WO2021128366A1 - Electronic element packaging structure - Google Patents
Electronic element packaging structure Download PDFInfo
- Publication number
- WO2021128366A1 WO2021128366A1 PCT/CN2019/129543 CN2019129543W WO2021128366A1 WO 2021128366 A1 WO2021128366 A1 WO 2021128366A1 CN 2019129543 W CN2019129543 W CN 2019129543W WO 2021128366 A1 WO2021128366 A1 WO 2021128366A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- electronic component
- printed circuit
- flexible circuit
- packaging structure
- Prior art date
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 29
- 238000003466 welding Methods 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Layout of the interconnection structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
Definitions
- the utility model relates to the technical field of electronic component packaging, in particular to an electronic component packaging structure.
- the purpose of the utility model is to provide an electronic component packaging structure with low cost and short production cycle.
- the present invention provides an electronic component packaging structure, which includes a flexible circuit board and an electronic component stacked on the flexible circuit board and forming an electrical connection.
- the electronic component packaging structure also includes stacking and fixing on the flexible circuit board.
- a printed circuit board on the flexible circuit board that is electrically connected to the flexible circuit board, the electronic component is fixed on the side of the printed circuit board away from the flexible circuit board, and the electronic component is connected to the printed circuit board.
- the circuit board is electrically connected and is electrically connected to the flexible circuit board through the printed circuit board.
- the electronic component is completely located within the range of the printed circuit board.
- the printed circuit board is completely located within the range of the flexible circuit board.
- the height of the printed circuit board is 1 mm, and the height of the electronic component is 1 mm.
- the printed circuit board and the flexible circuit board form a fixed electrical connection by welding.
- the electronic component and the printed circuit board form a fixed electrical connection by welding.
- the electronic component packaging structure of the present invention by stacking a layer of printed circuit boards on the flexible circuit board and forming electrical connections, and then fixing the electronic components on the printed circuit board, the printed circuit board and the flexible circuit
- the boards form electrical connections, so that the height of the printed circuit board is used to achieve the required height of the electronic component packaging structure, which not only has a short production cycle and low cost.
- Figure 1 is a top view of the electronic component packaging structure of the present invention
- Figure 2 is a front view of the electronic component packaging structure of the present invention.
- the present invention provides an electronic component packaging structure 100, which includes a flexible circuit board 1, an electronic component 3 stacked on the flexible circuit board 1 and forming electrical connections, and a printed circuit board 2. .
- the printed circuit board 2 is fixed on the flexible circuit board 1 and forms an electrical connection with the flexible circuit board 1, and the electronic component 3 is fixed on a side of the printed circuit board 2 away from the flexible circuit board 1
- the electronic component 3 is electrically connected to the printed circuit board 2 and is electrically connected to the flexible circuit board 1 through the printed circuit board 2.
- the electronic component 3 is completely located within the range of the printed circuit board 2, and the printed circuit board 2 is completely located within the range of the flexible circuit board 1; the printed circuit board 2 and the flexible circuit board 1 A fixed electrical connection is formed by soldering, and the electronic component 3 and the printed circuit board 2 are formed by soldering a fixed electrical connection.
- the printed circuit board 2 and the flexible circuit board 1 are welded and fixed, and the printed circuit board 2 and the electronic components 3 are welded and fixed; the two structures are fixed by welding, which has better stability, simple process and convenient operation .
- the height a of the printed circuit board 2 and the height of the electronic component 3 are both 1 mm.
- the height a of the printed circuit board 2 can also be other heights, which are determined according to actual needs.
- the electronic component packaging structure 100 needs to be applied to some specific occasions, and the superimposed height of the electronic component 3 and the printed circuit board 2 needs to reach 2mm; however, as described in this embodiment
- the height of the electronic component 3 is 1mm. If it is re-ordered, in real life, it takes a long period and high cost to re-order the electronic component 3;
- the printed circuit board 2 is soldered between the electronic component 3 and the flexible circuit board 1 to increase the height of the electronic component 3, with short cycle, low cost, and simple structure.
- the electronic component packaging structure of the present invention by stacking a layer of printed circuit boards on the flexible circuit board and forming electrical connections, and then fixing the electronic components on the printed circuit board, the printed circuit board and the flexible circuit
- the boards form electrical connections, so that the height of the printed circuit board is used to achieve the required height of the electronic component packaging structure, which not only has a short production cycle and low cost.
- This utility model provides an embodiment of the utility model described above, which does not limit the scope of the utility model's patent. Any equivalent structure or equivalent process transformation made by using the content of the utility model description and drawings, or Directly or indirectly used in other related technical fields are included in the scope of patent protection of the utility model for the same reason.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
An electronic element packaging structure (100), which comprises a flexible circuit board (1), an electronic element (3) stacked on the flexible circuit board (1) and forming an electrical connection, and a printed circuit board (2) fixedly stacked on the flexible circuit board (1) and forming an electrical connection with the flexible circuit board (1). The electronic element (3) is fixed onto the side of the printed circuit board (2) away from the flexible circuit board (1); the electronic element (3) is electrically connected to the printed circuit board (2) and electrically connected to the flexible circuit board (1) by means of the printed circuit board (2). Compared with the prior art, the electronic element packaging structure (100) is low in cost and short in manufacturing period.
Description
本实用新型涉及电子元件封装技术领域，尤其涉及一种电子元件封装结构。The utility model relates to the technical field of electronic component packaging, in particular to an electronic component packaging structure.
随着工业的发展，电子元件的种类越来越多，电子元件一般有固定的封装规格。封装时，部分柔性线路板（Flexible Printed Circuit，FPC）焊接电子元件以实现特征性能。With the development of industry, there are more and more types of electronic components, and electronic components generally have fixed packaging specifications. During packaging, part of the Flexible Printed Circuit (FPC) is soldered with electronic components to achieve characteristic performance.
然而，相关技术中，某些所述电子元件封装时需要达到特殊的高度，且这些特殊的高度超过所述标准封装规格，通过标准封装结构无法实现其封装，而订制该特殊高度要求的电子元件成本高，周期长。However, in the related art, some of the electronic components need to be packaged to a special height, and these special heights exceed the standard packaging specifications. The standard packaging structure cannot achieve their packaging, and the electronic components with the special height requirements are customized. The component cost is high and the cycle is long.
因此，有必要提供一种新的电子元件封装结构解决上述问题。Therefore, it is necessary to provide a new electronic component packaging structure to solve the above-mentioned problems.
本实用新型的目的在于提供一种成本低、制作周期短的电子元件封装结构。The purpose of the utility model is to provide an electronic component packaging structure with low cost and short production cycle.
为达到上述目的，本实用新型提供一种电子元件封装结构，其包括柔性电路板和叠设于所述柔性电路板并形成电连接的电子元件，所述电子元件封装结构还包括叠设固定于所述柔性电路板上并与所述柔性电路板形成电连接的印刷电路板，所述电子元件固定于所述印刷电路板远离所述柔性电路板的一侧，所述电子元件与所述印刷电路板电连接并通过所述印刷电路板与所述柔性电路板电连接。In order to achieve the above objective, the present invention provides an electronic component packaging structure, which includes a flexible circuit board and an electronic component stacked on the flexible circuit board and forming an electrical connection. The electronic component packaging structure also includes stacking and fixing on the flexible circuit board. A printed circuit board on the flexible circuit board that is electrically connected to the flexible circuit board, the electronic component is fixed on the side of the printed circuit board away from the flexible circuit board, and the electronic component is connected to the printed circuit board. The circuit board is electrically connected and is electrically connected to the flexible circuit board through the printed circuit board.
优选的，所述电子元件完全位于所述印刷电路板范围内。Preferably, the electronic component is completely located within the range of the printed circuit board.
优选的，所述印刷电路板完全位于所述柔性电路板范围内。Preferably, the printed circuit board is completely located within the range of the flexible circuit board.
优选的，所述印刷电路板的高度为1mm，所述电子元件的高度为1mm。Preferably, the height of the printed circuit board is 1 mm, and the height of the electronic component is 1 mm.
优选的，所述印刷电路板与所述柔性电路板通过焊接形成固定电连接。Preferably, the printed circuit board and the flexible circuit board form a fixed electrical connection by welding.
优选的，所述电子元件与所述印刷电路板通过焊接形成固定电连接。Preferably, the electronic component and the printed circuit board form a fixed electrical connection by welding.
与相关技术相比，本实用新型的电子元件封装结构，通过在柔性电路板上叠设一层印刷电路板并形成电连接，再将电子元件固定于印刷电路板，通过印刷电路板与柔性电路板形成电连接，从而利用印刷电路板的高度实现所述电子元件封装结构所需的高度，不仅制作周期短且成本低。Compared with the related art, the electronic component packaging structure of the present invention, by stacking a layer of printed circuit boards on the flexible circuit board and forming electrical connections, and then fixing the electronic components on the printed circuit board, the printed circuit board and the flexible circuit The boards form electrical connections, so that the height of the printed circuit board is used to achieve the required height of the electronic component packaging structure, which not only has a short production cycle and low cost.
为了更清楚地说明本实用新型实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本实用新型的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：In order to more clearly explain the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings needed in the description of the embodiments. Obviously, the drawings in the following description are only some implementations of the present utility model. For example, for those of ordinary skill in the art, without creative work, other drawings can be obtained based on these drawings, among which:
图1为本实用新型电子元件封装结构的俯视图；Figure 1 is a top view of the electronic component packaging structure of the present invention;
图2为本实用新型电子元件封装结构的正视图。Figure 2 is a front view of the electronic component packaging structure of the present invention.
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本实用新型的一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本实用新型保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, not all of them. Examples. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the scope of protection of the present utility model.
请参考图1-2所示，本实用新型提供一种电子元件封装结构100，其包括柔性电路板1、叠设于所述柔性电路板1并形成电连接的电子元件3以及印刷电路板2。Please refer to FIGS. 1-2. The present invention provides an electronic component packaging structure 100, which includes a flexible circuit board 1, an electronic component 3 stacked on the flexible circuit board 1 and forming electrical connections, and a printed circuit board 2. .
所述印刷电路板2固定于所述柔性电路板1上并与所述柔性电路板1形成电连接，所述电子元件3固定于所述印刷电路板2远离所述柔性电路板1的一侧，所述电子元件3与所述印刷电路板2电连接并通过所述印刷电路板2与所述柔性电路板1电连接。The printed circuit board 2 is fixed on the flexible circuit board 1 and forms an electrical connection with the flexible circuit board 1, and the electronic component 3 is fixed on a side of the printed circuit board 2 away from the flexible circuit board 1 The electronic component 3 is electrically connected to the printed circuit board 2 and is electrically connected to the flexible circuit board 1 through the printed circuit board 2.
本实施例中，所述电子元件3完全位于所述印刷电路板2范围内，所述印刷电路板2完全位于所述柔性电路板1范围内；所述印刷电路板2与所述柔性电路板1通过焊接形成固定电连接，所述电子元件3与所述印刷电路板2通过焊接形成固定电连接。In this embodiment, the electronic component 3 is completely located within the range of the printed circuit board 2, and the printed circuit board 2 is completely located within the range of the flexible circuit board 1; the printed circuit board 2 and the flexible circuit board 1 A fixed electrical connection is formed by soldering, and the electronic component 3 and the printed circuit board 2 are formed by soldering a fixed electrical connection.
所述印刷电路板2与所述柔性电路板1焊接固定，所述印刷电路板2与电子元件3焊接固定；两两结构之间通过焊接固定，其稳定性更好，且工艺简单，操作方便。The printed circuit board 2 and the flexible circuit board 1 are welded and fixed, and the printed circuit board 2 and the electronic components 3 are welded and fixed; the two structures are fixed by welding, which has better stability, simple process and convenient operation .
本实施例中，所述印刷电路板2的高度a和所述电子元件3的高度均为1mm。当然所述印刷电路板2的高度a也可以为其他高度，根据实际需要确定。In this embodiment, the height a of the printed circuit board 2 and the height of the electronic component 3 are both 1 mm. Of course, the height a of the printed circuit board 2 can also be other heights, which are determined according to actual needs.
如在本实施例中，电子元件封装结构100需要运用于某些特定的场合，其所述电子元件3和所述印刷电路板2的叠加起来的高度需要达到2mm；然而本实施例中所述电子元件3的高度为1mm，若重新订制，在实际生活中，重新订制电子元件3需要的周期长且成本高；本实施例中仅通过增加1mm高度的印刷电路板2，将所述印刷电路板2焊接在所述电子元件3和柔性电路板1之间，以增加所述电子元件3的高度，周期短，成本低，且结构简单。For example, in this embodiment, the electronic component packaging structure 100 needs to be applied to some specific occasions, and the superimposed height of the electronic component 3 and the printed circuit board 2 needs to reach 2mm; however, as described in this embodiment The height of the electronic component 3 is 1mm. If it is re-ordered, in real life, it takes a long period and high cost to re-order the electronic component 3; The printed circuit board 2 is soldered between the electronic component 3 and the flexible circuit board 1 to increase the height of the electronic component 3, with short cycle, low cost, and simple structure.
与相关技术相比，本实用新型的电子元件封装结构，通过在柔性电路板上叠设一层印刷电路板并形成电连接，再将电子元件固定于印刷电路板，通过印刷电路板与柔性电路板形成电连接，从而利用印刷电路板的高度实现所述电子元件封装结构所需的高度，不仅制作周期短且成本低。Compared with the related art, the electronic component packaging structure of the present invention, by stacking a layer of printed circuit boards on the flexible circuit board and forming electrical connections, and then fixing the electronic components on the printed circuit board, the printed circuit board and the flexible circuit The boards form electrical connections, so that the height of the printed circuit board is used to achieve the required height of the electronic component packaging structure, which not only has a short production cycle and low cost.
本实用新型提供一种以上所述仅为本实用新型的实施例，并非因此限制本实用新型的专利范围，凡是利用本实用新型说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本实用新型的专利保护范围内。This utility model provides an embodiment of the utility model described above, which does not limit the scope of the utility model's patent. Any equivalent structure or equivalent process transformation made by using the content of the utility model description and drawings, or Directly or indirectly used in other related technical fields are included in the scope of patent protection of the utility model for the same reason.
Claims (6)
- 一种电子元件封装结构，其包括柔性电路板和叠设于所述柔性电路板并形成电连接的电子元件，其特征在于，所述电子元件封装结构还包括叠设固定于所述柔性电路板上并与所述柔性电路板形成电连接的印刷电路板，所述电子元件固定于所述印刷电路板远离所述柔性电路板的一侧，所述电子元件与所述印刷电路板电连接并通过所述印刷电路板与所述柔性电路板电连接。An electronic component packaging structure, comprising a flexible circuit board and electronic components stacked on the flexible circuit board and forming electrical connections, wherein the electronic component packaging structure further includes stacking and fixing to the flexible circuit board A printed circuit board on and electrically connected to the flexible circuit board, the electronic component is fixed on the side of the printed circuit board away from the flexible circuit board, the electronic component is electrically connected to the printed circuit board and The printed circuit board is electrically connected to the flexible circuit board.
- 根据权利要求1所述的电子元件封装结构，其特征在于，所述电子元件完全位于所述印刷电路板范围内。The electronic component packaging structure according to claim 1, wherein the electronic component is completely located within the range of the printed circuit board.
- 根据权利要求2所述的电子元件封装结构，其特征在于，所述印刷电路板完全位于所述柔性电路板范围内。4. The electronic component packaging structure according to claim 2, wherein the printed circuit board is completely located within the range of the flexible circuit board.
- 根据权利要求1所述的电子元件封装结构，其特征在于，所述印刷电路板的高度为1mm，所述电子元件的高度为1mm。The electronic component packaging structure according to claim 1, wherein the height of the printed circuit board is 1 mm, and the height of the electronic component is 1 mm.
- 根据权利要求1所述的电子元件封装结构，其特征在于，所述印刷电路板与所述柔性电路板通过焊接形成固定电连接。4. The electronic component packaging structure of claim 1, wherein the printed circuit board and the flexible circuit board form a fixed electrical connection by welding.
- 根据权利要求1所述的电子元件封装结构，其特征在于，所述电子元件与所述印刷电路板通过焊接形成固定电连接。The electronic component packaging structure according to claim 1, wherein the electronic component and the printed circuit board form a fixed electrical connection by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2019/129543 WO2021128366A1 (en) | 2019-12-28 | 2019-12-28 | Electronic element packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2019/129543 WO2021128366A1 (en) | 2019-12-28 | 2019-12-28 | Electronic element packaging structure |
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| Publication Number | Publication Date |
|---|---|
| WO2021128366A1 true WO2021128366A1 (en) | 2021-07-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2019/129543 WO2021128366A1 (en) | 2019-12-28 | 2019-12-28 | Electronic element packaging structure |
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| Country | Link |
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| WO (1) | WO2021128366A1 (en) |
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| US20130083494A1 (en) * | 2011-10-04 | 2013-04-04 | Sierra Wireless, Inc. | Three-dimensional electronics packaging |
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| CN109478554A (en) * | 2016-04-29 | 2019-03-15 | Lg伊诺特有限公司 | Camera model and portable unit including the camera model |
| CN110337178A (en) * | 2019-04-25 | 2019-10-15 | 维沃移动通信有限公司 | A kind of circuit board assemblies and electronic equipment |
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2019
- 2019-12-28 WO PCT/CN2019/129543 patent/WO2021128366A1/en active Application Filing
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130083494A1 (en) * | 2011-10-04 | 2013-04-04 | Sierra Wireless, Inc. | Three-dimensional electronics packaging |
| CN109478554A (en) * | 2016-04-29 | 2019-03-15 | Lg伊诺特有限公司 | Camera model and portable unit including the camera model |
| CN106028643A (en) * | 2016-05-25 | 2016-10-12 | 武汉华星光电技术有限公司 | Flexible main board, flexible display equipment and manufacturing method for flexible main board |
| CN108307584A (en) * | 2017-01-13 | 2018-07-20 | 株式会社村田制作所 | Component module |
| CN108156756A (en) * | 2018-02-06 | 2018-06-12 | 国蓉科技有限公司 | A kind of isomery just have mercy on plate and based on isomery just have mercy on plate multi-layer board card manufacturing method |
| CN110337178A (en) * | 2019-04-25 | 2019-10-15 | 维沃移动通信有限公司 | A kind of circuit board assemblies and electronic equipment |
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