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WO2020086173A3 - Espaceur thermoconducteur pour chambre de traitement au plasma - Google Patents

Espaceur thermoconducteur pour chambre de traitement au plasma Download PDF

Info

Publication number
WO2020086173A3
WO2020086173A3 PCT/US2019/049563 US2019049563W WO2020086173A3 WO 2020086173 A3 WO2020086173 A3 WO 2020086173A3 US 2019049563 W US2019049563 W US 2019049563W WO 2020086173 A3 WO2020086173 A3 WO 2020086173A3
Authority
WO
WIPO (PCT)
Prior art keywords
plasma processing
processing chamber
heat conductive
conductive spacer
lid assembly
Prior art date
Application number
PCT/US2019/049563
Other languages
English (en)
Other versions
WO2020086173A2 (fr
Inventor
Beom Soo Park
Robin L. Tiner
Sang Jeong Oh
Gaku Furuta
Allen K. Lau
Jianheng LI
Lai ZHAO
Soo Young Choi
Jeevan Prakash SEQUEIRA
Wei-Ting Chen
Hsiao-Ling Yang
Cheng-Hang Hsu
Won Ho Sung
Hyun Young Hong
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/143,280 external-priority patent/US20200098549A1/en
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to CN201980066147.1A priority Critical patent/CN112823406B/zh
Priority to JP2021515521A priority patent/JP7369183B2/ja
Priority to KR1020217011718A priority patent/KR102529845B1/ko
Publication of WO2020086173A2 publication Critical patent/WO2020086173A2/fr
Publication of WO2020086173A3 publication Critical patent/WO2020086173A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357—Generation remote from the workpiece, e.g. down-stream
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32522—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Bathtub Accessories (AREA)

Abstract

Des aspects de la présente invention concernent un espaceur thermoconducteur destiné à être utilisé dans un ensemble couvercle d'une chambre de traitement au plasma. Dans un mode de réalisation, une chambre de traitement au plasma comprend un corps de chambre, et un ensemble couvercle accouplé au corps de chambre délimitant un volume de traitement. L'ensemble couvercle comprend une plaque de support accouplée au corps de chambre, et un diffuseur ayant une pluralité d'ouvertures de gaz formées à travers celui-ci. L'ensemble couvercle comprend également un espaceur thermoconducteur disposé entre la plaque de support et le diffuseur pour transférer la chaleur du diffuseur à la plaque de support. La chambre de traitement au plasma comprend un support de substrat disposé à l'intérieur du volume de traitement.
PCT/US2019/049563 2018-09-26 2019-09-04 Espaceur thermoconducteur pour chambre de traitement au plasma WO2020086173A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201980066147.1A CN112823406B (zh) 2018-09-26 2019-09-04 用于等离子体处理腔室的导热间隔件
JP2021515521A JP7369183B2 (ja) 2018-09-26 2019-09-04 プラズマ処理チャンバのための熱伝導スペーサ
KR1020217011718A KR102529845B1 (ko) 2018-09-26 2019-09-04 플라즈마 프로세싱 챔버용 열 전도성 스페이서

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US16/143,280 US20200098549A1 (en) 2018-09-26 2018-09-26 Heat conductive spacer for plasma processing chamber
US16/143,280 2018-09-26
US201962892978P 2019-08-28 2019-08-28
US62/892,978 2019-08-28

Publications (2)

Publication Number Publication Date
WO2020086173A2 WO2020086173A2 (fr) 2020-04-30
WO2020086173A3 true WO2020086173A3 (fr) 2020-07-02

Family

ID=70332163

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2019/049563 WO2020086173A2 (fr) 2018-09-26 2019-09-04 Espaceur thermoconducteur pour chambre de traitement au plasma

Country Status (5)

Country Link
JP (1) JP7369183B2 (fr)
KR (1) KR102529845B1 (fr)
CN (1) CN112823406B (fr)
TW (1) TWI803698B (fr)
WO (1) WO2020086173A2 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240115340A (ko) * 2021-12-15 2024-07-25 램 리써치 코포레이션 에칭 챔버 내 부분들 사이의 개선된 열 인터페이스 및 전기 인터페이스
US20240068096A1 (en) * 2022-08-30 2024-02-29 Applied Materials, Inc. Showerhead Assembly with Heated Showerhead

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120325796A1 (en) * 2011-06-21 2012-12-27 Tokyo Electron Limited Semiconductor manufacturing apparatus
US20160118284A1 (en) * 2014-10-22 2016-04-28 Panasonic Intellectual Property Management Co., Ltd. Plasma processing apparatus
US20170229290A1 (en) * 2016-02-10 2017-08-10 Hitachi High-Technologies Corporation Vacuum processing apparatus
US20180174804A1 (en) * 2012-05-09 2018-06-21 Lam Research Corporation Compression member for use in showerhead electrode assembly
US20180174869A1 (en) * 2016-12-21 2018-06-21 Samsung Electronics Co., Ltd. Temperature controller and a plasma-processing apparatus including the same

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4124383B2 (ja) * 1998-04-09 2008-07-23 財団法人国際科学振興財団 マイクロ波励起プラズマ装置用のシャワープレート及びマイクロ波励起プラズマ装置
KR100767762B1 (ko) * 2000-01-18 2007-10-17 에이에스엠 저펜 가부시기가이샤 자가 세정을 위한 원격 플라즈마 소스를 구비한 cvd 반도체 공정장치
JP4698251B2 (ja) * 2004-02-24 2011-06-08 アプライド マテリアルズ インコーポレイテッド 可動又は柔軟なシャワーヘッド取り付け
US20090071403A1 (en) * 2007-09-19 2009-03-19 Soo Young Choi Pecvd process chamber with cooled backing plate
US8147648B2 (en) 2008-08-15 2012-04-03 Lam Research Corporation Composite showerhead electrode assembly for a plasma processing apparatus
JP4963694B2 (ja) * 2008-09-29 2012-06-27 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP4786731B2 (ja) * 2009-06-12 2011-10-05 シャープ株式会社 プラズマｃｖｄ装置
JP5398837B2 (ja) * 2009-08-10 2014-01-29 三菱電機株式会社 プラズマｃｖｄ装置、プラズマ電極および半導体膜の製造方法
US20110061810A1 (en) * 2009-09-11 2011-03-17 Applied Materials, Inc. Apparatus and Methods for Cyclical Oxidation and Etching
US20140174361A1 (en) * 2012-12-21 2014-06-26 Applied Materials, Inc. Heated backing plate
JP5971870B2 (ja) 2013-11-29 2016-08-17 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及び記録媒体
CN205576274U (zh) * 2014-11-07 2016-09-14 应用材料公司 处理腔室
US11004662B2 (en) * 2017-02-14 2021-05-11 Lam Research Corporation Temperature controlled spacer for use in a substrate processing chamber

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120325796A1 (en) * 2011-06-21 2012-12-27 Tokyo Electron Limited Semiconductor manufacturing apparatus
US20180174804A1 (en) * 2012-05-09 2018-06-21 Lam Research Corporation Compression member for use in showerhead electrode assembly
US20160118284A1 (en) * 2014-10-22 2016-04-28 Panasonic Intellectual Property Management Co., Ltd. Plasma processing apparatus
US20170229290A1 (en) * 2016-02-10 2017-08-10 Hitachi High-Technologies Corporation Vacuum processing apparatus
US20180174869A1 (en) * 2016-12-21 2018-06-21 Samsung Electronics Co., Ltd. Temperature controller and a plasma-processing apparatus including the same

Also Published As

Publication number Publication date
JP2022501501A (ja) 2022-01-06
WO2020086173A2 (fr) 2020-04-30
JP7369183B2 (ja) 2023-10-25
KR20210047375A (ko) 2021-04-29
TWI803698B (zh) 2023-06-01
CN112823406A (zh) 2021-05-18
KR102529845B1 (ko) 2023-05-08
TW202028520A (zh) 2020-08-01
CN112823406B (zh) 2024-03-12

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