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WO2021083056A1 - 电路板装置及电子设备 - Google Patents

电路板装置及电子设备 Download PDF

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Publication number
WO2021083056A1
WO2021083056A1 PCT/CN2020/123340 CN2020123340W WO2021083056A1 WO 2021083056 A1 WO2021083056 A1 WO 2021083056A1 CN 2020123340 W CN2020123340 W CN 2020123340W WO 2021083056 A1 WO2021083056 A1 WO 2021083056A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
packaging substrate
electronic component
board device
accommodating space
Prior art date
Application number
PCT/CN2020/123340
Other languages
English (en)
French (fr)
Inventor
杨俊�
唐林平
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2021083056A1 publication Critical patent/WO2021083056A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders

Definitions

  • This application relates to the technical field of communication equipment design, and in particular to a circuit board device and electronic equipment.
  • the current electronic equipment has more and more functions, especially the audio-visual entertainment functions.
  • the space required for display modules, camera modules, and audio cavity components is increasing. Bigger.
  • more electronic components need to be integrated in electronic equipment, and the capacity of batteries is also increasing.
  • the overall size of the electronic device has not been increased blindly, that is, the internal space of the housing of the electronic device has not been increased accordingly. In this case, how to install a larger number of electronic components in a limited space is the focus of current electronic equipment research and development.
  • the present application discloses a circuit board device to solve the current problem of low integration of packaged modules in electronic equipment.
  • the present application provides a circuit board device, including a first circuit board and a packaging module, the packaging module including a packaging substrate, a first electronic component, a plastic packaging part, and a supporting structure, the supporting structure Supported between the first circuit board and the packaging substrate, the supporting structure, the first circuit board and the packaging substrate constitute a first accommodating space, and a second accommodating space is provided in the first accommodating space.
  • Electronic components, the first electronic components are arranged on the surface of the packaging substrate away from the first circuit board, the first electronic components are plastic-encapsulated in the plastic part, and the packaging substrate passes through the The supporting structure is electrically connected with the first circuit board.
  • An electronic device includes the circuit board device described above.
  • the first circuit board, the supporting structure and the packaging substrate constitute a first accommodating space
  • the second electronic component is arranged in the first accommodating space
  • the second electronic component can be arranged in the first accommodating space.
  • the multiple positions in the space are not limited to only being arranged on the packaging substrate.
  • the electronic components can only be arranged in the two-dimensional plane of the packaging substrate.
  • the embodiments of the present application disclose In the circuit board device, there are more layout positions for the second electronic components, which is beneficial to improve the integration degree of the electronic components.
  • the packaging substrate is supported on the first circuit board through the supporting structure, and the second electronic component does not need to be packaged.
  • the first circuit board can be separated from the packaging module directly.
  • the second electronic component can be replaced without the need to replace the entire package module as a whole, which can undoubtedly speed up the replacement efficiency of electronic components and shorten the replacement cycle.
  • FIG. 1 is a schematic structural diagram of a package module disclosed in an embodiment of the application
  • FIG. 2 is a schematic diagram of the structure of the circuit board device disclosed in an embodiment of the application.
  • 200-packaged module 210-packaged substrate, 220-first electronic component, 230-plastic package part, 240-support structure, 241-frame, 242-space spacer, 243-electrical connection part, 244-first Shield, 250-adhesive layer, 260-second shield, 270-shield spacer, 280-welded ball,
  • An embodiment of the present application discloses a circuit board device, and the disclosed circuit board device is applied to an electronic device.
  • the circuit board device disclosed in the embodiment of the present application includes a first circuit board 100 and a package module 200.
  • the packaging module 200 is the main packaging part of the circuit board device.
  • the packaging module 200 includes a packaging substrate 210, a first electronic component 220, a plastic packaging part 230 and a supporting structure 240.
  • the packaging substrate 210 is a basic component of the packaging module 200, and the packaging substrate 210 is usually a rigid circuit board.
  • the packaging substrate 210 can provide better support for other components of the packaging module 200.
  • the first circuit board 100 is a substrate of the entire circuit board device.
  • the first circuit board 100 is usually a main board or a sub-board of an electronic device, and the entire package module 200 is mounted on the first circuit board 100.
  • the supporting structure 240 is supported between the first circuit board 100 and the packaging substrate 210, and the packaging substrate 210 is supported on the first circuit board 100 through the supporting structure 240, so that the packaging substrate 210 and the first circuit There is a certain distance between the plates 100.
  • the supporting structure 240, the first circuit board 100 and the packaging substrate 210 constitute the first accommodating space 300.
  • the second electronic component 400 is arranged in the first accommodating space 300, and the first accommodating space 300 provides installation space for the second electronic component 400.
  • the second electronic component 400 may be installed on the first circuit board 100, It can also be mounted on the packaging substrate 210, and of course, can also be mounted on the supporting structure 240.
  • the first electronic component 220 is disposed on the surface of the packaging substrate 210 away from the first circuit board 100, and the first electronic component 220 is plastic-encapsulated in the plastic encapsulation part 230.
  • the packaging substrate 210 is electrically connected to the first circuit board 100 through the supporting structure 240, so that the packaging substrate 210 can supply power and communicate with the first electronic component 220 mounted thereon.
  • the first circuit board 100, the supporting structure 240 and the packaging substrate 210 constitute the first accommodating space 300
  • the second electronic component 400 is disposed in the first accommodating space 300
  • the second electronic The components 400 can be arranged in multiple positions in the first accommodating space 300, and are not limited to only being arranged on the packaging substrate 210.
  • the electronic components can only be arranged on the two-dimensional plane of the packaging substrate 210.
  • the layout is performed in the board surface.
  • the second electronic component 400 has more layout positions, which is beneficial to improve the integration degree of the electronic components.
  • the packaging substrate 210 is supported on the first circuit board 100 through the supporting structure 240, and the second electronic component 400 does not need to be packaged.
  • the first circuit board 100 can be replaced.
  • the second electronic component 400 can be directly replaced, without the need to replace the entire packaging module as a whole, which can undoubtedly speed up the replacement efficiency of electronic components and shorten the replacement period.
  • the supporting structure 240 not only supports the packaging substrate 210, but also cooperates with the first circuit board 100 and the packaging substrate 210 to form the first receiving space 300.
  • the supporting structure 240 can have various structures.
  • the supporting structure 240 may be a plurality of supporting columns distributed at intervals. Please refer to FIG. 1 and FIG. 2 again.
  • the supporting structure 240 may be a frame structure. In the projection perpendicular to the direction of the first circuit board 100, the outer contour of the frame structure can coincide with the projection of the edge of the package substrate 210, so that the frame structure can better support the package substrate 210.
  • the supporting structure 240 may include an enclosure frame 241 and a space spacer 242 arranged on the inner side of the enclosure frame 241.
  • the space spacer 242 The first accommodating space 300 is divided into at least two first accommodating sub-spaces.
  • the second electronic component 400 may be arranged in the at least two first containing sub-spaces.
  • At least one of the two side walls of the space partition 242 and the inner wall of the enclosure frame 241 may be provided with a first shield 244.
  • the first shielding member 244 can electromagnetically shield the second electronic component 400 in the first accommodating space 300, thereby preventing the second electronic component 400 from opposing
  • the electronic components outside the first accommodating space 300 generate electromagnetic interference, and at the same time, it is possible to prevent the electronic components outside the second accommodating space 300 from causing electromagnetic interference to the second electronic component 400 in the second accommodating space 300.
  • first shielding member 244 on the inner wall of the enclosure 241 and the side wall of the space spacer 242 can also prevent electromagnetic interference between the second electronic components 400 in the first containing subspace. Both side walls of the space partition 242 are provided with first shielding members 244, which can further improve the shielding effect.
  • the structure of the supporting structure 240 may be various.
  • the supporting structure 240 may be a second circuit board, the second circuit board is provided with a hole, the packaging substrate 210 and the first circuit board 100 are respectively connected to the ports at both ends of the hole, and The first containing space 300 is enclosed with the digging hole.
  • the supporting structure 240 is made of the second circuit board, which can undoubtedly be more convenient for molding.
  • the second circuit board itself has a conductive structure, which makes it easier to realize the connection between the packaging substrate 210 and the first circuit board 100. Electric connection.
  • an electrical connection structure can also be provided in the supporting structure 240 in other ways, so as to realize the electrical connection between the first circuit board 100 and the packaging substrate 210.
  • the supporting structure 240 may be provided with an electrical connection hole, an electrical connection portion 243 is provided in the electrical connection hole, and one end of the electrical connection portion 243 is electrically connected to the packaging substrate 210. The other end of the electrical connection portion 243 is electrically connected to the first circuit board 100.
  • the electrical connection portion 243 may be a conductive member installed in the electrical connection hole.
  • the electrical connection portion 243 may be an electroplated structural member.
  • the electrical connection portion 243 may be an electroplated metal layer, specifically, the electroplated metal layer may be a silver-plated layer.
  • the electrical connection portion 243 can be connected to the first circuit board 100 by soldering through the solder balls 280.
  • the solder connection can not only realize the assembly between the support structure 240 and the first circuit board 100, but also Realize the electrical connection between the two.
  • the supporting structure 240 can be connected to the first circuit board 100 through a conductive adhesive layer, which can realize the supporting structure.
  • the assembly of 240 between the first circuit board 100 can also realize the electrical connection between the electrical connection portion 243 and the first circuit board 100 at the same time.
  • the circuit board device disclosed in the embodiment of the present application may further include a second shielding member 260, and the packaging module 200 is disposed in the second shielding member 260.
  • the second shield 260 can electromagnetically shield the package module 200.
  • the second shield 260 may have various structures.
  • the second shield 260 may be a metal shield.
  • the second shield 260 may be a metal layer provided on the package module 200.
  • the metal layer may be a metal plating layer, such as a copper plating layer.
  • a second accommodating space may be formed between the second shielding member 260 and the packaging substrate 210, and a shielding spacer 270 may be provided in the second accommodating space, and the shielding spacer 270 may divide the second accommodating space. Divided into at least two second sub-accommodating spaces, each of the second sub-accommodating spaces may be provided with the first electronic component 220, and the shielding spacer 270 can prevent the occurrence between the first electronic components 220 in the second sub-accommodating space Mutual electromagnetic interference.
  • the packaging substrate 210 may be assembled and connected to the supporting structure 240 through a connector (such as a threaded connector, a rivet). Please refer to FIG. 1 again.
  • the packaging substrate 210 and the supporting structure 240 may be bonded and fixed by an adhesive layer 250.
  • the electrical connection portion 243 needs to pass through the adhesive layer 250 to achieve electrical connection with the packaging substrate 210.
  • the embodiment of the present application discloses an electronic device, and the disclosed electronic device includes the circuit board device described in the above embodiment.
  • the electronic devices disclosed in the embodiments of this application may be mobile phones, tablet computers, e-book readers, game consoles, car navigation systems, smart watches, etc.
  • the embodiments of this application do not limit the specific types of electronic devices.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

一种电路板装置，其包括第一电路板(100)和封装模块(200)，封装模块(200)包括封装基板(210)、第一电子元器件(220)、塑封部(230)和支撑结构件(240)，支撑结构件(240)支撑在第一电路板(100)与封装基板(210)之间，支撑结构件(240)、第一电路板(100)和封装基板(210)构成第一容纳空间(300)，第一容纳空间(300)中设置有第二电子元器件(400)，第一电子元器件(220)设置在封装基板(210)背离第一电路板(100)的板面上，第一电子元器件(220)塑封在塑封部(230)内，封装基板(210)通过支撑结构件(240)与第一电路板(100)电连接。

Description

电路板装置及电子设备
相关申请的交叉引用
本申请要求享有于2019年10月29日提交的中国专利申请201911040093.X的优先权，该申请的全部内容通过引用并入本文中。
技术领域
本申请涉及通信设备设计技术领域，尤其涉及一种电路板装置及电子设备。
背景技术
随着用户需求的提升，目前的电子设备的功能越来越多，特别是影音娱乐功能越来越多，与此同时，显示模组、摄像模组、音腔组件等需要占用的空间越来越大。特别是未来5G通讯功能的引入，电子设备内需要集成更多的电子元器件，电池的容量也越来越大。然而考虑到电子设备的便携性能，电子设备的整机尺寸并没有一味地增大，也就是说，电子设备的壳体内部空间并没有相应地增大。此种情况下，如何在有限的空间内设置数量更多的电子元器件，是当前电子设备研发的重点。
为了缓解上述问题，目前的电子设备通常采用系统封装技术，从而将一些功能模块集成在一起以实现小型化设计，进而减小在电路板上占用的面积，最终能够使得电路板上安装更多的功能模块。
目前电子设备内的封装模块中，电子元器件只能在封装基板上进行，因此电子元器件只能在封装基板的二维平面的板面内进行，存在集成度较低的问题。
发明内容
本申请公开一种电路板装置，以解决目前电子设备内封装模块的集成 度较低的问题。
为了解决上述问题，本申请提供了一种电路板装置，包括第一电路板和封装模块，所述封装模块包括封装基板、第一电子元器件、塑封部和支撑结构件，所述支撑结构件支撑在所述第一电路板与所述封装基板之间，所述支撑结构件、所述第一电路板和所述封装基板构成第一容纳空间，所述第一容纳空间中设置有第二电子元器件，所述第一电子元器件设置在所述封装基板背离所述第一电路板的板面上，所述第一电子元器件塑封在所述塑封部内，所述封装基板通过所述支撑结构件与所述第一电路板电连接。
一种电子设备，包括上文所述的电路板装置。
本申请采用的技术方案能够达到以下有益效果：
本申请公开的电路板装置中，第一电路板、支撑结构件和封装基板构成第一容纳空间，第二电子元器件设置在第一容纳空间内，第二电子元器件可以设置在第一容纳空间内的多个位置，不局限于只能设置在封装基板上，相比于现有技术中电子元器件只能在封装基板的二维平面的板面内进行布设，本申请实施例公开的电路板装置，第二电子元器件的布设位置更多，从而有利于提高电子元器件的集成度。
与此同时，封装基板通过支撑结构件支撑于第一电路板上，第二电子元器件无需封装，在第二电子元器件需要更换的过程中，可以将第一电路板与封装模块分开后直接替换第二电子元器件即可，无需对整个封装模块的整体更换，这无疑能够加快电子元器件的更换效率，缩短更换周期。
附图说明
此处所说明的附图用来提供对本申请的进一步理解，构成本申请的一部分，本申请的示意性实施例及其说明解释本申请，并不构成对本申请的不当限定。在附图中：
图1为本申请实施例公开的封装模块的结构示意图；
图2为本申请实施例公开的电路板装置的结构示意图。
附图标记说明：
100-第一电路板、
200-封装模块、210-封装基板、220-第一电子元器件、230-塑封部、240-支撑结构件、241-围框、242-空间隔离件、243-电连接部、244-第一屏蔽件、250-胶层、260-第二屏蔽件、270-屏蔽隔离件、280-焊接球、
300-第一容纳空间、
400-第二电子元器件。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚，下面将结合本申请具体实施例及相应的附图对本申请技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
以下结合附图，详细说明本申请各个实施例公开的技术方案。
请参考图1-图2，本申请实施例公开一种电路板装置，所公开的电路板装置应用于电子设备。本申请实施例公开的电路板装置包括第一电路板100和封装模块200。
封装模块200为电路板装置的主体封装部分，封装模块200包括封装基板210、第一电子元器件220、塑封部230和支撑结构件240。封装基板210为封装模块200的基础构件，封装基板210通常为硬质电路板。封装基板210能够为封装模块200的其它组成部分提供较好的支撑。
第一电路板100为整个电路板装置的基板，第一电路板100通常为电子设备的主板或副板，整个封装模块200安装在第一电路板100上。在本申请实施例中，支撑结构件240支撑在第一电路板100与封装基板210之间，封装基板210通过支撑结构件240支撑于第一电路板100，从而使得封装基板210与第一电路板100之间具有一定的距离。支撑结构件240、第一电路板100和封装基板210构成第一容纳空间300。
第一容纳空间300内设置有第二电子元器件400，第一容纳空间300为第二电子元器件400提供安装空间，具体地，第二电子元器件400可以安装在第一电路板100上，也可以安装在封装基板210上，当然，也可以安装在支撑结构件240上。
第一电子元器件220设置在封装基板210背离第一电路板100的板面上，且第一电子元器件220塑封在塑封部230中。封装基板210通过支撑结构件240与第一电路板100电连接，从而能够使得封装基板210为安装在其上的第一电子元器件220供电及通信。
本申请实施例公开的电路板装置中，第一电路板100、支撑结构件240和封装基板210构成第一容纳空间300，第二电子元器件400设置在第一容纳空间300内，第二电子元器件400可以设置在第一容纳空间300内的多个位置，不局限于只能设置在封装基板210上，相比于现有技术中电子元器件只能在封装基板210的二维平面的板面内进行布设，本申请实施例公开的电路板装置，第二电子元器件400的布设位置更多，从而有利于提高电子元器件的集成度。
与此同时，封装基板210通过支撑结构件240支撑于第一电路板100上，第二电子元器件400无需封装，在第二电子元器件400需要更换的过程中，可以将第一电路板100与封装模块200分开后直接替换第二电子元器件400即可，无需对整个封装模块的整体更换，这无疑能够加快电子元器件的更换效率，缩短更换周期。
支撑结构件240不但起到支撑封装基板210的作用，而且还用于与第一电路板100和封装基板210配合围成第一容纳空间300，支撑结构件240的结构可以有多种。例如，支撑结构件240可以为多个间隔分布的支撑柱。请再次参考图1和图2，在一种可选的实施例中，支撑结构件240可以为框架式结构件。在垂直于第一电路板100方向的投影中，框架式结构件的外侧轮廓可以与封装基板210的边缘的投影重合，从而使得框架式结构件起到对封装基板210较好的支撑作用。
为了更方便对第二电子元器件400的布局，在一种可选的实施例中， 支撑结构件240可以包括围框241和设置在围框241的内侧的空间隔离件242，空间隔离件242将第一容纳空间300分隔成至少两个第一容纳子空间。所述的至少两个第一容纳子空间内可以设置有第二电子元器件400。
在本申请实施例中，空间隔离件242的两侧壁中的至少一者以及围框241的内壁上可以设置有第一屏蔽件244。在围框241的内壁设置第一屏蔽件244的前提下，第一屏蔽件244能够对第一容纳空间300内的第二电子元器件400实施电磁屏蔽，进而能够防止第二电子元器件400对第一容纳空间300之外的电子器件产生电磁干扰，同时也能够避免第二容纳空间300之外的电子器件对第二容纳空间300内的第二电子元器件400产生电磁干扰。
在围框241的内壁与空间隔离件242的侧壁上设置第一屏蔽件244，还能够避免第一容纳子空间内的第二电子元器件400之间产生电磁干扰。空间隔离件242的两侧壁上均设置有第一屏蔽件244，能够进一步提高屏蔽效果。
如上文所述，支撑结构件240的结构可以有多种。在一种具体的实施方式中，支撑结构件240可以为第二电路板，第二电路板开设有挖孔，封装基板210和第一电路板100分别连接在挖孔的两端的端口上、且与挖孔围成第一容纳空间300。在此种情况下，支撑结构件240由第二电路板制成，无疑能够更方便成型，同时，第二电路板本身具有导电结构，更容易实现封装基板210与第一电路板100之间的电连接。
当然，还可以通过其他方式在支撑结构件240内设置电连接结构，进而实现第一电路板100与封装基板210之间的电连接。请再次参考图1，在一种具体的实施方式中，支撑结构件240可以开设有电连接孔，电连接孔内设置有电连接部243，电连接部243的一端与封装基板210电连接，电连接部243的另一端与第一电路板100电连接。电连接部243可以是安装在电连接孔内的导电件。例如，电连接部243可以为电镀结构件，例如，电连接部243可以是电镀金属层，具体地，电镀金属层可以是镀银层。
电连接部243可以通过焊接球280实现与第一电路板100之间的焊接相连，此种情况下，焊接相连不但能够实现支撑结构件240与第一电路板100之间的装配，同时还能够实现两者之间的电连接。当然，实现电连接部243与第一电路板100之间电连接的方式有多种，例如，支撑结构件240可以通过导电胶层与第一电路板100连接，导电胶层能实现支撑结构件240在第一电路板100之间的装配，同时还能够实现电连接部243与第一电路板100之间的电连接。
本申请实施例公开的电路板装置还可以包括第二屏蔽件260，封装模块200设置在第二屏蔽件260之内。第二屏蔽件260能够对封装模块200实施电磁屏蔽。第二屏蔽件260的结构可以有多种，例如，第二屏蔽件260可以是金属屏蔽罩。在一种可选的实施例中，第二屏蔽件260可以为设置在封装模块200上的金属层。该金属层可以为金属镀层，例如镀铜层。
在一种可选的实施例中，第二屏蔽件260与封装基板210之间可以形成第二容纳空间，第二容纳空间内可以设置有屏蔽隔离件270，屏蔽隔离件270将第二容纳空间分割成至少两个第二子容纳空间，各第二子容纳空间内可以设置有第一电子元器件220，屏蔽隔离件270能够防止第二子容纳空间内的第一电子元器件220之间产生相互电磁干扰。
在本申请实施例中，封装基板210与支撑结构件240之间的装配方式有多种。例如，封装基板210可以通过连接件(例如螺纹连接件、铆钉)实现与支撑结构件240之间的装配连接。请再次参考图1，在一种可选的实施例中，封装基板210可以与支撑结构件240之间通过胶层250粘接固定。当然，在支撑结构件240包括电连接部243的前提下，电连接部243需要穿过胶层250，从而实现与封装基板210之间的电连接。
基于本申请实施例公开的电路板装置，本申请实施例公开一种电子设备，所公开的电子设备包括上文实施例所述的电路板装置。
本申请实施例公开的电子设备可以是手机、平板电脑、电子书阅读器、游戏机、车载导航仪、智能手表等设备，本申请实施例不限制电子设 备的具体种类。
本申请上文实施例中重点描述的是各个实施例之间的不同，各个实施例之间不同的优化特征只要不矛盾，均可以组合形成更优的实施例，考虑到行文简洁，在此则不再赘述。
以上所述仅为本申请的实施例而已，并不限制本申请。对于本领域技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原理之内所作的任何修改、等同替换、改进等，均应包含在本申请的权利要求范围之内。

Claims (10)

  1. 一种电路板装置，包括第一电路板(100)和封装模块(200)，所述封装模块(200)包括封装基板(210)、第一电子元器件(220)、塑封部(230)和支撑结构件(240)，所述支撑结构件(240)支撑在所述第一电路板(100)与所述封装基板(210)之间，所述支撑结构件(240)、所述第一电路板(100)和所述封装基板(210)构成第一容纳空间(300)，所述第一容纳空间(300)中设置有第二电子元器件(400)，所述第一电子元器件(220)设置在所述封装基板(210)背离所述第一电路板(100)的板面上，所述第一电子元器件(220)塑封在所述塑封部(230)内，所述封装基板(210)通过所述支撑结构件(240)与所述第一电路板(100)电连接。
  2. 根据权利要求1所述的电路板装置，其中，所述支撑结构件(240)为框架式结构件，且在垂直于所述第一电路板(100)方向的投影中，所述框架式结构件的外侧轮廓的投影与所述封装基板(210)的边缘的投影重合。
  3. 根据权利要求2所述的电路板装置，其中，所述支撑结构件(240)包括围框(241)和设置在所述围框(241)的内侧的空间隔离件(242)，所述空间隔离件(242)将所述第一容纳空间(300)分隔成至少两个第一容纳子空间。
  4. 根据权利要求3所述的电路板装置，其中，所述空间隔离件(242)的两侧壁中的至少一者以及所述围框(241)的内壁上设置有第一屏蔽件(244)。
  5. 根据权利要求1所述的电路板装置，其中，所述支撑结构件(240)为第二电路板，所述第二电路板开设有挖孔，所述封装基板(210)和所述第一电路板(100)分别连接在所述挖孔的两端的端口上、且与所述挖孔围成所述第一容纳空间(300)。
  6. 根据权利要求1所述的电路板装置，其中，所述支撑结构件(240)开设有电连接孔，所述电连接孔内设置有电连接部(243)，所述 电连接部(243)的一端与所述封装基板(210)电连接，所述电连接部(243)的另一端与所述第一电路板(100)电连接。
  7. 根据权利要求1所述的电路板装置，其中，所述电路板装置还包括第二屏蔽件(260)，所述封装模块(200)设置在所述第二屏蔽件(260)之内。
  8. 根据权利要求7所述的电路板装置，其中，所述第二屏蔽件(260)为设置在所述封装模块(200)上的金属层。
  9. 根据权利要求7所述的电路板装置，其中，所述第二屏蔽件(260)与所述封装基板(210)形成第二容纳空间，所述第二容纳空间内设置有屏蔽隔离件(270)，所述屏蔽隔离件(270)将所述第二容纳空间分隔成至少两个第二子容纳空间，各所述第二子容纳空间内均设置有所述第一电子元器件(220)。
  10. 一种电子设备，包括权利要求1-9中任一项所述的电路板装置。
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