from the metal housing C, the position in the Z direction is lowered and the plate body 11 is flexed and deformed so that the left end of the plate body portion 11a to the top side lateral piece portion 11d The length in the long side direction to the right end is extended in the X direction (see FIG. 3B). That is, the height H2 of the conductive member 10A in the flattened state is smaller than the height H1 of the conductive member 10A in the initial state (H1> H2). On the other hand, the length L2 of the conductive member 10A in the flattened state is larger than the length L1 of the conductive member 10A in the initial state (L1 <L2).

Here, the fact that the bent portion 11b can be flexed and deformed so as to widen the bending means that, for example, the bending angle θ2 in the front view in a flattened state approaches 180 °. The bending angle θ2 at the flattened stage is, for example, 180 ° in the figure, which is a larger value than about 160 ° of the bending angle θ1 in the initial state.

The pressing load required for the bent portion 11b to flex and deform is sufficiently smaller than the pressing load required for compressive deformation in which the thickness of the plate 11 itself is reduced. Therefore, since the conductive member 10A has the bent portion 11b, the stress (repulsive force) of the conductive member 10A until the bent shape of the bent portion 11b is flattened can be reduced. At that time, in the bent portion 11b, the bending direction of the plate body 11 is reversed (the bending angle θ2 exceeds 180 °) so as to generate a so-called click feeling, and the fluctuation of the repulsive force changes greatly instantaneously. It is said to have a shape that does not occur. Therefore, the plate body 11 can be softly crushed until the bent shape of the bent portion 11b is flattened.

The rubber-like elastic body has the property of having high resilience at the time of unloading. Therefore, the plate body 11 has a stress to return to the original shape without causing plastic deformation in a state of being subjected to a pressing load by the metal housing C and the circuit board P. The contact surface portion 12b can maintain this surface contact state while being pressed by the metal housing C and the circuit board P under the stress. Therefore, when the bent portion 11b approaches flatness, the area of the contact surface that is in surface contact with the metal housing C can be widened in the X direction and the contact area can be widened. .. Therefore, according to the present embodiment, the conductive member 10A comes into contact with at least one of the metal housing C and the circuit board P without increasing the pressing load of the metal housing C and the circuit board P on the conductive member 10A. The resistance value can be reduced.

The plate body 11 is folded back in the vertical direction in the Z direction between the left end of the plate body base portion 11a, which is the "first end", and the right end of the top side horizontal piece portion 11d, which is the "second end". Although it may be extended, it does not have a "folded portion" that folds back in the left-right direction in the X direction. That is, the plate body 11 does not have an "overlapping portion" in which two or more plate bodies 11 overlap each other in a plan view. Therefore, the plate bodies 11 do not overlap in the Z direction when they are flexed and deformed by receiving a pressing load from the metal housing C and the circuit board P. That is, the plate body 11 has a structure in which the bent shape of the bent portion 11b is easily flattened.

After the distance between the metal housing C and the circuit board P in the Z direction reaches the thickness of the conductive member 10A from the initial state, the conductive member 10A is subjected to compressive deformation to reduce the plate thickness, and is conductive. This is the stage where the stress (repulsive force) of the member 10A rapidly increases. However, according to the configuration in which the plate body 11 does not have a "folded portion" and an "overlapping portion", the circuit board is formed from the time when the metal housing C comes into contact with the contact surface portion 12b until the bent portion 11b is crushed and flattened. It is possible to secure a longer displacement distance with respect to P. Therefore, the conductive member 10A can secure a longer range in which the repulsive force does not increase.

The plate body 11 extends in the X direction from the fixed holding portion 12a in the shape of a cantilever. Then, the deflection deformation of the plate body 11 at a stage before the compression deformation of the conductive member 10A begins to occur is completed within the gap between the metal housing C and the circuit board P. Therefore, at the stage where the plate body 11 is flexed and deformed, it is unlikely that the right end of the plate body 11 or the like hits the circuit board P and frictional resistance is generated. Therefore, according to the present embodiment, the pressing load and the stress (repulsive force) thereof by the metal housing C and the circuit board P on the conductive member 10A can be reduced.

When the conductive member 10A continues to be pressed by the metal housing C after being flattened, it finally comes into contact with the circuit board P. When the conductive member 10A is pressed from both the metal housing C and the circuit board P, the conductive member 10A itself is crushed and its plate thickness is reduced. At this time, since the plate body 11 is made of a rubber-like elastic body, the pressing load by the metal housing C and the circuit board P against the conductive member 10A and the stress (repulsive force) thereof can be reduced. At this time, if the conductive member 10A has an exposed portion 11e on the end face in the Y direction, for example, when the plate body 11 is compressed in the Z direction by the metal housing C and the circuit board P, the exposed portion is exposed. 11e can be efficiently bulged outward in the Y direction. Therefore, in the conductive member 10A, the pressing load at the time of compression can be further reduced.

Here, the case where the conductive member 10A is attached to the circuit board P and pressed by the metal housing C has been described. However, the same effect can be obtained when the conductive member 10A is attached to the metal housing C and pressed by the circuit board P.

As described above, the conductive member 10A has a plate body 11 made of a rubber-like elastic body and a conductive coating film 12 that can be expanded and contracted and deformed as the plate body 11 is deformed. Therefore, the conductive member 10A can be greatly deformed even by a small pressing load by the metal housing C and the circuit board P. Therefore, according to the present embodiment, the pressing load and the stress (repulsive force) thereof by the metal housing C and the circuit board P on the conductive member 10A can be reduced.

Further, the plate body 11 of the conductive member 10A has a bent portion 11b that can be flexed and deformed so as to widen the bending. The conductive coating 12 of the conductive member 10A has a contact surface portion 12b that conducts in a surface contact state between the metal housing C and at least one of the circuit boards P by covering the bent portion 11b. There is. Therefore, the conductive coating 12 can secure the cross-sectional area of the current path on the contact surface portion 12b with at least one of the metal housing C and the circuit board P. Therefore, according to the present embodiment, the metal housing C and the circuit board P are close to each other with respect to the conductive member 10A, and the contact surface portion 12b is in conductive contact with at least one of the metal housing C and the circuit board P. The contact resistance value at the start can be quickly reduced.

Then, the plate body 11 has a stress that tries to return to the original shape without causing plastic deformation in a state of being subjected to a pressing load by the metal housing C and the circuit board P. Therefore, the conductive member 10A can maintain this surface contact state while being pressed by the metal housing C and the circuit board P. Therefore, according to the present embodiment, even if, for example, an electronic device having a metal housing C and a circuit board P is subjected to vibration or impact, the electronic device and the conductive member 10A are stable. Conduction can be maintained.

Examples of the rubber-like elastic body applicable to the plate 11 include rubber materials such as silicone rubber, other synthetic rubbers, and thermoplastic elastomers. Above all, it is preferable to use a silicone rubber having heat resistance and a small compression set for the plate 11. The plate body 11 is not limited by the composition, structure, etc., and may be an elastic body having high flexibility and high resilience at the time of unloading, and the plate body 11 may have a urethane sponge or the like. A porous body or a resin film can also be used. However, it is more preferable to use a rubber-like elastic body for the plate body 11, which has a lower compression set value than the porous body or the resin film and is hard to settle even after long-term use. Further, these materials may not be used alone in the plate body 11, but may be used in combination of two or more kinds.

If the compression set of the plate 11 exceeds 30%, the elastic force when compressed by the metal housing C and the circuit board P is insufficient, and it becomes difficult to return to the original shape. Therefore, there is a high possibility that the continuity between the metal housing C and the circuit board P cannot be maintained. Therefore, it is preferable that the plate body 11 is composed of a compression set of 30% or less. As a result, the dimensional stability of the plate body 11 is ensured, and the elastic force when the plate body 11 is compressed by the metal housing C and the circuit board P can be maintained.

Here, the compression set is a value obtained under the condition of standing at 70 ° C. at a compression rate of 50% for 24 hours in accordance with JIS K6262: 2013. The smaller the compression set, the more the dimensions of the original shape are maintained.

It is preferable that the plate body 11 has a hardness of A1 to A90 measured by a type A durometer conforming to JIS K 6253-3: 2012. Since the hardness of the plate 11 is A1 or higher, the conductive member 10 has an appropriate repulsive force against the pressing by the metal housing C and the circuit board P and maintains the continuity in a surface contact state. can do. On the other hand, the plate body 11 has a hardness of A90 or less. This is because the plate body 11 can be easily flexed and deformed when the metal housing C and the circuit board P are pressed by approaching each other, and the plate body 11 is sufficiently soft to some extent. Therefore, as compared with, for example, a metal leaf spring that is often used as an EMI countermeasure component, the load when the conductive member 10 is pressed by the metal housing C and the circuit board P can be sufficiently reduced. More specifically, when the rubber-like elastic body of the base material is an insulating rubber, it preferably has a hardness of A1 to A60, and when it is a conductive rubber, it preferably has a hardness of A10 to A90. ..

Here, the hardness of the type A durometer can be measured at a temperature of 23 ° C. in accordance with JIS K6253-3: 2012.

The conductive member 10 does not require conductivity because the conductive coating 12 having conductivity is used as a member separate from the plate body 11. Therefore, in the conductive member 10, the plate body 11 can be made of a material that is sufficiently soft and easily deformed.

However, the plate body 11 may be a conductive rubber containing a conductive filler in the rubber material. As a result, the conductive member 10 has a structure in which not only the conductive coating 12 but also the plate 11 has conductivity. Therefore, since the plate body 11 is made of conductive rubber, the overall electrical resistance of the conductive member 10 can be reduced. A polymer material having conductivity such as conductive rubber can be produced by mixing and dispersing a conductive filler which is a conductive filler for imparting conductivity to a base material such as silicone rubber. can. Conductive fillers include carbon-based and graphite-based powders such as carbon black, carbon fiber, scaly graphite powder, graphene, and carbon nanotubes, as well as metals such as gold, silver, copper, nickel, iron, and tin, and others. A conductive metal-based powder made of the containing alloys can be used. The conductive rubber composition is crosslinked and cured to form a plate 11 having a bent portion 11b.

The plate body 11 preferably has a material thickness, that is, a plate thickness of 0.05 mm to 0.5 mm. When the thickness of the plate 11 is 0.05 mm or more, the conductive member 10 has an appropriate repulsive force against the pressing by the metal housing C and the circuit board P and maintains the continuity in a surface contact state. can do. On the other hand, when the thickness of the plate 11 is 0.5 mm or less, the conductive member 10 can be softly deformed when pressed by the metal housing C and the circuit board P.

The plate body 11 preferably has a long side extending in the X direction intersecting the Z direction with a length of 0.5 mm to 5 mm. Since the long side of the plate 11 is 0.5 mm or more, the plate 11 has a sufficient length so that it can be flexed and deformed. Therefore, the conductive member 10 is pressed by the metal housing C and the circuit board P. When received, it can be softly deformed. On the other hand, the conductive member 10 does not have any functional problem because the long side of the plate 11 is too long. Therefore, the upper limit of the length on the long side of the plate 11 is not limited. However, since the long side of the plate 11 is 5 mm or less, the conductive member 10 can be attached to a particularly small electronic device.

A resin, metal, or the like can be used for the conductive coating 12. Above all, it is preferable to use a conductive polymer film which is a stretchable resin for the conductive film 12. As a result, the conductive coating 12 can be expanded and contracted or bent without tearing as the plate 11 is bent or compressed, so that the compressive load of the conductive member 10 is lowered, which is preferable. For the conductive film 12, a conductive film-like member containing a polymer base material, for example, a polymer-based binder having elasticity such as liquid silicone, and a conductive powder as a filler is used.

The conductive coating 12 can also be made of a material similar to that of the plate 11. The term "similar material" as used herein means that the polymer base material, which is the base material of the conductive coating film 12, is a material having the same bonding structure and functional group as the rubber-like elastic body, which is the material of the plate body 11. Means. For example, when the plate 11 is made of silicone rubber, for the conductive coating 12, for example, a silicone polymer which is a material similar to the material of the plate 11 is used.

In the conductive member 10, the conductive coating 12 that covers the plate 11 is made of a material similar to that of the plate 11, so that the adhesiveness between the plate 11 and the conductive coating 12 can be improved. Further, since the plate 11 and the conductive coating 12 are made of similar materials, the difference between the elastic modulus of the conductive coating 12 and the elastic modulus of the plate 11 can be reduced. Therefore, the conductive coating film 12 can be expanded and contracted following the deforming plate body 11.

Conductive powders include those made of metals and alloys such as gold, silver, copper, nickel, iron and tin, those whose surface is coated with metals and alloys by plating, carbon, graphite, graphene, etc. Conductive materials such as carbon / graphitic ones can be used.

The conductive coating film 12 can be formed by containing flake-shaped metal particles in a polymer base material. In the flake-shaped metal particles, the conductivity in the plane direction is likely to be maintained even if the conductive coating 12 is elongated and deformed. Further, in the flake-shaped metal particles, the volume resistivity of the conductive coating 12 can be made low even if the filling amount with respect to the polymer base material is relatively small. Therefore, in the conductive member 10, the filling amount of the flake-shaped metal particles in the polymer base material can be reduced, and the difference between the elastic modulus of the conductive coating 12 and the elastic modulus of the plate 11 can be reduced. .. Then, in the case of flake-shaped metal particles, the change in resistivity when the conductive film 12 expands and contracts can be reduced. Therefore, it is preferable to use a material having a larger aspect ratio such as a scale shape or a fiber shape than a spherical shape as the conductive powder.

The conductive coating 12 tends to have a harder structure than the plate 11. Therefore, as the base material of the conductive coating 12, a material softer than the base material of the plate body 11 may be used. By doing so, the difference in elastic modulus between the plate body 11 and the conductive coating 12 can be reduced.

For example, the conductive film 12 made of a conductive film containing silver is heated after applying a conductive paint in which a material containing liquid silicone and silver is dissolved in a diluting solvent to volatilize the solvent and cure the silicone film. It is formed by making it. The conductive film 12 has, for example, a film thickness of 30 μm and a volume (electrical) resistivity of ^{3.10. -3} Ω · cm. As a guideline for the film thickness, the plate body 11 made of a rubber-like elastic body, particularly the bent portion 11b, can be deformed following a slight compressive deformation when a pressing load is applied from the metal housing C and the circuit board P. It should be thick. As a result, either the metal housing C or the circuit board P and the contact surface portion 12b can be easily brought into surface contact with each other.

The conductive paint is formed into a film shape by screen printing on the outer surface of the plate 11. In addition to screen printing, methods such as spray coating, dipping, and brush coating can be used to apply the conductive paint that forms the conductive coating 12. The conductive coating material of the conductive coating film 12 may be applied with the bent portion 11b of the plate body 11 having a three-dimensionally undulating shape, or may be applied after the bent portion 11b is stretched so as to be flattened. good.

In the conductive member 10, it is preferable that the flake-shaped metal particles have an aspect ratio of 2 or more and an average particle size of 1 to 50 μm. As a result, even if the conductive coating 12 is elongated and deformed, the conductivity in the surface direction can be maintained. Further, it is preferable that the flake-shaped metal particles are oriented along the surface direction of the surface of the conductive coating 12. This makes it possible to increase the electrical conductivity in the orientation direction.

The conductive coating 12 may cover at least a part of the surface of the plate 11 so that the metal housing C and the circuit board P are conductive. The plate 11 may have a region on the surface of which the conductive coating 12 is not formed, such as a linear or lattice shape. Further, the plate body 11 may be provided with a conductive coating film 12 covering only the top surface thereof, the top surface and the bottom surface, the top surface and the bottom surface, and at least one side surface. However, it is preferable that the conductive coating 12 is provided on the entire surface of the plate 11. By providing the conductive coating 12 over the entire surface of the plate 11, the metal housing C and the circuit board P can be reliably and conductively connected with each other with low resistance.

The conductive member 10 has a plurality of conductive members 10 connected in the Y direction by forming a conductive film 12 on the surface of the plate 11 after forming the plate 11 having a plurality of lengths in the Y direction. It can be formed by cutting the continuum along the X direction. When the conductive member 10 is formed by this method, the front and rear end surfaces of the conductive member 10 as a "cut surface" have an exposed portion 11e that exposes the surface of the plate body 11.

However, the conductive coating 12 may be configured to cover the entire surface of the plate 11. This is obtained by first cutting the continuum of the plate 11 along the X direction and then forming the conductive coating 12 on the surface of each plate 11.

The entire surface of the conductive member 10 formed in such a process is covered with the conductive coating 12. As a result, the entire surface of the conductive member 10 serves as a current path. Therefore, the conductive member 10 can connect the metal housing C and the circuit board P reliably and with low resistance by using the surface of the conductive member 10 as a current path. On the other hand, according to this configuration, the plate body 11 can be made of an insulating material such as insulating rubber. In general, trying to make an insulating material conductive tends to reduce its flexibility. However, according to this configuration, conductivity is not essential for the plate body 11. Therefore, according to this configuration, a material having higher flexibility can be used for the plate body 11, so that the conductive member 10 becomes soft when pressed by the metal housing C and the circuit board P. It can be transformed.

It is also possible to use a conductive metal foil for the conductive coating film 12. Copper, aluminum, or the like can be used as the material of the metal foil. In this case, the conductive coating 12 is integrated with the plate 11 by, for example, fixing copper foils to both the upper and lower surfaces of the plate 11.

Second Embodiment [Fig. 4A, Fig. 4B]

Hereinafter, with reference to the drawings of the conductive member 20 as the second embodiment, a part having a configuration different from that of the above-mentioned conductive member 10A will be mainly described. Unless otherwise specified, the conductive member 20 can exert the same effect as the above-mentioned conductive member 10.

As shown in FIG. 4B, the conductive member 20 of the present embodiment has a plate body 21 as a "base material", a conductive coating film 22, and an adhesive layer 13a. The adhesive layer 13a is the same for the conductive member 10A and the conductive member 20.

The conductive member 20 has the same configuration as the conductive member 10A. However, the plate body 21 in the conductive member 20 extends not only to the right side in the X direction but also to the left side from the plate body base portion 11a. The conductive coating 22 that covers the plate 21 is also formed not only to the right but also to the left from the plate base 11a.

The plate body 21 has a plate body base portion 11a, a bent portion 11b, and a bent portion 21b. The bent portion 21b has an inclined piece portion 21c extending in the direction opposite to the bent portion 11b in the X direction, and a top side lateral piece portion 21d. The bent portion 21b here has a shape symmetrical with the bent portion 11b centered on the plate body base portion 11a. However, the bent portion 11b and the bent portion 21b may have asymmetrical shapes on the left and right sides.

The conductive coating 22 has a fixed holding portion 12a, a contact surface portion 12b, and a contact surface portion 22b. The contact surface portion 22b covers the inclined piece portion 21c constituting the bent portion 21b and the top side lateral piece portion 21d.

The conductive member 20 is configured to make surface contact with the metal housing C at two locations, the contact surface portion 12b and the contact surface portion 22b. Therefore, the conductive member 20 can secure twice the cross-sectional area of the current path with the metal housing C as compared with the conductive member 10A. Therefore, according to the conductive member 20, the metal housing C and the circuit board P can be conductively connected with lower resistance.

Both the front end surface and the rear end surface of the plate body 21 in the Y direction are exposed portions 21e formed as "cut surfaces". The exposed portion 11e of the conductive member 10 of the first embodiment extends from the plate base portion 11a in the X direction, whereas the exposed portion 21e of the conductive member 20 of the present embodiment extends from the plate base portion 11a in the X direction. It is extending to both sides in. As described above, the exposed portion 21e is different in shape from the exposed portion 11e, but is the same as the exposed portion 11e except for the exposed portion 21e.

Third Embodiment [Fig. 5A, Fig. 5B]

Hereinafter, with reference to the drawings of the conductive member 30 as the third embodiment, a part having a configuration different from that of the above-mentioned conductive member 10B will be mainly described. Unless otherwise specified, the conductive member 30 can exert the same effect as the above-mentioned conductive member 10.

As shown in FIG. 5B, the conductive member 30 of the present embodiment has a plate body 31 as a "base material", a conductive coating film 32, and a metal foil layer 13b. In the present embodiment, the entire surface thereof is covered with the conductive coating 32, and the plate 31 is not exposed. The metal foil layer 13b is the same for the conductive member 10B and the conductive member 20.

The conductive member 30 has the same configuration as the conductive member 10B. However, the plate body 31 in the conductive member 30 has a tip portion 31f extending to the right from the bent portion 31b. The conductive coating 32 that covers the plate 31 is formed with a tip covering portion 32c that covers the tip portion 31f to the right of the contact surface portion 12b. A substrate contact surface portion 32d as an "another contact surface portion" is formed on the bottom surface of the right end of the tip covering portion 32c. The configuration of the bent portion 31b and the tip portion 31f here has a symmetrical shape centered on the contact surface portion 12b. However, the configuration of the bent portion 31b and the tip portion 31f may have an asymmetrical shape on the left and right sides.

The contact surface portion 12b covering the bent portion 31b is in contact with the metal housing C, which is one of the metal housing C and the circuit board P, and the substrate contact surface portion 32d covering the tip portion 31f is the metal housing C. And is in contact with the circuit board P, which is the other side of the circuit board P.

According to the present embodiment, the conductive member 30 is pressed by the metal housing C and the circuit board P in a state where the substrate contact surface portion 32d covering the tip portion 31f extending from the bent portion 31b is in contact with the circuit board P. NS. As a result, the pressing load of the metal housing C and the circuit board P on the conductive member 30 becomes larger than that in the state where the tip portion 31f is at the free end. Therefore, according to the present embodiment, the pressing load of the metal housing C and the circuit board P on the conductive member 30 does not become too small and can be maintained appropriately.

Fourth Embodiment [FIG. 6A, FIG. 6B]

Hereinafter, with reference to the drawings of the conductive member 40 as the fourth embodiment, a part having a configuration different from that of the above-mentioned conductive member 10 will be mainly described. Unless otherwise specified, the conductive member 40 can exert the same effect as the above-mentioned conductive member 10.

As shown in FIG. 6B, the conductive member 40 of the present embodiment has a plate body 41 as a "base material" and a conductive coating film 42. In the present embodiment, the entire surface thereof is covered with the conductive coating 42, and the plate 41 is not exposed.

The plate body 41 in the conductive member 40 has an upwardly convex curved shape. Therefore, the bent portion 41b also has a curved shape. A curved contact surface portion 42b is formed on the conductive coating 42 that covers the bent portion 41b.

The bent portion 41b does not have a bending angle θ1 like the bent portion 11b of the first embodiment described above. When the bending portion 41b of the curved shape is bent, it means that the curvature becomes smaller in the front view, that is, the bending portion approaches a straight line.

The conductive member 40 does not have a clear corner at the bent portion 41b. Therefore, in the conductive member 10, when flattened by being pressed by the metal housing C and the circuit board P, the corners do not remain without being flattened, and the conductive member 10 is flattened more smoothly. Can be done. Further, since the conductive member 40 does not have a corner portion where stress is easily concentrated and is likely to be a starting point of fracture, fatigue fracture is unlikely to occur even after repeated use, and durability can be improved.

Modifications of the Fourth Embodiment [FIGS. 7A, 7B]

Similar to the conductive member 10, the conductive member 40 may have an adhesive layer 13a as a “fixed portion” attached to the fixed holding portion 12a as shown in FIG. 7A as the conductive member 40A according to a modified example. .. Then, as shown in FIG. 7B as the conductive member 40B according to another modification, the fixed holding portion 12a may have a form in which the metal foil layer 13b as the “fixing portion” is embedded in advance.

Fifth Embodiment [FIGS. 8A-8C]

Hereinafter, with reference to the drawings of the conductive member 50 as the fifth embodiment, a part having a configuration different from that of the above-mentioned conductive member 40 will be mainly described. Unless otherwise specified, the conductive member 50 can exert the same effect as the above-mentioned conductive member 40.

As shown in FIG. 8A, the conductive member 50 of the present embodiment has a plate body 51 as a "base material" and a conductive coating film 52. In the present embodiment, the entire surface thereof is covered with the conductive coating 52, and the plate body 51 is not exposed.

The plate body 51 of the conductive member 50 has a downwardly convex curved shape, contrary to the plate body 41 of the conductive member 40. Therefore, the bent portion 51b also has a downwardly convex curved shape. The conductive coating 52 that covers the bent portion 51b is formed with a downwardly convex curved contact surface portion 52b. Further, the fixed holding portion 52a is formed on the top surface of the conductive coating 52, which is opposite to the fixed holding portion 12a of the conductive member 40.

Therefore, in the conductive member 50, when the metal housing C is located above in the Z direction and the circuit board P is located below, the fixed holding portion 52a is electrically connected to and contacts the metal housing C. The surface portion 52b is connected to the circuit board P.

Similar to the conductive member 40, the conductive member 50 may have an adhesive layer 13a as a “fixed portion” attached to the fixed holding portion 52a as shown in FIG. 8B as the conductive member 50A according to a modified example. Then, as shown in FIG. 8C as the conductive member 50B according to another modification, the fixed holding portion 52a may have a form in which the metal foil layer 13b as the “fixing portion” is embedded in advance.

Sixth Embodiment [Fig. 9A]

Hereinafter, with reference to the drawings of the conductive member 60 as the sixth embodiment, a part having a configuration different from that of the above-mentioned conductive member 40B will be mainly described. Unless otherwise specified, the conductive member 60 can exert the same effect as the above-mentioned conductive member 30.

As shown in FIG. 9A, the conductive member 60 of the present embodiment has a plate body 61 as a "base material" and a conductive coating film 62. In the present embodiment, the entire surface thereof is covered with the conductive coating 62, and the plate body 61 is not exposed.

The bent portion 61b of the plate body 61 has an upwardly convex curved shape similar to the conductive member 40B. However, the plate body 61 in the conductive member 60 has a tip portion 61f extending to the right from the bent portion 61b. The conductive coating 62 that covers the plate body 61 is formed with a tip covering portion 62c that covers the tip portion 61f to the right of the contact surface portion 62b. A substrate contact surface portion 62d as an "another contact surface portion" is formed on the bottom surface of the right end of the tip covering portion 62c. The conductive member 60 here has a symmetrical shape centered on the contact surface portion 62b. However, the conductive member 60 may have an asymmetrical shape on the left and right sides.

The contact surface portion 62b that covers the bent portion 61b is in contact with the metal housing C, which is one of the metal housing C and the circuit board P, and the substrate contact surface portion 62d that covers the tip portion 61f is the metal housing C. And is in contact with the circuit board P, which is the other side of the circuit board P.

Seventh Embodiment [Fig. 9B]

Hereinafter, with reference to the drawings of the conductive member 70 as the seventh embodiment, a part having a configuration different from that of the above-mentioned conductive member 60 will be mainly described. Unless otherwise specified, the conductive member 70 can exert the same effect as the above-mentioned conductive member 20.

As shown in FIG. 9B, the conductive member 70 of the present embodiment has a plate body 61 as a "base material", a conductive coating 62, and a metal leaf layer 13b, as well as a plate body as a "base material". It has 71 and a conductive coating 72. The plate body 61, the conductive coating 62, and the metal foil layer 13b are the same in the conductive member 60 and the conductive member 70.

The conductive member 70 includes the same configuration as the conductive member 60. However, in the conductive member 70, not only the plate body 61 extends to the right in the X direction from the plate body base 61a, but also the plate body 71 extends to the left. Then, in the conductive member 70, not only the conductive coating 62 that covers the plate 61 extending to the right from the plate base 61a, but also the conductive coating 72 that covers the plate 71 is left from the plate base 61a. Is formed in.

The plate body 71 has a bent portion 61b extending from the plate body base portion 61a and a bent portion 71b extending in the direction opposite to the tip portion 61f in the X direction and the tip portion 71f. The conductive member 70 here has a symmetrical shape centered on the plate base portion 61a. However, the bent portion 71b and the tip portion 71f may have a shape that is asymmetrical to the left and right with respect to the bent portion 61b and the tip portion 61f.

The conductive coating 72 includes a fixed holding portion 12a, a contact surface portion 62b, a contact surface portion 72b, a substrate contact surface portion 62d as an "another contact surface portion", and a substrate contact surface portion 72d as an "another contact surface portion". Have.

The conductive member 70 is configured to make surface contact with the metal housing C at two locations, the contact surface portion 62b and the contact surface portion 72b. Therefore, the conductive member 70 can secure twice the cross-sectional area of the current path with the metal housing C as compared with the conductive member 60. Similarly, the conductive member 70 is configured to make surface contact with the circuit board P at two locations, the substrate contact surface portion 62d and the substrate contact surface portion 72d. Therefore, the conductive member 70 is twice as large as the conductive member 60 on the free end side of the conductive member 70, which is not attached to the circuit board P like the metal foil layer 13b, even with the circuit board P. The cross-sectional area of the current path can be secured. Therefore, according to the conductive member 70, the metal housing C and the circuit board P can be conductively connected with lower resistance.

A modified example of the seventh embodiment [FIG. 12A]

Similar to the conductive member 10, the conductive member 70 has a “cut surface” as the front end surface and the rear end surface of the plate body 61 and the plate body 71 in the Y direction, as shown in FIG. 12A as the conductive member 70A according to the modified example. It may have an exposed portion 61e and an exposed portion 71e formed as. Since the conductive member 70A has the exposed portion 61e and the exposed portion 71e, it is possible to reduce the pressing load when the metal housing C and the circuit board P are compressed, similarly to the conductive member 10 and the like.

Eighth Embodiment [Fig. 10]

Hereinafter, with reference to the drawings of the conductive member 80 as the eighth embodiment, a part having a configuration different from that of the above-mentioned conductive member 60 will be mainly described. Unless otherwise specified, the conductive member 80 can exert the same effect as the above-mentioned conductive member 60.

As shown in FIG. 10, the conductive member 80 of the present embodiment has a plate body 81 as a "base material" and a conductive coating film 82. In the present embodiment, the entire surface thereof is covered with the conductive coating 82, and the plate 81 is not exposed.

The bent portion 81b of the plate body 81 has an upwardly convex curved shape like the conductive member 60. However, the bent portion 81b of the conductive member 80 has a flat upper end in the Z direction. Therefore, the contact surface portion 82b that covers the bent portion 11b also has a flat shape. Therefore, according to the conductive member 80, the metal housing C can be electrically connected to the metal housing C with the contact surface portion 82b having a wide area from the initial state of being pressed by the metal housing C and the circuit board P.

Ninth Embodiment [FIG. 11A, 11B]

Hereinafter, with reference to the drawings of the conductive member 90 as the ninth embodiment, a part having a configuration different from that of the above-mentioned conductive member 10 will be mainly described. Unless otherwise specified, the conductive member 90 can exert the same effect as the above-mentioned conductive member 10.

As shown in FIGS. 11A and 11B, the conductive member 90 has a hat shape in which the central portion of the thin disk is deep-drawn. The conductive member 90 has a plate body 91 and a conductive coating film 92. The plate body 91 has a bent portion 91b and a flange portion 91g. The bent portion 91b is formed so that the central portion in the radial direction of the ring-shaped flange portion 91g projects upward in the Z direction in a dome shape. A mountain-shaped hollow portion 94 is formed below the bent portion 91b. On the bottom surfaces of both sides of the flange portion 91g in the radial direction, ventilation grooves 95 that communicate the cavity 94 and the outside in the radial direction of the collar portion 91g are formed so as to be recessed upward. Both the upper and lower surfaces of the plate 91 are covered with the conductive coating 92. A fixed holding portion 92a is formed on the bottom surface of the flange portion 91g, and a contact surface portion 92b is formed on the top surface of the bent portion 91b.

In the conductive member 90 as well, as in the other embodiments, the fixed holding portion 92a is electrically connected to the circuit board P, and the contact surface portion 92b is electrically connected to the metal housing C. By pressing the bent portion 91b by the metal housing C, the bent portion 91b is deformed so as to be soft and flat while maintaining the state of surface contact between the contact surface portion 92b and the metal housing C. At the time of flattening, the air occupying the cavity 94 is discharged to the outside through the ventilation groove 95. Since the conductive member 90 has a circular shape in a plan view, it can be electrically connected to the circuit board P in multiple directions in the XY directions.

10th Embodiment [Fig. 12B]

Hereinafter, with reference to the drawings of the conductive member 100 as the tenth embodiment, a part having a configuration different from that of the above-mentioned conductive member 70A will be mainly described. That is, unless otherwise specified, the conductive member 100 can exert the same effect as the above-mentioned conductive member 70A.

As shown in FIG. 12B, the conductive member 100 of the present embodiment includes a plate body 61 as a "base material", a conductive coating film 62, a metal leaf layer 13b, and a plate body 71 as a "base material". In addition to the conductive film 72, it has a stretchable conductive protective film 66 and a stretchable conductive protective film 76. The conductive member 100 is configured such that the top surfaces of the

conductive films

62 and 72 are covered with the elastic conductive

protective films

66 and 76, respectively. The plate body 61, the metal leaf layer 13b, and the plate body 71 are the same in the conductive member 70A and the conductive member 100.

The

conductive coatings

62 and 72 have the same shape as the conductive member 70A and the conductive member 100. However, in the conductive member 100 in which the top surfaces of the

conductive coatings

62 and 72 are covered with the elastic conductive

protective films

66 and 76, respectively, the

contact surface portions

62b and 72b, which are the components of the conductive member 70A, are made of metal. It does not come into contact with C. Instead, in the conductive member 100, the regions corresponding to the

contact surface portions

62b and 72b of the conductive member 70A are the

bent portions

62h and 72h laminated on the bent portion 61b of the plate body 61 and the bent portion 71b of the plate body 71, respectively. Functions as.

The

conductive coatings

62 and 72 can be formed by containing conductive powder, for example, flaky metal particles, in the polymer base material, similarly to the above-mentioned conductive coatings 12 and the like. The conductive powders of the

conductive coatings

62 and 72 here are made of metals and alloys such as gold, silver, copper, nickel, iron and tin, and the surfaces are coated with metals and alloys by plating or the like. It is preferable to use a highly conductive conductive material such as copper.

The elastic conductive

protective films

66 and 76 have an extremely thin film shape in the Z direction as compared with the XY direction, and are arranged so as to have a wavy shape when viewed from the front. The stretchable conductive

protective films

66 and 76 are further laminated on the surfaces of the

conductive coating films

62 and 72, and are configured to be stretchable and deformable together with the

conductive coating films

62 and 72 according to the deformation of the

plate bodies

61 and 71. That is, the conductive member 100 is a conductive film formed by laminating the

conductive films

62 and 72 and the elastic conductive

protective films

66 and 76, respectively. The elastic conductive

protective films

66 and 76 have

contact surface portions

66b and 76b, respectively. The

contact surface portions

66b and 76b are formed in regions covering the

bent portions

62h and 72h, respectively. The

contact surface portions

66b and 76b function in the same manner as the

contact surface portions

62b and 72b of the conductive member 70A, for example.

In the conductive member 100, since the

conductive films

62 and 72 are covered with the elastic conductive

protective films

66 and 76, the

conductive films

62 and 72 are protected from corrosion, oxidation, sulfurization, etc. without being exposed and migration. Can be prevented. Since the stretchable conductive

protective films

66 and 76 are configured to be stretchable and deformable together with the

conductive coating films

62 and 72 according to the deformation of the

plate bodies

61 and 71, the

conductive coating films

62 and 72 are the stretchable conductive protective films 66, The

plates

61 and 71 can be softly deformed as in the case where they are not covered with 76.

As described above, the conductive member 100 is configured to have

conductive films

62 and 72 having different properties (for example, conductivity and flexibility) and elastic conductive

protective films

66 and 76. Therefore, in the conductive member 100 that electrically connects the metal housing C and the circuit board P with a low load, the

conductive coatings

62 and 72 have the conductivity and flexibility (low compression load). ) Can be maintained and deterioration over time due to corrosion etc. can be prevented.

The elastic conductive

protective films

66 and 76 are configured to contain, for example, a conductive carbon allotrope in the polymer base material. In the conductive member 100 in this case, the outermost layer, which is exposed to the outside of the conductive member 100 and has the highest possibility of deterioration over time such as corrosion, is composed of an allotrope of carbon having excellent corrosion resistance and the like. Will be done.

Since the elastic conductive

protective films

66 and 76 containing the allotrope of carbon having conductivity in the polymer base material cover the

conductive coatings

62 and 72, the conductivity of the

conductive coatings

62 and 72 and the

plates

61 and 71 The

conductive coatings

62 and 72 can be protected from corrosion and the like while maintaining flexibility. Further, since the elastic conductive

protective films

66 and 76 serve as the outermost layer of the conductive member 100, the gloss on the surface of the

conductive films

62 and 72 is reduced (hidden the metallic color), and a highly uniform black color is exhibited. It is possible to construct the conductive member 100 having excellent designability. Since the surfaces of the elastic conductive

protective films

66 and 76 contain a large amount of carbon allotropes, the heat resistance and abrasion resistance on the surface of the conductive member 100 can be improved.

In the conductive member 100, the

conductive films

62 and 72, which are easily formed so as to have higher flexibility than the elastic conductive

protective films

66 and 76, are configured to be adjacent to the

plate bodies

61 and 71, respectively. Therefore, it is possible to prevent the

conductive coatings

62 and 72 and the stretchable conductive

protective films

66 and 76 from being peeled off, especially between layers, when the

plates

61 and 71 are deformed.

Further, the conductive member 100 has a structure in which the

conductive films

62 and 72 and the elastic conductive

protective films

66 and 76 have a multi-layer structure, respectively, and carbon allotropes are concentrated on the elastic conductive

protective films

66 and 76. .. As a result, in the conductive member 100, a large volume occupied by the

conductive coatings

62 and 72 having high flexibility and conductivity can be secured. In the conductive member 100, the

conductive films

62 and 72 and the elastic conductive

protective films

66 and 76 have a multi-layer structure, respectively, and the elastic conductive

protective films

66 and 76 do not contain metal particles. As a result, the metal particles are not exposed, oxidation and migration of the

conductive coatings

62 and 72 can be suppressed, and an increase in the electric resistance value with time can be suppressed.

The stretchable conductive

protective films

66 and 76 preferably have a film thickness of 5 to 75 μm, and more preferably have a film thickness of 5 to 50 μm. When the elastic conductive

protective films

66 and 76 have an appropriate film thickness, the conductive film 62 has elasticity, flexibility and conductivity sufficient to flatten the flexible elastic conductive

protective films

66 and 76. , 72 can be prevented from corroding and the surface of the conductive member 100 can be protected. Further, when the elastic conductive

protective films

66 and 76 have an appropriate film thickness, it is possible to prevent the

conductive films

62 and 72 from being seen through and to impart high designability to the conductive member 100. ..

Examples of the polymer base material applicable to the base material of the elastic conductive

protective films

66 and 76 include highly flexible polymers such as silicone-based, urethane-based, acrylic-based, and olefin-based. The elastic conductive

protective films

66 and 76 can be made of the same material as the

conductive films

62 and 72. At this time, for example, when the

conductive films

62 and 72 are silicone polymers, the silicone polymer is also used as the base polymer of the elastic conductive

protective films

66 and 76.

When the elastic conductive

protective films

66, 76 laminated on the

conductive films

62, 72 are made of the same material as the

conductive films

62, 72, the

conductive films

62, 72 and the elastic conductive protective films 66, The adhesiveness with 76 can be improved. Further, since the

conductive films

62 and 72 and the elastic conductive

protective films

66 and 76 are made of similar materials, the elastic modulus of the

conductive films

62 and 72 and the elastic modulus of the elastic conductive

protective films

66 and 76 are further formed. The difference with can be reduced. Therefore, the elastic conductive

protective films

66 and 76 can be expanded and contracted together with the

conductive films

62 and 72 that expand and contract according to the

deformed plate bodies

61 and 71.

The elastic conductive

protective films

66 and 76 tend to have a harder structure than the

conductive films

62 and 72. Therefore, as the base material of the elastic conductive

protective films

66 and 76, a material that is softer than the base material of the

conductive coating films

62 and 72, that is, a material having a large degree of needle insertion may be used. By doing so, the difference between the elastic modulus of the

conductive films

62 and 72 and the elastic modulus of the elastic conductive

protective films

66 and 76 can be reduced.

The stretchable conductive

protective films

66 and 76 are configured by containing a conductive filler in a polymer base material. As the conductive filler of the elastic conductive

protective films

66 and 76, a carbon / graphite conductive material such as carbon, graphite, graphene, for example, that is, an allotrope of carbon having conductivity can be used other than the metal type. As the conductive filler, in addition to a spherical shape, a flat shape, a scale shape, a needle shape, a fiber shape, or the like can be used.

The stretchable conductive

protective films

66 and 76 are made by blending 60 parts by weight of carbon black and 20 parts by weight of multi-layer graphene with, for example, 100 parts by weight of a silicone polymer made of a two-component curable liquid silicone rubber. Shaped members are used. As the carbon black, for example, Mitsubishi Conductive Carbon Black # 3030B manufactured by Mitsubishi Chemical Corporation, which has an arithmetic mean particle size of 55 nm, can be used. As the multilayer graphene, for example, iGurafen-αS, a high-purity graphene powder manufactured by Aitec Co., Ltd., which has a particle size of 10 μm, can be used.

As described above, the stretchable conductive

protective films

66 and 76 are preferably configured to contain graphene. Then, it is preferable to use scale-shaped particles as graphene. By orienting the scaly graphene along the surface direction of the surfaces of the elastic conductive

protective films

66 and 76, the electrical conductivity in the orientation direction can be increased. Similarly, the stretchable conductive

protective films

66 and 76 are preferably configured to contain conductive carbon black. By interposing the carbon black around the graphene and between the graphenes, it is possible to increase the conductivity in both the surface direction and the thickness direction of the surfaces of the stretchable conductive

protective films

66 and 76, and as a result, the stretchable conductive protective film. The conductivity of 66 and 76 can be increased as a whole.

The conductive film-like member containing silicone polymer, carbon black and graphene is heated after being applied with a solution dissolved in a diluting solvent, and the solvent volatilizes to cure the silicone film, resulting in carbon / carbon fiber. / A conductive film containing graphite or the like is formed. The elastic conductive

protective films

66 and 76 have, for example, a film thickness of 25 μm and a volume (electrical) resistivity of ^5.10-1 Ω · cm. Since the elastic conductive

protective films

66 and 76 often have a higher resistance value than the

conductive films

62 and 72, it is preferable that the elastic conductive

protective films

66 and 76 have a thinner film thickness than the

conductive films

62 and 72. The conductive film-like member is discharged onto the outer surfaces of the conductive films 62 and 72 (the portion corresponding to the outer surface of the elastic conductive film 33 of the conductive member 30), and is formed into a film shape by, for example, a scraping method using a squeegee. NS. The method of applying the elastic conductive

protective films

66 and 76 is not limited to the ejection and squeegee method of the ink-like conductive composition, and may be dipping or transfer.

In the present embodiment, an example is shown in which the elastic conductive

protective films

66 and 76 are provided so as to cover only the top surfaces of the

conductive films

62 and 72, respectively. However, the elastic conductive

protective films

66 and 76 may be provided so as to cover the bottom surfaces of the

conductive films

62 and 72, respectively. As a result, the bottom surfaces of the

conductive coatings

62 and 72 can also be protected from corrosion and the like. At this time, in the case of a configuration having the substrate contact surface portion 62d as "another contact surface portion" such as the conductive member 60, the elastic conductive protective film 66 covering the substrate contact surface portion 62d is in contact with the substrate of the conductive member 60. It functions in the same manner as the surface portion 62d. Further, in the elastic conductive

protective films

66 and 76, when the

conductive coating films

62 and 72 are provided so as to cover the top surfaces of the

conductive coating films

62 and 72, respectively, a pair of the

conductive coating films

62 and 72 located at the left and right ends in the X direction in FIG. 12B. It may be formed so as to cover the side surface of the.

The stretchable conductive

protective films

66 and 76 of this embodiment can also be applied to each of the other embodiments and modifications described above. At this time, in the case of a conductive member 30 or the like that does not have the exposed portion 11e, the elastic conductive

protective films

66 and 76 may be formed so as to cover a pair of front and rear end side surfaces in the Y direction.

In the "conductive member" disclosed in this application, the configurations shown in each embodiment and modification can be freely combined within a range that does not cause a contradiction. For example, any "conductive member" may have a configuration corresponding to the exposed portion 11e, or may not have the exposed portion 11e. The exposed portion 11e is not limited to the two locations of the front end surface and the rear end surface in the Y direction, and may be one to four of the four surfaces including the left end surface and the right end surface in the X direction. Further, in any of the "conductive members", the adhesive layer 13a as the "fixing portion" may be attached to the fixed holding portion 12a, and the metal foil layer 13b as the "fixing portion" is embedded in advance. Is also good.

Hereinafter, examples will be shown to explain the conductive member 10 and the like of the present embodiment in more detail and concretely. However, this embodiment is not limited to the following examples.

Example 1

In Example 1, the conductive member 40A having the shape shown in FIG. 7A was produced. Conductive silicone rubber was used for the plate body 41. By press-molding the conductive silicone rubber, a curved plate 41 having a curved surface that is convex upward in the front view shown in FIG. 7A was formed. For the conductive coating 42, a conductive coating material using silver ink was used. By screen-printing silver ink on both the upper and lower surfaces of the formed plate 41, conductive coatings 42 were formed on the upper and lower surfaces of the conductive member 40A. The conductive member 40A was obtained by cutting the continuum of the conductive member 40A thus formed with a width of 1 mm along the long side direction.

In Example 1, a conductive member 40A having an "exposed portion" of the plate 41 without having a conductive coating 42 was formed on the cut surface. A double-sided tape was used for the adhesive layer 13a as the "fixing portion". The double-sided tape was provided on the lower surface of the fixed holding portion 12a. The conductive member 40A has a curved curved portion 41b, a thickness of 0.02 mm, a height H1 from the mounting surface to the top of 0.7 mm, and a length in the long side direction in a plan view of 2 mm. It became a dimension.

The conductive member 40A of the first embodiment formed in this way is pressed from above and below in the Z direction, and the electric resistance [Ω] between the fixed holding portion 12a and the contact surface portion 42b and the force applied to the inside of the conductive member 40A. [N] was measured.

When the contact approaching from above came into contact with the contact surface portion 42b, the electrical resistance value quickly dropped to a low level. Further, the conductive member 40A was pressed, and the electric resistance value gradually decreased until the conductive member 40A was flexed and deformed to be flattened. On the other hand, the force applied to the inside of the conductive member 40A hardly changed until it was flattened.

Therefore, in Example 1, it was found that the pressing load by the metal housing C and the circuit board P on the conductive member 40A and the stress (repulsive force) thereof are extremely reduced. Further, in Example 1, it was found that the contact resistance value when the contact surface portion 42b starts conducting conductive contact with at least one of the metal housing C and the circuit board P is rapidly reduced.

Example 2

In Example 2, the conductive member 40A having the shape shown in FIG. 7A was produced in the same manner as in Example 1. In the second embodiment, the material of each member constituting the conductive member 40A and the method of forming the same are the same as those in the first embodiment. However, in Example 2, the order of the steps in the method for producing the conductive coating 42 is different from that in Example 1.

That is, a continuous body of the plate body 41 press-formed into a curved surface shape that is convex upward in the front view shown in FIG. 7A was cut with a width of 1 mm along the long side direction. After that, by screen-printing silver ink on the entire surface of the individually cut plate 41, the conductive coating 42 was formed on the entire surface of the conductive member 40A. Thus, in Example 2, the conductive member 40A having the conductive coating 42 on any surface was formed.

For the conductive member 40A of Example 2, the electric resistance [Ω] between the fixed holding portion 12a and the contact surface portion 42b and the force [N] applied to the inside of the conductive member 40A were measured by the same method.

When the contact approaching from above came into contact with the contact surface portion 42b, the electrical resistance value quickly dropped to an extremely low level. Therefore, the electric resistance value remained at an extremely low level until the conductive member 40A was pressed, flexed, deformed, and flattened. On the other hand, the force applied to the inside of the conductive member 40A was increased until it was flattened as compared with Example 1, but maintained at a low level.

Therefore, in Example 2, it was found that the pressing load by the metal housing C and the circuit board P on the conductive member 40A and the stress (repulsive force) thereof are reduced. Further, in Example 2, it was found that the contact resistance value when the contact surface portion 42b started to make conductive contact with at least one of the metal housing C and the circuit board P was quickly made extremely small.

From the results of the above examples, it was shown that in the conductive member 10 and the like of the present embodiment, the contact resistance value when the conductive contact with at least one of the metal housing C and the circuit board P starts can be quickly reduced. Then, it was shown that the pressing load and the stress (repulsive force) thereof by the metal housing C and the circuit board P on the conductive member 10 and the like can be reduced.

10 Conductive member (first embodiment)
10A conductive member (modification example of the first embodiment)
10B conductive member (another modification of the first embodiment)
11 Plate (base material)
11a Plate base 11b Bent 11c Inclined piece 11d Top side horizontal piece 11e Exposed part 11h Connection hole 12 Conductive coating 12a Fixed holding part 12b Contact surface part 12e Filling part 13a Adhesive material layer (fixed part)
13b Metal leaf layer (fixed part)
20 Conductive member (second embodiment)
21 Plate (base material)
21b Bent part 21c Inclined piece part 21d Top side horizontal piece part 22 Conductive coating 22b Contact surface part 30 Conductive member (third embodiment)
31 Plate (base material)

31b Bent part

31f Tip part 32 Conductive coating 32c Tip covering part 32d Substrate contact surface part (another contact surface part)
40 Conductive member (4th embodiment)
40A conductive member (modification example of the fourth embodiment)
40B conductive member (another modification of the fourth embodiment)
41 Plate (base material)
41b Bent portion 42 Conductive coating 42b Contact surface portion 50 Conductive member (fifth embodiment)
50A conductive member (modification example of the fifth embodiment)
50B conductive member (another modification of the fifth embodiment)
51 Plate (base material)
51b Bent part 52 Conductive coating 52a Fixed holding part 52b Contact surface part 60 Conductive member (sixth embodiment)
61 Plate (base material)
61a Plate base 61b Bent 61e Exposed 61f Tip 62 Conductive coating 62b Contact surface 62c Tip covering 62d Substrate contact surface (another contact surface)
62h Bent part 66 Stretchable conductive protective film 66b Contact surface part 70 Conductive member (7th embodiment)
70A Conductive member (Modification example of the 7th embodiment)
71 Plate (base material)
71b Bent part 71e Exposed part 71f Tip part 72 Conductive coating 72b Contact surface part (another contact surface part)
72d Substrate contact surface portion 72h Bending portion 76 Stretchable conductive protective film 76b Contact surface portion 80 Conductive member (8th embodiment)
81 Plate (base material)
81b Bent portion 82 Conductive coating 82b Contact surface portion 90 Conductive member (9th embodiment)
91 Plate (base material)
91b Bent part 91g Brim part 92 Conductive coating 92a Fixed holding part 92b Contact surface part 94 Cavity part 95 Ventilation groove 100 Conductive member (10th embodiment)
C Metal housing H1 Height of the conductive member in the initial state H2 Height of the conductive member in the flattened state L1 Length of the conductive member in the initial state L2 Length of the conductive member in the flattened state P Circuit board X Left and right Direction (long side direction) (second direction)
Y Front-back direction (short side direction)
Z Height direction, vertical direction (first direction)
θ1 Bending angle in the initial state θ2 Bending angle in the flattened state

Claims

In the conductive member that conductively connects the first connection object and the second connection object,
A base material made of a rubber-like elastic body and
It has a conductive coating film provided on the surface of the base material and capable of expanding and contracting with the deformation of the base material.
The base material has a bent portion that projects in a first direction in which the first connection object and the second connection object approach and separate from each other.
The conductive coating has a contact surface portion that conducts in a surface contact state between the first connection object and at least one of the second connection objects by covering the bent portion.
In the conductive member, when the first connection object and the second connection object are pressed by approaching each other, the contact surface portion is formed with the first connection object and the second connection object. A conductive member characterized in that the bent portion can be flexed and deformed so as to widen the bend while maintaining the state of surface contact with at least one of the objects.
The base material is a plate body and is located between the first connection object and the second connection object which are arranged so as to face each other.
Claim 1 that the base material can be flexed and deformed so that the bent portion approaches flat when the first connection object and the second connection object are pressed by approaching each other. The conductive member described.
The conductive member according to claim 1 or 2, wherein the base material is a conductive rubber containing a conductive filler in a rubber material.
The conductive member according to any one of claims 1 to 3, wherein the conductive coating covers the entire surface of the base material.
The base material has a tip portion extending from the bent portion and has a tip portion extending from the bent portion.
The contact surface portion covering the bent portion comes into contact with one of the first connection object and the second connection object.
The conductive member according to any one of claims 1 to 4, wherein another contact surface portion that covers the tip portion is in contact with the other of the first connection object and the second connection object.
The conductive member according to any one of claims 1 to 5, wherein the base material has a hardness of A1 to A90 measured by a type A durometer conforming to JIS K 6253.
The conductive member according to any one of claims 1 to 6, further comprising a fixed holding portion provided with a fixing portion made of an adhesive layer or a metal foil layer.
The conductive member according to claim 7, wherein the base material extends from the fixed holding portion in a cantilever shape in a second direction intersecting with the first direction.
The conductive member according to any one of claims 1 to 8, wherein the base material has a material thickness of 0.05 mm to 0.5 mm.
Any of claims 1 to 9, wherein the base material has a long side extending in a second direction intersecting with the first direction, and the long side is 0.5 mm to 5 mm. The conductive member according to item 1.
The conductive member covers the contact surface portion and can be expanded and contracted along with the deformation of the base material and the deformation of the conductive film, and is between the first connection object and at least one of the second connection objects. It also has an elastic conductive protective film that conducts in a surface contact state,
The stretchable conductive protective film can be flexed and deformed so that the bent portion expands the bending while maintaining the state of surface contact with at least one of the first connecting object and the second connecting object. The conductive member according to any one of claims 1 to 10.
The conductive member according to claim 11, wherein the stretchable conductive protective film is formed by containing a conductive carbon allotrope in a polymer base material.
The conductive member according to claim 11 or 12, wherein the stretchable conductive protective film has a film thickness of 5 to 50 μm.
The stretchable conductive protective film is configured to contain graphene, and the graphene is oriented along the surface direction of the surface of the stretchable conductive protective film, any one of claims 11 to 13. The conductive member according to the item.