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WO2019178725A1 - 一种太阳能电池组件封装用背板 - Google Patents

一种太阳能电池组件封装用背板 Download PDF

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Publication number
WO2019178725A1
WO2019178725A1 PCT/CN2018/079481 CN2018079481W WO2019178725A1 WO 2019178725 A1 WO2019178725 A1 WO 2019178725A1 CN 2018079481 W CN2018079481 W CN 2018079481W WO 2019178725 A1 WO2019178725 A1 WO 2019178725A1
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WIPO (PCT)
Prior art keywords
resin substrate
wire
trenches
solar cell
wires
Prior art date
Application number
PCT/CN2018/079481
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English (en)
French (fr)
Inventor
陆颖
Original Assignee
海门市绣羽工业设计有限公司
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Application filed by 海门市绣羽工业设计有限公司 filed Critical 海门市绣羽工业设计有限公司
Priority to KR1020187037912A priority Critical patent/KR102133576B1/ko
Priority to PCT/CN2018/079481 priority patent/WO2019178725A1/zh
Publication of WO2019178725A1 publication Critical patent/WO2019178725A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L55/00—Compositions of homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C08L23/00 - C08L53/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C09J123/0853—Vinylacetate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0236—Special surface textures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0236—Special surface textures
    • H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/049—Protective back sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/052—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates to the field of solar cell technology, and in particular to a back panel for solar cell module packaging.
  • crystalline silicon solar cells have been widely used due to their high efficiency and mature manufacturing process.
  • Corresponding crystalline silicon solar modules usually include tempered glass, glue layer, battery sheet layer, glue layer and solar battery back plate.
  • the solar battery back plate is located at the back of the solar cell module to protect and support the battery sheet and has reliable performance. Insulation, water resistance, aging resistance.
  • a commonly used solar cell backsheet is a TPT backsheet which is formed by a three-layer film of polyvinyl fluoride, polyethylene terephthalate, and polyvinyl fluoride bonded by a glue and hot pressed.
  • the existing TPT backplane has poor thermal conductivity and cannot support and protect the solar cell panel, thereby affecting the service life of the corresponding solar cell module.
  • An object of the present invention is to overcome the above-mentioned deficiencies of the prior art and to provide a back sheet for solar cell module packaging.
  • a backsheet for solar cell module packaging proposed by the present invention includes:
  • a first resin substrate a lower surface of the first resin substrate is provided with a plurality of first trenches, and an upper surface of the first resin substrate is provided with a plurality of second trenches corresponding to the first trenches Each of the first trench and the corresponding second trench penetrates the first resin substrate;
  • An outer weathering layer is disposed on a lower surface of the first resin substrate, and the outer weathering layer covers the first metal wire;
  • first bonding layer a first bonding layer, the first bonding layer being disposed in a gap between adjacent second wires
  • the second resin substrate is disposed on the first adhesive layer, a lower surface of the second resin substrate is provided with a plurality of third trenches, and an upper surface of the second resin substrate is disposed a plurality of fourth trenches corresponding to the third trenches, each of the third trenches and the corresponding fourth trenches penetrating through the second resin substrate, the second metal Another portion of the wire is embedded in the third groove;
  • the second adhesive layer is disposed in a gap of the adjacent third metal wire
  • the third resin substrate is disposed on the second adhesive layer, a lower surface of the third resin substrate is provided with a plurality of fifth trenches, and an upper surface of the third resin substrate is disposed a plurality of sixth trenches corresponding to the fifth trench, each of the fifth trenches and the corresponding sixth trenches penetrating through the third resin substrate, the third metal Another portion of the wire is embedded in the fifth groove;
  • the third bonding layer is disposed on an upper surface of the third resin substrate, and the third bonding layer covers the fourth metal wire;
  • Corresponding first, second, third, and fourth wires form a heat conduction path.
  • the back sheet for solar cell module packaging further, the material of the first, second, and third resin substrates is PET, PEN, ABS, or PC, and the thickness of the first, second, and third resin substrates is 200. -300 microns.
  • the back sheet for solar cell module packaging further, the first, second, third, and fourth wires are made of aluminum, iron, copper, silver, aluminum-magnesium alloy or stainless steel, the first and second The third and fourth wires have a diameter of 150 to 400 microns.
  • the back sheet for solar cell module packaging further, the outer weathering layer is made of polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinylidene fluoride, polyvinyl fluoride or ethylene-tetrafluoroethylene copolymer.
  • the weatherable layer has a thickness of 50-100 microns.
  • the back sheet for solar cell module packaging further, the first, second, and third bonding layers are made of epoxy resin, EVA or polyolefin, and the thickness of the first, second, and third bonding layers is 30-100 microns.
  • the solar cell module package back sheet further, a part of the first metal wire is exposed to the outer weather resistant layer.
  • the solar cell module packaging back sheet further, the plurality of the first, second, third, fourth, fifth, and sixth trenches are respectively arranged in parallel, the first, second, third, and 4.
  • the bottom surfaces of the fifth and sixth grooves are all curved.
  • the back sheet for solar cell module encapsulation of the present invention by providing wires in contact with each other to form a heat conduction path, heat generated in the working process of the solar cell module can be effectively transmitted to the bottom of the back plate, and the first metal is disposed at the same time.
  • the wire portion is exposed to the outer weathering layer, so that the heat is quickly transmitted, and the heat dissipation performance of the solar cell module is improved.
  • the structure of the back plate of the present invention is a laminated structure, and a plurality of parallel wires are formed in each resin substrate.
  • the bottom surface of the groove is curved, so that the subsequent wire arrangement is regular, and the contact area between the wire and the resin substrate is increased, so that the wire can act as a reinforcing rib and effectively improve the mechanical strength of the entire back plate.
  • Long-term use by optimizing the material and specific dimensions of the various components of the backboard, effectively improve the overall performance of the backplane, which in turn can improve the stability of the corresponding solar module.
  • Fig. 1 is a schematic view showing the structure of a back sheet for solar cell module packaging of the present invention.
  • FIG. 2 is a schematic cross-sectional view showing first, second, and third resin substrates of the present invention.
  • FIG. 3 is a schematic plan view of the first, second, and third resin substrates of the present invention.
  • a backplane for packaging a solar cell module includes: a first resin substrate 1, and a plurality of first trenches 11 are disposed on a lower surface of the first resin substrate 1.
  • the upper surface of the first resin substrate is provided with a plurality of second trenches 12 corresponding to the first trenches 11, each of the first trenches 11 and the corresponding second trenches 12 Through the first resin substrate 1; a first wire 2, a part of the first wire 2 is embedded in the first groove 11; a second wire 3, the second wire 3 a portion is embedded in the second trench 12, each of the first wires 2 is in contact with the corresponding second wire 3; an outer weathering layer 4 is disposed on the outer weathering layer 4 a lower surface of a resin substrate 1 covering the first wire 2; a first bonding layer 5 disposed in a gap between adjacent second wires 3 a second resin substrate 6, the second resin substrate 6 is disposed on the first bonding layer 5, and a lower surface of the second resin substrate 6 is provided
  • the upper surface of the second resin substrate 6 is provided with a plurality of fourth trenches 62 corresponding to the third trenches 61, and each of the third trenches 61 and the corresponding fourth trenches Both slots 62 extend through the second resin substrate 6, another portion of the second wire 3 is embedded in the third trench 61; a third wire 7, a portion of the third wire 7 is embedded In the fourth groove 62, each of the second wires 3 is in contact with the corresponding third wire 7; the second bonding layer 8 is disposed on the second bonding layer 8 In the gap of the third metal wire 7; the third resin substrate 9, the third resin substrate 9 is disposed on the second adhesive layer 8, and the lower surface of the third resin substrate 9 is provided with a plurality of a fifth trench 91, the upper surface of the third resin substrate 9 is provided with a plurality of sixth trenches 92 corresponding to the fifth trenches 91, each of the fifth trenches 91 and the corresponding The sixth groove 92 penetrates through the third resin substrate 9, another portion of the third
  • the first, second, and third resin substrates (1, 6, 9) are made of PET, PEN, ABS, or PC, and the first, second, and third resin substrates (1, 6) , 9) has a thickness of 200-300 micrometers, and the resin substrate is too thin to form a groove on both sides of the resin substrate, which increases the difficulty of fabrication, and the resin substrate is too thick to occupy more space, thereby making the back plate
  • the overall thickness is thicker, which increases material costs.
  • the first, second, third, and fourth wires (2, 3, 7, 10) are made of aluminum, iron, copper, silver, aluminum-magnesium alloy or stainless steel, the first, The second, third, and fourth wires (2, 3, 7, 10) have a diameter of 150-400 ⁇ m, the diameter of the wire is too small, the thermal conductivity is deteriorated, and the diameter of the wire is too large, which increases The overall thickness of the back panel.
  • the outer weathering layer 4 is made of polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinylidene fluoride, polyvinyl fluoride or ethylene-tetrafluoroethylene copolymer, and the outer weathering layer 4 has a thickness of 50-100 microns.
  • the first, second, and third bonding layers (5, 8, 13) are made of epoxy resin, EVA or polyolefin, and the first, second, and third bonding layers (5, 8,13) has a thickness of 30-100 ⁇ m, and a suitable thickness of the bonding layer can satisfy the adhesion required for bonding of adjacent resin substrates.
  • a portion of the first wire 2 is exposed to the outer weathering layer 4 such that the first wire 2 is in direct contact with the air to facilitate heat dissipation.
  • a plurality of the first, second, third, fourth, fifth, and sixth grooves (11, 12, 61, 62, 91, 92) are respectively arranged in parallel, the first and the first 2.
  • the bottom surfaces of the third, fourth, fifth, and sixth grooves (11, 12, 61, 62, 91, 92) are all curved, so that the subsequent wire arrangement is regular, and the wire and the resin are enlarged.
  • the contact area of the substrate makes the complete back sheet excellent in impact resistance.
  • the present embodiment provides a backplane for a solar cell module package, comprising: a first resin substrate 1, and a plurality of first trenches 11 are disposed on a lower surface of the first resin substrate 1
  • the upper surface of the first resin substrate is provided with a plurality of second trenches 12 corresponding to the first trenches 11, each of the first trenches 11 and the corresponding second trenches 12
  • a first wire 2, a part of the first wire 2 is embedded in the first groove 11
  • a second wire 3, the second wire 3 a portion is embedded in the second trench 12, each of the first wires 2 is in contact with the corresponding second wire 3
  • an outer weathering layer 4 is disposed on the outer weathering layer 4 a lower surface of a resin substrate 1 covering the first wire 2
  • a first bonding layer 5 disposed in a gap between adjacent second wires 3 a second resin substrate 6, the second resin substrate 6 is disposed on the first bonding layer 5, and a lower surface of the second resin substrate 6 is
  • the upper surface of the second resin substrate 6 is provided with a plurality of fourth trenches 62 corresponding to the third trenches 61, and each of the third trenches 61 and the corresponding fourth trenches Both slots 62 extend through the second resin substrate 6, another portion of the second wire 3 is embedded in the third trench 61; a third wire 7, a portion of the third wire 7 is embedded In the fourth groove 62, each of the second wires 3 is in contact with the corresponding third wire 7; the second bonding layer 8 is disposed on the second bonding layer 8 In the gap of the third metal wire 7; the third resin substrate 9, the third resin substrate 9 is disposed on the second adhesive layer 8, and the lower surface of the third resin substrate 9 is provided with a plurality of a fifth trench 91, the upper surface of the third resin substrate 9 is provided with a plurality of sixth trenches 92 corresponding to the fifth trenches 91, each of the fifth trenches 91 and the corresponding The sixth groove 92 penetrates through the third resin substrate 9, another portion of the third
  • the material of the first, second, and third resin substrates (1, 6, 9) is PET, and the thickness of the first, second, and third resin substrates (1, 6, 9) is 250 ⁇ m.
  • the first, second, third, and fourth wires (2, 3, 7, 10) are made of copper, and the first, second, and third wires (2, 3, 7) are The diameter is 300 microns and the fourth wire (10) has a diameter of 175 microns.
  • the material of the outer weathering layer 4 is polytetrafluoroethylene, and the outer weathering layer 4 has a thickness of 75 micrometers.
  • the first, second, and third bonding layers (5, 8, 13) are made of EVA, and the first, second, and third bonding layers (5, 8, 13) have a thickness of 50 ⁇ m.
  • a portion of the first wire 2 is exposed to the outer weathering layer 4.
  • a plurality of the first, second, third, fourth, fifth, and sixth grooves (11, 12, 61, 62, 91, 92) are respectively arranged in parallel, the first, second, third
  • the bottom surfaces of the fourth, fifth, and sixth grooves (11, 12, 61, 62, 91, 92) are all curved.
  • the embodiment provides a back sheet for solar cell module packaging, which is different from the first embodiment in that the material of the first, second, and third resin substrates (1, 6, 9) is PC.
  • the first, second, and third resin substrates (1, 6, 9) have a thickness of 200 ⁇ m, and the first, second, third, and fourth wires (2, 3, 7, 10)
  • the material is stainless steel, and the first, second, third, and fourth wires (2, 3, 7, 10) have a diameter of 300 ⁇ m.
  • the material of the outer weathering layer 4 is an ethylene-tetrafluoroethylene copolymer, and the outer weathering layer 4 has a thickness of 100 ⁇ m.
  • the first, second, and third bonding layers (5, 8, 13) are made of epoxy resin, and the first, second, and third bonding layers (5, 8, 13) have a thickness of 100 ⁇ m.
  • a portion of the first wire 2 is exposed to the outer weathering layer 4, and the fourth wire 10 is exposed to the third bonding layer 13.
  • a plurality of the first, second, third, fourth, fifth, and sixth grooves (11, 12, 61, 62, 91, 92) are respectively arranged in parallel, the first, second, third
  • the bottom surfaces of the fourth, fifth, and sixth grooves (11, 12, 61, 62, 91, 92) are all curved.
  • This embodiment provides another back panel for solar cell module packaging, which is different from the first embodiment in that the materials of the first, second, and third resin substrates (1, 6, 9) are PEN.
  • the first, second, and third resin substrates (1, 6, 9) have a thickness of 300 ⁇ m, and the first, second, third, and fourth wires (2, 3, 7, 10)
  • the material is aluminum, the first and fourth wires (2, 10) have a diameter of 200 microns, and the second and third (3, 7) have a diameter of 370 microns.
  • the material of the outer weathering layer 4 is polyvinylidene fluoride, and the thickness of the outer weathering layer 4 is 90 micrometers.
  • the first, second, and third bonding layers (5, 8, 13) are made of polyolefin, and the first and second bonding layers (5, 8) have a thickness of 70 ⁇ m, and the third bonding layer The thickness of the layer (13) is 80 microns.
  • the first wire 2 is not exposed to the outer weathering layer 4.

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  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photovoltaic Devices (AREA)

Abstract

一种太阳能电池组件封装用背板。该背板包括外耐候层(4)、第一金属丝(2)、第一树脂基板(1)、第二金属丝(3)、第一粘结层(5)、第二树脂基板(6)、第三金属丝(7)、第二粘结层(8)、第三树脂基板(9)、第四金属丝(10)、第三粘结层(13)，其中，对应的所述第一、第二、第三、第四金属丝(2,3,7,10)形成导热通路。该太阳能电池组件封装用背板具有优异的散热性能，进而可以提高相应太阳能电池组件的稳定性。

Description

一种太阳能电池组件封装用背板 技术领域
本发明涉及太阳能电池技术领域，特别是涉及一种太阳能电池组件封装用背板。
背景技术
随着工业的高度发展和人口的持续增长，对能源的需求也急剧增加，其中煤炭和石油是最主要的能源材料。然而地球上的煤炭和石油总储藏量有限且不可再生，因而全球面临着严峻的能源问题。同时煤炭和石油的使用过程中也会造成严重的环境污染，给我们的地球造成了巨大的灾难。只有可再生能源的大规模利用以替代煤炭和石油，才能促进人类社会的可持续发展。太阳能是来自于太阳内部的核聚变所蕴藏着的、并能爆发向外辐射的能量，与传统能源相比，太阳能取之不尽，用之不竭。目前人类利用太阳能的主要方式为光能转换为热能或者光能转换为电能(光伏发电)。
在现有的各类太阳能电池中，晶体硅太阳能电池由于效率高、制造工艺成熟而得到广泛的应用。相应的晶体硅太阳能组件通常包括钢化玻璃、胶层、电池片层、胶层以及太阳能电池电池背板，太阳能电池背板位于太阳能电池组件的背面，对电池片起保护和支撑作用，具有可靠的绝缘性、阻水性、耐老化性。常用的太阳能电池背板为TPT背板，该TPT背板是由聚氟乙烯、聚对苯二甲酸乙二醇酯、聚氟乙烯三层独立的薄膜通过胶水粘结并进行热压形成的。现有的TPT背板导热性能较差，且不能良好的支撑以及保护太阳能电池片，进而影响相应太阳能电池组件的使用寿命。
发明内容
本发明的目的是克服上述现有技术的不足，提供一种太阳能电池组件封装用背板。
为实现上述目的，本发明提出的一种太阳能电池组件封装用背板，包 括：
第一树脂基板，所述第一树脂基板的下表面设置有多个第一沟槽，所述第一树脂基板的上表面设置有与所述第一沟槽相对应的多个第二沟槽，每个所述第一沟槽与相应的所述第二沟槽两者贯穿所述第一树脂基板；
第一金属丝，所述第一金属丝的一部分嵌入到所述第一沟槽中；
第二金属丝，所述第二金属丝的一部分嵌入到所述第二沟槽中，每个所述第一金属丝与对应的所述第二金属丝相接触；
外耐候层，所述外耐候层设置于所述第一树脂基板的下表面，所述外耐候层覆盖所述第一金属丝；
第一粘结层，所述第一粘结层设置于相邻第二金属丝的间隙中；
第二树脂基板，所述第二树脂基板设置于所述第一粘结层上，所述第二树脂基板的下表面设置有多个第三沟槽，所述第二树脂基板的上表面设置有与所述第三沟槽相对应的多个第四沟槽，每个所述第三沟槽与相应的所述第四沟槽两者贯穿所述第二树脂基板，所述第二金属丝的另一部分嵌入到所述第三沟槽中；
第三金属丝，所述第三金属丝的一部分嵌入到所述第四沟槽中，每个所述第二金属丝与对应的所述第三金属丝相接触；
第二粘结层，所述第二粘结层设置于相邻第三金属丝的间隙中；
第三树脂基板，所述第三树脂基板设置于所述第二粘结层上，所述第三树脂基板的下表面设置有多个第五沟槽，所述第三树脂基板的上表面设置有与所述第五沟槽相对应的多个第六沟槽，每个所述第五沟槽与相应的所述第六沟槽两者贯穿所述第三树脂基板，所述第三金属丝的另一部分嵌入到所述第五沟槽中；
第四金属丝，所述第四金属丝的一部分嵌入到所述第六沟槽中，每个所述第三金属丝与对应的所述第四金属丝相接触；
第三粘结层，所述第三粘结层设置于所述第三树脂基板的上表面，所 述第三粘结层覆盖所述第四金属丝；
对应的所述第一、第二、第三、第四金属丝形成导热通路。
如上太阳能电池组件封装用背板，进一步，所述第一、第二、第三树脂基板的材质为PET、PEN、ABS或PC，所述第一、第二、第三树脂基板的厚度为200-300微米。
如上太阳能电池组件封装用背板，进一步，所述第一、第二、第三、第四金属丝的材质为铝、铁、铜、银、铝镁合金或不锈钢，所述第一、第二、第三、第四金属丝的直径为150-400微米。
如上太阳能电池组件封装用背板，进一步，所述外耐候层的材质为聚四氟乙烯、聚三氟氯乙烯、聚偏氟乙烯、聚氟乙烯或乙烯-四氟乙烯共聚物，所述外耐候层的厚度为50-100微米。
如上太阳能电池组件封装用背板，进一步，第一、第二、第三粘结层的材质为环氧树脂、EVA或聚烯烃，所述第一、第二、第三粘结层的厚度为30-100微米。
如上太阳能电池组件封装用背板，进一步，所述第一金属丝的一部分裸露于所述外耐候层。
如上太阳能电池组件封装用背板，进一步，多个所述第一、第二、第三、第四、第五、第六沟槽分别平行排列，所述第一、第二、第三、第四、第五、第六沟槽的底面均呈弧形。
与现有技术相比，本发明的有益效果在于:
本发明的太阳能电池组件封装用背板中，通过设置相互接触的金属丝，进而形成导热通路，可以有效将太阳能电池组件在工作过程中产生的热量传递至背板的底部，同时设置第一金属丝部分裸露于外耐候层，使得热量迅速传出，提高的太阳能电池组件的散热性能，同时本发明的背板的结构为叠层结构，多条平行的金属丝形成在各个树脂基板中，通过设置沟槽的底面呈弧形，使得后续的金属丝排列规整，增大了金属丝与树脂基板的接 触面积，使得金属丝可以起到加强筋的作用，有效提高整个背板的机械强度，可以长期使用，通过优化背板各部件的材质和具体尺寸，有效提高了背板的综合性能，进而可以提高相应太阳能电池组件的稳定性。
附图说明
图1为本发明的太阳能电池组件封装用背板的结构示意图。
图2为本发明的第一、第二、第三树脂基板的截面示意图。
图3为本发明的第一、第二、第三树脂基板的俯视示意图。
具体实施方式
如图1-3所示，本发明提出的一种太阳能电池组件封装用背板，包括：第一树脂基板1，所述第一树脂基板1的下表面设置有多个第一沟槽11，所述第一树脂基板的上表面设置有与所述第一沟槽11相对应的多个第二沟槽12，每个所述第一沟槽11与相应的所述第二沟槽12两者贯穿所述第一树脂基板1；第一金属丝2，所述第一金属丝2的一部分嵌入到所述第一沟槽11中；第二金属丝3，所述第二金属丝3的一部分嵌入到所述第二沟槽12中，每个所述第一金属丝2与对应的所述第二金属丝3相接触；外耐候层4，所述外耐候层4设置于所述第一树脂基板1的下表面，所述外耐候层4覆盖所述第一金属丝2；第一粘结层5，所述第一粘结层5设置于相邻第二金属丝3的间隙中；第二树脂基板6，所述第二树脂基板6设置于所述第一粘结层5上，所述第二树脂基板6的下表面设置有多个第三沟槽61，所述第二树脂基板6的上表面设置有与所述第三沟槽61相对应的多个第四沟槽62，每个所述第三沟槽61与相应的所述第四沟槽62两者贯穿所述第二树脂基板6，所述第二金属丝3的另一部分嵌入到所述第三沟槽61中；第三金属丝7，所述第三金属丝7的一部分嵌入到所述第四沟槽62中，每个所述第二金属丝3与对应的所述第三金属丝7相接触；第二粘结层8，所述第二粘结层8设置于相邻第三金属丝7的间隙中；第三树脂基板9，所述第三树脂基板9设置于所述第二粘结层8上，所述第三树脂基板9的下表面 设置有多个第五沟槽91，所述第三树脂基板9的上表面设置有与所述第五沟槽91相对应的多个第六沟槽92，每个所述第五沟槽91与相应的所述第六沟槽92两者贯穿所述第三树脂基板9，所述第三金属丝7的另一部分嵌入到所述第五沟槽91中；第四金属丝10，所述第四金属丝10的一部分嵌入到所述第六沟槽92中，每个所述第三金属丝7与对应的所述第四金属丝10相接触；第三粘结层13，所述第三粘结层13设置于所述第三树脂基板9的上表面，所述第三粘结层13覆盖所述第四金属丝10；对应的所述第一、第二、第三、第四金属丝(2,3,7,10)形成导热通路。
较佳的，所述第一、第二、第三树脂基板(1,6,9)的材质为PET、PEN、ABS或PC，所述第一、第二、第三树脂基板(1,6,9)的厚度为200-300微米，树脂基板太薄则不易在树脂基板的双面形成形成凹槽，增加了制作难度，树脂基板太厚则会占用较多的空间，进而使得背板的整体厚度较厚，增加了材料成本。较佳的，所述第一、第二、第三、第四金属丝(2,3,7,10)的材质为铝、铁、铜、银、铝镁合金或不锈钢，所述第一、第二、第三、第四金属丝(2,3,7,10)的直径为150-400微米，金属丝的直径太小，导热性能会变差，金属丝的直径太大，则会增加背板的整体厚度。较佳的，所述外耐候层4的材质为聚四氟乙烯、聚三氟氯乙烯、聚偏氟乙烯、聚氟乙烯或乙烯-四氟乙烯共聚物，所述外耐候层4的厚度为50-100微米。较佳的，第一、第二、第三粘结层(5,8,13)的材质为环氧树脂、EVA或聚烯烃，所述第一、第二、第三粘结层(5,8,13)的厚度为30-100微米，合适厚度的粘结层可以满足相邻树脂基板粘结所需要的粘附力。较佳的，所述第一金属丝2的一部分裸露于所述外耐候层4，使得第一金属丝2与空气直接接触，便于散热。较佳的，多个所述第一、第二、第三、第四、第五、第六沟槽(11,12,61,62,91,92)分别平行排列，所述第一、第二、第三、第四、第五、第六沟槽(11,12,61,62,91,92)的底面均呈弧形，使得后续的金属丝排列规整，增大了金属丝与树脂基板的接触面积，使得完整的背板具有优异的抗 冲击性能。
实施例1：
如图1-3所示，本实施例提供一种太阳能电池组件封装用背板，包括：第一树脂基板1，所述第一树脂基板1的下表面设置有多个第一沟槽11，所述第一树脂基板的上表面设置有与所述第一沟槽11相对应的多个第二沟槽12，每个所述第一沟槽11与相应的所述第二沟槽12两者贯穿所述第一树脂基板1；第一金属丝2，所述第一金属丝2的一部分嵌入到所述第一沟槽11中；第二金属丝3，所述第二金属丝3的一部分嵌入到所述第二沟槽12中，每个所述第一金属丝2与对应的所述第二金属丝3相接触；外耐候层4，所述外耐候层4设置于所述第一树脂基板1的下表面，所述外耐候层4覆盖所述第一金属丝2；第一粘结层5，所述第一粘结层5设置于相邻第二金属丝3的间隙中；第二树脂基板6，所述第二树脂基板6设置于所述第一粘结层5上，所述第二树脂基板6的下表面设置有多个第三沟槽61，所述第二树脂基板6的上表面设置有与所述第三沟槽61相对应的多个第四沟槽62，每个所述第三沟槽61与相应的所述第四沟槽62两者贯穿所述第二树脂基板6，所述第二金属丝3的另一部分嵌入到所述第三沟槽61中；第三金属丝7，所述第三金属丝7的一部分嵌入到所述第四沟槽62中，每个所述第二金属丝3与对应的所述第三金属丝7相接触；第二粘结层8，所述第二粘结层8设置于相邻第三金属丝7的间隙中；第三树脂基板9，所述第三树脂基板9设置于所述第二粘结层8上，所述第三树脂基板9的下表面设置有多个第五沟槽91，所述第三树脂基板9的上表面设置有与所述第五沟槽91相对应的多个第六沟槽92，每个所述第五沟槽91与相应的所述第六沟槽92两者贯穿所述第三树脂基板9，所述第三金属丝7的另一部分嵌入到所述第五沟槽91中；第四金属丝10，所述第四金属丝10的一部分嵌入到所述第六沟槽92中，每个所述第三金属丝7与对应的所述第四金属丝10相接触；第三粘结层13，所述第三粘结层13设置于所述第三树脂基板9 的上表面，所述第三粘结层13覆盖所述第四金属丝10；对应的所述第一、第二、第三、第四金属丝(2,3,7,10)形成导热通路。
其中，所述第一、第二、第三树脂基板(1,6,9)的材质为PET，所述第一、第二、第三树脂基板(1,6,9)的厚度为250微米，所述第一、第二、第三、第四金属丝(2,3,7,10)的材质为铜，所述第一、第二、第三金属丝(2,3,7)的直径为300微米，第四金属丝(10)的直径为175微米。所述外耐候层4的材质为聚四氟乙烯，所述外耐候层4的厚度为75微米。第一、第二、第三粘结层(5,8,13)的材质为EVA，所述第一、第二、第三粘结层(5,8,13)的厚度为50微米。所述第一金属丝2的一部分裸露于所述外耐候层4，。多个所述第一、第二、第三、第四、第五、第六沟槽(11,12,61,62,91,92)分别平行排列，所述第一、第二、第三、第四、第五、第六沟槽(11,12,61,62,91,92)的底面均呈弧形。
实施例2
本实施例提供再一种太阳能电池组件封装用背板，与实施例1相比，区别仅在于，所述第一、第二、第三树脂基板(1,6,9)的材质为PC，所述第一、第二、第三树脂基板(1,6,9)的厚度为200微米，所述第一、第二、第三、第四金属丝(2,3,7,10)的材质为不锈钢，所述第一、第二、第三、第四金属丝(2,3,7,10)的直径为300微米。所述外耐候层4的材质为乙烯-四氟乙烯共聚物，所述外耐候层4的厚度为100微米。第一、第二、第三粘结层(5,8,13)的材质为环氧树脂，所述第一、第二、第三粘结层(5,8,13)的厚度为100微米，所述第一金属丝2的一部分裸露于所述外耐候层4，所述第四金属丝10裸露于所述第三粘结层13。多个所述第一、第二、第三、第四、第五、第六沟槽(11,12,61,62,91,92)分别平行排列，所述第一、第二、第三、第四、第五、第六沟槽(11,12,61,62,91,92)的底面均呈弧形。
实施例3
本实施例提供另一种太阳能电池组件封装用背板，与实施例1相比， 区别仅在于，所述第一、第二、第三树脂基板(1,6,9)的材质为PEN，所述第一、第二、第三树脂基板(1,6,9)的厚度为300微米，所述第一、第二、第三、第四金属丝(2,3,7,10)的材质为铝，所述第一、第四金属丝(2,10)的直径为200微米，所述第二、第三(3,7)的直径为370微米。所述外耐候层4的材质为聚偏氟乙烯，所述外耐候层4的厚度为90微米。第一、第二、第三粘结层(5,8,13)的材质为聚烯烃，所述第一、第二粘结层(5,8)的厚度为70微米，所述第三粘结层(13)的厚度为80微米。所述第一金属丝2未裸露于所述外耐候层4。
以上所述是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围。

Claims (7)

  1. 一种太阳能电池组件封装用背板，其特征在于：包括：
    第一树脂基板，所述第一树脂基板的下表面设置有多个第一沟槽，所述第一树脂基板的上表面设置有与所述第一沟槽相对应的多个第二沟槽，每个所述第一沟槽与相应的所述第二沟槽两者贯穿所述第一树脂基板；
    第一金属丝，所述第一金属丝的一部分嵌入到所述第一沟槽中；
    第二金属丝，所述第二金属丝的一部分嵌入到所述第二沟槽中，每个所述第一金属丝与对应的所述第二金属丝相接触；
    外耐候层，所述外耐候层设置于所述第一树脂基板的下表面，所述外耐候层覆盖所述第一金属丝；
    第一粘结层，所述第一粘结层设置于相邻第二金属丝的间隙中；
    第二树脂基板，所述第二树脂基板设置于所述第一粘结层上，所述第二树脂基板的下表面设置有多个第三沟槽，所述第二树脂基板的上表面设置有与所述第三沟槽相对应的多个第四沟槽，每个所述第三沟槽与相应的所述第四沟槽两者贯穿所述第二树脂基板，所述第二金属丝的另一部分嵌入到所述第三沟槽中；
    第三金属丝，所述第三金属丝的一部分嵌入到所述第四沟槽中，每个所述第二金属丝与对应的所述第三金属丝相接触；
    第二粘结层，所述第二粘结层设置于相邻第三金属丝的间隙中；
    第三树脂基板，所述第三树脂基板设置于所述第二粘结层上，所述第三树脂基板的下表面设置有多个第五沟槽，所述第三树脂基板的上表面设置有与所述第五沟槽相对应的多个第六沟槽，每个所述第五沟槽与相应的所述第六沟槽两者贯穿所述第三树脂基板，所述第三金属丝的另一部分嵌入到所述第五沟槽中；
    第四金属丝，所述第四金属丝的一部分嵌入到所述第六沟槽中，每个所述第三金属丝与对应的所述第四金属丝相接触；
    第三粘结层，所述第三粘结层设置于所述第三树脂基板的上表面，所述第三粘结层覆盖所述第四金属丝；
    对应的所述第一、第二、第三、第四金属丝形成导热通路。
  2. 根据权利要求1所述的太阳能电池组件封装用背板，其特征在于：所述第一、第二、第三树脂基板的材质为PET、PEN、ABS或PC，所述第一、第二、第三树脂基板的厚度为200-300微米。
  3. 根据权利要求1所述的太阳能电池组件封装用背板，其特征在于：所述第一、第二、第三、第四金属丝的材质为铝、铁、铜、银、铝镁合金或不锈钢，所述第一、第二、第三、第四金属丝的直径为150-400微米。
  4. 根据权利要求1所述的太阳能电池组件封装用背板，其特征在于：所述外耐候层的材质为聚四氟乙烯、聚三氟氯乙烯、聚偏氟乙烯、聚氟乙烯或乙烯-四氟乙烯共聚物，所述外耐候层的厚度为50-100微米。
  5. 根据权利要求1所述的太阳能电池组件封装用背板，其特征在于：第一、第二、第三粘结层的材质为环氧树脂、EVA或聚烯烃，所述第一、第二、第三粘结层的厚度为30-100微米。
  6. 根据权利要求1所述的太阳能电池组件封装用背板，其特征在于：所述第一金属丝的一部分裸露于所述外耐候层。
  7. 根据权利要求1所述的太阳能电池组件封装用背板，其特征在于：多个所述第一、第二、第三、第四、第五、第六沟槽分别平行排列，所述第一、第二、第三、第四、第五、第六沟槽的底面均呈弧形。
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102544152A (zh) * 2011-12-31 2012-07-04 升信新材（北京）科技有限公司 一种太阳能电池背板及其制备方法
CN103311346A (zh) * 2013-06-18 2013-09-18 哈尔滨凌云汽车零部件有限公司 碟式太阳能背板
CN103314070A (zh) * 2010-12-15 2013-09-18 东洋油墨Sc控股株式会社 活性能量线硬化性粘合剂、以及太阳能电池用背面保护片
US20150303338A1 (en) * 2012-12-06 2015-10-22 Lg Chem, Ltd. Backsheet
CN205900566U (zh) * 2016-08-02 2017-01-18 浙江晶茂科技股份有限公司 一种高强度耐腐蚀的太阳能电池背板膜

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104441804B (zh) 2015-01-06 2016-04-27 浙江华川实业集团有限公司 一种再生防火阻燃瓦楞纸及其制备方法
CN206932540U (zh) 2017-07-06 2018-01-26 苏州威力士精细化工有限公司 一种开设有吸波缓冲结构的石墨导热硅胶片

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103314070A (zh) * 2010-12-15 2013-09-18 东洋油墨Sc控股株式会社 活性能量线硬化性粘合剂、以及太阳能电池用背面保护片
CN102544152A (zh) * 2011-12-31 2012-07-04 升信新材（北京）科技有限公司 一种太阳能电池背板及其制备方法
US20150303338A1 (en) * 2012-12-06 2015-10-22 Lg Chem, Ltd. Backsheet
CN103311346A (zh) * 2013-06-18 2013-09-18 哈尔滨凌云汽车零部件有限公司 碟式太阳能背板
CN205900566U (zh) * 2016-08-02 2017-01-18 浙江晶茂科技股份有限公司 一种高强度耐腐蚀的太阳能电池背板膜

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