WO2021005683A1

WO2021005683A1 - Circuit pattern creating system, and method for creating circuit pattern

Info

Publication number: WO2021005683A1
Application number: PCT/JP2019/026997
Authority: WO
Inventors: 亮二郎富永
Original assignee: 株式会社Ｆｕｊｉ
Priority date: 2019-07-08
Filing date: 2019-07-08
Publication date: 2021-01-14
Also published as: JPWO2021005683A1; JP7455833B2

Abstract

Provided is a system for creating a circuit pattern comprising a plurality of wires, using a drawing device for drawing a plurality of wires on an insulator using an electrically conductive ink, the system comprising: a design information acquiring unit for acquiring design information relating to a circuit pattern; a wire thickness setting unit which, on the basis of a cross-sectional area of the wires included in the design information or a cross-sectional area of the wires determined from the design information, and width dimensions of the wires included in the design information, sets a thickness dimension of each of the wires separately; and a drawing control unit which controls a drawing operation of the drawing device so that the thickness dimensions separately set for the individual wires are satisfied.

Description

Circuit pattern creation system and circuit pattern creation method

This specification relates to a system and a method of creating a circuit pattern of an electronic circuit using a drawing device.

In order to create a circuit pattern of an electronic circuit, a method in which an insulating material is plated with metal on one surface, unnecessary metal parts are removed by etching, and the remaining metal parts are used as a circuit pattern has been conventionally practiced. .. In recent years, a new method for directly forming a circuit pattern has been developed and put into practical use by using a drawing device or a modeling device. As an example of this kind of new method, the technique of Patent Document 1 can be mentioned.

Patent Document 1 discloses a method for manufacturing a wiring board in which at least one layer of a conductive pattern (circuit pattern) and an insulating pattern is formed on an insulating base material along a wiring pattern. In this manufacturing method, at least one of the insulating base material and the insulating pattern is in a semi-cured state, a conductive pattern is formed on the upper portion thereof, and at least one of them is completely cured by heat treatment, and the conductive pattern is fired. Patent Document 1 further discloses an embodiment in which a conductive pattern and an insulating pattern are formed by an inkjet method. According to this, it is said that the adhesive force between the insulating layer (insulating base material, insulating pattern) and the conductive pattern can be improved.

Japanese Unexamined Patent Publication No. 2007-158352

By the way, in Patent Document 1, when a circuit pattern composed of a plurality of wirings is created by using an inkjet drawing device, it is possible to overdraw a plurality of times, and there is a degree of freedom in the thickness dimension of the wiring. However, if the thickness dimension of the wiring is not set appropriately, for example, the resistance value per unit length of the plurality of wirings may become non-uniform and the characteristics of the electronic circuit may deteriorate. Further, for example, when there is a difference in the magnitude of the current flowing through the plurality of wirings, an appropriate cross-sectional area of each wiring cannot be obtained.

The present specification provides a circuit pattern creation system and a circuit pattern creation method that optimize by individually setting the thickness dimension of each wiring when creating a circuit pattern using a drawing apparatus. It is an issue to be solved.

The present specification is a system for creating a circuit pattern composed of a plurality of the wirings by using a drawing device for drawing a plurality of wirings on an insulating material using conductive ink, and provides design information regarding the circuit patterns. Individually based on the design information acquisition unit to be acquired, the cross-sectional area of the wiring included in the design information or the cross-sectional area of the wiring obtained from the design information, and the width dimension of the wiring included in the design information. A wiring thickness setting unit that individually sets the thickness dimension of the wiring, and a drawing control unit that controls the drawing operation of the drawing device so as to satisfy the thickness dimension individually set for each wiring. The circuit pattern creation system provided is disclosed.

Further, the present specification is a method of creating a circuit pattern composed of a plurality of the wirings by using a drawing device for drawing a plurality of wirings on an insulating material using conductive ink, and is a design relating to the circuit pattern. Based on the design information acquisition process for acquiring information, the cross-sectional area of the wiring included in the design information or the cross-sectional area of the wiring obtained from the design information, and the width dimension of the wiring included in the design information. , A wiring thickness setting step of individually setting the thickness dimension of each of the wirings, and a drawing control step of controlling the drawing operation of the drawing device so as to satisfy the thickness dimension individually set for each of the wirings. Disclose a method for creating a circuit pattern including.

According to the circuit pattern creation system and the circuit pattern creation method disclosed in the present specification, the thickness dimension of each wiring can be individually set based on the cross-sectional area and the width dimension of the wiring, and the drawing operation of the drawing device can be set individually. It is possible to realize the thickness dimension individually set by the degree of freedom of. Therefore, unlike the conventional technique in which the thickness dimension of each wiring is uniformly formed by combining metal plating and etching treatment, the thickness dimension of each wiring can be individually optimized.

It is a side sectional view schematically showing a structural example of a substrate product including a circuit pattern. It is a block diagram which shows the structure of the circuit pattern creation system of 1st Embodiment. It is a top view which shows the specific example of a circuit pattern typically. It is a detailed process diagram of the circuit pattern creation process carried out by a circuit pattern creation system. It is a figure which illustrates the whole drawing pattern drawn by a drawing apparatus. It is a figure which illustrates the partial drawing pattern drawn by a drawing apparatus. FIG. 5 is a plan view illustrating a method of creating wiring extending in parallel and wiring extending in an oblique direction in a second embodiment using an inkjet drawing device.

1. 1. Substrate product 9 including circuit pattern 93
First, a configuration example of the substrate product 9 including the circuit pattern 93 will be described with reference to FIG. The substrate product 9 is configured by mounting the component 99 on the substrate 91. The substrate 91 is composed of an insulating material 92, a circuit pattern 93, an insulating layer 94, and a land 95. The insulating material 92 is a plate-shaped member formed by using the insulating material. As the insulating material 92, a ready-made plate material formed of a glass epoxy resin or the like may be used, or a liquid insulating material drawn by a drawing apparatus 3 described later may be solidified and formed. The circuit pattern 93 is an aggregate of a plurality of wirings 8 arranged on the surface of the insulating material 92. Each wire 8 is generally formed using a conductive material such as silver or copper.

The insulating layer 94 is formed so as to cover the circuit pattern 93 by using an insulating material. The insulating material forming the insulating layer 94 may be the same as or different from the insulating material forming the insulating material 92. In the circuit pattern 93, the connection portion to which the component 99 is connected is maintained in an exposed state without the insulating layer 94 being formed. The lands 95 are formed at the exposed connection points of the circuit pattern 93 using a conductive material. As a result, the substrate 91 is manufactured.

The mounting work of the plurality of components 99 on the substrate 91 is generally carried out by a component mounting line composed of a solder printing machine, a component mounting machine, and the like. Note that FIG. 1 shows a single-sided mounting board in which the component 99 is mounted on one side of the board 91. In addition, a double-sided mounting board in which the component 99 is mounted on both sides of the board 91 and a multi-layer circuit pattern 93. There is a multi-layer substrate on which is formed.

2. 2. Configuration and Function of Circuit Pattern Creation System 1 of the First Embodiment Next, the configuration and function of the circuit pattern creation system 1 of the first embodiment will be described with reference to FIG. The circuit pattern creation system 1 is composed of a transfer device 2, a drawing device 3, an XY drive device 4, and a control device 5. In the first embodiment, the circuit pattern creation system 1 not only creates the circuit pattern 93 but also manufactures the substrate 91.

The transport device 2 carries the insulating material 92 from outside the system onto the base shown in the drawing. Further, the transport device 2 carries the manufactured substrate 91 out of the system. As the transfer device 2, a conveyor device having a rotating conveyor belt can be exemplified.

The drawing device 3 has a plurality of types of drawing heads (illustrated) and performs a drawing operation toward the insulating material 92. Further, the drawing device 3 has a plurality of drawing heads of each type, so that the drawing speed is improved. The first-class drawing head ejects or ejects conductive ink to draw the circuit pattern 93. Conductive ink is produced, for example, by mixing fine metal particles such as silver in a solvent. When the solvent evaporates and dries, a circuit pattern 93 in which metal fine particles are connected is created.

The second type drawing head draws the insulating layer 94 by injecting or discharging a liquid insulating material. By solidifying the insulating material, the shape and insulating properties of the insulating layer 94 are stabilized. The second type drawing head can also be formed by drawing the insulating material 92. The third type drawing head ejects or ejects a liquid or paste-like conductive material to draw the land 95. This conductive material may be the same as or different from the conductive ink used by the first-class drawing head. The solidification of the conductive material stabilizes the shape and conductive properties of the land 95.

As the drawing device 3, an inkjet drawing device that ejects liquid ink, a dispenser drawing device that ejects ink having a relatively high viscosity, or the like can be used. Further, as the drawing device 3, an inkjet drawing device and a dispenser drawing device can be used together. Further, as the drawing device 3, a composite type drawing device that combines an inkjet method and a dispenser method can also be used. The drawing apparatus 3 may have a hot air supply unit that promotes the drying of the ink and a heating unit that promotes the solidification of the insulating material.

The XY drive device 4 drives the drawing head of the drawing device 3 relative to the insulating material 92 in the two-dimensional direction (XY direction). By "relative" is meant that the XY drive 4 may drive the drawing head, or the XY drive 4 may drive the insulating material 92. The operation of the XY drive device 4 makes it possible to create a circuit pattern 93 having an arbitrary shape.

The control device 5 controls the transfer device 2, the drawing device 3, and the XY drive device 4. In other words, the control device 5 controls the production of the substrate 91 by controlling the execution of the circuit pattern creating step, the insulating layer forming step, and the land forming step. The control device 5 includes three control function units related to the circuit pattern creation process, that is, a design information acquisition unit 51, a wiring thickness setting unit 52, and a drawing control unit 53. The three control functions are realized by software.

The design information acquisition unit 51 acquires design information regarding the circuit pattern 93 from outside the system. The design information is acquired from, for example, the CAD device that designed the substrate 91. Alternatively, the design information is passed in the form of electronic data from the client who requested the manufacture of the substrate 91. Usually, the design information includes information on the cross-sectional area S of the wiring 8 and information on the width dimension W.

The wiring thickness setting unit 52 individually sets the thickness dimension T of each wiring 8 based on the cross-sectional area S and the width dimension W of the wiring 8 included in the design information. If the information on the cross-sectional area S of the wiring 8 is not included in the design information, the wiring thickness setting unit 52 obtains the cross-sectional area S of the wiring 8 based on other information included in the design information. For example, the wiring thickness setting unit 52 can obtain an appropriate cross-sectional area S in which the wiring 8 does not overheat, based on the magnitude of the current flowing through the wiring 8. The wiring thickness setting unit 52 may obtain an appropriate cross-sectional area S based on the failure current flowing at the time of failure instead of the load current flowing at the time of normal operation.

The drawing control unit 53 controls the drawing operation of the drawing device 3 so as to satisfy the thickness dimension T individually set for each wiring 8. Specifically, the drawing control unit 53 individually sets the number of overlays N of the drawing operation for each wiring 8 based on the unit thickness dimension TU of the wiring 8 obtained by one drawing operation of the drawing device 3. To do.

Further, the drawing control unit 53 draws the entire drawing pattern PtA and the number of overlays N relative to each other based on the overlay count N of the drawing operation individually set for each wiring 8. A partial drawing pattern PtB for drawing a part of the wiring 8 is created. Next, the drawing control unit 53 causes the drawing device 3 to perform drawing operations for the entire drawing pattern PtA and the partial drawing pattern PtB. The detailed control functions of the wiring thickness setting unit 52 and the drawing control unit 53 will be described later with reference to a specific example of the circuit pattern 93.

3. 3. Operation of Circuit Pattern Creation System 1 Next, the operation of the circuit pattern creation system 1 will be described with reference to a specific example of the circuit pattern 93 shown in FIG. 3 and a process diagram shown in FIG. A specific example of the circuit pattern 93 includes a first wiring 81, a second wiring 82, and a third wiring 83 when the component 99 is a switching element. The first wiring 81 and the second wiring 82 form a main circuit, and a large main current flows through them. On the other hand, the third wiring 83 constitutes a control circuit, and a small control current flows.

In the design information acquisition step P1 of FIG. 4, the design information acquisition unit 51 has information on the cross-sectional area S1 and the width dimension W1 common to the first wiring 81 and the second wiring 82, and the cross-sectional area S3 and the width of the third wiring 83. Acquire the information of the dimension W3. If the information on the cross-sectional area S1 and the cross-sectional area S3 is not included in the design information, the wiring thickness setting unit 52 obtains the cross-sectional area S1 and the cross-sectional area S3 based on other information included in the design information. The cross-sectional area S1 is larger than the cross-sectional area S3, and the width dimension W1 is larger than the width dimension W3.

In the next wiring thickness setting step P2, the wiring thickness setting unit 52 uses the following

equations

1 and 2 to measure the thickness T1 of the first wiring 81 and the second wiring 82, and the thickness dimension T3 of the third wiring 83. Is set individually.
T1 = S1 / W1 ………… Equation 1
T3 = S3 / W3 ………… Equation 2

In the next overlay count calculation step P3, the drawing control unit 53 uses the following

equations

3 and 4 including the unit thickness dimension TU to display the overlay count N1 of the first wiring 81 and the second wiring 82, and the first The number of overlays N3 of the three wirings 83 is individually set. When the quotient of division in

Equations

3 and 4 has a fraction after the decimal point, the number of overlays N1 and the number of overlays N3 are rounded up integer values.
N1 = T1 / TU ………… Equation 3
N3 = T3 / TU ………… Equation 4

The magnitude relationship between the number of overlays N1 and the number of overlays N3 is not determined only by the magnitude relationship between the main current and the control current, but is determined in relation to a plurality of design information. In the following description, it is assumed that the number of overlays N1 is 20 and the number of overlays N3 is 15. That is, the number of overlays N1 of the first wiring 81 and the second wiring 82 is relatively large, and the number of overlays N3 of the third wiring 83 is relatively small.

In the next drawing pattern creation step P4, the drawing control unit 53 creates an overall drawing pattern PtA (shown in FIG. 5) for drawing the first wiring 81, the second wiring 82, and the third wiring 83. Next, the drawing control unit 53 creates a partial drawing pattern PtB (shown in FIG. 6) for drawing the first wiring 81 and the second wiring 82 having a relatively large number of overlays N1.

In the next drawing execution step P5, the drawing control unit 53 causes the drawing device 3 to perform the drawing operation of the entire drawing pattern PtA only 15 times. As a result, the third wiring 83 reaches a predetermined thickness dimension T3 and is finished. On the other hand, the thickness of the first wiring 81 and the second wiring 82 is still insufficient. Next, the drawing control unit 53 causes the drawing device 3 to perform the drawing operation of the partial drawing pattern PtB only five times. As a result, the first wiring 81 and the second wiring 82 are overlaid 20 times in total, and reach a predetermined thickness dimension T1 to be finished. If it takes time to dry the conductive ink, the drying time is appropriately set during the repetition of the drawing operation.

The above-mentioned overlay number calculation process P3, drawing pattern creation process P4, and drawing execution process P5 can be collectively regarded as a drawing control process. In other words, the design information acquisition step P1, the wiring thickness setting step P2, and the drawing control step complete the creation of the circuit pattern 93. As a result, the thickness dimension T1 of the first wiring 81 and the second wiring 82 becomes an appropriate value corresponding to the cross-sectional area S1 and the width dimension W1. Similarly, the thickness dimension T3 of the third wiring 83 is an appropriate value corresponding to the cross-sectional area S3 and the width dimension W3. After this, the circuit pattern creation system 1 proceeds to the insulating layer forming step.

According to the circuit pattern creation system 1 of the first embodiment, the thickness dimension T of each wiring 8 can be individually set based on the cross-sectional area S and the width dimension W of the wiring 8, and the drawing device 3 can draw. It is possible to realize the thickness dimension T individually set according to the degree of freedom of operation. Therefore, unlike the conventional technique in which the thickness dimension T of each wiring 8 is uniformly formed by combining metal plating and etching treatment, the thickness dimension T of each wiring 8 can be individually optimized.

4. Circuit pattern creation system of the second embodiment Next, the circuit pattern creation system of the second embodiment will be mainly described with respect to the differences from the first embodiment. In the second embodiment, the drawing device 3 that draws the circuit pattern 93 is limited to an inkjet drawing device that performs a drawing operation in units of pixels PX arranged in a two-dimensional grid pattern. In FIG. 7, a large number of pixel PXs are shown as small squares, respectively. The drawing device 3 cannot accurately draw each pixel PX in a square shape, but due to the comprehensive action of the conductive ink, such as wet spread, bleeding, and overwriting, a substantially linear wiring 8 is provided. Can be drawn.

Further, in the second embodiment, there are a wiring 8 extending in parallel with the pixel PX and a wiring 8 extending diagonally with respect to the arrangement of the pixel PX. For the sake of simplification of the following description, it is assumed that the size of one side of the pixel PX is 100 μm and that there is a wiring 8 extending in an oblique 45 ° direction. Further, it is assumed that the width dimension WC = 200 μm and the common cross-sectional area SC = 2000 μm ² common to the design information are defined for all the wirings 8. Further, it is assumed that the unit thickness dimension TU of the wiring 8 obtained by one drawing operation of the drawing device 3 is 0.5 μm.

In the fourth wiring 84 and the fifth wiring 85 extending in parallel with the pixel PX shown in FIG. 7, the common width dimension WC is twice the size of one side of the pixel PX. Therefore, the fourth wiring 84 and the fifth wiring 85 are drawn with a wiring width in which two pixel PXs are arranged side by side. Further, with respect to the fourth wiring 84 and the fifth wiring 85, the wiring thickness setting unit 52 and the drawing control unit 53 operate in the same manner as in the first embodiment.

That is, the wiring thickness setting unit 52 sets the thickness dimension T4 = SC / WC = (2000/200) = 10 μm of the fourth wiring 84 and the fifth wiring 85. Further, the drawing control unit 53 sets the number of times the fourth wiring 84 and the fifth wiring 85 are overlaid N4 = T4 / TU = (10 / 0.5) = 20 times.

On the other hand, the sixth wiring 86 and the seventh wiring 87 shown in FIG. 7 are candidates as the wiring 8 extending in the diagonal 45 ° direction with respect to the arrangement of the pixels PX. In the sixth wiring 86 and the seventh wiring 87, the actual width dimension that can be drawn is not an integral multiple of the size of one side of the pixel PX due to the limitation of the configuration of the drawing device 3 (invertical drawing device). Therefore, the actual width dimension W6 of the sixth wiring 86 and the actual width dimension W7 of the seventh wiring 87 cannot be matched with the design information (200 μm).

Specifically, the actual width dimension W6 of the sixth wiring 86 is 141 μm, which corresponds to the diagonal dimension of the pixel PX. Further, the actual width dimension W7 of the seventh wiring 87 fluctuates along the diagonal direction, and numerically fluctuates from the diagonal dimension of the pixel PX (141 μm) to twice the diagonal dimension of the pixel PX (282 μm). The average value of the actual width dimension W7 of the seventh wiring 87 is 212 μm.

Therefore, the wiring thickness setting unit 52 adopts the seventh wiring 87 on the side that approximates the design information (200 μm), and discards the sixth wiring 86. Further, the wiring thickness setting unit 52 sets the thickness dimension T7 of the seventh wiring 87 by using the average value of the actual width dimension W7 of the seventh wiring 87. The thickness dimension T7 is 9.43 μm (= 2000/212), which is smaller than that of the fourth wiring 84 and the fifth wiring 85. Further, the drawing control unit 53 sets the number of times the seventh wiring 87 is overlaid N7 = T7 / TU = (9.43 / 0.5) = 19 times.

After that, the drawing control unit 53 operates in the same manner as in the first embodiment. That is, the drawing control unit 53 creates an overall drawing pattern for drawing the fourth wiring 84, the fifth wiring 85, and the seventh wiring 87, and a partial drawing pattern for drawing the fourth wiring 84 and the fifth wiring 85. .. Next, the drawing control unit 53 causes the drawing device 3 to perform the drawing operation of the entire drawing pattern only 19 times, and subsequently performs the drawing operation of the partial drawing pattern only once. As a result, an appropriate cross-sectional area SC (2000 μm ² ) is ensured for all the wirings 8 (fourth wiring 84, fifth wiring 85, and seventh wiring 87).

In the circuit pattern creation system of the second embodiment, the actual width dimension W7 of the seventh wiring 87 extending in the oblique direction cannot be matched with the design information due to the restriction of the configuration of the drawing device 3. Nevertheless, the number of overlays N7 of the seventh wiring 87 can be individually set to ensure an appropriate cross-sectional area SC for all the wirings 8. As a result, the resistance value per unit length of all the wirings 8 can be made uniform, and the deterioration of the characteristics of the electronic circuit can be prevented. This effect becomes remarkable in the circuit pattern 93 in which the width dimension W of the wiring 8 is miniaturized to about several pixels PX or less.

5. Application and Modification of the Embodiment The drawing control unit 53 individually sets the number of overlays N of the drawing operation on the premise that the unit thickness dimension TU due to the drawing operation of the drawing device 3 is constant. There is another method. That is, the drawing control unit 53 sets the number of times N of the drawing device 3 to be overlaid with respect to the wiring 8 in common, changes the injection amount of the conductive ink of the drawing head for each wiring 8, and sets the unit thickness dimension TU. It may be adjusted individually. Further, the circuit pattern creation system 1 can also be applied to a double-sided mounting board or a multi-layer board.

Further, the size of one side of the pixel PX described in the second embodiment and the value of the unit thickness dimension TU of the wiring 8 obtained by one drawing operation are examples, and actually affect the performance of the drawing device 3. It is natural to be based. Further, in the thickness dimension T7 of the seventh wiring 87 described in the second embodiment, there may be a concern about local overheating in the bottleneck portion where the width dimension W7 is narrowed. In this case, the wiring thickness setting unit 52 sets the thickness dimension T7 of the seventh wiring 87 by using the minimum value (141 μm) of the actual width dimension W7 of the seventh wiring 87. According to this, an appropriate cross-sectional area SC (2000 μm ² ) can be secured in the bottleneck, and there is no risk of local overheating. Further, the second embodiment can be applied to the wiring 8 extending in an oblique direction other than 45 °. In addition, the first and second embodiments can be applied and modified in various ways.

1: Circuit pattern creation system 2: Conveyor device 3: Drawing device 4: XY drive device 5: Control device 51: Design information acquisition unit 52: Wiring thickness setting unit 53: Drawing control unit 8: Wiring 81-87: First wiring -Seventh wiring 91: Board 92: Insulator 93: Circuit pattern 99: Parts W1, W3: Width dimensions W6, W7: Actual width dimensions PtA: Overall drawing pattern PtB: Partial drawing pattern PX: Pixel

Claims

A system that creates a circuit pattern consisting of a plurality of the wirings by using a drawing device that draws a plurality of wirings on an insulating material using conductive ink.
A design information acquisition unit that acquires design information related to the circuit pattern,
Based on the cross-sectional area of the wiring included in the design information or the cross-sectional area of the wiring obtained from the design information, and the width dimension of the wiring included in the design information, the thickness dimension of each wiring is individually set. Wiring thickness setting part to be set to
A drawing control unit that controls the drawing operation of the drawing device so as to satisfy the thickness dimension individually set for each of the wirings.
Circuit pattern creation system with.
The drawing control unit individually sets the number of times the drawing operation is overlaid for each wiring based on the unit thickness dimension of the wiring obtained by one drawing operation of the drawing device. The circuit pattern creation system according to 1.
The drawing control unit draws all the wirings based on the number of overlays of the drawing operation individually set for each wiring, and the overall drawing pattern and the number of overlays are relatively high. The circuit pattern creation system according to claim 2, wherein a partial drawing pattern for drawing a large number of the wirings is created, and the drawing apparatus is made to perform the drawing operation.
The drawing device is an inkjet drawing device that performs the drawing operation in units of pixels arranged in a two-dimensional lattice.
The wiring thickness setting unit approximates the width dimension included in the design information of the wiring extending in an oblique direction with respect to the arrangement of the pixels, and the actual width that can be drawn by the configuration of the inkjet drawing device. The dimension is used to set the thickness dimension of the wiring extending in the diagonal direction.
The circuit pattern creation system according to any one of claims 1 to 3.
The wiring thickness setting unit uses the average value or the minimum value of the actual width dimensions when the actual width dimension of the wiring extending in the diagonal direction fluctuates along the diagonal direction. The circuit pattern creating system according to claim 4, wherein the thickness dimension of the wiring extending in an oblique direction is set.
Claims that the width dimension common to the design information and the common cross-sectional area are defined for the wiring extending in the diagonal direction and the wiring extending in parallel with the pixels. Item 4. The circuit pattern creation system according to item 4 or 5.
A method of creating a circuit pattern consisting of a plurality of the wirings by using a drawing device that draws a plurality of wirings on an insulating material using conductive ink.
A design information acquisition process for acquiring design information related to the circuit pattern, and
Based on the cross-sectional area of the wiring included in the design information or the cross-sectional area of the wiring obtained from the design information, and the width dimension of the wiring included in the design information, the thickness dimension of each wiring is individually set. Wiring thickness setting process to be set to
A drawing control step of controlling the drawing operation of the drawing apparatus so as to satisfy the thickness dimension individually set for each of the wirings,
A circuit pattern creation method comprising.