WO2019200881A1

WO2019200881A1 - Heat-dissipation component and intelligent terminal having same

Info

Publication number: WO2019200881A1
Application number: PCT/CN2018/112228
Authority: WO
Inventors: 段海涛; 郑凯; 丁智成
Original assignee: 南昌黑鲨科技有限公司
Priority date: 2018-04-17
Filing date: 2018-10-26
Publication date: 2019-10-24
Also published as: CN208143688U

Abstract

The utility model provides a heat-dissipation component. The heat-dissipation component is coupled with at least one heating element; the heat-dissipation component comprises a master heat-dissipation module and a heat-resistance module; the master heat-dissipation module and a heat-resistance module are connected to each other; the master heat-dissipation module comprises a top plate and a bottom plate weldedly connected to each other; the bottom plate is provided with a recess; a vacuum chamber is formed between the top plate and the bottom plate; a liquid heat-transfer medium is provided in the vacuum chamber; the liquid heat-transfer medium condenses after being gasified for heat dissipation. Combination of the master heat-dissipation module with the heat-resistance module can improve the heat-resistance performance and can also achieve a good heat insulation effect, thereby further providing more optimized use experience for a user.

Description

Heat dissipation member and intelligent terminal having the same

Technical field

The utility model relates to the field of heat sinks for smart terminals, in particular to a heat dissipating member and an intelligent terminal having the same.

Background technique

With the rapid development of smart terminal technology, the frequency of intelligent terminal chips is getting higher and higher, which leads to the generation of a large amount of heat in the use of intelligent terminals, and excessive heat often affects the user's comfort, and may even Will burn out the hardware in the smart terminal.

In general, most manufacturers solve the heat dissipation problem by using high thermal conductivity materials in the architecture. Traditional thermal conductive materials are mainly metallic materials such as copper, aluminum, silver, and the like. However, the metal material has a high density and a high expansion coefficient. In the case where high thermal conductivity is required, the requirements for use cannot be met (for example, the thermal conductivity of silver, copper, and aluminum is 430 W/mK, 400 W/mK, 238 W/mK, respectively), so With the improvement of the main frequency of intelligent terminal chips, intelligent terminal manufacturers urgently need to find a solution to improve hardware cooling.

To this end, it is necessary to provide a new type of heat dissipating member, which can effectively improve the heat dissipation performance of the terminal, improve the thermal experience, reduce the chip frequency limiting main heat dissipation module, and improve the user experience.

Utility model content

In order to overcome the above technical defects, the present invention aims to provide a novel heat dissipating member and an intelligent terminal having the same, which can effectively improve the heat dissipating energy of the terminal, improve the thermal experience, reduce the chip frequency limiting main heat dissipating module, and improve the user's Use experience.

The utility model discloses a heat dissipating member, and the heat dissipating member is coupled with at least one heating element;

The heat dissipating member includes a main heat dissipation module and a heat blocking module;

The main heat dissipation module and the heat rejection module are connected to each other, wherein

The main heat dissipation module includes a top plate and a bottom plate of the welded connection;

The bottom plate is provided with a recess, and a vacuum chamber is formed between the top plate and the bottom plate. The vacuum chamber is provided with a liquid heat transfer medium, and the liquid heat transfer medium is vaporized and condensed to dissipate heat.

Preferably, the top plate and the bottom plate are stamped and formed from a metal plate;

The metal plate includes a copper plate and/or a copper alloy plate.

Preferably, the inner wall of the vacuum chamber is a capillary channel structure;

Further, a water injection head with auxiliary material is further disposed on a sidewall of the vacuum chamber;

The vacuum chamber has a liquid heat transfer medium injected through the water injection head.

Preferably, the capillary channel structure is sintered from metal powder filled in the vacuum chamber.

Preferably, the auxiliary material comprises one or more of a mylar film, a rubber stopper, and a rubber strip.

Preferably, the liquid heat transfer medium comprises water, acetone or ethanol.

Preferably, the main heat dissipation module and the heat blocking module are further provided with a glue space at the junction of the water injection head.

Preferably, the heat blocking module is made of plastic;

The plastic includes polycarbonate, polycarbonate and polyacrylonitrile alloy, polyamide, polymethyl methacrylate, glass fiber polycarbonate composite, polypropylene, glass fiber nylon composite, one of polyphenylene sulfide Kind or more.

Preferably, the heat dissipation member may further be provided with at least one additional heat dissipation module;

The additional heat dissipation module is fixed to an outside of the main heat dissipation module;

The additional heat dissipation module includes a fan and/or a heat sink fin.

The present invention also provides an intelligent terminal, wherein the smart terminal is provided with a heat dissipating member as described above, and the heat dissipating member is fixed to a chip in the smart terminal. After adopting the above technical solution, compared with the prior art, the following beneficial effects are obtained:

1. The main heat-dissipating module and the heat-resisting module are injection-molded, and the heat-dissipating capacity of the main heat-dissipating module and the heat-blocking capacity of the heat-resisting module are superimposed, thereby significantly improving the heat-dissipating effect of

2. The main heat dissipation module effectively enhances the heat dissipation capability of the heat dissipation member by the vacuum chamber of the liquid heat transfer medium and the injected liquid heat transfer medium having the inner wall of the capillary channel structure; After the medium is condensed and liquefied, it can be returned to the evaporation heat source through the capillary channel structure again, so that the heat can be repeatedly recovered in the vacuum chamber;

3. The heat dissipating member can further be fixedly configured with at least one additional heat dissipating module, thereby further optimizing the heat dissipating effect of the smart terminal chip and improving the user experience.

DRAWINGS

1 is a schematic structural view of a heat dissipating member applied to an intelligent terminal according to an embodiment of the present invention;

2 is a top plan view of a heat dissipating member in accordance with an embodiment of the present invention;

3 is a top plan view of a main heat dissipation module in accordance with an embodiment of the present invention.

Reference mark:

1-main cooling module; 11-water injection head

2-heat blocking module.

detailed description

Advantages of the present invention will be further clarified below with reference to the accompanying drawings and specific embodiments.

The heat dissipating member provided by the utility model can be disposed in the body of the intelligent terminal and coupled with at least one heating element (for example, a chip of the intelligent terminal), and the coupling manner can be that the heat dissipating member and the heat generating member are in close contact with each other and conduct heat through conduction. Or there is an air gap between the two, and the heat is conducted by air conduction, that is, as long as the heat dissipating member and the heat generating member can conduct heat to each other in a relative position, they are all coupled. When the chip of the smart terminal is hot and hot during long-term use, the heat dissipating member can function well for cooling and cooling. Since the heat dissipating member of the present invention is connected to the main heat dissipating module 1 and the heat blocking module 2, the connection manner is such that the two are injection molded in an insert mold, or a backing glue, a glue adhesive, or both. It is mechanically fixed, such as hot melt, snap, and lock screws. Therefore, it can display a more optimized heat dissipation effect than a heat dissipation member that uses only the main heat dissipation module to dissipate heat. The intelligent terminal provided with the heat dissipating member of the present invention has a front and rear surface temperature difference of 1-3 ° C which is smaller and more uniform than that of the general heat dissipating member during operation.

As shown in FIG. 1 , FIG. 2 and FIG. 3 , it is a schematic structural view of a heat dissipating member according to the present invention applied to an intelligent terminal and a top view of the heat dissipating member. As shown in the figure, the heat dissipating member disclosed in the present invention comprises a main heat dissipating module 1 and a heat blocking module 2, and the main heat dissipating module 1 and the heat blocking module 2 are injection molded in an insert mold.

The main heat dissipation module 1 includes a top plate and a bottom plate that are welded together. The top plate and the bottom plate are respectively formed by stamping two metal plates. The metal material used for the metal plate includes, but is not limited to, copper, copper alloy, aluminum, silver, etc., and a copper plate or a copper alloy plate is preferred in this embodiment. It can be understood that the stamping shape of the top plate and the bottom plate of the utility model is not particularly limited, and can be set according to actual needs. Preferably, a recess is formed in the bottom plate stamped from the metal sheet. Wherein, the inner wall of the groove is filled with metal powder, and after sintering, a capillary channel structure is formed. The top plate and the bottom plate are provided with a groove on one side of the bottom plate, and a vacuum chamber is formed between the top plate and the bottom plate. The vacuum chamber has a liquid heat transfer medium as a liquid heat transfer medium, and the vacuum chamber The inner wall is a capillary channel structure. It can be understood that the liquid heat transfer medium includes, but is not limited to, water, acetone, ethanol, etc., and specifically can be selected according to the degree of heat resistance of the hardware in the environmental system in which the main heat dissipation module 1 is located. Further, a water injection head 11 is further disposed on the outer side of the vacuum chamber, and the water injection head 11 is sealed with an auxiliary material to prevent the internal liquid heat transfer medium from overflowing. The liquid heat transfer medium can also be injected into the vacuum chamber from the outside by the water injection head 11. In addition, the vacuum chamber can be evacuated by the water injection head 11 to ensure a seamless connection between the top plate and the bottom plate.

In a preferred embodiment, the heat-resisting module 2 and the main heat-dissipating module 1 are further provided with a glue space at the joint of the water-injecting head 11 to effectively prevent the injection molding material from being injected through the water during injection molding. The head 11 enters the vacuum chamber.

As described above, the main heat dissipating module 1 has a liquid heat transfer medium in the vacuum chamber, that is, the liquid heat transfer medium starts to generate endothermic gasification after being heated in a low vacuum environment. At this time, the heat energy is absorbed and the volume is rapidly expanded. The gas-phase liquid heat transfer medium quickly fills the entire cavity, enabling rapid cooling down. Condensation occurs when the heat in the environment dissipates, that is, when the liquid heat transfer medium in the gas phase comes into contact with a relatively cold operating environment. The condensed phenomenon releases the heat absorbed during the gasification, and the condensed liquid heat transfer medium is returned to the heat source by the capillary channel structure on the inner wall of the vacuum chamber, and the operation will be repeated in the vacuum chamber. .

In a preferred embodiment, the heat blocking module 2 in the heat dissipating member is made of plastic, including but not limited to polycarbonate, polycarbonate and polyacrylonitrile alloy, polyamide, polymethyl methacrylate, glass fiber. Polycarbonate composites, polypropylene, fiberglass nylon composites, polyphenylene sulfide, etc. Based on the special chemical properties of plastic, it can achieve good thermal insulation effect.

Therefore, the intelligent terminal provided with the heat dissipating component of the utility model can generate heat which can be absorbed by the liquid heat transfer medium in the vacuum cavity of the heat dissipating component, and can be better achieved by means of the heat blocking module. The heat insulation effect reduces the temperature difference between the front and rear surfaces of the smart terminal, thereby further improving the heat dissipation performance and further providing a more optimized user experience.

In addition, in a preferred embodiment, at least one additional heat dissipation module may be further provided to further improve the heat dissipation performance of the heat dissipation member. The additional heat dissipation module is mechanically fixed to the outside of the main heat dissipation module and is close to the heating element. The additional heat dissipation module may include various forms such as a fan, a heat sink fin, and the like. In this way, the heat dissipating member can simultaneously cool down the heat generating component such as the chip through the main heat dissipating module, the additional heat dissipating module and the heat blocking module, thereby achieving an excellent heat dissipating effect.

It should be noted that the embodiments of the present invention are preferred and are not intended to limit the scope of the present invention. Any person skilled in the art may use the above-disclosed technical contents to change or modify the equivalents. The embodiments, without departing from the technical scope of the present invention, any modifications or equivalent changes and modifications made to the above embodiments in accordance with the technical spirit of the present invention are still within the scope of the technical solutions of the present invention.

Claims

A heat dissipating member characterized in that

The heat dissipating member is coupled to at least one heat generating component;

The heat dissipating member includes a main heat dissipation module and a heat blocking module;

The main heat dissipation module and the heat rejection module are connected to each other, wherein

The main heat dissipation module includes a top plate and a bottom plate of the welded connection;

The bottom plate is provided with a recess, and a vacuum chamber is formed between the top plate and the bottom plate. The vacuum chamber is provided with a liquid heat transfer medium, and the liquid heat transfer medium is vaporized and condensed to dissipate heat.
The heat dissipating member according to claim 1, wherein

The top plate and the bottom plate are stamped and formed from a metal plate;

The metal plate includes a copper plate and/or a copper alloy plate.
The heat dissipating member according to claim 1, wherein

The inner wall of the vacuum chamber is a capillary channel structure;

Further, a water injection head with auxiliary material is further disposed on a sidewall of the vacuum chamber;

The vacuum chamber has a liquid heat transfer medium injected through the water injection head.
The heat dissipating member according to claim 3, wherein

The capillary channel structure is formed by sintering a metal powder filled in the vacuum chamber.
The heat dissipating member according to claim 3, wherein

The auxiliary material includes one or more of a mylar film, a rubber stopper, and a rubber strip.
The heat dissipating member according to claim 3, wherein

The liquid heat transfer medium comprises water, acetone or ethanol.
The heat dissipating member according to claim 3, wherein

The main heat dissipation module and the heat blocking module further have a glue space at the junction of the water injection head.
The heat dissipating member according to claim 1, wherein

The heat blocking module is made of plastic;

The plastic includes polycarbonate, polycarbonate and polyacrylonitrile alloy, polyamide, polymethyl methacrylate, glass fiber polycarbonate composite, polypropylene, glass fiber nylon composite, one of polyphenylene sulfide Kind or more.
The heat dissipating member according to claim 1, wherein

The heat dissipating member may further be provided with at least one additional heat dissipation module;

The additional heat dissipation module is fixed to an outside of the main heat dissipation module;

The additional heat dissipation module includes a fan and/or a heat sink fin.
An intelligent terminal, wherein the smart terminal is provided with a heat dissipating member according to any one of claims 1 to 9, the heat dissipating member being fixed to a chip in the smart terminal.