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WO2019104657A1 - 柔性显示装置、柔性显示装置的制造方法和电子装置 - Google Patents

柔性显示装置、柔性显示装置的制造方法和电子装置 Download PDF

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Publication number
WO2019104657A1
WO2019104657A1 PCT/CN2017/113989 CN2017113989W WO2019104657A1 WO 2019104657 A1 WO2019104657 A1 WO 2019104657A1 CN 2017113989 W CN2017113989 W CN 2017113989W WO 2019104657 A1 WO2019104657 A1 WO 2019104657A1
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WO
WIPO (PCT)
Prior art keywords
flexible
display device
display
area
electronic component
Prior art date
Application number
PCT/CN2017/113989
Other languages
English (en)
French (fr)
Inventor
邬强
谭小平
周锦杰
Original Assignee
深圳市柔宇科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to CN201780092180.2A priority Critical patent/CN110785800A/zh
Priority to PCT/CN2017/113989 priority patent/WO2019104657A1/zh
Publication of WO2019104657A1 publication Critical patent/WO2019104657A1/zh

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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements

Definitions

  • the present invention relates to a display device, and more particularly to a flexible display device, a method of manufacturing the flexible display device, and an electronic device.
  • a plurality of substrates such as a substrate of a display panel, a substrate for mounting a driving integrated circuit, and a substrate of an electronic component are connected by a bonding process, since the joint is difficult to bend or bend It is easy to break, thus limiting the bendability of the flexible display device.
  • Embodiments of the present invention provide a flexible display device, a method of manufacturing the flexible display device, and an electronic device.
  • the present invention provides a flexible display device including a display panel, a driving integrated circuit, an electronic component module, and a connector, the display panel including a flexible substrate, the flexible substrate including an adjacent display screen area and an electrical extension area,
  • the display area includes a display area capable of displaying an image frame, and the driver integrated circuit, the electronic component module, and the connector are both disposed on the electrical extension.
  • the invention provides an electronic device comprising:
  • the flexible display device is mounted on the housing.
  • the present invention provides a method of manufacturing a flexible display device, the method of manufacturing comprising:
  • a display panel on a flexible substrate comprising an adjacent display screen area and an electrical extension area, the display screen area including a display area capable of displaying an image frame;
  • a driver integrated circuit, an electronic component module, and a connector are attached to the electrical extension to form the flexible display device.
  • a flexible display device, a method of manufacturing a flexible display device, and an electronic device according to an embodiment of the present invention solve a plurality of flexible substrates by disposing a driving integrated circuit, an electronic component module, and a connector on an electrical extension region of a flexible substrate of a display panel The connection caused by the connection is difficult to bend, thereby improving the bendability of the flexible display device.
  • FIG. 1 is a schematic structural view of a flexible display device according to an embodiment of the present invention.
  • FIG. 2 is a schematic flow chart of a method of manufacturing a flexible display device according to an embodiment of the present invention
  • FIG. 3 is a schematic diagram of an electronic device according to an embodiment of the present invention.
  • FIG. 4 is another schematic flow chart of a method of manufacturing a flexible display device according to an embodiment of the present invention.
  • FIG. 5 is another schematic structural view of a flexible display device according to an embodiment of the present invention.
  • FIG. 6 is a schematic structural view of a display panel according to an embodiment of the present invention.
  • FIG. 7 is another schematic structural view of a display panel according to an embodiment of the present invention.
  • the electronic device 1000, the flexible display device 100, the display panel 20, the flexible substrate 21, the display screen area 212, the display area 2122, the non-display area 2124, the electrical extension area 214, the mounting sub-area 2142, the electrical connection sub-area 2144, and the organic light-emitting diode The layer 22, the flexible encapsulation film layer 23, the polarizer 24, the display layer 25, the touch layer 26, the driver integrated circuit 40, the electronic component module 60, the connector 80, and the housing 900.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include one or more of the described features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
  • connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or connected in one piece. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium, which can be the internal communication of two elements or the interaction of two elements. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
  • a flexible display device 100 includes a display panel 20, a driver IC 40, an electronic component module 60, and a connector 80.
  • the display panel 20 includes a flexible substrate 21.
  • the flexible substrate 21 includes a display screen area 212 and an electrical extension area 214 that are connected to each other.
  • the display screen area 212 includes a display area 2122 capable of displaying an image of the image.
  • Driver integrated circuit 40, electronic component module 60, and connector 80 are all disposed on electrical extension region 214.
  • a method for manufacturing a flexible display device 100 includes:
  • Step 02 manufacturing a display panel 20 on the flexible substrate 21, the flexible substrate 21 includes a display screen area 212 and an electrical extension area 214, and the display screen area 212 includes a display area 2122 capable of displaying an image screen;
  • Step 04 The driver integrated circuit 40, the electronic component module 60, and the connector 80 are attached to the electrical extension region 214 to form the flexible display device 100.
  • the flexible substrate 21 is a single flexible substrate, and the flexible substrate 21 is integrally formed.
  • the manufacturing method of the embodiment of the present invention can be used to manufacture the flexible display device 100 of the embodiment of the present invention.
  • the flexible display device 100 of the embodiment of the present invention may be applied to the electronic device 1000 of the embodiment of the present invention, or the electronic device 1000 of the embodiment of the present invention includes the flexible display device 100 of the embodiment of the present invention.
  • the electronic device 1000 of the embodiment of the present invention further includes a housing 900 on which the flexible display device 100 can be mounted.
  • the flexible display device 100 of the embodiment of the present invention, the manufacturing method of the flexible display device 100, and the electronic device 1000 are disposed on the electrical extension region 214 of the flexible substrate 21 of the display panel 20 by disposing the driving integrated circuit 40, the electronic component module 60, and the connector 80. Therefore, the problem that the joints are difficult to be bent due to the interconnection of the plurality of flexible substrates is solved, thereby improving the bendability of the flexible display device 100.
  • the electronic device 1000 includes a mobile phone, a tablet, a smart bracelet, a smart watch, and the like.
  • the mobile phone in FIG. 3 includes a flexible display device 100 and a housing 900 on which the flexible display device 100 is mounted.
  • the connector 80 includes solder joints, connecting wires, plugs, sockets, etc.
  • the electronic component module 60 can be connected through the connector 80 and other electronic devices of the electronic device 1000, such as electronic components.
  • the module 60 is connected to the main board of the electronic device 1000 through the connector 80.
  • the material used for the flexible substrate 21 includes polyimide (PI).
  • polyimide can be used for a long period of time in the temperature range of -200 degrees Celsius - 300 degrees Celsius, high temperature resistance up to 400 degrees Celsius, high insulation performance, and high bendability, so polyimide can be used as A material for manufacturing the flexible substrate 21.
  • the flexible substrate 21 uses polyimide as a substrate.
  • the flexible substrate 21 may also be made of other materials such as a polyester material, and is not specifically limited herein.
  • step 04 includes:
  • Step 042 The driver integrated circuit 40, the electronic component module 60, and the connector 80 are formed on the electrical extension region 214 by a COP (chip on PI) package.
  • COP chip on PI
  • the screen ratio of the electronic device 1000 provided with the flexible display device 100 can be increased.
  • COP refers to disposing the driving integrated circuit 40, the electronic component module 60, and the connector 80 on the back side of the display panel 20, thereby increasing the screen ratio of the electronic device 1000.
  • the flexible extension substrate 21 can be bent, the electrical extension region 214 and the display screen region 212 are oppositely disposed, and the driving integrated circuit 40, the electronic component module 60, and the connector 80 are electrically extended. Area 214.
  • the display screen area 212 and the electrical extension area 214 can be disposed in the same plane, that is, the flexible substrate 21 is in a flattened state, so that the thickness of the flexible substrate 21 can be reduced, and the flexible substrate 21 can be bent.
  • the folding property further increases the bendability of the flexible display device 100.
  • display screen area 212 also includes a non-display area 2124 that surrounds display area 2122.
  • the display panel 20 can be routed through the non-display area 2124.
  • the display panel 20 generally needs to be connected to the driving integrated circuit 40.
  • the display panel 20 is connected to the driving integrated circuit 40 through a connecting line.
  • the display screen area 212 generally includes a non-display area 2124 in addition to the display area 2122.
  • a connection line may be disposed on the non-display area 2124 to connect the display panel 20 with the driving integrated circuit 40.
  • the area occupied by the non-display area 2124 may be reduced by reasonably arranging the connection lines or the non-display area 2124 may be bent to the back side of the display area 2122 to increase the screen ratio. Make specific limits.
  • the driver integrated circuit 40 is used to drive the display panel 20 to output a display screen.
  • the display panel 20 can be controlled to output a preset display screen by the driver integrated circuit 40.
  • the display panel 20 generally includes a plurality of rows and columns of pixels, and the driving integrated circuit 40 can be connected to the pixels through a connection line, for example, including scan lines and data lines, and the driving integrated circuit 40 controls a certain line through the scan lines.
  • the (row drive) or a column (column drive) pixel operates, and the drive integrated circuit 40 controls the display brightness of the corresponding pixel point through the data line, thereby causing the display panel 20 to output a preset display screen.
  • the electronic component module 60 is formed from a plurality of electronic component packages.
  • the size of the electronic component module 60 is generally greatly reduced relative to the total size of the plurality of electronic components, so that the space occupied by the electronic component module 60 can be reduced, and the electronic component The module 60 is packaged as a device without peripheral components, and the wiring is easier and simpler, thereby preventing the scattered electronic components from affecting the bendability of the flexible display device 100.
  • the plurality of electronic components include electronic components such as capacitors, resistors, inductors, and control chips, which are not specifically limited herein.
  • the display panel 20 is an Organic Light-Emitting Diode (OLED) display screen.
  • the display panel 20 includes a flexible substrate 21 in sequence along the light emitting direction of the display panel 20 .
  • the display panel 20 can display an image screen in the display area 2122.
  • the display panel 20 is formed with a flexible substrate 21 as a substrate on which an organic light emitting diode layer 22 is formed, wherein the organic light emitting diode layer 22 can be formed by vaporizing a light emitting material on the flexible substrate 21, in order to form a full color display panel 20
  • the luminescent material may include a red luminescent material, a green luminescent material, and a blue luminescent material.
  • a flexible encapsulation film layer 23 is formed on the organic light emitting diode 22, and the organic light emitting diode layer 22 is protected by the flexible substrate 21 and the flexible encapsulation film layer 23 to prevent the organic light emitting diode layer 22 from being easily damaged.
  • the polarizer 24 is a polarizing element, and the light emitted from the organic light emitting diode layer 22 can be corrected by the polarizer 24, thereby improving the look and feel of the image screen displayed by the user on the display panel 20.
  • the display panel 20 includes a display layer 25 for outputting a display screen and a touch layer 26 for sensing a user's touch to form a touch signal.
  • the display panel 20 can be a touch display panel
  • the flexible display device 100 can be a flexible touch display device.
  • the display layer 25 may include, for example, an organic light emitting diode layer 22, a flexible packaging film layer 23, and a polarizer 24, and the display layer 25 may be disposed between the flexible substrate 21 and the touch layer 26.
  • Touch layer 26 can be, for example, a capacitive touch layer or a resistive touch layer.
  • the display layer 25 and the touch layer 26 are laminated and disposed such that the display panel 20 can output a display image by using the display layer 25, and the touch layer 26 is used to sense a user's touch to form a touch signal, thereby The touch signal controls the electronic device 1000.
  • the electrical extension region 214 includes a mounting sub-region 2142 and an electrical connection sub-region 2144.
  • the mounting sub-region 2142 is located between the electrical connection sub-region 2144 and the display panel region 212, and the driving integrated circuit 40
  • the electronic component module 60 is mounted to the mounting sub-area 2142, and the connector 80 is mounted to the electrical connection sub-area 2144.
  • the display panel 20 and the driver integrated circuit 40 can be conveniently connected, and the connector 80 can be easily connected to other electronic devices of the electronic device 1000.
  • the mounting sub-area 2124 is located between the electrical connection sub-area 2144 and the display screen area 212. Therefore, mounting the driving integrated circuit 40 on the mounting sub-area 2142 can cause the driving integrated circuit to be disposed close to the display panel 20, thereby facilitating connection of the driving integrated circuit. 40 and display panel 20.
  • the electronic component module 60 can also be mounted to the mounting sub-area 2142 to coordinate operation with the driver integrated circuit 40.
  • mounting the connector 80 in the electrical connection sub-area 2144 can facilitate the connector 80 and other electronic devices of the electronic device 1000 to be connected, thereby preventing the connector 80 and the other electronic devices of the electronic device 1000 from being connected to affect the driving integrated circuit 40 or
  • the electronic component module 60 operates normally.
  • the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them.
  • the first feature "above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.

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  • General Physics & Mathematics (AREA)
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Abstract

一种柔性显示装置(100)、柔性显示装置(100)的制造方法和电子装置(1000),柔性显示装置(100)包括显示面板(20)、驱动集成电路(40)、电子元件模块(60)和连接器(80)。显示面板(20)包括柔性基板(21)。柔性基板(21)包括相接的显示屏区(212)及电延伸区(214),显示屏区(212)包括能够显示图像画面的显示区(2122)。驱动集成电路(40)、电子元件模块(60)和连接器(80)均设置在电延伸区(214)上。

Description

柔性显示装置、柔性显示装置的制造方法和电子装置 技术领域
本发明涉及显示装置,特别涉及一种柔性显示装置、柔性显示装置的制造方法和电子装置。
背景技术
在柔性显示装置中,显示面板的基板、用于设置驱动集成电路的基板和电子元件的基板等多个基板之间通过邦定(bonding)工艺进行连接,由于连接处难以弯折或在弯折时容易断开,因此限制了柔性显示装置的可弯折性。
发明内容
本发明的实施例提供一种柔性显示装置、柔性显示装置的制造方法和电子装置。
本发明提供一种柔性显示装置,包括显示面板、驱动集成电路、电子元件模块和连接器,所述显示面板包括柔性基板,所述柔性基板包括相接的显示屏区及电延伸区,所述显示屏区包括能够显示图像画面的显示区,所述驱动集成电路、所述电子元件模块和所述连接器均设置在所述电延伸区上。
本发明提供一种电子装置,包括:
壳体;和
所述柔性显示装置,所述柔性显示装置安装在所述壳体上。
本发明提供一种柔性显示装置的制造方法,所述制造方法包括:
在柔性基板上制造形成显示面板,所述柔性基板包括相接的显示屏区及电延伸区,所述显示屏区包括能够显示图像画面的显示区;和
在所述电延伸区上贴合驱动集成电路、电子元件模块和连接器以形成所述柔性显示装置。
本发明实施方式的柔性显示装置、柔性显示装置的制造方法和电子装置通过将驱动集成电路、电子元件模块和连接器设置在显示面板的柔性基板的电延伸区上,从而解决多张柔性基板相互连接而导致的连接处难以弯折的问题,进而提高柔性显示装置的可弯折性。
本发明的实施方式的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本发明的实施方式的实践了解到。
附图说明
本发明的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解,其中:
图1是本发明实施方式的柔性显示装置的结构示意图;
图2是本发明实施方式的柔性显示装置的制造方法的流程示意图;
图3是本发明实施方式的电子装置的示意图;
图4是本发明实施方式的柔性显示装置的制造方法的另一个流程示意图;
图5是本发明实施方式的柔性显示装置的另一个结构示意图;
图6是本发明实施方式的显示面板的结构示意图;
图7是本发明实施方式的显示面板的另一个结构示意图。
主要元件符号附图说明:
电子装置1000、柔性显示装置100、显示面板20、柔性基板21、显示屏区212、显示区2122、非显示区2124、电延伸区214、安装子区域2142、电连接子区域2144、有机发光二极管层22、柔性封装膜层23、偏光片24、显示层25、触摸层26、驱动集成电路40、电子元件模块60、连接器80、壳体900。
具体实施方式
下面详细描述本发明的实施方式,所述实施方式的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的,仅用于解释本发明,而不能理解为对本发明的限制。
在本发明的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。
在本发明的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接。可以是机械连接,也可以是电连接。可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明中的具体含义。
请参阅图1,本发明实施方式的柔性显示装置100包括显示面板20、驱动集成电路(Driver IC)40、电子元件模块60和连接器80。显示面板20包括柔性基板21。柔性基板21包括相接的显示屏区212及电延伸区214,显示屏区212包括能够显示图像画面的显示区2122。驱动集成电路40、电子元件模块60和连接器80均设置在电延伸区214上。
请参阅图2,本发明实施方式的柔性显示装置100的制造方法包括:
步骤02:在柔性基板21上制造形成显示面板20,柔性基板21包括相接的显示屏区212及电延伸区214,显示屏区212包括能够显示图像画面的显示区2122;和
步骤04:在电延伸区214上贴合驱动集成电路40、电子元件模块60和连接器80以形成柔性显示装置100。
在某些实施方式中,柔性基板21为单张柔性基板,柔性基板21一体成型。
本发明实施方式的制造方法可以用于制造本发明实施方式的柔性显示装置100。
请参阅图3,本发明实施方式的柔性显示装置100可以应用于本发明实施方式的电子装置1000,或者说,本发明实施方式的电子装置1000包括本发明实施方式的柔性显示装置100。此外,本发明实施方式的电子装置1000还包括壳体900,柔性显示装置100可以安装在壳体900上。
本发明实施方式的柔性显示装置100、柔性显示装置100的制造方法和电子装置1000通过将驱动集成电路40、电子元件模块60和连接器80设置在显示面板20的柔性基板21的电延伸区214上,从而解决多张柔性基板相互连接而导致的连接处难以弯折的问题,进而提高柔性显示装置100的可弯折性。
在某些实施方式中,电子装置1000包括手机、平板电脑、智能手环、智能手表等。下面以电子装置1000为手机为例进行说明:请参阅图3。图3中的手机包括柔性显示装置100和壳体900,柔性显示装置100安装在壳体900上。
在某些实施方式中,连接器80包括焊点、连接线、插头、插座等起连接作用的部件,电子元件模块60可以通过连接器80和电子装置1000的其他电子器件进行连接,例如电子元件模块60通过连接器80和电子装置1000的主板进行连接。
在某些实施方式中,柔性基板21使用的材料包括聚酰亚胺(PI)。
如此,可以提高柔性基板21的性能。
具体地,聚酰亚胺能够长期使用的温度范围为-200摄氏度-300摄氏度,耐高温达400摄氏度以上,绝缘性能高,并且具有较高的可弯折性,因此可以利用聚酰亚胺作为柔性基板21的制造材料。在一个实施例中,柔性基板21采用聚酰亚胺作为基材。
在某些实施方式中,柔性基板21也可以采用聚酯材料等其他材料作为基材,在此不做具体限定。
请参阅图4,在某些实施方式中,步骤04包括:
步骤042:通过COP(chip on PI)封装方式在电延伸区214上形成驱动集成电路40、电子元件模块60和连接器80。
如此,可以增加设置有柔性显示装置100的电子装置1000的屏占比。
在某些实施方式中,COP是指将驱动集成电路40、电子元件模块60和连接器80设置在显示面板20的背面,从而提高电子装置1000的屏占比。具体地,请参阅图5,可以通过将柔性基板21进行弯折,使电延伸区214和显示屏区212相对设置,再将驱动集成电路40、电子元件模块60和连接器80设置在电延伸区214上。
在某些实施方式中,可以将显示屏区212和电延伸区214设置在同一平面内,即柔性基底21处于展平状态,从而可以减小柔性基底21的厚度,提高柔性基底21的可弯折性,进而提高柔性显示装置100的可弯折性。
请参阅图1,在某些实施方式中,显示屏区212还包括环绕显示区2122的非显示区2124。
如此,显示面板20可以通过非显示区2124进行布线。
具体地,显示面板20一般需要跟驱动集成电路40进行连接,例如显示面板20通过连接线与驱动集成电路40进行连接,因此显示屏区212除了显示区2122外,一般还包括非显示区2124,连接线可以设置在非显示区2124上,从而连接显示面板20与驱动集成电路40。
需要说明的是,在某些实施方式中,可以通过合理布置连接线减小非显示区2124所占面积或将非显示区2124弯折到显示区2122的背面以提高屏占比,在此不做具体限定。
在某些实施方式中,驱动集成电路40用于驱动显示面板20输出显示画面。
如此,可以通过驱动集成电路40控制显示面板20输出预设的显示画面。
具体地,显示面板20一般包括多行多列的像素点,驱动集成电路40可以通过连接线与像素点进行连接,连接线例如包括扫描线和数据线,驱动集成电路40通过扫描线控制某行(行驱动)或某列(列驱动)的像素点进行工作,驱动集成电路40通过数据线控制对应像素点的显示亮度,从而使得显示面板20输出预设的显示画面。
在某些实施方式中,电子元件模块60由多个电子元件封装形成。
如此,可以提高柔性显示装置100的可弯折性。
具体地,由于电子元件模块60封装时一般采用半导体工艺,电子元件模块60的尺寸一般相对多个电子元件的总尺寸大大减小,如此可以减小电子元件模块60所占用的空间,并且电子元件模块60封装后为无周边元件的器件,布线更容易、简单,从而避免散乱的电子元件影响柔性显示装置100的可弯折性。
在某些实施方式中,多个电子元件包括电容、电阻、电感、控制芯片等电子元件,在此不做具体限定。
请参阅图6,在某些实施方式中,显示面板20为柔性有机发光二极管(Organic Light-Emitting Diode,OLED)显示屏,沿显示面板20的发光方向,显示面板20依次包括柔性基板21、有机发光二极管层22、柔性封装膜层23、及偏光片24。
如此,显示面板20可在显示区2122显示图像画面。
具体地,显示面板20以柔性基底21作为基底,在基底上形成有机发光二极管层22,其中有机发光二极管层22可以通过在柔性基底21上蒸镀发光材料形成,为了形成全彩的显示面板20,发光材料可以包括红色发光材料、绿色发光材料和蓝色发光材料。在有机发光二极管22上形成柔性封装膜层23,利用柔性基底21和柔性封装膜层23保护有机发光二极管层22以避免有机发光二极管层22容易损坏。此外,偏光片24为偏光元件,利用偏光片24可以矫正有机发光二极管层22发出的光线,从而提高用户观看显示面板20显示的图像画面的观感。
请参阅图7,在某些实施方式中,显示面板20包括显示层25和触摸层26,显示层25用于输出显示画面,触摸层26用于感测用户的触摸以形成触摸信号。
如此,显示面板20可以为触摸显示面板,柔性显示装置100可以为柔性触摸显示装置。
具体地,显示层25例如可以包括有机发光二极管层22、柔性封装膜层23、及偏光片24,显示层25可以设置在柔性基板21和触摸层26之间。触摸层26例如可以为电容式触摸层或电阻式触摸层。在某些实施方式中,将显示层25和触摸层26层叠贴合设置,从而显示面板20可以利用显示层25输出显示画面,利用触摸层26感测用户的触摸以形成触摸信号,从而可以根据触摸信号控制电子装置1000。
请参阅图1,在某些实施方式中,电延伸区214包括安装子区域2142及电连接子区域2144,安装子区域2142位于电连接子区域2144及显示屏区212之间,驱动集成电路40与电子元件模块60安装在安装子区域2142,连接器80安装在电连接子区域2144。
如此,可以方便显示面板20和驱动集成电路40进行连接,以及方便连接器80和电子装置1000的其他电子器件进行连接。
具体地,安装子区域2124位于电连接子区域2144及显示屏区212之间,因此将驱动集成电路40安装在安装子区域2142可以使得驱动集成电路靠近显示面板20设置,从而便于连接驱动集成电路40和显示面板20。电子元件模块60也可以安装在安装子区域2142,从而与驱动集成电路40协调工作。另外,将连接器80安装在电连接子区域2144可以便于连接器80和电子装置1000的其他电子器件进行连接,避免连接器80和电子装置1000的其他电子器件进行连接时影响驱动集成电路40或电子元件模块60正常工作。
在本发明中,除非另有明确的规定和限定,第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且,第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方,或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本发明的不同结构。为了简化本发明的公开,下文中对特定例子的部件和设置进行描述。当然,它们仅仅为示例,并且目的不在于限制本发明。此外,本发明可以在不同例子中重复参考数字和/或参考字母,这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施方式和/或设置之间的关系。此外,本发明提供了的各种特定的工艺和材料的例子,但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
在本说明书的描述中,参考术语“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合实施方式或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施方式或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
尽管已经示出和描述了本发明的实施方式,本领域的普通技术人员可以理解:在不脱离本发明的原理和宗旨的情况下可以对这些实施方式进行多种变化、修改、替换和变型,本发明的范围由权利要求及其等同物限定。

Claims (11)

  1. 一种柔性显示装置,其特征在于,包括显示面板、驱动集成电路、电子元件模块和连接器,所述显示面板包括柔性基板,所述柔性基板包括相接的显示屏区及电延伸区,所述显示屏区包括能够显示图像画面的显示区,所述驱动集成电路、所述电子元件模块和所述连接器均设置在所述电延伸区上。
  2. 根据权利要求1所述的柔性显示装置,其特征在于,所述显示屏区还包括环绕所述显示区的非显示区。
  3. 根据权利要求1所述的柔性显示装置,其特征在于,所述电子元件模块由多个电子元件封装形成。
  4. 根据权利要求1所述的柔性显示装置,其特征在于,所述柔性基板使用的材料包括聚酰亚胺。
  5. 根据权利要求1所述的柔性显示装置,其特征在于,所述显示面板为柔性有机发光二极管显示屏,沿所述显示面板的发光方向,所述显示面板依次包括柔性基板、有机发光二极管层、柔性封装膜层、及偏光片。
  6. 根据权利要求1所述的柔性显示装置,其特征在于,所述显示面板包括显示层和触摸层,所述显示层用于输出显示画面,所述触摸层用于感测用户的触摸以形成触摸信号。
  7. 根据权利要求1所述的柔性显示装置,其特征在于,所述驱动集成电路用于驱动所述显示面板输出显示画面。
  8. 根据权利要求1所述的柔性显示装置,其特征在于,所述电延伸区包括安装子区域及电连接子区域,所述安装子区域位于所述电连接子区域及所述显示屏区之间,所述驱动集成电路与所述电子元件模块安装在所述安装子区域,所述连接器安装在所述电连接子区域。
  9. 一种电子装置,其特征在于,包括:
    壳体;和
    权利要求1-8任意一项所述的柔性显示装置,所述柔性显示装置安装在所述壳体上。
  10. 一种柔性显示装置的制造方法,其特征在于,所述制造方法包括:
    在柔性基板上制造形成显示面板,所述柔性基板包括相接的显示屏区及电延伸区,所述显示屏区包括能够显示图像画面的显示区;和
    在所述电延伸区上贴合驱动集成电路、电子元件模块和连接器以形成所述柔性显示装置。
  11. 根据权利要求10所述的制造方法,其特征在于,所述在所述电延伸区上贴合驱动集成电路、电子元件模块和连接器以形成所述柔性显示装置的步骤包括:
    通过COP封装方式在所述电延伸区上形成所述驱动集成电路、所述电子元件模块和所述连接器。
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