WO2020138209A1

WO2020138209A1 - Wiring base, electronic component housing package, and electronic device

Info

Publication number: WO2020138209A1
Application number: PCT/JP2019/050927
Authority: WO
Inventors: 茂典高谷
Original assignee: 京セラ株式会社
Priority date: 2018-12-26
Filing date: 2019-12-25
Publication date: 2020-07-02
Also published as: CN112585743A; CN112585743B; KR102463392B1; JPWO2020138209A1; JP7027578B2; KR20210027447A

Abstract

A wiring base according to an embodiment of the present invention is provided with a base and at least one terminal. The base has a recess opened in the upper surface. At least one terminal is positioned in the recess and extends from a first end toward a second end. The terminal has the first end positioned inside the recess and the second end positioned outside the recess, and has a diameter expansion part inside the recess.

Description

Wiring substrate, electronic component storage package, and electronic device

The present disclosure relates to a wiring substrate, a package for storing electronic components, and an electronic device.

With the development of information technology, the use of optical communication that enables high-speed and long-distance signal transmission is being promoted. Electronic devices that transmit optical signals are required to have stable operation and improved transmission efficiency. Patent Document 1 describes that an electronic device is composed of a wiring substrate and electronic components such as an LD (Laser Diode) or a PD (Photo Diode).

JP 2012-256692 A

A wiring substrate according to an embodiment of the present disclosure includes a substrate and at least one terminal. The base body has a first concave portion that is open on the upper surface. At least one terminal extends from the first end toward the second end and is located in the first recess. The terminal has a first end located inside the first recess and a second end located outside the first recess, and has a diameter-expanded portion inside the first recess.

An electronic component storage package according to an embodiment of the present disclosure includes a wiring base and a frame. The frame portion is located on the lower surface opposite to the upper surface of the base body.

An electronic device according to an embodiment of the present disclosure includes an electronic component and an external board. The electronic component is mounted on the lower surface of the base. The external substrate has a through hole corresponding to the terminal.

FIG. 3 is a top perspective view of a wiring substrate according to an embodiment of the present disclosure. FIG. 3 is a top perspective view of a wiring substrate according to an embodiment of the present disclosure. FIG. 3 is a top perspective view of an electronic component storage package according to an embodiment of the present disclosure. FIG. 3 is a top perspective view of an electronic component storage package according to an embodiment of the present disclosure. FIG. 3 is a bottom perspective view of an electronic component storage package according to an embodiment of the present disclosure. FIG. 3 is a side view of the electronic component storage package according to the embodiment of the present disclosure. FIG. 3 is a top perspective view in which a wiring base and an external substrate according to an embodiment of the present disclosure are connected. FIG. 3 is a top perspective view in which an electronic component storing package and an external substrate according to an embodiment of the present disclosure are connected. FIG. 6 is a top perspective view of an external substrate connected to the electronic component storage package according to the embodiment of the present disclosure. FIG. 4 is a bottom perspective view of an external substrate connected to an electronic component storage package according to an embodiment of the present disclosure. It is a top perspective view which expanded the wiring base body of FIG. 2 is a sectional view of the wiring substrate of FIG. 1 taken along line XII-XII. 2 is a sectional view of the wiring substrate of FIG. 1 taken along line XIV-XIV. 3 is a cross-sectional view of the wiring substrate of FIG. 2 taken along line XIII-XIII.

The wiring substrate 1 according to an embodiment of the present disclosure will be described below with reference to the drawings.

<Structure of wiring base 1>
The electronic device 100 includes an electronic component storage package 10. The electronic component storage package 10 includes a wiring substrate 1. The wiring base 1 includes a base 2 and terminals 4. The wiring base 1 is configured by arranging the first recess 21, the first signal conductor 3, the terminal 4, and the like on the upper surface of the base 2.

The base body 2 may have, for example, a circular shape when viewed from above. When the base 2 is circular in a top view, the radius may be 0.5 mm to 5 mm and the height may be 1 mm to 10 mm. The circular shape may include a shape in which a part of a circle is cut off when viewed from above. Further, the base body 2 may have a rectangular shape when viewed from above. When the base 2 has a rectangular shape in a top view, the size may be 1 mm×1 mm to 10 mm×10 mm. The base body 2 may be made of a dielectric material. Also. The base 2 may be formed by stacking dielectric materials. In addition, in this specification, a laminate of dielectric materials may be referred to as an insulating layer. The dielectric material includes, for example, a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body or a silicon nitride sintered body, or a glass ceramic material. Etc. can be used.

The first recess 21 is located on the upper surface of the base 2. The first recess 21 is open on the upper surface. The first recess 21 may be formed by forming a recess from the upper surface of the base body 2 toward the lower surface opposite to the upper surface by cutting a molded body or drilling a fired body. Further, when the base body 2 is formed by stacking the dielectric material, even if the first concave portion 21 is formed by cutting out a part of a plurality of dielectrics at the place where the first concave portion 21 is located and stacking them. Good. The shape of the first recess 21 may be, for example, circular when viewed from above. When the shape of the first recess 21 is circular in a top view, the size of the radius may be 0.1 mm to 1 mm. In addition, the first recess 21 may have a rectangular shape or an elliptical shape in which the corners of the rectangular shape are curved when viewed from above. When the first recess 21 has a rectangular shape in a top view, the size may be 0.2 mm×1 mm to 2 mm×10 mm. When the first recess 21 is oval in a top view, the radius of curvature of the curved portion may be 0.1 mm to 1 mm. When the first recess 21 has a circular shape or an elliptical shape in a top view, cracks due to stress concentration on corners unlike the case where the shape of the first recess 21 is a rectangular shape in a top view do not occur. The first recess 21 may have, for example, a rectangular shape when viewed in a cross section in the direction from the upper surface to the lower surface. The depth of the first recess 21 in the direction from the upper surface to the lower surface may be 0.1 mm to 3 mm. Further, the first recess 21 may have a taper shape, an inverse taper shape, or a step shape when viewed in a cross section in a direction from the upper surface to the lower surface.

The terminal 4 has a first end 41 and a second end 42. The terminal 4 extends from the first end 41 toward the second end 42. The terminal 4 may be rod-shaped. The terminal 4 may be located so as to extend in the direction perpendicular to the upper surface of the base 2. Note that the term "vertical" in this specification includes not only the vertical direction but also a case where the vertical direction is slightly inclined due to manufacturing errors. The error may be in the range of -0.1° to +0.1°.

The terminal 4 has a first end 41 located inside the first recess 21 and a second end 42 located outside the first recess 21, as shown in FIG. 11 or 12. The terminal 4 has an enlarged diameter portion 43 in the first recess 21. By having such an enlarged diameter portion 43 in the first concave portion 21, a joining material such as a brazing material applied to the enlarged diameter portion 43 when the terminal 4 is joined in the first concave portion 21. Since the contact area with the wiring substrate 1 increases, the bonding strength between the external substrate 8 such as FPC (Flexible Printed Circuits) and the wiring substrate 1 increases. Further, when the external substrate 8 and the wiring substrate 1 are connected, since the enlarged diameter portion 43 does not protrude from the opening of the first recess 21, the external substrate 8 does not float (float) from the wiring substrate 1. Excellent connection reliability. Further, for example, when the external substrate 8 and the expanded diameter portion 43 of the first recess 21 are connected using a brazing material, the first recess 21 may be a brazing material reservoir of the brazing material not used for joining. Therefore, it becomes difficult for the brazing material to protrude onto the upper surface of the wiring substrate 1. As a result, it is possible to reduce the floating of the external substrate 8 from the wiring substrate 1 due to the brazing filler metal that has overflowed. In the present specification, the diameter of a portion of the first recess 21 above the opening and close to the opening is used as a reference, and a portion having a diameter larger than that portion is defined as the enlarged diameter portion 43.

As shown in Figure 12 or Figure 14. The expanded diameter portion 43 may extend from the first end 41 toward the opening of the first recess 21. In other words, the expanded diameter portion 43 may include the first end 41. Furthermore, in other words, the area of the diameter of the expanded diameter portion 43 may be the same as the area of the diameter of the first end 41. In this specification, the area of the diameter of the expanded diameter portion 43 is the area of the cross section orthogonal to the axis of the terminal 4. The area of the diameter of the first end 41 is the surface area of the first end 41. Since the area of the diameter of the enlarged diameter portion 43 is the same as the area of the diameter of the first end 41, the joint strength with the connecting conductor 5 can be increased. In this specification, the diameter area of the expanded diameter portion 43 is S1, and the diameter area of the first end 41 is S2.

Further, as shown in FIG. 13, the expanded diameter portion 43 may extend from between the first end 41 and the second portion 42 toward the opening of the first recess 21. In other words, the expanded diameter portion 43 may not include the first end 41. Furthermore, in other words, the area of the diameter of the expanded diameter portion 43 may be larger than the area of the diameter of the first end 41. As a result, since the expanded diameter portion 43 does not include the first end 41, for example, when the first recess 21 further includes a recess that fits in the first end 41, the terminal 4 and the base body 2 are separated from each other. The connection can be made more stable.

The length of the terminal 4 may be 1 mm to 10 mm. When the terminal 4 is circular in a cross-sectional view intersecting in the axial direction, the radius of the expanded diameter portion 43 may be 0.1 mm to 0.8 mm, and the radius other than the expanded diameter portion 43 is 0.05 mm to 0.5 mm. May be The terminal 4 may be a metal including iron, for example. The terminal 4 is electrically connected to an external power source and supplies electricity to the mounted electronic component 101. A plurality of terminals 4 may be provided depending on the design of the wiring substrate 1. When there are a plurality of terminals 4, some terminals 4 may be electrically connected to each other, or each terminal 4 may not be electrically connected to each other.

The expanded diameter portion 43 may have a stepped shape when viewed in cross section including the axis of the terminal. When the expanded diameter portion 43 has a step shape, the step is located below the opening of the first recess 21 or in the lower surface direction than the opening. In other words, the expanded diameter portion 43 does not project upward from the opening. Since the expanded diameter portion 43 is step-shaped, it becomes easy to connect the external substrate 8 and the expanded diameter portion 43 of the first recess 21 with a brazing material or the like. As a result, the connection between the terminal 4 and the base 2 becomes more stable.

In the embodiment of the present disclosure shown in FIG. 1, a plurality of terminals 4 are located in the first recess 21. A plurality of first recesses 21 may be located on the upper surface of the base body 2, and a plurality of terminals 4 may be located in each of the plurality of first recesses 21.

The connecting conductor 5 is located in the first recess 21 and is connected to the first end 41. In the embodiment of the present disclosure illustrated in FIG. 1, the connection conductors 5 are located in the first recess 21 by the number of the plurality of terminals 4, and electrically correspond to each of the plurality of terminals 4 in a one-to-one correspondence. Connected. An insulating layer may be located in a region where the terminal 4 and the connecting conductor 5 are not located. The connection conductor 5 may be used, for example, to connect the base 2 and the terminal 4 with a bonding material such as a brazing material. The connection conductor 5 may be located so as to surround the outer circumference of the expanded diameter portion 43 when viewed from above. Since the connecting conductor 5 is positioned so as to surround the outer circumference of the expanded diameter portion 43, the terminal 4 can be easily joined to the connecting conductor 5, and at the time of joining the terminal 4 and the external substrate 8 with a brazing material, Since the brazing material that has flowed into the recess 21 can be received, it is possible to reduce the occurrence of a short circuit between the terminals 4.

The shape of the connecting conductor 5 may be, for example, rectangular or circular when viewed from above. When the connecting conductor 5 has a rectangular shape when viewed from above, the size may be 0.2 mm×0.2 mm to 2 mm×2 mm. When the connecting conductor 5 has a circular shape when viewed from above, the size of the radius may be 0.1 mm to 1 mm. The connecting conductor 5 is made of, for example, a metal material such as gold, silver, copper, nickel, tungsten, molybdenum, or manganese, and is co-fired in the form of a metallized layer or a plated layer on the surface of the uppermost insulating layer, or a metal. It may be plated.

In one embodiment of the present disclosure shown in FIG. 2, one terminal 4 is located in the first recess 21. There may be a plurality of first recesses 21, and one terminal 4 may be located in each of the first recesses 21. Since one terminal 4 is located in the first recess 21, the external substrate 8 is less likely to bend as compared with the embodiment of FIG. As a result, it is possible to reduce the floating of the external substrate 8 at the boundary between the opening of the first recess 21 and the upper surface of the substrate 2 due to the bending of the external substrate 8 in the first recess 21.

Further, in the embodiment of the present disclosure shown in FIG. 2, the shape of the connection conductor 5 may correspond to the shape of the first recess 21. Since the shape of the connection conductor 5 corresponds to the shape of the first recess 21, the connection region between the base 2 and the terminal 4 can be widened, and as a result, the bonding strength between the terminal 4 and the connection conductor 5 can be increased. Can be raised.

The first signal conductor 3 is located on the upper surface of the base 2 and extends in the first direction. The first signal conductor 3 is separated from the first recess 21 when viewed from above. The shape of the first signal conductor 3 may be, for example, a rectangular shape when viewed from above. When the shape of the first signal conductor 3 in a top view is rectangular, the width may be 0.05 mm to 1 mm and the length may be 0.5 mm to 5 mm. The first signal conductor 3 may include a metal material such as gold, silver, copper, nickel, tungsten, molybdenum, or manganese. The first signal conductor 3 may be co-fired or metal-plated on the upper surface of the substrate 2 in the form of a metallized layer, a plated layer, or the like. Further, the first signal conductor 3 may be located so as to extend in a substantially vertical direction with respect to the upper surface of the base 2. The first signal conductor 3 can be used to transmit a high frequency signal belonging to, for example, the 10 to 60 GHz band.

The first signal conductors 3 are a pair of first signal conductors 3 and may be positioned in parallel with each other. Since the pair of first signal conductors 3 are positioned in parallel, it is possible to reduce transmission loss when transmitting a high frequency signal.

A pair of first ground conductors 6 extending in the first direction and sandwiching at least a part of the first signal conductor 3 may be further provided. By providing the first ground conductor 6, when the first signal conductor 3 is a pair of first signal conductors 3, the arrangement of the first signal conductor 3 and the first ground conductor 6 becomes a coplanar structure. Since the first signal conductor 3 and the first ground conductor 6 are arranged in a coplanar structure, a high frequency signal can be smoothly transmitted. The first ground conductor 6 is made of, for example, a metal material such as gold, silver, copper, nickel, tungsten, molybdenum, or manganese, and is co-fired on the surface of the uppermost insulating layer in the form of a metallized layer or a plated layer. Alternatively, it may be metal-plated.

Further, the second ground conductor 61 may be located closer to the center of the upper surface than the first signal conductor 3 in a top view. The second ground conductor 61 is connected to the pair of first ground conductors 6. The second ground conductor 61 widens the area of the wiring substrate 1 that functions as a ground. As a result, the transmission of the high frequency signal becomes more stable. The second ground conductor 61 is made of a metal material such as gold, silver, copper, nickel, tungsten, molybdenum, or manganese, and is co-fired on the surface of the uppermost insulating layer in the form of a metallized layer or a plated layer. It may be metal-plated.

Further, the first ground conductor 6 does not have to be located on the outer periphery of the base body 2 and beyond the first signal conductor 3 in a top view. Since the first ground conductor 6 is not located on the outer periphery of the base 2 and beyond the first signal conductor 3, the second signal conductor 82 and the first ground are connected when the external substrate 8 and the wiring base 1 are connected. Occurrence of a short circuit due to contact with the conductor 6 can be reduced. The tip of the first signal conductor 3 and the outer periphery of the substrate 2 refer to the area A in FIGS. 1 to 4 of the drawings.

The first ground conductor 6 may be electrically connected to the ground conductor located inside the base 2 by the via 22. Since the first ground conductor 6 is connected to the ground conductor located inside the base 2 through the via 22, the region functioning as the ground can be widened.

The second ground conductor 61 may be electrically connected to the ground conductor located inside the base 2 by the via 22. By connecting the second ground conductor 61 to the ground conductor located inside the base 2 through the via 22, it is possible to widen the region functioning as the ground.

The base 2 may further have a second recess 7 located on the outer periphery of the base and beyond the first ground conductor. The second concave portion 7 is formed from the upper surface to the side surface, and may be continuously opened on the upper surface and the side surface. The base 2 may have a plurality of second recesses 7. The second recess 7 may be formed by cutting the base 2 from the upper surface to the side surface by cutting or the like. In addition, when the base 2 is formed of a stack of dielectric materials, the second recess 7 is formed by cutting a part of a plurality of dielectrics at a position where the second recess 7 is located and stacking the dielectrics. It may be formed. The second recess 7 may have, for example, a circular shape, a rectangular shape, or an elliptical shape when viewed from above. When the second recess 7 has a circular shape in a top view, the size of the radius may be 0.1 mm to 1 mm. When the second recess 7 has a rectangular shape in a top view, the size may be 0.2 mm×0.2 mm to 2 mm×10 mm. When the second recess 7 is circular or elliptical in a top view, the stress applied to the corners can be relaxed, and as a result, the wiring substrate 1 has few cracks.

The third ground conductor 71 may be located on the inner surface of the second recess 7. The third ground conductor 71 may be electrically connected to a ground conductor located inside the base 2, for example. Since the third ground conductor 71 is electrically connected to the ground conductor located inside the base body 2, it is possible to widen the region functioning as the ground. As a result, the ground of the high frequency signal transmitted by the first signal conductor 3 is strengthened, and the high frequency characteristics can be improved. The third ground conductor 71 is made of a metal material such as gold, silver, copper, nickel, tungsten, molybdenum, or manganese, and is co-fired on the surface of the uppermost insulating layer in the form of a metallized layer or a plated layer. Alternatively, it may be metal-plated.

The third ground conductor 71 may be electrically connected to the first ground conductor 6 while being connected to the first ground conductor 6. As a result, the region functioning as the ground can be further widened.

<Method for manufacturing wiring base 1>
Hereinafter, an example of a method of manufacturing the wiring base 1 will be described. First, an example of a method of manufacturing the substrate 2 that constitutes the wiring substrate 1 will be described. If the base body 2 has, for example, a plurality of insulating layers containing an aluminum oxide sintered body, it is manufactured as follows. First, a slurry is prepared by adding and mixing an appropriate organic binder, a solvent and the like to raw material powders such as aluminum oxide and silicon oxide. Next, the formed slurry is subjected to a forming method such as a doctor blade method and formed into a sheet shape to form a plurality of ceramic green sheets. At this time, notches serving as the first recess 21 and the second recess 7 may be provided at predetermined positions of the ceramic green sheet. Then, a plurality of ceramic green sheets are laminated and pressure-bonded. Finally, the laminated ceramic green sheets are fired in a reducing atmosphere at a temperature of about 1600° C., and are cut or punched to have an appropriate shape to produce the base 2 having a desired shape.

Next, a process of forming the first signal conductor 3, the connection conductor 5, the first ground conductor 6, the second ground conductor 61, and the third ground conductor 71 on the base 2 will be described. The first signal conductor 3, the connection conductor 5, the first ground conductor 6, the second ground conductor 61, and the third ground conductor 71 are formed of, for example, a metallized layer containing a high melting point metal such as tungsten, molybdenum, or manganese. In this case, it is formed as follows. First, a metal paste is prepared by kneading a high melting point metal powder together with an organic solvent and a binder. The metal paste is printed on a predetermined portion of the ceramic green sheet by a method such as screen printing. Then, the ceramic green sheets printed with the metal paste are stacked, pressure-bonded, and fired. Through the above steps, the metallized layer is deposited on the base body 2 as the first signal conductor 3, the connection conductor 5, the first ground conductor 6, the second ground conductor 61, and the third ground conductor 71. The surfaces of the first signal conductor 3, the connection conductor 5, the first ground conductor 6, the second ground conductor 61, and the third ground conductor 71 may be nickel-plated or gold-plated. By providing nickel plating or gold plating on the surface, the wettability of a bonding material such as a brazing material on the surface of the metal layer can be improved. As a result, the bondability of the external substrate 8 connected to the metal layer can be improved, and the corrosion resistance or weather resistance can be improved.

When forming the vias 22 in the base body 2, for example, through holes are provided at predetermined positions of a plurality of ceramic green sheets, and the metal paste is filled in the through holes. Then, the ceramic green sheets are laminated, pressed, and fired. The through holes may be provided by, for example, mechanical punching using a metal pin or drilling such as laser light. When the through hole is filled with the metal paste, a means such as vacuum suction may be used together to facilitate the filling of the metal paste.

The wiring substrate 1 can be manufactured by passing through the above steps.

<Structure of electronic component storage package 10>
An electronic component storage package 10 according to an embodiment of the present disclosure includes a wiring base 1 and a frame 11.

The frame 11 may be located on the lower surface of the base 2. The frame portion 11 may surround the mounting area of the electronic component 101 on the lower surface of the base body 2. The shape of the frame portion 11 may be, for example, a circular shape, a rectangular shape, or an elliptical shape when viewed from the bottom. Further, the frame portion 11 may match the shape of the wiring substrate 1 in a top view. When the shape of the frame portion 11 in a bottom view is circular, the size of the radius may be 1 mm×1 mm to 10 mm×10 mm. When the shape of the frame portion 11 in a bottom view is rectangular, the size may be 1 mm×1 mm to 10 mm×10 mm. Further, the height of the frame portion 11 may be 0.5 mm to 5 mm. For the frame portion 11, for example, a metal such as iron, copper, nickel, chromium, cobalt, molybdenum, or tungsten can be used. The frame portion 11 can be made of an alloy of the above-mentioned metals, for example, a copper-tungsten alloy, a copper-molybdenum alloy, an iron-nickel-cobalt alloy or the like.

<Configuration of electronic device 100>
An electronic device 100 according to an embodiment of the present disclosure includes an electronic component storage package 10, an electronic component 101, and an external board 8.

The electronic component 101 is mounted in the mounting area on the lower surface of the base 2. The electronic component 101 may be, for example, an LD or PD. The electronic component 101 may be connected to the first pad 23 and the second pad 24 located on the lower surface of the base 2 by wire bonding or the like.

The first pad 23 may be electrically connected to the terminal 4. The second pad 24 may be electrically connected to the first signal conductor 3. The first pad 23 may have, for example, a circular shape when viewed from below. When the first pad 23 has a circular shape when viewed from below, the size of the radius may be 0.1 mm to 0.5 mm.

When there are a plurality of terminals 4 and the terminals 4 are not electrically connected to each other, the number of the first pads 23 may correspond to the number of the terminals 4. The second pad 24 may have, for example, a rectangular shape when viewed from above. When the second pad 24 has a rectangular shape in a bottom view, the size thereof may be 0.1×0.1 mm to 1×1 mm. The number of second pads 24 may correspond to the number of first signal conductors 3. The first pad 23 and the second pad 24 may include a metal material such as gold, silver, copper, nickel, tungsten, molybdenum, or manganese. The first pad 23 and the second pad 24 may be co-fired or metal-plated on the surface of the insulating layer in the form of a metallized layer or a plated layer.

As shown in FIG. 9, the external substrate 8 has through holes 81 that correspond to the terminals 4 in a one-to-one correspondence, and when the external substrate 8 is connected to the wiring substrate 1, the terminals 4 are inserted into the through holes 81 of the external substrate 8. Is inserted.

The external board 8 may have an upper surface and a lower surface. The through hole 81 may penetrate from the upper surface to the lower surface of the external substrate 8. The area of the through hole 81 may be smaller than that of the enlarged diameter portion 43 and may be slightly larger than the size of the cross-sectional area of the second end 42. Since the area of the through hole 81 is smaller than that of the expanded diameter portion 43 and larger than the cross-sectional area of the second end 42, the wiring base 1 and the external substrate 8 can be easily aligned when the terminal 4 is inserted. Therefore, it is possible to reduce the positional deviation of the external substrate 8. As a result, high-frequency signal transmission between the electronic component 101 arranged on the wiring substrate 1 and the external substrate 8 connected to the electronic component 101 can be stably controlled. Further, since the brazing material applied to the expanded diameter portion 43 and the external substrate 8 can be bonded, the bonding strength can be increased.

As shown in FIG. 10, the second signal conductor 82 may be located on the lower surface of the external substrate 8. The second signal conductor 82 may be in a position in contact with the first signal conductor 3 when connected to the wiring substrate 1. This facilitates electrical connection between the second signal conductor 82 and the first signal conductor 3 and enables efficient signal transmission.

The external board 8 may be, for example, an FPC. When the external substrate 8 is an FPC, a conductive metal such as a copper foil is attached to the upper and lower surfaces of a thin and soft base film having insulation such as polyimide. Then, by etching the conductive metal into a predetermined shape, the external substrate 8 provided with the second signal conductor 82 having a desired shape can be manufactured.

The connection between the external substrate 8 and the wiring substrate 1 is performed by inserting the terminal 4 into the through hole 81 of the external substrate 8 and connecting the expanded diameter portion 43 of the terminal 4 and the lower surface of the external substrate 8 via a bonding material such as a brazing material. And the upper surface of the wiring substrate 1 and the lower surface of the external substrate 8 are closely contacted and connected. At this time, the upper surface of the wiring substrate 1 and the lower surface of the external substrate 8 are connected via a brazing material or the like.

The connection between the external substrate 8 and the wiring substrate 1 may be made by joining not only the lower surface of the external substrate 8 and the expanded diameter portion 43 but also the upper surface of the external substrate 8 and the terminal 4 via a brazing material or the like. As a result, the bonding strength between the wiring substrate 1 and the external substrate 8 can be increased.

When the external substrate 8 includes the second signal conductor 82, the second signal conductor 82 and the wiring base 1 may be electrically connected via a brazing material or the like.

The lid may be joined to the frame 11. When viewed from the bottom, the lid may have, for example, a circular shape, a rectangular shape, or an elliptical shape. Further, the lid body may match the shape of the base body 2 when viewed from below. The lid may be made of a metal containing iron, copper, nickel, chromium, cobalt, molybdenum, or tungsten, for example. Alternatively, the lid may use an alloy of the above-mentioned metals, for example, a copper-tungsten alloy, a copper-molybdenum alloy, an iron-nickel-cobalt alloy, or the like. The lid can be produced by subjecting an ingot of a metal material to a metal working method such as a rolling working method or a punching working method.

As described above, the present disclosure is not limited to the above-described embodiment, and various modifications and the like can be made without departing from the gist of the present disclosure. Furthermore, all changes and the like belonging to the claims are within the scope of the present disclosure.

1: wiring base 10: electronic component storage package 11: frame 100: electronic device 101: electronic component 2: base 21: first recess 22: via 23: first pad 24: second pad 3: first signal conductor 4: terminal 41: first end 42: second end 43: expanded portion 5: connection conductor 6: first ground conductor 61: second ground conductor 7: second recess 71: third ground conductor 8: external substrate 81 : Through hole 82: Second signal conductor

Claims

A base body having a first recess opening in the upper surface, a first signal conductor extending in the first direction on the upper surface, and at least one terminal extending from the first end toward the second end,
A connection conductor located in the first recess and connected to the first end;
The terminals are
A wiring substrate, wherein the first end is located inside the first recess, the second end is located outside the first recess, and a diameter-expanded portion is located inside the first recess.
The expanded portion is
The wiring substrate according to claim 1, wherein the wiring substrate has a step shape when viewed in a cross-section including the axis of the terminal.
The expanded portion is
The wiring substrate according to claim 1, which extends from the first end toward the opening.
The wiring substrate according to claim 1 or 2, wherein a diameter area S1 of the expanded diameter portion is larger than a diameter area S2 of the first end.
The wiring substrate according to any one of claims 1 to 4, wherein a plurality of the terminals are located in the first recess.
The wiring substrate according to any one of claims 1 to 4, wherein a plurality of the first recesses are provided, and one terminal is located in each of the plurality of first recesses.
The connection conductor is
The wiring substrate according to any one of claims 1 to 6, which is located so as to surround the outer circumference of the expanded diameter portion when viewed from above.
8. The wiring substrate according to claim 1, further comprising a pair of first ground conductors extending in the first direction and sandwiching the first signal conductor.
A second ground conductor closer to the center of the upper surface than the first signal conductor,
The wiring base according to claim 8, wherein the second ground conductor is connected to the pair of first ground conductors.
The base is
The wiring base according to claim 8 or 9, further comprising a second recess located on the outer periphery of the base and beyond the first ground conductor.
A third ground conductor located in the second recess,
The third ground conductor is
The wiring substrate according to claim 10, which is connected to the first ground conductor.
A wiring substrate according to any one of claims 1 to 11,
An electronic component storage package, comprising: a frame portion located on a lower surface opposite to the upper surface.
An electronic component storage package according to claim 12,
An electronic component mounted on the lower surface,
An external substrate having a through hole corresponding to the terminal,
The terminals are
An electronic device inserted into the through hole and positioned.