WO2019131856A1

WO2019131856A1 - Semiconductor back surface adhering film

Info

Publication number: WO2019131856A1
Application number: PCT/JP2018/048089
Authority: WO
Inventors: 佐藤慧; 志賀豪士; 高本尚英
Original assignee: 日東電工株式会社
Priority date: 2017-12-28
Filing date: 2018-12-27
Publication date: 2019-07-04
Also published as: WO2019131857A1; WO2019131850A1; WO2019131852A1; WO2019131854A1

Abstract

Provided is a semiconductor back surface adhering film which has excellent laser markability and excellent infrared shielding properties. A semiconductor back surface adhering film according to the present invention is closely adhered to the back surface of a semiconductor when in use, and comprises: a layer A which contains a black pigment and serves as the outermost layer when closely adhered to the back surface of the semiconductor; and a layer B which contains a black pigment and has a higher absorbance at the wavelength of 1,300 nm than the layer A, while serving as an inner layer that is positioned between the outermost layer and a semiconductor element when closely adhered to the back surface of the semiconductor.

Description

Semiconductor back contact film

The present invention relates to a semiconductor back contact film. More particularly, the present invention relates to a semiconductor back contact film that can be used in the process of manufacturing a semiconductor device.

In recent years, a flip chip type semiconductor device in which semiconductor elements such as semiconductor chips are mounted on a substrate by flip chip bonding is widely used. In a flip chip type semiconductor device, a semiconductor back contact film may be used as a film for forming a protective film on the back surface of the semiconductor element in order to prevent damage or the like of the semiconductor element (Patent Documents 1 and 2) reference).

JP, 2011-151360, A International Publication No. 2014/092200

The conventional semiconductor back contact film usually contains a coloring agent so as to be able to give imprint information by laser marking, and thereby has a light shielding property. By the way, in recent years, thinning of the silicon layer is in progress. Along with this, thinning of the semiconductor back contact film is also required. However, when silicon is thinned, there is a problem that the wavelength of light transmitted from infrared to visible light is expanded. In addition, in the case of a semiconductor back contact film, in many cases, the coloring agent having visible light absorption used for laser marking is in many cases not having absorption in the near infrared, and in addition to transmitting infrared light, along with thinning of the film. There is a problem that the light shielding property is reduced. When the light shielding property of the back contact film on the semiconductor is inferior, light is easily transmitted. Therefore, when light is transmitted, the circuit surface of the semiconductor adversely affects noise and the like, or the circuit surface can be viewed by using an infrared microscope or the like. In some cases, confidentiality can not be maintained.

The present invention has been made in view of the above problems, and an object thereof is to provide a semiconductor back contact film excellent in laser marking properties and infrared shielding properties.

The present inventors intensively studied to achieve the above object, and as a result, they contain a black pigment, and an A layer which becomes the outermost layer at the time of close contact with the back surface of the semiconductor and a black pigment and have an absorbance of 1300 nm It was also found that according to the semiconductor back contact film having the B layer which is high and which is the inner layer located between the outermost layer and the semiconductor element when the semiconductor back contact is in close contact, the laser marking property and the infrared shielding property are excellent. The present invention has been completed based on these findings.

That is, the present invention is a semiconductor back contact film used in close contact with the back surface of the semiconductor, which contains a black pigment and contains an A layer which becomes the outermost layer at the time of back contact with the semiconductor and a black pigment and at a wavelength of 1300 nm. Provided is a semiconductor back contact film having an absorbance higher than that of the A layer, and a B layer serving as an inner layer located between the outermost layer and the semiconductor element when in close contact with the semiconductor back surface. The semiconductor back contact film having such a configuration can be used in the process of manufacturing a semiconductor device.

The semiconductor back contact film of the present invention contains a black pigment, and in use, that is, a layer (A layer) which becomes the outermost layer when the semiconductor back contact film is in close contact with the semiconductor back, and a black pigment when used It has a layer (B layer) to be a layer (inner layer) positioned between the surface layer and the semiconductor element, and the absorbance of the B layer at a wavelength of 1300 nm is higher than the absorbance of the A layer at a wavelength of 1300 nm. In the semiconductor back contact film of the present invention having such a configuration, the outermost layer is excellent in laser marking property when the semiconductor back contact is in close contact, and the inner layer can sufficiently absorb infrared rays, and is excellent in infrared ray shielding properties.

In the semiconductor back contact film of the present invention, the content ratio of the black pigment in the B layer is preferably higher than the content ratio of the black pigment in the A layer. In the semiconductor back contact film of the present invention having such a configuration, the absorbance of the B layer at a wavelength of 1300 nm tends to be higher than the absorbance of the A layer at a wavelength of 1300 nm.

It is preferable that the layer which becomes an inner layer at the time of semiconductor back surface adhesion of the semiconductor back adhesion film of this invention is a layer which contains a black pigment as a whole and whose absorbance in wavelength 1300nm is higher than A layer. In the semiconductor back contact film of the present invention having such a configuration, the outermost layer is excellent in laser marking property when the semiconductor back contact is in contact, and the entire inner layer can absorb infrared rays more sufficiently. Excellent.

In the semiconductor back contact film of the present invention, the ratio [B layer / A layer] of the absorbance at a wavelength 1300 nm of the layer B to the absorbance at a wavelength 1300 nm of the layer A is preferably 1.2 to 15. The semiconductor back contact film of the present invention having such a constitution has a larger difference in contrast between the A layer and the B layer, and is further excellent in the laser marking property and the infrared ray shielding property of the semiconductor back contact film of the present invention.

In the semiconductor back contact film of the present invention, each of the layer A and the layer B preferably contains carbon black as the black pigment. The semiconductor back contact film of the present invention having such a configuration can easily adjust the absorbance of the A layer and the B layer by adjusting the content ratio of the black pigment, and the back contact film of the present invention can be easily obtained. Can.

In the semiconductor back contact film of the present invention, the content ratio of the black pigment in the layer A is preferably 0.05 to 5% by mass. By having such a configuration, the laser marking property is more excellent. In addition, sublimation of organic components such as a binder resin resulting from an increase in light-to-heat conversion due to excessive absorption of light can be suppressed, and character roughening can be suppressed. Further, in the dicing tape-integrated back contact film, air bubbles are unlikely to be generated between the layers.

In the semiconductor back contact film of the present invention, the content ratio of the black pigment in the layer B is preferably 0.5 to 10% by mass. By having such a configuration, the absorbance of the B layer can be made high, and the infrared ray shielding property is excellent, and the adhesion to the back surface of the work is excellent.

The semiconductor back contact film of the present invention is excellent in laser marking properties and infrared shielding properties. For this reason, by using the semiconductor back contact film of the present invention, even when the semiconductor wafer is thinned, laser marking can be performed clearly, and at the same time the semiconductor is irradiated with infrared rays. It is possible to suppress the adverse effect on the circuit surface or the visibility of the circuit surface.

It is the schematic (front sectional view) which shows one Embodiment of the semiconductor back contact film of this invention. It is the schematic (front sectional view) which shows one Embodiment of the dicing tape integrated type semiconductor back contact film. It is the schematic (front sectional drawing) which shows one Embodiment of a sticking process. It is the schematic (front sectional drawing) which shows one Embodiment of a dicing process. It is the schematic (front sectional drawing) which shows one Embodiment of a pick-up process. It is the schematic (front sectional drawing) which shows one Embodiment of a flip chip mounting process.

[Semiconductor back contact film]
The semiconductor back contact film of the present invention (sometimes referred to simply as "back contact film") is a film used in close contact with the back of a semiconductor, and is for forming a protective film on the back (so-called back) of a semiconductor chip. A film (semiconductor back surface protection film) is included. The back contact film of the present invention contains a black pigment, a layer which becomes the outermost layer at the time of close contact with the semiconductor, and a layer which contains the black pigment and whose absorbance at a wavelength of 1300 nm is higher than the layer which is the above outermost layer It has at least a layer to be an inner layer located between the outermost layer and the semiconductor element at the time of close contact with the back surface. In the present specification, a layer which contains a black pigment and which is the outermost layer when the back contact film of the present invention is used (that is, the semiconductor back contact film is in close contact with the back of the semiconductor) is referred to as "A layer". In some cases, a layer that contains a black pigment and becomes the above inner layer at the time of use may be referred to as "B layer".

In the present specification, the "surface" of a semiconductor (work) refers to the surface on which bumps for flip chip mounting of the work are formed, and the "back" is the opposite side of the surface, that is, the bumps are formed. It means the side that is not Moreover, in the present specification, the “back contact film” is a film which is in close contact with the back of the work even after being mounted on the semiconductor device, and peeled off in the process of manufacturing semiconductor devices such as dicing tapes and separators described later. Layers are not included. Therefore, the above-mentioned "uppermost layer" refers to the outermost layer in the back contact film, and may have a layer to be peeled off in the process of manufacturing a semiconductor device such as a dicing tape or a separator described later.

One embodiment of the back contact film of the present invention is shown in FIG. As shown in FIG. 1, the back contact film 10 of the present invention is disposed on the separator 30. The back contact film 10 of the present invention has a multilayer structure including the adhesive layer 11 and the laser mark layer 12, and the laser mark layer 12 is in close contact with the separator 30 in a peelable manner. The laser mark layer 12 shown in FIG. 1 corresponds to the layer (layer A) which is the outermost surface when the workpiece 10 is in close contact with the film 10, and the adhesive layer 11 is the outermost layer when the workpiece 10 is in close contact with the film 10. It corresponds to a layer (B layer) to be an inner layer located between semiconductor elements. In FIG. 1, the adhesive layer 11 and the laser mark layer 12 may have the reverse positional relationship (that is, an aspect in which the adhesive layer 11 is in close contact with the separator 30 so as to be peelable). When the adhesive layer 11 and the laser mark layer 12 have the positional relationship shown in FIG. 1, the back contact film 10 of the present invention can be used by being attached to the back of the work and heat cured. On the other hand, when the positional relationship between the adhesive layer 11 and the laser mark layer 12 is opposite to that shown in FIG. 1, it can be preferably used to produce a dicing tape-integrated back contact film described later.

In the back contact film 10, for example, the adhesive layer 11 is thermally cured by heat treatment at 120 ° C. for 2 hours, while the laser mark layer 12 is not substantially thermally cured, or 2 at 120 ° C. While the adhesive layer 11 is cured by radiation irradiation, while the adhesive layer 11 is cured by radiation, while the adhesive layer 11 is cured by radiation, while the adhesive layer 11 and the laser mark layer 12 are cured. Can be, for example, a thermosetting-less laminated structure in which the thermosetting does not substantially cure. The layer not thermally cured substantially by the heat treatment at 120 ° C. for 2 hours in the back contact film 10 includes a thermosetting layer that has already been cured.

In the back contact film of the present invention, the absorbance of the B layer at a wavelength of 1300 nm is higher than the absorbance of the A layer at a wavelength of 1300 nm. The ratio [B layer / A layer] of the absorbance at wavelength 1300 nm of layer B to the absorbance at wavelength 1300 nm of layer A is not particularly limited, but is preferably 1.2 or more, more preferably 1.5 or more, and more preferably Preferably it is 1.8 or more. The difference of the contrast of A layer and B layer becomes larger as the said ratio is 1.2 or more, and it is further excellent by the laser marking property and infrared rays shielding property of the back contact film of this invention. The ratio is, for example, 15 or less, preferably 10 or less. In the present specification, the absorbance of each layer can be measured using a known spectrophotometer.

The absorbance of the layer A at a wavelength of 1300 nm is not particularly limited, but is preferably 3 or less, more preferably 2.5 or less, and still more preferably 2 or less. A layer can be made into a layer more suitable for laser marking property as the said light absorbency is 3 or less, and it can be set as the structure which is further excellent by the laser marking property and infrared rays shielding property of the back contact film of this invention. The absorbance is, for example, 0.1 or more.

The absorbance of the B layer at a wavelength of 1300 nm is not particularly limited, but is preferably 0.5 or more, more preferably 0.7 or more, and still more preferably 1 or more. It is excellent by infrared shielding property as the said light absorbency is 0.5 or more. The absorbance is, for example, 5 or less.

The absorbance of the layer A at a wavelength of 550 nm is not particularly limited, but is preferably 0.2 to 4.5, more preferably 0.3 to 4, and still more preferably 0.4 to 3.5. It is excellent by laser marking property as the said light absorbency is 0.2 or more. When the absorbance is 4.5 or less, sublimation of organic components such as a binder resin caused by an increase in light-to-heat conversion due to excessive absorption of light can be suppressed, and character roughening can be suppressed. Further, in the dicing tape-integrated back contact film, air bubbles are unlikely to be generated between the layers.

(A layer)
A layer is a layer which becomes the outermost layer in a back contact film, when a back contact film is used in close contact with the back surface of a work. The layer A functions as a laser mark layer when the workpiece is in close contact with the back surface, and laser marking is performed in the process of manufacturing the semiconductor device.

The A layer contains a black pigment. Thereby, high contrast can be ensured between the marking location by the laser marking of layer A and the other location, and good visibility can be realized for the marking information. The said black pigment may contain only 1 type, and may contain 2 or more types.

Examples of the black pigment include carbon black, carbon nanotubes, graphite (graphite), azo pigments such as copper oxide, manganese dioxide, azomethine azo black, aniline black, perylene black, titanium black, cyanine black, activated carbon, ferrite And magnetite, chromium oxide, iron oxide, molybdenum disulfide, complex oxide black pigment and the like. Among them, carbon black is preferable. Examples of carbon black include furnace black, channel black, acetylene black, thermal black, lamp black and the like. Examples of black colorants include pigment blacks 1 and 7 and the like.

The content ratio of the black pigment is preferably 0.05 to 5% by mass, more preferably 0.1 to 2% by mass, and still more preferably 0.2 to 1.5% by mass with respect to the total mass of the layer A. It is. The light absorbency of A layer can be made high as the said content rate is 0.05 mass% or more, and it is excellent by laser marking property. When the content is 5% by mass or less, the absorbance of the layer A can be appropriately suppressed, and sublimation of organic components such as a binder resin resulting from an increase in light-to-heat conversion due to excessive absorption of light is suppressed. Can be suppressed. Further, in the dicing tape-integrated back contact film, air bubbles are unlikely to be generated between the layers.

It is preferable that the composition (resin composition) which forms A layer and A layer contains a thermoplastic resin. When the layer A is a thermosetting layer (that is, a thermosetting layer or a thermosetting layer), the layer A and the resin composition may contain a thermosetting resin and a thermoplastic resin. It may contain a thermoplastic resin having a thermosetting functional group capable of reacting with a curing agent to form a bond. When the layer A and the resin composition contain a thermoplastic resin having a thermosetting functional group, the resin composition does not need to contain a thermosetting resin (epoxy resin etc.).

The thermoplastic resin in the layer A and the above-mentioned resin composition has, for example, a binder function. Examples of the thermoplastic resin include acrylic resin, natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin , Polycarbonate resins, thermoplastic polyimide resins, polyamide resins such as 6-nylon and 6,6-nylon, phenoxy resins, acrylic resins, saturated polyester resins such as polyethylene terephthalate (PET) and polybutylene terephthalate (PBT), polyamideimide resins And fluorine resins. The thermoplastic resin may be used alone or in combination of two or more. As the thermoplastic resin, an acrylic resin is preferable from the viewpoint of having few ionic impurities and high heat resistance.

The said acrylic resin is a polymer containing the structural unit derived from an acryl-type monomer (The monomer component which has a (meth) acryloyl group in a molecule | numerator) as a structural unit of a polymer. It is preferable that the said acrylic resin is a polymer which contains the structural unit originating in a (meth) acrylic acid ester most by mass ratio. In addition, an acrylic resin may use only 1 type and may use 2 or more types. Further, in the present specification, “(meth) acrylic” represents “acrylic” and / or “methacrylic” (any one or both of “acrylic” and “methacrylic”), and the same applies to others. .

As said (meth) acrylic acid ester, the hydrocarbon group containing (meth) acrylic acid ester which may have an alkoxy group is mentioned, for example. Examples of the hydrocarbon group-containing (meth) acrylic acid ester include (meth) acrylic acid alkyl ester, (meth) acrylic acid cycloalkyl ester, and (meth) acrylic acid aryl ester. Examples of the above (meth) acrylic acid alkyl ester include methyl ester of (meth) acrylic acid, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, Isopentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester (lauryl ester), tridecyl ester, tetradecyl ester Hexadecyl ester, octadecyl ester, eicosyl ester and the like. Examples of the (meth) acrylic acid cycloalkyl ester include cyclopentyl ester and cyclohexyl ester of (meth) acrylic acid. Examples of the (meth) acrylic acid aryl ester include phenyl ester of (meth) acrylic acid and benzyl ester. Examples of the hydrocarbon group-containing (meth) acrylic acid ester having an alkoxy group include those in which one or more hydrogen atoms in the hydrocarbon group in the above-mentioned hydrocarbon group-containing (meth) acrylic acid ester are substituted with an alkoxy group, For example, 2-methoxymethyl ester of (meth) acrylic acid, 2-methoxyethyl ester, 2-methoxybutyl ester and the like can be mentioned. The hydrocarbon group-containing (meth) acrylic acid ester which may have an alkoxy group may be used alone or in combination of two or more.

The said acrylic resin is a structure derived from the other monomer component which can be copolymerized with the hydrocarbon group containing (meth) acrylic acid ester which may have an alkoxy group for the purpose of modification, such as cohesion force and heat resistance. It may contain units. As said other monomer component, functional group containing functional groups, such as a carboxy group containing monomer, an acid anhydride monomer, a hydroxyl group containing monomer, a glycidyl group containing monomer, a sulfonic acid group containing monomer, a phosphoric acid group containing monomer, acrylamide, acrylonitrile etc. are mentioned, for example. Monomers etc. are mentioned. Examples of the carboxy group-containing monomer include acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid and the like. Examples of the acid anhydride monomer include maleic anhydride, itaconic anhydride and the like. Examples of the above-mentioned hydroxy group-containing monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, Examples thereof include 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, and (4-hydroxymethylcyclohexyl) methyl (meth) acrylate. Examples of the glycidyl group-containing monomers include glycidyl (meth) acrylate and methyl glycidyl (meth) acrylate. Examples of the sulfonic acid group-containing monomer include styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamido-2-methylpropane sulfonic acid, (meth) acrylamidopropane sulfonic acid, sulfopropyl (meth) acrylate, (meth Acryloyloxy naphthalene sulfonic acid etc. are mentioned. Examples of the above-mentioned phosphoric acid group-containing monomer include 2-hydroxyethyl acryloyl phosphate and the like. The other monomer components may be used alone or in combination of two or more.

The acrylic resin that may be contained in the layer A and the above resin composition is, from the viewpoint of achieving both the visibility of the imprinted information by laser marking and the good cleavability at the time of expanding, butyl acrylate, ethyl acrylate, acrylonitrile, and acrylic It is preferable that it is a copolymer of monomers appropriately selected from acids.

When the layer A and the resin composition contain a thermosetting resin together with a thermoplastic resin, examples of the thermosetting resin include epoxy resin, phenol resin, amino resin, unsaturated polyester resin, polyurethane resin, silicone resin, A thermosetting polyimide resin etc. are mentioned. The said thermosetting resin may use only 1 type, and may use 2 or more types. An epoxy resin is preferable as the thermosetting resin because the content of ionic impurities and the like which may cause corrosion of the semiconductor chip tends to be small. Moreover, as a hardening agent of an epoxy resin, a phenol resin is preferable.

Examples of the epoxy resin include bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, brominated bisphenol A epoxy resin, hydrogenated bisphenol A epoxy resin, bisphenol AF epoxy resin, biphenyl resin Cresol novolac epoxy resin such as epoxy resin, naphthalene epoxy resin, fluorene epoxy resin, phenol novolac epoxy resin, ortho cresol novolac epoxy resin, trishydroxyphenylmethane epoxy resin, tetraphenylolethane epoxy resin etc A multifunctional epoxy resin is mentioned. The said epoxy resin may use only 1 type, and may use 2 or more types.

Among them, a phenol novolac epoxy resin, an ortho cresol novolac epoxy resin, a biphenyl epoxy resin, a trishydroxyphenylmethane epoxy resin, tetrapheny, since they are rich in reactivity with a phenol resin as a curing agent and excellent in heat resistance. Roll ethane type epoxy resin is preferred.

As a phenol resin which can act as a curing agent for epoxy resin, for example, novolac type phenol resins such as phenol novolac resin, phenol aralkyl resin, cresol novolac resin, tert-butylphenol novolac resin, nonylphenol novolac resin and the like can be mentioned. Moreover, as said phenol resin, polyoxystyrenes, such as a resol type phenol resin and polypara oxystyrene, are also mentioned. The said phenol resin may use only 1 type, and may use 2 or more types.

In the layer A and the above resin composition, from the viewpoint of sufficiently advancing the curing reaction between the epoxy resin and the phenol resin, the phenol resin has a hydroxyl group in the phenol resin per equivalent of epoxy group in the epoxy resin component. It is preferably contained in an amount of 0.5 to 2.0 equivalents, more preferably 0.8 to 1.2 equivalents.

When the layer A and the resin composition contain a thermosetting resin, the content of the thermosetting resin is preferably 5 to 60% by mass, more preferably the total mass of the layer A or the resin composition. Is 10 to 50% by mass.

When A layer and the said resin composition contain the thermoplastic resin which has a thermosetting functional group, a thermosetting functional group containing acrylic resin can be used as said thermoplastic resin, for example. The acrylic resin in the thermosetting functional group-containing acrylic resin preferably contains a structural unit derived from a hydrocarbon group-containing (meth) acrylic acid ester as the largest structural unit in mass ratio. As the said hydrocarbon group containing (meth) acrylic acid ester, the hydrocarbon illustrated as a hydrocarbon group containing (meth) acrylic acid ester which forms the acrylic resin as a thermoplastic resin which may be contained in the above-mentioned A layer, for example A group containing (meth) acrylic acid ester is mentioned. On the other hand, as a thermosetting functional group in a thermosetting functional group containing acrylic resin, a glycidyl group, a carboxy group, a hydroxyl group, an isocyanate group etc. are mentioned, for example. Among them, glycidyl group and carboxy group are preferable. That is, as a thermosetting functional group containing acrylic resin, a glycidyl group containing acrylic resin and a carboxy group containing acrylic resin are especially preferable. Moreover, it is preferable to include a curing agent together with the thermosetting functional group-containing acrylic resin, and as the curing agent, for example, it is exemplified as a crosslinking agent which can be included in a radiation curable adhesive for forming an adhesive layer described later. The thing is mentioned. When the thermosetting functional group in the thermosetting functional group-containing acrylic resin is a glycidyl group, it is preferable to use a polyphenol compound as a curing agent, and, for example, various phenol resins described above can be used.

When A layer and the said resin composition contain a thermosetting resin, it is preferable to contain a thermosetting catalyst (thermosetting accelerator). When the thermosetting catalyst is contained, the curing reaction of the resin component can be sufficiently advanced to cure the layer A, and the curing reaction rate can be increased. Examples of the thermosetting catalyst include imidazole compounds, triphenylphosphine compounds, amine compounds, and trihalogenborane compounds. Examples of imidazole compounds include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole and 2-phenyl- 4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazo Lilium trimellitate, 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-undecylimidazolyl- (1 ')]-Ethyl-s-triazine, 2,4-diamide -6- [2′-ethyl-4′-methylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)]-ethyl- Examples thereof include s-triazine isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole and the like. Examples of triphenyl phosphine compounds include triphenyl phosphine, tributyl phosphine, tri (p-methylphenyl) phosphine, tri (nonylphenyl) phosphine, diphenyl tolyl phosphine, tetraphenyl phosphonium bromide, methyl triphenyl phosphonium and methyl triphenyl Phosphonium chloride, methoxymethyltriphenylphosphonium, benzyltriphenylphosphonium chloride and the like can be mentioned. The triphenylphosphine-based compounds also include compounds having both a triphenylphosphine structure and a triphenylborane structure. Examples of such a compound include tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetra-p-triborate, benzyltriphenylphosphonium tetraphenylborate, triphenylphosphine triphenylborane and the like. Examples of amine compounds include monoethanolamine trifluoroborate, dicyandiamide and the like. Examples of trihalogen borane compounds include trichloroborane and the like. The said thermosetting catalyst may contain only 1 type, and may contain 2 or more types.

The layer A and the resin composition may contain a filler. By including the filler, it is easy to adjust the physical properties such as the modulus of elasticity of the layer A, the strength at yield point, and the elongation at break. Moreover, it becomes possible to provide marking information more clearly by laser marking. As a filler, an inorganic filler and an organic filler are mentioned. As a constituent material of the inorganic filler, for example, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker, nitrided Silicon, boron nitride, crystalline silica, amorphous silica and the like can be mentioned. Moreover, as a constituent material of the inorganic filler, single metals such as aluminum, gold, silver, copper, nickel and the like, alloys, amorphous carbon, graphite and the like can also be mentioned. Examples of the constituent material of the organic filler include poly (methyl methacrylate) (PMMA), polyimide, polyamide imide, polyether ether ketone, polyether imide, and polyester imide. The said filler may contain only 1 type, and may contain 2 or more types.

The filler may have various shapes such as sphere, needle, and flake. The average particle diameter of the filler is preferably 10 μm or less, more preferably 8 μm or less, and still more preferably 7 μm or less. The average particle diameter is preferably 0.1 μm or more, and more preferably 0.2 μm or more. When the average particle diameter is 10 μm or less, irregular reflection of a light beam irradiated at the time of laser marking can be suppressed, and the infrared shielding property is excellent, and imprint information can be more clearly provided by laser marking. Moreover, it is excellent by cutting property about the back contact film which will be fragmented. In the present specification, the average particle diameter of the filler can be determined, for example, using a light intensity type particle size distribution analyzer (trade name “LA-910”, manufactured by Horiba, Ltd.).

The content ratio of the filler is preferably 10% by mass or more, more preferably 15% by mass or more, and more preferably 20% by mass or more based on the total mass of the layer A or the resin composition. The content ratio is preferably 60% by mass or less, more preferably 57% by mass or less, and still more preferably 55% by mass or less.

The layer A and the above resin composition may contain other components as needed. As said other component, flame retardants, a silane coupling agent, an ion trap agent, coloring agents other than the said black pigment, etc. are mentioned, for example. Examples of the flame retardant include metal hydroxides such as aluminum hydroxide, magnesium hydroxide, iron hydroxide, calcium hydroxide, tin hydroxide, complexed metal hydroxides, phosphazene compounds, antimony trioxide, Antimony oxide, brominated epoxy resin etc. are mentioned. Examples of the silane coupling agent include β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, and γ-glycidoxypropylmethyldiethoxysilane. Examples of the ion trap agent include hydrotalcites, bismuth hydroxide, hydrous antimony oxide (eg, “IXE-300” manufactured by Toagosei Co., Ltd.), and zirconium phosphate having a specific structure (eg, manufactured by Toagosei Co., Ltd.) “IXE-100”), magnesium silicate (eg “Kyoward 600” manufactured by Kyowa Chemical Industry Co., Ltd.), aluminum silicate (eg “Kyoward 700 manufactured by Kyowa Chemical Industry Co., Ltd.”) and the like. Compounds capable of forming a complex with a metal ion can also be used as an ion trapping agent. Examples of such a compound include triazole compounds, tetrazole compounds and bipyridyl compounds. Among these, triazole compounds are preferable from the viewpoint of the stability of the complex formed with the metal ion. As such a triazole compound, for example, 1,2,3-benzotriazole, 1- {N, N-bis (2-ethylhexyl) aminomethyl} benzotriazole, carboxybenzotriazole, 2- (2-hydroxy-) 5-Methylphenyl) benzotriazole, 2- (2-hydroxy-3,5-di-t-butylphenyl) -5-chlorobenzotriazole, 2- (2-hydroxy-3-t-butyl-5-methylphenyl) ) 5-Chlorobenzotriazole, 2- (2-hydroxy-3,5-di-t-amylphenyl) benzotriazole, 2- (2-hydroxy-5-t-octylphenyl) benzotriazole, 6- (2 -Benzotriazolyl) -4-t-octyl-6'-t-butyl-4'-methyl-2,2'-methylenebi Phenol, 1- (2 ', 3'-hydroxypropyl) benzotriazole, 1- (1,2-dicarboxydiethyl) benzotriazole, 1- (2-ethylhexylaminomethyl) benzotriazole, 2,4-di-t -Pentyl-6-{(H-benzotriazol-1-yl) methyl} phenol, 2- (2-hydroxy-5-tert-butylphenyl) -2H-benzotriazole, 3- (2H-benzotriazole-2-) Yl) -5- (1,1-dimethylethyl) -4-hydroxy, octyl-3- [3-t-butyl-4-hydroxy-5- (5-chloro-2H-benzotriazol-2-yl) phenyl ] Propionate, 2-Ethylhexyl-3- [3-t-butyl-4-hydroxy-5- (5-chloro-2H-benzotriazole) -2-yl) phenyl] propionate, 2- (2H-benzotriazol-2-yl) -6- (1-methyl-1-phenylethyl) -4- (1,1,3,3-tetramethylbutyl) Phenol, 2- (2H-benzotriazol-2-yl) -4-tert-butylphenol, 2- (2-hydroxy-5-methylphenyl) benzotriazole, 2- (2-hydroxy-5-tert-octylphenyl) -Benzotriazole, 2- (3-t-butyl-2-hydroxy-5-methylphenyl) -5-chlorobenzotriazole, 2- (2-hydroxy-3,5-di-t-amylphenyl) benzotriazole, 2- (2-hydroxy-3,5-di-t-butylphenyl) -5-chloro-benzotriazole, 2- [2-hydroxy-3,5-di (1 , 1-Dimethylbenzyl) phenyl] -2H-benzotriazole, 2,2'-methylenebis [6- (2H-benzotriazol-2-yl) -4- (1,1,3,3-tetramethylbutyl) phenol ], 2- [2-hydroxy-3,5-bis (α, α-dimethylbenzyl) phenyl] -2H-benzotriazole, methyl-3- [3- (2H-benzotriazol-2-yl) -5-] t-Butyl-4-hydroxyphenyl] propionate and the like. In addition, specific hydroxyl group-containing compounds such as quinol compounds, hydroxyanthraquinone compounds and polyphenol compounds can also be used as the ion trap agent. Specific examples of such a hydroxyl group-containing compound include 1,2-benzenediol, alizarin, anthralpine, tannin, gallic acid, methyl gallate, pyrogallol and the like. Examples of colorants other than the black pigment include cyan colorants, magenta colorants, yellow colorants and the like. The other components may be used alone or in combination of two or more.

The layer A is preferably a thermosetting layer (that is, a thermosetting layer or a thermosetting layer), and the thermosetting component is a thermosetting layer (thermosetting layer) that is thermosetting. More preferable. The thermosetting A layer is formed by curing a thermosetting resin composition layer formed from the resin composition forming the A layer.

(B layer)
B layer is a layer used as an inner layer (layer located between the outermost layer and work) in the back contact film when the back contact film is used in close contact with the back surface of the work. The layer B may be an adhesive layer having a bonding surface to the rear surface of the workpiece when in close contact with the rear surface of the workpiece, or may be an intermediate layer positioned between the adhesive layer and the outermost layer. The layer B to be the adhesive layer may have a thermosetting property so that it can be adhered and protected to the back surface of the work by heat curing after being attached to the back surface of the work. When the adhesive layer is non-thermosetting and does not have thermosetting property, the adhesive layer is adhered to the back surface of the work by adhesion (wettability) at the interface due to pressure etc. It is possible.

The B layer contains a black pigment. Thereby, the infrared ray blocking property of the B layer can be made excellent. The said black pigment may contain only 1 type, and may contain 2 or more types.

Examples of the black-based pigment include those exemplified as the black pigment contained in the above-mentioned A layer. Among them, carbon black is preferable. The black pigment contained in the B layer is preferably the same as the black pigment contained in the A layer. That is, when the black pigment in the A layer is carbon black, the black pigment in the B layer is preferably carbon black. When the black pigment in the A layer and the black pigment in the B layer are the same type (especially, both are carbon black), the absorbance of the A layer and the B layer can be easily adjusted by adjusting the content ratio, and this is easily The back contact film of the invention can be obtained.

The content of the black pigment in the layer B is preferably higher than the content of the black pigment in the layer A. In this case, the absorbance of the B layer tends to be higher than the absorbance of the A layer. In particular, when black pigments of the same type are used in layer A and layer B, the absorbance of layer B is higher than the absorbance of layer A.

The content of the black pigment in the layer B is preferably 0.5 to 10% by mass, more preferably 0.8 to 8% by mass, and still more preferably 1 to 5% by mass with respect to the total mass of the layer B. is there. The light absorbency of B layer can be made high as the said content rate is 0.5 mass% or more, and it is excellent by infrared rays shielding property. It is excellent by the adhesiveness to the back surface of a workpiece | work that the said content rate is 10 mass% or less.

It is preferable that the composition (resin composition) which forms B layer and B layer contains a thermoplastic resin. When the layer B has a thermosetting property, the resin composition forming the layer B and the layer B may contain a thermosetting resin and a thermoplastic resin, and may react with a curing agent to form a bond. You may contain the thermoplastic resin which has a thermosetting functional group. When B layer contains the thermoplastic resin which has a thermosetting functional group, the said resin composition does not need to contain thermosetting resin (an epoxy resin etc.).

The thermoplastic resin has, for example, a binder function in the B layer. As said thermoplastic resin, what was illustrated as a thermoplastic resin which the above-mentioned A layer may contain is mentioned. The thermoplastic resin may be used alone or in combination of two or more. As the thermoplastic resin, an acrylic resin is preferable from the viewpoint of having few ionic impurities and high heat resistance.

The acrylic resin which may be contained in the resin composition for forming the layer B and the layer B is an acrylic acid from the viewpoint of achieving both the adhesiveness to the work and the good cleavability at the time of expansion when the layer B is an adhesive layer. It is preferable that it is a copolymer of monomers suitably selected from butyl, ethyl acrylate, acrylonitrile and acrylic acid.

When the resin composition which forms B layer and B layer includes a thermosetting resin together with a thermoplastic resin, as the thermosetting resin, for example, epoxy resin, phenol resin, amino resin, unsaturated polyester resin, polyurethane resin And silicone resins and thermosetting polyimide resins. The said thermosetting resin may use only 1 type, and may use 2 or more types. An epoxy resin is preferable as the thermosetting resin because the content of ionic impurities and the like which may cause corrosion of the semiconductor chip tends to be small. Moreover, as a hardening agent of an epoxy resin, a phenol resin is preferable.

As said epoxy resin, what was illustrated as an epoxy resin which the above-mentioned A layer may contain is mentioned. The said epoxy resin may use only 1 type, and may use 2 or more types. Among them, a phenol novolac epoxy resin, an ortho cresol novolac epoxy resin, a biphenyl epoxy resin, a trishydroxyphenylmethane epoxy resin, tetrapheny, since they are rich in reactivity with a phenol resin as a curing agent and excellent in heat resistance. Roll ethane type epoxy resin is preferred.

As a phenol resin which can act as a hardening agent of an epoxy resin, what was illustrated as a phenol resin which above-mentioned A layer may contain is mentioned. The said phenol resin may use only 1 type, and may use 2 or more types.

In the resin composition for forming the layer B and the layer B, from the viewpoint of sufficiently advancing the curing reaction between the epoxy resin and the phenol resin, the phenol resin is the phenol resin per equivalent of epoxy group in the epoxy resin component. The hydroxyl group is preferably contained in an amount of 0.5 to 2.0 equivalents, more preferably 0.8 to 1.2 equivalents.

When the resin composition for forming the layer B and the layer B includes a thermosetting resin, the content ratio of the thermosetting resin is the resin for forming the layer B or layer B from the viewpoint of appropriately curing the layer B. The content is preferably 5 to 60% by mass, more preferably 10 to 50% by mass, with respect to the total mass of the composition.

When the resin composition which forms B layer and B layer contains the thermoplastic resin which has a thermosetting functional group, as the thermoplastic resin concerned, it is illustrated as a thermosetting functional group content acrylic resin which the above-mentioned A layer may contain. Are listed. Among them, glycidyl group-containing acrylic resin and carboxy group-containing acrylic resin are particularly preferable. Moreover, it is preferable to include a curing agent together with the thermosetting functional group-containing acrylic resin, and as the curing agent, for example, those exemplified as a crosslinking agent which may be included in a radiation-curable pressure-sensitive adhesive for pressure-sensitive adhesive layer formation described later Can be mentioned. When the thermosetting functional group in the thermosetting functional group-containing acrylic resin is a glycidyl group, it is preferable to use a polyphenol compound as a curing agent, and, for example, various phenol resins described above can be used.

The resin composition which forms B layer and B layer may contain the thermosetting catalyst (thermosetting accelerator). When the thermosetting catalyst is contained, the curing reaction of the resin component can be sufficiently advanced in curing of the resin composition, and the curing reaction rate can be increased. As said thermosetting catalyst, what was illustrated as a thermosetting catalyst which the above-mentioned A layer may contain is mentioned. The said thermosetting catalyst may contain only 1 type, and may contain 2 or more types.

The resin composition which forms B layer and B layer may contain the filler. By including the filler, physical properties such as the modulus of elasticity of the B layer, the strength at yield, the elongation at break, etc. can be easily adjusted. As a filler, what was illustrated as a filler which the above-mentioned A layer may contain is mentioned. The said filler may contain only 1 type, and may contain 2 or more types.

The filler may have various shapes such as sphere, needle, and flake. The average particle diameter of the filler is preferably 10 μm or less, more preferably 8 μm or less, and still more preferably 7 μm or less. The average particle diameter is preferably 0.1 μm or more, and more preferably 0.2 μm or more. When the average particle diameter is 10 μm or less, the back contact film which is to be fragmented is more excellent in cleavability.

The content ratio of the filler is preferably 10% by mass or more, more preferably 15% by mass or more, and more preferably 20% by mass or more, based on the total mass of the B layer or the resin composition forming the B layer. The content ratio is preferably 60% by mass or less, more preferably 57% by mass or less, and still more preferably 55% by mass or less.

The resin composition which forms B layer and B layer may contain the other component as needed. As said other components, the flame retardant, the silane coupling agent, the ion trap agent, coloring agents other than a black pigment etc. which were illustrated as other components which the above-mentioned A layer may contain are mentioned. The other components may be used alone or in combination of two or more.

In the back contact film of the present invention, the layer to be the inner layer (layers other than the layer A) may have a single layer structure or a multilayer structure. When the layer to be the inner layer has a single-layer structure, the layer to be the inner layer is a single layer B which is an adhesive layer. When the layer to be the inner layer has a multilayer structure, the layer to be the inner layer contains a black pigment as a whole (that is, assuming all the plurality of inner layers as one layer), and the absorbance at a wavelength of 1300 nm is A Preferably, the layer is higher than the layer. When the layer to be the inner layer has such a multilayer structure, in the back contact film of the present invention, the outermost layer is excellent in laser marking property when the workpiece is in close contact with the back surface, and the entire inner layer absorbs infrared rays more sufficiently. Can be done, and the infrared shielding property is even better.

The thickness of the layer A is, for example, 2 to 180 μm, preferably 4 to 160 μm.

The thickness (total thickness) of the layer to be the inner layer is, for example, 2 to 200 μm, preferably 4 to 160 μm, more preferably 6 to 100 μm, and still more preferably 8 to 80 μm.

The ratio of the thickness of the layer A to the thickness of the layer to be the inner layer (total thickness) is preferably 1 or more, more preferably 1.5 or more, and still more preferably 2 or more. The ratio is, for example, 8 or less.

The thickness of the back contact film of the present invention is, for example, 2 to 200 μm, preferably 4 to 160 μm, more preferably 6 to 100 μm, and still more preferably 10 to 80 μm. When the thickness is 2 μm or more, the back surface of the workpiece can be protected more firmly. If the thickness is 200 μm or less, the workpiece after close contact can be made thinner.

[Dicing tape integrated semiconductor back contact film]
The back contact film of the present invention comprises a dicing tape having a laminated structure including a substrate and a pressure sensitive adhesive layer, and the back contact film of the present invention which is in close contact with the pressure sensitive adhesive layer of the dicing tape. Alternatively, it may be used as a dicing tape-integrated semiconductor back contact film (sometimes referred to as "dicing tape integrated back contact film"). In addition, the said dicing tape integrated type back contact film may be called "the dicing tape integrated type back contact film of this invention." When the back contact film of the present invention is used as a dicing tape-integrated back contact film, it is possible to make wrinkles less likely to occur when sticking to a substrate.

One embodiment of the dicing tape-integrated back contact film of the present invention will be described with reference to FIG. The dicing tape-integrated back contact film 1 shown in FIG. 2 is disposed on the separator 30. The dicing tape-integrated back contact film 1 can be used in the process for obtaining a semiconductor chip with a film of a chip equivalent size for forming a back contact film of a semiconductor chip, and the back contact film 10 of the present invention and It has a laminated structure including the dicing tape 20.

(Base material)
The substrate in the dicing tape is an element functioning as a support in the dicing tape and the dicing tape-integrated back contact film. As a base material, a plastic base material (especially plastic film) is mentioned, for example. The substrate may be a single layer, or a laminate of similar or different substrates.

Examples of the resin constituting the plastic base include low density polyethylene, linear low density polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, random copolymer polypropylene, block copolymer polypropylene, homopolypropylene , Polybutene, polymethylpentene, ethylene-vinyl acetate copolymer (EVA), ionomer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester (random, alternating) copolymer, ethylene- Polyolefin resins such as butene copolymer, ethylene-hexene copolymer; polyurethane; polyester such as polyethylene terephthalate (PET), polyethylene naphthalate, polybutylene terephthalate (PBT); polycarbonate; polyimide Riete ether ketone; polyetherimides; aramid, polyamide such as wholly aromatic polyamide; polyphenyl sulfide; fluorine resin, polyvinyl chloride, polyvinylidene chloride, cellulose resin, silicone resin, and the like. It is easy to maintain chip separation distance using partial heat contraction of dicing tape or base material in expanding process for securing good heat shrinkability in base material and widening separation distance between semiconductor chips after dicing. From the viewpoint, it is preferable that the substrate contains ethylene-vinyl acetate copolymer or polyvinyl chloride as a main component. In addition, with the main component of a base material, it is set as the component which occupies the largest mass ratio in a structural component. The said resin may use only 1 type and may use 2 or more types. When the pressure-sensitive adhesive layer is a radiation-curable pressure-sensitive adhesive layer as described later, the substrate preferably has radiation transparency.

When the substrate is a plastic film, the plastic film may be non-oriented or may be oriented in at least one direction (uniaxial direction, biaxial direction, etc.). When oriented in at least one direction, the plastic film can be thermally shrunk in the at least one direction. In order for the substrate and the dicing tape to have isotropic heat shrinkability, the substrate is preferably a biaxially oriented film. The plastic film oriented in at least one direction can be obtained by stretching a non-stretched plastic film in at least one direction (uniaxial stretching, biaxial stretching, etc.). The base material and the dicing tape preferably have a thermal contraction rate of 1 to 30%, more preferably 2 to 25%, and further preferably 1 to 30% in a heat treatment test performed under conditions of a heating temperature of 100 ° C. and a heating time treatment of 60 seconds. It is preferably 3 to 20%, particularly preferably 5 to 20%. The heat shrinkage rate is preferably a heat shrinkage rate in at least one direction of the MD direction and the TD direction.

The surface on the pressure-sensitive adhesive layer side of the substrate is, for example, corona discharge treatment, plasma treatment, sand mat processing, ozone exposure treatment, flame exposure treatment, high-piezoelectric shock treatment, for the purpose of enhancing adhesion and retention with the pressure-sensitive adhesive layer. Physical treatments such as exposure treatment and ionizing radiation treatment; chemical treatments such as chromic acid treatment; and surface treatments such as easy adhesion treatment with a coating agent (primer) may be applied. Moreover, in order to provide antistatic ability, you may provide the conductive vapor deposition layer containing a metal, an alloy, these oxides, etc. on the base-material surface. It is preferable that the surface treatment for improving adhesiveness is given to the whole surface by the side of the adhesive layer in a base material.

The thickness of the substrate is preferably 40 μm or more, more preferably 50 μm or more, and still more preferably from the viewpoint of securing strength for the substrate to function as a support in the dicing tape and dicing tape-integrated back contact film. Is 55 μm or more, particularly preferably 60 μm or more. Further, from the viewpoint of realizing appropriate flexibility in the dicing tape and the dicing tape-integrated back contact film, the thickness of the substrate is preferably 200 μm or less, more preferably 180 μm or less, and still more preferably 150 μm or less. is there.

(Pressure-sensitive adhesive layer)
The pressure-sensitive adhesive layer in the dicing tape is a pressure-sensitive adhesive layer (pressure-sensitive adhesive type pressure-sensitive adhesive layer) capable of intentionally reducing the adhesive force by the action from the outside in the use process of the dicing tape-integrated back contact film. It may be a pressure-sensitive adhesive layer (pressure-sensitive adhesive non-reducing pressure-sensitive adhesive layer) in which the adhesion is hardly or not reduced depending on the external action in the use process of the dicing tape-integrated back contact film. It can select suitably according to the method, conditions, etc. of singulation of the work separated into pieces using dicing tape integrated back contact film. The pressure-sensitive adhesive layer may have a single-layer structure or a multi-layer structure.

When the pressure-sensitive adhesive layer is a pressure-sensitive adhesive type pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer exhibits relatively high adhesion and relatively low adhesion in the manufacturing process and use process of the dicing tape-integrated back contact film. It becomes possible to use properly the state which shows power. For example, when attaching a back contact film to the adhesive layer of the dicing tape in the manufacturing process of the dicing tape integrated back contact film, or when the dicing tape integrated back contact film is used in the dicing step, the adhesive layer is relative While it becomes possible to suppress and prevent lifting of the back contact film from the pressure-sensitive adhesive layer by using a state that exhibits extremely high adhesive strength, thereafter, the semiconductor chip is obtained from the dicing tape with dicing tape integrated back contact film. In the pickup step for pickup, the pickup can be easily performed by reducing the adhesive force of the pressure-sensitive adhesive layer.

Examples of the pressure-sensitive adhesive that can form such a pressure-sensitive adhesive type pressure-sensitive adhesive layer include a radiation-curable pressure-sensitive adhesive and a heat-foaming type pressure-sensitive adhesive. As an adhesive which forms an adhesive force reduction type adhesive layer, 1 type of adhesive may be used and 2 or more types of adhesive may be used.

As the radiation-curable pressure-sensitive adhesive, for example, a pressure-sensitive adhesive of a type which can be cured by irradiation of electron beam, ultraviolet light, α-ray, β-ray, γ-ray or X-ray can be used. A pressure sensitive adhesive (ultraviolet curable pressure sensitive adhesive) can be particularly preferably used.

The radiation-curable pressure-sensitive adhesive includes, for example, a base polymer such as an acrylic polymer, and a radiation-polymerizable monomer component or oligomer component having a functional group such as a radiation-polymerizable carbon-carbon double bond. Types of radiation curable adhesives.

The said acryl-type polymer is a polymer containing the structural unit derived from an acryl-type monomer (The monomer component which has a (meth) acryloyl group in a molecule | numerator) as a structural unit of a polymer. It is preferable that the said acryl-type polymer is a polymer which contains the structural unit originating in a (meth) acrylic acid ester most by mass ratio. In addition, an acryl-type polymer may use only 1 type, and may use 2 or more types.

As said (meth) acrylic acid ester, the hydrocarbon group containing (meth) acrylic acid ester which may have an alkoxy group is mentioned, for example. As a hydrocarbon group-containing (meth) acrylic acid ester which may have an alkoxy group, a hydrocarbon which may have an alkoxy group exemplified as a constituent unit of an acrylic resin which the above-mentioned back contact film may contain A group containing (meth) acrylic acid ester is mentioned. The hydrocarbon group-containing (meth) acrylic acid ester which may have an alkoxy group may be used alone or in combination of two or more. As the above-mentioned hydrocarbon group-containing (meth) acrylic acid ester which may have an alkoxy group, 2-ethylhexyl acrylate and lauryl acrylate are preferable. In order to properly express in the pressure-sensitive adhesive layer basic characteristics such as tackiness by the hydrocarbon group-containing (meth) acrylate which may have an alkoxy group, all monomer components for forming an acrylic polymer 40 mass% or more is preferable, and, as for the ratio of hydrocarbon group containing (meth) acrylic acid ester which may have an alkoxy group in these, 60 mass% or more is more preferable.

The above acrylic polymer is derived from another monomer component copolymerizable with the hydrocarbon group-containing (meth) acrylic acid ester which may have the above alkoxy group for the purpose of modifying cohesion and heat resistance etc. May be included. As said other monomer component, the other monomer illustrated as a structural unit of the acrylic resin which the above-mentioned back contact film may contain is mentioned. The other monomer components may be used alone or in combination of two or more. In order to properly express in the pressure-sensitive adhesive layer basic characteristics such as tackiness by the hydrocarbon group-containing (meth) acrylate which may have an alkoxy group, all monomer components for forming an acrylic polymer 60 mass% or less is preferable, and, as for the total ratio of the said other monomer component in ,, it is 40 mass% or less more preferably.

The above-mentioned acrylic polymer may contain a structural unit derived from a polyfunctional monomer copolymerizable with a monomer component forming the acrylic polymer in order to form a crosslinked structure in the polymer skeleton. Examples of the polyfunctional monomer include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, penta Erythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate (eg, polyglycidyl (meth) acrylate), polyester The monomer etc. which have a (meth) acryloyl group and other reactive functional groups in the molecule | numerator of (meth) acrylate, urethane (meth) acrylate, etc. are mentioned. The polyfunctional monomers may be used alone or in combination of two or more. In order to properly express in the pressure-sensitive adhesive layer basic characteristics such as tackiness by the hydrocarbon group-containing (meth) acrylate which may have an alkoxy group, all monomer components for forming an acrylic polymer 40 mass% or less is preferable, and, as for the ratio of the said polyfunctional monomer in these, 30 mass% or less is more preferable.

An acrylic polymer is obtained by subjecting one or more monomer components containing an acrylic monomer to polymerization. As a polymerization method, solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization and the like can be mentioned.

An acrylic polymer can be obtained by polymerizing a raw material monomer for forming it. Examples of the polymerization method include solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization and the like. The mass average molecular weight of the acrylic polymer is preferably 100,000 or more, more preferably 200,000 to 3,000,000. When the mass average molecular weight is 100,000 or more, the amount of low molecular weight substances in the pressure-sensitive adhesive layer tends to be small, and the contamination of the back contact film, the semiconductor wafer and the like can be further suppressed.

The pressure-sensitive adhesive layer or the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer may contain a crosslinking agent. For example, when using an acrylic polymer as the base polymer, the acrylic polymer can be crosslinked to further reduce low molecular weight substances in the pressure-sensitive adhesive layer. In addition, the mass average molecular weight of the acrylic polymer can be increased. As said crosslinking agent, a polyisocyanate compound, an epoxy compound, a polyol compound (polyphenol type compound etc.), an aziridine compound, a melamine compound etc. are mentioned, for example. When a crosslinking agent is used, the amount thereof used is preferably about 5 parts by mass or less, more preferably 0.1 to 5 parts by mass, with respect to 100 parts by mass of the base polymer.

Examples of the radiation polymerizable monomer component include urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxy penta ( Examples include meta) acrylates, dipentaerythritol hexa (meth) acrylates, and 1,4-butanediol di (meth) acrylates. Examples of the radiation polymerizable oligomer component include various oligomers such as urethane type, polyether type, polyester type, polycarbonate type and polybutadiene type, and those having a molecular weight of about 100 to 30000 are preferable. The content of the radiation polymerizable monomer component and the oligomer component in the radiation curable adhesive forming the adhesive layer is, for example, 5 to 500 parts by mass, preferably 40 to 150 parts by mass with respect to 100 parts by mass of the base polymer. It is about a mass part. Further, as the addition type radiation-curable pressure-sensitive adhesive, for example, those disclosed in JP-A-60-196956 may be used.

The radiation-curable pressure-sensitive adhesive may be an internal radiation-curable resin containing a base polymer having a functional group such as a radiation-polymerizable carbon-carbon double bond or the like in the polymer side chain or in the polymer main chain at the polymer main chain terminal. There is also a sex adhesive. Use of such an internal-type radiation-curable pressure-sensitive adhesive tends to be able to suppress unintended changes in adhesion properties caused by the movement of low molecular weight components in the formed pressure-sensitive adhesive layer.

An acrylic polymer is preferable as the base polymer contained in the intrinsic type radiation-curable pressure-sensitive adhesive. As a method for introducing a radiation polymerizable carbon-carbon double bond into an acrylic polymer, for example, an acrylic polymer was obtained by polymerizing (copolymerizing) a raw material monomer containing a monomer component having a first functional group. Thereafter, a compound having a second functional group capable of reacting with the first functional group and a radiation-polymerizable carbon-carbon double bond, while maintaining the radiation-polymerizable carbon-carbon double bond, is an acrylic polymer Methods for condensation reaction or addition reaction.

Examples of combinations of the first functional group and the second functional group include a carboxy group and an epoxy group, an epoxy group and a carboxy group, a carboxy group and an aziridyl group, an aziridyl group and a carboxy group, a hydroxy group and an isocyanate group, An isocyanate group, a hydroxy group, etc. are mentioned. Among these, the combination of a hydroxy group and an isocyanate group and the combination of an isocyanate group and a hydroxy group are preferable from the viewpoint of easiness of reaction tracking. Among them, it is technically difficult to produce a polymer having a highly reactive isocyanate group, while the first functional group is preferably from the viewpoint of the ease of preparation and availability of an acrylic polymer having a hydroxy group. The combination which is a hydroxyl group and whose said 2nd functional group is an isocyanate group is preferable. As a compound having an isocyanate group and a radioactively polymerizable carbon-carbon double bond, that is, as a radiation polymerizable unsaturated functional group-containing isocyanate compound, for example, methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl- α, α-dimethylbenzyl isocyanate and the like can be mentioned. Moreover, as an acrylic polymer having a hydroxy group, one comprising a constitutional unit derived from the above-mentioned hydroxy group-containing monomer, or an ether compound such as 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether or diethylene glycol monovinyl ether Can be mentioned.

The radiation-curable pressure-sensitive adhesive preferably contains a photopolymerization initiator. Examples of the photopolymerization initiator include α-ketol compounds, acetophenone compounds, benzoin ether compounds, ketal compounds, aromatic sulfonyl chloride compounds, photoactive oxime compounds, benzophenone compounds, thioxanthone compounds, Examples include camphor quinone, halogenated ketones, acyl phosphinoxides, and acyl phosphonates. Examples of the above α-ketol compounds include 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, α-hydroxy-α, α'-dimethylacetophenone, 2-methyl-2-hydroxy Propiophenone, 1-hydroxycyclohexyl phenyl ketone and the like can be mentioned. Examples of the above acetophenone compounds include methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1- [4- (methylthio) -phenyl] -2 And -morpholinopropan-1-one and the like. Examples of the above-mentioned benzoin ether compound include benzoin ethyl ether, benzoin isopropyl ether, anisoin methyl ether and the like. Examples of the ketal compounds include benzyl dimethyl ketal and the like. Examples of the aromatic sulfonyl chloride compounds include 2-naphthalene sulfonyl chloride and the like. Examples of the photoactive oxime compounds include 1-phenyl-1,2-propanedione-2- (O-ethoxycarbonyl) oxime and the like. Examples of the benzophenone series compounds include benzophenone, benzoylbenzoic acid, 3,3'-dimethyl-4-methoxybenzophenone and the like. Examples of the above thioxanthone compounds include thioxanthone, 2-chlorothioxanthone, 2-methyl thioxanthone, 2,4-dimethyl thioxanthone, isopropyl thioxanthone, 2,4-dichloro thioxanthone, 2,4-diethyl thioxanthone, 2,4-diisopropyl Thioxanthone etc. are mentioned. The content of the photopolymerization initiator in the radiation curable pressure sensitive adhesive is, for example, 0.05 to 20 parts by mass with respect to 100 parts by mass of the base polymer.

The heat-foaming pressure-sensitive adhesive is a pressure-sensitive adhesive containing a component (foaming agent, heat-expandable microspheres, etc.) that foams or expands by heating. Examples of the foaming agent include various inorganic foaming agents and organic foaming agents. Examples of the inorganic foaming agent include ammonium carbonate, ammonium hydrogencarbonate, sodium hydrogencarbonate, ammonium nitrite, sodium borohydride, azides and the like. Examples of the organic foaming agent include salt-fluorinated alkanes such as trichloromonofluoromethane and dichloromonofluoromethane; azo compounds such as azobisisobutyronitrile, azodicarbonamide and barium azodicarboxylate; Hydrazine compounds such as sulfonylhydrazide, diphenylsulfone-3,3'-disulfonylhydrazide, 4,4'-oxybis (benzenesulfonylhydrazide), allylbis (sulfonylhydrazide) and the like; p-toluylenesulfonyl semicarbazide, 4,4'- Semicarbazide compounds such as oxybis (benzenesulfonyl semicarbazide); triazole compounds such as 5-morpholine-1,2,3,4-thiatriazole; N, N'-dinitrosopentamethylenetetramine, N, N'-di Chill -N, N-nitroso compounds such as N'- dinitrosoterephthalamide, and the like. Examples of the thermally expandable microspheres include microspheres having a configuration in which a substance that is easily gasified and expanded by heating is enclosed in a shell. Examples of the substance which is easily gasified and expanded by the above heating include isobutane, propane, pentane and the like. Thermally expandable microspheres can be produced by encapsulating a substance which is easily gasified and expanded by heating into a shell-forming substance by a coacervation method, an interfacial polymerization method or the like. As the above-mentioned shell-forming substance, a substance exhibiting heat melting property or a substance which can be ruptured by the action of thermal expansion of the encapsulating substance can be used. Examples of such a substance include vinylidene chloride / acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, polysulfone and the like.

Examples of the non-adhesive force-reducing pressure-sensitive adhesive layer include a pressure-sensitive pressure-sensitive adhesive layer. In the pressure-sensitive pressure-sensitive adhesive layer, a pressure-sensitive adhesive layer formed of the radiation-curable pressure-sensitive adhesive described above in relation to the pressure-sensitive adhesive type pressure-sensitive adhesive layer is cured in advance by radiation irradiation. An adhesive layer is included. As the pressure-sensitive adhesive forming the non-adhesive force-reducing type pressure-sensitive adhesive layer, one kind of pressure-sensitive adhesive may be used, or two or more kinds of pressure-sensitive adhesives may be used. Further, the whole of the pressure-sensitive adhesive layer may be a non-adhesive force reducing type pressure-sensitive adhesive layer, or a part may be an adhesive force non-reducing type pressure-sensitive adhesive layer. For example, when the pressure-sensitive adhesive layer has a single-layer structure, the entire pressure-sensitive adhesive layer may be a non-adhesive force reducing type pressure-sensitive adhesive layer, or a specific portion in the pressure-sensitive adhesive layer The region, which is the region outside the central region) is the non-adhesive force reducing type adhesive layer, and the other part (for example, the central region which is the divided object of the semiconductor wafer or the adhesion target region of the semiconductor wafer) The pressure-sensitive adhesive layer may be an adhesive force-reducible type adhesive layer. In addition, when the pressure-sensitive adhesive layer has a laminated structure, all the pressure-sensitive adhesive layers in the laminated structure may be a non-adhesive force reducing type pressure-sensitive adhesive layer, or some of the pressure-sensitive adhesive layers in the laminated structure have non-adhesiveness. It may be a reduced pressure-sensitive adhesive layer.

A pressure-sensitive adhesive layer (irradiated radiation-curable pressure-sensitive adhesive layer) in a form in which a pressure-sensitive adhesive layer (a non-irradiated radiation-curable pressure-sensitive adhesive layer) formed of a radiation-curable pressure-sensitive adhesive is previously cured by radiation Even if the adhesive force is reduced by the irradiation, the adhesive property due to the contained polymer component is exhibited, and it is possible to exhibit the minimum adhesive force necessary for the adhesive layer of the dicing tape in the dicing step or the like. When the radiation-cured radiation-curable pressure-sensitive adhesive layer is used, the entire pressure-sensitive adhesive layer may be a radiation-cured radiation-curable pressure-sensitive adhesive layer in the surface spreading direction of the pressure-sensitive adhesive layer. The radiation-curable radiation-curable pressure-sensitive adhesive layer may be a radiation-cured pressure-sensitive adhesive layer other than the radiation-exposed radiation-curable pressure-sensitive adhesive layer. In the present specification, the "radiation-curable pressure-sensitive adhesive layer" refers to a pressure-sensitive adhesive layer formed of a radiation-curable pressure-sensitive adhesive, and a radiation-curable non-radiation-curable radiation-curable pressure-sensitive adhesive layer and the adhesive The agent layer includes both of the radiation-curable radiation-curable pressure-sensitive adhesive layer after being cured by irradiation.

As a pressure-sensitive adhesive for forming the pressure-sensitive pressure-sensitive adhesive layer, known pressure-sensitive pressure-sensitive adhesives can be used, and acrylic pressure-sensitive adhesives and rubber-based pressure-sensitive adhesives containing acrylic polymers as base polymers Can. When the pressure-sensitive adhesive layer contains an acrylic polymer as a pressure-sensitive adhesive, the acrylic polymer is a polymer containing a constituent unit derived from (meth) acrylic acid ester as the largest constituent unit in mass ratio preferable. As the acrylic polymer, for example, an acrylic polymer described as an acrylic polymer that can be included in the above-described addition type radiation curable adhesive can be employed.

The pressure-sensitive adhesive forming the pressure-sensitive adhesive layer or the pressure-sensitive adhesive layer may be any known or commonly used pressure-sensitive adhesive layer such as a crosslinking accelerator, tackifier, anti-aging agent, coloring agent (pigment, dye, etc.) The additive used for (1) may be mix | blended. As said coloring agent, the compound colored by irradiation with radiation is mentioned, for example. When it contains a compound that is colored by irradiation, only the irradiated part can be colored. The compound to be colored by the irradiation with radiation is a compound which is colorless or pale before irradiation with radiation but turns to a color by irradiation with radiation, and examples thereof include leuco dyes and the like. The amount of the compound to be colored by the above radiation irradiation is not particularly limited and can be appropriately selected.

The thickness of the pressure-sensitive adhesive layer is not particularly limited, but when the pressure-sensitive adhesive layer is a pressure-sensitive adhesive layer formed of a radiation-curable pressure-sensitive adhesive, adhesion of the pressure-sensitive adhesive layer to the back contact film before and after radiation curing From the viewpoint of balance, the thickness is preferably about 1 to 50 μm, more preferably 2 to 30 μm, and still more preferably 3 to 25 μm.

The back contact film of the present invention and the dicing tape-integrated back contact film of the present invention may have a separator on the back contact film surface. Specifically, each back contact film of the present invention or each dicing tape-integrated back contact film may be in the form of a sheet having a separator, or the separator may be elongated and a plurality thereof is provided thereon. The back contact film or the plurality of dicing tape-integrated back contact films may be disposed, and the separator may be wound into a roll. The separator is an element for covering and protecting the back contact film of the present invention, and is peeled from the sheet when using the back contact film of the present invention or the dicing tape-integrated back contact film of the present invention. Examples of the separator include plastic films and papers surface-coated with a polyethylene terephthalate (PET) film, a polyethylene film, a polypropylene film, and a release agent such as a fluorine-based release agent or a long chain alkyl acrylate release agent.

The thickness of the separator is, for example, 10 to 200 μm, preferably 15 to 150 μm, and more preferably 20 to 100 μm. When the thickness is 10 μm or more, it is difficult to be broken due to cutting at the time of processing of the separator. When the thickness is 200 μm or less, the dicing tape-integrated back contact film is more easily peeled off from the separator at the time of bonding to the substrate and the frame.

[Method for producing back contact film]
The back contact film 10 which is one embodiment of the back contact film of the present invention is manufactured, for example, as follows.

In the preparation of the back contact film 10 shown in FIG. 1, first, the adhesive layer (B layer) 11 and the laser mark layer (A layer) 12 are separately prepared. The adhesive layer 11 applies a resin composition (adhesive composition) for forming the adhesive layer 11 on a separator to form a resin composition layer, and then performs desolvation and curing by heating to form a resin composition. It can be produced by solidifying the product layer. In the preparation of the adhesive layer 11, the heating temperature is, for example, 90 to 150 ° C., and the heating time is, for example, 1 to 2 minutes. As a coating method of a resin composition, roll coating, screen coating, gravure coating etc. are mentioned, for example. On the other hand, the laser mark layer 12 applies a resin composition for forming the laser mark layer 12 on the separator to form a resin composition layer, and then performs desolvation and curing by heating to solidify the resin composition layer. It can be produced by In the preparation of the laser mark layer 12, the heating temperature is, for example, 90 to 160 ° C., and the heating time is, for example, 2 to 4 minutes. As described above, the adhesive layer 11 and the laser mark layer 12 can be produced in a form in which each is accompanied by a separator. Then, the exposed surfaces of the adhesive layer 11 and the laser mark layer 12 are attached to each other, and then punching processing is performed so as to obtain a target plane projection shape and a plane projection area, and the adhesive layer 11 and the laser mark layer 12 The back contact film 10 having a laminated structure of

[Manufacturing method of dicing tape integrated type back contact film]
The dicing tape integrated back contact film 1 which is one embodiment of the dicing tape integrated back adhesion film of the present invention is manufactured, for example, as follows.

The dicing tape 20 of the dicing tape-integrated back contact film 1 shown in FIG. 2 can be produced by providing the adhesive layer 22 on the prepared base 21. For example, the base material 21 made of resin can be obtained by forming a film by a known or conventional film forming method. Examples of the film forming method include a calendar film forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a coextrusion method, a dry lamination method and the like. The substrate 21 is subjected to surface treatment as required. In the formation of the pressure-sensitive adhesive layer 22, for example, after preparing a pressure-sensitive adhesive composition for forming a pressure-sensitive adhesive layer, first, the composition is applied on a substrate 21 or a separator to form a pressure-sensitive adhesive composition layer. Do. Examples of the method for applying the pressure-sensitive adhesive composition include roll coating, screen coating, and gravure coating. Next, in the pressure-sensitive adhesive composition layer, the solvent is removed as necessary by heating, and a crosslinking reaction is caused as necessary. The heating temperature is, for example, 80 to 150 ° C., and the heating time is, for example, 0.5 to 5 minutes. When the pressure-sensitive adhesive layer 22 is formed on a separator, the pressure-sensitive adhesive layer 22 with the separator is attached to the substrate 21 and then the target plane projection shape (for example, the back contact film 10 has a similar shape Punching is performed so as to obtain a shape and a planar projected area, and then the separator is peeled off. Thereby, the dicing tape 20 which has a laminated structure of the base material 21 and the adhesive layer 22 is produced.

Next, the laser mark layer 12 side of the back contact film 10 obtained above is bonded to the adhesive layer 22 side of the dicing tape 20. The bonding temperature is, for example, 10 to 50 ° C., and the bonding pressure (linear pressure) is, for example, 0.1 to 20 kgf / cm. When the pressure-sensitive adhesive layer 22 is the above-mentioned radiation-curable pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer 22 may be irradiated with radiation such as ultraviolet light before the bonding, or after the bonding The adhesive layer 22 may be irradiated with radiation such as ultraviolet light from the side. Alternatively, in the process of manufacturing the dicing tape-integrated back contact film 1, such radiation may not be performed (in this case, the adhesive layer 22 is cured in the process of using the dicing tape-integrated back contact film 1) Is possible). In the case where the pressure-sensitive adhesive layer 22 is of an ultraviolet-curable type, the ultraviolet irradiation dose for curing the pressure-sensitive adhesive layer 22 is, for example, 50 to 500 mJ / cm ² . The area (irradiated area R) where the irradiation as the adhesive force reducing measure of the pressure-sensitive adhesive layer 22 is performed in the dicing tape-integrated back-adhesion film 1 is, for example, as shown in FIG. It is an area | region except the peripheral part in the alignment area | region.

As described above, for example, the back contact film 10 of the present invention shown in FIG. 1 and the dicing tape integrated back contact film 1 shown in FIG. 2 can be produced. In the back contact film 10 of the present invention shown in FIG. 2, the adhesive layer 11 is an inner layer, and the laser mark layer 12 is an outermost layer.

[Method of Manufacturing Semiconductor Device]
A semiconductor device can be manufactured using the dicing tape-integrated back contact film of the present invention. Specifically, the step of sticking the back surface of the work to the back adhesion film side (especially the adhesive layer side) in the dicing tape-integrated back adhesion film of the present invention (sticking step) and cutting the object including at least the work The semiconductor device can be manufactured by the manufacturing method including the step of obtaining the singulated semiconductor chip (dicing step). 3 to 6 show steps in a method of manufacturing a semiconductor device using the dicing tape-integrated back contact film 1 shown in FIG.

(Pasting process)
As a work to be attached to the back contact film side (particularly the adhesive layer side) of the dicing tape-integrated back contact film of the present invention in the pasting step, a semiconductor wafer and a plurality of semiconductor chips have their back surfaces and / or side surfaces made of resin. And the like. Then, for example, as shown in FIG. 3 (a), the semiconductor wafer 40 held by the wafer processing tape T1 is attached to the back contact film 10 (particularly the adhesive layer 11) of the dicing tape integrated back contact film 1 of the present invention. Stick to). Bumps (not shown) for flip chip mounting are provided on the surface of the semiconductor wafer 40. Thereafter, as shown in FIG. 3B, the wafer processing tape T1 is peeled off from the semiconductor wafer 40.

(Thermal curing process)
When the back contact film of the present invention has a thermosetting adhesive layer, it is preferable to have a step (heat curing step) of heat curing the adhesive layer in the back contact film after the sticking step. For example, in the heat curing step, heat treatment for heat curing the adhesive layer 11 is performed. The heating temperature is preferably 80 to 200 ° C., more preferably 100 to 150 ° C. The heating time is preferably 0.5 to 5 hours, more preferably 1 to 3 hours. Specifically, the heat treatment is performed, for example, at 120 ° C. for 2 hours. In the heat curing step, the adhesion between the back adhesion film 10 of the present invention and the semiconductor wafer 40 of the dicing tape integrated back adhesion film 1 is enhanced by the heat curing of the adhesive layer 11, and the dicing tape integrated back adhesion film 1 and The semiconductor wafer fixed holding power of the back contact film 10 of the present invention is enhanced. In addition, when the back contact film of the present invention does not have a thermosetting adhesive layer, baking may be performed, for example, in the range of 50 to 100 ° C. for several hours, whereby the wettability of the adhesive layer interface is improved. And the semiconductor wafer fixed holding power is increased.

(Laser marking process)
The method for manufacturing a semiconductor device preferably includes a step (laser marking step) of laser marking by irradiating a laser from the substrate side of the dicing tape to the laser mark layer. When performing the said thermosetting process, it is preferable to perform a laser marking process after the said thermosetting process. Specifically, in the laser marking step, for example, laser marking is performed by irradiating a laser from the side of the base 21 of the dicing tape 20 to the laser mark layer 12. By the laser marking process, various information such as character information and graphic information can be imprinted on each semiconductor chip. In the laser marking process, it is possible to perform laser marking efficiently on a plurality of semiconductor chips collectively in one laser marking process. As a laser used at a laser marking process, a gas laser and a solid state laser are mentioned, for example. Examples of the gas laser include a carbon dioxide gas laser (CO ₂ laser) and an excimer laser. As a solid state laser, Nd: YAG laser is mentioned, for example.

(Dicing process)
In the dicing step, for example, as shown in FIG. 4, a frame (dicing frame) 51 for pressing and fixing the dicing tape is stuck on the adhesive layer 22 in the dicing tape integrated back contact film 1 and holding of the dicing apparatus After being held by the tool 52, cutting with a dicing blade provided in the dicing apparatus is performed. In FIG. 4, the cut portion is schematically represented by a thick line. In the dicing step, the semiconductor wafer is singulated into semiconductor chips 41, and the back contact film 10 of the present invention of the dicing tape integrated back contact film 1 is cut into small pieces of film 10 '. Thereby, the semiconductor chip 41 with the film 10 ′, ie, the semiconductor chip 41 with the film 10 ′ is obtained.

(Irradiation process)
The method for manufacturing a semiconductor device may have a step of irradiating the pressure-sensitive adhesive layer from the substrate side with radiation (radiation irradiation step). When the pressure-sensitive adhesive layer of the dicing tape is a layer formed of a radiation-curable pressure-sensitive adhesive, after the above-mentioned dicing process, the above-mentioned radiation irradiation in the production process of the dicing tape-integrated back contact film is replaced. The adhesive layer may be irradiated with radiation such as ultraviolet light from the side of the substrate. The irradiation dose is, for example, 50 to 500 mJ / cm ² . The area (irradiated area R shown in FIG. 2) where the irradiation as the adhesive force reduction measure of the pressure-sensitive adhesive layer is performed in the dicing tape-integrated back-adhesion film is, for example, the peripheral edge thereof in the back-adhesion film bonding area of the pressure-sensitive adhesive layer. This is an area excluding parts.

(Pickup process)
Preferably, the method of manufacturing a semiconductor device includes a step of picking up a semiconductor chip with a film (pickup step). The pick-up step is, for example, a cleaning step of cleaning the semiconductor chip 41 side of the dicing tape 20 with the semiconductor chip 41 with the film 10 ′ using a cleaning liquid such as water, or a separation distance between the semiconductor chips 41 with the film 10 ′. An expanding step for expanding may be performed after passing through if necessary. For example, as shown in FIG. 5, the semiconductor chip 41 with the film 10 ′ is picked up from the dicing tape 20. For example, with the dicing tape 20 with the dicing frame 51 held by the holder 52 of the apparatus, the pin member 53 of the pickup mechanism on the lower side of the dicing tape 20 in the figure of the semiconductor chip 41 with film 10 'to be picked up. Is raised and pushed up through the dicing tape 20, and then held by suction by the suction jig 54. In the pickup step, the push-up speed of the pin member 53 is, for example, 1 to 100 mm / sec, and the push-up amount of the pin member 53 is, for example, 50 to 3000 μm.

(Flip chip mounting process)
The method of manufacturing the semiconductor device preferably includes a step (flip chip step) of flip chip mounting the semiconductor chip 41 with a film after the pickup step. For example, as shown in FIG. 6, the semiconductor chip 41 with the film 10 ′ is flip-chip mounted on the mounting substrate 61. Examples of the mounting substrate 61 include a lead frame, a TAB (Tape Automated Bonding) film, and a wiring substrate. The semiconductor chip 41 is electrically connected to the mounting substrate 61 via the bumps 62 by flip chip mounting. Specifically, a substrate (electrode pad) (not shown) that the semiconductor chip 41 has on the circuit formation side and a terminal portion (not shown) that the mounting substrate 61 has are electrically connected via the bumps 62. Ru. The bumps 62 are, for example, solder bumps. In addition, a thermosetting underfill agent 63 is interposed between the chip 41 and the mounting substrate 61.

As described above, a semiconductor device can be manufactured using the dicing tape-integrated back contact film of the present invention.

EXAMPLES The present invention will be described in more detail by way of examples, but the present invention is not limited to these examples.

Example 1
(Preparation of laser mark layer)
90 parts by mass of acrylic resin (trade name "Teisan Resin SG-P3" manufactured by Nagase ChemteX Co., Ltd.) and 40 parts by mass epoxy resin E ₁ (trade name "KI-3000-4" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) 60 parts by mass of epoxy resin E ₂ (trade name “JER YL 980”, manufactured by Mitsubishi Chemical Corporation), 100 parts by mass of phenol resin (trade name “MEH 7851-SS”, manufactured by Meiwa Kasei Co., Ltd.), silica filler ( Trade name "SO-25R", average particle diameter: 0.5 μm, manufactured by Admatex Co., Ltd. 220 parts by mass, and black pigment (trade name "# 20", carbon black, manufactured by Mitsubishi Chemical Corporation) 3 parts by mass 10 parts by mass of a thermosetting catalyst (trade name "Quazole 2PHZ", manufactured by Shikoku Kasei Kogyo Co., Ltd.) is added to methyl ethyl ketone and mixed, and the solid concentration is It was obtained 8% by weight of the resin composition. Next, the resin composition was applied on a silicone release-treated surface of a PET separator (50 μm in thickness) having a silicone release-treated surface using an applicator to form a resin composition layer. Next, the composition layer was heated at 130 ° C. for 2 minutes to desolvate and thermally cure, and a 17 μm-thick laser mark layer (thermally cured layer) was produced on the PET separator.

(Preparation of adhesive layer)
90 parts by mass of acrylic resin (trade name "Teisan Resin SG-P3" manufactured by Nagase ChemteX Co., Ltd.) and 40 parts by mass epoxy resin E ₁ (trade name "KI-3000-4" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) 60 parts by mass of epoxy resin E ₂ (trade name “JER YL 980”, manufactured by Mitsubishi Chemical Corporation), 100 parts by mass of phenol resin (trade name “MEH 7851-SS”, manufactured by Meiwa Kasei Co., Ltd.), silica filler ( Trade name "SO-25R", average particle diameter: 0.5 μm, made by Admatex Co., Ltd. 220 parts by mass, and black pigment (trade name "# 20", carbon black, made by Mitsubishi Chemical Corporation) 20 parts by mass The mixture was added to methyl ethyl ketone and mixed to obtain a resin composition having a solid content concentration of 28% by mass. Next, the resin composition was applied on a silicone release-treated surface of a PET separator (50 μm in thickness) having a silicone release-treated surface using an applicator to form a resin composition layer. Next, the composition layer was subjected to heating for 2 minutes at 130 ° C. to desolvate, and an adhesive layer having a thickness of 8 μm was produced on the PET separator.

The laser mark layer on the PET separator produced as described above and the adhesive layer on the PET separator were bonded together using a laminator. Specifically, the exposed surfaces of the laser mark layer and the adhesive layer were bonded to each other under conditions of a temperature of 100 ° C. and a pressure of 0.6 MPa. As described above, a back contact film of Example 1 was produced. The laser mark layer is a layer which is the outermost layer when the semiconductor is in close contact with the back surface, and the adhesive layer is a layer which is an inner layer.

Comparative Example 1
A back contact film of Comparative Example 1 was produced in the same manner as in Example 1 except that the blending amount of the black pigment in the adhesive layer was changed as shown in Table 1.

Comparative example 2
A back contact film of Comparative Example 2 was prepared in the same manner as Example 1, except that the blending amount of the black pigment in the laser mark layer and the blending amount of the black pigment in the adhesive layer were changed as shown in Table 1, respectively. did.

Comparative example 3
90 parts by mass of acrylic resin (trade name "Teisan Resin SG-P3" manufactured by Nagase ChemteX Co., Ltd.) and 40 parts by mass epoxy resin E ₁ (trade name "KI-3000-4" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) 60 parts by mass of epoxy resin E ₂ (trade name “JER YL 980”, manufactured by Mitsubishi Chemical Corporation), 100 parts by mass of phenol resin (trade name “MEH 7851-SS”, manufactured by Meiwa Kasei Co., Ltd.), silica filler ( Trade name "SO-25R", average particle diameter: 0.5 μm, made by Admatex Co., Ltd. 220 parts by mass, and black pigment (trade name "# 20", carbon black, made by Mitsubishi Chemical Corporation) 20 parts by mass 10 parts by mass of a thermosetting catalyst (trade name "Quazole 2PHZ", manufactured by Shikoku Kasei Kogyo Co., Ltd.) is added to methyl ethyl ketone and mixed, and solid content concentration is achieved It was obtained 28% by weight of the resin composition. Next, the resin composition was applied on a silicone release-treated surface of a PET separator (50 μm in thickness) having a silicone release-treated surface using an applicator to form a resin composition layer. Next, the composition layer was heated at 130 ° C. for 2 minutes to desolvate and thermally cure, and a back contact film (thermally cured) of Comparative Example 3 with a thickness of 25 μm was produced on the PET separator.

Comparative example 4
90 parts by mass of acrylic resin (trade name "Teisan Resin SG-P3" manufactured by Nagase ChemteX Co., Ltd.) and 40 parts by mass epoxy resin E ₁ (trade name "KI-3000-4" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) 60 parts by mass of epoxy resin E ₂ (trade name “JER YL 980”, manufactured by Mitsubishi Chemical Corporation), 100 parts by mass of phenol resin (trade name “MEH 7851-SS”, manufactured by Meiwa Kasei Co., Ltd.), silica filler ( Trade name "SO-25R", average particle diameter: 0.5 μm, manufactured by Admatex Co., Ltd. 220 parts by mass, and black pigment (trade name "# 20", carbon black, manufactured by Mitsubishi Chemical Corporation) 3 parts by mass 10 parts by mass of a thermosetting catalyst (trade name "Quazole 2PHZ", manufactured by Shikoku Kasei Kogyo Co., Ltd.) is added to methyl ethyl ketone and mixed, and the solid concentration is It was obtained 8% by weight of the resin composition. Next, the resin composition was applied on a silicone release-treated surface of a PET separator (50 μm in thickness) having a silicone release-treated surface using an applicator to form a resin composition layer. Next, the composition layer was heated at 130 ° C. for 2 minutes to desolvate and thermally cure, and a back contact film (thermally cured) of Comparative Example 4 with a thickness of 25 μm was produced on the PET separator.

<Evaluation>
The following evaluation was performed regarding each layer which comprises the back contact film or back contact film obtained by the Example and the comparative example. The results are shown in Table 1.

(1) Absorbance About each layer in a back contact film obtained by an example and a comparative example, using an integrating sphere unit of an ultraviolet visible near infrared spectrophotometer (brand name "V-670", JASCO Corporation make) The transmittance (absorbance) spectrum was measured, and the absorbance at a wavelength of 1300 nm was calculated.

(2) Transmittance and light blocking property at a wavelength of 1300 nm The back contact films obtained in Examples and Comparative Examples are integrated into an ultraviolet visible near infrared spectrophotometer (trade name "V-670", manufactured by JASCO Corporation) The transmittance spectrum was measured using a sphere unit. With regard to the light shielding property, the case where the transmittance at a wavelength of 1300 nm was less than 20% was evaluated as ○, and the case where it was 20% or more as x.

(3) Laser marking property The back contact film obtained in the example and the comparative example is bonded to a dicing tape to prepare a dicing tape integrated back contact film, and the back contact film is formed by a green laser with a wavelength of 532 nm through the dicing tape. I printed it. Then, if the printed characters satisfy both criteria of easy visibility (contrast is clear) in dark field observation using a microscope and that no bubbles are generated, ○, at least one of them The case where the criteria were not met was evaluated as x.

1 Dicing tape-integrated back contact film 10 back contact film 11 of the present invention adhesive layer (B layer)
12 Laser mark layer (A layer)
20 dicing tape 21 substrate 22 adhesive layer 30 separator 40 semiconductor wafer 41 semiconductor chip

Claims

A semiconductor back contact film used in close contact with the back of the semiconductor,
A layer which contains a black pigment and which becomes the outermost layer at the time of close contact with the back surface of the semiconductor,
A semiconductor back contact film comprising a black pigment and having a higher absorbance at a wavelength of 1300 nm than the A layer, and a B layer serving as an inner layer positioned between the outermost layer and the semiconductor element when in close contact with the semiconductor back surface.
The semiconductor back contact film according to claim 1, wherein the content ratio of the black pigment in the layer B is higher than the content ratio of the black pigment in the layer A.
The semiconductor back contact film according to claim 1 or 2, wherein the layer to be the inner layer at the time of close contact with the back of the semiconductor is a layer containing a black pigment as a whole and having a higher absorbance at a wavelength of 1300 nm than the A layer.
The semiconductor back contact film according to any one of claims 1 to 3, wherein the ratio [B layer / A layer] of the absorbance at a wavelength 1300 nm of the layer B to the absorbance at a wavelength 1300 nm of the layer A is 1.2 to 15.
The semiconductor back contact film according to any one of claims 1 to 4, wherein each of the layer A and the layer B contains carbon black as the black pigment.
The semiconductor back contact film according to any one of claims 1 to 5, wherein the content ratio of the black pigment in the layer A is 0.05 to 5% by mass.
The semiconductor back contact film according to any one of claims 1 to 6, wherein the content ratio of the black pigment in the layer B is 0.5 to 10% by mass.