WO2020147358A1

WO2020147358A1 - Multi-substrate alignment printing method and alignment printing machine

Info

Publication number: WO2020147358A1
Application number: PCT/CN2019/112501
Authority: WO
Inventors: 邱国良
Original assignee: 东莞市凯格精密机械有限公司
Priority date: 2019-01-14
Filing date: 2019-10-22
Publication date: 2020-07-23

Abstract

A multi-substrate alignment printing method and an alignment printing machine. The alignment printing machine comprises a rack, a platform module capable of lifting provided on the rack, conveying guide rails for conveying a jig loaded with multiple substrates to the center position of the printing machine, and a CCD module for sucking the substrates and imaging positioning; a lower suction nozzle platform is provided on the platform module; multiple lower suction nozzles are disposed on the lower suction nozzle platform at intervals; and the lower suction nozzle platform is located between the two conveying guide rails. According to the present invention, multiple lower suction nozzles and a single upper suction nozzle are used and are all controlled independently by electromagnetic valves, complete adjustment of each substrate requires the use of suction adjustment of the lower suction nozzles and the upper suction nozzle, and therefore, independent adjustment and printing of multiple substrates are implemented. The present product is detected and adjusted for multiple times by means of CCD, and the positions of the substrates and the position of a steel net are repeatedly confirmed, so that the printing positions of the substrates can be ensured.

Description

Multi-substrate alignment printing method and alignment printing machine

This application is required to be submitted to the Chinese Patent Office on January 14, 2019, the application number is 201910032200.8, the title of the invention is "a multi-substrate registration printing method and registration printing machine" and it is submitted to the China Patent Office on January 14, 2019 The priority of the Chinese patent application whose application number is 201920055870.7 and the invention title is "a multi-substrate alignment printing method and alignment printing machine", the entire content of which is incorporated into this application by reference.

Technical field

The invention relates to a printing machine, in particular to a multi-substrate registration printing method and a registration printing machine.

Background technique

The solder paste printer is generally composed of boards, solder paste, imprinting and transport circuit boards; its working principle is: first fix the circuit board to be printed on the printing positioning table, and then use the scraper of the printer to remove the tin Paste or red glue is printed on the corresponding pads through the stencil, and the evenly missed PCB is input to the placement machine through the transmission table for automatic placement; in the prior art, the SMT solder paste printing industry generally uses a single camera for soldering For the phase and alignment of the paste printer, the single camera needs to take the phase mark (Mark) twice or even three times on the printed substrate. After obtaining the coordinates of the printed substrate and calculating by the industrial control system, give instructions to the printing platform Move to the target position, and then start printing solder paste, red glue and other fluxes. Because of the work efficiency, the camera does not detect whether the printed circuit board has moved to the target position again, so this is an open loop process. Realize precise closed-loop control; the camera does not go back to the position of the first phase to check whether the printed circuit board is displaced to the target coordinates after the completion of the first relative positioning action, which makes it difficult to ensure the accuracy of its alignment. Moreover, the current existing printers generally print on a single substrate, which is low in efficiency.

Summary of the invention

The purpose of the present invention is to provide a multi-substrate registration printer for the above-mentioned defects of the prior art.

In order to solve the above-mentioned defects of the prior art, the technical solution provided by the present invention is: a multi-substrate alignment printing method, including the following steps:

(1) Multi-substrate conveying; the jig loaded with multiple substrates is transported to the printing position of the printer through the transport rail, and the transport rail stops the jig.

(2) The CCD module corrects the coincidence of the steel mesh and the fixture MARK; the CCD module first calibrates the coincidence of the steel mesh and the fixture MARK, and then positions each individual substrate MARK, and starts the correction after the positioning is completed.

Specifically, the CCD module is first calibrated to complete the coincidence of the steel mesh and the fixture MARK, and then the lower nozzle platform is lifted to the image capturing position. Each lower nozzle sucks a substrate. The CCD module MARKs each individual substrate. Positioning, start calibration after positioning.

(3) Substrate calibration; the lower nozzle platform is lifted by the lifting mechanism and sucks the substrate; the lower nozzle platform is provided with the same number of lower nozzles as the substrate, and the lower nozzle platform is lifted to the position of the upper nozzle suction plate. Each lower suction nozzle sucks a substrate, and the upper suction nozzle of the CCD module vacuum sucks one of the substrates. When the vacuum degree of the upper suction nozzle reaches the negative pressure value set by the digital negative pressure gauge, the lower suction nozzle releases the vacuum; The lower nozzle platform is lowered to the image capturing position to perform the correction action. After completion, the lower nozzle platform rises to the upper nozzle suction plate position and sucks the substrate. When the vacuum degree of the lower nozzle reaches the negative pressure value set by the digital negative pressure gauge After the upper suction nozzle releases the vacuum, the lower suction nozzle platform is lowered to the image capturing position again to complete the calibration of a substrate.

(4) Fixture return: the lower nozzle platform is lowered to the image capturing position, and the lower nozzle platform adjusts the entire substrate-loaded jig. After adjusting the substrate-loaded jig, the lower nozzle platform rises to close tightly. The position of the substrate, while the lower suction nozzle sucks the substrate, the upper suction nozzle on the CCD module releases the vacuum, the lower suction nozzle platform returns to the image capturing position, and the jig loaded with the substrate is adjusted back to the original position.

Since the lower nozzle platform adjusts the substrate, it will drive the jig to be adjusted together, so after the substrate is corrected, the jig needs to be adjusted to the original position again.

(5) Repeat the above steps (3) and (4) until each individual substrate is adjusted, and the upper suction nozzle rises to the original position.

As an improvement of the multi-substrate alignment printing method of the present invention, the CCD module detects the positioning of each substrate again. If the substrate positioning is not correct, repeat the above steps (3) and (4) again, Until each individual substrate is positioned.

As an improvement of the multi-substrate alignment printing method of the present invention, after the positioning of each individual substrate is completed, the lower nozzle platform rises to the printing position, the substrate is printed, and the platform is lowered after the printing is completed, and the jig loaded with the substrate is transported The guide rails are transported out of the printing press.

As an improvement of the multi-substrate alignment printing method of the present invention, each of the lower suction nozzles is connected to a solenoid valve, the vacuum of each lower suction nozzle is individually controlled, and the upper suction nozzle has one, which is separately connected to the solenoid valve, The vacuum of the upper nozzle is controlled separately, and the upper and lower nozzles are controlled separately.

The multi-substrate alignment printing method of the present invention can be adjusted for a printer that prints multiple substrates at the same time, and each substrate will be calibrated before printing, so that both the printing efficiency and the printing quality can be guaranteed.

Another object of the present invention is to provide a multi-substrate registration printer, including a frame, on which a platform module capable of lifting and lowering is provided for transporting a jig loaded with multiple substrates to the center of the printer Position of the transportation guide rail and the CCD module used to pick up the substrate for image capturing and positioning. The platform module is provided with a lower nozzle platform, and the lower nozzle platform is provided with a plurality of lower nozzles at intervals. The nozzle platform is located between the two transport rails.

As an improvement of the multi-substrate registration printer of the present invention, the number of the lower suction nozzles is the same as the number of substrates on the jig, and each lower suction nozzle is independently controlled by a solenoid valve. The lower suction nozzle corresponds to a substrate.

As an improvement of the multi-substrate alignment printer of the present invention, the CCD module includes an X-axis movement control device and a Y-axis movement control device. The X-axis movement control device is provided with a CCD, and one side of the CCD An upper suction nozzle and a digital negative pressure gauge are provided, the upper suction nozzle is independently controlled by a solenoid valve, and the X-axis movement control device is controlled to move by the Y-axis movement control device.

As an improvement of the multi-substrate registration printer of the present invention, a lifting mechanism is provided in the middle of the CCD, and the lifting mechanism controls the upper suction nozzle to move up and down.

As an improvement of the multi-substrate registration printer of the present invention, when the platform module lifts the lower suction nozzle to the image capturing position, the lower suction nozzle sucks the substrate, and the CCD module positions the steel mesh and The position of the fixture with the substrate.

As an improvement of the multi-substrate alignment printer of the present invention, the CCD module adjusts the position of each individual substrate until the positioning of each individual substrate is completed.

As an improvement of the multi-substrate alignment printer of the present invention, the CCD module first calibrates and completes the overlap of the steel mesh and the position recognition point of the jig, and then locates the position recognition point of each individual substrate. After the substrate positioning is completed Correction.

As an improvement of the multi-substrate registration printer of the present invention, a vacuum pump is provided on one side of the frame, and the vacuum pump is in communication with the solenoid valve.

The upper suction nozzle is lowered by the lifting mechanism, the platform module rises to a position close to the substrate, the upper suction nozzle vacuums the substrate, and when the negative pressure value set by the digital negative pressure gauge is reached, the The lower suction nozzle releases the vacuum, the platform module is lowered to the image capturing position, the platform module adjusts the entire substrate-loaded jig, after adjusting the substrate-loaded jig, the platform module rises to Close to the substrate position, the lower suction nozzle sucks the substrate, the upper suction nozzle releases the vacuum, the platform module returns to the imaging position, and the jig loaded with the substrate is adjusted back to the original position again; repeat the above actions until the adjustment is complete For each individual substrate, the upper suction nozzle rises to its original position. The CCD module detects the positioning of the substrate again. If the substrate is not correctly positioned, repeat the above actions again until the positioning of each individual substrate is completed. After the positioning is completed, the platform rises to the printing position, and the substrate is printed. After the printing is completed, the platform descends, and the jig loaded with the substrate is transported out of the printer through the transport rail.

The number of substrates on the jig loaded with substrates corresponds to the number of lower suction nozzles; each substrate corresponds to a lower suction nozzle, and each lower suction nozzle is connected to a solenoid valve and the vacuum is controlled separately. One solenoid valve cannot control everything. Down the nozzle. There is only one upper suction nozzle, which is also connected to the solenoid valve and vacuum control separately, and cannot be controlled together with the lower suction nozzle.

Compared with the prior art, the advantages of the present invention are: the present invention adopts multiple lower suction nozzles and a single upper suction nozzle, and the multiple lower suction nozzles and a single upper suction nozzle are independently controlled by solenoid valves, and each time a substrate is adjusted Both need to use the suction adjustment of the lower nozzle and the upper nozzle. Achieve individual adjustment and printing of multiple substrates. This product has passed multiple inspections and adjustments of the CCD, repeated confirmation of the position of the substrate and the steel mesh, to ensure the printing position of the substrate.

BRIEF DESCRIPTION

The present invention and its beneficial technical effects will be further described in detail below based on the drawings and specific embodiments, in which:

Figure 1 is a schematic diagram of the three-dimensional structure of the present invention.

Figure 2 is a schematic diagram of the CCD module structure.

Figure 3 is a schematic diagram of the structure of a digital negative pressure gauge.

Figure 4 is a schematic diagram of the structure after removing the CCD module.

Reference sign name: 1. Rack 2. Platform module 3. Transportation rail 4. CCD module 5. Lower nozzle platform 6. Lower nozzle 7. Solenoid valve 8. Vacuum pump 41. X-axis movement control device 42. Y-axis movement control device 43, digital negative pressure gauge 44, upper suction nozzle 45, lifting mechanism 46, CCD.

detailed description

The following further describes the present invention based on the drawings and specific embodiments, but the implementation of the present invention is not limited thereto.

A multi-substrate alignment printing method includes the following steps:

(1) Multi-substrate transportation; the jig loaded with multiple substrates is transported to the printing position of the printer through the transport rail, and the transport rail stops the transport of the jig;

(2) The CCD module corrects the coincidence of the steel mesh and the fixture MARK; the CCD module first calibrates the coincidence of the steel mesh and the fixture MARK, and then positions each individual substrate MARK, and starts the correction after the positioning is completed;

(3) Substrate calibration; the lower nozzle platform is lifted by the lifting mechanism and sucks the substrate; the lower nozzle platform is provided with the same number of lower nozzles as the substrate, and the lower nozzle platform is lifted to the position of the upper nozzle suction plate. Each lower suction nozzle sucks a substrate, and the upper suction nozzle of the CCD module vacuum sucks one of the substrates. When the vacuum degree of the upper suction nozzle reaches the negative pressure value set by the digital negative pressure gauge, the lower suction nozzle releases the vacuum;

(4) Fixture return: the lower nozzle platform is lowered to the image capturing position, and the lower nozzle platform adjusts the entire substrate-loaded jig. After adjusting the substrate-loaded jig, the lower nozzle platform rises to close tightly. The position of the substrate, while the lower suction nozzle sucks the substrate, the upper suction nozzle on the CCD module releases the vacuum, the lower nozzle platform returns to the imaging position, and the jig loaded with the substrate is adjusted back to the original position;

Preferably, the CCD module detects the positioning of each substrate again. If the positioning of the substrate is not correct, repeat the above-mentioned steps (3) and (4) again until the positioning of each individual substrate is completed.

Preferably, after the positioning of each individual substrate is completed, the lower nozzle platform rises to the printing position, the substrate is printed, and the platform is lowered after the printing is completed, and the jig loaded with the substrate is transported out of the printing machine through the transport rail.

Preferably, each of the lower suction nozzles is connected to a solenoid valve, the vacuum of each lower suction nozzle is individually controlled, and the upper suction nozzle has one, which is separately connected to the solenoid valve, and the vacuum of the upper suction nozzle is individually controlled. Separate control from the lower nozzle.

As shown in Figures 1 to 4, a multi-substrate alignment printer includes a frame 1, on which a platform module 2 that can be raised and lowered is provided for transporting a jig loaded with multiple substrates to printing The transportation guide 3 at the center of the machine and the CCD module 4 used for picking and positioning the substrate. The platform module 2 is provided with a lower nozzle platform 5, and the lower nozzle platform 5 is provided with a plurality of lower nozzles 6 at intervals. The lower nozzle platform 5 is located between the two transport rails 3.

Preferably, the number of lower suction nozzles 6 is the same as the number of substrates on the jig, each lower suction nozzle 6 is independently controlled by a solenoid valve 7, and each lower suction nozzle 6 corresponds to a substrate.

Preferably, the CCD module 4 includes an X-axis movement control device 41 and a Y-axis movement control device 42. The X-axis movement control device 41 is provided with a CCD 46, and one side of the CCD 46 is provided with an upper suction nozzle 44 and a digital negative pressure gauge 43. , The upper suction nozzle 44 is independently controlled by the solenoid valve 7, and the X-axis movement control device 41 is controlled by the Y-axis movement control device 42 to move. The Y-axis movement control device 42 includes two gantry brackets. The two gantry brackets are respectively erected on the frame. One of the gantry brackets is provided with a drive screw and a slide rail, and the other gantry bracket is provided with a slide rail. Driven by the motor, the X-axis movement control device 41 is connected to the slide rail and the drive screw. The X-axis movement control device 41 includes a beam. An X-axis slide rail is provided on one side of the beam. The CCD46 is connected to the X-axis slide rail. The CCD46 is provided with a Z-axis slider and a Z-axis slide rail. The upper suction nozzle 44 is set at On the Z-axis slider, the lifting mechanism 45 can control the upper suction nozzle 44 to move up and down.

Preferably, a lifting mechanism 45 is provided in the middle of the CCD 46, and the lifting mechanism 45 controls the upper suction nozzle 44 to move up and down.

Preferably, when the platform module 2 lifts the lower suction nozzle 6 to the image capturing position, the lower suction nozzle 6 sucks the substrate, and the CCD module 4 positions the steel mesh and the jig carrying the substrate.

Preferably, the CCD module 4 adjusts the position of each individual substrate until the positioning of each individual substrate is completed.

The CCD module 4 first calibrates to complete the coincidence of the steel mesh and the position identification point of the jig, and then locates the position identification point of each individual substrate, and performs calibration after the substrate positioning is completed.

Preferably, a vacuum pump 8 is provided on one side of the frame 1, and the vacuum pump 8 is in communication with the solenoid valve 7.

The upper suction nozzle 44 is lowered by the lifting mechanism 45, the platform module 2 rises to a position close to the substrate, the upper suction nozzle 44 vacuums the substrate, and when the negative pressure value set by the digital negative pressure gauge is reached, the lower suction nozzle 6 is released Vacuum, the platform module 2 lowers to the image capturing position, the platform module 2 adjusts the entire substrate-loaded jig, after adjusting the substrate-loaded jig, the platform module 2 rises to the position close to the substrate, and the suction nozzle 6 Suction the substrate, the upper suction nozzle 44 releases the vacuum, the platform module 2 is lowered back to the image capturing position, and the jig loaded with the substrate is adjusted back to the original position; the above actions are repeated until each individual substrate is adjusted. The suction nozzle 44 rises to the original position. The CCD module 4 detects the positioning of the substrate again. If the substrate is not correctly positioned, repeat the above actions again until the positioning of each individual substrate is completed. After the positioning is completed, the platform rises to the printing position, and the substrate is printed. After the printing is completed, the platform descends, and the jig loaded with the substrate is transported out of the printing machine through the transport guide 3.

The lower suction nozzle 6 corresponds to the number of substrates on the jig loaded with the substrate; each substrate corresponds to a lower suction nozzle 6, and each lower suction nozzle 6 is connected to a solenoid valve 7 and the vacuum is controlled separately, not one The solenoid valve 7 controls all the lower suction nozzles. There is one upper suction nozzle 44, which is also separately connected to the solenoid valve 7 and the vacuum control, and both the upper suction nozzle 44 and the lower suction nozzle 6 are controlled separately.

The present invention adopts multiple lower suction nozzles 6 and a single upper suction nozzle 44. The multiple lower suction nozzles 6 and the single upper suction nozzle 44 are independently controlled by the solenoid valve 7. Each adjustment of a substrate requires the use of the lower suction nozzle 6 and The suction adjustment of the upper suction nozzle 44. Achieve individual adjustment and printing of multiple substrates.

Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, and substitutions can be made to these embodiments without departing from the principle and structure of the present invention. And variations, the scope of the present invention is defined by the appended claims and their equivalents.

Claims

A multi-substrate alignment printing method is characterized by comprising the following steps:

(1) Multi-substrate transportation; the jig loaded with multiple substrates is transported to the printing position of the printer through the transport rail, and the transport rail stops the transport of the jig;

(2) The CCD module corrects the coincidence of the steel mesh and the fixture MARK; the CCD module first calibrates the coincidence of the steel mesh and the fixture MARK, and then positions each individual substrate MARK, and starts the correction after the positioning is completed;

(3) Substrate calibration; the lower nozzle platform is lifted by the lifting mechanism and sucks the substrate; the lower nozzle platform is provided with the same number of lower nozzles as the substrate, and the lower nozzle platform is lifted to the position of the upper nozzle suction plate. Each lower suction nozzle sucks a substrate, and the upper suction nozzle of the CCD module vacuum sucks one of the substrates. When the vacuum degree of the upper suction nozzle reaches the negative pressure value set by the digital negative pressure gauge, the lower suction nozzle releases the vacuum;

(4) Fixture return: the lower nozzle platform is lowered to the image capturing position, and the lower nozzle platform adjusts the entire substrate-loaded jig. After adjusting the substrate-loaded jig, the lower nozzle platform rises to close tightly. The position of the substrate, while the lower suction nozzle sucks the substrate, the upper suction nozzle on the CCD module releases the vacuum, the lower nozzle platform returns to the imaging position, and the jig loaded with the substrate is adjusted back to the original position;

(5) Repeat the above steps (3) and (4) until each individual substrate is adjusted, and the upper suction nozzle rises to the original position.
The multi-substrate alignment printing method according to claim 1, wherein the CCD module detects the positioning of each substrate again, and if the positioning of the substrate is not correct, repeat the above (3) and (4) again. ) Step action until each individual substrate is positioned.
The multi-substrate alignment printing method according to claim 2, wherein after the positioning of each individual substrate is completed, the lower nozzle platform rises to the printing position, and the substrate is printed. After the printing is completed, the platform is lowered, and the substrate is loaded. The jig is transported out of the printing machine through the transport rail.
The multi-substrate alignment printing method of claim 3, wherein each of the lower suction nozzles is connected to a solenoid valve, the vacuum of each lower suction nozzle is individually controlled, and the upper suction nozzle has one Connect the solenoid valve, the vacuum of the upper nozzle is controlled separately, and the upper and lower nozzles are controlled separately.
A multi-substrate registration printing machine, comprising a frame, characterized in that a platform module capable of lifting and lowering is provided on the frame, and a transportation guide rail for transporting a jig loaded with multiple substrates to the center of the printing machine And a CCD module for image capturing and positioning of the substrate. The platform module is provided with a lower nozzle platform, the lower nozzle platform is provided with a plurality of lower nozzles at intervals, and the lower nozzle platforms are located at two Between two transport rails.
The multi-substrate registration printer according to claim 5, wherein the number of the lower suction nozzles is the same as the number of the substrates on the fixture, and each of the lower suction nozzles is independent by a solenoid valve Control, each of the lower suction nozzles corresponds to a substrate.
The multi-substrate alignment printer according to claim 6, wherein the CCD module includes an X-axis movement control device and a Y-axis movement control device, and the X-axis movement control device is provided with a CCD, and the One side of the CCD is provided with an upper suction nozzle and a digital negative pressure gauge, the upper suction nozzle is independently controlled by a solenoid valve, and the X-axis movement control device is controlled to move by the Y-axis movement control device.
7. The multi-substrate registration printer according to claim 7, wherein a lifting mechanism is provided in the middle of the CCD, and the lifting mechanism controls the upper suction nozzle to move up and down.
The multi-substrate alignment printer according to claim 8, wherein when the platform module lifts the lower suction nozzle to the image capturing position, the lower suction nozzle sucks the substrate, and the CCD module Position the steel mesh and the jig carrying the substrate.
The multi-substrate alignment printer according to claim 9, wherein the CCD module adjusts the position of each individual substrate until the positioning of each individual substrate is completed.
The multi-substrate alignment printer according to claim 10, wherein the CCD module is first calibrated to complete the overlap of the steel mesh and the position recognition point of the jig, and then position the position recognition point of each individual substrate, and the substrate Correction is performed after positioning is completed.
The multi-substrate alignment printer according to claim 5, wherein a vacuum pump is provided on one side of the frame, and the vacuum pump is in communication with the solenoid valve.