WO2019208141A1 - シリコーン粘着剤用剥離フィルム及びその製造方法 - Google Patents
シリコーン粘着剤用剥離フィルム及びその製造方法 Download PDFInfo
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- WO2019208141A1 WO2019208141A1 PCT/JP2019/014903 JP2019014903W WO2019208141A1 WO 2019208141 A1 WO2019208141 A1 WO 2019208141A1 JP 2019014903 W JP2019014903 W JP 2019014903W WO 2019208141 A1 WO2019208141 A1 WO 2019208141A1
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- group
- fluorine
- hydrolyzable
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- 0 CC(C)(*)C(C)(C)[N+]([O-])=O Chemical compound CC(C)(*)C(C)(C)[N+]([O-])=O 0.000 description 1
- OZSQDNCDEHVGBC-UHFFFAOYSA-N CC(C)(C(C)(C)O)N Chemical compound CC(C)(C(C)(C)O)N OZSQDNCDEHVGBC-UHFFFAOYSA-N 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/002—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from unsaturated compounds
- C08G65/005—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from unsaturated compounds containing halogens
- C08G65/007—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from unsaturated compounds containing halogens containing fluorine
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/22—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring
- C08G65/223—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring containing halogens
- C08G65/226—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring containing halogens containing fluorine
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
- C09D171/02—Polyalkylene oxides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/002—Priming paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/005—Presence of halogenated polymer in the release coating
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
- C09J2483/003—Presence of polysiloxane in the primer coating
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
- C09J2483/005—Presence of polysiloxane in the release coating
Definitions
- the present invention relates to a release film for a silicone pressure-sensitive adhesive and a method for producing the same, and more specifically, a primer layer is formed using an organosilicon compound having a plurality of silanol groups (hydroxyl groups bonded to silicon atoms) between the release layer and the release layer.
- the present invention relates to a release film for a silicone adhesive and a method for producing the same.
- a cured film of a silicone composition is formed on the substrate surface to provide releasability. This is generally referred to as release paper.
- silicone-based adhesives based on organopolysiloxane are excellent in heat resistance, cold resistance, chemical resistance, electrical insulation, low toxicity, etc. It has been. Silicone-based adhesives have a very strong adhesive force, and in order to make the adhesive tape or label coated with them easily peel from the substrate, the cured silicone film formed on the substrate is separated. It is necessary to have excellent moldability.
- Patent Document 1 discloses a silicone composition that provides a cured silicone film having excellent releasability, such as C n F 2n + 1 CH 2 CH 2 — (where n is 1 or more).
- An organopolysiloxane composition having a fluorine-containing substituent represented by an integer) is disclosed in Japanese Patent Publication No. 4-76391 (Patent Document 2) using the formula F [CF (CF 3 ) CF 2 O] n CF ( An organopolysiloxane composition having a fluorine-containing substituent represented by CF 3 ) CF 2 OCH 2 CH 2 CH 2 — (n is an integer of 1 to 5) has been proposed.
- silicone compositions have a relatively light release force with respect to silicone adhesives, but they are remarkably peeled over time, and in addition, they are peeled off differently on each side of process paper or double-sided adhesive tape. Although a heavy peeling force is required to impart force, there is no peeling force control agent such as a general silicone composition for release paper, and therefore there is a problem that it cannot be used for such applications.
- peeling force control agent such as a general silicone composition for release paper
- the present invention has been made in view of the above circumstances, there is little change in peeling force with time, even a thin layer has little transition from a peeling layer to an adhesive over time, and light peeling to heavy peeling depending on the required application.
- a method for producing a release film for a silicone pressure-sensitive adhesive film in which a release film with a controllable peel force and a release layer having excellent stability on various base materials is formed by a wet method or a dry method, is provided. It is intended.
- the present inventors have wet applied a solution containing an organosilicon compound having a plurality of silanol groups in the molecule and a solvent on at least one surface of the substrate.
- a step of drying the solvent, forming and laminating a primer layer on at least one surface of the substrate, and a solution containing a hydrolyzable fluorine-containing compound and a solvent on the outer surface of the primer layer After the wet coating, the solvent is dried, or the hydrolyzable fluorine-containing compound obtained by evaporating the solvent from the solution is dry-coated, and the hydrolyzable fluorine-containing compound is cured to form a primer layer.
- An organosilicon compound having a plurality of silanol groups in the molecule on at least one surface of various substrates obtained by a method having a step of forming and laminating a release layer on the outer surface
- the release film for the silicone pressure-sensitive adhesive provided with the above can stably provide a release film excellent in release characteristics to various substrates, and the primer layer and the release layer can be used in a room temperature (25 ° C.) process. The inventors have found that it can be applied and have come to make the present invention.
- a release film for a silicone pressure-sensitive adhesive comprising a primer layer as a first layer on at least one surface of a substrate and a release layer as a second layer on the outer surface of the primer layer.
- the primer layer is composed of a layer having a thickness of 0.5 to 500 nm mainly composed of an organosilicon compound having a plurality of silanol groups in the molecule, and the release layer is formed from a hydrolyzable fluorine-containing compound cured product.
- a release film for a silicone pressure-sensitive adhesive comprising a layer having a thickness of 0.5 to 30 nm as a main component.
- the release film according to [1], wherein the organosilicon compound having a plurality of silanol groups in the molecule is a hydrolysis / partial condensate of tetraalkoxysilane.
- the hydrolyzable fluorine-containing compound has at least one hydrolyzable silyl group at the end of at least one molecular chain, and the hydrolyzable silyl group is an alkoxy group having 1 to 12 carbon atoms or 2 to 12 carbon atoms.
- the hydrolyzable fluorine-containing compound contains — (CF 2 ) d —O— (CF 2 O) p (CF 2 CF 2 O) q (CF 2 CF 2 CF 2 O) r (CF 2 CF 2 CF) in the molecule.
- the hydrolyzable fluorine-containing compound is any one of [1] to [4], which is at least one selected from fluorine-containing hydrolyzable organosilicon compounds represented by the following general formulas (1) to (5) Release film.
- (A-Rf) ⁇ - ZW ⁇ (1) Rf- (ZW ⁇ ) 2 (2) Z ′-(Rf-ZW ⁇ ) ⁇ (3)
- A is a fluorine atom, a hydrogen atom, or a monovalent fluorine-containing group having a —CF 3 group, —CF 2 H group or —CH 2 F group at the end, and Z and Z ′ are independently a single bond or nitrogen It is a divalent to octavalent organic group which may contain an atom, oxygen atom, silicon atom, phosphorus atom or sulfur atom, and may be fluorine-substituted, and W is a monovalent having a hydrolyzable group at the terminal.
- the manufacturing method of the peeling film in any one of.
- a release film for a silicone pressure-sensitive adhesive having a release surface excellent in release characteristics and having a tight adhesion.
- the method for producing the release film can be formed by a wet process (brush coating, spin coating, spray coating, gravure coating, die coating, bar coating, slit coating) without requiring a vacuum process or a high-temperature heating process. It gives a silicone adhesive with a release surface that exhibits light / heavy release properties with little change over time. In particular, it has been difficult to use, in particular, a differential release film for a baseless silicone adhesive sheet, Useful for peelable films such as double-sided tape.
- the release film for a silicone pressure-sensitive adhesive of the present invention has a primer layer as a first layer on at least one surface, preferably one surface of a substrate, and further has a primer layer as a second layer on the outer surface of the primer layer.
- the release layer is a layer having a thickness of 0.5 to 30 nm mainly composed of a cured product of a hydrolyzable fluorine-containing compound.
- a solution containing an organosilicon compound having a plurality of silanol groups in a molecule and a solvent is wet-coated on the surface (at least one surface) of various substrates, and then the solvent is dried to prepare a primer.
- the solvent is dried, or
- the surface of various substrates can be applied by dry coating the hydrolyzable fluorine-containing compound obtained by evaporating the solvent from the solution, and by forming and laminating the release layer (second layer) by curing the hydrolyzable fluorine-containing compound.
- a primer layer (first layer) having a film thickness of 0.5 to 500 nm mainly composed of an organosilicon compound having a plurality of silanol groups in the molecule, and further has a hydrolyzable fluorine-containing layer on the surface.
- a release film for silicone pressure-sensitive adhesive having a release layer having a thickness of 0.5 ⁇ 30 nm as a main component (the second layer) of the cured product of the object is obtained.
- Resin, paper, or a metal is used, Specifically, Polyester, such as a polyethylene terephthalate, Polypropylene, Polyethylene, Polyvinyl chloride, Polytetrafluoroethylene, A polyimide, etc. Plastic films and sheets obtained from these synthetic resins, paper substrates such as glassine paper, kraft paper, clay coated paper, laminated paper substrates such as polyethylene laminated fine paper, polyethylene laminated kraft paper, metals such as aluminum foil and copper foil Examples include foil. Among these, polyester films such as polyethylene terephthalate, polyimide films, and the like are preferable.
- the thickness of the substrate is not particularly limited, but is preferably 10 to 200 ⁇ m, and more preferably 25 to 125 ⁇ m. In the present invention, the thickness of the substrate can be measured with a micrometer or the like.
- the primer layer (first layer) formed and laminated on at least one surface of the base material is mainly composed of an organosilicon compound having a plurality of silanol groups in the molecule, preferably 50% by mass of the organosilicon compound.
- the film thickness is 0.5 to 500 nm.
- the primer layer (first layer) is formed by, for example, wet-coating a solution containing an organosilicon compound having a plurality of silanol groups in the molecule and a solvent on at least one surface of various substrates, and then drying the solvent. It can be formed (laminated) by removing.
- the organosilicon compound having a plurality of silanol groups in the molecule is preferably one having two or more silanol groups, more preferably three or more, still more preferably four or more in one molecule. If the number of silanol groups in the molecule is too small, the coating itself may be weakened.
- an organic silicon compound having a plurality of (two or more) silanol groups in the molecule means an organic compound having a silanol group content (silanol group concentration) of 0.0001 mol / g or more in the organosilicon compound. This means that it is a silicon compound (preferably an organopolysiloxane compound).
- the amount of silanol groups in the organosilicon compound is 0.0001 to 0.05 mol / g, particularly 0.001 to 0.00. It is preferably 04 mol / g, particularly 0.005 to 0.03 mol / g.
- An organosilicon compound having a plurality of silanol groups in the molecule hydrolyzes an organosilicon compound having a plurality of hydrolyzable groups such as alkoxy groups such as methoxy and ethoxy groups and halogen atoms such as chlorine atoms in the molecule.
- -It can be obtained by partial condensation.
- organosilicon compound having a plurality of hydrolyzable groups in the molecule methyltrimethoxysilane, dimethyldimethoxysilane, phenyltrimethoxysilane, dimethoxydiphenylsilane, tetramethoxysilane, tetraethoxysilane, methyltriethoxysilane , Dimethyldiethoxysilane, phenyltriethoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, decyltrimethoxysilane, 1,6-bis (trimethoxysilyl) Hexane, trifluoropropyltrimethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, 2- (3,4-epoxycyclohexyl)
- the partial condensate has a plurality of silanol groups (hydroxyl groups bonded to silicon atoms) in a molecule obtained by hydrolyzing an organosilicon compound such as organosilane having a plurality of hydrolyzable groups. It means an organopolysiloxane compound having a plurality of residual silanol groups in the molecule, obtained by partially dehydrating condensation of organosilane or its derivative.
- the hydrolyzed / partial condensate of the organosilicon compound having a plurality of hydrolyzable groups in the molecule preferably has a weight average molecular weight of 300 to 100,000, preferably 5,000 to 50,000. Is more preferable.
- a weight average molecular weight can be calculated
- the organosilicon compound having a plurality of silanol groups in the molecule used in the present invention is particularly preferably a hydrolyzed / partial condensate of tetraorganosilane such as tetramethoxysilane or tetraethoxysilane.
- the organosilicon compound having a plurality of silanol groups in the molecule is desirably diluted with a solvent.
- a solvent for dissolving the organosilicon compound having a plurality of silanol groups in the molecule, alcohols such as methanol, ethanol, isopropanol and butanol, and ethers such as propylene glycol monomethyl ether and polyethylene glycol monopropyl ether are preferred, It is not limited, and may be appropriately selected from wettability with the substrate and boiling point.
- the concentration of the organosilicon compound having a plurality of silanol groups in the molecule in the solution containing the organosilicon compound having a plurality of silanol groups in the molecule and the solvent is preferably from 0.01 to 10% by mass, preferably from 0.1 to 2%. More preferred is mass%. If the concentration is too low, the number of uncoated parts increases, and if the concentration is too high, secondary aggregation may occur between silanol groups.
- an ultraviolet absorber in a solution containing an organic silicon compound having a plurality of silanol groups in the molecule and a solvent
- an ultraviolet absorber in a solution containing an organic silicon compound having a plurality of silanol groups in the molecule and a solvent
- an ultraviolet absorber in a solution containing an organic silicon compound having a plurality of silanol groups in the molecule and a solvent
- an ultraviolet absorber in a light stabilizer, an antioxidant, a leveling agent, an antifoaming agent, a pigment, a dye
- Components such as surfactants such as dispersants, antistatic agents and antifogging agents
- the organic silicon compound having a plurality of silanol groups in the molecule of the primer layer obtained by removing the solvent is 50% by mass or more (50 to 100% by mass), particularly 80 to 100% by mass (ie,
- the above-mentioned optional components are preferably added in a range of 50% by mass or less (0 to 50% by mass, preferably
- Solutions containing an organosilicon compound having a plurality of silanol groups in the molecule and a solvent such as wet coating, especially dipping, brush coating, spin coating, spray coating, gravure coating, die coating, bar coating, slit coating, flow coating, etc.
- numerator can be formed by apply
- the heating may be performed at a temperature range that does not affect the substrate, for example, at 40 to 500 ° C. for 1 minute to 24 hours.
- the thickness of the primer layer (first layer) formed and laminated on at least one surface of the substrate is appropriately selected depending on the type of the substrate, but is usually 0.5 to 500 nm, preferably 3 to 200 nm, in particular 10 to 100 nm.
- the film thickness can be measured by a known method such as spectroscopic ellipsometry or X-ray reflectance method (hereinafter the same).
- the release layer (second layer) formed and laminated on the outer surface of the primer layer is a cured product having a film thickness of 0.5 to 30 nm mainly composed of a cured product of a hydrolyzable fluorine-containing compound. is there.
- the release layer (second layer) is formed by, for example, applying and curing a solution (release agent) containing a hydrolyzable fluorine-containing compound and a solvent on the outer surface of the formed primer layer surface (first layer). Can be formed (laminated).
- hydrolyzable fluorine-containing compound examples include Japanese Patent Application Laid-Open Nos. 2007-197425, 2007-297589, 2007-297543, 2008-088412, 2008-144144, JP 2010-031184, JP 2010-047516, JP 2011-116947, JP 2011-178835, JP 2014-084405, JP 2014-105235, JP Hydrolyzable fluorine-containing organosilicon compounds described in JP2013-253228A, JP2014-218639A, International Publication No. 2013/121984 (Patent Documents 3, 6 to 18), and the like can be used.
- the hydrolyzable fluorine-containing compound will be described more specifically.
- the hydrolyzable fluorine-containing compound according to the present invention has at least one hydrolyzable silyl group at the end of at least 1, preferably 1 to 14, more preferably 1 to 7, and preferably 1 to 7, respectively. 1 to 6, more preferably 2 to 4 (for example, having at least 1, preferably 2 to 60, more preferably 3 to 30 hydrolyzable silyl groups in one molecule)
- a fluorine compound is preferable, and the compound has 1 to 12 carbon atoms, particularly an alkoxy group having 1 to 10 carbon atoms such as a methoxy group, an ethoxy group, a propoxy group, and a butoxy group in one molecule, a methoxymethoxy group, and a methoxy group.
- C2-C12 alkoxyalkoxy groups such as ethoxy groups, especially C1-C10 acyloxy groups such as acetoxy groups, isopropenoxy
- a hydrolyzable silyl group selected from a alkenyloxy group having 2 to 10 carbon atoms such as a group, a silyl group having a halogen group such as a chloro group, a bromo group, an iodo group or an amino group, and a silazane group; More preferably, it is an organosilicon compound having a fluorine atom.
- the hydrolyzable fluorine-containing compound is preferably a compound having a fluorooxyalkylene group (that is, a monovalent or divalent perfluoropolyether residue) in the molecule.
- the fluorooxyalkylene group is a compound having a (poly) fluorooxyalkylene structure (a divalent linear perfluorooxyalkylene polymer residue) in which a plurality of repeating units represented by —C j F 2j O— are bonded. (Wherein j is an integer of 1 or more, preferably 1 to 6, more preferably 1 to 4).
- the repeating unit should have 3 to 500, preferably 15 to 200, more preferably 20 to 100, and more preferably 25 to 80.
- the repeating unit —C j F 2j O— may be either a linear type or a branched type.
- the following units may be mentioned, and two or more of these repeating units may be combined.
- the above (poly) fluorooxyalkylene structure (divalent linear perfluorooxyalkylene polymer residue) is, in particular, — (CF 2 ) d —O— (CF 2 O) p (CF 2 CF 2 O) q (CF 2 CF 2 CF 2 O) r (CF 2 CF 2 CF 2 O) s (CF (CF 3 ) CF 2 O) t — (CF 2 ) d —
- subjected p, q, r, s, and t may be couple
- d is independently an integer of 0 to 8, preferably an integer of 0 to 5, more preferably an integer of 0 to 2, and the unit may be linear or branched. In particular, it can be represented by the following structure.
- p ′, q ′, r ′, s ′, t ′ are each independently an integer of 1 to 200, and the sum of p ′, q ′, r ′, s ′, t ′ is 3)
- Each repeating unit shown in parentheses marked with p ′, q ′, r ′, s ′, t ′ may be bonded at random.
- d ′ is an integer of 0-5 independently And the unit may be linear or branched.
- the hydrolyzable fluorine-containing compound according to the present invention is more preferably a fluorine-containing hydrolyzable organosilicon compound (fluorine-containing hydrolyzable organosilicon compound) represented by any one of the following general formulas (1) to (5) It is. These may be used individually by 1 type and may use 2 or more types together.
- (A-Rf) ⁇ - ZW ⁇ (1) Rf- (ZW ⁇ ) 2 (2)
- A is a fluorine atom, a hydrogen atom, or a monovalent fluorine-containing group having a —CF 3 group, —CF 2 H group or —CH 2 F group at the end, and Z and Z ′ are independently a single bond or nitrogen It is a divalent to octavalent organic group which may contain an atom, oxygen atom, silicon atom, phosphorus atom or sulfur atom, and may be fluorine-substituted, and W is a monovalent having a hydrolyzable group at the terminal.
- Organic group is a fluorine atom, a hydrogen atom, or a monovalent fluorine-containing group having a —CF 3 group, —CF 2 H group or —CH 2 F group at the end, and Z and Z ′ are independently a single bond or nitrogen It is a divalent to octavalent organic group which may contain an atom, oxygen atom, silicon atom, phosphorus atom or sulfur atom, and may be fluor
- ⁇ and ⁇ are each independently an integer of 1 to 7, preferably ⁇ is an integer of 1 to 3, more preferably 1, ⁇ is an integer of 1 to 3, and ⁇ + ⁇ is an integer of 2 to 8, preferably Is an integer from 2 to 4.
- ⁇ is an integer of 2 to 8, preferably 2 or 3.
- Q is a single bond or a divalent organic group, ⁇ is each independently an integer of 1 to 10, Y is a divalent organic group having a hydrolyzable group, B is a hydrogen atom, carbon An alkyl group of 1 to 4 or a halogen atom.
- Rf is the above-described (poly) fluorooxyalkylene structure (divalent linear perfluorooxyalkylene polymer residue) — (CF 2 ) d —O— (CF 2 O) p (CF 2 CF 2 O) q (CF 2 CF 2 CF 2 O) r (CF 2 CF 2 CF 2 CF 2 O) s (CF (CF 3) CF 2 O) t - (CF 2) d- , which is similar to the above.
- A is a fluorine atom, a hydrogen atom, or a monovalent fluorine-containing group whose terminal is a —CF 3 group, a —CF 2 H group, or a —CH 2 F group.
- Specific examples of the monovalent fluorine-containing group having a terminal —CF 3 group, —CF 2 H group, or —CH 2 F group include —CF 3 group, —CF 2 CF 3 group, —CF 2 CF 2 Examples include CF 3 group and —CH 2 CF (CF 3 ) —OC 3 F 7 group.
- A is preferably a —CF 3 group, a —CF 2 CF 3 group, or a —CF 2 CF 2 CF 3 group.
- Z and Z ′ may each independently contain a single bond, a nitrogen atom, an oxygen atom, a silicon atom, a phosphorus atom or a sulfur atom, and may be substituted with fluorine.
- the organic group can be represented by (L) e -M (e is an integer of 1 to 7, preferably an integer of 1 to 3).
- L is a single bond, or an oxygen atom, a sulfur atom, or a divalent organic group.
- L in Z is an Rf group and an M group (or a W group).
- L in Z ′ is a linking group between M (or Rf group) and Rf group.
- an amide bond, an ether bond, an ester bond, or a diorganosilylene group such as a dimethylsilylene group, —Si [OH] [— (CH 2 ) f —Si (CH 3 ) 3 ] -(F is an integer of 2 to 4) is an unsubstituted or substituted divalent organic group having 2 to 12 carbon atoms which may contain one or more selected from the group consisting of groups represented by Is an unsubstituted or substituted divalent hydrocarbon group having 2 to 12 carbon atoms which may contain the above structure.
- Examples of the unsubstituted or substituted divalent hydrocarbon group having 2 to 12 carbon atoms include ethylene group, propylene group (trimethylene group, methylethylene group), butylene group (tetramethylene group, methylpropylene group), hexamethylene Group, an alkylene group such as an octamethylene group, an arylene group such as a phenylene group, or a combination of two or more of these groups (such as an alkylene / arylene group). Further, a group in which some or all of the hydrogen atoms bonded to the carbon atoms of these groups are substituted with a halogen atom such as fluorine or iodine may be used. Of these, an unsubstituted or substituted alkylene group having 2 to 4 carbon atoms or a phenylene group is preferable.
- Examples of the divalent organic group for L include a group represented by the following structure, or a group in which two or more of these are bonded. (Wherein f is an integer of 2 to 4, b is an integer of 2 to 6, preferably an integer of 2 to 4, u and v are integers of 1 to 4, and g is 2 to 4) An integer and Me is a methyl group.)
- M is a single bond, a nitrogen atom, a silicon atom, a carbon atom, a phosphorus atom, a group containing these, or a divalent to octavalent organic group.
- M in Z is a linking group of L (or Rf
- R 1 is independently of each other, preferably an alkyl group having 1 to 3 carbon atoms, a hydroxyl group, or an oxyalkylene having 1 to 3 carbon atoms which may intervene a diorganosiloxane structure having 2 to 51 silicon atoms.
- R 3 is independently of each other preferably an alkyl group having 1 to 3 carbon atoms, an alkenyl group having 2 or 3 carbon atoms, an alkoxy group having 1 to 3 carbon atoms, or a chloro group.
- R 4 is an aryl group having 6 to 10 carbon atoms such as an alkyl group having 1 to 3 carbon atoms or a phenyl group.
- M is a siloxane residue, it has 2 to 51 silicon atoms, preferably 2 to 13 silicon atoms, more preferably 2 to 11 silicon atoms, and still more preferably 2 to 5 silicon atoms. It preferably has a linear, branched or cyclic organopolysiloxane structure.
- the organopolysiloxane is an unsubstituted or fluorine having 1 to 8 carbon atoms, more preferably 1 to 4 carbon atoms such as methyl, ethyl, propyl, butyl, and C 3 F 7 —C 3 H 6 —. Those having a substituted alkyl group or a phenyl group are preferred. Further, it may contain a silalkylene structure in which two silicon atoms are bonded by an alkylene group, that is, Si— (CH 2 ) n —Si. In the above formula, n is an integer of 2 to 6, preferably an integer of 2 to 4.
- M examples include those shown below. (In the formula, i is an integer of 1 to 20, c is an integer of 1 to 50, and Me is a methyl group.)
- W is a monovalent organic group having a hydrolyzable group at the terminal, and is preferably represented by the following formula.
- R is an alkyl group having 1 to 4 carbon atoms or a phenyl group
- X is a hydrolyzable group
- a is 2 or 3
- m is an integer of 0 to 10.
- examples of the hydrolyzable group of X include a methoxy group, an ethoxy group, a propoxy group, a butoxy group and the like having 1 to 12 carbon atoms, particularly an alkoxy group having 1 to 10 carbon atoms, a methoxymethoxy group, a methoxyethoxy group, etc.
- C2-C10 alkenyloxy groups such as alkoxyalkoxy groups having 2 to 10 carbon atoms, especially 1 to 10 carbon atoms such as acetoxy groups, acetoxy groups and isopropenoxy groups, chloro groups and bromo groups
- halogen groups such as an iodo group, amino groups and the like.
- R is an alkyl group such as a methyl group having 1 to 4 carbon atoms, an ethyl group, or a phenyl group, and a methyl group is particularly preferable.
- a is 2 or 3, and 3 is preferable from the viewpoint of reactivity and adhesion to a substrate.
- m is an integer of 0 to 10, preferably an integer of 2 to 8, and more preferably 2 or 3.
- examples of the structure represented by ( ⁇ ) ⁇ ZW ⁇ and —ZW ⁇ include the following structures.
- L, R, X, f, c and a are as described above, m1 is an integer of 1 to 10, preferably an integer of 2 to 8, and Me is a methyl group.
- Q is a single bond or a divalent organic group, and is a linking group between the Rf group and the Y group.
- the divalent organic group for Q is preferably an amide bond, an ether bond, an ester bond, or a diorganosilylene group such as a dimethylsilylene group, —Si [OH] [— (CH 2 ) f —Si (CH 3 ) 3 ]-(f is an integer of 2 to 4), an unsubstituted or substituted divalent organic group having 2 to 12 carbon atoms, which may contain one or more selected from the group consisting of More preferably, it is an unsubstituted or substituted divalent hydrocarbon group having 2 to 12 carbon atoms which may contain the above structure.
- Examples of the unsubstituted or substituted divalent hydrocarbon group having 2 to 12 carbon atoms include those similar to the unsubstituted or substituted divalent hydrocarbon group having 2 to 12 carbon atoms exemplified in L above. it can.
- Examples of the divalent organic group for Q include groups represented by the following structures. (Wherein f is an integer of 2 to 4, b is an integer of 2 to 6, preferably an integer of 2 to 4, u and v are integers of 1 to 4, and g is 2 to 4) An integer and Me is a methyl group.)
- Y is a divalent organic group having a hydrolyzable group independently of each other, and preferably has a structure represented by the following formula.
- R, X and a are as described above.
- K is an integer of 0 to 10, preferably 0 to 8.
- h is an integer of 1 to 6, preferably 1 or 2.
- M ′ is an unsubstituted or substituted trivalent to octavalent, preferably trivalent or tetravalent hydrocarbon group, and some or all of the carbon atoms in the hydrocarbon group may be replaced by silicon atoms, A part or all of the hydrogen atoms bonded to the carbon atom may be replaced with a halogen atom such as a fluorine atom.
- M ′ is preferably a group represented by the following structure.
- M 1 is a single bond, an unsubstituted or substituted divalent hydrocarbon group having 1 to 6 carbon atoms, or a diorganosilylene group such as a dimethylsilylene group
- M 2 is represented by —R 1 C ⁇ .
- Examples of M 1 include a single bond, a phenylene group, a dimethylsilylene group, and a tetrafluoroethylene group.
- Examples of M 2 include the following. (In the formula, Me is a methyl group.)
- Examples of such Y include the following groups.
- k1 is an integer of 0 to 10, preferably 0 to 8
- k2 is an integer of 2 to 10, preferably 2 to 8
- Me is It is a methyl group.
- ⁇ is an integer of 1 to 10, preferably an integer of 1 to 4.
- B is independently of each other a hydrogen atom, an alkyl group such as a methyl group having 1 to 4 carbon atoms, an ethyl group, a propyl group or a butyl group, or a halogen atom such as a fluorine atom, a chlorine atom, a bromine atom or an iodine atom. is there.
- fluorine-containing hydrolyzable organosilicon compound fluorine-containing hydrolyzable organosilicon compound represented by the above formulas (1) to (5) include the following structures.
- Me is a methyl group
- p1, q1, r1, s1, and t1 are each independently an integer of 1 to 200
- the total of p1, q1, r1, s1, and t1 is 3 to 500.
- each unit shown in parentheses to which p1, q1, r1, s1, and t1 are attached may be combined at random.
- a hydrolyzable group is contained at one end. More preferably, a compound is used.
- the fluorine-containing hydrolyzable organosilicon compound (fluorine-containing hydrolyzable organosilicon compound) represented by the general formulas (1) to (5) according to the present invention is a part of the hydrolyzable group (X). Or the compound (compound whose X is OH group) in which all are hydrolyzed may be included, and the compound in which some or all of these OH groups are condensed may be included.
- fluorine-containing hydrolyzable organosilicon compounds fluorine-containing hydrolyzable organosilicon compounds represented by the general formulas (1) to (5)
- a compound containing a hydrolyzable group at one end is used.
- both-end hydrolyzable group-containing polymer or non-functional polymer is produced as a by-product. You may go out.
- the components not involved in curing such as non-functional polymers are the total of the fluorine-containing hydrolyzable organosilicon compounds represented by the general formulas (1) to (5).
- the content is preferably 50% by mass or less (0 to 50% by mass), preferably 0 to 45% by mass.
- the hydrolyzable fluorine-containing compound is desirably diluted with a solvent in advance, and such a solvent is not particularly limited as long as it dissolves the hydrolyzable fluorine-containing compound uniformly.
- a solvent is not particularly limited as long as it dissolves the hydrolyzable fluorine-containing compound uniformly.
- fluorine-modified aliphatic hydrocarbon solvents perfluoroheptane, perfluorooctane, etc.
- fluorine-modified aromatic hydrocarbon solvents (1,3-trifluoromethylbenzene, etc.
- fluorine-modified ether solvents methyl perfluoro) Butyl ether, ethyl perfluorobutyl ether, perfluoro (2-butyltetrahydrofuran), etc.
- fluorine-modified alkylamine solvents perfluorotributylamine, perfluorotripentylamine, etc.
- hydrocarbon solvents petroleum
- the said solvent may be used individually by 1 type, or may mix and use 2 or more types.
- the solvent is a hydrolyzable fluorine-containing compound in a release agent (solution containing a hydrolyzable fluorine-containing compound and a solvent) in an amount of 0.01 to 50% by mass, preferably 0.03 to 10% by mass, more preferably 0.05. It is desirable to contain it in an amount of ⁇ 1% by mass.
- the release agent containing the hydrolyzable fluorine-containing compound (solution containing the hydrolyzable fluorine-containing compound and a solvent) is a wet coating method (dipping method, brush coating, spin coating, spraying, gravure coating, die coating, bar coating, It can be applied to the substrate by a known method such as slit coating or vapor deposition.
- the coating conditions and the like may be in accordance with a conventionally known method.
- the solvent is dried or the release agent (
- the hydrolyzable fluorine-containing compound obtained by evaporating the solvent from the solution containing the hydrolyzable fluorine-containing compound and the solvent can be applied by dry coating, but the primer layer is coated and formed by a wet coating method (wet method). Therefore, it is more efficient to apply a release agent containing a hydrolyzable fluorine-containing compound (solution containing a hydrolyzable fluorine-containing compound and a solvent) by a wet coating method (wet method).
- the primer layer surface on the substrate is subjected to a cleaning treatment such as plasma treatment, UV treatment, ozone treatment or a treatment for activating the surface. Also good.
- the hydrolyzable fluorine-containing compound (release agent) can be cured at room temperature (25 ° C.) in 1 to 24 hours, but is further heated at 30 to 200 ° C. for 1 minute to 1 hour in order to cure in a shorter time. May be. Curing is preferably performed under humidification (50 to 90% RH) in order to accelerate hydrolysis.
- the fluorine layer (release layer) which is the second layer of the release film for the silicone pressure-sensitive adhesive of the present invention is mainly composed of a cured product of a fluorine-containing hydrolyzable organosilicon compound (fluorine-containing hydrolyzable organosilicon compound).
- the cured product is preferably in the range of 50% by mass or more (50 to 100% by mass), particularly 55 to 100% by mass in the release layer.
- the film thickness of the fluorine layer (release layer) which is the second layer of the release film for a silicone pressure-sensitive adhesive of the present invention is 0.5 to 30 nm, and particularly preferably 1 to 20 nm. If the film thickness is too thick, the treatment agent aggregates and the components transferred to the silicone pressure-sensitive adhesive increase, and the residual adhesion (re-adhesion force) of the silicone pressure-sensitive adhesive after peeling may worsen. It may not be enough.
- the release film of the present invention thus obtained is used in various applications as a release film for adhesive tapes and adhesive sheets for silicone adhesives, for protective films for various displays, masking for electronic parts and adhesive fixing. It can be used for member applications.
- a release layer was formed on the primer layer of the base material on which the primer layer was formed based on the following method.
- the compounds 1 to 5 shown below are diluted with a fluorine-modified ether solvent (Novec 7200 (ethyl perfluorobutyl ether, 3M)) so that the solid content is 0.1% by mass, and then spray coating apparatus (Co., Ltd.) Spray coating was performed on the outer surface of the primer layer of the base material using NST-51) manufactured by T & K. Then, it hardened
- the average thickness of the release layer calculated from the amount of F detected by a fluorescent X-ray apparatus (ZSXmini 2 manufactured by Rigaku Corporation) was about 8 to 10 nm.
- Release agent for silicone adhesive X-70-201S manufactured by Shin-Etsu Chemical Co., Ltd., release agent for addition curing type silicone adhesive, silanol group amount: 0 mol / g) 4 parts by mass, Novec7300 (manufactured by 3M Japan)
- the mixture was diluted with 96 parts by mass, and 0.05 parts by mass of a complex salt of chloroplatinic acid and vinylsiloxane (platinum concentration 2 mass%) was added thereto to prepare a treatment liquid.
- K control coater model No.
- Example 1 is superior to Comparative Example 1 in terms of excellent light peelability and little change in peel force over time. Further, as is apparent from the results in Table 3, light / heavy release characteristics according to the purpose can be appropriately obtained by appropriately selecting the type of hydrolyzable fluorine-containing compound constituting the release layer (second layer). I understand that.
- the release film of the present invention having excellent release characteristics is used for various applications as a release film for adhesive tapes and adhesive sheets for silicone adhesives, for protective films for various displays, for masking electronic components and for adhesive fixing members. Etc. can be used.
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Abstract
Description
なお、本発明に関連する従来技術として、下記文献が挙げられる。
〔1〕
基材の少なくとも片方の表面上に、第1層としてのプライマー層を有し、さらに該プライマー層の外表面上に第2層としての剥離層を有してなるシリコーン粘着剤用剥離フィルムであって、該プライマー層が分子中にシラノール基を複数個有する有機ケイ素化合物を主成分とする膜厚0.5~500nmの層からなり、かつ該剥離層が加水分解性含フッ素化合物の硬化物を主成分とする膜厚0.5~30nmの層からなるシリコーン粘着剤用剥離フィルム。
〔2〕
分子中にシラノール基を複数個有する有機ケイ素化合物が、テトラアルコキシシランの加水分解・部分縮合物である〔1〕に記載の剥離フィルム。
〔3〕
加水分解性含フッ素化合物が、少なくとも1個の分子鎖末端に加水分解性シリル基を少なくとも1個有し、該加水分解性シリル基が、炭素数1~12のアルコキシ基、炭素数2~12のアルコキシアルコキシ基、炭素数1~10のアシロキシ基、炭素数2~10のアルケニルオキシ基、ハロゲン基又はアミノ基を有するシリル基及びシラザン基から選ばれる基である〔1〕又は〔2〕に記載の剥離フィルム。
〔4〕
加水分解性含フッ素化合物が、分子中に-(CF2)d-O-(CF2O)p(CF2CF2O)q(CF2CF2CF2O)r(CF2CF2CF2CF2O)s(CF(CF3)CF2O)t-(CF2)d-(式中、p、q、r、s、tはそれぞれ独立に0~200の整数であり、かつ、p+q+r+s+t=3~500であり、p、q、r、s、tが付された括弧内に示される各繰り返し単位はランダムに結合されていてよく、dは独立に0~8の整数であり、該単位は直鎖状であっても分岐状であってもよい。)で示される2価の直鎖状パーフルオロオキシアルキレンポリマー残基を有し、かつ、少なくとも1個の分子鎖末端に加水分解性シリル基を少なくとも1個有するフルオロオキシアルキレン基含有有機ケイ素化合物である〔1〕~〔3〕のいずれかに記載の剥離フィルム。
〔5〕
加水分解性含フッ素化合物が、下記一般式(1)~(5)で表されるフッ素含有加水分解性有機ケイ素化合物から選ばれる少なくとも1種である〔1〕~〔4〕のいずれかに記載の剥離フィルム。
(A-Rf)α-ZWβ (1)
Rf-(ZWβ)2 (2)
Z’-(Rf-ZWβ)γ (3)
〔式中、Rfは-(CF2)d-O-(CF2O)p(CF2CF2O)q(CF2CF2CF2O)r(CF2CF2CF2CF2O)s(CF(CF3)CF2O)t-(CF2)d-で示される2価の直鎖状パーフルオロオキシアルキレンポリマー残基であり、p、q、r、s、tはそれぞれ独立に0~200の整数であり、かつ、p+q+r+s+t=3~500であり、p、q、r、s、tが付された括弧内に示される各繰り返し単位はランダムに結合されていてよく、dは独立に0~8の整数であり、該単位は直鎖状であっても分岐状であってもよい。Aはフッ素原子、水素原子、又は末端が-CF3基、-CF2H基もしくは-CH2F基である1価のフッ素含有基であり、Z、Z’は独立に単結合、又は窒素原子、酸素原子、ケイ素原子、リン原子もしくは硫黄原子を含んでいてもよく、フッ素置換されていてもよい2~8価の有機基であり、Wは末端に加水分解性基を有する1価の有機基である。α、βはそれぞれ独立に1~7の整数であり、かつ、α+β=2~8の整数である。γは2~8の整数である。〕
A-Rf-Q-(Y)δ-B (4)
Rf-(Q-(Y)δ-B)2 (5)
(式中、Rf、Aは前記と同じであり、Qは単結合又は2価の有機基であり、δはそれぞれ独立に1~10の整数であり、Yは加水分解性基を有する2価の有機基であり、Bは水素原子、炭素数1~4のアルキル基、又はハロゲン原子である。)
〔6〕
フッ素含有加水分解性有機ケイ素化合物が、下記に示すものである〔5〕に記載の剥離フィルム。
〔7〕
剥離層が、加水分解性含フッ素化合物の硬化物と、無官能性含フッ素化合物とを含むものである〔1〕~〔6〕のいずれかに記載の剥離フィルム。
〔8〕
基材が、樹脂、紙又は金属である〔1〕~〔7〕のいずれかに記載の剥離フィルム。
〔9〕
基材の少なくとも片方の表面上に、分子中にシラノール基を複数個有する有機ケイ素化合物と溶剤を含む溶液を湿式塗布する工程と、該溶剤を乾燥させて前記基材の少なくとも片方の表面上にプライマー層を形成・積層する工程と、該プライマー層の外表面上に、加水分解性含フッ素化合物と溶剤を含む溶液を湿式塗布した後に該溶剤を乾燥させるか、又は、該溶液から溶剤を蒸発させた加水分解性含フッ素化合物を乾式塗布する工程と、該加水分解性含フッ素化合物を硬化させてプライマー層の外表面上に剥離層を形成・積層する工程とを含む〔1〕~〔8〕のいずれかに記載の剥離フィルムの製造方法。
本発明のシリコーン粘着剤用剥離フィルムは、基材の少なくとも片方、好ましくは片方の表面上に、第1層としてのプライマー層を有し、さらに該プライマー層の外表面上に第2層としての剥離層を有してなるシリコーン粘着剤用剥離フィルムであって、該プライマー層が分子中にシラノール基を複数個有する有機ケイ素化合物を主成分とする膜厚0.5~500nmの層からなり、かつ該剥離層が加水分解性含フッ素化合物の硬化物を主成分とする膜厚0.5~30nmの層からなるものである。
基材の厚さとしては特に制限されないが、10~200μmであることが好ましく、25~125μmであることがより好ましい。なお、本発明において、基材の厚さはマイクロメーター等により測定できる。
該プライマー層(第1層)は、例えば、各種基材の少なくとも片方の表面上に、分子中にシラノール基を複数個有する有機ケイ素化合物と溶剤を含む溶液を湿式塗布した後、該溶剤を乾燥除去することにより形成(積層)することができる。
分子中にシラノール基を複数個有する有機ケイ素化合物と溶剤を含む溶液中における分子中にシラノール基を複数個有する有機ケイ素化合物の濃度は、0.01~10質量%が好ましく、0.1~2質量%がさらに好ましい。濃度が低すぎると、未塗工部分が増えてしまい、濃度が高すぎると、シラノール基同士で2次凝集が起こる可能性がある。
該剥離層(第2層)は、例えば、形成したプライマー層表面(第1層)の外表面上に、加水分解性含フッ素化合物と溶剤を含む溶液(剥離剤)を塗布して硬化させることにより形成(積層)することができる。
-CF2O-
-CF2CF2O-
-CF2CF2CF2O-
-CF(CF3)CF2O-
-CF2CF2CF2CF2O-
-CF2CF2CF2CF2CF2O-
-C(CF3)2O-
(A-Rf)α-ZWβ (1)
Rf-(ZWβ)2 (2)
Z’-(Rf-ZWβ)γ (3)
A-Rf-Q-(Y)δ-B (4)
Rf-(Q-(Y)δ-B)2 (5)
また、Qは単結合又は2価の有機基であり、δはそれぞれ独立に1~10の整数であり、Yは加水分解性基を有する2価の有機基であり、Bは水素原子、炭素数1~4のアルキル基、又はハロゲン原子である。
また、Rは、炭素数1~4のメチル基、エチル基等のアルキル基、又はフェニル基であり、中でもメチル基が好適である。
aは2又は3であり、反応性、基材に対する密着性の観点から、3が好ましい。mは0~10の整数であり、好ましくは2~8の整数であり、より好ましくは2又は3である。
また、Bは互いに独立に、水素原子、炭素数1~4のメチル基、エチル基、プロピル基及びブチル基等のアルキル基、又はフッ素原子、塩素原子、臭素原子及びヨウ素原子等のハロゲン原子である。
なお、本発明にかかる一般式(1)~(5)で表されるフッ素含有加水分解性有機ケイ素化合物(含フッ素加水分解性有機ケイ素化合物)は、上記加水分解性基(X)の一部又は全部が加水分解されている化合物(XがOH基である化合物)を含んでいてもよく、これらOH基の一部又は全部が縮合している化合物を含んでいてもよい。また、上記一般式(1)~(5)で表されるフッ素含有加水分解性有機ケイ素化合物(含フッ素加水分解性有機ケイ素化合物)の中でも片末端に加水分解性基を含有する化合物を用いる場合、該片末端フッ素含有加水分解性有機ケイ素化合物の製造過程で、例えば、両末端加水分解性基含有ポリマーや無官能ポリマーが副生するが、これら片末端官能性有機ケイ素化合物以外のポリマーを含んでいてもよい。この場合、上記製造過程で副生するポリマーのうち、無官能ポリマー等の硬化に関与しない成分は、一般式(1)~(5)で表されるフッ素含有加水分解性有機ケイ素化合物との合計中、50質量%以下(0~50質量%)、好ましくは0~45質量%の範囲で含有することが好ましい。
溶剤は剥離剤(加水分解性含フッ素化合物と溶剤を含む溶液)中における加水分解性含フッ素化合物が0.01~50質量%、好ましくは0.03~10質量%、さらに好ましくは0.05~1質量%になるように含有することが望ましい。
ここで、本発明のシリコーン粘着剤用剥離フィルムの第2層であるフッ素層(剥離層)は、フッ素含有加水分解性有機ケイ素化合物(含フッ素加水分解性有機ケイ素化合物)の硬化物を主成分とするものであり、該硬化物は、剥離層中50質量%以上(50~100質量%)、特には55~100質量%の範囲であることが好ましい。
〔プライマー層の形成〕
ポリエチレンテレフタレートフィルム基材(東レ株式会社製ルミラーS10、厚さ50μm、幅300mm、長さ330mm)に、テトラエトキシシランの加水分解・部分縮合物(重量平均分子量:25,000、シラノール基量:0.01mol/g)をブタノールで固形分0.5質量%に希釈した処理液にて、上記基材の片方の表面上にKコントロールコータ(型式No.202)を用い、No.1コーティングバーで塗布した後、熱風循環式乾燥器で120℃/60秒加熱して、プライマー層形成フィルムを得た。蛍光X線装置(株式会社リガク製 ZSXmini2)によるSi検出量から算出したプライマー層の平均の膜厚は約30nmであった。
下記に示す化合物1~5を固形分で0.1質量%になるようにフッ素変性エーテル系溶剤(Novec7200(エチルパーフルオロブチルエーテル、3M社製))で希釈した後、スプレー塗工装置(株式会社ティーアンドケー製NST-51)で上記基材のプライマー層の外表面上にスプレー塗工した。その後、80℃で30分硬化させて硬化被膜(剥離層)を形成し、剥離フィルム(試験体)を作製した。蛍光X線装置(株式会社リガク製 ZSXmini2)によるF検出量から算出した剥離層の平均の膜厚は約8~10nmであった。
下記に示す含フッ素化合物の混合物(片末端加水分解性シリル基含有成分(片末端成分)/両末端加水分解性シリル基含有成分(両末端成分)/加水分解性シリル基非含有成分(無官能成分)の3成分系の混合物)であり、表1にこれらの組成(混合比率)を示す。
下記に示す含フッ素化合物の混合物(片末端加水分解性シリル基含有成分(片末端成分)/両末端加水分解性シリル基含有成分(両末端成分)/加水分解性シリル基非含有成分(無官能成分)の3成分系の混合物)であり、表1にこれらの組成(混合比率)を示す。
下記に示す含フッ素化合物の混合物(片末端加水分解性シリル基含有成分(片末端成分)/両末端加水分解性シリル基含有成分(両末端成分)/加水分解性シリル基非含有成分(無官能成分)の3成分系の混合物)であり、表1にこれらの組成(混合比率)を示す。
下記に示す含フッ素化合物の混合物(片末端加水分解性シリル基含有成分(片末端成分)/両末端加水分解性シリル基含有成分(両末端成分)/加水分解性シリル基非含有成分(無官能成分)の3成分系の混合物)であり、表1にこれらの組成(混合比率)を示す。
シリコーン粘着剤用剥離剤X-70-201S(信越化学工業株式会社製、付加硬化型シリコーン粘着剤用剥離剤、シラノール基量:0mol/g)4質量部を、Novec7300(スリーエムジャパン株式会社製)96質量部で希釈し、これに塩化白金酸とビニルシロキサンとの錯塩(白金濃度2質量%)0.05質量部を添加して処理液を調製した。
得られた処理液を、上記基材のプライマー層上にKコントロールコータ(型式No.202)を用い、No.1コーティングバーで塗布した後、熱風循環式乾燥器で150℃/60秒加熱して硬化被膜(塗工量≒0.3g/m2)を形成させ、剥離フィルム(試験体)を得た。なお、蛍光X線装置(株式会社リガク製 ZSXmini2)によるSi検出量から算出したプライマー層の平均の膜厚は約30nmであった。
得られた剥離フィルムに幅25mmのシリコーン系粘着テープカプトンNo.650S#25、株式会社寺岡製作所製)を貼り合せ、25g/cm2の荷重下、70℃で1日~21日間貼り合せエージングさせた。引張り試験機を用いて貼り合せテープを180度の角度で剥離速度0.3m/分で剥がし、剥離に要する力(N/25mm)を測定した。
上記剥離測定後の粘着テープをSUS板に貼り付け、2kgテープローラー1往復で圧着し30分放置後、この粘着テープを引張り試験機を用いて180度の角度で剥離速度0.3m/分で剥がし、剥離に要する力(N/25mm)を測定した。
Claims (9)
- 基材の少なくとも片方の表面上に、第1層としてのプライマー層を有し、さらに該プライマー層の外表面上に第2層としての剥離層を有してなるシリコーン粘着剤用剥離フィルムであって、該プライマー層が分子中にシラノール基を複数個有する有機ケイ素化合物を主成分とする膜厚0.5~500nmの層からなり、かつ該剥離層が加水分解性含フッ素化合物の硬化物を主成分とする膜厚0.5~30nmの層からなるシリコーン粘着剤用剥離フィルム。
- 分子中にシラノール基を複数個有する有機ケイ素化合物が、テトラアルコキシシランの加水分解・部分縮合物である請求項1に記載の剥離フィルム。
- 加水分解性含フッ素化合物が、少なくとも1個の分子鎖末端に加水分解性シリル基を少なくとも1個有し、該加水分解性シリル基が、炭素数1~12のアルコキシ基、炭素数2~12のアルコキシアルコキシ基、炭素数1~10のアシロキシ基、炭素数2~10のアルケニルオキシ基、ハロゲン基又はアミノ基を有するシリル基、及びシラザン基から選ばれる基である請求項1又は2に記載の剥離フィルム。
- 加水分解性含フッ素化合物が、分子中に-(CF2)d-O-(CF2O)p(CF2CF2O)q(CF2CF2CF2O)r(CF2CF2CF2CF2O)s(CF(CF3)CF2O)t-(CF2)d-(式中、p、q、r、s、tはそれぞれ独立に0~200の整数であり、かつ、p+q+r+s+t=3~500であり、p、q、r、s、tが付された括弧内に示される各繰り返し単位はランダムに結合されていてよく、dは独立に0~8の整数であり、該単位は直鎖状であっても分岐状であってもよい。)で示される2価の直鎖状パーフルオロオキシアルキレンポリマー残基を有し、かつ、少なくとも1個の分子鎖末端に加水分解性シリル基を少なくとも1個有するフルオロオキシアルキレン基含有有機ケイ素化合物である請求項1~3のいずれか1項に記載の剥離フィルム。
- 加水分解性含フッ素化合物が、下記一般式(1)~(5)で表されるフッ素含有加水分解性有機ケイ素化合物から選ばれる少なくとも1種である請求項1~4のいずれか1項に記載の剥離フィルム。
(A-Rf)α-ZWβ (1)
Rf-(ZWβ)2 (2)
Z’-(Rf-ZWβ)γ (3)
〔式中、Rfは-(CF2)d-O-(CF2O)p(CF2CF2O)q(CF2CF2CF2O)r(CF2CF2CF2CF2O)s(CF(CF3)CF2O)t-(CF2)d-で示される2価の直鎖状パーフルオロオキシアルキレンポリマー残基であり、p、q、r、s、tはそれぞれ独立に0~200の整数であり、かつ、p+q+r+s+t=3~500であり、p、q、r、s、tが付された括弧内に示される各繰り返し単位はランダムに結合されていてよく、dは独立に0~8の整数であり、該単位は直鎖状であっても分岐状であってもよい。Aはフッ素原子、水素原子、又は末端が-CF3基、-CF2H基もしくは-CH2F基である1価のフッ素含有基であり、Z、Z’は独立に単結合、又は窒素原子、酸素原子、ケイ素原子、リン原子もしくは硫黄原子を含んでいてもよく、フッ素置換されていてもよい2~8価の有機基であり、Wは末端に加水分解性基を有する1価の有機基である。α、βはそれぞれ独立に1~7の整数であり、かつ、α+β=2~8の整数である。γは2~8の整数である。〕
A-Rf-Q-(Y)δ-B (4)
Rf-(Q-(Y)δ-B)2 (5)
(式中、Rf、Aは前記と同じであり、Qは単結合又は2価の有機基であり、δはそれぞれ独立に1~10の整数であり、Yは加水分解性基を有する2価の有機基であり、Bは水素原子、炭素数1~4のアルキル基、又はハロゲン原子である。) - 剥離層が、加水分解性含フッ素化合物の硬化物と、無官能性含フッ素化合物とを含むものである請求項1~6のいずれか1項に記載の剥離フィルム。
- 基材が、樹脂、紙又は金属である請求項1~7のいずれか1項に記載の剥離フィルム。
- 基材の少なくとも片方の表面上に、分子中にシラノール基を複数個有する有機ケイ素化合物と溶剤を含む溶液を湿式塗布する工程と、該溶剤を乾燥させて前記基材の少なくとも片方の表面上にプライマー層を形成・積層する工程と、該プライマー層の外表面上に、加水分解性含フッ素化合物と溶剤を含む溶液を湿式塗布した後に該溶剤を乾燥させるか、又は、該溶液から溶剤を蒸発させた加水分解性含フッ素化合物を乾式塗布する工程と、該加水分解性含フッ素化合物を硬化させてプライマー層の外表面上に剥離層を形成・積層する工程とを含む請求項1~8のいずれか1項に記載の剥離フィルムの製造方法。
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- 2019-04-04 WO PCT/JP2019/014903 patent/WO2019208141A1/ja active Application Filing
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TW202003752A (zh) | 2020-01-16 |
US20210238453A1 (en) | 2021-08-05 |
CN112004675A (zh) | 2020-11-27 |
JP6912001B2 (ja) | 2021-07-28 |
JPWO2019208141A1 (ja) | 2021-04-30 |
KR20210005117A (ko) | 2021-01-13 |
TWI802684B (zh) | 2023-05-21 |
KR102563538B1 (ko) | 2023-08-04 |
CN112004675B (zh) | 2023-06-27 |
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