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WO2021145734A1 - Ensemble d'affichage comprenant une antenne et dispositif électronique le comprenant - Google Patents

Ensemble d'affichage comprenant une antenne et dispositif électronique le comprenant Download PDF

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Publication number
WO2021145734A1
WO2021145734A1 PCT/KR2021/000622 KR2021000622W WO2021145734A1 WO 2021145734 A1 WO2021145734 A1 WO 2021145734A1 KR 2021000622 W KR2021000622 W KR 2021000622W WO 2021145734 A1 WO2021145734 A1 WO 2021145734A1
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WO
WIPO (PCT)
Prior art keywords
display
antenna
disposed
layer
display substrate
Prior art date
Application number
PCT/KR2021/000622
Other languages
English (en)
Korean (ko)
Inventor
손동일
변형섭
조치현
천재봉
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2021145734A1 publication Critical patent/WO2021145734A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly

Definitions

  • Various embodiments of the present disclosure relate to a display assembly including an antenna and an electronic device including the same.
  • the electronic device may output the stored information as sound or image.
  • various functions may be mounted in one electronic device, such as a mobile communication terminal, in recent years. For example, not only communication functions, but also entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions for mobile banking, etc., and functions such as schedule management and electronic wallets are integrated into one electronic device. there is.
  • Various circuit components for providing the integrated function are mounted on a circuit board in an electronic device, and accordingly, mounting space efficiency is becoming important.
  • a next-generation communication system for example, a next-generation (eg, 5th generation) communication system, or Efforts are being made to develop next-generation communication systems.
  • a next-generation communication system is being implemented in a very high frequency band such as a millimeter wave (mm Wave) (a band of several tens of GHz, for example, a band of 6 GHz or more and 300 GHz or less).
  • mm Wave millimeter wave
  • the size of the circuit board on which the circuit components are disposed may be increased or the circuit boards may be designed by stacking them.
  • an antenna structure used for next-generation communication eg, millimeter wave communication
  • the surrounding environment may be affected by high-frequency characteristics. For example, even with a next-generation communication antenna having the same structure, performance may vary depending on an actual installation environment.
  • a communication device including an antenna may be mounted by using a display substrate (eg, a substrate) mounted on the display assembly.
  • a display substrate eg, a substrate
  • the board additionally disposed on one side of the main circuit board used for the antenna it is possible to secure a degree of freedom in the mounting space of the electronic device.
  • the display substrate mounted on the display assembly may be extended or bent, and the communication device may be mounted on the surface facing various directions of the display substrate.
  • a portable communication device may include a printed circuit board on which a processor is positioned and a display electrically connected to the processor.
  • the display may include a transparent member, a display substrate disposed under the transparent member, at least a portion of which is bent, a display element layer disposed on or above the display substrate, and on or above the display substrate.
  • the antenna may include an disposed antenna, and at least a portion disposed along a bent region of the display substrate, and a communication wire electrically connected to the antenna.
  • the display assembly includes a first area, a second area, and a portion between the first area and the second area, and at least a portion is bent to form the second area as a part of the first area and a display substrate including a bending region facing the display device, a display element layer disposed on the first region and including a plurality of display pixels, and an antenna structure disposed on or above the display substrate.
  • the antenna structure includes an antenna disposed over at least one of the first area, the second area, and the bending area, a wireless communication circuit disposed over the second area, and at least a portion of the bending area is formed along the bending area, and a communication wire electrically connecting the antenna and the wireless communication circuit.
  • An electronic device includes a transparent member, a display element layer disposed under the transparent member and including one or more display pixels, a first region connected to the one or more display pixels, and the first region A display substrate extending from and including a bending region bent downward, an antenna formed over at least a portion of the first region of the display substrate, and a communication wire connected to the antenna and formed along the bending region of the display substrate. can do.
  • the electronic device may improve the degree of freedom in design inside the electronic device by arranging the antenna structure inside the display assembly and maintaining the performance of the wireless communication device.
  • the electronic device may connect an antenna and a wireless communication circuit by extending or bending a display substrate disposed inside a display assembly and forming a communication line along the extended or bent section. Accordingly, the antenna may be positioned at various positions, such as facing the front, rear, or side of the electronic device.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure
  • FIG. 2 is a block diagram of a display device according to various embodiments of the present disclosure.
  • FIG. 3 is a front perspective view of an electronic device, according to various embodiments of the present disclosure.
  • FIG. 4 is a rear perspective view of an electronic device, according to various embodiments of the present disclosure.
  • FIG. 5 is an exploded perspective view of an electronic device, according to various embodiments of the present disclosure.
  • FIG. 6 is a diagram illustrating an example of an electronic device supporting 5G communication.
  • FIG. 7 is a block diagram of a communication device according to an embodiment.
  • FIG. 8 is a cross-sectional view illustrating a stacked structure of layers constituting a display assembly disposed in an electronic device and an antenna according to one of various embodiments of the present disclosure
  • FIGS. 9A and 9B are cross-sectional views illustrating a display substrate constituting a display assembly disposed in an electronic device and structures of wirings disposed on the display substrate according to one embodiment of the present disclosure
  • FIGS. 10A and 10B are cross-sectional views illustrating a display substrate constituting a display assembly disposed in an electronic device and structures of wirings disposed on the display substrate according to one of various embodiments of the present disclosure
  • FIG. 11 is a cross-sectional view illustrating a stacked structure of layers constituting a display assembly disposed in an electronic device and an antenna according to one of various embodiments of the present disclosure
  • FIG. 12 is a cross-sectional view illustrating a stacked structure of layers constituting a display assembly disposed in an electronic device and an antenna according to one of various embodiments of the present disclosure
  • FIG. 13 is a cross-sectional view illustrating a stacked structure of layers constituting a display assembly disposed in an electronic device and an antenna according to one of various embodiments of the present disclosure
  • FIG. 14 is a cross-sectional view illustrating a stacked structure of layers constituting a display assembly disposed in an electronic device and an antenna according to one of various embodiments of the present disclosure
  • 15 is a cross-sectional view illustrating a stacked structure of layers constituting a display assembly disposed in an electronic device and an antenna according to one of various embodiments of the present disclosure
  • 16 is an exploded perspective view illustrating an electronic device including a display assembly according to various embodiments of the present disclosure
  • 17A and 17B are stacked perspective views illustrating a configuration of a display assembly according to various embodiments of the present disclosure
  • 18A, 18B, and 18C are schematic diagrams illustrating an arrangement structure between a pixel(s) 633a and an antenna electrode, according to various embodiments of the present disclosure.
  • FIG. 19 is a schematic diagram illustrating a disposition relationship between a sensor electrode and an antenna electrode, according to various embodiments of the present disclosure.
  • FIG. 20 is a schematic diagram illustrating a time division switching operation of a display assembly according to various embodiments of the present disclosure
  • 21 is a cross-sectional view of a substrate of a display assembly and electrical components disposed on the substrate, according to various embodiments of the present disclosure
  • 22 is a block diagram illustrating a connection structure between a display assembly and a main circuit board according to various embodiments of the present disclosure
  • 23A, 23B, and 23C are diagrams illustrating the arrangement of wireless communication circuitry in a display assembly, according to various embodiments of the present disclosure
  • 24A, 24B, and 24C are diagrams illustrating placement of wireless communication circuitry in a display assembly, according to various embodiments of the present disclosure
  • 25A, 25B, and 25C are diagrams illustrating placement of wireless communication circuitry in a display assembly, according to various embodiments of the present disclosure.
  • 26A, 26B, and 26C are diagrams illustrating placement of wireless communication circuitry in a display assembly, according to various embodiments of the present disclosure
  • 27A and 27B are diagrams illustrating the arrangement of wireless communication circuitry in a display assembly, according to various embodiments of the present disclosure
  • 28A, 28B, and 28C are diagrams illustrating placement of wireless communication circuitry in a display assembly, according to various embodiments of the present disclosure.
  • 29 is a cross-sectional view illustrating the arrangement of a wireless communication circuit and a heat dissipation structure in a display assembly according to various embodiments of the present disclosure
  • FIG. 30 is a cross-sectional view illustrating the arrangement of a wireless communication circuit and a heat dissipation structure in a display assembly, according to various embodiments of the present disclosure
  • FIG. 1 it is a block diagram of the electronic device 101 in the network environment 100 .
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120 , a memory 130 , an input device 150 , a sound output device 155 , a display device 160 , an audio module 170 , and a sensor module ( 176 , interface 177 , haptic module 179 , camera module 180 , power management module 188 , battery 189 , communication module 190 , subscriber identification module 196 , or antenna module 197 . ) may be included. In some embodiments, at least one of these components (eg, the display device 160 or the camera module 180 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components may be implemented as one integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).
  • the sensor module 176 eg, a fingerprint sensor, an iris sensor, or an illuminance sensor
  • the processor 120 for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be loaded into the volatile memory 132 , process commands or data stored in the volatile memory 132 , and store the resulting data in the non-volatile memory 134 .
  • software eg, a program 140
  • the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 .
  • the volatile memory 132 may be loaded into the volatile memory 132 , process commands or data stored in the volatile memory 132 , and store the resulting data in the non-volatile memory 134 .
  • the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and a secondary processor 123 (eg, a graphics processing unit, an image signal processor) that can be operated independently or in conjunction with the main processor 121 . , a sensor hub processor, or a communication processor). Additionally or alternatively, the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function. The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .
  • a main processor 121 eg, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphics processing unit, an image signal processor
  • the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function.
  • the auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .
  • the auxiliary processor 123 may be, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the coprocessor 123 eg, an image signal processor or a communication processor
  • may be implemented as part of another functionally related component eg, the camera module 180 or the communication module 190. have.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 .
  • the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input device 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 .
  • the input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).
  • the sound output device 155 may output a sound signal to the outside of the electronic device 101 .
  • the sound output device 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
  • the display device 160 may visually provide information to the outside (eg, a user) of the electronic device 101 .
  • the display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device.
  • the display device 160 may include a touch circuitry configured to sense a touch or a sensor circuit (eg, a pressure sensor) configured to measure the intensity of a force generated by the touch. there is.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input device 150 , or an external electronic device (eg, a sound output device 155 ) connected directly or wirelessly with the electronic device 101 . The sound may be output through the electronic device 102 (eg, a speaker or a headphone).
  • an external electronic device eg, a sound output device 155
  • the sound may be output through the electronic device 102 (eg, a speaker or a headphone).
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 388 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module).
  • a wireless communication module 192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 eg, : It may include a local area network (LAN) communication module, or a power line communication module.
  • a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, WiFi direct, or IrDA (infrared data association)) or a second network 199 (eg, a cellular network, the Internet, or It may communicate with an external electronic device via a computer network (eg, a telecommunication network such as a LAN or WAN).
  • a computer network eg, a telecommunication network such as a LAN or WAN.
  • These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other.
  • the wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 .
  • the electronic device 101 may be identified and authenticated.
  • the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, RFIC
  • other than the radiator may be additionally formed as a part of the antenna module 197 .
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the electronic devices 102 and 104 may be the same or a different type of the electronic device 101 .
  • all or part of the operations performed by the electronic device 101 may be executed by one or more of the external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • the one or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the execution result to the electronic device 101 .
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, or client-server computing technology may be used.
  • the electronic device may have various types of devices.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a wearable device e.g., a smart bracelet
  • a home appliance device e.g., a home appliance
  • first”, “second”, or “first” or “second” may simply be used to distinguish the component from other components in question, and may refer to components in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When mentioned, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101).
  • a storage medium eg, internal memory 136 or external memory 138
  • the processor eg, the processor 120
  • the device eg, the electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not include a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.
  • a signal eg, electromagnetic wave
  • the method according to various embodiments disclosed in this document may be provided in a computer program product (computer program product).
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play Store TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones).
  • a part of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.
  • each component eg, a module or a program of the above-described components may include a singular or a plurality of entities.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.
  • FIG. 2 is a block diagram of a display device according to various embodiments of the present disclosure.
  • the display device 160 may include a display 210 and a display driver IC (DDI) 230 for controlling the display 210 .
  • the DDI 230 may include an interface module 231 , a memory 233 (eg, a buffer memory), an image processing module 235 , or a mapping module 237 .
  • the DDI 230 may receive, for example, image data or image information including an image control signal corresponding to a command for controlling the image data from other components of the electronic device through the interface module 231 .
  • the image information is provided by a processor (eg, the main processor 121 (eg, an application processor) of FIG. 1 ) or an auxiliary processor (eg, in FIG.
  • the DDI 230 may communicate with the touch circuit 250 or the sensor module 176 through the interface module 231. Also, the DDI 230 may store at least a portion of the received image information in the memory 233, for example, in units of frames.
  • the image processing module 235 may store, for example, at least a portion of the image data in the memory 233. Pre-processing or post-processing (eg, adjusting resolution, brightness, or size) may be performed based on at least the characteristics of the image data or the characteristics of the display 210.
  • the mapping module 237 may A voltage value or a current value corresponding to the pre-processed or post-processed image data may be generated, according to an embodiment, the generation of the voltage value or the current value may include, for example, a property (eg, a property of pixels of the display 210 ). : may be performed based at least in part on an arrangement of pixels (RGB stripe or pentile structure), or a size of each sub-pixel) At least some pixels of the display 210 may have, for example, the voltage value or the current value Visual information (eg, text, image, or icon) corresponding to the image data may be displayed through the display 210 by being driven based at least in part on the display 210 .
  • a property eg, a property of pixels of the display 210
  • Visual information eg, text, image, or icon
  • the display device 160 may further include a touch circuit 250 .
  • the touch circuit 250 may include a touch sensor 251 and a touch sensor IC 253 for controlling the touch sensor 251 .
  • the touch sensor IC 253 may control the touch sensor 251 to sense a touch input or a hovering input for a specific position of the display 210 , for example.
  • the touch sensor IC 253 may detect a touch input or a hovering input by measuring a change in a signal (eg, voltage, light amount, resistance, or electric charge amount) for a specific position of the display 210 .
  • the touch sensor IC 253 may provide information (eg, location, area, pressure, or time) regarding the sensed touch input or hovering input to the processor 120 .
  • At least a part of the touch circuit 250 is disposed as a part of the display driver IC 230 , the display 210 , or outside the display device 160 . may be included as a part of other components (eg, the coprocessor 123).
  • the display device 160 may further include at least one sensor (eg, a fingerprint sensor, an iris sensor, a pressure sensor, or an illuminance sensor) of the sensor module 176 , or a control circuit therefor.
  • the at least one sensor or a control circuit therefor may be embedded in a part of the display device 160 (eg, the display 210 or the DDI 230 ) or a part of the touch circuit 250 .
  • the sensor module 176 embedded in the display device 160 includes a biometric sensor (eg, a fingerprint sensor)
  • the biometric sensor provides biometric information related to a touch input through a partial area of the display 210 . (eg, fingerprint image) can be acquired.
  • the pressure sensor may acquire pressure information related to a touch input through a part or the entire area of the display 210 .
  • the touch sensor 251 or the sensor module 176 may be disposed between pixels of the pixel layer of the display 210 , or above or below the pixel layer.
  • FIG. 3 is a front perspective view of an electronic device 101 according to various embodiments of the present disclosure.
  • 4 is a rear perspective view of the electronic device 101 according to various embodiments of the present disclosure.
  • the electronic device 101 includes a first surface (or front) 310A, a second surface (or rear) 310B, and a first surface 310A and
  • the housing 310 may include a side surface 310C surrounding the space between the second surfaces 310B.
  • the housing may refer to a structure forming a part of the first surface 310A, the second surface 310B, and the side surface 310C of FIG. 3 .
  • the first surface 310A may be formed by a front plate 302 (eg, a glass plate or a polymer plate) that is at least partially transparent.
  • the second surface 310B may be formed by a substantially opaque back plate 311 .
  • the back plate 311 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.
  • the side surface 310C is coupled to the front plate 302 and the rear plate 311 and may be formed by a side bezel structure (or “side member”) 318 including a metal and/or a polymer.
  • the back plate 311 and the side bezel structure 318 are integrally formed and may include the same material (eg, a metal material such as aluminum).
  • the front plate 302 includes two first regions 310D that extend seamlessly from the first surface 310A toward the rear plate 311 by bending the front plate. It may include both ends of the long edge of (302).
  • the rear plate 311 has two second regions 310E that extend seamlessly by bending from the second surface 310B toward the front plate 302 with long edges. It can be included at both ends.
  • the front plate 302 (or the back plate 311 ) may include only one of the first regions 310D (or the second regions 310E). In another embodiment, some of the first regions 310D or the second regions 310E may not be included.
  • the side bezel structure 318 when viewed from the side of the electronic device 101 , has a side surface that does not include the first regions 310D or the second regions 310E as described above. It may have a first thickness (or width), and may have a second thickness thinner than the first thickness at a side surface including the first regions 310D or the second regions 310E.
  • the electronic device 101 includes a display 301 , an audio module 303 , 307 , 314 , a sensor module 304 , 316 , 319 , a camera module 305 , 312 , 313 , and a key input. at least one of a device 317 , a light emitting element 306 , and a connector hole 308 . In some embodiments, the electronic device 101 may omit at least one of the components (eg, the key input device 317 or the light emitting device 306 ) or additionally include other components.
  • the display 301 may be visually exposed through, for example, a substantial portion of the front plate 302 .
  • at least a portion of the display 301 may be exposed through the front plate 302 forming the first areas 310D of the first surface 310A and the side surface 310C.
  • the edge of the display 301 may be formed to be substantially the same as an adjacent outer shape of the front plate 302 .
  • the distance between the outer edge of the display 301 and the outer edge of the front plate 302 may be substantially the same.
  • a recess or opening is formed in a part of the screen display area of the display 301 , and the audio module 314 is aligned with the recess or the opening, the sensor It may include at least one of a module 304 , a camera module 305 , and a light emitting device 306 .
  • an audio module 314 , a sensor module 304 , a camera module 305 , a fingerprint sensor 316 , and a light emitting element 306 . may include at least one or more of.
  • the display 301 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. can be placed.
  • a touch sensing circuit a pressure sensor capable of measuring the intensity (pressure) of a touch
  • a digitizer that detects a magnetic field type stylus pen.
  • at least a portion of the sensor module 304 , 519 , and/or at least a portion of a key input device 317 , the first region 310D, and/or the second region 310E can be placed in
  • the audio modules 303 , 307 , and 314 may include, for example, a microphone hole 303 and speaker holes 307 and 314 .
  • a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound.
  • the speaker holes 307 and 314 may include an external speaker hole 307 and a call receiver hole 314 .
  • the speaker holes 307 and 314 and the microphone hole 303 may be implemented as a single hole, or a speaker may be included without the speaker holes 307 and 314 (eg, a piezo speaker).
  • the audio modules 303 , 307 , and 314 are not limited to the above structure, and may be variously designed and changed according to the structure of the electronic device 101 , such as mounting only some audio modules or adding a new audio module.
  • the sensor modules 304 , 316 , and 319 may generate, for example, an electrical signal or data value corresponding to an internal operating state of the electronic device 101 or an external environmental state.
  • the sensor modules 304 , 316 , 319 may include, for example, a first sensor module 304 (eg, a proximity sensor) and/or a second sensor module (eg, a second sensor module) disposed on the first side 310A of the housing 310 . (not shown) (eg, a fingerprint sensor), and/or a third sensor module 319 (eg, HRM sensor) and/or a fourth sensor module 316 disposed on the second side 310B of the housing 310 . ) (eg fingerprint sensor).
  • a first sensor module 304 eg, a proximity sensor
  • a second sensor module eg, a second sensor module
  • a third sensor module 319 eg, HRM sensor
  • fourth sensor module 316 disposed on the second side 310B of the housing 310 .
  • the fingerprint sensor may be disposed on the first surface 310A (eg, the display 301) as well as the second surface 310B of the housing 310.
  • the electronic device 101 may include a sensor module, not shown, for example.
  • a sensor module not shown, for example.
  • at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 304 is further added.
  • the sensor modules 304 , 316 , and 319 are not limited to the above structure, and the design may be changed in various ways, such as mounting only some sensor modules or adding a new sensor module, depending on the structure of the electronic device 101 . there is.
  • the camera modules 305 , 312 , and 313 are, for example, a first camera device 305 disposed on a first side 310A of the electronic device 101 , and a second side 310B. ) disposed in the second camera device 312 , and/or a flash 313 .
  • the camera module 305, 312 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 313 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 101 .
  • the camera modules 305 , 312 , and 313 are not limited to the above structure, and may be designed and changed in various ways, such as mounting only some camera modules or adding a new camera module, depending on the structure of the electronic device 101 .
  • the key input device 317 may be disposed, for example, on the side surface 310C of the housing 310 .
  • the electronic device 101 may not include some or all of the above-mentioned key input devices 317 and the not included key input devices 317 may be displayed on the display 301 as soft keys, etc. It can be implemented in the form
  • the key input device may include a sensor module 316 disposed on the second surface 310B of the housing 310 .
  • the light emitting device 306 may be disposed on the first surface 310A of the housing 310 , for example.
  • the light emitting device 306 may provide, for example, state information of the electronic device 101 in the form of light.
  • the light emitting device 306 may provide, for example, a light source that is linked to the operation of the camera module 305 .
  • Light emitting element 306 may include, for example, LEDs, IR LEDs, and xenon lamps.
  • the connector hole 308 is, for example, a first connector hole 308 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data with an external electronic device. ), and/or a second connector hole (eg, earphone jack) (not shown) capable of accommodating a connector for transmitting and receiving audio signals to and from an external electronic device.
  • the connector hole 308 is not limited to the above structure, and various design changes may be made, such as mounting only some connector holes or adding a new connector hole, depending on the structure of the electronic device 101 .
  • FIG 5 is an exploded perspective view of an electronic device 101 according to various embodiments of the present disclosure.
  • the electronic device 101 (eg, the electronic device 101 of FIGS. 1 to 3 ) according to various embodiments includes a side bezel structure 331 and a first support member 332 (eg: bracket), the front plate 320 , the display 330 , the printed circuit board 340 , the battery 350 , the second support member 360 (eg, the rear case), the antenna 370 , and the rear plate 380 . ) may be included.
  • the electronic device 101 may omit at least one of the components (eg, the first support member 332 or the second support member 360 ) or additionally include other components. .
  • At least one of the components of the electronic device 101 may be the same as or similar to at least one of the components of the electronic device 101 of FIG. 2 or 3 , and overlapping descriptions will be omitted below.
  • the first support member 332 may be disposed inside the electronic device 101 and may be connected to the side bezel structure 331 or may be integrally formed with the side bezel structure 331 .
  • the first support member 332 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the first support member 332 may have a display 330 coupled to one side and a printed circuit board 340 coupled to the other side thereof.
  • the printed circuit board 340 may be equipped with a processor, memory, and/or an interface.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may, for example, electrically or physically connect the electronic device 101 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery 350 is a device for supplying power to at least one component of the electronic device 101 , for example, a non-rechargeable primary battery, or a rechargeable secondary battery, or fuel. It may include a battery. At least a portion of the battery 350 may be disposed substantially on the same plane as the printed circuit board 340 , for example. The battery 350 may be integrally disposed inside the electronic device 101 or may be detachably disposed with the electronic device 101 .
  • the antenna 370 may be disposed between the rear plate 380 and the battery 350 .
  • the antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
  • the antenna structure may be formed by a part of the side bezel structure 331 and/or the first support member 332 or a combination thereof.
  • FIG. 6 is a diagram illustrating an example of an electronic device 101 supporting 5G communication, according to various embodiments of the present disclosure.
  • the electronic device 101 includes a housing 410 , a processor 440 , a communication module 450 (eg, the communication module 190 of FIG. 1 ), a first communication device 421 , and a second Communication device 422 , third communication device 423 , fourth communication device 424 , first conductive line 431 , second conductive line 432 , third conductive line 433 , or fourth conductive line line 434 .
  • a communication module 450 eg, the communication module 190 of FIG. 1
  • the housing 410 may protect other components of the electronic device 101 .
  • the housing 410 is attached to or integrally formed with, for example, a front plate, a back plate facing away from the front plate, and a front plate. It may include a side member (or a metal frame) surrounding the space between the plate and the back plate.
  • the electronic device 101 may include at least one communication device.
  • the electronic device 101 may include at least one of a first communication device 421 , a second communication device 422 , a third communication device 423 , or a fourth communication device 424 . .
  • the first communication device 421 , the second communication device 422 , the third communication device 423 , or the fourth communication device 424 may be located inside the housing 410 .
  • the first communication device 421 when viewed from the rear plate of the electronic device, the first communication device 421 may be disposed on the upper left side of the electronic device 101 , and the second communication device 422 may be the electronic device 101 .
  • the third communication device 423 may be disposed at the lower left side of the electronic device 101
  • the fourth communication device 424 may be disposed at the lower right side of the electronic device 101 .
  • the processor 440 is one of a central processing unit, an application processor, a graphic processing unit (GPU), an image signal processor of a camera, or a baseband processor (or a communication processor (CP)). or more.
  • the processor 440 may be implemented as a system on chip (SoC) or a system in package (SiP).
  • the communication module 450 may be electrically connected to at least one communication device using at least one conductive line.
  • the communication module 450 uses the first conductive line 431 , the second conductive line 432 , the third conductive line 433 , or the fourth conductive line 434 , and the first communication device 421 , the second communication device 422 , the third communication device 423 , or the fourth communication device 424 may be electrically connected.
  • the communication module 450 may include, for example, a baseband processor or at least one communication circuit (eg, IFIC or RFIC).
  • the communication module 450 may include, for example, a baseband processor separate from the processor 440 (eg, an application processor (AP)).
  • the first conductive line 431 , the second conductive line 432 , the third conductive line 433 , or the fourth conductive line 434 may include, for example, a coaxial cable or an FPCB.
  • the communication module 450 may include a first baseband processor (BP) (not shown) or a second baseband processor (BP) (not shown).
  • the electronic device 101 may further include one or more interfaces for supporting inter-chip communication between the first BP (or the second BP) and the processor 440 .
  • the processor 440 and the first BP or the second BP may transmit/receive data using the inter-processor communication channel.
  • the first BP or the second BP may provide an interface for communicating with other entities.
  • the first BP may support wireless communication for, for example, a first network (not shown).
  • the second BP may support wireless communication for, for example, a second network (not shown).
  • the first BP or the second BP may form one module with the processor 440 .
  • the first BP or the second BP may be integrally formed with the processor 440 .
  • the first BP or the second BP may be disposed in one chip or may be formed in the form of an independent chip.
  • the processor 440 and at least one baseband processor eg, the first BP
  • SoC chip the other baseband processor
  • the other baseband processor eg, the second BP
  • the first network (not shown) or the second network (not shown) may correspond to the network 199 of FIG. 1 .
  • the first network (not shown) and a second network (not shown) each of which may comprise a 4G (4 th generation) networks, and 5G (5 th generation) networks.
  • the 4G network may support, for example, a long term evolution (LTE) protocol defined in 3GPP.
  • the 5G network may support, for example, a new radio (NR) protocol specified in 3GPP.
  • LTE long term evolution
  • NR new radio
  • FIG. 7 is a block diagram of a communication device according to various embodiments of the present disclosure.
  • a communication device 500 (eg, the first communication device 421 , the second communication device 422 , the third communication device 423 , or the fourth communication device 424 of FIG. 6 ).
  • a communication circuit 530 , a first antenna array 540 , or a second antenna array 545 may be positioned on one side of the display assembly 550 .
  • a first antenna array 540 , or a second antenna array 545 is disposed on a first side of a substrate disposed on the display assembly 550 , and a second side of the substrate disposed on the display assembly 550 is disposed.
  • a communication circuit 530 may be located on the surface.
  • the display assembly 550 uses a transmission line (eg, the first conductive line 431 of FIG. 5 , a coaxial cable) to another PCB (eg, a PCB on which the communication module 450 of FIG.
  • the display assembly 550 is connected to a PCB on which the communication module 450 is disposed by a coaxial cable using, for example, a coaxial cable connector, and the coaxial cable is used for transmission of transmit and receive IF signals or RF signals.
  • a connector eg, a coaxial cable connector or a board to board (B-to-B)
  • the display assembly 550 is connected to a PCB on which the communication module 450 is disposed by a coaxial cable using, for example, a coaxial cable connector, and the coaxial cable is used for transmission of transmit and receive IF signals or RF signals.
  • power or other control signals may be transmitted through the B-to-B connector.
  • the first antenna array 540 or the second antenna array 545 may include a plurality of antennas.
  • the antenna may include a patch antenna, a loop antenna, or a dipole antenna.
  • the plurality of antennas included in the first antenna array 540 may be patch antennas to form beams toward the rear plate of the electronic device 400 .
  • the plurality of antennas included in the second antenna array 545 may be a dipole antenna or a loop antenna to form a beam toward a side member of the electronic device 400 .
  • the communication circuit 530 may support at least some bands (eg, 24 GHZ to 30 GHZ or 37 GHz to 40 GHz) among 6 GHZ to 300 GHZ bands.
  • the communication circuit 530 may up-convert or down-convert the frequency.
  • the communication circuit 530 included in the communication device 500 eg, the first communication device 421 of FIG. 6
  • the communication module eg, the communication module 450 of FIG. 6
  • An IF signal received through the first conductive line 431 of FIG. 6 may be up-converted into an RF signal.
  • the communication circuit 530 included in the communication device 500 (eg, the first communication device 421 of FIG. 6 ) is received through the first antenna array 540 or the second antenna array 545 .
  • An RF signal (eg millimeter wave signal) can be down-converted to an IF signal and transmitted to a communication module using a conductive line.
  • FIG. 8 is a cross-sectional view illustrating a stacked structure of layers constituting a display assembly disposed in an electronic device (eg, a portable communication device) and an antenna according to one of various embodiments of the present disclosure
  • the display assembly 330 is a transparent member 610 , disposed under the transparent member 610 , and at least a part of a bent display substrate 631 (substrate) (eg, a substrate). , the display element layer 633 disposed on or above the display substrate 631 , the antenna 641 disposed on or above the display substrate 631 , and bending of the display substrate 631 . At least a portion of the region may include a communication wire 645 electrically connected to the antenna 641 .
  • the display assembly 330 may further include a wireless communication circuit 643 electrically connected to the antenna 641 through a communication wire 645 .
  • the display assembly 330 includes a display substrate 631 including a first area S1 , a bending area S3 , and a second area S2 , and on the first area S1 . or above), and an antenna structure 601 disposed on or above the display substrate 631 , wherein the antenna structure 601 is disposed on the first region S1 .
  • antenna 641 , the wireless communication circuit 643 disposed on the second area S2 , and at least a part of it is located along the bending area S3 , and electrically connects the antenna 641 and the wireless communication circuit 643 .
  • a connected communication line 645 may be included.
  • the structure of the display assembly 330 of FIG. 8 may be partially or entirely the same as that of the display device 160 of FIG. 1 and the displays 301 or 330 of FIGS. 3 to 5 .
  • the structure of the antenna 641 of FIG. 8 may be partially or entirely the same as that of the communication devices 421 to 424 or 500 of FIGS. 6 and 7 .
  • 'X' in the two-axis Cartesian coordinate system may indicate a length direction of the display assembly 330 and 'Z' may indicate a thickness direction of the display assembly 330 .
  • 'Z' may mean a first direction (+Z) and a second direction (-Z), and 'X' is a third direction (+X, or -X). ) can mean
  • the transparent member 610 has a first surface facing the first direction (+Z), a second surface facing the second direction (-Z) opposite to the first direction (+Z), and
  • the first direction (+Z) or the second direction (-Z) may include a side that faces a third direction perpendicular to the side.
  • the transparent member 610 includes an active area A1 that provides an image and/or a video to a user through the display panel 630 and an inactive area extending from the active area A1 to an edge of the transparent member 310 . (A2) may be included.
  • the display element layer 633 of the display panel 630 may be disposed in a flat state under the active area A1 of the transparent member 610 , and at least a portion of the display panel 630 is disposed below the non-active area A2 . (eg, the bending region S3 of the display substrate 631 ) may be disposed in a bent state.
  • An opaque non-conductive material may be applied to the lower portion of the non-active area A2 so that internal electronic components, signal lines, or circuit lines are not exposed to the outside.
  • the display panel 630 may include an optical layer 635 , a display element layer 633 , a TFT layer 632 , and a display substrate 631 .
  • the display panel 630 may be exposed as a first surface (eg, a front surface) through the transparent member 610 , and a display element layer 633 including at least one pixel(s) 633a .
  • it may include a TFT layer 632 connected to an (active) organic light emitting diode and a display device layer 633.
  • the transparent member 610 ) and the display element layer 633, or inside the display element layer 633, an optical member and/or a touch sensor layer 634 may be mounted.
  • the display panel 630 is configured to output a screen. As an output device, it may be used as an input device equipped with a touch screen function If the display panel 630 has a touch screen function, an Indium-Tin Oxide film for detecting a user's touch position, etc. ITO) film may also correspond to the touch sensor layer 634. As another example, a dielectric layer (not shown) may be disposed between the display element layer 633 and/or the touch sensor layer 634, A display substrate 631 may be disposed on the rear surface of the device layer 633 .
  • the display element layer 633 includes an encapsulation member (not shown) that covers and protects the light emitting elements (eg, at least one pixel(s) 633a) formed on the display substrate 631 .
  • the encapsulation member may include glass, a polymer film, or a metal.
  • the encapsulation member may include a thin film encapsulation layer in which a plurality of organic layers and a plurality of inorganic layers are alternately stacked at least once.
  • the encapsulation member may seal the at least one pixel(s) 633a to protect the plurality of light emitting devices from external foreign substances (eg, moisture and/or oxygen).
  • an optical layer 635 may be disposed between the transparent member 610 and the display substrate 631 .
  • the optical layer 635 transmits the screen output from the display element layer 633 and may be laminated on the display element layer 633 as at least one.
  • the optical layer 635 may include an optical compensation film for correcting a phase difference of a screen output from the display element layer 633 .
  • the optical layer 635 may include an optical compensation film, for example, a polarizing film.
  • a tri-acetyl cellulose (TAC) film is attached to both sides of a polyvinyl alcohol (PVA) film providing a polarization function, and, in addition, the surface-side TAC film is on the surface coating layer. It may be a configuration protected by
  • a dielectric layer 620 may be disposed between the transparent member 610 and the display panel 630 .
  • the dielectric layer 620 may be disposed in contact with the transparent member 610, for example, silicon, air, foam, membrane, optical clear adhesive (OCA), sponge, It may include rubber, ink, polymer (PC, PET).
  • OCA optical clear adhesive
  • the dielectric layer 620 may be provided to adhere the transparent member 610 and/or the optical layer 635 , or to have a refractive index different from that of the transparent member 610 and/or the optical layer 635 .
  • the display assembly 330 may include a display substrate 631 .
  • the display substrate 631 may be formed of a transparent insulating substrate such as glass or a polymer film, and when the display substrate 631 is formed of a polymer film, it may include a flexible substrate.
  • the display substrate 631 may include at least one polymer layer.
  • the display substrate 631 may be manufactured as a single layer including polyimide (PI) or as a plurality of layers in which polyimide (PI) - silicon nitride film (SiN) - polyimide (PI) are sequentially stacked. can be manufactured.
  • the display substrate 631 may be made of a plurality of layers in which polyimide (PI)-silicon nitride (SiN) is repeatedly stacked.
  • PI polyimide
  • PC polycarbonate
  • PMMA poly Methyl methacrylate
  • PI polyimide
  • PET polyethylene terephthalate
  • PPT polypropylene terephthalate
  • PEN polyethylene terephthalate glycol
  • TAC tri-acetyl-cellulose
  • COP cyclic olefin polymer
  • COC dicyclopentadiene polymer
  • the display substrate 631 may include a first surface 631a and a second surface 631b facing in a direction opposite to the first surface 631a.
  • the display substrate 631 is electrically connected to the display pixel(s) 633a , and extends from the first region S1 and at least a first region S1 stacked with at least a portion of the display element layer 633 , and at least It may include a bending area S3 partially bent, and a second area S2 extending from the bending area S3 and facing at least a portion of the first area S1 .
  • the first surface 631a is oriented in the first direction (+Z)
  • the second surface 631b is opposite to the first direction (+Z).
  • the bending area S3 of the display substrate 631 includes a bent section extending from the first area S1, and the first surface 631a or the second surface 631b is formed in a first direction ( +Z), the second direction (-Z), or the third direction (+X, or -X).
  • the second region S2 of the display substrate 631 extends from the bending region S3 , the first surface 631a faces the second direction -Z, and the second surface 631b faces the first direction It can face (+Z).
  • the first region S1 may support the display panel 630 while forming a flatness face.
  • the bending area S3 may be disposed to extend from one side of the first area S1 to one side of the second area S2 (eg, in the lower direction ( ⁇ X) of the display panel 630 ). However, the bending area S3 does not extend only in the lower direction, and the other side of the first area S1 (eg, in the upper direction (-X) of the display panel 630 , or in the display panel 630 ). may be arranged to extend in the left and right directions).
  • the bending region S3 of the display substrate 631 may include a bent surface.
  • the second region S2 of the display substrate 631 is configured to form a flatness face, and a wireless communication device (eg, the communication device 421-424 of FIG. 6 ) may be disposed on at least part of it.
  • a wireless communication device eg, the communication device 421-424 of FIG. 6
  • at least one antenna 651 may be disposed on the first surface 631a of the first area S1
  • the antenna 651 may be disposed on the first surface 631a of the second area S2.
  • It may include a wireless communication circuit 643 electrically connected to.
  • the at least one antenna 651 and the wireless communication circuit 643 may be disposed to face each other with the display substrate 631 interposed therebetween.
  • a communication line 645 may be disposed in the bending region S3 of the display substrate 631 .
  • the communication wiring 645 formed on the display substrate 631 is bent from the first region S1 of the display substrate 631 through the bending region S3 and then extends to the second region S2.
  • the display panel 630 includes a display element layer 633 and a TFT layer 632 having a plurality of signal lines and a plurality of pixels, and is formed from the display element layer 633 and the TFT layer 632 . Electrically connected signal wiring may be formed on one surface or inside of the display substrate 631 .
  • a display driver IC) 637 and/or a touch sensor panel IC can be placed on the first surface 631a of the second region S2 of the display substrate 631.
  • a communication line 645 connected to a display driver IC 637 and/or a signal line connected to a touch sensor panel IC (TSP-IC) may be disposed in the bending area S3 .
  • the communication wiring 645 and the signal wiring may include a flexible printed circuit film or a chip on film having a driving chip or a tape carrier package.
  • the communication wiring 645 and the signal wiring may be connected to a connector disposed adjacent to the display substrate 631 , and the connector may be connected to a printed circuit board on which a control circuit is formed (eg, the printed circuit board 340 of FIG. 5 ).
  • the display driving circuit 637 is electrically connected to a control circuit of a circuit board (eg, the printed circuit board 340 of FIG. 5 ), and the control circuit interworks with the display driving circuit 637 to display image data, or the Receives and processes image information including an image control signal corresponding to a command for controlling image data, so that visual information (eg, text, image, or icon) can be displayed through the display panel 630 .
  • the display assembly 330 may include an antenna structure 601 .
  • the antenna structure 601 may include an antenna layer 640 including an antenna 641 , a wireless communication circuit 643 , and communication wiring 645 .
  • the antenna layer 640 may include at least one antenna 641 , and the antenna 641 may be disposed on the display substrate 631 .
  • the antenna layer 640 may be disposed between the optical layer 635 and the touch sensor layer 634 , and may include the antenna 641 and its surrounding area.
  • the location of the antenna layer 640 is not limited thereto, and may be disposed on the optical layer 635 or disposed below the touch sensor layer 634 .
  • the peripheral area of the antenna layer 640 is a predetermined area to protect the antenna 641 and compensate for its height with other layers for lamination (eg, the optical layer 635 and the touch sensor layer 634 ). It can form a height or a slope.
  • the peripheral region of the antenna layer 640 may be made of a material different from that of the antenna 641 .
  • the antenna 651 may include at least one radiation conductor(s), and may be formed on or above the first surface 631a of the display substrate 631 .
  • the area in which the antenna 641 is formed may be an active area A1 of the display panel 630 or an inactive area A2 extending from the active area A1.
  • the radiation conductor(s) may be formed of, for example, a patch-type radiation conductor or a radiation conductor having a dipole structure extending in one direction.
  • the plurality of radiation conductor(s) may be arrayed to form a designated pattern to form an antenna array.
  • the distance between the plurality of radiation conductor(s) may be spaced apart by 1/4 or more of the wavelength ( ⁇ ) of the frequency used by the antenna.
  • the plurality of radiation conductor(s) are disposed on the first surface 631a of the display substrate 631 and protrude to a predetermined thickness, but the present invention is not limited thereto, and the first surface 631a is not limited thereto. It may be manufactured in the form of a thin plate, or may be disposed in an open substrate so as not to protrude from the outer surface of the substrate.
  • the plurality of radiation conductor(s) are electrically connected to a feeding part (not shown) of a circuit board (eg, the printed circuit board 340 of FIG. 5 ) to transmit a high-frequency signal in at least one frequency band. can send and receive.
  • the feeding unit is electrically connected to the plurality of radiation conductor(s) to supply a radio frequency signal (RF signal) by applying a signal current, or through the radiation conductor(s). It may receive other received high-frequency signals.
  • RF signal radio frequency signal
  • the wireless communication circuit 643 may be disposed on the display substrate 631 .
  • the display substrate 631 may include a base substrate including polyimide (PI) or a flexible circuit substrate 690 extending from the base substrate.
  • a chip eg, an integrated circuit chip in which a part of the wireless communication circuit 643 is implemented is one side of an area on which the radiation conductor(s) is disposed or the opposite side of the surface on which the radiation conductor is disposed. It may be disposed on a surface facing the direction. For example, it may be formed on the first surface 631a of the second region S2 .
  • the wireless communication circuit 643 may receive a communication signal through an RF transceiver or transmit the received communication signal to the wireless transceiver.
  • the wireless communication circuit 643 may perform wireless communication using the radiation conductor(s) while being controlled by a processor (eg, the processor 440 of FIG. 6 ).
  • the wireless communication circuit 643 receives control signals and power from a processor (eg, the processor 440 of FIG. 6 ) and a power management module (eg, the power management module 188 of FIG. 1 ). , it is possible to process a communication signal received from the outside or a communication signal to be transmitted to the outside.
  • the wireless communication circuit 643 may include a switch circuit for separating a transmission/reception signal, various amplifiers or filter circuits for improving the quality of a transmission/reception signal, and the like.
  • the wireless communication circuit 643 includes a phase shifter coupled to each radiation conductor, such that the antenna structure 601, e.g. , it is possible to control the orientation direction of the electronic device.
  • the wireless communication circuit 643 provides a phase difference feed to each radiation conductor to provide the communication device or an electronic device on which the communication device is mounted (eg, the electronic device of FIG. 1 ). 101)) can be controlled.
  • phase difference feeding may be useful in securing an optimal communication environment or a good communication environment in a communication method with strong straightness, such as millimeter wave communication (eg, wireless communication using a frequency band of 6 GHz or more and 300 GHz or less).
  • one end of the communication wire 645 may be connected to the antenna 641 of the antenna layer 640 , and the other end may be connected to the wireless communication circuit 643 .
  • the communication wiring 645 power line and/or signal line (eg, RF signal line)) supplied to the wireless communication circuit 643 is bent along the bent display substrate 631, so that the antenna 641 and can be connected
  • the communication wiring 645 is plated along the side of the display panel 630 in order to be connected to the antenna layer 640 , and the antenna 641 and the antenna 641 along the upper surface or the lower surface of the antenna layer 640 . can be electrically connected.
  • the present invention is not limited thereto, and the connection between the antenna 641 and the wireless communication circuit 643 may be connected or coupled to the via hole together with the communication wire 645 to transmit/receive communication signals.
  • the communication wiring 645 may be connected to a wireless communication circuit 643 and/or a connector (not shown) disposed on the first surface 631a of the display substrate 631 .
  • the connector may be connected to a connector (not shown) provided on a circuit board (eg, the printed circuit board 340 of FIG. 5 ) to establish a line for transmitting power or a communication signal.
  • the communication wiring 645 is disposed on the upper surface of the polyimide (PI) of the display substrate 631 , but is not limited thereto, and between the polyimide (PI) and the silicon nitride film (SiN) of the display substrate 631 . can be placed in
  • a polymer layer 681 , a light blocking member 682 , and/or a heat dissipation layer 683 may be sequentially disposed under the display substrate 631 .
  • the light blocking member 682 may be provided as a layer for shielding the rear surface of the display assembly 330 , and may be, for example, a cushion member, an emboss member, or a copper sheet (CU sheet), and may include a black color.
  • the heat dissipation layer 683 may block heat generated from the display substrate 631 or block heat generated from the wireless communication circuit 643 from being transferred to the display panel 630 .
  • the heat dissipation layer 683 may include a graphite material.
  • 9A and 9B are cross-sectional views illustrating a structure of a display substrate constituting a display assembly disposed in an electronic device and wirings disposed on the display substrate, according to one of various embodiments of the present disclosure.
  • 9A shows the display substrate when viewed from above
  • FIG. 9B shows the unfolded state of the display substrate.
  • the display assembly 330 includes a display substrate 631 , a display driver IC (eg, DDI 637 ) disposed on one side of the display substrate 631 , and a wireless communication circuit 643 . can do.
  • the display assembly 330 may include a display wire 637a connected to the DDI 637 and a communication wire 645 connected to the wireless communication circuit 643 .
  • the DDI 230 and the wireless communication circuit 643 of FIGS. 9A and 9B may have the same structure in part or all as the display driver IC (DDI) 230 of FIG. 2 and the wireless communication circuit 643 of FIG. 8 . there is.
  • the display substrate 631 forms a flatness face while forming a first region S1 supporting the display panel, a bending region extending from the first region S1 and bending ( S3 ), and a second region S2 extending from the bending region S3 and facing at least a portion of the first region S1 .
  • the bending region S3 includes a 3-1 region S31 forming an acute angle with the front surface and a 3-2 region S32 forming an acute angle with the rear surface with respect to the bending line L as a center, and seamlessly can be extended
  • a DDI 637 for display control and a wireless communication circuit 643 are disposed on one surface (eg, the second region S2) of the display substrate 631 together.
  • can be Wirings for respectively connecting the DDI 637 and the wireless communication circuit 643 may be formed on the display substrate 631 , and the wires may be positioned so as not to overlap each other.
  • the DDI 637 and the wireless communication circuit 643 are illustrated as being implemented on separate chips, respectively, they may be implemented in a single chip or package differently from the drawings. In this case, the DDI 637 and the wireless communication circuit 643 may be circuits physically separated from each other within one chip or package, or may be one circuit that is not physically separated but logically or software separated.
  • the display wiring 637a connected to the DDI 637 is connected to a display element layer (eg, the display element layer 633 of FIG. 8 ) through a TFT layer (eg, the TFT layer 632 of FIG. 8 ).
  • a display element layer eg, the display element layer 633 of FIG. 8
  • a TFT layer eg, the TFT layer 632 of FIG. 8
  • the communication wire 645 connected to the wireless communication circuit 643 may be electrically connected to the antenna 641 .
  • the communication wiring 645 is connected to an antenna layer including the antenna 641 (eg, the antenna layer 640 of FIG. 8 ), so as to be connected to a display panel (eg, the display panel 630 of FIG. 8 ).
  • the communication wiring 645 may be connected through at least one conductive via penetrating the display substrate 631 .
  • communication wiring extending laterally may be excluded.
  • 10A and 10B are cross-sectional views illustrating a display substrate constituting a display assembly disposed in an electronic device and structures of wirings disposed on the display substrate according to one of various embodiments of the present disclosure; 10A shows the display substrate when viewed from above, and FIG. 10B shows the unfolded state of the display substrate.
  • the display assembly 330 includes a display substrate 631 , a display driver IC (eg, DDI 637 ) disposed on one side of the display substrate 631 , and a wireless communication circuit 643 . can do.
  • the display assembly 330 may include a display wire 637a connected to the DDI 637 and a communication wire 645 connected to the wireless communication circuit 643 .
  • the structures and wirings of the DDI 637 and the wireless communication circuit 643 of FIGS. 10A and 10B apply mutatis mutandis FIGS. 9A and 9B , and descriptions will be made focusing on different configurations.
  • the display substrate 631 may include a base substrate 6311 and an additional substrate 6313 connected to an end of the base substrate 6311 .
  • the base substrate 6311 may be a substrate made of a single or a plurality of layers including polyimide (PI), and the DDI 637 may be positioned thereon.
  • the additional board 6313 is a flexible circuit board, in which a wireless communication circuit 643 may be positioned.
  • the wireless communication circuit 643 may be disposed on a separate additional substrate 6313 to form a heat dissipation structure and ease of mounting in an electronic device.
  • a connector 6317 for electrical contact with the main circuit board eg, the printed circuit board 340 of FIG.
  • wires for respectively connecting the DDI 637 and the wireless communication circuit 643 may be formed on the display substrate 631 , and the wires may be positioned so as not to overlap each other.
  • FIG. 11 is a cross-sectional view illustrating a stacked structure of layers constituting a display assembly disposed in an electronic device and an antenna according to one of various embodiments of the present disclosure
  • the display assembly 330 is disposed below the transparent member 610 and the transparent member 610 , and at least partially bent on or above the display substrate 631 and the display substrate 631 . ) disposed on the display element layer 633 , the antenna 641 disposed on or above the display substrate 631 , and at least a part of the antenna 641 is disposed in a bent region of the display substrate 631 , ) and may include a communication line 645 electrically connected thereto.
  • the display assembly 330 may further include a wireless communication circuit 643 electrically connected to the antenna 641 through a communication wire 645 .
  • 'X' in the two-axis Cartesian coordinate system may indicate a length direction of the display assembly 330
  • 'Z' may indicate a thickness direction of the display assembly 330
  • 'Z' may mean a first direction (+Z) and a second direction (-Z).
  • the 'X' may mean a third direction (+X, or -X).
  • the display assembly 330 of FIG. 11 may have the same structure as part or all of the display device 160 of FIG. 1 and the displays 301 or 330 of FIGS. 3 to 4 .
  • the configuration of the transparent member 610, the display element layer 633, the display substrate 631, the antenna 641, and the wireless communication circuit 643 of FIG. 11 is the transparent member 610 and the display element of FIG.
  • the configuration of the layer 633 , the display substrate 631 , the antenna 641 , and the wireless communication circuit 643 can be applied mutatis mutandis.
  • the display assembly 330 of FIG. 11 will be described with a focus on differences in configuration from the display assembly 330 of FIG. 8 .
  • the display assembly 330 includes a dielectric layer 620 , a display panel (eg, an optical layer 635 , a touch sensor layer 634 , and a display element layer 633 ) based on the transparent member 610 .
  • the TFT layer 632 , the display substrate 631 ), the polymer layer 681 , the light blocking member 682 , and/or the heat dissipation layer 683 may be sequentially disposed.
  • the flexible circuit substrate 690 and the second region S2 of the display substrate 631 are disposed under at least a partial region of the heat dissipation layer 683 , and the display substrate 631 is disposed.
  • a wireless communication circuit 643 and a display driver IC eg, a DDI 637) may be disposed in the second area S2.
  • an antenna 641 may be disposed on at least a partial area of the display panel 630 .
  • the antenna 641 may be provided in a patterned shape sharing at least a portion of the display element layer 633 and/or the TFT layer 632 .
  • the antenna 641 may be located on or within the TFT layer 632 , and wiring for the touch sensor layer 634 and at least one pixel(s) 633a of the display element layer 633 . It may be disposed so as not to overlap the back.
  • a slit (or opening or hole) 647 is formed in the display element layer 633 and/or the touch sensor layer 634 facing the antenna 641 to form at least one pixel(s) 633a and/or a signal Interference from wiring can be avoided.
  • the communication wiring 645 (power line and/or signal line (eg, RF signal line)) supplied to the wireless communication circuit 643 is bent along the bent display substrate 631, so that the antenna ( 641) can be connected.
  • the communication wiring 645 is connected to the antenna 641 located on or inside the TFT layer 632 , and is disposed on one surface of the polyimide (PI) along the bending region S3 of the display substrate 631 . and is connected to the wireless communication circuit 643 facing the second direction (-Z), it is possible to establish a line for transmitting power or a communication signal.
  • FIG. 12 is a cross-sectional view illustrating a stacked structure of layers constituting a display assembly disposed in an electronic device and an antenna according to one of various embodiments of the present disclosure
  • 'X' in the two-axis Cartesian coordinate system may indicate a length direction of the display assembly 330
  • 'Z' may indicate a thickness direction of the display assembly 330
  • 'Z' may mean a first direction (+Z) and a second direction (-Z).
  • the 'X' may mean a third direction (+X, or -X).
  • the display assembly 330 of FIG. 12 may have the same structure as part or all of the display device 160 of FIG. 1 and the displays 301 or 330 of FIGS. 3 to 4 .
  • the configuration of the transparent member 610, the display element layer 633, the display substrate 631, the antenna 641, and the wireless communication circuit 643 of FIG. 12 is the transparent member 610 and the display element of FIG.
  • the configuration of the layer 633 , the display substrate 631 , the antenna 641 , and the wireless communication circuit 643 can be applied mutatis mutandis.
  • the display assembly 330 includes a dielectric layer 620 , a display panel (eg, an optical layer 635 , a touch sensor layer 634 , and a display element layer 633 ) based on the transparent member 610 .
  • a display panel eg, an optical layer 635 , a touch sensor layer 634 , and a display element layer 633
  • the TFT layer 632 , the display substrate 631 ), the polymer layer 681 , the light blocking member 682 , and/or the heat dissipation layer 683 may be sequentially disposed.
  • the flexible circuit substrate 690 and the second region S2 of the display substrate 631 are disposed below at least a partial region of the heat dissipation layer 683 , In the second area S2 , a wireless communication circuit 643 and a display driver IC (eg, a DDI 637 ) may be disposed.
  • a wireless communication circuit 643 and a display driver IC eg, a DDI 637
  • an antenna layer 640 including an antenna 641 may be disposed on at least a partial area of the display panel 630 .
  • An antenna layer 640 may be disposed between the TFT layer 632 and the display substrate 631 .
  • the antenna 641 may include at least one radiation conductor(s), and may be formed on the first surface 631a of the display substrate 631 .
  • the radiation conductor(s) may consist of, for example, a patch type radiation conductor. When a plurality of radiation conductor(s) are formed, the plurality of radiation conductor(s) may be arrayed to form a designated pattern to form an antenna array.
  • a slit (or an opening or a hole corresponding to the size of the antenna 641 ) ) 648 may be formed to avoid interference from at least one pixel(s) 633a and/or signal wiring.
  • the communication wiring 645 (power line and/or signal line (eg, RF signal line)) supplied to the wireless communication circuit 643 is bent along the bent display substrate 631, so that the antenna ( 641) can be connected.
  • the communication wiring 645 is connected to the antenna 641 located on or inside the TFT layer 632 , and is disposed on one surface of the polyimide (PI) along the bending region S3 of the display substrate 631 . and is connected to the wireless communication circuit 643 facing the second direction (-Z), it is possible to establish a line for transmitting power or a communication signal.
  • FIG. 13 is a cross-sectional view illustrating a stacked structure of layers constituting a display assembly disposed in an electronic device and an antenna according to one of various embodiments of the present disclosure
  • 'X' in the two-axis Cartesian coordinate system may indicate a length direction of the display assembly 330
  • 'Z' may indicate a thickness direction of the display assembly 330
  • 'Z' may mean a first direction (+Z) and a second direction (-Z).
  • the 'X' may mean a third direction (+X, or -X).
  • the display assembly 330 of FIG. 13 may have the same structure as part or all of the display device 160 of FIG. 1 and the displays 301 or 330 of FIGS. 3 to 4 .
  • the configuration of the transparent member 610, the display element layer 633, the display substrate 631, the antenna 641, and the wireless communication circuit 643 in FIG. 13 is the transparent member 610 and the display element in FIG.
  • the configuration of the layer 633 , the display substrate 631 , the antenna 641 , and the wireless communication circuit 643 can be applied mutatis mutandis.
  • the display assembly 330 of FIG. 13 will be described with a focus on differences in configuration from the display assembly 330 of FIG. 8 .
  • the display assembly 330 includes a dielectric layer 620 , a display panel (eg, an optical layer 635 , a touch sensor layer 634 , and a display element layer 633 ) based on the transparent member 610 .
  • a display panel eg, an optical layer 635 , a touch sensor layer 634 , and a display element layer 633
  • the TFT layer 632 , the display substrate 631 ), the polymer layer 681 , the light blocking member 682 , and/or the heat dissipation layer 683 may be sequentially disposed.
  • the flexible circuit substrate 690 and the second region S2 of the display substrate 631 are disposed under at least a partial region of the heat dissipation layer 683 , and the second region S2 of the display substrate In the second area S2 , a wireless communication circuit 643 and a display driver IC (eg, a DDI 637 ) may be disposed.
  • a wireless communication circuit 643 and a display driver IC eg, a DDI 637
  • the antenna layer 640 including the antenna 641 may be disposed on at least a partial area of the display panel 630 .
  • the antenna layer 640 may be disposed between the optical layer 635 and the touch sensor layer 634 .
  • the antenna 641 may include at least one radiation conductor(s), and may be formed to be spaced apart from the first surface 631a of the display substrate 631 .
  • the radiation conductor(s) may consist of, for example, a patch type radiation conductor. When a plurality of radiation conductor(s) are formed, the plurality of radiation conductor(s) may be arrayed to form a designated pattern to form an antenna array.
  • the communication wiring 645 (power line and/or signal line (eg, RF signal line)) supplied to the wireless communication circuit 643 includes a touch sensor layer 634 , a display element layer 633 and It may be connected through at least one conductive via 649 passing through the TFT layer 632 .
  • the communication wiring 645 extends from the antenna 641 along one side facing the second direction (-Z) of the antenna layer 640 , and passes through the conductive via 649 to the second of the display substrate 631 . It may be connected to the first surface 631a facing the first direction (+Z).
  • the communication wiring 645 disposed on the first surface 631a of the display substrate 631 is bent along the bending region S3 of the display substrate 631 and is connected to the wireless communication circuit 643 to provide power or a communication signal. It is possible to establish a line for transmitting
  • the communication wiring 645 is not limited to the connection through the conductive via 649 , and through at least one slit formed in the display substrate 631 or the TFT layer 632 , the wireless communication circuit 643 is connected to the antenna. (641) can be fed.
  • FIG. 14 is a cross-sectional view illustrating a stacked structure of layers constituting a display assembly disposed in an electronic device and an antenna according to one of various embodiments of the present disclosure
  • 'X' in the two-axis Cartesian coordinate system may indicate a length direction of the display assembly 330
  • 'Z' may indicate a thickness direction of the display assembly 330
  • 'Z' may mean a first direction (+Z) and a second direction (-Z).
  • the 'X' may mean a third direction (+X, or -X).
  • the display assembly 330 of FIG. 14 may have the same structure as part or all of the display device 160 of FIG. 1 and the displays 301 or 330 of FIGS. 3 to 4 .
  • the configuration of the transparent member 610, the display element layer 633, the display substrate 631, the antenna 641, and the wireless communication circuit 643 in FIG. 14 is the transparent member 610 and the display element in FIG. Some or all of the configuration of the layer 633 , the display substrate 631 , the antenna 641 , and the wireless communication circuit 643 may be the same.
  • the display assembly 330 of FIG. 14 will be described with a focus on differences in configuration from the display assembly 330 of FIG. 8 .
  • the display assembly 330 includes a dielectric layer 620 , a display panel (eg, an optical layer 635 , a touch sensor layer 634 , and a display element layer 633 ) based on the transparent member 610 .
  • a display panel eg, an optical layer 635 , a touch sensor layer 634 , and a display element layer 633
  • the TFT layer 632 , the display substrate 631 ), the polymer layer 681 , the light blocking member 682 , and/or the heat dissipation layer 683 may be sequentially disposed.
  • the flexible circuit substrate 690 and the second region S2 of the display substrate 631 are disposed under at least a partial region of the heat dissipation layer 683 , and the second region S2 of the display substrate In the second area S2 , a wireless communication circuit 643 and a display driver IC (eg, a DDI 637 ) may be disposed.
  • a wireless communication circuit 643 and a display driver IC eg, a DDI 637
  • the antenna layer 640 including the antenna 641 may be disposed on at least a partial area of the display panel 630 .
  • Antenna layer 640 may be disposed between dielectric layer 620 and optical layer 635 .
  • the antenna 641 may include at least one radiation conductor(s), and may be formed to be spaced apart from the first surface 631a of the display substrate 631 .
  • the radiation conductor(s) may consist of, for example, a patch type radiation conductor. When a plurality of radiation conductor(s) are formed, the plurality of radiation conductor(s) may be arrayed to form a designated pattern to form an antenna array.
  • the communication wiring 645 (power line and/or signal line (eg, RF signal line)) supplied to the wireless communication circuit 643 is at least one of the display panel 630 cut diagonally or stepwise. It can be formed by plating the side of the layer of
  • the communication wiring 645 is an optical layer 635 cut diagonally or stepwise from the antenna 641 through one surface facing the second direction (-Z) of the antenna layer 640, the touch sensor layer ( 634 , the display element layer 633 , and the TFT layer 632 may extend along side surfaces.
  • the communication wiring 645 extending from the side to the first surface 631a facing the first direction (+Z) of the display substrate 631 is bent along the bending area S3 of the display substrate 631 and is It may be connected to the communication circuit 643 to establish a line for transmitting power or a communication signal.
  • 15 is a cross-sectional view illustrating a stacked structure of layers constituting a display assembly disposed in an electronic device and an antenna according to one of various embodiments of the present disclosure
  • 'X' in the two-axis Cartesian coordinate system may indicate a length direction of the display assembly 330
  • 'Z' may indicate a thickness direction of the display assembly 330
  • 'Z' may mean a first direction (+Z) and a second direction (-Z).
  • the 'X' may mean a third direction (+X, or -X).
  • the display assembly 330 of FIG. 15 may have the same structure as part or all of the display device 160 of FIG. 1 and the displays 301 or 330 of FIGS. 3 to 4 .
  • the configuration of the transparent member 610, the display element layer 633, the display substrate 631, the antenna 641, and the wireless communication circuit 643 in FIG. 14 is the transparent member 610 and the display element in FIG. Some or all of the configuration of the layer 633 , the display substrate 631 , the antenna 641 , and the wireless communication circuit 643 may be the same.
  • the display assembly 330 of FIG. 15 will be described with a focus on differences in configuration from the display assembly 330 of FIG. 8 .
  • the display assembly 330 includes a dielectric layer 620 , a display panel (eg, an optical layer 635 , a touch sensor layer 634 , and a display element layer 633 ) based on the transparent member 610 .
  • a display panel eg, an optical layer 635 , a touch sensor layer 634 , and a display element layer 633
  • the TFT layer 632 , the display substrate 631 ), the polymer layer 681 , the light blocking member 682 , and/or the heat dissipation layer 683 may be sequentially disposed.
  • the flexible circuit substrate 690 and the second region S2 of the display substrate 631 are disposed under at least a partial region of the heat dissipation layer 683 , and the second region S2 of the display substrate In the second area S2 , a wireless communication circuit 643 and a display driver IC (eg, a DDI 637 ) may be disposed.
  • a wireless communication circuit 643 and a display driver IC eg, a DDI 637
  • the antenna layer 640 including the antenna 641 may be disposed on at least a partial area of the display panel 630 .
  • the antenna layer 640 may be disposed between the transparent member 610 and the dielectric layer 620 .
  • the antenna 641 may include at least one radiation conductor(s), and may be formed to be spaced apart from the first surface 631a of the display substrate 631 .
  • the radiation conductor(s) may consist of, for example, a patch type radiation conductor. When a plurality of radiation conductor(s) are formed, the plurality of radiation conductor(s) may be arrayed to form a designated pattern to form an antenna array.
  • the antenna layer 640 is a separate connector for connection with the communication wiring 645 (power line and/or signal line (eg, RF signal line)) supplied to the wireless communication circuit 643 .
  • a connection wiring 640b wired along the 640a and the connection portion 640a may be provided.
  • the antenna layer 640 may further include a connection portion 640a extending outwardly from a portion where the antenna 641 is disposed, and the connection wiring 640b is connected from the antenna 641 to the antenna layer 640 . It may be connected to the communication wiring 645 disposed on the first surface 631a of the display substrate 631 in the first direction (+Z) through the one surface and the connection part 640a.
  • connection wiring 640b may be located on one substrate extending from the active area A1 to the non-active area.
  • one substrate may include at least one polymer layer, like the display substrate 631 .
  • the communication wiring 645 extending along the first surface 631a of the display substrate 631 is bent along the bending region S3 of the display substrate 631 to be connected to the wireless communication circuit 643 , and to power or communication A line for transmitting a signal can be established.
  • 16 is an exploded perspective view illustrating an electronic device including a display assembly according to various embodiments of the present disclosure
  • 17A and 17B are stacked perspective views illustrating a configuration of a display assembly according to various embodiments of the present disclosure
  • the electronic device 101 includes a transparent member 610 , a dielectric layer 620 , a display panel 330 , a bracket 332 , a battery 350 , a main circuit board 340 , and a rear cover 380 .
  • the display panel 630 may be disposed between the front and rear surfaces of the housing (the housing 310 of FIG. 5 ), and may be exposed through the transparent member 610 .
  • the transparent member 610 may be positioned in front of the electronic device 101 to protect the display panel 630 from the external environment.
  • the electronic device 101 may include a panel-shaped touch sensor or a pressure sensor or a fingerprint sensor integrated into the display panel 630 , and thus may be utilized not only as an output device but also as an input device.
  • An antenna electrode 641a for an antenna may be mounted inside the display panel 630 .
  • the display panel 630 may implement various user experiences (eg, 3D input) through a combination of the at least one sensor, and may perform a wireless communication function through an antenna.
  • the electronic device 101 may include a bracket 332 supporting the display panel 630 and the main circuit board 340 .
  • the bracket 332 may be made of a metallic material, and may be disposed between the display assembly 330 and the rear cover 380 .
  • the bracket 332 may prevent the integrated circuit chips mounted on the main circuit board 340 from contacting the display panel 630 , and may prevent electromagnetic interference between the integrated circuit chips by providing an electromagnetic shielding function. there is.
  • the bracket 332 may supplement the rigidity of the electronic device.
  • the display panel 630 includes a display substrate 631 , and under the display substrate 631 , a polymer layer 681 , a light blocking member 682 , and/or a heat dissipation layer 683 are sequentially arranged. can be placed as
  • the display panel 630 has an OLED structure, the first transparent plate 810 facing the first direction (+Z) and the second direction opposite to the first direction (+Z) ( A second transparent plate 820 facing -Z) may be included. At least one electrode may be disposed between the first transparent plate 810 and the second transparent plate 820 .
  • a first electrode 831 and a second electrode 832 may be included between the first transparent plate 810 and the second transparent plate 820 .
  • the display panel 630 may include a control circuit (not shown) electrically connected to the first electrode 831 and the second electrode 832 . The control circuit may display visual information on at least a portion of the display assembly 330 using the first electrode 831 and the second electrode 832 .
  • the first transparent plate 810 may be formed of various organic and/or inorganic materials.
  • the first transparent plate 810 may be formed, for example, in a form in which an organic material and an inorganic material are repeatedly stacked in multiple layers (eg, 5 layers) or more.
  • the second transparent plate 310 may be formed of, for example, one inorganic layer.
  • the second transparent plate 820 is, acrylonitrile butadiene styrene (ABS), acrylic, polycarbonate (PC), polymethyl methacrylate (PMMA), polyimide (polyimide, PI), polyethylene Terephthalate (polyethylene terephthalate, PET), polypropylene terephthalate (PPT), amorphous polyethylene terephthalate (APET), polynaphthalene terephthalate (PEN), polyethylene terephthalate glycerol ( polyethylene terephthalate glycol, PETG), tri-acetyl-cellulose (TAC), cycloolefin polymer (COP), cyclic olefin copolymer (COC), dicyclopentadiene polymer (polydicyclopentadiene) , DCPD), cyclopentadienyl anions (CPD), polyarylate (PAR), polyethersulfone (PES), polyether imide (PEI), modified epoxy resin or acrylic
  • At least one of the first electrode 831 and the second electrode 832 may include a transparent or opaque conductive material.
  • at least one electrode of the first electrode 831 and the second electrode 832 is a transparent conductive material, indium-tin-oxide (ITO), indium-zinc-oxide (IZO), PEDOT, silver nano It may include at least one of a wire (Ag Nanowire), a transparent polymer conductor, or graphene.
  • at least one of the first electrode 831 and the second electrode 832 is an opaque conductive material, and includes silver (Ag), copper (Cu), magnesium (Mg), titanium (Ti), and molybdenum. It may include at least one of (Mo), aluminum (Al), or graphene.
  • the display panel 630 may further include a transistor (TFT) 840 electrically connected to the first electrode 831 , wherein the transistor 840 includes a gate electrode, a source electrode, and A drain electrode may be included.
  • the third electrode 850 which is an electrode layer disposed under the second transparent plate 820 , provides a ground function and may be used as a shared electrode of an electrode for other sensors in the display assembly 330 . .
  • the display panel 630 may include an antenna electrode 641a formed on the same layer as the first electrode 831 and/or the second electrode 832 .
  • the antenna electrode 641a may be a radiation conductor forming at least one or more patterns.
  • the antenna electrode 641a may be spaced apart so as not to overlap the display pixel(s) 633a and/or the display electrodes (eg, the first electrode 831 and the second electrode 832), It may consist of slits or independent electrode layers.
  • the antenna electrode 641a may be disposed between the second electrodes 832 .
  • the antenna electrode 641a forms the same layer as the second electrode 832 and may be designed not to overlap.
  • the antenna electrode 641a may be spaced apart from the plurality of second electrodes 832 and may have a bar shape arranged in parallel with one side of the second electrodes 832 .
  • the antenna electrode 641a may be disposed on the same layer as the gate electrode of the transistor 840 and may be made of a material different from that of the gate electrode.
  • the antenna electrode 641a may be spaced apart from a region other than the display pixel(s) 633a.
  • 18A, 18B, and 18C are schematic diagrams illustrating an arrangement structure between a pixel(s) and an antenna electrode according to various embodiments of the present disclosure
  • the antenna electrode 641a may form various patterns, and is disposed around one organic light emitting material set composed of display pixels (R, G, and B pixels) based on the set. It can be configured as a bridge structure.
  • the antenna electrodes 641a may be disposed to surround one set of organic light emitting materials, and the antenna electrodes 641a may be configured to be connected to each other as a whole. (See FIG. 18A )
  • the antenna electrode 641a may be configured in a coil shape that surrounds a partial region around the set of at least one organic light emitting material (see FIG. 18B ).
  • the antenna electrode 641a overlaps each other for R, G, and B pixels. may be spaced apart from each other at a predetermined interval without being
  • a display pixel eg, the second electrode 832 of FIGS. 17A and 17B
  • a set of organic light emitting materials may be included in one integrated circuit (IC) or IC package.
  • one organic light emitting material set is connected to the display driver IC (DDI), and a light emitting operation may be performed according to a circuit operation.
  • the antenna electrode 641a is respectively connected to a wireless communication circuit (eg, RFIC), and may perform a wireless communication operation according to the circuit operation.
  • the number of display pixels positioned within the antenna electrode 641a and the antenna wiring may be variously designed and changed.
  • 19 is a schematic diagram illustrating a disposition relationship between a sensor electrode and an antenna electrode, according to various embodiments of the present disclosure
  • 20 is a schematic diagram illustrating a time division switching operation of a display assembly according to various embodiments of the present disclosure
  • different electrodes may be disposed on the same layer as the display pixels (R, G, and B pixels).
  • the first electrode 931 may be an electrode for operating any one of a pressure sensor, a touch sensor, a fingerprint sensor, a proximity sensor, and a biosensor, and may have a predetermined interval with respect to the R, G, and B pixels without overlapping each other. may be spaced apart.
  • the communication circuit may be configured to transmit/receive a radio frequency signal to/from an external electronic device using the second electrode 932 .
  • the second electrode 932 is an antenna electrode, and may be disposed on the same layer or on the same plane as the first electrode 931 .
  • the second electrode 932 may be alternately disposed with the first electrode 931 and may be made of the same material.
  • the electronic device may include a control circuit (not shown) electrically connected to at least one of a touch electrode, a pressure electrode, a display electrode, a fingerprint electrode, and/or an antenna electrode.
  • the control circuit detects a position of a touch input with respect to a touch of a user's finger by using the touch electrode, detects the intensity of the user's touch input by using a pressure electrode, and uses the display electrode, Visual information may be displayed on at least a portion of the display.
  • the display apparatus of the electronic device may be repeatedly performed time division driving divided into five sections. For example, during a first time period, a reception signal may be received through the display electrode. In a first time period, a driving voltage may be applied through the display electrode, and a reference voltage, eg, a ground voltage or a specific voltage, may be applied to the touch electrode, the pressure electrode, the fingerprint electrode, and the antenna electrode.
  • a reference voltage eg, a ground voltage or a specific voltage
  • a reception signal may be received through the touch electrode during a second time period.
  • a driving voltage may be applied through the touch electrode
  • a reference voltage eg, a ground voltage or a specific voltage
  • a reception signal may be received through the pressure electrode during a third time period.
  • a driving voltage may be applied through the pressure electrode, and a reference voltage, eg, a ground voltage or a specific voltage, may be applied to the touch electrode, the display electrode, the fingerprint electrode, and the antenna electrode.
  • the electronic device may include a fingerprint electrode electrically connected to the control circuit, and the control circuit may acquire user's fingerprint information included in the touch input by using the fingerprint electrode.
  • the electronic device may include an antenna electrode electrically connected to the communication circuit, and the communication circuit may transmit and receive a radio frequency signal with an external electronic device using the antenna electrode.
  • the fingerprint electrode may receive a reception signal having a fourth period during a fourth time period.
  • the antenna electrode may receive a reception signal having a fifth period during a fifth time period.
  • a driving voltage may be applied to the fingerprint electrode and/or the antenna electrode, and a reference voltage, eg, a ground voltage or a specific voltage, may be applied to the remaining electrodes.
  • two or more signals may be simultaneously driven in one division period, and time division driving of the two divisions may be repeatedly performed or time division driving may be performed through inversion driving.
  • the control circuit detects that the touch sensor of the electronic device does not operate, Only the screen output and pressure sensor can be driven simultaneously or time-divisionally.
  • the control circuit may temporarily increase a corresponding signal frequency and decrease the remaining signal frequency in the electronic device. For example, during card payment due to the fingerprint recognition mode, an operation of temporarily increasing the frequency of the fingerprint recognition signal and decreasing the frequency of other proximity sensors may be performed.
  • the control circuit when the wireless charging mode operating in the antenna structure is set, the control circuit reduces the remaining sensor-related signal frequency and/or power or stops the sensor-related sensing while charging is in progress in the electronic device can be done
  • 21 is a cross-sectional view of a substrate of a display assembly and electrical components disposed on the substrate, according to various embodiments of the present disclosure
  • 22 is a block diagram illustrating a connection structure between a display assembly and a main circuit board according to various embodiments of the present disclosure
  • the display assembly 330 includes a transparent member 710 , an antenna layer 750 including at least one antenna, and a TFT/display element layer 720 and a display substrate 730 . may include.
  • the structure of the display assembly 330 of FIG. 21 may be the same as all or part of the display assembly 330 of FIG. 8 .
  • the display substrate 730 includes a first region S1, a bending region S3, and a second region S2, and on the first region S1, a transparent member 710;
  • An antenna layer 750 including at least one antenna and a TFT/display element layer 720 may be stacked.
  • the antenna may be implemented by forming a pattern on one surface of the TFT/display element layer 720 .
  • the TFT/display element layer 720 may form a thin-film-encapsulation (TFE) that covers and protects internal elements, and may implement an antenna pattern on an upper surface of the encapsulation member.
  • TFE thin-film-encapsulation
  • the second region S2 forms a region extending from the bending region S3 , and includes at least one electrical component (eg, a display driver IC (DDI) 751 ) and a wireless communication circuit (eg: The RFIC 752 may be disposed. As another example, the RFIC 752 may be disposed on the flexible circuit board 760 connected from the end of the second region S2.
  • a display driver IC DDR4
  • a wireless communication circuit eg: The RFIC 752 may be disposed.
  • the RFIC 752 may be disposed on the flexible circuit board 760 connected from the end of the second region S2.
  • a communication line 755 may be disposed in the bending area S3 to electrically connect the RFIC 752 and the antenna.
  • the communication wiring 755 may be processed into a signal pattern along the display substrate 730 , may extend from the upper surface of the encapsulation member, and may be connected to the antenna pattern.
  • a connector 761 is positioned at one end of the flexible circuit board 760 and may be connected to a main circuit board of an electronic device (eg, the printed circuit board 340 of FIG. 5 ).
  • the AP, CP, and display PMIC signals/power on the main circuit board 340 through a connector are electrically connected to the display assembly 330 .
  • the AP may connect image data generated by the GPU and a control signal of the display assembly.
  • CP can connect I/F signal made by modem and control signal of RFIC.
  • the display PMIC can supply the power required by the DDI and the power required by the RFIC.
  • the connector 761 may be designed to space apart pin positions of each signal line as much as possible to improve noise between each connection signal, or a shielding structure for each connection module may be applied.
  • one flexible circuit board may include a plurality of connection lines (eg, connectors), and at least one connection line transmits a display signal. and another connection line may be used to transmit a communication signal.
  • connection lines eg, connectors
  • 23A, 23B, and 23C are diagrams illustrating the arrangement of wireless communication circuitry in a display assembly, according to various embodiments of the present disclosure
  • 23A and 23B are a cross-sectional view and a plan view of the display substrate before bending
  • FIG. 23C is a cross-sectional view of the display substrate after bending.
  • the display assembly 330 may include a transparent member 710 , a TFT/display element layer 720 , a display substrate 730 , and a conductive plate 740 .
  • the structure of the display assembly 330 of FIGS. 23A, 23B, and 23C may be the same as a part or all of the display assembly 330 of FIG. 21 .
  • the display substrate 730 includes a first region S1, a bending region S3, and a second region S2, and on the first region S1, a transparent member ( 710 , the TFT/display element layer 720 , and the display substrate 730 and the conductive plate 740 may be stacked.
  • the display substrate 730 may be a single or multiple-layered substrate including polyimide (PI), and the conductive plate 740 may be a copper plate.
  • PI polyimide
  • the conductive plate 740 may be a copper plate.
  • at least a partial layer is removed to create a hole 741 , and when the display substrate 730 is bent, the antenna 753 and/or the wireless communication circuit ( For example, RFIC 752) may be deployed.
  • the bending region S3 may extend from the first region S1 and may be bent downward to face a portion of the first region S1 and the second region S2. .
  • the second area S2 is an area extending from the bending area S3 , and at least one electrical component (eg, a display driver IC (DDI) 751 ) may be disposed.
  • the RFIC 752 may be disposed on the flexible circuit board 760 connected from the end of the second region S2 .
  • a connector 761 is positioned on the flexible circuit board 760 and may be connected to a main circuit board of an electronic device (eg, the printed circuit board 340 of FIG. 5 ).
  • the first region S1 of the display substrate 730 is disposed above the hole 741 of the conductive plate 740 , and below the display substrate 730 .
  • the flexible circuit board 760 may be stacked.
  • the conductive plate 740 and the flexible circuit board 760 may be spaced apart from each other by a predetermined interval.
  • the antenna 753 and the RFIC 752 may be disposed to face each other.
  • the antenna 753 is disposed on the top surface of the flexible circuit board 760 facing the first direction (+Z) and the interior adjacent to the top surface, and the second direction (-Z) opposite to the first direction (+Z) ), the RFIC 752 may be disposed on the lower surface, respectively.
  • the antenna 753 and the RFIC 752 are connected to or coupled via a hole to transmit and receive a communication signal, and the antenna 753 receives the received from the RFIC 752 through the hole 741 of the conductive plate 740 . It can radiate radio signals.
  • 24A, 24B, and 24C are diagrams illustrating placement of wireless communication circuitry in a display assembly, according to various embodiments of the present disclosure
  • 24A is a cross-sectional view of the display substrate before bending
  • FIG. 24B is a plan view of the display substrate showing the front and rear surfaces of the antenna
  • FIG. 24C is a cross-sectional view after the display substrate is bent.
  • the display assembly 330 may include a transparent member 710 , a TFT/display element layer 720 , a display substrate 730 , and a conductive plate 740 .
  • the structure of the display assembly 330 of FIGS. 24A, 24B, and 24C may be partially or entirely the same as that of FIGS. 23A, 23B, and 23C, and will be described below focusing on differences.
  • the display substrate 730 includes a first region S1 , a bending region S3 , and a second region S2 , and a conductive plate disposed in the first region S1 . At least a partial layer of the region 740 is removed to form a hole 741 , and when the display substrate 730 is bent, the antenna 753 may be disposed under the hole 741 .
  • the second area S2 is an area extending from the bending area S3 , and at least one electrical component (eg, a display driver IC (DDI) 751 ) may be disposed.
  • a wireless communication circuit eg, RFIC 752
  • the antenna 753 may be disposed adjacent to the left or right edge of the display assembly 330 (or the first region S1 of the display substrate 730 ), and for this purpose, a separate connection member connected to the RFIC 752 .
  • the position can be set through (752a) (eg, a flexible circuit board).
  • a first connector 761 electrically connected to the DDI 751 is positioned on the flexible circuit board 760
  • a second connector 762 electrically connected to the RFIC 752 is positioned on the flexible circuit board 760 . It may be connected to a main circuit board (eg, the printed circuit board 340 of FIG. 5 ).
  • the first connector 761 and the second connector 762 may be disposed on different flexible printed circuit boards.
  • an antenna 753 may be disposed inside the hole 741 of the conductive plate 740 .
  • the antenna 753 may be disposed adjacent to the left or right edge of the display assembly 330 .
  • the antenna 753 may radiate a radio signal received from the RFIC 752 through the hole 741 of the conductive plate 740 .
  • 25A, 25B, and 25C are diagrams illustrating placement of wireless communication circuitry in a display assembly, according to various embodiments of the present disclosure.
  • 25A is a cross-sectional view of the display substrate before bending
  • FIG. 25B is a plan view of the display substrate, showing the front and rear surfaces of the flexible circuit board
  • FIG. 25C is a cross-sectional view after the display substrate is bent.
  • the display assembly 330 may include a transparent member 710 , a TFT/display element layer 720 , a display substrate 730 , and a conductive plate 740 .
  • the structure of the display assembly 330 of FIGS. 25A, 25B, and 25C may be partially or entirely the same as that of FIGS. 23A, 23B, and 23C, and will be described below focusing on differences.
  • the display substrate 730 includes a first region S1 , a bending region S3 , and a second region S2 , and a conductive plate disposed in the first region S1 .
  • a partial layer is removed to create a hole 741 , and when the display substrate 730 is bent, the antenna 753 and/or a wireless communication circuit (eg: RFIC 752) may be deployed.
  • the second area S2 is an area extending from the bending area S3 , and at least one electrical component (eg, a display driver IC (DDI) 751 ) may be disposed.
  • the RFIC 752 may be disposed on the flexible circuit board 760 connected from the end of the second region S2 .
  • a first connector 761 electrically connected to the DDI 751 is positioned on the flexible circuit board 760
  • a second connector 762 electrically connected to the RFIC 752 is positioned on the flexible circuit board 760 . It may be connected to a main circuit board (eg, the printed circuit board 340 of FIG. 5 ).
  • the first connector 761 and the second connector 762 may be disposed on different flexible printed circuit boards.
  • the first region S1 of the display substrate 730 is disposed above the hole 741 of the conductive plate 740 , and below
  • the flexible circuit board 760 may be stacked.
  • the conductive plate 740 and the flexible circuit board 760 may be spaced apart from each other by a predetermined interval.
  • the antenna 753 and the RFIC 752 may be disposed to face each other.
  • the antenna 753 is disposed on the top surface of the flexible circuit board 760 facing the first direction (+Z) and the interior adjacent to the top surface, and the second direction (-Z) opposite to the first direction (+Z) ), the RFIC 752 may be disposed on the lower surface, respectively.
  • the antenna 753 and the RFIC 752 are connected to or coupled via a hole to transmit and receive a communication signal, and the antenna 753 receives the received from the RFIC 752 through the hole 741 of the conductive plate 740 . It can radiate radio signals.
  • a partition wall 770 (eg, a wave trap) may be disposed along the periphery of the antenna 753 .
  • the barrier rib 770 may limit interference from adjacent lines and may reduce antenna performance deviation when bonding to the conductive plate 740 .
  • the partition wall 770 is joined along the periphery of the hole 741 of the conductive plate 740 , and an area in which the antenna 753 is disposed or an opening for transmitting and receiving a communication signal corresponding to the thickness design of the partition wall 770 . thickness can be adjusted.
  • the protrusion 745 is disposed to correspond to the partition wall 770 , and the thickness of the area where the antenna 753 is disposed or the opening for transmitting and receiving communication signals can be adjusted.
  • an insulating member 765 may be disposed under the antenna 753 .
  • the insulating member 765 is disposed in at least a partial area of the flexible circuit board 760 (eg, an area adjacent to the antenna 753 ), and has a high dielectric constant compared to other areas of the flexible circuit board 760 . It is composed of a material having a , so that the performance of the antenna 753 can be improved.
  • 26A, 26B, and 26C are diagrams illustrating placement of wireless communication circuitry in a display assembly, according to various embodiments of the present disclosure
  • 26A is a cross-sectional view of the display substrate before bending
  • FIG. 26B is a plan view of the display substrate, showing the front and back surfaces of the flexible circuit board
  • FIG. 26C is a cross-sectional view after the display substrate is bent.
  • the display assembly 330 may include a transparent member 710 , a TFT/display element layer 720 , a display substrate 730 , and a conductive plate 740 .
  • the structure of the display assembly 330 of FIGS. 26A, 26B, and 26C may be partially or entirely the same as that of FIGS. 23A, 23B, and 23C, and will be described below focusing on differences.
  • the display substrate 730 includes a first region S1 , a bending region S3 , and a second region S2 , and a conductive plate disposed in the first region S1 .
  • a partial layer is removed to create a hole 741 , and when the display substrate 730 is bent, the antenna 753 and/or a wireless communication circuit (eg: RFIC 752) may be deployed.
  • the second area S2 is an area extending from the bending area S3 , and at least one electrical component (eg, a display driver IC (DDI) 751 ) may be disposed.
  • the RFIC 752 may be disposed on the flexible circuit board 760 connected from the end of the second region S2 .
  • the RFIC 752 may be disposed in a region where the display substrate 730 and the flexible circuit board 760 overlap.
  • the first region S1 of the display substrate 730 is disposed above the hole 741 of the conductive plate 740 , and is disposed below the display substrate 730 .
  • the second region S2 of the display substrate 730 and the flexible circuit board 760 may be stacked.
  • the conductive plate 740 and the second region S2 of the display substrate 730 may be spaced apart from each other by a predetermined interval.
  • the antenna 753 and the RFIC 752 may be disposed to face each other.
  • the antenna 753 is disposed on the top surface of the second region S2 of the display substrate 730 facing the first direction (+Z) and the interior adjacent to the top surface, and is opposite to the first direction (+Z).
  • RFICs 752 may be respectively disposed on a lower surface of the flexible circuit board 760 in the second direction (-Z).
  • the antenna 753 and the RFIC 752 may be connected or coupled to the via hole to transmit/receive communication signals, and the antenna 753 may receive a radio signal transmitted from the RFIC 752 through the hole 741 of the conductive plate 740 . signal can be emitted.
  • connection between the antenna 753 and the RFIC 752 is in the form of a coplanar waveguide (CPW) or microtrip having the same shape as the wiring structure of one surface of the flexible circuit board 760 other than the conductive wire via process. It can be implemented as a transmission line of The RFIC 752 feed line and the feed line on the display substrate 730 may be connected through a hot bar bonding process or the like.
  • CPW coplanar waveguide
  • 27A and 27B are diagrams illustrating the arrangement of wireless communication circuitry in a display assembly, according to various embodiments of the present disclosure
  • 27A is a perspective view of a bent display substrate
  • FIG. 27B is a cross-sectional view of the bent display substrate.
  • the structure of the display substrate 730 of FIGS. 27A and 27B may be partially or entirely the same as that of FIGS. 23A, 23B and 23C , and will be described below focusing on differences.
  • the display substrate 730 includes a first region S1 , a bending region S3 , and a second region S2 , and is connected from an end of the second region S2 .
  • the RFIC 752 and the first antenna 753 may be disposed on the flexible circuit board 760 .
  • the first antenna 753a is disposed on the upper surface of the flexible circuit board 760 facing the first direction (+Z) and the upper surface adjacent to the upper surface, and the second direction (+Z) opposite to the first direction (+Z) RFICs 752 may be respectively disposed on the lower surface of the flexible circuit board 760 facing -Z).
  • the first antenna 753a and the RFIC 752 may be connected or coupled through a conductive via 754 to transmit/receive a communication signal.
  • the second antenna 753b may be disposed in the bending region S3 of the display substrate 730 .
  • the first antenna 753a and the second antenna 753b may be disposed in a vertical direction to each other, and the first antenna 753a may radiate toward the top surface and the second antenna 753b may radiate toward the side surface.
  • the first antenna 753a may be formed of a patch type radiation conductor
  • the second antenna 753b may be formed of a radiation conductor having a dipole structure extending in one direction. When the radiation conductor(s) are formed in plurality, the plurality of radiation conductors may be arrayed to form a designated pattern to form an antenna array.
  • 28A, 28B, and 28C are diagrams illustrating placement of wireless communication circuitry in a display assembly, according to various embodiments of the present disclosure.
  • 28A is a cross-sectional view of the display substrate before bending
  • FIG. 28B is a plan view of the display substrate
  • 28C is a cross-sectional view after the display substrate is bent.
  • the display assembly 330 may include a transparent member 710 , a TFT/display element layer 720 , a display substrate 730 , and a conductive plate 740 .
  • the structure of the display assembly 330 of FIGS. 28A, 28B, and 28C may be partially or entirely the same as that of FIGS. 23A, 23B, and 23C, and will be described below focusing on differences.
  • the display substrate 730 includes a first region S1 , a bending region S3 , and a second region S2 , and is disposed in the first region S1 .
  • at least a partial layer is removed to create a hole 741 , and when the display substrate 730 is bent, the antenna 753 and/or wireless communication circuit (eg, the hole 741 ) down. : RFIC 752) may be disposed.
  • the second area S2 is an area extending from the bending area S3 , and at least one electrical component (eg, a display driver IC (DDI) 751 ) may be disposed.
  • the RFIC 752 may be disposed on the flexible circuit board 760 connected from the end of the second region S2 . Unlike FIGS. 23A to 23C , the RFIC 752 may be disposed on one surface of the flexible circuit board 760 facing the second direction (-Z).
  • the first region S1 of the display substrate 730 is disposed above the hole 741 of the conductive plate 740 , and is disposed below the display substrate 730 .
  • the flexible circuit board 760 may be stacked.
  • the conductive plate 740 and the second region S2 of the display substrate 730 may be spaced apart from each other by a predetermined interval.
  • the RFIC 752 on which the antenna 753 is mounted is disposed, and the antenna 753 and the RFIC ( 752) may be arranged to face the same direction.
  • An adhesive layer or a material for heat dissipation may be added to a portion where the RFIC 752 and the display substrate 730 contact each other.
  • at least a portion of the TFT/display element layer 720 may be removed to minimize a portion overlapping the RFIC 752 .
  • 29 is a cross-sectional view illustrating the arrangement of a wireless communication circuit and a heat dissipation structure in a display assembly according to various embodiments of the present disclosure
  • the display assembly 330 may include a TFT/display element layer 720 , a display substrate 730 , and a conductive plate 740 .
  • the structure of the display assembly 330 of FIG. 29 may be partially or entirely the same as that of FIGS. 23A, 23B, and 23C, and will be described below focusing on differences.
  • At least a partial layer is removed to form a hole 741 , and when the display substrate 730 is bent, the hole Below the 741 , an antenna 753 and an RFIC 752 may be disposed on the upper and lower surfaces of the flexible circuit board 760 , respectively.
  • a heat dissipation structure may be formed around the RFIC 752 .
  • an opening is formed in a portion of the bracket 790 disposed under the RFIC 752 , and a conductive member 782 and a heat dissipation member 781 may be mounted inside the opening.
  • a conductive member 782 having a first area may be disposed above the bracket 790
  • a heat dissipation member 781 having a second area may be disposed below the bracket 790 .
  • the first area may be larger than the second area
  • the heat dissipation member 781 may be soldered to the conductive member 782 , and the heat dissipation member 781 may be partially fixed in the vicinity of the step formed in the bracket 790 .
  • the conductive member 782 may be a metal plate such as a copper plate
  • the heat dissipation member 781 may be a heat pipe.
  • a heat transfer member 783 may be disposed between the conductive member 782 and the RFIC 752 .
  • the heat transfer member 783 may be formed of a carbon fiber thermal interface material (TIM) to effectively transmit heat from the RFIC 752 .
  • TIM carbon fiber thermal interface material
  • heat generated by the RFIC 752 may be diffused to the bracket 790 through the heat transfer member 783 , the conductive member 782 , and the heat dissipation member 781 , thereby improving heat dissipation performance.
  • FIG. 30 is a cross-sectional view illustrating the arrangement of a wireless communication circuit and a heat dissipation structure in a display assembly, according to various embodiments of the present disclosure
  • the display assembly 330 may include a TFT/display element layer 720 , a display substrate 730 , and a conductive plate 740 .
  • the structure of the display assembly 330 of FIG. 30 may be partially or wholly the same as that of FIG. 29 , and will be described below focusing on differences.
  • At least a partial layer is removed to form a hole 741 , and when the display substrate 730 is bent, the hole
  • An antenna 753 and an RFIC 752 may be respectively disposed on the upper and lower surfaces of the flexible circuit board 760 disposed under the 741 .
  • An antenna 753 may be mounted inside the hole 741 .
  • an opening is formed in a portion of the bracket 790 disposed under the flexible circuit board 760 , and the RFIC 752 , the conductive member 782 and the heat dissipation member 781 are formed inside the opening.
  • the conductive member 782 may be a metal plate such as a copper plate
  • the heat dissipation member 781 may be a heat pipe.
  • the RFIC 752 is mounted inside the opening of the bracket 790 to shield noise generated from the RFIC 752 .
  • the antenna 753 may radiate the radio signal received from the RFIC 752 through the hole 741 of the conductive plate 740 and the hole 741 of the TFT/display element layer 720 .
  • a connector 761 is positioned on the flexible circuit board 760 and may be electrically connected to electronic components (eg, AP, CP) of the main circuit board 340 of the electronic device.
  • a portable communication device (eg, 101 in FIG. 1 ) according to various embodiments of the present disclosure includes a printed circuit board (eg, 340 in FIG. 5 ) on which a processor (eg, 120 in FIG. 1 ) is located and electrically with the processor It may include a connected display.
  • the display (eg, 330 in FIG. 8 ) includes a transparent member (eg, 610 in FIG. 8 ), a display substrate disposed under the transparent member and at least partially bent (eg, 631 in FIG. 8 ), the display substrate A display element layer disposed on or above (eg, 633 of FIG. 8 ), an antenna disposed on or above the display substrate (eg, 641 of FIG. 8 ), and bent of the display substrate At least a portion thereof is disposed along the region and may include a communication line (eg, 645 of FIG. 8 ) electrically connected to the antenna.
  • a communication line eg, 645 of FIG. 8
  • the portable communication device may further include a wireless communication circuit (eg, 643 of FIG. 8 ) electrically connected to the antenna through the communication wire.
  • a wireless communication circuit eg, 643 of FIG. 8
  • the display substrate is electrically connected to at least one display pixel (eg, 633a in FIG. 8 ), and a first region (eg, in FIG. 8 ) formed to face at least a portion of the display element layer S1), a bending region extending from the first region and bent downward (eg, S3 in FIG. 8), and a second region extending from the bending region and facing at least a portion of the first region (eg, FIG. 8) S2) of 8 may be included.
  • the display further includes a display driving circuit (eg, 637 in FIG. 8 ) electrically connected to the display substrate, wherein the wireless communication circuit and the display driving circuit are disposed in the second area.
  • a display driving circuit eg, 637 in FIG. 8
  • the display is disposed on the display element layer, and further includes an antenna layer (eg, 640 in FIG. 8 ) including the antenna, and the wireless communication circuit is the second of the display substrate. It can be arranged in two areas.
  • the display further includes a touch sensor layer (eg, 634 in FIG. 8 ) and a TFT layer (eg, 632 in FIG. 8 ) disposed between the display substrate and the transparent member, and the communication
  • the wiring may include a first portion extending along a side surface of at least one of the touch sensor layer, the display element layer, and the TFT layer, and a second portion extending to the bent region of the display substrate.
  • the display further includes a TFT layer disposed between the display substrate and the transparent member, wherein the antenna is disposed on the same plane as at least a portion of the TFT layer, and among the display element layer A slit may be formed in a region corresponding to the antenna.
  • the display is disposed on the first region of the display substrate, and further includes an antenna layer including the antenna, wherein the display element layer is disposed in a region corresponding to the antenna.
  • a slit having a size corresponding to that of the antenna may be formed.
  • the communication wiring may be electrically connected to the antenna through at least one conductive via penetrating the display element layer.
  • the display further includes a touch sensor layer and a TFT layer between the display substrate and the transparent member
  • the communication wiring includes the touch sensor layer, the display element layer and the It may include a first portion extending along at least one side of the TFT layer, and a second portion extending to the bending region of the flexible substrate.
  • the antenna may include an array of a plurality of radiation conductors, the array of radiation conductors forming a periodic pattern, and may include a patch-type radiation conductor or a dipole-type radiation conductor.
  • the display substrate is formed of a single or a plurality of layers including polyimide (PI), and one side of the display substrate includes a display driving circuit for display control and a wireless communication circuit for an antenna. Each can be arranged. Wires for respectively connecting the display driving circuit and the wireless communication circuit may be positioned on the display substrate so as not to overlap each other.
  • PI polyimide
  • the display substrate includes a base substrate including polyimide or a flexible circuit board extending from one side of the base substrate, and a display driving circuit for display control is disposed on one surface of the base substrate, A wireless communication circuit for an antenna may be disposed on one surface of the flexible circuit board. Wirings for respectively connecting the display driving circuit and the wireless communication circuit may be wired along the display substrate and positioned so as not to overlap each other.
  • the display assembly may include a first area, a second area, and between the first area and the second area, and at least a part of the display assembly is bent to form the second area of the first area.
  • a display substrate including a bending region facing a portion thereof, a display element layer disposed on the first region and including a plurality of display pixels, and an antenna structure disposed on or above the display substrate.
  • the antenna structure includes an antenna disposed over at least one of the first area, the second area, and the bending area, a wireless communication circuit disposed over the second area, and at least a portion of the bending area is formed along the bending area, and a communication wire electrically connecting the antenna and the wireless communication circuit.
  • the display assembly further includes a touch sensor layer and a TFT layer disposed on or above the display substrate, and the communication wiring includes the touch sensor layer, the display element layer and the TFT. It may extend along a side surface of at least one of the layers to be wired to the bending region of the display substrate.
  • the pattern formed by the antenna may be disposed on the same surface as the plurality of display pixels, and may be spaced apart from each other so as not to overlap each other.
  • the display assembly may further include a display driving circuit electrically connected to the display substrate, and the display driving circuit may be disposed in the second region.
  • an electronic device includes a transparent member, a display element layer disposed under the transparent member and including one or more display pixels, a first region connected to the one or more display pixels, and extending from the first region and a display substrate including a bending region bent downward, an antenna formed on at least a portion of the first region of the display substrate, and a communication wire connected to the antenna and formed along the bending region of the display substrate.
  • the display substrate includes a second region extending from the bending region and facing at least a portion of the first region, a wireless communication circuit is disposed in the second region, and the communication wiring can be connected with
  • the transparent member includes an active region that provides an image and/or a video to a user through a display panel including the display element layer and the display substrate, and a non-active region extending to a periphery of the active region and the antenna disposed in the first area may overlap at least a portion of the active area.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • User Interface Of Digital Computer (AREA)

Abstract

Divers modes de réalisation de la présente invention concernent un dispositif de communication portable pouvant comprendre une carte de circuit imprimé sur laquelle un processeur est situé et un dispositif d'affichage connecté électriquement au processeur. L'affichage peut comprendre : un élément transparent ; un substrat d'affichage disposé au-dessous de l'élément transparent, et dont au moins une partie est pliée ; une couche d'élément d'affichage disposée sur ou au-dessus du substrat d'affichage ; une antenne disposée sur ou au-dessus du substrat d'affichage ; et un fil de communication dont au moins une partie est disposée le long d'une région courbée du substrat d'affichage et connectée électriquement à l'antenne.
PCT/KR2021/000622 2020-01-15 2021-01-15 Ensemble d'affichage comprenant une antenne et dispositif électronique le comprenant WO2021145734A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2020-0005639 2020-01-15
KR1020200005639A KR20210092095A (ko) 2020-01-15 2020-01-15 안테나를 포함하는 디스플레이 조립체 및 이를 포함하는 전자 장치

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WO2021145734A1 true WO2021145734A1 (fr) 2021-07-22

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US20220102871A1 (en) * 2021-06-30 2022-03-31 Shanghai Tianma Micro-electronics Co., Ltd. Antenna
WO2023212473A1 (fr) * 2022-04-25 2023-11-02 Apple Inc. Dispositif d'affichage avec traces conductrices enroulées latéralement

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US20140226291A1 (en) * 2012-02-24 2014-08-14 Apple Inc. Electronic Device Assemblies
KR20160129336A (ko) * 2015-04-30 2016-11-09 엘지전자 주식회사 이동 단말기
KR20170119849A (ko) * 2016-04-20 2017-10-30 삼성전자주식회사 디스플레이가 포함된 전자 장치
KR20190060305A (ko) * 2017-11-24 2019-06-03 삼성전자주식회사 가요성 기판과 도전층 사이에 응력 완화 층을 갖는 디스플레이 모듈을 포함하는 전자 장치
KR20190115888A (ko) * 2018-04-04 2019-10-14 삼성전자주식회사 무선 충전 모듈 및 플렉서블 디스플레이를 포함하는 전자 장치

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US20140226291A1 (en) * 2012-02-24 2014-08-14 Apple Inc. Electronic Device Assemblies
KR20160129336A (ko) * 2015-04-30 2016-11-09 엘지전자 주식회사 이동 단말기
KR20170119849A (ko) * 2016-04-20 2017-10-30 삼성전자주식회사 디스플레이가 포함된 전자 장치
KR20190060305A (ko) * 2017-11-24 2019-06-03 삼성전자주식회사 가요성 기판과 도전층 사이에 응력 완화 층을 갖는 디스플레이 모듈을 포함하는 전자 장치
KR20190115888A (ko) * 2018-04-04 2019-10-14 삼성전자주식회사 무선 충전 모듈 및 플렉서블 디스플레이를 포함하는 전자 장치

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220102871A1 (en) * 2021-06-30 2022-03-31 Shanghai Tianma Micro-electronics Co., Ltd. Antenna
US11909118B2 (en) * 2021-06-30 2024-02-20 Shanghai Tianma Micro-electronics Co., Ltd. Antenna
WO2023212473A1 (fr) * 2022-04-25 2023-11-02 Apple Inc. Dispositif d'affichage avec traces conductrices enroulées latéralement

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