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WO2021018071A1 - A conductive flexible link and manufacturing method thereof - Google Patents

A conductive flexible link and manufacturing method thereof Download PDF

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Publication number
WO2021018071A1
WO2021018071A1 PCT/CN2020/104703 CN2020104703W WO2021018071A1 WO 2021018071 A1 WO2021018071 A1 WO 2021018071A1 CN 2020104703 W CN2020104703 W CN 2020104703W WO 2021018071 A1 WO2021018071 A1 WO 2021018071A1
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WO
WIPO (PCT)
Prior art keywords
straps
flexible link
conductive flexible
substrates
manufacturing
Prior art date
Application number
PCT/CN2020/104703
Other languages
French (fr)
Inventor
Kui YANG
Original Assignee
Shanghai Yizhao Pharmaceutical Science & Technology Co. Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Yizhao Pharmaceutical Science & Technology Co. Ltd. filed Critical Shanghai Yizhao Pharmaceutical Science & Technology Co. Ltd.
Publication of WO2021018071A1 publication Critical patent/WO2021018071A1/en

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals

Definitions

  • the invention flexible conductive link, mainly employed as heat or electricity transfer route which is intended to achieve a thermal or electricity coupling and structural decoupling between energy origin and destination.
  • a new conductive flexible link comprising metallic substrates 1, normally made of coppor, aluminum or other metal alloy; advanced material straps 2, normally made of pyrolytic graphite or other advanced materials, including but not limited to special alloy, ceramic, nano composites.
  • Graphite flexible straps 2 with inherent high thermal and electricity conductivity are penetrated at its inserting ends with various shapes of one or multiple holes 3, including but not limited to, rectangular, trapezoid, star, ellipse... etc. Both ends of penetrated flexible straps 2 are inserted intermittently into metallic substrates 1 which in turn clamped the straps 2 vertically. Finally the accumulative such sandwich structures are welded to form an integral structure on both ends of flexible conductive link.
  • the metallic endings serve as fixture to other component and straps 2 serve as efficient route transferring heat or electricity.
  • Current connection applied in flexible link between advanced materials and metallic endings are complicated and expensive. Introduction of adhesive generated high resistance in low temperature and possibly caused outgassing concern. Other mechanic solutions potentially generate void volume which further lower transferring efficiency. In both case the manufacturing cost is inevitably high.
  • a stack of substrates 1 constitute metallic panel and clamp the straps 2 by welding process.
  • the holes which have close perimeter independent of outer perimeter of the strap 2 are referred as close hole.
  • One or multiple closed holes as buffer compensating dimension expansion and shrinkage during temperature fluctuations are pre punched at ends of flexible straps 2, illustrated by Fig. 3 and Fig. 5.
  • holes with notches 6 by which perimeter of the hole constitute a section of outer perimeter of the strap 2 itself referred as open holes.
  • These notches 6 partially connected to the outer perimeter of straps 2 and apparently formed zigzag edge serving as gas or liquid passage during further processing period, illustrated by Fig. 4 and Fig. 6.
  • the holes 3 result in straps 2 embedding into the panel as original empty holes 3 are refilled and occupied by upper and lower substrates material merged during welding process, which therefore reinforced the whole structure.
  • straps end are at minimal 3 mm less than substrate edge in other dimensions excepting in its inserting direction. If heat electron beam solution is selected, straps end can be larger, more close to the edge of substrates. Take rectangle substrates 1 and straps 2 as example, periphery areas in top substrates 1 left by undersized straps ends are merged vertically with corresponding periphery area in below substrates 1; Similarly blank area in top substrates 1 intentionally uncovered by holes 3 are merged vertically with corresponding blank area in below substrates 1. Hence the whole stack of substrates 1 and straps 2 are build into one integral panel during welding. The part in the panel 4 formed by periphery and blank area is amenable to mechanic processing such as trilling and digging.
  • the number, location and intervals of substrates 1 and straps 2 intertwined can be arranged case by case and varied in one unit with regard to energy transfer requirement.
  • additional binding materials 7 as welding assistance including alloy foil, welding paste and powder, pre coated alloy layer are positioned between substrate 1 and strap 2.
  • Thickness of the substrates 1 foils varied with respect to distribution of straps 2 in one unit.
  • the accumulative thickness of the substrates 1 spacing the straps 2 is no less than two times of the thickness of the straps 2 accommodated.
  • single strap thickness is 0.05 mm
  • substrate thickness is 0.05 mm as well.
  • One insertion take two straps and every insertion (two straps) should be separated by 4 substrate foils at minimum.
  • Substrates 1 and pressing mold are rounded at edge 8 corresponding to strap insertion section to avoid flexible strap damage caused by substrate edge 8.
  • One or multiple straps 2 intermittently insert into substrates 1 with proper intervals to achieve accumulative sandwich structure. Limited pressure imposed normally less than 1 MPa to clamp the stack during deoxygenization by vacuum or inert gas to facilitate residue air escaping and inert gas entry into holes 3.
  • the low clamping pressure normally less than 1 MPa maintained, marginally secure the strap and substrate in proper position, during the whole pre heating period when temperature gradually elevated.
  • Moderate clamping pressure normally less than 2 MPa imposed on stack in presence of binding material 7 after reaching welding temperature.
  • Electron Beam Welding with moderate clamping pressure, normally less than 2 MPa rather than high pressure pressing is undertaken along with circumference of substrates 1 excepting straps 2 insertion section.
  • This invention provide a simple but effective solution on connection between metallic endings and flexible straps without any organic materials involvement.
  • Fig. 1 is schematic overall diagram illustrating welded apparatus.
  • Fig. 2 is side view illustrating single sandwich structure with binding material.
  • Fig. 3 is perspective view of single sandwich structure, closed hole.
  • Fig. 4 is perspective view of single sandwich structure open hole.
  • Fig. 5 is perspective view of single sandwich structure with binding material, closed hole.
  • Fig. 6 is perspective view of single sandwich structure with binding material, open hole.
  • Substrates 1 merged with assistance of binding material which is melted and penetrated into crevice including the holes 3 under welding condition such as temperature and pressure.
  • the pressure required in this embodiment is lower than that in first embodiment.
  • same principle of low pressure in deoxygenization and pre heating phase still applied.
  • the invention applies in any working condition which require energy coupling and structure decoupling, for instance the connection between cryocooler and precision instrument, electricity supply in various vibration condition...

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

A conductive flexible link and manufacturing method thereof are provided. The conductive flexible link comprises substrates (1). The substrates (1) are constructed into a panel (4) and straps (2) which are embedded into the panel (4). The manufacturing method comprises steps of pretreatment on straps ends, intermittently inserting straps (2) into substrates (1), deoxygenization by vacuum or inert gas under low clamping pressure, pre heating under low clamping pressure on stack, welding under target temperature and pressure, and cooling under deoxygenized environment.

Description

A conductive flexible link and manufacturing method thereof Technical Field
The invention, flexible conductive link, mainly employed as heat or electricity transfer route which is intended to achieve a thermal or electricity coupling and structural decoupling between energy origin and destination.
Background Art
In conventional flexible link structure, straps made of superior conductive material, such as graphite can be connected by forging and adhesive to metal endings as elaborated in U.S. Pat. No. 5,077,637 and 6,749,010B2. These solutions caused heat or electricity resistance, in the meantime, entailed high manufacturing cost.
Summary of Invention
A new conductive flexible link comprising metallic substrates 1, normally made of coppor, aluminum or other metal alloy; advanced material straps 2, normally made of pyrolytic graphite or other advanced materials, including but not limited to special alloy, ceramic, nano composites. Graphite flexible straps 2 with inherent high thermal and electricity conductivity are penetrated at its inserting ends with various shapes of one or multiple holes 3, including but not limited to, rectangular, trapezoid, star, ellipse... etc. Both ends of penetrated flexible straps 2 are inserted intermittently into metallic substrates 1 which in turn clamped the  straps 2 vertically. Finally the accumulative such sandwich structures are welded to form an integral structure on both ends of flexible conductive link.
Technical Problem
In popular flexible link structure, the metallic endings serve as fixture to other component and straps 2 serve as efficient route transferring heat or electricity. Current connection applied in flexible link between advanced materials and metallic endings are complicated and expensive. Introduction of adhesive generated high resistance in low temperature and possibly caused outgassing concern. Other mechanic solutions potentially generate void volume which further lower transferring efficiency. In both case the manufacturing cost is inevitably high.
Solution to Problem
Solution to problem is described with reference of drawings. The second embodiment shared the same principle as first embodiment but with binding materials. To clear illustrate the structure, dimension of components, especially thickness, are exaggerated.
In this invention, a stack of substrates 1 constitute metallic panel and clamp the straps 2 by welding process.
The holes which have close perimeter independent of outer perimeter of the strap 2 are referred as close hole. One or multiple closed holes as buffer compensating dimension expansion and shrinkage during temperature fluctuations are pre punched at ends of flexible straps 2, illustrated by Fig. 3 and Fig. 5. In the meantime, holes with notches 6 by which perimeter of the hole constitute a section of outer perimeter of the strap 2 itself, referred as open holes. These notches 6 partially connected to the outer perimeter of straps 2 and apparently formed zigzag edge serving as gas or liquid passage during further processing period, illustrated by Fig. 4 and Fig. 6. In either case, the holes 3 result in straps 2  embedding into the panel as original empty holes 3 are refilled and occupied by upper and lower substrates material merged during welding process, which therefore reinforced the whole structure.
If heat pressing solution is selected, in plane of straps 2 and substrates 1 tight fitting, straps end are at minimal 3 mm less than substrate edge in other dimensions excepting in its inserting direction. If heat electron beam solution is selected, straps end can be larger, more close to the edge of substrates. Take rectangle substrates 1 and straps 2 as example, periphery areas in top substrates 1 left by undersized straps ends are merged vertically with corresponding periphery area in below substrates 1; Similarly blank area in top substrates 1 intentionally uncovered by holes 3 are merged vertically with corresponding blank area in below substrates 1. Hence the whole stack of substrates 1 and straps 2 are build into one integral panel during welding. The part in the panel 4 formed by periphery and blank area is amenable to mechanic processing such as trilling and digging.
The number, location and intervals of substrates 1 and straps 2 intertwined can be arranged case by case and varied in one unit with regard to energy transfer requirement.
In case that excessive thickness of the strap render welding ineffective, additional binding materials 7 as welding assistance, including alloy foil, welding paste and powder, pre coated alloy layer are positioned between substrate 1 and strap 2.
Thickness of the substrates 1 foils varied with respect to distribution of straps 2 in one unit. The accumulative thickness of the substrates 1 spacing the straps 2 is no less than two times of the thickness of the straps 2 accommodated. For instance single strap thickness is 0.05 mm, substrate thickness is 0.05 mm as well. One insertion take two straps and every insertion (two straps) should be separated by 4 substrate foils at minimum. Substrates 1 and pressing mold are rounded at edge 8 corresponding to strap insertion section to avoid flexible strap damage caused by substrate edge 8.
One or multiple straps 2 intermittently insert into substrates 1 with proper intervals to achieve accumulative sandwich structure. Limited pressure imposed  normally less than 1 MPa to clamp the stack during deoxygenization by vacuum or inert gas to facilitate residue air escaping and inert gas entry into holes 3.
The low clamping pressure, normally less than 1 MPa maintained, marginally secure the strap and substrate in proper position, during the whole pre heating period when temperature gradually elevated.
In the moment of reaching welding temperature, high pressure no less than 5 Mpa applied to clamp the stack and merge the substrates 1 into a panel in absence of binding material 7. Higher pressure is selectively imposed on the corresponding area that flexible strap 2 did not cover.
Moderate clamping pressure, normally less than 2 MPa imposed on stack in presence of binding material 7 after reaching welding temperature.
In case that pressure sensitive straps 2 applied, Electron Beam Welding with moderate clamping pressure, normally less than 2 MPa rather than high pressure pressing is undertaken along with circumference of substrates 1 excepting straps 2 insertion section.
Post welding cool down period, vacuum or inert gas maintain to avoid oxygenation.
Advantageous Effects of Invention
This invention provide a simple but effective solution on connection between metallic endings and flexible straps without any organic materials involvement.
Brief Description of Drawings
Fig. 1 is schematic overall diagram illustrating welded apparatus.
Fig. 2 is side view illustrating single sandwich structure with binding material.
Fig. 3 is perspective view of single sandwich structure, closed hole.
Fig. 4 is perspective view of single sandwich structure open hole.
Fig. 5 is perspective view of single sandwich structure with binding material, closed hole.
Fig. 6 is perspective view of single sandwich structure with binding material, open hole.
In describing the preferred embodiment of the invention which is illustrated in the drawings, specific terminology will be resorted to for the sake of clarity. However, it is not intended that the invention be limited to the specific term so selected and it is to be understood that each specific term includes all technical equivalents which operate in a similar manner to accomplish a similar purpose.
Description of Embodiments
First embodiment as illustrated in Fig. 3 and Fig. 4, no binding material 7 applied. Substrates 1 merged under welding condition mainly target temperature and pressure. Initial low pressure as temperature gradient elevation in deoxygenization and preheating period render no constrain on substrates 1 dimension and eliminate internal stress potentially caused by heat expansion. When substrate material reach target welding temperature and expanded to certain extent, high pressure impose on the stack to perform welding.
Second embodiment as illustrated in Fig. 5 and Fig. 6, binding material 7 applied. Substrates 1 merged with assistance of binding material which is melted and penetrated into crevice including the holes 3 under welding condition such as temperature and pressure. The pressure required in this embodiment is lower than that in first embodiment. However same principle of low pressure in deoxygenization and pre heating phase still applied.
Industrial Applicability
The invention applies in any working condition which require energy coupling and structure decoupling, for instance the connection between cryocooler and precision instrument, electricity supply in various vibration condition...
The detailed description in connection with drawings is intended principally as a description of presently preferred embodiment of invention, and is not intended to represent the only form in which the present invention may be constructed or utilized. The description set forth the designs, functions, means and methods of implementing the invention in connection with illustrated embodiments. It is to be understood, however, that the same or equivalent functions and features may be accomplished by different embodiments that are also intended to be encompassed within the spirit and scope of the invention and that various modifications may be adopted without departing from the invention or scope of the following claims.

Claims (16)

  1. A conductive flexible link comprising substrates that are constructed into a panel and straps that are embedded into the said panel.
  2. A conductive flexible link of claim 1, wherein one or multiple straps intermittently insert into substrates to achieve accumulative sandwich structure.
  3. A conductive flexible link in accordance to claim 2 wherein the number, location and intervals of substrates and straps intertwined are arranged case by case and varied in one unit with regard to energy transfer requirement.
  4. A conductive flexible link in accordance to claim 2, wherein thickness of the substrates foils varied with respect to distribution of straps in one unit.
  5. A conductive flexible link in accordance to claim 4, wherein the accumulative thickness of the substrates spacing the straps is no less than two times of total thickness of the straps it accommodated.
  6. A conductive flexible link in accordance to claim 2, wherein in plane of straps and substrates tight fitting, straps end are smaller than substrate in other dimensions excepting in its inserting direction.
  7. A conductive flexible link in accordance to claim 1, straps are penetrated with various shapes of one or multiple holes at its inserting ends, including but not limited to, rectangular, trapezoid, star, ellipse... etc.
  8. A conductive flexible link in accordance to claim 7, wherein open holes with notches 6 by which perimeter of the hole constitute a section of outer perimeter of the strap itself are penetrated.
  9. A conductive flexible link in accordance to claim 1, wherein additional binding materials as welding assistance, including alloy foil, welding paste and powder, pre coated layer are positioned between substrate and strap.
  10. A manufacturing method for producing conductive flexible link comprising a step of pretreatment on straps ends including penetration; a step of  intermittently inserting straps into substrates; a step of deoxygenization by vacuum or inert gas under low clamping pressure; a step of pre heating under low clamping pressure on stack; a step of welding under target temperature and pressure; a step of cooling under deoxygenized environment.
  11. A manufacturing method for producing conductive flexible link of claim 10, wherein straps end are cut to the dimensions at minimal 3 mm less than substrate edge except in its inserting direction.
  12. A manufacturing method for producing conductive flexible link of claim 10, wherein the intertwined straps and substrates are under low clamping pressure normally less than 1 MPa during both deoxygenization and pre heating periods.
  13. A manufacturing method for producing conductive flexible link of claim 10, wherein the intertwined straps and substrates are imposed by high pressure more than 5 MPa in absence of binding material.
  14. A manufacturing method for producing conductive flexible link of claim 13, wherein higher pressure is selectively imposed on the corresponding area that flexible strap did not occupy.
  15. A manufacturing method for producing conductive flexible link of claim 10, wherein moderate clamping pressure, normally less than 2 MPa is imposed on stack in presence of binding material after reaching welding temperature.
  16. A manufacturing method for producing conductive flexible link of claim 10, wherein in case that pressure sensitive straps applied, Electron Beam Welding under moderate clamping pressure, normally less than 2 MPa rather than high pressure pressing is undertaken along with circumference of substrates 1 excepting straps insertion section.
PCT/CN2020/104703 2019-07-27 2020-07-26 A conductive flexible link and manufacturing method thereof WO2021018071A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201921194026.9U CN211234067U (en) 2019-07-27 2019-07-27 Flexible heat transfer conductive device
CN201921194026.9 2019-07-27

Publications (1)

Publication Number Publication Date
WO2021018071A1 true WO2021018071A1 (en) 2021-02-04

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5343940A (en) * 1992-10-29 1994-09-06 Amigo Jean Flexible heat transfer device
US5485671A (en) * 1993-09-10 1996-01-23 Aavid Laboratories, Inc. Method of making a two-phase thermal bag component cooler
EP1020912A1 (en) * 1991-05-31 2000-07-19 Minnesota Mining And Manufacturing Company Semi-rigid heat transfer devices
LU100895B1 (en) * 2016-12-08 2018-12-18 Patrick Joseph Glynn APPARATUS AND METHODS FOR ENERGY STORAGE AND RECOVERY
CN109475425A (en) * 2016-03-28 2019-03-15 加利福尼亚大学董事会 Heat exchange module, system and method
CN208936834U (en) * 2018-09-06 2019-06-04 广州大学 A kind of flexible flat heat pipe structure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1020912A1 (en) * 1991-05-31 2000-07-19 Minnesota Mining And Manufacturing Company Semi-rigid heat transfer devices
US5343940A (en) * 1992-10-29 1994-09-06 Amigo Jean Flexible heat transfer device
US5485671A (en) * 1993-09-10 1996-01-23 Aavid Laboratories, Inc. Method of making a two-phase thermal bag component cooler
CN109475425A (en) * 2016-03-28 2019-03-15 加利福尼亚大学董事会 Heat exchange module, system and method
LU100895B1 (en) * 2016-12-08 2018-12-18 Patrick Joseph Glynn APPARATUS AND METHODS FOR ENERGY STORAGE AND RECOVERY
CN208936834U (en) * 2018-09-06 2019-06-04 广州大学 A kind of flexible flat heat pipe structure

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