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WO2020143204A1 - Calibration tooling, and device and method for measuring blind mating connector interfitting gap - Google Patents

Calibration tooling, and device and method for measuring blind mating connector interfitting gap Download PDF

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Publication number
WO2020143204A1
WO2020143204A1 PCT/CN2019/096093 CN2019096093W WO2020143204A1 WO 2020143204 A1 WO2020143204 A1 WO 2020143204A1 CN 2019096093 W CN2019096093 W CN 2019096093W WO 2020143204 A1 WO2020143204 A1 WO 2020143204A1
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Prior art keywords
connector
displacement sensor
displacement
disk
machine
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PCT/CN2019/096093
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French (fr)
Chinese (zh)
Inventor
何丽平
周海
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烽火通信科技股份有限公司
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Priority to BR112021007703-0A priority Critical patent/BR112021007703B1/en
Publication of WO2020143204A1 publication Critical patent/WO2020143204A1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/16Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring distance of clearance between spaced objects

Definitions

  • the invention relates to the field of measuring the interworking gap between the machine board and the backplane connector, in particular to a measuring device and method for the interworking gap of the blind plug connector.
  • the interworking gap (Demated value) between the chassis connector and the sub-frame backplane connector directly affects the reliability of the product. Many signal failures are related to this value being too large.
  • the Demated value is specifically shown in Figures 1 and 2.
  • the factors that affect the Demated value include the machining and assembly errors of the machine board, the machining and assembly errors of the sub-frame, and the deformation of the machine board after insertion and removal of the backplane. All the influencing factors are normally distributed. How to accurately and efficiently measure the Demated value has become an urgent problem to be solved in the design and manufacture of high-end equipment.
  • the Demated value mainly measures the distance from the machine panel to the backplane and the distance from the machine panel to the machine connector through a depth ruler, and calculates the interworking gap of the connector based on the thickness value of the backplane connector shell bottom.
  • the object of the present invention is to provide a measurement device for the gap of the blind mating connector, which can avoid the problem of poor measurement data consistency caused by multiple measurements and multiple calculations. It is not limited by the test conditions, the whole test tooling is simple and easy to operate, the test efficiency is high, and the test accuracy is high.
  • a measuring device for inter-matching gap of blind plug connectors including:
  • the calibration tooling is provided with a groove, and the depth S of the groove is the length of the part of the pin on the backplane connector for mating with the signal connector on the backplane connector plus the thickness of the bottom of the backplane connector shell;
  • Analog machine disk which includes,
  • At least one displacement sensor which is fixed on the disk body and is arranged adjacent to one of the machine disk connectors, and the portion of the displacement sensor extending from the disk body exceeds the length of the machine disk connector Slightly larger than the depth S;
  • the displacement sensor when the calibration tool is attached to the simulated machine disk, the displacement sensor can be extended into the groove, and at least one machine board connector can be held against The step surface of the groove.
  • the displacement tester is also used to clear the data read when the calibration tool is attached to the simulated machine disk.
  • the simulated machine disk includes three displacement sensors.
  • the measuring device further includes an operating platform for receiving the simulated machine disk.
  • another object of the present invention is to provide a calibration tooling, which can avoid the problem of poor measurement data consistency caused by multiple measurements and multiple calculations, and is not limited by the test conditions.
  • the entire test tooling Simple and easy to operate, high test efficiency and high test accuracy.
  • a calibration tool is used to assist in measuring the interworking gap between the machine disk connector and the backplane connector.
  • the calibration tool is provided with a groove, and the depth S of the groove is the signal pin on the backplane connector.
  • the pin length of the connector of the machine board connector is connected to the thickness of the bottom of the backplane connector shell.
  • another object of the present invention is to provide a calibration tooling, which can avoid the problem of poor measurement data consistency caused by multiple measurements and multiple calculations, and is not limited by the test conditions.
  • the entire test tooling Simple and easy to operate, high test efficiency and high test accuracy.
  • a method for measuring the inter-matching gap using the above measurement device includes the following steps:
  • the calibration tool is attached to the simulated machine disk so that the displacement sensor extends into the groove, and at least one machine disk connector is pressed against the step of the groove On the surface, the pre-compression amount t1 of the displacement sensor at this time is read by the displacement tester.
  • a displacement tester is used to clear the pre-compression amount t1 of the displacement sensor.
  • the simulated machine disk includes three displacement sensors, and the three displacement sensors are used to respectively measure the corresponding pre-compression amount t1 and displacement value t2.
  • the measurement device of the blind mating connector inter-matching gap of the present invention only requires fewer measurement calculations, and the consistency of the measurement data is better, because The S value is known in advance (the measurement is simple and convenient, and there is no limit to the test space).
  • the displacement sensor and displacement tester are needed to measure t1 and t2.
  • the entire test tooling is simple and easy to operate, and the test efficiency is high.
  • t1 is measured, which eliminates the nonlinear part of the front end of the displacement sensor, and adopts the measurement method of the combination of the displacement sensor and the displacement tester. Compared with the existing test method, it can only reach 0.1mm.
  • the measurement method in the present invention can It reaches 0.01mm, which can meet the measurement accuracy requirements.
  • the measuring device of the blind mating connector interworking gap of the present invention can flexibly select multiple test points by setting multiple displacement sensors to determine the position and trend of the worst DEMATED value, making the measurement results more reliable .
  • Figure 1 is a schematic plan view of the Demated value of the interworking gap
  • Figure 2 is a perspective schematic view of the Demated value of the interworking gap
  • Figure 3 is a schematic diagram of the relevant dimensions when measuring the Demated value with a depth ruler
  • FIG. 4 is a schematic structural diagram of a measurement device in an embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of a calibration tooling in an embodiment of the present invention.
  • FIG. 7 is a schematic diagram of calibration tooling and simulated machine board testing in an embodiment of the present invention.
  • FIG. 8 is a schematic diagram of t1 and t2 during the test process of the subrack to be tested in the embodiment of the present invention.
  • an embodiment of the present invention provides a measurement device for a blind mating connector inter-matching gap, which includes a calibration tool 1 and an analog machine board 2.
  • the calibration tool 1 is provided with a groove 11, and the depth S of the groove 11 is the length of the part of the pin used for butting the signal pin on the backplane connector and the chassis connector plus the thickness of the bottom of the backplane connector shell .
  • Analog machine board 2 which includes,
  • At least one displacement sensor 22 which is fixed on the disk body 21, and is arranged adjacent to one of the machine disk connectors, and the portion of the displacement sensor 22 that protrudes from the disk body 21 exceeds the machine disk
  • the length of the connector is slightly larger than the depth S;
  • the measurement device in this embodiment further includes an operation platform 3, which is mainly used to provide a test platform, and is used to hold the simulation machine board 2 in actual use.
  • This S value refers to the length of the part of the pin on the backplane connector that is used for the docking of the signal pin and the chassis connector plus the thickness of the bottom of the backplane connector shell.
  • the bottom of the connector shell is the boundary.
  • the part of the pin length on the backplane connector that is used for the docking of the signal pin with the chassis connector refers to the part located on the left side of the bottom of the backplane connector shell.
  • This S value can be measured in advance. After the S value is obtained, the calibration tool 1 can be made based on the S value, and the depth of the groove 11 of the calibration tool 1 is S.
  • the simulated machine board 2 refers to a machine board manufactured according to the structure size of the actual machine board, the model and the number of the machine board connectors, and can simulate the situation when the actual machine board is inserted.
  • the portion of the displacement sensor 22 that protrudes from the disk body 21 exceeds the length of the machine disk connector and is slightly larger than the depth S. The effect it has is that the displacement sensor 22 will be located in the groove 11 A little bit of pre-compression amount t1 is generated. This pre-compression amount t1 is mainly to eliminate the nonlinear part of the front end of the displacement sensor 22, and can be set reasonably according to the actual situation.
  • an embodiment of the present invention provides a measurement device for a blind mating connector inter-matching gap, which includes a calibration tool 1 and an analog machine board 2.
  • the calibration tool 1 is provided with a groove 11, and the depth S of the groove 11 is the length of the part of the pin used for butting the signal pin on the backplane connector and the chassis connector plus the thickness of the bottom of the backplane connector shell .
  • Analog machine board 2 which includes,
  • At least one displacement sensor 22 which is fixed on the disk body 21, and is arranged adjacent to one of the machine disk connectors, and the portion of the displacement sensor 22 that protrudes from the disk body 21 exceeds the machine disk
  • the length of the connector is slightly larger than the depth S;
  • the displacement sensor 22 can be extended into the groove 11 and at least one machine board connector can be held against The step surface of the groove 11 is described.
  • the two machine disk connectors adjacent to the displacement sensor 22 bear against the stepped surface of the groove 11 so that the measurement will be more accurate.
  • an embodiment of the present invention provides a measurement device for a blind mating connector inter-matching gap, which includes a calibration tool 1 and an analog machine board 2.
  • the calibration tool 1 is provided with a groove 11, and the depth S of the groove 11 is the length of the part of the pin used for butting the signal pin on the backplane connector and the chassis connector plus the thickness of the bottom of the backplane connector shell .
  • Analog machine board 2 which includes,
  • At least one displacement sensor 22 which is fixed on the disk body 21, and is arranged adjacent to one of the machine disk connectors, and the portion of the displacement sensor 22 that protrudes from the disk body 21 exceeds the machine disk
  • the length of the connector is slightly larger than the depth S;
  • displacement tester 23 is also used to clear the data read when the calibration tool 1 and the simulation machine plate 2 are attached.
  • the value of T can be directly obtained by reading the displacement value of the displacement sensor 22 (in this case, t2).
  • an embodiment of the present invention provides a measurement device for a blind mating connector inter-matching gap, which includes a calibration tool 1 and an analog machine board 2.
  • the calibration tooling 1 has
  • a groove 11, the depth S of the groove 11 is the length of a part of the pin used for butt connection between the signal pin on the backplane connector and the chassis connector plus the thickness of the bottom of the backplane connector shell.
  • Analog machine board 2 which includes,
  • At least one displacement sensor 22 which is fixed on the disk body 21, and is arranged adjacent to one of the machine disk connectors, and the portion of the displacement sensor 22 that protrudes from the disk body 21 exceeds the machine disk
  • the length of the connector is slightly larger than the depth S;
  • simulation machine board 2 includes three displacement sensors 22.
  • test points can be flexibly selected to determine the position and trend of the worst DEMATED value, making the measurement results more reliable.
  • an embodiment of the present invention provides a calibration tool 1 for assisting in measuring the interworking gap between a machine disk connector and a backplane connector.
  • the calibration tool 1 is provided with a groove 11.
  • the depth S of the groove 11 is the length of the part of the pin on the backplane connector used for butt connection between the signal pin and the chassis connector plus the thickness of the bottom of the backplane connector shell.
  • An embodiment of the present invention provides a method for measuring an interworking gap using the measurement device in Embodiment 1, the method includes the following steps:
  • An embodiment of the present invention provides a method for measuring an interworking gap using the measurement device in Embodiment 1, the method includes the following steps:
  • the calibration tool 1 is attached to the simulated machine board 2 so that the displacement sensor 22 extends into the groove 11 while at least one machine board connector is held against the step of the groove 11
  • the displacement tester 23 reads the pre-compression amount t1 of the displacement sensor 22 at this time.
  • the two machine disk connectors adjacent to the displacement sensor 22 bear against the stepped surface of the groove 11 so that the measurement will be more accurate.
  • the displacement tester 23 is used to clear the pre-compression amount t1 of the displacement sensor 22.
  • the value of T can be directly obtained by reading the displacement value of the displacement sensor 22 (in this case, t2).
  • An embodiment of the present invention provides a method for measuring an interworking gap using the measurement device in Embodiment 1, the method includes the following steps:
  • the simulated machine disk 2 includes three displacement sensors 22, and the three displacement sensors 22 are used to respectively measure the corresponding pre-compression amount t1 and displacement value t2.
  • test points can be flexibly selected to determine the position and trend of the worst DEMATED value, making the measurement results more reliable.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)

Abstract

A device and method for measuring a blind mating connector interfitting gap, comprising: calibration tooling (1) which is provided thereon with a groove (11), the depth S of the groove (11) being a partial pin length of a signal pin on a backplane connector for docking with a machine disk connector plus the thickness of the casing bottom of the backplane connector; and a simulation machine disk (2). The simulation machine disk (2) comprises: a disk body (21); a plurality of machine disk connectors which are each fixed on the disk body (21); at least one displacement sensor (22) which is fixed on the simulation machine disk (2) and arranged adjacent to one machine disk connector, the length of a part of the displacement sensor (22) that protrudes from the simulation machine disk (2) beyond the machine disk connector being slightly greater than the depth S; and a displacement tester (23) which is connected to the displacement sensor (22) and used for reading data of the displacement sensor (22). The device for measuring the blind mating connector interfitting gap may avoid the problem of poor measurement data consistency caused by multiple measurements and multiple calculations, and is not limited by the test conditions. The entire test tooling is simple and easy to operate, has high testing efficiency and high testing accuracy.

Description

一种校准工装、盲插连接器互配间隙的测量装置及方法Measuring device and method for calibrating tooling and blind mating connector inter-matching gap 技术领域Technical field
本发明涉及机盘与背板连接器互配间隙测量领域,具体涉及一种盲插连接器互配间隙的测量装置及方法。The invention relates to the field of measuring the interworking gap between the machine board and the backplane connector, in particular to a measuring device and method for the interworking gap of the blind plug connector.
背景技术Background technique
机盘连接器与子框背板连接器的互配间隙(Demated值)直接影响到产品的可靠性,很多信号故障与该值偏大有关。Demated值具体参考图1和图2所示,影响Demated值的因素包括机盘的加工及装配误差、子框的加工及装配误差、机盘插拔背板受力后的变形等。所有影响因素处于正态分布状态,如何准确、高效测量Demated值,成为高端设备设计、制造迫切需要解决的问题。The interworking gap (Demated value) between the chassis connector and the sub-frame backplane connector directly affects the reliability of the product. Many signal failures are related to this value being too large. The Demated value is specifically shown in Figures 1 and 2. The factors that affect the Demated value include the machining and assembly errors of the machine board, the machining and assembly errors of the sub-frame, and the deformation of the machine board after insertion and removal of the backplane. All the influencing factors are normally distributed. How to accurately and efficiently measure the Demated value has become an urgent problem to be solved in the design and manufacture of high-end equipment.
由于机盘与背板处在互配状态下,几乎没有足够测试空间借助目前已有的设备和工具直接完成机盘与背板Demated值的测试。Because the machine board and the backplane are in a mutually matched state, there is almost no enough test space to directly complete the test of the machine board and the backplane Demated value with the help of currently available equipment and tools.
目前Demated值主要通过深度尺测量机盘面板到背板的距离、机盘面板到机盘连接器的距离,结合背板连接器壳底的厚度值计算出连接器的互配间隙。At present, the Demated value mainly measures the distance from the machine panel to the backplane and the distance from the machine panel to the machine connector through a depth ruler, and calculates the interworking gap of the connector based on the thickness value of the backplane connector shell bottom.
参见图3所示,深度尺测量Demated值具体过程如下:As shown in Figure 3, the specific process of measuring the Demated value by the depth ruler is as follows:
(1)测量机盘面板到机盘连接器的距离T1;(1) Measure the distance T1 between the machine panel and the connector of the machine;
(2)测量机盘面板到背板的距离T2;(2) Measure the distance T2 between the machine panel and the backplane;
(3)计算T=T2-T1;(3) Calculate T=T2-T1;
(4)测量背板连接器壳底的厚度H;(4) Measure the thickness H of the bottom shell of the backplane connector;
(5)计算Demated值:D=T-H。(5) Calculate the Demated value: D=T-H.
由上述过程可知,采用深度尺测量Demated值,需要两次测量后再经过计算得到。其不仅受测试条件的限制,而且测量数据的一致性太差,不能满足连接器的互配间隙的测量精度要求。It can be seen from the above process that using the depth ruler to measure the Demated value requires two measurements before calculation. It is not only limited by the test conditions, but also the consistency of the measurement data is too poor to meet the measurement accuracy requirements of the inter-gap of the connector.
发明内容Summary of the invention
针对现有技术中存在的缺陷,本发明的目的在于提供一种盲插连接器互配间隙的测量装置,其能避免多次测量和多次计算带来的测量数据一致性较差的问题,且不受测试条件的限制,整个测试工装简单、易操作,测试效率高,测试精度高。In view of the defects in the prior art, the object of the present invention is to provide a measurement device for the gap of the blind mating connector, which can avoid the problem of poor measurement data consistency caused by multiple measurements and multiple calculations. It is not limited by the test conditions, the whole test tooling is simple and easy to operate, the test efficiency is high, and the test accuracy is high.
为达到以上目的,本发明采取的技术方案是:To achieve the above objectives, the technical solutions adopted by the present invention are:
一种盲插连接器互配间隙的测量装置,包括:A measuring device for inter-matching gap of blind plug connectors, including:
校准工装,其上设有一个凹槽,所述凹槽的深度S为背板连接器上信号针与机盘连接器对接用的部分针长加上背板连接器壳底的厚度;以及The calibration tooling is provided with a groove, and the depth S of the groove is the length of the part of the pin on the backplane connector for mating with the signal connector on the backplane connector plus the thickness of the bottom of the backplane connector shell; and
模拟机盘,其包括,Analog machine disk, which includes,
-盘体;-Plate body;
-多个机盘连接器,其均固定在所述盘体上;-Multiple machine disk connectors, all of which are fixed on the disk body;
-至少一个位移传感器,其固定在所述盘体上,并与一个所述机盘连接器相邻设置,且所述位移传感器伸出所述盘体的部分超出所述机盘连接器的长度略大于所述深度S;-At least one displacement sensor, which is fixed on the disk body and is arranged adjacent to one of the machine disk connectors, and the portion of the displacement sensor extending from the disk body exceeds the length of the machine disk connector Slightly larger than the depth S;
-位移测试仪,其与所述位移传感器相连,用于读取所述位移传感器的数据。-A displacement tester, which is connected to the displacement sensor and used to read the data of the displacement sensor.
在上述技术方案的基础上,当所述校准工装与所述模拟机盘贴合时,可使所述位移传感器伸入所述凹槽内,且使至少一个所述机盘连接器抵持在所述凹槽的台阶面上。On the basis of the above technical solution, when the calibration tool is attached to the simulated machine disk, the displacement sensor can be extended into the groove, and at least one machine board connector can be held against The step surface of the groove.
在上述技术方案的基础上,所述位移测试仪还用于将所述校准工 装与模拟机盘贴合时所读取的数据清零。On the basis of the above technical solution, the displacement tester is also used to clear the data read when the calibration tool is attached to the simulated machine disk.
在上述技术方案的基础上,所述模拟机盘包括三个位移传感器。On the basis of the above technical solution, the simulated machine disk includes three displacement sensors.
在上述技术方案的基础上,所述测量装置还包括用于承放模拟机盘的操作台。On the basis of the above technical solution, the measuring device further includes an operating platform for receiving the simulated machine disk.
与此同时,本发明的另一个目的在于提供一种校准工装,其能避免多次测量和多次计算带来的测量数据一致性较差的问题,且不受测试条件的限制,整个测试工装简单、易操作,测试效率高,测试精度高。At the same time, another object of the present invention is to provide a calibration tooling, which can avoid the problem of poor measurement data consistency caused by multiple measurements and multiple calculations, and is not limited by the test conditions. The entire test tooling Simple and easy to operate, high test efficiency and high test accuracy.
一种校准工装,用于辅助测量机盘连接器与背板连接器的互配间隙,所述校准工装上设有一个凹槽,所述凹槽的深度S为背板连接器上信号针与机盘连接器对接用的部分针长加上背板连接器壳底的厚度。A calibration tool is used to assist in measuring the interworking gap between the machine disk connector and the backplane connector. The calibration tool is provided with a groove, and the depth S of the groove is the signal pin on the backplane connector. The pin length of the connector of the machine board connector is connected to the thickness of the bottom of the backplane connector shell.
与此同时,本发明的另一个目的在于提供一种校准工装,其能避免多次测量和多次计算带来的测量数据一致性较差的问题,且不受测试条件的限制,整个测试工装简单、易操作,测试效率高,测试精度高。At the same time, another object of the present invention is to provide a calibration tooling, which can avoid the problem of poor measurement data consistency caused by multiple measurements and multiple calculations, and is not limited by the test conditions. The entire test tooling Simple and easy to operate, high test efficiency and high test accuracy.
一种利用上述测量装置测量互配间隙的方法,该方法包括以下步骤:A method for measuring the inter-matching gap using the above measurement device, the method includes the following steps:
将校准工装与模拟机盘贴合,利用校准工装上的凹槽以及模拟机盘,读取此时的位移传感器的预压缩量t1;Fit the calibration tool and the simulation machine disk, and use the groove on the calibration tool and the simulation machine disk to read the pre-compression amount t1 of the displacement sensor at this time;
将模拟机盘插入待测子架,读取位移传感器的位移值t2;Insert the simulated machine disk into the sub-rack to be tested, and read the displacement value t2 of the displacement sensor;
计算机盘连接器实际插入背板连接器的行程T=t2-t1;The stroke T of the computer disk connector actually inserted into the backplane connector is t=t2-t1;
计算互配间隙:Demated值=S-T。Calculate the interworking gap: Demated value = S-T.
在上述技术方案的基础上,将校准工装与模拟机盘贴合,使所述位移传感器伸入所述凹槽内,同时使至少一个所述机盘连接器抵持在 所述凹槽的台阶面上,并由位移测试仪读取此时的位移传感器的预压缩量t1。On the basis of the above technical solution, the calibration tool is attached to the simulated machine disk so that the displacement sensor extends into the groove, and at least one machine disk connector is pressed against the step of the groove On the surface, the pre-compression amount t1 of the displacement sensor at this time is read by the displacement tester.
在上述技术方案的基础上,利用位移测试仪将位移传感器的预压缩量t1清零。On the basis of the above technical solutions, a displacement tester is used to clear the pre-compression amount t1 of the displacement sensor.
在上述技术方案的基础上,所述模拟机盘包括三个位移传感器,利用三个所述位移传感器分别测量对应的预压缩量t1和位移值t2。Based on the above technical solution, the simulated machine disk includes three displacement sensors, and the three displacement sensors are used to respectively measure the corresponding pre-compression amount t1 and displacement value t2.
与现有技术相比,本发明的优点在于:Compared with the prior art, the advantages of the present invention are:
(1)本发明的盲插连接器互配间隙的测量装置,和现有技术中深度尺测量Demated值相比,本申请仅需要测量计算的环节更少,测量数据的一致性较好,由于S值事先已知(其测量简单方便,没有测试空间的限制),实际测量时只需要利用位移传感器和位移测试仪测量t1和t2即可,整个测试工装简单、易操作,测试效率高,由于在测量过程中测量了t1,其消除了位移传感器前端非线性部分,并且采用位移传感器和位移测试仪结合的测量方式,相比现有测试方法只能达到0.1mm,本发明中的测量方法可以达到0.01mm,从而能满足测量精度要求。(1) Compared with the measurement of the Demated value of the depth ruler in the prior art, the measurement device of the blind mating connector inter-matching gap of the present invention only requires fewer measurement calculations, and the consistency of the measurement data is better, because The S value is known in advance (the measurement is simple and convenient, and there is no limit to the test space). In actual measurement, only the displacement sensor and displacement tester are needed to measure t1 and t2. The entire test tooling is simple and easy to operate, and the test efficiency is high. During the measurement process, t1 is measured, which eliminates the nonlinear part of the front end of the displacement sensor, and adopts the measurement method of the combination of the displacement sensor and the displacement tester. Compared with the existing test method, it can only reach 0.1mm. The measurement method in the present invention can It reaches 0.01mm, which can meet the measurement accuracy requirements.
(2)本发明的盲插连接器互配间隙的测量装置,其可以通过设置多个位移传感器来灵活的选择多个测试点,确定DEMATED值最差的位置及趋势,使得测量结果更为可靠。(2) The measuring device of the blind mating connector interworking gap of the present invention can flexibly select multiple test points by setting multiple displacement sensors to determine the position and trend of the worst DEMATED value, making the measurement results more reliable .
附图说明BRIEF DESCRIPTION
图1为互配间隙Demated值的平面示意图;Figure 1 is a schematic plan view of the Demated value of the interworking gap;
图2为互配间隙Demated值的立体示意图;Figure 2 is a perspective schematic view of the Demated value of the interworking gap;
图3为深度尺测量Demated值时相关尺寸示意图;Figure 3 is a schematic diagram of the relevant dimensions when measuring the Demated value with a depth ruler;
图4为本发明实施例中的测量装置的结构示意图;4 is a schematic structural diagram of a measurement device in an embodiment of the present invention;
图5为本发明实施例中S值的示意图;5 is a schematic diagram of the S value in an embodiment of the present invention;
图6为本发明实施例中校准工装的结构示意图;6 is a schematic structural diagram of a calibration tooling in an embodiment of the present invention;
图7为本发明实施例中校准工装与模拟机盘测试示意图;7 is a schematic diagram of calibration tooling and simulated machine board testing in an embodiment of the present invention;
图8为本发明实施例中待测子架测试过程中t1和t2的示意图。8 is a schematic diagram of t1 and t2 during the test process of the subrack to be tested in the embodiment of the present invention.
图中:1-校准工装,11-凹槽,2-模拟机盘,21-盘体,22-位移传感器,23-位移测试仪,3-操作台,4-待测子架。In the picture: 1-calibration tooling, 11-groove, 2-simulation machine disk, 21-disk body, 22-displacement sensor, 23-displacement tester, 3-operating table, 4-subrack to be tested.
具体实施方式detailed description
以下结合附图及实施例对本发明作进一步详细说明。The present invention will be further described in detail below with reference to the drawings and embodiments.
实施例1:Example 1:
参见图4至图8所示,本发明实施例提供一种盲插连接器互配间隙的测量装置,其包括校准工装1和模拟机盘2。As shown in FIGS. 4 to 8, an embodiment of the present invention provides a measurement device for a blind mating connector inter-matching gap, which includes a calibration tool 1 and an analog machine board 2.
其中,校准工装1上设有一个凹槽11,所述凹槽11的深度S为背板连接器上信号针与机盘连接器对接用的部分针长加上背板连接器壳底的厚度。Wherein, the calibration tool 1 is provided with a groove 11, and the depth S of the groove 11 is the length of the part of the pin used for butting the signal pin on the backplane connector and the chassis connector plus the thickness of the bottom of the backplane connector shell .
模拟机盘2,其包括, Analog machine board 2, which includes,
-盘体21;-Plate body 21;
-多个机盘连接器,其均固定在所述盘体21上;-A plurality of machine disk connectors, all of which are fixed on the disk body 21;
-至少一个位移传感器22,其固定在所述盘体21上,并与一个所述机盘连接器相邻设置,且所述位移传感器22伸出所述盘体21的部分超出所述机盘连接器的长度略大于所述深度S;-At least one displacement sensor 22, which is fixed on the disk body 21, and is arranged adjacent to one of the machine disk connectors, and the portion of the displacement sensor 22 that protrudes from the disk body 21 exceeds the machine disk The length of the connector is slightly larger than the depth S;
-位移测试仪23,其与所述位移传感器22相连,用于读取所述位移传感器22的数据。-A displacement tester 23, which is connected to the displacement sensor 22 and used to read the data of the displacement sensor 22.
进一步地,本实施例中的测量装置还包括操作台3,操作台3主要是用来提供测试平台用的,实际使用过程中,是用来承放模拟机盘2的。Further, the measurement device in this embodiment further includes an operation platform 3, which is mainly used to provide a test platform, and is used to hold the simulation machine board 2 in actual use.
下面对本实施例中的测量装置的原理进行介绍:The principle of the measuring device in this embodiment is introduced below:
参见图5所示,首先定义一个S值,这个S值指的是背板连接器上信号针与机盘连接器对接用的部分针长加上背板连接器壳底的厚度,以背板连接器壳底为边界,背板连接器上信号针与机盘连接器对接用的部分针长指的是位于背板连接器壳底左边的部分。这个S值可以事先测量出来,得到S值后,便可以以S值为基准,制作校准工装1,而校准工装1的凹槽11深度就是S。As shown in Figure 5, first define an S value. This S value refers to the length of the part of the pin on the backplane connector that is used for the docking of the signal pin and the chassis connector plus the thickness of the bottom of the backplane connector shell. The bottom of the connector shell is the boundary. The part of the pin length on the backplane connector that is used for the docking of the signal pin with the chassis connector refers to the part located on the left side of the bottom of the backplane connector shell. This S value can be measured in advance. After the S value is obtained, the calibration tool 1 can be made based on the S value, and the depth of the groove 11 of the calibration tool 1 is S.
然后将校准工装1和模拟机盘2对接,使位移传感器22位于凹槽11内。模拟机盘2指的是按照实际机盘结构尺寸、机盘连接器的型号和数量而制作的机盘,其能够模拟实际机盘插入时的情形。本实施例中的位移传感器22伸出所述盘体21的部分超出所述机盘连接器的长度略大于所述深度S,其所要起到的效果就是位移传感器22位于凹槽11内后会产生一点点预压缩量t1,这个预压缩量t1主要是为了消除位移传感器22前端非线性部分,可以根据实际情况合理设置。Then, the calibration tool 1 and the simulation machine board 2 are docked, so that the displacement sensor 22 is located in the groove 11. The simulated machine board 2 refers to a machine board manufactured according to the structure size of the actual machine board, the model and the number of the machine board connectors, and can simulate the situation when the actual machine board is inserted. In this embodiment, the portion of the displacement sensor 22 that protrudes from the disk body 21 exceeds the length of the machine disk connector and is slightly larger than the depth S. The effect it has is that the displacement sensor 22 will be located in the groove 11 A little bit of pre-compression amount t1 is generated. This pre-compression amount t1 is mainly to eliminate the nonlinear part of the front end of the displacement sensor 22, and can be set reasonably according to the actual situation.
然后,再将模拟机盘2插入到待测子架4中去实际测量互配间隙Demated值,通过读取位移传感器22的位移值t2,由t1和t2即可求得机盘连接器实际插入背板连接器的行程T=t2-t1。从而便可以求得Demated值=S-T。Then, insert the simulated chuck 2 into the sub-rack 4 to be measured to actually measure the value of the inter-matching gap. By reading the displacement value t2 of the displacement sensor 22, the actual insertion of the chuck connector can be obtained from t1 and t2. The backplane connector travel T=t2-t1. Thus, the value of Demated = S-T can be obtained.
综上所述,和现有技术中深度尺测量Demated值相比,本申请仅需要测量计算的环节更少,测量数据的一致性较好,由于S值事先已知其测量简单方便,没有测试空间的限制,实际测量时只需要利用位移传感器22和位移测试仪23测量t1和t2即可,整个测试工装简单、易操作,测试效率高,由于在测量过程中测量了t1,其消除了位移传感器22前端非线性部分,并且采用位移传感器22和位移测试仪23结合的测量方式,相比现有测试方法只能达到0.1mm,本实施例中的测量方法可以达到0.01mm,从而能满足测量精度要求。In summary, compared with the measurement of the Demated value by the depth ruler in the prior art, this application only requires fewer measurement and calculation steps, and the consistency of the measurement data is better. Because the S value is known in advance, the measurement is simple and convenient, and there is no test Due to space constraints, only the displacement sensor 22 and displacement tester 23 are needed to measure t1 and t2 during actual measurement. The entire test tool is simple and easy to operate, and the test efficiency is high. Since t1 is measured during the measurement process, it eliminates displacement The nonlinear part of the front end of the sensor 22, and the measurement method using the combination of the displacement sensor 22 and the displacement tester 23 can only reach 0.1mm compared to the existing test method, and the measurement method in this embodiment can reach 0.01mm, which can satisfy the measurement Precision requirements.
实施例2:Example 2:
参见图4至图8所示,本发明实施例提供一种盲插连接器互配间隙的测量装置,其包括校准工装1和模拟机盘2。As shown in FIGS. 4 to 8, an embodiment of the present invention provides a measurement device for a blind mating connector inter-matching gap, which includes a calibration tool 1 and an analog machine board 2.
其中,校准工装1上设有一个凹槽11,所述凹槽11的深度S为背板连接器上信号针与机盘连接器对接用的部分针长加上背板连接器壳底的厚度。Wherein, the calibration tool 1 is provided with a groove 11, and the depth S of the groove 11 is the length of the part of the pin used for butting the signal pin on the backplane connector and the chassis connector plus the thickness of the bottom of the backplane connector shell .
模拟机盘2,其包括, Analog machine board 2, which includes,
-盘体21;-Plate body 21;
-多个机盘连接器,其均固定在所述盘体21上;-A plurality of machine disk connectors, all of which are fixed on the disk body 21;
-至少一个位移传感器22,其固定在所述盘体21上,并与一个所述机盘连接器相邻设置,且所述位移传感器22伸出所述盘体21的部分超出所述机盘连接器的长度略大于所述深度S;-At least one displacement sensor 22, which is fixed on the disk body 21, and is arranged adjacent to one of the machine disk connectors, and the portion of the displacement sensor 22 that protrudes from the disk body 21 exceeds the machine disk The length of the connector is slightly larger than the depth S;
-位移测试仪23,其与所述位移传感器22相连,用于读取所述位移传感器22的数据。-A displacement tester 23, which is connected to the displacement sensor 22 and used to read the data of the displacement sensor 22.
进一步地,当所述校准工装1与所述模拟机盘2贴合时,可使所述位移传感器22伸入所述凹槽11内,且使至少一个所述机盘连接器抵持在所述凹槽11的台阶面上。Further, when the calibration tool 1 is attached to the simulated machine board 2, the displacement sensor 22 can be extended into the groove 11 and at least one machine board connector can be held against The step surface of the groove 11 is described.
优选地,与所述位移传感器22相邻的两个机盘连接器抵持在所述凹槽11的台阶面上,这样测量时会更准确。Preferably, the two machine disk connectors adjacent to the displacement sensor 22 bear against the stepped surface of the groove 11 so that the measurement will be more accurate.
实施例3:Example 3:
参见图4至图8所示,本发明实施例提供一种盲插连接器互配间隙的测量装置,其包括校准工装1和模拟机盘2。As shown in FIGS. 4 to 8, an embodiment of the present invention provides a measurement device for a blind mating connector inter-matching gap, which includes a calibration tool 1 and an analog machine board 2.
其中,校准工装1上设有一个凹槽11,所述凹槽11的深度S为背板连接器上信号针与机盘连接器对接用的部分针长加上背板连接器壳底的厚度。Wherein, the calibration tool 1 is provided with a groove 11, and the depth S of the groove 11 is the length of the part of the pin used for butting the signal pin on the backplane connector and the chassis connector plus the thickness of the bottom of the backplane connector shell .
模拟机盘2,其包括, Analog machine board 2, which includes,
-盘体21;-Plate body 21;
-多个机盘连接器,其均固定在所述盘体21上;-A plurality of machine disk connectors, all of which are fixed on the disk body 21;
-至少一个位移传感器22,其固定在所述盘体21上,并与一个所述机盘连接器相邻设置,且所述位移传感器22伸出所述盘体21的部分超出所述机盘连接器的长度略大于所述深度S;-At least one displacement sensor 22, which is fixed on the disk body 21, and is arranged adjacent to one of the machine disk connectors, and the portion of the displacement sensor 22 that protrudes from the disk body 21 exceeds the machine disk The length of the connector is slightly larger than the depth S;
-位移测试仪23,其与所述位移传感器22相连,用于读取所述位移传感器22的数据。-A displacement tester 23, which is connected to the displacement sensor 22 and used to read the data of the displacement sensor 22.
进一步地,所述位移测试仪23还用于将所述校准工装1与模拟机盘2贴合时所读取的数据清零。Further, the displacement tester 23 is also used to clear the data read when the calibration tool 1 and the simulation machine plate 2 are attached.
这里所述的将所读取的数据清零,指的是将预压缩量t1清零,因为在测量机盘连接器实际插入背板连接器的行程T时,由于T=t2-t1,将预压缩量t1清零可以让T读取更方便,在预压缩量t1被清零的情形下,T的值直接可以通过读取位移传感器22的位移值来得到(此时即为t2)。Clearing the data read here refers to clearing the pre-compression amount t1, because when measuring the stroke T of the disk connector actually inserted into the backplane connector, since T=t2-t1, the Clearing the pre-compression amount t1 can make T reading more convenient. In the case where the pre-compression amount t1 is cleared, the value of T can be directly obtained by reading the displacement value of the displacement sensor 22 (in this case, t2).
实施例4:Example 4:
参见图4至图8所示,本发明实施例提供一种盲插连接器互配间隙的测量装置,其包括校准工装1和模拟机盘2。As shown in FIGS. 4 to 8, an embodiment of the present invention provides a measurement device for a blind mating connector inter-matching gap, which includes a calibration tool 1 and an analog machine board 2.
其中,校准工装1上设有Among them, the calibration tooling 1 has
一个凹槽11,所述凹槽11的深度S为背板连接器上信号针与机盘连接器对接用的部分针长加上背板连接器壳底的厚度。A groove 11, the depth S of the groove 11 is the length of a part of the pin used for butt connection between the signal pin on the backplane connector and the chassis connector plus the thickness of the bottom of the backplane connector shell.
模拟机盘2,其包括, Analog machine board 2, which includes,
-盘体21;-Plate body 21;
-多个机盘连接器,其均固定在所述盘体21上;-A plurality of machine disk connectors, all of which are fixed on the disk body 21;
-至少一个位移传感器22,其固定在所述盘体21上,并与一个 所述机盘连接器相邻设置,且所述位移传感器22伸出所述盘体21的部分超出所述机盘连接器的长度略大于所述深度S;-At least one displacement sensor 22, which is fixed on the disk body 21, and is arranged adjacent to one of the machine disk connectors, and the portion of the displacement sensor 22 that protrudes from the disk body 21 exceeds the machine disk The length of the connector is slightly larger than the depth S;
-位移测试仪23,其与所述位移传感器22相连,用于读取所述位移传感器22的数据。-A displacement tester 23, which is connected to the displacement sensor 22 and used to read the data of the displacement sensor 22.
进一步地,所述模拟机盘2包括三个位移传感器22。Further, the simulation machine board 2 includes three displacement sensors 22.
通过设置三个位移传感器22,从而可以灵活的选择多个测试点,确定DEMATED值最差的位置及趋势,使得测量结果更为可靠。By setting three displacement sensors 22, multiple test points can be flexibly selected to determine the position and trend of the worst DEMATED value, making the measurement results more reliable.
实施例5:Example 5:
参见图5所示,本发明实施例提供一种校准工装1,用于辅助测量机盘连接器与背板连接器的互配间隙,所述校准工装1上设有一个凹槽11,所述凹槽11的深度S为背板连接器上信号针与机盘连接器对接用的部分针长加上背板连接器壳底的厚度。As shown in FIG. 5, an embodiment of the present invention provides a calibration tool 1 for assisting in measuring the interworking gap between a machine disk connector and a backplane connector. The calibration tool 1 is provided with a groove 11. The depth S of the groove 11 is the length of the part of the pin on the backplane connector used for butt connection between the signal pin and the chassis connector plus the thickness of the bottom of the backplane connector shell.
实施例6:Example 6:
本发明实施例提供一种利用实施例1中的测量装置测量互配间隙的方法,该方法包括以下步骤:An embodiment of the present invention provides a method for measuring an interworking gap using the measurement device in Embodiment 1, the method includes the following steps:
将校准工装1与模拟机盘2贴合,利用校准工装1上的凹槽11以及模拟机盘2,读取此时的位移传感器22的预压缩量t1;Fit the calibration tool 1 to the simulation machine plate 2 and use the groove 11 on the calibration tool 1 and the simulation machine plate 2 to read the pre-compression amount t1 of the displacement sensor 22 at this time;
将模拟机盘2插入待测子架4,读取位移传感器22的位移值t2;Insert the simulated machine disk 2 into the sub-rack 4 to be tested, and read the displacement value t2 of the displacement sensor 22;
计算机盘连接器实际插入背板连接器的行程T=t2-t1;The stroke T of the computer disk connector actually inserted into the backplane connector is t=t2-t1;
计算互配间隙:Demated值=S-T。Calculate the interworking gap: Demated value = S-T.
实施例7:Example 7:
本发明实施例提供一种利用实施例1中的测量装置测量互配间隙的方法,该方法包括以下步骤:An embodiment of the present invention provides a method for measuring an interworking gap using the measurement device in Embodiment 1, the method includes the following steps:
将校准工装1与模拟机盘2贴合,利用校准工装1上的凹槽11以及模拟机盘2,读取此时的位移传感器22的预压缩量t1;Fit the calibration tool 1 to the simulation machine plate 2 and use the groove 11 on the calibration tool 1 and the simulation machine plate 2 to read the pre-compression amount t1 of the displacement sensor 22 at this time;
将模拟机盘2插入待测子架4,读取位移传感器22的位移值t2;Insert the simulated machine disk 2 into the sub-rack 4 to be tested, and read the displacement value t2 of the displacement sensor 22;
计算机盘连接器实际插入背板连接器的行程T=t2-t1;The stroke T of the computer disk connector actually inserted into the backplane connector is t=t2-t1;
计算互配间隙:Demated值=S-T。Calculate the interworking gap: Demated value = S-T.
进一步地,将校准工装1与模拟机盘2贴合,使所述位移传感器22伸入所述凹槽11内,同时使至少一个所述机盘连接器抵持在所述凹槽11的台阶面上,并由位移测试仪23读取此时的位移传感器22的预压缩量t1。优选地,与所述位移传感器22相邻的两个机盘连接器抵持在所述凹槽11的台阶面上,这样测量时会更准确。Further, the calibration tool 1 is attached to the simulated machine board 2 so that the displacement sensor 22 extends into the groove 11 while at least one machine board connector is held against the step of the groove 11 The displacement tester 23 reads the pre-compression amount t1 of the displacement sensor 22 at this time. Preferably, the two machine disk connectors adjacent to the displacement sensor 22 bear against the stepped surface of the groove 11 so that the measurement will be more accurate.
进一步地,利用位移测试仪23将位移传感器22的预压缩量t1清零。Further, the displacement tester 23 is used to clear the pre-compression amount t1 of the displacement sensor 22.
这里所述的将所读取的数据清零,指的是将预压缩量t1清零,因为在测量机盘连接器实际插入背板连接器的行程T时,由于T=t2-t1,将预压缩量t1清零可以让T读取更方便,在预压缩量t1被清零的情形下,T的值直接可以通过读取位移传感器22的位移值来得到(此时即为t2)。Clearing the data read here refers to clearing the pre-compression amount t1, because when measuring the stroke T of the disk connector actually inserted into the backplane connector, since T=t2-t1, the Clearing the pre-compression amount t1 can make T reading more convenient. In the case where the pre-compression amount t1 is cleared, the value of T can be directly obtained by reading the displacement value of the displacement sensor 22 (in this case, t2).
实施例8:Example 8:
本发明实施例提供一种利用实施例1中的测量装置测量互配间隙的方法,该方法包括以下步骤:An embodiment of the present invention provides a method for measuring an interworking gap using the measurement device in Embodiment 1, the method includes the following steps:
将校准工装1与模拟机盘2贴合,利用校准工装1上的凹槽11以及模拟机盘2,读取此时的位移传感器22的预压缩量t1;Fit the calibration tool 1 to the simulation machine plate 2 and use the groove 11 on the calibration tool 1 and the simulation machine plate 2 to read the pre-compression amount t1 of the displacement sensor 22 at this time;
将模拟机盘2插入待测子架4,读取位移传感器22的位移值t2;Insert the simulated machine disk 2 into the sub-rack 4 to be tested, and read the displacement value t2 of the displacement sensor 22;
计算机盘连接器实际插入背板连接器的行程T=t2-t1;The stroke T of the computer disk connector actually inserted into the backplane connector is t=t2-t1;
计算互配间隙:Demated值=S-T。Calculate the interworking gap: Demated value = S-T.
进一步地,所述模拟机盘2包括三个位移传感器22,利用三个所述位移传感器22分别测量对应的预压缩量t1和位移值t2。Further, the simulated machine disk 2 includes three displacement sensors 22, and the three displacement sensors 22 are used to respectively measure the corresponding pre-compression amount t1 and displacement value t2.
通过设置三个位移传感器22,从而可以灵活的选择多个测试点,确定DEMATED值最差的位置及趋势,使得测量结果更为可靠。By setting three displacement sensors 22, multiple test points can be flexibly selected to determine the position and trend of the worst DEMATED value, making the measurement results more reliable.
本发明不局限于上述实施方式,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也视为本发明的保护范围之内。本说明书中未作详细描述的内容属于本领域专业技术人员公知的现有技术。The present invention is not limited to the above-mentioned embodiments. For those of ordinary skill in the art, without departing from the principles of the present invention, several improvements and retouches can be made. These improvements and retouches are also regarded as the protection of the present invention Within range. The contents that are not described in detail in this specification belong to the prior art known to those skilled in the art.

Claims (10)

  1. 一种盲插连接器互配间隙的测量装置,其特征在于,包括:A measuring device for inter-matching gap of blind plug connectors, which is characterized by comprising:
    校准工装(1),其上设有一个凹槽(11),所述凹槽(11)的深度S为背板连接器上信号针与机盘连接器对接用的部分针长加上背板连接器壳底的厚度;以及The calibration tooling (1) is provided with a groove (11), and the depth S of the groove (11) is the length of the part of the pin on the backplane connector used for butt connection between the signal pin and the chassis connector plus the backplane The thickness of the connector shell bottom; and
    模拟机盘(2),其包括,Analog machine disk (2), which includes,
    -盘体(21);-Plate body (21);
    -多个机盘连接器,其均固定在所述盘体(21)上;-A plurality of machine disk connectors, all of which are fixed on the disk body (21);
    -至少一个位移传感器(22),其固定在所述盘体(21)上,并与一个所述机盘连接器相邻设置,且所述位移传感器(22)伸出所述盘体(21)的部分超出所述机盘连接器的长度略大于所述深度S;-At least one displacement sensor (22), which is fixed on the disk body (21) and is adjacent to one of the machine disk connectors, and the displacement sensor (22) extends out of the disk body (21) ) Part exceeds the length of the machine disk connector is slightly greater than the depth S;
    -位移测试仪(23),其与所述位移传感器(22)相连,用于读取所述位移传感器(22)的数据。-A displacement tester (23), which is connected to the displacement sensor (22) and used to read data of the displacement sensor (22).
  2. 如权利要求1所述的测量装置,其特征在于:当所述校准工装(1)与所述模拟机盘(2)贴合时,可使所述位移传感器(22)伸入所述凹槽(11)内,且使至少一个所述机盘连接器抵持在所述凹槽(11)的台阶面上。The measuring device according to claim 1, characterized in that when the calibration tool (1) is attached to the simulated machine plate (2), the displacement sensor (22) can be extended into the groove (11), and at least one of the machine plate connectors is pressed against the stepped surface of the groove (11).
  3. 如权利要求2所述的测量装置,其特征在于:所述位移测试仪(23)还用于将所述校准工装(1)与模拟机盘(2)贴合时所读取的数据清零。The measuring device according to claim 2, characterized in that the displacement tester (23) is also used to clear the data read when the calibration tool (1) and the simulation machine disk (2) are attached .
  4. 如权利要求2所述的测量装置,其特征在于:所述模拟机盘(2)包括三个位移传感器(22)。The measuring device according to claim 2, characterized in that the analog machine plate (2) includes three displacement sensors (22).
  5. 如权利要求1所述的测量装置,其特征在于:所述测量装置还包括用于承放模拟机盘(2)的操作台(3)。The measuring device according to claim 1, characterized in that the measuring device further comprises an operating table (3) for receiving the simulated machine board (2).
  6. 一种校准工装(1),用于辅助测量机盘连接器与背板连接器 的互配间隙,其特征在于:所述校准工装(1)上设有一个凹槽(11),所述凹槽(11)的深度S为背板连接器上信号针与机盘连接器对接用的部分针长加上背板连接器壳底的厚度。A calibration tool (1) is used to assist in measuring the interworking gap between the machine disk connector and the backplane connector, and is characterized in that: the calibration tool (1) is provided with a groove (11), the recess The depth S of the slot (11) is the length of the part of the pin on the backplane connector used to mate with the connector of the machine board plus the thickness of the bottom of the backplane connector shell.
  7. 一种利用权利要求1所述的测量装置测量互配间隙的方法,其特征在于,该方法包括以下步骤:A method for measuring an interworking gap by using the measuring device according to claim 1, wherein the method includes the following steps:
    将校准工装(1)与模拟机盘(2)贴合,利用校准工装(1)上的凹槽(11)以及模拟机盘(2),读取此时的位移传感器(22)的预压缩量t1;Lay the calibration tool (1) and the simulation machine disk (2), use the groove (11) on the calibration tool (1) and the simulation machine board (2) to read the pre-compression of the displacement sensor (22) at this time Quantity t1;
    将模拟机盘(2)插入待测子架(4),读取位移传感器(22)的位移值t2;Insert the simulated machine disk (2) into the sub-rack (4) to be tested, and read the displacement value t2 of the displacement sensor (22);
    计算机盘连接器实际插入背板连接器的行程T=t2-t1;The stroke T of the computer disk connector actually inserted into the backplane connector is t=t2-t1;
    计算互配间隙:Demated值=S-T。Calculate the interworking gap: Demated value = S-T.
  8. 如权利要求7所述的方法,其特征在于:将校准工装(1)与模拟机盘(2)贴合,使所述位移传感器(22)伸入所述凹槽(11)内,同时使至少一个所述机盘连接器抵持在所述凹槽(11)的台阶面上,并由位移测试仪(23)读取此时的位移传感器(22)的预压缩量t1。The method according to claim 7, characterized in that the calibration tool (1) and the simulation machine plate (2) are stuck together, so that the displacement sensor (22) extends into the groove (11), and at the same time At least one of the machine disk connectors bears against the stepped surface of the groove (11), and the pre-compression amount t1 of the displacement sensor (22) at this time is read by the displacement tester (23).
  9. 如权利要求8所述的方法,其特征在于:利用位移测试仪(23)将位移传感器(22)的预压缩量t1清零。The method according to claim 8, characterized in that the pre-compression amount t1 of the displacement sensor (22) is cleared by a displacement tester (23).
  10. 如权利要求7所述的方法,其特征在于:所述模拟机盘(2)包括三个位移传感器(22),利用三个所述位移传感器(22)分别测量对应的预压缩量t1和位移值t2。The method according to claim 7, characterized in that the simulated machine disk (2) includes three displacement sensors (22), and the corresponding pre-compression amount t1 and displacement are respectively measured by the three displacement sensors (22) Value t2.
PCT/CN2019/096093 2019-01-07 2019-07-16 Calibration tooling, and device and method for measuring blind mating connector interfitting gap WO2020143204A1 (en)

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