WO2020013333A1 - Pick-up device, mounting device, pick-up method, and mounting method - Google Patents

Abstract

The present invention prevents the adhesion of adjacent heat conduction sheets when picking up the heat conduction sheets. The present invention is provided with: a stage 2 on which a heat-conductive molding sheet 20 having a plurality of heat conduction sheets 21 fragmented into small pieces by making a cut is mounted; and a moving head 3 for picking up and moving a heat conduction sheet 21 from the heat conductive molding sheet 20 mounted on the stage 2, wherein the heat conductive molding sheet 20 has magnetic properties, and a holding mechanism 4, which magnetizes and holds at least one among the heat conductive molding sheet 20 and the heat conduction sheets 21, is provided on at least one side of the stage 2 or the moving head 3.

Description

Pickup device, mounting device, pickup method, mounting method

The present technology relates to a pickup device and a pickup method for picking up and transferring a heat conductive sheet, and a mounting device and a mounting method for a heat conductive sheet. This application is based on Japanese Patent Application No. 2018-132740 filed on July 12, 2018 in Japan and Japanese Patent Application No. 2019-130427 filed on July 12, 2019 in Japan. Claiming priority as a basis, these applications are hereby incorporated by reference.

In recent years, electronic devices have been following the trend of miniaturization, but since the power consumption cannot be changed so much due to the variety of applications, measures to dissipate heat in the devices have become even more important.

放熱 As a measure for heat dissipation in the electronic devices described above, a heat sink, a heat pipe, a heat sink, or the like made of a metal material having high thermal conductivity such as copper or aluminum is widely used. These heat radiating components having excellent thermal conductivity are arranged close to electronic components, such as semiconductor packages, which are heat generating portions in the electronic device, in order to achieve a heat radiating effect or reduce the temperature inside the device. In addition, these heat radiating components having excellent heat conductivity are arranged from the electronic components, which are heat generating parts, to a low-temperature place.

熱 Heat-conducting sheets and heat-conducting grease are used for heat-generating parts in electronic devices. For example, Patent Literature 1 discloses a technique of a heat conductive sheet used between a semiconductor such as a CPU and a heat sink.

JP 2015-35580 A

As a mounting method of the electronic component, the component supplied from the component supply unit is vacuum-sucked and picked up by a suction nozzle provided in the transfer head, and the transfer head is moved based on the control data to mount the component on the substrate. Methods are known.

In the method for mounting the heat conductive sheet, first, the heat conductive sheet cut into small pieces of a predetermined size is placed on the stage of the mounting machine. Then, a predetermined heat conductive sheet is sucked and held by a suction nozzle of the transfer head, picked up, and mounted on a predetermined electronic component or electronic device.

At this time, if the heat conductive sheet having high flexibility, the adjacent heat conductive sheet adheres after die-cutting, and the small heat conductive sheet on the stage is attracted and picked up, the adjacent heat conductive sheet adheres. There was a problem of coming.

Accordingly, it is an object of the present technology to provide a pickup device, a mounting device, a pickup method, and a mounting method that can prevent an adjacent heat conductive sheet from adhering when picking up a heat conductive sheet.

In order to solve the above-described problem, a pickup device according to the present technology includes a stage on which a thermally conductive molded sheet having a plurality of thermally conductive sheets that are cut into small pieces by being provided with cuts is placed, A transfer head that picks up and moves the heat conductive sheet from the heat conductive molded sheet placed thereon, wherein the heat conductive molded sheet has magnetism, and the stage or the transfer head Is provided with a holding mechanism for magnetizing and holding at least one of the thermally conductive molded sheet and the thermally conductive sheet.

Further, a mounting device according to the present technology is a mounting device that picks up a heat conductive sheet and mounts the heat conductive sheet on an electronic component or an electronic device, wherein the mounting device includes a plurality of heat conductive sheets that are cut into small pieces by being provided with cuts. A stage on which the thermally conductive molded sheet is mounted, and a transfer head for picking up and moving the thermally conductive sheet from the thermally conductive molded sheet placed on the stage, The formable sheet has magnetism, and at least one of the stage and the transfer head is provided with a holding mechanism for magnetizing and holding at least one of the heat conductive formed sheet or the heat conductive sheet. Things.

Further, the pickup method according to the present technology includes a stage on which a thermally conductive molded sheet having a plurality of thermally conductive sheets that are fragmented by being provided with a cut is placed, and a stage that is placed on the stage. A transfer head for picking up and moving the heat conductive sheet from the heat conductive molded sheet, wherein the heat conductive molded sheet has magnetism, and is provided on at least one of the stage or the transfer head. A holding mechanism magnetizes and holds at least one of the thermally conductive molded sheet and the thermally conductive sheet, and picks up the thermally conductive sheet by the transfer head.

Further, the mounting method according to the present technology is a mounting method in which a heat conductive sheet is picked up and mounted on an electronic component or an electronic device, wherein the heat conductive sheet includes a plurality of heat conductive sheets that are cut into small pieces by being provided with cuts. A stage on which a body sheet is mounted, and a transfer head for picking up and moving a heat conductive sheet from the heat conductive formed sheet mounted on the stage, wherein the heat conductive formed sheet is By having a magnetism, by a holding mechanism provided on at least one of the stage or the transfer head, at least one of the thermally conductive molded sheet or the heat conductive sheet is magnetized and held. The heat conductive sheet is picked up and mounted on an electronic component or electronic device.

Further, the pickup method according to the present technology includes a plurality of heat-conducting molded sheets having a plurality of heat-conducting sheets or a plurality of accommodating recesses for accommodating the heat-conducting sheets, which are cut into small pieces, and Has a carrier tape sealed with a cover film, and a transfer head that picks up the heat conductive sheet from the accommodation recess, wherein the heat conductive molded sheet and the heat conductive sheet have magnetism, The heat conductive molded sheet or the heat conductive sheet is magnetized and held by a holding mechanism provided on at least one of the stage on which the carrier tape is mounted and the transfer head, and the heat is transferred by the transfer head. This is to pick up the conductive sheet.

According to the present technology, it is possible to prevent the adjacent heat conductive sheet from adhering to and pulling up together with the heat conductive sheet sucked by the transfer head, and only the heat conductive sheet sucked by the transfer head is placed on the stage. From the heat conductive molded sheet.

FIG. 1 is a cross-sectional view illustrating a schematic configuration of a pickup device to which the present technology is applied. FIG. 2 is a cross-sectional view illustrating an example of a semiconductor device using a heat conductive sheet. FIG. 3 is a perspective view showing a carrier tape provided with a housing recess for housing a heat conductive sheet. FIG. 4 is a cross-sectional view illustrating a schematic configuration of a modified example of the pickup device to which the present technology is applied. FIG. 5 is a cross-sectional view illustrating a schematic configuration of a modified example of the pickup device to which the present technology is applied. FIG. 6 is an external perspective view showing a thermally conductive molded sheet having a plurality of fragmented thermal conductive sheets. FIG. 7 is a cross-sectional view illustrating a schematic configuration of a pickup device that picks up a heat conductive sheet stored in a storage recess of a carrier tape by a transfer head provided with a holding mechanism. FIG. 8 is a cross-sectional view illustrating a schematic configuration of a pickup device that picks up a heat conductive sheet accommodated in an accommodation recess of a carrier tape placed on a stage having a holding mechanism by a transfer head. FIG. 9 is a cross-sectional view illustrating a schematic configuration of a pickup device that picks up a heat conductive sheet housed in a housing recess of a carrier tape mounted on a stage equipped with a holding mechanism by a transfer head equipped with a holding mechanism. .

Hereinafter, a pickup device, a mounting device, a pickup method, and a mounting method to which the present technology is applied will be described in detail with reference to the drawings. Note that the present technology is not limited to only the following embodiments, and it is needless to say that various modifications can be made without departing from the gist of the present technology. Also, the drawings are schematic, and the ratio of each dimension may be different from the actual one. Specific dimensions and the like should be determined in consideration of the following description. In addition, it is needless to say that the drawings include portions having different dimensional relationships and ratios.

<Pickup device>
As shown in FIG. 1, a pickup device 1 to which the present technology is applied includes a stage 2 on which a thermally conductive molded body sheet 20 formed in a sheet shape is placed, and a heat conductive member placed on the stage 2. And a transfer head 3 for picking up and moving the heat conductive sheet 21 from the compliant molded body sheet 20.

The thermally conductive molded sheet 20 has a plurality of thermal conductive sheets 21 which are cut into small pieces by being cut (FIG. 6). The thermally conductive molded sheet 20 has magnetism and is magnetized when a magnetic field is applied from the outside.

In the pickup device 1, a holding mechanism 4 for magnetizing and holding at least one of the thermally conductive molded sheet 20 and the thermally conductive sheet 21 is provided on at least one of the stage 2 and the transfer head 3. Thus, the pickup device 1 can prevent the heat conductive sheet 21 adsorbed by the transfer head 3 from being attached and pulled up together with the heat conductive sheet 21 adsorbed by the transfer head 3. Only the heat conductive molded body sheet 20 placed on the stage 2 can be picked up.

In addition, in the pickup device 1, by providing the transfer mechanism 3 with the holding mechanism 4, the holding force is increased by magnetically attracting the heat conductive sheet 21, so that the size of the heat conductive sheet 21 increases. Also, there is no need to increase the suction force applied to the heat conductive sheet 21 as compared with the case where suction is performed only by vacuum suction, and deformation of the heat conductive sheet 21 can be prevented. Further, even when the holding mechanism 4 is provided on the stage 2, the pickup device 1 can prevent the heat conductive sheet 21 adjacent to the heat conductive sheet 21 adsorbed by the transfer head 3 from adhering. The heat conductive sheet 21 can be taken up without increasing the applied suction force, and deformation of the heat conductive sheet 21 can be prevented.

Hereinafter, each configuration of the pickup device 1 will be described by taking a case where the holding mechanism 4 is provided on the stage 2 as an example.

[stage]
The stage 2 holds the heat conductive sheet 21 other than the heat conductive sheet 21 picked up when the heat conductive sheet 21 is picked up. The stage 2 has a mounting surface 2a on which the thermally conductive molded sheet 20 is placed, and a holding mechanism 4 for applying a magnetic field to the thermally conductive molded sheet 20 placed on the mounting surface 2a is provided. Built-in. The stage 2 is formed of a material such as iron and ferritic stainless steel that does not hinder the magnetic field applied by the holding mechanism 4.

[Holding mechanism]
The holding mechanism 4 has a magnetic field applying unit that applies a magnetic field to the thermally conductive molded sheet 20 placed on the placement surface 2a. Known means can be used as the magnetic field applying means, and examples thereof include a permanent magnet, a solenoid, and an electromagnet. The magnetic flux density of the magnetic field applying means can be appropriately set in accordance with the thickness of the thermally conductive molded sheet 20, the size of the thermally conductive sheet 21, the magnetic permeability, and the like, and is, for example, 1 to 13 gauss. Further, the holding mechanism 4 may be capable of controlling on / off of the application of the magnetic field by the magnetic field applying unit as needed. Thereby, when placing or removing the thermally conductive molded sheet 20 on the stage 2, the application of the magnetic field is turned off and the work of placing and removing the thermally conductive molded sheet 20 is easily performed. be able to. Further, the holding mechanism 4 may be capable of adjusting the strength of the magnetic field by the magnetic field applying means. Adjustment of the strength of the magnetic field is appropriately performed by a method according to the configuration of the magnetic field applying means, such as adjusting the strength of the current flowing through the coil, the distance to the mounting surface 2a, and interposing a demagnetizing member for shielding the magnetic field. be able to.

[Transfer head]
The transfer head 3 that picks up the heat conductive sheet 21 has a suction portion 3a at the tip of the head that sucks the heat conductive sheet 21. Take up from sheet 20. The suction unit 3a is formed of a suction nozzle that suctions the heat conductive sheet 21 by, for example, sucking it under a negative pressure. The transfer head 3 is movable by a moving mechanism (not shown), and transfers the heat conductive sheet 21 picked up from the heat conductive molded sheet 20 to a predetermined position, for example, an electronic component such as a semiconductor device. .

Here, the thermally conductive molded sheet 20 is formed by molding the thermally conductive resin composition into a sheet, and has the thermally conductive sheet 21 which is cut into a plurality of pieces by being cut. Therefore, the heat transfer sheet 21 can be individually picked up by the transfer head 3. The heat conductive sheet 21 has a slight adhesive property and is in close contact with the adjacent heat conductive sheet 21 even when the heat conductive sheet 21 is cut into small pieces. May also be attached and taken up together.

However, the thermally conductive molded sheet 20 has magnetism, and is magnetized by applying a magnetic field by the holding mechanism 4. Accordingly, the holding mechanism 4 can hold the thermally conductive molded sheet 20 on the mounting surface 2a of the stage 2. Thus, the pickup device 1 can prevent the heat conductive sheet 21 adsorbed by the transfer head 3 from being attached and pulled up together with the heat conductive sheet 21 adsorbed by the transfer head 3. Only the heat conductive molded body sheet 20 placed on the stage 2 can be picked up.

The heat transfer sheet 21 picked up by the transfer head 3 is also magnetized in the same manner as other heat transfer sheets, but the strength and location of the magnetic field of the magnetic field applying means and the suction force of the transfer head 3 are affected by the heat. By adjusting so that only the conductive sheet 21 can be picked up from the mounting surface 2a, the pickup can be performed.

Further, the transfer head 3 may pick up one heat conductive sheet 21 and include a plurality of suction portions 3a so that a plurality of adjacent or non-adjacent heat conductive sheets 21 are picked up by one pick-up operation. You may.

[Semiconductor device]
The transfer head 3 can mount the picked-up heat conductive sheet 21 in an electronic component such as a semiconductor device or various electronic devices. In this case, the pickup device 1 functions as a mounting device.

For example, the heat conductive sheet 21 picked up by the transfer head 3 is mounted on a semiconductor device incorporated in various electronic devices, and is sandwiched between a heat source and a heat radiating member. FIG. 2 illustrates an example of a semiconductor device. The semiconductor device 50 shown in FIG. 2 includes at least an electronic component 51, a heat spreader 52, and a heat conductive sheet 21, and the heat conductive sheet 21 is sandwiched between the heat spreader 52 and the electronic component 51. By using the heat conductive sheet 21, the semiconductor device 50 has a high heat radiation property and also has an excellent effect of suppressing electromagnetic waves.

The electronic component 51 is not particularly limited and can be appropriately selected according to the purpose. Examples thereof include a CPU, an MPU, a graphic operation element, and an image sensor. The heat spreader 52 is not particularly limited as long as it is a member that radiates heat generated by the electronic component 51, and can be appropriately selected according to the purpose. The heat conductive sheet 21 is sandwiched between the heat spreader 52 and the electronic component 51. Further, the heat conductive sheet 21 constitutes, together with the heat spreader 52, a heat radiating member that radiates heat of the electronic component 51 by being sandwiched between the heat spreader 52 and the heat sink 53.

The mounting position of the heat conductive sheet 21 is not limited to between the heat spreader 52 and the electronic component 51 or between the heat spreader 52 and the heat sink 53, and can be appropriately selected according to the configuration of the electronic device or the semiconductor device. . The heat radiating member is not limited to the heat spreader 52 and the heat sink 53, and may be any member that conducts heat generated from a heat source and radiates the heat to the outside. For example, a radiator, a cooler, a die pad, a printed circuit board, a cooling fan , A Peltier element, a heat pipe, a metal cover, a housing, and the like.

[Carrier tape]
Alternatively, as shown in FIG. 3, the transfer head 3 may house the heat conductive sheet 21 in a storage recess of a supply member such as a carrier tape 60 that supplies the heat conductive sheet 21 by a moving mechanism. The carrier tape 60 is formed in a long shape, a plurality of accommodation recesses 61 are formed in the longitudinal direction, and the accommodation recesses 61 are sealed with a cover film 62.

(4) The carrier tape 60 accommodates the heat conductive sheet 21 in the accommodation recess 61, is sealed with the cover film 62, and is supplied as a reel wound around a reel. When the heat conductive sheet 21 is used, the heat conductive sheet 21 is pulled out from the reel body, and after the cover film 62 is peeled off, the heat conductive sheet 21 is automatically mounted by manual operation or by a pickup mechanism such as a vacuum nozzle.

[Modification 1]
In the above-described pickup device 1, the holding mechanism 4 is provided on the stage 2. However, in the pickup device to which the present technology is applied, the holding mechanism 4 may be provided on the transfer head 3. In the following description, the same members as those of the above-described pickup device 1 are denoted by the same reference numerals, and the details thereof are omitted.

(4) In the pickup device 30 shown in FIG. 4, a holding mechanism 4 is formed on the transfer head 3, and a magnetic field can be applied to a predetermined heat conductive sheet 21 to be picked up. The heat conductive sheet 21 has magnetism and is magnetized by applying a magnetic field from a holding mechanism 4 provided on the transfer head 3.

(4) Although the holding mechanism 4 is not provided on the stage 2, the thermally conductive molded sheet 20 has a slight adhesive property and is held on the mounting surface 2a of the stage 2. Therefore, in the pickup device 30, only the predetermined heat conductive sheet 21 is magnetized and absorbed by the holding mechanism 4 of the transfer head 3, and can be separated from the heat conductive molded sheet 20 and picked up.

The holding mechanism 4 of the pickup device 30 can switch on / off the application of the magnetic field, and when mounting the picked-up heat conductive sheet 21, the magnetic field can be turned off and the heat conductive sheet 21 can be released. And

The pickup device 30 may be provided with a holding means for holding the thermally conductive sheet 20 on the stage 2. As a result, the thermally conductive molded sheet 20 can be held on the mounting surface 2a, and only the thermally conductive sheet 21 magnetically attracted by the transfer head 3 can be picked up. As means for holding the thermally conductive molded body sheet 20 provided on the stage 2, for example, there is a method in which countless suction holes are provided on the mounting surface 2 a of the stage 2 and held by vacuum.

Also, as in the pickup device 40 shown in FIG. 5, a holding mechanism 4 may be provided on the stage 2 and the transfer head 3 so that the thermally conductive molded sheet 20 is magnetically attracted to the mounting surface 2a. In this case, the balance between the magnetic field strength of the holding mechanism 4 provided on the transfer head 3 and the magnetic field strength of the holding mechanism 4 provided on the stage 2 is adjusted, and the predetermined heat magnetically attracted by the holding mechanism 4 of the transfer head 3 is adjusted. It is necessary to take up only the conductive sheet 21.

[Modification 2]
Further, in the pickup method to which the present technology is applied, as shown in FIG. 7, the transfer head 3 provided with the holding mechanism 4 picks up the heat conductive sheet 21 stored in the storage recess 61 and provides it for mounting. Is also good. As described above, the heat conductive sheet 21 has magnetism and is magnetized by applying a magnetic field from the holding mechanism 4 provided on the transfer head 3. The holding mechanism 4 is capable of switching on / off of application of a magnetic field, thereby magnetizing the heat conductive sheet 21 and adsorbing it to the transfer head 3, and turning off the magnetic field to release the heat conductive sheet 21. It can be released.

As described above, the transfer head 3 can adsorb the heat conductive sheet 21 by the holding mechanism 4 and store the heat conductive sheet 21 in the housing concave portion 61 of the carrier tape 60. In addition, the transfer head 3 can be used for mounting, for example, by picking up the heat conductive sheet 21 housed in the housing recess 61 by the holding mechanism 4 and transporting the heat conductive sheet 21 to a predetermined mounting position.

Further, as shown in FIG. 8, the carrier tape 60 is placed on the stage 2 provided with the holding mechanism 4, and the back surface of the housing recess 61, that is, the side opposite to the side sealed with the cover film 62 is set. While applying a magnetic field from the surface, the predetermined heat conductive sheet 21 may be picked up by the suction nozzle 3a of the transfer head 3 provided with the holding mechanism 4 or the transfer head 3 not provided with the holding mechanism 4. By magnetizing the heat conductive sheet 21 in the housing recess 61 by the holding mechanism 4 provided on the stage 2, for example, the heat conductive sheet 21 housed in the adjacent housing recess 61 can be stored without magnetically attracting. Even when the plurality of small heat conductive sheets 21 and the heat conductive molded sheet 20 are accommodated in the recess 61, only the predetermined heat conductive sheet 21 can be adsorbed to the transfer head 3 and picked up. It can be provided for mounting, and another heat conductive sheet 21 can be kept in the accommodation recess 61.

As shown in FIG. 9, when the holding mechanism 4 is provided on the transfer head 3 and the stage 2, the magnetic field strength of the holding mechanism 4 provided on the transfer head 3 and the strength of the holding mechanism 4 provided on the stage 2 are different. By adjusting the balance of the magnetic field strength, only the predetermined heat conductive sheet 21 magnetically attracted by the holding mechanism 4 of the transfer head 3 can be picked up.

In each of the above-described configurations in which the transfer mechanism 3 is provided with the transfer head 3 and / or the stage 2 and the heat conductive sheet 21 is picked up from the housing recess 61 of the carrier tape 60, the heat conductive sheet 20 is adhered to one surface of the sheet 20. An adhesive layer may be formed, and the surface on which the pressure-sensitive adhesive layer is formed may be accommodated facing the bottom surface 61a of the accommodation recess 61. Thus, when the transfer head 3 picks up the predetermined heat conductive sheet 21 from the housing recess 61, the other heat conductive sheet 21 is also placed in the housing recess 61 by the adhesive force of the adhesive layer, and the predetermined thermal conductivity is obtained. Only the conductive sheet 21 can be picked up.

The pressure-sensitive adhesive layer is formed, for example, by mixing and curing a silicone A liquid (base agent) and a silicone B liquid (curing agent) of a two-component addition-reaction type liquid silicone resin at a predetermined compounding ratio, and thermally curing a silicone film. It can be formed by superimposing on one surface of the body sheet 20 and applying surface pressure.

The pressure-sensitive adhesive layer may be formed by spray-coating an acrylic or silicone-based pressure-sensitive adhesive on one surface of the thermally conductive molded sheet 20.

Alternatively, the pressure-sensitive adhesive layer is formed by pressing the thermally conductive molded sheet 20 having both surfaces sandwiched by the supporting film to expose the uncured component of the polymer matrix component to both sides of the sheet. It may be formed by peeling the support film on one side.

[Thermal conductive sheet / thermal conductive sheet]
Next, the heat conductive molded sheet 20 and the heat conductive sheet 21 will be described. The heat conductive molded sheet 20 is formed by slicing a molded body obtained by curing the heat conductive resin composition into a sheet. The heat conductive sheet 21 is formed by cutting the heat conductive molded body sheet 20 into a plurality of small pieces. The heat conductive sheet 21 includes a polymer matrix component, a fibrous heat conductive filler, and a magnetic metal powder.

(Polymer matrix component)
The polymer matrix component contained in the heat conductive sheet 21 is a polymer component that becomes a base material of the heat conductive sheet 21. The type is not particularly limited, and a known polymer matrix component can be appropriately selected. For example, one of the polymer matrix components is a thermosetting polymer.

As the thermosetting polymer, for example, crosslinked rubber, epoxy resin, polyimide resin, bismaleimide resin, benzocyclobutene resin, phenol resin, unsaturated polyester, diallyl phthalate resin, silicone resin, polyurethane, polyimide silicone, thermosetting type Examples include polyphenylene ether and thermosetting modified polyphenylene ether. These may be used alone or in combination of two or more.

As the crosslinked rubber, for example, natural rubber, butadiene rubber, isoprene rubber, nitrile rubber, hydrogenated nitrile rubber, chloroprene rubber, ethylene propylene rubber, chlorinated polyethylene, chlorosulfonated polyethylene, butyl rubber, halogenated butyl rubber, fluorine Rubber, urethane rubber, acrylic rubber, polyisobutylene rubber, silicone rubber and the like. These may be used alone or in combination of two or more.

シ リ コ ー ン Also, among these thermosetting polymers, it is preferable to use a silicone resin from the viewpoint of excellent moldability and weatherability, as well as adhesion and followability to electronic components. The silicone resin is not particularly limited, and the type of the silicone resin can be appropriately selected depending on the purpose.

From the viewpoint of obtaining the above-mentioned moldability, weather resistance, adhesion, and the like, the silicone resin is preferably a silicone resin composed of a liquid silicone gel base and a curing agent. Examples of such a silicone resin include an addition-reaction-type liquid silicone resin and a heat-curable millable silicone resin using a peroxide for vulcanization. Among these, an addition-reaction-type liquid silicone resin is particularly preferable as a heat-radiating member of an electronic device, since it is required that the heat-generating surface and the heat-sink surface of the electronic component be in close contact with each other.

As the addition reaction type liquid silicone resin, it is preferable to use a two-component addition reaction type silicone resin containing a polyorganosiloxane having a vinyl group as a main component and a polyorganosiloxane having a Si—H group as a curing agent. .

In the combination of the main component of the liquid silicone gel and the curing agent, the mixing ratio of the main component and the curing agent may be, as a mass ratio, the main component: the curing agent = 35: 65 to 65:35. preferable.

Further, the content of the polymer matrix component in the heat conductive sheet of the present invention is not particularly limited and can be appropriately selected depending on the purpose. However, the formability of the sheet, the adhesion of the sheet, and the like are ensured. In view of this, the content is preferably about 15% by volume to 50% by volume, and more preferably 20% by volume to 45% by volume.

(Thermal conductive filler)
The heat conductive filler contained in the heat conductive sheet of the present invention is a component for improving the heat conductivity of the sheet. As for the kind of the heat conductive filler, a fibrous heat conductive filler and other known heat conductive fillers can be appropriately selected.

Here, the type of the fibrous heat conductive filler is not particularly limited as long as it is a fibrous material having a high heat conductivity, and examples thereof include metals such as silver, copper, and aluminum, alumina, and nitride. Ceramics such as aluminum, silicon carbide, and graphite, and carbon fibers can be used. Among these fibrous heat conductive fillers, it is preferable to use carbon fibers from the viewpoint of obtaining higher heat conductivity.

The heat conductive filler may be used singly or as a mixture of two or more. When two or more kinds of heat conductive fillers are used, each of them may be a fibrous heat conductive filler or a fibrous heat conductive filler and another form of heat conductive filler. A mixture with a filler may be used.

種類 The type of the carbon fiber is not particularly limited, and can be appropriately selected depending on the purpose. For example, pitch-based, PAN-based, graphitized PBO fibers, arc discharge, laser evaporation, CVD (chemical vapor deposition), CCVD (catalytic chemical vapor deposition), etc. Can be used. Among these, carbon fibers obtained by graphitizing PBO fibers and pitch-based carbon fibers are more preferable in that high thermal conductivity is obtained.

炭素 Further, the carbon fiber can be used after part or all of its surface treatment, if necessary. As the surface treatment, for example, an oxidation treatment, a nitridation treatment, a nitration, a sulfonation, or a metal, a metal compound, an organic compound, or the like attached to the surface of a functional group or carbon fiber introduced to the surface by these treatments or For example, a coupling process may be used. Examples of the functional group include a hydroxyl group, a carboxyl group, a carbonyl group, a nitro group, an amino group, and the like.

Further, the average fiber length (average major axis length) of the carbon fibers is not particularly limited and can be appropriately selected. However, from the viewpoint of ensuring high thermal conductivity, the average fiber length is in the range of 50 μm to 300 μm. Is preferably in the range of 75 μm to 275 μm, and particularly preferably in the range of 90 μm to 250 μm.

Furthermore, the average fiber diameter (average minor axis length) of the carbon fibers is not particularly limited and can be appropriately selected, but is in the range of 4 μm to 20 μm from the viewpoint of ensuring high thermal conductivity. It is more preferable that the thickness be in the range of 5 μm to 14 μm.

The aspect ratio (average major axis length / average minor axis length) of the carbon fiber is preferably 8 or more, more preferably 9 to 30, from the viewpoint of ensuring high thermal conductivity. . If the aspect ratio is less than 8, the fiber length (major axis length) of the carbon fiber is short, so that the thermal conductivity may be reduced. Since the dispersibility decreases, there is a possibility that a sufficient thermal conductivity cannot be obtained.

Here, the average major axis length and average minor axis length of the carbon fibers can be measured by, for example, a microscope, a scanning electron microscope (SEM), or the like, and the average can be calculated from a plurality of samples.

Further, the content of the fibrous heat conductive filler in the heat conductive sheet is not particularly limited and can be appropriately selected depending on the purpose, but is preferably 4% by volume to 40% by volume. It is more preferably from 5% by volume to 35% by volume. If the content is less than 4% by volume, it may be difficult to obtain a sufficiently low thermal resistance, and if it exceeds 40% by volume, the moldability of the heat conductive sheet and the fibrous heat conduction There is a possibility that the orientation of the hydrophilic filler may be affected. Further, the content of the heat conductive filler containing a fibrous heat conductive filler in the heat conductive sheet is preferably 15% by volume to 75% by volume.

(Inorganic filler)
It is preferable that the heat conductive sheet 21 further includes an inorganic filler. This is because the heat conductivity of the heat conductive sheet 21 can be further increased, and the strength of the sheet can be improved. The shape, material, average particle size and the like of the inorganic filler are not particularly limited, and can be appropriately selected according to the purpose. Examples of the shape include a spherical shape, an elliptical spherical shape, a block shape, a granular shape, a flat shape, and a needle shape. Among these, a spherical shape and an elliptical shape are preferred from the viewpoint of filling properties, and a spherical shape is particularly preferred.

Examples of the material of the inorganic filler include aluminum nitride (aluminum nitride: AlN), silica, alumina (aluminum oxide), boron nitride, titania, glass, zinc oxide, silicon carbide, silicon (silicon), silicon oxide, and metal particles. And the like. These may be used alone or in combination of two or more. Among these, alumina, boron nitride, aluminum nitride, zinc oxide, and silica are preferable, and alumina and aluminum nitride are particularly preferable in terms of thermal conductivity.

Also, the inorganic filler that has been subjected to a surface treatment can be used. When the inorganic filler is treated with a coupling agent as the surface treatment, the dispersibility of the inorganic filler is improved, and the flexibility of the heat conductive sheet is improved.

平均 The average particle size of the inorganic filler can be appropriately selected according to the type of the inorganic material. When the inorganic filler is alumina, the average particle size is preferably 1 μm to 10 μm, more preferably 1 μm to 5 μm, and particularly preferably 4 μm to 5 μm. If the average particle size is less than 1 μm, the viscosity may increase and mixing may be difficult. On the other hand, when the average particle size exceeds 10 μm, the thermal resistance of the heat conductive sheet may increase.

Further, when the inorganic filler is aluminum nitride, the average particle size is preferably 0.3 μm to 6.0 μm, more preferably 0.3 μm to 2.0 μm, and more preferably 0.5 μm to 1. Particularly preferably, it is 5 μm. If the average particle size is less than 0.3 μm, the viscosity may increase and mixing may be difficult. If the average particle size exceeds 6.0 μm, the thermal resistance of the heat conductive sheet may increase.

The average particle size of the inorganic filler can be measured by, for example, a particle size distribution meter or a scanning electron microscope (SEM).

(Magnetic metal powder)
The magnetic metal powder contained in the heat conductive sheet 21 is a component for realizing magnetic adsorption to the heat conductive molded sheet 20 and the holding mechanism 4 of the heat conductive sheet 21. The content of the magnetic metal powder may be any value as long as it can be magnetically attracted by the holding mechanism 4. Can be set. Further, by adjusting the content of the magnetic metal powder, the heat conductive sheet 21 may be provided with electromagnetic wave absorbing performance. For example, if the following magnetic metal powder is contained in the range of 1 to 30% by volume, it can be used as a normal heat conductive sheet. If the magnetic metal powder is contained in the range of 30 to 75% by volume, electromagnetic wave It can be used as a heat conductive sheet having absorption performance.

種類 The type of the magnetic metal powder is not particularly limited except that it is a material that can take on magnetism, and a known magnetic metal powder can be appropriately selected. For example, amorphous metal powder or crystalline metal powder can be used. Examples of the amorphous metal powder include Fe-Si-B-Cr, Fe-Si-B, Co-Si-B, Co-Zr, Co-Nb, and Co-Ta powders. Examples of the crystalline metal powder include pure iron, Fe-based, Co-based, Ni-based, Fe-Ni-based, Fe-Co-based, Fe-Al-based, Fe-Si-based, and Fe-Si-Al-based. And Fe-Ni-Si-Al-based materials. Further, as the crystalline metal powder, a microcrystalline metal obtained by adding a trace amount of N (nitrogen), C (carbon), O (oxygen), B (boron), etc. Powder may be used.

As the magnetic metal powder, a powder of different materials or a powder of a mixture of two or more powders having different average particle diameters may be used.

Further, it is preferable to adjust the spherical shape, the flat shape and the like of the magnetic metal powder. For example, in order to enhance the filling property, it is preferable to use a spherical magnetic metal powder having a particle size of several μm to several tens μm. Such a magnetic metal powder can be produced by, for example, an atomizing method or a method of thermally decomposing metal carbonyl. The atomizing method has an advantage that a spherical powder is easily produced, and the molten metal is caused to flow out of a nozzle, and a jet stream of air, water, an inert gas, or the like is sprayed on the discharged molten metal to solidify as a droplet. It is a method of making powder. When producing magnetic metal powder by the atomizing method, the cooling rate is preferably set to about 10 ⁻⁶ (K / s) in order to prevent the molten metal from being crystallized.

(4) When the amorphous alloy powder is manufactured by the above-described atomizing method, the surface of the amorphous alloy powder can be made smooth. When the amorphous alloy powder having a small surface unevenness and a small specific surface area is used as the magnetic metal powder, the filling property of the binder resin can be improved. Further, the filling property can be further improved by performing the coupling treatment.

(Other components)
The heat conductive sheet 21 may appropriately contain other components according to the purpose in addition to the above-described polymer matrix component, heat conductive filler, inorganic filler, and magnetic metal powder. Examples of other components include a thixotropic agent, a dispersant, a curing accelerator, a retarder, a slight tackifier, a plasticizer, a flame retardant, an antioxidant, a stabilizer, and a colorant.

The thickness of the heat conductive sheet 21 is not particularly limited, and can be appropriately changed depending on the place where the sheet is used, and for example, in the range of 0.2 mm to 5 mm in consideration of the adhesiveness and strength of the sheet. it can.

<Production method of heat conductive sheet>
Next, a method for manufacturing the heat conductive sheet 21 will be described. The method for producing the heat conductive sheet 21 includes a step of preparing a heat conductive resin composition containing a polymer matrix component, a fibrous heat conductive filler, and a magnetic metal powder (a sheet composition preparing step). Orienting the fibrous heat conductive filler (filler orientation step); curing the polymer matrix component while maintaining the orientation of the fibrous heat conductive filler; A step of producing a conductive resin molded article (a step of producing a thermally conductive resin molded article) and a predetermined angle (for example, 0 ° to 90 °) with respect to the major axis direction of the oriented fibrous heat conductive filler. ), The heat conductive resin molded body is cut to produce a sheet-like heat conductive molded body sheet 20 (a heat conductive molded body sheet preparation step); Heat conductive sheet 21 cut into small pieces (A step of preparing a heat conductive sheet).

熱 The heat conductive sheet 21 can be obtained through the above steps. As described above, the heat conductive molded sheet 20 and the heat conductive sheet 21 have high thermal conductivity and magnetic susceptibility.

(Sheet composition preparing step)
The method for producing the heat conductive sheet 21 includes a sheet composition preparing step. In this sheet composition preparing step, the polymer matrix component, the fibrous heat conductive filler and the magnetic metal powder, and the inorganic filler and / or other components are blended to prepare a sheet composition. . The procedure for blending and preparing each component is not particularly limited. For example, a fibrous heat conductive filler, an inorganic filler, a magnetic metal powder, and other components are added to the polymer matrix component and mixed. By doing so, the composition for the sheet is prepared.

(Filler orientation step)
The method for manufacturing the heat conductive sheet 21 of the present invention includes a filler orientation step. The method for orienting the fibrous heat conductive filler is not particularly limited as long as it is a means capable of orienting in one direction.

As a method for orienting the fibrous heat conductive filler in one direction, the method may be performed by extruding or press-fitting the sheet composition into a hollow mold under a high shear force. Can be According to this method, the fibrous heat conductive filler can be relatively easily oriented, and the orientation of the fibrous heat conductive filler becomes the same (within ± 10 °).

方法 As a method of extruding or press-fitting the sheet composition into the hollow mold under a high shearing force, specifically, an extrusion molding method or a mold molding method is mentioned. In the extrusion molding method, when the sheet composition is extruded from a die, or in the mold molding method, when the heat conductive resin composition is pressed into a mold, the binder resin flows, and the flow direction thereof The fibrous thermally conductive filler is oriented along. At this time, if a slit is attached to the tip of the die, the fibrous heat conductive filler is more easily oriented.

大 き The size and shape of the molded body (block-shaped molded body) can be determined according to the required size of the heat conductive sheet. For example, a rectangular parallelepiped having a cross section having a vertical size of 0.5 cm to 15 cm and a horizontal size of 0.5 cm to 15 cm can be given. The length of the rectangular parallelepiped may be determined as needed.

(Heat conductive resin molded body manufacturing process)
The method for manufacturing the heat conductive sheet 21 includes a heat conductive resin molded body manufacturing step. Here, the thermally conductive resin molded body refers to a base material (molded body) for cutting out a sheet, which is a base of the thermally conductive molded sheet 20 obtained by cutting into a predetermined size. The production of the heat conductive resin molded body is performed by curing the polymer matrix component while maintaining the orientation state of the fibrous heat conductive filler performed in the filler orientation step described above. .

The method and conditions for curing the polymer matrix component can be changed according to the type of the polymer matrix component. For example, when the polymer matrix component is a thermosetting resin, the curing temperature in thermosetting can be adjusted. Further, when the thermosetting resin contains a liquid silicone gel base material and a curing agent, it is preferable to perform the curing at a curing temperature of 80 ° C. to 120 ° C. The curing time in the thermal curing is not particularly limited, but may be 1 hour to 10 hours.

(Heat conductive molded sheet production process)
The method of manufacturing the heat conductive sheet 21 includes a step of preparing a heat conductive molded sheet. In the step of preparing a thermally conductive molded sheet, the thermally conductive resin molded body is formed so as to form an angle of 0 ° to 90 ° with respect to a major axis direction of the oriented fibrous thermally conductive filler. Cut into sheets.

切断 In addition, the cutting of the thermally conductive resin molded body is performed using a slicing apparatus. The slicing apparatus is not particularly limited as long as it can cut the sheet compact, and a known slicing apparatus can be appropriately used. For example, an ultrasonic cutter, a plane, or the like can be used.

(Heat conduction sheet making process)
The method for manufacturing the heat conductive sheet 21 includes a heat conductive sheet forming step. In the heat conductive sheet forming step, a plurality of heat conductive sheets 21 are obtained by cutting the heat conductive molded sheet 20 into small pieces. Each of the small heat conductive sheets 21 has flexibility and slight adhesiveness, and is in close contact with the adjacent heat conductive sheet 21 through the cut. Thereafter, the heat conductive sheet 21 is picked up from the heat conductive molded sheet 20 by the pickup device 1 as described above.

(Pressing process)
The method of manufacturing the heat conductive sheet 21 further includes the steps of: heat smoothing the surface of the heat conductive molded sheet 20 or the heat conductive sheet 21 to increase the adhesion and reduce the interface contact resistance under light load; A step of pressing the body sheet 20 or the heat conductive sheet 21 (press step) can be included. The press can be performed using, for example, a pair of press devices including a flat plate and a press head having a flat surface. Pressing may be performed using a pinch roll.

The pressure at the time of the pressing is not particularly limited and can be appropriately selected depending on the purpose.However, if the pressure is too low, the heat resistance tends to be the same as when the pressing is not performed, and if the pressure is too high, the sheet is stretched. Due to the tendency, the pressure is preferably in the range of 0.1 MPa to 100 MPa, more preferably in the range of 0.5 MPa to 95 MPa.

[Modified Example of Thermally Conductive Molded Sheet and Thermally Conductive Sheet]
The heat conductive molded sheet 20 and the heat conductive sheet 21 are made of a heat conductive layer containing a fibrous heat conductive filler in a polymer matrix component, and a magnetic material such as magnetic metal powder in a polymer matrix component. It may have a laminated structure in which a magnetic layer is contained. In the case of a two-layer structure of a heat conductive layer and a magnetic layer, for example, when the holding mechanism 4 is provided on the stage 2, the magnetic conductive layer is provided on the stage 2 side so that the heat conductive molded sheet 20 is held on the stage 2. When the holding mechanism 4 is provided on the transfer head 3 side, by providing a magnetic layer on the transfer head 3 side, the heat conductive sheet 21 can be easily picked up. In addition, the heat conductive sheet 21 may have a structure in which a magnetic layer is provided between two heat conductive layers, or a structure in which a heat conductive layer is provided between two magnetic layers.

Next, the present invention will be specifically described based on examples. However, the present invention is not limited to the following examples.

[Example 1]
In Example 1, two-component addition-reaction-type liquid silicone resin was prepared by adding Fe-Si-B-Cr amorphous magnetic particles having an average particle diameter of 5 µm and pitch-based carbon fibers having an average fiber length of 200 µm (thermal conductive fiber: Japan). (Available from Graphite Fiber Co., Ltd.) in a volume ratio of two-component addition-reaction liquid silicone resin: amorphous magnetic particles: pitch-based carbon fiber = 35 vol%: 45 vol%: 20 vol%. A resin composition (thermally conductive resin composition) was prepared.

The two-component addition reaction type liquid silicone resin is a mixture of a silicone A liquid (base) and a silicone B liquid (curing agent) in a ratio of 19 vol%: 16 vol%. The obtained silicone resin composition was extruded into a rectangular parallelepiped mold 40 mm × 40 mm in which a PET film subjected to a peeling treatment was adhered to the inner wall to form a silicone molded body. The obtained silicone molded product was cured in an oven at 100 ° C. for 6 hours to obtain a cured silicone product (a thermally conductive resin molded product). Next, the obtained cured silicone material is cut by an ultrasonic cutter perpendicular to the long axis of the oriented carbon fiber, that is, at a cutting angle of 90 ° (orientation angle: 90 °), and the heat conduction is performed with a thickness of 1 mm. A sample of a molded sheet was obtained. The slicing speed of the ultrasonic cutter was 50 mm per second.

切 れ As shown in FIG. 6, a cut was made in the obtained 40 mm × 40 mm thermally conductive sheet so that 16 10 mm × 10 mm thermally conductive sheets could be obtained, and placed on the stage of the pickup device. From the back of the stage, a thermally conductive molded sheet containing magnetic powder was fixed with an electromagnet, and a predetermined thermal conductive sheet in the thermally conductive molded sheet placed on the stage was picked up by a transfer head equipped with a suction nozzle. . The magnetic flux density of the electromagnet was 2 Gauss. From the thermally conductive molded sheet according to Example 1, the thermal conductive sheet could be picked up with good yield without the adjacent thermal conductive sheet adhering.

[Example 2]
In Example 2, two-component addition-reaction-type liquid silicone resin was prepared by adding Fe-Si-B-Cr amorphous magnetic particles having an average particle diameter of 5 μm and pitch-based carbon fibers having an average fiber length of 200 μm (thermal conductive fiber: Japan). (Manufactured by Graphite Fiber Co., Ltd.) in a volume ratio of two-component addition reaction type liquid silicone resin: amorphous magnetic particles: pitch-based carbon fiber: alumina = 35 vol%: 45 vol%: 12 vol%: 8 vol%. By dispersing, a silicone resin composition (thermally conductive resin composition) was prepared.

The two-component addition reaction type liquid silicone resin is a mixture of a silicone A liquid (base) and a silicone B liquid (curing agent) in a ratio of 19 vol%: 16 vol%. The obtained silicone resin composition was extruded into a rectangular parallelepiped mold 40 mm × 40 mm in which a PET film subjected to a peeling treatment was adhered to the inner wall to form a silicone molded body. The obtained silicone molded product was cured in an oven at 100 ° C. for 6 hours to obtain a cured silicone product (a thermally conductive resin molded product). Next, the obtained cured silicone material is cut by an ultrasonic cutter perpendicular to the long axis of the oriented carbon fiber, that is, at a cutting angle of 90 ° (orientation angle: 90 °), and the heat conduction is performed with a thickness of 1 mm. A sample of a molded sheet was obtained. The slicing speed of the ultrasonic cutter was 50 mm per second.

A 16 mm x 10 mm heat conductive sheet was cut out of the obtained 40 mm x 40 mm thermally conductive sheet (Fig. 6), and placed on the stage of the pickup device. From the back of the stage, a thermally conductive molded sheet containing magnetic powder was fixed with an electromagnet, and a predetermined thermal conductive sheet in the thermally conductive molded sheet placed on the stage was picked up by a transfer head equipped with a suction nozzle. . The magnetic flux density of the electromagnet was 2 Gauss. From the thermally conductive molded sheet according to Example 2, the thermal conductive sheet could be picked up with good yield without the adjacent thermal conductive sheet adhering.

[Example 3]
In Example 3, two-component addition-reaction liquid silicone resin was prepared by adding Fe-Si-B-Cr amorphous magnetic particles having an average particle diameter of 5 μm and pitch-based carbon fibers having an average fiber length of 200 μm (thermally conductive fiber: Japan). (Manufactured by Graphite Fiber Co., Ltd.) such that the two-component addition reaction type liquid silicone resin: amorphous magnetic particles: pitch-based carbon fiber: alumina = 35 vol%: 45 vol%: 6 vol%: 14 vol% By dispersing, a silicone resin composition (thermally conductive resin composition) was prepared.

The two-component addition reaction type liquid silicone resin is a mixture of a silicone A liquid (base) and a silicone B liquid (curing agent) in a ratio of 19 vol%: 16 vol%. The obtained silicone resin composition was extruded into a rectangular parallelepiped mold 40 mm × 40 mm in which a PET film subjected to a peeling treatment was adhered to the inner wall to form a silicone molded body. The obtained silicone molded product was cured in an oven at 100 ° C. for 6 hours to obtain a cured silicone product (a thermally conductive resin molded product). Next, the obtained cured silicone material is cut by an ultrasonic cutter perpendicular to the long axis of the oriented carbon fiber, that is, at a cutting angle of 90 ° (orientation angle: 90 °), and the heat conduction is performed with a thickness of 1 mm. A sample of a molded sheet was obtained. The slicing speed of the ultrasonic cutter was 50 mm per second.

A 16 mm x 10 mm heat conductive sheet was cut out of the obtained 40 mm x 40 mm thermally conductive sheet (Fig. 6), and placed on the stage of the pickup device. From the back of the stage, a thermally conductive molded sheet containing magnetic powder was fixed with an electromagnet, and a predetermined thermal conductive sheet in the thermally conductive molded sheet placed on the stage was picked up by a transfer head equipped with a suction nozzle. . The magnetic flux density of the electromagnet was 2 Gauss. From the heat conductive molded sheet according to Example 3, the heat conductive sheet could be picked up with good yield without the adjacent heat conductive sheet adhering.

[Example 4]
In Example 4, two-component addition-reaction-type liquid silicone resin was prepared by adding Fe-Si-B-Cr amorphous magnetic particles having an average particle diameter of 5 μm and pitch-based carbon fibers having an average fiber length of 200 μm (heat conductive fiber: Japan). (Manufactured by Graphite Fiber Co., Ltd.) in a volume ratio of two-component addition-reaction liquid silicone resin: amorphous magnetic particles: pitch-based carbon fiber: alumina = 35 vol%: 45 vol%: 4 vol%: 16 vol%. By dispersing, a silicone resin composition (thermally conductive resin composition) was prepared.

The two-component addition reaction type liquid silicone resin is a mixture of a silicone A liquid (base) and a silicone B liquid (curing agent) in a ratio of 19 vol%: 16 vol%. The obtained silicone resin composition was extruded into a rectangular parallelepiped mold 40 mm × 40 mm in which a PET film subjected to a peeling treatment was adhered to the inner wall to form a silicone molded body. The obtained silicone molded product was cured in an oven at 100 ° C. for 6 hours to obtain a cured silicone product (a thermally conductive resin molded product). Next, the obtained cured silicone material is cut by an ultrasonic cutter perpendicular to the long axis of the oriented carbon fiber, that is, at a cutting angle of 90 ° (orientation angle: 90 °), and the heat conduction is performed with a thickness of 1 mm. A sample of a molded sheet was obtained. The slicing speed of the ultrasonic cutter was 50 mm per second.

A 16 mm x 10 mm heat conductive sheet was cut out of the obtained 40 mm x 40 mm thermally conductive sheet (Fig. 6), and placed on the stage of the pickup device. From the back of the stage, a thermally conductive molded sheet containing magnetic powder was fixed with an electromagnet, and a predetermined thermal conductive sheet in the thermally conductive molded sheet placed on the stage was picked up by a transfer head equipped with a suction nozzle. . The magnetic flux density of the electromagnet was 2 Gauss. From the thermally conductive molded sheet according to Example 4, the thermal conductive sheet could be picked up with good yield without the adjacent thermal conductive sheet adhering.

[Example 5]
In Example 5, two-component addition reaction type liquid silicone resin was prepared by adding Fe-Si-B-Cr amorphous magnetic particles having an average particle size of 5 μm and pitch-based carbon fibers having an average fiber length of 200 μm (thermal conductive fiber: Japan). (Manufactured by Graphite Fiber Co., Ltd.) in a volume ratio of two-component addition-reaction liquid silicone resin: amorphous magnetic particles: pitch-based carbon fiber: alumina = 35 vol%: 45 vol%: 4 vol%: 16 vol%. By dispersing, a silicone resin composition (thermally conductive resin composition) was prepared.

The two-component addition reaction type liquid silicone resin is a mixture of a silicone A liquid (base) and a silicone B liquid (curing agent) in a ratio of 19 vol%: 16 vol%. The obtained silicone resin composition was extruded into a rectangular parallelepiped mold 50 mm × 50 mm in which a PET film subjected to a release treatment was adhered to an inner wall to form a silicone molded body. The obtained silicone molded product was cured in an oven at 100 ° C. for 6 hours to obtain a cured silicone product (a thermally conductive resin molded product). Next, the obtained cured silicone material is cut by an ultrasonic cutter perpendicular to the long axis of the oriented carbon fiber, that is, at a cutting angle of 90 ° (orientation angle: 90 °), and the heat conduction is performed with a thickness of 1 mm. A sample of a molded sheet was obtained. The slicing speed of the ultrasonic cutter was 50 mm per second.

(4) A cut was made from the obtained 50 mm × 50 mm thermally conductive sheet so that 16 10 mm × 10 mm thermally conductive sheets could be obtained (FIG. 6), and the sheet was placed on the stage of a pickup device. From the back of the stage, a thermally conductive molded sheet containing magnetic powder is fixed by an electromagnet, the thermally conductive sheet is picked up by a transfer head equipped with a suction nozzle, and the heat is transferred to a receiving recess of the carrier tape wound in a reel shape. The conductive sheet was put. The magnetic flux density of the electromagnet was 2 Gauss. From the thermally conductive molded sheet according to Example 5, the thermal conductive sheet could be picked up with good yield without the adjacent thermal conductive sheet adhering. When mounting the heat conductive sheet, a carrier tape was mounted on the stage, and the heat conductive sheet was picked up from the housing recess by a transfer head equipped with a suction nozzle while applying an electromagnet from the back of the stage to the back side of the housing recess with an electromagnet. The magnetic flux density of the electromagnet was 2 Gauss. At the time of mounting, similarly, the heat conductive sheet could be picked up with good yield.

[Example 6]
In Example 6, two-component addition-reaction-type liquid silicone resin was prepared by adding Fe-Si-B-Cr amorphous magnetic particles having an average particle diameter of 5 μm and pitch-based carbon fibers having an average fiber length of 200 μm (thermal conductive fiber: Japan). (Manufactured by Graphite Fiber Co., Ltd.) in a volume ratio of two-component addition-reaction liquid silicone resin: amorphous magnetic particles: pitch-based carbon fiber: alumina = 35 vol%: 45 vol%: 4 vol%: 16 vol%. By dispersing, a silicone resin composition (thermally conductive resin composition) was prepared.

The two-component addition reaction type liquid silicone resin is a mixture of a silicone A liquid (base) and a silicone B liquid (curing agent) in a ratio of 19 vol%: 16 vol%. The obtained silicone resin composition was extruded into a rectangular parallelepiped mold 50 mm × 50 mm in which a PET film subjected to a release treatment was adhered to an inner wall to form a silicone molded body. The obtained silicone molded product was cured in an oven at 100 ° C. for 6 hours to obtain a cured silicone product (a thermally conductive resin molded product). Next, the obtained cured silicone material is cut by an ultrasonic cutter perpendicular to the long axis of the oriented carbon fiber, that is, at a cutting angle of 90 ° (orientation angle: 90 °), and the heat conduction is performed with a thickness of 1 mm. A sample of a molded sheet was obtained. The slicing speed of the ultrasonic cutter was 50 mm per second.

(4) The silicone A liquid (main agent) and the silicone B liquid (curing agent) of the two-component addition reaction type liquid silicone resin were cured to obtain a silicone film having a thickness of 20 μm. The obtained silicone film was pressed and transferred to a thermally conductive molded sheet of 50 mm × 50 mm to form an adhesive layer. The condition of the silicone film transfer press was 0.5 MPa × 80 ° C. × 3 minutes. Next, a cut is made in the thermally conductive molded sheet to which the silicone film has been transferred so that 16 thermally conductive sheets of 10 mm × 10 mm can be removed (FIG. 6), and the surface to which the silicone film has been transferred is arranged on the stage of the pickup device. did. The heat conductive sheet was picked up from the heat conductive molded sheet by a transfer head equipped with a suction nozzle, and the heat conductive sheet was placed in the receiving recess of the carrier tape wound in a reel shape. At this time, the heat conductive sheet was accommodated with the surface on which the silicone film was transferred facing the bottom of the accommodation recess. From the thermally conductive molded sheet according to Example 6, the thermal conductive sheet could be picked up with good yield without the adjacent thermal conductive sheet adhering. When mounting the heat conductive sheet, the heat conductive sheet was picked up from the housing recess by the transfer head equipped with the electromagnet. The magnetic flux density of the electromagnet was 2 Gauss. At the time of mounting, the silicone film was transferred to one surface of the heat conductive sheet, so that it could be easily fixed to the adherend.

[Example 7]
In Example 7, two-component addition reaction type liquid silicone resin was prepared by adding Fe—Si—B—Cr amorphous magnetic particles having an average particle diameter of 5 μm and pitch-based carbon fibers having an average fiber length of 200 μm (thermal conductive fiber: Japan). (Manufactured by Graphite Fiber Co., Ltd.) in a volume ratio of two-component addition-reaction liquid silicone resin: amorphous magnetic particles: pitch-based carbon fiber: alumina = 35 vol%: 45 vol%: 4 vol%: 16 vol%. By dispersing, a silicone resin composition (thermally conductive resin composition) was prepared.

The two-component addition reaction type liquid silicone resin is a mixture of a silicone A liquid (base) and a silicone B liquid (curing agent) in a ratio of 19 vol%: 16 vol%. The obtained silicone resin composition was extruded into a rectangular parallelepiped mold 50 mm × 50 mm in which a PET film subjected to a release treatment was adhered to an inner wall to form a silicone molded body. The obtained silicone molded product was cured in an oven at 100 ° C. for 6 hours to obtain a cured silicone product (a thermally conductive resin molded product). Next, the obtained cured silicone material is cut by an ultrasonic cutter perpendicular to the long axis of the oriented carbon fiber, that is, at a cutting angle of 90 ° (orientation angle: 90 °), and the heat conduction is performed with a thickness of 1 mm. A sample of a molded sheet was obtained. The slicing speed of the ultrasonic cutter was 50 mm per second.

ア ク リ ル An acrylic pressure-sensitive adhesive was spray-coated on one surface of the obtained 50 mm × 50 mm thermally conductive molded sheet to form a pressure-sensitive adhesive layer. Next, a cut was made so that 16 heat conductive sheets of 10 mm × 10 mm could be taken out (FIG. 6), and the coated surface of the adhesive was placed on the stage of the pickup device. The heat conductive sheet was picked up from the heat conductive molded sheet by a transfer head equipped with a suction nozzle, and the heat conductive sheet was placed in the receiving recess of the carrier tape wound in a reel shape. At this time, the heat conductive sheet was accommodated with the surface on which the acrylic pressure-sensitive adhesive was applied facing the bottom of the accommodation recess. The heat conductive sheet could be picked up with good yield from the heat conductive molded sheet according to Example 7 without adhering the adjacent heat conductive sheet. When mounting the heat conductive sheet, the heat conductive sheet was picked up from the housing recess by the transfer head equipped with the electromagnet. The magnetic flux density of the electromagnet was 2 gauss. Also at the time of mounting, since the acrylic pressure-sensitive adhesive was applied to one surface of the heat conductive sheet, it was easily fixed to the adherend.

[Comparative Example 1]
In Comparative Example 1, silica powder of 3 to 5 μm was used instead of the magnetic powder, and the mixture was in a volume ratio of two-component addition-reaction-type liquid silicone resin: silica: pitch-based carbon fiber = 35 vol%: 53 vol% : 12 vol% to prepare a silicone resin composition (thermally conductive resin composition). Other steps were the same as in Example 1.

A cut was made in the obtained 40 mm × 40 mm thermally conductive sheet so that 16 10 mm × 10 mm thermally conductive sheets could be obtained, and placed on the stage of the pickup device. A predetermined heat conductive sheet in the heat conductive molded sheet placed on the stage was picked up by a transfer head equipped with a suction nozzle, but did not have a magnetic field applying means such as an electromagnet on the back surface of the stage, Since the magnetic powder was not contained in the thermally conductive molded sheet, the thermally conductive molded sheet could not be held on the stage, and the adjacent thermal conductive sheet was attached, so the evaluation was NG.

[Comparative Example 2]
In Comparative Example 2, alumina having an average particle diameter of 4 μm, which had been subjected to a coupling treatment with a silicic coupling agent, and pitch-based carbon fibers having an average fiber length of 150 μm (a thermally conductive fiber: Nippon Graphite Fiber Co., Ltd.) and aluminum nitride having an average particle size of 1 μm, which has been subjected to a coupling treatment with a silane coupling agent, in a volume ratio of two liquid addition reaction type liquid silicone resin: alumina particles: pitch-based carbon fiber : Room temperature aluminum = 34 vo 1%: 20 vo 1%: 22 vo 1%: 24 vo 1% to prepare a silicone resin composition (thermally conductive resin composition). The two-component addition reaction type liquid silicone resin is obtained by mixing a silicone A liquid (base agent) and a silicone B liquid (curing agent) at a ratio of 17 vol%: 17 vol%. Other steps are the same as those in the first embodiment.

A cut was made in the obtained 40 mm × 40 mm thermally conductive sheet so that 16 10 mm × 10 mm thermally conductive sheets could be obtained, and placed on the stage of the pickup device. A predetermined heat conductive sheet in the heat conductive molded sheet placed on the stage was picked up by a transfer head equipped with a suction nozzle, but did not have a magnetic field applying means such as an electromagnet on the back surface of the stage, Since the magnetic powder was not contained in the thermally conductive molded sheet, the thermally conductive molded sheet could not be held on the stage, and the adjacent thermal conductive sheet was attached, so the evaluation was NG.

From the above Examples and Comparative Examples, by providing the thermally conductive molded sheet with magnetism, at least one of the stage and the transfer head is provided with a holding mechanism for magnetizing and holding the thermally conductive molded sheet. It can be seen that the heat conductive sheet adjacent to the heat conductive sheet to be picked up can be held on the stage to prevent adhesion, and the heat conductive sheet can be picked up with good yield.

1 pickup device, 2 stage, 3 transfer head, 4 holding mechanism, 20 thermally conductive molded sheet, 21 thermal conductive sheet

Claims (15)

1. A stage on which a thermally conductive molded sheet having a plurality of thermally conductive sheets that are cut into small pieces by being provided with cuts is placed,
   A transfer head for picking up and moving a heat conductive sheet from the heat conductive molded sheet placed on the stage,
   The heat conductive molded sheet has magnetism,
   A pickup device provided with a holding mechanism for magnetizing and holding at least one of the thermally conductive molded sheet or the thermally conductive sheet on at least one of the stage and the transfer head.
2. The holding mechanism, at the time of pickup of the heat conductive sheet, magnetizes at least one of the heat conductive molded body or the heat conductive sheet,
   2. The pickup device according to claim 1, wherein magnetization is released after picking up the heat conductive sheet.
3. (3) The pickup device according to (1) or (2), wherein the holding mechanism includes a permanent magnet or a solenoid electromagnet.
4. In a mounting device that picks up a heat conductive sheet and mounts it on an electronic component or electronic device,
   The above mounting device,
   A stage on which a thermally conductive molded sheet having a plurality of thermally conductive sheets that are cut into small pieces by being provided with cuts is placed,
   A transfer head for picking up and moving a heat conductive sheet from the heat conductive molded sheet placed on the stage,
   The heat conductive molded sheet has magnetism,
   A mounting apparatus, wherein at least one of the stage and the transfer head is provided with a holding mechanism for magnetizing and holding at least one of the thermally conductive molded sheet and the thermally conductive sheet.
5. A stage on which a thermally conductive molded sheet having a plurality of thermally conductive sheets that are cut into small pieces by being provided with cuts is placed,
   A transfer head for picking up and moving a heat conductive sheet from the heat conductive molded sheet placed on the stage,
   The heat conductive molded sheet has magnetism,
   By a holding mechanism provided on at least one of the stage or the transfer head, at least one of the heat conductive molded sheet or the heat conductive sheet is magnetized and held,
   A pickup method for picking up the heat conductive sheet by the transfer head.
6. 6. The pickup method according to claim 5, wherein the thermally conductive molded sheet contains a magnetic powder.
7. 6. The pickup method according to claim 5, wherein the heat conductive molded sheet contains a magnetic powder and further contains a heat conductive filler.
8. The pickup method according to claim 7, wherein the thermal conductive filler has at least a fibrous thermal conductive filler.
9. The pick-up method according to claim 8, wherein the fibrous heat conductive filler is oriented in one direction.
10. 10. The pickup method according to claim 8, wherein the fibrous heat conductive filler is a carbon fiber.
11. (10) The pickup method according to any one of (7) to (9), wherein the heat conductive filler further contains an inorganic filler.
12. 12. The pickup method according to claim 11, wherein the content of the fibrous heat conductive filler is 4 to 40% by volume, and the content of the heat conductive filler is 15 to 75% by volume.
13. In a mounting method of picking up a heat conductive sheet and mounting it on an electronic component or electronic device,
    A stage on which a thermally conductive molded sheet having a plurality of thermally conductive sheets that are cut into small pieces by being provided with cuts is placed,
    A transfer head for picking up and moving a heat conductive sheet from the heat conductive molded sheet placed on the stage,
    The heat conductive molded sheet has magnetism,
    By a holding mechanism provided on at least one of the stage or the transfer head, at least one of the heat conductive molded sheet or the heat conductive sheet is magnetized and held,
    A mounting method of picking up the heat conductive sheet by the transfer head and mounting the heat conductive sheet on an electronic component or electronic device.
14. A carrier tape comprising a plurality of heat conductive molded sheets having a plurality of heat conductive sheets cut into small pieces by being provided with notches or a plurality of housing recesses for housing the heat conductive sheets, wherein the housing recesses are sealed with a cover film. When,
    A transfer head for picking up the heat conductive sheet from the accommodation recess,
    The heat conductive molded sheet and the heat conductive sheet have magnetism,
    A holding mechanism provided on at least one of the stage or the transfer head on which the carrier tape is mounted, magnetizes and holds the thermally conductive molded sheet or the thermally conductive sheet, and the transfer head A pickup method for picking up a heat conductive sheet.
15. The pick-up method according to claim 14, wherein the heat conductive molded sheet has a pressure-sensitive adhesive layer formed on one surface thereof, and is accommodated with the surface on which the adhesive layer is formed facing the bottom surface of the accommodation recess.

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