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WO2020134871A1 - 一种外壳结构及终端设备 - Google Patents

一种外壳结构及终端设备 Download PDF

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Publication number
WO2020134871A1
WO2020134871A1 PCT/CN2019/122253 CN2019122253W WO2020134871A1 WO 2020134871 A1 WO2020134871 A1 WO 2020134871A1 CN 2019122253 W CN2019122253 W CN 2019122253W WO 2020134871 A1 WO2020134871 A1 WO 2020134871A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
shell
heat
sliding
dissipation plate
Prior art date
Application number
PCT/CN2019/122253
Other languages
English (en)
French (fr)
Inventor
黄华
杨峻
张治国
甄海涛
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to US17/418,646 priority Critical patent/US11630494B2/en
Priority to EP19901905.0A priority patent/EP3905003B1/en
Publication of WO2020134871A1 publication Critical patent/WO2020134871A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
    • G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
    • G06F1/1624—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with sliding enclosures, e.g. sliding keyboard or display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G06F1/166—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to integrated arrangements for adjusting the position of the main body with respect to the supporting surface, e.g. legs for adjusting the tilt angle
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1675—Miscellaneous details related to the relative movement between the different enclosures or enclosure parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20972—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20981—Liquid coolant without phase change

Definitions

  • Embodiments of the present application relate to the field of terminal equipment, and more specifically, to a housing structure and terminal equipment.
  • the heat dissipation structure of the notebook computer includes a heat pipe, a radiator and a fan.
  • the heat pipe is in contact with the heat-generating device through a heat-conducting material, for example, the heat-generating device is a central processing unit (CPU) and a graphics processing unit (GPU).
  • the heat pipe conducts the heat of the heating element to the radiator, and the fan will discharge the heat from the radiator to the outside environment through the air outlet.
  • the power consumption of notebook computers also continues to increase, and the heating devices of notebook computers will generate more heat, so the traditional heat dissipation structure cannot dissipate heat from the heating devices normally.
  • the surface temperature of the notebook computer is high, which affects the user's feel, and also causes the heating device to automatically reduce the frequency.
  • the central processor automatically reduces the frequency, which affects the user's experience.
  • Embodiments of the present application provide a housing structure and terminal equipment to better dissipate heat for a heat-generating device of a notebook computer.
  • an embodiment of the present application provides an outer shell structure, which includes a bottom shell and a lifting shell.
  • the first end of the bottom shell is connected to the first end of the lifting shell, the second end of the bottom shell and the second end of the lifting shell are separated by a first distance, and the space between the bottom shell and the lifting shell forms a heat dissipation channel.
  • the bottom case is provided with a heat dissipation plate, the first surface of the heat dissipation plate is in contact with the heating element, and the second surface of the heat dissipation plate is located in the heat dissipation channel.
  • a heat dissipation plate is provided on the bottom case, and the first surface of the heat dissipation plate is in contact with the heat generating device, and the heat generated by the heat generating device can be conducted to the heat dissipating plate. Since the second surface of the heat dissipation plate is located in the heat dissipation channel formed by the bottom case and the lifting case, the heat on the heat dissipation plate can be quickly taken away by the air in the heat dissipation channel. Since the heat dissipation channel communicates with the external environment, the heat radiated from the heat dissipation plate will quickly flow to the external environment through the heat dissipation channel. Therefore, the outer shell structure provided by the embodiment of the present application can better dissipate heat for the heat-generating device in the bottom shell.
  • a sliding component is also included.
  • the first end of the bottom shell and the first end of the lifting shell are hinged to each other, and the second end of the bottom shell and the second end of the lifting shell are connected by a sliding assembly.
  • the sliding assembly When the second end of the lifting shell and the second end of the bottom shell are relatively moved by the sliding assembly to a first distance, the second end of the lifting shell and the second end of the bottom shell are fixedly connected by the sliding assembly.
  • the sliding assembly can be used to keep the outer shell structure in a closed state. At this time, no heat dissipation channel is formed between the bottom case and the lifting case. In the case where the user needs to dissipate heat for the heat-generating device in the bottom case, the sliding assembly can be used to keep the case structure open, and at this time, a heat dissipation channel is formed between the bottom case and the lifting case. Therefore, the embodiment of the present application can make the housing structure in the open state and the closed state by sliding the assembly, so the housing structure provided by the embodiment of the present application has higher flexibility.
  • the sliding assembly includes a sliding shaft and a sliding structural member, the sliding shaft is disposed at the second end of the bottom shell, and the sliding structural member is disposed at the second end of the lifting shell.
  • the sliding structural member is provided with mutually connected sliding grooves and clamping grooves, and the sliding shaft is adapted to the sliding grooves and clamping grooves.
  • the bottom shell is provided with a groove for receiving the shell lift.
  • the sliding component can be used to keep the shell structure in a closed state. At this time, a heat dissipation channel is no longer formed between the bottom case and the lifting case, and the lifting case can be stored to The groove of the bottom shell can save the space for storing the shell structure.
  • the first end of the bottom shell is fixedly connected to the first end of the lifting shell.
  • the first surface of the heat dissipation plate is further provided with a heat conductive material and a heat pipe.
  • the first surface of the heat dissipation plate is in contact with the heat generating device through the heat conductive material and the heat pipe.
  • the thermally conductive material and the heat pipe have better thermal conductivity, the thermally conductive material and the heat pipe can better conduct the heat on the heating element to the heat dissipation plate, so that the heat dissipation plate can conduct the heat to the outside environment faster.
  • the second surface of the heat dissipation plate is further provided with heat dissipation fins.
  • a heat dissipation fan is further provided on the heat dissipation fins on the second surface of the heat dissipation plate.
  • the second surface of the heat dissipation plate is provided with heat dissipation fins.
  • the heat dissipation fins increase the heat dissipation area of the heat dissipation plate.
  • the heat dissipation fins can quickly export the heat on the heat dissipation plate to the outside environment.
  • the cooling fan can blow the cold air of the external environment to the cooling fins, so that the heat on the cooling fins dissipates faster.
  • At least one ventilation hole is provided on the heat dissipation plate.
  • the ventilation holes provided on the heat dissipation plate can also quickly lead the heat on the heat dissipation plate to the outside environment.
  • an embodiment of the present application provides a terminal device.
  • the terminal device includes the housing structure disclosed in the first aspect and any possible implementation manner of the first aspect.
  • FIG. 1 is a schematic diagram of a housing structure provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a housing structure in an open state provided by an embodiment of the present application
  • FIG. 3 is a schematic diagram of a housing structure in a closed state provided by an embodiment of the present application.
  • FIG. 4 is a schematic diagram of a sliding shaft of a sliding assembly provided by an embodiment of the present application.
  • FIG. 5 is a schematic diagram of a sliding structural member of a sliding assembly provided by an embodiment of the present application.
  • FIG. 6 is a schematic diagram of a sliding assembly in a first state provided by an embodiment of the present application.
  • FIG. 7 is a schematic diagram of a sliding assembly in a second state provided by an embodiment of the present application.
  • FIG. 8 is a schematic diagram of a heat dissipation plate provided by an embodiment of this application.
  • FIG. 9 is a schematic diagram of a heat dissipation plate, a heat conductive material, a heat pipe, and a heat generating device provided by an embodiment of the present application;
  • FIG. 10 is a schematic diagram of another heat dissipation plate provided by an embodiment of this application.
  • FIG. 11 is a schematic diagram of a heat dissipation plate, a heat conductive material, a heat pipe, a heat generating device, a heat dissipation fin, and a heat dissipation fan provided by an embodiment of the present application;
  • FIG. 12 is a schematic diagram of a terminal device provided by an embodiment of the present application.
  • FIG. 1 is a schematic diagram of a housing structure provided by an embodiment of the present application.
  • the casing structure shown in FIG. 1 may be a casing structure of a notebook computer.
  • the outer shell structure includes a bottom shell 1 and a lifting shell 2, the first end of the bottom shell 1 is connected to the first end of the lifting shell 2, and the second end of the bottom shell 1 is connected to the lifting shell 2
  • the second end of is separated by a first distance h, and the space between the bottom case 1 and the lifting case 2 forms a heat dissipation channel 3.
  • the bottom case 1 is provided with a heat dissipation plate 11.
  • the first surface of the heat dissipation plate 11 is in contact with the heat generating device 12.
  • the second surface of the heat dissipation plate 11 is located in the heat dissipation channel 3.
  • the heating device 12 may be a device inside a notebook computer such as a central processing unit or a graphics processor.
  • a heat dissipation plate 11 is provided on the bottom case 1, and the first surface of the heat dissipation plate 11 is in contact with the heating element 12, and the heat generated by the heating element 12 can be conducted to the heat dissipation plate 11. Since the second surface of the heat dissipation plate 11 is located in the heat dissipation channel 3 formed by the bottom case 1 and the lifting case 2, the heat on the heat dissipation plate 11 can be quickly taken away by the air in the heat dissipation channel 3. Since the heat dissipation channel 3 communicates with the external environment, the heat radiated from the heat dissipation plate 11 will quickly flow through the heat dissipation channel 3 to the external environment. Therefore, the housing structure provided by the embodiment of the present application can better dissipate heat for the heat-generating device 12 in the bottom case 1.
  • FIG. 2 is a schematic view of a case structure provided in an embodiment of the present application in an open state
  • FIG. 3 is a case of a case structure provided in an embodiment of the present application in a closed state Schematic diagram of the state.
  • the housing structure includes not only all the components in FIG. 1, but also the housing structure includes the sliding assembly 4. Wherein, the first end of the bottom shell 1 and the first end of the lifting shell 2 are hinged to each other, and the second end of the bottom shell 1 and the second end of the lifting shell 2 are connected by a sliding assembly 4.
  • the sliding assembly 4 when the user does not need to dissipate heat from the heating device 12 in the bottom case 1, the sliding assembly 4 can be used to put the housing structure in the closed state as shown in FIG. 3, this At this time, a heat dissipation channel is no longer formed between the bottom case 1 and the lifting case 2.
  • the sliding assembly 4 can be used to make the case structure in an open state as shown in FIG. 2, at this time, a heat dissipation channel is formed between the bottom case 1 and the lifting case 2 3. Therefore, the embodiment of the present application can make the housing structure in the open state and the closed state through the sliding assembly 4, so the housing structure provided by the embodiment of the present application has higher flexibility.
  • FIG. 4 is a schematic diagram of a sliding shaft of a sliding assembly provided by an embodiment of the present application
  • FIG. 5 is a sliding of a sliding assembly provided by an embodiment of the present application.
  • FIG. 6 is a schematic diagram of a sliding assembly in a first state provided by an embodiment of the present application
  • FIG. 7 is a schematic diagram of a sliding assembly in a second state provided by an embodiment of the present application. .
  • the sliding assembly 4 of the housing structure includes a sliding shaft 41 and a sliding structural member 42, the sliding shaft 41 is disposed at the second end of the bottom shell 1, and the sliding structural member 42 is disposed at the lifting shell The second end of 2.
  • the sliding structural member 42 is provided with a sliding groove 421 and a clamping groove 422 that are connected to each other.
  • the sliding shaft 41 is adapted to the sliding groove 421 and the clamping groove 422, that is, the sliding shaft 41 can slide in the sliding groove 421, and the sliding shaft 41 can be fixed In the card slot 422.
  • the sliding assembly 4 is in a state as shown in FIG. 2, that is, the housing structure is in an open state.
  • the user can use external force to make the sliding shaft 41 leave the slot 422 and enter the sliding slot 421.
  • the sliding shaft 41 of the sliding assembly 4 shown in FIG. 2 is fixed in the clamping slot 422, and the sliding shaft 41 of the sliding assembly 4 shown in FIG. 7 is also fixed in the clamping slot 422 Inside.
  • the sliding shaft 41 of the sliding assembly 4 shown in FIG. 3 is in the sliding groove 421, and the sliding shaft 41 of the sliding assembly 4 shown in FIG. 6 is also in the sliding groove 421.
  • the bottom case 1 may also be provided with a groove (not shown in the figure) for receiving the lifting case 2.
  • the sliding assembly 4 can be used to put the case structure in the closed state as shown in FIG. 3, at this time, the bottom case 1 and the lift case 2 are no longer A heat dissipation channel is formed, and the lifting shell 2 can be stored in the groove of the bottom shell 1, thereby saving space for storing the shell structure.
  • a housing structure with a sliding assembly 4 is provided.
  • the housing mechanism may have other forms, and is not limited to the embodiments shown in FIGS. 2 to 7.
  • the outer shell structure includes a bottom shell and a lifting shell.
  • the first end of the bottom shell may also be fixedly connected to the first end of the lifting shell, and the second end of the bottom shell is connected to the second end of the lifting shell.
  • the ends are separated by a first distance, and the space between the bottom shell and the lifting shell forms a heat dissipation channel.
  • the bottom case is provided with a heat dissipation plate, the first surface of the heat dissipation plate is in contact with the heating element, and the second surface of the heat dissipation plate is located in the heat dissipation channel.
  • FIG. 8 is a schematic diagram of a heat sink provided by an embodiment of the present application.
  • FIG. 9 is a heat sink provided by an embodiment of the present application.
  • heating devices In the embodiments shown in FIGS. 8 and 9, the first surface of the heat dissipation plate 11 is further provided with a heat conductive material 13 and a heat pipe 14, and the first surface of the heat dissipation plate 11 is connected to the heat generating device 12 through the heat conductive material 13 and the heat pipe 14. contact.
  • the thermally conductive material 13 and the heat pipe 14 have better thermal conductivity, the thermally conductive material 13 and the heat pipe 14 can better conduct the heat on the heating element 12 to the heat dissipation plate 11
  • the heat sink 11 can conduct heat to the outside environment faster.
  • FIG. 10 is a schematic diagram of another heat dissipation plate provided by an embodiment of the present application
  • FIG. 11 is a heat dissipation plate, a thermally conductive material provided by an embodiment of the present application. Schematic diagrams of heat pipes, heating devices, cooling fins and cooling fans.
  • the first surface of the heat dissipation plate 11 is provided with a heat conductive material 13 and a heat pipe 14, and the first surface of the heat dissipation plate 11 is in contact with the heating device 12 through the heat conductive material 13 and the heat pipe 14 .
  • the second surface of the heat dissipation plate 11 is also provided with heat dissipation fins 15, and the heat dissipation fin 15 on the second surface of the heat dissipation plate 11 is also provided with a heat dissipation fan 16.
  • the second surface of the heat dissipation plate 11 is provided with heat dissipation fins 15.
  • the heat dissipation fins 15 increase the heat dissipation area of the heat dissipation plate 11, and the heat dissipation fins 15 can quickly dissipate heat
  • the heat on the board 11 is conducted to the outside environment.
  • the cooling fan 16 can blow the cold air of the external environment to the cooling fin 15 so that the heat on the cooling fin 15 dissipates faster.
  • the heat dissipation plate 11 may also be provided with at least one ventilation hole (not shown in the figure).
  • the ventilation hole provided on the heat dissipation plate 11 may also dissipate the heat on the heat dissipation plate 11 Quickly export to the outside world.
  • FIG. 12 is a schematic diagram of a terminal device according to an embodiment of the present application.
  • the terminal device shown in FIG. 12 includes a housing structure 100 and a display screen 200.
  • the housing structure 100 of FIG. 12 please refer to the detailed description of the housing structure in the embodiments shown in FIGS. 1 to 11.
  • the terminal device shown in FIG. 12 may be a device such as a notebook computer.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Physics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种外壳结构及终端设备，该外壳结构包括底壳（1）和抬壳（2）。底壳（1）的第一端与抬壳（2）的第一端相连接，底壳（1）的第二端与抬壳（2）的第二端间隔第一距离（h），底壳（1）与抬壳（2）之间的空间形成散热通道（3）。底壳（1）上设置有散热板（11），散热板（11）的第一表面与发热器件（12）相接触，散热板（11）的第二表面位于散热通道（3）内。在底壳（1）上设置散热板（11），并将散热板（11）的第一表面与发热器件（12）相接触，可以将发热器件（12）产生的热量传导给散热板（11）。由于散热板（11）的第二表面位于底壳（1）与抬壳（2）形成的散热通道（3）内，所以散热板（11）上的热量可以很快的被散热通道（3）内的空气带走。因此，该外壳结构可以更好的为底壳（1）内的发热器件（12）进行散热。

Description

一种外壳结构及终端设备
本申请要求在2018年12月27日提交中国国家知识产权局、申请号为201811609128.2、发明名称为“一种外壳结构及终端设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及终端设备领域，更具体的说，涉及外壳结构及终端设备。
背景技术
随着笔记本电脑朝着高性能和轻薄化的趋势发展，散热性能已经成为笔记本电脑发展的重要因素之一。
目前，笔记本电脑的散热结构包括热管、散热器和风扇。其中，热管通过导热材料与发热器件接触，例如，发热器件为中央处理器(central processing unit，CPU)和图形处理器(graphic processing unit，GPU)。热管将发热器件的热量传导至散热器上，风扇会将散热器上的热量通过出风口排出至外界环境。
然而，随着笔记本电脑的性能不断提高，笔记本电脑的功耗也在不断增加，笔记本电脑的发热器件就会产生更多的热量，所以传统的散热结构无法为发热器件正常的散热，这样不仅会导致笔记本电脑的表面温度高，影响用户的手感，还会使得发热器件自动降频，例如，中央处理器会自动的降低频率，从而影响用户的使用体验。
发明内容
本申请实施例提供一种外壳结构及终端设备，以更好的为笔记本电脑的发热器件进行散热。
本申请实施例是这样实现的：
第一方面，本申请实施例提供了一种外壳结构，该外壳结构包括底壳和抬壳。底壳的第一端与抬壳的第一端相连接，底壳的第二端与抬壳的第二端间隔第一距离，底壳与抬壳之间的空间形成散热通道。底壳上设置有散热板，散热板的第一表面与发热器件相接触，散热板的第二表面位于散热通道内。
在第一方面中，在底壳上设置散热板，并将散热板的第一表面与发热器件相接触，可以将发热器件产生的热量传导给散热板。由于散热板的第二表面位于底壳与抬壳形成的散热通道内，所以散热板上的热量可以很快的被散热通道内的空气带走。由于散热通道与外界环境相连通，所以散热板散发出来的热量会很快的经过散热通道流动至外界环境。因此，本申请实施例提供的外壳结构可以更好的为底壳内的发热器件进行散热。
在一种可能的实现方式中，还包括滑动组件。底壳的第一端与抬壳的第一端相互铰接，底壳的第二端与抬壳的第二端通过滑动组件连接。在抬壳的第二端与底壳的第二端通过滑动组件相对移动至间隔第一距离时，抬壳的第二端与底壳的第二端通过滑动组件固定连接。
其中，在用户不需要为底壳内的发热器件散热的情况下，可以利用滑动组件使外壳结构处于关闭状态，此时，底壳和抬壳之间不再形成散热通道。在用户需要为底壳内的 发热器件散热的情况下，可以利用滑动组件使外壳结构处于打开状态，此时，底壳和抬壳之间形成散热通道。因此，本申请实施例可以通过滑动组件使得外壳结构处于打开状态和关闭状态，所以本申请实施例提供的外壳结构具有更高的灵活性。
在一种可能的实现方式中，滑动组件包括滑轴和滑动结构件，滑轴设置在底壳的第二端，滑动结构件设置在抬壳的第二端。滑动结构件上设置有相互连通的滑槽和卡槽，滑轴与滑槽和卡槽相适配。滑轴在滑动结构件的滑槽内滑动至卡槽内时，抬壳的第二端与底壳的第二端间隔第一距离，抬壳的第二端与底壳的第二端通过滑轴和卡槽固定连接。
在一种可能的实现方式中，底壳上设置有容纳抬壳的凹槽。
其中，在用户不需要为底壳内的发热器件散热的情况下，可以利用滑动组件使外壳结构处于关闭状态，此时，底壳和抬壳之间不再形成散热通道，抬壳可以收纳至底壳的凹槽内，从而可以节省存放外壳结构的空间。
在一种可能的实现方式中，底壳的第一端与抬壳的第一端固定连接。
在一种可能的实现方式中，散热板的第一表面上还设置有导热材料和热管。散热板的第一表面通过导热材料和热管与发热器件相接触。
其中，由于导热材料和热管具有更好的导热性能，所以导热材料和热管可以更好的将发热器件上的热量传导至散热板上，从而使得散热板可以更快的将热量传导至外界环境。
在一种可能的实现方式中，散热板的第二表面上还设置有散热翅片。
在一种可能的实现方式中，散热板的第二表面的散热翅片上还设置有散热风扇。
其中，散热板的第二表面上设置有散热翅片，散热翅片增加了散热板的散热面积，散热翅片可以快速的将散热板上的热量导出至外界环境。而且，散热风扇可以将外界环境的冷空气吹向散热翅片，以使散热翅片上的热量消散的更快。
在一种可能的实现方式中，散热板上设置有至少一个通风孔。
其中，散热板上设置的通风孔也可以将散热板上的热量快速导出至外界环境。
第二方面，本申请实施例提供了一种终端设备，该终端设备包括第一方面及第一方面的任意一种可能的实现方式中公开的外壳结构。
附图说明
图1所示的为本申请实施例提供的一种外壳结构的示意图；
图2所示的为本申请实施例提供的一种外壳结构处于打开状态的示意图；
图3所示的为本申请实施例提供的一种外壳结构处于关闭状态的示意图；
图4所示的为本申请实施例提供的一种滑动组件的滑轴的示意图；
图5所示的为本申请实施例提供的一种滑动组件的滑动结构件的示意图；
图6所示的为本申请实施例提供的一种滑动组件处于第一状态的示意图；
图7所示的为本申请实施例提供的一种滑动组件处于第二状态的示意图；
图8所示的为本申请实施例提供的一种散热板的示意图；
图9所示的为本申请实施例提供的一种散热板、导热材料、热管和发热器件的示意图；
图10所示的为本申请实施例提供的另一种散热板的示意图；
图11所示的为本申请实施例提供的一种散热板、导热材料、热管、发热器件、散热翅片和散热风扇的示意图；
图12所示的为本申请实施例提供的一种终端设备的示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行描述。
请参见图1所示，图1所示的为本申请实施例提供的一种外壳结构的示意图。图1所示的外壳结构可以为笔记本电脑的外壳结构。在图1所示的实施例中，外壳结构包括底壳1和抬壳2，底壳1的第一端与抬壳2的第一端相连接，底壳1的第二端与抬壳2的第二端间隔第一距离h，底壳1与抬壳2之间的空间形成散热通道3。底壳1上设置有散热板11，散热板11的第一表面与发热器件12相接触，散热板11的第二表面位于散热通道3内。其中，发热器件12可以为中央处理器或图形处理器等笔记本电脑内部的器件。
在图1所示的实施例中，在底壳1上设置散热板11，并将散热板11的第一表面与发热器件12相接触，可以将发热器件12产生的热量传导给散热板11。由于散热板11的第二表面位于底壳1与抬壳2形成的散热通道3内，所以散热板11上的热量可以很快的被散热通道3内的空气带走。由于散热通道3与外界环境相连通，所以散热板11散发出来的热量会很快的经过散热通道3流动至外界环境。因此，本申请实施例提供的外壳结构可以更好的为底壳1内的发热器件12进行散热。
请参见图2和图3所示，图2所示的为本申请实施例提供的一种外壳结构处于打开状态的示意图，图3所示的为本申请实施例提供的一种外壳结构处于关闭状态的示意图。在图2和图3所示的实施例中，外壳结构不仅包括图1中的全部部件，而且，外壳结构还包括滑动组件4。其中，底壳1的第一端与抬壳2的第一端相互铰接，底壳1的第二端与抬壳2的第二端通过滑动组件4连接。在抬壳2的第二端与底壳1的第二端通过滑动组件4相对移动至间隔第一距离h时，抬壳2的第二端与底壳1的第二端通过滑动组件4固定连接，如图2所示的状态，即外壳结构处于打开状态。抬壳2的第二端与底壳1的第二端通过滑动组件4可以相对移动至相互接触，如图3所示的状态，即外壳结构处于关闭状态。
在图2和图3所示的实施例中，在用户不需要为底壳1内的发热器件12散热的情况下，可以利用滑动组件4使外壳结构处于如图3所示的关闭状态，此时，底壳1和抬壳2之间不再形成散热通道。在用户需要为底壳1内的发热器件12散热的情况下，可以利用滑动组件4使外壳结构处于如图2所示的打开状态，此时，底壳1和抬壳2之间形成散热通道3。因此，本申请实施例可以通过滑动组件4使得外壳结构处于打开状态和关闭状态，所以本申请实施例提供的外壳结构具有更高的灵活性。
请参见图2至图7所示，图4所示的为本申请实施例提供的一种滑动组件的滑轴的示意图，图5所示的为本申请实施例提供的一种滑动组件的滑动结构件的示意图，图6所示的为本申请实施例提供的一种滑动组件处于第一状态的示意图，图7所示的为本申请实施例提供的一种滑动组件处于第二状态的示意图。
在图2至图7所示的实施例中，外壳结构的滑动组件4包括滑轴41和滑动结构件42，滑轴41设置在底壳1的第二端，滑动结构件42设置在抬壳2的第二端。滑动结构件42上设置有相互连通的滑槽421和卡槽422，滑轴41与滑槽421和卡槽422相适配，即滑轴41可在滑槽421内滑动，滑轴41可以固定在卡槽422内。滑轴41在滑动结构件42的滑槽421内滑动至卡槽422内时，抬壳2的第二端与底壳1的第二端间隔第一距离h，抬壳2的第二端与底壳1的第二端通过滑轴41和卡槽422固定连接，此时，滑动组件4如图2所示的状态，即外壳结构处于打开状态。当然，用户可以使用外力使得滑轴 41离开卡槽422并进入滑槽421内。
在图2至图7所示的实施例中，图2所示的滑动组件4的滑轴41固定在卡槽422内，图7所示的滑动组件4的滑轴41同样固定在卡槽422内。图3所示的滑动组件4的滑轴41在滑槽421内，图6所示的滑动组件4的滑轴41同样在滑槽421内。
在图2至图7所示的实施例中，底壳1上还可以设置有容纳抬壳2的凹槽(图中未示出)。在用户不需要为底壳1内的发热器件12散热的情况下，可以利用滑动组件4使外壳结构处于如图3所示的关闭状态，此时，底壳1和抬壳2之间不再形成散热通道，抬壳2可以收纳至底壳1的凹槽内，从而可以节省存放外壳结构的空间。
在图2至图7所示的实施例中，提供了一种具有滑动组件4的外壳结构。当然，外壳机构还可以有其他形态，并不局限于图2至图7所示的实施例。
例如，在一种可以实现的方案中，外壳结构包括底壳和抬壳，底壳的第一端还可以与抬壳的第一端固定连接，底壳的第二端与抬壳的第二端间隔第一距离，底壳与抬壳之间的空间形成散热通道。底壳上设置有散热板，散热板的第一表面与发热器件相接触，散热板的第二表面位于散热通道内。其中，这种方案虽然无法将抬壳收纳至底壳内，但是同样可以更好的为底壳内的发热器件进行散热。
请参见图8和图9所示，图8所示的为本申请实施例提供的一种散热板的示意图，图9所示的为本申请实施例提供的一种散热板、导热材料、热管和发热器件的示意图。在图8和图9所示的实施例中，散热板11的第一表面上还设置有导热材料13和热管14，散热板11的第一表面通过导热材料13和热管14与发热器件12相接触。
在图8和图9所示的实施例中，由于导热材料13和热管14具有更好的导热性能，所以导热材料13和热管14可以更好的将发热器件12上的热量传导至散热板11上，从而使得散热板11可以更快的将热量传导至外界环境。
请参见图10和图11所示，图10所示的为本申请实施例提供的另一种散热板的示意图，图11所示的为本申请实施例提供的一种散热板、导热材料、热管、发热器件、散热翅片和散热风扇的示意图。在图10和图11所示的实施例中，散热板11的第一表面上设置有导热材料13和热管14，散热板11的第一表面通过导热材料13和热管14与发热器件12相接触。散热板11的第二表面上还设置有散热翅片15，散热板11的第二表面的散热翅片15上还设置有散热风扇16。
在图10和图11所示的实施例中，散热板11的第二表面上设置有散热翅片15，散热翅片15增加了散热板11的散热面积，散热翅片15可以快速的将散热板11上的热量导出至外界环境。而且，散热风扇16可以将外界环境的冷空气吹向散热翅片15，以使散热翅片15上的热量消散的更快。
在图10和图11所示的实施例中，散热板11上还可以设置有至少一个通风孔(图中未示出)，散热板11上设置的通风孔也可以将散热板11上的热量快速导出至外界环境。
请参见图12所示，图12所示的为本申请实施例提供的一种终端设备的示意图。在图12所示的终端设备包括外壳结构100和显示屏幕200，其中，关于图12的外壳结构100的详细说明，请参见图1至图11所示的实施例中关于外壳结构的详细说明。在图12所示的实施例中，图12所示的终端设备可以为笔记本电脑等设备。

Claims (10)

  1. 一种外壳结构，其特征在于，包括底壳和抬壳；
    所述底壳的第一端与所述抬壳的第一端相连接，所述底壳的第二端与所述抬壳的第二端间隔第一距离，所述底壳与所述抬壳之间的空间形成散热通道；
    所述底壳上设置有散热板，所述散热板的第一表面与发热器件相接触，所述散热板的第二表面位于所述散热通道内。
  2. 根据权利要求1所述的外壳结构，其特征在于，还包括滑动组件；
    所述底壳的第一端与所述抬壳的第一端相互铰接，所述底壳的第二端与所述抬壳的第二端通过所述滑动组件连接；
    在所述抬壳的第二端与所述底壳的第二端通过所述滑动组件相对移动至间隔所述第一距离时，所述抬壳的第二端与所述底壳的第二端通过所述滑动组件固定连接。
  3. 根据权利要求2所述的外壳结构，其特征在于，所述滑动组件包括滑轴和滑动结构件，所述滑轴设置在所述底壳的第二端，所述滑动结构件设置在所述抬壳的第二端；
    所述滑动结构件上设置有相互连通的滑槽和卡槽，所述滑轴与所述滑槽和所述卡槽相适配；
    所述滑轴在所述滑动结构件的滑槽内滑动至所述卡槽内时，所述抬壳的第二端与所述底壳的第二端间隔第一距离，所述抬壳的第二端与所述底壳的第二端通过所述滑轴和所述卡槽固定连接。
  4. 根据权利要求2或3所述的外壳结构，其特征在于，所述底壳上设置有容纳所述抬壳的凹槽。
  5. 根据权利要求1所述的外壳结构，其特征在于，所述底壳的第一端与所述抬壳的第一端固定连接。
  6. 根据权利要求1至5任意一项所述的外壳结构，其特征在于，所述散热板的第一表面上还设置有导热材料和热管；
    所述散热板的第一表面通过所述导热材料和所述热管与所述发热器件相接触。
  7. 根据权利要求1至6任意一项所述的外壳结构，其特征在于，所述散热板的第二表面上还设置有散热翅片。
  8. 根据权利要求7任意一项所述的外壳结构，其特征在于，所述散热板的第二表面的散热翅片上还设置有散热风扇。
  9. 根据权利要求6至8任意一项所述的外壳结构，其特征在于，所述散热板上设置有至少一个通风孔。
  10. 一种终端设备，其特征在于，包括：如权利要求1至权利要求9任意一项所述的外壳结构。
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